LMS3655AMRNLT [TI]

5.5A、36V 同步 400kHz 降压转换器 | RNL | 22 | -40 to 125;
LMS3655AMRNLT
型号: LMS3655AMRNLT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

5.5A、36V 同步 400kHz 降压转换器 | RNL | 22 | -40 to 125

开关 输出元件 转换器
文件: 总50页 (文件大小:2300K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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LMS3655  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
LMS3655 5.5A36V 同步、400kHz 直流/直流降压转换器  
1 特性  
3 说明  
1
在将 12V 转换为 5V 时具有 96% 的峰值效率  
EMI 和开关噪声  
LMS3655 同步降压稳压器针对高性能应用进行了 优  
化,可提供 1V 20V 的可调节输出。PWM PFM  
模式之间的无缝转换以及低静态电流可确保在所有负载  
下实现高效率和出色的瞬态响应。  
最少的开关节点振铃  
假随机扩频  
400kHz (±10%) 固定开关频率  
高级高速电路支持 LMS3655 24V 的输入调节至  
3.3V 的输出(400kHz 固定频率),同时还支持 5.5A  
的持续负载电流。创新的频率折返架构允许该器件通过  
3.5V 的输入电压调节生成 3.3V 的输出。输入电压  
范围可高达 36V,瞬态容差高达 42V,有助于轻松实  
现输入浪涌保护设计。  
–40°C +150°C 结温范围  
外部频率同步  
具有内部滤波器和 3ms 释放计时器的 RESET 输出  
可提高效率的自动轻负载模式  
引脚可选强制 PWM 模式  
内置补偿、软启动、电流限制、热关断和 UVLO  
25°C 时在 3.5A 负载下具有 0.35V 压降(典型值)  
开漏复位输出具有内置的滤波和延迟功能,可提供正确  
的系统状态指示。凭借这一特性,器件无需使用附加监  
控组件,这节省了成本和电路板空间。  
32µA IQ_VIN:在 3.3VOUT 且无负载情况下的静态电  
流(典型值)  
5.5A 持续负载电流  
器件信息(1)  
可调节输出电压(1V 20V)  
±1.5% 基准电压容差  
器件名称  
LMS3655  
封装  
封装尺寸  
VQFN-HR (22)  
4.00mm × 5.00mm  
4mm × 5mm0.5mm 间距 SON 封装  
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附  
录。  
2 应用  
噪声敏感型医疗 应用  
电信  
高性能工业  
典型应用电路  
LMS3655 效率:输出电压 = 5V  
VIN  
3.5 V to 36 V  
100%  
98%  
96%  
94%  
92%  
90%  
88%  
86%  
84%  
10 µF  
10 µF  
PVIN 1  
PVIN 2  
10 µF  
PGND1  
AVIN  
PGND2  
RESET  
VCC  
SYNC  
4.7 µF  
LMS3655  
BIAS  
AGND  
0.1 µF  
FB  
NC  
CFF  
RFBB  
RFBT  
FPWM  
CBOOT  
470 nF  
SW  
VIN = 12  
VIN = 24  
EN  
82%  
80%  
L1=10 µH  
VOUT  
3 X 47 µF  
0.001  
0.01  
0.1  
1
10  
Output Current (A)  
Copyright © 2017, Texas Instruments Incorporated  
LMS3  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SNAS744  
 
 
 
 
LMS3655  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
www.ti.com.cn  
目录  
8.3 Feature Description................................................. 14  
8.4 Device Functional Modes........................................ 19  
Application and Implementation ........................ 23  
9.1 Application Information............................................ 23  
9.2 Typical Applications ................................................ 23  
9.3 Do's and Don't's ...................................................... 40  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Device Comparison Table..................................... 3  
Pin Configuration and Functions......................... 4  
Specifications......................................................... 5  
7.1 Absolute Maximum Ratings ...................................... 5  
7.2 ESD Ratings.............................................................. 5  
7.3 Recommended Operating Conditions....................... 5  
7.4 Thermal Information.................................................. 6  
7.5 Thermal Information (for Device Mounted on PCB).. 6  
7.6 Electrical Characteristics........................................... 6  
7.7 System Characteristics ............................................. 8  
7.8 Timing Requirements................................................ 9  
7.9 Typical Characteristics............................................ 10  
Detailed Description ............................................ 12  
8.1 Overview ................................................................. 12  
8.2 Functional Block Diagram ....................................... 13  
9
10 Power Supply Recommendations ..................... 40  
11 Layout................................................................... 40  
11.1 Layout Guidelines ................................................. 40  
11.2 Layout Example .................................................... 42  
12 器件和文档支持 ..................................................... 43  
12.1 器件支持................................................................ 43  
12.2 文档支持................................................................ 43  
12.3 接收文档更新通知 ................................................. 43  
12.4 社区资源................................................................ 43  
12.5 ....................................................................... 43  
12.6 静电放电警告......................................................... 43  
12.7 Glossary................................................................ 43  
13 机械、封装和可订购信息....................................... 43  
8
4 修订历史记录  
注:之前版本的页码可能与当前版本有所不同。  
Changes from Revision A (October 2017) to Revision B  
Page  
将最大可调节输出电压从 15V 更改成了 20V.......................................................................................................................... 1  
Changed maximum extended output adjustment from: 15 V to: 20 V .................................................................................. 5  
Added new extended output adjustment tablenote to the Recommended Operating Conditions.......................................... 5  
Changes from Original (July 2017) to Revision A  
Page  
Changed symbol from: IB to: IB_NSW ....................................................................................................................................... 6  
Added IB spec to System Characteristics............................................................................................................................... 8  
Added System Characteristics crossreference links for the IB spec..................................................................................... 18  
2
Copyright © 2017–2018, Texas Instruments Incorporated  
 
LMS3655  
www.ti.com.cn  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
5 Device Comparison Table  
Table 1. LMS3655 Devices (5.5-A Output)  
SPREAD  
SPECTRUM  
PART NUMBER  
OUTPUT VOLTAGE  
PACKAGE QTY  
LMS3655AMRNLR  
LMS3655AMRNLT  
LMS3655MMRNLR  
LMS3655MMRNLT  
Adjustable  
Adjustable  
Adjustable  
Adjustable  
No  
No  
3000  
250  
Yes  
Yes  
3000  
250  
Copyright © 2017–2018, Texas Instruments Incorporated  
3
 
LMS3655  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
www.ti.com.cn  
6 Pin Configuration and Functions  
RNL Package  
22-Pin VQFN  
Top View  
Pin Functions  
PIN  
TYPE(1)  
DESCRIPTION  
NO.  
NAME  
Internal 3.1-V LDO output. Used as supply to internal control circuits. Connect a high-quality 4.7-µF  
capacitor from this pin to AGND.  
1
VCC  
A
P
I
Bootstrap capacitor connection for gate drivers. Connect a high quality 470-nF capacitor from this pin to  
the SW pin.  
2
3
4
CBOOT  
SYNC  
Synchronization input to regulator. Used to synchronize the device switching frequency to a system clock.  
Triggers on rising edge of external clock; frequency must be in the range of 250 kHz and 500 kHz.  
Input supply to regulator. Connect input bypass capacitors directly to this pin and PGND pins. Connect  
PVIN1 and PVIN2 pins directly together at PCB.  
PVIN1  
P
5
6
Power ground to internal low-side MOSFET. These pins must be tied together on the PCB. Connect  
PGND1 and PGND2 directly together at PCB. Connect to AGND and system ground.  
PGND1  
SW  
G
P
7
8
9
Regulator switch node. Connect to power inductor.  
10  
11  
12  
13  
Power ground to internal low-side MOSFET. These pins must be tied together. Connect PGND1 and  
PGND2 directly together at PCB. Connect to AGND and system ground.  
PGND2  
G
Input supply to regulator. Connect input bypass capacitors directly to this pin and PGND pins. Connect  
PVIN1 and PVIN2 pins directly together at PCB.  
14  
PVIN2  
P
15  
16  
1 7  
18  
AVIN  
FPWM  
NC  
A
I
Analog VIN. Connect to PVIN1 and PVIN2 on PCB.  
Mode control input of regulator. High = FPWM, low = Automatic light load mode. Do not float.  
No internal connection.  
I
EN  
Enable input to regulator. High = on, Low = off. Can be connected to VIN. Do not float.  
Open-drain reset output flag. Connect to suitable voltage supply through a current limiting resistor. High =  
regulator OK, Low = regulator fault. Goes low when EN = low.  
19  
20  
RESET  
AGND  
O
G
Analog ground for regulator and system. All electrical parameters are measured with respect to this pin.  
Connect to PGND on PCB.  
21  
22  
FB  
A
P
Feedback input to regulator. Connect to feedback voltage divider.  
Input to auxiliary bias regulator. Connect to output voltage node.  
BIAS  
(1) A = Analog, O = Output, I = Input, G = Ground, P = Power  
4
Copyright © 2017–2018, Texas Instruments Incorporated  
LMS3655  
www.ti.com.cn  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
7 Specifications  
7.1 Absolute Maximum Ratings  
(1)  
Over the recommended operating junction temperature range of –40°C to +150°C (unless otherwise noted).  
PARAMETER  
VIN (AVIN, PVIN1, and PVIN2) to AGND, PGND(2)  
SW to AGND, PGND(3)  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
MAX  
40  
UNIT  
V
VIN + 0.3  
3.6  
V
CBOOT to SW  
EN to AGND, PGND(2)  
V
40  
V
BIAS to AGND, PGND  
16  
V
FB to AGND, PGND  
16  
V
RESET to AGND, PGND  
RESET sink current(4)  
SYNC to AGND, PGND(2)  
FPWM to AGND, PGND(2)  
VCC to AGND, PGND  
8
V
10  
mA  
V
–0.3  
–0.3  
–0.3  
–40  
–40  
40  
40  
V
3.6  
V
Junction temperature  
150  
150  
°C  
°C  
Storage temperature, Tstg  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) A maximum of 42 V can be sustained at this pin for a duration of 500 ms at a duty cycle of 0.01%.  
(3) A voltage of 2 V below PGND and 2 V above VIN can appear on this pin for 200 ns with a duty cycle of 0.01%.  
(4) Do not exceed the voltage rating on this pin.  
7.2 ESD Ratings  
VALUE  
±1000  
±250  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)  
Electrostatic  
discharge  
V(ESD)  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
Over the recommended operating junction temperature range of –40°C to +150°C (unless otherwise noted).  
MIN  
3.9  
3.3  
1
NOM  
MAX  
36  
UNIT  
V
Input voltage after start-up(1)  
Output adjustment for LMS3655(2)  
Extended output adjustment for LMS3655(3)(4)  
Load current for LMS3655  
6
V
20  
V
5.5  
125  
A
Operating ambient temperature(5)  
–40  
°C  
(1) An extended input voltage range to 3.5 V is possible; see System Characteristics table. See Input UVLO for start-up conditions.  
(2) The output voltage must not be allowed to fall below zero volts during normal operation.  
(3) Operation below 3.3 V and above 6 V may require changes to the typical application schematic, operation may not be possible over the  
full input voltage range, and some system specifications will not be achieved for this extended output voltage range. Consult the factory  
for further information.  
(4) Operation above 15 V requires the BIAS pin grounded or powered by an external source. A maximum of 16 V can be sustained on the  
BIAS pin.  
(5) High junction temperatures degrade operating lifetime.  
Copyright © 2017–2018, Texas Instruments Incorporated  
5
 
 
LMS3655  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
www.ti.com.cn  
7.4 Thermal Information  
LMS3655  
RNL (VQFN)  
22 PINS  
38.5  
THERMAL METRIC(1)  
UNIT  
RθJA  
RθJC  
RθJB  
ψJT  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
16.3  
16.4  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
2.0  
ψJB  
16.4  
RθJC(bot)  
4.6  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
7.5 Thermal Information (for Device Mounted on PCB)  
LMS3655  
THERMAL METRIC(1)  
RNL (VQFN)  
22 PINS  
29.4  
UNIT  
RθJA  
RθJC  
RθJB  
ψJT  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
14.2  
5.4  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
1.2  
ψJB  
5.4  
RθJC(bot)  
2.4  
(1) Mounted on a thermally optimized FR4 four layer EVM with a size of 4000 mill × 3000 mill.  
7.6 Electrical Characteristics  
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.  
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most  
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following  
conditions apply: VIN = 13.5 V.  
PARAMETER  
TEST CONDITIONS  
VIN = 3.8 V to 36 V, TJ = 25°C  
VIN = 3.8 V to 36 V  
MIN  
–1%  
TYP  
MAX  
1%  
UNIT  
Initial reference voltage for 5-V  
and 3.3-V options  
VFB  
–1.5%  
1.5%  
Operating quiescent current;  
measured at VIN pin when  
enabled and not switching(1)  
IQ  
VIN = 13.5 V, VBIAS = 5 V  
7.5  
16  
µA  
µA  
VIN = 13.5 V, VBIAS = 5 V, FPWM =  
0 V  
53  
53  
2
62  
62  
3
Bias current into BIAS pin,  
enabled, not switching  
IB_NSW  
VIN = 13.5 V, VBIAS = 3.3 V, FPWM  
= 0 V  
Shutdown quiescent current;  
measured at VIN pin  
ISD  
EN 0.4 V  
µA  
V
Rising  
3.2  
2.95  
3.55  
3.25  
0.3  
3.90  
3.55  
VIN-OPERATE  
Minimum input voltage to operate Falling  
Hysteresis  
0.28  
0.4  
RESET upper threshold voltage  
RESET lower threshold voltage  
Rising, % of VOUT  
Falling, % VOUT  
105%  
92%  
107%  
94%  
110%  
96.5%  
VRESET  
Magnitude of RESET lower  
threshold from steady state  
output voltage  
Steady-state output voltage and  
RESET falling threshold read at the  
same TJ and VIN  
96%  
(1) This is the current used by the device while not switching, open loop on the ATE. It does not represent the total input current from the  
regulator system.  
6
Copyright © 2017–2018, Texas Instruments Incorporated  
 
 
LMS3655  
www.ti.com.cn  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
Electrical Characteristics (continued)  
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.  
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most  
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following  
conditions apply: VIN = 13.5 V.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
RESET hysteresis as a percent of  
output voltage setpoint  
VRESET_HYST  
VRESET_VALID  
±1%  
50-µA pullup to RESET pin,  
EN = 0 V, TJ= 25°C  
Minimum input voltage for proper  
RESET function  
1.5  
0.4  
0.4  
0.4  
440  
440  
V
50-µA pullup to RESET pin,  
VIN = 1.5 V, EN = 0 V  
0.5-mA pullup to RESET pin,  
VIN = 13.5 V, EN = 0 V  
Low level RESET function output  
voltage  
VOL  
V
1-mA pullup to RESET pin,  
VIN = 13.5 V, EN = 3.3 V  
VIN = 13.5 V, center frequency with  
spread spectrum, PWM operation  
360  
360  
400  
FSW  
Switching frequency  
kHz  
kHz  
VIN = 13.5 V, without spread  
spectrum, PWM operation  
400  
400  
FSYNC  
DSYNC  
Sync frequency range  
250  
25%  
1.5  
500  
Sync input duty cycle range  
High state input < 5.5 V and > 2.3 V  
FPWM input high (MODE = FPWM)  
75%  
FPWM input low (MODE = AUTO  
with diode emulation)  
VFPWM  
FPWM input threshold voltage  
0.4  
1
V
FPWM input hysteresis  
0.15  
Frequency span of spread  
spectrum operation  
FSSS  
FPSS  
±3%  
Spread-spectrum pattern  
frequency(2)  
1.2  
Hz  
µA  
VIN = 13.5 V, VFPWM = 3.3 V  
VIN = VFPWM = 13.5 V  
VIN = 13.5 V, VSYNC = 3.3 V  
VIN = VSYNC = 13.5 V  
LMS3655  
1
1
IFPWM  
FPWM leakage current  
SYNC leakage current  
1
ISYNC  
µA  
1
IL-HS  
IL-LS  
High-side switch current limit  
Low-side switch current limit  
6.7  
6
8.5  
7
9.5  
7.7  
A
A
LMS3655  
Zero-cross current limit FPWM =  
low  
IL-ZC  
–0.02  
–1.5  
60  
A
Negative current limit FPWM =  
high  
IL-NEG  
High-side MOSFET RDSON  
VIN = 13 V, IL = 1 A  
,
130  
80  
RDSON  
Power switch on-resistance  
mΩ  
Low-side MOSFET RDSON  
,
40  
VIN = 13 V, IL = 1 A  
Enable input threshold voltage -  
rising  
VEN  
Enable rising  
1.7  
2
V
VEN_HYST  
VEN_WAKE  
IEN  
Enable threshold hysteresis  
Enable wake-up threshold  
EN pin input current  
0.45  
0.4  
0.55  
V
V
VIN = VEN = 13.5 V  
2
3.05  
3.15  
2.7  
3
µA  
VIN = 13.5 V, VBIAS = 0 V  
VCC  
Internal VCC voltage  
V
VIN = 13.5 V, VBIAS = 3.3 V  
VIN rising  
V
Internal VCC input undervoltage  
lockout  
VCC_UVLO  
Hysteresis below VCC-UVLO  
185  
mV  
(2) Ensured by Design, Not tested at production.  
Copyright © 2017–2018, Texas Instruments Incorporated  
7
LMS3655  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
www.ti.com.cn  
Electrical Characteristics (continued)  
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.  
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most  
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following  
conditions apply: VIN = 13.5 V.  
PARAMETER  
TEST CONDITIONS  
FB = 1 V  
MIN  
TYP  
20  
1
MAX  
UNIT  
IFB  
Input current from FB to AGND  
nA  
TJ = 25°C  
0.993  
0.99  
1.007  
1.01  
VREF  
Reference voltage  
V
TJ = –40°C to 125°C  
1
Pull FB pin low. Sink 1-mA at  
RESET pin  
RRESET  
RDSON of RESEToutput  
50  
120  
Ω
VIH  
1.5  
VSYNC  
VIL  
0.4  
1
V
VHYST  
0.15  
160  
Rising  
185  
TSD  
Thermal shutdown thresholds(2)  
°C  
Hysteresis  
15  
Fsw = 400 kHz  
While in dropout(2)  
96%  
DMAX  
Maximum switch duty cycle  
98%  
7.7 System Characteristics  
The following specifications are ensured by design provided that the component values in the typical application circuit are  
used. These parameters are not ensured by production testing. Limits apply over the recommended operating junction  
temperature range of –40°C to +150°C, unless otherwise noted. Minimum and maximum limits are specified through test,  
design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for  
reference purposes only. Unless otherwise stated the following conditions apply: VIN = 13.5 V.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Minimum input voltage for full functionality at  
3.5-A load, after start-up.  
VOUT = 3.3 V +2% or –3% regulation  
3.5  
VIN-MIN  
V
Minimum input voltage for full functionality at  
maximum rated load 5.5 A after start-up.  
VOUT = 3.3 V +2% or –3% regulation  
VIN = VOUT + 1 V to 36 V, IOUT = 3.5 A  
3.8  
VOUT  
FSW  
Output voltage  
–2.25%  
2.25%  
VIN = 24 V, FPWM = 24V, VOUT = 3.3 V,  
IOUT = 200 mA  
Switching frequency  
400  
32  
kHz  
µA  
VIN = 13.5 V, VOUT = 3.3 V, IOUT = 0 A ,  
FPWM = 0, RFBT = 49.9 kΩ, RFBB = 21.7  
kΩ  
IQ_VIN  
Input current to VIN pin  
VIN = 13.5 V, VOUT = 5.0 V, IOUT = 0 A,  
FPWM = 0, RFBT = 49.9 kΩ, RFBB = 12.4  
kΩ  
57  
IB  
Bias current in AUTO mode at no load  
VIN = 13.5 V, IOUT = 0 A, FPWM = 0  
32  
42  
µA  
V
VOUT = 3.3 V or 5 V, IOUT= 3.5 A, +2% or  
–3% output accuracy  
0.35  
0.6  
Minimum input to output voltage differential to  
maintain regulation accuracy without inductor  
DCR drop  
VDROP1  
VOUT = 3.3 V or 5 V, IOUT= 5.5 A, +2% or  
–3% output accuracy  
0.65  
0.5  
0.85  
0.7  
V
V
V
VOUT = 3.3 V or 5 V, IOUT = 3.5 A,  
FSW = 330 kHz, 2% regulation accuracy  
Minimum input to output voltage differential to  
maintain FSW 330 kHz without inductor DCR  
drop  
VDROP2  
VOUT = 3.3 V or 5 V, IOUT = 5.5 A,  
FSW = 330 kHz, 2% regulation accuracy  
0.7  
1.2  
VIN = 13.5 V, VOUT = 5 V, IOUT = 3.5 A  
VIN = 13.5 V, VOUT = 3.3 V, IOUT = 3.5 A  
VIN = 13.5 V, VOUT = 5 V, IOUT = 100 mA  
94%  
92%  
92%  
Efficiency  
Typical efficiency  
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7.8 Timing Requirements  
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.  
Minimum and maximum limits are ensured through test, design or statistical correlation. Typical values represent the most  
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following  
conditions apply: VIN = 13.5 V.  
MIN  
NOM  
60  
65  
3
MAX  
UNIT  
tON  
Minimum switch on-time, VIN = 18 V, IL = 1 A  
Minimum switch off-time, VIN = 3.8 V, IL = 1 A  
Delay time to RESET high signal  
84  
ns  
tOFF  
80  
ns  
tRESET-act  
tRESET-filter  
tSS  
2
4
ms  
µs  
Glitch filter time for RESET function(1)  
24  
4
Soft-start time from first switching pulse to VREF at 90%  
Turnon delay, CVCC = 4.7 µF(2)  
2.5  
5
ms  
ms  
ms  
tEN  
0.8  
6
tW  
Short-circuit wait time (hiccup time)(3)  
Change transition time from AUTO to FPWM MODE, 10-mA load, VIN = 13.5 V  
Change transition time from FPWM to AUTO MODE, 10-mA load, VIN = 13.5 V  
250  
450  
tFPWM  
µs  
(1) See Detailed Description.  
(2) This is the time from the rising edge of EN to the time that the soft-start ramp begins.  
(3) Tw is the wait time between current limit trip and restart. Tw is proportional to the soft-start time. However, provision must be made to  
make Tw longer to ensure survivability during an output short circuit.  
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7.9 Typical Characteristics  
Unless otherwise specified the following conditions apply: VIN = 12 V, TA = 25ºC. Specified temperatures are ambient.  
104%  
103%  
102%  
101%  
100%  
99%  
450000  
440000  
430000  
420000  
410000  
400000  
390000  
380000  
370000  
360000  
350000  
-50  
-25  
0
25  
50  
75  
100 125 150 175  
-40  
10  
60  
110  
160  
Temperature (èC)  
Temperature (èC)  
LMS3  
LMS3  
VIN = 12 V  
Figure 1. Reference Voltage Drift  
VIN = 12 V  
Figure 2. Switching Frequency vs Temperature  
10  
8
8
7
6
5
4
3
2
1
0
6
4
2
LMS3655  
150 200  
LMS3655  
0
-50  
0
50  
100  
-50  
0
50  
100  
150  
200  
Temperature (èC)  
Temperature (èC)  
LMS3  
LMS3  
VIN = 12 V  
VIN = 12V  
Figure 3. High-Side/Peak Current Limit for LMS3655  
Figure 4. Low-Side/Valley Current Limit for LMS3655  
25  
0.25  
0.2  
0.15  
0.1  
0.05  
0
3.8 VIN  
5.5 VIN  
13.5 VIN  
18 VIN  
20  
15  
10  
5
0
-50  
0
5
10  
15  
20  
25  
30  
35  
40  
0
50  
100  
150  
200  
Temperature (èC)  
Temperature (èC)  
LMS3  
LMS3  
VIN = 12 V  
VIN = 12 V  
Figure 5. Short Circuit Average Input Current  
for LMS3655  
Figure 6. Shutdown Current  
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Typical Characteristics (continued)  
Unless otherwise specified the following conditions apply: VIN = 12 V, TA = 25ºC. Specified temperatures are ambient.  
5.4  
5.3  
5.2  
5.1  
5
108%  
106%  
104%  
102%  
100%  
98%  
VRESET_UPPER  
VRESET_UPPER  
VRESET_UPPER_FALLING  
VOUT  
4.9  
4.8  
4.7  
4.6  
4.5  
VRESET_LOWER_RISING  
VRESET_LOWER  
96%  
VRESET_LOWER  
94%  
-40 -20  
0
20  
40  
60  
80 100 120 140 160  
-40 -20  
0
20  
40  
60  
80 100 120 140 160  
Termperature (èC)  
Temperature (èC)  
D026  
D027  
Figure 7. RESET Threshold 5-V Output  
Figure 8. RESET Threshold as Percentage of Output Voltage  
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8 Detailed Description  
8.1 Overview  
The LMS3655 devices are wide-input voltage range, low quiescent current, high-performance regulators with  
internal compensation. This device is designed to minimize end-product cost and size while operating in  
demanding high-performance industrial environments. Normal operating frequency is 400 kHz allowing the use of  
small passive components. This device has a low unloaded current consumption, eliminating the need for an  
external backup LDO. The LMS3655 low shutdown current and high maximum operating voltage also allow for  
the elimination of an external load switch. To further reduce system cost, an advanced reset output is provided,  
which can often eliminate the use of an external reset or supervisor device.  
The LMS3655 family is designed with a flip-chip or HotRod™ technology, greatly reducing the parasitic  
inductance of the pins. In addition, the layout of the device allows for partial cancellation of the current generated  
magnetic field which reduces the radiated noise generated by the switching action.  
As a result the switch-node waveform exhibits less overshoot and ringing.  
Figure 9. Switch Node Waveform (VIN = 13.5 V, IOUT = 5.5 A)  
The LMS3655 is available in a VQFN package with wettable flanks which allows easy inspection of the soldering  
without the requirement of x-ray checks.  
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8.2 Functional Block Diagram  
SYNC  
VCC  
BIAS  
VIN  
* = not used in -ADJ  
Oscillator  
Int. Reg. Bias  
CBOOT  
Enable  
Logic  
HS Current  
Sense  
EN  
FB  
¯
1.0-V  
Reference  
PWM  
Comp.  
+
-
Error  
Amplifier  
Control Logic  
Driver  
SW  
*
*
+
-
LS Current  
Sense  
RESET  
Reset  
Control  
Mode Logic  
FPWM  
AGND  
PGND  
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Functional Block Diagram (continued)  
8.2.1 Control Scheme  
The LMS3655 control scheme allows this device to operate under a wide range of conditions with a low number  
of external components. Peak current mode control allows a wide range of input voltages and output capacitance  
values while maintaining a constant switching frequency. Stable operation is maintained while output capacitance  
is changed during operation as well. This allows use in systems that require high performance during load  
transients and which have load switches that remove loads as the operating state changes. Short minimum on  
and off times ensure constant frequency regulation over a wide range of conversion ratios.  
This architecture uses frequency spreading to achieve low dropout voltage maintaining output regulation as the  
input voltage falls close to output voltage. The frequency spreading is smooth and continuous, and activated as  
the off time approaches its minimum. Under these conditions, the LMS3655 operates like a constant off-time  
converter, allowing the maximum duty cycle to reach 98% and output voltage regulation with 650-mV dropout. As  
load current is reduced, the LMS3655 transitions to light load mode. In this mode, diode emulation is used to  
reduce RMS inductor current and switching frequency. Average output voltage increases slightly while lightly  
loaded as well.  
8.3 Feature Description  
8.3.1 RESET Flag Output  
While the LMS3655 reset function resembles a standard Power-Good function, its functionality is designed to  
replace a discrete reset device, reducing additional component cost. There are three major differences between  
the reset function and the normal power good function seen in most regulators.  
A delay has been added between the point at which the output voltage is within specified limits and the flag  
asserts Power Good. A glitch filter prevents false flag operation for short excursions in the output voltage,  
such as during line and load transients. See Figure 11 and Figure 12 for more detail.  
RESET output signals a fault (pulls its output to ground) while the part is disabled.  
RESET continues to operate with input voltage as low as 1.5 V. Below this input voltage, RESET output may  
be high impedance.  
Because the RESET comparator and the regulation loop share the same reference, the thresholds track with the  
output voltage. When EN is pulled low, the RESET flag output is forced low. When the device is disabled,  
RESET remains valid as long as the input voltage is 1.5 V. RESET operation can best be understood by  
reference to Figure 10 and Figure 11. Output voltage excursions lasting less than TRESET-filter do not trip RESET.  
Once the output voltage is within the prescribed limits, a delay of TRESET-act is imposed before RESET goes high.  
This enables tighter tolerance than is possible with an external supervisor device while also expanding the  
system allowance for transient response without the need for extremely accurate internal circuitry.  
This output consists of an open-drain NMOS; requiring an external pullup resistor to a suitable logic supply. It  
can also be pulled up to either VCC or VOUT, through an appropriate resistor, as desired. The pin can be left  
floating or grounded if the RESET function is not used in the application. The maximum current into this pin must  
be limited to 10 mA, and the maximum voltage must be less than 8 V.  
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Feature Description (continued)  
Figure 10. Static RESET Operation  
Figure 11. RESET Timing Behavior  
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Feature Description (continued)  
The threshold voltage for the RESET function takes advantage of the availability of the LMS3655 internal  
feedback threshold to the RESET circuit. This allows a maximum threshold of 96.5% of selected output voltage  
to be specified at the same time as 96% of actual set point.  
8.3.2 Enable and Start-Up  
Start-up and shutdown of the LMS3655 are controlled by the EN input. Applying a voltage of 2 V activates the  
device, while a voltage of 1.45 V is required for shutdown. The EN input may also be connected directly to the  
input voltage supply. This input must not be left floating. The LMS3655 uses a reference-based soft start that  
prevents output voltage overshoots and large inrush currents as the regulator is starting up.  
A typical start-up waveform is shown in Figure 12 along with timing definitions. This waveform indicates the  
sequence and timing between the enable input, output voltage, and RESET. From the figure, the user can define  
several different start-up times depending on what is relevant to the application. Table 2 lists the timing  
definitions and typical values.  
tRESET-UP  
tPOWER-UP  
tRESET-ACT  
tEN  
tSS  
2 ms/div  
Figure 12. Typical Start-Up Waveform  
Table 2. Typical Start-Up Times  
PARAMETER  
DEFINITION  
VALUE  
UNIT  
ms  
tRESET-READY  
tPOWER-UP  
tSS  
Total start-up sequence time  
Start-up time  
Time from EN to RESET released  
Time from EN to 90% of VOUT  
7.5  
4
ms  
Soft-start time  
Rise time of VOUT from 10% to 90%  
Time from EN to start of VOUT rising  
3.2  
1
ms  
tEN  
Delay time  
ms  
Time from output voltage within 94% and  
RESET released  
tRESET-ACT  
RESET time  
3
ms  
8.3.3 Soft-Start Function  
Soft-start time is fixed internally at about 4 ms. Soft start is achieved by ramping the internal reference. The  
LMS3655 operates correctly even if there is a voltage present on the output before activation of the LMS3655  
(prebiased start-up). The device operates in AUTO mode during soft start, and the state of the FPWM pin is  
ignored during that period.  
8.3.4 Current Limit  
The LMS3655 incorporates a valley current limit for normal overloads and for short-circuit protection. A precision  
low-side current limit prevents excessive average output current from the buck converter of the LMS3655. A  
high-side peak-current limit is employed for protection of the top N MOSFET and inductors. The two current limits  
enable use of smaller inductors than a system with a single current limit. This scheme allows use of inductors  
with saturation current rated less than twice the operating current of the LMS3655.  
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During overloads the low-side current limit, IL-LS (see Electrical Characteristics), determines the maximum load  
current that the LMS3655 can supply. When the low-side switch turns on, the inductor current begins to ramp  
down. If the current does not fall below IL-LS before the next turnon cycle, then that cycle is skipped, and the low-  
side FET is left on until the current falls below IL-LS. This is different than the more typical peak current limit, and  
results in Equation 1 for the maximum load current.  
(
V
IN - VOUT  
2FS L  
)
VOUT  
IOUT  
= ILS  
+
max  
V
IN  
(1)  
If the converter continues triggering valley current limit for more than about 64 clock cycles, the device turns off  
both high and low side switches for approximately 6 ms (see TW in Timing Requirements). If the overload is still  
present after the hiccup time, another 64 cycles is counted, and the process is repeated. If the current limit is not  
tripped for two consecutive clock cycles, the counter is reset. The hiccup time allows the inductor current to fall to  
zero, resetting the inductor volt-second balance. Of course the output current is greatly reduced in this condition  
(see Typical Characteristics). A typical short-circuit transient and recovery is shown in Figure 13.  
SPACE  
Figure 13. Short-Circuit Transient and Recovery  
SPACE  
The high-side current limit trips when the peak inductor current reaches IL-HS (see Electrical Characteristics). This  
is a cycle-by-cycle current limit and does not produce any frequency or current foldback. It is meant to protect the  
high-side MOSFET from excessive current. Under some conditions, such as high input voltage, this current limit  
may trip before the low-side protection. The peak value of this current limit varies with duty cycle.  
In response to a short circuit, the peak current limit prevents excessive peak current while valley current limit  
prevents excessive average inductor current and keeps the power dissipation low during a fault. After a small  
number of cycles of valley current limit triggers, hiccup mode is activated.  
In addition, the INEG current limit also protects the low-side switch from excessive negative current when the  
device is in FPWM mode. If this current exceeds INEG, the low-side switch is turned off until the next clock cycle.  
When the device is in AUTO mode, the negative current limit is increased to about IZC (about 0 A). This allows  
the device to operate in DCM.  
8.3.5 Hiccup Mode  
Hiccup mode prevents excessive heating and power consumption under sustained short-circuit conditions. If an  
overcurrent condition is maintained, the LMS3655 shuts off its output and waits for TW (approximately 6 ms),  
after which the LMS3655 restarts operation by activating soft start.  
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Vout  
Figure 14. Hiccup Operation  
During hiccup mode operation, the switch node of the LMS3655 is high impedance after a short circuit or  
overcurrent persists for a short duration. Periodically, the LMS3655 attempts to restart. If the short has been  
removed before one of these restart attempts, the LMS3655 operates normally.  
8.3.6 Synchronizing Input  
It is often desirable to synchronize the operation of multiple regulators in a single system. This technique results  
in better-defined EMI and can reduce the need for capacitance on some power rails. The LMS3655 provides a  
SYNC input which allows synchronization with an external clock. The LMS3655 implements an in-phase locking  
scheme—the rising edge of the clock signal provided to the SYNC input corresponds to turning on the high-side  
device within the LMS3655. The SYNC mode operation is implemented using phase locking over a limited  
frequency range eliminating large glitches upon initial application of an external clock. The clock fed into the  
LMS3655 replaces the internal free running clock but does not affect frequency foldback operation. Output  
voltage continues to be well regulated with duty factors outside of the normal 4% through 96% range though at  
reduced frequency.  
The SYNC input recognizes a valid high level as that 1.5 V, and a valid low as that 0.4 V. The frequency  
synchronization signal must be in the range of 250 kHz to 500 kHz with a duty cycle of 10% to 90%. The internal  
clock is synced to the rising edge of the external clock. Ground this input if not used; this input must not be  
allowed to float. See Device Functional Modes to determine which modes are valid for synchronizing the clock.  
The device remains in FPWM mode and operates in CCM for light loads when a synchronization input is  
provided. To prevent frequency foldback behavior at low duty cycles, provide a 200-mA load.  
8.3.7 Undervoltage Lockout (UVLO) and Thermal Shutdown (TSD)  
The LMS3655 incorporates an input UVLO function. The device accepts an EN command when the input voltage  
rises above about 3.64 V and shuts down when the input falls below about 3.3 V. See Electrical Characteristics  
under VIN-OPERATE for detailed specifications.  
TSD is provided to protect the device from excessive temperature. When the junction temperature reaches about  
165°C, the device shuts down; restart occurs at a temperature of about 150°C.  
8.3.8 Input Supply Current  
The LMS3655 is designed to have very low input supply current when regulating light loads. This is achieved by  
powering much of the internal circuitry from the output. The BIAS pin is the input to the LDO that powers the  
majority of the control circuits. By connecting the BIAS input to the output of the regulator, this current acts as a  
small load on the output. This current is reduced by the ratio of VOUT / VIN, just like any other load.  
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IQ_VIN is defined as the current consumed by a converter using a LMS3655 device while regulating without a  
load. To calculate the theoretical total quiescent current, the below equation can be used with parameters from  
the Electrical Characteristics and System Characteristics tables. While operating without a load, the LMS3655  
only powers itself. The device draws power from three sources: the VIN pin (IQ), the EN pin (IEN), and the BIAS  
pin (IB). Because the BIAS input is connected to the output of the circuit, the power consumed is converted from  
input power with an effective efficiency, ηeff. Here, effective efficiency is the added input power needed when  
lightly loading the converter of the LMS3655 device and is divided by the corresponding additional load. This  
allows unloaded current to be calculated in Equation 2:  
Output Voltage  
IQ_ VIN = IQ +IEN + I +I  
(
)
heff ìInput Voltage  
B
div  
where  
IQ_VIN is the current consumed by the operating (switching) buck converter while unloaded.  
IQ is the current drawn by the LMS3655 from its VIN terminal. See IQ in Electrical Characteristics.  
IEN is current drawn by the LMS3655 from its EN terminal. Include this current if EN is connected to VIN. See  
IEN in Electrical Characteristics. Note that this current drops to a very low value if connected to a voltage less  
than 5 V.  
IB is bias current drawn by the unloaded LMS3655. See IB in System Characteristics.  
Idiv is the current drawn by the feedback voltage divider used to set output voltage.  
ηeff is the light load efficiency of the Buck converter with IQ_VIN removed from the input current of the buck  
converter.  
(2)  
NOTE  
The EN pin consumes a few micro-amperes when tied to high; see IEN. Add IEN to IQ as  
shown in Equation 2 if EN is tied to VIN. If EN is tied to a voltage less than 5 V, virtually no  
current is consumed allowing EN to be used as an UVLO pin once a voltage divider is  
added.  
8.4 Device Functional Modes  
Refer to Table 3 and the following paragraphs for a detailed description of the functional modes for the  
LMS3655.  
These modes are controlled by the FPWM input as listed in Table 3. This input can be controlled by any  
compatible logic while the regulator is operating. If it is desired to fix the mode for a given application, the input  
can be either connected to ground, a logic supply, the VIN pin, or the VCC pin, as desired. The FPWM pin must  
not be allowed to float.  
Table 3. Mode Selection  
FPWM INPUT VOLTAGE  
OPERATING MODE  
Forced PWM: The regulator operates as a constant frequency, current mode, full-  
synchronous converter for all loads; without diode emulation.  
> 1.5 V  
AUTO: The regulator moves between PFM and PWM as the load current changes, using  
diode-emulation mode to allow DCM (see the Glossary).  
< 0.4 V  
8.4.1 AUTO Mode  
In AUTO mode the device moves between PWM and PFM as the load changes. At light loads, the regulator  
operates in PFM. At higher loads, the mode changes to PWM. The load currents at which the mode changes can  
be found in the Application Curves.  
In PWM, the converter operates as a constant frequency, current mode, full synchronous converter using PWM  
to regulate the output voltage. While operating in this mode the output voltage is regulated by switching at a  
constant frequency and modulating the duty cycle to control the power to the load. This provides excellent line  
and load regulation and low output voltage ripple. When in PWM, the converter synchronizes to any valid clock  
signal on the SYNC input (see Synchronizing Input); during PFM operation, the SYNC input is ignored.  
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In PFM, the high-side FET is turned on in a burst of one or more cycles to provide energy to the load. The  
frequency of these bursts is adjusted to regulate the output, while diode emulation is used to maximize efficiency  
(see the Glossary). This mode provides high light-load efficiency by reducing the amount of input supply current  
required to regulate the output voltage at small loads. A small increase in the output voltage occurs in PFM. This  
trades off very good light load efficiency for larger output voltage ripple and variable switching frequency. The  
actual switching frequency and output voltage ripple depend on the input voltage, output voltage, and load. See  
the Application Curves for output voltage variation in AUTO mode. A typical switching waveform for PFM is  
shown in Figure 15.  
A unique feature of this device is that a minimum input voltage is required for the regulator to switch from PWM  
to PFM at light load. This feature is a consequence of the advanced architecture employed to provide high  
efficiency at light loads. Figure 16 indicates typical values of input voltage required to switch modes at no load.  
Also, once the regulator switches to PFM at light load, it remains in that mode if the input voltage is reduced.  
SPACE  
4.2  
Inductor Current:  
250 mA/div  
Light Load Deactivation Threshold (Falling)  
Light Load Activation Threshold (Rising)  
4
3.8  
SW:  
5V/div  
3.6  
3.4  
VOUT:  
5V/div  
3.2  
10 µs/div  
-50  
0
50  
100  
150  
Temperature (èC)  
LMS3  
Figure 15. Typical PFM Switching Waveforms  
Figure 16. Input Voltage for Mode Change — 3.3-V  
Output, 10-µH Inductor  
6
Light Load Deactivation Threshold (Falling)  
Light Load Activation Threshold (Rising)  
5.9  
5.8  
5.7  
5.6  
5.5  
5.4  
5.3  
5.2  
5.1  
5
-50  
0
50  
100  
150  
Temperature (èC)  
LMS3  
Figure 17. Input Voltage for Mode Change — 5-V Output, 10-µH Inductor  
8.4.2 FPWM Mode  
With a logic high on the FPWM input, the device is locked in PWM mode. CCM operation is maintained, even at  
no load, by allowing the inductor current to reverse its normal direction. To prevent frequency foldback behavior  
at low duty cycles, provide a 200-mA load. This mode trades off reduced light load efficiency for low output  
voltage ripple, tight output voltage regulation, and constant switching frequency. In this mode, a negative current  
limit of INEG is imposed to prevent damage to the low-side FET of the regulator. When in PWM, the converter  
synchronizes to any valid clock signal on the SYNC input (see Synchronizing Input).  
When constant frequency operation is more important than light load efficiency, pull the LMS3655 FPWM input  
high or provide a valid synchronization input. Once activated, the diode emulation feature is turned off in this  
mode. This means that the device remains in CCM under light loads. Under conditions where the device must  
reduce the on time or off time below the ensured minimum, the frequency reduces to maintain the effective duty  
cycle required for regulation. This can occur for high input or output voltage ratios.  
With the FPWM pin pulled low (normal mode), the diode emulation feature is activated. Device operation is the  
same as above; however, the regulator goes into DCM operation when the valley of the inductor current reaches  
zero.  
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This feature may be activated and deactivated while the part is regulating without removing the load. This feature  
activates and deactivates gradually preventing perturbation of output voltage. When in FPWM mode, a limited  
reverse current is allowed through the inductor allowing power to pass from the regulator's output to its input. In  
this case, ensure that a large enough input capacitor is used to absorb the reverse current.  
NOTE  
While FPWM is activated, larger currents pass through the inductor than in AUTO mode  
when lightly loaded. This may result in more EMI, though at a predictable frequency. Once  
loads are heavy enough to necessitate CCM operation, FPWM has no measurable effect  
on the operation of the regulator.  
8.4.3 Dropout  
The minimum off time influences the dropout performance of the buck regulator. As the input voltage is reduced,  
to near the output voltage, the off time of the high-side switch starts to approach the minimum value (see  
Electrical Characteristics). Beyond this point the switching may become erratic or the output voltage falls out of  
regulation. To avoid this problem, the LMS3655 automatically reduces the switching frequency to increase the  
effective duty cycle. This results in two specifications regarding dropout voltage, as shown in System  
Characteristics. One specification indicates when the switching frequency drops to 330 kHz. The other  
specification indicates when the output voltage has fallen to 3% of nominal. See the Application Curves for  
typical dropout values. Figure 18 and Figure 19 show the overall dropout characteristic for the 5-V option.  
Additional dropout information is discussed in Application Curves for 5-V output and in Application Curves for  
3.3-V output.  
SPACE  
450000  
400000  
350000  
300000  
250000  
200000  
150000  
100000  
50000  
0
5.2  
0 A  
2 A  
4 A  
5.5 A  
5
4.8  
4.6  
4.4  
4.2  
4
0 A  
2 A  
4 A  
5.5 A  
4
4.5  
5
5.5  
4
4.2 4.4 4.6 4.8  
5
5.2 5.4 5.6 5.8  
6
Input Voltage (V)  
Input Voltage (V)  
LMS3  
LMS3  
Figure 18. Overall Dropout Characteristics  
(VOUT = 5 V)  
Figure 19. Frequency Dropout Characteristics  
(VOUT = 5 V)  
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8.4.4 Spread-Spectrum Operation  
The spread spectrum is a factory option. In order to find which parts have spread spectrum enabled, see Device  
Comparison Table.  
The purpose of the spread spectrum is to eliminate peak emissions at specific frequencies by spreading  
emissions across a wider range of frequencies. In most systems containing the LMS3655 devices, low frequency  
conducted emissions from the first few harmonics of the switching frequency can be easily filtered. A more  
difficult design criterion is reduction of emissions at higher harmonics which fall in the FM band. These harmonics  
often couple to the environment through electric fields around the switch node. The LMS3655 devices use a ±3%  
spread of frequencies which spread energy smoothly across the FM band but is small enough to limit sub-  
harmonic emissions below its switching frequency. Peak emissions at the switching frequency of the part are  
only reduced by slightly less than 1 dB, while peaks in the FM band are typically reduced by more than 6 dB.  
The LMS3655 devices use a cycle-to-cycle frequency hopping method based on a linear feedback shift register  
(LFSR). Intelligent pseudo random generator limits cycle to cycle frequency changes to limit output ripple.  
Pseudo random pattern repeats by approximately 1.2 Hz which is below the audio band.  
The spread spectrum is only available while the clock of the LMS3655 devices is free running at its natural  
frequency. Any of the following conditions overrides spread spectrum, turning it off:  
An external clock is applied to the SYNC/MODE terminal.  
The clock is slowed due to operation at low input voltage; this is operation in dropout.  
The clock is slowed under light load in AUTO mode; this is normally not seen above 200 mA of load. In  
FPWM mode, spread spectrum is active even if there is no load.  
22  
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9 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
9.1 Application Information  
The LMS3655 is a step-down DC-DC converter, typically used to convert a higher DC voltage to a lower DC  
voltage with a maximum output current of 5.5 A. The following design procedures can be used to select  
components for the LMS3655. Alternately, the WEBENCH® Design Tool may be used to generate a complete  
design. This tool uses an iterative design procedure and has access to a comprehensive database of  
components. This allows the tool to create an optimized design and allows the user to experiment with various  
design options.  
9.2 Typical Applications  
9.2.1 General Application  
Figure 20 shows a general application schematic. FPWM, SYNC, and EN are digital inputs. RESET is an open-  
drain output.  
The FPWM pin can be connected to GND to enable light-load PFM operation. Select this option if current  
consumption at light load is critical. The pin can be connected to VCC or VIN for forced 400-kHz operation.  
Select this option if constant switching frequency is critical. The pin can also be driven by an external signal  
and can be toggled while the part is in operation (by an MCU, for example). Refer to the Device Functional  
Modes for more details on the operation and signal requirements of the FPWM pin.  
The SYNC pin can be used to control the switching frequency and the phase of the converter. If the function  
is not needed, tie the SYNC pin to GND, VCC, or VIN.  
The RESET pin can be left floating or tied to ground if the function is not required. If the function is needed,  
the pin must be connected to a DC rail through a pullup resistor (100 kΩ is the typical recommended value).  
Check RESET Flag Output for the details of the RESET pin function.  
Connect the output to the FB pin through a voltage divider. See Detailed Design Procedure for details on  
component selection.  
The BIAS pin can be connected directly to the output voltage. In applications that can experience inductive  
shorts (such as cases with long leads on the output), a 3 Ω or so is necessary between the output and the  
BIAS pin, and a small capacitor to GND is necessary close to the BIAS pin (CBIAS). Alternatively, a Schottky  
diode can be connected between OUT and GND to limit the negative voltage that can arise on the output  
during inductive shorts. In addition, BIAS can also be connected to an external rail if necessary and if  
available. The typical current into the bias pin is 15 mA when the device is operating in PWM mode at 400  
kHz.  
Power components must be chosen carefully for proper operation of the converter. Detailed Design  
Procedure discusses the details of the process of choosing the input capacitors, output capacitors, and  
inductor for the application.  
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Typical Applications (continued)  
VIN  
3.5 V to 36 V  
10 µF  
PVIN 1  
PVIN 2  
10 µF  
10 µF  
PGND1  
PGND2  
RESET  
AVIN  
VCC  
SYNC  
BIAS  
4.7 µF  
LMS3655  
AGND  
0.1 µF  
FB  
NC  
CFF  
RFBB  
RFBT  
FPWM  
CBOOT  
470 nF  
SW  
EN  
L1=10 µH  
VOUT  
3 X 47 µF  
Copyright © 2017, Texas Instruments Incorporated  
Figure 20. General Application Circuit  
9.2.1.1 Design Requirements  
Three sets of application-specific design requirements are outlined in Table 8, Table 9, and Table 10. The  
minimum input voltage shown in Figure 20 is not the minimum operating voltage of the LMS3655. Rather, it is a  
typical operating range for the systems. For the complete information regarding minimum input voltage see  
Electrical Characteristics.  
9.2.1.2 Detailed Design Procedure  
9.2.1.2.1 External Components Selection  
The device requires input capacitors and an output inductor-capacitor filter. These components are critical to the  
performance of the device.  
9.2.1.2.1.1 Input Capacitors  
The input capacitor supplies the AC switching current drawn from the switching action of the internal power  
FETs. The input current of a buck converter is discontinuous, so the ripple current supplied by the input capacitor  
is large. The input capacitor must be rated to handle both the RMS current and the dissipated power.  
The device is designed to be used with ceramic capacitors on the input of the buck regulator. The recommended  
dielectric type of these capacitors is X5R, X7R, or of comparable material to maintain proper tolerances over  
voltage and temperature.  
The device requires a minimum of 20 µF of ceramic capacitance at the input. TI recommends 2 × 10 µF, 10 µF  
for PVIN1 and 10 µF for PVIN2. Place these capacitors close to the PVIN1, PGND1, PVIN2, and the PGND2  
pads. The ceramic input capacitors provide a low impedance source to the regulator in addition to supplying  
ripple current and isolating switching noise from other circuits. Table 4 shows the nominal and minimum values of  
total input capacitance recommended for the LMS3655. Also shown are the measured values of effective  
capacitance for the indicated capacitor.  
24  
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Typical Applications (continued)  
In addition, it is especially important to have small ceramic bypass capacitors of 10 nF to 100 nF very close to  
the PVIN1 and PVIN2 inputs to minimize ringing and EMI generation due to the high-speed switching of the  
device coupled with trace inductance. TI recommends that a small case size 10-nF ceramic capacitor be placed  
across the input, as close to the device as possible. Additional high-frequency capacitors can be used to help  
manage conducted EMI or voltage spike issues that may be encountered.  
Many times it is desirable to use an additional electrolytic capacitor on the input, in parallel with the ceramics.  
This is especially true if long leads or traces are used to connect the input supply to the regulator. The moderate  
ESR of this capacitor can help damp any ringing on the input supply caused by long power leads. The use of this  
additional capacitor also helps with voltage dips caused by input supplies with unusually high impedance.  
Table 4. Recommended Input Capacitors  
NOMINAL INPUT CAPACITANCE  
MINIMUM INPUT CAPACITANCE  
PART NUMBER  
RATED  
CAPACITANCE  
MEASURED  
MEASURED CAPACITANCE(1)  
RATED CAPACITANCE  
CAPACITANCE(1)  
3 × 10 μF  
22.5 μF  
2 × 10 μF  
15 μF  
CL32B106KBJNNNE  
(1) Measured at 14 V and 25°C.  
9.2.1.2.1.2 Output Inductors and Capacitors  
There are several design considerations related to the selection of output inductors and capacitors:  
Load transient response  
Stability  
Efficiency  
Output ripple voltage  
Overcurrent ruggedness  
The device has been optimized for use with LC values as shown in the Figure 20.  
9.2.1.2.1.2.1 Inductor Selection  
The LMS3655 devices run in current mode and with internal compensation. The compensation of the adjustable  
5-V and 3.3-V configurations is stable with inductance between 6.5 µH and 20 µH. For most applications, the  
adjustable 5-V and 3.3-V configurations of the LMS3655 devices are optimized for a nominal inductance of 10  
μH. This gives a ripple current that is approximately 20% to 30% of the full load current of 5.5 A. If applying a  
synchronization clock signal, the designer should appropriately size the inductor for the converter's operating  
switching frequency. For output voltages greater than 5 V, a proportionally larger inductor can be used, thus  
keeping the ratio of inductor current slope to internal compensating slope constant. Inductance that is too high is  
not recommended because it can result in poor load transient behavior and instability.  
The inductor must be rated to handle the peak load current plus the ripple current—carefully review the different  
saturation current ratings specified by different manufacturers. Saturation current ratings are typically specified at  
25°C, so ratings at maximum ambient temperature of the application should be requested from the manufacturer.  
For the LMS3655, TI recommends a saturation current of 10 A or higher. Carefully review the inductor parasitic  
resistance; the inductor parasitic resistance must be as low as possible to minimize losses at heavy loads. The  
best way to obtain an optimum design is to use the Texas Instruments WEBENCH Design Tool.  
Table 5 gives a list of several possible inductors that can be used with the LMS3655.  
The designer should choose the inductors that best match the system requirements. A very wide range of  
inductors are available as regarding physical size, height, maximum current (thermally limited, and inductance  
loss limited), series resistance, maximum operating frequency, losses, and so forth. In general, inductors of  
smaller physical size have higher series resistance (DCR) and implicitly lower overall efficiency is achieved. Very  
low-profile inductors may have even higher series resistance. TI recommends finding the best compromise  
between system performance and cost.  
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Table 5. Recommended Inductors  
MANUFACTURER  
Würth  
PART NUMBER  
SATURATION CURRENT  
DC RESISTANCE  
16 mΩ  
7443251000  
7447709100  
8.5 A  
10.5 A  
12 A  
Würth  
21 mΩ  
Vishay  
IHLP4040DZER100M01  
36.5 mΩ  
9.2.1.2.1.2.2 Output Capacitor Selection  
The output capacitor of a switching converter absorbs the AC ripple current from the inductor, reduces the output  
voltage ripple, and provides the initial response to a load transient. The ripple voltage at the output of the  
converter is the product of the ripple current flowing through the output capacitor and the impedance of the  
capacitor. The impedance of the capacitor can be dominated by capacitive, resistive, or inductive elements within  
the capacitor, depending on the frequency of the ripple current. Ceramic capacitors have very low ESR and  
remain capacitive up to high frequencies. Their inductive component can be usually neglected at the operating  
frequency range of the converter.  
The LMS3655 is designed to work with low-ESR ceramic capacitors. TI recommends X5R and X7R type  
capacitors. The effective value of these capacitors is defined as the actual capacitance under voltage bias and  
temperature. All ceramic capacitors have a large voltage coefficient, in addition to normal tolerances and  
temperature coefficients. Under DC bias, the capacitance value drops considerably. Larger case sizes or higher  
voltage capacitors are better in this regard. To help mitigate these effects, multiple small capacitors can be used  
in parallel to bring the minimum effective capacitance up to the desired value. This can also ease the RMS  
current requirements on a single capacitor. Table 6 shows the nominal and minimum values of total output  
ceramic capacitance recommended for the LMS3655.The values shown also provide a starting point for other  
output voltages. More output capacitance can be used to improve transient performance and reduce output  
voltage ripple.  
In order to minimize ceramic capacitance, a low-ESR electrolytic capacitor can be used in parallel with minimal  
ceramic capacitance. As a starting point for designing with an output electrolytic capacitor, Table 7 shows the  
minimum ceramic capacitance recommended when paired with a 120-µF Aluminum-polymer (ESR = 25 mΩ) in  
order to maintain stable operation. Depending on load transient design requirements, the designer may choose  
to add additional capacitance.  
In practice, the output capacitor has the most influence on the transient response and loop phase margin. Load  
transient testing and bode plots are the best way to validate any given design and should always be completed  
before the application goes into production. Make a careful study of temperature and bias voltage variation of any  
candidate ceramic capacitor in order to ensure that the minimum value of effective capacitance is provided. The  
best way to obtain an optimum design is to use the Texas Instruments WEBENCH Design Tool.  
In adjustable applications the feed-forward capacitor, CFF, provides another degree of freedom when stabilizing  
and optimizing the design. Refer to Optimizing Transient Response of Internally Compensated DC-DC  
Converters With Feedforward Capacitor (SLVA289) for helpful information when adjusting the feed-forward  
capacitor.  
In addition to the capacitance shown in Table 6, a small ceramic capacitor placed on the output can help to  
reduce high frequency noise. Small case-size ceramic capacitors in the range of 1 nF to 100 nF can be very  
helpful in reducing spikes on the output caused by inductor parasitics.  
Limit the maximum value of total output capacitance to between 800 μF and 1200 μF. Large values of output  
capacitance can prevent the regulator from starting up correctly and adversely effect the loop stability. If values  
greater than the given range are to be used, then a careful study of start-up at full load and loop stability must be  
performed.  
(1)  
Table 6. Recommended Output Ceramic Capacitors  
NOMINAL OUTPUT CERAMIC  
CAPACITANCE  
MINIMUM OUTPUT CERAMIC  
CAPACITANCE  
OUTPUT VOLTAGE  
PART NUMBER  
RATED CAPACITANCE  
4 × 47 µF  
RATED CAPACITANCE  
3 x 47µF  
3.3 V  
5 V  
GRM32ER71A476KE15L  
GRM32ER71A476KE15L  
4 × 47 µF  
3 × 47µF  
(1) L = 10 μH  
26  
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Table 6. Recommended Output Ceramic Capacitors () (continued)  
NOMINAL OUTPUT CERAMIC  
CAPACITANCE  
MINIMUM OUTPUT CERAMIC  
CAPACITANCE  
RATED CAPACITANCE  
3 × 47μF  
OUTPUT VOLTAGE  
PART NUMBER  
RATED CAPACITANCE  
4× 47 μF  
6 V  
10 V(2)  
GRM32ER71A476KE15L  
GRM32ER71A476KE15L  
4 × 47 μF  
3 × 47 μF  
(2) L = 20 μH  
(1)  
Table 7. Recommended Output Al-Polymer and Ceramic Capacitors  
MINIMUM OUTPUT CERAMIC  
OUTPUT AL-POLYMER CAPACITANCE  
CAPACITANCE  
RATED CAPACITANCE  
1 × 47µF + 1 x 20µF  
1 × 47µF  
OUTPUT VOLTAGE  
PART NUMBER  
RATED CAPACITANCE  
120 µF  
3.3 V  
5 V  
APXE160ARA121MH70G  
APXE160ARA121MH70G  
120 µF  
(1) L = 10 μH  
Consult Output Ripple Voltage for Buck Switching Regulator (SLVA630) for more details on the estimation of the  
output voltage ripple for this converter.  
9.2.1.2.2 FB for Adjustable Output  
The LMS3655 devices regulate output voltage to a level that results in the FB node being VREF, which is  
approximately 1 V (see Electrical Characteristics). Output voltage given a specific feedback divider can be  
calculated using Equation 3:  
RFBB + RFBT  
Output Voltage = Vref  
ì
RFBB  
(3)  
To ensure proper behavior for all modes of operation, a 50-kΩ resistor is recommended for RFBT. RFBB can then  
be determined using Equation 4:  
V
ìRFBT  
ref  
RFBB  
=
Output Voltage - V  
ref  
(4)  
In addition, a feed-forward capacitor CFF may be required to optimize the transient response. For output voltages  
greater than 6 V, the WEBENCH Design Tool can be used to optimize the design.  
9.2.1.2.3 VCC  
The VCC pin is the output of the internal LDO used to supply the control circuits of the LMS3655. This output  
requires a 4.7-µF, 10-V ceramic capacitor connected from VCC to GND for proper operation. X7R type is  
recommended. In general, this output must not be loaded with any external circuitry. However, the output can be  
used to supply a logic level to the FPWM input or for the pullup resistor used with the RESET output. The  
nominal output of the LDO is 3.15 V.  
9.2.1.2.4 BIAS  
The BIAS pin is the input to the internal LDO. As detailed in Input Supply Current, this input is connected directly  
to VOUT to provide the lowest possible supply current at light loads. Because this input is connected directly to the  
output, it must be protected from negative voltage transients. Such transients may occur when the output is  
shorted at the end of a long PCB trace or cable. If this is likely in a given application, then place a small resistor  
in series between the BIAS input and VOUT as shown in Figure 23.  
Size the resistor to limit the current out of the BIAS pin to < 100 mA. Values in the range of 2 Ω to 5 Ω are  
typically sufficient. Values greater than 5 Ω are not recommended. As a rough estimate, assume that the full  
negative transient appears across RBIAS and design for a current of < 100 mA. In severe cases, a Schottky diode  
can be placed in parallel with the output to limit the transient voltage and current.  
When a resistor is used between the output and the BIAS pin, a 0.1-µF capacitor is required close to the BIAS  
pin. In general, TI recommends having a 0.1-µF capacitor near the BIAS pin, regardless of the presence of the  
resistor, unless the trace between the output capacitors and the BIAS pin is very short.  
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The typical current into the bias pin is 15 mA when the device is operating in PWM mode at 400 kHz.  
9.2.1.2.5 CBOOT  
The LMS3655 requires a boot-strap capacitor between the CBOOT pin and the SW pin. This capacitor stores  
energy that is used to supply the gate drivers for the power MOSFETs. A ceramic capacitor of 0.47 µF, 6.3 V is  
required.  
9.2.1.2.6 Maximum Ambient Temperature  
As with any power conversion device, the LMS3655 dissipates internal power while operating. The effect of this  
power dissipation is to raise the internal temperature of the converter above ambient. The internal die  
temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance,  
RθJA of the device and PCB combination. The maximum internal die temperature for the LMS3655 is 150°C, thus  
establishing a limit on the maximum device power dissipation and therefore load current at high ambient  
temperatures. Equation 5 shows the relationships between the important parameters.  
(
TJ - TA  
RqJA  
)
h
1- h  
1
IOUT  
=
(
)
VOUT  
(5)  
The device uses an advanced package technology that uses the pads and pins as heat spreading paths. As a  
result, the pads must be connected to large copper areas to dissipate the heat from the IC. All pins provide some  
heat relief capability but the PVINs, PGNDs, and SW pins are of particular importance for proper heat dissipation.  
Utilization of all the board layers for heat dissipation and using vias as heat pipes is recommended. The Layout  
Guidelines includes an example that shows layout for proper heat management.  
28  
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9.2.1.3 Application Curves  
These parameters are not tested and represent typical performance only. Unless otherwise stated, the following  
conditions apply: VIN = 12 V, TA = 25°C. For the purpose of offering more information to the designer, information  
for the application with FPWM pin high (FPWM mode) and FPWM pin low (AUTO mode) is included, although  
the schematic shows the application running specifically in FPWM mode. The mode is specified under each  
following graph.  
3.5  
3
3.5  
3
8.0 VIN  
4.0 VIN  
6.0 VIN  
12.0 VIN  
13.5 VIN  
24.0 VIN  
36.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Output Current (A)  
Output Current (A)  
LMS3  
LMS3  
Figure 21. Power Dissipation 5-V Output  
Figure 22. Power Dissipation 3.3-V Output  
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9.2.2 Adjustable 5-V Output  
VIN  
5.5 V œ 36 V  
PVIN 1  
10 µF  
PVIN 2  
10 µF  
PGND1  
0.1 µF  
PGND2  
RESET  
0.1 µF  
RESET/PG OUT  
AVIN  
100 kΩ  
VCC  
NC  
4.7 µF  
LMS3655  
BIAS  
AGND  
3 Ω  
0.1 µF  
FPWM  
EN  
FB  
22 pF  
21.7 kΩ  
470 nF  
49.9 kΩ  
CBOOT  
VOUT = 5 V  
SYNC IN  
SYNC  
SW  
L1 = 10 µF  
1 X 47 µF  
100 kΩ  
1 X 120 µF  
ESR = 25 mΩ  
Copyright © 2017, Texas Instruments Incorporated  
Figure 23. 5-V, 5.5-A Output Power Supply  
9.2.2.1 Design Requirements  
Example requirements for a typical 5-V application. The input voltages are here for illustration purposes only.  
See Electrical Characteristics for minimum operating input voltage. The minimum input voltage necessary to  
achieve proper output regulation depends on the components used. See Figure 29 for typical drop-out behavior.  
Table 8. Example Requirements for 5-V Typical Application  
DESIGN PARAMETER  
Input voltage range  
EXAMPLE VALUE  
8 V to 18 V steady-state, 5.5 V to 36 V transients  
0 A to 5.5 A  
Output current  
Switching Frequency at 0-A load  
Current Consumption at 0-A load  
Synchronization  
Critical: must have > 250 kHz  
Not critical: < 100 mA acceptable  
Yes: 300 kHz supplied by MCU  
9.2.2.2 Detailed Design Procedure  
BIAS is connected to the output. This example assumes that the load is connected to the output through long  
wires so a 3-Ω resistor is inserted to minimize risks of damage to the part during load shorts. In addition 0.1-  
µF capacitor is required close to the bias pin.  
FB is connected to the output through a voltage divider in order to create a voltage of 1 V at the FB pin when  
the output is at 5 V. A 22-pF capacitance is added in parallel with the top feedback resistor in order to  
improve transient behavior. BIAS and FB are connected to the output through separate traces. This is  
important to reduce noise and achieve good performance. See Layout Guidelines for more details on the  
proper layout method.  
SYNC is connected to ground through a pulldown resistor, and an external synchronization signal can be  
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applied. The pulldown resistor ensures that the pin is not floating when the SYNC pin is not driven by any  
source.  
EN is connected to VIN so the device operates as soon as the input voltage rises above the VIN-OPERATE  
threshold.  
FPWM is connected to VIN. This causes the device to operate in FPWM mode. In this mode, the device  
remains in CCM operation regardless of the output current and is ensured to be within the boundaries set by  
FSW. To prevent frequency foldback behavior at low duty cycles, provide a 200-mA load. The drawback is that  
the efficiency is not optimized for light loads. See Device Functional Modes for more details.  
A 4.7-µF capacitor is connected between VCC and GND close to the VCC pin. This ensures stable operation  
of the internal LDO.  
RESET is biased to the output in this example. A pullup resistor is necessary. A 100-kΩ is selected for this  
application and is generally sufficient. The value can be selected to match the needs of the application but  
must not lead to excessive current into the RESET pin when RESET is in a low state. Consult Absolute  
Maximum Ratings for the maximum current allowed. In addition, a low pullup resistor could lead to an  
incorrect logic level due to the value of RRESET. Consult Electrical Characteristics for details on the RESET  
pin.  
Input capacitor selection is detailed in Input Capacitors. It is important to connect small high-frequency  
capacitors CIN_HF1 and CIN_HF2 as close to both inputs PVIN1 and PVIN2 as possible.  
Output capacitor selection is detailed in Output Capacitor Selection.  
Inductor selection is detailed in Inductor Selection. In general, a 10-µH inductor is recommended for the  
nominal adjustable output range of 3.3 V to 5 V. The inductance can vary with the output voltage due to ripple  
and current limit requirements.  
9.2.2.3 Application Curves  
The following characteristics apply only to the circuit of Adjustable 5-V Output. These parameters are not tested  
and represent typical performance only. Unless otherwise stated, the following conditions apply: VIN = 12 V, TA =  
25°C. For the purpose of offering more information to the designer, information for the application with FPWM pin  
high (FPWM mode) and FPWM pin low (AUTO mode) is included, although the schematic shows the application  
running specifically in FPWM mode. The mode is specified under each following graph.  
100%  
95%  
90%  
85%  
80%  
75%  
70%  
65%  
60%  
100%  
95%  
90%  
85%  
80%  
75%  
70%  
65%  
60%  
55%  
50%  
8.0 VIN  
8.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
0.001  
0.01  
0.1  
1
10  
0
1
2
3
4
5
6
Output Current (A)  
Output Current (A)  
LMS3  
LMS3  
VOUT = 5 V  
AUTO  
VOUT = 5 V  
FPWM  
Figure 24. Efficiency  
Figure 25. Efficiency  
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5.12  
5.11  
5.1  
5.05  
5.03  
5.01  
4.99  
4.97  
4.95  
8.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
5.09  
5.08  
5.07  
5.06  
5.05  
5.04  
5.03  
5.02  
5.01  
8.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
1
2
3
4
5
6
Output Current (A)  
Output Current (A)  
LMS3  
LMS3  
VOUT = 5 V  
AUTO  
VOUT = 5 V  
FPWM  
Figure 26. Load and Line Regulation  
Figure 27. Load and Line Regulation  
1.2  
1
1000  
-40èC  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
25èC  
105èC  
0.8  
0.6  
0.4  
0.2  
0
0
1
2
3
4
5
6
0
10  
20  
30  
40  
Output Current (A)  
Input Voltage (V)  
LMS3  
LMS3  
VOUT = 5 V  
VOUT = 5 V  
Figure 29. Dropout for –3% Regulation  
Figure 28. Load Current for PFM-to-PWM Transition  
450000  
400000  
350000  
300000  
250000  
200000  
150000  
100000  
50000  
0
1.2  
1
-40èC  
25èC  
105èC  
0.8  
0.6  
0.4  
0.2  
0
8 VIN  
12 VIN  
18 VIN  
24 VIN  
0.001  
0.01  
0.1  
1
10  
0
1
2
3
4
5
6
Output Current (A)  
LMS3  
Output Current (A)  
LMS3  
VOUT = 5 V  
AUTO  
VOUT = 5 V  
Figure 31. Switching Frequency vs Load Current  
Figure 30. Dropout for 330 kHz  
32  
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9
8
7
6
5
4
3
2
1
0
LMS3655  
40  
0
5
10  
15  
20  
25  
30  
35  
45  
AUTO  
VOUT = 5 V  
L = 10 µH  
Input Voltage (V)  
LMS3  
COUT = 170 µF  
IOUT = 10 mA to 3.5 A  
TR = TF = 1 µs  
VOUT = 5 V  
L = 10 µH  
Figure 33. Load Transients  
Figure 32. Output Current Level Limit Before Overcurrent  
Protection  
FPWM  
VOUT = 5 V  
IOUT = 0 A to 3.5 A  
L = 10 µH  
COUT = 170 µF  
TR = TF = 1 µs  
Figure 34. Load Transient  
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9.2.3 Adjustable 3.3-V Output  
VIN  
3.8 V to 36 V  
VDD  
PVIN 1  
10 µF  
PVIN 2  
PGND2  
RESET  
10 µF  
100 kΩ  
RESET/PG OUT  
PGND1  
0.1 µF  
0.1 µF  
AVIN  
VCC  
NC  
4.7 µF  
LMS3655  
BIAS  
AGND  
0.1 µF  
FPWM  
EN  
FB  
22 pF  
21.7 kΩ  
49.9 kΩ  
CBOOT  
470 nF  
VOUT = 3.3 V  
SW  
SYNC  
L1 = 10 µH  
1 X 67 µF  
1 X 120 µF  
ESR = 25 mΩ  
Copyright © 2017, Texas Instruments Incorporated  
Figure 35. Adjustable 3.3-V, 5.5-A Output Power Supply  
9.2.3.1 Design Requirements  
Example requirements for a typical 3.3-V application. The input voltages are here for illustration purposes only.  
See Electrical Characteristics for minimum operating input voltage. The minimum input voltage necessary to  
achieve proper output regulation depends on the components used. See Figure 41 for typical drop-out behavior.  
Table 9. Example Requirements for 3.3-V Application  
DESIGN PARAMETER  
Input voltage range  
EXAMPLE VALUE  
8-V to 18-V steady-state, 4.0-V to 36-V transients  
0 A to 5.5 A  
Output current  
Switching Frequency at 0-A load  
Current Consumption at 0-A load  
Synchronization  
Not critical: Need >330 kHz at high load only  
Critical: Need to ensure low current consumption to reduce battery drain  
No  
9.2.3.2 Detailed Design Procedure  
BIAS is connected to the output. This example assumes that the load is close to the output so no bias  
resistance is necessary. A 0.1-µF capacitor is still recommended close to the bias pin.  
FB is connected to the output through a voltage divider in order to create a voltage of 1 V at the FB pin when  
the output is at 3.3 V. A 22-pF capacitance is added in parallel with the top feedback resistor in order to  
improve transient behavior. BIAS and FB are connected to the output through separate traces. This is  
important to reduce noise and achieve good performance. See Layout Guidelines for more details on the  
proper layout method.  
SYNC is connected to ground directly as there is no need for this function in this application.  
EN is connected to VIN so the device operates as soon as the input voltage rises above the VIN-OPERATE  
threshold.  
34  
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FPWM is connected to GND. This causes the device to operate in AUTO mode. In this mode, the switching  
frequency is adjusted at light loads to optimize efficiency. As a result the switching frequency changes with  
the output current until medium load is reached. The part will then switch at the frequency defined by FSW  
.
See Device Functional Modes for more details.  
A 4.7-µF capacitor is connected between VCC and GND close to the VCC pin. This ensures stable operation  
of the internal LDO.  
RESET is biased to an external rail in this example. A pullup resistor is necessary. A 100-kΩ pullup resistor is  
selected for this application and is generally sufficient. The value can be selected to match the needs of the  
application but must not lead to excessive current into the RESET pin when RESET is in a low state. Consult  
Absolute Maximum Ratings for the maximum current allowed. In addition, a low pullup resistor could lead to  
an incorrect logic level due to the value of RRESET. Consult Electrical Characteristics for details on the RESET  
pin.  
It is important to connect small high frequency capacitors CIN_HF1 and CIN_HF2 as close to both inputs PVIN1  
and PVIN2 as possible. For the detailed process of choosing input capacitors, refer to Input Capacitors.  
Output capacitor selection is detailed in Output Capacitor Selection.  
Inductor selection is detailed in Inductor Selection. In general, a 10-µH inductor is recommended for the  
nominal adjustable output range of 3.3 V to 5 V. The inductance can vary with the output voltage due to ripple  
and current limit requirements.  
9.2.3.3 Application Curves  
The following characteristics apply only to the circuit of Figure 35. These parameters are not tested and  
represent typical performance only. Unless otherwise stated, the following conditions apply: VIN = 12 V, TA  
=
25°C. For the purpose of offering more information to the designer, information for the application with FPWM pin  
high (FPWM mode) and FPWM pin low (AUTO mode) is included, although the schematic shows the application  
running specifically in AUTO mode. The mode is specified under each of the following graphs.  
100%  
95%  
90%  
85%  
80%  
75%  
70%  
65%  
60%  
55%  
50%  
45%  
40%  
35%  
30%  
25%  
20%  
1.1  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
6.0 VIN  
6.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
0.1  
0.0001  
0.0001  
0.001  
0.01  
0.1  
1
10  
1.0001  
2.0001  
Output Current (A)  
3.0001  
4.0001  
5.0001  
Output Current (A)  
LMS3  
LMS3  
VOUT = 3.3 V  
AUTO  
VOUT = 3.3 V  
FPWM  
Figure 36. Efficiency  
Figure 37. Efficiency  
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3.4  
3.38  
3.36  
3.34  
3.32  
3.3  
3.4  
3.38  
3.36  
3.34  
3.32  
3.3  
6.0 VIN  
6.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
12.0 VIN  
13.5 VIN  
18.0 VIN  
24.0 VIN  
36.0 VIN  
3.28  
3.26  
3.24  
3.22  
3.2  
3.28  
3.26  
3.24  
3.22  
3.2  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
1
2
3
4
5
6
Output Current (A)  
Output Current (A)  
LMS3  
LMS3  
VOUT = 3.3 V  
AUTO  
VOUT = 3.3 V  
FPWM  
Figure 38. Load and Line Regulation  
Figure 39. Load and Line Regulation  
1.2  
1
1400  
1200  
1000  
800  
600  
400  
200  
0
-40èC  
25èC  
105èC  
0.8  
0.6  
0.4  
0.2  
0
0
1
2
3
4
5
6
0
5
10  
15  
20  
25  
30  
35  
40  
Output Current (A)  
Input Voltage (V)  
LMS3  
LMS3  
VOUT = 3.3 V  
VOUT = 3.3 V  
Figure 41. Dropout for –3% Regulation  
Figure 40. Load Current for PFM-to-PWM Transition  
450000  
400000  
350000  
300000  
250000  
200000  
150000  
100000  
50000  
0
1.2  
1
-40èC  
25èC  
105èC  
0.8  
0.6  
0.4  
0.2  
0
8 VIN  
12 VIN  
18 VIN  
24 VIN  
0.001  
0.01  
0.1  
1
10  
0
1
2
3
4
5
6
Output Current (A)  
Output Current (A)  
LMS3  
LMS3  
VOUT = 3.3 V  
AUTO  
VOUT = 3.3 V  
Figure 42. Dropout for 330 kHz  
Figure 43. Switching Frequency vs Load Current  
36  
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9
8
7
6
5
4
3
2
1
LMS3655  
40  
0
0
5
10  
15  
20  
25  
30  
35  
45  
Input Voltage (V)  
AUTO  
VOUT = 3.3 V  
L = 10 µH,  
LMS3  
VOUT = 3.3 V  
L = 10 µH  
COUT = 190 µF  
IOUT = 0 A to 3.5 A  
TR = TF = 1 µs  
Figure 44. Output Current Level for Overcurrent Protection  
Trip  
Figure 45. Load Transient  
FPWM  
VOUT = 3.3 V  
L = 10 µH,  
VOUT = 3.3 V  
IOUT = 10 mA  
COUT = 190 µF  
IOUT = 0 A to 3.5 A  
TR = TF = 1 µs  
Figure 47. Mode Change Transient AUTO to FPWM mode  
Figure 46. Load Transient  
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9.2.4 6-V Adjustable Output  
VIN  
8 V œ 36 V  
PVIN 1  
PVIN 2  
10 µF  
10 µF  
PGND1  
AVIN  
PGND2  
RESET  
0.1 µF  
0.1 µF  
VCC  
NC  
4.7 µF  
LMS3655  
BIAS  
AGND  
3Ω  
0.1 µF  
FB  
FPWM  
EN  
22 pF  
10.2 kΩ  
49.9 kΩ  
CBOOT  
470 nF  
VOUT = 6 V  
SW  
SYNC  
L1 = 10 µH  
1 X 67 µF  
1 X 120 µF  
ESR = 25 mΩ  
Copyright © 2017, Texas Instruments Incorporated  
Figure 48. 6-V Output Power Supply  
9.2.4.1 Design Requirements  
The application highlighted in this section is for a typical 6-V system. The input voltages are here for illustration  
purposes only. See Electrical Characteristics for minimum operating input voltage.  
Table 10. Example Requirements for 6-V Application  
DESIGN PARAMETER  
Input voltage range  
EXAMPLE VALUE  
8-V to 18-V steady-state  
0 A to 5.5 A  
Output current  
Switching Frequency at 0-A load  
Current Consumption at 0-A load  
Synchronization  
> 250 kHz preferred  
Not critical  
No  
9.2.4.2 Detailed Design Procedure  
BIAS is connected to the output. This example assumes that inductive shorts are a risk for this application so  
a 3-Ω resistor is added between BIAS and the output. A 0.1-µF capacitor is added close to the BIAS pin.  
FB is connected to the output through a voltage divider in order to create a voltage of 1 V at the FB pin when  
the output is at 6 V. A 22-pF capacitance is added in parallel with the top feedback resistor in order to  
improve transient behavior. BIAS and FB are connected to the output through separate traces. This is  
important to reduce noise and achieve good performances. See Layout Guidelines for more details on the  
proper layout method.  
SYNC is connected to ground directly as there is no need for this function in this application.  
EN is toggled by an external device (like an MCU for example). A pulldown resistor is placed to ensure the  
part does not turn on if the external source is not driving the pin (Hi-Z condition).  
FPWM is connected to VIN. This causes the device to operate in FPWM mode. To prevent frequency  
foldback behavior at low duty cycles, provide a 200mA load. In this mode, the device remains in CCM  
operation regardless of the output current and is ensured to be within the boundaries set by FSW. The  
drawback is that the efficiency is not optimized for light loads. See Device Functional Modes for more details.  
A 4.7-µF capacitor is connected between VCC and GND close to the VCC pin. This ensure stable operation  
of the internal LDO.  
RESET is not used in this example so the pin has been left floating. Other possible connections can be seen  
38  
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in the previous typical applications and in RESET Flag Output.  
Power components (input capacitor, output capacitor, and inductor) selection can be found here in External  
Components Selection.  
9.2.4.3 Application Curves  
The following characteristics apply only to the circuit of Figure 48. These parameters are not tested and  
represent typical performance only. Unless otherwise stated, the following conditions apply: VIN = 12 V, TA  
=
25°C.  
VOUT = 6 V  
FPWM  
IOUT = 0 A  
VOUT = 6 V  
FPWM  
IOUT = 0 A  
Figure 50. Start-Up Waveform (EN Tied to VIN)  
Figure 49. Start-Up Waveform  
FPWM  
VOUT = 6 V  
IOUT = 0 A to 3.5 A  
L = 10 µH,  
COUT = 190 µF  
TR = TF = 1 µs  
Figure 51. Load Transient  
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9.3 Do's and Don't's  
Don't: Exceed the Absolute Maximum Ratings.  
Don't: Exceed the Recommended Operating Conditions.  
Don't: Allow the EN, FPWM or SYNC input to float.  
Don't: Allow the output voltage to exceed the input voltage, nor go below ground.  
Don't: Use the thermal data given in the Thermal Information table to design your application.  
Do: Follow all of the guidelines and/or suggestions found in this data sheet before committing a design to  
production. TI Application Engineers are ready to help critique designs and PCB layouts to help ensure  
successful projects.  
Do: Refer to the helpful documents found in 相关文档.  
10 Power Supply Recommendations  
The characteristics of the input supply must be compatible with the Absolute Maximum Ratings and  
Recommended Operating Conditions found in this data sheet. In addition, the input supply must be capable of  
delivering the required input current to the loaded regulator. The average input current can be estimated with  
Equation 6:  
VOUT IOUT  
IIN =  
V ∂ h  
IN  
where  
η is the efficiency  
(6)  
If the regulator is connected to the input supply through long wires or PCB traces, special care is required to  
achieve good performance. The parasitic inductance and resistance of the input cables can have an adverse  
effect on the operation of the regulator. The parasitic inductance, in combination with the low-ESR ceramic input  
capacitors, can form an under-damped resonant circuit. This circuit may cause overvoltage transients at the VIN  
pin, each time the input supply is cycled on and off. The parasitic resistance causes the voltage at the VIN pin to  
dip when the load on the regulator is switched on or exhibits a transient. If the regulator is operating close to the  
minimum input voltage, this dip may cause the device to shut down or reset. The best way to solve these kinds  
of issues is to reduce the distance from the input supply to the regulator or use an aluminum or tantalum input  
capacitor in parallel with the ceramics. The moderate ESR of these types of capacitors helps to damp the input  
resonant circuit and reduce any voltage overshoots. A value in the range of 20 µF to 100 µF is usually sufficient  
to provide input damping and help to hold the input voltage steady during large load transients.  
Sometimes, for other system considerations, an input filter is used in front of the regulator. This can lead to  
instability, as well as some of the effects mentioned above, unless it is designed carefully. LP3913 Power  
Management IC for Flash Memory Based Portable Media Players (SNVA489) provides helpful suggestions when  
designing an input filter for any switching regulator.  
In some cases a transient voltage suppressor (TVS) is used on the input of regulators. One class of this device  
has a snap-back V-I characteristic (thyristor type). The use of a device with this type of characteristic is not  
recommend. When the TVS fires, the clamping voltage drops to a very low value. If this holding voltage is less  
than the output voltage of the regulator, the output capacitors are discharged through the regulator back to the  
input. This uncontrolled current flow could damage the regulator.  
11 Layout  
11.1 Layout Guidelines  
The PCB layout of a DC-DC converter is critical for optimal performance of the application. For a buck converter  
the input loop formed by the input capacitors and power grounds are very critical. The input loop carries fast  
transient currents that cause larger transient voltages when reacting with a parasitic loop inductance. The IC  
uses two input loops in parallel IN1 and IN2 as shown in Figure 52 that cuts the parasitic input inductance in half.  
To get the minimum input loop area two small high frequency capacitors CIN1 and CIN2 are placed as close as  
possible.  
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Layout Guidelines (continued)  
To further reduce inductance, an input current return path should be placed underneath the loops IN1 and IN2.  
The closest metal plane is MID1 Layer2, and there is a solid copper plane placed right under the IN1 and IN2  
loop the parasitic loop inductance is minimized. Connecting this MID1 Layer2 plane to GND provides a nice  
bridge connection between GND1 and GND2 as well. Minimizing the parasitic input loop inductance will minimize  
switch node ringing and EMI.  
The output current loop can be optimized as well by using two ceramic output caps COUT1 and COUT2, one on  
each side. They form two parallel ground return paths OUT1 from COUT1 back to the low-side FET PGND1 pins  
5, 6, 7, 8, and a second symmetric ground return path OUT2 from COUT2 back to low-side FET PGND2 pins 10,  
11, 12, and 13. Having two parallel ground return paths yield reduced ground bouncing and reduced sensitivity of  
surrounding circuits.  
Figure 52. Layout of the Power Components and Current Flow  
Providing adequate thermal paths to dissipate heat is critical for operation at full current. The recommended  
method for heat dissipation is to use large solid 2-oz copper planes well connected to the power pins VIN1, VIN2,  
GND1, and GND2 which transfer the heat out of the IC over the TOP Layer1 copper planes. It is important to  
leave the TOP Layer1 copper planes as unbroken as possible so that heat is not trapped near the IC. The heat  
flow can be further optimized by thermally connecting the TOP Layer1 plane to large BOTTOM Layer 4 2-oz  
copper planes with vias. MID2 Layer3 is then open for all other signal routing. A fully filled or solid BOTTOM  
Layer4 ground plane without any interruptions or ground splitting is beneficial for EMI as well. Most important for  
low EMI is to use the smallest possible switch node copper area. The switch node including the CBOOT cap has  
the largest dV/dt signal causing common-mode noise coupling. Using any kind of grounded shield around the  
switch node shortens and reduces this e-field.  
All these DC-DC converter descriptions can be transformed into layout guidelines:  
1. Place two 0.047-µF, 50-V high frequency input capacitors CIN1 and CIN2 as close as possible to the VIN1,  
VIN2, PGND1, PGND2 pins to minimize switch node ringing.  
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Layout Guidelines (continued)  
2. Place bypass capacitors for VCC and BIAS close to their respective pins. Make sure AGND pin sees the  
CVCC and CBIAS capacitors first before a connection to PGND.  
3. Place CBOOT capacitor with smallest parasitic loop. Shielding the CBOOT capacitor and switch node has the  
biggest impact to reduce common-mode noise. Placing a small RBOOT resistor (less than 3 Ω is  
recommended) in series to CBOOT slows down the dV/dt of the switch node and reduce EMI.  
4. Place the feedback resistor divider as close as possible to the FB pin and to AGND pin of the device. Use a  
dedicated feedback trace, and route away from switch node and CBOOT capacitor to avoid any cross coupling  
into sensitive analog feedback.  
5. Use a dedicated BIAS trace to avoid noise into feedback trace.  
6. Use a 3-Ω to 5-Ω resistor between the output and BIAS if the load is far from the output of the converter or  
inductive shorts on the output are possible.  
7. Use well connected large 2-oz. TOP and BOTTOM copper planes for all power pins VIN1/2 and PGND1/2.  
8. Minimize switch node and CBOOT area for lowest EMI common mode noise.  
9. Place input and output wires on the same side of the PCB using an EMI filter and away from the switch node  
for lowest EMI.  
The resources in 器件和文档支持 provide additional important guidelines.  
11.2 Layout Example  
This example layout is the one used in the LMS3655 EVM. It shows the CIN and CIN_HF capacitors placed  
symmetrically on either side of the device.  
Figure 53. Recommended Layout for LMS3655  
42  
版权 © 2017–2018, Texas Instruments Incorporated  
LMS3655  
www.ti.com.cn  
ZHCSGY9B JULY 2017REVISED MARCH 2018  
12 器件和文档支持  
12.1 器件支持  
12.1.1 第三方产品免责声明  
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类  
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。  
12.2 文档支持  
12.2.1 相关文档  
更多信息,请参见以下文档:  
《采用前馈电容器优化内部补偿直流/直流转换器的瞬态响应》(SLVA289)  
《降压开关稳压器的输出纹波电压》(SLVA630)  
AN-1149 开关电源布局指南》(SNVA021)  
AN-1229 Simple Switcher® PCB 布局指南》(SNVA054)  
《构建电源 - 布局注意事项》(SLUP230)  
AN-2020 热设计:学会洞察先机,不做事后诸葛》(SNVA419)  
《半导体和 IC 封装热指标》(SPRA953)  
12.3 接收文档更新通知  
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产  
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。  
12.4 社区资源  
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商按照原样提供。这些内容并不构成 TI 技术规范,  
并且不一定反映 TI 的观点;请参阅 TI 《使用条款》。  
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在  
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。  
设计支持  
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。  
12.5 商标  
HotRod, E2E are trademarks of Texas Instruments.  
WEBENCH is a registered trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
12.6 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
12.7 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
13 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,也  
不会对此文档进行修订。如欲获取此数据表的浏览器版本,请参阅左侧的导航。  
版权 © 2017–2018, Texas Instruments Incorporated  
43  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-May-2023  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
LMS3655AMRNLR  
LMS3655AMRNLT  
LMS3655MMRNLR  
LMS3655MMRNLT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
VQFN-HR  
VQFN-HR  
VQFN-HR  
VQFN-HR  
RNL  
RNL  
RNL  
RNL  
22  
22  
22  
22  
3000 RoHS & Green  
250 RoHS & Green  
3000 RoHS & Green  
250 RoHS & Green  
SN  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
LM3655A  
Samples  
Samples  
Samples  
Samples  
SN  
SN  
SN  
LM3655A  
LM3655M  
LM3655M  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-May-2023  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF LMS3655 :  
Automotive : LMS3655-Q1  
NOTE: Qualified Version Definitions:  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Addendum-Page 2  
GENERIC PACKAGE VIEW  
RNL 22  
5 X 4, 0.5 mm pitch  
VQFN-HR - 1 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
This image is a representation of the package family, actual package may vary.  
Refer to the product data sheet for package details.  
4226989/A  
www.ti.com  
PACKAGE OUTLINE  
RNL0022A  
VQFN-HR - 0.9 mm max height  
SCALE 2.800  
PLASTIC QUAD FLATPACK - NO LEAD  
4.1  
3.9  
A
B
PIN 1 INDEX AREA  
5.1  
4.9  
0.1 MIN  
(0.05)  
SECTION A-A  
SCALE 30.000  
SECTION A-A  
TYPICAL  
0.9  
0.8  
C
SEATING PLANE  
0.08 C  
0.05  
0.00  
2
1
0.45  
0.35  
2X 0.8 0.1  
8X 0.5  
5X  
(0.2) TYP  
9
8
10  
7
4
11  
2X  
1.45 0.1  
2X  
2X  
2.175  
2.95 0.1  
0.25  
PKG  
14  
0.3  
0.2  
15X  
2X  
2
2X 0.85  
A
A
0.1  
0.05  
C A B  
C
0.65  
0.45  
5X  
22  
17  
1
2X 0.575  
0.45  
0.35  
18  
0.45  
0.35  
SYMM  
2
0.5  
0.3  
11X  
0.5  
0.3  
4221861/E 07/2019  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
RNL0022A  
VQFN-HR - 0.9 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
4X (0.5)  
18  
SYMM  
15X (0.25)  
22  
12X (0.6)  
2X (0.4)  
(2.325)  
1
17  
2X (2)  
5X (0.75)  
2X (1.425)  
SEE SOLDER MASK  
DETAILS  
3X (0.4)  
2X (0.575)  
2X (1)  
2X (0.4)  
0.000 PKG  
2X (0.25)  
14  
(0.295)  
4
(
0.2) VIA TYP  
NOTE 4  
(3.15)  
(1.125)  
2X (1.65)  
2X (1.875)  
(2.175)  
(1.955)  
11  
7
4X (0.5)  
8
9
(2)  
10  
(3.4)  
6X (3.8)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:20X  
0.05 MIN  
ALL AROUND  
0.05 MAX  
ALL AROUND  
SOLDER MASK  
OPENING  
METAL EDGE  
EXPOSED  
METAL  
EXPOSED  
METAL  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
NON SOLDER MASK  
DEFINED  
SOLDER MASK DEFINED  
SOLDER MASK DETAILS  
(PREFERRED)  
4221861/E 07/2019  
NOTES: (continued)  
3. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown  
on this view. It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
RNL0022A  
VQFN-HR - 0.9 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
4X (0.5)  
SYMM  
15X (0.25)  
5X (0.75)  
18  
22  
12X (0.6)  
2X (0.4)  
(2.325)  
1
2X (2)  
17  
(R0.05) TYP  
2X (1.425)  
2X (0.575)  
6X  
EXPOSED  
METAL  
7X  
EXPOSED  
METAL  
(1.4)  
(0.12)  
0.000 PKG  
(0.25)  
4X ( 0.4)  
4
14  
(0.71)  
(2)  
2X (1.445)  
(1.54)  
4X (0.5)  
11  
2X (2.175)  
2X (2.305)  
4X  
(0.66)  
7
(2.37)  
9
10  
8
8X (0.4)  
4X (0.63)  
(2)  
(3.8)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
FOR PADS 4,8,9,10 & 14  
80% PRINTED SOLDER COVERAGE BY AREA  
SCALE:25X  
4221861/E 07/2019  
NOTES: (continued)  
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担  
保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。  
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。  
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成  
本、损失和债务,TI 对此概不负责。  
TI 提供的产品受 TI 的销售条款ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改  
TI 针对 TI 产品发布的适用的担保或担保免责声明。  
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE  
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2023,德州仪器 (TI) 公司  

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