LMH1983 [TI]
具有音频时钟的 3G/高清/标清视频时钟发生器;型号: | LMH1983 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有音频时钟的 3G/高清/标清视频时钟发生器 时钟 时钟发生器 |
文件: | 总55页 (文件大小:1943K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LMH1983
SNLS309I –APRIL 2010–REVISED DECEMBER 2014
LMH1983 3G/HD/SD Video Clock Generator with Audio Clock
1 Features
3 Description
The LMH1983 is a highly-integrated programmable
1
•
Four PLLs for Simultaneous A/V Clock Generation
audio/video (A/V) clock generator intended for
broadcast and professional applications. It can
replace multiple PLLs and VCXOs used in
applications supporting SMPTE serial digital video
(SDI) and digital audio AES3/EBU standards. It offers
low-jitter reference clocks for any SDI transmitter to
meet stringent output jitter specifications without
additional clock cleaning circuits.
–
–
–
–
PLL1: 27 or 13.5 MHz
PLL2: 148.5 or 74.25 MHz
PLL3: 148.5/1.001 or 74.25/1.001 MHz
PLL4: 98.304 MHz / 2X (X = 0 to 15)
•
•
3 x 2 Video Clock Crosspoint
Flexible PLL Bandwidth to Optimize Jitter
Performance and Lock Time
The LMH1983 features automatic input format
detection, simple programming of multiple A/V output
formats, genlock or digital free-run modes, and
override programmability of various automatic
functions. The recognized input formats include HVF
syncs for the major video standards, 27 MHz, 10
MHz, and 32/44.1/48/96 kHz audio word clocks.
•
•
•
Soft Resynchronization to New Reference
Digital Holdover or Free-run on Loss of Reference
Status Flags for Loss of Reference and Loss of
PLL Lock
•
•
3.3 V Single Supply Operation
I2C Interface with Address Select Pin (3 States)
The dual-stage PLL architecture integrates four PLLs
with three on-chip VCOs. The first stage (PLL1) uses
an external low-noise 27 MHz VCXO with narrow
loop bandwidth to provide a clean reference clock for
the next stage. The second stage (PLL2, 3, 4)
consists of three parallel VCO PLLs for simultaneous
generation of the major digital A/V clock fundamental
rates, including 148.5 MHz, 148.5/1.001 MHz, and
98.304 MHz (4 × 24.576 MHz). Each PLL can
generate a clock and a timing pulse to indicate top of
frame (TOF).
2 Applications
•
•
•
•
•
•
•
•
•
•
Triple Rate (3G/HD/SD) SDI SerDes
FPGA Reference Clock Generation/Cleaning
Audio Embed or De-embed
Video Cameras
Frame Synchronizers (Genlock, DARS)
A-D or D-A Conversion, Editing, Processing Cards
Keyers and Logo Inserters
Device Information(1)
Format or Standards Converters
Video Displays and Projectors
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMH1983
WQFN (40)
6.00 mm × 6.00 mm
A/V Test and Measurement Equipment
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Block Diagram
LOOP
FILTER
27 MHz
VCXO
27 MHz (PLL1)
525i
Analog
ref. in
H sync
V sync
F sync
CLKout1
29.97 Hz (TOF1)
525i/29.97 SDI out
+ embedded audio
LMH1981
Sync
Separator
Hin
Vin
Fin
148.5 MHz (PLL2)
29.97 Hz (TOF2)
CLKout2
CLKout3
FPGA
1080p/59.94 SDI out
+ embedded audio
A/V Frame Sync with
Downconverter,
LMH1983
148.35 MHz (PLL3)
59.94 Hz (TOF3)
Audio Embedder and
De-embedder
1080p/59.94 SDI in
+ embedded audio
24.576 MHz (PLL4)
5.994 Hz
CLKout4
Genlocked to video ref. in
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMH1983
SNLS309I –APRIL 2010–REVISED DECEMBER 2014
www.ti.com
Table of Contents
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 20
8.5 Programming........................................................... 24
8.6 Register Map........................................................... 26
Applications and Implementation ...................... 35
9.1 Application Information............................................ 35
9.2 Typical Applications ................................................ 35
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Description (continued)......................................... 3
Pin Configurations and Functions....................... 3
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Frame Timing Outputs Timing Requirements........... 8
7.7 Frame Timing Outputs Switching Characteristics..... 8
7.8 Typical Characteristics.............................................. 9
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 12
9
10 Power Supply Recommendations ..................... 43
11 Layout................................................................... 43
11.1 Layout Guidelines ................................................. 43
11.2 Layout Example .................................................... 44
12 Device and Documentation Support ................. 47
12.1 Documentation Support ........................................ 47
12.2 Trademarks........................................................... 47
12.3 Electrostatic Discharge Caution............................ 47
12.4 Glossary................................................................ 47
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 47
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (October 2014) to Revision I
Page
•
•
Updated ESD Ratings table.................................................................................................................................................... 5
Updated formatting for Typical Characteristics graphs ......................................................................................................... 9
Changes from Revision G (Nov 2012) to Revision H
Page
•
Added Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and
Functions, Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation
Support; Mechanical, Packaging, and Ordering Information ................................................................................................. 1
Changed typical value of low output sink current to match simulation value of 1.25 mA. .................................................... 6
Added clarification about PLL4 behavior. ............................................................................................................................ 15
Added clarification section for LOR Determination .............................................................................................................. 17
Changed appearance of Reg 0x11 mode description for clarity. ......................................................................................... 18
Changed register initialization procedure to prevent device from exhibiting poor duty cycle performance on CLKout3 .... 19
Added clarification note about 480i/29.97, 480p/59.94, 576i/25 and 576p/50 resolutions................................................... 23
Changed default value for Reg 0x11[3:2] bits. .................................................................................................................... 28
Changed Reg 0x11[3:2] description for clarification of TOF1_Sync behavior dependent on LOA window ......................... 28
•
•
•
•
•
•
•
•
2
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SNLS309I –APRIL 2010–REVISED DECEMBER 2014
5 Description (continued)
When locked to reference, an internal 10-bit ADC will track the loop filter control voltage. When a loss of
reference (LOR) occurs, the LMH1983 can be programmed to hold the control voltage to maintain output
accuracy within ±0.5 ppm (typical) of the previous reference. The LMH1983 can be configured to re-synchronize
to a previous reference with glitch-less operation.
6 Pin Configurations and Functions
RTA40A Package
40-Pin WQFN Package with Exposed Thermal Pad
Top View
VDD
VDD
Hin
1
2
3
4
5
6
7
30 Fout2
29
CLKout2-
28 CLKout2+
27 Cbyp2
Vin
Fin
26
25
Cbyp4
Cbyp3
Die Attach Pad (DAP)
INIT
Connect to GND on PCB
ADDR
24 CLKout3-
23 CLKout3+
22 Fout3
8
9
SDA
SCL
VDD
21 GND
10
Pin Functions
PIN
SIGNAL
LEVEL
I/O
DESCRIPTION
NO.
1
NAME
VDD
–
–
Power
Power
3.3-V supply for PLL1
3.3-V supply for logic I/O
2
VDD
Horizontal sync reference signal
3
Hin
I
LVCMOS
Auto polarity correction for HVF will be based off Hin polarity.
Recognized clock inputs can be applied to Hin.
4
5
6
Vin
Fin
I
I
I
LVCMOS
LVCMOS
LVCMOS
Vertical sync reference signal
Field sync (odd/even) reference signal
INIT
Reset signal for audio-video phase alignment (rising edge triggered)
I2C address select
Pin settings:
7
ADDR
I
LVCMOS
– Tie low: 0x65 (7-bit slave address in hex)
– Float: 0x66
– Tie high: 0x67
8
SDA(1)
SCL(1)
I/O
I
I2C
I2C
I2C Data signal
I2C Clock signal
9
10
11
12
VDD
NO_LOCK(2)
–
Power
LVCMOS
LVCMOS
3.3-V supply for logic I/O
O
O
Loss of lock status flag for PLLs 1-4 (active high)
Loss of alignment status flag for OUTs 1–4 (active high)
NO_ALIGN
(1) SDA and SCL pins each require a pull-up resistor of 4.7 kΩ to the VDD supply.
(2) The NO_LOCK status flag is derived from the Lock Status register bits (LOCK1-4) for each PLL. Each lock status bit can be masked
from the NO_LOCK flag by setting their respective mask bits.
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Pin Functions (continued)
PIN
SIGNAL
LEVEL
I/O
DESCRIPTION
NO.
NAME
13
NO_REF
O
O
–
LVCMOS
LVDS
Loss of reference status flag (active high)
14
15
CLKout4–
CLKout4+
Audio clock from PLL4 (fundamental rate is 98.304 MHz).
The output is 24.576 MHz by default and is selectable via the host.
16
17
VDD
Power
3.3 V supply for CLKout4
Audio frame timing signal for OUT4 (active low.) Timing Generator
fixed to PLL4 clock. The output is the audio-video-frame (AVF) pulse
by default and is programmable via the host. Optional OSCin function
can be used to apply a 27 MHz external clock for PLL4 to generate an
audio clock independent of the video input reference; this function
must be enabled via the host.
Fout4 (OSCin)
I/O
LVCMOS
18
19
20
21
GND
VDD
VDD
GND
–
–
–
–
GND
Power
Power
GND
Ground
3.3 V supply for PLL3 and PLL4
3.3 V supply for CLKout3
Ground
Video frame timing signal for OUT3 (active low). Timing generator
assignable to PLL1, PLL2, or PLL3. OUT3 format is selectable via the
host.
22
Fout3
O
O
LVCMOS
LVDS
Video clock from PLL1, PLL2, or PLL3 depending on output
crosspoint mode. The output is 148.35 MHz by default and is
selectable via the host.
23
24
CLKout3+
CLKout3–
Bias bypass for on-chip LDO for PLL3
Connect to 1.0 µF and 0.1 µF bypass capacitors.
25
26
27
Cbyp3
Cbyp4
Cbyp2
–
–
–
Analog
Analog
Analog
Bias bypass for on-chip LDO for PLL4
Connect to 1.0 µF and 0.1 µF bypass capacitors.
Bias bypass for on-chip LDO for PLL2
Connect to 1.0 µF and 0.1 µF bypass capacitors.
Video clock from PLL1, PLL2, or PLL3 depending on output
crosspoint mode. The output is 148.5 MHz by default and is selectable
via the host.
28
29
CLKout2+
CLKout2–
O
O
LVDS
Video frame timing signal for OUT2 (active low). Timing generator
assignable to PLL1, PLL2, or PLL3. OUT2 format is selectable via the
host.
30
Fout2
LVCMOS
31
32
VDD
VDD
–
–
Power
Power
3.3-V supply for CLKout2
3.3-V supply for PLL2
27 MHz VCXO clock signal for PLL1.
33
34
XOin–(3)
XOin+
– LVCMOS: Directly connect clock signal to XOin+ and bias XOin- to
mid-supply with 0.1µF bypass capacitor.
I
LVCMOS/LVDS
– LVDS: Directly connect LVDS clock signals to XOin+ and XOin-.(4)
35
36
CLKout1–
CLKout1+
Video clock from PLL1.
The output is 27 MHz by default and is selectable via the host.
O
O
LVDS
Reference frame timing signal for OUT1 (active Low). Timing
generator fixed to PLL1 OUT1 Format follows the reference input
format.
37
Fout1
LVCMOS
38
39
VDD
GND
–
–
Power
GND
3.3 V supply for CLKout1
Ground
Loop filter for PLL1 charge pump output with VCXO Voltage Control
(VC) sensing.
If free-run and holdover mode, PLL1 is disabled and an internal DAC
outputs a control voltage to the VCXO.
40
–
VC_LPF
DAP
O
–
Analog
GND
Die Attach Pad (Connect to ground on PCB)
(3) XOin must be driven by a 27 MHz clock in order to read or write registers via I2C.
(4) A TCXO or other clean 27 MHz oscillator can be applied for standalone clock generation using PLLs 2-4 (bypass PLL1).
4
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SNLS309I –APRIL 2010–REVISED DECEMBER 2014
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)(3)
MIN
MAX
3.6
UNIT
V
VDD
VI
Supply voltage
Input voltage (any input)
Output voltage (any output)
Junction temperature
Storage temperature range
-0.3
-0.3
VDD + 0.3
VDD + 0.3
150
V
VO
V
TJMAX
Tstg
°C
°C
-65
150
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For soldering information, see SNOA549.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
7.2 ESD Ratings
VALUE
2500
250
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Machine model (MM)(2)
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(3)
750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2500 V may actually have higher performance.
(2) Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC).
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
0
NOM
MAX
VDD
85
UNIT
V
Input Voltage
Temperature Range, TA
-40
°C
7.4 Thermal Information
RTA
THERMAL METRIC(1)
UNIT
40 PINS
3.3 ± 5%
33
TJMAX
RθJA
Junction Temperature, VDD
Thermal Resistance(2)
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PC Board.
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7.5 Electrical Characteristics(1)
Unless otherwise specified, all limits are specified for TA = 25°C, VDD = 3.3 V, RL_CLK = 100 Ω (CLKout differential load).
PARAMETER
TEST CONDITIONS
MIN(2)
TYP(3) MAX(2) UNIT
Default register settings, no load on logic outputs.
VDD = 3.465 V
IDD
IDD
Total supply current
170
60
212
100
mA
mA
PLL2, PLL3 and PLL4 disabled, no load on logic
outputs. VDD = 3.465 V
Total supply current
REFERENCE INPUTS (Hin, Vin, Fin)
VIL
VIH
Low input voltage
High input voltage
IIN = ±10 μA
0
0.3 VDD
VDD
V
V
IIN = ±10 µA
0.7 VDD
Time from when reference input first presented to
when detected as indicated by NO_REF going low.
Reference timing must be stable and accurate (no
missing pulses).
Input
Frames
TAFD
Auto-format detection time
2
4
OSCin LOGIC INPUTS
VIL
VIH
Low input voltage
High input voltage
IIN = ±10 µA
IIN = ±10 µA
0
0.3 VDD
VDD
V
V
0.7 VDD
I2C INTERFACE (SDA, SCL)
VIL
VIH
IIN
Low input voltage
High input voltage
Input current
0
0.7 VDD
−10
0.3 VDD
VDD
V
V
VIN between 0.1 VDD and 0.9 VDD
VOL = 0V or 0.4V
+10
μA
mA
IOL
Low output sink current
1.25
STATUS FLAG OUTPUTS (NO_REF, NO_ALIGN,NO_LOCK)
VOL
VOH
Low output voltage
High output voltage
IOUT = +10 mA
0.4
0.4
10
V
V
IOUT = −10 mA
VDD-0.4V
FRAME TIMING OUTPUTS
IOUT = +10 mA
VOL
VOH
IOZ
Low output voltage
High output voltage
Fout1, Fout2, Fout3(4)
IOUT = -10mA
VDD-0.4 V
Fout1, Fout2, Fout3(4)
Output shutdown leakage
current
Output buffer shutdown, pin connected to VDD or
GND VDD = 3.465V
0.4
|μA|
VIDEO and AUDIO CLOCK OUTPUTS (CLKout1, CLKout2 and CLKout3)
Measured at CLKout1 all other CLKouts shutdown
250
250
8
fs
fs
27 MHz TIE deterministic
Jitter
Measured at CLKout1, other CLKouts output default
PLL
Measured at CLKout2 all other CLKouts shutdown
ps
ps
ps
ps
ps
ps
148.5 MHz TIE
deterministic Jitter
Measured at CLKout2, other CLKouts output default
PLL
8
tDJ
Measured at CLKout3 all other CLKouts shutdown
4
148.35 MHz TIE
deterministic Jitter
Measured at CLKout3, other CLKouts output default
PLL
4
Measured at CLKout4 all other CLKouts shutdown
15
15
24.576 MHz TIE
deterministic Jitter
Measured at CLKout4, other CLKouts output default
PLL
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. No specification of parametric performance
is indicated in the electrical tables under conditions different than those tested.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using
statistical analysis methods.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(4) tD for FoutX is measured from the positive clock edge of CLKout to the negative edge of FoutX at the 50% levels.
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Electrical Characteristics(1) (continued)
Unless otherwise specified, all limits are specified for TA = 25°C, VDD = 3.3 V, RL_CLK = 100 Ω (CLKout differential load).
PARAMETER
TEST CONDITIONS
MIN(2)
TYP(3) MAX(2) UNIT
Measured at CLKout1, other CLKouts shutdown
2.7
2.7
3.0
3.0
3.5
3.5
3.4
3.4
ps
ps
ps
ps
ps
ps
ps
ps
27 MHz TIE random Output
Jitter(5)
Measured at CLKout1, other CLKouts output default
PLL
Measured at CLKout2, other CLKouts shutdown
148.5 MHz TIE Random
Output Jitter(5)
Measured at CLKout2, other CLKouts output default
PLL
tRJ
Measured at CLKout3, other CLKouts shutdown
148.35 MHz TIE Random
(5)
Measured at CLKout3, other CLKouts output default
PLL
Output Jitter
Measured at CLKout4, other CLKouts shutdown
24.576 MHz TIE Random
Output Jitter(5)
Measured at CLKout4, other CLKouts output default
PLL
Measured at 50% level of clock amplitude, any
output clock
TD
tR
Duty cycle
50%
400
400
350
1.25
Rise time
20% to 80%
15 pF load
15 pF load
ps
ps
mV
V
Fall time
80% to 20%
tF
Differential signal output
voltage
100 Ω differential load, CLKout1, CLKout2 or
VOD
VOS
247
454
CLKout3(6)
Common signal output
voltage
100 Ω differential load, CLKout1, CLKout2 or
1.125
1.375
CLKout3(6)
|Change to VOD| for
complementary output
states
100 Ω differential load, CLKout1, CLKout2 or
|VOD
|
50
50
|mV|
|mV|
CLKout3(6)
|Change to VOS| for
complementary output
states
100 Ω differential load, CLKout1, CLKout2 or
|VOS
|
CLKout3(6)
Differential clock output pins connected to GND for
CLKout1, CLKout2, or CLKout3
IOS
IOZ
Output short circuit current
24
10
|mA|
|µA|
Output shutdown leakage
current
Output buffer in shutdown mode, differential clock
output pins connected to VDD or GND
1
VCXO INPUT (XOin)
Maximum relative frequency
offset between VCXO input Assumes H input jitter of ±15 ns
fOFF
±150
ppm
and H input
Single-ended signal input
voltage range
VXOin_SE
Single-ended input buffer mode
0
VDD
454
V
Differential signal input
voltage range
VXOin_DIFF
Differential input buffer mode, VCM = 1.2 V
247
350
mV
DIGITAL HOLDOVER and FREE-RUN SPECIFICATIONS
VVCout_RNG DAC output voltage range Digital Free-run Mode
VDD
0.5V
-
0.5
V
(5) The SD and HD clock output jitter is based on XO input clock with 20 ps peak-to-peak using a time interval error (TIE) jitter
measurement. The typical TIE peak-to-peak jitter was measured on the LMH1983 evaluation bench board using TDSJIT3 jitter analysis
software on a Tektronix DSA71604 oscilloscope and 1 GHz active differential probe. TDSJIT3 Clock TIE Measurement Setup: 10-12 bit
error rate (BER), >100K samples recorded using multiple acquisitions. Oscilloscope Setup: 20 mV/div vertical scale, 10 µs/div horizontal
scale, and 25 GS/s sampling rate
(6) The differential output swing and common mode voltage may be adjusted via the I2C interface. Testing is done with a value of 0x3E
loaded into Register 0x3A.
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7.6 Frame Timing Outputs Timing Requirements
MIN
NOM
MAX UNIT
tR
tF
Rise time 20% to 80%
Fall time 20% to 80%
15 pF load
15 pF load
1
1
ns
ns
7.7 Frame Timing Outputs Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TOF1 delay measured from the CLKout1 clock reset
edge. Delay spec applies for all output clock and format
supported by the output pair following output initialization.
15 pF load.
ns
(1)
tD1
tD2
tD3
tD4
Timing output delay time
22
TOF2 delay measured from the CLKout2 clock reset
edge. Delay spec applies for all output clock and format
supported by the output pair following output initialization.
15 pF load.
ns
ns
ns
Timing output delay time
Timing output delay time
Timing output delay time
2
2
TOF3 delay measured from the CLKout3 clock reset
edge. Delay spec applies for all output clock and format
supported by the output pair following output initialization.
15 pF load.
TOF4 delay measured from the CLKout4 clock reset
edge. Delay spec applies for all output clock and format
supported by the output pair following output initialization.
15 pF load.
22
(1) tD for CLKoutX is measured from the positive clock edge of XOin to the positive clock edge of CLKoutX using 50% levels. The
measurement is taken at the clock cycle where the input and output clocks are phase aligned.
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7.8 Typical Characteristics
Horizontal Scale: 2.6ps / Division
Figure 1. CLKout1 Jitter Histogram
Figure 2. CLKout1 Phase Noise
Figure 4. CLKout2 Phase Noise
Figure 6. CLKout3 Phase Noise
Horizontal Scale: 4.4ps / Division
Figure 3. CLKout2 Jitter Histogram
Horizontal Scale: 4.4ps / Div
Figure 5. CLKout3 Jitter Histogram
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Typical Characteristics (continued)
Horizontal Scale: 7 ps / Div
Figure 7. CLKout4 Jitter Histogram
Figure 8. CLKout4 Phase Noise
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8 Detailed Description
8.1 Overview
The LMH1983 is an analog phase locked loop (PLL) clock generator that can output simultaneous clocks at a
variety of video and audio rates, synchronized or “genlocked” to Hsync and Vsync input reference timing. The
LMH1983 features an output Top of Frame (TOF) pulse generator for each of its four channels, each with
programmable timing that can also be synchronized to the reference frame. The clock generator uses a two-
stage PLL architecture. The first stage is a VCXO-based PLL (PLL1) that requires an external 27 MHz VCXO
and loop filter. In Genlock mode, PLL1 can phase lock a low loop bandwidth VCXO clock to the input reference.
The VCXO provides a low phase noise clock source to attenuate input timing jitter for minimum jitter transfer.
The combination of the external VCXO, external loop filter, and programmable PLL parameters provide flexibility
for the system designer to optimize the loop bandwidth and loop response for the application.
The second stage consists of three PLLs (PLL2, PLL3, PLL4) with integrated VCOs and loop filters. These PLLs
continually track the reference VCXO clock phase from PLL1 regardless of the device mode. The PLL2 and PLL3
have pre-configured divider ratios to provide frequency multiplication or translation from the VCXO clock
frequency to generate the two common HD clock rates (148.5 MHz and 148.35 MHz). PLL4 is pre-configured to
generate an audio clock that defaults to a 24.576 MHz output, although PLL4 has several registers that allow it to
be re-configured for a variety of applications.
The VCO PLLs use a high loop bandwidth to assure PLL stability, so the VCXO of PLL1 must provide a stable
low-jitter clock reference to ensure optimal output jitter performance. Any unused clock or TOF output can be
placed in Hi-Z mode. This may be useful for reducing power dissipation as well as reducing jitter or phase noise
on the active clock output. The TOF pulse can be programmed to indicate the start (top) of frame and even
provide format cross-locking. The output format registers should be programmed to specify the output timing
(output clocks and TOF pulse), the output timing offset relative to the reference, and the output initialization
(alignment) to the reference frame.
When a loss of reference occurs during genlock, PLL1 can default to either Free-run or Holdover operation.
When Free-run is selected, the output frequency accuracy will be determined by the external bias on the free-run
control voltage input pin, VC_LPF. When Holdover is selected, the loop filter can hold the control voltage to
maintain short-term output phase accuracy for a brief period in order to allow the application to select the
secondary input reference and re-lock the outputs. These options in combination with a proper PLL1 loop
response design can provide flexibility to manage output clock behavior during loss and re-acquisition of the
reference. The reference status and PLL lock status flags can provide real-time status indication to the
application system. The loss of reference and lock detection thresholds can also be configured.
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8.2 Functional Block Diagram
External Loop Filter and VCXO
27 MHz
VCXO
V
DD
/2
= Device pins
VC_LPF
XOin+
XOin-
10-Bit SAR
ADC
CLKout1+
CLKout1-
Vc(Freerun)
DAC
27.0
(13.5)
MHz
Vc(Genlock)
Fout1
Hin
Vin
Fin
Ref
Input Format
and Polarity
Detection
PLL1
TOF1
In1
In2
Genlock PLL
CLKout2+
CLKout2-
Fbk
148.5
(74.25)
MHz
Out2
PLL2
3G(HD)
Video Clock
3x2
Video Clock
Crosspoint
148.35,
(74.176)
MHz
CLKout3+
CLKout3-
Out3
PLL3
3G(HD)/1.001
Video Clock
NO_REF
Device
Control and
Registers
In3
ADDR
NO_ALIGN
NO_LOCK
Fout2
Fout3
SDA
SCL
2
I C Interface
2
I C Address Options: 0x65h-67h
98.304 MHz,
others*
CLKout4+
CLKout4-
PLL4
Audio Clock
MUX
AFS/Word
Fout4
(Osc In)
27 MHz_Osc
X
* Audio Clock PLL supports 98.304/2 MHz, where X=0-15
8.3 Feature Description
The following subsections provide information about the various control mechanisms and features that are
fundamental to the LMH1983 clock generator.
8.3.1 Control of PLL1
PLL1 generates a 27 MHz reference that is used as the primary frequency reference for all of the other PLLs in
the device. PLL1 has a dual loop architecture with the primary loop locking the external 27 MHz VCXO to a
harmonic of the HIN signal. In addition to this loop, there is a secondary loop that may be used in genlock
operations. This second loop compares the phase of the TOF1 output signal from the LMH1983 to the FIN signal.
In order to bring the frame alignment of the output signals into sync with the input reference, the second loop
may override the primary loop. Detailed information about controlling this functionality is described in TOF1
Alignment.
To illustrate the dual loop architecture of PLL1, refer to the PLL1 block diagram in Figure 9. The primary loop
takes the reference applied to the HIN input and divides that by R (stored in Registers 0x29 and 0x2A). The
dividend is then compared in phase and frequency to the output of the external 27 MHz VCXO divided by N
(stored in Registers 0x2B and 0x2C). The PFD (phase frequency detector) then generates output pulses that are
integrated via an external loop filter that drives the control voltage of the external VCXO.
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Feature Description (continued)
V in
PFD
PFD
TOF1
SAR
DAC
MUX
CP
H in
÷ R
Current
Source
VCXO
(ext)
÷ N
Loop Filter
(ext)
÷ 1 or ÷ 2
CLK1 Out
Figure 9. PLL1 Block Diagram
Since PLL2, PLL3, and PLL4 all use PLL1 as their input reference, the performance of PLL1 affects the
performance of all four clock outputs. The loop filters for the other three PLLs are internal, and the bandwidths
are set significantly higher than that of PLL1, so the low frequency jitter characteristics of all four clock outputs
are determined by the loop response of PLL1. Accordingly, special attention should be paid to the PLL1's loop
bandwidth and damping factor.
8.3.2 PLL1 Loop Response Design Equations
The loop response is primarily determined by the loop filter components and the loop gain. A passive second
order loop filter consisting of RS, CS, and CP components can provide sufficient input jitter attenuation for most
applications. In some cases, a higher order filter may be used to shape the low frequency response of PLL1
further. Assuming a topology for the loop filter similar to that shown in the Figure 9, the bandwidth of the PLL is
determined by:
BWPLL1= RSx KVCO x ICP1/(2*π*FB_DIV)
where
•
•
RS is the series resistor value in the external loop filter.
KVCO is the nominal 27 MHz VCXO gain in Hz/V. KVCO= Pull_range*27 MHz/Vin_Range. For the VCXO used in
the typical interface circuit (Mfgr: CTS, P/N 357LB3C027M0000): LVCO=100 ppm*27 MHz / (3.0V-0.3V) = 1000
Hz/V
•
•
ICP1 is the current from the PLL1 charge pump.
FB_DIV is the divide ratio of the PLL, which is set by the R and N register values, this will be equal to the
number of 27 MHz clock pulses in one HIN period. For NTSC, this value will be 1716.
(1)
Under normal operation, several of these parameters are set by the device automatically, for example the charge
pump current and the value of 'FB_DIV'. When the input reference format changes, both N and the charge pump
current are updated, N is changed to allow for lock to the new reference, and the charge pump current is
adjusted to maintain constant loop bandwidth.
It should be noted that this bandwidth calculation is an approximation and does not take into account the effects
of the damping factor or the second pole introduced by CP.
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Feature Description (continued)
VC_LPF
CS
RS
CP
Figure 10. External Loop Filter Schematic Detail
At frequencies far above the –3dB loop bandwidth, the closed-loop frequency response of PLL1 will roll off at
about –40dB/decade, which is useful for attenuating input jitter at frequencies above the loop bandwidth. Near
the –3dB corner frequency, the roll-off characteristic depends on other factors, such as damping factor and filter
order.
To prevent output jitter due to the modulation of the VCXO by the PLL's phase comparison frequency, the
bandwidth needs to meet the following criterion:
BW ≤ (27 MHz / FB_DIV ) / 20
(2)
PLL1's damping factor can be approximated by:
DF = (RS/2)√(ICP1 x CS x KVCO/FB_DIV)
where
•
CS is the value of the series capacitor (in Farads)
(3)
Typically, DF is targeted to be between 1/√2 and 1, which will yield a good trade-off between lock time and
reference spur attenuation. DF is related to the phase margin, a measure of the PLL stability.
There is a second parallel capacitor, CP, which is needed to filter the reference spurs introduced by the PLL. The
spurs may modulate the VCXO control voltage, leading to jitter. The following relationship should be used to
determine CP:
CP ≈ CS/20
(4)
The PLL loop gain, K, can be calculated as:
K = ICP1 x KVCO/FB_DIV
(5)
Therefore, Bandwidth and Damping Factor can be expressed in terms of K:
BW = RS x K
(6)
(7)
DF = (RS/2) x √(CS x K)
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Feature Description (continued)
8.3.3 Control of PLL2 and PLL3
PLL2 and PLL3 have the least amount of flexibility of the four PLLs in the LMH1983. They are pre-programmed
to run at 148.5 MHz and 148.35 MHz respectively. There is a divide-by-two option available to allow the output to
be 74.25 MHz or 74.18 MHz, should these frequencies be required. These two PLLs can also be disabled –
disabling PLL2 or PLL3 can save significant amounts of power if that particular clock is not required. Figure 11
shows a simplified functional block diagram of PLL2 and PLL3.
CP
÷ R
PFD
Current
Source
27 MHz In
þ
÷ N
VCO
CLK Out
Figure 11. PLL2 / PLL3 Block Diagram
8.3.4 Control of PLL4
Although originally intended to generate only a clock for audio use, PLL4 features much greater versatility.
Several registers may be used to configure PLL4 to generate a broad selection of frequencies. The default state
for PLL4 is to generate 24.576 MHz (48 kHz x 512) on the output of CLK4 and a 5.996 Hz output from TOF4.
This is done by taking CLK1 (27 MHz), and dividing by 75, resulting in a signal of 360 kHz. This frequency is
compared to the internal PLL4 VCO, nominally 1.2 GHz, divided by 4096. The VCO frequency is adjusted via
register control until the resulting frequency yields 360 kHz. The final VCO frequency is then divided by 12 to
generate a 98.304 MHz signal (48 kHz x 2048). Any power of two multiple of 48 kHz can be generated by
changing the contents of the PLL4_DIV component of Register 0x34. Note that the divider here is in powers of 2,
so the default value of 2 results in the 98.304 MHz signal being divided by 22 or 4. The final CLKout4 frequency
is therefore 24.576 MHz. PLL4_DIV is a 4-bit value, so values up to 15 may be programmed, resulting in a divide
by 215 or 32,768. If audio clocks based on a 44.1 kHz sampling clock are desired, refer to Application Note
AN–2108, Generating 44.1 kHz Based Clocks with the LMH1983, (SNLA129) for detailed instructions.
TOF4 has two different operation modes. When the AFS_mode bit (Register 0x09) is set to a 0, then TOF4 is
derived by dividing CLKout4 by a value of 2TOF4_ACLK (Register 0x4A). if the AFS_mode bit is set to 1, then TOF4
is derived from TOF1 — divided by AFS_div (Register 0x49). When AutoFormatDetect is true, then the AFS_div
register is read only and is internally set depending upon the format detected.
Phase/
Frequency
Detector
27ꢀMHz In
Current
Source
÷ꢀR
Loop Filter
VCO
(~1.3545GHz)
÷ꢀ(N x 8)
CLKout4
PLL4_DIV
÷ 4 or 5
(is125M)
÷ꢀ3
÷ꢀ2
TOF4_ACLK
÷ꢀ2
TOF4
MUX
Frame_in
AFS_mode
AFS_div
Figure 12. PLL4 Block Diagram
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Feature Description (continued)
8.3.5 Clock Output Jitter
Many circuits that require video clocks, such as the embedded Serializers and Deserializers found in FPGAs, are
sensitive to jitter. In all real world applications, jitter has a random component, so it is best specified in statistical
terms. The SMPTE serial standards (SMPTE 259M, SMPTE 292M and SMPTE 424M) use a frequency domain
method of specifying jitter where they refer to the peak-to-peak jitter of a signal after the jitter has been bandpass
filtered. Jitter at frequencies below 10 Hz is ignored, and the jitter in a band from 10 Hz to an intermediate
frequency (1 kHz for the 270 Mbps standard, 100 kHz for the 1.5 Gbps and 3 Gbps standards) is referred to as
timing jitter. Jitter from the intermediate frequency up to 1/10 of the serial rate is referred to as alignment jitter.
The limits that the SMPTE standards place are peak-to-peak limits, but especially at the higher rates, random
processes have a significant impact, and it is not possible to consider peak-to-peak jitter without a corresponding
confidence level. The methodology used to specify the jitter on the LMH1983 decomposes the jitter into a
deterministic component (tDJ) plus a random component (tRJ). This is the methodology used by the jitter analysis
tools supported on high bandwidth oscilloscopes and timing analysis tools from major instrumentation
manufacturers.
To convert between RMS jitter and peak-to-peak jitter, the Bit Error Rate (BER) must be specified. Since jitter is
a random event, without a known BER, the peak-to-peak jitter will be dependent upon the observation time and
can be arbitrarily large. The equation that links peak-to-peak jitter to RMS jitter is:
tP-P= tDJ+α*tRJ
(8)
where α is determined by the BER according to the equation:
1/2erfc(√2*α) = BER
(9)
The erfc (error function) can be found in several mathematics references and is also a function in both Excel and
MATLAB. A fairly common BER used for these calculations is 10-12, which yields a value of α = 14.
Another common method for evaluating the jitter of a clock output is to look at the phase noise as a function of
frequency. Plots showing the phase noise for each of the four CLKout outputs can be found in Figure 1 through
Figure 8.
8.3.6 Lock Determination
There are four bits in Register 0x02 that indicate the lock status of the four PLLs. Lock determination for PLL1
can be controlled through two registers: LockStepSize (Register 0x2D) and Loss of Lock Threshold (Register
0x1C). The LockStepSize register sets the amount of variation that is permitted on the VC_LPF pin while still
considering the device to be locked. If the reference to the LMH1983 has a large amount of jitter, then the device
may be unable to declare lock because the LockStepSize is set too low. The second register, the Loss of Lock
Threshold register, controls the lock state declaration of PLL1. This register sets a number of cycles on the HIN
input that must be seen before loss of lock is declared. For some reference signals, there can be several missing
HIN pulses during vertical refresh. Therefore, it is suggested that this register be loaded with a value greater than
six (Loss of Lock Threshold > 6). Pin 11, NO_LOCK, gives the lock status of the LMH1983. Note that the status
of the NO_LOCK pin can also be read from Register 0x01, and it is a logical OR of the four individual NO_LOCK
status bits of the four PLLs. The NO_LOCK status pin is masked by the bits in the PLL Lock mask (Register
0x1D), and the status is also masked if an individual PLL is powered down.
8.3.7 Lock Time Considerations
The lock time of the LMH1983 is dominated by the lock time of PLL1. The other PLLs have much higher loop
bandwidths, and as a result, they lock more quickly than PLL1 does. Therefore, lock time considerations mainly
rely on PLL1. The lock time for a PLL is dependent upon the loop bandwidth (see Equation 1). A small loop
bandwidth typically increases the time required to achieve lock. To counter this issue, the LMH1983 also allows a
Fastlock mode. In this mode, the bandwidth is increased by increasing the charge pump current when the loop is
unlocked. Then, at a time programmed by the user after lock is declared, ICP1 is throttled back to drop the
bandwidth to the desired set point. The result is both fast lock time and very low residual jitter.
Another factor when considering lock time is whether 'drift lock' has been enabled or not (see TOF1 Alignment).
If drift lock is enabled and there is a significant difference in the phase of TOF1 relative to the FIN signal, the
VCXO is slewed to ramp the clock rate up or down until the two framing signals are brought into alignment. It is
possible that this process may take a long time (tens of seconds).
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Feature Description (continued)
Aside from the time required for the PLL to lock, there is a circuit that determines how to set the NO_LOCK
output pin. The LMH1983 PLL operates by adjusting the voltage that is applied to the VCXO control pin to lock
the VCXO to a harmonic of the incoming reference. When the device is not locked, the PLL pulls the VCXO
control voltage to one extreme of its range to slew the voltage into lock. Once the phase differences between the
VCXO and the reference are small, the device begins to nudge the control voltage back and forth to maintain the
phase difference. An adjustment might be necessary either due to VCXO drift or due to jitter on the reference. To
determine the status of NO_LOCK, the LMH1983 establishes a window to view the amount of adjustment that is
required over a period of time. Two parameters are set via register control to determine NO_LOCK status.
LockStepSize (Register 0x2D) sets the amount of time in which to observe the signal, and Loss of Lock
Threshold (Register 0x1C) sets the amount of variation in the control voltage that can be seen over this time
frame while still considering the device to be locked.
To minimize the amount of time necessary to assert lock, load LockStepSize (Register 0x2D) with a value of
0x01 and the Loss of Lock Threshold (Register 0x1C) with a value of 0x1F. The effect of this change can be
seen in Figure 13:
reference
(input)
NOREF
(output)
LOCK ~ 4.4s
NOLOCK
(output)
reference
(input)
NOREF
(output)
LOCK ~ 760 ms
NOLOCK
(output)
Figure 13. Faster NO_LOCK Reaction Mode Timing
8.3.8 LOR Determination
When the PLL is not locked, there is an internal counter that counts the number of 27 MHz clock pulses between
consecutive HSync pulses divide-by-two. This counter saturates at 0x7FFF (or 32767 decimal). Once this
counter saturates, LOR is declared. Given this is a divide-by-two counter, the time to declare LOR is: (2 x 32767)
/ (27E6) = 2.4 ms. On the other hand, when the PLL is locked and there are missing HSync pulses, LOR is set
when the internal counter is greater than the following: (Number of 27 MHz clocks in one Hsync pulse + 3) x
(LOR_THRES + 1).
8.3.9 Output Driver Adjustments
The LVDS output drivers can be adjusted via the I2C interface to change the differential output voltage swing, the
common mode voltage, and the amount of pre-emphasis applied to the LVDS output:
•
Register 0x3A, Bit 7 turns on the pre-emphasis, which may be used to extend the reach between the
LMH1983 and the load. It is recommended that the trace length is kept short, as longer traces have more
opportunity to couple with hostile signals and degrade jitter performance.
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Feature Description (continued)
•
The differential output swing of the CLKout pins is adjusted through Register 0x3A, Bits [6:4]. A larger value
loaded into Bits [6:4] correspond to an increase in the output swing.
•
The common mode output voltage can be adjusted via Register 0x3A, Bits [3:0].
8.3.10 TOF1 Alignment
Each of the four clock outputs has a corresponding Top Of Frame (TOF) output signal. The LMH1983 is
programmed with a video format for each of the three video clocks (CLKout 1-3), and the TOF signal provides a
digital indication when the start of a new frame occurs for that particular format. As an example, if PLL1 is
programmed with a video format corresponding to NTSC, CLK1 is 27 MHz, and TOF1 outputs a pulse once per
frame, or once every 900,900 clock cycles. In its default state, the LMH1983 detects the input reference format
and programs this format as the output format for CLKout1. Therefore, if the input reference is an NTSC
reference, then TOF1 will default to a 29.97 Hz signal.
If the HIN, VIN, and FIN inputs to the LMH1983 are coming from the LMH1981 Sync Separator, then the rising
edge of the FIN input will come in the middle of a line (between HIN pulses). The TOF pulse, if aligned, will be a
pulse with a width of 1 x H period and transitions aligned with the leading edges of the HIN pulses. When set for
zero offset, the TOF pulse will be high during the H period where the FIN input transitions, as seen in Figure 14.
TOF1
H
IN
F
IN
Figure 14. TOF1 Timing
The alignment between the incoming FIN and the TOF1 output may be controlled in a number of ways. There are
three different alignment modes in which TOF1 may operate as selected via Register 0x11:
1. 11'b (default): PLL1 never attempts to align.
2. 10'b: PLL1 always forces alignment to FIN.
3. 00'b: Automatically force alignment to FIN when they are misaligned.
Misalignment can be defined by the user via Register 0x15. In Register 0x15, a time window is defined to specify
the amount of mismatch permitted between FIN and TOF1 while still considering them to be aligned. If the input
reference signal has a significant amount of low frequency jitter or wander, it may be possible for the relative
alignment between TOF1 and FIN to vary over time. Selecting "Always Align" mode may lead to undesirable
timing jumps on the output of CLKout1/TOF1.
Once the device decides that it needs to align TOF1 and FIN, there are two ways that it can be done. Crash lock
involves simply resetting the counter that keeps track of where the TOF1 output transition happens, resulting in
an instantaneous shift of TOF1 to align with FIN. Drift lock involves using the second loop in PLL1 and skewing
the VCXO to make the frequency of CLKout1 either speed up or slow down. The VCXO skewing slowly pulls
TOF1 and FIN into alignment. If a new reference is applied that is not in alignment with TOF1, but the output is
currently in use, it may be better to slew TOF1 into alignment rather than to cause a major disruption in the
timing with a crash lock. The LMH1983 allows the user to select either crash lock or drift lock, controllable via
Register 0x11. The option of crash lock or drift lock is available when the difference in phase is small (Output <
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Feature Description (continued)
2LOA_window x 27 MHz Clock) and when the difference in phase is large (Output > 2LOA_window x 27 MHz Clock).
Furthermore, if the difference is large, the user can tell the device to achieve alignment either by advancing or
retarding the phase of PLL1. Note that if the difference in alignment is large, achieving alignment via drift lock
may take a very long time (tens of seconds), during which the output clock will not be phase locked to the input
HIN.
8.3.11 TOF2 and TOF3 Alignment
Similar to TOF1, CLKout2 and CLKout3 have associated video formats. The format is determined by
programming Register 0x07 and 0x08, respectively. Once the format is programmed and the TOF outputs are
enabled, a TOF pulse is generated at the appropriate rate for each of the outputs. There are four different
alignment modes that may be selected for TOF2 and TOF3:
Table 1. TOF2/TOF3 Alignment Modes
TOF2/TOF3 ALIGNMENT MODE
DESCRIPTION
Auto Align when Misaligned
One Shot Manual Align
Always Align
0
1
2
3
Never Align
TOF2 and TOF3 are generally aligned with TOF1. The alignment status bit will only be set if the frame rates are
the same as one another. Another option for alignment is via software, where the TOFX_INIT bit is set. For
example, the LSB of Register 0x12 is the TOF2_INIT bit. Writing a 1 to this bit while also setting TOF2 alignment
mode to anything other than 3 (Never Align) will cause TOF2 to reset its phase immediately. Note that this bit is
a self-clearing bit, so it will always return a zero.
8.3.11.1 TOF3 Initialization Set Up
Under some circumstances, it is possible for an LMH1983 to power up in an anomalous state in which the output
of PLL3 exhibits a large amount of cycle-to-cycle jitter. A simple register write after power up will prevent the
device from remaining in this state. Writing to Register 0x13[5:4] = 10'b to force Always Align Mode ensures that
the device will not exhibit poor duty cycle performance on CLKout3.
8.3.12 TOF4 Alignment
CLKout4 of the LMH1983 is most often used to generate an audio clock. The default base audio clock rate is 48
kHz, and this sample clock is synchronous in phase with the video frame only once every 5 frames for 29.97 and
30 Hz frame rate standards, or once every ten frames for 60 Hz and 59.94 Hz systems. The LMH1983 can
generate a TOF4 pulse that occurs at this rate, allowing audio frames to be synchronized with the video frames.
TOF4 may be aligned either to TOF1 or to the FIN input. Additionally, there is an external INIT input that can be
used to set TOF4 alignment.
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10ns / div
Top 200mV / div
Bottom 1V / div
4 ns / div
Top 200 mV / div
Bottom 1V / div
Figure 15. TOF1 Timing
Top Trace CLKout1, Bottom Trace TOF1
Figure 16. TOF2 Timing
Top Trace CLKout2, Bottom Trace TOF2
4ns / div
Top 200mV / div
Bottom 1V / div
10 ns / div
Top 200 mV / div
Bottom 1V / div
Figure 17. TOF3 Timing
Top Trace CLKout3, Bottom Trace TOF3
Figure 18. TOF4 Timing
Top Trace CLKout4, Bottom Trace TOF4
8.4 Device Functional Modes
8.4.1 Reference Detection
The device uses Auto Format Detect as the default mode, as the device determines the reference format among
those shown in Auto Format Detection Codes, and initiates the internal configurations accordingly. There are 31
pre-defined formats plus one format that the user can define. The device recognizes a format by measuring the
HIN input frequency and looking at the VIN and FIN inputs. The device then determines if the reference input
format is an interlaced or progressive input. For some formats such as a 10 MHz or 27 MHz Hsync reference, if
HIN and VIN create a spurious input, the device will not properly recognize the reference input and will not lock
properly to the reference. Because of this, if HIN has one of these 'special' signals on it, VIN and FIN should be
muted.
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Device Functional Modes (continued)
8.4.2 User Defined Formats
There are several registers in the LMH1983 that are loaded automatically based on the format of the reference
that is detected. The LMH1983 allows the user to define a non-standard format and a corresponding set of
values to load into the appropriate registers if that format is detected. In order to identify the format, the
LMH1983 measures the frequency of the Hsync input, counts the number of lines per frame in the format, and
detects if the particular format is interlaced or progressive. The Hsync frequency is measured by counting the
number of 27 MHz clock edges that occur in a period of time equal to 20 horizontal sync times. To implement a
user defined format, the following registers are configured:
•
The minimum and maximum permissible count must be set, thereby establishing a window of frequency for
Hsync. Registers 0x51 and 0x52 define the 16-bit value for the low end of the frequency range, while
Registers 0x53 and 0x54 define the high end of the frequency range.
•
•
•
•
Registers 0x5A and 0x5B define the number of lines per frame for the format.
Register 0x5D, Bit 4 indicates whether the user defined format is interlaced or not.
Register 0x5D, Bit 7 enables the detection of a user-defined format.
Once the user-defined format is detected, the contents of Registers 0x55 through 0x59 configure PLL1 to lock
to 27MHz, which is then used as the reference for PLL2, PLL3, and PLL4.
Table 2 lists the supported standard timing formats. Table 2 includes the relevant parameters used to configure
the LMH1983 for the input and output formats. Auto-detection of the input is supported for the formats listed in
Table 2. The input format can also be programmed manually by the host via I2C if it is necessary to override the
auto-detection feature.
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Table 2. Supported Formats Lookup Table (LUT)
INPUT TIMING / PLL1 PARAMETERS
OUTPUT TIMING (OUT1–4) PARAMETERS
FORMAT
Reference
Divider
Feedback
Divider
Phase Detector
(PD) Freq. (kHz)
PD Periods per
Frame Counter
PLL Clock
Freq. (MHz)
Total Clocks per Total Lines per
Frame Rate
(Hz)
PLL#
Line Counter
1716
9438
1728
9504
858
Frame Counter
1
2
1
2
1
2
1
2
2
3
2
2
3
2
2
3
2
3
2
2
3
2
2
3
2
3
2
4
4
27.0
148.5
27.0
NTSC, 525i
PAL, 625i
525p
1
1
1
1
1716
1728
858
15.7343
15.625
31.4685
31.25
525
625
525
625
525
29.97
25
625
525
625
148.5
27.0
59.94
50
148.5
27.0
4719
864
625p
864
148.5
148.5
148.35
148.5
148.5
148.35
148.5
148.5
148.35
148.5
148.35
148.5
148.5
148.35
148.5
148.5
148.35
148.5
148.35
148.5
98.304
98.304
4752
3300
3300
3960
6600
6600
7920
8250
8250
2200
2200
2640
4400
4400
5280
5500
5500
4400
4400
5280
2048
1024
Input only
Input only
720p/60
720p/59.94
1
5
600
3003
720
45.0
8.99101
37.5
750
150
750
750
150
750
750
375
1125
225
1125
1125
225
1125
1125
1125
1125
225
1125
1
750
750
60
59.94
50
720p/50
1
750
720p/30
1
1200
6006
1440
1500
3003
400
22.5
750
30
720p/29.97
5
4.49550
18.75
750
29.97
25
720p/25
1
750
720p/24
1
18.0
750
24
720p/23.98
2
8.99101
67.5
750
23.98
60
1080p/60
1
1125
1125
1125
1125
1125
1125
1125
1125
1125
1125
1125
1
1080p/59.94
1080p/50
5
2002
480
13.48651
56.25
59.94
50
1
1080p(psF)/30
1080p(psF)/29.97
1080p(psF)/25
1080p(psF)/24
1080p(psF)/23.98
1080i/60
1
800
33.75
30
5
4004
960
6.74326
28.125
27.0
29.97
25
1
1
1000
1001
800
24
1
26.9730
33.75
23.98
30
1
1080i/59.94
1080i/50
5
4004
960
6.74326
28.125
24.0
29.97
25
1
48 kHz word clock
96 kHz word clock
27 MHz osc clk
10 MHz GPS osc clk
2
1125
1125
1000
1620
48000
96000
4
24.0
1
1
1000
600
27.000
16.6666
1
1
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8.4.3 Auto Format Detection Codes
The Auto Format Detection Codes apply to Registers 0x07 (Output Mode – PLL2 Format), 0x08 (Output Mode –
PLL3 Format), and 0x20 (Input Format).
FORMAT CODE
DESCRIPTION
Hsync PERIOD
(in 27 MHz CLOCKS)
INTERLACED (I) /
PROGRESSIVE (P)
0
525I29.97(1)
625I25(2)
1716
1728
I
1
I
2
525P59.94(1)
625P50(2)
720P60
858
P
3
864
P
4
600
P
5
720P59.94
720P50
600.6
720
P
6
P
7
720P30
1200
P
8
720P29.97
720P25
1201.2
1440
P
9
P
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
63
720P24
1500
P
720P23.98
1080P60
1501.5
400
P
P
1080P59.94
1080P50
400.4
480
P
P
1080P30
800
P
1080P29.97
1080P25
800.8
960
P
P
1080P24
1000
P
1080P23.98
1080I30
1001
P
800
I
1080I29.97
1080I25
800.8
960
I
I
1080I24
1000
I
1080I23.98
48 kHz Audio
96 kHz Audio
44.1 kHz Audio
32 kHz Audio
27 MHz Hsync
10 MHz Hsync
User Defined
Unknown
1001
I
562.5
281.25
612.244898
843.75
1
—
—
—
—
—
—
2.7
User Defined
All Others
User Defined
(1) NTSC, 525i and 525p formats are also commonly known as 480I29.97 and 480P59.94, respectively,
since the visible screen resolution consists of 480 pixels.
(2) PAL, 625i and 625p formats are also commonly known as 576I25 and 576P50, respectively, since the
visible screen resolution consists of 576 pixels.
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8.4.4 Free-Run, Genlock, and Holdover Modes
The LMH1983 primary PLL can operate in three different modes, selected via Register 0x05. These modes are
Free-run, Genlock, and Holdover Mode:
•
•
•
Free-run mode: HIN, VIN, and FIN are not used, and the VCXO control voltage is set by the contents of
Registers 0x18 and 0x19. By writing to these registers, the VCXO voltage can be trimmed up or down. The
slave PLLs will remain locked to the primary PLL.
Genlock mode: The VCXO control voltage is actively controlled to maintain lock between HIN and the VCXO
output frequency. In addition, there is a second PLL loop that may take over to assert a lock between TOF1
and FIN. See TOF1 Alignment for more details.
Holdover mode: In the event that the reference is lost, there is an A/D — D/A pair that is able to take over for
the PLL control loop and hold the VCXO control voltage constant. For this to work properly, the device must
realize that it has lost its reference shortly after the reference is actually lost. Some sync separators, when the
analog input is lost, will output random pulses from the H, V, and F outputs. This can confuse the device.
Therefore if Holdover mode is to be used in conjunction with an analog sync separator, it is best to gate the
H, V, and F signals with a signal that indicates if there is a valid reference input.
8.5 Programming
8.5.1 I2C Interface Protocol
The protocol of the I2C interface begins with the start pulse, followed by a byte which consists of a seven-bit
slave device address and a Read/Write bit as an LSB. The default address of the LMH1983 for write sequences
is 0xCC (11001100'b) and for read sequences is 0xCD (11001101'b). The base address can be changed with the
ADDR pin. When ADDR is left open, the base address is 0x66 (which, when left shifted for a write sequence
becomes 0xCC). When ADDR is connected to GND, the base address is 0x65, and when ADDR is connected to
VDD, the base address is 0x67.
Please note: The I2C interface of the LMH1983 requires the 27 MHz VCXO clock input to be running in order to
read I2C data packets into the 27 MHz clock domain. If the 27 MHz clock is not running, the I2C interface should
still respond (ACK), but Write commands may be ignored and Read commands may return invalid data.
8.5.2 Write Sequence
The write sequence begins with a start condition, which consists of the master pulling SDA low while SCL is high.
The slave address is sent next. The slave address is a seven-bit address followed by the Read/Write bit (Read =
1'b and Write = 0'b). For the default base address of 0x66 (1100110'b), the 0 is appended to the end, and the net
address is 0xCC. Each byte sent after the address is followed by an ACK bit. When SCL is high, the master will
release the SDA line, and the slave pulls SDA low to acknowledge. Once the device address has been sent, the
next byte sent is the register address. Following the register address and the ACK, the data byte is sent. When
more than one data byte is sent, the register address is automatically incremented so that the data is written into
the next address location. The Write Sequence Timing Diagram is shown in Figure 19. Note that there is an ACK
bit following each data byte.
SCL
SDA
A7 A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
1
1
0
0
1
1
0
0
0
0
0
0
S
t
S
t
a
r
t
o
p
A
C
K
A
C
K
A
C
K
A
C
K
R
e
a
d
2
Address
Data Byte 1
Data Byte n
I C
Slave
Address
$CD
Figure 19. Write Sequence Timing Diagram
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Programming (continued)
8.5.3 Read Sequence
Read sequences consist of two I2C transfers. The first is the address access transfer, which consists of a write
sequence that transfers only the address to be accessed. The second is the data read transfer which starts at
the address indicated in the first transfer and increments to the next address, continuing to read addresses until
a stop condition is encountered. The timing diagram of the address access transfer is shown in Figure 20. A read
sequence begins with a start pulse, the slave device address including the Read/Write bit (Read = 1'b and Write
= 0'b), and then its ACK bit. The next byte is the address to be read, followed by the ACK bit and the stop bit to
indicate the end of the address access transfer. The subsequent read data transfer shown consists of the start
pulse, the slave device address including the Read/Write bit (this time a R/W Bit = 1'b, indicating that the data is
to be read) and the ACK bit. The next byte is the data read from the initial access address. After each data byte
is read, the address is incremented, thereby allowing the next byte of data to be read from the subsequent
address of the device. Each byte is separated from the previous byte by an ACK bit, and the end of the read
sequence is indicated with a STOP bit. The timing diagram for a read data transfer is shown in Figure 21 for
additional timing details.
SCL
SDA
A7 A6 A5 A4 A3 A2 A1 A0
1
1
0
0
1
1
0
0
0
0
S
t
S
t
a
r
t
o
p
A
C
K
A
C
K
W
r
I
t
e
2
Address
I C
Slave
Address
$CC
Figure 20. Read Sequence — Address Access Transfer
SCL
SDA
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
1
1
0
0
1
1
0
1
0
0
0
S
t
S
t
a
r
t
o
p
A
C
K
A
C
K
A
C
K
R
e
a
d
2
Data Byte 1
Data Byte n
I C
Slave
Address
$CD
Figure 21. Read Sequence — Data Read Transfer
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8.6 Register Map
The following table provides details on the device's configuration registers. Default value for fields that are seven
bits or less are expressed in binary, and default values for fields that are 8 bits (Byte) are expressed in hex. Do
not write to Reserved (RSVD) fields.
Table 3. LMH1983 Register Map
ADD NAME
BITS FIELD
R/W
DEFAULT
DESCRIPTION
7
INTERLACED
R
—
Indicates if the input reference format is an interlaced format
This bit is set depending on if the sync detection circuit had
determined if the reference is an analog or digital derived
signal
6
ANALOG_REF
R
—
Returns the value of the input polarity determined by the sync
detector for HSYNC — 0 indicates an active low sync
5
4
INPUT_POLARITY
HSYNC_STATUS
R
R
—
—
Device Status
— Input Reference
This bit is set if the Hsync During Vsync detector will set
NO_H_DURING_V on the next rising edge of VSYNC
0x00
3
2
H_ONLY
R
R
—
—
This is set by the Interlaced detector
LOR_STATUS
Returns the inverse of the NO_REF output pin state
Set if HSYNC_MISSING is high wile no_h_during_v is low.
Remains set until read, then self-clears
1
LOST_HSYNC
R
—
0
Reserved
R
R
R
R
R
0
Reserved — always returns '0'
7
Lock_Status
Align_Status
Wrong_Format
Holdover
1
0
Returns lock status for all unmasked and enabled PLLs
Returns the Align Status for all enabled TOFs
Returns the value of the Wrong_Format bit.
Returns the value of the PLL Holdover Bit
Reserved
6
0x01 Device Status
5
1
4
0
3:0
RSVD
0000
[7] indicates the lock status of PLL4.
[6] indicates the lock status of PLL3.
[5] indicates the lock status of PLL2.
[4] indicates the lock status of PLL1.
0 = PLL Not Locked
7:4
3:0
Lock_Detect
Align_Detect
R
—
—
1 = PLL Locked
PLL Lock and Output
Alignment Status
0x02
[3] indicates the lock status of TOF4.
[2] indicates the lock status of TOF3.
[1] indicates the lock status of TOF2.
[0] indicates the lock status of TOF1.
0 = TOF Alignment not detected
1 = TOF alignment detected
R
R
0x03 Revision ID
0x04 Reserved
7:0
7:0
0xC0
0x00
Returns device revision code
Reserved
RSVD
Writing a ‘1’ will reset all registers to their default values. This
bit is self-clearing and always returns ‘0’ when read.
7
6
Soft_Reset
Powerdown
R/W
R/W
0
0
Controls the power down function.
Enables Auto Format Detection (AFD).
0 = Auto Format Detect disabled
1 = Auto Format Detect enabled
5
EN_AFD
R/W
1
Sets PLL1 operating mode:
00 = Force Free-run
01 = Genlock
4:3
PLL1_Mode
R/W
01
10 = Force Holdover
11 = Reserved
0x05 Device Control
Sets default mode of operation on Loss of Reference (LOR)
condition:
0 = Holdover on LOR
1 = Free-run on LOR
2
LOR Mode
R/W
0
When this bit is set, it forces the PLL2 and PLL3 clock rates to
148.xx MHz regardless of chosen output format. Otherwise,
the native clock rate of the chosen output format will be used.
0 = Uses the native clock rates
1 = Forces PLL2 = 148.5 MHz and PLL3 = 148.35 MHz clock
rate
1
0
Force_148
GOE
R/W
R/W
1
1
Global Output Enable
0 = Disables all CLKout and Fout output buffers (Hi-Z)
1 = Enable active outputs
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Register Map (continued)
Table 3. LMH1983 Register Map (continued)
ADD NAME
BITS FIELD
R/W
DEFAULT
DESCRIPTION
7:4
RSVD
0000
Reserved
Enables Auto Polarity Detection and Correction. The proper
polarity needs to be set to synchronize the output timing
signals to the leading edges of the H and V inputs.
0 = The polarities of HVF inputs are manually set by their
respective polarity override registers.
3
EN_AUTOPOL
R/W
1
1 = The polarity of the H input is auto-detected. The polarity
correction applied to the H input will also be applied to V and
F inputs.
0x06 Input Polarity
Used to manually set the H input Polarity.
0 = Active Low (Negative polarity)
1 = Active High (Positive polarity)
2
1
0
HIN_POL_OVR
VIN_POL_OVR
FIN_POL_OVR
R/W
R/W
R/W
0
0
0
Used to manually set the V input Polarity.
0 = Active Low (Negative polarity)
1 = Active High (Positive polarity)
Used to manually set the F input Polarity.
0 = Active Low (Negative polarity)
1 = Active High (Positive polarity)
7:6
5:0
7:6
5:0
7:5
RSVD
00
001110
00
Reserved
0x07 Output Mode – PLL2 Format
0x08 Output Mode – PLL3 Format
PLL2_Format
RSVD
R/W
R/W
Sets the video format output timing for PLL2.
Reserved
PLL3_Format
RSVD
001101
000
Sets the video format output timing for PLL3.
Reserved
Sets the TOF4 output timing mode.
4
AFS Mode
XPT_Mode
R/W
R/W
0
0 = Secondary Audio Clock Output (derived from PLL4 clock)
1 = Audio Frame Sync (derived from TOF1)
0x09 Output Mode – Misc
Sets the PLL crosspoint mode for Out2 and Out3.
Refer to Table 4.
3:0
0000
[3] sets CLKout4 output buffer mode.
[2] sets CLKout3 output buffer mode.
[1] sets CLKout2 output buffer mode.
[0] sets CLKout1 output buffer mode.
0 = CLKoutx enabled
7:4
3:0
CLK_HIZ
R/W
R/W
0000
1111
1 = CLKoutx Hi-Z
0x0A Output Buffer Control
[3] sets Fout4 output buffer mode.
[2] sets Fout3 output buffer mode.
[1] sets Fout2 output buffer mode.
[0] sets Fout1 output buffer mode.
0 = Foutx enabled
FOUT_HIZ
1 = Foutx Hi-Z
7:5
4:0
RSVD
000
Reserved
Output Frame Control –
Offset1_MSB
0x0B
TOF1 Offset MSB
R/W
R/W
00000
TOF1_Offset[12:0] sets number of lines to delay TOF1.
TOF1_Offset_MSB[4:0] sets TOF1_Offset[12:8]
TOF1_Offset_LSB[7:0] sets TOF1_Offset[7:0]
Output Frame Control –
Offset1_LSB
0x0C
7:0
TOF1 Offset LSB
0x00
7:5
4:0
RSVD
000
Reserved
Output Frame Control –
Offset2_MSB
0x0D
TOF2 Offset MSB
R/W
R/W
00000
TOF2_Offset[12:0] sets number of lines to delay TOF2.
TOF2_Offset_MSB[4:0] sets TOF2_Offset[12:8]
TOF2_Offset_LSB[7:0] sets TOF2_Offset[7:0]
Output Frame Control –
Offset2_LSB
0x0E
7:0
TOF2 Offset LSB
0x00
7:5
4:0
RSVD
000
Reserved
Output Frame Control –
Offset3_MSB
0x0F
TOF3 Offset MSB
R/W
R/W
00000
TOF3_Offset[12:0] sets number of lines to delay TOF3.
TOF3_Offset_MSB[4:0] sets TOF3_Offset[12:8]
TOF3_Offset_LSB[7:0] sets TOF3_Offset[7:0]
Output Frame Control –
Offset3_LSB
0x10
7:0
TOF3 Offset LSB
0x00
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Register Map (continued)
Table 3. LMH1983 Register Map (continued)
ADD NAME
BITS FIELD
R/W
DEFAULT
DESCRIPTION
7:6
RSVD
00
Reserved
00 = Auto-align when misaligned
01 = Reserved
5:4
TOF1_Align_Mode
R/W
11
10 = Always Align
11 = Never Align(1)
This bit sets the PLL1/TOF1 output synchronization behavior
when the same reference is reapplied following a momentary
LOR condition and TOF1 is within 2 lines of the expected
location.
00 = Always Drift Lock – ensures the outputs drift smoothly
back to frame alignment without excessive output phase
disturbances
01 = Drift Lock if output < (2LOA_window x 27 MHz Clock). Crash
Lock otherwise.
3:2
TOF1_Sync
R/W
01
0x11 Alignment Control – TOF1
1X = Always Crash Lock – achieves the fastest frame
alignment through PLL/TOF counter resets, which can result in
output phase disturbances
Sets the direction that TOF1 slews to achieve frame alignment
when a new reference is applied and TOF1 is outside of 2
lines of the expected location.
0 = TOF1 lags by railing the VCXO input low
1 = TOF1 advances by railing the VCXO input high
1
TOF1_Sync_Slew
R/W
R/W
R/W
0
0
RSVD
RSVD
0
Reserved
Reserved
7:6
00
00 = auto align when misaligned
01 = one shot manual align when writing TOF2_INIT=1
10 = always align
5:4
3:1
TOF2_Align_Mode
RSVD
11
11 = never align
000
Reserved
0x12 Alignment Control – TOF2
Writing one to this bit while also writing TOF2_Align_Mode =
3, will cause the TOF2_INIT output to go high for at least one
vframe period + one Hsync period and not more than one
vframe period + two Hsync periods. The assertion of
TOF2_INIT must happen immediately (it cannot wait for
Hsync). If TOF2_Align_Mode is being written to 3, this bit will
have no effect. This bit is self-clearing and will always read
zero.
0
TOF2_INIT
0
7:6
5:4
3:1
RSVD
00
11
Reserved
00 = auto align when misaligned
01 = one shot manual align when writing TOF3_INIT=1
10 = always align
TOF3_Align_Mode
RSVD
R/W
R/W
11= never align
000
Reserved
0x13 Alignment Control – TOF3
Writing one to this bit while also writing TOF3_Align_Mode ≠
3, will cause the TOF3_INIT output to go high for at least one
vframe period + one Hsync period and not more than one
vframe period + two Hsync periods. The assertion of
0
TOF3_INIT
0
TOF3_init must happen immediately (it cannot wait for Hsync).
If TOF3_Align_Mode is being written to 3, this bit will have no
effect. This bit is self-clearing and will always read zero.
(1) NOTE: When H_ONLY is 1, TOF1 align mode is forced to never align.
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Register Map (continued)
Table 3. LMH1983 Register Map (continued)
ADD NAME
BITS FIELD
R/W
R/W
R/W
DEFAULT
DESCRIPTION
7:6
RSVD
00
Reserved
00 = auto align when misaligned
01 = one shot manual align. AFS_Init_Input reg determines if
done by pin (INIT) or register (AFS_INIT = 1)
10 = always align
5:4
AFS_Align_Mode
11
11= never align
0 = Rising edges on INIT (pin 6) trigger AFS one shot manual
align.
3
AFS_Init_Input
RSVD
0
1 = Writing ‘1’ to AFS_Init register triggers AFS one shot
manual align.
0x14 Alignment Control – AFS
2:1
00
Reserved
Writing one to this bit while also writing AFS_Align_Mode = 3
and AFS_Init_Input=1, or providing a rising edge on the init
input when AFS_Align_Mode ≠ 3 and AFS_Init_Input=0, will
cause the AFS_INIT output to go high for at least one vframe
period + one Hsync period and not more than one vframe
period + two Hsync periods. The assertion of AFS_INIT must
happen immediately (it cannot wait for Hsync). If
0
AFS_INIT
R/W
0
AFS_Align_Mode = 3, toggling the init input will have no effect.
This bit is self-clearing and will always read zero.
7:3
2:0
7:2
RSVD
00000
010
Reserved
Number of 27 MHz clocks between the TOF1 and Vsync
before Loss of Alignment is reported.
If the code loaded in this register is n, then Loss of Alignment
will be reported if the difference between TOF1 and Vsync
exceeds 2n 27 MHz clock cycles
0x15 Loss of Alignment Control
LOA_Window
RSVD
R/W
000000
Reserved
The VC_Hold[9:0] input signal changes rather slowly. For
synchronization, it should be sampled on consecutive 27 MHz
clocks until two identical values are found. This value will be
saved as VC_Hold_sampled[9:0].
LOR Control – Holdover
0x16
Whenever the VC_Hold[9:8] register is read,
Sampled Voltage MSB
1:0
VC_Hold_MSB
R
10
VC_Hold_sampled[9:8] is returned, and VC_Hold[7:0] will
memorize the current value of VC_Hold_sampled[7:0] (to be
read at a later time).
This scheme allows a coherent 10-bit value to be read.
Returns a synchronized snapshot of the VC_Hold[9:8] (MSB).
The VC_Hold[9:0] input signal changes rather slowly. For
synchronization, it should be sampled on consecutive 27 MHz
clocks until two identical values are found. This value will be
saved as VC_Hold_sampled[9:0].
LOR Control – Holdover
0x17
Whenever the VC_Hold[9:8] register is read,
7:0
VC_Hold_LSB
R
—
Sampled Voltage LSB
VC_Hold_sampled[9:8] is returned, and VC_Hold[7:0] will
memorize the current value of VC_Hold_sampled[7:0] (to be
read at a later time).
This scheme allows a coherent 10-bit value to be read.
Returns a synchronized snapshot of the VC_Hold[7:0] (LSB)
7:2
1:0
RSVD
Reserved
LOR Control Free-run
0x18
Free-run Control Voltage (VC_Free[9:0]) is the voltage
asserted on VC_LPF pin in free-run mode.
Writing will change the MSB (VC_Free[9:8])
Control Voltage MSB
VC_Free_MSB
R/W
R/W
01
Free-run Control Voltage (VC_Free[9:0]) is the voltage
asserted on VC_LPF pin in free-run mode.
Writing will change the LSB (VC_Free[7:0])
LOR Control – Free-run
0x19
7:0
7:2
1
VC_Free_LSB
RSVD
0xFF
000000
0
Control Voltage LSB
Reserved
Directly controls the ADC_Disable output port.
0 = enable holdover ADC
1 = disable holdover ADC
ADC_Disable
R/W
R/W
LOR Control – ADC and
DAC Disable
0x1A
Directly controls the DAC_Disable output port.
0 = enable Free-run/Holdover DAC
0
DAC_Disable
0
1 = disable Free-run/Holdover DAC
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Register Map (continued)
Table 3. LMH1983 Register Map (continued)
ADD NAME
BITS FIELD
R/W
DEFAULT
DESCRIPTION
7
RSVD
0
Reserved
HSYNC_Missing
Threshold
Sets the threshold for number of additional clocks to wait
before setting HSYNC_Missing.
6:4
3
R/W
00
0
Loss of Reference
Threshold
0x1B
RSVD
Reserved
Sets the number of Hsync periods to wait before setting loss
of reference. Since during blanking there can have up to 5
missing Hsync pulses, this value is usually set to 6.
2:0
7:5
4:0
LOR_Threshold
RSVD
R/W
R/W
001
000
Reserved
Sets the number of Hsync periods to wait before setting loss
of lock. Since during blanking there can have up to 5 missing
Hsync pulses, this value is usually set > 6.
0x1C Loss of Lock Threshold
LOCK1_Threshold
10000
Setting this bit masks the PLL4 lock status in the global
LOCK_STATUS bit.
7
6
5
4
3
2
1
0
MASK_LOCK4
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Setting this bit masks the PLL3 lock status in the global
LOCK_STATUS bit.
MASK_LOCK3
Setting this bit masks the PLL2 lock status in the global
LOCK_STATUS bit.
MASK_LOCK2
Setting this bit masks the PLL1 lock status in the global
LOCK_STATUS bit.
MASK_LOCK1
Mask Control – PLL Lock
0x1D
and Output Align
Setting this bit masks the TOF4 align status in the global
ALIGN_STATUS bit.
MASK_TOF4_ALIGN
MASK_TOF3_ALIGN
MASK_TOF2_ALIGN
MASK_TOF1_ALIGN
Setting this bit masks the TOF3 align status in the global
ALIGN_STATUS bit.
Setting this bit masks the TOF2 align status in the global
ALIGN_STATUS bit.
Setting this bit masks the TOF1 align status in the global
ALIGN_STATUS bit.
0x1E Reserved
0x1F Reserved
7:0
7:0
7:6
RSVD
RSVD
RSVD
0x00
0x00
00
Reserved
Reserved
Reserved
When Auto Format Detection is enabled (EN_AFD, address
0x05), this register is read-only and controlled automatically.
When Auto Format Detection is disabled, this register is
writable via I2C.
All writes to this register (whether automatic or manual) will
update all the LUT1 (Lookup Table 1), LUT2_2, and LUT2_3
output registers based on the value written here. Writing to
any of the LUT1, LUT2_2, or LUT2_3 output registers will set
this field to 6’d62 (0x3E) indicating that custom changes have
been made.
0x20 Input Format
5:0
Input Format
000000
7:4
3:0
RSVD
00
Reserved
Writes to this register update the Vsync code which tells the
device what the Input frame rate is. There is a table which
correlates the Vsync codes to the actual frame rates. When
Auto Format Detection is enabled (EN_AFD, address 5), this
register is read-only, and is automatically loaded by the
device.
Output Frame Lookup –
0x21
Input Vsync Code
Input Vsync Code
R/W
0011
7:4
3:0
7:4
3:0
7:0
RSVD
00
Reserved
Whenever PLL2_FORMAT (address 7) is written, this field is
updated with the appropriate Vsync code. If any custom
changes are made the device will set this field to 4’d14 (0x0E)
to so indicate.
Output Frame Lookup –
0x22
PLL2 Vsync Code
PLL2 Vsync Code
RSVD
R/W
R/W
0101
0000
0110
0x00
Reserved
Whenever PLL3_FORMAT (address 8) is written, this field is
updated with the appropriate Vsync code. If any custom
changes are made the device will set this field to 4’d14 (Ox0E)
to so indicate.
Output Frame Lookup –
0x23
PLL3 Vsync Code
PLL3 Vsync Code
RSVD
0x24 Reserved
Reserved
30
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Register Map (continued)
Table 3. LMH1983 Register Map (continued)
ADD NAME
BITS FIELD
R/W
DEFAULT
DESCRIPTION
7:5
4
RSVD
000
Reserved
0 = Divide by 1 (Output is 27 MHz)
1 = Divide by 2 (Output is 13.5 MHz)
PLL1_DIV
RSVD
R/W
0
0
3
Reserved
Directly controls the mode of the PLL1 input buffer.
0 = Single Ended
1 = Differential
2
1
PLL1 Input Mode
RSVD
R/W
0
0
0x25 PLL1 Advanced Control
Reserved
This bit enables ICP1_FAST (address 0x27) to be used during
locking.
0 = FastLock disabled
1 = FastLock enabled
0
FastLock
RSVD
1
7:4
0000
Reserved
Sets the amount of time that PLL1_Lock must be asserted
before the PLL1 Charge pump current is reduced from the
ICP1_Fast value to the ICP1 value. The time delay is specified
in units of half seconds. Delay = FastlockDelay*0.5 Seconds.
Valid values are from 0 to 10. Values from 11 to 15 are
reserved.
PLL1 Advanced Control
0x26
FastLock Delay
3:0
FastLock Delay
R/W
0000
This field specifies the charge pump current to drive when
FastLock is active. Charge pump current is equal to 34.375 µA
* register value
PLL1 Advanced Control
0x27
FastLock Charge Pump
Current
4:0
4:0
R/W
R/W
11111
01000
Fastlock CP Current
This field defines the charge pump current used when
FastLock is not active. Charge pump current is equal to
34.375 µA * register value
PLL1 Advanced Control
0x28
PLL1 Charge Pump
Current
Charge Pump Current
7:2
1:0
RSVD
MSB
000000
00
Reserved
PLL1 Advanced Control
0x29
R Counter MSB
R/W
R/W
The two LSBs of Register 0x29 along with the eight bits of
Register 0x2A form a ten bit word which comprises the R
divider for PLL1. This register is internally written based on the
input format and when AutoFormatDetect is enabled, these
registers are read only.
PLL1 Advanced Control
0x2A
7:0
LSB
0x01
R Counter LSB
7
RSVD
MSB
0
Reserved
PLL1 Advanced Control
0x2B
N Counter MSB
6:0
R/W
R/W
0000110
The 7 LSBs of Register 0x2B along with the eight bits of
Register 0x2C comprise the fifteen bit word which is used for
the N divider of PLL1. These registers are internally controlled
based on the input format detected and when
PLL1 Advanced Control
0x2C
7:0
LSB
0xB4
N Counter LSB
AutoFormatDetect is enabled, these registers are read only.
7:5
4:0
7:5
RSVD
000
01000
000
Reserved
PLL1 Advanced Control
0x2D
Lock Step Size
Lock Step Size
RSVD
R/W
See Application Information section discussion on Lock Detect
Reserved
0 = divide by 1
1 = divide by 2
4
3
PLL2_DIV
R/W
R/W
0
0
PLL2 Advanced Control
0x2E
Main
0 = PLL2 disable is determined by XPT_MODE (Address
0x09)
PLL2_DISABLE
1 = PLL2 is disabled
2:0
7:4
3:0
RSVD
RSVD
ICP2
000
0000
0010
Reserved
Reserved
PLL2 Advanced Control
0x2F
Charge Pump Current
R/W
R/W
Controls PLL2 Charge Pump Current
PLL2 Advanced Control
VCO Range
0x30
7:0
7:5
4
VCO_RNG2
RSVD
0x0C
000
0
Controls the VCO range
Reserved
0 = divide by 1
1 = divide by 2
PLL3_DIV
R/W
R/W
PLL3 Advanced Control
0x31
Main
0 = PLL3 disable is determined by XPT_MODE (Address
0x09)
3
ICP3
0
1 = PLL3 is disabled
2:0
7:4
3:0
RSVD
RSVD
ICP3
000
0000
0011
Reserved
Reserved
PLL3 Advanced Control
0x32
Charge Pump Current
R/W
Controls PLL3 Charge Pump Current
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Register Map (continued)
Table 3. LMH1983 Register Map (continued)
ADD NAME
BITS FIELD
R/W
DEFAULT
DESCRIPTION
PLL3 Advanced Control
VCO Range
0x33
7:0
7:4
VCO_RNG3
R/W
0x05
Controls the VCO range
Controls the PLL4 output divider — PLL4 is divided by
2PLL4_DIV
PLL4_DIV
R/W
R/W
0010
0 = PLL4 is enabled
1 = PLL4 is disabled
3
2
1
PLL4_Disable
RSVD
0
0
0
PLL4 Advanced Control
Main
0x34
Reserved
0 = 100 MHz clock
1 = 125 MHz clock
IS125M
R/W
R/W
0 = using 27 MHz Clock
1 = using external clock
0
PLL4_Mode
0
7:4
3:0
7
RSVD
0000
1000
0
Reserved
PLL4 Advanced Control
Charge Pump Current
0x35
0x36
0x37
ICP4
R/W
R/W
Controls PLL4 Charge Pump Current
Reserved
RSVD
PLL4 Advanced Control
R counter
6:0
7:2
1:0
DIV_R4
RSVD
1001011
000000
10
Sets the R divider in PLL4
Reserved
PLL4 Advanced Control
N counter MSB
DIV_N4_MSB
R/W
R/W
Two MSBs of the N divider in PLL4
PLL4 Advanced Control
N counter LSB
0x38
0x39
7:0
7:0
DIV_N4_LSB
VCO4 Range
0x00
0x16
8 LSBs of the N divider in PLL4
PLL4 Advanced Control
VCO Range
The value in the VCO4 Range register is used to adjust the
center frequency of PLL4.
R/W
7
LVDS Boost
LVDS_DIFF
LVDS_CM
RSVD
R/W
R/W
R/W
0
Applies pre-emphasis to LVDS output
Adjusts LVDS Differential output swing
Adjusts LVDS Common Mode output voltage
Reserved
0x3A LVDS Control
6:4
3:0
7:5
100
1001
000
TOF1 Adv Control
LPF MSB
5 MSBs of the TOF1 lines per Frame count. This is read-only
and loaded automatically when Auto Format Detection is
enabled
0x3B
4:0
TOF1_LPF_MSB
R
R
00010
8 LSBs of the TOF1 lines per Frame count. This is read-only
and loaded automatically when Auto Format Detection is
enabled
Together with Register 0x3B this is a 13 bit number which
number of lines per frame. TOF1 will be at a frequency of
Hsync divided by this value.
TOF1 Advanced Control
LPF_LSB
0x3C
7:0
TOF1_LPF_LSB
0x0D
7
RSVD
0
Reserved
TOF2 Advanced Control
CPL MSB
0x3D
0x3E
0x3F
6:0
TOF2_CPL_MSB
R
R
0001010
This 15 bit register gives the number of clock cycles per line to
calculate TOF2. It is loaded automatically based on the format
set with Register 0x07.
TOF2 Advanced Control
CPL LSB
7:0
TOF2_CPL_LSB
0x50
7:5
4:0
RSVD
000
Reserved
TOF2 Advanced Control
LPF MSB
TOF2_LPF_MSB
R
R
00010
This 13 bit register is loaded automatically based on the
format selected via Register 0x07. It sets the number of lines
per frame for the selected format to set the TOF2 rate
correctly.
TOF2 Advanced Control
LPF_LSB
0x40
7:0
TOF2_LPF_LSB
0x65
7:5
4:0
RSVD
000
Reserved
TOF2 Advanced Control
Frame Reset MSB
0x41
0x42
0x43
0x44
0x45
TOF2_RST_MSB
R
R
00010
Automatically loaded based on formats selected.
TOF2 Advanced Control
Frame Reset LSB
7:0
TOF2_RST_LSB
0x58
7
RSVD
0
Reserved
TOF3 Advanced Control
CPL_MSB
6:0
TOF3_CPL_MSB
R
R
0001000
This 15 bit register gives the number of clock cycles per line to
calculate TOF3. It is loaded automatically based on the format
set with Register 0x08.
TOF3 Advanced Control
CPL_LSB
7:0
TOF2_CPL_LSB
0x98
7:5
4:0
RSVD
000
Reserved
TOF3 Advanced Control
LPF_MSB
TOF3_LPF_MSB
R
R
00100
This 13 bit register is loaded automatically based on the
format selected via Register 0x08. It sets the number of lines
per frame for the selected format to set the TOF3 rate
correctly.
TOF3 Advanced Control
LPF_LSB
0x46
7:0
TOF3_LPF_LSB
0x65
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Register Map (continued)
Table 3. LMH1983 Register Map (continued)
ADD NAME
BITS FIELD
R/W
DEFAULT
000
DESCRIPTION
7:5
4:0
RSVD
Reserved
TOF3 Advanced Control
Frame Reset MSB
0x47
TOF3_RST_MSB
R
R
00000
Automatically loaded based on formats selected.
TOF3 Advanced Control
Frame Reset LSB
0x48
0x49
7:0
TOF3_RST_LSB
0x01
TOF4 Advanced Control
AFS
See Detailed Description section for details. See also PLL4
7:0
7:4
3:0
TOF4_AFS
RSVD
R/W
R/W
0x05
0000
1011
Block Diagram.
Reserved
TOF4 Advanced Control
ACLK
0x4A
See Detailed Description section for details. See also PLL4
TOF4_ACLK
Block Diagram.
0x4B
to
0x50
Reserved
7:0
7:0
RSVD
0x00
0x00
Reserved
User Auto Format
27M High Value MSB
User format detect is determined by looking at the frequency
of the Hsync input. This frequency is measured by counting
the number of 27 MHz clock cycles that occur in 20 Hsync
periods. This 16 bit register lists the maximum number of 27
MHz clock cycles in 20 Hsync periods that could be
0x51
0x52
0x53
0x54
USR_27M_High_MSB
R/W
R/W
R/W
R/W
User Auto Format
27M High Value LSB
7:0
7:0
7:0
USR_27M_High_LSB
USR_27M_Low_MSB
USR_27M_Low_LSB
0x00
0x00
0x00
considered to meet the criteria for the User Format
User Auto Format
27M Low Value MSB
User format detect is determined by looking at the frequency
of the Hysnc input. This frequency is measured by counting
the number of 27 MHz clock cycles that occur in 20 Hsync
periods. This 16 bit register lists the minimum number of 27
MHz clock cycles in 20 Hsync periods that could be
considered to meet the criteria for the User Format
User Auto Format
27M Low Value LSB
7:2
1:0
RSVD
000000
00
Reserved
User Auto Format
R divider MSB
0x55
0x56
0x57
USR_DIV_R1_MSB
R/W
R/W
See Detailed Description section for details.
User Auto Format
R Divider LSB
7:0
USR_DIV_R1_LSB
0x00
See Detailed Description section for details.
7
RSVD
0
Reserved
User Auto Format
N Divider MSB
6:0
USR_DIV_N1_MSB
R/W
R/W
0000000
See Detailed Description section for details.
User Auto Format
N Divider LSB
0x58
0x59
7:0
7:0
USR_DIV_N1_LSB
USR_ICP
0x00
0x00
See Detailed Description section for details.
See Detailed Description section for details.
User Auto Format
Charge Pump Current
R/W
7:5
4:0
RSVD
000
Reserved
User Auto Format
LPF MSB
0x5A
USR_TOF_LPF_MSB
R/W
R/W
00000
See Detailed Description section for details.
User Auto Format
LPF LSB
0x5B
0x5C
7:0
7:0
USR_TOF_LPF_MSB
USR_TOF4
0x00
0x00
See Detailed Description section for details.
See Detailed Description section for details.
User Auto Format
AFS
R/W
R/W
Enables the Auto Format Detection User Mode.
0 = disabled
1 = enabled
7
EN_USERMODE
RSVD
0
6:5
00
Reserved
User Auto Format
Misc
Sets the INTERLACED value to output from LUT1 if the
INPUT_FORMAT register is set to the user code. This bit also
specifies the value that the Auto Format Detection must see
on the interlaced signal to detect the user defined mode.
0x5D
4
USR_IINTERLACED
USR_IN_VS_CODE
R/W
R/W
0
Sets the INPUT_VS_CODE value to output from LUT1 if the
INPUT_FORMAT registers is set to the user code.
3:0
0000
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Table 4. Crosspoint Output Selection Table
REGISTER 0x09 [3:0]
PLL2_DISABLE(1)
PLL3_DISABLE(1)
OUT2 SOURCE
PLL2
OUT3 SOURCE
0000 (default)
0001
0
0
PLL3
PLL1
1
1
PLL1
0010
0
1
PLL2
PLL2
0011
1
0
PLL3
PLL3
0100
0
0
PLL3
PLL2
0101
1
0
PLL1
PLL3
0110
0
1
PLL2
PLL1
0111
0
1
PLL1
PLL2
1000
1
0
PLL3
PLL1
1001
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
1010
1011
1100
1101
1110
1111
(1) PLL2_Disable and PLL3_Disable can be forced via register writes to the PLLx_DISABLE registers independently of the status of the
Crosspoint Mode bits.
Table 5. Vsync Codes
Vsync CODE
FRAME RATE (Hz)
NUMBER (BINARY)(1)
0 (0000)
1 (0001)
2 (0010)
3 (0011)
4 (0100)
5 (0101)
6 (0110)
7 (0111)
23.98 Hz
24 Hz
25 Hz
29.97 Hz
30 Hz
50 Hz
59.94 Hz
60 Hz
(1) Vsync codes are used by Registers 0x21 (Output Frame Lookup –
Input Vsync Code), 0x22 (Output Frame Lookup – PLL2 Vsync
Code), and 0x23 (Output Frame Lookup – PLL3 Vsync Code).
34
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9 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LMH1983 is an analog phase locked loop (PLL) clock generator that can output simultaneous clocks at a
variety of video and audio rates, synchronized or “genlocked” to Hsync and Vsync input reference timing. The
LMH1983 features an output Top of Frame (TOF) pulse generator for each of its four channels, each with
programmable timing that can also be synchronized to the reference frame. The clock generator uses a two-
stage PLL architecture to attenuate input timing jitter for minimum jitter transfer. The combination of the external
VCXO, external loop filter, and programmable PLL parameters provides flexibility to optimize the loop bandwidth
and loop response for design applications.
9.2 Typical Applications
9.2.1 Typical Genlock Timing Generation with NTSC 525i/29.97 High Speed Reference
The LMH1983 is commonly used with Hsync, Vsync, and Fsync timing signals as a reference for genlock. Once
these signals are provided, the LMH1983 can produce a specific set of clock output signals required by a
downstream endpoint. In some video applications, a multi-format video sync separator is used to derive the
Hsync, Vsync, and Fsync signals from a standard analog SD/ED/HD video signal. In Figure 22, a LMH1981
multi-format sync separator is used to provide HIN, VIN, and FIN for the LMH1983. In this case, LMH1983 PLLs 1-
4 provide a 27 MHz/29.97 Hz, 148.5 MHz/29.97 Hz, 148.35 MHz/59.94 Hz, and 24.576 MHz/5.994 Hz output,
respectively, to an A/V Frame Synchronizer. Another example of this application can be seen in Figure 23, where
HIN, VIN, and FIN signals are provided directly from an FPGA SDI RX without a sync separator. In the latter
example, the NTSC 525i/29.97 HIN, VIN, and FIN parameters are provided individually for the LMH1983, after
which the LMH1983 provides 3G, 3G/1.001, and Audio Clock Generation.
LOOP
FILTER
27 MHz
VCXO
27 MHz (PLL1)
525i
Analog
ref. in
H sync
V sync
F sync
CLKout1
29.97 Hz (TOF1)
525i/29.97 SDI out
+ embedded audio
LMH1981
Sync
Separator
Hin
Vin
Fin
148.5 MHz (PLL2)
29.97 Hz (TOF2)
CLKout2
CLKout3
FPGA
1080p/59.94 SDI out
+ embedded audio
A/V Frame Sync with
Downconverter,
Audio Embedder and
De-embedder
LMH1983
148.35 MHz (PLL3)
59.94 Hz (TOF3)
1080p/59.94 SDI in
+ embedded audio
24.576 MHz (PLL4)
5.994 Hz
CLKout4
Genlocked to video ref. in
Figure 22. LMH1983 Video Genlock Timing Generation for A/V Frame Synchronizer
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Typical Applications (continued)
LOOP
FILTER
27 MHz
VCXO
27 MHz
525i/29.97 SDI out
+ embedded audio
H blank
V blank
F blank
CLKout1
525i/29.97 digital
blanking pulse inputs
from FPGA SDI RX
Hin
Vin
Fin
1080i/29.97 SDI out
+ embedded audio
148.5 MHz (PLL2)
148.35 MHz (PLL3)
CLKout2
CLKout3
CLKout4
HD-SDI Upconverter
(HD/SD Simulcast)
with Audio Embedder
LMH1983
525i/29.97 SDI in
+ embedded audio
24.576 MHz
PLL1 Ref. In Format = 525i/29.97
PLL2 Video Format = 525i/29.97*
PLL3 Video Format = 1080i/29.97*
A/V clock signals
genlocked to SDI in
PLL4 Audio Format = 24.576 MHz with 48 kHz word clock
* GHQRWHVꢀ³3*ꢀ&/.´ꢀPRGHꢀ(148.5 or 148.35 MHz)
Figure 23. LMH1983 Video Timing Generation for HD-SDI Up-Conversion with Audio Embed/De-embed
9.2.1.1 Design Requirements
When designing for the LMH1983, it is essential to choose the correct VCXO and external loop filter capacitors.
The following subsections provide guidance regarding how to select these components to improve timing stability
and accuracy.
9.2.1.1.1 VCXO Selection Criteria
The recommended VCXO is CTS part number 357LB3C027M0000, which has an absolute pull range of ±50 ppm
and a temperature range of –20°C to +70°C. A VCXO with a smaller APR can provide better frequency stability
and slightly lower jitter, but the APR must be larger than the anticipated variation of the input frequency range.
9.2.1.1.2 Loop Filter Capacitors
The most common types of capacitors used in many circuits today are ferroelectric ceramic capacitors such as
X7R, Y5V, X5R, Y5U, and so on. These capacitors suffer from piezoelectric effects, which generate an electrical
signal in response to mechanical vibration, stress, and shock. This effect can adversely affect the jitter
performance when presented to the control input to the VCXO. The easiest way to eliminate this effect is to use
tantalum capacitors that do not exhibit the piezoelectric effect.
9.2.1.2 Detailed Design Procedure
Once the appropriate external VCXO and loop filter components are selected, the input timing signaling should
be referenced to Table 2 to determine whether NTSC 525i/29.97 sync format is supported. This video format is a
supported video format for automatic detection under Auto Format Detection Code 0, so it is not necessary to
override the input auto-detection feature.
Once PLL1 has genlocked to the chosen NTSC, 525i input reference signal, PLLs 2-3 can be set according to
the desired output signals specified in Figure 23. Refer to Table 6 and Table 7 for a list of possible input and
output formats available for auto-format detection in Figure 22 and Figure 23, respectively. The format code can
be applied as an expected input format for PLL1 (Register 0x20) or a programmed output format for PLL2
(Register 0x07) and PLL3 (Register 0x08).
Table 6. Relevant Auto-Format Detection Codes for Figure 22
PLLx
(INPUT/OUTPUT)
HSync PERIOD
(in 27 MHz CLOCKS)
FORMAT CODE
DESCRIPTION
PLL1 (Input)
PLL2 (Output)
PLL3 (Output)
0
0
525I29.97
525I29.97
1716
1716
400.4
13
1080P59.94
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Table 7. Relevant Auto-Format Detection Codes for Figure 23
PLLx
(INPUT/OUTPUT)
HSync PERIOD
(in 27 MHz CLOCKS)
FORMAT CODE
DESCRIPTION
PLL1 (Input)
0
0
525I29.97
525I29.97
1080I29.97
1716
1716
800.8
PLL2 (Output)
PLL3 (Output)
21
To ensure correct auto-detection and CLKout signaling desired in Figure 22 and Figure 23, the following SMBus
register values should be verified or changed from their default values.
Table 8. SMBus Register Settings for Figure 22
Register[Bit(s)]
0x05[5]
WRITE VALUE
1'b
COMMENTS
Auto Format Detect enabled
0x05[4:3]
0x05[1]
01'b
PLL1 operating in Genlock mode
1'b
Forces PLL2 = 148.5 MHz and PLL3 = 148.35 MHz
Set PLL2 Output to Format Detection Code 0 (0x00)
Set PLL3 Output to Format Detection Code 13 (0x0D)
Set to always align when misaligned
0x07[5:0]
0x08[5:0]
0x11[5:4]
0x11[3:2]
0x12[5:4]
0x13[5:4]
0x14[5:4]
0x34[7:4]
000000'b
001101'b
10'b
01'b
Drift lock (small misalignment), crash lock (large misalignment)
Set TOF2 to always align when misaligned
10'b
10'b
Set TOF3 to always align when misaligned
10'b
Set AFS_Align_Mode to always align when misaligned
Set PLL4_DIV to divide-by-4 for 24.576 MHz
0010'b
Table 9. SMBus Register Settings for Figure 23
Register[Bit(s)]
0x05[5]
WRITE VALUE
1'b
COMMENTS
Auto Format Detect enabled
0x05[4:3]
0x05[1]
01'b
PLL1 operating in Genlock mode
1'b
Forces PLL2 = 148.5 MHz and PLL3 = 148.35 MHz
Set PLL2 Output to Format Detection Code 0 (0x00)
Set PLL3 Output to Format Detection Code 21 (0x15)
Set to always align when misaligned
0x07[5:0]
0x08[5:0]
0x11[5:4]
0x11[3:2]
0x12[5:4]
0x13[5:4]
0x14[5:4]
0x34[7:4]
000000'b
010101'b
10'b
01'b
Drift lock (small misalignment), crash lock (large misalignment)
Set TOF2 to always align when misaligned
Set TOF3 to always align when misaligned
Set AFS_Align_Mode to always align when misaligned
Set PLL4_DIV to divide-by-4 for 24.576 MHz
10'b
10'b
10'b
0010'b
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9.2.1.3 Application Curves
10 ns / div
20 µs / div
Traces 1-4: 1V / div
Traces 1-3: 2V / div
Figure 24. CLKout 1-4 Signals after Genlock to 525i/29.97
Input Reference
Figure 25. TOF1 Falling Edge Alignment with HSync and
VSync Reference Timing
20 µs / div
20 µs / div
Traces 1-3: 2 V / div
Traces 1-4: 2 V / div
Figure 26. TOF1 Alignment Comparison to HSync and
VSync Reference Timing
Figure 27. TOF1 and TOF3 Alignment on Rising Edge
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9.2.2 A/V Clock Generation with Recognized Clock-based Input Reference
The LMH1983 is shown in the following application example where the HIN input reference timing signal is clock-
based. After achieving genlock, the LMH1983 can produce a specific set of clock output signals required
downstream. In this case, LMH1983 PLLs 1-4 provide a 27 MHz, 74.25 MHz, 74.176 MHz, and 98.304 MHz
output, respectively.
LOOP
FILTER
27 MHz
VCXO
27 MHz
CLKout1
Other clock inputs supported
32, 44.1, 48 or 96 kHz (Audio)
27 MHz (Video)
Hin
74.25 MHz (PLL2)
74.176 MHz (PLL3)
10 MHz (GPS)
CLKout2
CLKout3
CLKout4
A/V clock signals
genlocked to
clock ref. in
LMH1983
98.304 MHz
PLL1 Ref. In Format = Audio word, 27 MHz, or 10 MHz clock
PLL2 Video Format = 1080i/25
PLL3 Video Format = 1080i/29.97
PLL4 Audio Format = 98.304 MHz with 48 kHz word clock
Figure 28. LMH1983 A/V Clock Generation with Non-Format Specific Input Clock Reference
9.2.2.1 Design Requirements
When designing for the LMH1983, it is essential to ensure that the correct VCXO and external loop filter
capacitors are chosen. Refer to VCXO Selection Criteria and Loop Filter Capacitors for guidance regarding how
to select these components to improve timing stability and accuracy.
9.2.2.2 Detailed Design Procedure
Once the appropriate external VCXO and loop filter components are selected, the input timing signaling should
be referenced to the "Supported Formats Lookup Table (LUT)" (see Table 2) to determine whether the video
clock, GPS clock, and audio clock are supported by automatic format detection. From Table 2 and the Auto
Format Detection Codes, all of the reference clock inputs mentioned in this application are supported under the
auto format detection feature. Once PLL1 has genlocked to the chosen HIN signal, PLLs 2-3 can be set
according to the desired output signals specified in Auto Format Detection Codes. Refer to Table 10 for a list of
possible input and output formats available for auto-format detection in this application. The format code can be
applied as an expected input format for PLL1 (Register 0x20) or a programmed output format for PLL2 (Register
0x07) and PLL3 (Register 0x08).
Table 10. Relevant Auto-Format Detection Codes for Figure 28
HSync PERIOD
(in 27 MHz CLOCKS)
PLLx (INPUT/OUTPUT)
FORMAT CODE
DESCRIPTION
PLL2 (Output)
PLL3 (Output)
PLL1 (Input)
PLL1 (Input)
PLL1 (Input)
PLL1 (Input)
PLL1 (Input)
PLL1 (Input)
22
21
25
26
27
28
29
30
1080I25
960
800.8
562.5
281.25
612.244898
843.75
1
1080I29.97
48 kHz Audio
96 kHz Audio
44.1 kHz Audio
32 kHz Audio
27 MHz HSync
10 MHz HSync
2.7
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To ensure correct auto-detection and the correct CLKout signaling desired in Figure 28, the following SMBus
register values should be verified or changed from their default values.
Table 11. SMBus Register Settings for Figure 28
REGISTER[Bit(s)]
0x05[5]
WRITE VALUE
1'b
COMMENTS
Auto Format Detect enabled
0x05[4:3]
0x05[1]
01'b
PLL1 operating in Genlock mode
0'b
Allow PLL2 and PLL3 to use the native clock rates
Set PLL2 Output to Format Detection Code 22 (0x16)
Set PLL3 Output to Format Detection Code 21 (0x15)
Set to always align when misaligned
0x07[5:0]
0x08[5:0]
0x11[5:4]
0x11[3:2]
0x12[5:4]
0x13[5:4]
0x14[5:4]
0x2E[4]
010110'b
010101'b
10'b
01'b
Drift lock (small misalignment), crash lock (large misalignment)
Set TOF2 to always align when misaligned
Set TOF3 to always align when misaligned
Set AFS_Align_Mode to always align when misaligned
Set PLL2_DIV to divide-by-2 for 74.25 MHz
Set PLL3_DIV to divide-by-2 for 74.176 MHz
Set PLL4_DIV to divide-by-1 for 98.304 MHz
10'b
10'b
10'b
1'b
0x31[4]
1'b
0x34[7:4]
0000'b
9.2.2.3 Application Curve
10ns / div
Traces 1-4: 1V / div
Figure 29. CLKout 1-4 Signals after Genlock to Clock-Based Reference
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9.2.3 A/V Clock Generation Using Free-Run Mode
The LMH1983 can be used in free-run mode, as shown in the following application example. No HIN, VIN, and FIN
input reference timing signals are provided. Instead, the LMH1983 tracks a 27 MHz TCXO reference, which
replaces the external VCXO and loop filter mentioned in previous applications. The LMH1983 can still produce a
specific set of clock output signals required by a downstream endpoint. In this application, LMH1983 PLLs 1-4
provide a 27 MHz, 148.5 MHz, 148.35 MHz, and 98.304 MHz output, respectively.
TCXO
27 MHz
±1ppm
27 MHz
CLKout1
Hin
Vin
Fin
No input
148.5 MHz (PLL2)
148.35 MHz (PLL3)
98.304 MHz
CLKout2
CLKout3
CLKout4
A/V clock
signals will
track the TCXO
and have the
same accuracy
LMH1983
PLL1 Mode = Free run
PLL2 Video Format = 1080p/50
PLL3 Video Format = 1080p/59.94
PLL4 Audio Format = 98.304 MHz with 48 kHz word clock
Figure 30. High-Precision, Stable A/V Clock Generation Using a 27 MHz TCXO Reference
9.2.3.1 Design Requirements
This application requires less components than the previous applications mentioned in this section. This is
because there is no HIN reference, external VCXO, or loop filter. However, the PLL1 signal is still applied via the
27 MHz TCXO clock signal on the XOin± pins. Using a TCXO for reference allows a stable, standalone clock
generation for PLLs 2-4.
9.2.3.2 Detailed Design Procedure
Since no HIN input timing signaling is provided, this application example cannot use the "Supported Formats
Lookup Table (LUT)" (see Table 2) for automatic format detection. However, PLLs 2-4 can still be manually
programmed to output the correct output format using Auto Format Detection Codes. To output the desired video
and audio formats from PLLs 2-3, the following output codes should be used:
Table 12. Auto-Format Detection Output Codes for Figure 30
PLLx
(INPUT/OUTPUT)
HSync PERIOD
(in 27 MHz CLOCKS)
FORMAT CODE
DESCRIPTION
PLL2 (Output)
PLL3 (Output)
14
13
1080P50
480
1080P59.94
400.4
To ensure correct auto-detection and the correct CLKout signaling desired in Figure 30, the following SMBus
register values should be verified or changed from their default values.
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Table 13. SMBus Register Settings for Figure 30
REGISTER[Bit(s)]
0x05[5]
WRITE VALUE
1'b
COMMENTS
Auto Format Detect enabled
0x05[4:3]
0x05[1]
00'b
PLL1 operating in Free-run mode
1'b
Forces PLL2 = 148.5 MHz and PLL3 = 148.35 MHz
Set PLL2 Output to Format Detection Code 14 (0x0E)
Set PLL3 Output to Format Detection Code 13 (0x0D)
Set to always align when misaligned
0x07[5:0]
0x08[5:0]
0x11[5:4]
0x11[3:2]
0x12[5:4]
0x13[5:4]
0x34[7:4]
001110'b
001101'b
10'b
01'b
Drift lock (small misalignment), crash lock (large misalignment)
Set TOF2 to always align when misaligned
10'b
10'b
Set TOF3 to always align when misaligned
0000'b
Set PLL4_DIV to divide-by-1 for 98.304 MHz
9.2.3.3 Application Curve
10 ns / div
Traces 1-4: 1 V / div
Figure 31. CLKout 1-4 Signals after Tracking 27 MHz TCXO Reference
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10 Power Supply Recommendations
It is important to ensure that the LMH1983 is provided with an adequate power supply that provides the cleanest
voltage to the VDD_IO and VDD supply pins. One potential source of jitter on a multiple clock system such as
the LMH1983 is interference among the four PLLs on the chip. To help reduce this effect, each PLL is run from a
separate power supply internally on the LMH1983, and each supply has its own internal regulator. These
regulators each require their own external bypass as seen in Figure 32 with bypass capacitors.
Capacitors can be
either tantalum or an
ultra-low ESR ceramic.
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
VDD_IO
VDD
PLL1
(Pin 1)
(Pin 2, 10)
VDD
CLKout3
(Pin 20)
VDD
CLKout1
(Pin 38)
3.3 V
3.3 V
VDD
VDD
CLKout4
(Pin 16)
CLKout2
(Pin 31)
VDD
PLL2
(Pin 32)
Internal
LDO
regulator
Cbyp2
(Pin 27)
3.3 V
VDD
Internal
LDO
regulator
Cbyp3
(Pin 25)
PLL3,
PLL4
(Pin 19)
Internal
LDO
regulator
Cbyp4
(Pin 26)
Place 1 µF and 0.1 µF
bypass capacitors as close to
the Cbyp Pin as possible.
Figure 32. LMH1983 Power Supply Connection Diagram
11 Layout
11.1 Layout Guidelines
When designing the PCB layout for the LMH1983, it is important to follow these the guidelines:
•
Whenever possible, dedicate an entire layer to each power supply. This will reduce the inductance in the
supply plane.
•
•
•
Use surface mount components whenever possible.
Place bypass capacitors and filter components as close as possible to each power pin.
Place the loop filter components, including the buffer amplifier, and VCXO as close as possible to the
LMH1983.
•
Do not allow discontinuities in the ground planes – return currents follow the path of least resistance. For high
frequency signals this will be the path of least inductance.
•
•
Make sure to match the trace lengths of all differential traces.
Remember that vias have significant inductance — when using a via to connect to a power supply or ground
layer, two in parallel will reduce the inductance over a single via.
•
•
Connect the pad on the bottom of the package to a solid ground connection. This contact is used as a major
ground connection as well as providing a thermal conduit which helps to maintain a constant die temperature.
See Application Note: AN-1187, Leadless Leadframe Package (LLP) (SNOA401) for more Information on the
LLP (WQFN) style package.
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11.2 Layout Example
C1
C3
C6
VddCLK1
VddCLK2
VddCLK3
VddCLK4
1 µF
1 µF
1 µF
C2
C4
C7
Vdd3_3
C5
C8
VddPLL1
VddPLL2
VddPLL3
0.1 µF
0.1 µF
0.1 µF
1 µF
0.1 µF
GND
37
36
35
GND
Fout1
CLKout1+
CLKout1-
Fout1
CLK1_P
CLK1_N
Vdd3_3
R1
R2
3
4
5
6
30
29
28
Vin
Hin
Hsync
Fout2
CLKout2-
CLKout2+
Fout2
CLK2_P
CLK2_N
0
0
Vsync
Fsync
INIT
Do Not Load
Do Not Load
Fin
INIT
GND
24
23
22
CLKout3-
CLKout3+
Fout3
CLK3_N
CLK3_P
Fout3
7
8
9
ADDR
SDA
SCL
SDA
SCL
U1
Vdd3_3
17
15
14
Fout4/OSCin
CLKout4+
CLKout4-
Fout4
CLK4_P
CLK4_N
LMH1983SQ
Vdd3_3
R4
R5
10.0k
13
12
11
NO_REF
NO_ALIGN
NO_LOCK
NOREF
NOALIGN
NOLOCK
3.0k
34
33
XOin+
XOin-
5
GND
U2
40
3
LMP7711MK
VC_LPF
R7
1.8k
1
V-
V+
CS
47 µF
4
CP
1 µF
VddVCXO
Vdd3_3
RS
17.4k
GND
C12
0.1 µF
5
GND
OUTA
OUT
GND
1
VC
R10
4
49.9
X1
GND
357LB3I027M0000
GND
Figure 33. LMH1983 Typical Interface Circuit
An example of a typical application circuit for the LMH1983 is shown in the Figure 33. When performing PCB
layout, key areas to consider regarding this circuit are the loop filter – which consists of RS, CS, CP and the
LM7711 Operational Amplifier which buffers the loop filter output prior to driving the control voltage input of the
VCXO. Care must be taken in the component selection for the loop filter components (see VCXO Selection
Criteria and Loop Filter Capacitors). The CLKout outputs are differential LVDS signals and should be treated as
differential signals. These signals may be laid out as fully differential lines, in which the characteristic impedance
between the two lines is nominally 100 Ω. Alternately, loosely coupled lines may be used, in which case the
characteristic impedance of each line should be 50 Ω referenced to GND. In either case, care should be taken to
match the lengths of the traces as closely as possible. Trace length mismatches on a differential line will add to
the jitter seen on that line. Jitter is also added to the clock outputs if other signals are allowed to interfere with the
signal traces. Therefore, to the greatest extent possible, the clock traces should be isolated from other signals.
Long parallel runs should also be avoided. In places where a hostile signal must cross a sensitive clock signal, it
should be routed such that it crosses as closely as possible to a 90° crossing.
When performing board layouts with the LMH1983, stencil parameters such as aperture area ratio and the
fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to placement of
the WQFN package is highly recommended to improve board assembly yields. If the via and aperture openings
are not carefully monitored, the solder may flow unevenly through the DAP. Stencil parameters for aperture
opening and via locations are shown in Figure 34.
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Layout Example (continued)
Figure 34. No Pullback LLP, Single Row Reference Diagram
Table 14. No Pullback LLP Stencil Aperture Summary for LMH1983
DEVICE
PIN
COUNT
MKT.
DWG.
PCB I/O
PAD SIZE PITCH
(mm)
PCB
PCB
DAP SIZE
(mm)
STENCIL
I/O
STENCIL
DAP
NUMBER of
DAP
GAP BETWEEN
DAP APERTURE
(DIM A mm)
(mm)
APERTURE APERTURE APERTURE
(mm)
(mm)
OPENINGS
LMH1983
40
SNA40A 0.25 x 0.6
0.5
4.6 x 4.6
0.25 x 0.7
1.0 x 1.0
16
0.2
Figure 35. 40-Pin WQFN Stencil Example of Via and Opening Placement
The following PCB layout example is derived from the layout design of the LMH1983 in the SD1983EVK
Evaluation Module User's Guide (SNLU001). This graphic and additional layout board description demonstrates
both proper routing and solder techniques when designing in this clock generator.
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Figure 36. LMH1983 Example Layout
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
•
•
•
•
•
Absolute Maximum Ratings for Soldering (SNOA549).
Generating 44.1 kHz Based Clocks with the LMH1983, Application Note AN–2108 (SNLA129).
Leadless Leadframe Package (LLP), Application Note AN-1187 (SNOA401).
SD1983EVK/LMH1983 Evaluation Kit User Guide (SNLU001).
Semiconductor and IC Package Thermal Metrics (SPRA953).
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMH1983SQ/NOPB
LMH1983SQE/NOPB
LMH1983SQX/NOPB
ACTIVE
ACTIVE
ACTIVE
WQFN
WQFN
WQFN
RTA
RTA
RTA
40
40
40
1000 RoHS & Green
250 RoHS & Green
2500 RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
-40 to 85
LMH1983
SN
SN
LMH1983
LMH1983
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Jul-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMH1983SQ/NOPB
LMH1983SQE/NOPB
LMH1983SQX/NOPB
WQFN
WQFN
WQFN
RTA
RTA
RTA
40
40
40
1000
250
330.0
178.0
330.0
16.4
16.4
16.4
6.3
6.3
6.3
6.3
6.3
6.3
1.5
1.5
1.5
12.0
12.0
12.0
16.0
16.0
16.0
Q1
Q1
Q1
2500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Jul-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMH1983SQ/NOPB
LMH1983SQE/NOPB
LMH1983SQX/NOPB
WQFN
WQFN
WQFN
RTA
RTA
RTA
40
40
40
1000
250
356.0
208.0
356.0
356.0
191.0
356.0
35.0
35.0
35.0
2500
Pack Materials-Page 2
PACKAGE OUTLINE
RTA0040A
WQFN - 0.8 mm max height
S
C
A
L
E
2
.
2
0
0
PLASTIC QUAD FLATPACK - NO LEAD
6.1
5.9
B
A
PIN 1 INDEX AREA
6.1
5.9
0.5
0.3
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
0.8 MAX
C
SEATING PLANE
0.08
0.05
0.00
(0.2) TYP
(0.1) TYP
4.6 0.1
EXPOSED
THERMAL PAD
20
11
36X 0.5
10
21
4X
4.5
SEE TERMINAL
DETAIL
1
30
0.3
40X
40
31
0.2
PIN 1 ID
(OPTIONAL)
0.5
0.3
0.1
C A B
40X
0.05
4214989/B 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RTA0040A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
4.6)
SYMM
40
31
40X (0.6)
40X (0.25)
1
30
36X (0.5)
SYMM
(5.8)
(0.74)
TYP
(
0.2) TYP
VIA
(1.31)
TYP
10
21
(R0.05) TYP
11
20
(0.74) TYP
(1.31 TYP)
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214989/B 02/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RTA0040A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.48) TYP
9X ( 1.28)
40
31
40X (0.6)
1
30
40X (0.25)
36X (0.5)
(1.48)
TYP
SYMM
(5.8)
METAL
TYP
10
21
(R0.05) TYP
11
20
SYMM
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
70% PRINTED SOLDER COVERAGE BY AREA
SCALE:15X
4214989/B 02/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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