LMR43610RS5QRPERQ1 [TI]
具有低 IQ 的汽车类 3V 至 36V、1A、低 EMI 同步降压稳压器 | RPE | 9 | -40 to 150;
| 型号： | LMR43610RS5QRPERQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有低 IQ 的汽车类 3V 至 36V、1A、低 EMI 同步降压稳压器 | RPE | 9 | -40 to 150 稳压器 |
| 文件： | 总10页 (文件大小：714K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMR43620-Q1, LMR43610-Q1
SNVSBX5A – OCTOBER 2020 – REVISED DECEMBER 2020
LMR436x0-Q1, 36-V, 1-A/2-A Buck Converter with 1.5-µA IQ in 4-mm2 HotRod™ QFN
1 Features
3 Description
•
•
•
AEC-Q100-qualified for automotive applications:
– Temperature grade 1: –40°C to +125°C, TA
> 85% efficiency at 1 mA
– 1.5-µA IQ (switching) at 13.5 VIN, 3.3 fixed VOUT
Miniature solution size and low component cost
– 2-mm × 2-mm HotRod™ package with wettable
flanks
The LMR436x0-Q1 is the industry's smallest 36 V, 2 A
and 1 A synchronous step-down DC/DC converters in
2-mm x 2-mm HotRod™ package. This easy-to-use
converter supports a wide input voltage range of 3.0V
to 36 V with transients up to 42 V.
The LMR43620-Q1 is specifically designed to meet
low standby power requirements for always on,
automotive
applications.
Auto-mode
enables
– Internal compensation
frequency foldback when operating at light loads,
allowing an unloaded current consumption of 1.5 µA
at 13.5 VIN and high light load efficiency. Seamless
transition between PWM and PFM modes along with
very low MOSFET ON resistances ensures
exceptional efficiency across the entire load range.
•
•
Optimized for ultra-low EMI requirements
– Spread spectrum reduces peak emissions
– Pin selectable FPWM mode for constant
frequency at light loads with MODE/SYNC pin
– FSW synchronization with MODE/SYNC pin
Designed for automotive automotive applications
– Junction temperature range: –40°C to +150°C
– Supports 42-V automotive load dump
– Supports 3-VIN for automotive cold crank
– Adjustable up to 95% of VIN, 3.3-V and 5-V
fixed VOUT options available
The control architecture and feature-set are optimized
for an ultra-small solution size. The device uses peak
current mode control to minimize output capacitance.
The LMR436x0-Q1 minimizes input filter size by
utilizing pseudo-random spread spectrum, a low-EMI
HotRod™ package, and an optimized pin-out. The
MODE/SYNC and RT pin variants can be used to set
or synchronize the frequency between 200 kHz and
2.2 MHz to avoid noise sensistive frequency bands.
•
Suitable for scalable power supplies
– Adjustable FSW: 200 kHz - 2.2 MHz with RT pin
– Pin compatible with:
•
•
LMR36506-Q1 (65 V, 600 mA)
LMR36503-Q1 (65 V, 300 mA)
The rich feature set of the LMR436x0-Q1 is designed
to simplify implementation for a wide range of
automotive end equipments.
2 Applications
Device Information
•
•
•
Advanced driver assistance systems: radar ECU
Infotainment and cluster: head unit, eCall
Body electronics and lighting
PART NUMBER
LMR43620-Q1
LMR43610-Q1
PACKAGE(1)
VQFN-HR (9)
VQFN-HR (9)
BODY SIZE (NOM)
2.00 mm × 2.00 mm
2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
100
90
80
70
60
50
40
30
20
VIN = 12 V
VIN = 24 V
10
0
1E-5
0.0001
0.001 0.01
Load Current (A)
0.10.2 0.5 1
2
SNVS
Typical Solution Size
Efficiency: VOUT = 3.3 V (Fixed), 2.2 MHz
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
without notice.
LMR43620-Q1, LMR43610-Q1
SNVSBX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Documentation Support.............................................. 3
5.2 Receiving Notification of Documentation Updates......3
5.3 Support Resources..................................................... 3
5.4 Trademarks.................................................................3
5.5 Electrostatic Discharge Caution..................................3
5.6 Glossary......................................................................3
6 Mechanical, Packaging, and Orderable Information....4
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (October 2020) to Revision A (December 2020)
Page
•
Added LMR43610-Q1 to data sheet...................................................................................................................1
Copyright © 2020 Texas Instruments Incorporated
2
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Product Folder Links: LMR43620-Q1 LMR43610-Q1
LMR43620-Q1, LMR43610-Q1
SNVSBX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
For related documentation see the following:
•
•
Texas Instruments, Thermal Design by Insight not Hindsight Application Report
Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Application Report
•
•
•
•
•
•
•
•
•
Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report
Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report
Texas Instruments, PowerPAD™ Thermally Enhanced Package Application Report
Texas Instruments, PowerPAD™ Made Easy Application Report
Texas Instruments, Using New Thermal Metrics Application Report
Texas Instruments, Layout Guidelines for Switching Power Supplies Application Report
Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report
Texas Instruments, Construction Your Power Supply- Layout Considerations Seminar
Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report
5.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.4 Trademarks
HotRod™, PowerPAD™, and are trademarks of TI.
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2020 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: LMR43620-Q1 LMR43610-Q1
LMR43620-Q1, LMR43610-Q1
SNVSBX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2020 Texas Instruments Incorporated
4
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Product Folder Links: LMR43620-Q1 LMR43610-Q1
LMR43620-Q1, LMR43610-Q1
SNVSBX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
PACKAGE OUTLINE
RPE0009A
VQFN-HR - 1.0 mm max height
S
C
A
L
E
6
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
2.1
1.9
B
A
PIN 1 INDEX AREA
2.1
1.9
0.1 MIN
(0.05)
A
-
A
4
0
.
0
0
0
SECTION A-A
TYPICAL
1.0
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
4X (0.15)
0.55
0.45
(0.2) TYP
0.275
0.175
4X (0.15)
2X
4X
0.1
C A B
C
4
0.05
5
2X 0.738
2X 0.25
0.000 PKG
2X 0.25
A
A
1.1 0.05
2X 0.738
8
1
9
0.275
0.175
PIN 1 ID
0.6
0.5
4X
2X
0.1
C A B
0.4
0.3
0.05
C
0.45
0.35
4X
4224447/A 09/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
Copyright © 2020 Texas Instruments Incorporated
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Product Folder Links: LMR43620-Q1 LMR43610-Q1
LMR43620-Q1, LMR43610-Q1
SNVSBX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
EXAMPLE BOARD LAYOUT
RPE0009A
VQFN-HR - 1.0 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
2X (0.75)
2X (0.4)
(0.35)
9
4X (0.225)
1
2X (0.575)
(1.3)
8
2X (0.738)
4X (0.6)
2X (0.25)
0.000 PKG
(0.55)
4X (0.25)
2X (0.25)
SEE SOLDER MASK
DETAILS
(R0.05) TYP
2X (0.738)
5
4
2X (0.575)
SYMM
(1.8)
2X (0.7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4224447/A 09/2018
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
Copyright © 2020 Texas Instruments Incorporated
6
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Product Folder Links: LMR43620-Q1 LMR43610-Q1
LMR43620-Q1, LMR43610-Q1
SNVSBX5A – OCTOBER 2020 – REVISED DECEMBER 2020
www.ti.com
EXAMPLE STENCIL DESIGN
RPE0009A
VQFN-HR - 1.0 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
2X (0.75)
2X
2X (0.55)
9
2X (0.35)
(0.4)
2X (0.5)
4X (0.225)
(0.925)
(0.175)
1
8
2X (0.738)
4X (0.6)
2X (0.25)
0.000 PKG
4X (0.25)
2X (0.25)
(R0.05) TYP
2X (0.738)
5
4
2X (0.575)
SYMM
(1.8)
2X (0.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 30X
PADS 1 & 8:
90% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
PAD 9:
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
DWG_NO:5/REV:5 MM_YYYY:5
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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Copyright © 2020 Texas Instruments Incorporated
Submit Document Feedback
7
Product Folder Links: LMR43620-Q1 LMR43610-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMR43610MSC3RPERQ1
LMR43620MSC3RPERQ1
PREVIEW VQFN-HR
PREVIEW VQFN-HR
RPE
RPE
9
9
4500
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
3000 RoHS (In work)
& Non-Green
PMR43620MSC3RPERQ1
ACTIVE
VQFN-HR
RPE
9
3000 RoHS (In work)
& Non-Green
Call TI
Call TI
-40 to 150
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Dec-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
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TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
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