LMP8674MA/NOPB [TI]
Quad 40V Low Noise Precision Amplifiers 14-SOIC -40 to 125;
| 型号： | LMP8674MA/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Quad 40V Low Noise Precision Amplifiers 14-SOIC -40 to 125 放大器 光电二极管 |
| 文件： | 总16页 (文件大小：808K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMP8671, LMP8672, LMP8674
www.ti.com
SNOSB39B –JULY 2011–REVISED MARCH 2013
Single, Dual, and Quad 40V Low Noise Precision Amplifiers
Check for Samples: LMP8671, LMP8672, LMP8674
1
FEATURES
DESCRIPTION
The LMP8671/2/4 combines great precision, low
2
•
•
•
Output Short Circuit Protection
PSRR and CMRR Exceed 110dB
Best in Class Linearity (135dB)
noise and a large operating voltage range to provide
a high SNR and a wide dynamic range. Its AC
performance allows it to be used over a wide
frequency without degradation. It is the ideal choice
for applications requiring DC precision and low noise
such as precision PLL filters, multi feedback and multi
pole active filters, GPS receivers and precision
control loop systems. The LMP8671/2/4 offers an
extremely high open loop gain of 135dB, low voltage
noise density (2.5nV/√Hz), and a superb linearity of
0.000009%. These characteristics drastically reduce
gain error which is a challenge in accurate systems
requiring higher gains such as data acquisition
systems.
APPLICATIONS
•
Low Noise Industrial Applications Including
Test, Measurement, and Ultrasound
•
•
•
•
Precision Active Filters
PLL Filters
4-20mA Current Loops
Motor Control
KEY SPECIFICATIONS
To ensure that the most challenging loads are driven
without compromise, the LMP8671/2/4 has a high
slew rate of ±20V/μs and an output current capability
of ±26mA.
•
•
•
•
•
•
•
•
Input Offset Voltage 0.4mV
TC VOS 2μV/°C (max)
Power Supply Voltage Range ±2.5V to ±20V
Voltage Noise Density 2.5nV/√Hz
Slew Rate ±20V/μs
The LMP8671/2 family of high-voltage amplifiers are
available in SOIC-8, the LMP8674 in SOIC-14.
Gain Bandwidth Product 55MHz
Open Loop Gain 135dB
Input Bias Current 10nA
Connection Diagrams
NC
NC
V+
-IN
-
+
+IN
V-
V
OUT
NC
Figure 1. See Package Number — D0008A
Figure 2. See Package Number — D0008A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated
LMP8671, LMP8672, LMP8674
SNOSB39B –JULY 2011–REVISED MARCH 2013
www.ti.com
Figure 3. See Package Number — D0014A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)(3)
Power Supply Voltage (VS = V+ - V-)
Storage Temperature
Input Voltage
46V
−65°C to 150°C
(V-) - 0.7V to (V+) + 0.7V
Continuous
Output Short Circuit(4)
Power Dissipation
ESD Rating(5)
Internally Limited
2000V
ESD Rating(6)
Pins 1, 4, 7 and 8
Pins 2, 3, 5 and 6
200V
100V
Junction Temperature
150°C
Thermal Resistance
θJA (SO)
145°C/W
For soldering specifications, http://www.ti.com/lit/SNOA549
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All
voltages are measured with respect to the ground pin, unless otherwise specified.
(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(4) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature,
TA. The maximum allowable power dissipation is PDMAX = (TJMAX - TA) / θJA or the number given in Absolute Maximum Ratings,
whichever is lower.
(5) Human body model, applicable std. JESD22-A114C.
(6) Machine model, applicable std. JESD22-A115-A.
Operating Ratings
Temperature Range TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ 125°C
±2.5V ≤ VS ≤ ±22V
Supply Voltage Range LMP8671/2/4
2
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LMP8671 LMP8672 LMP8674
LMP8671, LMP8672, LMP8674
www.ti.com
SNOSB39B –JULY 2011–REVISED MARCH 2013
Electrical Characteristics for the LMP8671/2/4(1)
The following specifications apply for VS = ±20V, RL = 2kΩ, RSOURCE = 10Ω, fIN = 1kHz, TA = 25°C, unless otherwise specified.
Boldface limits apply at the temperature extremes.
LMP8671/2/4
Units
(Limits)
Symbol
VOS
Parameter
Offset Voltage
Conditions
Typical(2)
Limit(3)
±400
±750
±100
μV (max)
Average Input Offset Voltage Drift
vs Temperature
μV/°C
(max)
ΔVOS/ΔTemp
–40°C ≤ TA ≤ 125°C
0.1
10
50
11
2
VCM = 0V
LMP8671/4
VCM = 0V
LMP8672
VCM = 0V
LMP8671/4
VCM = 0V
LMP8672
±75
±95
nA (max)
nA (max)
nA (max)
IB
Input Bias Current
±200
±250
±50
±95
IOS
Input Offset Current
±100
±125
25
nA (max)
nA/°C
Input Bias Current Drift
vs Temperature
ΔIOS/ΔTemp
–40°C ≤ TA ≤ 125°C
0.2
+17.1
–16.9
V (min)
V (min)
VIN-CM
Common-Mode Input Voltage Range
Differential Input Impedance
30
kΩ
ZIN
Common Mode Input Impedance
–10V<Vcm<10V
20Hz to 20kHz
1000
MΩ
μVRMS
(max)
Equivalent Input Noise Voltage
Equivalent Input Noise Density
0.34
2.5
0.65
4.7
en
nV/√Hz
(max)
f = 1kHz
f = 1kHz
f = 10Hz
1.6
3.1
in
Current Noise Density
Total Harmonic Distortion + Noise
Settling time
pA/√Hz
% (max)
μs
THD+N
tS
AV = 1, VOUT = 3Vrms, RL = 600Ω
0.00003
0.00009
AV = –1, 10V step, CL = 100pF
0.1% error range
1.2
GBWP
SR
Gain Bandwidth Product
Slew Rate
55
45
MHz (min)
±20
±15
V/μs (min)
Average Input Offset Voltage Shift
vs Power Supply Voltage
110
100
PSRR
CMRR
AVOL
See(4)
125
115
dB (min)
dB (min)
dB (min)
V (min)
mA
105
100
Common-Mode Rejection
–15V≤Vcm≤15V
–15V ≤ Vout ≤ 15V
RL = 2kΩ
Open Loop Voltage Gain
135
125
±18.8
±18.6
VOUTMAX
IOUT-CC
Maximum Output Voltage Swing
Instantaneous Short Circuit Current
RL = 2kΩ
±19.0
+53
–42
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All
voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of
product characterization and are not ensured.
(3) Datasheet min/max specification limits are ensured by test or statistical analysis.
(4) PSRR is measured as follows: For VS, VOS is measured at two supply voltages, ±5V and ±20V, PSRR = |20log(ΔVOS/ΔVS)|.
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LMP8671 LMP8672 LMP8674
LMP8671, LMP8672, LMP8674
SNOSB39B –JULY 2011–REVISED MARCH 2013
www.ti.com
Electrical Characteristics for the LMP8671/2/4(1) (continued)
The following specifications apply for VS = ±20V, RL = 2kΩ, RSOURCE = 10Ω, fIN = 1kHz, TA = 25°C, unless otherwise specified.
Boldface limits apply at the temperature extremes.
LMP8671/2/4
Units
(Limits)
Symbol
Parameter
Conditions
Typical(2)
Limit(3)
fIN = 10kHz
ROUT
IOUT
Output Impedance
Closed-Loop
Open-Loop
0.01
13
Ω
Output Current
RL = 2kΩ
9.5
9.3
mA (min)
IOUT = 0mA
6
8
LMP8671
5
mA (max)
IS
Total Quiescent Current
LMP8672
LMP8674
12.5
20
16
22
mA (max)
mA (max)
4
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LMP8671 LMP8672 LMP8674
LMP8671, LMP8672, LMP8674
www.ti.com
SNOSB39B –JULY 2011–REVISED MARCH 2013
Typical Performance Characteristics
THD+N vs Frequency
+VCC = –VEE = 15V, VO = 3VRMS
,
THD+N vs Output Voltage
VCC = 2.5V, VEE = –2.5V, RL = 600 Ω
RL = 600Ω
0.001
0.01
0.005
0.0005
0.002
0.001
0.0002
0.0001
0.0005
0.0002
0.0001
0.00005
0.00005
0.00002
0.00001
0.00002
0.00001
20
50
200 500 1k 2k
20k
100
5k 10k
10m
100m
1
10 20
FREQUENCY (Hz)
V
RMS
Figure 4.
Figure 5.
PSRR+ vs Frequency
VCC = 2.5V, VEE = –2.5V,
RL = 2kΩ, VRIPPLE = 200mVPP
PSRR– vs Frequency
VCC = 2.5V, VEE = –2.5V,
RL = 2kΩ, VRIPPLE = 200mVPP
40
50
-40
-50
60
-60
70
-70
80
-80
90
-90
100
110
120
130
140
-100
-110
-120
-130
-140
20
100
1k
10k 20k
100
20
1k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 6.
Figure 7.
PSRR+ vs Frequency
VCC = 15V, VEE = –15V,
RL = 2kΩ, VRIPPLE = 200mVPP
PSRR– vs Frequency
VCC = 15V, VEE = –15V,
RL = 2kΩ, VRIPPLE = 200mVPP
-60
-70
-60
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-150
-160
-100
-110
-120
-130
-140
-150
-160
100
100
20
1k
10k 20k
20
1k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 8.
Figure 9.
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LMP8671 LMP8672 LMP8674
LMP8671, LMP8672, LMP8674
SNOSB39B –JULY 2011–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
PSRR+ vs Frequency
VCC = 15V, VEE = –15V,
RL = 600Ω, VRIPPLE = 200mVPP
PSRR– vs Frequency
VCC = 15V, VEE = –15V,
RL = 600Ω, VRIPPLE = 200mVPP
40
50
-40
-50
60
-60
70
-70
80
-80
90
-90
100
110
120
130
140
-100
-110
-120
-130
-140
20
100
1k
10k 20k
100
20
1k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 10.
Figure 11.
CMRR vs Frequency
VCC = 15V, VEE = –15V, RL = 600Ω
CMRR vs Frequency
VCC = 15V, VEE = –15V, RL = 2kΩ
0
-10
0
-50
-20
-30
-40
-50
-60
-70
-80
-100
-90
-100
-110
-120
-130
-150
10
100
1k
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 12.
Figure 13.
CMRR vs Frequency
VCC = 2.5V, VEE = –2.5V, RL = 600Ω
CMRR vs Frequency
VCC = 2.5V, VEE = –2.5V, RL = 2kΩ
0
-50
0
-50
-100
-100
-150
-150
10
10
100
1k
10k
100k
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 14.
Figure 15.
6
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LMP8671 LMP8672 LMP8674
LMP8671, LMP8672, LMP8674
www.ti.com
SNOSB39B –JULY 2011–REVISED MARCH 2013
Typical Performance Characteristics (continued)
Output Voltage vs Supply Voltage
Output Voltage vs Supply Voltage
THD+N = 1%, RL = 2kΩ
THD+N = 1%, RL = 600Ω
12
10
12
10
8
6
4
8
6
4
2
0
2
0
2.5 4.5 6.5 8.5 10.5 12.5 14.5 16.5 18.5
2.5 4.5 6.5 8.5 10.5 12.5 14.5 16.5 18.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 16.
Figure 17.
Crosstalk vs Frequency
VCC = 15V, VEE = –15V, RL = 2kΩ
Full Power Bandwidth vs Frequency
2
0
0 dB = 1 V
PP
-2
-4
-6
-8
-10
-12
-14
1
10 100 1k 10k 100k 1M
FREQUENCY (Hz)
100M
10M
Figure 18.
Figure 19.
Gain Phase vs Frequency
Voltage Noise Density vs Frequency
180
100
10
1
V
= 30V
160
140
120
100
80
S
V
CM
= 15V
60
40
20
0
1k
10k
10
100
100k 1M 10M
1
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 20.
Figure 21.
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LMP8671 LMP8672 LMP8674
LMP8671, LMP8672, LMP8674
SNOSB39B –JULY 2011–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
Current Noise Density vs Frequency
100
10
1
V
S
= 30V
V
CM
= 15V
1.5 pA/ Hz
10k 100k
1
10
100
1k
FREQUENCY (Hz)
Figure 22.
Offset Voltage Distribution
VCC = ±20V
45
40
35
30
25
20
15
10
5
0
Vos (uV)
Figure 23.
TcVos Distribution
VCC = ±20V
80
70
60
50
40
30
20
10
0
-2 -1.2 -1.1 -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1
0
0.1
2
TcVos (uV/C)
Figure 24.
8
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LMP8671 LMP8672 LMP8674
LMP8671, LMP8672, LMP8674
www.ti.com
SNOSB39B –JULY 2011–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision A (March 2013) to Revision B
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 8
Copyright © 2011–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LMP8671 LMP8672 LMP8674
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2013
PACKAGING INFORMATION
Orderable Device
LMP8671MA/NOPB
LMP8671MAX/NOPB
LMP8672MA/NOPB
LMP8672MAX/NOPB
LMP8674MA/NOPB
LMP8674MAX/NOPB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
8
8
95
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LMP86
71MA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
D
D
2500
95
Green (RoHS
& no Sb/Br)
LMP86
71MA
8
Green (RoHS
& no Sb/Br)
LMP86
72MA
8
2500
55
Green (RoHS
& no Sb/Br)
LMP86
72MA
14
14
Green (RoHS
& no Sb/Br)
LMP8674
MA
2500
Green (RoHS
& no Sb/Br)
LMP8674
MA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMP8671MAX/NOPB
LMP8672MAX/NOPB
LMP8674MAX/NOPB
SOIC
SOIC
SOIC
D
D
D
8
8
2500
2500
2500
330.0
330.0
330.0
12.4
12.4
16.4
6.5
6.5
6.5
5.4
5.4
2.0
2.0
2.3
8.0
8.0
8.0
12.0
12.0
16.0
Q1
Q1
Q1
14
9.35
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMP8671MAX/NOPB
LMP8672MAX/NOPB
LMP8674MAX/NOPB
SOIC
SOIC
SOIC
D
D
D
8
8
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
14
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明