LMS3655AMRNLT [TI]
5.5A、36V 同步 400kHz 降压转换器 | RNL | 22 | -40 to 125;型号: | LMS3655AMRNLT |
厂家: | TEXAS INSTRUMENTS |
描述: | 5.5A、36V 同步 400kHz 降压转换器 | RNL | 22 | -40 to 125 开关 输出元件 转换器 |
文件: | 总50页 (文件大小:2300K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LMS3655
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
LMS3655 5.5A、36V 同步、400kHz 直流/直流降压转换器
1 特性
3 说明
1
•
•
在将 12V 转换为 5V 时具有 96% 的峰值效率
低 EMI 和开关噪声
LMS3655 同步降压稳压器针对高性能应用进行了 优
化,可提供 1V 至 20V 的可调节输出。PWM 和 PFM
模式之间的无缝转换以及低静态电流可确保在所有负载
下实现高效率和出色的瞬态响应。
–
–
最少的开关节点振铃
假随机扩频
•
•
•
•
•
•
•
•
•
400kHz (±10%) 固定开关频率
高级高速电路支持 LMS3655 将 24V 的输入调节至
3.3V 的输出(400kHz 固定频率),同时还支持 5.5A
的持续负载电流。创新的频率折返架构允许该器件通过
仅 3.5V 的输入电压调节生成 3.3V 的输出。输入电压
范围可高达 36V,瞬态容差高达 42V,有助于轻松实
现输入浪涌保护设计。
–40°C 至 +150°C 结温范围
外部频率同步
具有内部滤波器和 3ms 释放计时器的 RESET 输出
可提高效率的自动轻负载模式
引脚可选强制 PWM 模式
内置补偿、软启动、电流限制、热关断和 UVLO
25°C 时在 3.5A 负载下具有 0.35V 压降(典型值)
开漏复位输出具有内置的滤波和延迟功能,可提供正确
的系统状态指示。凭借这一特性,器件无需使用附加监
控组件,这节省了成本和电路板空间。
32µA IQ_VIN:在 3.3VOUT 且无负载情况下的静态电
流(典型值)
•
•
•
•
5.5A 持续负载电流
器件信息(1)
可调节输出电压(1V 至 20V)
±1.5% 基准电压容差
器件名称
LMS3655
封装
封装尺寸
VQFN-HR (22)
4.00mm × 5.00mm
4mm × 5mm、0.5mm 间距 SON 封装
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
2 应用
•
•
•
噪声敏感型医疗 应用
电信
高性能工业
典型应用电路
LMS3655 效率:输出电压 = 5V
VIN
3.5 V to 36 V
100%
98%
96%
94%
92%
90%
88%
86%
84%
10 µF
10 µF
PVIN 1
PVIN 2
10 µF
PGND1
AVIN
PGND2
RESET
VCC
SYNC
4.7 µF
LMS3655
BIAS
AGND
0.1 µF
FB
NC
CFF
RFBB
RFBT
FPWM
CBOOT
470 nF
SW
VIN = 12
VIN = 24
EN
82%
80%
L1=10 µH
VOUT
3 X 47 µF
0.001
0.01
0.1
1
10
Output Current (A)
Copyright © 2017, Texas Instruments Incorporated
LMS3
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNAS744
LMS3655
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
www.ti.com.cn
目录
8.3 Feature Description................................................. 14
8.4 Device Functional Modes........................................ 19
Application and Implementation ........................ 23
9.1 Application Information............................................ 23
9.2 Typical Applications ................................................ 23
9.3 Do's and Don't's ...................................................... 40
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information.................................................. 6
7.5 Thermal Information (for Device Mounted on PCB).. 6
7.6 Electrical Characteristics........................................... 6
7.7 System Characteristics ............................................. 8
7.8 Timing Requirements................................................ 9
7.9 Typical Characteristics............................................ 10
Detailed Description ............................................ 12
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 13
9
10 Power Supply Recommendations ..................... 40
11 Layout................................................................... 40
11.1 Layout Guidelines ................................................. 40
11.2 Layout Example .................................................... 42
12 器件和文档支持 ..................................................... 43
12.1 器件支持................................................................ 43
12.2 文档支持................................................................ 43
12.3 接收文档更新通知 ................................................. 43
12.4 社区资源................................................................ 43
12.5 商标....................................................................... 43
12.6 静电放电警告......................................................... 43
12.7 Glossary................................................................ 43
13 机械、封装和可订购信息....................................... 43
8
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (October 2017) to Revision B
Page
•
•
•
将最大可调节输出电压从 15V 更改成了 20V.......................................................................................................................... 1
Changed maximum extended output adjustment from: 15 V to: 20 V .................................................................................. 5
Added new extended output adjustment tablenote to the Recommended Operating Conditions.......................................... 5
Changes from Original (July 2017) to Revision A
Page
•
•
•
Changed symbol from: IB to: IB_NSW ....................................................................................................................................... 6
Added IB spec to System Characteristics............................................................................................................................... 8
Added System Characteristics crossreference links for the IB spec..................................................................................... 18
2
Copyright © 2017–2018, Texas Instruments Incorporated
LMS3655
www.ti.com.cn
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
5 Device Comparison Table
Table 1. LMS3655 Devices (5.5-A Output)
SPREAD
SPECTRUM
PART NUMBER
OUTPUT VOLTAGE
PACKAGE QTY
LMS3655AMRNLR
LMS3655AMRNLT
LMS3655MMRNLR
LMS3655MMRNLT
Adjustable
Adjustable
Adjustable
Adjustable
No
No
3000
250
Yes
Yes
3000
250
Copyright © 2017–2018, Texas Instruments Incorporated
3
LMS3655
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
www.ti.com.cn
6 Pin Configuration and Functions
RNL Package
22-Pin VQFN
Top View
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NO.
NAME
Internal 3.1-V LDO output. Used as supply to internal control circuits. Connect a high-quality 4.7-µF
capacitor from this pin to AGND.
1
VCC
A
P
I
Bootstrap capacitor connection for gate drivers. Connect a high quality 470-nF capacitor from this pin to
the SW pin.
2
3
4
CBOOT
SYNC
Synchronization input to regulator. Used to synchronize the device switching frequency to a system clock.
Triggers on rising edge of external clock; frequency must be in the range of 250 kHz and 500 kHz.
Input supply to regulator. Connect input bypass capacitors directly to this pin and PGND pins. Connect
PVIN1 and PVIN2 pins directly together at PCB.
PVIN1
P
5
6
Power ground to internal low-side MOSFET. These pins must be tied together on the PCB. Connect
PGND1 and PGND2 directly together at PCB. Connect to AGND and system ground.
PGND1
SW
G
P
7
8
9
Regulator switch node. Connect to power inductor.
10
11
12
13
Power ground to internal low-side MOSFET. These pins must be tied together. Connect PGND1 and
PGND2 directly together at PCB. Connect to AGND and system ground.
PGND2
G
Input supply to regulator. Connect input bypass capacitors directly to this pin and PGND pins. Connect
PVIN1 and PVIN2 pins directly together at PCB.
14
PVIN2
P
15
16
1 7
18
AVIN
FPWM
NC
A
I
Analog VIN. Connect to PVIN1 and PVIN2 on PCB.
Mode control input of regulator. High = FPWM, low = Automatic light load mode. Do not float.
No internal connection.
—
I
EN
Enable input to regulator. High = on, Low = off. Can be connected to VIN. Do not float.
Open-drain reset output flag. Connect to suitable voltage supply through a current limiting resistor. High =
regulator OK, Low = regulator fault. Goes low when EN = low.
19
20
RESET
AGND
O
G
Analog ground for regulator and system. All electrical parameters are measured with respect to this pin.
Connect to PGND on PCB.
21
22
FB
A
P
Feedback input to regulator. Connect to feedback voltage divider.
Input to auxiliary bias regulator. Connect to output voltage node.
BIAS
(1) A = Analog, O = Output, I = Input, G = Ground, P = Power
4
Copyright © 2017–2018, Texas Instruments Incorporated
LMS3655
www.ti.com.cn
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
7 Specifications
7.1 Absolute Maximum Ratings
(1)
Over the recommended operating junction temperature range of –40°C to +150°C (unless otherwise noted).
PARAMETER
VIN (AVIN, PVIN1, and PVIN2) to AGND, PGND(2)
SW to AGND, PGND(3)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
MAX
40
UNIT
V
VIN + 0.3
3.6
V
CBOOT to SW
EN to AGND, PGND(2)
V
40
V
BIAS to AGND, PGND
16
V
FB to AGND, PGND
16
V
RESET to AGND, PGND
RESET sink current(4)
SYNC to AGND, PGND(2)
FPWM to AGND, PGND(2)
VCC to AGND, PGND
8
V
10
mA
V
–0.3
–0.3
–0.3
–40
–40
40
40
V
3.6
V
Junction temperature
150
150
°C
°C
Storage temperature, Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) A maximum of 42 V can be sustained at this pin for a duration of ≤ 500 ms at a duty cycle of ≤ 0.01%.
(3) A voltage of 2 V below PGND and 2 V above VIN can appear on this pin for ≤ 200 ns with a duty cycle of ≤ 0.01%.
(4) Do not exceed the voltage rating on this pin.
7.2 ESD Ratings
VALUE
±1000
±250
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
Over the recommended operating junction temperature range of –40°C to +150°C (unless otherwise noted).
MIN
3.9
3.3
1
NOM
MAX
36
UNIT
V
Input voltage after start-up(1)
Output adjustment for LMS3655(2)
Extended output adjustment for LMS3655(3)(4)
Load current for LMS3655
6
V
20
V
5.5
125
A
Operating ambient temperature(5)
–40
°C
(1) An extended input voltage range to 3.5 V is possible; see System Characteristics table. See Input UVLO for start-up conditions.
(2) The output voltage must not be allowed to fall below zero volts during normal operation.
(3) Operation below 3.3 V and above 6 V may require changes to the typical application schematic, operation may not be possible over the
full input voltage range, and some system specifications will not be achieved for this extended output voltage range. Consult the factory
for further information.
(4) Operation above 15 V requires the BIAS pin grounded or powered by an external source. A maximum of 16 V can be sustained on the
BIAS pin.
(5) High junction temperatures degrade operating lifetime.
Copyright © 2017–2018, Texas Instruments Incorporated
5
LMS3655
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
www.ti.com.cn
7.4 Thermal Information
LMS3655
RNL (VQFN)
22 PINS
38.5
THERMAL METRIC(1)
UNIT
RθJA
RθJC
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
16.3
16.4
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
2.0
ψJB
16.4
RθJC(bot)
4.6
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information (for Device Mounted on PCB)
LMS3655
THERMAL METRIC(1)
RNL (VQFN)
22 PINS
29.4
UNIT
RθJA
RθJC
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
14.2
5.4
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
1.2
ψJB
5.4
RθJC(bot)
2.4
(1) Mounted on a thermally optimized FR4 four layer EVM with a size of 4000 mill × 3000 mill.
7.6 Electrical Characteristics
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following
conditions apply: VIN = 13.5 V.
PARAMETER
TEST CONDITIONS
VIN = 3.8 V to 36 V, TJ = 25°C
VIN = 3.8 V to 36 V
MIN
–1%
TYP
MAX
1%
UNIT
Initial reference voltage for 5-V
and 3.3-V options
VFB
–1.5%
1.5%
Operating quiescent current;
measured at VIN pin when
enabled and not switching(1)
IQ
VIN = 13.5 V, VBIAS = 5 V
7.5
16
µA
µA
VIN = 13.5 V, VBIAS = 5 V, FPWM =
0 V
53
53
2
62
62
3
Bias current into BIAS pin,
enabled, not switching
IB_NSW
VIN = 13.5 V, VBIAS = 3.3 V, FPWM
= 0 V
Shutdown quiescent current;
measured at VIN pin
ISD
EN ≤ 0.4 V
µA
V
Rising
3.2
2.95
3.55
3.25
0.3
3.90
3.55
VIN-OPERATE
Minimum input voltage to operate Falling
Hysteresis
0.28
0.4
RESET upper threshold voltage
RESET lower threshold voltage
Rising, % of VOUT
Falling, % VOUT
105%
92%
107%
94%
110%
96.5%
VRESET
Magnitude of RESET lower
threshold from steady state
output voltage
Steady-state output voltage and
RESET falling threshold read at the
same TJ and VIN
96%
(1) This is the current used by the device while not switching, open loop on the ATE. It does not represent the total input current from the
regulator system.
6
Copyright © 2017–2018, Texas Instruments Incorporated
LMS3655
www.ti.com.cn
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
Electrical Characteristics (continued)
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following
conditions apply: VIN = 13.5 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RESET hysteresis as a percent of
output voltage setpoint
VRESET_HYST
VRESET_VALID
±1%
50-µA pullup to RESET pin,
EN = 0 V, TJ= 25°C
Minimum input voltage for proper
RESET function
1.5
0.4
0.4
0.4
440
440
V
50-µA pullup to RESET pin,
VIN = 1.5 V, EN = 0 V
0.5-mA pullup to RESET pin,
VIN = 13.5 V, EN = 0 V
Low level RESET function output
voltage
VOL
V
1-mA pullup to RESET pin,
VIN = 13.5 V, EN = 3.3 V
VIN = 13.5 V, center frequency with
spread spectrum, PWM operation
360
360
400
FSW
Switching frequency
kHz
kHz
VIN = 13.5 V, without spread
spectrum, PWM operation
400
400
FSYNC
DSYNC
Sync frequency range
250
25%
1.5
500
Sync input duty cycle range
High state input < 5.5 V and > 2.3 V
FPWM input high (MODE = FPWM)
75%
FPWM input low (MODE = AUTO
with diode emulation)
VFPWM
FPWM input threshold voltage
0.4
1
V
FPWM input hysteresis
0.15
Frequency span of spread
spectrum operation
FSSS
FPSS
±3%
Spread-spectrum pattern
frequency(2)
1.2
Hz
µA
VIN = 13.5 V, VFPWM = 3.3 V
VIN = VFPWM = 13.5 V
VIN = 13.5 V, VSYNC = 3.3 V
VIN = VSYNC = 13.5 V
LMS3655
1
1
IFPWM
FPWM leakage current
SYNC leakage current
1
ISYNC
µA
1
IL-HS
IL-LS
High-side switch current limit
Low-side switch current limit
6.7
6
8.5
7
9.5
7.7
A
A
LMS3655
Zero-cross current limit FPWM =
low
IL-ZC
–0.02
–1.5
60
A
Negative current limit FPWM =
high
IL-NEG
High-side MOSFET RDSON
VIN = 13 V, IL = 1 A
,
130
80
RDSON
Power switch on-resistance
mΩ
Low-side MOSFET RDSON
,
40
VIN = 13 V, IL = 1 A
Enable input threshold voltage -
rising
VEN
Enable rising
1.7
2
V
VEN_HYST
VEN_WAKE
IEN
Enable threshold hysteresis
Enable wake-up threshold
EN pin input current
0.45
0.4
0.55
V
V
VIN = VEN = 13.5 V
2
3.05
3.15
2.7
3
µA
VIN = 13.5 V, VBIAS = 0 V
VCC
Internal VCC voltage
V
VIN = 13.5 V, VBIAS = 3.3 V
VIN rising
V
Internal VCC input undervoltage
lockout
VCC_UVLO
Hysteresis below VCC-UVLO
185
mV
(2) Ensured by Design, Not tested at production.
Copyright © 2017–2018, Texas Instruments Incorporated
7
LMS3655
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
www.ti.com.cn
Electrical Characteristics (continued)
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.
Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following
conditions apply: VIN = 13.5 V.
PARAMETER
TEST CONDITIONS
FB = 1 V
MIN
TYP
20
1
MAX
UNIT
IFB
Input current from FB to AGND
nA
TJ = 25°C
0.993
0.99
1.007
1.01
VREF
Reference voltage
V
TJ = –40°C to 125°C
1
Pull FB pin low. Sink 1-mA at
RESET pin
RRESET
RDSON of RESEToutput
50
120
Ω
VIH
1.5
VSYNC
VIL
0.4
1
V
VHYST
0.15
160
Rising
185
TSD
Thermal shutdown thresholds(2)
°C
Hysteresis
15
Fsw = 400 kHz
While in dropout(2)
96%
DMAX
Maximum switch duty cycle
98%
7.7 System Characteristics
The following specifications are ensured by design provided that the component values in the typical application circuit are
used. These parameters are not ensured by production testing. Limits apply over the recommended operating junction
temperature range of –40°C to +150°C, unless otherwise noted. Minimum and maximum limits are specified through test,
design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for
reference purposes only. Unless otherwise stated the following conditions apply: VIN = 13.5 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Minimum input voltage for full functionality at
3.5-A load, after start-up.
VOUT = 3.3 V +2% or –3% regulation
3.5
VIN-MIN
V
Minimum input voltage for full functionality at
maximum rated load 5.5 A after start-up.
VOUT = 3.3 V +2% or –3% regulation
VIN = VOUT + 1 V to 36 V, IOUT = 3.5 A
3.8
VOUT
FSW
Output voltage
–2.25%
2.25%
VIN = 24 V, FPWM = 24V, VOUT = 3.3 V,
IOUT = 200 mA
Switching frequency
400
32
kHz
µA
VIN = 13.5 V, VOUT = 3.3 V, IOUT = 0 A ,
FPWM = 0, RFBT = 49.9 kΩ, RFBB = 21.7
kΩ
IQ_VIN
Input current to VIN pin
VIN = 13.5 V, VOUT = 5.0 V, IOUT = 0 A,
FPWM = 0, RFBT = 49.9 kΩ, RFBB = 12.4
kΩ
57
IB
Bias current in AUTO mode at no load
VIN = 13.5 V, IOUT = 0 A, FPWM = 0
32
42
µA
V
VOUT = 3.3 V or 5 V, IOUT= 3.5 A, +2% or
–3% output accuracy
0.35
0.6
Minimum input to output voltage differential to
maintain regulation accuracy without inductor
DCR drop
VDROP1
VOUT = 3.3 V or 5 V, IOUT= 5.5 A, +2% or
–3% output accuracy
0.65
0.5
0.85
0.7
V
V
V
VOUT = 3.3 V or 5 V, IOUT = 3.5 A,
FSW = 330 kHz, 2% regulation accuracy
Minimum input to output voltage differential to
maintain FSW ≥ 330 kHz without inductor DCR
drop
VDROP2
VOUT = 3.3 V or 5 V, IOUT = 5.5 A,
FSW = 330 kHz, 2% regulation accuracy
0.7
1.2
VIN = 13.5 V, VOUT = 5 V, IOUT = 3.5 A
VIN = 13.5 V, VOUT = 3.3 V, IOUT = 3.5 A
VIN = 13.5 V, VOUT = 5 V, IOUT = 100 mA
94%
92%
92%
Efficiency
Typical efficiency
8
Copyright © 2017–2018, Texas Instruments Incorporated
LMS3655
www.ti.com.cn
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
7.8 Timing Requirements
Limits apply over the recommended operating junction temperature range of –40°C to +150°C, unless otherwise noted.
Minimum and maximum limits are ensured through test, design or statistical correlation. Typical values represent the most
likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following
conditions apply: VIN = 13.5 V.
MIN
NOM
60
65
3
MAX
UNIT
tON
Minimum switch on-time, VIN = 18 V, IL = 1 A
Minimum switch off-time, VIN = 3.8 V, IL = 1 A
Delay time to RESET high signal
84
ns
tOFF
80
ns
tRESET-act
tRESET-filter
tSS
2
4
ms
µs
Glitch filter time for RESET function(1)
24
4
Soft-start time from first switching pulse to VREF at 90%
Turnon delay, CVCC = 4.7 µF(2)
2.5
5
ms
ms
ms
tEN
0.8
6
tW
Short-circuit wait time (hiccup time)(3)
Change transition time from AUTO to FPWM MODE, 10-mA load, VIN = 13.5 V
Change transition time from FPWM to AUTO MODE, 10-mA load, VIN = 13.5 V
250
450
tFPWM
µs
(1) See Detailed Description.
(2) This is the time from the rising edge of EN to the time that the soft-start ramp begins.
(3) Tw is the wait time between current limit trip and restart. Tw is proportional to the soft-start time. However, provision must be made to
make Tw longer to ensure survivability during an output short circuit.
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7.9 Typical Characteristics
Unless otherwise specified the following conditions apply: VIN = 12 V, TA = 25ºC. Specified temperatures are ambient.
104%
103%
102%
101%
100%
99%
450000
440000
430000
420000
410000
400000
390000
380000
370000
360000
350000
-50
-25
0
25
50
75
100 125 150 175
-40
10
60
110
160
Temperature (èC)
Temperature (èC)
LMS3
LMS3
VIN = 12 V
Figure 1. Reference Voltage Drift
VIN = 12 V
Figure 2. Switching Frequency vs Temperature
10
8
8
7
6
5
4
3
2
1
0
6
4
2
LMS3655
150 200
LMS3655
0
-50
0
50
100
-50
0
50
100
150
200
Temperature (èC)
Temperature (èC)
LMS3
LMS3
VIN = 12 V
VIN = 12V
Figure 3. High-Side/Peak Current Limit for LMS3655
Figure 4. Low-Side/Valley Current Limit for LMS3655
25
0.25
0.2
0.15
0.1
0.05
0
3.8 VIN
5.5 VIN
13.5 VIN
18 VIN
20
15
10
5
0
-50
0
5
10
15
20
25
30
35
40
0
50
100
150
200
Temperature (èC)
Temperature (èC)
LMS3
LMS3
VIN = 12 V
VIN = 12 V
Figure 5. Short Circuit Average Input Current
for LMS3655
Figure 6. Shutdown Current
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Typical Characteristics (continued)
Unless otherwise specified the following conditions apply: VIN = 12 V, TA = 25ºC. Specified temperatures are ambient.
5.4
5.3
5.2
5.1
5
108%
106%
104%
102%
100%
98%
VRESET_UPPER
VRESET_UPPER
VRESET_UPPER_FALLING
VOUT
4.9
4.8
4.7
4.6
4.5
VRESET_LOWER_RISING
VRESET_LOWER
96%
VRESET_LOWER
94%
-40 -20
0
20
40
60
80 100 120 140 160
-40 -20
0
20
40
60
80 100 120 140 160
Termperature (èC)
Temperature (èC)
D026
D027
Figure 7. RESET Threshold 5-V Output
Figure 8. RESET Threshold as Percentage of Output Voltage
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8 Detailed Description
8.1 Overview
The LMS3655 devices are wide-input voltage range, low quiescent current, high-performance regulators with
internal compensation. This device is designed to minimize end-product cost and size while operating in
demanding high-performance industrial environments. Normal operating frequency is 400 kHz allowing the use of
small passive components. This device has a low unloaded current consumption, eliminating the need for an
external backup LDO. The LMS3655 low shutdown current and high maximum operating voltage also allow for
the elimination of an external load switch. To further reduce system cost, an advanced reset output is provided,
which can often eliminate the use of an external reset or supervisor device.
The LMS3655 family is designed with a flip-chip or HotRod™ technology, greatly reducing the parasitic
inductance of the pins. In addition, the layout of the device allows for partial cancellation of the current generated
magnetic field which reduces the radiated noise generated by the switching action.
As a result the switch-node waveform exhibits less overshoot and ringing.
Figure 9. Switch Node Waveform (VIN = 13.5 V, IOUT = 5.5 A)
The LMS3655 is available in a VQFN package with wettable flanks which allows easy inspection of the soldering
without the requirement of x-ray checks.
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8.2 Functional Block Diagram
SYNC
VCC
BIAS
VIN
* = not used in -ADJ
Oscillator
Int. Reg. Bias
CBOOT
Enable
Logic
HS Current
Sense
EN
FB
¯
1.0-V
Reference
PWM
Comp.
+
-
Error
Amplifier
Control Logic
Driver
SW
*
*
+
-
LS Current
Sense
RESET
Reset
Control
Mode Logic
FPWM
AGND
PGND
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Functional Block Diagram (continued)
8.2.1 Control Scheme
The LMS3655 control scheme allows this device to operate under a wide range of conditions with a low number
of external components. Peak current mode control allows a wide range of input voltages and output capacitance
values while maintaining a constant switching frequency. Stable operation is maintained while output capacitance
is changed during operation as well. This allows use in systems that require high performance during load
transients and which have load switches that remove loads as the operating state changes. Short minimum on
and off times ensure constant frequency regulation over a wide range of conversion ratios.
This architecture uses frequency spreading to achieve low dropout voltage maintaining output regulation as the
input voltage falls close to output voltage. The frequency spreading is smooth and continuous, and activated as
the off time approaches its minimum. Under these conditions, the LMS3655 operates like a constant off-time
converter, allowing the maximum duty cycle to reach 98% and output voltage regulation with 650-mV dropout. As
load current is reduced, the LMS3655 transitions to light load mode. In this mode, diode emulation is used to
reduce RMS inductor current and switching frequency. Average output voltage increases slightly while lightly
loaded as well.
8.3 Feature Description
8.3.1 RESET Flag Output
While the LMS3655 reset function resembles a standard Power-Good function, its functionality is designed to
replace a discrete reset device, reducing additional component cost. There are three major differences between
the reset function and the normal power good function seen in most regulators.
•
A delay has been added between the point at which the output voltage is within specified limits and the flag
asserts Power Good. A glitch filter prevents false flag operation for short excursions in the output voltage,
such as during line and load transients. See Figure 11 and Figure 12 for more detail.
•
•
RESET output signals a fault (pulls its output to ground) while the part is disabled.
RESET continues to operate with input voltage as low as 1.5 V. Below this input voltage, RESET output may
be high impedance.
Because the RESET comparator and the regulation loop share the same reference, the thresholds track with the
output voltage. When EN is pulled low, the RESET flag output is forced low. When the device is disabled,
RESET remains valid as long as the input voltage is ≥ 1.5 V. RESET operation can best be understood by
reference to Figure 10 and Figure 11. Output voltage excursions lasting less than TRESET-filter do not trip RESET.
Once the output voltage is within the prescribed limits, a delay of TRESET-act is imposed before RESET goes high.
This enables tighter tolerance than is possible with an external supervisor device while also expanding the
system allowance for transient response without the need for extremely accurate internal circuitry.
This output consists of an open-drain NMOS; requiring an external pullup resistor to a suitable logic supply. It
can also be pulled up to either VCC or VOUT, through an appropriate resistor, as desired. The pin can be left
floating or grounded if the RESET function is not used in the application. The maximum current into this pin must
be limited to 10 mA, and the maximum voltage must be less than 8 V.
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Feature Description (continued)
Figure 10. Static RESET Operation
Figure 11. RESET Timing Behavior
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Feature Description (continued)
The threshold voltage for the RESET function takes advantage of the availability of the LMS3655 internal
feedback threshold to the RESET circuit. This allows a maximum threshold of 96.5% of selected output voltage
to be specified at the same time as 96% of actual set point.
8.3.2 Enable and Start-Up
Start-up and shutdown of the LMS3655 are controlled by the EN input. Applying a voltage of ≥ 2 V activates the
device, while a voltage of ≤ 1.45 V is required for shutdown. The EN input may also be connected directly to the
input voltage supply. This input must not be left floating. The LMS3655 uses a reference-based soft start that
prevents output voltage overshoots and large inrush currents as the regulator is starting up.
A typical start-up waveform is shown in Figure 12 along with timing definitions. This waveform indicates the
sequence and timing between the enable input, output voltage, and RESET. From the figure, the user can define
several different start-up times depending on what is relevant to the application. Table 2 lists the timing
definitions and typical values.
tRESET-UP
tPOWER-UP
tRESET-ACT
tEN
tSS
2 ms/div
Figure 12. Typical Start-Up Waveform
Table 2. Typical Start-Up Times
PARAMETER
DEFINITION
VALUE
UNIT
ms
tRESET-READY
tPOWER-UP
tSS
Total start-up sequence time
Start-up time
Time from EN to RESET released
Time from EN to 90% of VOUT
7.5
4
ms
Soft-start time
Rise time of VOUT from 10% to 90%
Time from EN to start of VOUT rising
3.2
1
ms
tEN
Delay time
ms
Time from output voltage within 94% and
RESET released
tRESET-ACT
RESET time
3
ms
8.3.3 Soft-Start Function
Soft-start time is fixed internally at about 4 ms. Soft start is achieved by ramping the internal reference. The
LMS3655 operates correctly even if there is a voltage present on the output before activation of the LMS3655
(prebiased start-up). The device operates in AUTO mode during soft start, and the state of the FPWM pin is
ignored during that period.
8.3.4 Current Limit
The LMS3655 incorporates a valley current limit for normal overloads and for short-circuit protection. A precision
low-side current limit prevents excessive average output current from the buck converter of the LMS3655. A
high-side peak-current limit is employed for protection of the top N MOSFET and inductors. The two current limits
enable use of smaller inductors than a system with a single current limit. This scheme allows use of inductors
with saturation current rated less than twice the operating current of the LMS3655.
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During overloads the low-side current limit, IL-LS (see Electrical Characteristics), determines the maximum load
current that the LMS3655 can supply. When the low-side switch turns on, the inductor current begins to ramp
down. If the current does not fall below IL-LS before the next turnon cycle, then that cycle is skipped, and the low-
side FET is left on until the current falls below IL-LS. This is different than the more typical peak current limit, and
results in Equation 1 for the maximum load current.
(
V
IN - VOUT
2∂FS ∂L
)
∂
VOUT
IOUT
= ILS
+
max
V
IN
(1)
If the converter continues triggering valley current limit for more than about 64 clock cycles, the device turns off
both high and low side switches for approximately 6 ms (see TW in Timing Requirements). If the overload is still
present after the hiccup time, another 64 cycles is counted, and the process is repeated. If the current limit is not
tripped for two consecutive clock cycles, the counter is reset. The hiccup time allows the inductor current to fall to
zero, resetting the inductor volt-second balance. Of course the output current is greatly reduced in this condition
(see Typical Characteristics). A typical short-circuit transient and recovery is shown in Figure 13.
SPACE
Figure 13. Short-Circuit Transient and Recovery
SPACE
The high-side current limit trips when the peak inductor current reaches IL-HS (see Electrical Characteristics). This
is a cycle-by-cycle current limit and does not produce any frequency or current foldback. It is meant to protect the
high-side MOSFET from excessive current. Under some conditions, such as high input voltage, this current limit
may trip before the low-side protection. The peak value of this current limit varies with duty cycle.
In response to a short circuit, the peak current limit prevents excessive peak current while valley current limit
prevents excessive average inductor current and keeps the power dissipation low during a fault. After a small
number of cycles of valley current limit triggers, hiccup mode is activated.
In addition, the INEG current limit also protects the low-side switch from excessive negative current when the
device is in FPWM mode. If this current exceeds INEG, the low-side switch is turned off until the next clock cycle.
When the device is in AUTO mode, the negative current limit is increased to about IZC (about 0 A). This allows
the device to operate in DCM.
8.3.5 Hiccup Mode
Hiccup mode prevents excessive heating and power consumption under sustained short-circuit conditions. If an
overcurrent condition is maintained, the LMS3655 shuts off its output and waits for TW (approximately 6 ms),
after which the LMS3655 restarts operation by activating soft start.
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Vout
Figure 14. Hiccup Operation
During hiccup mode operation, the switch node of the LMS3655 is high impedance after a short circuit or
overcurrent persists for a short duration. Periodically, the LMS3655 attempts to restart. If the short has been
removed before one of these restart attempts, the LMS3655 operates normally.
8.3.6 Synchronizing Input
It is often desirable to synchronize the operation of multiple regulators in a single system. This technique results
in better-defined EMI and can reduce the need for capacitance on some power rails. The LMS3655 provides a
SYNC input which allows synchronization with an external clock. The LMS3655 implements an in-phase locking
scheme—the rising edge of the clock signal provided to the SYNC input corresponds to turning on the high-side
device within the LMS3655. The SYNC mode operation is implemented using phase locking over a limited
frequency range eliminating large glitches upon initial application of an external clock. The clock fed into the
LMS3655 replaces the internal free running clock but does not affect frequency foldback operation. Output
voltage continues to be well regulated with duty factors outside of the normal 4% through 96% range though at
reduced frequency.
The SYNC input recognizes a valid high level as that ≥ 1.5 V, and a valid low as that ≤ 0.4 V. The frequency
synchronization signal must be in the range of 250 kHz to 500 kHz with a duty cycle of 10% to 90%. The internal
clock is synced to the rising edge of the external clock. Ground this input if not used; this input must not be
allowed to float. See Device Functional Modes to determine which modes are valid for synchronizing the clock.
The device remains in FPWM mode and operates in CCM for light loads when a synchronization input is
provided. To prevent frequency foldback behavior at low duty cycles, provide a 200-mA load.
8.3.7 Undervoltage Lockout (UVLO) and Thermal Shutdown (TSD)
The LMS3655 incorporates an input UVLO function. The device accepts an EN command when the input voltage
rises above about 3.64 V and shuts down when the input falls below about 3.3 V. See Electrical Characteristics
under VIN-OPERATE for detailed specifications.
TSD is provided to protect the device from excessive temperature. When the junction temperature reaches about
165°C, the device shuts down; restart occurs at a temperature of about 150°C.
8.3.8 Input Supply Current
The LMS3655 is designed to have very low input supply current when regulating light loads. This is achieved by
powering much of the internal circuitry from the output. The BIAS pin is the input to the LDO that powers the
majority of the control circuits. By connecting the BIAS input to the output of the regulator, this current acts as a
small load on the output. This current is reduced by the ratio of VOUT / VIN, just like any other load.
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IQ_VIN is defined as the current consumed by a converter using a LMS3655 device while regulating without a
load. To calculate the theoretical total quiescent current, the below equation can be used with parameters from
the Electrical Characteristics and System Characteristics tables. While operating without a load, the LMS3655
only powers itself. The device draws power from three sources: the VIN pin (IQ), the EN pin (IEN), and the BIAS
pin (IB). Because the BIAS input is connected to the output of the circuit, the power consumed is converted from
input power with an effective efficiency, ηeff. Here, effective efficiency is the added input power needed when
lightly loading the converter of the LMS3655 device and is divided by the corresponding additional load. This
allows unloaded current to be calculated in Equation 2:
Output Voltage
IQ_ VIN = IQ +IEN + I +I
(
)
heff ìInput Voltage
B
div
where
•
•
•
IQ_VIN is the current consumed by the operating (switching) buck converter while unloaded.
IQ is the current drawn by the LMS3655 from its VIN terminal. See IQ in Electrical Characteristics.
IEN is current drawn by the LMS3655 from its EN terminal. Include this current if EN is connected to VIN. See
IEN in Electrical Characteristics. Note that this current drops to a very low value if connected to a voltage less
than 5 V.
•
•
•
IB is bias current drawn by the unloaded LMS3655. See IB in System Characteristics.
Idiv is the current drawn by the feedback voltage divider used to set output voltage.
ηeff is the light load efficiency of the Buck converter with IQ_VIN removed from the input current of the buck
converter.
(2)
NOTE
The EN pin consumes a few micro-amperes when tied to high; see IEN. Add IEN to IQ as
shown in Equation 2 if EN is tied to VIN. If EN is tied to a voltage less than 5 V, virtually no
current is consumed allowing EN to be used as an UVLO pin once a voltage divider is
added.
8.4 Device Functional Modes
Refer to Table 3 and the following paragraphs for a detailed description of the functional modes for the
LMS3655.
These modes are controlled by the FPWM input as listed in Table 3. This input can be controlled by any
compatible logic while the regulator is operating. If it is desired to fix the mode for a given application, the input
can be either connected to ground, a logic supply, the VIN pin, or the VCC pin, as desired. The FPWM pin must
not be allowed to float.
Table 3. Mode Selection
FPWM INPUT VOLTAGE
OPERATING MODE
Forced PWM: The regulator operates as a constant frequency, current mode, full-
synchronous converter for all loads; without diode emulation.
> 1.5 V
AUTO: The regulator moves between PFM and PWM as the load current changes, using
diode-emulation mode to allow DCM (see the Glossary).
< 0.4 V
8.4.1 AUTO Mode
In AUTO mode the device moves between PWM and PFM as the load changes. At light loads, the regulator
operates in PFM. At higher loads, the mode changes to PWM. The load currents at which the mode changes can
be found in the Application Curves.
In PWM, the converter operates as a constant frequency, current mode, full synchronous converter using PWM
to regulate the output voltage. While operating in this mode the output voltage is regulated by switching at a
constant frequency and modulating the duty cycle to control the power to the load. This provides excellent line
and load regulation and low output voltage ripple. When in PWM, the converter synchronizes to any valid clock
signal on the SYNC input (see Synchronizing Input); during PFM operation, the SYNC input is ignored.
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In PFM, the high-side FET is turned on in a burst of one or more cycles to provide energy to the load. The
frequency of these bursts is adjusted to regulate the output, while diode emulation is used to maximize efficiency
(see the Glossary). This mode provides high light-load efficiency by reducing the amount of input supply current
required to regulate the output voltage at small loads. A small increase in the output voltage occurs in PFM. This
trades off very good light load efficiency for larger output voltage ripple and variable switching frequency. The
actual switching frequency and output voltage ripple depend on the input voltage, output voltage, and load. See
the Application Curves for output voltage variation in AUTO mode. A typical switching waveform for PFM is
shown in Figure 15.
A unique feature of this device is that a minimum input voltage is required for the regulator to switch from PWM
to PFM at light load. This feature is a consequence of the advanced architecture employed to provide high
efficiency at light loads. Figure 16 indicates typical values of input voltage required to switch modes at no load.
Also, once the regulator switches to PFM at light load, it remains in that mode if the input voltage is reduced.
SPACE
4.2
Inductor Current:
250 mA/div
Light Load Deactivation Threshold (Falling)
Light Load Activation Threshold (Rising)
4
3.8
SW:
5V/div
3.6
3.4
VOUT:
5V/div
3.2
10 µs/div
-50
0
50
100
150
Temperature (èC)
LMS3
Figure 15. Typical PFM Switching Waveforms
Figure 16. Input Voltage for Mode Change — 3.3-V
Output, 10-µH Inductor
6
Light Load Deactivation Threshold (Falling)
Light Load Activation Threshold (Rising)
5.9
5.8
5.7
5.6
5.5
5.4
5.3
5.2
5.1
5
-50
0
50
100
150
Temperature (èC)
LMS3
Figure 17. Input Voltage for Mode Change — 5-V Output, 10-µH Inductor
8.4.2 FPWM Mode
With a logic high on the FPWM input, the device is locked in PWM mode. CCM operation is maintained, even at
no load, by allowing the inductor current to reverse its normal direction. To prevent frequency foldback behavior
at low duty cycles, provide a 200-mA load. This mode trades off reduced light load efficiency for low output
voltage ripple, tight output voltage regulation, and constant switching frequency. In this mode, a negative current
limit of INEG is imposed to prevent damage to the low-side FET of the regulator. When in PWM, the converter
synchronizes to any valid clock signal on the SYNC input (see Synchronizing Input).
When constant frequency operation is more important than light load efficiency, pull the LMS3655 FPWM input
high or provide a valid synchronization input. Once activated, the diode emulation feature is turned off in this
mode. This means that the device remains in CCM under light loads. Under conditions where the device must
reduce the on time or off time below the ensured minimum, the frequency reduces to maintain the effective duty
cycle required for regulation. This can occur for high input or output voltage ratios.
With the FPWM pin pulled low (normal mode), the diode emulation feature is activated. Device operation is the
same as above; however, the regulator goes into DCM operation when the valley of the inductor current reaches
zero.
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This feature may be activated and deactivated while the part is regulating without removing the load. This feature
activates and deactivates gradually preventing perturbation of output voltage. When in FPWM mode, a limited
reverse current is allowed through the inductor allowing power to pass from the regulator's output to its input. In
this case, ensure that a large enough input capacitor is used to absorb the reverse current.
NOTE
While FPWM is activated, larger currents pass through the inductor than in AUTO mode
when lightly loaded. This may result in more EMI, though at a predictable frequency. Once
loads are heavy enough to necessitate CCM operation, FPWM has no measurable effect
on the operation of the regulator.
8.4.3 Dropout
The minimum off time influences the dropout performance of the buck regulator. As the input voltage is reduced,
to near the output voltage, the off time of the high-side switch starts to approach the minimum value (see
Electrical Characteristics). Beyond this point the switching may become erratic or the output voltage falls out of
regulation. To avoid this problem, the LMS3655 automatically reduces the switching frequency to increase the
effective duty cycle. This results in two specifications regarding dropout voltage, as shown in System
Characteristics. One specification indicates when the switching frequency drops to 330 kHz. The other
specification indicates when the output voltage has fallen to 3% of nominal. See the Application Curves for
typical dropout values. Figure 18 and Figure 19 show the overall dropout characteristic for the 5-V option.
Additional dropout information is discussed in Application Curves for 5-V output and in Application Curves for
3.3-V output.
SPACE
450000
400000
350000
300000
250000
200000
150000
100000
50000
0
5.2
0 A
2 A
4 A
5.5 A
5
4.8
4.6
4.4
4.2
4
0 A
2 A
4 A
5.5 A
4
4.5
5
5.5
4
4.2 4.4 4.6 4.8
5
5.2 5.4 5.6 5.8
6
Input Voltage (V)
Input Voltage (V)
LMS3
LMS3
Figure 18. Overall Dropout Characteristics
(VOUT = 5 V)
Figure 19. Frequency Dropout Characteristics
(VOUT = 5 V)
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8.4.4 Spread-Spectrum Operation
The spread spectrum is a factory option. In order to find which parts have spread spectrum enabled, see Device
Comparison Table.
The purpose of the spread spectrum is to eliminate peak emissions at specific frequencies by spreading
emissions across a wider range of frequencies. In most systems containing the LMS3655 devices, low frequency
conducted emissions from the first few harmonics of the switching frequency can be easily filtered. A more
difficult design criterion is reduction of emissions at higher harmonics which fall in the FM band. These harmonics
often couple to the environment through electric fields around the switch node. The LMS3655 devices use a ±3%
spread of frequencies which spread energy smoothly across the FM band but is small enough to limit sub-
harmonic emissions below its switching frequency. Peak emissions at the switching frequency of the part are
only reduced by slightly less than 1 dB, while peaks in the FM band are typically reduced by more than 6 dB.
The LMS3655 devices use a cycle-to-cycle frequency hopping method based on a linear feedback shift register
(LFSR). Intelligent pseudo random generator limits cycle to cycle frequency changes to limit output ripple.
Pseudo random pattern repeats by approximately 1.2 Hz which is below the audio band.
The spread spectrum is only available while the clock of the LMS3655 devices is free running at its natural
frequency. Any of the following conditions overrides spread spectrum, turning it off:
•
•
•
An external clock is applied to the SYNC/MODE terminal.
The clock is slowed due to operation at low input voltage; this is operation in dropout.
The clock is slowed under light load in AUTO mode; this is normally not seen above 200 mA of load. In
FPWM mode, spread spectrum is active even if there is no load.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LMS3655 is a step-down DC-DC converter, typically used to convert a higher DC voltage to a lower DC
voltage with a maximum output current of 5.5 A. The following design procedures can be used to select
components for the LMS3655. Alternately, the WEBENCH® Design Tool may be used to generate a complete
design. This tool uses an iterative design procedure and has access to a comprehensive database of
components. This allows the tool to create an optimized design and allows the user to experiment with various
design options.
9.2 Typical Applications
9.2.1 General Application
Figure 20 shows a general application schematic. FPWM, SYNC, and EN are digital inputs. RESET is an open-
drain output.
•
The FPWM pin can be connected to GND to enable light-load PFM operation. Select this option if current
consumption at light load is critical. The pin can be connected to VCC or VIN for forced 400-kHz operation.
Select this option if constant switching frequency is critical. The pin can also be driven by an external signal
and can be toggled while the part is in operation (by an MCU, for example). Refer to the Device Functional
Modes for more details on the operation and signal requirements of the FPWM pin.
•
•
The SYNC pin can be used to control the switching frequency and the phase of the converter. If the function
is not needed, tie the SYNC pin to GND, VCC, or VIN.
The RESET pin can be left floating or tied to ground if the function is not required. If the function is needed,
the pin must be connected to a DC rail through a pullup resistor (100 kΩ is the typical recommended value).
Check RESET Flag Output for the details of the RESET pin function.
•
•
Connect the output to the FB pin through a voltage divider. See Detailed Design Procedure for details on
component selection.
The BIAS pin can be connected directly to the output voltage. In applications that can experience inductive
shorts (such as cases with long leads on the output), a 3 Ω or so is necessary between the output and the
BIAS pin, and a small capacitor to GND is necessary close to the BIAS pin (CBIAS). Alternatively, a Schottky
diode can be connected between OUT and GND to limit the negative voltage that can arise on the output
during inductive shorts. In addition, BIAS can also be connected to an external rail if necessary and if
available. The typical current into the bias pin is 15 mA when the device is operating in PWM mode at 400
kHz.
•
Power components must be chosen carefully for proper operation of the converter. Detailed Design
Procedure discusses the details of the process of choosing the input capacitors, output capacitors, and
inductor for the application.
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LMS3655
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Typical Applications (continued)
VIN
3.5 V to 36 V
10 µF
PVIN 1
PVIN 2
10 µF
10 µF
PGND1
PGND2
RESET
AVIN
VCC
SYNC
BIAS
4.7 µF
LMS3655
AGND
0.1 µF
FB
NC
CFF
RFBB
RFBT
FPWM
CBOOT
470 nF
SW
EN
L1=10 µH
VOUT
3 X 47 µF
Copyright © 2017, Texas Instruments Incorporated
Figure 20. General Application Circuit
9.2.1.1 Design Requirements
Three sets of application-specific design requirements are outlined in Table 8, Table 9, and Table 10. The
minimum input voltage shown in Figure 20 is not the minimum operating voltage of the LMS3655. Rather, it is a
typical operating range for the systems. For the complete information regarding minimum input voltage see
Electrical Characteristics.
9.2.1.2 Detailed Design Procedure
9.2.1.2.1 External Components Selection
The device requires input capacitors and an output inductor-capacitor filter. These components are critical to the
performance of the device.
9.2.1.2.1.1 Input Capacitors
The input capacitor supplies the AC switching current drawn from the switching action of the internal power
FETs. The input current of a buck converter is discontinuous, so the ripple current supplied by the input capacitor
is large. The input capacitor must be rated to handle both the RMS current and the dissipated power.
The device is designed to be used with ceramic capacitors on the input of the buck regulator. The recommended
dielectric type of these capacitors is X5R, X7R, or of comparable material to maintain proper tolerances over
voltage and temperature.
The device requires a minimum of 20 µF of ceramic capacitance at the input. TI recommends 2 × 10 µF, 10 µF
for PVIN1 and 10 µF for PVIN2. Place these capacitors close to the PVIN1, PGND1, PVIN2, and the PGND2
pads. The ceramic input capacitors provide a low impedance source to the regulator in addition to supplying
ripple current and isolating switching noise from other circuits. Table 4 shows the nominal and minimum values of
total input capacitance recommended for the LMS3655. Also shown are the measured values of effective
capacitance for the indicated capacitor.
24
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Typical Applications (continued)
In addition, it is especially important to have small ceramic bypass capacitors of 10 nF to 100 nF very close to
the PVIN1 and PVIN2 inputs to minimize ringing and EMI generation due to the high-speed switching of the
device coupled with trace inductance. TI recommends that a small case size 10-nF ceramic capacitor be placed
across the input, as close to the device as possible. Additional high-frequency capacitors can be used to help
manage conducted EMI or voltage spike issues that may be encountered.
Many times it is desirable to use an additional electrolytic capacitor on the input, in parallel with the ceramics.
This is especially true if long leads or traces are used to connect the input supply to the regulator. The moderate
ESR of this capacitor can help damp any ringing on the input supply caused by long power leads. The use of this
additional capacitor also helps with voltage dips caused by input supplies with unusually high impedance.
Table 4. Recommended Input Capacitors
NOMINAL INPUT CAPACITANCE
MINIMUM INPUT CAPACITANCE
PART NUMBER
RATED
CAPACITANCE
MEASURED
MEASURED CAPACITANCE(1)
RATED CAPACITANCE
CAPACITANCE(1)
3 × 10 μF
22.5 μF
2 × 10 μF
15 μF
CL32B106KBJNNNE
(1) Measured at 14 V and 25°C.
9.2.1.2.1.2 Output Inductors and Capacitors
There are several design considerations related to the selection of output inductors and capacitors:
•
•
•
•
•
Load transient response
Stability
Efficiency
Output ripple voltage
Overcurrent ruggedness
The device has been optimized for use with LC values as shown in the Figure 20.
9.2.1.2.1.2.1 Inductor Selection
The LMS3655 devices run in current mode and with internal compensation. The compensation of the adjustable
5-V and 3.3-V configurations is stable with inductance between 6.5 µH and 20 µH. For most applications, the
adjustable 5-V and 3.3-V configurations of the LMS3655 devices are optimized for a nominal inductance of 10
μH. This gives a ripple current that is approximately 20% to 30% of the full load current of 5.5 A. If applying a
synchronization clock signal, the designer should appropriately size the inductor for the converter's operating
switching frequency. For output voltages greater than 5 V, a proportionally larger inductor can be used, thus
keeping the ratio of inductor current slope to internal compensating slope constant. Inductance that is too high is
not recommended because it can result in poor load transient behavior and instability.
The inductor must be rated to handle the peak load current plus the ripple current—carefully review the different
saturation current ratings specified by different manufacturers. Saturation current ratings are typically specified at
25°C, so ratings at maximum ambient temperature of the application should be requested from the manufacturer.
For the LMS3655, TI recommends a saturation current of 10 A or higher. Carefully review the inductor parasitic
resistance; the inductor parasitic resistance must be as low as possible to minimize losses at heavy loads. The
best way to obtain an optimum design is to use the Texas Instruments WEBENCH Design Tool.
Table 5 gives a list of several possible inductors that can be used with the LMS3655.
The designer should choose the inductors that best match the system requirements. A very wide range of
inductors are available as regarding physical size, height, maximum current (thermally limited, and inductance
loss limited), series resistance, maximum operating frequency, losses, and so forth. In general, inductors of
smaller physical size have higher series resistance (DCR) and implicitly lower overall efficiency is achieved. Very
low-profile inductors may have even higher series resistance. TI recommends finding the best compromise
between system performance and cost.
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LMS3655
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Table 5. Recommended Inductors
MANUFACTURER
Würth
PART NUMBER
SATURATION CURRENT
DC RESISTANCE
16 mΩ
7443251000
7447709100
8.5 A
10.5 A
12 A
Würth
21 mΩ
Vishay
IHLP4040DZER100M01
36.5 mΩ
9.2.1.2.1.2.2 Output Capacitor Selection
The output capacitor of a switching converter absorbs the AC ripple current from the inductor, reduces the output
voltage ripple, and provides the initial response to a load transient. The ripple voltage at the output of the
converter is the product of the ripple current flowing through the output capacitor and the impedance of the
capacitor. The impedance of the capacitor can be dominated by capacitive, resistive, or inductive elements within
the capacitor, depending on the frequency of the ripple current. Ceramic capacitors have very low ESR and
remain capacitive up to high frequencies. Their inductive component can be usually neglected at the operating
frequency range of the converter.
The LMS3655 is designed to work with low-ESR ceramic capacitors. TI recommends X5R and X7R type
capacitors. The effective value of these capacitors is defined as the actual capacitance under voltage bias and
temperature. All ceramic capacitors have a large voltage coefficient, in addition to normal tolerances and
temperature coefficients. Under DC bias, the capacitance value drops considerably. Larger case sizes or higher
voltage capacitors are better in this regard. To help mitigate these effects, multiple small capacitors can be used
in parallel to bring the minimum effective capacitance up to the desired value. This can also ease the RMS
current requirements on a single capacitor. Table 6 shows the nominal and minimum values of total output
ceramic capacitance recommended for the LMS3655.The values shown also provide a starting point for other
output voltages. More output capacitance can be used to improve transient performance and reduce output
voltage ripple.
In order to minimize ceramic capacitance, a low-ESR electrolytic capacitor can be used in parallel with minimal
ceramic capacitance. As a starting point for designing with an output electrolytic capacitor, Table 7 shows the
minimum ceramic capacitance recommended when paired with a 120-µF Aluminum-polymer (ESR = 25 mΩ) in
order to maintain stable operation. Depending on load transient design requirements, the designer may choose
to add additional capacitance.
In practice, the output capacitor has the most influence on the transient response and loop phase margin. Load
transient testing and bode plots are the best way to validate any given design and should always be completed
before the application goes into production. Make a careful study of temperature and bias voltage variation of any
candidate ceramic capacitor in order to ensure that the minimum value of effective capacitance is provided. The
best way to obtain an optimum design is to use the Texas Instruments WEBENCH Design Tool.
In adjustable applications the feed-forward capacitor, CFF, provides another degree of freedom when stabilizing
and optimizing the design. Refer to Optimizing Transient Response of Internally Compensated DC-DC
Converters With Feedforward Capacitor (SLVA289) for helpful information when adjusting the feed-forward
capacitor.
In addition to the capacitance shown in Table 6, a small ceramic capacitor placed on the output can help to
reduce high frequency noise. Small case-size ceramic capacitors in the range of 1 nF to 100 nF can be very
helpful in reducing spikes on the output caused by inductor parasitics.
Limit the maximum value of total output capacitance to between 800 μF and 1200 μF. Large values of output
capacitance can prevent the regulator from starting up correctly and adversely effect the loop stability. If values
greater than the given range are to be used, then a careful study of start-up at full load and loop stability must be
performed.
(1)
Table 6. Recommended Output Ceramic Capacitors
NOMINAL OUTPUT CERAMIC
CAPACITANCE
MINIMUM OUTPUT CERAMIC
CAPACITANCE
OUTPUT VOLTAGE
PART NUMBER
RATED CAPACITANCE
4 × 47 µF
RATED CAPACITANCE
3 x 47µF
3.3 V
5 V
GRM32ER71A476KE15L
GRM32ER71A476KE15L
4 × 47 µF
3 × 47µF
(1) L = 10 μH
26
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Table 6. Recommended Output Ceramic Capacitors () (continued)
NOMINAL OUTPUT CERAMIC
CAPACITANCE
MINIMUM OUTPUT CERAMIC
CAPACITANCE
RATED CAPACITANCE
3 × 47μF
OUTPUT VOLTAGE
PART NUMBER
RATED CAPACITANCE
4× 47 μF
6 V
10 V(2)
GRM32ER71A476KE15L
GRM32ER71A476KE15L
4 × 47 μF
3 × 47 μF
(2) L = 20 μH
(1)
Table 7. Recommended Output Al-Polymer and Ceramic Capacitors
MINIMUM OUTPUT CERAMIC
OUTPUT AL-POLYMER CAPACITANCE
CAPACITANCE
RATED CAPACITANCE
1 × 47µF + 1 x 20µF
1 × 47µF
OUTPUT VOLTAGE
PART NUMBER
RATED CAPACITANCE
120 µF
3.3 V
5 V
APXE160ARA121MH70G
APXE160ARA121MH70G
120 µF
(1) L = 10 μH
Consult Output Ripple Voltage for Buck Switching Regulator (SLVA630) for more details on the estimation of the
output voltage ripple for this converter.
9.2.1.2.2 FB for Adjustable Output
The LMS3655 devices regulate output voltage to a level that results in the FB node being VREF, which is
approximately 1 V (see Electrical Characteristics). Output voltage given a specific feedback divider can be
calculated using Equation 3:
RFBB + RFBT
Output Voltage = Vref
ì
RFBB
(3)
To ensure proper behavior for all modes of operation, a 50-kΩ resistor is recommended for RFBT. RFBB can then
be determined using Equation 4:
V
ìRFBT
ref
RFBB
=
Output Voltage - V
ref
(4)
In addition, a feed-forward capacitor CFF may be required to optimize the transient response. For output voltages
greater than 6 V, the WEBENCH Design Tool can be used to optimize the design.
9.2.1.2.3 VCC
The VCC pin is the output of the internal LDO used to supply the control circuits of the LMS3655. This output
requires a 4.7-µF, 10-V ceramic capacitor connected from VCC to GND for proper operation. X7R type is
recommended. In general, this output must not be loaded with any external circuitry. However, the output can be
used to supply a logic level to the FPWM input or for the pullup resistor used with the RESET output. The
nominal output of the LDO is 3.15 V.
9.2.1.2.4 BIAS
The BIAS pin is the input to the internal LDO. As detailed in Input Supply Current, this input is connected directly
to VOUT to provide the lowest possible supply current at light loads. Because this input is connected directly to the
output, it must be protected from negative voltage transients. Such transients may occur when the output is
shorted at the end of a long PCB trace or cable. If this is likely in a given application, then place a small resistor
in series between the BIAS input and VOUT as shown in Figure 23.
Size the resistor to limit the current out of the BIAS pin to < 100 mA. Values in the range of 2 Ω to 5 Ω are
typically sufficient. Values greater than 5 Ω are not recommended. As a rough estimate, assume that the full
negative transient appears across RBIAS and design for a current of < 100 mA. In severe cases, a Schottky diode
can be placed in parallel with the output to limit the transient voltage and current.
When a resistor is used between the output and the BIAS pin, a 0.1-µF capacitor is required close to the BIAS
pin. In general, TI recommends having a 0.1-µF capacitor near the BIAS pin, regardless of the presence of the
resistor, unless the trace between the output capacitors and the BIAS pin is very short.
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The typical current into the bias pin is 15 mA when the device is operating in PWM mode at 400 kHz.
9.2.1.2.5 CBOOT
The LMS3655 requires a boot-strap capacitor between the CBOOT pin and the SW pin. This capacitor stores
energy that is used to supply the gate drivers for the power MOSFETs. A ceramic capacitor of 0.47 µF, ≥ 6.3 V is
required.
9.2.1.2.6 Maximum Ambient Temperature
As with any power conversion device, the LMS3655 dissipates internal power while operating. The effect of this
power dissipation is to raise the internal temperature of the converter above ambient. The internal die
temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance,
RθJA of the device and PCB combination. The maximum internal die temperature for the LMS3655 is 150°C, thus
establishing a limit on the maximum device power dissipation and therefore load current at high ambient
temperatures. Equation 5 shows the relationships between the important parameters.
(
TJ - TA
RqJA
)
∂
h
1- h
1
IOUT
=
∂
VOUT
(5)
The device uses an advanced package technology that uses the pads and pins as heat spreading paths. As a
result, the pads must be connected to large copper areas to dissipate the heat from the IC. All pins provide some
heat relief capability but the PVINs, PGNDs, and SW pins are of particular importance for proper heat dissipation.
Utilization of all the board layers for heat dissipation and using vias as heat pipes is recommended. The Layout
Guidelines includes an example that shows layout for proper heat management.
28
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9.2.1.3 Application Curves
These parameters are not tested and represent typical performance only. Unless otherwise stated, the following
conditions apply: VIN = 12 V, TA = 25°C. For the purpose of offering more information to the designer, information
for the application with FPWM pin high (FPWM mode) and FPWM pin low (AUTO mode) is included, although
the schematic shows the application running specifically in FPWM mode. The mode is specified under each
following graph.
3.5
3
3.5
3
8.0 VIN
4.0 VIN
6.0 VIN
12.0 VIN
13.5 VIN
24.0 VIN
36.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Output Current (A)
Output Current (A)
LMS3
LMS3
Figure 21. Power Dissipation 5-V Output
Figure 22. Power Dissipation 3.3-V Output
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9.2.2 Adjustable 5-V Output
VIN
5.5 V œ 36 V
PVIN 1
10 µF
PVIN 2
10 µF
PGND1
0.1 µF
PGND2
RESET
0.1 µF
RESET/PG OUT
AVIN
100 kΩ
VCC
NC
4.7 µF
LMS3655
BIAS
AGND
3 Ω
0.1 µF
FPWM
EN
FB
22 pF
21.7 kΩ
470 nF
49.9 kΩ
CBOOT
VOUT = 5 V
SYNC IN
SYNC
SW
L1 = 10 µF
1 X 47 µF
100 kΩ
1 X 120 µF
ESR = 25 mΩ
Copyright © 2017, Texas Instruments Incorporated
Figure 23. 5-V, 5.5-A Output Power Supply
9.2.2.1 Design Requirements
Example requirements for a typical 5-V application. The input voltages are here for illustration purposes only.
See Electrical Characteristics for minimum operating input voltage. The minimum input voltage necessary to
achieve proper output regulation depends on the components used. See Figure 29 for typical drop-out behavior.
Table 8. Example Requirements for 5-V Typical Application
DESIGN PARAMETER
Input voltage range
EXAMPLE VALUE
8 V to 18 V steady-state, 5.5 V to 36 V transients
0 A to 5.5 A
Output current
Switching Frequency at 0-A load
Current Consumption at 0-A load
Synchronization
Critical: must have > 250 kHz
Not critical: < 100 mA acceptable
Yes: 300 kHz supplied by MCU
9.2.2.2 Detailed Design Procedure
•
BIAS is connected to the output. This example assumes that the load is connected to the output through long
wires so a 3-Ω resistor is inserted to minimize risks of damage to the part during load shorts. In addition 0.1-
µF capacitor is required close to the bias pin.
•
FB is connected to the output through a voltage divider in order to create a voltage of 1 V at the FB pin when
the output is at 5 V. A 22-pF capacitance is added in parallel with the top feedback resistor in order to
improve transient behavior. BIAS and FB are connected to the output through separate traces. This is
important to reduce noise and achieve good performance. See Layout Guidelines for more details on the
proper layout method.
•
SYNC is connected to ground through a pulldown resistor, and an external synchronization signal can be
30
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applied. The pulldown resistor ensures that the pin is not floating when the SYNC pin is not driven by any
source.
•
•
EN is connected to VIN so the device operates as soon as the input voltage rises above the VIN-OPERATE
threshold.
FPWM is connected to VIN. This causes the device to operate in FPWM mode. In this mode, the device
remains in CCM operation regardless of the output current and is ensured to be within the boundaries set by
FSW. To prevent frequency foldback behavior at low duty cycles, provide a 200-mA load. The drawback is that
the efficiency is not optimized for light loads. See Device Functional Modes for more details.
•
•
A 4.7-µF capacitor is connected between VCC and GND close to the VCC pin. This ensures stable operation
of the internal LDO.
RESET is biased to the output in this example. A pullup resistor is necessary. A 100-kΩ is selected for this
application and is generally sufficient. The value can be selected to match the needs of the application but
must not lead to excessive current into the RESET pin when RESET is in a low state. Consult Absolute
Maximum Ratings for the maximum current allowed. In addition, a low pullup resistor could lead to an
incorrect logic level due to the value of RRESET. Consult Electrical Characteristics for details on the RESET
pin.
•
Input capacitor selection is detailed in Input Capacitors. It is important to connect small high-frequency
capacitors CIN_HF1 and CIN_HF2 as close to both inputs PVIN1 and PVIN2 as possible.
•
•
Output capacitor selection is detailed in Output Capacitor Selection.
Inductor selection is detailed in Inductor Selection. In general, a 10-µH inductor is recommended for the
nominal adjustable output range of 3.3 V to 5 V. The inductance can vary with the output voltage due to ripple
and current limit requirements.
9.2.2.3 Application Curves
The following characteristics apply only to the circuit of Adjustable 5-V Output. These parameters are not tested
and represent typical performance only. Unless otherwise stated, the following conditions apply: VIN = 12 V, TA =
25°C. For the purpose of offering more information to the designer, information for the application with FPWM pin
high (FPWM mode) and FPWM pin low (AUTO mode) is included, although the schematic shows the application
running specifically in FPWM mode. The mode is specified under each following graph.
100%
95%
90%
85%
80%
75%
70%
65%
60%
100%
95%
90%
85%
80%
75%
70%
65%
60%
55%
50%
8.0 VIN
8.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
0.001
0.01
0.1
1
10
0
1
2
3
4
5
6
Output Current (A)
Output Current (A)
LMS3
LMS3
VOUT = 5 V
AUTO
VOUT = 5 V
FPWM
Figure 24. Efficiency
Figure 25. Efficiency
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5.12
5.11
5.1
5.05
5.03
5.01
4.99
4.97
4.95
8.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
5.09
5.08
5.07
5.06
5.05
5.04
5.03
5.02
5.01
8.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
1
2
3
4
5
6
Output Current (A)
Output Current (A)
LMS3
LMS3
VOUT = 5 V
AUTO
VOUT = 5 V
FPWM
Figure 26. Load and Line Regulation
Figure 27. Load and Line Regulation
1.2
1
1000
-40èC
900
800
700
600
500
400
300
200
100
0
25èC
105èC
0.8
0.6
0.4
0.2
0
0
1
2
3
4
5
6
0
10
20
30
40
Output Current (A)
Input Voltage (V)
LMS3
LMS3
VOUT = 5 V
VOUT = 5 V
Figure 29. Dropout for –3% Regulation
Figure 28. Load Current for PFM-to-PWM Transition
450000
400000
350000
300000
250000
200000
150000
100000
50000
0
1.2
1
-40èC
25èC
105èC
0.8
0.6
0.4
0.2
0
8 VIN
12 VIN
18 VIN
24 VIN
0.001
0.01
0.1
1
10
0
1
2
3
4
5
6
Output Current (A)
LMS3
Output Current (A)
LMS3
VOUT = 5 V
AUTO
VOUT = 5 V
Figure 31. Switching Frequency vs Load Current
Figure 30. Dropout for ≥ 330 kHz
32
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9
8
7
6
5
4
3
2
1
0
LMS3655
40
0
5
10
15
20
25
30
35
45
AUTO
VOUT = 5 V
L = 10 µH
Input Voltage (V)
LMS3
COUT = 170 µF
IOUT = 10 mA to 3.5 A
TR = TF = 1 µs
VOUT = 5 V
L = 10 µH
Figure 33. Load Transients
Figure 32. Output Current Level Limit Before Overcurrent
Protection
FPWM
VOUT = 5 V
IOUT = 0 A to 3.5 A
L = 10 µH
COUT = 170 µF
TR = TF = 1 µs
Figure 34. Load Transient
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9.2.3 Adjustable 3.3-V Output
VIN
3.8 V to 36 V
VDD
PVIN 1
10 µF
PVIN 2
PGND2
RESET
10 µF
100 kΩ
RESET/PG OUT
PGND1
0.1 µF
0.1 µF
AVIN
VCC
NC
4.7 µF
LMS3655
BIAS
AGND
0.1 µF
FPWM
EN
FB
22 pF
21.7 kΩ
49.9 kΩ
CBOOT
470 nF
VOUT = 3.3 V
SW
SYNC
L1 = 10 µH
1 X 67 µF
1 X 120 µF
ESR = 25 mΩ
Copyright © 2017, Texas Instruments Incorporated
Figure 35. Adjustable 3.3-V, 5.5-A Output Power Supply
9.2.3.1 Design Requirements
Example requirements for a typical 3.3-V application. The input voltages are here for illustration purposes only.
See Electrical Characteristics for minimum operating input voltage. The minimum input voltage necessary to
achieve proper output regulation depends on the components used. See Figure 41 for typical drop-out behavior.
Table 9. Example Requirements for 3.3-V Application
DESIGN PARAMETER
Input voltage range
EXAMPLE VALUE
8-V to 18-V steady-state, 4.0-V to 36-V transients
0 A to 5.5 A
Output current
Switching Frequency at 0-A load
Current Consumption at 0-A load
Synchronization
Not critical: Need >330 kHz at high load only
Critical: Need to ensure low current consumption to reduce battery drain
No
9.2.3.2 Detailed Design Procedure
•
BIAS is connected to the output. This example assumes that the load is close to the output so no bias
resistance is necessary. A 0.1-µF capacitor is still recommended close to the bias pin.
•
FB is connected to the output through a voltage divider in order to create a voltage of 1 V at the FB pin when
the output is at 3.3 V. A 22-pF capacitance is added in parallel with the top feedback resistor in order to
improve transient behavior. BIAS and FB are connected to the output through separate traces. This is
important to reduce noise and achieve good performance. See Layout Guidelines for more details on the
proper layout method.
•
•
SYNC is connected to ground directly as there is no need for this function in this application.
EN is connected to VIN so the device operates as soon as the input voltage rises above the VIN-OPERATE
threshold.
34
Copyright © 2017–2018, Texas Instruments Incorporated
LMS3655
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ZHCSGY9B –JULY 2017–REVISED MARCH 2018
•
FPWM is connected to GND. This causes the device to operate in AUTO mode. In this mode, the switching
frequency is adjusted at light loads to optimize efficiency. As a result the switching frequency changes with
the output current until medium load is reached. The part will then switch at the frequency defined by FSW
.
See Device Functional Modes for more details.
•
•
A 4.7-µF capacitor is connected between VCC and GND close to the VCC pin. This ensures stable operation
of the internal LDO.
RESET is biased to an external rail in this example. A pullup resistor is necessary. A 100-kΩ pullup resistor is
selected for this application and is generally sufficient. The value can be selected to match the needs of the
application but must not lead to excessive current into the RESET pin when RESET is in a low state. Consult
Absolute Maximum Ratings for the maximum current allowed. In addition, a low pullup resistor could lead to
an incorrect logic level due to the value of RRESET. Consult Electrical Characteristics for details on the RESET
pin.
•
It is important to connect small high frequency capacitors CIN_HF1 and CIN_HF2 as close to both inputs PVIN1
and PVIN2 as possible. For the detailed process of choosing input capacitors, refer to Input Capacitors.
•
•
Output capacitor selection is detailed in Output Capacitor Selection.
Inductor selection is detailed in Inductor Selection. In general, a 10-µH inductor is recommended for the
nominal adjustable output range of 3.3 V to 5 V. The inductance can vary with the output voltage due to ripple
and current limit requirements.
9.2.3.3 Application Curves
The following characteristics apply only to the circuit of Figure 35. These parameters are not tested and
represent typical performance only. Unless otherwise stated, the following conditions apply: VIN = 12 V, TA
=
25°C. For the purpose of offering more information to the designer, information for the application with FPWM pin
high (FPWM mode) and FPWM pin low (AUTO mode) is included, although the schematic shows the application
running specifically in AUTO mode. The mode is specified under each of the following graphs.
100%
95%
90%
85%
80%
75%
70%
65%
60%
55%
50%
45%
40%
35%
30%
25%
20%
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
6.0 VIN
6.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
0.1
0.0001
0.0001
0.001
0.01
0.1
1
10
1.0001
2.0001
Output Current (A)
3.0001
4.0001
5.0001
Output Current (A)
LMS3
LMS3
VOUT = 3.3 V
AUTO
VOUT = 3.3 V
FPWM
Figure 36. Efficiency
Figure 37. Efficiency
Copyright © 2017–2018, Texas Instruments Incorporated
35
LMS3655
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
www.ti.com.cn
3.4
3.38
3.36
3.34
3.32
3.3
3.4
3.38
3.36
3.34
3.32
3.3
6.0 VIN
6.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
12.0 VIN
13.5 VIN
18.0 VIN
24.0 VIN
36.0 VIN
3.28
3.26
3.24
3.22
3.2
3.28
3.26
3.24
3.22
3.2
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
1
2
3
4
5
6
Output Current (A)
Output Current (A)
LMS3
LMS3
VOUT = 3.3 V
AUTO
VOUT = 3.3 V
FPWM
Figure 38. Load and Line Regulation
Figure 39. Load and Line Regulation
1.2
1
1400
1200
1000
800
600
400
200
0
-40èC
25èC
105èC
0.8
0.6
0.4
0.2
0
0
1
2
3
4
5
6
0
5
10
15
20
25
30
35
40
Output Current (A)
Input Voltage (V)
LMS3
LMS3
VOUT = 3.3 V
VOUT = 3.3 V
Figure 41. Dropout for –3% Regulation
Figure 40. Load Current for PFM-to-PWM Transition
450000
400000
350000
300000
250000
200000
150000
100000
50000
0
1.2
1
-40èC
25èC
105èC
0.8
0.6
0.4
0.2
0
8 VIN
12 VIN
18 VIN
24 VIN
0.001
0.01
0.1
1
10
0
1
2
3
4
5
6
Output Current (A)
Output Current (A)
LMS3
LMS3
VOUT = 3.3 V
AUTO
VOUT = 3.3 V
Figure 42. Dropout for ≥ 330 kHz
Figure 43. Switching Frequency vs Load Current
36
Copyright © 2017–2018, Texas Instruments Incorporated
LMS3655
www.ti.com.cn
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
9
8
7
6
5
4
3
2
1
LMS3655
40
0
0
5
10
15
20
25
30
35
45
Input Voltage (V)
AUTO
VOUT = 3.3 V
L = 10 µH,
LMS3
VOUT = 3.3 V
L = 10 µH
COUT = 190 µF
IOUT = 0 A to 3.5 A
TR = TF = 1 µs
Figure 44. Output Current Level for Overcurrent Protection
Trip
Figure 45. Load Transient
FPWM
VOUT = 3.3 V
L = 10 µH,
VOUT = 3.3 V
IOUT = 10 mA
COUT = 190 µF
IOUT = 0 A to 3.5 A
TR = TF = 1 µs
Figure 47. Mode Change Transient AUTO to FPWM mode
Figure 46. Load Transient
Copyright © 2017–2018, Texas Instruments Incorporated
37
LMS3655
ZHCSGY9B –JULY 2017–REVISED MARCH 2018
www.ti.com.cn
9.2.4 6-V Adjustable Output
VIN
8 V œ 36 V
PVIN 1
PVIN 2
10 µF
10 µF
PGND1
AVIN
PGND2
RESET
0.1 µF
0.1 µF
VCC
NC
4.7 µF
LMS3655
BIAS
AGND
3Ω
0.1 µF
FB
FPWM
EN
22 pF
10.2 kΩ
49.9 kΩ
CBOOT
470 nF
VOUT = 6 V
SW
SYNC
L1 = 10 µH
1 X 67 µF
1 X 120 µF
ESR = 25 mΩ
Copyright © 2017, Texas Instruments Incorporated
Figure 48. 6-V Output Power Supply
9.2.4.1 Design Requirements
The application highlighted in this section is for a typical 6-V system. The input voltages are here for illustration
purposes only. See Electrical Characteristics for minimum operating input voltage.
Table 10. Example Requirements for 6-V Application
DESIGN PARAMETER
Input voltage range
EXAMPLE VALUE
8-V to 18-V steady-state
0 A to 5.5 A
Output current
Switching Frequency at 0-A load
Current Consumption at 0-A load
Synchronization
> 250 kHz preferred
Not critical
No
9.2.4.2 Detailed Design Procedure
•
BIAS is connected to the output. This example assumes that inductive shorts are a risk for this application so
a 3-Ω resistor is added between BIAS and the output. A 0.1-µF capacitor is added close to the BIAS pin.
•
FB is connected to the output through a voltage divider in order to create a voltage of 1 V at the FB pin when
the output is at 6 V. A 22-pF capacitance is added in parallel with the top feedback resistor in order to
improve transient behavior. BIAS and FB are connected to the output through separate traces. This is
important to reduce noise and achieve good performances. See Layout Guidelines for more details on the
proper layout method.
•
•
SYNC is connected to ground directly as there is no need for this function in this application.
EN is toggled by an external device (like an MCU for example). A pulldown resistor is placed to ensure the
part does not turn on if the external source is not driving the pin (Hi-Z condition).
•
FPWM is connected to VIN. This causes the device to operate in FPWM mode. To prevent frequency
foldback behavior at low duty cycles, provide a 200mA load. In this mode, the device remains in CCM
operation regardless of the output current and is ensured to be within the boundaries set by FSW. The
drawback is that the efficiency is not optimized for light loads. See Device Functional Modes for more details.
•
A 4.7-µF capacitor is connected between VCC and GND close to the VCC pin. This ensure stable operation
of the internal LDO.
•
RESET is not used in this example so the pin has been left floating. Other possible connections can be seen
38
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in the previous typical applications and in RESET Flag Output.
•
Power components (input capacitor, output capacitor, and inductor) selection can be found here in External
Components Selection.
9.2.4.3 Application Curves
The following characteristics apply only to the circuit of Figure 48. These parameters are not tested and
represent typical performance only. Unless otherwise stated, the following conditions apply: VIN = 12 V, TA
=
25°C.
VOUT = 6 V
FPWM
IOUT = 0 A
VOUT = 6 V
FPWM
IOUT = 0 A
Figure 50. Start-Up Waveform (EN Tied to VIN)
Figure 49. Start-Up Waveform
FPWM
VOUT = 6 V
IOUT = 0 A to 3.5 A
L = 10 µH,
COUT = 190 µF
TR = TF = 1 µs
Figure 51. Load Transient
Copyright © 2017–2018, Texas Instruments Incorporated
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ZHCSGY9B –JULY 2017–REVISED MARCH 2018
www.ti.com.cn
9.3 Do's and Don't's
•
•
•
•
•
•
Don't: Exceed the Absolute Maximum Ratings.
Don't: Exceed the Recommended Operating Conditions.
Don't: Allow the EN, FPWM or SYNC input to float.
Don't: Allow the output voltage to exceed the input voltage, nor go below ground.
Don't: Use the thermal data given in the Thermal Information table to design your application.
Do: Follow all of the guidelines and/or suggestions found in this data sheet before committing a design to
production. TI Application Engineers are ready to help critique designs and PCB layouts to help ensure
successful projects.
•
Do: Refer to the helpful documents found in 相关文档.
10 Power Supply Recommendations
The characteristics of the input supply must be compatible with the Absolute Maximum Ratings and
Recommended Operating Conditions found in this data sheet. In addition, the input supply must be capable of
delivering the required input current to the loaded regulator. The average input current can be estimated with
Equation 6:
VOUT ∂IOUT
IIN =
V ∂ h
IN
where
•
η is the efficiency
(6)
If the regulator is connected to the input supply through long wires or PCB traces, special care is required to
achieve good performance. The parasitic inductance and resistance of the input cables can have an adverse
effect on the operation of the regulator. The parasitic inductance, in combination with the low-ESR ceramic input
capacitors, can form an under-damped resonant circuit. This circuit may cause overvoltage transients at the VIN
pin, each time the input supply is cycled on and off. The parasitic resistance causes the voltage at the VIN pin to
dip when the load on the regulator is switched on or exhibits a transient. If the regulator is operating close to the
minimum input voltage, this dip may cause the device to shut down or reset. The best way to solve these kinds
of issues is to reduce the distance from the input supply to the regulator or use an aluminum or tantalum input
capacitor in parallel with the ceramics. The moderate ESR of these types of capacitors helps to damp the input
resonant circuit and reduce any voltage overshoots. A value in the range of 20 µF to 100 µF is usually sufficient
to provide input damping and help to hold the input voltage steady during large load transients.
Sometimes, for other system considerations, an input filter is used in front of the regulator. This can lead to
instability, as well as some of the effects mentioned above, unless it is designed carefully. LP3913 Power
Management IC for Flash Memory Based Portable Media Players (SNVA489) provides helpful suggestions when
designing an input filter for any switching regulator.
In some cases a transient voltage suppressor (TVS) is used on the input of regulators. One class of this device
has a snap-back V-I characteristic (thyristor type). The use of a device with this type of characteristic is not
recommend. When the TVS fires, the clamping voltage drops to a very low value. If this holding voltage is less
than the output voltage of the regulator, the output capacitors are discharged through the regulator back to the
input. This uncontrolled current flow could damage the regulator.
11 Layout
11.1 Layout Guidelines
The PCB layout of a DC-DC converter is critical for optimal performance of the application. For a buck converter
the input loop formed by the input capacitors and power grounds are very critical. The input loop carries fast
transient currents that cause larger transient voltages when reacting with a parasitic loop inductance. The IC
uses two input loops in parallel IN1 and IN2 as shown in Figure 52 that cuts the parasitic input inductance in half.
To get the minimum input loop area two small high frequency capacitors CIN1 and CIN2 are placed as close as
possible.
40
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Layout Guidelines (continued)
To further reduce inductance, an input current return path should be placed underneath the loops IN1 and IN2.
The closest metal plane is MID1 Layer2, and there is a solid copper plane placed right under the IN1 and IN2
loop the parasitic loop inductance is minimized. Connecting this MID1 Layer2 plane to GND provides a nice
bridge connection between GND1 and GND2 as well. Minimizing the parasitic input loop inductance will minimize
switch node ringing and EMI.
The output current loop can be optimized as well by using two ceramic output caps COUT1 and COUT2, one on
each side. They form two parallel ground return paths OUT1 from COUT1 back to the low-side FET PGND1 pins
5, 6, 7, 8, and a second symmetric ground return path OUT2 from COUT2 back to low-side FET PGND2 pins 10,
11, 12, and 13. Having two parallel ground return paths yield reduced ground bouncing and reduced sensitivity of
surrounding circuits.
Figure 52. Layout of the Power Components and Current Flow
Providing adequate thermal paths to dissipate heat is critical for operation at full current. The recommended
method for heat dissipation is to use large solid 2-oz copper planes well connected to the power pins VIN1, VIN2,
GND1, and GND2 which transfer the heat out of the IC over the TOP Layer1 copper planes. It is important to
leave the TOP Layer1 copper planes as unbroken as possible so that heat is not trapped near the IC. The heat
flow can be further optimized by thermally connecting the TOP Layer1 plane to large BOTTOM Layer 4 2-oz
copper planes with vias. MID2 Layer3 is then open for all other signal routing. A fully filled or solid BOTTOM
Layer4 ground plane without any interruptions or ground splitting is beneficial for EMI as well. Most important for
low EMI is to use the smallest possible switch node copper area. The switch node including the CBOOT cap has
the largest dV/dt signal causing common-mode noise coupling. Using any kind of grounded shield around the
switch node shortens and reduces this e-field.
All these DC-DC converter descriptions can be transformed into layout guidelines:
1. Place two 0.047-µF, 50-V high frequency input capacitors CIN1 and CIN2 as close as possible to the VIN1,
VIN2, PGND1, PGND2 pins to minimize switch node ringing.
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ZHCSGY9B –JULY 2017–REVISED MARCH 2018
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Layout Guidelines (continued)
2. Place bypass capacitors for VCC and BIAS close to their respective pins. Make sure AGND pin sees the
CVCC and CBIAS capacitors first before a connection to PGND.
3. Place CBOOT capacitor with smallest parasitic loop. Shielding the CBOOT capacitor and switch node has the
biggest impact to reduce common-mode noise. Placing a small RBOOT resistor (less than 3 Ω is
recommended) in series to CBOOT slows down the dV/dt of the switch node and reduce EMI.
4. Place the feedback resistor divider as close as possible to the FB pin and to AGND pin of the device. Use a
dedicated feedback trace, and route away from switch node and CBOOT capacitor to avoid any cross coupling
into sensitive analog feedback.
5. Use a dedicated BIAS trace to avoid noise into feedback trace.
6. Use a 3-Ω to 5-Ω resistor between the output and BIAS if the load is far from the output of the converter or
inductive shorts on the output are possible.
7. Use well connected large 2-oz. TOP and BOTTOM copper planes for all power pins VIN1/2 and PGND1/2.
8. Minimize switch node and CBOOT area for lowest EMI common mode noise.
9. Place input and output wires on the same side of the PCB using an EMI filter and away from the switch node
for lowest EMI.
The resources in 器件和文档支持 provide additional important guidelines.
11.2 Layout Example
This example layout is the one used in the LMS3655 EVM. It shows the CIN and CIN_HF capacitors placed
symmetrically on either side of the device.
Figure 53. Recommended Layout for LMS3655
42
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LMS3655
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12 器件和文档支持
12.1 器件支持
12.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
12.2 文档支持
12.2.1 相关文档
更多信息,请参见以下文档:
•
•
•
•
•
•
•
《采用前馈电容器优化内部补偿直流/直流转换器的瞬态响应》(SLVA289)
《降压开关稳压器的输出纹波电压》(SLVA630)
《AN-1149 开关电源布局指南》(SNVA021)
《AN-1229 Simple Switcher® PCB 布局指南》(SNVA054)
《构建电源 - 布局注意事项》(SLUP230)
《AN-2020 热设计:学会洞察先机,不做事后诸葛》(SNVA419)
《半导体和 IC 封装热指标》(SPRA953)
12.3 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.5 商标
HotRod, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,也
不会对此文档进行修订。如欲获取此数据表的浏览器版本,请参阅左侧的导航。
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43
PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMS3655AMRNLR
LMS3655AMRNLT
LMS3655MMRNLR
LMS3655MMRNLT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VQFN-HR
VQFN-HR
VQFN-HR
VQFN-HR
RNL
RNL
RNL
RNL
22
22
22
22
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LM3655A
Samples
Samples
Samples
Samples
SN
SN
SN
LM3655A
LM3655M
LM3655M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2023
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMS3655 :
Automotive : LMS3655-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
GENERIC PACKAGE VIEW
RNL 22
5 X 4, 0.5 mm pitch
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226989/A
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PACKAGE OUTLINE
RNL0022A
VQFN-HR - 0.9 mm max height
SCALE 2.800
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
A
B
PIN 1 INDEX AREA
5.1
4.9
0.1 MIN
(0.05)
SECTION A-A
SCALE 30.000
SECTION A-A
TYPICAL
0.9
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
2
1
0.45
0.35
2X 0.8 0.1
8X 0.5
5X
(0.2) TYP
9
8
10
7
4
11
2X
1.45 0.1
2X
2X
2.175
2.95 0.1
0.25
PKG
14
0.3
0.2
15X
2X
2
2X 0.85
A
A
0.1
0.05
C A B
C
0.65
0.45
5X
22
17
1
2X 0.575
0.45
0.35
18
0.45
0.35
SYMM
2
0.5
0.3
11X
0.5
0.3
4221861/E 07/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
RNL0022A
VQFN-HR - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X (0.5)
18
SYMM
15X (0.25)
22
12X (0.6)
2X (0.4)
(2.325)
1
17
2X (2)
5X (0.75)
2X (1.425)
SEE SOLDER MASK
DETAILS
3X (0.4)
2X (0.575)
2X (1)
2X (0.4)
0.000 PKG
2X (0.25)
14
(0.295)
4
(
0.2) VIA TYP
NOTE 4
(3.15)
(1.125)
2X (1.65)
2X (1.875)
(2.175)
(1.955)
11
7
4X (0.5)
8
9
(2)
10
(3.4)
6X (3.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL EDGE
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
SOLDER MASK DETAILS
(PREFERRED)
4221861/E 07/2019
NOTES: (continued)
3. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
RNL0022A
VQFN-HR - 0.9 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X (0.5)
SYMM
15X (0.25)
5X (0.75)
18
22
12X (0.6)
2X (0.4)
(2.325)
1
2X (2)
17
(R0.05) TYP
2X (1.425)
2X (0.575)
6X
EXPOSED
METAL
7X
EXPOSED
METAL
(1.4)
(0.12)
0.000 PKG
(0.25)
4X ( 0.4)
4
14
(0.71)
(2)
2X (1.445)
(1.54)
4X (0.5)
11
2X (2.175)
2X (2.305)
4X
(0.66)
7
(2.37)
9
10
8
8X (0.4)
4X (0.63)
(2)
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
FOR PADS 4,8,9,10 & 14
80% PRINTED SOLDER COVERAGE BY AREA
SCALE:25X
4221861/E 07/2019
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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