LMV821-N [TI]
LMV821-N/LMV822-N/LMV822-N-Q1/LMV824/LMV824-N-Q1 Single/Dual/Quad Low Voltage; LMV821 -N / LMV822 -N / LMV822 -N -Q1 / LMV824 / LMV824 -N -Q1单/双/四通道，低电压
| 型号： | LMV821-N |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LMV821-N/LMV822-N/LMV822-N-Q1/LMV824/LMV824-N-Q1 Single/Dual/Quad Low Voltage |
| 文件： | 总37页 (文件大小：2310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
LMV821-N/LMV822-N/LMV822-N-Q1/LMV824/LMV824-N-Q1 Single/Dual/Quad Low Voltage,
Low Power, R-to-R Output, 5 MHz Op Amps
Check for Samples: LMV821-N, LMV822-N, LMV822-N-Q1, LMV824-N, LMV824-N-Q1
1
FEATURES
APPLICATIONS
2
•
(For Typical, 5 V Supply Values; Unless
Otherwise Noted)
•
•
•
•
•
Cordless Phones
Cellular Phones
Laptops
•
LMV822-Q1 and LMV824-Q1 are available in
Automotive AEC-Q100 Grade 1 version
PDAs
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Ultra Tiny, SC70-5 Package 2.0 x 2.0 x 1.0 mm
Guaranteed 2.5 V, 2.7 V and 5 V Performance
Maximum VOS 3.5 mV (Guaranteed)
VOS Temp. Drift 1 uV/° C
PCMCIA
DESCRIPTION
The LMV821/LMV822/LMV824 bring performance
and economy to low voltage / low power systems.
With a 5 MHz unity-gain frequency and a guaranteed
1.4 V/µs slew rate, the quiescent current is only 220
µA/amplifier (2.7 V). They provide rail-to-rail (R-to-R)
output swing into heavy loads (600 Ω Guarantees).
The input common-mode voltage range includes
ground, and the maximum input offset voltage is
3.5mV (Guaranteed). They are also capable of
comfortably driving large capacitive loads (refer to the
application notes section).
GBW product @ 2.7 V 5 MHz
ISupply @ 2.7 V 220 μA/Amplifier
Minimum SR 1.4 V/us (Guaranteed)
CMRR 90 dB
PSRR 85 dB
VCM @ 5V -0.3V to 4.3V
Rail-to-Rail (R-to-R) Output Swing
@600 Ω Load 160 mV from rail
@10 kΩ Load 55 mV from rail
The LMV821 (single) is available in the ultra tiny
SC70-5 package, which is about half the size of the
previous title holder, the SOT23-5.
Stable with High Capacitive Loads (Refer to
Application Section)
Overall,
the
LMV821/LMV822/LMV824
(Single/Dual/Quad) are low voltage, low power,
performance op amps, that can be designed into a
wide range of applications, at an economical price.
Telephone-line Transceiver for a PCMCIA Modem Card
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
(3)
ESD Tolerance
Machine Model
Human Body Model
LMV822/824
100V
2000V
1500V
LMV821
Differential Input Voltage
± Supply Voltage
5.5V
Supply Voltage (V+–V −
)
Output Short Circuit to V+(4)
Output Short Circuit to V−(4)
Soldering Information
Infrared or Convection (20 sec)
Storage Temperature Range
235°C
−65°C to 150°C
150°C
(5)
Junction Temperature
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human body model, 1.5 kΩ in series wth 100 pF. Machine model, 200Ω in series with 100 pF.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 45 mA over long term may adversely
affect reliability.
(5) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings(1)
Supply Voltage
2.5V to 5.5V
Temperature Range
LMV821, LMV822, LMV824
LMV822-Q1, LMV824-Q1
−40°C ≤T J ≤85°C
−40°C ≤T J ≤125°C
Thermal Resistance (θ JA
)
Ultra Tiny SC70-5 Package, 5-Pin Surface Mount
Tiny SOT23-5 Package, 5-Pin Surface Mount
SOIC Package, 8-Pin Surface Mount
VSSOP Package, 8-Pin Mini Surface Mount
SOIC Package, 14-Pin Surface Mount
TSSOP Package, 14-Pin
440 °C/W
265 °C/W
190 °C/W
235 °C/W
145 °C/W
155 °C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
2
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
2.7V DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C. V+ = 2.7V, V − = 0V, VCM = 1.0V, VO = 1.35V and R L > 1 MΩ.
Boldface limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV821/822/824 and −40°C ≤T J ≤125°C for
LMV822-Q1/LMV824-Q1).
Typ
LMV821/822/824
Symbol
VOS
Parameter
Input Offset Voltage
Condition
Units
(1)
(2)
Limit
3.5
4
LMV821/822/822-Q1/824
LMV824-Q1
1
mV
max
1
1
5.5
TCVOS
IB
Input Offset Voltage Average Drift
Input Bias Current
μV/°C
90
140
nA
max
30
0.5
85
IOS
Input Offset Current
30
50
nA
max
CMRR
+PSRR
Common Mode Rejection Ratio
0V ≤ VCM ≤ 1.7V
70
68
dB
min
Positive Power Supply Rejection
Ratio
1.7V ≤ V+ ≤ 4V, V- = 1V, VO = 0V,
VCM = 0V
LMV821/822/824/824-Q1
75
70
dB
min
85
85
85
LMV822-Q1
-1.0V ≤ V- ≤ -3.3V, V+ = 1.7V, VO
= 0V, VCM = 0V
75
dB
−PSRR
Negative Power Supply Rejection
Ratio
73
70
dB
min
LMV821/822/824/824-Q1
LMV822-Q1
85
-0.3
2.0
73
-0.2
1.9
dB
V
VCM
Input Common-Mode Voltage
Range
For CMRR ≥ 50dB
V
AV
Large Signal Voltage Gain
Sourcing, RL = 600Ω to 1.35V,
VO = 1.35V to 2.2V;
LMV821/822/824
90
85
dB
min
100
100
90
LMV822-Q1/LMV824-Q1
90
dB
Sinking, RL = 600Ω to 1.35V,
VO = 1.35V to 0.5V
LMV821/822/824
85
80
dB
min
LMV822-Q1/LMV824-Q1
90
85
dB
Sourcing, RL =2kΩ to 1.35V,
VO = 1.35V to 2.2V;
LMV821/822/824
95
90
dB
min
100
100
95
LMV822-Q1/LMV824-Q1
95
dB
Sinking, RL = 2kΩ to 1.35V,
VO = 1.35V to 0.5V
LMV821/822/824
90
85
dB
min
LMV822-Q1/LMV824-Q1
95
90
dB
V O
Output Swing
V+ = 2.7V, RL= 600Ω to 1.35V
2.50
2.40
V
min
2.58
0.20
0.30
V
max
0.13
2.66
0.08
V+ = 2.7V, RL= 2kΩ to 1.35V
2.60
2.50
V
min
0.120
0.200
V
max
IO
Output Current
Sourcing, VO = 0V
Sinking, VO = 2.7V
16
26
12
12
mA
mA
(1) Typical Values represent the most likely parametric norm.
(2) All limits are guaranteed by testing or statistical analysis.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
2.7V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits guaranteed for TJ = 25°C. V+ = 2.7V, V − = 0V, VCM = 1.0V, VO = 1.35V and R L > 1 MΩ.
Boldface limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV821/822/824 and −40°C ≤T J ≤125°C for
LMV822-Q1/LMV824-Q1).
Typ
LMV821/822/824
Symbol
IS
Parameter
Supply Current
Condition
LMV821 (Single)
Units
(1)
(2)
Limit
0.3
0.5
mA
max
0.22
0.45
0.72
LMV822 (Dual)
LMV824 (Quad)
0.6
0.8
mA
max
1.0
1.2
mA
max
2.5V DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C. V+ = 2.5V, V − = 0V, VCM = 1.0V, VO = 1.25V and R L > 1 MΩ.
Boldface limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV821/822/824 and −40°C ≤T J ≤125°C for
LMV822-Q1/LMV824-Q1).
Typ
LMV821/822/824
Symbol
VOS
Parameter
Input Offset Voltage
Condition
Units
(1)
(2)
Limit
LMV821/822/822-Q1/824
3.5
4
mV
max
1
1
LMV824-Q1
5.5
V O
Output Swing
2.30
2.20
V
min
2.37
V+ = 2.5V, RL = 600Ω to 1.25V
0.20
0.30
V
max
0.13
2.46
0.08
2.40
2.30
V
min
V+ = 2.5V, RL = 2kΩ to 1.25V
0.12
0.20
V
max
(1) Typical Values represent the most likely parametric norm.
(2) All limits are guaranteed by testing or statistical analysis.
2.7V AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C. V+ = 2.7V, V − = 0V, VCM = 1.0V, VO = 1.35V and R L > 1 MΩ.
Boldface limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV821/822/824 and −40°C ≤T J ≤125°C for
LMV822-Q1/LMV824-Q1).
(2)
Typ
LMV821/822/824 Limit
Symbol
Parameter
Conditions
Units
(1)
(3)
(4)
SR
Slew Rate
1.5
5
V/μs
MHz
Deg.
dB
GBW
Φm
Gain-Bandwdth Product
Phase Margin
61
10
135
28
0.1
Gm
Gain Margin
Amp-to-Amp Isolation
Input-Related Voltage Noise
Input-Referred Current Noise
Total Harmonic Distortion
dB
en
f = 1 kHz, VCM = 1V
f = 1 kHz
nV/√Hz
pA/√Hz
in
THD
f = 1 kHz, AV = −2,
RL = 10 kΩ, VO = 4.1 V PP
0.01
%
(1) Typical Values represent the most likely parametric norm.
(2) All limits are guaranteed by testing or statistical analysis.
(3) V+ = 5V. Connected as voltage follower with 3V step input. Number specified is the slower of the positive and negative slew rates.
(4) Input referred, V+ = 5V and RL = 100kΩ connected to 2.5V. Each amp excited in turn with 1 kHz to produce V O = 3 VPP
.
4
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
5V DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C. V+ = 5V, V − = 0V, VCM = 2.0V, VO = 2.5V and R L > 1 MΩ.
Boldface limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV821/822/824 and −40°C ≤T J ≤125°C for
LMV822-Q1/LMV824-Q1).
Typ
LMV821/822/824
Symbol
VOS
Parameter
Input Offset Voltage
Condition
Units
(1)
(2)
Limit
LMV821/822/822-Q1/824
3.5
4.0
mV
max
1
LMV824-Q1
1
1
5.5
TCVOS
IB
Input Offset Voltage Average Drift
Input Bias Current
μV/°C
100
150
nA
max
40
0.5
90
IOS
Input Offset Current
30
50
nA
max
CMRR
+PSRR
Common Mode Rejection Ratio
0V ≤ VCM ≤ 4.0V
72
70
dB
min
Positive Power Supply Rejection
Ratio
1.7V ≤ V+ ≤ 4V, V- = 1V, VO = 0V,
VCM = 0V
LMV821/822/824/824-Q1
75
70
dB
min
85
85
85
LMV822-Q1
-1.0V ≤ V- ≤ -3.3V, V+ = 1.7V, VO
= 0V, VCM = 0V
75
dB
−PSRR
Negative Power Supply Rejection
Ratio
73
70
dB
min
LMV821/822/824/824-Q1
LMV822-Q1
85
-0.3
4.3
73
-0.2
4.2
dB
V
VCM
Input Common-Mode Voltage
Range
For CMRR ≥ 50dB
V
AV
Large Signal Voltage Gain
Sourcing, RL = 600Ω to 1.35V,
VO = 1.35V to 2.2V;
LMV821/822/824
95
90
dB
min
105
105
105
105
105
105
105
LMV822-Q1/LMV824-Q1
95
dB
Sinking, RL = 600Ω to 1.35V,
VO = 1.35V to 0.5V
LMV821/822/824
95
90
dB
min
LMV822-Q1/LMV824-Q1
95
dB
Sourcing, RL =2kΩ to 1.35V,
VO = 1.35V to 2.2V;
LMV821/822/824
95
90
dB
min
LMV822-Q1/LMV824-Q1
95
dB
Sinking, RL = 2kΩ to 1.35V,
VO = 1.35V to 0.5V
LMV821/822/824
95
90
dB
min
LMV822-Q1/LMV824-Q1
105
95
dB
V O
Output Swing
V+ = 5V,RL = 600Ω to 2.5V
4.75
4.70
4.84
V
min
V+ = 5V,RL = 600Ω to 2.5V
(LMV824-Q1)
V+ = 5V,RL = 600Ω to 2.5V
4.84
0.17
0.17
4.90
0.10
4.60
0.250
0.30
V
max
V+ = 5V,RL = 600Ω to 2.5V
(LMV824-Q1)
V+ = 5V, RL = 2kΩ to 2.5V
0.40
4.85
4.80
V
min
0.15
0.20
V
max
(1) Typical Values represent the most likely parametric norm.
(2) All limits are guaranteed by testing or statistical analysis.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
5V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits guaranteed for TJ = 25°C. V+ = 5V, V − = 0V, VCM = 2.0V, VO = 2.5V and R L > 1 MΩ.
Boldface limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV821/822/824 and −40°C ≤T J ≤125°C for
LMV822-Q1/LMV824-Q1).
Typ
LMV821/822/824
Symbol
IO
Parameter
Output Current
Condition
Sourcing, VO = 0V
Units
(1)
(2)
Limit
20
15
mA
min
45
40
Sinking, VO = 5V
LMV821 (Single)
LMV822 (Dual)
LMV824 (Quad)
20
15
mA
min
IS
Supply Current
0.4
0.6
mA
max
0.30
0.5
1.0
0.7
0.9
mA
max
1.3
1.5
mA
max
6
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
5V AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C. V+ = 5V, V − = 0V, VCM = 2V, VO = 2.5V and R L > 1 MΩ.
Boldface limits apply at the temperature extremes (−40°C ≤T J ≤85°C for LMV821/822/824 and −40°C ≤T J ≤125°C for
LMV822-Q1/LMV824-Q1).
(2)
Typ
LMV821/822/824 Limit
Symbol
Parameter
Conditions
Units
(1)
(3)
(4)
SR
Slew Rate
2.0
5.6
67
1.4
V/μs min
MHz
GBW
Φm
Gain-Bandwdth Product
Phase Margin
Deg.
Gm
Gain Margin
15
dB
Amp-to-Amp Isolation
Input-Related Voltage Noise
Input-Referred Current Noise
Total Harmonic Distortion
135
24
dB
en
f = 1 kHz, VCM = 1V
f = 1 kHz
nV/√Hz
pA/√Hz
in
0.25
THD
f = 1 kHz, AV = −2,
RL = 10 kΩ, VO = 4.1 V PP
0.01
%
(1) Typical Values represent the most likely parametric norm.
(2) All limits are guaranteed by testing or statistical analysis.
(3) V+ = 5V. Connected as voltage follower with 3V step input. Number specified is the slower of the positive and negative slew rates.
(4) Input referred, V+ = 5V and RL = 100kΩ connected to 2.5V. Each amp excited in turn with 1 kHz to produce V O = 3 VPP
.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
Typical Performance Characteristics
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Supply Current
Input Current
vs.
vs.
Supply Voltage (LMV821)
Temperature
Figure 1.
Figure 2.
Sourcing Current
vs.
Output Voltage (VS = 2.7V)
Sourcing Current
vs
Output Voltage (VS = 5V)
Figure 3.
Figure 4.
Sinking Current
vs.
Output Voltage (VS = 2.7V)
Sinking Current
vs.
Output Voltage (VS = 5V)
Figure 5.
Figure 6.
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Output Voltage Swing
Output Voltage Swing
vs.
Supply Voltage (RL = 2kΩ)
vs.
Supply Voltage (RL = 10kΩ)
Figure 7.
Figure 8.
Output Voltage Swing
vs.
Supply Voltage (RL = 600Ω)
Output Voltage Swing
vs.
Load Resistance
Figure 9.
Figure 10.
Input Voltage Noise
vs.
Input Current Noise
vs.
Frequency
Frequency
Figure 11.
Figure 12.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Crosstalk Rejection
+PSRR
vs.
Frequency
vs.
Frequency
Figure 13.
Figure 14.
-PSRR
vs.
Frequency
CMRR
vs.
Frequency
Figure 15.
Figure 16.
Gain and Phase Margin
vs.
Input Voltage
vs.
Output Voltage
Frequency
(RL = 100kΩ, 2kΩ, 600Ω) 2.7V
Figure 17.
Figure 18.
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Gain and Phase Margin
Gain and Phase Margin
vs.
vs.
Frequency
(RL = 100kΩ, 2kΩ, 600Ω) 5V
Frequency
(Temp.= 25, -40, 85°C, RL = 10kΩ) 2.7V
Figure 19.
Figure 20.
Gain and Phase Margin
Gain and Phase Margin
vs.
vs.
Frequency
(Temp.= 25, -40, 85 °C, RL = 10kΩ) 5V
Frequency
(CL = 100pF, 200pF, 0pF, RL = 10kΩ)2.7V
Figure 21.
Figure 22.
Gain and Phase Margin
Gain and Phase Margin
vs.
vs.
Frequency
(CL = 100pF, 200pF, 0pF RL = 10kΩ) 5V
Frequency
(CL = 100pF, 200pF, 0pF RL = 600Ω) 2.7V
Figure 23.
Figure 24.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
Gain and Phase Margin
vs.
Slew Rate
vs.
Supply Voltage
Frequency
(CL = 100pF, 200pF, 0pF RL = 600Ω) 5V
Figure 25.
Figure 26.
Non-Inverting Large Signal Pulse Response
Non-Inverting Small Signal Pulse Response
Figure 27.
Figure 28.
Inverting Large Signal Pulse Response
Inverting Small Signal Pulse Response
Figure 29.
Figure 30.
12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
Typical Performance Characteristics (continued)
Unless otherwise specified, VS = +5V, single supply, TA = 25°C.
THD
vs.
Frequency
Figure 31.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
APPLICATION NOTE
This application note is divided into two sections: design considerations and Application Circuits.
DESIGN CONSIDERATIONS
This section covers the following design considerations:
1. Frequency and Phase Response Considerations
2. Unity-Gain Pulse Response Considerations
3. Input Bias Current Considerations
FREQUENCY AND PHASE RESPONSE CONSIDERATIONS
The relationship between open-loop frequency response and open-loop phase response determines the closed-
loop stability performance (negative feedback). The open-loop phase response causes the feedback signal to
shift towards becoming positive feedback, thus becoming unstable. The further the output phase angle is from
the input phase angle, the more stable the negative feedback will operate. Phase Margin (φm) specifies this
output-to-input phase relationship at the unity-gain crossover point. Zero degrees of phase-margin means that
the input and output are completely in phase with each other and will sustain oscillation at the unity-gain
frequency.
The AC tables show φm for a no load condition. But φm changes with load. The Gain and Phase margin vs
Frequency plots in the curve section can be used to graphically determine the φm for various loaded conditions.
To do this, examine the phase angle portion of the plot, find the phase margin point at the unity-gain frequency,
and determine how far this point is from zero degree of phase-margin. The larger the phase-margin, the more
stable the circuit operation.
The bandwidth is also affected by load. The graphs of Figure 32 and Figure 33 provide a quick look at how
various loads affect the φm and the bandwidth of the LMV821/822/824 family. These graphs show capacitive
loads reducing both φm and bandwidth, while resistive loads reduce the bandwidth but increase the φm. Notice
how a 600Ω resistor can be added in parallel with 220 picofarads capacitance, to increase the φm 20°(approx.),
but at the price of about a 100 kHz of bandwidth.
Overall, the LMV821/822/824 family provides good stability for loaded condition.
Figure 32. Phase Margin vs Common Mode Voltage for Various Loads
14
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
Figure 33. Unity-Gain Frequency vs Common Mode Voltage for Various Loads
UNITY GAIN PULSE RESPONSE CONSIDERATION
A pull-up resistor is well suited for increasing unity-gain, pulse response stability. For example, a 600 Ω pull-up
resistor reduces the overshoot voltage by about 50%, when driving a 220 pF load. Figure 34 shows how to
implement the pull-up resistor for more pulse response stability.
Figure 34. Using a Pull-up Resistor at the Output for Stabilizing Capacitive Loads
Higher capacitances can be driven by decreasing the value of the pull-up resistor, but its value shouldn't be
reduced beyond the sinking capability of the part. An alternate approach is to use an isolation resistor as
illustrated in Figure 35 .
Figure 36 shows the resulting pulse response from a LMV824, while driving a 10,000 pF load through a 20Ω
isolation resistor.
Figure 35. Using an Isolation Resistor to Drive Heavy Capacitive Loads
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
Figure 36. Pulse Response per Figure 35
INPUT BIAS CURRENT CONSIDERATION
Input bias current (IB) can develop a somewhat significant offset voltage. This offset is primarily due to IB flowing
through the negative feedback resistor, RF. For example, if IB is 90 nA (max @ room) and RF is 100 kΩ, then an
offset of 9 mV will be developed (VOS=IBx RF).Using a compensation resistor (RC), as shown in Figure 37,
cancels out this affect. But the input offset current (IOS) will still contribute to an offset voltage in the same
manner - typically 0.05 mV at room temp.
Figure 37. Canceling the Voltage Offset Effect of Input Bias Current
APPLICATION CIRCUITS
This section covers the following application circuits:
1. Telephone-Line Transceiver
2. “Simple” Mixer (Amplitude Modulator)
3. Dual Amplifier Active Filters (DAAFs)
•
•
a. Low-Pass Filter (LPF)
b. High-Pass Filter (HPF)
4. Tri-level Voltage Detector
16
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
TELEPHONE-LINE TRANSCEIVER
The telephone-line transceiver of Figure 38 provides a full-duplexed connection through a PCMCIA, miniature
transformer. The differential configuration of receiver portion (UR), cancels reception from the transmitter portion
(UT). Note that the input signals for the differential configuration of UR, are the transmit voltage (VT) and VT/2.
This is because Rmatch is chosen to match the coupled telephone-line impedance; therefore dividing VT by two
(assuming R1 >> Rmatch). The differential configuration of UR has its resistors chosen to cancel the VT and VT/2
inputs according to the following equation:
(1)
Figure 38. Telephone-line Transceiver for a PCMCIA Modem Card
Note that Cr is included for canceling out the inadequacies of the lossy, miniature transformer. Refer to
application note AN-397 for detailed explanation.
“SIMPLE” MIXER (AMPLITUDE MODULATOR)
The mixer of Figure 39 is simple and provides a unique form of amplitude modulation. Vi is the modulation
frequency (FM), while a +3V square-wave at the gate of Q1, induces a carrier frequency (FC). Q1 switches
(toggles) U1 between inverting and non-inverting unity gain configurations. Offsetting a sine wave above ground
at Vi results in the oscilloscope photo of Figure 40.
The simple mixer can be applied to applications that utilize the Doppler Effect to measure the velocity of an
object. The difference frequency is one of its output frequency components. This difference frequency magnitude
(/FM-FC/) is the key factor for determining an object's velocity per the Doppler Effect. If a signal is transmitted to a
moving object, the reflected frequency will be a different frequency. This difference in transmit and receive
frequency is directly proportional to an object's velocity.
Figure 39. Amplitude Modulator Circuit
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
Figure 40. Output signal per the Circuit of Figure 39
DUAL AMPLIFIER ACTIVE FILTERS (DAAFs)
The LMV822/24 bring economy and performance to DAAFs. The low-pass and the high-pass filters of Figure 41
and Figure 42 (respectively), offer one key feature: excellent sensitivity performance. Good sensitivity is when
deviations in component values cause relatively small deviations in a filter's parameter such as cutoff frequency
(Fc). Single amplifier active filters like the Sallen-Key provide relatively poor sensitivity performance that
sometimes cause problems for high production runs; their parameters are much more likely to deviate out of
specification than a DAAF would. The DAAFs of Figure 41 and Figure 42 are well suited for high volume
production.
3 kHz Low-Pass Active Filter with a Butterworth Response and a Pass Band Gain of Times Two
Figure 41. Dual Amplifier
18
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
300 Hz High-Pass Active Filter with a Butterworth Response and a Pass Band Gain of Times Two
Figure 42. Dual Amplifier
Table 1 provides sensitivity measurements for a 10 MΩ load condition. The left column shows the passive
components for the 3 kHz low-pass DAAF. The third column shows the components for the 300 Hz high-pass
DAAF. Their respective sensitivity measurements are shown to the right of each component column. Their values
consists of the percent change in cutoff frequency (Fc) divided by the percent change in component value. The
lower the sensitivity value, the better the performance.
Each resistor value was changed by about 10 percent, and this measured change was divided into the measured
change in Fc. A positive or negative sign in front of the measured value, represents the direction Fc changes
relative to components' direction of change. For example, a sensitivity value of negative 1.2, means that for a 1
percent increase in component value, Fc decreases by 1.2 percent.
Note that this information provides insight on how to fine tune the cutoff frequency, if necessary. It should be also
noted that R4 and R5 of each circuit also caused variations in the pass band gain. Increasing R4 by ten percent,
increased the gain by 0.4 dB, while increasing R5 by ten percent, decreased the gain by 0.4 dB.
Table 1.
Component
(LPF)
Sensitivity
(LPF)
Component
(HPF)
Sensitivity
(HPF)
Ra
C1
R2
R3
C3
R4
R5
-1.2
-0.1
-1.1
+0.7
-1.5
-0.6
+0.6
Ca
Rb
R1
C2
R3
R4
R5
-0.7
-1.0
+0.1
-0.1
+0.1
-0.1
+0.1
Active filters are also sensitive to an op amp's parameters -Gain and Bandwidth, in particular. The LMV822/24
provide a large gain and wide bandwidth. And DAAFs make excellent use of these feature specifications.
Single Amplifier versions require a large open-loop to closed-loop gain ratio - approximately 50 to 1, at the Fc of
the filter response. Figure 43 shows an impressive photograph of a network analyzer measurement (hp3577A).
The measurement was taken from a 300 kHz version of Figure 41. At 300 kHz, the open-loop to closed-loop gain
ratio @ Fc is about 5 to 1. This is 10 times lower than the 50 to 1 “rule of thumb” for Single Amplifier Active
Filters.
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
Butterworth Response as Measured by the HP3577A Network Analyzer
Figure 43. 300 kHz, Low-Pass Filter
In addition to performance, DAAFs are relatively easy to design and implement. The design equations for the
low-pass and high-pass DAAFs are shown below. The first two equation calculate the Fc and the circuit Quality
Factor (Q) for the LPF (Figure 41). The second two equations calculate the Fc and Q for the HPF (Figure 42).
(2)
To simplify the design process, certain components are set equal to each other. Refer to Figure 41 and
Figure 42. These equal component values help to simplify the design equations as follows:
(3)
To illustrate the design process/implementation, a 3 kHz, Butterworth response, low-pass filter DAAF (Figure 41)
is designed as follows:
1. Choose C1 = C3 = C = 1 nF
2. Choose R4 = R5 = 1 kΩ
3. Calculate Ra and R2 for the desired Fc as follows:
(4)
4. Calculate R3 for the desired Q. The desired Q for a Butterworth (Maximally Flat) response is 0.707 (45
degrees into the s-plane). R3 calculates as follows:
20
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
(5)
Notice that R3 could also be calculated as 0.707 of Ra or R2.
The circuit was implemented and its cutoff frequency measured. The cutoff frequency measured at 2.92 kHz.
The circuit also showed good repeatability. Ten different LMV822 samples were placed in the circuit. The
corresponding change in the cutoff frequency was less than a percent.
TRI-LEVEL VOLTAGE DETECTOR
The tri-level voltage detector of Figure 44 provides a type of window comparator function. It detects three
different input voltage ranges: Min-range, Mid-range, and Max-range. The output voltage (VO) is at VCC for the
Min-range. VO is clamped at GND for the Mid-range. For the Max-range, VO is at Vee. Figure 45 shows a VO vs.
VI oscilloscope photo per the circuit of Figure 44.
Its operation is as follows: VI deviating from GND, causes the diode bridge to absorb IIN to maintain a clamped
condition (VO= 0V). Eventually, IIN reaches the bias limit of the diode bridge. When this limit is reached, the
clamping effect stops and the op amp responds open loop. The design equation directly preceding Figure 45,
shows how to determine the clamping range. The equation solves for the input voltage band on each side GND.
The mid-range is twice this voltage band.
Figure 44. Tri-level Voltage Detector
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
21
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
www.ti.com
'V
'V
OV
-VIN
+VIN
OV
Figure 45. X, Y Oscilloscope Trace showing VOUT vs VIN per the Circuit of Figure 44
Connection Diagram
Figure 46. 5-Pin SC70-5/SOT23-5
Figure 47. 8-Pin SOIC/VSSOP
Top View
Top View
Package Number DCK0005A/DBV0005A
Package Number D0008A/DGK0008A
Figure 48. 14-Pin SOIC/TSSOP
Top View
Package Number D0014A/PW0014A
22
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
LMV821-N, LMV822-N, LMV822-N-Q1
LMV824-N, LMV824-N-Q1
www.ti.com
SNOS032G –AUGUST 1999–REVISED NOVEMBER 2013
REVISION HISTORY
Changes from Revision D (February 2013) to Revision G
Page
•
•
•
•
•
•
Added new part ..................................................................................................................................................................... 1
Added new device ................................................................................................................................................................ 1
Added new device ................................................................................................................................................................ 2
Added new device ................................................................................................................................................................ 3
Added new device ................................................................................................................................................................ 4
Added new device ................................................................................................................................................................ 5
Copyright © 1999–2013, Texas Instruments Incorporated
Submit Documentation Feedback
23
Product Folder Links: LMV821-N LMV822-N LMV822-N-Q1 LMV824-N LMV824-N-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
1000
1000
(1)
(2)
(6)
(3)
(4/5)
LMV821M5
NRND
ACTIVE
SOT-23
SOT-23
DBV
5
5
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
A14
A14
LMV821M5/NOPB
DBV
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV821M5X
NRND
SOT-23
SOT-23
DBV
DBV
5
5
3000
3000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
A14
A14
LMV821M5X/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV821M7
NRND
SC70
SC70
DCK
DCK
5
5
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
A15
A15
LMV821M7/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV821M7X
NRND
SC70
SC70
DCK
DCK
5
5
3000
3000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
A15
A15
LMV821M7X/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV822M
NRND
SOIC
SOIC
D
D
8
8
95
95
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
LMV
822M
LMV822M/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV
822M
LMV822MM
NRND
VSSOP
VSSOP
DGK
DGK
8
8
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
V822
V822
LMV822MM/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV822MMX
NRND
VSSOP
VSSOP
DGK
DGK
8
8
3500
3500
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
V822
V822
LMV822MMX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV822MX
NRND
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
8
8
8
8
2500
2500
1000
3500
TBD
Call TI
CU SN
CU SN
CU SN
Call TI
-40 to 85
-40 to 85
-40 to 125
-40 to 125
LMV
822M
LMV822MX/NOPB
LMV822Q1MM/NOPB
LMV822Q1MMX/NOPB
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
LMV
822M
VSSOP
VSSOP
DGK
DGK
Green (RoHS
& no Sb/Br)
AKAA
Green (RoHS
& no Sb/Br)
AKAA
LMV824M
NRND
SOIC
SOIC
D
D
14
14
55
55
TBD
Call TI
Call TI
-40 to 85
-40 to 85
LMV824M
LMV824M
LMV824M/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LMV824MT/NOPB
LMV824MTX
ACTIVE
TSSOP
TSSOP
TSSOP
PW
14
14
14
94
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
Level-1-260C-UNLIM
LMV824
MT
NRND
PW
PW
2500
2500
TBD
Call TI
-40 to 85
LMV824
MT
LMV824MTX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
LMV824
MT
LMV824MX
NRND
SOIC
SOIC
D
D
14
14
2500
2500
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
LMV824M
LMV824M
LMV824MX/NOPB
ACTIVE
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV824Q1MA/NOPB
LMV824Q1MAX/NOPB
LMV824Q1MT/NOPB
LMV824Q1MTX/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
14
14
55
2500
94
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
LMV824Q1
MA
Green (RoHS
& no Sb/Br)
LMV824Q1
MA
TSSOP
TSSOP
PW
PW
Green (RoHS
& no Sb/Br)
LMV824
Q1MT
2500
Green (RoHS
& no Sb/Br)
LMV824
Q1MT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2013
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV822-N, LMV822-N-Q1, LMV824-N, LMV824-N-Q1 :
Catalog: LMV822-N, LMV824-N
•
Automotive: LMV822-N-Q1, LMV824-N-Q1
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Dec-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV821M5
LMV821M5/NOPB
LMV821M5X
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DGK
DGK
DGK
DGK
D
5
5
1000
1000
3000
3000
1000
1000
3000
3000
1000
1000
3500
3500
2500
2500
2500
2500
2500
2500
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
8.4
8.4
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.2
1.2
1.2
1.2
1.4
1.4
1.4
1.4
2.0
2.0
1.6
2.3
2.3
2.3
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
5
8.4
3.2
3.2
8.0
LMV821M5X/NOPB
LMV821M7
5
8.4
3.2
3.2
8.0
5
8.4
2.25
2.25
2.25
2.25
5.3
2.45
2.45
2.45
2.45
3.4
8.0
LMV821M7/NOPB
LMV821M7X
SC70
5
8.4
8.0
SC70
5
8.4
8.0
LMV821M7X/NOPB
LMV822MM
SC70
5
8.4
8.0
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
8
12.4
12.4
12.4
12.4
12.4
12.4
12.4
16.4
16.4
16.4
12.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
16.0
16.0
LMV822MM/NOPB
LMV822MMX
8
5.3
3.4
8
5.3
3.4
LMV822MMX/NOPB
LMV822MX
8
5.3
3.4
8
6.5
5.4
LMV822MX/NOPB
LMV824MTX
SOIC
D
8
6.5
5.4
TSSOP
SOIC
PW
D
14
14
14
14
6.95
6.5
8.3
LMV824MX
9.35
9.35
9.35
LMV824MX/NOPB
LMV824Q1MAX/NOPB
SOIC
D
6.5
SOIC
D
6.5
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Dec-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV824Q1MTX/NOPB TSSOP
PW
14
2500
330.0
12.4
6.95
8.3
1.6
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV821M5
LMV821M5/NOPB
LMV821M5X
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DGK
DGK
DGK
DGK
D
5
5
1000
1000
3000
3000
1000
1000
3000
3000
1000
1000
3500
3500
2500
2500
2500
2500
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
5
LMV821M5X/NOPB
LMV821M7
5
5
LMV821M7/NOPB
LMV821M7X
SC70
5
SC70
5
LMV821M7X/NOPB
LMV822MM
SC70
5
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
8
LMV822MM/NOPB
LMV822MMX
8
8
LMV822MMX/NOPB
LMV822MX
8
8
LMV822MX/NOPB
LMV824MTX
SOIC
D
8
TSSOP
SOIC
PW
14
14
LMV824MX
D
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Dec-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV824MX/NOPB
LMV824Q1MAX/NOPB
LMV824Q1MTX/NOPB
SOIC
SOIC
D
D
14
14
14
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
TSSOP
PW
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明