LP2950ACZ-5.0/LFT7 [TI]

LP2950-N/LP2951-N Series of Adjustable Micropower Voltage Regulators; LP2950 -N / LP2951 -N系列的可调微功耗电压调节器
LP2950ACZ-5.0/LFT7
型号: LP2950ACZ-5.0/LFT7
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LP2950-N/LP2951-N Series of Adjustable Micropower Voltage Regulators
LP2950 -N / LP2951 -N系列的可调微功耗电压调节器

调节器
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LP2950-N, LP2951-N  
www.ti.com  
SNVS764N JANUARY 2000REVISED MAY 2013  
LP2950-N/LP2951-N Series of Adjustable Micropower Voltage Regulators  
Check for Samples: LP2950-N, LP2951-N  
1
FEATURES  
DESCRIPTION  
The LP2950-N and LP2951-N are micropower  
2
5V, 3V, and 3.3V Versions Available  
High Accuracy Output Voltage  
Ensured 100 mA Output Current  
Extremely Low Quiescent Current  
Low Dropout Voltage  
voltage regulators with very low quiescent current (75  
μA typ.) and very low dropout voltage (typ. 40 mV at  
light loads and 380 mV at 100 mA). They are ideally  
suited for use in battery-powered systems.  
Furthermore, the quiescent current of the LP2950-  
N/LP2951-N increases only slightly in dropout,  
prolonging battery life.  
Extremely Tight Load and Line Regulation  
Very Low Temperature Coefficient  
Use as Regulator or Reference  
Needs Minimum Capacitance for Stability  
Current and Thermal Limiting  
The LP2950-N-5.0 is available in the surface-mount  
PFM package, and in the popular 3-pin TO-92  
package for pin-compatibility with older 5V regulators.  
The 8-lead LP2951-N is available in plastic, ceramic  
dual-in-line, WSON, or metal can packages and  
offers additional system functions.  
Stable With Low-ESR Output Capacitors (10  
mto 6)  
One such feature is an error flag output which warns  
of a low output voltage, often due to falling batteries  
on the input. It may be used for a power-on reset. A  
second feature is the logic-compatible shutdown input  
which enables the regulator to be switched on and  
off. Also, the part may be pin-strapped for a 5V, 3V,  
or 3.3V output (depending on the version), or  
programmed from 1.24V to 29V with an external pair  
of resistors.  
LP2951-N VERSIONS ONLY  
Error Flag Warns of Output Dropout  
Logic-Controlled Electronic Shutdown  
Output Programmable From 1.24 to 29V  
Careful design of the LP2950-N/LP2951-N has  
minimized all contributions to the error budget. This  
includes a tight initial tolerance (.5% typ.), extremely  
good load and line regulation (.05% typ.) and a very  
low output voltage temperature coefficient, making  
the part useful as a low-power voltage reference.  
Block Diagram and Typical Applications  
Figure 1. LP2950-N  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2013, Texas Instruments Incorporated  
LP2950-N, LP2951-N  
SNVS764N JANUARY 2000REVISED MAY 2013  
www.ti.com  
Figure 2. LP2951-N  
Connection Diagrams  
Figure 3. TO-92 Plastic Package (LP) Bottom  
View  
Figure 6. 10-Lead Ceramic Surface-Mount  
Package (NAC) Top View  
Figure 4. Dual-In-Line Packages (P, NAB)  
Surface-Mount Package (D, DGK) Top View  
Figure 7. PFM (NDP) Front View  
INPUT  
OUTPUT  
SENSE  
1
2
3
4
8
7
6
5
FEEDBACK  
DAP  
V
TAP  
SHUTDOWN  
GND  
ERROR  
Figure 5. Metal Can Package (LMC) Top View  
Connect DAP to GND at device pin 4.  
Figure 8. 8-Lead WSON (NGT) Top View  
2
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SNVS764N JANUARY 2000REVISED MAY 2013  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
Input Supply Voltage - SHUTDOWN Input Voltage Error Comparator Output Voltage(3)  
FEEDBACK Input Voltage(3)(4)  
0.3 to +30V  
1.5 to +30V  
Power Dissipation  
Internally Limited  
+150°C  
Junction Temperature (TJ)  
Ambient Storage Temperature  
65° to +150°C  
4 seconds, 260°C  
10 seconds, 240°C  
75 seconds, 219°C  
2500V  
Soldering Dwell Time, Temperature  
Wave  
Infrared  
Vapor Phase  
Human Body Model(5)  
ESD Rating  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and  
associated test conditions, see the Electrical Characteristics tables.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) May exceed input supply voltage.  
(4) When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be  
diode-clamped to ground.  
(5) Human Body Model (HBM) is 1.5 kΩ in series with 100 pF; LP2950-N passes 2.5 kV (HBM) ESD; LP2951-N passes 2.5 kV (HBM)  
except: Feedback pin passes 1kV (HBM) and Shutdown pin passes 2kV (HBM).  
OPERATING RATINGS(1)  
Maximum Input Supply Voltage  
30V  
LP2950AC-XX, LP2950C-XX  
LP2951  
40° to +125°C  
55° to +150°C  
40° to +125°C  
Junction Temperature Range (TJ)(2)  
LP2951AC-XX, LP2951C-XX  
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which  
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and  
associated test conditions, see the Electrical Characteristics tables.  
(2) The junction-to-ambient thermal resistances are as follows: 180°C/W and 160°C/W for the TO-92 package with 0.40 inch and 0.25 inch  
leads to the printed circuit board (PCB) respectively, 105°C/W for the molded PDIP (P), 130°C/W for the ceramic DIP (NAB), 160°C/W  
for the molded plastic SOIC (D), 200°C/W for the molded plastic VSSOP (DGK), and 160°C/W for the metal can package (LMC). The  
above thermal resistances for the P, NAB, D, and DGK packages apply when the package is soldered directly to the PCB. Junction-to-  
case thermal resistance for the LMC package is 20°C/W. Junction-to-case thermal resistance for the PFM package is 5.4°C/W. The  
value of θJA for the WSON package is typically 51°C/W but is dependent on the PCB trace area, trace material, and the number of  
layers and thermal vias. For details of thermal resistance and power dissipation for the WSON package, refer to Application Note AN-  
1187 (literature number SNOA401).  
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SNVS764N JANUARY 2000REVISED MAY 2013  
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ELECTRICAL CHARACTERISTICS(1)  
LP2950AC-XX  
LP2951AC-XX  
LP2950C-XX  
LP2951C-XX  
LP2951  
Parameter  
Conditions(1)  
Units  
Typ  
Tested  
Typ  
Tested Design Typ  
Limit(2) Limit(4)  
Tested Design  
Limit(2) Limit(4)  
Limit(2)(3)  
3V Versions(5)  
Output Voltage  
TJ = 25°C  
3.0  
3.0  
3.015  
2.985  
3.0  
3.0  
3.0  
3.0  
3.015  
2.985  
3.0  
3.0  
3.0  
3.0  
3.030  
2.970  
3.045  
2.955  
3.060  
2.940  
3.072  
2.928  
V max  
V min  
V max  
V min  
V max  
V min  
V max  
V min  
25°C TJ 85°C  
3.030  
2.970  
3.036  
2.964  
3.042  
2.958  
Full Operating Temperature 3.0  
Range  
3.036  
2.964  
3.045  
2.955  
Output Voltage  
100 μA IL 100 mA  
TJ TJMAX  
3.0  
3.3V Versions(5)  
Output Voltage  
TJ = 25°C  
3.3  
3.3  
3.317  
3.284  
3.3  
3.3  
3.3  
3.3  
3.317  
3.284  
3.3  
3.3  
3.3  
3.3  
3.333  
3.267  
3.350  
3.251  
3.366  
3.234  
3.379  
3.221  
V max  
V min  
V max  
V min  
V max  
V min  
V max  
V min  
25°C TJ 85°C  
3.333  
3.267  
3.340  
3.260  
3.346  
3.254  
Full Operating Temperature 3.3  
Range  
3.340  
3.260  
3.350  
3.251  
Output Voltage  
100 μA IL 100 mA  
TJ TJMAX  
3.3  
5V Versions(5)  
Output Voltage  
TJ = 25°C  
5.0  
5.0  
5.025  
4.975  
5.0  
5.0  
5.0  
5.0  
5.025  
4.975  
5.0  
5.0  
5.0  
5.0  
5.05  
4.95  
5.075  
4.925  
5.1  
V max  
V min  
V max  
V min  
V max  
V min  
V max  
V min  
25°C TJ 85°C  
5.05  
4.95  
Full Operating Temperature 5.0  
Range  
5.06  
4.94  
5.06  
4.94  
4.9  
Output Voltage  
100 μA IL 100 mA  
TJ TJMAX  
5.0  
5.075  
4.925  
5.075  
4.925  
5.12  
4.88  
All Voltage Options  
Output Voltage  
Temperature  
Coefficient  
See(6)  
20  
120  
20  
100  
50  
150  
ppm/°C  
Line Regulation(7)  
(VONOM + 1)V Vin  
0.03  
0.1  
0.03  
0.1  
0.04  
0.2  
% max  
% max  
30V(8)  
0.5  
0.2  
0.4  
(1) Unless otherwise noted, all limits specified for VIN = (VONOM + 1)V, IL = 100 μA and CL = 1μF for 5V versions and 2.2 μF for 3V and  
3.3V versions. Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in  
normal type apply for TA = TJ = 25°C. Additional conditions for the 8-pin versions are FEEDBACK tied to VTAP, OUTPUT tied to SENSE,  
and VSHUTDOWN 0.8V.  
(2) Ensured and 100% production tested.  
(3) A Military RETS specification is available on request. At time of printing, the LP2951-N RETS specification complied with the boldface  
limits in this column. The LP2951-N LMC, NAC, or NAB may also be procured as Standard Military Drawing Spec #5962-3870501MGA,  
MXA, or MPA.  
(4) Ensured but not 100% production tested. These limits are not used to calculate outgoing AQL levels.  
(5) All LP2950 devices have the nominal output voltage coded as the last two digits of the part number. In the LP2951 products, the 3.0V  
and 3.3V versions are designated by the last two digits, but the 5V version is denoted with no code at this location of the part number  
(refer to ordering information table).  
(6) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.  
(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to  
heating effects are covered under the specification for thermal regulation.  
(8) Line regulation for the LP2951-N is tested at 150°C for IL = 1mA. For IL = 100 μA and TJ = 125°C, line regulation is specified by design  
to 0.2%. See TYPICAL PERFORMANCE CHARACTERISTICS for line regulation versus temperature and load current.  
4
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SNVS764N JANUARY 2000REVISED MAY 2013  
ELECTRICAL CHARACTERISTICS(1) (continued)  
LP2950AC-XX  
LP2951AC-XX  
LP2950C-XX  
LP2951C-XX  
LP2951  
Parameter  
Conditions(1)  
Units  
Typ  
Tested  
Typ  
Tested Design Typ  
Limit(2) Limit(4)  
Tested Design  
Limit(2) Limit(4)  
Limit(2)(3)  
Load Regulation(7)  
Dropout Voltage(9)  
100 μA IL 100 mA  
IL = 100 μA  
0.04  
0.1  
0.3  
80  
0.04  
0.1  
0.1  
0.2  
0.3  
80  
% max  
% max  
0.2  
80  
mV  
max  
50  
150  
450  
600  
50  
150  
50  
150  
mV  
max  
IL = 100 mA  
450  
450  
mV  
max  
380  
75  
380  
75  
600  
140  
14  
380  
75  
600  
mV  
max  
Ground Current  
IL = 100 μA  
120  
140  
12  
120  
12  
120  
140  
12  
μA max  
μA max  
IL = 100 mA  
8
8
8
mA  
max  
14  
14  
mA  
max  
Dropout Ground  
Current  
Vin = (VONOM 0.5)V  
IL = 100 μA  
110  
160  
170  
200  
200  
110  
160  
170  
200  
110  
160  
170  
200  
200  
μA max  
μA max  
200  
220  
Current Limit  
Vout = 0  
mA  
max  
220  
220  
mA  
max  
Thermal Regulation  
See(10)  
0.05  
0.2  
0.05  
0.2  
0.05  
0.2  
%/W  
max  
Output Noise, 10 Hz to CL = 1μF (5V Only)  
430  
160  
100  
430  
160  
100  
430  
160  
100  
μV rms  
μV rms  
μV rms  
100 kHz  
CL = 200 μF  
CL = 3.3 μF  
(Bypass = 0.01 μF  
Pins 7 to 1 (LP2951-N)  
8-pin Versions Only  
LP2951  
LP2951AC-XX  
LP2951C-XX  
Reference Voltage  
1.23  
5
1.25  
1.23  
5
1.25  
1.23  
5
1.26  
V max  
1.26  
1.22  
1.2  
1.26  
1.27  
V max  
V min  
1.22  
40  
1.21  
1.2  
1.2  
V min  
Reference Voltage  
See(11)  
1.27  
1.19  
40  
1.27  
1.19  
1.285  
1.185  
40  
V max  
V min  
Feedback Pin Bias  
Current  
20  
20  
20  
20  
20  
50  
nA max  
nA max  
ppm/°C  
60  
60  
60  
Reference Voltage  
Temperature  
Coefficient  
See(12)  
Feedback Pin Bias  
Current Temperature  
Coefficient  
0.1  
0.1  
0.1  
nA/°C  
(9) Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value  
measured at 1V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over  
temperature) must be taken into account.  
(10) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load  
or line regulation effects. Specifications are for a 50 mA load pulse at VIN = 30V (1.25W pulse) for T = 10ms.  
(11) VREF VOUT (VIN 1V), 2.3V VIN 30V, 100 μA IL 100 mA, TJ TJMAX  
.
(12) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.  
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ELECTRICAL CHARACTERISTICS(1) (continued)  
LP2950AC-XX  
LP2951AC-XX  
LP2950C-XX  
LP2951C-XX  
LP2951  
Parameter  
Conditions(1)  
Units  
Typ  
Tested  
Typ  
Tested Design Typ  
Limit(2) Limit(4)  
Tested Design  
Limit(2) Limit(4)  
Limit(2)(3)  
Error Comparator  
Output Leakage  
Current  
VOH = 30V  
0.01  
150  
1
2
0.01  
150  
1
0.01  
150  
1
μA max  
μA max  
2
2
Output Low Voltage  
Vin = (VONOM 0.5)V  
IOL = 400μA  
250  
250  
250  
mV  
max  
400  
400  
25  
400  
mV  
max  
Upper Threshold  
Voltage  
See(13)  
See(13)  
60  
75  
40  
25  
95  
60  
75  
40  
95  
60  
75  
40  
25  
95  
mV min  
mV min  
Lower Threshold  
Voltage  
mV  
max  
140  
140  
140  
mV  
max  
Hysteresis  
Shutdown Input  
Input  
See(13)  
15  
15  
15  
mV  
1.3  
1.3  
1.3  
V
Logic  
Low (Regulator ON)  
High (Regulator OFF)  
Vshutdown = 2.4V  
0.6  
2.0  
50  
0.7  
2.0  
0.7  
V max  
V min  
Voltage  
2.0  
Shutdown Pin Input  
Current  
30  
450  
3
30  
450  
3
50  
600  
10  
30  
450  
3
50  
100  
600  
750  
10  
μA max  
μA max  
μA max  
μA max  
μA max  
μA max  
100  
600  
750  
10  
100  
750  
20  
Vshutdown = 30V  
See(14)  
Regulator Output  
Current in Shutdown  
20  
20  
(13) Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage  
measured at Vin = (VONOM + 1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain =  
VOUT/VREF = (R1 + R2)/R2.For example, at a programmed output voltage of 5V, the Error output is specified to go low when the output  
drops by 95 mV × 5V/1.235V = 384 mV. Thresholds remain constant as a percent of Vout as Vout is varied, with the dropout warning  
occurring at typically 5% below nominal, 7.5% ensured.  
(14) VSHUTDOWN 2V, VIN 30V, VOUT = 0, Feedback pin tied to VTAP  
.
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TYPICAL PERFORMANCE CHARACTERISTICS  
Quiescent Current  
Dropout Characteristics  
Figure 9.  
Figure 10.  
Input Current  
Input Current  
Figure 11.  
Figure 12.  
Output Voltage vs. Temperature of 3 Representative Units  
Quiescent Current  
Figure 13.  
Figure 14.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Quiescent Current  
Quiescent Current  
Figure 15.  
Figure 16.  
Quiescent Current  
Short Circuit Current  
Figure 17.  
Figure 18.  
Dropout Voltage  
Dropout Voltage  
Figure 19.  
Figure 20.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
LP2951-N Minimum Operating Voltage  
LP2951-N Feedback Bias Current  
Figure 21.  
Figure 22.  
LP2951-N Feedback Pin Current  
LP2951-N Error Comparator Output  
Figure 23.  
Figure 24.  
LP2951-N Comparator Sink Current  
Line Transient Response  
Figure 25.  
Figure 26.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Load Transient Response  
Load Transient Response  
Figure 27.  
Figure 28.  
LP2951-N Enable Transient  
Output Impedance  
Figure 29.  
Figure 30.  
Ripple Rejection  
Ripple Rejection  
Figure 31.  
Figure 32.  
10  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Ripple Rejection  
LP2951-N Output Noise  
Figure 33.  
Figure 34.  
LP2951-N Divider Resistance  
Shutdown Threshold Voltage  
Figure 35.  
Figure 36.  
Line Regulation  
LP2951-N Maximum Rated Output Current  
Figure 37.  
Figure 38.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
LP2950-N Maximum Rated Output Current  
Thermal Response  
Figure 39.  
Figure 40.  
Output Capacitor ESR Range  
LP2951-N Input Pin Current vs Input Voltage  
120  
V
= 2.0V  
SD  
Output Load = Open  
100  
80  
60  
40  
20  
0
Ta= -50°C  
Ta= -40°C  
Ta= +25°C  
Ta= +125°C  
0
5
10  
15  
20  
25  
30  
INPUT PIN VOLTAGE, V (V)  
IN  
Figure 41.  
Figure 42.  
LP2951-N Input Pin Current vs Input Voltage  
120  
V
= 2.0V  
SD  
Output Load = Short to Ground  
100  
80  
60  
40  
20  
0
Ta= -50°C  
Ta= -40°C  
Ta= +25°C  
Ta= +125°C  
0
5
10  
15  
20  
25  
30  
INPUT PIN VOLTAGE, V (V)  
IN  
Figure 43.  
12  
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SNVS764N JANUARY 2000REVISED MAY 2013  
APPLICATION HINTS  
Output Capacitor Requirements  
A 1.0 μF (or greater) capacitor is required between the output and ground for stability at output voltages of 5V or  
higher. At lower output voltages, more capacitance is required (2.2 μF or more is recommended for 3.0V and  
3.3V versions). Without this capacitor the part will oscillate. Most types of tantalum or aluminum electrolytic work  
fine here; even film types work but are not recommended for reasons of cost. Many aluminum electrolytics have  
electrolytes that freeze at about 30°C, so solid tantalums are recommended for operation below 25°C. The  
important parameters of the capacitor are an ESR of about 5Ω or less and a resonant frequency above 500 kHz.  
The value of this capacitor may be increased without limit.  
Figure 44. Output Capacitor ESR Range  
The reason for the lower ESR limit is that the loop compensation of the feedback loop relies on the capacitance  
value and the ESR value of the output capacitor to provide the zero that gives added phase lead (See  
Figure 44).  
fZ = (1 / (2 x π x COUT x ESR) )  
(1)  
Using the 2.2 µF value from the Output Capacitor ESR Range curve (Figure 44), a useful range for fZ can be  
estimated:  
fZ(MIN)= (1 / (2 x π x 2.2 µF x 5) ) = 14.5 kHz  
fZ(MAX)= (1 / (2 x π x 2.2 µF x 0.05) ) = 318 kHz  
(2)  
(3)  
For ceramic capacitors, the low ESR produces a zero at a frequency that is too high to be useful, so meaningful  
phase lead does not occur. A ceramic output capacitor can be used if a series resistance is added  
(recommended value of resistance about 0.1to 2) to simulate the needed ESR. Only X5R, X7R, or better,  
MLCC types should be used, and should have a DC voltage rating at least twice the VOUT(NOM) value.  
At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced  
to 0.33 μF for currents below 10 mA or 0.1 μF for currents below 1 mA. Using the adjustable versions at voltages  
below 5V runs the error amplifier at lower gains so that more output capacitance is needed. For the worst-case  
situation of a 100 mA load at 1.23V output (Output shorted to Feedback) a 3.3 μF (or greater) capacitor should  
be used.  
Unlike many other regulators, the LP2950-N will remain stable and in regulation with no load in addition to the  
internal voltage divider. This is especially important in CMOS RAM keep-alive applications. When setting the  
output voltage of the LP2951-N versions with external resistors, a minimum load of 1 μA is recommended.  
Applications having conditions that may drive the LP2950-N/51 into nonlinear operation require special  
consideration. Nonlinear operation will occur when the output voltage is held low enough to force the output  
stage into output current limiting while trying to pull the output voltage up to the regulated value. The internal loop  
response time will control how long it takes for the device to regain linear operation when the output has returned  
to the normal operating range. There are three significant nonlinear conditions that need to be considered, all can  
force the output stage into output current limiting mode, all can cause the output voltage to over-shoot with low  
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value output capacitors when the condition is removed, and the recommended generic solution is to set the  
output capacitor to a value not less than 10 μF. Although the 10 μF value for COUT may not eliminate the output  
voltage over-shoot in all cases, it should lower it to acceptable levels (<10% of VOUT(NOM)) in the majority of  
cases. In all three of these conditions, applications with lighter load currents are more susceptible to output  
voltage over-shoot than applications with higher load currents.  
1) At power-up, with the input voltage rising faster than output stage can charge the output capacitor.  
VIN tRISE(MIN) > ((COUT / 100 mA) x ΔVIN)  
where  
ΔVIN = VOUT(NOM) + 1.0V  
(4)  
(5)  
(6)  
2) Recovery from an output short circuit to ground condition.  
C
OUT(MIN)(160 mA - ILOAD(NOM))/((VOUT(NOM)/10)/25 μs))  
3) Toggling the LP2951-N SHUTDOWN pin from high (i.e. OFF) to low (i.e. ON).  
C
OUT(MIN)(160 mA - ILOAD(NOM))/((VOUT(NOM)/10)/25 μs))  
Figure 45. LP2951-N Enable Transient  
Input Capacitor Requirements  
A minimum 1 μF tantalum, ceramic or aluminum electrolytic capacitor should be placed from the LP2950-  
N/LP2951-N input pin to ground if there is more than 10 inches of wire between the input and the AC filter  
capacitor or if a battery is used as the input.  
Error Detection Comparator Output  
The comparator produces a logic low output whenever the LP2951-N output falls out of regulation by more than  
approximately 5%. This figure is the comparator's built-in offset of about 60mV divided by the 1.235 reference  
voltage. (Refer to the block diagram in the front of the datasheet.) This trip level remains “5% below normal”  
regardless of the programmed output voltage of the 2951. For example, the error flag trip level is typically 4.75V  
for a 5V output or 11.4V for a 12V output. The out of regulation condition may be due either to low input voltage,  
current limiting, or thermal limiting.  
Figure 46 below gives a timing diagram depicting the ERROR signal and the regulated output voltage as the  
LP2951-N input is ramped up and down. For 5V versions, the ERROR signal becomes valid (low) at about 1.3V  
input. It goes high at about 5V input (the input voltage at which VOUT = 4.75V). Since the LP2951-N's dropout  
voltage is load-dependent (see curve in typical performance characteristics), the input voltage trip point (about  
5V) will vary with the load current. The output voltage trip point (approx. 4.75V) does not vary with load.  
The error comparator has an open-collector output which requires an external pull up resistor. This resistor may  
be returned to the output or some other supply voltage depending on system requirements. In determining a  
value for this resistor, note that while the output is rated to sink 400 μA, this sink current adds to battery drain in  
a low battery condition. Suggested values range from 100k to 1 MΩ. The resistor is not required if this output is  
unused.  
14  
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*When VIN 1.3V, the error flag pin becomes a high impedance, and the error flag voltage rises to its pull-up voltage.  
Using VOUT as the pull-up voltage (see Figure 47), rather than an external 5V source, will keep the error flag voltage  
under 1.2V (typ.) in this condition. The user may wish to divide down the error flag voltage using equal-value resistors  
(10 ksuggested), to ensure a low-level logic signal during any fault condition, while still allowing a valid high logic  
level during normal operation.  
Figure 46. ERROR Output Timing  
Programming the Output Voltage (LP2951-N)  
The LP2951-N may be pin-strapped for the nominal fixed output voltage using its internal voltage divider by tying  
the output and sense pins together, and also tying the feedback and VTAP pins together. Alternatively, it may be  
programmed for any output voltage between its 1.235V reference and its 30V maximum rating. As seen in  
Figure 47, an external pair of resistors is required.  
The complete equation for the output voltage is  
where  
VREF is the nominal 1.235V reference voltage and IFB is the feedback pin bias current, nominally -20nA  
(7)  
The minimum recommended load current of 1 μA forces an upper limit of 1.2 MΩ on the value of R2, if the  
regulator must work with no load (a condition often found in CMOS in standby). IFB will produce a 2% typical  
error in VOUT which may be eliminated at room temperature by trimming R1. For better accuracy, choosing R2 =  
100 kreduces this error to 0.17% while increasing the resistor program current to 12 μA. Since the LP2951-N  
typically draws 60 μA at no load with Pin 2 open-circuited, this is a small price to pay.  
*See Application Hints  
**Drive with TTL-high to shut down. Ground or leave open if shutdown feature is not to be used.  
Note: Pins 2 and 6 are left open.  
Figure 47. Adjustable Regulator  
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Stray capacitance to the LP2951-N Feedback terminal can cause instability. This may especially be a problem  
when using high value external resistors to set the output voltage. Adding a 100 pF capacitor between the Output  
pin and the Feedback pin,and increasing the output capacitor to at least 3.3 μF, will fix this problem.  
Reducing Output Noise  
In reference applications it may be advantageous to reduce the AC noise present at the output. One method is to  
reduce the regulator bandwidth by increasing the size of the output capacitor. This is the only way noise can be  
reduced on the 3 lead LP2950-N but is relatively inefficient, as increasing the capacitor from 1 μF to 220 μF only  
decreases the noise from 430 μV(RMS) to 160 μV(RMS) for a 100 kHz bandwidth at 5V output.  
Noise can be reduced fourfold by a bypass capacitor across R1, since it reduces the high frequency gain from 4  
to unity. Pick  
(8)  
or about 0.01 μF. When doing this, the output capacitor must be increased to 3.3 μF to maintain stability. These  
changes reduce the output noise from 430 μV to 100 μV rms for a 100 kHz bandwidth at 5V output. With the  
bypass capacitor added, noise no longer scales with output voltage so that improvements are more dramatic at  
higher output voltages.  
WSON Mounting  
The NGT (No Pullback) 8-Lead WSON package requires specific mounting techniques which are detailed in  
Application Note 1187 (literature number SNOA401). Referring to the PCB Design Recommendations section  
(literature number SNOA401), it should be noted that the pad style which should be used with the WSON  
package is the NSMD (non-solder mask defined) type. Additionally, it is recommended the PCB terminal pads to  
be 0.2 mm longer than the package pads to create a solder fillet to improve reliability and inspection.  
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the  
amount of additional copper area connected to the DAP.  
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive  
die attach adhesive. The DAP has no direct electrical (wire) connection to any of the eight pins. There is a  
parasitic PN junction between the die substrate and the device ground. As such, it is strongly recommend that  
the DAP be connected directly to the ground at device lead 4 (i.e. GND). Alternately, but not recommended, the  
DAP may be left floating (i.e. no electrical connection). The DAP must not be connected to any potential other  
than ground.  
For the LP2951-N in the NGT 8-Lead WSON package, the junction-to-case thermal rating, θJC, is 14.2°C/W,  
where the case is the bottom of the package at the center of the DAP. The junction-to-ambient thermal  
performance for the LP2951-N in the NGT 8-Lead WSON package, using the JEDEC JESD51 standards is  
summarized in the following table:  
Board Type  
Thermal Vias  
θJC  
θJA  
JEDEC 2-Layer JESD 51-3  
None  
14.2°C/W  
14.2°C/W  
14.2°C/W  
14.2°C/W  
14.2°C/W  
185°C/W  
68°C/W  
60°C/W  
51°C/W  
48°C/W  
1
2
4
6
JEDEC 4-Layer JESD 51-7  
16  
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SNVS764N JANUARY 2000REVISED MAY 2013  
Typical Applications  
Figure 48. 1A Regulator with 1.2V Dropout  
Figure 49. 300mA Regulator with 0.75V Dropout  
*Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically  
160mA.  
Figure 50. Wide Input Voltage Range Current Limiter  
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Figure 51. Low Drift Current Source  
*Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically  
160mA.  
Figure 52. 5 Volt Current Limiter  
18  
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SNVS764N JANUARY 2000REVISED MAY 2013  
Early warning flag on low input voltage  
Main output latches off at lower input voltages  
Battery backup on auxiliary output  
Operation: Reg. #1's VOUT is programmed one diode drop above 5V. Its error flag becomes active when VIN  
5.7V. When VIN drops below 5.3V, the error flag of Reg. #2 becomes active and via Q1 latches the main output  
off. When VIN again exceeds 5.7V Reg. #1 is back in regulation and the early warning signal rises, unlatching  
Reg. #2 via D3.  
Figure 53. Regulator with Early Warning and Auxiliary Output  
Figure 54. Latch Off When Error Flag Occurs  
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For 5Vout, use internal resistors. Wire pin 6 to 7, & wire pin 2 to +Vout Bus.  
Figure 55. 2 Ampere Low Dropout Regulator  
*High input lowers Vout to 2.5V  
Figure 56. 5V Regulator with 2.5V Sleep Function  
20  
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SNVS764N JANUARY 2000REVISED MAY 2013  
Figure 57. Open Circuit Detector for 4 20mA Current Loop  
*Optional Latch off when drop out occurs. Adjust R3 for C2 Switching when Vin is 6.0V  
**Outputs go low when VIN drops below designated thresholds.  
Figure 58. Regulator with State-of-Charge Indicator  
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For values shown, Regulator shuts down when Vin < 5.5V and turns on again at 6.0V. Current drain in disconnected  
mode is 150μA.  
*Sets disconnect Voltage  
**Sets disconnect Hysteresis  
Figure 59. Low Battery Disconnect  
LM34 for 125°F Shutdown  
LM35 for 125°C Shutdown  
Figure 60. System Overtemperature Protection Circuit  
22  
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SNVS764N JANUARY 2000REVISED MAY 2013  
Schematic Diagram  
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REVISION HISTORY  
Changes from Revision M (April 2013) to Revision N  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 23  
24  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
PACKAGING INFORMATION  
Orderable Device  
LP2950ACZ-3.0/NOPB  
LP2950ACZ-3.3/NOPB  
LP2950ACZ-5.0/LFT1  
LP2950ACZ-5.0/LFT3  
LP2950ACZ-5.0/LFT7  
LP2950ACZ-5.0/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
LP  
3
3
3
3
3
3
1800  
Green (RoHS  
& no Sb/Br)  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
2950A  
CZ3.0  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
LP  
LP  
LP  
LP  
LP  
1800  
2000  
2000  
2000  
1800  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
2950A  
CZ3.3  
Green (RoHS  
& no Sb/Br)  
2950A  
CZ5.0  
Green (RoHS  
& no Sb/Br)  
2950A  
CZ5.0  
Green (RoHS  
& no Sb/Br)  
2950A  
CZ5.0  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
2950A  
CZ5.0  
LP2950CDT-3.0  
ACTIVE  
ACTIVE  
TO-252  
TO-252  
NDP  
NDP  
3
3
75  
75  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LP2950CDT-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
LP2950  
CDT-3.0  
LP2950CDT-3.3  
ACTIVE  
ACTIVE  
ACTIVE  
TO-252  
TO-252  
TO-252  
NDP  
NDP  
NDP  
3
3
3
75  
75  
75  
TBD  
Call TI  
CU SN  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
LP2950  
CDT-3.3  
LP2950CDT-3.3/NOPB  
LP2950CDT-5.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
LP2950  
CDT-3.3  
Green (RoHS  
& no Sb/Br)  
LP2950  
CDT-5.0  
LP2950CDTX-3.0  
ACTIVE  
ACTIVE  
TO-252  
TO-252  
NDP  
NDP  
3
3
2500  
2500  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LP2950CDTX-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
LP2950  
CDT-3.0  
LP2950CDTX-3.3  
ACTIVE  
ACTIVE  
TO-252  
TO-252  
NDP  
NDP  
3
3
2500  
2500  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LP2950CDTX-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
LP2950  
CDT-3.3  
LP2950CDTX-5.0  
LP2950CDTX-5.0/NOPB  
LP2950CN  
ACTIVE  
ACTIVE  
ACTIVE  
TO-252  
TO-252  
PDIP  
NDP  
NDP  
P
3
3
8
2500  
2500  
40  
TBD  
Call TI  
CU SN  
Call TI  
Call TI  
Level-2-260C-1 YEAR  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
LP2950  
CDT-5.0  
Green (RoHS  
& no Sb/Br)  
LP2950  
CDT-5.0  
TBD  
LP  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
LP  
LP  
LP  
LP  
LP  
LP  
LP  
LP  
LP  
LP  
D
Qty  
2000  
1800  
2000  
2000  
1800  
2000  
2000  
2000  
2000  
1800  
95  
(1)  
(2)  
(3)  
(4/5)  
2951CN  
LP2950CZ-3.0/LFT3  
LP2950CZ-3.0/NOPB  
LP2950CZ-3.3/LFT1  
LP2950CZ-3.3/LFT3  
LP2950CZ-3.3/NOPB  
LP2950CZ-5.0/LFT1  
LP2950CZ-5.0/LFT3  
LP2950CZ-5.0/LFT7  
LP2950CZ-5.0/LFT8  
LP2950CZ-5.0/NOPB  
LP2951ACM  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
TO-92  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
3
3
3
3
3
3
3
3
3
3
8
8
8
8
8
8
Green (RoHS  
& no Sb/Br)  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
SNCU  
Call TI  
Call TI  
CU SN  
Call TI  
CU SN  
CU SN  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Level-1-NA-UNLIM  
Call TI  
2950  
CZ3.0  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
2950  
CZ3.0  
Green (RoHS  
& no Sb/Br)  
2950  
CZ3.3  
Green (RoHS  
& no Sb/Br)  
2950  
CZ3.3  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
2950  
CZ3.3  
Green (RoHS  
& no Sb/Br)  
2950  
CZ5.0  
Green (RoHS  
& no Sb/Br)  
2950  
CZ5.0  
Green (RoHS  
& no Sb/Br)  
2950  
CZ5.0  
Green (RoHS  
& no Sb/Br)  
2950  
CZ5.0  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
2950  
CZ5.0  
TBD  
2951  
ACM>D  
LP2951ACM-3.0  
D
95  
TBD  
Call TI  
2951A  
CM30>D  
LP2951ACM-3.0/NOPB  
LP2951ACM-3.3  
D
95  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Call TI  
2951A  
CM30>D  
D
95  
TBD  
2951A  
CM33>D  
LP2951ACM-3.3/NOPB  
LP2951ACM/NOPB  
D
95  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
2951A  
CM33>D  
D
95  
Green (RoHS  
& no Sb/Br)  
2951  
ACM>D  
LP2951ACMM  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
1000  
1000  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
L0DA  
LP2951ACMM-3.0  
TBD  
L0BA  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
LP2951ACMM-3.0/NOPB  
ACTIVE  
VSSOP  
DGK  
8
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L0BA  
LP2951ACMM-3.3  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0CA  
L0CA  
LP2951ACMM-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951ACMM/NOPB  
ACTIVE  
VSSOP  
DGK  
8
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L0DA  
LP2951ACMMX  
LP2951ACMMX-3.0  
ACTIVE  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
8
8
8
3500  
3500  
3500  
TBD  
Call TI  
Call TI  
CU SN  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
L0DA  
L0BA  
L0BA  
TBD  
LP2951ACMMX-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951ACMMX-3.3  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
3500  
3500  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0CA  
L0CA  
LP2951ACMMX-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951ACMMX/NOPB  
LP2951ACMX  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
VSSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
DGK  
D
8
8
8
8
8
8
8
8
8
8
3500  
2500  
2500  
2500  
2500  
2500  
2500  
40  
Green (RoHS  
& no Sb/Br)  
CU SN  
Call TI  
Call TI  
CU SN  
Call TI  
CU SN  
CU SN  
Call TI  
SN  
Level-1-260C-UNLIM  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
L0DA  
2951  
TBD  
ACM>D  
LP2951ACMX-3.0  
LP2951ACMX-3.0/NOPB  
LP2951ACMX-3.3  
LP2951ACMX-3.3/NOPB  
LP2951ACMX/NOPB  
LP2951ACN  
D
TBD  
Call TI  
2951A  
CM30>D  
D
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Call TI  
2951A  
CM30>D  
D
TBD  
2951A  
CM33>D  
D
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Call TI  
2951A  
CM33>D  
D
Green (RoHS  
& no Sb/Br)  
2951  
ACM>D  
P
TBD  
LP  
2951ACN  
LP2951ACN/NOPB  
LP2951ACSD  
PDIP  
P
40  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
Call TI  
LP  
2951ACN  
WSON  
NGT  
1000  
TBD  
Call TI  
2951AC  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
LP2951ACSD/NOPB  
ACTIVE  
WSON  
NGT  
8
1000  
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-260C-UNLIM  
-40 to 125  
2951AC  
LP2951ACSDX  
LP2951ACSDX-3.3  
ACTIVE  
ACTIVE  
ACTIVE  
WSON  
WSON  
WSON  
NGT  
NGT  
NGT  
8
8
8
4500  
4500  
4500  
TBD  
Call TI  
Call TI  
SN  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
2951AC  
51AC33  
51AC33  
TBD  
LP2951ACSDX-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951ACSDX/NOPB  
LP2951CM  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
WSON  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
NGT  
D
8
8
8
8
8
8
8
4500  
95  
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-260C-UNLIM  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
2951AC  
TBD  
Call TI  
Call TI  
CU SN  
Call TI  
CU SN  
CU SN  
2951  
CM>D  
LP2951CM-3.0  
D
95  
TBD  
Call TI  
2951C  
M30>D  
LP2951CM-3.0/NOPB  
LP2951CM-3.3  
D
95  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Call TI  
2951C  
M30>D  
D
95  
TBD  
2951C  
M33>D  
LP2951CM-3.3/NOPB  
LP2951CM/NOPB  
D
95  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
2951C  
M33>D  
D
95  
Green (RoHS  
& no Sb/Br)  
2951  
CM>D  
LP2951CMM  
LP2951CMM-3.0  
ACTIVE  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
8
8
8
1000  
1000  
1000  
TBD  
Call TI  
Call TI  
CU SN  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
L0DB  
L0BB  
L0BB  
TBD  
LP2951CMM-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951CMM-3.3/NOPB  
LP2951CMM/NOPB  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
1000  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
L0CB  
L0DB  
Green (RoHS  
& no Sb/Br)  
LP2951CMMX  
LP2951CMMX-3.0  
ACTIVE  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
8
8
8
3500  
3500  
3500  
TBD  
Call TI  
Call TI  
CU SN  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
L0DB  
L0BB  
L0BB  
TBD  
LP2951CMMX-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
LP2951CMMX-3.3  
ACTIVE  
VSSOP  
VSSOP  
DGK  
8
8
3500  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0CB  
L0CB  
LP2951CMMX-3.3/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DGK  
DGK  
D
3500  
3500  
2500  
2500  
2500  
2500  
2500  
2500  
40  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951CMMX/NOPB  
LP2951CMX  
VSSOP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
8
8
8
8
8
8
8
8
8
Green (RoHS  
& no Sb/Br)  
CU SN  
Call TI  
Call TI  
CU SN  
Call TI  
CU SN  
CU SN  
Call TI  
SN  
Level-1-260C-UNLIM  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
L0DB  
2951  
TBD  
CM>D  
LP2951CMX-3.0  
D
TBD  
Call TI  
2951C  
M30>D  
LP2951CMX-3.0/NOPB  
LP2951CMX-3.3  
D
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Call TI  
2951C  
M30>D  
D
TBD  
2951C  
M33>D  
LP2951CMX-3.3/NOPB  
LP2951CMX/NOPB  
LP2951CN  
D
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Call TI  
2951C  
M33>D  
D
Green (RoHS  
& no Sb/Br)  
2951  
CM>D  
P
TBD  
LP  
2951CN  
LP2951CN/NOPB  
P
40  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
LP  
2951CN  
LP2951CSD  
LP2951CSD-3.0  
ACTIVE  
ACTIVE  
ACTIVE  
WSON  
WSON  
WSON  
NGT  
NGT  
NGT  
8
8
8
1000  
1000  
1000  
TBD  
Call TI  
Call TI  
SN  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
-40 to 125  
2951ACB  
51AC30B  
51AC30B  
TBD  
LP2951CSD-3.0/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951CSD-3.3  
ACTIVE  
ACTIVE  
WSON  
WSON  
NGT  
NGT  
8
8
1000  
1000  
TBD  
Call TI  
SN  
Call TI  
-40 to 125  
-40 to 125  
51AC33B  
51AC33B  
LP2951CSD-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951CSD/NOPB  
ACTIVE  
WSON  
NGT  
8
1000  
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-260C-UNLIM  
-40 to 125  
2951ACB  
LP2951CSDX  
ACTIVE  
ACTIVE  
WSON  
WSON  
NGT  
NGT  
8
8
4500  
4500  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
-40 to 125  
-40 to 125  
2951ACB  
51AC30B  
LP2951CSDX-3.0  
TBD  
Addendum-Page 5  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
LP2951CSDX-3.0/NOPB  
ACTIVE  
WSON  
NGT  
8
4500  
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-260C-UNLIM  
-40 to 125  
51AC30B  
LP2951CSDX-3.3  
ACTIVE  
ACTIVE  
WSON  
WSON  
NGT  
NGT  
8
8
4500  
4500  
TBD  
Call TI  
SN  
Call TI  
-40 to 125  
-40 to 125  
51AC33B  
51AC33B  
LP2951CSDX-3.3/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2951CSDX/NOPB  
ACTIVE  
WSON  
NGT  
8
4500  
Green (RoHS  
& no Sb/Br)  
SN  
Level-1-260C-UNLIM  
-40 to 125  
2951ACB  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 6  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-May-2013  
Addendum-Page 7  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-May-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP2950CDTX-3.0/NOPB TO-252  
LP2950CDTX-3.3/NOPB TO-252  
NDP  
NDP  
NDP  
NDP  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
3
3
3
3
8
8
8
8
8
8
8
8
8
2500  
2500  
2500  
2500  
1000  
1000  
1000  
1000  
1000  
1000  
3500  
3500  
3500  
330.0  
330.0  
330.0  
330.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
16.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
6.9  
6.9  
6.9  
6.9  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
10.5  
10.5  
10.5  
10.5  
3.4  
2.7  
2.7  
2.7  
2.7  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
16.0  
16.0  
16.0  
16.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q2  
Q2  
Q2  
Q2  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
LP2950CDTX-5.0  
TO-252  
LP2950CDTX-5.0/NOPB TO-252  
LP2951ACMM  
VSSOP  
VSSOP  
LP2951ACMM-3.0  
3.4  
LP2951ACMM-3.0/NOPB VSSOP  
LP2951ACMM-3.3 VSSOP  
LP2951ACMM-3.3/NOPB VSSOP  
3.4  
3.4  
3.4  
LP2951ACMM/NOPB  
LP2951ACMMX  
VSSOP  
VSSOP  
VSSOP  
3.4  
3.4  
LP2951ACMMX-3.0  
3.4  
LP2951ACMMX-3.0/NOP VSSOP  
B
3.4  
LP2951ACMMX-3.3  
VSSOP  
DGK  
DGK  
8
8
3500  
3500  
330.0  
330.0  
12.4  
12.4  
5.3  
5.3  
3.4  
3.4  
1.4  
1.4  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
LP2951ACMMX-3.3/NOP VSSOP  
B
LP2951ACMMX/NOPB VSSOP  
DGK  
D
8
8
3500  
2500  
330.0  
330.0  
12.4  
12.4  
5.3  
6.5  
3.4  
5.4  
1.4  
2.0  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
LP2951ACMX  
SOIC  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-May-2013  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP2951ACMX-3.0  
LP2951ACMX-3.0/NOPB  
LP2951ACMX-3.3  
SOIC  
SOIC  
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500  
2500  
2500  
2500  
2500  
1000  
1000  
4500  
4500  
4500  
4500  
1000  
1000  
1000  
1000  
1000  
3500  
3500  
3500  
3500  
3500  
3500  
2500  
2500  
2500  
2500  
2500  
2500  
1000  
1000  
1000  
1000  
1000  
1000  
4500  
4500  
4500  
4500  
4500  
4500  
330.0  
330.0  
330.0  
330.0  
330.0  
178.0  
178.0  
330.0  
330.0  
330.0  
330.0  
178.0  
178.0  
178.0  
178.0  
178.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
6.5  
6.5  
6.5  
6.5  
6.5  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
6.5  
6.5  
6.5  
6.5  
6.5  
6.5  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
5.4  
5.4  
5.4  
5.4  
5.4  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
5.4  
5.4  
5.4  
5.4  
5.4  
5.4  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
2.0  
2.0  
2.0  
2.0  
2.0  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
1.3  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
D
SOIC  
D
LP2951ACMX-3.3/NOPB  
LP2951ACMX/NOPB  
LP2951ACSD  
SOIC  
D
SOIC  
D
WSON  
WSON  
WSON  
WSON  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
D
LP2951ACSD/NOPB  
LP2951ACSDX  
LP2951ACSDX-3.3  
LP2951ACSDX-3.3/NOPB WSON  
LP2951ACSDX/NOPB  
LP2951CMM  
WSON  
VSSOP  
VSSOP  
LP2951CMM-3.0  
LP2951CMM-3.0/NOPB VSSOP  
LP2951CMM-3.3/NOPB VSSOP  
LP2951CMM/NOPB  
LP2951CMMX  
VSSOP  
VSSOP  
VSSOP  
LP2951CMMX-3.0  
LP2951CMMX-3.0/NOPB VSSOP  
LP2951CMMX-3.3 VSSOP  
LP2951CMMX-3.3/NOPB VSSOP  
LP2951CMMX/NOPB  
LP2951CMX  
VSSOP  
SOIC  
LP2951CMX-3.0  
SOIC  
D
LP2951CMX-3.0/NOPB  
LP2951CMX-3.3  
SOIC  
D
SOIC  
D
LP2951CMX-3.3/NOPB  
LP2951CMX/NOPB  
LP2951CSD  
SOIC  
D
SOIC  
D
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
LP2951CSD-3.0  
LP2951CSD-3.0/NOPB  
LP2951CSD-3.3  
LP2951CSD-3.3/NOPB  
LP2951CSD/NOPB  
LP2951CSDX  
LP2951CSDX-3.0  
LP2951CSDX-3.0/NOPB WSON  
LP2951CSDX-3.3 WSON  
LP2951CSDX-3.3/NOPB WSON  
LP2951CSDX/NOPB WSON  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-May-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP2950CDTX-3.0/NOPB  
LP2950CDTX-3.3/NOPB  
LP2950CDTX-5.0  
TO-252  
TO-252  
TO-252  
TO-252  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
SOIC  
NDP  
NDP  
NDP  
NDP  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
D
3
3
3
3
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500  
2500  
2500  
2500  
1000  
1000  
1000  
1000  
1000  
1000  
3500  
3500  
3500  
3500  
3500  
3500  
2500  
2500  
2500  
2500  
367.0  
367.0  
367.0  
367.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
35.0  
38.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP2950CDTX-5.0/NOPB  
LP2951ACMM  
LP2951ACMM-3.0  
LP2951ACMM-3.0/NOPB  
LP2951ACMM-3.3  
LP2951ACMM-3.3/NOPB  
LP2951ACMM/NOPB  
LP2951ACMMX  
LP2951ACMMX-3.0  
LP2951ACMMX-3.0/NOPB  
LP2951ACMMX-3.3  
LP2951ACMMX-3.3/NOPB  
LP2951ACMMX/NOPB  
LP2951ACMX  
LP2951ACMX-3.0  
SOIC  
D
LP2951ACMX-3.0/NOPB  
LP2951ACMX-3.3  
SOIC  
D
SOIC  
D
Pack Materials-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-May-2013  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP2951ACMX-3.3/NOPB  
LP2951ACMX/NOPB  
LP2951ACSD  
SOIC  
SOIC  
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500  
2500  
1000  
1000  
4500  
4500  
4500  
4500  
1000  
1000  
1000  
1000  
1000  
3500  
3500  
3500  
3500  
3500  
3500  
2500  
2500  
2500  
2500  
2500  
2500  
1000  
1000  
1000  
1000  
1000  
1000  
4500  
4500  
4500  
4500  
4500  
4500  
367.0  
367.0  
210.0  
210.0  
367.0  
367.0  
367.0  
367.0  
210.0  
210.0  
210.0  
210.0  
210.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
185.0  
185.0  
367.0  
367.0  
367.0  
367.0  
185.0  
185.0  
185.0  
185.0  
185.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
D
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
SOIC  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
D
LP2951ACSD/NOPB  
LP2951ACSDX  
LP2951ACSDX-3.3  
LP2951ACSDX-3.3/NOPB  
LP2951ACSDX/NOPB  
LP2951CMM  
LP2951CMM-3.0  
LP2951CMM-3.0/NOPB  
LP2951CMM-3.3/NOPB  
LP2951CMM/NOPB  
LP2951CMMX  
LP2951CMMX-3.0  
LP2951CMMX-3.0/NOPB  
LP2951CMMX-3.3  
LP2951CMMX-3.3/NOPB  
LP2951CMMX/NOPB  
LP2951CMX  
LP2951CMX-3.0  
SOIC  
D
LP2951CMX-3.0/NOPB  
LP2951CMX-3.3  
SOIC  
D
SOIC  
D
LP2951CMX-3.3/NOPB  
LP2951CMX/NOPB  
LP2951CSD  
SOIC  
D
SOIC  
D
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
NGT  
LP2951CSD-3.0  
LP2951CSD-3.0/NOPB  
LP2951CSD-3.3  
LP2951CSD-3.3/NOPB  
LP2951CSD/NOPB  
LP2951CSDX  
LP2951CSDX-3.0  
LP2951CSDX-3.0/NOPB  
LP2951CSDX-3.3  
LP2951CSDX-3.3/NOPB  
LP2951CSDX/NOPB  
Pack Materials-Page 4  
MECHANICAL DATA  
NDP0003B  
TD03B (Rev F)  
www.ti.com  
MECHANICAL DATA  
NGT0008A  
SDC08A (Rev A)  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
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and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
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voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
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of any TI components in safety-critical applications.  
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help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
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have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
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microcontroller.ti.com  
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OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

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