LMX2492QRTWTQ1 [TI]
具有斜坡/线性调频脉冲生成功能的汽车级 500MHz 至 14GHz 宽带、低噪声分数 N PLL | RTW | 24 | -40 to 125;型号: | LMX2492QRTWTQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有斜坡/线性调频脉冲生成功能的汽车级 500MHz 至 14GHz 宽带、低噪声分数 N PLL | RTW | 24 | -40 to 125 脉冲 |
文件: | 总41页 (文件大小:1910K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LMX2492, LMX2492-Q1
ZHCSCB6 –MARCH 2014
LMX2492/LMX2492-Q1 14GHz 低噪声分数 N 分频锁相环 (PLL),具有斜
坡/超宽带信号源发生功能
1 特性
3 说明
1
•
•
•
•
•
•
•
•
•
•
-227dBc/Hz 标称 PLL 噪声
LMX2492/92-Q1 是一款具有斜坡和超宽带信号源发生
功能的 14GHz 宽频带三角积分分数 N 分频 PLL。 它
由一个相位频率检测器、可编程电荷泵以及用于外部
VCO 的高频输入组成。 LMX2492/92-Q1 支持宽范围
且灵活的斜升功能类 (class of ramping capabilities),
其中包括 FSK,PSK 和高达 8 个段的可配置分段线性
FM 调制系统配置。 它还支持精细的 PLL 分辨率以及
相位检测器速率高达 200MHz 的快速斜坡。
500MHz - 14GHz 宽频带 PLL
3.15 -5.25V 电荷泵 PLL 电源
多用途斜坡/超宽带信号源发生
最大相位检测器频率 200MHz
频移键控/相移键控 (FSK/PSK) 调制引脚
数字锁检测
单个 3.3V 电源
LMX2492/92-Q1 的任何一个寄存器均可被回读。
LMX2492/92-Q1 可由单个 3.3V 电源供电运行。 而
且,对于电压高达 5.25V 的电荷泵的支持能够免除对
于外部放大器的需要,从而获得一个具有更佳相位噪声
性能的更简单解决方案。
汽车用 125°C Q100 1 级认证
非汽车用 (LMX2492) 选项
2
应用范围
•
•
•
•
•
•
•
汽车用调频连续波 (FMCW) 雷达
军用雷达
器件信息
微波回程
订货编号
封装
封装尺寸
测试和测量
LMX2492-Q1RTW
超薄四方扁平无
引线 (WQFN)
(24)
卫星通信
4mm x 4mm
LMX2492RTW
无线基础设施
针对高速模数转换器 (ADC) / 数模转换器 (DAC) 的
采样时钟
4 简化电路原理图
OSCin
2X
R Divider
(16 bit)
CPout
Phase
Comp
Charge
Pump
51 :
GND/OSCin*
C2_LF
R2_LF
51 :
C1_LF
Vcp
GND (x3)
18 :
18 :
Vcc (x5)
Fin
CE
CLK
MICROWIRE
Interface
36 :
18 :
DATA
To Circuit
N Divider
(18 bit)
LE
Fin*
68 :
TRIG1
TRIG2
51 :
6'
Modulation
Generator
Compensation
(24 bit)
MUX
MOD
MUXout
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SNAS624
LMX2492, LMX2492-Q1
ZHCSCB6 –MARCH 2014
www.ti.com.cn
目录
8.6 Register Map........................................................... 14
8.7 Register Field Descriptions ..................................... 18
8.8 Lock Detect and Charge Pump Monitoring............. 21
8.9 TRIG1,TRIG2,MOD, and MUXout Pins .................. 22
8.10 Ramping Functions ............................................... 24
8.11 Individual Ramp Controls...................................... 26
Applications and Implementation ...................... 27
9.1 Application Information............................................ 27
9.2 Typical Applications ................................................ 27
1
2
3
4
5
6
7
特性.......................................................................... 1
应用范围................................................................... 1
说明.......................................................................... 1
简化电路原理图........................................................ 1
修订历史记录 ........................................................... 2
Terminal Configuration and Functions................ 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings................................... 4
7.2 Handling Ratings ...................................................... 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information ................................................. 4
7.5 Electrical Characteristics .......................................... 5
9
10 Power Supply Recommendations ..................... 33
11 Layout................................................................... 34
11.1 Layout Guidelines ................................................. 34
11.2 Layout Example .................................................... 34
12 Device and Documentation Support ................. 35
12.1 Device Support .................................................... 35
12.2 Documentation Support ....................................... 35
12.3 Related Links ........................................................ 35
12.4 Trademarks........................................................... 35
12.5 Electrostatic Discharge Caution............................ 35
12.6 Glossary................................................................ 35
13 机械封装和可订购信息 .......................................... 35
7.6 Timing Requirements, Programming Interface (CLK,
DATA, LE).................................................................. 6
7.7 Serial Data Input Timing ........................................... 6
7.8 Typical Characteristics ............................................. 7
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes........................................ 13
8.5 Programming........................................................... 14
8
5 修订历史记录
日期
修订版本
注释
2014 年 3 月
*
最初发布版本。
2
Copyright © 2014, Texas Instruments Incorporated
LMX2492, LMX2492-Q1
www.ti.com.cn
ZHCSCB6 –MARCH 2014
6 Terminal Configuration and Functions
WQFN (RTW)
24 Terminal
(Top View)
24 23 22 21 20 19
GND
GND
GND
18 Vcc
1
2
3
4
5
6
17 MUXout
LE
16
15
Pin 0
(Ground Substrate)
Fin
Fin*
Vcc
DATA
14 CLK
CE
13
7
8
9
10 11 12
Terminal Functions
TERMINAL
TYPE
DESCRIPTION
NUMBER
NAME
DAP
0
1
GND
GND
GND
Die Attach Pad. Connect to PCB ground plane.
Ground for charge pump.
GND
GND
2,3
Ground for Fin Buffer
Complimentary high frequency input pins. Should be AC coupled. If driving single-ended,
impedance as seen from Fin and Fin* pins looking outwards from the part should be roughly the
same.
Fin
Fin*
4,5
Input
6
7
8
9
Vcc
Vcc
Supply
Supply
Supply
Input
Power Supply for Fin Buffer
Supply for On-chip LDOs
Supply for OSCin Buffer
Vcc
OSCin
Reference Frequency Input
Complimentary input for OSCin.
GND/
OSCin*
10
GND/Input If not used, it is recommended to match the termination as seen from the OSCin terminal looking
outwards. However, this may also be grounded as well.
11
12
13
14
15
16
17
18
19
20
21
22
23
24
GND
MOD
CE
GND
Ground for OSCin Buffer
Input/Output Multiplexed Input/Output Pins for Ramp Triggers, FSK/PSK Modulation, FastLock, and Diagnostics
Input
GND
GND
Input
Chip Enable
CLK
DATA
LE
Serial Programming Clock.
Serial Programming Data
Serial Programming Latch Enable
MUXout Input/Output Multiplexed Input/Output Pins for Ramp Triggers, FSK/PSK Modulation, FastLock, and Diagnostics
Vcc
Vcc
Supply
Supply
Supply for delta sigma engine.
Supply for general circuitry.
TRIG1
TRIG2
Vcp
Input/Output Multiplexed Input/Output Pins for Ramp Triggers, FSK/PSK Modulation, FastLock, and Diagnostics
Input/Output Multiplexed Input/Output Pins for Ramp Triggers, FSK/PSK Modulation, FastLock, and Diagnostics
Supply
NC
Power Supply for the charge pump.
No connect.
Rset
CPout
Output
Charge Pump Output
Copyright © 2014, Texas Instruments Incorporated
3
LMX2492, LMX2492-Q1
ZHCSCB6 –MARCH 2014
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
Vcc
-0.3
-0.3
-0.3
MAX
5.5
UNIT
V
Vcp
Supply Voltage for Charge Pump
Charge Pump Output Pin
All Vcc Pins
CPout
Vcc
Vcp
V
3.6
V
Others
TSolder
TJunction
All Other I/O Pins
Vcc + 0.3
260
V
Lead Temperature (solder 4 seconds)
Junction Temperature
°C
°C
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX
150
3
UNIT
°C
TSTG
MSL
Storage Temperature Range
-65
Moisture Sensitivity Level
n/a
V
Human body model (HBM) ESD stress voltage(2)
Charged device model (CDM) ESD stress voltage(3)
2500
1500
(1)
VESD
V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500 V HBM allows
safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250 V CDM allows safe
manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
SYMBOL
Vcc
PARAMETER
PLL Supply Voltage
DEVICE
MIN
3.15
Vcc
-40
TYP
MAX
3.45
5.25
85
UNIT
V
3.3
Vcp
Charge Pump Supply Voltage
V
LMX2492
LMX2492-Q1
LMX2492
TA
TJ
Ambient Temperature
°C
°C
-40
125
125
135
-40
Junction Temperature
LMX2492-Q1
-40
7.4 Thermal Information
THERMAL METRIC(1)
Temperature
UNIT
RθJA
RθJC
ψJB
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-board characterization parameter
39.4
7.1
20
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright © 2014, Texas Instruments Incorporated
LMX2492, LMX2492-Q1
www.ti.com.cn
ZHCSCB6 –MARCH 2014
7.5 Electrical Characteristics
(3.15 V ≤ Vcc ≤ 3.45 V. Vcc ≤Vcp ≤5.25 V. Typical values are at Vcc = Vcp = 3.3 V, 25 °C.
-40°C ≤ TA ≤ 85 °C for the LMX2492 and -40°C ≤ TA ≤ 125 °C for the LMX2492-Q1 ; except as specified.)
SYMBOL
PARAMETER
Current Consumption
Current
CONDITIONS
Fpd = 10 MHz
MIN
TYP
45
50
55
2
MAX
UNIT
All Vcc Pins
Fpd = 100 MHz
Fpd = 200 MHz
Kpd = 0.1 mA
Kpd = 1.6 mA
Kpd = 3.1 mA
Icc
mA
Vcp Pin
10
19
3
IccPD
fOSCin
POWERDOWN
OSC_DIFFR=0, Doubler Disabled
OSC_DIFFR=0, Doubler Enabled
OSC_DIFFR=1, Doubler Disabled
OSC_DIFFR=1, Doubler Enabled
10
10
600
300
Frequency for OSCin
terminal
MHz
10
1200
600
10
vOSCin
fFin
Voltage for OSCin Pin(1)
Frequency for FinPin(2)
Power for Fin Pin
0.5
500
-5
Vcc-0.5
14000
5
Vpp
MHz
pFin
Single-Ended Operation
dBm
fPD
Phase Detector Frequency
PLL Figure of Merit(3)
200
MHz
PN1Hz
-227
-120
dBc/Hz
Normalized PLL 1/f
Noise(3)
Normalized to 10 kHz offset for a 1 GHz
carrier.
PN10kHz
dBc/Hz
nA
Charge Pump Leakage Tri-
state Leakage
Charge Pump Mismatch(4) VCPout = Vcp / 2
ICPoutTRI
ICPoutMM
10
5 %
0.1
CPG=1X
…
ICPout
Charge Pump Current
VCPout = Vcp / 2
mA
CPG=31X
3.1
(1) For optimal phase noise performance, higher input voltage and a slew rate of at least 3 V/ns is recommended
(2) Tested to 13.5 GHz, Guaranteed to 14 GHz by characterization
(3) PLL Noise Metrics are measured with a clean OSCin signal with a high slew rate using a wide loop bandwidth. The noise metrics model
the PLL noise for an infinite loop bandwidth as:
PLL_Total = 10×log( 10PLL_Flat/10 + 10PLL_Flicker(Offset)/10
PLL_Flat = PN1Hz + 20×log(N) + 10×log(Fpd/1Hz)
)
PLL_Flicker = PN10kHz - 10×log(Offset/10kHz) + 20×log(Fvco/1GHz)
(4) Charge pump mismatch varies as a function of charge pump voltage. Consult typical performance characteristics to see this variation.
Copyright © 2014, Texas Instruments Incorporated
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LMX2492, LMX2492-Q1
ZHCSCB6 –MARCH 2014
www.ti.com.cn
Electrical Characteristics (continued)
(3.15 V ≤ Vcc ≤ 3.45 V. Vcc ≤Vcp ≤5.25 V. Typical values are at Vcc = Vcp = 3.3 V, 25 °C.
-40°C ≤ TA ≤ 85 °C for the LMX2492 and -40°C ≤ TA ≤ 125 °C for the LMX2492-Q1 ; except as specified.)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
LOGIC OUTPUT TERMINALS (MUXout,TRIG1,TRIG2,MOD)
0.8 x
Vcc
VOH
VOL
Output High Voltage
Output Low Voltage
Vcc
0
V
V
0.2 x Vcc
LOGIC INPUT TERMINALS (CE,CLK,DATA,LE,MUXout,TRIG1,TRIG2,MOD)
VIH
Input High Voltage
Input Low Voltage
Input Leakage
1.4
0
Vcc
0.6
5
V
V
VIL
IIH
-5
5
1
uA
us
us
TCELOW
TCEHIGH
Chip enable Low Time
Chip enable High Time
5
7.6 Timing Requirements, Programming Interface (CLK, DATA, LE)
SYMBOL
PARAMETER
MIN
35
10
10
25
25
10
10
TYP
MAX
UNIT
ns
TCE
Clock To LE Low Time
TCS
Data to Clock Setup Time
Data to Clock Hold Time
Clock Pulse Width High
Clock Pulse Width Low
Enable to Clock Setup Time
Enable Pulse Width High
ns
TCH
ns
TCWH
TCWL
TCES
TEWH
ns
ns
ns
ns
7.7 Serial Data Input Timing
MSB
LSB
D0
DATA
CLK
LE
R/W
A15
t
t
CWH
CS
t
CE
t
t
CH
CES
t
CWL
t
EWH
There are several other considerations for programming:
•
The DATA is clocked into a shift register on each rising edge of the CLK signal. On the rising edge of the LE
signal, the data is sent from the shift register to an actual counter.
•
If no LE signal is given after the last data bit and the clock is kept toggling, then these bits will be read into
the next lower register. This eliminates the need to send the address each time.
•
•
A slew rate of at least 30 V/us is recommended for the CLK, DATA, and LE signals
Timing specs also apply to readback. Readback can be done through the MUXout, TRIG1, TRIG2, or MOD
terminals.
6
Copyright © 2014, Texas Instruments Incorporated
LMX2492, LMX2492-Q1
www.ti.com.cn
ZHCSCB6 –MARCH 2014
7.8 Typical Characteristics
5
4
5
4
3
3
2
2
1
1
0
0
±1
±2
±3
±4
±5
±1
±2
±3
±4
±5
Kpd = 8x
Kpd = 16x
Kpd = 31x
Kpd = 8x
Kpd = 16x
Kpd = 31x
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Charge Pump Voltage (V)
Charge Pump Voltage (V)
C001
C002
For a charge pump supply of 3.3 V, optimal performance is for a
typical charge pump output voltage between 0.5 and 2.8 volts.
Figure 1. Charge Pump Current for Vcp = 3.3 V
For a charge pump supply voltage of 5 volts or higher, optimal
performance is typically for a charge pump output voltage between
0.5 and 4.5 volts.
Figure 2. Charge Pump Current for Vcp = 5.5 V
0
±5
±10
±15
±20
±25
±30
±35
±40
0
2
4
6
8
10
12
14
16
Frequency (GHz)
C001
Typical value of lowest power level as a function of frequency. Design to electrical specifications for input sensitivity, not typical performance
graphs.
Figure 3. Fin Input Sensitivity
Copyright © 2014, Texas Instruments Incorporated
7
LMX2492, LMX2492-Q1
ZHCSCB6 –MARCH 2014
www.ti.com.cn
Typical Characteristics (continued)
±90
Theoretical 1/f
Theoretical Flat
Theoretical Model
Measurement
±95
±100
±105
±110
±115
±120
1k
10k
100k
1M
Offset (Hz)
C001
This plot is for a phase detector of 100 MHz, 2 MHz loop bandwidth, and VCO at 9600 MHz. However, the plot shown is the divide by 2 port
at 4800 MHz. The input was a 100 MHz Wenzel Oscillator. The model shows this phase noise has a figure of merit of -227 dBc/Hz and a
normalized 1/f noise of -120.5 dBc/Hz. The charge pump supply was 5 V and the charge pump output voltage was 1.34 V.
Figure 4. LMX2492/92-Q1 Phase Noise for Fpd =100 MHz, Fvco = 9600 MHz/2
8
Copyright © 2014, Texas Instruments Incorporated
LMX2492, LMX2492-Q1
www.ti.com.cn
ZHCSCB6 –MARCH 2014
8 Detailed Description
8.1 Overview
The LMX2492/92-Q1 is a microwave PLL, consisting of a reference input and divider, high frequency input and
divider, charge pump, ramp generator, and other digital logic. The Vcc power supply pins run at a nominal 3.3
volts, while the charge pump supply pin, Vcp, operates anywhere from Vcc to 5 volts. The device is designed to
operate with an external loop filter and VCO. Modulation is achieved by manipulating the MASH engine.
8.2 Functional Block Diagram
GND (x3)
Vcc (x5)
Vcp
2X
OSCin
R Divider
(16 bit)
Charge
Pump
CPout
GND/OSCin*
Lock
Detect
Fin
Fin*
CE
N Divider
(18 bit)
4/5
Prescaler
TRIG1
TRIG2
MOD
CLK
6'
Modulation
Generator
MUX
MICROWIRE
Interface
Compensation
(24 bit)
DATA
LE
MUXout
8.3 Feature Description
8.3.1 OSCin Input
The reference can be applied in several ways. If using a differential input, this should be terminated differentially
with a 100 ohm resistance and AC coupled to the OSCin and GND/OSCin* terminals. If driving this single-ended,
then the GND/OSCin* terminal may be grounded, although better performance is attained by connecting the
GND/OSCin* terminal through a series resistance and capacitance to ground to match the OSCin terminal
impedance.
8.3.2 OSCin Doubler
The OSCin doubler allows the input signal to the OSCin to be doubled in order to have higher phase detector
frequencies. This works by clocking on both the rising and falling edges of the input signal, so it therefore
requires a 50% input duty cycle.
8.3.3 R Divider
The R counter is 16 bits divides the OSCin signal from 1 to 65535. If DIFF_R = 0, then any value can be chosen
in this range. If DIFF_R=1, then the divide is restricted to 2,4,8, and 16, but allows for higher OSCin frequencies.
8.3.4 PLL N Divider
The 16 bit N divider divides the signal at the Fin terminal down to the phase detector frequency. It contains a 4/5
prescaler that creates minimum divide restrictions, but allows the N value to increment in values of one.
Minimum N
Modulator Order
Divide
Integer Mode, 1st
16
Order Modulator
2nd Order Modulator
3rd Order Modulator
4th Order Modulator
17
19
25
Copyright © 2014, Texas Instruments Incorporated
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LMX2492, LMX2492-Q1
ZHCSCB6 –MARCH 2014
www.ti.com.cn
8.3.5 Fractional Circuitry
The fractional circuitry controls the N divider with delta sigma modulation that supports a programmable first,
second, third, and fourth order modulator. The fractional denominator is a fully programmable 24-bit denominator
that can support any value from 1,2,..., 224, with the exception when the device is running one of the ramps, and
in this case it is a fixed size of 224.
8.3.6 PLL Phase Detector and Charge Pump
The phase detector compares the outputs of the R and N dividers and generates a correction voltage
corresponding to the phase error. This voltage is converted to a correction current by the charge pump. The
phase detector frequency, fPD, can be calculated as follows: fPD = fOSCin × OSC_2X / R.
The charge pump supply voltage on this device, Vcp, can be either run at the Vcc voltage, or up to 5.25 volts in
order to get higher tuning voltages to present to the VCO.
8.3.7 External Loop Filter
The loop filter is external to the device and is application specific. Texas Instruments website has details on this
at www.ti.com.
8.3.8 Fastlock and Cycle Slip Reduction
The Fastlock™ and Cycle Slip Reduction features can be used to improved lock time. When the frequency is
changed, a timeout counter can be used to engage these features for a prescribed number of phase detector
cycles. During this time that the timeout counter is counting down, the device can be used to pull a terminal from
high impedance to ground switch in an extra resistor (R2pLF), change the charge pump current (FL_CPG), or
change the phase detector frequency. TRIG2 is recommended for switching the resistor with a setting of
TRIG2_MUX = Fastlock (2) and TRIG2_PIN = Inverted/Open Drain (5).
Charge
CPout
Pump
C2_LF
TRIG2
C1_LF
R2pLF
R2_LF
Fastlock
Control
Parameter
Normal Operation
Fastlock Operation
Charge Pump Gain
CPG
FL_CPG
Device Pin
(TRIG1, TRIG2, MOD, or MUXout)
High Impedance
Grounded
The resistor and the charge pump current are changed simultaneously so that the phase margin remains the
same while the loop bandwidth is by a factor of K as shown in the following table:
Parameter
Symbol
FL_CPG
K
Calculation
Typically use the highest value.
K=sqrt(FL_CPG/CPG)
R2 / (K-1)
Charge Pump Gain in Fastlock
Loop Bandwidth Multiplier
External Resistor
R2pLF
10
Copyright © 2014, Texas Instruments Incorporated
LMX2492, LMX2492-Q1
www.ti.com.cn
ZHCSCB6 –MARCH 2014
Cycle slip reduction is another method that can also be used to speed up lock time by reducing cycle slipping.
Cycle slipping typically occurs when the phase detector frequency exceeds about 100x the loop bandwidth of the
PLL. Cycle slip reduction works in a different way than fastlock. To use this, the phase detector frequency is
decreased while the charge pump current is simultaneously increased by the same factor. Although the loop
bandwidth is unchanged, the ratio of the phase detector frequency to the loop bandwidth is, and this is helpful for
cases when the phase detector frequency is high. Because cycle slip reduction changes the phase detector rate,
it also impacts other things that are based on the phase detector rate, such as the fastlock timeout-counter and
ramping controls.
8.3.9 Lock Detect and Charge Pump Voltage Monitor
The LMX2492/92-Q1 offers two methods to determine if the PLL is in lock, charge pump voltage monitoring and
digital lock detect. These features can be used individually or in conjunction to give a reliable indication of when
the PLL is in lock. The output of this detection can be routed to the TRIG1, TRIG2, MOD, or MUXout terminals.
8.3.9.1 Charge Pump Voltage Monitor
The charge pump voltage monitor allows the user to set low (CMP_THR_LOW) and high (CMP_THR_HIGH)
thresholds for a comparator that monitors the charge pump output voltage.
Vcp
Threshold
Suggested Level
CPM_THR_LOW
= (Vthresh + 0.08) / 0.085
6 for 0.5V limit
3.3 V
CPM_THR_HIGH
42 for 2.8V limit
4 for 0.5V limit
46 for 4.5V limit
= (Vthresh - 0.96) / 0.044
CPM_THR_LOW
= (Vthresh + 0.056) / 0.137
5.0 V
CPM_THR_HIGH
= (Vthresh -1.23) / 0.071
8.3.9.2 Digital Lock Detect
Digital lock detect works by comparing the phase error as presented to the phase detector. If the phase error
plus the delay as specified by the PFD_DLY bit is outside the tolerance as specified by DLD_TOL, then this
comparison would be considered to be an error, otherwise passing. The DLD_ERR_CNT specifies how may
errors are necessary to cause the circuit to consider the PLL to be unlocked. The DLD_PASS_CNT specifies
how many passing comparisons are necessary to cause the PLL to be considered to be locked and also resets
the count for the errors. The DLD_TOL value should be set to no more than half of a phase detector period plus
the PFD_DLY value. The DLD_ERR_CNT and DLD_PASS_CNT values can be decreased to make the circuit
more sensitive. If the circuit is too sensitive, then chattering can occur and the DLD_ERR_CNT,
DLD_PASS_CNT, or DLD_TOL values should be increased.
Note that if the OSCin signal goes away and there is no noise or self-oscillation at the OSCin pin, then it is
possible for the digital lock detect to indicate a locked state when the PLL really is not in lock. If this is a concern,
then digital lock detect can be combined with charge pump voltage monitor to detect this situation..
8.3.10 FSK/PSK Modulation
Two level FSK or PSK modulation can be created whenever a trigger event, as defined by the FSK_TRIG field is
detected. This trigger can be defined as a transition on a terminal (TRIG1, TRIG2, MOD, or MUXout) or done
purely in software. The RAMP_PM_EN bit defines the modulation to be either FSK or PSK and the FSK_DEV
register determines the amount of the deviation. Remember that the FSK_DEV[32:0] field is programmed as the
2's complement of the actual desired FSK_DEV value. This modulation can be added to the modulation created
from the ramping functions as well.
RAMP_PM_EN
Modulation Type
2 Level FSK
Deviation
0
1
Fpd × FSK_DEV / 224
360° × FSK_DEV / 224
2 Level PSK
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8.3.11 Ramping Functions
The LMX2492/92-Q1 supports a broad and flexible class of FMCW modulation formed by up to 8 linear ramps.
When the ramping function is running, the denominator is fixed to a forced value of 224 = 16777216. The
waveform always starts at RAMP0 when the LSB of the PLL_N (R16) is written to. After it is set up, it will start at
the initial frequency and have piecewise linear frequency modulation that deviates from this initial frequency as
specified by the modulation. Each of the eight ramps can be individually programmed. Various settings are as
follows
Ramp Characteristic
Programming Field Name
Description
The user programs the length of the ramp in phase detector cycles. If
RAMPx_DLY=1, then each count of RAMPx_LEN is actually two phase detector
cycles.
RAMPx_LEN
RAMPx_DLY
Ramp Length
The user does not directly program slope of the line, but rather this is done by
defining how long the ramp is and how much the fractional numerator is
increased per phase detector cycle. The value for RAMPx_INC is calculated by
taking the total expected increase in the frequency, expressed in terms of how
much the fractional numerator increases, and dividing it by RAMPx_LEN. The
value programmed into RAMPx_INC is actually the two's complement of the
desired mathematical value.
RAMPx_LEN
RAMPx_DLY
RAMPx_INC
Ramp Slope
The event that triggers the next ramp can be defined to be the ramp finishing or
can wait for a trigger as defined by TRIG A, TRIG B, or TRIG C.
Trigger for Next Ramp
Next Ramp
RAMPx_NEXT_TRIG
RAMPx_NEXT
This sets the ramp that follows. Waveforms are constructed by defining a chain
ramp segments. To make the waveform repeat, make RAMPx_NEXT point to
the first ramp in the pattern.
Ramp Fastlock
Ramp Flags
RAMPx_FL
This allows the ramp to use a different charge pump current or use Fastlock
This allows the ramp to set a flag that can be routed to external terminals to
trigger other devices.
RAMPx_FLAG
8.3.11.1 Ramp Count
If it is desired that the ramping waveform keep repeating, then all that is needed is to make the RAMPx_NEXT of
the final ramp equal to the first ramp. This will run until the RAMP_EN bit is set to zero. If this is not desired, then
one can use the RAMP_COUNT to specify how may times the specified pattern is to repeat.
8.3.11.2 Ramp Comparators and Ramp Limits
The ramp comparators and ramp limits use programable thresholds to allow the device to detect whenever the
modulated waveform frequency crosses a limit as set by the user. The difference between these is that
comparators set a flag to alert the user while a ramp limits prevent the frequency from going beyond the
prescribed threshold. In either case, these thresholds are expressed by programming the
Extended_Fractional_Numerator.
Extended_Fractional_Numerator
=
Fractional_Numerator
+
(N-N*)
×
224
In the above, N is the PLL feedback value without ramping and N* is the instantaneous value during ramping.
The actual value programmed is the 2's complement of Extended_Fractional_Numerator.
Type
Programming Bit
RAMP_LIMIT_LOW
RAMP_LIMIT_HIGH
Threshold
Lower Limit
Upper Limit
Ramp Limits
For the ramp comparators, if the ramp is increasing and exceeds the value as specified
by RAMP_CMPx, then the flag will go high, otherwise it is low. If the ramp is decreasing
and goes below the value as specified by RAMP_CMPx, then the flag will go high,
otherwise it will be low.
Ramp
Comparators
RAMP_CMP0
RAMP_CMP1
8.3.12 Power on Reset (POR)
The power on reset circuitry sets all the registers to a default state when the device is powered up. This same
reset can be done by programming SWRST=1. In the programming section, the power on reset state is given for
all the programmable fields.
12
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8.4 Device Functional Modes
The two primary ways to use the LMX2492/92-Q1 are to run it to generate a set of frequencies
8.4.1 Continuous Frequency Generator
In this mode, the LMX2492/92-Q1 generates a single frequency that only changes when the N divider is
programmed to a new value. In this mode, the RAMP_EN bit is set to 0 and the ramping controls are not used.
The fractional denominator can be programmed to any value from 1 to 16777216. In this kind of application, the
PLL is tuned to different channels, but at each channel, the goal is to generate a stable fixed frequency.
8.4.1.1 Integer Mode Operation
In integer mode operation, the VCO frequency needs to be an integer multiple of the phase detector frequency.
This can be the case when the output frequency or frequencies are nicely related to the input frequency. As a
rule of thumb, if this an be done with a phase detector of as high as the lesser of 10 MHz or the OSCin
frequency, then this makes sense. To operate the device in integer mode, disable the fractional circuitry by
programming the fractional order (FRAC_ORDER) , dithering (FRAC_DITH), and numerator (FRAC_NUM) to
zero.
8.4.1.2 Fractional Mode Operation
In fractional mode, the output frequency does not need to be an integer multiple of the phase detector frequency.
This makes sense when the channel spacing is more narrow or the input and output frequencies are not nicely
related. There are several programmable controls for this such as the modulator order, fractional dithering,
fractional numerator, and fractional denominator. There are many trade-offs with choosing these, but here are
some guidelines
Parameter
Field Name
How to Choose
The first step is to find the fractional denominator. To do this, find the frequency that
divides the phase detector frequency by the channel spacing. For instance, if the
output ranges from 5000 to 5050 in 5 MHz steps and the phase detector is 100
MHz, then the fractional denominator is 100 MHz/5 = 20. So for a an output of 5015
MHz, the N divider would be 50 + 3/20. In this case, the fractional numerator is 3
and the fractional denominator is 20. Sometimes when dithering is used, it makes
Fractional Numerator and
Denominator
FRAC_NUM
FRAC_DEN
sense
to
express
this
as
a
larger
equivalent
fraction.
Note that if ramping is active, the fractional denominator is forced to 224
.
There are many trade-offs, but in general try either the 2nd or 3rd order modulator
Fractional Order
Dithering
FRAC_ORDER as starting points. The 3rd order modulator may give lower main spurs, but may
generate others. Also if dithering is involved, it can generate phase noise.
Dithering can reduce some fractional spurs, but add noise. Consult application note
FRAC_DITH
AN-1879 for more details on this.
8.4.2 Modulated Waveform Generator
In this mode, the device can generate a broad class of frequency sweeping waveforms. The user can specify up
to 8 linear segments in order to generate these waveforms. When the ramping function is running, the
denominator is fixed to a forced value of 224 = 16777216
In addition to the ramping functions, there is also the capability to use a terminal to add phase or frequency
modulation that can be done by itself or added on top of the waveforms created by the ramp generation
functions.
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8.5 Programming
8.5.1 Loading Registers
The device is programmed using several 24 bit registers. The first 16 bits of the register are the address,
followed by the next 8 bits of data. The user has the option to pull the LE terminal high after this data, or keep
sending data and it will apply this data to the next lower register. So instead of sending three registers of 24 bits
each, one could send a single 40 bit register with the 16 bits of address and 24 bits of data. For that matter, the
entire device could be programmed as a single register if desired.
8.6 Register Map
Registers are programmed in REVERSE order from highest to lowest. Registers NOT shown in this table or
marked as reserved can be written as all 0's unless otherwise stated. The POR value is the power on reset value
that is assigned when the device is powered up or the SWRST bit is asserted.
Table 1. Register Map
Register
D7
D6
D5
D4
D3
D2
D1
D0
POR
0x18
0x00
0x00
-
0
1
2
0
0x1
0
0
0
1
1
0
0
0
Reserved
Reserved
0x2
0
0
0
0
0
0
SWRST
POWERDOWN[1:0]
PLL_N[17:16]
3-15
16
17
18
19
20
21
22
23
24
25
26
0x3 - 0xF
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
PLL_N[7:0]
0x64
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x04
0x00
PLL_N[15:8]
FRAC_ORDER[2:0]
FRAC_DITHER[1:0]
FRAC_NUM[7:0]
FRAC_NUM[15:8]
FRAC_NUM[23:16]
FRAC_DEN[7:0]
FRAC_DEN[15:8]
FRAC_DEN[23:16]
PLL_R[7:0]
PLL_R[15:8]
PLL_R_
DIFF
27
0x1B
0
0
FL_CSR[1:0]
PFD_DLY[1:0]
0
OSC_2X
0x08
28
29
0x1C
0x1D
0
CPPOL
CPG[4:0]
0x00
0x00
FL_TOC[10:8]
FL_CPG[4:0]
CPM_
FLAGL
30
31
0x1E
0x1F
0
0
CPM_THR_LOW[5:0]
CPM_THR_HIGH[5:0]
0x0a
0x32
CPM_
FLAGH
32
33
34
0x20
0x21
0x22
FL_TOC[7:0]
DLD_PASS_CNT[7:0]
DLD_ERR_CNTR[4:0]
TRIG1
_MUX[5]
0x00
0x0f
0x00
DLD_TOL[2:0]
1
MOD_
MUX[5]
MUXout
_MUX[5]
TRIG2
_MUX[5]
35
0x23
0
0
1
0x41
36
37
0x24
0x25
TRIG1_MUX[4:0]
TRIG2_MUX[4:0]
MOD_MUX[4:0]
TRIG1_PIN[2:0]
TRIG2_PIN[2:0]
MOD_PIN[2:0]
0x08
0x10
0x18
0x38
-
38
0x26
39
0x27
MUXout_MUX[4:0]
MUXout_PIN[2:0]
40-57
0x28-0x39
Reserved
14
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ZHCSCB6 –MARCH 2014
Register Map (continued)
Table 1. Register Map (continued)
Register
0x3A
D7
D6
D5
D4
D3
D2
D1
D0
POR
RAMP_
PM_EN
RAMP_
CLK
58
RAMP_TRIG_A[3:0]
RAMP_TRIG_C[3:0]
0
RAMP_EN
0x00
59
60
61
62
63
64
65
66
67
68
69
0x3B
0x3C
0x3D
0x3E
0x3F
0x40
0x41
0x42
0x43
0x44
0x45
RAMP_TRIG_B[3:0]
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
RAMP_CMP0[7:0]
RAMP_CMP0[15:8]
RAMP_CMP0[23:16]
RAMP_CMP0[31:24]
RAMP_CMP0_EN[7:0]
RAMP_CMP1[7:0]
RAMP_CMP1[15:8]
RAMP_CMP1[23:16]
RAMP_CMP1[31:24]
RAMP_CMP1_EN[7:0]
RAMP_
LIMH[32]
RAMP_
LIML[32]
FSK_
DEV[32]
RAMP_
CMP1[32] CMP0[32]
RAMP_
70
0x46
0
FSK_TRIG[1:0]
0x08
71
72
73
74
75
76
77
78
79
80
81
82
83
0x47
0x48
0x49
0x4A
0x4B
0x4C
0x4D
0x4E
0x4F
0x50
0x51
0x52
0x53
FSK_DEV[7:0]
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0xff
FSK_DEV[15:8]
FSK_DEV[23:16]
FSK_DEV[31:24]
RAMP_LIMIT_LOW[7:0]
RAMP_LIMIT_LOW[15:8]
RAMP_LIMIT_LOW[23:16]
RAMP_LIMIT_LOW[31:24]
RAMP_LIMIT_HIGH[7:0]
RAMP_LIMIT_HIGH[15:8]
RAMP_LIMIT_HIGH[23:16]
RAMP_LIMIT_HIGH[31:24]
RAMP_COUNT[7:0]
0xff
0xff
0xff
0x00
RAMP_
AUTO
84
85
0x54
0x55
RAMP_TRIG_INC[1:0]
RAMP_COUNT[12:8]
0x00
0x00
Reserved
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Register Map (continued)
Table 1. Register Map (continued)
Register
0x56
D7
D6
D5
D4
D3
D2
D1
D0
POR
0x00
0x00
0x00
86
87
88
RAMP0_INC[7:0]
RAMP0_INC[15:8]
RAMP0_INC[23:16]
0x57
0x58
RAMP0_
DLY
RAMP0_
FL
89
0x59
RAMP0_INC[29:24]
RAMP0_LEN[7:0]
0x00
90
91
0x5A
0x5B
0x00
0x00
RAMP0_LEN[15:8]
RAMP0_
NEXT_TRIG[1:0]
RAMP0_
RST
92
0x5C
RAMP0_NEXT[2:0]
RAMP0_FLAG[1:0]
RAMP1_FLAG[1:0]
RAMP2_FLAG[1:0]
RAMP3_FLAG[1:0]
0x00
93
94
95
0x5D
0x5E
0x5F
RAMP1_INC[7:0]
RAMP1_INC[15:8]
RAMP1_INC[23:16]
0x00
0x00
0x00
RAMP1_
DLY
RAMP1_
FL
96
0x60
RAMP1_INC[29:24]
0x00
97
98
0x61
0x62
RAMP1_LEN[7:0]
0x00
0x00
RAMP1_LEN[15:8]
RAMP1_
NEXT_TRIG[1:0]
RAMP1_
RST
99
0x63
RAMP1_NEXT[2:0]
0x00
100
101
102
0x64
0x65
0x66
RAMP2_INC[7:0]
RAMP2_INC[15:8]
RAMP2_INC[23:16]
0x00
0x00
0x00
RAMP2
DLY
RAMP2_
FL
103
0x67
RAMP2_INC[29:24]
0x00
104
105
0x68
0x69
RAMP2_LEN[7:0]
0x00
0x00
RAMP2_LEN[15:8]
RAMP2_
NEXT_TRIG[1:0]
RAMP2_
RST
106
0x6A
RAMP2_NEXT[2:0]
0x00
107
108
109
0x6B
0x6C
0x6D
RAMP3_INC[7:0]
RAMP3_INC[15:8]
RAMP3_INC[23:16]
0x00
0x00
0x00
RAMP3_
DLY
RAMP3_
FL
110
0x6E
RAMP3_INC[29:24]
RAMP3_LEN[7:0]
0x00
111
112
0x6F
0x70
0x00
0x00
RAMP3_LEN[15:8]
RAMP3_
NEXT_TRIG[1:0]
RAMP3_
RST
113
0x71
RAMP3_NEXT[2:0]
0x00
16
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ZHCSCB6 –MARCH 2014
Register Map (continued)
Table 1. Register Map (continued)
Register
0x72
D7
D6
D5
D4
D3
D2
D1
D0
POR
0x00
0x00
0x00
114
115
116
RAMP4_INC[7:0]
RAMP4_INC[15:8]
RAMP4_INC[23:16]
0x73
0x74
RAMP4_
DLY
RAMP4_
FL
117
0x75
RAMP4_INC[29:24]
RAMP4_LEN[7:0]
0x00
118
119
0x76
0x77
0x00
0x00
RAMP4_LEN[15:8]
RAMP4_
NEXT_TRIG[1:0]
RAMP4_
RST
120
0x78
RAMP4_NEXT[2:0]
RAMP4_FLAG[1:0]
RAMP5_FLAG[1:0]
RAMP6_FLAG[1:0]
RAMP7_FLAG[1:0]
0x00
121
122
123
0x79
0x7A
0x7B
RAMP5_INC[7:0]
RAMP5_INC[15:8]
RAMP5_INC[23:16]
0x00
0x00
0x00
RAMP5_
DLY
RAMP5_
FL
124
0x7C
RAMP5_INC[29:24]
0x00
125
126
0x7D
0x7E
RAMP5_LEN[7:0]
0x00
0x00
RAMP5_LEN[15:8]
RAMP5_
NEXT_TRIG[1:0]
RAMP5_
RST
127
0x7F
RAMP5_NEXT[2:0]
0x00
128
129
130
0x80
0x81
0x82
RAMP6_INC[7:0]
RAMP6_INC[15:8]
RAMP6_INC[23:16]
0x00
0x00
0x00
RAMP6_
DLY
RAMP6_
FL
131
0x83
RAMP6_INC[29:24]
0x00
132
133
0x84
0x85
RAMP6_LEN[7:0]
0x00
0x00
RAMP6_LEN[15:8]
RAMP6_
NEXT_TRIG[1:0]
RAMP6_
RST
134
0x86
RAMP6_NEXT[2:0]
0x00
135
136
137
0x87
0x88
0x89
RAMP7_INC[7:0]
RAMP7_INC[15:8]
RAMP7_INC[23:16]
0x00
0x00
0x00
RAMP7_
DLY
RAMP7_
FL
138
0x8A
RAMP7_INC[29:24]
RAMP7_LEN[7:0]
0x00
139
140
0x8B
0x8C
0x00
0x00
RAMP7_LEN[15:8]
RAMP7_
NEXT_TRIG[1:0]
RAMP7_
RST
141
0x8D
RAMP7_NEXT[2:0]
0x00
0x00
0x8E-
0x7fff
142-32767
Reserved
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8.7 Register Field Descriptions
The following sections go through all the programmable fields and their states. Additional information is also
available in the applications and feature descriptions sections as well. The POR column is the power on reset
state that this field assumes if not programmed.
8.7.1 POWERDOWN and Reset Fields
Table 2. POWERDOWN and Reset Fields
Field
Location
POR
Description and States
Value
POWERDOWN State
POWERDOWN, ignore CE
Power Up, ignore CE
0
1
POWERDOWN
[1:0]
R2[1:0]
0
POWERDOWN Control
Power State Defined by CE
terminal state
2
3
Reserved
Reset State
Value
Software Reset. Setting this bit sets all
registers to their POR default values.
SWRST
R2[2]
0
0
1
Normal Operation
Register Reset
18
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ZHCSCB6 –MARCH 2014
8.7.2 Dividers and Fractional Controls
Table 3. Dividers and Fractional Controls
Field
Location
POR
Description and States
PLL_N
[17:0]
R18[1] to
R16[0]
Feedback N counter Divide value. Minimum count is 16. Maximum is 262132. Writing of
the register R16 begins any ramp execution when RAMP_EN=1.
16
Value
Dither
Weak
0
FRAC_ DITHER
[1:0]
R18[3:2]
R18[6:4]
0
0
Dither used by the fractional modulator
1
Medium
2
Strong
3
Disabled
Value
Modulator Order
Integer Mode
1st Order Modulator
2nd Order Modulator
3rd Order Modulator
4th Order Modulator
Reserved
0
1
FRAC_ ORDER
[2:0]
Fractional Modulator order
2
3
4
5-7
FRAC_NUM
[23:0]
R21[7] to
R19[0]
Fractional Numerator. This value should be less than or equal to the fractional
denominator.
0
0
1
FRAC_DEN
[23:0]
R24[7] to
R22[0]
Fractional Denominator. If the RAMP_EN=1, this field is ignored and the denominator is
fixed to 224
.
PLL_R
[15:0]
R26[7] to
R25[0]
Reference Divider value. Selecting 1 will bypass counter.
Value
Doubler
Disabled
Enables the Doubler before the Reference
divider
OSC_2X
R27[0]
R27[2]
0
0
0
1
Enabled
Enables the Differential
R
counter.
Value
R Divider
Single-Ended
Differential
Pulse Width
Reserved
860 ps
This allows for higher OSCin frequencies,
but restricts PLL_R to divides of 2,4,8 or
16.
0
PLL_R _DIFF
1
Value
Sets the charge pump minimum pulse
width. This could potentially be a trade-off
between fractional spurs and phase noise.
Setting 1 is recommended for general use.
0
PFD_DLY
[1:0]
R27[4:3]
1
1
2
1200 ps
3
1500 ps
Value
Charge Pump State
Tri-State
0
1
100 uA
CPG
[4:0]
R28[4:0]
R28[5]
0
0
Charge pump gain
2
200 uA
…
31
Value
0
…
3100 uA
Charge Pump Polarity
Negative
Charge
Pump
Polarity
CPPOL
Positive is for a positive slope VCO
characteristic, negative otherwise.
1
Positive
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8.7.2.1 Speed Up Controls (Cycle Slip Reduction and Fastlock)
Table 4. FastLock and Cycle Slip Reduction
Field
Location
POR
Description and States
Cycle Slip Reduction (CSR) reduces the
phase detector frequency by multiplying
both the R and N counters by the CSR
value while either the FastLock Timer is
counting or the RAMPx_FL=1 and the part
is ramping. Care must be taken that the R
and N divides remain inside the range of
the counters. Cycle slip reduction is
Value
CSR Value
0
1
2
Disabled
x 2
FL_ CSR
[1:0]
x 4.
R27[6:5]
0
3
Reserved
generally
ramping.
not
recommended
during
Value
Fastlock Charge Pump Gain
0
1
Tri-State
100 uA
Charge pump gain only when Fast Lock
FL_ CPG
[4:0]
R29[4:0]
0
Timer is counting down or
running with RAMPx_FL=1
a ramp is
2
200 uA
…
31
Value
0
…
3100 uA
Fast Lock Timer. This counter starts
counting when the user writes the
PLL_N(Register R16). During this time the
FL_CPG gain is sent to the charge pump,
Fastlock Timer Value
Disabled
1
1 x 32 = 32
R29[7:5]
and
R32[7:0]
FL_ TOC
[10:0]
0
and the FL_CSR shifts the R and N
...
counters if enabled. When the counter
terminates, the normal CPG is presented
and the CSR undo’s the shifts to give a
normal PFD frequency.
2047
2047 x 32 = 65504
20
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8.8 Lock Detect and Charge Pump Monitoring
Table 5. Lock Detect and Charge Pump Monitor
Field
Location
POR
Description and States
Value
Threshold
Lowest
Charge pump voltage low threshold value.
0x0A When the charge pump voltage is below
this threshold, the LD goes low.
0
…
CPM_THR _LOW
[5:0]
R30[5:0]
…
63
Highest
Value
Flag Indication
This is a read only bit.
Low indicates the charge pump voltage is
below the minimum threshold.
Charge pump is below
CPM_THR_LOW threshold
0
1
CPM_FLAGL
R30[6]
R31[5:0]
R31[6]
-
Charge pump is above
CPM_THR_LOW threshold
Value
0
Threshold
Lowest
…
Charge pump voltage high threshold value.
CPM_THR _HIGH
[5:0]
0x32 When the charge pump voltage is above
this threshold, the LD goes low.
…
63
Highest
Threshold
Value
This
is
a
read
only
bit.
Charge pump is below
CPM_THR_HIGH threshold
Charge pump voltage high comparator
reading. High indicates the charge pump
voltage is above the maximum threshold.
0
1
CPM_FLAGH
-
Charge pump is above
CPM_THR_HIGH threshold
Digital Lock Detect Filter amount. There must be at least DLD_PASS_CNT good edges
0xff and less than DLD_ERR edges before the DLD is considered in lock. Making this number
smaller will speed the detection of lock, but also will allow a higher chance of DLD chatter.
DLD_ PASS_CNT
[7:0]
R33[7:0]
R34[4:0]
Digital Lock Detect error count. This is the maximum number of errors greater than
DLD_TOL that are allowed before DLD is de-asserted. Although the default is 0, the
recommended value is 4.
DLD_ ERR_CNT
[4:0]
0
0
Value
Window and Fpd Frequency
0
1 ns (Fpd > 130 MHz)
Digital Lock detect edge window. If both N
and R edges are within this window, it is
considered a “good” edge. Edges that are
farther apart in time are considered “error”
edges. Window choice depends on phase
detector frequency, charge pump minimum
pulse width, fractional modulator order and
the users desired margin.
1.7 ns (80 MHz , Fpd ≤ 130
1
MHz)
2
3
3 ns (60 MHz , Fpd ≤ 80 MHz)
6 ns (45 MHz , Fpd ≤ 60 MHz)
DLD _TOL
[2:0]
R34[7:5]
10 ns (30 MHz < Fpd ≤ 45
4
MHz)
5
18 ns ( Fpd ≤ 30 MHz)
6 and 7
Reserved
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8.9 TRIG1,TRIG2,MOD, and MUXout Pins
Table 6. TRIG1, TRIG2, MOD, and MUXout Terminal States
Field
Location
POR
Description and States
Value
Pin Drive State
0
1
2
TRISTATE (default)
Open Drain Output
TRIG1 _PIN
[2:0]
R36[2:0]
0
Pullup / Pulldown Output
TRIG2 _PIN
[2:0]
R37[2:0]
R38[2:0]
0
0
3
Reserved
This is the terminal drive state for the
TRIG1, TRIG2, MOD, and MUXout Pins
MOD_ _PIN
[2:0]
4
5
6
7
GND
Inverted Open Drain Output
MUXout_ _PIN
[2:0]
Inverted Pullup / Pulldown
Output
R39[2:0]
0
Input
22
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Table 7. TRIG1, TRIG2, MOD, and MUXout Selections
Field
Location
POR
Description and States
Value
MUX State
GND
0
1
2
3
Input TRIG1
Input TRIG2
Input MOD
Output TRIG1 after
synchronizer
4
5
6
Output TRIG2 after
synchronizer
Output MOD after
synchronizer
7
8
9
Output Read back
Output CMP0
Output CMP1
Output LD (DLD good AND
CPM good)
10
11
12
13
14
Output DLD
Output CPMON good
Output CPMON too High
Output CPMON too low
These fields control what signal is muxed
to or from the TRIG1,TRIG2, MOD, and
MUXout pins.
Some of the abbreviations used are:
COMP0, COMP1: Comparators 0 and 1
LD, DLD: Lock Detect, Digital Lock Detect
Output RAMP LIMIT
EXCEEDED
15
TRIG1_MUX
R36[7:3],
R37.3
R36[7:3],
R35.3
R37[7:3],
R35.4
R38[7:3],
R35.7
[5:0]
TRIG2_MUX
[5:0]
MOD_MUX
[5:0]
16
17
Output R Divide/2
Output R Divide/4
Output N Divide/2
Output N Divide/4
Reserved
1
2
3
7
18
CPM:
CPG:
CPUP:
Charge
Charge
Charge
Pump
Pump
Pump Up
Monitor
Gain
Pulse
MUXout_MUX
[5:0]
19
20
CPDN: Charge Pump Down Pulse
21
Reserved
22
Output CMP0RAMP
Output CMP1RAMP
Reserved
23
24
25
Reserved
26
Reserved
27
Reserved
28
Output Faslock
Output CPG from RAMP
Output Flag0 from RAMP
Output Flag1 from RAMP
Output TRIGA
29
30
31
32
33
Output TRIGB
34
Output TRIGC
35
Output R Divide
Output CPUP
36
37
Output CPDN
38
Output RAMP_CNT Finished
Reserved
39 to 63
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8.10 Ramping Functions
Table 8. Ramping Functions
Field
Location
POR
Description and States
Enables the RAMP functions. When this bit
is set, the Fractional Denominator is fixed
to 224. RAMP execution begins at RAMP0
upon the PLL_N[7:0] write. The Ramp
should be set up before RAMP_EN is set.
Value
Ramp
0
Disabled
RAMP_EN
R58[0]
0
1
Enabled
RAMP clock input source. The ramp can
be clocked by either the phase detector
clock or the MOD terminal based on this
selection.
Value
Source
0
Phase Detector
RAMP_CLK
R58[1]
R58[2]
0
0
1
MOD Terminal
Value
Modulation Type
RAMP_PM_EN
Phase modulation enable.
0
1
Frequency Modulation
Phase Modulation
Value
0
Source
Never Triggers (default)
TRIG1 terminal rising edge
TRIG2 terminal rising edge
MOD terminal rising edge
DLD Rising Edge
1
2
3
4
5
CMP0 detected (level)
RAMPx_CPG Rising edge
RAMPx_FLAG0 Rising edge
Always Triggered (level)
TRIG1 terminal falling edge
TRIG2 terminal falling edge
MOD terminal falling edge
DLD Falling Edge
RAMP_TRIGA
[3:0]
RAMP_TRIGB
[3:0]
RAMP_TRIGC
[3:0]
6
R58[7:4]
R59[3:0]
R59[7:4]
0
Trigger A,B, and C Sources
7
8
9
10
11
12
13
14
15
CMP1 detected (level)
RAMPx_CPG Falling edge
RAMPx_FLAG0 Falling edge
R70[0],
R63[7] to
R60[0]
RAMP_CMP0
[32:0]
Twos compliment of Ramp Comparator 0 value. Be aware of that the MSB is in Register
R70.
0
0
0
0
Comparator 0 is active during each RAMP corresponding to the bit. Place a 1 for ramps it
is active in and 0 for ramps it should be ignored. RAMP0 corresponds to R64[0], RAMP7
corresponds to R64[7]
RAMP_CMP0_EN
[7:0]
R64[7:0]
R70[1],
R68[7] to
R65[0]
RAMP_CMP1
[32:0]
Twos compliment of Ramp Comparator 1 value. Be aware of that the MSB is in Register
R70.
Comparator 1 is active during each RAMP corresponding to the bit. Place a 1 for ramps it
is active in and 0 for ramps it should be ignored. RAMP0 corresponds to R64[0], RAMP7
corresponds to R64[7].
RAMP_CMP1_EN
[7:0]
R69[7:0]
Value
Trigger
Always Triggered
Trigger A
0
1
2
3
Deviation trigger source. When this trigger
source specified is active, the FSK_DEV
value is applied.
FSK_TRIG
[1:0]
R76[4] to
R75[3]
0
0
Trigger B
Trigger C
R70[2],
R74[7] to
R71[0]
Twos compliment of the deviation value for frequency modulation and phase modulation.
This value should be written with 0 when not used. Be aware that the MSB is in Register
R70.
FSK_DEV
[32:0]
24
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Ramping Functions (continued)
Table 8. Ramping Functions (continued)
Field
Location
POR
Description and States
Twos compliment of the ramp lower limit that the ramp can not go below . The ramp limit
0x000 occurs before any deviation values are included. Care must be taken if the deviation is
00000 used and the ramp limit must be set appropriately. Be aware that the MSB is in Register
R70.
R70[3],
R78[7] to
75[0]
RAMP_LIMIT_LOW
[32:0]
Twos compliment of the ramp higher limit that the ramp can not go above. The ramp limit
0xfffffff occurs before any deviation values are included. Care must be taken if the deviation is
R70[4],
R82[7] to
79.0[0]
RAMP_LIMIT_HIGH
[32:0]
f
used and the ramp limit must be set appropriately. Be aware that the MSB is in Register
R70.
Number of RAMPs that will be executed before a trigger or ramp enable is brought down.
Load zero if this feature is not used. Counter is automatically reset when RAMP_EN goes
from 0 to 1.
RAMP_COUNT
[12:0]
R84[4] to
R83[0]
0
Value
Ramp
RAMP_EN unaffected by ramp
counter (default)
0
Automatically clear RAMP_EN when
RAMP Count hits terminal count.
RAMP_AUTO
R84[5]
0
0
RAMP_EN automatically
brought low when ramp
counter terminal counts
1
Value
Source
Increments occur on each
ramp transition
0
Increment Trigger source for RAMP
Counter. To disable ramp counter, load a
count value of 0.
RAMP_TRIG_INC
[1:0]
R84[7:6]
1
2
3
Increment occurs on trigA
Increment occurs on trigB
Increment occurs on trigC
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8.11 Individual Ramp Controls
These bits apply for all eight ramps. For the field names, x can be 0,1,2,3,4,5,6, or 7.
Table 9. Individual Ramp Controls
Field
Location POR
Description and States
RAMPx
_INC[29:0]
Varies
0
Signed ramp increment.
Value
0
CPG
RAMPx _FL
Varies
0
This enables fastlock and cycle slip reduction for ramp x.
Disabled
Enabled
Clocks
1
Value
During this ramp, each increment takes 2 PFD cycles per
LEN clock instead of the normal 1 PFD cycle. Slows the
ramp by a factor of 2.
1 PFD clock per RAMP
tick.(default)
RAMPx
_DLY
0
1
Varies
Varies
0
0
2 PFD clocks per RAMP
tick.
RAMPx
_LEN
Number of PFD clocks (if DLY is 0) to continue to increment RAMP. 1=>1 cycle, 2=>2 etc. Maximum of
65536 cycles.
Value
Flag
Both FLAG1 and FLAG0
are zero. (default)
0
FLAG0 is set, FLAG1 is
clear
RAMPx
_FLAG[1:0]
1
2
3
Varies
Varies
0
0
General purpose FLAGS sent out of RAMP.
FLAG0 is clear, FLAG1 is
set
Both FLAG0 and FLAG1
are set.
Forces a clear of the ramp accumulator. This is used to
erase any accumulator creep that can occur depending on
how the ramps are defined. Should be done at the start of a
ramp pattern.
Value
Reset
Disabled
Enabled
RAMP0
_RST
0
1
Value
Operation
RAMPx_LEN
TRIG_A
RAMPx_
NEXT
_TRIG
[1:0]
Determines what event is necessary to cause the state
machine to go to the next ramp. It can be set to when the
RAMPx_LEN counter reaches zero or one of the events for
Triggers A,B, or C.
0
1
2
3
Varies
Varies
0
0
TRIG_B
TRIG_C
RAMP0
_NEXT[2:0]
The next RAMP to execute when the length counter times out
26
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9 Applications and Implementation
9.1 Application Information
The LMX2492/92-Q1 can be used in a broad class of applications such as generating a single frequency for a
high frequency clock, generating a tunable range of frequencies, or generating swept waveforms that can be
used in applications such as radar.
9.2 Typical Applications
The following schematic is an example of hat could be used in a typical application.
3.3 or 5 V
R3_LF
100 nF
C2_LF
C1_LF
3.3 V
C3_LF
R2_LF
100 nF
24 23 22 21 20 19
3.3 V
Vcc
GND
GND
GND
18
17
16
15
14
13
1
2
3
4
5
6
MUXOUT
100 nF
18 :
18 :
LE
10 pF
36 :
To
DATA
Fin
Circuit
Fin*
CLK
CE
68 :
3.3 V
10 pF
Vcc
51 :
100 nF
3.3 V
7
8
9
10 11 12
3.3 V
18 :
100 nF
100 nF
68 :
18 :
9.2.1 Design Requirements
For these examples, it will be assumed that there is a 100 MHz input signal and the output frequency is between
9400 and 9800 MHz with various modulated waveforms.
Parameter
Symbol
Value
Comments
Input Frequency
OSCin
100 MHz
There are many possibilities, but this choice gives
good performance and saves a little current (as
shown in the electrical specifications).
Phase Detector
Frequency
Fpd
100 MHz
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Typical Applications (continued)
Parameter
Symbol
Value
Comments
9400 - 9800 MHz (Simple Chirp)
9400 - 9800 (Flattened Ramp)
In the different examples, the VCO frequency is
actually changing. However, the same loop filter
design can be used for all three.
VCO Frequency
Fvco
9500 - 9625 MHz (Complex Triggered
Ramp
This parameter has nothing to do with the
LMX2492/92-Q1, but is rather set by the external
VCO choice.
VCO Gain
Kvco
200 MHz/V
9.2.2 Detailed Design Procedure
The first step is to calculate the reference divider (PLL_R) and feedback divider (PLL_N) values as shown in the
table that follows.
Parameter
Symbol and Calculations
Value
Comments
To design a loop filter, one designs for a fixed VCO
value, although it is understood that the VCO will
tune around. This typical value is usually chosen as
the average VCO frequency.
Average
VCO Frequency
FvcoAvg
= (FvcoMax + FvcoMin)/2
9600 MHz
This parameter has nothing to do with the
LMX2492/92-Q1, but is rather set by the external
VCO choice. In this case, it was the RFMD1843
VCO.
VCO Gain
Kvco
200 MHz/V
This bandwidth is very wide to allow the VCO
frequency to be modulated.
PLL Loop Bandwidth
Charge Pump Gain
R Divider
BW
380 kHz
3.1 mA
1
Using the larger gain allows a wider loop bandwidth
and gives good phase performance.
CPG
PLL_R
= OSCin / Fpd
This value is calculated from previous values.
This value is calculated from previous values.
PLL_N
= Fvco / Fpd
N Divider
96
C1_LF
C2_LF
C3_LF
R2_LF
R3_LF
68 pF
3.9 nF
Loop Filter
Components
150 pF
390 ohm
390 ohm
These were calculated by TI design tools.
Once a loop filter bandwidth is chosen, the external loop filter components of C1_LF, C2_LF, C3_LF, R2_LF, and
R3_LF can be calculated with a tool such as the Clock Architect tool available at www.ti.com. It is also highly
recommended to look at the EVM instructions. The CodeLoader software is an excellent starting point and
example to see how to program this device.
28
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9.2.3 Application Performance Plot - Sawtooth Waveform Example
Using the above design, it can be programmed to generate a sawtooth waveform with the following paramters.
Parameter
Ramp Duration
VCO Frequency
Range
Symbol
ΔT
Value
100 uS
Fvco
ΔF
9400 - 9800 MHz
9400 - 9800 MHz = 400 MHz Change
tRAMP0t
tRAMP0t
tRAMP0t
tRAMP0t
Because we want the ramp length to be 100 us, this works out to 10,000 phase detector cycles which means
that RAMP0_LEN=10000. To change 400 MHz, we know that each one of the 10000 steps is 40 kHz. Given the
fractional denominator is 224 = 16777216 and the phase detector frequency is 100 MHz, this implies that the
fractional numerator at the end of the ramp will be 6711. However, since this 6711 number is not exact (closer to
6718.8864), the ramp will creep if we do not reset it. Therefore, we set reset the ramp. After the ramp finishes,
we want to start with the same ramp, so RAMP0_NEXT is RAMP0. The results of this analysis are in the table
below:
RAMP
RAMP0_LEN
RAMP0_INC
RAMP0_NEXT
RAMP0_RST
ΔT × Fpd = 100 us / 100 MHz
(ΔF / Fpd) /RAMP0_LEN × 224
= (400/100)/10000 ×16777216 = 6711
RAMP0
0
1
= 10000
The actual measured waveform for this is shown in the following figure. Note that the frequency that was actually
measured was from the divide by two output of the VCO and therefore the measured frequency was half of the
actual frequency presented to the PLL. This ramping waveform does show some undershoot as the frequency
rapidly returns from 9800 MHz ( 4900 MHz on the plot) to 9400 MHz (4700 MHz on the plot). This undershoot
can be mitigated by adding additional ramps.
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9.2.4 Application Performance Plot - Flat Top Triangle Waveform
Now consider pattern as shown below. The ramp is sometimes used because it can better account for Doppler
Shift. The purpose for making the top and bottom portions flat is to help reduce the impact of the PLL
overshooting and undershooting in order to make the sloped ramped portions more linear.
Parameter
Symbol
ΔT0
Value
10 uS
90 uS
10 uS
90 uS
0
ΔT1
Ramp Duration
ΔT2
ΔT3
ΔF0
ΔF1
400 MHz
0
Range
ΔF2
ΔF3
-400 MHz
tRAMP1t
tRAMP1t
RAMP0
RAMP2
RAMP0
RAMP2
RAMP
RAMPx_LEN
RAMPx_INC
RAMPx_NEXT
RAMPx_RST
10 us/ 100 MHz
=1000
RAMP0
0
1
1
0
0
(ΔF / Fpd) /RAMP1_LEN × 224
= (400/100)/9000 ×16777216 =
7457
90 us / 100 MHz
=9000
RAMP1
RAMP2
2
3
10 us/ 100 MHz
=1000
0
(ΔF / Fpd) /RAMP1_LEN × 224
= (-400/100)/9000 ×16777216 =
-7457
90 us / 100 MHz
=9000
RAMP3
0
0
Program in 2's complement of -
7457
= 230-7457 = 1073734367
30
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The actual measured waveform for this is shown in the following figure. Note that the frequency that was actually
measured was from the divide by two output of the VCO and therefore the measured frequency was half of the
actual frequency presented to the PLL. The flattened top and bottom of this triangle wave help mitigate the
overshoot and undersoot in the frequency.
The actual measured waveform for this is shown in the following figure. Note that the frequency that was actually
measured was from the divide by two output of the VCO and therefore the measured frequency was half of the
actual frequency presented to the PLL. The flattened top and bottom of this triangle wave help mitigate the
overshoot and undersoot in the frequency.
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9.2.5 Applications Performance Plot -- Complex Triggered Ramp
In this example, the modulation is not started until a trigger pulse from the MOD terminal goes high. Assume a
phase detector frequency of 100 MHz and we RAMP1 to be 60 us and ramps 2,3,and 4 to be 12 us each. We
set the next trigger for RAMP0 to be trigger A and define trigger A to be the MOD terminal. Then we configure as
follows:
MOD
Frequency
9.800 GHz
Increased Charge Pump Gain
Increased Charge Pump Gain
9.800 GHz
9.400 GHz
9.725 GHz
9.600 GHz
FLAG0
TRIG1 Output as Loop Filter Switch 1
FLAG1
TRIG2 Output as Loop Filter Switch 2
'T2
'T3
'T4
'T2
'T3
'T4
'T0
'T1
'T1
Figure 5. Complex Triggered Ramp Example
RAMPx
_LEN
RAMPx_
INC
RAMPx
_NEXT
RAMPx_
NEXT_TRIG
RAMPx_RS
T
RAMP
RAMP0
RAMP1
RAMPx_FL
RAMPx_FLAG
FLAG0 and
FLAG1
1
0
0
0
1
2
TRIG A
1
1
FLAG0 and
FLAG1
6000
1073730639
TOC Timeout
RAMP2
RAMP3
1200
1200
27963
17476
1
0
3
4
Disabled
FLAG1
TOC Timeout
TOC Timeout
0
0
FLAG0 and
FLAG1
RAMP4
1200
10486
0
1
TOC Timeout
0
32
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The actual measured waveform for this is shown in the following figure. Note that the frequency that was actually
measured was from the divide by two output of the VCO and therefore the measured frequency was half of the
actual frequency presented to the PLL. The flattened top and bottom of this triangle wave help mitigate the
overshoot and undersoot in the frequency.
Figure 6. Actual Measurement for Complex Triggered Ramp
10 Power Supply Recommendations
For power supplies, it is recommended to place 100 nF close to each of the power supply pins. If fractional spurs
are a large concern, using a ferrite bead to each of these power supply pins can reduce spurs to a small degree.
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11 Layout
11.1 Layout Guidelines
For layout examples, the EVM instructions are the most comprehensive document. In general, the layout
guidelines are similar to most other PLL devices. For the high frequency Fin pin, it is recommended to use 0402
components and match the trace width to these pad sizes. Also the same needs to be done on the Fin* pin. If
layout is easier to route the signal to Fin* instead of Fin, then this is acceptable as well.
11.2 Layout Example
34
Copyright © 2014, Texas Instruments Incorporated
LMX2492, LMX2492-Q1
www.ti.com.cn
ZHCSCB6 –MARCH 2014
12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
Texas Instruments has several software tools to aid in the development process including CodeLoder for
programming, Clock Design Tool for Loop filter design and phase noise/spur simulation, and the Clock Architect.
All these tools are available at www.ti.com.
12.2 Documentation Support
12.2.1 Related Documentation
For the avid reader, the following resources are available at www.ti.com.
Application Note 1879 -- Fractional N Frequency Synthesis
PLL Performance, Simulation, and Design -- by Dean Banerjee
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 10. Related Links
TECHNICAL
DOCUMENTS
TOOLS and
SOFTWARE
SUPPORT and
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE and BUY
LMX2492
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
LMX2492-Q1
12.4 Trademarks
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
13 机械封装和可订购信息
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对
本文档进行修订的情况下发生改变。 要获得这份数据表的浏览器版本,请查阅左侧导航栏。
Copyright © 2014, Texas Instruments Incorporated
35
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LMX2492QRTWRQ1
LMX2492QRTWTQ1
LMX2492RTWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WQFN
WQFN
WQFN
WQFN
RTW
RTW
RTW
RTW
24
24
24
24
1000 RoHS & Green
250 RoHS & Green
1000 RoHS & Green
250 RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
-40 to 85
-40 to 85
X2492Q
SN
SN
SN
X2492Q
X2492
X2492
LMX2492RTWT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
RTW0024A
WQFN - 0.8 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
B
A
PIN 1 INDEX AREA
4.1
3.9
C
0.8 MAX
SEATING PLANE
0.08 C
0.05
0.00
2X 2.5
(0.1) TYP
EXPOSED
THERMAL PAD
7
12
20X 0.5
6
13
2X
25
2.5
2.6 0.1
1
18
0.3
24X
0.2
24
19
PIN 1 ID
(OPTIONAL)
0.1
C A B
C
0.05
0.5
0.3
24X
4222815/A 03/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RTW0024A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
2.6)
SYMM
24
19
24X (0.6)
1
18
24X (0.25)
(1.05)
SYMM
25
(3.8)
20X (0.5)
(R0.05)
TYP
6
13
(
0.2) TYP
VIA
7
12
(1.05)
(3.8)
LAND PATTERN EXAMPLE
SCALE:15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222815/A 03/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RTW0024A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X ( 1.15)
(0.675) TYP
19
(R0.05) TYP
24
24X (0.6)
1
18
24X (0.25)
(0.675)
TYP
SYMM
20X (0.5)
25
(3.8)
6
13
METAL
TYP
7
12
SYMM
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 25:
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4222815/A 03/2016
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
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TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022,德州仪器 (TI) 公司
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