LMX2430TMX/NOPB [TI]
用于射频个人通信的 3.0GHz/0.8GHz PLLatinum 双路高频合成器 | PW | 20 | -40 to 85;
| 型号： | LMX2430TMX/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 用于射频个人通信的 3.0GHz/0.8GHz PLLatinum 双路高频合成器 | PW | 20 | -40 to 85 通信 射频 光电二极管 个人通信 |
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LMX2430, LMX2433, LMX2434
SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016
LMX243x PLLatinum™ Dual High-Frequency Synthesizer for RF Personal
Communications
1 Features
2 Applications
1
•
Low Current Consumption
•
•
•
•
Mobile Handsets
Cordless Handsets
Wireless Data
–
–
–
LMX2430 (RF/IF): 2.8 mA/ 1.4 mA
LMX2433 (RF/IF): 3.2 mA/ 2 mA
LMX2434 (RF/IF): 4.6 mA/ 2.4 mA
Cable TV Tuners
•
•
•
2.25-V to 2.75-V Operation
3 Description
Synchronous/Asynchronous Power Down
Multiple PLL Options:
Using
a
proprietary digital-phase, locked-loop
technique, the LMX243x devices generate very
stable, low-noise control signals for RF and IF voltage
controlled oscillators. Both the RF and IF
–
–
–
LMX2430 (RF/IF): 3 GHz /0.8 GHz
LMX2433 (RF/IF): 3.6 GHz /1.7 GHz
LMX2434 (RF/IF): 5 GHz /2.5 GHz
synthesizers include
a
two-level programmable
charge pump. Both the RF and IF PLLs have
dedicated fastlock circuitry with integrated time-out
counters which require only a single word write to
power up or change frequencies.
•
Programmable Charge-Pump Current Levels
RF and IF: 1 or 4 mA
–
•
•
•
•
Fastlock With Integrated Time-Out Counters
Digital Filtered Lock-Detect Output
Device Information(1)
Analog Lock Detect (Push-Pull / Open-Drain)
1.8-V MICROWIRE Logic Interface
PART NUMBER
PACKAGE
ULGA (20)
TSSOP (20)
BODY SIZE (NOM)
3.50 mm × 3.50 mm
6.50 mm × 4.40 mm
LMX243x
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Block Diagram
NOTE: 1 (2) refers to Pin 1 of the 20-Pin ULGA and Pin 2 of the 20-Pin TSSOP
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMX2430, LMX2433, LMX2434
SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016
www.ti.com
Table of Contents
9.4 Device Functional Modes........................................ 28
9.5 Programming........................................................... 29
9.6 Register Maps......................................................... 30
10 Application and Implementation........................ 41
10.1 Application Information.......................................... 41
10.2 Typical Application ............................................... 42
11 Power Supply Recommendations ..................... 44
12 Layout................................................................... 44
12.1 Layout Guidelines ................................................. 44
12.2 Layout Example .................................................... 44
13 Device and Documentation Support ................. 45
13.1 Device Support...................................................... 45
13.2 Related Links ........................................................ 45
13.3 Community Resources.......................................... 45
13.4 Trademarks........................................................... 45
13.5 Electrostatic Discharge Caution............................ 45
13.6 Glossary................................................................ 45
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Description continued........................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 Recommended Operating Conditions....................... 4
7.3 Thermal Information.................................................. 5
7.4 Electrical Characteristics .......................................... 5
7.5 Timing Requirements................................................ 7
7.6 Typical Characteristics.............................................. 8
Parameter Measurement Information ................ 12
8.1 Bench Test Setups.................................................. 12
Detailed Description ............................................ 23
9.1 Overview ................................................................. 23
9.2 Functional Block Diagram ....................................... 23
9.3 Feature Description................................................. 24
8
9
14 Mechanical, Packaging, and Orderable
Information ........................................................... 46
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (March 2013) to Revision D
Page
•
•
Shortened data sheet title LMX243x PLLatinum™ Dual High-Frequency Synthesizer for RF Personal
Communications LMX2430 3 GHz/0.8 GHz, LMX2433 3.6 GHz/1.7 GHz, LMX2434 5 GHz/2.5 GHz to LMX243x
PLLatinum™ Dual High-Frequency Synthesizer for RF Personal Communications because the extra information is
also listed in Features............................................................................................................................................................. 1
Added Device Information table, Pin Configuration and Functions section, Thermal Information table, Feature
Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section ..................................................................................................................... 1
Changes from Revision B (March 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format ........................................................................................................... 40
2
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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016
5 Description continued
The LMX243x devices are high-performance frequency synthesizers with integrated dual-modulus prescalers. A
32/33 or a 16/17 prescale ratio can be selected for the 5-GHz LMX2434 RF synthesizer. An 8/9 or a 16/17
prescale ratio can be selected for both the LMX2430 and LMX2433 RF synthesizers. The IF circuitry contains an
8/9 or a 16/17 prescaler.
Serial data is transferred to the devices through a three-wire interface (DATA, LE, CLK). A low voltage logic
interface allows direct connection to 1.8-V devices. Supply voltages from 2.25 V to 2.75 V are supported.
6 Pin Configuration and Functions
NPE Package
PW Package
20-Pin ULGA Ultra Thin Chip Scale
20-Pin TSSOP Thin Shrink Small Outline
Top View
Top View
Pin Functions
PIN
I/O
DESCRIPTION
NAME
ULGA
TSSOP
MICROWIRE Clock input. High-impedance CMOS input. DATA is clocked into the
24-bit shift register on the rising edge of CLK.
CLK
18
19
I
IF PLL charge-pump output. The output is connected to the external loop filter,
which drives the input of the IF VCO.
CPoutIF
CPoutRF
DATA
4
5
O
O
I
RF PLL charge-pump output. The output is connected to the external loop filter,
which drives the input of the RF VCO.
12
19
13
20
MICROWIRE Data input. High-impedance CMOS input. Binary serial data. The MSB
of DATA is shifted in first. The two last bits are the control bits.
Chip Enable input. High-Impedance CMOS input. When this pin is set HIGH, the RF
and IF PLLs are powered up. Power down is then controlled through the
MICROWIRE. When this pin is set LOW, the device is asynchronously powered
down, and the charge-pump output is forced to a high-impedance state (tri-state).
EN
3
5
4
6
I
I
Oscillator Enable input. High-impedance CMOS input. When this pin is set HIGH,
the oscillator buffer is always powered up, independent of the state of the EN pin.
When this pin is set LOW, the OSCout/ FLoutIF pin functions as an IF fastlock
output, which connects a resistor in parallel to R2 of the external loop filter.
ENosc
FinIF
2
3
I
O
I
IF PLL prescaler input. Small signal input from the VCO.
RF PLL fastlock output. This pin connects a resistor in parallel to R2 of the external
loop filter. This pin can also function as a general-purpose CMOS tri-state output.
FLoutRF
FinRF
10
14
11
15
RF PLL prescaler input. Small-signal input from the VCO.
RF PLL prescaler complementary input. For single-ended operation, this pin must be
AC grounded through a 100-pF capacitor. The LMX243x can be driven differentially
when the AC-coupled capacitor is omitted.
FinRF*
15
16
I
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Pin Functions (continued)
PIN
I/O
DESCRIPTION
NAME
ULGA
TSSOP
Programmable multiplexed output. Functions as a general-purpose CMOS tri-state
output, N and R divider output, RF/ IF PLL push-pull analog lock-detect output, RF/
IF PLL open-drain analog lock-detect output, or RF/ IF PLL digital filtered lock-detect
output.
Ftest/LD
9
10
O
1
2
Ground for the IF PLL analog and digital circuits, MICROWIRE, Ftest/LD and
oscillator circuits.
GND
LE
11
13
12
14
—
I
MICROWIRE Latch Enable input. High-impedance CMOS input. When LE
transitions HIGH, DATA stored in the shift register is loaded into one of 6 internal
control registers.
17
18
Oscillator output/ IF PLL fastlock output. The output configuration is dependent on
the state of the ENosc pin. When ENosc is set LOW, the pin functions as an IF
fastlock output, which connects a resistor in parallel to R2 of the external loop filter.
This configuration also functions as a general-purpose CMOS tri-state output. When
ENosc is set HIGH, the pin functions as an oscillator output so that an external
crystal can be used.
OSCout/
FLoutIF
6
7
7
8
O
Reference oscillator input. The input has an approximate Vcc/2 threshold and is
driven by an external AC-coupled source.
OSCin
Vcc
I
16
8
17
9
Power supply bias for the RF PLL analog circuits. Vcc may range from 2.25 V to
2.75 V. Bypass capacitors must be placed as close as possible to this pin and be
connected directly to the ground plane.
—
20
1
7 Specifications
7.1 Absolute Maximum Ratings
(1)(2)(3)(4)
See
MIN
MAX
UNIT
Power supply voltage
VCC to GND
−0.3
3.25
V
Voltage on any pin to GND
VI must be < +3.25 V
VI
−0.3
VCC + 0.3
V
TL
Lead temperature (solder 4 seconds)
Storage temperature
260
150
°C
°C
Tstg
−65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) This device is a high-performance RF integrated circuit with an ESD rating < 2000 V and is ESD-sensitive. Handling and assembly of
this device must be done at ESD-protected work stations.
(3) GND = 0 V.
(4) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
7.2 Recommended Operating Conditions
MIN
2.25
−40
MAX
2.75
85
UNIT
V
Power supply voltage Vcc to GND
Operating temperature, TA
°C
4
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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016
7.3 Thermal Information
LMX243x
THERMAL METRIC(1)
NPE (ULGA)
PW (TSSOP)
20 PINS
111.5
UNIT
20 PINS
80.9
22.5
40
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
44.9
63.5
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.2
6.1
ψJB
40
62.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Electrical Characteristics
VCC = EN = 2.5 V, −40°C ≤ TA ≤ +85°C, unless otherwise specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
ICC PARAMETERS
LMX2430
LMX2433
CLK, DATA and LE = 0 V
OSCin = GND
RF_PD Bit = 0
2.8
3.2
3.6 mA
4.4 mA
Power supply current,
RF
ICCRF
synthesizer
IF_PD Bit = 1
RF_P Bit = 0
LMX2434
4.6
6.2 mA
LMX2430
LMX2433
CLK, DATA and LE = 0 V
OSCin = GND
RF_PD Bit = 1
IF_PD Bit = 0
1.4
2
2
mA
Power supply current,
IF
synthesizer
2.8 mA
ICCIF
LMX2434
2.4
3.5 mA
IF_P Bit = 0
EN, ENosc, CLK, DATA
and LE = 0 V
ICCPD
Power-down current
10
μA
RF SYNTHESIZER PARAMETERS
RF_P Bit = 0
RF_P Bit = 1
RF_P Bit = 0
RF_P Bit = 1
RF_P Bit = 0 or 1
P = 8 / 9(1)
250
250
500
500
1000
24
2500 MHz
3000 MHz
3000 MHz
3600 MHz
5000 MHz
LMX2430
RF operating
frequency
fFinRF
LMX2433
LMX2434
262,151
NRF
N divider range
P = 16 / 17(1)
P = 32 / 33(1)
48
524,287
524,287
32,767
96
RRF
RF R divider range
3
fCOMPRF
RF phase detector frequency
10 MHz
LMX2430 / 33
−15
−12
0
0
dBm
dBm
mA
2.25 V ≤ VCC ≤ 2.75 V(2)
pFinRF
RF input sensitivity
LMX2434
2.35 V ≤ VCC ≤ 2.75 V(2)
VCPoutRF = VCC / 2
RF_CPG Bit = 0(3)
–1
–4
1
ICPoutRF
Source
RF charge-pump output source current
RF charge-pump output sink current
VCPoutRF = VCC / 2
RF_CPG Bit = 1(3)
mA
VCPoutRF = VCC / 2
RF_CPG Bit = 0(3)
mA
ICPoutRF
Sink
VCPoutRF = VCC / 2
RF_CPG Bit = 1(3)
4
mA
(1) Some of the values in this range are illegal divide ratios (B < A). To obtain continuous legal division, the Minimum Divide Ratio must be
calculated. Use N ≥ P * (P−1), where P is the value of the prescaler selected.
(2) Refer to LMX243x FinRF Sensitivity Test Set-Up.
(3) Refer to LMX243x Charge Pump Test Set-Up.
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Electrical Characteristics (continued)
VCC = EN = 2.5 V, −40°C ≤ TA ≤ +85°C, unless otherwise specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
ICPoutRF
TRI
RF charge-pump output tri-state current
0.5 V ≤ VCPoutRF ≤ VCC – 0.5 V(3)
–2.5
2.5
nA
RF charge-pump output sink current vs
charge-pump output source current
mismatch
ICPoutRF
%MIS
VCPoutRF = VCC / 2(4)
3%
10%
RF charge-pump output current
magnitude variation vs charge-pump
output voltage
ICPoutRF
%VCPoutRF
0.5 V ≤ VCPoutRF ≤ VCC – 0.5 V(4)
5%
2%
15%
ICPoutRF
%TA
RF charge-pump output current
magnitude variation vs temperature
VCPoutRF = VCC / 2(4)
IF SYNTHESIZER PARAMETERS
LMX2430
IF_P Bit = 0 or 1
IF_P Bit = 0 or 1
IF_P Bit = 0 or 1
P = 8/9(1)
100
250
500
24
800 MHz
1700 MHz
2500 MHz
fFinIF
IF operating frequency LMX2433
LMX2434
131,079
NIF
IF N divider range
P = 16/17(1)
48
262,143
32,767
RIF
IF R divider range
3
fCOMPIF
pFinIF
IF phase detector frequency
IF input sensitivity
10 MHz
2.25 V ≤ VCC ≤ 2.75 V(2)
–15
0
dBm
VCPoutIF = VCC/2
IF_CPG Bit = 0(3)
–1
–4
1
mA
ICPoutIF
Source
IF charge-pump output source current
VCPoutIF = VCC/2
IF_CPG Bit = 1(3)
mA
mA
mA
nA
VCPoutIF = VCC/2
IF_CPG Bit = 0(3)
ICPoutIF
Sink
IF charge-pump output sink current
IF charge-pump output tri-state current
VCPoutIF = VCC/2
IF_CPG Bit = 1(3)
4
ICPoutIF
TRI
0.5 V ≤ VCPoutIF ≤ VCC – 0.5 V(3)
–2.5
2.5
10%
15%
IF charge-pump output sink current vs
charge-pump output source current
mismatch
ICPoutIF
%MIS
VCPoutIF = VCC/2(4)
3%
ICPoutIF
%VCPoutIF
IF charge-pump output current magnitude
variation vs charge-pump output voltage
0.5 V ≤ VCPoutIF ≤ VCC – 0.5 V(4)
5%
2%
ICPoutIF
%TA
IF charge-pump output current magnitude
variation vs temperature
VCPoutIF = VCC/2(4)
OSCILLATOR PARAMETERS
fOSCin Oscillator operating frequency
vOSCin
1
256 MHz
VCC VPP
(5)
Oscillator sensitivity
See
0.5
VOSCin = VCC
VOSCin = 0 V
100
µA
µA
IOSCin
Oscillator input current
–100
1.6
DIGITAL INTERFACE (DATA, CLK, LE, EN, ENosc, Ftest/LD, FLoutRF, OSCout/ FLoutIF)
VIH
VIL
IIH
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
High-level output voltage
Low-level output voltage
V
V
0.4
1
VIH = VCC
μA
μA
V
IIL
VIL = 0 V
−1
VOH
VOL
IOH = −500 μA
IOL = 500 μA
V
CC − 0.4
0.4
V
(4) Refer to Charge Pump Current Specification Definitions for details on how these measurements are made.
(5) Refer to LMX243x OSCin Sensitivity Test Set-Up.
6
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Electrical Characteristics (continued)
VCC = EN = 2.5 V, −40°C ≤ TA ≤ +85°C, unless otherwise specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
PHASE NOISE CHARACTERISTICS
TCXO Reference Source
RF_CPG Bit = 1
IF_PD Bit = 1
RF synthesizer normalized phase noise
dBc/
Hz
LNRF(f)
LNIF(f)
–219
–214
contribution(6)
TCXO Reference Source
IF_CPG Bit = 1
RF_PD Bit = 1
IF synthesizer normalized phase noise
contribution(6)
dBc/
Hz
fFinRF = 2750 MHz
f = 10-kHz offset
fCOMPRF = 1 MHz
Loop Bandwidth = 100 kHz
NRF = 2750
dBc/
Hz
LMX2430
–90.3
–88.9
–85.6
fOSCin = 10 MHz
vOSCin = 1 VPP
RF_CPG Bit = 1
IF_PD Bit = 1
TA = 25oC(7)
fFinRF = 3200 MHz
f = 10-kHz offset
fCOMPRF = 1 MHz
Loop Bandwidth = 100 kHz
NRF = 3200
RF synthesizer single-
side band phase noise LMX2433
measured
dBc/
Hz
LRF(f)
fOSCin = 10 MHz
vOSCin = 1 VPP
RF_CPG Bit = 1
IF_PD Bit = 1
TA = 25°C(7)
fFinRF = 4700 MHz
f = 10-kHz offset
fCOMPRF = 1 MHz
Loop Bandwidth = 100 kHz
NRF = 4700
dBc/
Hz
LMX2434
fOSCin = 10 MHz
vOSCin = 1 VPP
RF_CPG Bit = 1
IF_PD Bit = 1
TA = 25°C(7)
(6) Normalized Phase Noise Contribution is defined as LN(f) = L(f) − 20 log (N) − 10 log (fCOMP), where L(f) is defined as the single side
band phase noise measured at an offset frequency, f, in a 1-Hz bandwidth. The offset frequency, f, must be chosen sufficiently smaller
than the loop bandwidth of the PLL, yet large enough to avoid substantial phase noise contribution from the reference source. N is the
value selected for the feedback divider and fCOMP is the RF/IF phase and frequency detector comparison frequency.
(7) The synthesizer phase noise is measured with the LMX2430PW/LMX2430NPE evaluation boards and the HP8566B Spectrum Analyzer.
7.5 Timing Requirements
(1)
See
MIN
NOM
MAX
UNIT
MICROWIRE INTERFACE
tCS
DATA to CLK set-up time
50
10
50
50
50
50
ns
ns
ns
ns
ns
ns
tCH
DATA to CLK hold time
CLK pulse width HIGH
CLK pulse width LOW
CLK to LE set-up time
LE pulse width
tCWH
tCWL
tES
tEW
(1) Refer to LMX243x Serial Data Input Timing figure.
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7.6 Typical Characteristics
7.6.1 Sensitivity
VCC = EN = 2.25 V
VCC = EN = 2.75 V
Figure 2. LMX2430 FinRF Input Power vs Frequency
Figure 1. LMX2430 FinRF Input Power vs Frequency
VCC = EN = 2.25 V
VCC = EN = 2.75 V
Figure 4. LMX2433 FinRF Input Power vs Frequency
Figure 3. LMX2433 FinRF Input Power vs Frequency
VCC = EN = 2.35 V
VCC = EN = 2.75 V
Figure 6. LMX2434 FinRF Input Power vs Frequency
Figure 5. LMX2434 FinRF Input Power vs Frequency
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Sensitivity (continued)
VCC = EN = 2.25 V
VCC = EN = 2.75 V
Figure 8. LMX2430 FinIF Input Power vs Frequency
Figure 7. LMX2430 FinIF Input Power vs Frequency
VCC = EN = 2.25 V
Figure 9. LMX2433 FinIF Input Power vs Frequency
VCC = EN = 2.75 V
Figure 10. LMX2433 FinIF Input Power vs Frequency
VCC = EN = 2.25 V
Figure 11. LMX2434 FinIF Input Power vs Frequency
VCC = EN = 2.75 V
Figure 12. LMX2434 FinIF Input Power vs Frequency
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Sensitivity (continued)
VCC = EN = 2.25 V
VCC = EN = 2.75 V
Figure 14. LMX243x OSCin Input Voltage vs Frequency
Figure 13. LMX243x OSCin Input Voltage vs Frequency
7.6.2 Charge Pump
VCC = EN = 2.5 V
−40°C ≤ TA ≤ +85°C
VCC = EN = 2.5 V
−40°C ≤ TA ≤ +85°C
Figure 15. LMX243x RF Charge-Pump Sweeps
Figure 16. LMX243x IF Charge-Pump Sweeps
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7.6.3 Input Impedance
VCC = EN = 2.5 V
TA = 25°C
VCC = EN = 2.5 V
TA = 25°C
Figure 17. LMX243x ULGA FinRF Input Impedance
Figure 18. LMX243x TSSOP FinRF Input Impedance
VCC = EN = 2.5 V
TA = 25°C
VCC = EN = 2.5 V
TA = 25°C
Figure 19. LMX243x ULGA FinIF Input Impedance
Figure 20. LMX243x TSSOP FinIF Input Impedance
VCC = EN = 2.5 V
TA = 25°C
VCC = EN = 2.5 V
TA = 25°C
Figure 21. LMX243x ULGA OSCin Input Impedance vs
Frequency
Figure 22. LMX233xU TSSOP OSCin Input Impedance vs
Frequency
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8 Parameter Measurement Information
8.1 Bench Test Setups
8.1.1 LMX243x Charge-Pump Test Setup
Figure 23. Charge-Pump Current Test Setup
Figure 23 shows the setup required to measure the RF charge-pump sink current of the LMX243x device. The
same setup is used for the LMX2430PW evaluation board. The purpose of this test is to assess the functionality
of the RF charge pump. The IF charge pump is evaluated in the same way.
This setup uses an open-loop configuration. A power supply is connected to VCC. By means of a signal
generator, a 10-MHz signal is typically applied to the FinRF pin. The signal is one of two inputs to the phase /
frequency detector (PFD). The 3-dB pad provides a 50-Ω match between the PLL and the signal generator. The
OSCin pin is tied to Vcc. This establishes the other input to the PFD. Alternatively, this input can be tied directly
to the ground plane. The EN and ENosc pins are also both tied to Vcc. A semiconductor parameter analyzer is
connected to the CPoutRF pin and used to measure the sink, source, and tri-state leakage currents.
Let Fr represent the frequency of the signal applied to the OSCin pin, which is simply zero in this case (DC), and
let Fp represent the frequency of the signal applied to the FinRF pin. The PFD is sensitive to the rising edges of
Fr and Fp. Assuming positive VCO characteristics (RF_CPP bit = 1); the charge pump turns ON, and sinks
current when the first rising edge of Fp is detected. Because Fr has no rising edge, the charge pump continues to
sink current indefinitely. In order to measure the RF charge-pump source current, the RF_CPP bit is simply set to
0 (negative VCO characteristics) in CodeLoader. Similarly, in order to measure the tri-state leakage current, the
RF_CPT bit is set to 1.
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The measurements are typically taken over supply voltage and temperature. The measurements are also
typically taken at the HIGH and LOW charge-pump current gains. The charge-pump current gain can be
controlled by the RF_CPG bit in CodeLoader. Once the charge-pump currents are determined, the (i) charge-
pump output current magnitude variation versus charge-pump output voltage, (ii) charge-pump output sink
current versus charge-pump output source current mismatch, and (iii) charge-pump output current magnitude
versus temperature, can be calculated. Refer to the Charge Pump Current Specifications Definition for more
details.
8.1.2 Charge-Pump Current Specification Definitions
I1 = Charge-Pump Sink Current at VCPout = Vcc − ΔV
I2 = Charge-Pump Sink Current at VCPout = Vcc//2
I3 = Charge-Pump Sink Current at VCPout = ΔV
I4 = Charge-Pump Source Current at VCPout = Vcc − ΔV
I5 = Charge-Pump Source Current at VCPout = Vcc/2
I6 = Charge-Pump Source Current at VCPout = ΔV
ΔV = Voltage offset from the positive and negative rails. Dependent on the VCO tuning range relative to Vcc and
GND. Typical values are between 0.5V and 1.0V.
VCPout refers to either VCPoutRF or VCPoutIF
ICPout refers to either ICPoutRF or ICPoutIF
Figure 24. Charge-Pump Parameters
8.1.2.1 Charge-Pump Output Current Variation vs Charge-Pump Output Voltage
(1)
8.1.2.2 Charge-Pump Sink Current vs Charge-Pump Output Source Current Mismatch
(2)
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Bench Test Setups (continued)
8.1.2.3 Charge-Pump Output Current Variation vs Temperature
(3)
8.1.3 LMX243x FinRF Sensitivity Test Setup
Figure 25. RF Input Sensitivity Test Setup
Figure 25 shows the setup required to measure the RF input sensitivity level of the LMX243x device. The same
setup is used for the LMX2430PW evaluation board. The purpose of this test is to measure the acceptable signal
level to the FinRF input of the PLL chip. Outside the acceptable signal range, the feedback divider begins to
divide incorrectly and miscount the frequency. The FinIF sensitivity is evaluated in the same way.
The setup uses an open-loop configuration. A power supply is connected to Vcc. The IF PLL is powered down
(IF_PD bit = 1). By means of a signal generator, an RF signal is applied to the FinRF pin. The 3-dB pad provides
a 50-Ω match between the PLL and the signal generator. The EN, ENosc, and OSCin pins are all tied to VCC
.
The N value is typically set to 10000 in CodeLoader, that is, RF_B word = 156 and RF_A word = 16 for RF_P bit
= 0 (LMX2434) or RF_P bit = 1 (LMX2430 and LMX2433). The feedback divider output is routed to the Ftest/LD
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Bench Test Setups (continued)
pin by selecting the RF_N/2 Frequency word (MUX[3:0] word = 15) in CodeLoader. A Universal Counter is
connected to the Ftest/LD pin and used to monitor the output frequency of the feedback divider. The expected
frequency must be the signal generator frequency divided by twice the corresponding counter value, that is,
20,000. The factor of two comes in because the LMX43x device has an internal /2 circuit which is used to
provide a 50% duty cycle.
Sensitivity is typically measured over frequency, supply voltage and temperature. In order to perform the
measurement, the temperature, frequency, and supply voltage is set to a fixed value, and the power level of the
signal at FinRF is varied. Sensitivity is reached when the frequency error of the divided RF input is greater than
or equal to 1 Hz. The power attenuation from the cable and the 3-dB pad must be accounted for. The feedback
divider miscounts if too much or too little power is applied to the FinRF input. Therefore, the allowed input power
level is bounded by the upper and lower sensitivity limits. In a typical application, if the power level to the FinRF
input approaches the sensitivity limits, this can introduce spurs or cause degradation to the phase noise. When
the power level gets even closer to these limits, or exceeds them, the RF PLL loses lock.
8.1.4 LMX243x OSCin Sensitivity Test Setup
Figure 26. OSCin Sensitivity Test Setup
Figure 26 shows the setup required to measure the OSCin buffer sensitivity level in the LMX243x device. The
same setup is used for the LMX2430PW evaluation board. This setup is similar to the FinRF sensitivity setup
except that the signal generator is now connected to the OSCin pin, and both Fin pins are tied to VCC. The 51-Ω
shunt resistor matches the OSCin input to the signal generator. The R counter is typically set to 1000, that is,
RF_R word = 1000 or IF_R word = 1000. The reference divider output is routed to the Ftest/LD pin by selecting
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Bench Test Setups (continued)
the RF_R/ 2 frequency word (MUX[3:0] word = 14) or the IF_R/ 2 frequency word (MUX[3:0] word = 12) in
CodeLoader. A universal counter is connected to the Ftest/LD pin and is used to monitor the output frequency of
the reference divider. The expected frequency must be the signal generator frequency divided by twice the
corresponding counter value, that is, 2000. The factor of two comes in because the LMX243x device has an
internal /2 circuit which is used to provide a 50% duty cycle.
In a similar way, sensitivity is typically measured over frequency, supply voltage and temperature. In order to
perform the measurement, the temperature, frequency, and supply voltage is set to a fixed value and the power
level (voltage level) of the signal at OSCin is varied. Sensitivity is reached when the frequency error of the
divided input signal is greater than or equal to 1 Hz.
8.1.5 LMX243x FinRF Input Impedance Test Setup
Figure 27. Imput Impedance Test Setup
Notes:
1. DATA is clocked into the 24-bit shift register on the rising edge of CLK
2. The MSB of DATA is shifted in first.
Figure 28. LMX243x Serial Data Input Timing
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Bench Test Setups (continued)
Figure 28 shows the setup required to measure the RF input impedance of the LMX243x device. The same
setup is used for the LMX2430PW evaluation board. Measuring the input impedance of the device facilitates the
design of appropriate matching networks to match the PLL to the VCO, or in more critical situations, to the
characteristic impedance of the printed-circuit-board (PCB) trace, to prevent undesired transmission line effects.
The FinIF input impedance is evaluated in the same way.
Before the actual measurements are taken, the network analyzer must be calibrated, that is, the error coefficients
must be calculated. The calibration standard of the network analyzer is used to calculate these coefficients. The
calibration standard includes an open, short and a matched load. A 1-port calibration is implemented here.
To calculate the coefficients, the PLL chip is first removed from the PCB. A piece of semi-rigid coaxial cable is
then soldered to the pad on the PCB which is equivalent to the FinRF pin on the PLL chip. Proper grounding
near the exposed tip of the semi-rigid coaxial cable is required for accurate results. The DC blocking capacitor is
removed for this test. The network analyzer port is then connected to the other end of the semi-rigid coaxial
cable. In this way, the semi-rigid coaxial cable acts as a transmission line. This transmission line adds electrical
length and produces an offset from the reference plane of the network analyzer; therefore, it must be included in
the calibration. The desired operating frequency is then set. The typical frequency range selected for the RF
synthesizer of the LMX243x device is from 100 MHz to 6000 MHz.
The network analyzer calculates the calibration coefficients based on the measured S11 parameters. With this all
done, calibration is now complete.
The PLL chip is then placed on the PCB, and a power supply connected to VCC. The EN, ENosc, and OSCin pins
are all tied to VCC. Alternatively, the OSCin pin can be tied to ground. In this setup, the complementary input
(FinRF*) is AC-coupled to ground. With the network analyzer still connected to the semi-rigid coaxial cable, the
measured FinRF impedance is displayed.
The OSCin input impedance is measured in the same way. The impedance is measured when the oscillator
buffer is powered up (ENosc is set HIGH) and when the oscillator buffer is powered down (ENosc pin is set
LOW).
Table 1. LMX243x ULGA FinRF Input Impedance Table(1)
fFinRF
|Γ|
ANGLE (Γ)
Re {ZFinRF}
Im {ZFinRF}
|ZFinRF|
(MHz)
(°)
(Ω)
(Ω)
(Ω)
100
200
0.86
0.86
0.85
0.84
0.83
0.82
0.82
0.81
0.80
0.80
0.79
0.79
0.78
0.78
0.77
0.76
0.75
0.73
0.72
0.70
–8.63
–10.72
–13.48
–17.01
–21.05
–25.32
–29.78
–34.35
–39.02
–43.83
–48.76
–53.90
–59.07
–64.41
–70.04
–75.84
–82.06
–88.56
–95.19
–101.45
334.27
265.44
202.09
150.76
112.18
85.96
67.32
54.27
44.76
37.32
31.65
27.30
23.84
21.34
19.20
17.46
16.27
15.36
14.90
14.32
–339.55
–313.48
–281.42
–245.31
–212.85
–185.41
–162.49
–143.15
–127.07
–113.62
–102.07
–91.89
476.48
410.77
346.46
287.93
240.60
204.37
175.88
153.09
134.72
119.59
106.86
95.86
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
–82.83
86.19
–74.84
77.82
–67.56
70.24
–60.88
63.33
–54.72
57.09
–48.89
51.25
–43.34
45.83
–38.66
41.23
(1) VCC = EN = 2.5 V, TA = 25°C
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Bench Test Setups (continued)
Table 1. LMX243x ULGA FinRF Input Impedance Table(1) (continued)
fFinRF
|Γ|
ANGLE (Γ)
Re {ZFinRF}
Im {ZFinRF}
|ZFinRF|
(MHz)
(°)
(Ω)
(Ω)
(Ω)
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
3500
3600
3700
3800
3900
4000
4100
4200
4300
4400
4500
4600
4700
4800
4900
5000
5100
5200
5300
5400
5500
5600
5700
5800
5900
6000
0.68
0.67
0.66
0.66
0.67
0.69
0.71
0.72
0.74
0.75
0.76
0.77
0.77
0.78
0.79
0.79
0.80
0.80
0.80
0.80
0.80
0.80
0.80
0.80
0.82
0.83
0.83
0.84
0.84
0.84
0.84
0.84
0.84
0.84
0.83
0.83
0.82
0.82
0.81
0.80
–107.85
–114.12
–120.12
–126.01
–131.82
–137.96
–144.21
–150.25
–156.23
–161.92
–167.18
–172.05
–177.55
179.16
174.92
170.77
166.54
162.52
158.74
155.06
151.49
148.28
146.02
144.12
142.31
140.78
139.65
138.75
137.79
136.82
135.77
134.64
133.33
131.68
129.77
127.55
125.41
123.35
121.68
120.42
14.10
13.81
13.27
12.50
11.68
10.55
9.53
8.55
7.75
7.22
6.87
6.63
6.40
6.18
5.99
5.85
5.74
5.73
5.73
5.68
5.69
5.70
5.73
5.60
5.41
5.29
5.14
4.99
4.84
4.92
4.88
4.99
5.11
5.25
5.43
5.70
6.03
6.42
6.75
7.11
–34.26
–30.35
–27.09
–24.00
–21.22
–18.24
–15.58
–12.92
–10.25
–7.77
–5.48
–3.42
–1.49
0.35
37.05
33.34
30.17
27.06
24.22
21.07
18.26
15.49
12.85
10.61
8.79
7.46
6.57
6.19
2.18
6.37
3.99
7.08
5.80
8.16
7.56
9.49
9.22
10.86
12.24
13.62
14.91
15.95
16.80
17.52
18.21
18.67
19.05
19.46
20.39
19.51
21.04
21.77
22.58
23.64
24.82
26.04
27.18
28.12
28.89
10.84
12.38
13.78
14.88
15.84
16.66
17.42
17.95
18.38
18.85
19.79
18.89
20.44
21.16
21.96
23.01
24.16
25.33
26.41
27.30
28.00
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Table 2. LMX243x TSSOP FinRF Input Impedance Table(1)
fFinRF
|Γ|
Angle (Γ)
Re {ZFinRF}
Im {ZFinRF}
|ZFinRF|
(MHz)
(°)
(Ω)
(Ω)
(Ω)
100
0.86
0.85
0.84
0.83
0.82
0.82
0.82
0.82
0.81
0.8
–12.47
–15.35
–19.41
–24.22
–28.97
–33.65
–38.37
–43.22
–48.37
–53.84
–59.8
214.61
166.75
122.76
89.48
67.73
52.07
41.64
34.6
–314.33
–270.14
–228.38
–193.48
–167.98
–148.64
–131.88
–117.36
–104.33
–92.74
–82.21
–72.67
–64.06
–56.21
–49.36
–43.3
380.61
317.46
259.28
213.17
181.12
157.5
138.3
122.35
108.47
96.28
85.31
75.42
66.51
58.42
51.45
45.29
39.94
35.19
30.88
27.18
24.41
21.74
18.97
16.36
13.4
200
300
400
500
600
700
800
900
29.69
25.88
22.78
20.17
17.88
15.93
14.5
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
3200
3300
3400
3500
3600
3700
3800
3900
4000
4100
4200
4300
4400
4500
4600
0.79
0.78
0.77
0.76
0.75
0.74
0.73
0.72
0.71
0.7
–66.29
–73.3
–80.74
–88.27
–95.87
–103.41
–110.77
–118.23
–125.46
–131.35
–137.19
–143.41
–149.45
–156.15
–163.87
–171.33
–178.24
174.91
168.09
161.11
153.92
146.42
138.67
130.89
123.33
116.17
109.55
103.54
98.25
13.27
12.42
11.67
11.2
–37.96
–33.2
–28.78
–24.74
–21.6
11.25
11.37
10.94
10.37
9.7
0.68
0.68
0.68
0.69
0.71
0.73
0.74
0.75
0.75
0.75
0.74
0.74
0.74
0.74
0.74
0.75
0.76
0.77
0.78
0.79
0.79
0.79
0.78
0.77
0.77
0.76
–18.79
–15.88
–13.18
–10.26
–6.92
8.62
7.79
10.42
8.34
7.47
–3.71
7.3
0.76
7.34
7.24
2.18
7.56
7.33
5.12
8.94
7.53
8.14
11.09
13.75
16.85
20.27
23.96
27.83
31.79
35.77
39.69
43.44
47.2
7.83
11.3
8.19
14.72
8.59
18.36
8.97
22.22
9.3
26.23
9.54
30.32
9.74
34.42
9.91
38.43
10.2
42.23
93.38
10.71
11.7
45.97
88.86
49.59
50.95
54.32
57.18
60.66
64.82
85.1
13.43
14.79
16.13
17.9
52.63
82.09
55.23
78.59
58.48
74.73
62.3
(1) VCC = EN = 2.5 V, TA = 25°C
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Table 2. LMX243x TSSOP FinRF Input Impedance Table(1) (continued)
fFinRF
|Γ|
Angle (Γ)
Re {ZFinRF}
Im {ZFinRF}
|ZFinRF|
(MHz)
(°)
(Ω)
(Ω)
(Ω)
4700
4800
4900
5000
5100
5200
5300
5400
5500
5600
5700
5800
5900
6000
0.76
0.75
0.75
0.75
0.76
0.77
0.78
0.78
0.76
0.73
0.71
0.68
0.65
0.64
70.66
66.05
61.68
57.35
53.11
48.79
43.56
38.11
32.89
27.85
21.89
15.38
9.47
19.89
22.5
66.66
72.05
69.56
75.48
81.77
88.9
25.37
28.56
31.7
77.73
84.19
91.39
96.73
106.2
119.67
136.16
153.21
171.43
194.19
212.1
221.24
225.69
34.78
40.56
52.53
71.05
95.57
133.18
177.08
207.23
222.92
100.34
112.59
125.62
135.74
142.32
141.32
116.75
77.49
4.15
35.24
Table 3. LMX243x ULGA FinIF Input Impedance Table(1)
fFinIF
|Γ|
Angle (Γ)
Re {ZFinIF}
Im {ZFinIF}
|ZFinIF|
(MHz)
(°)
(Ω)
(Ω)
(Ω)
100
200
0.87
0.86
0.85
0.84
0.83
0.83
0.82
0.81
0.8
–6.19
–8.1
446.34
353.77
257.5
188.33
141.63
109.44
86.57
70.47
58.9
–341.41
–328.44
–300.77
–268.39
–235.88
–206.86
–182.41
–161.46
–144.27
–130.45
–120.14
–111.08
–101.96
–93.09
–85.47
–78.74
–72.74
–66.32
–59.4
561.94
482.73
395.94
327.87
275.13
234.03
201.91
176.17
155.83
140.05
128.02
117.2
106.81
97.2
300
–10.98
–14.21
–17.67
–21.32
–25.13
–29.04
–32.99
–36.73
–40.28
–44.11
–48.38
–52.91
–57.26
–61.56
–66.01
–71.39
–77.74
–84.72
–92.59
–100.18
–107.33
–114.48
–118.42
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
0.79
0.79
0.79
0.79
0.79
0.78
0.77
0.77
0.77
0.77
0.76
0.73
0.71
0.69
0.68
0.68
50.96
44.21
37.38
31.82
27.95
25.34
23.28
20.98
18.4
89.15
82.11
75.71
68.83
61.32
54.59
48.36
42.84
38.41
34.27
31.32
15.22
15.02
14.39
14.07
13.94
13.37
12.71
–52.48
–46.17
–40.46
–35.79
–31.55
–28.62
(1) VCC = EN = 2.5 V, TA = 25°C
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Table 4. LMX243x TSSOP FinIF Input Impedance Table(1)
fFinIF
|Γ|
Angle (Γ)
Re {ZFinIF}
Im {ZFinIF}
|ZFinIF|
(MHz)
(°)
(Ω)
(Ω)
(Ω)
100
0.87
0.86
0.85
0.84
0.84
0.83
0.83
0.82
0.81
0.80
0.79
0.79
0.78
0.77
0.76
0.74
0.74
0.74
0.74
0.73
0.72
0.71
0.71
0.69
0.67
–7.11
–9.92
400.44
288.69
198.42
141.73
105.75
82
–348.14
–318.81
–281.45
–246.13
–214.58
–188.43
–166.34
–147.46
–131.83
–117.87
–106.36
–96.2
530.62
430.1
344.36
284.02
239.22
205.5
178.76
156.96
139.35
124.1
111.64
100.63
90.08
80.06
71.42
64.62
59.06
52.94
46.53
40.87
36.3
200
300
–13.64
–17.47
–21.42
–25.39
–29.46
–33.67
–37.99
–42.47
–46.96
–51.67
–57.02
–63.11
–69.26
–74.82
–79.79
–86.55
–94.37
–101.95
–108.92
–115.63
–123.23
–131.44
–138.35
400
500
600
700
65.48
53.78
45.17
38.82
33.93
29.53
25.26
22.15
20.49
19.54
17.7
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
–86.47
–76.93
–68.42
–61.59
–56.35
–50.74
–44.56
–38.87
–34.18
–30.11
–25.97
–21.74
–18.31
15.09
13.38
12.62
12.21
11.65
11.13
11.08
11.54
32.29
28.25
24.4
21.64
(1) VCC = EN = 2.5 V, TA = 25°C
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Table 5. LMX243x ULGA OSCin Input Impedance Table(1)
ENosc = 1
ENosc = 0
fOSCin
(MHz)
Re {ZOSCin}
Im {ZOSCin}
|ZOSCin|
Re {ZOSCin}
Im {ZOSCin}
|ZOSCin|
(Ω)
(Ω)
(Ω)
(Ω)
(Ω)
(Ω)
5
5032.01
2529.17
1412.1
1051.18
710.63
545.87
442.32
314.15
316.48
223.49
196.9
–10120.58
–7382.23
–5693.56
–4930.8
11302.53
7803.46
5866.06
5041.6
2641.63
1108.82
526.74
330.16
233.66
212.67
192.16
112.07
143.65
84.09
–13293.58
–8932.61
–6461.11
–5452.11
–4455.98
–3822.33
–3306.06
–2963.67
–2657.93
–2405.34
–2196.07
–2044.88
–1898.92
–1775.84
–1652.06
13553.5
9001.17
6482.55
5462.1
7.5
10
12.5
15
–4099.58
–3584.6
4160.72
3625.92
3156.35
2823.63
2538.75
2290.95
2114.3
4462.1
17.5
20
3828.24
3311.64
2965.79
2661.81
2406.81
2196.45
2046.34
1900.12
1776.58
1652.83
–3125.21
–2806.1
22.5
25
–2518.94
–2280.02
–2105.11
–1942.45
–1816.83
–1701.59
–1573.28
27.5
30
40.38
32.5
35
175.38
158.95
137.8
1950.35
1823.77
1707.16
1577.42
77.29
67.31
37.5
40
51.11
114.2
50.39
(1) VCC = EN = 2.5 V, TA = 25°C
Table 6. LMX243x TSSOP OSCin Input Impedance Table(1)
ENosc = 1
ENosc = 0
fOSCin
Re {ZOSCin}
(MHz)
Im {ZOSCin}
|ZOSCin|
Re {ZOSCin}
Im {ZOSCin}
|ZOSCin|
(Ω)
(Ω)
(Ω)
(Ω)
(Ω)
(Ω)
5
1111.3
628.81
359.99
284.12
203.53
134.32
109.85
80.56
69.37
60.1
–4814.09
–3411.8
–2623.46
–2065
4940.69
3469.26
2648.04
2084.46
1812.7
1554.32
1347.78
1195.45
1065.98
975.7
654.13
388.42
237.72
159
–7449.33
–5150.6
7477.99
5165.22
3899.44
2992.88
2601.63
2223.86
1957.94
1731.18
1554.15
1415.04
1290.5
7.5
10
–3892.18
–2988.66
–2597.16
–2222.34
–1956.99
–1730.53
–1553.43
–1414.54
–1290.03
–1188.88
–1096.89
–1024.88
–963.11
12.5
15
–1801.24
–1548.5
–1343.3
–1192.73
–1063.72
–973.84
–890.31
–816.01
–758.24
–707.57
–661.87
152.53
82.41
60.86
47.56
47.47
37.83
34.8
17.5
20
22.5
25
27.5
30
50.3
891.73
817.28
759.38
708.57
662.86
32.5
35
45.52
41.55
37.73
36.09
29.72
31.5
1189.25
1097.35
1025.14
963.38
37.5
40
23.04
22.61
(1) VCC = EN = 2.5 V, TA = 25°C
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9 Detailed Description
9.1 Overview
The basic phase-lock-loop (PLL) configuration consists of a high-stability crystal reference oscillator, a frequency
synthesizer such as the LMX243x, a voltage controlled oscillator (VCO), and a passive loop filter. The frequency
synthesizer includes a phase detector, current-mode charge pump, programmable reference R and feedback N
frequency dividers. The VCO frequency is established by dividing the crystal reference signal down through the
reference divider to obtain a comparison reference frequency. This reference signal, fr, is then presented to the
input of a phase / frequency detector and compared with the feedback signal, fp, which was obtained by dividing
the VCO frequency down by way of the feedback divider. The phase and frequency detector (PFD) measures the
phase error between the fr and fp signals and outputs control signals that are directly proportional to the phase
error. The charge pump then pumps charge into or out of the loop filter based on the magnitude and direction of
the phase error. The loop filter converts the charge into a stable control voltage for the VCO. The function of the
PFD is to adjust the voltage presented to the VCO until the frequency of the feedback signal and phase match
that of the reference signal. When this phase-locked condition exists, the VCO frequency is N times that of the
comparison frequency, where N is the feedback divider ratio.
9.2 Functional Block Diagram
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9.3 Feature Description
9.3.1 Reference Oscillator Input
The reference oscillator frequency for both the RF and IF PLLs is provided from an external reference through
the OSCin pin. The reference buffer circuit supports input frequencies from 5 to 40 MHz with a minimum input
sensitivity of 0.5 VPP. The reference buffer circuit has an approximate Vcc/2 input threshold and can be driven
from an external AC-coupled source. Typically, the OSCin pin is connected to the output of a crystal oscillator.
9.3.2 Reference Dividers (R Counters)
The reference dividers divide the reference input signal, OSCin, by a factor of R. The output of the reference
divider circuits feeds the reference input of the phase detector. This reference input to the phase detector is often
referred to as the comparison frequency. The divide ratio must be chosen such that the maximum phase
comparison frequency (fCOMPRF or fCOMPIF) of 10 MHz is not exceeded.
The RF and IF reference dividers are each comprised of 15-bit CMOS binary counters that support a continuous
integer divide ratio from 3 to 32,767. The RF and IF reference divider circuits are clocked by the output of the
reference buffer circuit which is common to both. Refer to RF_R[14:0] - RF Synthesizer Programmable
Reference Divider (R Counter) (R0[17:3]) and IF_R[14:0] - IF Synthesizer Programmable Reference Divider (R
Counter) (R3[17:3]) for details on how to program the RF_R and IF_R counters.
9.3.3 Prescalers
The FinRF and FinIF input pins drive the input of a differential-pair amplifier. The output of the differential-pair
amplifier drives a chain of D-type flip-flops in a dual modulus configuration. The output of the prescaler is used to
clock the subsequent feedback dividers. The RF PLL complementary inputs can be driven differentially, or the
negative input can be AC-coupled to ground through an external capacitor for single-ended configuration. A
16/17 or a 32/33 prescale ratio can be selected for the 5-GHz LMX2434 RF synthesizer. An 8/9 or a 16/17
prescale ratio can be selected for both the LMX2430 and LMX2433 RF synthesizers. The IF PLL is single-ended,
and an 8/9 or a 16/17 prescale ratio can be selected for the IF synthesizer.
9.3.4 Programmable Feedback Dividers (N Counters)
The programmable feedback dividers operate in concert with the prescalers to divide the input signal, Fin, by a
factor of N. The output of the programmable reference divider is provided to the feedback input of the phase
detector circuit. The divide ratio must be chosen so that the maximum phase comparison frequency (fCOMPRF or
fCOMPIF) of 10 MHz is not exceeded.
The programmable feedback divider circuit is comprised of an A counter (swallow counter) and a B counter
(programmble binary counter). For both the LMX2430 and LMX2433, the RF_A counter is a 4-bit swallow
counter, programmable from 0 to 15. The LMX2434 RF_A counter is a 5-bit swallow counter, programmable from
0 to 31. The LMX243x IF_A counter is a 4-bit swallow counter, programmable from 0 to 15. For both the
LMX2430 and LMX2433, the RF_B counter is a 15-bit binary counter, programmable from 3 to 32,767. The
LMX2434 RF_B counter is a 14-bit binary counter, programmable from 3 to 16,383. The LMX243x IF_B is a 14-
bit binary counter programmable from 3 to 16,383. A continuous integer divide ratio is achieved if N ≥ P × (P−1),
where P is the value of the prescaler selected.
Divide ratios less than the minimum continuous divide ratio are achievable as long as the binary programmable
counter value is greater than the swallow counter value (B ≥ A). Refer to RF_A[3:0] - LMX2430/33 RF
Synthesizer Swallow Counter (A Counter) (R1[6:3]), RF_A[4:0] - LMX2434 RF Synthesizer Swallow Counter (A
Counter) (R1[7:3]), RF_B[14:0] - LMX2430/33 RF Synthesizer Programmable Binary Counter (B Counter)
(R1[21:7]), RF_B[13:0] - LMX2434 RF Synthesizer Programmable Binary Counter (B Counter) (R1[21:8]),
IF_A[3:0] - IF Synthesizer Swallow Counter (A Counter) (R4[6:3]), and IF_B[13:0] - IF Synthesizer Programmable
Binary Counter (B Counter) (R4[20:7]) for details on how to program the A and B counters. Equation 4 and
Equation 5 are useful in determining and programming a particular value of N:
N = (P × B) + A
Fin = N × fCOMP
(4)
(5)
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Feature Description (continued)
9.3.5 Phase / Frequency Detectors
The RF and IF PFDs are driven from their respective N and R counter outputs. The maximum frequency for both
the RF and IF phase detector inputs is 10 MHz. The PFD outputs control the respective charge pumps. The
polarity of the pump-up or pump-down control signals are programmed using the RF_CPP or IF_CPP control
bits, depending on whether the RF or IF VCO characteristics are positive or negative. Refer to RF_CPP - RF
Synthesizer Phase Detector Polarity (R0[18]) and IF_CPP - IF Synthesizer Phase Detector Polarity (R3[18]) for
more details. The PFDs have a detection range of −2π to +2π. The PFDs also receive a feedback signal from
the charge pump in order to eliminate dead zone.
9.3.5.1 Phase Comparator and Internal Charge-Pump Characteristics
Notes:
1. The minimum width of the pump-up and pump-down current pulses occur at the CPoutRF or CPoutIF
pins when the loop is phase locked.
2. The diagram assumes positive VCO characteristic that is, RF_CPP or IF_CPP = 1.
3. fr is the PFD input from the reference divider (R counter).
4. fp is the PFD input from the programmable feedback divider (N counter).
5. CPout refers to either the RF or IF charge-pump output
Figure 29. Phase Detector and Charge-Pump Operation
9.3.6 Charge Pumps
The charge pump directs charge into or out of an external loop filter. The loop filter converts the charge into a
stable control voltage which is applied to the tuning input of the VCO. The charge pump steers the VCO control
voltage towards VCC during pump-up events and towards GND during pump-down events. When locked,
CPoutRF or CPoutIF are primarily in a tri-state mode with small corrections occurring at the phase comparator
rate. The charge-pump output current magnitude can be selected by toggling the RF_CPG or IF_CPG control
bits.
9.3.7 Microwire Serial Interface
The programmable register set is accessed through the MICROWIRE serial interface. A low voltage logic
interface allows direct connection to 1.8-V devices. The interface is comprised of three signal pins: CLK, DATA
and LE. Serial data is clocked into the 24-bit shift register on the rising edge of CLK. The last two bits decode the
internal control register address. When LE transitions HIGH, DATA stored in the shift register is loaded into one
of four control registers depending on the state of the address bits. The MSB of DATA is loaded in first. The
synthesizers can be programmed even in power-down mode. A complete programming description is provided in
Programming.
9.3.8 Multi-Function Outputs
The Ftest/LD output pin of the LMX243x device is a multi-function output that can be configured as a general-
purpose CMOS tri-state output, push-pull analog lock-detect output, open-drain analog lock-detect output, digital
filtered lock-detect output, or used to monitor the output of the various reference divider (R counter) or feedback
divider (N counter) circuits. The Ftest/LD control word is used to select the desired output function. When the
PLL is in power-down mode, the Ftest/LD output is disabled and is in a high-impedance state. A complete
programming description of the multi-function output is provided in MUX[3:0] - Multifunction Output Select
(R3[23:22]:R0[23:22]).
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Feature Description (continued)
9.3.8.1 Push-Pull Analog Lock-Detect Output
An analog lock-detect status generated from the phase detector is available on the Ftest/LD output pin if
selected. A push-pull configuration can be selected for the lock-detect output signal. With this configuration, the
lock-detect output goes HIGH when the charge pump is inactive. It goes LOW when the charge pump is active
during a comparison cycle. Narrow low-going pulses are observed when the charge pump turns on.
There are three separate push-pull analog lock-detect signals that are routed to the multiplexer. Two of these
monitor the lock status of the individual synthesizers. The third detects the condition when both the RF and IF
synthesizers are in a locked state. External circuitry is required to provide a steady DC signal to indicate when
the PLL is in a locked state. Refer to MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22]) for details on
how to program the different push-pull analog lock-detect options.
9.3.8.2 Open-Drain Analog Lock-Detect Output
The lock-detect output can be an open-drain configuration. In this configuration, the lock-detect output goes to a
high impedance state when the charge pump is inactive. It goes LOW when the charge pump is active during a
comparison cycle. When a pullup resistor is used, narrow low-going pulses are observed when the charge pump
turns on.
Similarly, three separate open-drain analog lock-detect signals are routed to the multiplexer. Two of these
monitor the lock status of the individual synthesizers. The third detects the condition when both the RF and IF
synthesizers are in a locked state. External circuitry is required to provide a steady DC signal to indicate when
the PLL is in a locked state. Refer to MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22]) for details on
how to program the different open-drain analog lock-detect options.
9.3.8.3 Digital Filtered Lock-Detect Output
A digital filtered lock-detect status generated from the phase detector is also available on the Ftest/LD output pin
if selected. The lock-detect digital filter compares the difference between the phases of the inputs to the PFD to
an RC-generated delay of approximately 15 ns. If the phase error is less than the 15-ns RC delay for 5
consecutive reference cycles, the PLL enters a locked state (HIGH). Once in lock, the RC delay is changed to
approximately 30 ns. Once the phase error becomes greater than the 30-ns RC delay, the PLL falls out of lock
(LOW). When the PLL is in power-down mode, the Ftest/LD output is forced LOW. A flow chart of the digital
filtered lock-detect output is shown in Figure 30.
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Feature Description (continued)
Figure 30. Digital Lock-Detect Operation
Similarly, three separate digital filtered lock-detect signals are routed to the multiplexer. Two of these monitor the
lock status of the individual synthesizers. The third detects the condition when both the RF and IF synthesizers
are in a locked state. External circuitry is not required when the digital filtered lock-detect option is selected.
Refer to MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22]) for details on how to program the different
digital filtered lock-detect options.
9.3.8.4 Reference Divider and Feedback Divider Output
The outputs of the various N and R dividers can be monitored by selecting the appropriate Ftest/LD word. This is
essential when performing OSCin or Fin sensitivity measurements. Refer to the LMX243x FinRF Sensitivity Test
Setup or LMX243x OSCin Sensitivity Test Setup sections for more details.
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Feature Description (continued)
NOTE
The R and N outputs that are routed to the Ftest/LD are R/2 and N/2, respectively. The
internal /2 circuit is used to provide a 50% duty cycle. Refer to MUX[3:0] - Multifunction
Output Select (R3[23:22]:R0[23:22]) for more details on how to route the appropriate
divider output to the Ftest/LD pin.
9.3.9 Fastlock Output
The LMX243x fastlock feature allows a faster loop response time during lock aquisition. The loop response time
(lock time) can be approximately halved if the loop bandwidth is doubled. In order to achieve this, the same gain
/ phase relationship must be maintained when the loop bandwidth is doubled. When the FLoutRF or OSCout/
FLoutIF pins are configured as fastLock outputs, an open-drain device is enabled. The open-drain device
switches in a resistor parallel, and of equal value, to R2 of the external loop filter.
The loop bandwidth is effectively doubled and stability is maintained. Once locked to the correct frequency, the
PLL returns to a steady-state condition. The LMX243x offers two methods to achieve fastlock: manual and
automatic. Manual fastlock is achieved by increasing the charge pump current from 1 mA (RF_CPG/ IF_CPG Bit
= 0) in the steady-state mode, to 4 mA (RF_CPG/ IF_CPG Bit = 1) in fastlock mode. Automatic fastlock is
achieved by programming the time-out counter register (RF_TOC/ IF_TOC) with the appropriate number of
phase comparison cycles that the RF/ IF synthesizer spends in the fastlock state. Refer to R2 Register and R5
Register for details on how to configure the FLoutRF or OSCout/ FLoutIF output to an open-drain fastlock output.
9.3.10 Counter Reset
When the RF_RST/ IF_RST bit is enabled, both the feedback divider (RF_N/ IF_N) and reference divider (RF_R/
IF_R) are held at their load point. When the device is programmed to normal operation, both the feedback divider
and reference divider are enabled and resume counting in close alignment to each other. Refer to RF_RST - RF
Synthesizer Counter Reset (R0[21]) and IF_RST - IF Synthesizer Counter Reset (R3[21]) for more details.
9.4 Device Functional Modes
9.4.1 Power Control
The LMX243x device can be asynchronously powered down when the EN pin is set LOW, independent of the
state of the power-down bits.
NOTE
The OSCout/ FLoutIF pin can still be enabled if the ENosc pin is set HIGH, independent of
the state of the EN pin. This capability allows the oscillator buffer to be used as a crystal
oscillator.
When EN is set HIGH, power down is controlled through the MICROWIRE. The power-down word is comprised
of the RF_PD/ IF_PD bit, in conjunction with the RF_CPT/ IF_CPT bit. The power-down control word is used to
set the operating mode of the device. Refer to RF_CPT - RF Synthesizer Charge-Pump Tri-State (R0[20]),
RF_PD - RF Synthesizer Power Down (R1[23]), IF_CPT - IF Synthesizer Charge-Pump Tri-State (R3[20]), and
IF_PD - IF Synthesizer Power Down (R4[23]) for details on how to program the RF or IF power-down bits.
When either synthesizer is powered down, the respective prescaler, phase detector, and charge-pump circuit is
disabled. The CPoutRF/ CPoutIF, FinRF/ FinIF, and FinRF* pins are all forced to a high impedance state. The
reference divider and feedback divider circuits are held at the load point during power down. The oscillator buffer
is disabled when the ENosc pin is set LOW. The OSCin pin is forced to a HIGH state through an approximate
100-kΩ resistance when this condition exists. When either synthesizer is activated, the respective prescaler,
phase detector, charge-pump circuit, and the oscillator buffer are all powered up. The feedback divider and
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Device Functional Modes (continued)
reference divider are held at their load point. This allows the reference oscillator, feedback divider, reference
divider, and prescaler circuitry to reach proper bias levels. After a finite delay, the feedback and reference
dividers are enabled and resume counting in close alignment (the maximum error is one prescaler cycle). The
MICROWIRE control register remains active and capable of loading and latching data while in power-down
mode.
9.4.1.1 Synchronous Power-Down Mode
In this mode, the power-down function is gated by the charge pump. When the device is configured for
synchronous power down, the device enters the power-down mode upon completion of the next charge-pump
pulse event.
9.4.1.2 Asynchronous Power-Down Mode
In the asynchronous power-down mode, the power-down function is NOT gated by the completion of a charge-
pump pulse event. When the device is configured for asynchronous power down, the part goes into power-down
mode immediately.
Table 7. Power-Down Modes
RF_CPT / IF_CPT
BIT
RF_PD /
IF_PD BIT
EN PIN
OPERATING MODE
0
1
1
1
1
X(1)
X(1)
Asynchronous Power Down
0
0
PLL Active. Normal Operation
1
0
PLL Active. Charge-Pump Output in High-Impedance State
Synchronous Power Down
0
1
1
1
Asynchronous Power Down
(1) X refers to a don’t care condition.
9.5 Programming
9.5.1 Microwire Interface
The 24-bit shift register is loaded through the MICROWIRE interface. The shift register consists of a 21-bit
DATA[20:0] FIELD and a 3-bit ADDRESS[2:0] FIELD as shown in Table 8. The ADDRESS FIELD is used to
decode the internal control register address. When LE transitions HIGH, DATA stored in the shift register is
loaded into one of 6 control registers depending on the state of the ADDRESS bits. The MSB of DATA is loaded
into the shift register first. The DATA FIELD assignments are shown in Control Register Content Map.
Table 8. Register Structure
MSB
LSB
DATA[20:0]
ADDRESS[2:0]
23
3
2
0
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9.5.2 Control Register Location
The ADDRESS[2:0] bits decode the internal register address. The Table 9 shows how the ADDRESS bits are
mapped into the target control register.
Table 9. Control Register Locations
ADDRESS[2:0]
TARGET
FIELD
REGISTER
0
0
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
R0
R1
R2
R3
R4
R5
9.6 Register Maps
9.6.1 Control Register Content Map
The control register content map describes how the bits within each control register are allocated to specific
control functions. The bits that are marked 0 must be programmed as such to ensure proper device operation.
Table 10. Control Register Content Map
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
ADDRESS
[2:0]
REG
DATA[20:0] FIELD
FIELD
RF RF RF RF
_
_
_
_
R0 MUX[3:2]
RF_R[14:0]
0
0
0
0
RS CP CP CP
T
T
G
P
RF RF
LMX2430/33
RF_B[14:0]
LMX2430/33
RF_A[3:0]
R1
_
_
0
1
PD
P
RF RF
LMX2434
RF_B[13:0]
LMX2434
RF_A[4:0]
R1
R2
_
_
0
0
0
0
1
1
1
0
1
PD
P
0
0
0
0
0
0
0
0
0
0
0
RF_TOC[11:0]
IF_R[14:0]
IF_ IF_ IF_ IF_
R3 MUX[1:0] RS CP CP CP
T
0
0
T
G
P
IF_ IF_
PD
R4
R5
IF_B[13:0]
0
IF_A[3:0]
1
1
0
0
0
1
P
0
0
0
0
0
IF_TOC[11:0]
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9.6.2 R0 Register
The R0 register contains the RF_R, RF_CPP, RF_CPG, RF_CPT, and RF_RST control words, in addition to two
of the four bits that compose the MUX control word. The detailed descriptions and programming information for
each control word is discussed in the following sections.
Table 11. R0 Register
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
ADDRESS
[2:0]
REG
DATA[20:0] FIELD
FIELD
RF RF RF RF
_
_
_
_
R0 MUX[3:2]
RF_R[14:0]
0
0
0
RS CP CP CP
T
T
G
P
9.6.2.1 RF_R[14:0] - RF Synthesizer Programmable Reference Divider (R Counter) (R0[17:3])
The RF reference divider (RF_R) can be programmed to support divide ratios from 3 to 32,767. Divide ratios less
than 3 are prohibited.
Table 12. PLL R Divider
RF_R[14:0]
DIVIDE RATIO
14
0
13
0
12
0
11
0
10
0
9
0
0
•
8
0
0
•
7
0
0
•
6
0
0
•
5
0
0
•
4
0
0
•
3
0
0
•
2
0
1
•
1
1
0
•
0
1
0
•
3
4
•
0
0
0
0
0
•
•
•
•
•
32767
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
9.6.2.2 RF_CPP - RF Synthesizer Phase Detector Polarity (R0[18])
The RF_CPP bit is used to control the PFD polarity of the RF synthesizer based on the VCO tuning
characteristics.
Table 13. Phase Detector Polarity
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
RF_CPP
R0[18]
RF Phase and Frequency RF VCO Negative Tuning RF VCO Positive Tuning
Detector Polarity
Characteristics
Characteristics
Figure 31. RF VCO Characteristics
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9.6.2.3 RF_CPG - RF Synthesizer Charge-Pump Current Gain (R0[19])
The RF_CPG bit controls the charge-pump gain of the RF synthesizer. Two gain levels are available.
Table 14. Charge-Pump Polarity
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
RF Charge-Pump Current
Gain
LOW
1 mA
HIGH
4 mA
RF_CPG
R0[19]
9.6.2.4 RF_CPT - RF Synthesizer Charge-Pump Tri-State (R0[20])
The RF_CPT bit allows the charge pump to be switched between a normal operating mode and a high-
impedance output state. This happens asynchronously with the change in the RF_CPT bit.
Furthermore, the RF_CPT bit operates in conjuction with the RF_PD bit to set a synchronous or an
asynchronous power-down mode. Refer to RF_PD - RF Synthesizer Power Down (R1[23]) for more details on
how to program the RF_PD bit.
Table 15. Charge-Pump Tri-State
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
RF_CPT
R0[20]
RF Charge-Pump tri-state RF Charge Pump Normal RF Charge-Pump Output
Operation in High Impedance State
9.6.2.5 RF_RST - RF Synthesizer Counter Reset (R0[21])
The RF_RST bit resets the RF_A, RF_B and RF_R counters. After removing the reset, the RF_A and RF_B
counters resume counting in close alignment with the RF_R counter. The maximum error is one prescaler cycle.
Table 16. N Counter Reset
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
RF_RST
R0[21]
RF Counter Reset
RF_A, RF_B and RF_R
Normal Operation
RF_A, RF_B and RF_R
Reset
9.6.3 R1 Register
The R1 register contains the RF_A, RF_B, RF_P, and RF_PD control words. The RF_A and RF_B control words
are used to set up the programmable feedback divider. The detailed descriptions and programming information
for each control word is discussed in the following sections.
Table 17. RI Register
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
ADDRESS
[2:0]
REG
DATA[20:0] FIELD
FIELD
RF RF
LMX2430/33
RF_B[14:0]
LMX2430/33
RF_A[3:0]
R1
R1
_
_
0
0
0
1
PD
P
RF RF
LMX2434
RF_B[13:0]
LMX2434
RF_A[4:0]
_
_
0
1
PD
P
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9.6.3.1 LMX243x RF Synthesizer Swallow Counter
9.6.3.1.1 RF_A[3:0] - LMX2430/33 RF Synthesizer Swallow Counter (A Counter) (R1[6:3])
The RF_A control word is used to set up the A counter of the RF synthesizer. For both the LMX2430 and
LMX2433, the A counter is a 4-bit swallow counter used in the programmable feedback divider. The RF_A
control word can be programmed to values ranging from 0 to 15.
Table 18. RF_A Divider for LMX2430/33
LMX2430/33
RF_A[3:0]
DIVIDE RATIO
3
0
0
•
2
0
0
•
1
0
0
•
0
0
1
•
0
1
•
15
1
1
1
1
9.6.3.1.2 RF_A[4:0] - LMX2434 RF Synthesizer Swallow Counter (A Counter) (R1[7:3])
The LMX2434 A counter is a 5-bit swallow counter used in the programmable feedback divider. The RF_A
control word can be programmed to values ranging from 0 to 31.
Table 19. RF A Divider for LMX2434
LMX2434
RF_A[4:0]
DIVIDE RATIO
4
0
0
•
3
0
0
•
2
0
0
•
1
0
0
•
0
0
1
•
0
1
•
31
1
1
1
1
1
9.6.3.2 LMX243x RF Synthesizer Programmable Binary Counter
9.6.3.2.1 RF_B[14:0] - LMX2430/33 RF Synthesizer Programmable Binary Counter (B Counter) (R1[21:7])
The RF_B control word is used to set up the B counter of the RF synthesizer. For both the LMX2430 and
LMX2433, the B counter is a 15-bit programmable binary counter used in the programmable feedback divider.
The RF_B control word can be programmed to values ranging from 3 to 32,767. Divide ratios less than 3 are
prohibited.
Table 20. RF B Divider for LMX2430/33
LMX2430/33
RF_B[14:0]
DIVIDE
RATIO
14
0
13
0
12
0
11
0
10
0
9
0
0
•
8
0
0
•
7
0
0
•
6
0
0
•
5
0
0
•
4
0
0
•
3
0
0
•
2
0
1
•
1
1
0
•
0
1
0
•
3
4
•
0
0
0
0
0
•
•
•
•
•
32767
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
9.6.3.2.2 RF_B[13:0] - LMX2434 RF Synthesizer Programmable Binary Counter (B Counter) (R1[21:8])
The LMX2434 B counter is a 14-bit programmable binary counter used in the programmable feedback divider.
The RF_B control word can be programmed to values ranging from 3 to 16,383. Divide ratios less than 3 are
prohibited.
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Table 21. RF B Divider for LMX2434
LMX2434
RF_B[13:0]
DIVIDE
RATIO
13
0
12
0
11
0
10
0
9
0
0
•
8
0
0
•
7
0
0
•
6
0
0
•
5
0
0
•
4
0
0
•
3
0
0
•
2
0
1
•
1
1
0
•
0
1
0
•
3
4
•
0
0
0
0
•
•
•
•
16383
1
1
1
1
1
1
1
1
1
1
1
1
1
1
9.6.3.3 LMX243x RF Synthesizer Prescaler Select
9.6.3.3.1 RF_P - LMX2430/33 RF Synthesizer Prescaler Select (R1[22])
Both the LMX2430 and LMX2433 RF synthesizers use a selectable dual-modulus prescaler. An 8/9 or a 16/17
prescale ratio can be selected.
Table 22. Prescaler Select Bit for LMX2430/33
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
RF_P
R1[22]
LMX2430/33
RF Prescaler Select
8/9 Prescaler Selected
16/17 Prescaler Selected
9.6.3.3.2 RF_P - LMX2434 RF Synthesizer Prescaler Select (R1[22])
The LMX2434 RF synthesizer uses a selectable dual-modulus prescaler. A 16/17 or a 32/33 prescale ratio can
be selected.
Table 23. Prescaler Select Bit for LMX2434
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
RF_P
R1[22]
LMX2434
RF Prescaler Select
16/17 Prescaler Selected 32/33 Prescaler Selected
9.6.3.4 RF_PD - RF Synthesizer Power Down (R1[23])
The RF_PD bit is used to switch the RF PLL between a powered-up and powered-down mode.
Furthermore, the RF_PD bit operates in conjunction with the RF_CPT bit to set a synchronous or an
asynchronous power-down mode. Refer to RF_CPT - RF Synthesizer Charge-Pump Tri-State (R0[20]) for more
details on how to program the RF_CPT bit.
Table 24. Power Down Bit
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
RF Power down
0
1
RF_PD
R1[23]
RF PLL Active
RF PLL Power down
9.6.4 R2 Register
The R2 Register contains the RF_TOC control word. The RF_TOC is used to set up the fastlock circuitry of the
RF synthesizer. The RF_TOC is a 12-bit binary counter programmable from 0 to 4095.
Table 25. R2 Register
23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
ADDRESS
[2:0]
FIELD
REG
R2
DATA[20:0] FIELD
0
0
0
0
0
0
0
0
0
RF_TOC[11:0]
0
1
0
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9.6.4.1 RF_TOC[0:11] - RF Synthesizer Time-Out Counter (R2[14:3])
The FLoutRF pin can be configured as a general-purpose CMOS tri-state output or as a fastlock output by
programming the RF_TOC appropriately. When the RF_TOC is programmed from 0 to 3, automatic fastlock is
disabled, and the FLoutRF pin is either configured as a general-purpose CMOS tri-state output or manual
fastlock is enabled. When the RF_TOC is programmed to 0, the FLoutRF pin is in tri-state (high impedance)
mode. The charge-pump current is then the value specified by RF_CPG (R0[19]). When the RF_TOC is
programmed to 1, the FLoutRF pin is pulled to a LOW state. The charge-pump current is then set to a HIGH gain
state (RF_CPG bit = 1). This condition is known as the manual fastlock. When the RF_TOC is programmed to 2,
the FLout_RF pin is again pulled to a LOW state, but this time the charge-pump current is the value specified by
RF_CPG (R0[19]). When the RF_TOC is programmed to 3, the FLoutRF pin is pulled to a HIGH state. Again, the
charge-pump current is the value specified by RF_CPG (R0[19]). When the RF_TOC is programmed from 4 to
4095, fastlock is enabled, and the FLoutRF pin is pulled to a LOW state. Fastlock time outs after the specified
number of PFD events. At this time, the FLoutRF pin switches to tri-state (high impedance) mode. The value
programmed into RF_TOC represents the number of PFD events that the RF synthesizer spends in the fastlock
state.
NOTE
Any write to the RF_TOC requires a PFD event on the RF synthesizer to latch the
contents. This means that writes to the RF_TOC take effect synchronously with the next
PFD event.
Table 26. Fastlock Time-Out Counter
FASTLOCK PERIOD
[PFD EVENTS]
FLoutRF PIN
FUNCTIONALITY / STATE
RF_TOC[11:0]
FASTLOCK MODE
ICPoutRF MAGNITUDE
0
Disabled
N/A
N/A
N/A
N/A
4
General-Purpose.
High Impedance State
ICPoutRF magnitude
controlled by R0[19]
1
2
3
4
Enabled
Manual Fastlock
General-Purpose.
Logic LOW State
ICPoutRF = 4 mA
Disabled
General-Purpose.
Logic LOW State
ICPoutRF magnitude
controlled by R0[19]
Disabled
General-Purpose.
Logic HIGH State
ICPoutRF magnitude
controlled by R0[19]
Enabled
FastLock.
ICPoutRF = 4 mA
Automatic Fastlock
Logic LOW State. Switches Switches to 1 mA after 4
to High Impedance after 4
PFD events
PFD events
…
…
…
…
…
4095
Enabled
4095
FastLock.
ICPoutRF = 4 mA
Automatic Fastlock
Logic LOW State. Switches Switches to 1 mA after
to High Impedance after
4095 PFD events
4095 PFD events
9.6.4.2 R3 Register
The R3 register contains the IF_R, IF_CPP, IF_CPG, IF_CPT, and IF_RST control words, in addition to two of
the four bits that compose the MUX control word. The detailed descriptions and programming information for
each control word is discussed in the following sections.
Table 27. R3 Register
REG 23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
ADDRESS
[2:0]
DATA[20:0] FIELD
FIELD
IF_ IF_ IF_ IF_
R3 MUX[1:0] RS CP CP CP
IF_R[14:0]
0
1
1
T
T
G
P
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9.6.4.2.1 IF_R[14:0] - IF Synthesizer Programmable Reference Divider (R Counter) (R3[17:3])
The IF reference divider (IF_R) can be programmed to support divide ratios from 3 to 32,767. Divide ratios less
than 3 are prohibited.
Table 28. IF R Divider
IF_R[14:0]
DIVIDE RATIO
14
0
13
0
12
0
11
0
10
0
9
0
0
•
8
0
0
•
7
0
0
•
6
0
0
•
5
0
0
•
4
0
0
•
3
0
0
•
2
0
1
•
1
1
0
•
0
1
0
•
3
4
•
0
0
0
0
0
•
•
•
•
•
32767
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
9.6.4.2.2 IF_CPP - IF Synthesizer Phase Detector Polarity (R3[18])
The IF_CPP bit is used to control the PFD polarity of the IF synthesizer based on the VCO tuning characteristics.
Table 29. IF PLL Charge-Pump Polarity
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
IF PFD Polarity
0
1
IF_CPP
R3[18]
IF VCO Negative Tuning
Characteristics
IF VCO Positive Tuning
Characteristics
Figure 32. IF VCO Characteristics
9.6.4.2.3 IF_CPG - IF Synthesizer Charge-Pump Current Gain (R3[19])
The IF_CPG bit controls the charge-pump gain of the IF synthesizer. Two gain levels are available.
Table 30. IF PLL Phase Detector Polarity Bit
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
IF Charge-Pump Current
Gain
LOW
1 mA
HIGH
4 mA
IF_CPG
R3[19]
9.6.4.2.4 IF_CPT - IF Synthesizer Charge-Pump Tri-State (R3[20])
The IF_CPT bit allows the charge pump to be switched between a normal operating mode and a high impedance
output state. This happens asynchronously with the change in the IF_CPT bit.
Furthermore, the IF_CPT bit operates in conjuction with the IF_PD bit to set a synchronous or an asynchronous
power-down mode. Refer to IF_PD - IF Synthesizer Power Down (R4[23]) for more details on how to program
the IF_PD bit.
Table 31. IF PLL Charge-Pump Polarity Bit
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
IF_CPT
R3[20]
IF Charge-Pump Tri-State IF Charge Pump Normal
Operation
IF Charge-Pump Output in
High Impedance State
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9.6.4.2.5 IF_RST - IF Synthesizer Counter Reset (R3[21])
The IF_RST bit resets of the IF_A, IF_B and IF_R counters. After removing the reset, the IF_A and IF_B
counters resume counting in close alignment with the IF_R counter. The maximum error is one prescaler cycle.
Table 32. IF PLL Counter Reset
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
IF_RST
R3[21]
IF Counter Reset
IF_A, IF_B and IF_R
Normal Operation
IF_A, IF_B and IF_R
Reset
9.6.5 R4 Register
The R4 register contains the IF_A, IF_B, IF_P, and IF_PD control words. The IF_A and IF_B control words are
used to set up the programmable feedback divider. The detailed descriptions and programming information for
each control word is discussed in the following sections. R4[21] is always set to 0.
Table 33. R4 Register
REG 23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
ADDRESS
[2:0]
DATA[20:0] FIELD
FIELD
IF_ IF_
R4
0
IF_B[13:0]
IF_A[3:0]
1
0
0
PD
P
9.6.5.1 IF_A[3:0] - IF Synthesizer Swallow Counter (A Counter) (R4[6:3])
The IF_A control word is used to set up the A counter of the IF synthesizer. The A counter is a 4-bit swallow
counter used in the programmable feedback divider. The IF_A control word can be programmed to values
ranging from 0 to 15.
Table 34. IF A counter Bit
IF_A[3:0]
DIVIDE RATIO
3
0
0
•
2
0
0
•
1
0
0
•
0
0
1
•
0
1
•
15
1
1
1
1
9.6.5.2 IF_B[13:0] - IF Synthesizer Programmable Binary Counter (B Counter) (R4[20:7])
The IF_B control word is used to set up the B counter of the IF synthesizer. The B counter is a 14-bit
programmable binary counter used in the programmable feedback divider. The IF_B control word can be
programmed to values ranging from 3 to 16,383. Divide ratios less than 3 are prohibited.
Table 35. IF B Counter
IF_B[13:0]
DIVIDE
RATIO
13
0
12
0
11
0
10
0
9
0
0
•
8
0
0
•
7
0
0
•
6
0
0
•
5
0
0
•
4
0
0
•
3
0
0
•
2
0
1
•
1
1
0
•
0
1
0
•
3
4
•
0
0
0
0
•
•
•
•
16383
1
1
1
1
1
1
1
1
1
1
1
1
1
1
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9.6.5.2.1 IF_P - IF Synthesizer Prescaler Select (R4[22])
The LMX243x IF synthesizer uses a selectable dual modulus prescaler. An 8/9 or a 16/17 prescale ratio can be
selected.
Table 36. IF Prescaler Select Bit
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
0
1
IF_P
R4[22]
IF Prescaler Select
8/9 Prescaler Selected
16/17 Prescaler Selected
9.6.5.3 IF_PD - IF Synthesizer Power Down (R4[23])
The IF_PD bit is used to switch the IF PLL between a powered-up and powered-down mode.
Furthermore, the IF_PD bit operates in conjuction with the IF_CPT bit to set a synchronous or an asynchronous
power-down mode. Refer to IF_CPT - IF Synthesizer Charge-Pump Tri-State (R3[20]) for more details on how to
program the IF_CPT bit.
Table 37. IF PLL Powerdown Bit
FUNCTION
CONTROL BIT
REGISTER LOCATION
DESCRIPTION
IF Power down
0
1
IF_PD
R4[23]
IF PLL Active
IF PLL Power down
9.6.6 R5 Register
The R5 Register contains the IF_TOC control word. The IF_TOC is used to set up the fastlock circuitry of the IF
synthesizer. The IF_TOC is a 12-bit binary counter programmable from 0 to 4095.
Table 38. R5 Register
REG 23 22 21 20 19 18 17 16 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
ADDRESS
[2:0]
DATA[20:0] FIELD
FIELD
R5
0
0
0
0
0
0
0
0
0
IF_TOC[11:0]
1
0
1
38
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9.6.6.1 IF_TOC[0:11] - IF Synthesizer Time-Out Counter (R5[14:3])
The OSCout/ FLoutIF pin can be configured as a general-purpose CMOS tri-state output or as a fastlock output
by programming the IF_TOC appropriately. When the IF_TOC is programmed from 0 to 3, automatic fastlock is
disabled, and the OSCout/ FLoutIF pin is configured as a general-purpose CMOS tri-state output or manual
fastlock is enabled. When the IF_TOC is programmed to 0, the OSCout/ FLoutIF pin is in tri-state (high
impedance) mode. The charge-pump current is then the value specified by IF_CPG (R3[19]). When the IF_TOC
is programmed to 1, the OSCout/ FLoutIF pin is pulled to a LOW state. The charge-pump current is then set to a
HIGH gain state (IF_CPG bit = 1). This condition is known as the manual fastlock. When the IF_TOC is
programmed to 2, the OSCout/ FLout_IF pin is again pulled to a LOW state, but this time the charge-pump
current is the value specified by IF_CPG (R3[19]). When the IF_TOC is programmed to 3, the OSCout/ FLoutIF
pin is pulled to a HIGH state. Again, the charge-pump current is the value specified by IF_CPG (R3[19]). When
the IF_TOC is programmed from 4 to 4095, fastlock is enabled, and the OSCout/ FLoutIF pin is pulled to a LOW
state. Fastlock timeouts after the specified number of PFD events. At this time, the OSCout/ FLoutIF pin switches
to tri-state (high impedance) mode. The value programmed into IF_TOC represents the number of PFD events
that the IF synthesizer spends in the fastlock state.
NOTE
Any write to the IF_TOC requires a PFD event on the IF synthesizer to latch the contents.
This means that writes to the IF_TOC take effect synchronously with the next PFD event.
Table 39. IF PLL Fastlock Time-Out Counter
FASTLOCK PERIOD
[PFD Events]
OSCout/ FLoutIF PIN
FUNCTIONALITY / STATE
IF_TOC[11:0]
FASTLOCK MODE
ICPoutIF MAGNITUDE
0
Disabled
N/A
N/A
N/A
N/A
4
General-Purpose.
High Impedance State
ICPoutIF magnitude
controlled by R3[19]
1
2
3
4
Enabled
Manual Fastlock
General-Purpose.
Logic LOW State
ICPoutIF = 4 mA
Disabled
General-Purpose.
Logic LOW State
ICPoutIF magnitude
controlled by R3[19]
Disabled
General-Purpose.
Logic HIGH State
ICPoutIF magnitude
controlled by R3[19]
Enabled
FastLock.
ICPoutIF = 4 mA
Automatic Fastlock
Logic LOW State. Switches Switches to 1 mA after 4
to High Impedance after 4
PFD events
PFD events
…
…
…
…
…
4095
Enabled
4095
FastLock.
ICPoutIF = 4 mA
Automatic Fastlock
Logic LOW State. Switches Switches to 1 mA after
to High Impedance after
4095 PFD events
4095 PFD events
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9.6.7 MUX[3:0] - Multifunction Output Select (R3[23:22]:R0[23:22])
The MUX control word is used to determine which signal is routed to the Ftest/LD pin.
Table 40. Multifunction Output Select(1)
MUX[3:0]
MUX OUTPUT STATE
0
0
0
0
0
0
0
0
1
0
1
0
High Impedance (Tri-state) State Output
Logic HIGH State Output
Logic LOW State Output
RF PLL and IF PLL Digital Lock Detect.
Open-Drain Output
0
0
0
0
0
1
1
1
1
0
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0
1
RF PLL Digital Lock Detect.
Open-Drain Output
IF PLL Digital Lock Detect.
Open-Drain Output
RF PLL and IF PLL Analog Lock Detect.
Open-Drain Output
RF PLL Analog Lock Detect.
Open-Drain Output
IF PLL Analog Lock Detect.
Open-Drain Output
RF PLL and IF PLL Analog Lock Detect.
Push-Pull Output
RF PLL Analog Lock Detect.
Push-Pull Output
IF PLL Analog Lock Detect.
Push-Pull Output
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
IF_R/ 2 Frequency
IF_N/ 2 Frequency
RF_R/ 2 Frequency
RF_N/ 2 Frequency
(1) 1. RF_N = (RF_B × RF_P) + RF_A
2. IF_N = (IF_B × IF_P) + IF_A
40
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The LMX2430 family of devices can be used in a broad class of applications. LMX2430x devices have very low
current consumption and are well-suited for many lower power applications. Because these devices have two
PLLs, they can be used to generate two distinct frequencies. However, it is a perfectly valid thing to only use one
of the PLLs and power down the other side. When only one side is used, be sure to power the other side down,
but do NOT disconnect the power pins for the unused side as they are shared across several internal blocks.
When the unused side is powered down, it draws no current, and the counters and charge pump are not running
or generating any noise and spurs. Figure 33 generally applies to most applications.
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10.2 Typical Application
VCC_PLL
R34
3.3 W
U1
VCC_PLL
1
2
20
19
VCC
DATA
CLK
LE
DATA
CLK
LE
C21
100 pF
GND
FinIF
R25
3.3 W
3
18
17
16
15
14
C12
100 pF
4
VCC_PLL
EN
VCC
5
CPoutiF
FinRF*
FinRF
GND
C14
C15
R26
R26
6
RFOUT
Enose
OSCout
OSCin
18 W
18 W
R27
18 W
7
100 pF
100 pF
8
13
12
11
OSCin
CPoutRF
GND
VCC_PLL
R20
100k R21
100k R22
9
VCC_PLL
VCC
VCC_RF
3.3 W
C5
100 pF
U2
10
Ftest/LD
FLoutRF
VCO
R24
5.6 W
C8
1 uF
13
14
15
16
8
7
6
5
LMX243X
GND
GND
GND
MOD
GND
U5
LM6211
VCC
C10
1 uF
GND
GND
Ftest/LD
R23
VCC_AMP
10 W
C9
1 uF
R1_RF
R3_RF
R4_RF
C1_RF
Ca_LF
Open
0 W
0 W
C4_RF
Open
C3_RF
R2_RF
TBD
C2_RF
Figure 33. Typical Use Case
42
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10.2.1 Design Requirements
Table 41 lists the design parameters of the LMX243x.
Table 41. Design Parameters
PARAMETER
VALUE
4 mA
KPD
Charge-Pump Gain
VCO Input Capacitance
Phase Detector Frequency
OSCin Frequency
Loop Bandwidth
Phase Margin
CVCO
22 pF
fPD
1 MHz
100 MHz
31.1 kHz
59.6 degrees
0.9
fOSC
BW
PM
Gamma
T3/T1
C1_RF
C2_RF
C3_RF
C4_RF
R2_RF
R3_RF
R4_RF
Gamma
T3/T1 Ratio
177.1%
270 pF
10 nF
1 nF
Loop Filter Components
Open
1.8 Ω
820 Ω
0 Ω
10.2.2 Detailed Design Procedure
The loop filter design is key and involves trade-offs between lock time, phase noise, and spurs. The TI website
has references and design and simulation tools that can be used to design the loop filter and simulate the
performance.
10.2.3 Application Curves
Figure 35. Phase Detector Spurs
Figure 34. Phase Noise
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11 Power Supply Recommendations
Low-noise regulators are generally recommended for the supply pins. It is acceptable to have one regulator
supply the part, although it is best to implement individual bypassing as shown in the Layout Guidelines for the
best spur performance. The charge-pump pins are typically the most sensitive to supply noise, but the external
VCO used with this device is likely to be orders of magnitude more sensitive.
12 Layout
12.1 Layout Guidelines
In general, there are two cases for layout:
1. Use as a single PLL: In this case, all power supply pins must be connected, but for those on the unused PLL,
bypassing is not necessary, and they can be shorted together. Leave unused outputs unconnected, and do
not ground them.
2. Use as a dual PLL: In this case, supply coupling is much more critical as there can be crosstalk between the
two PLLs. There must be isolation in the form of resistors or inductors between the charge-pump supply pins,
and decoupling capacitors are more important.
12.2 Layout Example
Figure 36. Layout Example
44
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SNAS187D –FEBRUARY 2003–REVISED JANUARY 2016
13 Device and Documentation Support
13.1 Device Support
13.1.1 Device Nomenclature
13.1.1.1 List of Definitions
fCOMP
Fin:
A:
:
RF or IF phase detector comparison frequency
RF or IF input frequency
RF_A or IF_A counter value
B:
RF_B or IF_B counter value
P:
Preset modulus of the dual moduIus prescaler
LMX2430 RF synthesizer: P = 8 or 16
LMX2433 RF synthesizer: P = 8 or 16
LMX2434 RF synthesizer: P = 16 or 32
LMX243x IF synthesizer: P = 8 or 16
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 42. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
LMX2430
LMX2433
LMX2434
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
13.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.4 Trademarks
PLLatinum, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
46
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
NPE
PW
Qty
(1)
(2)
(3)
(4/5)
(6)
LMX2430SLEX/NOPB
LMX2430TM/NOPB
LMX2430TMX/NOPB
LMX2433SLEX/NOPB
LMX2434SLEX/NOPB
ACTIVE
ULGA
TSSOP
TSSOP
ULGA
20
20
20
20
20
2500 RoHS & Green
73 RoHS & Green
NIAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
X2430
SLE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SN
SN
LMX2430
TM>D
PW
2500 RoHS & Green
2500 RoHS & Green
2500 RoHS & Green
LMX2430
TM>D
NPE
NPE
NIAU
NIAU
X2433
SLE
ULGA
X2434
SLE
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMX2430SLEX/NOPB
LMX2430TMX/NOPB
LMX2433SLEX/NOPB
LMX2434SLEX/NOPB
ULGA
TSSOP
ULGA
ULGA
NPE
PW
20
20
20
20
2500
2500
2500
2500
330.0
330.0
330.0
330.0
12.4
16.4
12.4
12.4
3.8
6.95
3.8
3.8
7.1
3.8
3.8
1.3
1.6
1.3
1.3
8.0
8.0
8.0
8.0
12.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
NPE
NPE
3.8
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMX2430SLEX/NOPB
LMX2430TMX/NOPB
LMX2433SLEX/NOPB
LMX2434SLEX/NOPB
ULGA
TSSOP
ULGA
ULGA
NPE
PW
20
20
20
20
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
NPE
NPE
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TUBE
T - Tube
height
L - Tube length
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device
Package Name Package Type
PW TSSOP
Pins
SPQ
L (mm)
W (mm)
T (µm)
B (mm)
LMX2430TM/NOPB
20
73
495
8
2514.6
4.06
Pack Materials-Page 3
PACKAGE OUTLINE
PW0020A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX AREA
18X 0.65
20
1
2X
5.85
6.6
6.4
NOTE 3
10
B
11
0.30
20X
4.5
4.3
NOTE 4
0.19
1.2 MAX
0.1
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
A
20
0 -8
DETAIL A
TYPICAL
4220206/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
20X (1.5)
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
11
10
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220206/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
20X (1.5)
SYMM
(R0.05) TYP
20
1
20X (0.45)
SYMM
18X (0.65)
10
11
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220206/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
NPE0020A
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
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DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
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such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
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TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
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SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
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