LMS202ECMWX/NOPB [TI]
DUAL LINE TRANSCEIVER, PDSO16, SOIC-16;
| 型号： | LMS202ECMWX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL LINE TRANSCEIVER, PDSO16, SOIC-16 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总14页 (文件大小：782K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMS202E
www.ti.com
SNLS160D –DECEMBER 2002–REVISED APRIL 2013
LMS202E 15KV ESD Rated, 5V Single Supply TIA/EIA-232 Dual Transceivers
Check for Samples: LMS202E
1
FEATURES
DESCRIPTION
The LMS202E features two transmitters and two
receivers for RS-232 communication. It has a DC-to-
DC converter that permits the device to operate with
only a single +5V power supply. The on-chip DC-to-
DC converter which utilizes four external 0.1μF
capacitors to generate dual internal power supplies
for RS-232 compatible output levels.
2
•
ESD Protection for RS-232 I/O Pins
•
±15kV-IEC1000 4-2 (EN61000-4-2) Contact
Discharge
•
±8kV-IEC1000 4-2 (EN61000-4-2) Air-Gap
Discharge
•
•
•
•
•
•
±15kV Human Body Model
The device meet EIA/TIA-232E and CCITT V.28
specifications up to 230kbits/sec. The LMS202E is
available in a 16 pin narrow and wide SOIC package.
Single +5V Power Supply
230 Kbps Data Rate
On-Board DC-to-DC Converter
0.1μF Charge Pump Capacitors
Drop-In Replacement to Maxim’s MAX202E
The transmitter outputs and receiver inputs have
±15kV electrostatic discharge (ESD) protection. The
LMS202E survives a ± 15kV ESD event to the RS-
232 input and output pins when subjected according
to Human Body Model or IEC 1000-4-2 (EN61000-4-
2), air-gap specification. It survives a ±8kV discharge
when subjected to IEC 1000-4-2 (EN61000-4-2),
contact specification. This device is designed for use
in harsh environments where ESD is a concern.
APPLICATIONS
•
•
•
POS Equipment (Bar code reader)
Hand-Held Equipment
General Purpose RS-232 Communication
CONNECTION DIAGRAM AND TYPICAL CIRCUIT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
LMS202E
SNLS160D –DECEMBER 2002–REVISED APRIL 2013
www.ti.com
PIN DESCRIPTIONS
Pin Number
Pin Name
C1+, C1−
V+
Pin Function
1, 3
2
External capacitor connection pins. Recommended external capacitor C1 = 0.1μF (6.3V)
Positive supply for TIA/EIA-232E drivers. Recommended external capacitor C4 = 0.1μF (6.3V)
External capacitor connection pins. Recommended external capacitor C2 = 0.1μF (16V)
Negative supply for TIA/EIA-232E drivers. Recommended external capacitor C3 = 0.1μF (16V)
4, 5
6
C2+, C2−
V−
7, 14
T1out, T2out
Transmitter output pins conform to TIA/EIA-232E levels. The typical transmitter output swing is ±8V
when loaded 3kΩ load to ground. The open-circuit output voltage swings from (V+ − 0.6V) to V−
8,13
R1in, R2in
Receiver inputs accept TIA/EIA-232
9, 12
10, 11
R1out and R2out Receiver output pins are TTL/CMOS compatible
Tin1, Tin2
Transmitter input pins are TTL/CMOS compatible. Inputs of transmitter do not have pull-up resistors.
Connect all unused transmitter inputs to ground
15
16
GND
VS
Ground pin
Power supply pin for the device, +5V (±10%)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
ABSOLUTE MAXIMUM RATINGS
VS
−0.3V to 6V
(VS − 0.3V) to + 14V
+0.3V to −14V
V+
V−
Driver Input Voltage, TIN
Receiver Input Voltage, RIN
Driver Output Voltage TO
−0.3V to (V+ +0.3V)
± 30V
(V− −0.3V to (V+ +
0.3V)
Receiver Output Voltage RO
Short Circuit Duration, TO
ESD Rating
−0.3 to (VS + 0.3)
Continuous
(3)
(4)
IEC 1000-4-2)
See
Air-Gap Discharge
Contact Discharge
Human Body Model
15kV
8kV
(5)
(4)
(6)
See
See
15kV
2kV
(7)(6)
ESD Rating (MM)
200V
Soldering Information
Junction Temperature
Storage Temperature Range
Infrared or Convection
(20sec.)
235°C
150°C
−65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the
Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) IEC 1000-4-2, 330Ω in series with 150pF
(4) ESD rating applies to pins 7,8 13 and 14
(5) Human Body Model, 1.5kΩ in series with 100pF
(6) ESD rating applies to pins 1, 2, 3, 4, 5, 6, 9, 10, 11, 12, 15 and 16
(7) Machine model, 0Ω in series with 200pF
2
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LMS202E
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SNLS160D –DECEMBER 2002–REVISED APRIL 2013
OPERATING RATINGS
Supply Voltage VS
4.5V to 5.5V
0°C to +70°C
Ambient Temperature Range, TA
Commercial (C)
Industrial (I)
−40°C to +85°C
(1)
Package Thermal Resistance
SO
71°C/W
55°C/W
WSO
(1) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) − TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
ELECTRICAL CHARACTERISTICS
Over recommended operating supply and temperature ranges unless otherwise specified
C1 = C2 = C3 = C4 = Cbp = 0.1μF
(1)
(1)
Symbol
Parameter
Conditions
Min
Typ(2)
Max
Units
DC Characteristics
IS
Supply Current
No Load, TA = 25°C
1
7
mA
Logic
IINPUT
VTHL
VTHH
VOL
Input Leakage Current
TIN = 0V to VS
±10
μA
V
Input Logic Theshold Low
Input Logic Theshold High
TIN
0.8
TIN
2.0
V
TTL/CMOS Output Voltage
Low
ROUT, IOUT = 3.2mA
0.4
V
VOH
TTL/CMOS Output Voltage
High
ROUT, IOUT = −1.0mA
3.5
VS −0.1
V
RS-232 Receiver Inputs
VRI
Receiver Input Voltage Range
−30
+30
V
V
VRTHL
VRTHH
VHYST
RI
Receiver Input Theshold Low VS = 5V, TA = 25°C
Receiver Input Theshold High VS = 5V, TA = 25°C
0.8
1.4
2
2.4
1.0
7
V
Receiver Input Hysteresis
Receiver Input Resistance
VS = 5V
0.2
3
0.6
5
V
VS = 5V, TA = 25°C
kΩ
RS-232 Transmitter Outputs
VO
RO
IOS
Transmitter Output Voltage
Swing
All transmitters loaded with 3kΩ to GND
±5
±8
V
Ω
Output Resistance
VS = V+ = V− = 0V,
VO = ± 2V
300
Output Short Circuit Current
±11
±60
mA
Timing Characteristics
DR
Maximum Data Rate
CL = 50pF to 1000pF,
RL = 3kΩ to 7kΩ
230
kbps
μs
TRPLH
TRPHL
Receiver Propagation Delay
CL = 150pF
0.08
2.4
6
1
TDPLH
TDPHL
Transmitter Propagation
Delay
RL = 3kΩ, CL = 2500pF
All transmitters loaded
μs
VSLEW
Transition Region Slew Rate
TA = 25°C, VS = 5V
3
30
V/μs
CL = 50pF to 1000pF, RL = 3kΩ to 7kΩ
Measured from +3V to −3V or vice versa
ESD Performance: Transmitter Outputs and Receiver Inputs
ESD Rating
Human Body Model
IEC 1000-4-2, Contact
IEC 1000-4-2, Air-gap
±15
±8
kV
±15
(1) All limits are specified by testing or statistical analysis
(2) Typical Values represent the most likely parametric norm.
Copyright © 2002–2013, Texas Instruments Incorporated
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SNLS160D –DECEMBER 2002–REVISED APRIL 2013
www.ti.com
TYPICAL CHARACTERISTICS
Transmitter Output High Voltage vs. Load Capacitance
Transmitter Slew Rate vs. Load Capacitance
4
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LMS202E
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SNLS160D –DECEMBER 2002–REVISED APRIL 2013
APPLICATION INFORMATION
CAPACITOR SELECTION
The recommended capacitors are 0.1μF. However, larger capacitors for the charge pump may be used to
minimized ripples on V+ and V− pins.
POWER SUPPLY DECOUPLING
In some applications that are sensitive to power supply noise from the charge pump, place a decoupling
capacitor, Cbp, from VS to GND. Use at least a 0.1µF capacitor or the same size as the charge pump capacitors
(C1 − C4).
CHARGED PUMP
The dual internal charged-pump provides the ±10V to the to transmitters. Using capacitor C1, the charge pump
converts +5V to +10V then stores the +10V in capacitor C3. The charge pump uses capacitor C2 to invert the
+10V to −10V. The −10V is then stored in capacitor C4.
ELECTROSTATIC DISCHARGE PROTECTION
ESD protection has been placed at all pins to protect the device from ESD. All pins except for the transmitter
output pins (pins 7 and 14) and receiver input pins (pins 8 and 13) have a ESD rating of 2kV Human Body Model
(HBM) and 200V Machine Model (MM). The RS-232 bus pins (pins 7, 8, 13 and 14) have a more robust ESD
protection. The RS-232 bus pins have a ESD rating of 15kV HBM and IEC 1000-4-2, air-gap. In addition the bus
pins meet an ESD rating of 8kV with IEC 1000-4-2, contact. The ESD structures can withstand a high ESD event
under the following conditions: powered-on, powered-off, and Input connected to high and low with outputs
unloaded.
HUMAN BODY MODEL
The Human Body Model is an ESD testing standard, defined in Mil-STD-883C method 3015.7. It simulates a
human discharging an ESD charge to the IC device. The rise time is approximately 10 ns and decay time is
approximately 150 ns. The waveform is obtained by discharging 2kV volts capacitor through a resistor, R2 = 1.5
kΩ. The peak current is approximately 1.33A.
Figure 1. HBM ESD Test Model
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SNLS160D –DECEMBER 2002–REVISED APRIL 2013
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Figure 2. HBM Waveform
MACHINE MODEL
The Machine Model is the standard ESD test method in Japan and the automotive industry. It simulates a charge
on large object discharging through the IC device. This takes place in automated test and handling systems. The
equipment can accumulate static charge due to improper grounding, which is transmitted through the IC when it
is picked and placed.
The waveform is obtained by discharging 400V volts capacitor to the device. Resistor, R2 = 0Ω.
The parasitic inductance, L, from the PCB affects the peak current and period of the waveform. For L = 0.5µF,
the peak current is approximately 7A with a period of 60 ns. For L = 2.5µH, the peak current is reduced to 4A
with a period of 140 ns.
Figure 3. MM ESD Model
Figure 4. MM Waveform
6
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Product Folder Links: LMS202E
LMS202E
www.ti.com
SNLS160D –DECEMBER 2002–REVISED APRIL 2013
IEC 1000-4-2 (EN61000-4-2)
The European Union requires ESD immunity testing for all electronic products as a condition for EMC Mark
before shipping to any member countries. This is not a IC requirement but an overall system requirement. IEC
1000-4-2 specifies ESD testing both by contact and air-gap discharge. ESD testing by contact are generally more
repeatable than air-gap but is less realistic to actual ESD event. However, air-gap discharge is more realistic but
ESD results may vary widely dependent on environmental conditions (temperature, humidity,....) The waveform is
obtained by discharging 150pF capacitor through a resistor, R2 = 330Ω. A typical peak current may be high as
37A with 10kV.
Figure 5. IEC ESD Model
Figure 6. IEC Waveform
Copyright © 2002–2013, Texas Instruments Incorporated
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SNLS160D –DECEMBER 2002–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2015
PACKAGING INFORMATION
Orderable Device
LMS202ECM/NOPB
LMS202ECMX/NOPB
LMS202EIM/NOPB
LMS202EIMX/NOPB
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
16
16
16
16
48
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LMS202ECM
ACTIVE
ACTIVE
ACTIVE
D
D
D
2500
48
Green (RoHS
& no Sb/Br)
-40 to 85
LMS202ECM
LMS202EIM
LMS202EIM
Green (RoHS
& no Sb/Br)
-40 to 85
2500
Green (RoHS
& no Sb/Br)
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMS202ECMX/NOPB
LMS202EIMX/NOPB
SOIC
SOIC
D
D
16
16
2500
2500
330.0
330.0
16.4
16.4
6.5
6.5
10.3
10.3
2.3
2.3
8.0
8.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2014
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMS202ECMX/NOPB
LMS202EIMX/NOPB
SOIC
SOIC
D
D
16
16
2500
2500
367.0
367.0
367.0
367.0
35.0
35.0
Pack Materials-Page 2
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