LM95245CIMX/NOPB [TI]
具有 SMBus 接口、采用 β 补偿技术、适用于 45nm 处理器二极管的 ±0.75°C 远程和本地温度传感器 | D | 8;
| 型号： | LM95245CIMX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 SMBus 接口、采用 β 补偿技术、适用于 45nm 处理器二极管的 ±0.75°C 远程和本地温度传感器 | D | 8 温度传感 输出元件 二极管 传感器 换能器 温度传感器 |
| 文件： | 总40页 (文件大小：845K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM95245
www.ti.com
SNIS148G –OCTOBER 2007–REVISED MARCH 2013
Precision Remote Diode Digital Temperature Sensor with TruTherm® BJT Beta
Compensation Technology for 45nm Process
Check for Samples: LM95245
1
FEATURES
DESCRIPTION
The LM95245 is an 11-bit digital temperature sensor
with a 2-wire System Management Bus (SMBus)
interface and TruTherm technology that can monitor
the temperature of a remote diode as well as its own
temperature. The LM95245 can be used to very
accurately monitor the temperature of external
devices such as microprocessors. TruTherm
technology allows the LM95245 to precisely monitor
thermal diodes found in 90 nm and smaller geometry
processes. The LM95245 is specifically targeted for
Intel processors on 45nm process. LM95245 reports
temperature in two different formats for +127.875°C/-
128°C range and 0°C/255°C range. The LM95245
T_CRIT and OS outputs are asserted when either
unmasked channel exceeds its programmed limit and
can be used to shutdown the system, to turn on the
system fans, or as a microcontroller interrupt function.
The current status of the T_CRIT and OS pins can be
read back from the status registers via the SMBus
interface. All limits have a shared programmable
hysteresis register.
2
•
Remote and Local Temperature Channels
Targeted for Intel 45nm Processor Diodes
•
•
Two Formats: −128°C to +127.875°C and 0°C to
255.875°C
•
•
•
•
•
•
Digital Filter for Remote Channel
Programmable TCRIT and OS Thresholds
Programmable Shared Hysteresis Register
Diode Fault Detection
Mask, Offset, and Status Registers
SMBus 2.0 Compatible Interface, Supports
TIMEOUT
•
Programmable Conversion Rate for Best
Power Consumption
•
•
•
Three-Level Address Pin
Standby Mode One-Shot Conversion Control
Pin-for-Pin Compatible With the LM95235 and
LM86, LM89, LM99
The remote temperature channel of the LM95245 has
•
8-Pin VSSOP and SOIC Packages
a
programmable digital filter. The LM95245 is
targeted for a typical Intel® processor on a 45 nm, 65
nm or 90nm process, and has an offset register for
maximum flexibility and best accuracy.
APPLICATIONS
•
Processor/Computer System Thermal
Management (For Example, Laptops,
Desktops, Workstations, Servers)
The LM95245 has a three-level address pin to
connect up to 3 devices to the same SMBus master,
that is shared with the OS output. The LM95245 has
a programmable conversion rate register and a
standby mode to save power. One conversion can be
triggered in standby mode by writing to the one-shot
register.
•
•
Electronic Test Equipment
Office Electronics
KEY SPECIFICATIONS
•
•
•
Supply Voltage 3.0 to 3.6 V
Supply Current, Conv. Rate = 1 Hz 350 µA (typ)
Remote Diode Temperature Accuracy
–
TA = 25°C to 85°C; TD = 50°C to 105°C, ±0.75
°C (max)
–
TA = 25°C to 85°C; TD = 40°C to 125°C, ±1.5
°C (max)
•
•
Local Temperature Accuracy
TA = 25°C to 100°C, ±2.0 °C (max)
Conversion Rate, Both Channels 16 to 0.4 Hz
–
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2013, Texas Instruments Incorporated
LM95245
SNIS148G –OCTOBER 2007–REVISED MARCH 2013
www.ti.com
Connection Diagram
Top View
V
1
2
3
4
8
SMBCLK
SMBDAT
OS/A0
DD
D+
D-
7
LM95245
6
T_CRIT
5
GND
Figure 1. VSSOP-8 and SOIC-8 Packages
see package numbers DGK0008A, D0008A
Simplified Block Diagram
3.0V-3.6V
1
LM95245
4
6
T_CRIT
Local
Diode Selector
+
-
Temperature
Sensor
S D Converter
2
Circuitry
Remote
Diode
Selector
D+
D-
OS
/A0
+
-
3
TruTherm &
Diode Config
Registers
Limit &
Hyst
Local
Temp
Remote
Temp
General
Config
Registers
Status
Registers
ID
Registers
Control
Logic
Registers Registers Registers
7
8
SMBus Serial Interface
SMBDAT
SMBCLK
5
Table 1. Pin Descriptions
Pin
Number
Name
Type
Description
Device power supply. Requires bypass capacitor of 10 µF in parallel with 0.1 µF and
100 pF. Place 100 pF closest to device pin.
1
VDD
Power
2
3
4
5
D+
D-
Analog Input/Output Positive input from the thermal diode.
Analog Input/Output Negative input from the thermal diode.
T_CRIT
GND
Digital Output
Ground
Critical temperature output. Open-drain output requires pull-up resistor. Active low.
Device ground.
Over-temperature shutdown comparator output or SMBus slave address input. Defaults as
an SMBus slave address input that selects one of three addresses. Can be tied to VDD
GND, or to the middle of a resistor divider connected between VDD and GND. When
programmed as an OS comparator output it is active low and open drain.
,
6
OS/A0
Digital Input/Output
7
8
SMBDAT
SMBCLK
Digital Input/Output SMBus interface data pin. Open-drain output requires pull-up resistor.
Digital Input
SMBus interface clock pin.
2
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SNIS148G –OCTOBER 2007–REVISED MARCH 2013
Typical Application
+3.3V
Standby
C4
10 µF
C3
0.1 µF
C2
100 pF
R2
1.3k
R3
1.3k
R1
1.3k
R4
1.3k
SMBus
Master
Place capacitor C2
close to LM95245
LM95245
1
2
3
4
8
7
6
5
SMBCLK
SMBDAT
ALERT
SMI
V
SMBCLK
SMBDAT
OS/A0
DD
D+
D-
C1
100 pF
Processor
Place close to
LM95245
GND
T_CRIT
Main CPU
Voltage
Shutdown Control
Power Supply
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
Supply Voltage, VDD
−0.3V to 6.0V
−0.5V to 6.0V
(VDD +0.3V)
±1 mA
Voltage at SMBDAT, SMBCLK, T_CRIT, OS/A0 Pins
Voltage at Other Pins
(3)
Input Current at D− Pin
Input Current at All Other Pins
±5 mA
(3)
Output Sink Current, SMBDAT, T_Crit, OS Pins
10 mA
30 mA
(3)
Package Input Current
Human Body Model
Machine Model
2500V
(4)
ESD Susceptibility
250V
Charged Device Model
1000V
(5)
Junction Temperature
+125°C
Storage Temperature
−65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. Reflow temperature
profiles are different for packages containing lead (Pb) than for those that do not.
(3) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5
mA. Parasitic components and or ESD protection circuitry are shown in Table 2 for the LM95245's pins. Care should be taken not to
forward bias the parasitic diodes on pins 2 and 3. Doing so by more than 50 mV may corrupt the temperature measurements. SNP
refers to Snap-back device.
(4) Human body model (HBM) is a charged 100 pF capacitor discharged into a 1.5 kΩ resistor. Machine model (MM), is a charged 200 pF
capacitor discharged directly into each pin. Charged Device Model (CDM) simulates a pin slowly acquiring charge (such as from a
device sliding down the feeder in an automated assembler) then rapidly being discharged.
(5) Thermal resistance junction-to-ambient when attached to a printed circuit board with 1 oz. foil and no airflow is: θJA for VSSOP-8
package = 210°C/WθJA for SOIC-8 package = 168°C/W
Table 2. ESD Protection
Pin No.
Label
VDD
D+
Circuit
Pin ESD Protection Structure Circuits
1
2
B
A
V+
V+
D2
D1
160 k
80 k
D2
D3
ESD
Clamp
D1
6.5V
PIN
ESD
CLAMP
D3
6.5V
3
D−
A
GND
GND
4
5
6
T_CRIT
GND
C
B
C
Circuit A
Circuit B
PIN
OS/A0
D1
SNP
7
8
SMBDAT
SMBCLK
C
C
GND
Circuit C
4
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SNIS148G –OCTOBER 2007–REVISED MARCH 2013
Operating Ratings(1)
Operating Temperature Range
-40°C to +125°C
-40°C ≤ TA ≤ +85°C
+3.0V to +3.6V
Electrical Characteristics Temperature Range, TMIN ≤ TA ≤ TMAX
Supply Voltage (VDD
)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
Temperature-to-Digital Converter Characteristics
Unless otherwise noted, these specifications apply for VDD = +3.0 Vdc to 3.6 Vdc. Boldface limits apply for TA = TJ = TMIN
TA ≤ TMAX; all other limits TA = TJ = +25°C, unless otherwise noted. TJ is the junction temperature of the LM95245. TD is the
junction temperature of the remote thermal diode.
≤
Unit
Parameter
Test Conditions
Typ(1)
Limits(2)
(Limit)
°C (max)
°C (max)
Temperature Accuracy Using Local
Diode(3)
TA = 25°C to +100°C
±1
±2
±6
TA = -40°C to +25°C
Temperature Accuracy Using Remote
Diode(4)
TA = +25°C to +85°C;
TD = +50°C to +105°C
45nm Intel Processor
45nm Intel Processor
45nm Intel Processor
±0.5
±0.75
±1.5
±3.0
°C (max)
°C (max)
°C (max)
TA = +25°C to +85°C;
TD = +40°C to +120°C
±0.75
TA = -40°C to +25°C;
TD = +25°C to +125°C
11
0.125
13
Bits
°C
Digital Filter Off
Digital Filter On
Remote Diode Measurement Resolution
Bits
0.03125
11
°C
Local Diode Measurement Resolution
Conversion Time, Fastest Setting(5)
Bits
0.125
63
°C
Local and Remote Channels
Local or Remote Channels
SMBus Inactive, 1 Hz conversion rate
Standby Mode
72
ms (max)
ms
33
(6)
350
670
µA (max)
µA
Quiescent Current
300
D− Source Voltage
400
mV
High-level
Low-level
172
225
µA (max)
µA
External Diode Current Source
Diode Source Current Ratio
Power-On Reset Voltage
10.75
16
2.8
1.6
V (max)
V (min)
°C
T_CRIT Pin Temperature Threshold
OS Pin Temperature Threshold
Default
Default
+110
+85
°C
(1) Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical
specifications are not guaranteed.
(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the
internal power dissipation of the LM95245 and the thermal resistance. See () for the thermal resistance to be used in the self-heating
calculation.
(4) The accuracy of the LM95245 is guaranteed when using a typical thermal diode of an Intel processor on a 45 nm process, as selected
in the Remote Diode Model Select register. See typical performance curve for performance with Intel processor on a 65nm or 90nm
process.
(5) This specification is provided only to indicate how often temperature data is updated. The LM95245 can be read at any time without
regard to conversion state (and will yield last conversion result).
(6) Quiescent current will not increase substantially when the SMBus is active.
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Logic Electrical Characteristics
Digital DC Characteristics
Unless otherwise noted, these specifications apply for VDD= +3.0 Vdc to 3.6 Vdc. Boldface limits apply for TA = TJ = TMIN to
TMAX; all other limits TA= TJ= +25°C, unless otherwise noted.
Unit
(Limit)
Parameter
Test Conditions
Typ(1)
Limits(2)
SMBDAT, SMBCLK INPUTS
VIN(1)
Logical “1” Input Voltage
Logical “0” Input Voltage
2.1
0.8
V (min)
V (max)
mV
VIN(0)
VIN(HYST)
SMBDAT and SMBCLK Digital Input
Hysteresis
400
IIN(1)
IIN(0)
CIN
Logical “1” Input Current
Logical “0” Input Current
Input Capacitance
VIN = VDD
VIN = 0 V
−0.005
0.005
5
−10
µA (max)
µA (max)
pF
+10
A0 DIGITAL INPUT
VIH
Input High Voltage
0.90 × VDD
0.57 × VDD
0.43 × VDD
0.10 × VDD
−10
V (min)
V (max)
V (min)
V (max)
µA (max)
µA (max)
pF
VIM
Input Middle Voltage
VIL
Input Low Voltage
IIN(1)
IIN(0)
CIN
Logical “1” Input Current
Logical “0” Input Current
Input Capacitance
VIN = VDD
VIN = 0 V
−0.005
0.005
5
+10
SMBDAT, T_CRIT, OS DIGITAL OUTPUTS
IOH High Level Output Leakage Current
VOUT = VDD
10
µA (max)
V (max)
VOL(T_CRIT, OS) T_CRIT, OS Low Level Output Voltage IOL = 6 mA
0.4
IOL = 4 mA
IOL = 6 mA
0.4
0.6
V (max)
V (max)
VOL(SMBDAT)
COUT
SMBDAT Low Level Output Voltage
Digital Output Capacitance
5
pF
(1) Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical
specifications are not guaranteed.
(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
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SMBus Digital Switching Characteristics
Unless otherwise noted, these specifications apply for VDD= +3.0 Vdc to +3.6 Vdc, CL (load capacitance) on output lines = 80
pF. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted.
The switching characteristics of the LM95245 fully meet or exceed the published specifications of the SMBus version 2.0. The
following parameters are the timing relationships between SMBCLK and SMBDAT signals related to the LM95245. They
adhere to, but are not necessarily, the SMBus specifications.
Unit
(Limit)
Parameter
SMBus Clock Frequency
SMBus Clock Low Time
Test Conditions
Typ(1) Limits(2)
100
10
kHz (max)
kHz (min)
fSMB
tLOW
4.7
25
µs (min)
ms (max)
from VIN(0)max to VIN(0)max
tHIGH
SMBus Clock High Time
SMBus Rise Time
from VIN(1)min to VIN(1)min
(3)
4.0
µs (min)
µs (max)
µs (max)
tR,SMB
tF,SMB
1
(4)
SMBus Fall Time
0.3
CL = 400 pF,
IO = 3 mA,
tOF
Output Fall Time
250
ns (max)
(4)
SMBDAT and SMBCLK Time Low for Reset of
Serial Interface
25
35
ms (min)
ms (max)
tTIMEOUT
tSU;DAT
tHD;DAT
(5)
Data In Setup Time to SMBCLK High
250
ns (min)
300
1075
ns (min)
ns (max)
Data Out Stable after SMBCLK Low
Start Condition SMBDAT Low to SMBCLK Low
(Start condition hold before the first clock falling
edge)
tHD;STA
100
ns (min)
Stop Condition SMBCLK High to SMBDAT Low
(Stop Condition Setup)
tSU;STO
tSU;STA
tBUF
100
0.6
1.3
ns (min)
µs (min)
µs (min)
SMBus Repeated Start-Condition Setup Time,
SMBCLK High to SMBDAT Low
SMBus Free Time Between Stop and Start
Conditions
(1) Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical
specifications are not guaranteed.
(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
(3) The output rise time is measured from (VIN(0)max - 0.15V) to (VIN(1)min + 0.15V).
(4) The output fall time is measured from (VIN(1)min + 0.15V) to (VIN(0)max - 0.15V).
(5) Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM95245's SMBus state machine,
therefore setting SMBDAT and SMBCLK pins to a high impedance state.
tLOW
tR
tF
VIH
SMBCLK V
IL
tHD;STA
tHD;DAT
tSU;STA
tHIGH
tSU;STO
tBUF
tSU;DAT
VIH
VIL
SMBDAT
P
S
S
P
Figure 2. SMBus Communication
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Typical Performance Characteristics
Thermal Diode Capacitor or PCB Leakage Current
Effect Remote Diode Temperature Reading
Remote Temperature Reading Sensitivity to
Thermal Diode Filter Capacitance, TruTherm Enabled
Figure 3.
Figure 4.
Intel Processor on 45nm,
65nm, or 90 nm Porcess
Thermal Diode Performance Comparison
Conversion Rate Effect on
Average Power Supply Current
Figure 5.
Figure 6.
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FUNCTIONAL DESCRIPTION
The LM95245 is a temperature sensor that measures Local and Remote temperature zones. The LM95245 uses
a ΔVbe temperature sensing method. A differential voltage, representing temperature, is digitized using a Sigma-
Delta analog to digital converter. TruTherm BJT (Transistor) Beta Compensation Technology allows the
LM95245 to accurately sense the temperature of a thermal diode found on die fabricated using a sub-micron
process. For more information on TruTherm Technology see Applications Hints . The LM95245 is compatible
with the serial SMBus version 2.0 two-wire serial interface.
The LM95245 has OS and TCRIT open-drain digital outputs that indicate the state of the local and remote
temperature readings when compared to user-programmable limits. If enabled, the local temperature is
compared to the user-programmable Local Shared OS and TCRIT Limit Register (Default Value = 85°C). The
comparison result can trigger the T_CRIT pin and/or the OS pin depending on the settings of the Local TCRIT
Mask and OS Mask bits found in Configuration Register 1. The comparison result can also be read back from
Status Register 1. If enabled, the remote temperature is compared to the user-programmable Remote TCRIT
Limit Register (Default Value = 110°C), and the Remote OS Limit Register (Default Value = 85°C) values. The
comparison result can trigger the T_CRIT pin and/or the OS pin depending on the settings of Configuration
Register 1. The following table describes the default temperature settings for each measured temperature that
triggers T_CRIT and/or OS pins:
Output Pin
T_CRIT
OS
Remote, °C
Local, °C
110
85
85
85
The following table describes the limit register mapping to the T_CRIT and/or OS pins:
Output Pin
T_CRIT
OS
Remote
Local
Remote TCRIT Limit
Remote OS Limit
Local Shared OS/TCRIT Limit
Local Shared OS/TCRIT Limit
The T_CRIT and OS outputs are open-drain, active low.
The remote temperature readings support a programmable digital filter. Based on the settings in Configuration
Register 2 a digital filter can be turned on to improve the noise performance of the remote temperature as well as
to increase the resolution of the temperature reading. If the filter is enabled the filtered readings are used for
TCRIT and OS comparisons. The LM95245 may be placed in low power consumption (Standby) mode by setting
the STOP/RUN bit found in Configuration Register 1. In the Standby mode, the LM95245’s SMBus interface
remains active while all circuitry not required is turned off. In the Standby mode the host can trigger one round of
conversions by writing to the One-Shot Register. The value written into this register is not kept. Local and
Remote temperatures will be converted once and the T_CRIT and OS pins will reflect the comparison results
based on this set of conversions results.
All the temperature readings are in 16-bit left-justified word format. The 10-bit plus sign local temperature reading
is contained in two 8-bit registers: Local Temp MSB and Local Temp LSB Registers. The remote temperature
supports both a 13-bit unsigned and a 12-bit plus sign format. These readings are available in their
corresponding registers as described in Table 8. The lower 2-bits of the remote temperature reading will contain
temperature information only if the digital filter is enabled. If the digital filter is disabled, these two bits will read
back 0.
The signed and unsigned remote temperature readings are available simultaneously in separate registers,
therefore allowing both negative temperatures and temperatures 128°C and above to be measured.
All Limit Registers support unsigned temperature format with 1°C LSb resolution. The Local Shared TCRIT and
OS Limit Register is 7 bits for limits between 0°C and 127°C. The Remote Temperature TCRIT and OS Limit
Registers are 8 bits each for limits between 0°C and 255°C.
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CONVERSION SEQUENCE
In the power-up default state the LM95245 takes a maximum of 1 second to convert the Local Temperature,
Remote Temperature, and to update all of its registers. Only during the conversion process is the Busy bit (D7) in
Status Register 1 (02h) high. These conversions are addressed in a round-robin sequence. The conversion rate
may be modified by the Conversion Rate bits found in the Conversion Rate Register (R/W: 04h/0Ah). When the
conversion rate is modified a delay is inserted between conversions, the actual maximum conversion time
remains at 72 ms. Different conversion rates will cause the LM95245 to draw different amounts of supply current
as shown in Figure 7.
Figure 7. Conversion Rate Effect on Power Supply Current
POWER-ON-DEFAULT STATES
LM95245 always powers up to these known default states. The LM95245 remains in these states until after the
first conversion.
1. Command Register set to 00h
2. Conversion Rate register defaults to 02h (1 second).
3. Local Temperature set to 0°C until the end of the first conversion
4. Remote Diode Temperature set to 0°C until the end of the first conversion
5. Remote OS limit default is 55h (85 °C).
6. Local Shared and TCRIT limit default is 55h (85 °C).
7. Remote TCRIT limit default is 6Eh (110 °C).
8. Remote Offset High and Low bytes default to 00h.
9. Configuration Register 1 defaults to 00h. This sets the LM95245 as follows:
(a) The STOP/RUN defaults to the active/converting mode.
(b) The Local and Remote TCRIT and OS Masks are reset to 0.
10. Configuration Register 2 defaults to 1Fh. This sets the LM95245 as follows:
(a) Remote Diode digital filter defaults on.
(b) The Remote Diode mode defaults to a typical Intel processor on 45/65/90 nm process.
(c) Diode Fault Mask bit for TCRIT defaults to 1.
(d) Diode Fault Mask bit for OS defaults to 0.
(e) Pin 6 Function defaults to Address Input function (A0).
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SMBus INTERFACE
The LM95245 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBDAT line is
bidirectional. The LM95245 never drives the SMBCLK line and it does not support clock stretching. According to
SMBus specifications, the LM95245 has a 7-bit slave address. Three SMBus addresses can be selected by
connecting pin 6 (A0) to either Low, Mid-Supply or High voltages. The address selection table below shows two
sets of possible selections for the LM95245CIMM and the LM95245CIMM-1.
LM95245CIMM SMBus Device
Address
LM95245CIMM-1 SMBus
Device Address
State of the A0 Pin
HEX
18
Binary
HEX
19
Binary
Low
Mid-Supply
High
001 1000
010 1001
100 1100
001 1001
010 1001
100 1100
29
29
4C
4D
The OS/A0 pin, after power-up, defaults as an address select input pin (A0). After power-up, the OS/A0 pin can
only be programmed as an OS output when it is in the “High” state. Therefore, 4Ch is the only valid slave
address that can be used when the OS/A0 pin is programmed to function as an OS output. When the OS/A0 pin
is programmed to function as an A0 input the LM95245 will immediately detect the state of this pin to determine
its SMBus slave address. The LM95245 does not latch the state of the A0 pin when it is functioning as an input.
If the OS/A0 pin is not used it must be externally connected through hardware to some state, as shown in the
table, in order to guarantee that the proper address is selected and not in an indeterminate state. The OS/A0
does not have an internal pull-up.
DIGITAL FILTER
In order to suppress erroneous remote temperature readings due to noise, the LM95245 incorporates a digital
filter for the Remote Temperature Channel. The filter is accessed in the Configuration Register 2, bits D2 (FE1)
and D1(FE0). The filter can be set according to the following table.
FE1
0
FE0
0
Filter Setting
Filter Off
0
1
Reserved
Reserved
Filter On
1
0
1
1
Filter Impulse and Step Response Curves depicts the filter output in response to a step input and an impulse
input.
Filter Impulse and Step Response Curves
Figure 8. Seventeen and Fifty Degree Step
Response
Figure 9. Impulse Response with Input Transients
Less Than 4°C
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Figure 10. Impuse Response with Input Transients Greater Than 4°C
Figure 11 shows the filter in use in a typical Intel processor on a 45/65/90 nm process system. Note that the two
curves have been purposely offset for clarity. Inserting the filter does not induce an offset as shown.
45
LM95245 with
Filter Off
43
41
39
37
35
33
31
29
27
25
LM95245 with
Filter On
0
50
100
150
200
SAMPLE NUMBER
Figure 11. Digital Filter Response in a Typical Intel Processor on a 45nm, 65 nm or 90 nm Process
(Filter Curves Were Purposely Offset for Clarity)
TEMPERATURE DATA FORMAT
Temperature data can only be read from the Local and Remote Temperature registers.
Remote temperature data with the digital filter off is represented by an 10-bit plus sign, two's complement word
and 11-bit unsigned binary word with an LSb (Least Significant Bit) equal to 0.125°C. The data format is a left
justified 16-bit word available in two 8-bit registers. Unused bits report "0".
Remote temperature data with the digital filter on is represented by a 12-bit plus sign, two's complement word
and 13-bit unsigned binary word with an LSb (Least Significant Bit) equal to 0.03125°C (1/32°C). The data format
is a left justified 16-bit word available in two 8-bit registers. Unused bits report "0".
Table 3. 11-Bit, 2's Complement (10-Bit Plus Sign)
Digital Output
Temperature
Binary
Hex
+125°C
+25°C
+1°C
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0010 0000
0000 0000 0000 0000
7D00h
1900h
0100h
0020h
0000h
+0.125°C
0°C
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Table 3. 11-Bit, 2's Complement (10-Bit Plus
Sign) (continued)
Digital Output
Temperature
Binary
Hex
−0.125°C
−1°C
1111 1111 1110 0000
1111 1111 0000 0000
1110 0111 0000 0000
1100 1001 0000 0000
FFE0h
FF00h
E700h
C900h
−25°C
−55°C
Table 4. 11-Bit, Unsigned Binary
Digital Output
Temperature
Binary
Hex
+255.875°C
+255°C
+201°C
+125°C
+25°C
1111 1111 1110 0000
1111 1111 0000 0000
1100 1001 0000 0000
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0010 0000
0000 0000 0000 0000
FFE0h
FF00h
C900h
7D00h
1900h
0100h
0020h
0000h
+1°C
+0.125°C
0°C
Table 5. 13-Bit, 2's Complement (12-Bit Plus Sign)
Digital Output
Temperature
Binary
Hex
+125°C
+25°C
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0000 1000
0000 0000 0000 0000
1111 1111 1111 1000
1111 1111 0000 0000
1110 0111 0000 0000
1100 1001 0000 0000
7D00h
1900h
0100h
0008h
0000h
FFF8h
FF00h
E700h
C900h
+1°C
+0.03125°C
0°C
−0.03125°C
−1°C
−25°C
−55°C
Table 6. 13-Bit, Unsigned Binary
Digital Output
Temperature
Binary
Hex
+255.875°C
+255°C
+201°C
+125°C
+25°C
1111 1111 1110 0000
1111 1111 0000 0000
1100 1001 0000 0000
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0000 1000
0000 0000 0000 0000
FFE0h
FF00h
C900h
7D00h
1900h
0100h
0008h
0000h
+1°C
+0.03125°C
0°C
Local Temperature data is represented by a 10-bit plus sign, two's complement word with an LSb (Least
Significant Bit) equal to 0.125°C. The data format is a left justified 16-bit word available in two 8-bit registers.
Unused bits will always report "0". Local temperature readings greater than +127.875°C are clamped to
+127.875°C, they will not roll-over to negative temperature readings.
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Table 7. 11-Bit, 2's Complement (10-Bit Plus Sign)
Digital Output
Binary
Temperature
Hex
+125°C
+25°C
+1°C
0111 1101 0000 0000
0001 1001 0000 0000
0000 0001 0000 0000
0000 0000 0010 0000
0000 0000 0000 0000
1111 1111 1110 0000
1111 1111 0000 0000
1110 0111 0000 0000
1100 1001 0000 0000
7D00h
1900h
0100h
0020h
0000h
FFE0h
FF00h
E700h
C900h
+0.125°C
0°C
−0.125°C
−1°C
−25°C
−55°C
SMBDAT OPEN-DRAIN OUTPUT
The SMBDAT output is an open-drain output and does not have internal pull-ups. A “high” level will not be
observed on this pin until pull-up current is provided by some external source, typically a pull-up resistor. Choice
of resistor value depends on many system factors but, in general, the pull-up resistor should be as large as
possible without effecting the SMBus desired data rate. This will minimize any internal temperature reading
errors due to internal heating of the LM95245. The maximum resistance of the pull-up to provide a 2.1V high
level, based on LM95245 specification for High Level Output Current with the supply voltage at 3.0V, is 82 kΩ
(5%) or 88.7 kΩ (1%).
T_CRIT OUTPUT AND TCRIT LIMIT
The LM95245's T_CRIT pin is an active-low open-drain output that is triggered when the local and/or the remote
temperature conversion is above the limits defined by the Remote and/or Local Limit registers. The state of the
T_CRIT pin will return to the HIGH state when both the Local and Remote temperatures are below the values
programmed into the Limit Registers less the value in the Common Hysteresis Register. Additionally, if the
remote temperature exceeds the value in the Remote TCRIT Limit Register the Status Bit for Remote TCRIT
(RTCRIT), in Status Register 1, is set to 1. In the same way if the local temperature exceeds the value in the
Local Shared OS and TCRIT Limit Register the Status Bit for the Shared Local OS and TCRIT (LOC) bit in
Status Register 1 is set to 1.The T_CRIT output and the Status Register flags are updated after every Local and
Remote temperature conversion. See Figure 12
Remote TCRIT Limit
Hysteresis
Remote
Temperature
Remote TCRIT Limit -
Hysteresis
T_CRIT
Output Pin
Status bit RCRIT
Figure 12. T_CRIT Comparator Temperature Response Diagram
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OS OUTPUT AND OS LIMIT
The LM95245's OS/A0 pin is selected as an OS digital output as described in SMBus INTERFACE. As an OS
pin, it is activated whenever the local and/or remote temperature conversion is above the limits defined by the
Limit registers. If the remote temperature exceeds the value in the Remote OS Limit Register the Status Bit for
Remote OS (ROS) in Status Register 1 is set to 1. In the same way if the local temperature exceeds the value in
the Local Shared OS and TCRIT Limit Register the Status Bit for the Shared Local OS and TCRIT (LOC) bit in
Status Register 1 is set to 1. The state of the T_CRIT pin output will return to the HIGH state when both the
Local and Remote temperatures are below the values programmed into the Limit Registers less the value in the
Common Hysteresis Register. The OS output and the Status Register flags are updated after every Local and
Remote temperature conversion. See Figure 13.
Remote OS Limit
Hysteresis
Remote
Temperature
Remote OS Limit -
Hysteresis
OS
Output Pin
Status bit ROS
Figure 13. OS Temperature Response Diagram
DIODE FAULT DETECTION
The LM95245 is equipped with operational circuitry designed to detect fault conditions concerning the remote
diodes. In the event that the D+ pin is detected as shorted to GND, VDD or D+ is floating, the Remote
Temperature reading is –128.000 °C if signed format is selected and +255.875 °C if unsigned format is selected.
In addition, the Status Register 1 bit D2 is set.
COMMUNICATING with the LM95245
SMBus Timing Diagrams for Access of Data (Default Address of 4Ch is Shown)
1
9
1
9
SMBCLK
SMBDAT
R/W
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
Ack
by
LM95245
Stop
by
Master
Ack by
LM95245
Start by
Master
Frame 1
Frame 2
Serial Bus Address Byte
Command Byte
Figure 14. (a) Serial Bus Write to the Internal Command Register
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1
9
1
9
SMBCLK
R/W
SMBDAT
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
Ack
by
LM95245
Ack
by
LM95245
Start by
Master
Frame 1
Frame 2
Serial Bus Address Byte
Command Byte
1
9
SMBCLK
(Continued)
SMBDAT
(Continued)
D7 D6 D5 D4 D3 D2 D1 D0
Stop
by
Ack by
LM95245
Master
Frame 3
Data Byte
Figure 15. (b) Serial Bus Write to the Internal Command Register Followed by a Data Byte
1
9
1
9
SMBCLK
SMBDAT
A6 A5 A4 A3 A2 A1
A0
R/W
D7 D6 D5 D4 D3 D2 D1 D0
Ack
by
LM95245
NoAck Stop
Start by
Master
by
by
Master Master
Frame 1
Frame 2
Serial Bus Address Byte
Data Byte from the LM95245
Figure 16. (c) Serial Bus byte Read from a Register with the Internal Command Register Preset to
Desired Value
1
9
1
9
SMBCLK
SMBDAT
R/W
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
Ack
by
LM95245
Ack
by
Repeat
Start by
Start by
Master
LM95245 Master
Frame 1
Frame 2
Serial Bus Address Byte
Command Byte
1
9
1
9
SMBCLK
(Continued)
SMBDAT
(Continued)
A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
R/W
Ack
by
No Ack Stop
by
by
Master Master
LM95245
Frame 3
Frame 4
Serial Bus Address Byte
Data Byte from the LM95245
Figure 17. (d) Serial Bus Write followed by a Repeat Start and Immediate Read
The data registers in the LM95245 are selected by the Command Register. At power-up the Command Register
is set to “00”, the location for the Read Local Temperature Register. The Command Register latches the last
location it was set to. Each data register in the LM95245 falls into one of four types of user accessibility:
1. Read only
2. Write only
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3. Write/Read same address
4. Write/Read different address
A Write to the LM95245 will always include the address byte and the command byte. A write to any register
requires one data byte.
Reading the LM95245 can take place either of two ways:
1. If the location latched in the Command Register is correct (most of the time it is expected that the Command
Register will point to one of the Read Temperature Registers because that will be the data most frequently
read from the LM95245), then the read can simply consist of an address byte, followed by retrieving the data
byte.
2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another
address byte will accomplish a read.
The data byte has the most significant bit first. At the end of a read, the LM95245 can accept either acknowledge
or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master
has read its last byte). When retrieving all 11 bits from a previous remote diode temperature measurement, the
master must insure that all 11 bits are from the same temperature conversion. This may be achieved by reading
the MSB register first. The LSB will be locked after the MSB is read. The LSB will be unlocked after being read. If
the user reads MSBs consecutively, each time the MSB is read, the LSB associated with that temperature will be
locked in and override the previous LSB value locked-in.
SERIAL INTERFACE RESET
In the event that the SMBus Master is RESET while the LM95245 is transmitting on the SMBDAT line, the
LM95245 must be returned to a known state in the communication protocol. This may be done in one of two
ways:
1. When SMBDAT is LOW, the LM95245 SMBus state machine resets to the SMBus idle state if either
SMBDAT or SMBCLK are held low for more than 35 ms (tTIMEOUT). Note that according to SMBus
specification 2.0 all devices are to timeout when either the SMBCLK or SMBDAT lines are held low for 25 -
35 ms. Therefore, to insure a timeout of all devices on the bus the SMBCLK or SMBDAT lines must be held
low for at least 35 ms.
2. When SMBDAT is HIGH, have the master initiate an SMBus start. The LM95245 will respond properly to an
SMBus start condition at any point during the communication. After the start the LM95245 will expect an
SMBus Address address byte.
ONE-SHOT CONVERSION
The One-Shot register is used to initiate a single conversion and comparison cycle when the device is in standby
mode, after which the device returns to standby. This is not a data register and it is the write operation that
causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will
always be read from this register.
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LM95245 REGISTERS
Command register selects which registers will be read from or written to. Data for this register should be
transmitted during the Command Byte of the SMBus write communication. POR means Power-On Reset.
P0-P7: Command
P7
P6
P5
P4
P3
P2
P1
P0
Command
Table 8. Register Summary
Read
Address
(Hex)
Write
Address
(Hex)
No.
of
bits
POR
Default
(Hex)
Read/
Write
Register Name
Description
TEMPERATURE SIGNED VALUE REGISTERS
Local Temp MSB
0x00
0x30
0x01
0x10
NA
NA
NA
NA
8
3
−
−
−
−
RO
RO
RO
RO
Supports SMBus byte
Local Temp LSB
All unused bits are reported as "0".
Supports SMBus byte
Remote Temp MSB – Signed
Remote Temp LSB – Signed
8
5/3
All unused bits are reported as "0".
TEMPERATURE UNSIGNED VALUE REGISTERS
Remote Temp MSB –
Unsigned
0x31
0x32
NA
8
−
−
RO
RO
Supports SMBus byte reads
Remote Temp LSB –
Unsigned
NA
5/3
All unused bits are reported as "0".
DIODE CONFIGURATION REGISTERS
Filter Enable, Diode Model Select, Diode Fault
Mask; Pin 6 OS/A0 function select
Configuration Register 2
0xBF
0x11
0x12
0xBF
0x11
0x12
5
8
3
0x1F
0x00
0x00
R/W
R/W
R/W
Remote Offset
High Byte
2's Complement
Remote Offset
Low Byte
2's Complement
All unused bits are reported as "0".
GENERAL CONFIGURATION REGISTERS
0x03/
Configuration Register 1
0x09
0x09/
0x03
STOP/RUN , Remote TCRIT mask, Remote OS
mask, Local TCRIT mask, Local OS mask
5
2
−
0x00
0x02
−
R/W
R/W
WO
Conversion Rate
0x04/0x0A 0x04/0x0A
Continuous or specific settings
A write to this register activates one conversion if
STOP/RUN bit = 1.
One-Shot
NA
0x0F
STATUS REGISTERS
Status Register 1
0x02
0x33
NA
NA
5
2
−
−
RO
RO
Busy bit, and status bits
Not Ready bit
Status Register 2
LIMIT REGISTERS
0x07/
0x0D
0x0D/
0x07
Unsigned 0 to 255 °C
Default 85 °C
Remote OS Limit
8
7
0x55
0x55
R/W
R/W
Local Shared OS and T_Crit
Limit
Unsigned 0 to 127 °C
Default 85 °C
0x20
0x20
Unsigned 0 to 255 °C
Default 110 °C
Remote T_Crit Limit
0x19
0x21
0x19
0x21
8
5
0x6E
0x0A
R/W
R/W
Common Hysteresis
IDENTIFICATION REGISTERS
Manufacturer ID
up to 31°C
0xFE
0xFF
0x01
0xB3
RO
RO
Always returns 0x01
Revision ID
Returns revision number.
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LOCAL and REMOTE MSB and LSB TEMPERATURE REGISTERS
Table 9. Local Temperature MSB
(Read Only Address 00h)
10-bit plus sign format:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
SIGN
64
32
16
8
4
2
1
Temperature Data: LSb = 1°C.
Table 10. Local Temperature LSB
(Read Only Address 30h)
10-bit plus sign format:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
0.5
0.25
0.125
0
0
0
0
0
Temperature Data: LSb = 0.125°C.
Table 11. Signed Remote Temperature MSB
(Read Only Address 01h)
12-bit plus sign format:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
SIGN
64
32
16
8
4
2
1
Temperature Data: LSb = 1°C.
Table 12. Signed Remote Temperature LSB, Filter On
(Read Only Address 10h)
12-bit plus sign binary formats with filter on:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
0.5
0.25
0.125
0.0625
0.03125
0
0
0
Table 13. Signed Remote Temperature LSB, Filter Off
(Read Only Address 10h)
12-bit plus sign binary formats with filter off:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
0.5
0.25
0.125
0
0
0
0
0
Temperature Data: LSb = 0.125°C filter off or 0.03125°C filter on.
Table 14. Unsigned Remote Temperature MSB
(Read Only Address 31h)
13-bit unsigned format:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
128
64
32
16
8
4
2
1
Temperature Data: LSb = 1°C.
Table 15. Unsigned Remote Temperature LSB, Filter On
(Read Only Address 32h)
13-bit unsigned binary formats with filter on:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
0.5
0.25
0.125
0.0625
0.03125
0
0
0
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Table 16. Unsigned Remote Temperature LSB, Filter Off
(Read Only Address 32h)
13-bit unsigned binary formats with filter off:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
0.5
0.25
0.125
0
0
0
0
0
Temperature Data: LSb = 0.125°C filter off or 0.03125°C filter on.
For data synchronization purposes, the MSB register should be read first if the user wants to read both MSB and LSB registers. The LSB
will be locked after the MSB is read. The LSB will be unlocked after being read. If the user reads MSBs consecutively, each time the MSB
is read, the LSB associated with that temperature will be locked in and override the previous LSB value locked-in.
DIODE CONFIGURATION REGISTERS
Table 17. Configuration Register 2
(Read/write Address BFh):
D7
D6
D5
D4
D3
D2
D1
D0
0
OS/A0 Function Select
OS Fault Mask
T_CRIT Mask
TruTherm Select
RFE1
RFE0
1
Bits
Name
Description
7
Reserved
Reports "0" when read.
0: Address (A0) function is enabled
1: Over-temperature Shutdown (OS) is enabled
6
OS/A0 Function Select
0: Off
1: On
5
4
Diode Fault Mask for OS
Diode Fault Mask for T_CRIT
0: Off
1: On
0: Selects Diode Model 2, MMBT3904, with TruTherm technology disabled. Note,
performance in this mode is not guaranteed.
1: Selects Diode Model 1, A typical Intel Processor, with 45nm, 65 nm or 90 nm
technology, and TruTherm technology enabled.
Remote Diode TruTherm
Mode Select
3
00: Filter Disable
01: Reserved
10: Reserved
2-1
0
Remote Filter Enable
Reserved
11: Filter Enable
Reports "1" when read.
Power up default is 1Fh.
Table 18. Remote Offset High Byte (2's Complement)
(R/W Address 11h)
10-bit plus sign format:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
SIGN
64
32
16
8
4
2
1
Power up default is 00h.
Table 19. Remote Offset Low Byte (2's Complement)
(R/W Address 12h)
10-bit plus sign format:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
0.50
0.25
0.125
0
0
0
0
0
Power up default is 00h. LSb = 0.125 °C.
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GENERAL CONFIGURATION REGISTERS
Table 20. Configuration Register 1
(Read/write Address 03h/09h or 09h/03h):
D7
D6
D5
D4
D3
D2
D1
D0
0
STOP/RUN
0
Remote T_CRIT Mask
Remote OS Mask
Local T_CRIT Mask
Local OS Mask
0
Bits
Name
Description
7
Reserved
Reports "0" when read.
0: Active / Converting
1: Standby
6
5
4
STOP/RUN
Reserved
Reports "0" when read.
0: Off
1: On
Remote T_CRIT Mask
0: Off
1: On
3
2
Remote OS Mask
0: Off
1: On
Local T_CRIT Mask
0: Off
1: On
1
0
Local OS Mask
Reserved
Reports "0" when read.
Power up default is 00h.
Table 21. Conversion Rate Register
(Read/write Address 04h/0Ah or 0Ah/04h):
2-bit format:
BIT
D7
D6
D5
D4
D3
D2
D1
D0
Value
0
0
0
0
0
0
MSb
LSb
Bits
Name
Reserved
Description
7:2
Reports "0" when read.
00: Continuous (33 ms typical when remote diode is missing or fault or 63 ms typical
with remote diode connected)
01: 0.364 seconds
10: 1 second
1:0
Conversion Rate
11: 2.5 seconds
Power up default is 02h (1 second).
Table 22. One Shot Register
(Write Only Address 0Fh):
Writing to this register will start one conversion if the device is in standby mode (i.e. STOP/RUN bit = 1).
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STATUS REGISTERS
Table 23. Status Register 1
(Read Only Address 02h):
D7
D6
D5
D4
D3
D2
D1
D0
Busy
0
0
ROS
0
Diode Fault
RTCRIT
LOC
Bits
7
Name
Description
Busy
When set to "1" the part is converting.
Report "0" when read.
6-5
4
Reserved
ROS
Status Bit for Remote OS
Reports "0" when read.
3
Reserved
2
Status bit for missing diode (Either D+ is shorted to GND, or VDD; or D+ is floating.)
Note: The unsigned registers will report 0°C if read; the signed value registers will report
−128.000°C.
Diode Fault
1
0
RTCRIT
LOC
Status bit for Remote TCRIT.
Status bit for the shared Local OS and TCRIT .
Table 24. Status Register 2
(Read Only Address 33h):
D7
D6
D5
D4
D3
D2
D1
D0
Not Ready
Reserved
0
0
0
0
0
0
Bits
7
Name
Description
Not Ready
Reserved
Reserved
Waiting for 30 ms power-up sequence to end.
Can report "0" or "1" when read.
Reports "0" when read.
6
5-0
LIMIT REGISTERS
Table 25. Unsigned Remote OS Limit - 0°C to 255°C
(Read/Write Address 07h/0Dh or 0Dh/07h):
D7
D6
D5
D4
D3
D2
D1
D0
128
64
32
16
8
4
2
1
Power on Reset default is 55h (85°C).
Table 26. Unsigned Local Shared OS and T_CRIT Limit - 0°C to 127°C
(Read/Write Address 20h):
D7
D6
D5
D4
D3
D2
D1
D0
128
64
32
16
8
4
2
1
Power on Reset default is 55h (85°C).
Table 27. Unsigned Remote T_CRIT Limit - 0°C to 255°C
(Read/Write Address 19h):
D7
D6
D5
D4
D3
D2
D1
D0
128
64
32
16
8
4
2
1
Power on Reset default is 6Eh (110°C).
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Table 28. Common Hysteresis Register
(Read/Write Address 21h):
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
16
8
4
2
1
Power on Reset default is 0Ah (10°C).
IDENTIFICATION REGISTERS
Table 29. Manufacturers ID Register
(Read Only Address FEh):
Always returns 01h.
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
1
Table 30. Revision ID Register
(Read Only Address FFh)
Default is B3h. This register will increment by 1 every time there is a revision to the die by Texas Instruments. The initial revision bits for
B3h are shown below.
D7
D6
D5
D4
D3
D2
D1
D0
1
0
1
1
0
0
1
1
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APPLICATIONS HINTS
The LM95245 can be applied easily in the same way as other integrated-circuit temperature sensors, and its
remote diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit
board, and because the path of best thermal conductivity is between the die and the pins, its temperature will
effectively be that of the printed circuit board lands and traces soldered to the LM95245's pins. This presumes
that the ambient air temperature is almost the same as the surface temperature of the printed circuit board; if the
air temperature is much higher or lower than the surface temperature, the actual temperature of the LM95245 die
will be at an intermediate temperature between the surface and air temperatures. Again, the primary thermal
conduction path is through the leads, so the circuit board temperature will contribute to the die temperature much
more strongly than will the air temperature.
To measure temperature external to the LM95245's die, use a remote diode. This diode can be located on the
die of a target IC, allowing measurement of the IC's temperature, independent of the LM95245's temperature. A
discrete diode can also be used to sense the temperature of external objects or ambient air. Remember that a
discrete diode's temperature will be affected, and often dominated, by the temperature of its leads. Most silicon
diodes do not lend themselves well to this application. It is recommended that an MMBT3904 transistor base-
emitter junction be used with the collector tied to the base. Accuracy using the MMBT3904 is not guaranteed. For
applications requiring the use of the MMBT3904 use the LM95235.
The LM95245's BJT Beta Compensation TruTherm technology allows accurate sensing of integrated thermal
diodes, such as those found on most processors.
The LM95245 has been optimized to measure the remote thermal diode integrated in a typical Intel processor on
45 nm, 65 nm or 90 nm process. Using the Remote Diode Model Select register the remote inputs must be
assigned to sense a typical Intel processor on 45nm, 65 nm or 90 nm process. The typical performance of the
LM95245 with these processors is shown in Figure 18. The Remote Offset register can be used to compensate
for temperature errors further.
Figure 18. LM95245 Typical Performance with a Variety of Intel Processors
DIODE NON-IDEALITY
Diode Non-Ideality Factor Effect on Accuracy
When a transistor is connected as a diode, the following relationship holds for variables VBE, T and IF:
V
h xV
BE
≈
’
◊
»
ÿ
Ÿ
⁄
t
«
…
=
x e
-1
IF IS
…
Ÿ
where
•
kT
q
=
Vt
24
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•
•
•
•
•
•
•
q = 1.6×10−19 Coulombs (the electron charge),
T = Absolute Temperature in Kelvin
k = 1.38×10−23 joules/K (Boltzmann's constant),
η is the non-ideality factor of the process the diode is manufactured on,
IS = Saturation Current and is process dependent,
If = Forward Current through the base-emitter junction
VBE = Base-Emitter Voltage drop
(1)
(2)
In the active region, the -1 term is negligible and may be eliminated, yielding the following equation
V
h xV
BE
≈
’
»
ÿ
t
«
…
◊Ÿ
=
x e
IF IS
…
Ÿ
⁄
In Equation 2, η and IS are dependant upon the process that was used in the fabrication of the particular diode.
By forcing two currents with a very controlled ratio(IF2 / IF1) and measuring the resulting voltage difference, it is
possible to eliminate the IS term. Solving for the forward voltage difference yields the relationship:
≈IF2 ’
kT
≈ ’ x ln
= h x « q ◊
DVBE
«IF1 ◊
(3)
Solving Equation 3 for temperature yields:
q x DVBE
T =
IF2
≈
’
h x k x ln
∆
∆
÷
÷
IF1
«
◊
(4)
Equation 4 holds true when a diode connected transistor such as the MMBT3904 is used. When this “diode”
equation is applied to an integrated diode such as a processor transistor with its collector tied to GND as shown
in Figure 19 it will yield a wide non-ideality spread. This wide non-ideality spread is not due to true process
variation but due to the fact that Equation 4 is an approximation.
TruTherm technology uses the transistor (BJT) equation, Equation 5, which is a more accurate representation of
the topology of the thermal diode found in an FPGA or processor.
q x DVBE
T =
I
≈
’
C2
h x k x ln∆
÷
÷
∆
IC1
«
◊
(5)
TruTherm should only be enabled when measuring the temperature of a transistor integrated as shown in the
processor of Figure 19, because Equation 5 only applies to this topology.
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2
3
D+
D-
I
E
= I
F
100 pF
PROCESSOR
I
R
LM95245
I
C
I
F
2
3
D+
D-
MMBT3904
100 pF
I
R
LM95245
Figure 19. Thermal Diode Current Paths
Calculating Total System Accuracy
The voltage seen by the LM95245 also includes the IFRS voltage drop of the series resistance. The non-ideality
factor, η, is the only other parameter not accounted for and depends on the diode that is used for measurement.
Since ΔVBE is proportional to both η and T, the variations in η cannot be distinguished from variations in
temperature. Since the non-ideality factor is not controlled by the temperature sensor, it will directly add to the
inaccuracy of the sensor. For the for Intel processor on 65nm process, Intel specifies a +4.06%/−0.897%
variation in η from part to part when the processor diode is measured by a circuit that assumes diode equation,
Equation 4, as true. As an example, assume a temperature sensor has an accuracy specification of ±1.0°C at a
temperature of 80°C (353 Kelvin) and the processor diode has a non-ideality variation of +4.06%/−0.89%. The
resulting system accuracy of the processor temperature being sensed will be:
TACC = + 1.0°C + (+4.06% of 353 K) = +15.3 °C
(6)
and
TACC = - 1.0°C + (−0.89% of 353 K) = −4.1 °C
(7)
TrueTherm technology uses the transistor equation, Equation 4, resulting in a non-ideality spread that truly
reflects the process variation which is very small. The transistor equation non-ideality spread is ±0.39% for the
65nm thermal diode. The resulting accuracy when using TruTherm technology improves to:
TACC = ±0.75°C + (±0.39% of 353 K) = ± 2.16 °C
(8)
Intel does not specify the diode model ideality and series resistance of the thermal diodes on 45nm so a similar
comparison cannot be calculated, but lab experiments have shown similar improvement. For the 45nm processor
the ideality spread as specified by Intel is -0.399% to +0.699%. The resulting spread in accuracy when using
TruTherm technology with the thermal diode on Intel processors with 45nm process is:
TACC = -0.75°C + (-0.39% of 353 K) = -2.16 °C
(9)
to
TACC = +0.75°C + (+0.799% of 353 K) = +4.32 °C
(10)
The next error term to be discussed is that due to the series resistance of the thermal diode and printed circuit
board traces. The thermal diode series resistance is specified on most processor data sheets. For Intel
processors in 45 nm process, this is specified at 4.5Ω typical with a minimum of 3Ω and a maximum of 7Ω. The
LM95245 accommodates the typical series resistance of Intel Processor on 45 nm process. The error that is not
accounted for is the spread of the processor's series resistance. The equation used to calculate the temperature
error due to series resistance (TER) for the LM95245 is simply:
º
W
≈
’
÷
C
TER = 0.62
x R
PCB
∆
«
◊
(11)
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Solving Equation 11 for RPCB equal to -1.5Ω to 2.5Ω results in the additional error due to the spread in this series
resistance of -0.93°C to +1.55°C. The spread in error cannot be canceled out, as it would require measuring
each individual thermal diode device. This is quite difficult and impractical in a large volume production
environment.
Equation 11 can also be used to calculate the additional error caused by series resistance on the printed circuit
board. Since the variation of the PCB series resistance is minimal, the bulk of the error term is always positive
and can simply be cancelled out by subtracting it from the output readings of the LM95245.
Processor Family
Transistor Equation ηT, non-ideality
Series R,Ω
min
typ
max
1.008
1.005
Intel Processor on 45 nm process
Intel Processor on 65 nm process
0.997
0.997
1.001
1.001
4.5
4.52
Note: NA = Not Available at publication of this document.
PCB LAYOUT FOR MINIMIZING NOISE
Figure 20. Ideal Diode Trace Layout
In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced
on traces running between the remote temperature diode sensor and the LM95245 can cause temperature
conversion errors. Keep in mind that the signal level the LM95245 is trying to measure is in microvolts. The
following guidelines should be followed:
1. VDD should be bypassed with a 0.1 µF capacitor in parallel with 100 pF. The 100 pF capacitor should be
placed as close as possible to the power supply pin. A bulk capacitance of approximately 10 µF needs to be
in the near vicinity of the LM95245.
2. A 100 pF diode bypass capacitor is recommended to filter high frequency noise but may not be necessary.
The LM95245 can handle capacitance up to 3.3 nF (see Typical Performance Curve "Remote Temperature
Reading Sensitivity to Thermal Diode Filter Capacitance"). Place the filter capacitors close to the LM95245
pins and make sure the traces to this capacitor are matched.
3. Ideally, the LM95245 should be placed within 10 cm of the Processor diode pins with the traces being as
straight, short and identical as possible. Trace resistance of 1Ω can cause as much as 0.62°C of error. This
error can be compensated by using simple software offset compensation.
4. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This
GND guard should not be between the D+ and D− lines. In the event that noise does couple to the diode
lines it would be ideal if it is coupled common mode. That is equally to the D+ and D− lines.
5. Avoid routing diode traces in close proximity to power supply switching or filtering inductors.
6. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be
kept at least 2 cm apart from the high speed digital traces.
7. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should
cross at a 90 degree angle.
8. The ideal place to connect the LM95245's GND pin is as close as possible to the Processors GND
associated with the sense diode.
9. Leakage current between D+ and GND and between D+ and D− should be kept to a minimum. Thirteen
nano-amperes of leakage can cause as much as 0.2°C of error in the diode temperature reading. Keeping
the printed circuit board as clean as possible will minimize leakage current.
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Noise coupling into the digital lines greater than 400 mVp-p (typical hysteresis) and undershoot less than 500 mV
below GND, may prevent successful SMBus communication with the LM95245. SMBus no acknowledge is the
most common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of
communication is rather low (100 kHz max), care still needs to be taken to ensure proper termination within a
system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3 dB
corner frequency of about 40 MHz is included on the LM95245's SMBCLK input. Additional resistance can be
added in series with the SMBDAT and SMBCLK lines to further help filter noise and ringing. Minimize noise
coupling by keeping digital traces out of switching power supply areas as well as ensuring that digital lines
containing high speed data communications cross at right angles to the SMBDAT and SMBCLK lines.
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SNIS148G –OCTOBER 2007–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision F (March 2013) to Revision G
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 28
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PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LM95245CIM/NOPB
LM95245CIMM
ACTIVE
SOIC
D
8
8
95
RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
95245
CIM
Samples
NRND
VSSOP
DGK
1000
Non-RoHS
& Green
Call TI
-40 to 125
T45C
LM95245CIMM-1/NOPB
LM95245CIMM/NOPB
LM95245CIMMX-1/NOPB
LM95245CIMMX/NOPB
LM95245CIMX/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
8
8
8
8
8
1000 RoHS & Green
1000 RoHS & Green
3500 RoHS & Green
3500 RoHS & Green
2500 RoHS & Green
SN
SN
SN
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
T46C
T45C
T46C
T45C
Samples
Samples
Samples
Samples
Samples
95245
CIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-May-2023
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM95245CIMM
VSSOP
DGK
DGK
DGK
DGK
DGK
D
8
8
8
8
8
8
1000
1000
1000
3500
3500
2500
178.0
178.0
178.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
5.3
5.3
5.3
5.3
5.3
6.5
3.4
3.4
3.4
3.4
3.4
5.4
1.4
1.4
1.4
1.4
1.4
2.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
LM95245CIMM-1/NOPB VSSOP
LM95245CIMM/NOPB VSSOP
LM95245CIMMX-1/NOPB VSSOP
LM95245CIMMX/NOPB VSSOP
LM95245CIMX/NOPB
SOIC
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM95245CIMM
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
DGK
D
8
8
8
8
8
8
1000
1000
1000
3500
3500
2500
208.0
208.0
208.0
367.0
367.0
367.0
191.0
191.0
191.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
LM95245CIMM-1/NOPB
LM95245CIMM/NOPB
LM95245CIMMX-1/NOPB
LM95245CIMMX/NOPB
LM95245CIMX/NOPB
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
SOIC
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LM95245CIM/NOPB
D
8
95
495
8
4064
3.05
Pack Materials-Page 3
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.189-.197
[4.81-5.00]
NOTE 3
.150
[3.81]
4X (0 -15 )
4
5
8X .012-.020
[0.31-0.51]
B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.010 [0.25]
C A B
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 - 8
.016-.050
[0.41-1.27]
DETAIL A
TYPICAL
(.041)
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
EXPOSED
METAL
.0028 MAX
[0.07]
.0028 MIN
[0.07]
ALL AROUND
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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