LMP8480ATQDGKRQ1 [TI]

AEC-Q100、4V 至 76V 电流感应放大器 | DGK | 8 | -40 to 125;
LMP8480ATQDGKRQ1
型号: LMP8480ATQDGKRQ1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

AEC-Q100、4V 至 76V 电流感应放大器 | DGK | 8 | -40 to 125

放大器 光电二极管
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LMP8480-Q1, LMP8481-Q1  
SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
LMP848x-Q1 Automotive, 76-V, High-Side, High-Speed, Current-Sense Amplifier  
1 Features  
3 Description  
The  
LMP8481-Q1 devices are precision, high-side,  
current-sense amplifiers that amplify small  
automotive-qualified  
LMP8480-Q1  
and  
1
Qualified for Automotive Applications  
AEC-Q100 Qualified With the Following Results:  
a
Device Temperature Grade 1: –40°C to 125°C  
Ambient Operating Temperature  
differential voltage developed across a current-sense  
resistor in the presence of high input common-mode  
voltages. These amplifiers are designed for  
Device HBM ESD Classification Level 2  
Device CDM ESD Classification Level C6  
bidirectional  
(LMP8481-Q1)  
or  
unidirectional  
(LMP8480-Q1) current applications and accept input  
signals with a common-mode voltage range from 4 V  
to 76 V with a bandwidth of 270 kHz. Because the  
operating power-supply range overlaps the input  
common-mode voltage range, the LMP848x-Q1 can  
be powered by the same voltage that is being  
monitored. This benefit eliminates the need for an  
intermediate supply voltage to be routed to the point  
of load where the current is being monitored,  
resulting in reduced component count and board  
space.  
Bidirectional or Unidirectional Sensing  
Common Mode Voltage Range: 4.0 V to 76 V  
Supply Voltage Range: 4.5 V to 76 V  
Fixed Gains: 20, 60, and 100 V/V  
Gain Accuracy: ±0.1%  
Offset: ±80 µV  
Bandwidth (–3 dB): 270 kHz  
Quiescent Current: < 100 µA  
Buffered High-Current Output: > 5 mA  
Input Bias Current: 7 µA  
The LMP848x-Q1 family consists of fixed gains of 20,  
60, and 100 for applications that demand high  
accuracy over temperature. The low-input offset  
voltage allows the use of smaller sense resistors  
without sacrificing system error. The LMP8480-Q1  
and LMP8481-Q1 are pin-for-pin replacements for the  
MAX4080 and MAX4081 devices, offering improved  
offset voltage, wider reference adjust range, and  
higher output drive capabilities. The LMP8480-Q1  
and LMP8481-Q1 are available in an 8-pin VSSOP  
package.  
PSRR (DC): 122 dB  
CMRR (DC): 124 dB  
2 Applications  
Body Control Modules  
Powertrain  
Battery Management  
Inverters  
Device Information(1)  
PART NUMBER  
LMP8480-Q1  
PACKAGE  
VSSOP (8)  
VSSOP (8)  
BODY SIZE (NOM)  
3.00 mm x 3.00 mm  
3.00 mm x 3.00 mm  
LMP8481-Q1  
(1) For all available packages, see the orderable addendum at  
the end of the data sheet.  
Typical Application Schematic  
ISENSE  
V
CC  
= +4.5V to +76V  
To Load  
C1  
RSENSE  
0.1 µF  
RSP  
GND  
LMP8481-Q1  
REFA  
V
OUT  
VSENSE  
VIN+  
REFB  
RSN  
ADC  
VREF  
VIN-  
LM4140ACM-1.2  
C2  
0.1 µF  
Copyright © 2016, Texas Instruments Incorporated  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
LMP8480-Q1, LMP8481-Q1  
SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
www.ti.com  
Table of Contents  
1
2
3
4
5
6
7
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Device Comparison Table..................................... 3  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
7.1 Absolute Maximum Ratings ...................................... 4  
7.2 ESD Ratings.............................................................. 4  
7.3 Recommended Operating Conditions....................... 4  
7.4 Thermal Information.................................................. 4  
7.5 Electrical Characteristics........................................... 5  
7.6 Typical Characteristics.............................................. 7  
Detailed Description ............................................ 10  
8.1 Overview ................................................................. 10  
8.2 Functional Block Diagrams ..................................... 11  
8.3 Feature Description................................................. 12  
8.4 Device Functional Modes........................................ 18  
9
Application and Implementation ........................ 19  
9.1 Application Information............................................ 19  
9.2 Typical Applications ................................................ 19  
10 Power Supply Recommendations ..................... 22  
10.1 Power Supply Decoupling..................................... 22  
11 Layout................................................................... 22  
11.1 Layout Guidelines ................................................. 22  
11.2 Layout Example .................................................... 22  
12 Device and Documentation Support ................. 23  
12.1 Device Support .................................................... 23  
12.2 Related Links ........................................................ 23  
12.3 Receiving Notification of Documentation Updates 23  
12.4 Community Resources.......................................... 23  
12.5 Trademarks........................................................... 23  
12.6 Electrostatic Discharge Caution............................ 23  
12.7 Glossary................................................................ 23  
8
13 Mechanical, Packaging, and Orderable  
Information ........................................................... 24  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Original (July 2016) to Revision A  
Page  
Released to production........................................................................................................................................................... 1  
2
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Product Folder Links: LMP8480-Q1 LMP8481-Q1  
 
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SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
5 Device Comparison Table  
DEVICE NAME  
LMP8480T-Q1  
LMP8480S-Q1  
LMP8481T-Q1  
LMP8481S-Q1  
LMP8481H-Q1  
GAIN  
x20  
POLARITY  
Unidirectional  
x60  
Unidirectional  
x20  
Bidirectional or unidirectional  
Bidirectional or unidirectional  
Bidirectional or unidirectional  
x60  
x100  
6 Pin Configuration and Functions  
DGK Package, LMP8480-Q1  
8-Pin VSSOP  
DGK Package, LMP8481-Q1  
8-Pin VSSOP  
Top View  
Top View  
R
V
R
SN  
1
2
3
4
8
7
6
5
SP  
R
R
SN  
1
2
3
4
8
7
6
5
SP  
NC  
NC  
V
CC  
VCC  
NC  
REFA  
REFB  
NC  
GND  
OUT  
V
GND  
OUT  
Pin Functions  
PIN  
NO.  
LMP8480-Q1 LMP8481-Q1  
I/O  
DESCRIPTION  
NAME  
GND  
NC  
4
4
3
7
6
8
1
2
5
P
I
Ground  
3, 6, 7  
No connection, not internally connected  
Reference voltage A input  
Reference voltage B input  
Negative current-sense input  
Positive current-sense input  
Positive supply voltage  
REFA  
REFB  
RSN  
8
I
I
RSP  
1
I
VCC  
2
P
O
VOUT  
5
Output  
Copyright © 2016–2017, Texas Instruments Incorporated  
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LMP8480-Q1, LMP8481-Q1  
SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
www.ti.com  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)  
MIN  
–0.3  
–0.3  
MAX  
85  
UNIT  
Supply voltage (VCC to GND)  
RSP or RSN to GND  
VOUT to GND  
V
V
V
85  
–0.3 to the lesser of (VCC + 0.3) or +20  
Other VREF pin tied to ground  
–0.3  
–0.3  
–85  
–20(4)  
–5(4)  
–40  
12  
6
VREF pins  
(LMP8481-Q1 only)  
V
Applied to both VREF pins tied together  
Differential input voltage  
Current into output pin  
Current into any other pins  
Operating temperature  
Junction temperature  
Storage temperature  
85  
20  
5
V
mA  
mA  
°C  
125  
150  
150  
–40  
°C  
–65  
°C  
(1) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(MAX), θJA, and the ambient temperature,  
TA. The maximum allowable power dissipation PDMAX = (TJ(MAX) –TA) / θJA or the number given in Absolute Maximum Ratings,  
whichever is lower.  
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(4) When the input voltage (VIN) at any pin exceeds power supplies (VIN < GND or VIN > VS ), the current at that pin must not exceed 5  
mA, and the voltage (VIN) has to be within the Absolute Maximum Ratings for that pin. The 20-mA package input current rating limits  
the number of pins that can safely exceed the power supplies with current flow to four pins.  
7.2 ESD Ratings  
VALUE  
±2000  
±750  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)  
V(ESD)  
Electrostatic discharge  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
expected normal operating conditions over free-air temperature range (unless otherwise noted)(1)  
MIN  
MAX UNIT  
Supply voltage (VCC  
)
4.5  
4.0  
76  
76  
V
V
V
Common mode voltage  
VREFA and VREFB tied together  
–0.3 to the lesser of (VCC – 1.5) or +6  
Reference input  
(LMP8481-Q1 only)  
–0.3 or +12 where the average of the  
two VREF pins is less than the lesser of  
(VCC – 1.5) or +6  
Single VREF pin with other VREF pin grounded  
V
(1) Exceeding the Recommended Operating Conditions for extended periods of time may effect device reliability or cause parametric shifts.  
7.4 Thermal Information  
LMP8480-Q1, LMP8481-Q1  
THERMAL METRIC(1)  
DGK (VSSOP)  
8 PINS  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
185  
°C/W  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
4
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Product Folder Links: LMP8480-Q1 LMP8481-Q1  
 
 
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SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
7.5 Electrical Characteristics  
unless otherwise specified, all limits specified for at TA = 25°C, VCC = 4.5 V to 76 V, 4.5 V VCM 76 V, RL = 100 kΩ,  
VSENSE = (VRSP – VRSN) = 0 V(1)  
PARAMETER  
TEST CONDITIONS  
MIN(2)  
TYP(3)  
MAX(2)  
±265  
UNIT  
µV  
TA = 25°C  
±80  
VCC = VRSP = 48 V,  
VOS  
Input offset voltage (RTI)  
ΔV = 100 mV  
–40°C TA 125°C  
±900  
TCVOS  
Input offset voltage drift(4)  
Input bias current(5)  
±6  
µV°C  
VCC = VRSP = 76 V, per input  
6.3  
IB  
μA  
μA  
VCC = VRSP = 76 V, per input,  
–40°C TA 125°C  
12  
Input leakage current  
VCC = 0, VRSP = 86 V, both inputs together  
0.01  
ILEAK  
VCC = 0, VRSP = 86 V, both inputs together,  
–40°C TA 125°C  
2
667  
222  
133  
-T version,  
–40°C TA 125°C  
-S version,  
VCC = 16  
VSENSE  
(MAX)  
Differential input voltage across  
sense resistor(6)  
mV  
V/V  
–40°C TA 125°C  
-H version,  
–40°C TA 125°C  
-T version  
20  
60  
-T version, –40°C TA 125°C  
-S version  
19.8  
59.5  
99.2  
20.2  
60.5  
AV  
Gain  
-S version, –40°C TA 125°C  
-H version  
100  
-H version, –40°C TA 125°C  
100.8  
±0.6%  
±0.8%  
TA = 25°C  
VCC = VRSP = 48 V  
Gain error  
–40°C TA 125°C  
VRSP = 48 V, VCC = 4.5 to 76 V  
122  
124  
124  
DC PSRR DC power-supply rejection ratio  
DC CMRR DC common-mode rejection ratio  
dB  
dB  
VRSP = 48 V, VCC = 4.5 to 76 V,  
–40°C TA 125°C  
100  
100  
4
VCC = 48 V, VRSP = 4.5 to 76 V  
VCC = 48 V, VRSP = 4.5 to 76 V,  
–40°C TA 125°C  
VCC = 48 V, VRSP = 4 to 76 V  
Input common-mode voltage  
CMVR  
range  
CMRR > 100 dB, –40°C TA 125°C  
76  
V
ROUT  
Output resistance, load regulation VSENSE = 100 mV  
0.1  
Ω
Maximum output voltage  
(headroom)  
VCC = 4.5 V, VRSP = 48 V, VSENSE = +1 V,  
IOUT (sourcing) 500 μA  
VOMAX  
230  
500  
mV  
(VOMAX = VCC – VOUT  
)
(1) Electrical Characteristics table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions  
result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical  
tables under conditions of internal self-heating where TJ > TA.  
(2) All limits are specified by testing, design, or statistical analysis.  
(3) Typical values represent the most likely parametric norm at the time of characterization. Actual typical values can vary over time and  
also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.  
(4) Offset voltage temperature drift is determined by dividing the change in VOS at the temperature extremes by the total temperature  
change.  
(5) Positive bias current corresponds to current flowing into the device.  
(6) This parameter is specified by design and/or characterization and is not tested in production.  
Copyright © 2016–2017, Texas Instruments Incorporated  
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Electrical Characteristics (continued)  
unless otherwise specified, all limits specified for at TA = 25°C, VCC = 4.5 V to 76 V, 4.5 V VCM 76 V, RL = 100 kΩ,  
VSENSE = (VRSP – VRSN) = 0 V(1)  
PARAMETER  
TEST CONDITIONS  
MIN(2)  
TYP(3)  
MAX(2)  
UNIT  
VCC = VRSP = 48 V, VSENSE = –1 V,  
IOUT (sinking) = 10 µA  
3
VCC = VRSP = 48 V, VSENSE = –1 V,  
IOUT (sinking) = 10 µA, –40°C TA 125°C  
15  
VCC = VRSP = 4.5 V, VSENSE = –1 V,  
IOUT (sinking) = 10 µA  
3
VOMIN  
Minimum output voltage  
mV  
VCC = VRSP = 48 V, VSENSE = –1 V,  
IOUT (sinking) = 100 µA  
18  
VCC = VRSP = 48 V, VSENSE = –1 V,  
IOUT (sinking) = 100 µA, –40°C TA 125°C  
55  
VCC = VRSP = 4.5 V, VSENSE = –1 V,  
IOUT (sinking) = 100 µA  
18  
12  
VCC = 28 V, VRSP = 28 V, VSENSE = 600 mV,  
I OUT (sourcing) = 500 µA  
VOLOAD  
VOLREG  
Output voltage with load  
Output load regulation  
V
VCC = 20, VRSP = 16 V, VOUT = 12,  
ΔIL = 200 nA to 8 mA  
0.001%  
88  
VOUT = 2 V, RL = 10 MΩ, VCC = VRSP = 76 V  
100  
155  
ICC  
Supply current  
µA  
VOUT = 2 V, RL = 10 MΩ, VCC = VRSP = 76 V,  
–40°C TA 125°C  
BW  
–3-dB bandwidth  
RL = 10 MΩ, CL = 20 pF  
270  
1
kHz  
V/µs  
VSENSE from 10 mV to 80 mV, RL = 10 MΩ,  
CL = 20 pF  
SR  
Slew rate(7)  
eni  
Input-referred voltage noise  
f = 1 kHz  
95  
20  
nV/Hz  
µs  
Output settling time to 1% of final VSENSE = 10 mV to 100 mV and 100 mV  
value  
tSETTLE  
to 10 mV  
VCC = VRSP = 48 V, VSENSE = 100 mV, output  
to 1% of final value  
tPU  
Power-up time  
50  
µs  
Output settles to 1% of final value, the device  
does not experience phase reversal when  
overdriven  
tRECOVERY Saturation recovery time  
CLOAD Max output capacitance load  
50  
µs  
pF  
No sustained oscillations  
500  
(7) The number specified is the average of rising and falling slew rates and measured at 90% to 10%.  
6
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SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
7.6 Typical Characteristics  
unless otherwise specified, TA = 25°C, VCC = 4.5 V to 76 V, 4.5 V < VCM < 76 V, RL = 100 kΩ, VSENSE = (VRSP – VRSN) = 0 V,  
for all gain options  
Figure 1. Offset Voltage Histogram  
Figure 2. Typical Offset Voltage vs Temperature  
Figure 4. Typical Gain Accuracy vs Supply Voltage  
Figure 3. Typical Gain Accuracy vs Temperature  
Figure 6. AC Common-Mode Rejection Ratio vs Frequency  
Figure 5. Typical Offset Voltage vs Supply Voltage  
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Typical Characteristics (continued)  
unless otherwise specified, TA = 25°C, VCC = 4.5 V to 76 V, 4.5 V < VCM < 76 V, RL = 100 kΩ, VSENSE = (VRSP – VRSN) = 0 V,  
for all gain options  
LMP8480S-Q1  
Figure 7. AC Power Supply Rejection Ratio vs Frequency  
Figure 8. Small Signal Gain vs Frequency  
Figure 10. Small Signal Pulse Response  
Figure 9. Large Signal Pulse Response  
Figure 12. Supply Current vs Temperature  
Figure 11. Supply Current vs Supply Voltage  
8
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SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
Typical Characteristics (continued)  
unless otherwise specified, TA = 25°C, VCC = 4.5 V to 76 V, 4.5 V < VCM < 76 V, RL = 100 kΩ, VSENSE = (VRSP – VRSN) = 0 V,  
for all gain options  
Figure 14. Saturated Output Sinking Current at 4.5 V  
Figure 13. Saturated Output Sourcing Current at 4.5 V  
Figure 16. Saturated Output Current Sinking at 12 V  
Figure 15. Saturated Output Sourcing Current at 12 V  
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8 Detailed Description  
8.1 Overview  
The LMP8480-Q1 and LMP8481-Q1 are single-supply, high-side current sense amplifiers with available fixed  
gains of x20, x60 and x100. The power supply range is 4.5 V to 76 V, and the common-mode input voltage range  
is capable of 4.0-V to 76-V operation. The supply voltage and common-mode range are completely independent  
of each other, which causes the LMP848x-Q1 supply voltage to be extremely flexible because the LMP848x-Q1  
supply voltage can be greater than, equal to, or less than the load source voltage, and allows the device to be  
powered from the system supply or the load supply voltage.  
The LMP8480-Q1 and LMP8481-Q1 supply voltage does not have to be larger than the load source voltage. A  
76-V load source voltage with a 5-V supply voltage is perfectly acceptable.  
8.1.1 Theory of Operation  
The LMP8480-Q1 and LMP8481-Q1 are comprised of two main stages. The first stage is a differential input  
current to voltage converter, followed by a differential voltage amplifier and level-shifting output stage. Also  
present is an internal 14-V low-dropout regulator (LDO) to power the amplifiers and output stage, as well as a  
reference divider resistor string to allow the setting of the reference level.  
As Figure 18 illustrates, the current flowing through RSENSE develops a voltage drop called VSENSE. The voltage  
across the sense resistor, VSENSE, is then applied to the input RSP and RSN pins of the amplifier.  
Internally, the voltage on each input pin is converted to a current by the internal precision thin-film input resistors  
RGP and RGN. A second set of much higher value VCM sense resistors between the inputs provide a sample of  
the input common-mode voltage for internal use by the differential amplifier.  
VSENSE is applied to the differential amplifier through RGP and RGN. These resistors change the input voltage to a  
differential current. The differential amplifier then servos the resistor currents through the MOSFETs to maintain  
a zero balance across the differential amplifier inputs.  
With no input signal present, the currents in RGP and RGN are equal. When a signal is applied to VSENSE, the  
current through RGP and RGN are imbalanced and are no longer equal. The amplifier then servos the MOSFETS  
to correct this current imbalance, and the extra current required to balance the input currents is then reflected  
down into the two lower 400-kΩ tail resistors. The difference in the currents into the tail resistors is therefore  
proportional to the amplitude and polarity of VSENSE. The tail resistors, being larger than the input resistors for the  
same current, then provide voltage gain by changing the current into a proportionally larger voltage. The gain of  
the first stage is then set by the tail resistor value divided by RG value.  
The differential amplifier stage then samples the voltage difference across the two 400-kΩ tail resistors and also  
applies a further gain-of-five and output level-shifting according to the applied reference voltage (VREF).  
The resulting output of the amplifier will be equal to the differential input voltage times the gain of the device, plus  
any voltage value applied to the two VREF pins.  
The resistor values in the schematic are ideal values for clarity and understanding. Table 1 shows the actual  
values used that account for parallel combinations and loading. This table can be used for calculating the effects  
of any additional external resistance.  
The LMP8480-Q1 is identical to the LMP8481-Q1, except that both the VREF pins are grounded internally.  
Table 1. Actual Internal Resistor Values  
RGP AND RGN  
(Each)  
RVCMSENSE  
(Each)  
RTAIL  
(Each)  
DIFFERENTIAL AMP FB VREFx RESISTORS  
GAIN OPTION  
(Each)  
1967.6 k  
1967.6 k  
1967.6 k  
(Each)  
98.38 k  
98.38 k  
98.38 k  
20x  
60x  
98.38 k  
32.793 k  
19.676 k  
491.9 k  
172.165 k  
98.38 k  
393.52 k  
393.52 k  
393.52 k  
100x  
10  
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SNVSAL6A JULY 2016REVISED FEBRUARY 2017  
8.2 Functional Block Diagrams  
R
SN  
R
SP  
LMP8480-Q1  
V
SENSE  
Difference  
Amplifier  
(x5)  
V
CM  
SENSE  
R
GP  
R
GN  
2 MW  
Internal  
14V LDO  
Regulator  
V
CC  
-
+
-
+
V
OUT  
100 kW  
100 kW  
V to I  
Converter  
1.95 MW  
400 kW  
400 kW  
GND  
Copyright © 2017, Texas Instruments Incorporated  
Figure 17. LMP8480-Q1 Block Diagram  
R
SN  
R
SP  
LMP8481-Q1  
V
SENSE  
Difference  
Amplifier  
(x5)  
V
CM  
SENSE  
R
GP  
R
GN  
2 MW  
Internal  
14V LDO  
Regulator  
V
CC  
-
+
-
V
V
OUT  
+
100 kW  
100 kW  
V to I  
Converter  
REFA  
1.95 MW  
V
REFB  
400 kW  
400 kW  
GND  
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Figure 18. LMP8481-Q1 Block Diagram  
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8.3 Feature Description  
8.3.1 Basic Connections  
Figure 19 through Figure 22 show the basic connections for several different configurations.  
Figure 19 shows the basic connections for the LMP8480-Q1 for unidirectional applications. The output is at zero  
with zero sense voltage.  
I
SENSE  
+4.0 V  
to  
V
= +4.5 V to +76 V  
CC  
To Load  
+76 V  
R
SENSE  
C
BYPASS  
0.1 PF  
V
CC  
RSN  
OUTPUT  
VSENSE  
V
LMP8480-Q1  
OUT  
RSP  
GND  
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Figure 19. LMP8480-Q1 Basic Connections (Unidirectional)  
Figure 20 shows the basic connections for the LMP8481-Q1 for bidirectional applications using an external  
reference input. At zero input voltage, the output is at the applied reference voltage (VREF), moving positive or  
negative from the zero reference point.  
I
SENSE  
+4.0V  
to  
V
= +4.5V to +76V  
CC  
To Load  
+76V  
R
SENSE  
C
BYPASS  
0.1mF  
V
CC  
RSN  
OUTPUT  
VSENSE  
V
LMP8481-Q1  
OUT  
REFA  
RSP  
GND  
REFB  
V
REF  
INPUT  
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Figure 20. LMP8481-Q1 Basic Connections for External 1:1 VREF Input (Bidirectional)  
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Feature Description (continued)  
Figure 21 shows the basic connections for the LMP8481-Q1 for bidirectional applications centering the output at  
one-half the applied VREF or VCC voltage. If VREFA is connected to VCC, then the output zero point is VCC / 2. If  
VREFA is connected to the ADC VREF line, then the zero output is at mid-scale for the ADC.  
I
SENSE  
+4.0V  
to  
V
= +4.5V to +76V  
CC  
To Load  
+76V  
R
SENSE  
C
BYPASS  
0.1mF  
V
CC  
RSN  
OUTPUT  
VSENSE  
V
LMP8481-Q1  
OUT  
REFA  
RSP  
GND  
REFB  
V
REF  
or  
V
CC  
Copyright © 2017, Texas Instruments Incorporated  
Figure 21. LMP8481-Q1 Basic Connections for Mid-Bias  
(VREF / 2) Input (Bidirectional)  
Figure 22 shows how to connect the LMP8481-Q1 for unidirectional applications, thus making the LMP8481-Q1  
equivalent to the LMP8480-Q1 in Figure 19.  
I
SENSE  
+4.0 V  
to  
V
= +4.5 V to +76 V  
CC  
To Load  
+76 V  
R
SENSE  
C
BYPASS  
0.1 PF  
V
CC  
RSN  
OUTPUT  
VSENSE  
V
LMP8481-Q1  
OUT  
REFA  
REFB  
RSP  
GND  
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Figure 22. LMP8481-Q1 Connections for Unidirectional Configuration  
(Equivalent to LMP8480-Q1 Unidirectional)  
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Feature Description (continued)  
8.3.2 Selection of the Sense Resistor  
The accuracy of the current measurement depends heavily on the accuracy of the shunt resistor RSENSE. The  
value of RSHUNT depends on the application and is a compromise between small-signal accuracy, maximum  
permissible voltage drop, and allowable power dissipation in the current measurement circuit.  
The use of a 4-terminal or Kelvin sense resistor is highly recommended; see the Layout Guidelines.  
For best results, the value of the resistor is calculated from the maximum expected load current ILMAX and the  
expected maximum output swing VOUTMAX, plus a few percent of headroom. See the Maximum Output Voltage  
section for details about the maximum output voltage limits.  
High values of RSENSE provide better accuracy at lower currents by minimizing the effects of amplifier offset. Low  
values of RSENSE minimize load voltage loss, but at the expense of accuracy at low currents. A compromise  
between low current accuracy and load circuit losses must generally be made.  
The maximum VSENSE voltage that must be generated across the RSENSE resistor is shown in Equation 1:  
VSENSE = VOUTMAX / AV  
(1)  
NOTE  
The maximum VSENSE voltage must be no more than 667 mV.  
From this maximum VSENSE voltage, the RSENSE value can be calculated from Equation 2:  
RSENSE = VSENSE / ILMAX  
(2)  
Take care not exceed the maximum power dissipation of the resistor. The maximum sense resistor power  
dissipation is shown in Equation 3:  
PRSENSE = VSENSE × ILMAX  
(3)  
Using a 2-3x minimum safety margin is recommended in selecting the power rating of the resistor.  
8.3.3 Using PCB Traces as Sense Resistors  
While it may be tempting to use a known length of PCB trace resistance as a sense resistor, it is not  
recommended.  
The temperature coefficient of copper is typically 3300-4000 ppm/°K, and can vary over PCB process variations  
and require measurement correction (possibly requiring ambient temperature measurements).  
A typical surface mount sense resistor tempco is in the 50 ppm to 500 ppm/°C range offering more measurement  
consistency and accuracy over the copper trace. Special low-tempco resistors are available in the 0.1 to 50 ppm  
range, but at a higher cost.  
8.3.4 VREFA and VREFB Pins (LMP8481-Q1 Only)  
The voltage applied to the VREFA and VREFB pins controls the output zero reference level. Depending on how the  
pins are configured, the output reference level can be set to GND, or VCC / 2, or external VREF / 2, or the average  
of two different input references.  
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Feature Description (continued)  
The reference inputs consist of a pair of divider resistors with equal values to a common summing point, VREF',  
as shown in Figure 23. Assuming VSENSE is zero, the output is at the same value as VREF'.  
Figure 23. VREF Input Resistor Network  
VREF' is the voltage at the resistor tap-point that is directly applied to the output as an offset. With the two VREF  
inputs tied together, the output zero voltage has a 1:1 ratio relationship with VREF  
.
VOUT = ( (VRSP – VRSN) ×Av ) + VREF’  
(4)  
(5)  
(6)  
Where:  
VREF’ = VREFA = VREFB (Equal Inputs)  
or:  
VREF’ = ( VREFA + VREFB ) / 2 (Different Inputs)  
8.3.4.1 One-to-One (1:1) Reference Input  
To directly set the reference level, the two inputs are connected to the external reference voltage. The applied  
VREF is reflected 1:1 on the output, as shown in Figure 24.  
Figure 24. Applying 1:1 Direct Reference Voltage  
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Feature Description (continued)  
8.3.4.2 Setting Output to One-Half VCC or external VREF  
For mid-range operation, VREFB must be tied to ground and VREFA can be tied to VCC or an external A/D reference  
voltage. The output is set to one-half the reference voltage. For example, a 5-V reference results in a 2.5-V  
output zero reference.  
Figure 25. Applying a Divided Reference Voltage  
VREF’ = (VREFA – VREFB) / 2  
(7)  
When the reference pins are biased at different voltages, the output is referenced to the average of the two  
applied voltages.  
The reference pins must always be driven from clean, stable sources, such as A/D reference lines or clean  
supply lines. Any noise or drifts on the reference inputs are directly reflected in the output. Take care if the power  
supply is used as the reference source so as to not introduce supply noise, drift or sags into the measurement.  
Different resistor divider ratios can be set by adding external resistors in series with the internal 100-kΩ resistors,  
though the temperature coefficient (tempco) of the external resistors may not tightly track the internal resistors  
and there are slight errors over temperature.  
The LMP8480-Q1 is identical to the LMP8481-Q1, except that both the VREF pins are grounded internally. The  
LMP8481-Q1 can replace the LMP8480-Q1 if both VREF pins are grounded.  
8.3.5 Reference Input Voltage Limits (LMP8481-Q1 Only)  
The maximum voltage on either reference input pin is limited to VCC or 12 V, whichever is less.  
The average voltage on the two VREF pins, and thus the actual output reference voltage level, is limited to a  
maximum of 1.5 V below VCC, or 6 V, whichever is less. Beware that supply voltages of less than 7.5 V have a  
diminishing VREF maximum.  
Both VREFA and VREFB can both be grounded to provide a ground referenced output (thus functionally duplicating  
the LMP8480-Q1).  
Note that there can be a dynamic error in the VREF to output level matching of up to 100 µV/V. Normally this error  
is not an issue for fixed references, but if the reference voltage is dynamically adjusted during operation, this  
error must be taken into account during calibration routines. This error varies in both amplitude and polarity part-  
to-part, but the slope is generally linear.  
8.3.6 Low-Side Current Sensing  
The LMP8480-Q1 and LMP8481-Q1 are not recommended for low-side current sensing at ground level. The  
voltage on either input pin must be a minimum of 4.0 V above the ground pin for proper operation. The output  
level may not be valid for common-mode voltages below 4 V. This minimum voltage requirement must be taken  
into consideration for monitoring or feedback applications where the load-supply voltage can dip below 4 V or be  
switched completely off.  
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Feature Description (continued)  
8.3.7 Input Series Resistance  
Because the input stage uses precision resistors to convert the voltage on the input pin to a current, any  
resistance added in series with the input pins changes the gain. If a resistance is added in series with an input,  
the gain of that input does not track that of the other input, causing a constant gain error.  
TI does not recommend using external resistances to alter the gain because external resistors do not have the  
same thermal matching as the internal thin film resistors.  
If resistors are purposely added for filtering, resistance must be added equally to both inputs and the user must  
be aware that the gain changes slightly. See the end of the Theory of Operation section for the internal resistor  
values. External resistances must be kept below 10 Ω.  
8.3.8 Minimum Output Voltage  
The amplifier output cannot swing to exactly 0 V. There is always a minimum output voltage set by the output  
transistor saturation and input offset errors. This voltage creates a minimum output swing around the zero current  
reading resulting from the output saturation. The user must be aware of this output swing when designing any  
servo loops or data acquisition systems that may assume 0 V = 0 A. If a true zero is required, use the LMP8481-  
Q1 with a VREF set slightly above ground (> 50 mV); see the Swinging Output Below Ground section for a  
possible solution to this issue.  
8.3.9 Swinging Output Below Ground  
If a negative supply is available, a pulldown resistor can be added from the output to the negative voltage to  
allow the output to swing a few millivolts below ground. Adding a pulldown resistor allows the ADC to resolve true  
zero and recover codes that normally are lost to the negative output saturation limit.  
LMP848x-Q1  
Figure 26. Output Pulldown Resistor Example  
A minimum of 50 µA must be sourced (pulled) from the output to a negative voltage. The pulldown resistor can  
be calculated from:  
RPD = –VS / 50 µA  
(8)  
For example, if a –5-V supply is available, use a pulldown resistor of 5 V / 50 µA = 100 kΩ. Adding this resistor  
allows the output to swing to approximately 10 mV below ground.  
This technique can also reduce the maximum positive swing voltage. Do not forget to include the parallel loading  
effects of the pulldown any output load. Exceeding –100 mV on the output is not recommended. Source currents  
greater than 100 µA must be avoided to prevent self-heating at high-supply voltages. Pulldown resistor values  
must not be so low as to heavily load the output during positive output excursions. This mode of operation is not  
directly specified and is not ensured.  
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Feature Description (continued)  
8.3.10 Maximum Output Voltage  
The LMP8481-Q1 has an internal precision 14-V low-dropout regulator that limits the maximum amplifier output  
swing to approximately 250 mV below VCC or 13.7 V (whichever is less). This regulator effectively clamps the  
maximum output to slightly less than 13.7 V even with a VCC greater than 14 V; see Typical Application With a  
Resistive Divider for more information.  
8.4 Device Functional Modes  
8.4.1 Unidirectional vs Bidirectional Operation  
Unidirectional operation is where the load current only flows in one direction (VSENSE is always positive).  
Application examples are PA monitoring, non-inductive load monitoring, and laser or LED drivers. Unidirectional  
operation allows the output zero reference to be true zero volts on the output. The LMP8480-Q1 is designed for  
unidirectional applications where the setting of VREF is not required; see the Unidirectional Application With the  
LMP8480-Q1 for more details.  
Bidirectional operation is where the load current can flow in both directions (VSENSE can be positive or negative).  
Application examples are battery-charging or regenerative motor monitoring. The LMP8481-Q1 is designed for  
bidirectional applications and has a pair of VREF pins to allow the setting of the output zero reference level  
(VREF); see the Unidirectional Application With the LMP8480-Q1 section for more details.  
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9 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
The LMP848x-Q1 amplifies the voltage developed across a current-sensing resistor when current passes  
through it. Flexible offset inputs allow adjusting the functionality of the output for multiple configurations, as  
discussed throughout this section.  
9.1.1 Input Common-Mode and Differential Voltage Range  
The input common-mode range, where common-mode range is defined as the voltage from ground to the voltage  
on RSP input, must be in the range of 4.0 V to 76 V. Operation below 4.0 V on either input pin introduces severe  
gain error and nonlinearities.  
The maximum differential voltage (defined as the voltage difference between RSP and RSN) must be 667 mV or  
less. The theoretical maximum input is 700 mV (14 V / 20).  
Taking the inputs below 4 V does not damage the device, but the output conditions during this time are not  
predictable and are not ensured.  
If the load voltage (Vcm) is expected to fall below 4 V as part of normal operation, preparations must be made for  
invalid output levels during this time.  
9.2 Typical Applications  
9.2.1 Unidirectional Application With the LMP8480-Q1  
LMP8480-Q1  
Copyright © 2017, Texas Instruments Incorporated  
Figure 27. Unidirectional Application with the LMP8480-Q1  
9.2.1.1 Design Requirements  
The LMP8480-Q1 is designed for unidirectional current sense applications. The output of the amplifier is equal to  
the differential input voltage times the fixed device gain.  
9.2.1.2 Detailed Design Procedure  
The output voltage can be calculated from Equation 9:  
VOUT = ( (VRSP – VRSN) × Av )  
(9)  
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Typical Applications (continued)  
Note that the minimum zero reading is limited by the lower output swing and input offset. The LMP8480-Q1 is  
functionally identical to the LMP8481-Q1, but with the VREFA and VREFB nodes grounded internally. The  
LMP8481-Q1 can replace the LMP8480-Q1 if both the VREF inputs (pins 6 and 7) are grounded.  
9.2.1.3 Application Curve  
Figure 28. Unidirectional Transfer Function for Gain-of-20 Option  
9.2.2 Bidirectional Current Sensing Using the LMP8481-Q1  
LMP8481-Q1  
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Figure 29. Bidirectional Current Sensing Using the LMP8481-Q1  
9.2.2.1 Design Requirements  
Bidirectional operation is required where the measured load current can be positive or negative. Because VSENSE  
can be positive or negative, and the output cannot swing negative, the zero output level must be level-shifted  
above ground to a known zero reference point. The LMP8481-Q1 allows for the setting this reference point.  
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Typical Applications (continued)  
9.2.2.2 Detailed Design Procedure  
The VREFA and VREFB pins set the zero reference point. The output zero reference point is set by applying a  
voltage to the REFA and REFB pins; see the Unidirectional Application With the LMP8480-Q1 section. VREFA and  
VREFB Pins (LMP8481-Q1 Only) shows the output transfer function with a 1.2-V reference applied to the gain-of-  
20 option.  
9.2.2.3 Application Curve  
Figure 30. Bidirectional Transfer Function Using a 1.2-V Reference Voltage  
9.2.3 Typical Application With a Resistive Divider  
Take care if the output is driving an A/D input with a maximum A/D maximum input voltage lower than the  
amplifier supply voltage because the output can swing higher than the planned load maximum resulting from  
input transients or shorts on the load and overload or possibly damage the A/D input.  
A resistive attenuator, as shown in Figure 31, can be used to match the maximum swing to the input range of the  
A/D converter.  
LMP8480-Q1  
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Figure 31. Typical Application With Resistive Divider Example  
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10 Power Supply Recommendations  
10.1 Power Supply Decoupling  
In order to decouple the LMP848x-Q1 from ac noise on the power supply, TI recommends using a 0.1-μF bypass  
capacitor between the VCC and GND pins. This capacitor must be placed as close as possible to the supply pins.  
In some cases, an additional 10-μF bypass capacitor can further reduce the supply noise.  
Do not forget that these bypass capacitors must be rated for the full supply and load source voltage. TI  
recommends that the working voltage of the capacitor (WVDC) be at least two times the maximum expected  
circuit voltage.  
11 Layout  
11.1 Layout Guidelines  
The traces leading to and from the sense resistor can be significant error sources. With small value sense  
resistors (< 100 mΩ), any trace resistance shared with the load current can cause significant errors.  
The amplifier inputs must be directly connected to the sense resistor pads using Kelvin or 4-wire connection  
techniques. The traces must be one continuous piece of copper from the sense resistor pad to the amplifier input  
pin pad, and ideally on the same copper layer with minimal vias or connectors. These recommendations can be  
important around the sense resistor if any significant heat gradients are being generated.  
To minimize noise pickup and thermal errors, the input traces must be treated as a differential signal pair and  
routed tightly together with a direct path to the input pins. The input traces must be run away from noise sources,  
such as digital lines, switching supplies or motor drive lines. Remember that these traces can contain high  
voltage, and must have the appropriate trace routing clearances.  
Because the sense traces only carry the amplifier bias current (approximately 7 µA at room temperature), the  
connecting input traces can be thinner, signal level traces. Excessive resistance in the trace must also be  
avoided.  
The paths of the traces must be identical, including connectors and vias, so that these errors are equal and  
cancel.  
The sense resistor heats up when the load increases. When the resistor heats up, the resistance generally goes  
up, which causes a change in the readings. The sense resistor must have as much heatsinking as possible to  
remove this heat through the use of heatsinks or large copper areas coupled to the resistor pads. A reading  
drifting over time after turn-on can usually be traced back to sense resistor heating.  
11.2 Layout Example  
Figure 32. Kelvin or 4–Wire Connection to the Sense Resistor  
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12 Device and Documentation Support  
12.1 Device Support  
12.1.1 Development Support  
LMP8480/1 PSPICE Model  
LMP8480/1 TINA Reference Design  
TINA-TI SPICE-Based Analog Simulation Program  
LMP8480/1 Evaluation Boards  
LMP8480/1 Evaluation Board Manual  
12.2 Related Links  
The table below lists quick access links. Categories include technical documents, support and community  
resources, tools and software, and quick access to order now.  
Table 2. Related Links  
TECHNICAL  
DOCUMENTS  
TOOLS &  
SOFTWARE  
SUPPORT &  
COMMUNITY  
PARTS  
PRODUCT FOLDER  
ORDER NOW  
LMP8480-Q1  
LMP8481-Q1  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
12.3 Receiving Notification of Documentation Updates  
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper  
right corner, click on Alert me to register and receive a weekly digest of any product information that has  
changed. For change details, review the revision history included in any revised document.  
12.4 Community Resources  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
12.5 Trademarks  
E2E is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
12.6 Electrostatic Discharge Caution  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
12.7 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
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13 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
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PACKAGE OPTION ADDENDUM  
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10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LMP8480ASQDGKRQ1  
LMP8480ATQDGKRQ1  
LMP8481AHQDGKRQ1  
LMP8481ASQDGKRQ1  
LMP8481ATQDGKRQ1  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
8
3500 RoHS & Green  
3500 RoHS & Green  
3500 RoHS & Green  
3500 RoHS & Green  
3500 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
16GX  
16HX  
16IX  
SN  
SN  
SN  
SN  
16JX  
16KX  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF LMP8480-Q1, LMP8481-Q1 :  
Catalog: LMP8480, LMP8481  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL INFORMATION  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LMP8480ASQDGKRQ1 VSSOP  
LMP8480ATQDGKRQ1 VSSOP  
LMP8481AHQDGKRQ1 VSSOP  
LMP8481ASQDGKRQ1 VSSOP  
LMP8481ATQDGKRQ1 VSSOP  
DGK  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
8
3500  
3500  
3500  
3500  
3500  
330.0  
330.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
12.4  
5.3  
5.3  
5.3  
5.3  
5.3  
3.4  
3.4  
3.4  
3.4  
3.4  
1.4  
1.4  
1.4  
1.4  
1.4  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Aug-2022  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LMP8480ASQDGKRQ1  
LMP8480ATQDGKRQ1  
LMP8481AHQDGKRQ1  
LMP8481ASQDGKRQ1  
LMP8481ATQDGKRQ1  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
8
3500  
3500  
3500  
3500  
3500  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
35.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, regulatory or other requirements.  
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an  
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license  
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you  
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these  
resources.  
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with  
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for  
TI products.  
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2022, Texas Instruments Incorporated  

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