LMR436X0 [TI]

LMR436x0, 36-V, 1-A/2-A Buck Converter with 1.5 μA IQ in 4-mm2 HotRod™ QFN;
LMR436X0
型号: LMR436X0
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LMR436x0, 36-V, 1-A/2-A Buck Converter with 1.5 μA IQ in 4-mm2 HotRod™ QFN

文件: 总8页 (文件大小:732K)
中文:  中文翻译
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LMR43620, LMR43610  
SNVSBY4 – DECEMBER 2020  
LMR436x0, 36-V, 1-A/2-A Buck Converter with 1.5 µA IQ in 4-mm2 HotRodQFN  
1 Features  
3 Description  
Miniature solution size and low component cost  
– 2-mm × 2-mm HotRodpackage with wettable  
flanks  
The LMR436x0 is the industry's smallest 36 V, 2 A  
and 1 A synchronous step-down DC/DC converters in  
2-mm x 2-mm HotRodpackage. This easy-to-use  
converter supports a wide input voltage range of 3.0V  
to 36 V with transients up to 42 V. The transient  
tolerance reduces the necessary design effort to  
protect against input overvoltage and meets the surge  
immunity requirements of IEC 61000-4-5.  
– Internal compensation  
Optimized for ultra-low EMI requirements  
– Spread spectrum reduces peak emissions  
– Pin selectable FPWM mode for constant  
frequency at light loads with MODE/SYNC pin  
– FSW synchronization with MODE/SYNC pin  
Designed for industrial automotive applications  
– Junction temperature range: –40°C to +150°C  
– Supports 42-V transients  
The control architecture and feature-set are optimized  
for an ultra-small solution size. The device uses peak  
current mode control to minimize output capacitance.  
The LMR436x0 minimizes input filter size by utilizing  
pseudo-random spread spectrum,  
a
low-EMI  
– Supports 3-VIN minimum  
– Adjustable up to 95% of VIN, 3.3-V and 5-V  
fixed VOUT options available  
HotRodpackage, and an optimized pin-out. The  
MODE/SYNC and RT pin variants can be used to set  
or synchronize the frequency between 200 kHz and  
2.2 MHz to avoid noise sensistive frequency bands.  
> 85% efficiency at 1 mA  
– 1.5-µA IQ (switching) at 24 VIN, 3.3 fixed VOUT  
Suitable for scalable power supplies  
– Adjustable FSW: 200 kHz - 2.2 MHz with RT pin  
– Pin compatible with:  
The rich feature set of the is designed to simplify  
implementation for a wide range of automotive end  
equipments.  
The compact solution size and rich feature set of  
LMR436x0 simplifies implementation for a wide range  
of industrial applications.  
LMR36506 (65 V, 600 mA)  
LMR36503 (65 V, 300 mA)  
2 Applications  
Device Information  
PART NUMBER  
LMR43620  
PACKAGE(1)  
VQFN-HR (9)  
VQFN-HR (9)  
BODY SIZE (NOM)  
2.00 mm × 2.00 mm  
2.00 mm × 2.00 mm  
Advanced driver assistance systems: radar ECU  
Infotainment and cluster: head unit, eCall  
Body electronics and lighting  
LMR43610  
(1) For all available packages, see the orderable addendum at  
the end of the data sheet.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
VIN = 12 V  
VIN = 24 V  
10  
0
1E-5  
0.0001  
0.001 0.01  
Load Current (A)  
0.10.2 0.5 1  
2
SNVS  
Typical Solution Size  
Efficiency: VOUT = 3.3 V (Fixed), 2.2 MHz  
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change  
without notice.  
 
LMR43620, LMR43610  
SNVSBY4 – DECEMBER 2020  
www.ti.com  
4 Device and Documentation Support  
4.1 Documentation Support  
4.1.1 Related Documentation  
For related documentation see the following:  
Texas Instruments, Thermal Design by Insight not Hindsight Application Report  
Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages  
Application Report  
Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report  
Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report  
Texas Instruments, PowerPADThermally Enhanced Package Application Report  
Texas Instruments, PowerPADMade Easy Application Report  
Texas Instruments, Using New Thermal Metrics Application Report  
Texas Instruments, Layout Guidelines for Switching Power Supplies Application Report  
Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report  
Texas Instruments, Construction Your Power Supply- Layout Considerations Seminar  
Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report  
4.2 Receiving Notification of Documentation Updates  
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on  
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For  
change details, review the revision history included in any revised document.  
4.3 Support Resources  
TI E2Esupport forums are an engineer's go-to source for fast, verified answers and design help — straight  
from the experts. Search existing answers or ask your own question to get the quick design help you need.  
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do  
not necessarily reflect TI's views; see TI's Terms of Use.  
4.4 Trademarks  
HotRod, PowerPAD, and are trademarks of TI.  
TI E2Eis a trademark of Texas Instruments.  
All trademarks are the property of their respective owners.  
4.5 Electrostatic Discharge Caution  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
4.6 Glossary  
TI Glossary  
This glossary lists and explains terms, acronyms, and definitions.  
Copyright © 2020 Texas Instruments Incorporated  
2
Submit Document Feedback  
Product Folder Links: LMR43620 LMR43610  
LMR43620, LMR43610  
SNVSBY4 – DECEMBER 2020  
www.ti.com  
5 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
Copyright © 2020 Texas Instruments Incorporated  
Submit Document Feedback  
3
Product Folder Links: LMR43620 LMR43610  
LMR43620, LMR43610  
SNVSBY4 – DECEMBER 2020  
www.ti.com  
PACKAGE OUTLINE  
RPE0009A  
VQFN-HR - 1.0 mm max height  
S
C
A
L
E
6
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD  
2.1  
1.9  
B
A
PIN 1 INDEX AREA  
2.1  
1.9  
0.1 MIN  
(0.05)  
A
-
A
4
0
.
0
0
0
SECTION A-A  
TYPICAL  
1.0  
0.8  
C
SEATING PLANE  
0.08 C  
0.05  
0.00  
4X (0.15)  
0.55  
0.45  
(0.2) TYP  
0.275  
0.175  
4X (0.15)  
2X  
4X  
0.1  
C A B  
C
4
0.05  
5
2X 0.738  
2X 0.25  
0.000 PKG  
2X 0.25  
A
A
1.1 0.05  
2X 0.738  
8
1
9
0.275  
0.175  
PIN 1 ID  
0.6  
0.5  
4X  
2X  
0.1  
C A B  
0.4  
0.3  
0.05  
C
0.45  
0.35  
4X  
4224447/A 09/2018  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
www.ti.com  
Copyright © 2020 Texas Instruments Incorporated  
4
Submit Document Feedback  
Product Folder Links: LMR43620 LMR43610  
LMR43620, LMR43610  
SNVSBY4 – DECEMBER 2020  
www.ti.com  
EXAMPLE BOARD LAYOUT  
RPE0009A  
VQFN-HR - 1.0 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
2X (0.75)  
2X (0.4)  
(0.35)  
9
4X (0.225)  
1
2X (0.575)  
(1.3)  
8
2X (0.738)  
4X (0.6)  
2X (0.25)  
0.000 PKG  
(0.55)  
4X (0.25)  
2X (0.25)  
SEE SOLDER MASK  
DETAILS  
(R0.05) TYP  
2X (0.738)  
5
4
2X (0.575)  
SYMM  
(1.8)  
2X (0.7)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE: 30X  
0.05 MAX  
ALL AROUND  
0.05 MIN  
ALL AROUND  
METAL UNDER  
SOLDER MASK  
METAL EDGE  
EXPOSED  
METAL  
EXPOSED  
METAL  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
NON SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4224447/A 09/2018  
NOTES: (continued)  
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).  
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown  
on this view. It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
Copyright © 2020 Texas Instruments Incorporated  
Submit Document Feedback  
5
Product Folder Links: LMR43620 LMR43610  
LMR43620, LMR43610  
SNVSBY4 – DECEMBER 2020  
www.ti.com  
EXAMPLE STENCIL DESIGN  
RPE0009A  
VQFN-HR - 1.0 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
2X (0.75)  
2X  
2X (0.55)  
9
2X (0.35)  
(0.4)  
2X (0.5)  
4X (0.225)  
(0.925)  
(0.175)  
1
8
2X (0.738)  
4X (0.6)  
2X (0.25)  
4X (0.25)  
0.000 PKG  
2X (0.25)  
(R0.05) TYP  
2X (0.738)  
5
4
2X (0.575)  
SYMM  
(1.8)  
2X (0.7)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 MM THICK STENCIL  
SCALE: 30X  
PADS 1 & 8:  
90% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE  
PAD 9:  
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE  
DWG_NO:5/REV:5 MM_YYYY:5  
NOTES: (continued)  
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
Copyright © 2020 Texas Instruments Incorporated  
6
Submit Document Feedback  
Product Folder Links: LMR43620 LMR43610  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Jan-2021  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LMR43610MB3RPER  
LMR43620MB5RPER  
PREVIEW VQFN-HR  
PREVIEW VQFN-HR  
RPE  
RPE  
9
9
3000  
3000  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 150  
-40 to 150  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE AND DISCLAIMER  
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE  
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”  
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY  
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD  
PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate  
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable  
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you  
permission to use these resources only for development of an application that uses the TI products described in the resource. Other  
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TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either  
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applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE  
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Copyright © 2021, Texas Instruments Incorporated  

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