LMX1601 [TI]

LMX1600 2.0 GHz/500 MHz, LMX1601 1.1 GHz/500 MHz, LMX1602 1.1 GHz/1.1 GHz PLLatinum™ Low Cost Dual Frequency Synthesizer; LMX1600 2.0主频/ 500MHz的, LMX1601 1.1千兆赫/ 500兆赫, LMX1602 1.1千兆赫/ 1.1 GHz的PLLatinumâ ?? ¢低成本双频合成器
LMX1601
型号: LMX1601
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LMX1600 2.0 GHz/500 MHz, LMX1601 1.1 GHz/500 MHz, LMX1602 1.1 GHz/1.1 GHz PLLatinum™ Low Cost Dual Frequency Synthesizer
LMX1600 2.0主频/ 500MHz的, LMX1601 1.1千兆赫/ 500兆赫, LMX1602 1.1千兆赫/ 1.1 GHz的PLLatinumâ ?? ¢低成本双频合成器

信号电路 锁相环或频率合成电路 光电二极管 信息通信管理
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OBSOLETE  
LMX1600, LMX1601, LMX1602  
www.ti.com  
SNAS017F MARCH 1998REVISED APRIL 2013  
LMX1600 2.0 GHz/500 MHz, LMX1601 1.1 GHz/500 MHz, LMX1602 1.1 GHz/1.1 GHz  
PLLatinum™ Low Cost Dual Frequency Synthesizer  
Check for Samples: LMX1600, LMX1601, LMX1602  
1
FEATURES  
DESCRIPTION  
The LMX1600/01/02 is part of a family of monolithic  
integrated dual frequency synthesizers designed to  
be used in a local oscillator subsystem for a radio  
transceiver. It is fabricated using TI's 0.5u ABiC V  
silicon BiCMOS process.  
23  
VCC = 2.7V to 3.6V Operation  
Low Current Consumption:  
4 mA @ 3V (Typ) for LMX1601  
5 mA @ 3V (Typ) for LMX1600 or LMX1602  
PLL Powerdown Mode: ICC = 1 µA Typical  
Digital Filtered Lock Detects  
The LMX1600/01/02 contains two dual modulus  
prescalers, four programmable counters, two phase  
detectors and two selectable gain charge pumps  
necessary to provide the control voltage for two  
external loop filters and VCO loops. Digital filtered  
lock detects for both PLLs are included. Data is  
Dual Modulus Prescaler:  
2 GHz/500 MHz Option: (Main) 32/33 (Aux)  
8/9  
transferred into the LMX1600/01/02 via  
MICROWIRE serial interface (Data, Clock, LE).  
a
1.1 GHz/500 MHz Option: (Main) 16/17 (Aux)  
8/9  
VCC supply voltage can range from 2.7V to 3.6V. The  
LMX1600/01/02 features very low current  
consumption - typically 4.0 mA at 3V for LMX1601,  
5.0 mA at 3V for LMX1600 or LMX1602. Powerdown  
for the PLL is hardware controlled.  
1.1 GHz/1.1 GHz Option: (Main) 16/17 (Aux)  
16/17  
APPLICATIONS  
Cordless / Cellular / PCS Phones  
Other Digital Mobile Phones  
The LMX1600/01/02 is available in a 16 pin TSSOP  
surface mount plastic package.  
Functional Block Diagram  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PLLatinum is a trademark of Texas Instruments.  
2
3
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 1998–2013, Texas Instruments Incorporated  
OBSOLETE  
LMX1600, LMX1601, LMX1602  
SNAS017F MARCH 1998REVISED APRIL 2013  
www.ti.com  
Connection Diagrams  
16 Pin PLGA  
See Package Number NPG  
16 Pin TSSOP  
See Package Number PW  
2
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OBSOLETE  
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SNAS017F MARCH 1998REVISED APRIL 2013  
PIN DESCRIPTIONS  
Pin No. for  
16-pin  
PLGA  
Pin No. for  
16-pin  
TSSOP  
Pin Name  
I/O  
Description  
Package  
Package  
16  
1
FoLD  
O
I
Multiplexed output of the Main/Aux programmable or reference dividers and  
Main/Aux lock detect. CMOS output. (See Programming Description)  
1
2
OSCIN  
PLL reference input which drives both the Main and Aux R counter inputs. Has  
about 1.2V input threshold and can be driven from an external CMOS or TTL  
logic gate. Typically connected to a TCXO output. Can be used with an  
external resonator (See Programming Description).  
2
3
4
5
3
4
5
6
OSCOUT  
GND  
O
I
Oscillator output. Used with an external resonator.  
Aux PLL ground.  
finAUX  
Aux prescaler input. Small signal input from the VCO.  
VCC  
Aux PLL power supply voltage input. Must be equal to VCCMAIN. May range from  
2.7V to 3.6V. Bypass capacitors should be placed as close as possible to this  
pin and be connected directly to the ground plane.  
AUX  
6
7
7
8
CPoAUX  
ENAUX  
O
I
Aux PLL Charge Pump output. Connected to a loop filter for driving the control  
input of an external VCO.  
Powers down the Aux PLL when LOW (N and R counters, prescaler, and  
tristates charge pump output). Bringing ENAUX HIGH powers up the Aux PLL.  
8
9
ENMAIN  
CPoMAIN  
I
Powers down the Main PLL when LOW (N and R counters, prescaler, and  
tristates charge pump output). Bringing ENMAIN HIGH powers up the Main PLL.  
9
10  
11  
O
Main PLL Charge Pump output. Connected to a loop filter for driving the  
control input of an external VCO.  
10  
VCC  
Main PLL power supply voltage input. Must be equal to VCCAUX. May range  
from 2.7V to 3.6V. Bypass capacitors should be placed as close as possible to  
this pin and be connected directly to the ground plane.  
MAIN  
11  
12  
13  
12  
13  
14  
finMAIN  
GND  
LE  
I
I
Main prescaler input. Small signal input from the VCO.  
Main PLL ground.  
Load enable high impedance CMOS input. Data stored in the shift registers is  
loaded into one of the 4 internal latches when LE goes HIGH (control bit  
dependent).  
14  
15  
15  
16  
Data  
I
I
High impedance CMOS input. Binary serial data input. Data entered MSB first.  
The last two bits are the control bits.  
Clock  
High impedance CMOS Clock input. Data for the various counters is clocked in  
on the rising edge, into the 18-bit shift register.  
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)(3)  
Value  
Parameter  
Symbol  
Min  
0.3  
0.3  
0.3  
65  
Typical  
Max  
6.5  
Unit  
V
VCC  
MAIN  
Power Supply Voltage  
VCC  
6.5  
V
AUX  
Voltage on any pin with GND=0V  
Storage Temperature Range  
Lead Temp. (solder 4 sec)  
ESD-Human Body Model(2)  
VI  
TS  
TL  
VCC + 0.3  
+150  
+260  
V
°C  
°C  
eV  
2000  
(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Recommended Operating Conditions  
indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. "Electrical  
Characteristics" document specific minimum and/or maximum performance values at specified test conditions and are ensured. Typical  
values are for informational purposes only - based on design parameters or device characterization and are not ensured.  
(2) This device is a high performance RF integrated circuit and is ESD sensitive. Handling and assembly of this device should only be done  
on ESD-free workstations.  
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
Recommended Operating Conditions  
Value  
Parameter  
Symbol  
Min  
Typical  
Max  
Unit  
V
VCC  
2.7  
3.6  
MAIN  
Power Supply Voltage  
Operating Temperature  
VCC  
VCC  
VCC  
V
AUX  
MAIN  
MAIN  
TA  
40  
+85  
°C  
4
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Product Folder Links: LMX1600 LMX1601 LMX1602  
OBSOLETE  
LMX1600, LMX1601, LMX1602  
www.ti.com  
SNAS017F MARCH 1998REVISED APRIL 2013  
Electrical Characteristics  
(VCC = VCC = 3.0V; TA = 25°C except as specified)  
MAIN  
AUX  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
GENERAL  
ICC  
Power  
Supply  
Current  
2 GHz + 500 MHz  
Crystal Mode(1)  
Crystal Mode(1)  
Crystal Mode(1)  
Crystal Mode(1)  
Crystal Mode(1)  
Crystal Mode(1)  
5.0  
4.0  
5.0  
3.5  
2.5  
1.5  
1
mA  
mA  
1.1 GHz + 500 MHz  
1.1 GHz + 1.1 GHz  
2 GHz Only  
mA  
mA  
1.1 GHz Only  
mA  
500 MHz Only  
mA  
ICC-PWDN  
fin  
Power Down Current  
ENMAIN = LOW, ENAUX = LOW  
fin Main 2 GHz Option  
fin Main and Aux 1.1 GHz Option  
fin Aux 500 MHz Option  
Logic Mode(1)  
µA  
fin Operating Frequency  
200  
100  
40  
1
2000  
1100  
500  
40  
MHz  
MHz  
MHz  
MHz  
MHz  
VPP  
MHz  
dBm  
OSCIN  
Oscillator Operating Frequency  
Crystal Mode(1)  
1
20  
VOSC  
fφ  
Oscillator Input Sensitivity  
0.5  
VCC  
Maximum Phase Detector Frequency  
Main and Aux RF Input Sensitivity  
10  
Pfin  
15  
0
CHARGE PUMP  
ICPo-source  
ICPo-sink  
RF Charge Pump Output Current (See  
Programming Description)  
VCPo = VCC/2, High Gain Mode  
VCPo = VCC/2, High Gain Mode  
VCPo = VCC/2, Low Gain Mode  
VCPo = VCC/2, Low Gain Mode  
0.5 VCPo VCC0.5  
1600  
1600  
160  
160  
µA  
µA  
µA  
µA  
nA  
ICPo-source  
ICPo-sink  
ICPo-Tri  
Charge Pump Tri-state Current  
1
DIGITAL INTERFACE (DATA, CLK, LE, EN, FoLD)  
VIH  
VIL  
IIH  
IIL  
High-Level Input Voltage  
Low-Level Input Voltage  
High-Level Input Current  
Low-Level Input Current  
OSCIN Input Current  
0.8VCC  
V
0.2VCC  
1.0  
V
VIH = VCC = 3.6V(2)  
VIL = 0V; VCC = 3.6V(2)  
VIH = VCC = 3.6V  
1.0  
1.0  
µA  
µA  
µA  
µA  
µA  
1.0  
IIH  
IIL  
100  
OSCIN Input Current  
VIL = 0V; VCC = 3.6V  
100  
IO  
OSCOUT Output Current Magnitude  
(sink/source)(3)  
Logic Mode VCC  
|200|  
0.4  
= 3.6V(1)  
VOUT = VCC/2  
Crystal Mode  
VCC = 2.7V(1)  
|300|  
µA  
VOH  
VOL  
High-Level Output Voltage  
Low-Level Output Voltage  
IOH = 500 µA  
VCC0.4  
V
V
IOL = 500 µA  
MICROWIRE TIMING  
tCS  
Data to Clock Set Up Time  
See SERIAL DATA INPUT TIMING  
See SERIAL DATA INPUT TIMING  
See SERIAL DATA INPUT TIMING  
See SERIAL DATA INPUT TIMING  
See SERIAL DATA INPUT TIMING  
See SERIAL DATA INPUT TIMING  
50  
10  
50  
50  
50  
50  
ns  
ns  
ns  
ns  
ns  
ns  
tCH  
Data to Clock Hold Time  
Clock Pulse Width High  
tCWH  
tCWL  
tES  
Clock Pulse Width Low  
Clock to Load Enable Set Up Time  
Load Enable Pulse Width  
tEW  
(1) Refer to Programming Description.  
(2) Except fin.  
(3) The OSCout Output Current Magnitude is lass than or equal to 200µA when the Logic Mode is selected. The OSCout Output Current  
Magnitude is greater than or equal to 300µA when the Crystal Mode is selected.  
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Electrical Characteristics (continued)  
(VCC = VCC = 3.0V; TA = 25°C except as specified)  
MAIN  
AUX  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
CLOSED LOOP SYNTHESIZER PERFORMANCE (TI evaluation board only)  
RFφn Main PLL Phase Noise Floor  
See(4)  
160  
dBc/Hz  
(4) Offset frequency = 1 kHz, fin = 900 MHz, fφ = 25 kHz, N = 3600, fOSC = 10 MHz, VOSC > 1.2 VPP. Refer to the Application Note, AN-  
1052, for description of phase noise floor measurement.  
Functional Description  
The basic phase-lock-loop (PLL) configuration consists of a high-stability crystal reference oscillator, a frequency  
synthesizer such as the Texas Instruments LMX1600/01/02, a voltage controlled oscillator (VCO), and a passive  
loop filter. The frequency synthesizer includes a phase detector, current mode charge pump, as well as  
programmable reference [R], and feedback [N] frequency dividers. The VCO frequency is established by dividing  
the crystal reference signal down via the R counter to obtain the comparison frequency. This reference signal, fr,  
is then presented to the input of a phase/frequency detector and compared with another signal, fp, the feedback  
signal, which was obtained by dividing the VCO frequency down using the N counter. The phase/frequency  
detector's current source outputs pump charge into the loop filter, which then converts the charge into the VCO's  
control voltage. The phase/frequency comparator's function is to adjust the voltage presented to the VCO until  
the feedback signal's frequency (and phase) match that of the reference signal. When this “phase-locked”  
condition exists, the VCO's frequency will be N times that of the comparison frequency, where N is the divider  
ratio.  
REFERENCE OSCILLATOR INPUTS  
The reference oscillator frequency for the Main and Aux PLL's is provided by either an external reference through  
the OSCIN pin with the OSCOUT pin not connected or connected to a 30 pF capacitor to ground in Logic Mode, or  
an external crystal resonator across the OSCIN and OSCOUT pins in Crystal Mode (See Programming  
Description). The OSCIN input can operate to 40 MHz in Logic Mode or to 20 MHz in Crystal Mode with an input  
sensitivity of 0.5 VPP. The OSCIN pin drives the Main and Aux R counters. The inputs have a 1.2V input  
threshold and can be driven from an external CMOS or TTL logic gate. The OSCIN pin is typically connected to  
the output of a Temperature Compensated Crystal Oscillator (TCXO).  
REFERENCE DIVIDERS (R COUNTERS)  
The Main and Aux R Counters are clocked through the oscillator block in common. The maximum frequency is  
40 MHz in Logic Mode or 20 MHz in crystal Mode. Both R Counters are 12-bit CMOS counters with a divide  
range from 2 to 4,095. (See Programming Description)  
FEEDBACK DIVIDERS (N COUNTERS)  
The Main and Aux N Counters are clocked by the small signal fin Main and fin Aux input pins respectively. These  
inputs should be AC coupled through external capacitors. The Main N counter has an 16-bit equivalent integer  
divisor configured as a 5-bit A Counter and an 11-bit B Counter offering a continuous divide range from 992 to  
65,535 (2 GHz option) or a 4-bit A Counter and a 12-bit B Counter offering a continuous divide range from 240 to  
65,535 (1.1 GHz option). The Main N divider incorporates a 32/33 dual modulus prescaler capable of operation  
from 200 MHz to 2.0 GHz or a 16/17 dual modulus prescaler capable of operation from 100 MHz to 1.1 GHz.  
The Aux N divider operates from 100 MHz to 1.1 GHz with a 16/17 prescaler or from 40 MHz to 500 MHz with a  
8/9 prescaler. The Aux N counter is a 16-bit integer divider fully programmable from 240 to 65,535 over the  
frequency range of 100 MHz to 1.1 GHz or from 56 to 32,767 over the frequency range of 40 MHz to 550 MHz.  
The Aux N counter is configured as a 4-bit A Counter and a 12-bit B Counter. These inputs should be AC  
coupled through external capacitors. (See Programming Description)  
6
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SNAS017F MARCH 1998REVISED APRIL 2013  
Prescalers  
The RF input to the prescalers consists of the fin pins which are one of two complimentary inputs to a differential  
pair amplifier. The complimentary inputs are internally coupled to ground with a 10 pF capacitor and not brought  
out to a pin. The input buffer drives the A counter's ECL D-type flip flops in a dual modulus configuration. A 32/33  
for 2.0 GHz option, 16/17 for 1.1 GHz option, or 8/9 for 500 MHz option prescale ratio is provided for the  
LMX1600/01/02. The prescaler clocks the subsequent CMOS flip-flop chain comprising the fully programmable A  
and B counters.  
PHASE/FREQUENCY DETECTOR  
The Main and Aux phase(/frequency) detectors are driven from their respective N and R counter outputs. The  
maximum frequency at the phase detector inputs is 10 MHz (unless limited by the minimum continuous divide  
ratio of the multi modulus prescalers). The phase detector outputs control the charge pumps. The polarity of the  
pump-up or pump-down control is programmed using Main_PD_Pol or Aux_PD_Pol depending on whether  
Main or Aux VCO characteristics are positive or negative. (See Programming Description) The phase detector  
also receives a feedback signal from the charge pump in order to eliminate dead zone.  
CHARGE PUMP  
The phase detector's current source outputs pump charge into an external loop filter, which then converts the  
charge into the VCO's control voltage. The charge pumps steer the charge pump output, CPo, to VCC (pump-up)  
or ground (pump-down). When locked, CPo is primarily in a tri-state mode with small corrections. The charge  
pump output current magnitude can be selected as 160 µA or 1600 µA using bits AUX_CP_GAIN and  
MAIN_CP_GAIN as shown in Programming Description.  
MICROWIRE SERIAL INTERFACE  
The programmable functions are accessed through the MICROWIRE serial interface. The interface is made of 3  
functions: clock, data, and latch enable (LE). Serial data for the various counters is clocked in from data on the  
rising edge of clock, into the 18-bit shift register. Data is entered MSB first. The last two bits decode the internal  
register address. On the rising edge of LE, data stored in the shift register is loaded into one of the 4 appropriate  
latches (selected by address bits). Data is loaded from the latch to the counter when counter reaches to zero. A  
complete programming description is included in the following sections.  
FoLD MULTIFUNCTION OUTPUT  
The LMX1600/01/02 programmable output pin (FoLD) can deliver the internal counter outputs, digital lock  
detects, or CMOS high/low levels.  
Lock Detect  
A digital filtered lock detect function is included with each phase detector through an internal digital filter to  
produce a logic level output available on the Fo/LD output pin, if selected. The lock detect output is high when  
the error between the phase detector inputs is less than 15 ns for 4 consecutive comparison cycles. The lock  
detect output is low when the error between the phase detector outputs is more than 30 ns for one comparison  
cycle. The lock detect output is always low when the PLL is in power down mode. For further description see  
Programming Description.  
POWER CONTROL  
Each PLL is individually power controlled by the device EN pin. The ENMAIN controls the Main PLL, and the  
ENAUX controls the Aux PLL. Activation of EN = LOW (power down) condition results in the disabling of the  
respective N and R counters and de-biasing of their respective fin inputs (to a high impedance state). The  
reference oscillator input block powers down and the OSCIN pin reverts to a high impedance state only when  
both EN pins are LOW. Power down forces the respective charge pump and phase comparator logic to a tri-state  
condition as well as disabling the bandgap reference block. Power up occurs immediately when the EN pin is  
brought high. Power up sequence: Bandgap and Oscillator blocks come up first, with the remaining PLL functions  
becoming active approx. 1 µs later. All programming information is retained internally in the chip when in power  
down mode. The MICROWIRE control register remains active and capable of loading and latching in data during  
power down mode.  
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Programming Description  
MICROWIRE INTERFACE  
The descriptions below detail the 18-bit data register loaded through the MICROWIRE Interface. The 18-bit shift  
register is used to program the 12-bit Main and Aux R counter registers and the 16-bit Main and Aux N counter  
registers. The shift register consists of a 16-bit DATA field and a 2-bit control (CTL [1:0]) field as shown below.  
The control bits decode the internal register address. On the rising edge of LE, data stored in the shift register is  
loaded into one of the 4 appropriate latches (selected by address bits). Data is shifted in MSB first.  
MSB  
LSB  
0
DATA [15:0]  
CTL [1:0]  
18  
2 1  
Register Location Truth Table  
When LE transitions high, data is transferred from the 18-bit shift register into one of the 4 appropriate internal  
latches depending upon the state of the control (CTL) bits. The control bits decode the internal register address  
CTL [1:0]  
DATA Location  
AUX_R Register  
AUX_N Register  
MAIN_R Register  
MAIN_N Register  
0
0
1
1
0
1
0
1
Register Content Truth Table  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0
0
1
1
0
0
1
0
1
AUX_R  
AUX_N  
MAIN_R  
MAIN_N  
FoLD  
AUX_R_CNTR  
AUX_B_CNTR  
CP_WORD  
AUX_A_CNTR  
MAIN_R_CNTR  
MAIN_B_CNTR and MAIN_A_CNTR  
PROGRAMMABLE REFERENCE DIVIDERS  
AUX_R Register  
If the Control Bits (CTL [1:0]) are 0 0 when LE transitions high, data is transferred from the 18-bit shift register  
into a latch which sets the Aux PLL 12-bit R counter divide ratio. The divide ratio is programmed using the bits  
AUX_R_CNTR as shown in 12-Bit Programmable Main and Auxiliary Reference Divider Ratio (MAIN/AUX R  
Counter). The divider ratio must be 2. The FoLD word bits controls the multifunction FoLD output as described  
in Programming Description.  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
FoLD[3:0]  
9
8
7
6
5
4
3
2
1
0
0
0
AUX_R  
AUX_R_CNTR[11:0]  
8
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MAIN_R REGISTER  
If the Control Bits (CTL [1:0]) are 1 0 when LE transitions high, data is transferred from the 18-bit shift register  
into a latch which sets the Main PLL 12-bit R counter divide ratio and various control functions. The divide ratio is  
programmed using the bits MAIN_R_CNTR as shown in 12-Bit Programmable Main and Auxiliary Reference  
Divider Ratio (MAIN/AUX R Counter). The divider ratio must be 2. The charge pump control word  
(CP_WORD[3:0]) sets the charge pump gain and the phase detector polarity as detailed in CHARGE PUMP  
CONTROL WORD (CP_WORD).  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
CP_WORD[3:0]  
9
8
7
6
5
4
3
2
1
1
0
0
MAIN_R  
MAIN_R_CNTR[11:0]  
12-Bit Programmable Main and Auxiliary Reference Divider Ratio (MAIN/AUX R Counter)  
MAIN_R_CNTR/AUX_R_CNTR  
Divide Ratio(1)  
11  
0
10  
0
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
0
0
1
1
1
0
2
0
1
3
0
0
4,095  
1
1
1
1
1
1
1
1
1
1
1
1
(1) Legal divide ratio: 2 to 4,095.  
PROGRAMMABLE FEEDBACK (N) DIVIDERS  
AUX_N Register  
If the Control Bits (CTL[1:0]) are 0 1 when LE transitions high, data is transferred from the 18-bit shift register  
into the AUX_N register latch which sets the Aux PLL 16-bit programmable N counter value. The AUX_N counter  
is a 16-bit counter which is fully programmable from 240 to 65,535 for 1.1 GHz option or from 56 to 32,767 for  
500 MHz option. The AUX_N register consists of the 4-bit swallow counter (AUX_A_CNTR), the 12-bit  
programmable counter (AUX_B_CNTR). Serial data format is shown below. The divide ratio (AUX_N_CNTR  
[13:0]) must be 240 (1.1 GHz option) or 56 (500 MHz option) for a continuous divide range. The Aux PLL N  
divide ratio is programmed using the bits AUX_A_CNTR, AUX_B_CNTR as shown in 4-BIT Swallow Counter  
Divide Ratio (Aux A COUNTER).  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
AUX_B_CNTR[11:0]  
9
8
7
6
5
4
3
2
1
0
0
1
AUX_N  
AUX_A_CNTR[3:0]  
4-BIT Swallow Counter Divide Ratio (Aux A COUNTER)  
Table 1. 1.1 GHz Option  
Swallow  
AUX_A_CNTR  
Count(1)  
(A)  
0
3
0
0
2
0
0
1
0
0
0
0
1
1
15  
1
1
1
1
(1) Swallow Counter Value: 0 to 15  
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Table 2. 500 MHz Option(1)  
Swallow  
AUX_A_CNTR  
Count(2)  
(A)  
0
3
X
X
2
0
0
1
0
0
0
0
1
1
7
X
1
1
1
(1) X = Don't Care condition  
(2) Swallow Counter Value: 0 to 7  
12-BIT Programmable Counter Divide Ratio (Aux B COUNTER)  
AUX_B_CNTR(1)(2)  
Divide Ratio(3)  
11  
0
10  
0
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
0
1
1
1
0
0
1
0
3
4
0
0
4,095  
1
1
1
1
1
1
1
1
1
1
1
1
(1) AUX_B_CNTR AUX_A_CNTR  
(2) See PROGRAMMABLE FEEDBACK (N) DIVIDERS for calculation of VCO output frequency  
(3) Divide ratio: 3 to 4,095 (Divide ratios less than 3 are prohibited)  
MAIN_N Register  
If the Control Bits (CTL[1:0]) are 1 1 when LE transitions high, data is transferred from the 18-bit shift register  
into the MAIN_N register latch which sets 16-bit programmable N divider value. The Main N divider is a 16-bit  
counter which is fully programmable from 992 to 65,535 for 2 GHz option and from 240 to 65,535 for 1.1 GHz  
option. The MAIN_N register consists of the 5-bit (2 GHz option) or 4-bit (1.1 GHz option) swallow counter  
(MAIN_A_CNTR) and the 11-bit (2 GHz option) or 12-bit (1.1 GHz option) programmable counter  
(MAIN_B_CNTR). Serial data format for the MAIN_N register latch shown below. The divide ratio must be 992  
(2 GHz option) or > 240 (1.1 GHz option) for a continuous divide range. The divide ratio is programmed using the  
bits MAIN _A_CNTR and MAIN_B_CNTR as shown in Swallow Counter Divide Ratio (Main A COUNTER) and  
Programmable Counter Divide Ratio (Main B COUNTER). The pulse swallow function which determines the  
divide ratio is described in Pulse Swallow Function.  
Table 3. 2 GHz Option  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
AUX_B_CNTR[10:0]  
9
8
7
6
5
4
3
2
1
1
0
1
MAIN_N  
MAIN_N  
AUX_A_CNTR[4:0]  
Table 4. 1.1 GHz Option  
First Bit  
SHIFT REGISTER BIT LOCATION  
Last Bit  
17 16 15 14 13 12 11 10  
AUX_B_CNTR[11:0]  
9
8
7
6
5
4
3
2
1
1
0
1
AUX_A_CNTR[3:0]  
10  
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Swallow Counter Divide Ratio (Main A COUNTER)  
Table 5. 2 GHz Option (5 Bit)  
Table 6. 1.1 GHz Option (4 Bit)  
Swallow  
Count(1)  
MAIN_A_CNTR  
Swallow  
MAIN_A_CNTR  
Count(1)  
(A)  
0
3
0
0
2
0
0
1
0
0
0
0
1
(A)  
0
4
0
0
3
0
0
2
0
0
1
0
0
0
0
1
1
1
15  
1
1
1
1
31  
1
1
1
1
1
(1) Swallow Counter Value: 0 to 31  
(1) Swallow Counter Value: 0 to 15  
Programmable Counter Divide Ratio (Main B COUNTER)  
Table 7. 2 GHz Option (11 Bit)(1)  
MAIN_B_CNTR(2)  
Divide Ratio(3)  
10  
0
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
0
1
1
1
0
0
1
0
3
4
0
2,047  
1
1
1
1
1
1
1
1
1
1
1
(1) See Pulse Swallow Function for calculation of VCO output frequency  
(2) MAIN_B_CNTR MAIN_A_CNTR  
(3) Divide ratio: 3 to 2,047 (Divide ratios less than 3 are prohibited)  
Table 8. 1.1 GHz Option (12 Bit)(1)  
MAIN_B_CNTR(2)  
Divide Ratio(3)  
11  
0
10  
0
9
0
0
8
0
0
7
0
0
6
0
0
5
0
0
4
0
0
3
0
0
2
1
0
1
0
3
0
1
1
0
4
0
0
4,095  
1
1
1
1
1
1
1
1
1
1
1
1
(1) See Pulse Swallow Function for calculation of VCO output frequency.  
(2) MAIN_B_CNTR MAIN_A_CNTR  
(3) Divide ratio: 3 to 4,095 (Divide ratios less than 3 are prohibited)  
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Pulse Swallow Function  
The N divider counts such that it divides the VCO RF frequency by (P+1) for A times, and then divides by P for  
(B – A) times. The B value (B_CNTR) must be 3. The continuous divider range for the Main PLL N divider is  
from 992 to 65,535 for 2 GHz option, from 240 to 65,535 for 1.1 GHz option, and from 56 to 32,767 for 500 MHz  
option. Divider ratios less than the minimum value are achievable as long as the binary counter value is greater  
than or equal to the swallow counter value (B_CNTR A_CNTR).  
fVCO = N x ( fOSC / R )  
where  
fVCO: Output frequency of external voltage controlled oscillator (VCO)  
fOSC: Output frequency of the external reference frequency oscillator (input to OSCIN).  
R: Preset divide ratio of binary programmable reference counter (R_CNTR)  
(1)  
N = (P x B) + A  
where  
N: Preset divide ratio of main programmable integer N counter (N_CNTR)  
B: Preset divide ratio of binary programmable B counter (B_CNTR)  
A: Preset value of binary 4-bit swallow A counter (A _CNTR)  
P: Preset modulus of dual modulus prescaler (P = 32 for 2 GHz option, P=16 for 1.1 GHz option, and P=8 for 500  
MHz option) (2)  
CHARGE PUMP CONTROL WORD (CP_WORD)  
MSB  
LSB  
AUX_CP_GAIN  
MAIN_CP_GAIN  
AUX_PD_POL  
MAIN_PD_POL  
BIT  
LOCATION  
FUNCTION  
0
1
AUX_CP_GAIN  
MAIN_CP_GAIN  
AUX_PD_POL  
MAIN_PD_POL  
MAIN_R[17]  
MAIN_R[16]  
MAIN_R[15]  
MAIN_R[14]  
Aux Charge Pump Current Gain  
Main Charge Pump Current Gain  
Aux Phase Detector Polarity  
Main Phase Detector Polarity  
LOW  
HIGH  
LOW  
HIGH  
Negative  
Negative  
Positive  
Positive  
AUX_CP_GAIN (MAIN_R[17]) and MAIN_CP_GAIN (MAIN_R[16]) are used to select charge pump current  
magnitude either low gain mode (160 µA typ) or high gain mode (1600 µA typ)  
AUX_ PD_POL (MAIN_R[15]) and MAIN_ PD_POL (MAIN_R[14]) are respectively set to one when Aux or Main  
VCO characteristics are positive as in (1) below. When VCO frequency decreases with increasing control voltage  
(2) PD_POL should set to zero.  
VCO Characteristics  
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Phase Comparator and Internal Charge Pump Characteristics  
(AUX_PD_POL/MAIN_PD_POL = 1)  
fr is phase detector input from reference counter. fp is phase detector input from programmable N counter.  
Phase difference detection range: - 2π to + 2pπ.  
The minimum width pump up and pump down current pulses occur at the CPo pin when the loop is locked.  
FOUT/LOCK DETECT PROGRAMMING TRUTH TABLE (FoLD)  
FoLD  
Fo/LD OUTPUT STATE  
3
2
1
0
AUX_R[17] AUX_R[16]  
AUX_R[15]  
AUX_R[14](1)  
0
0
0
0
0
1
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
“0”  
“1”  
X
x
Main Lock Detect  
Aux Lock Detect  
X
X
X
X
X
Main “and” Aux Lock Detect  
Main Reference Counter Output  
Aux Reference Counter Output  
Main Programmable Counter Output  
Aux Programmable Counter Output  
(1) See OSC Mode Programming for AUX_R[14] description.  
Lock Detect Digital Filter  
The Lock Detect Digital Filter compares the difference between the phase of the inputs of the phase detector to a  
RC generated delay of approximately 15 ns. To enter the locked state (Lock = HIGH) the phase error must be  
less than the 15 ns RC delay for 4 consecutive reference cycles. Once in lock (Lock = HIGH), the RC delay is  
changed to approximately 30 ns. To exit the locked state (Lock = LOW), the phase error must become greater  
than the 30 ns RC delay. When the PLL is in the powerdown mode, Lock is forced LOW. A flow chart of the  
digital filter is shown below.  
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Typical Lock Detect Timing (AUX_PD_POL/MAIN_PD_POL = 1)  
OSC Mode Programming  
The OSCout pin can be optimized for operating with an external crystal resonator or an external reference  
frequency source (i.e. TCXO). If the application uses an external reference frequency source, the current  
dissipation of the LMX1600/01/02 can be reduced with the Logic Mode (0.5 mA typ.). Crystal Mode should be  
used when an external crystal resonator is used. Logic Mode is used when an external reference frequency  
source is used. In Logic Mode, OSCOUT should be connected to a 30 pF capacitor to ground for optimum  
performance.  
When the FoLD output state is selected to CMOS high/low levels, the OSC Mode is forced to Crystal Mode.  
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FoLD  
OSCOUT  
3
2
1
0
AUX_R[17]  
AUX_R[16]  
AUX_R[15]  
AUX_R[14]  
0
0
0
0
0
0
1
0
1
Crystal Mode  
Crystal Mode  
Logic Mode  
0
All Other States  
Crystal Mode  
Typical Crystal Oscillator Circuit  
A typical implementation of a 10 MHz crystal oscillator with the OSCOUT pin in Crystal Mode is shown below.  
SERIAL DATA INPUT TIMING  
Data shifted into register on clock rising edge.  
Data is shifted in MSB first.  
TEST CONDITIONS: The Serial Data Input Timing is tested using a symmetrical waveform around VCC/2. The  
test waveform has an edge rate of 0.6 V/ns with amplitudes of 2.2V @ VCC = 2.7V.  
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TYPICAL APPLICATION EXAMPLE  
OPERATIONAL NOTES:  
*
VCO is assumed AC coupled.  
**  
RIN increases impedance so that VCO output power is provided to the load rather than the PLL. Typical  
values are 10to 200depending on the VCO power level. The fin RF impedance ranges from 40to  
100. The fin IF impedances are higher.  
***  
50termination is often used on test boards to allow use of external reference oscillator. For most typical  
products, a CMOS clock is used and no terminating resistor is required. OSCIN may be AC or DC coupled.  
AC coupling is recommended because the input circuit provides its own bias. (See Figure 1)  
Figure 1.  
**** Adding RC filter to the VCC line is recommended to reduce loop-to-loop noise coupling.  
— Proper use of grounds and bypass capacitors is essential to achieve a high level of performance. Crosstalk  
between pins can be reduced by careful board layout.  
— This is a static sensitive device. It should be handled only at static free work stations.  
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REVISION HISTORY  
Changes from Revision E (April 2013) to Revision F  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 16  
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