LP2981AIM5X-2.7/NOPB [TI]

2.7V FIXED POSITIVE LDO REGULATOR, 0.375V DROPOUT, PDSO5, SOT-23, SOP-5;
LP2981AIM5X-2.7/NOPB
型号: LP2981AIM5X-2.7/NOPB
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2.7V FIXED POSITIVE LDO REGULATOR, 0.375V DROPOUT, PDSO5, SOT-23, SOP-5

光电二极管 输出元件 调节器
文件: 总24页 (文件大小:1180K)
中文:  中文翻译
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LP2981-N  
www.ti.com  
SNOS773K MARCH 2000REVISED APRIL 2013  
LP2981-N Micropower 100 mA Ultra Low-Dropout Regulator in SOT-23 Package  
Check for Samples: LP2981-N  
1
FEATURES  
DESCRIPTION  
The LP2981-N is a 100 mA, fixed-output voltage  
regulator designed specifically to meet the  
requirements of battery-powered applications.  
2
Ultra Low Dropout Voltage  
Output Voltage Accuracy 0.75% (A Grade)  
Specified 100 mA Output Current  
Using an optimized VIP (Vertically Integrated PNP)  
< 1 μA Quiescent Current when Shutdown  
Low Ground Pin Current at All Load Currents  
High Peak Current Capability (300 mA Typical)  
Wide Supply Voltage Range (16V Max)  
Fast Dynamic Response to Line and Load  
Low ZOUT Over Wide Frequency Range  
Overtemperature/Overcurrent Protection  
40°C to +125°C Junction Temperature Range  
process,  
the  
LP2981-N  
delivers  
unequaled  
performance in all specifications critical to battery-  
powered designs:  
Dropout Voltage. Typically 200 mV @ 100 mA load,  
and 7 mV @ 1 mA load.  
Ground Pin Current. Typically 600 μA @ 100 mA  
load, and 80 μA @ 1 mA load.  
Sleep Mode. Less than 1 μA quiescent current when  
ON/OFF pin is pulled low.  
APPLICATIONS  
Precision Output. 0.75% tolerance output voltages  
available (A grade).  
Cellular Phone  
Nine voltage options, from 2.5V to 5.0V, are available  
as standard products.  
Palmtop/Laptop Computer  
Personal Digital Assistant (PDA)  
Camcorder, Personal Stereo, Camera  
Block Diagram  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2013, Texas Instruments Incorporated  
LP2981-N  
SNOS773K MARCH 2000REVISED APRIL 2013  
www.ti.com  
Connection Diagram  
Figure 1. 5-Lead Small Outline Package (SOT-23)  
Top View  
See Package Number DBV0005A  
PIN DESCRIPTIONS  
Pin  
Number  
Name  
Function  
VIN  
GND  
1
2
3
4
5
Input Voltage  
Common Ground (device substrate)  
Logic high enable input  
ON/OFF  
N/C  
Post package trim - do not connect to this pin  
Regulated output voltage  
VOUT  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
Storage Temperature Range  
Operating Junction Temperature Range  
Lead Temperature (Soldering, 5 sec.)  
ESD Rating(3)  
65°C to +150°C  
40°C to +125°C  
260°C  
2 kV  
Power Dissipation(4)  
Internally Limited  
0.3V to +16V  
2.1V to +16V  
Input Supply Voltage (Survival)  
Input Supply Voltage (Operating)  
Shutdown Input Voltage (Survival)  
Output Voltage (Survival(5)  
IOUT (Survival)  
0.3V to +16V  
0.3V to +9V  
)
Short Circuit Protected  
0.3V to +16V  
Input-Output Voltage (Survival,(6)  
)
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply  
when operating the device outside of its rated operating conditions.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(3) The ESD rating of pins 3 and 4 for the SOT-23 package is 1 kV.  
(4) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal  
resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated  
using:  
The value of θJA for the SOT-23 package is 220°C/W. Exceeding the maximum allowable power dissipation will cause excessive die  
temperature, and the regulator will go into thermal shutdown.  
(5) If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2981-N output must be diode-clamped  
to ground.  
(6) The output PNP structure contains a diode between the VIN and VOUT terminals that is normally reverse-biased. Reversing the polarity  
from VIN to VOUT will turn on this diode (see APPLICATION HINTS).  
2
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SNOS773K MARCH 2000REVISED APRIL 2013  
ELECTRICAL CHARACTERISTICS  
Limits in standard typeface are for TJ = 25°C, and limits in boldface type applyover the full operating temperature range.  
Unless otherwise specified: VIN = VO(NOM) + 1V, CIN = 1 μF, IL = 1 mA, COUT = 4.7 μF,VON/OFF = 2V.  
Symbol  
Parameter  
Conditions  
Typ  
LP2981AI-XX(1)  
LP2981I-XX(1)  
Units  
Min  
0.75  
1.0  
2.5  
Max  
0.75  
1.0  
Min  
1.25  
2.0  
3.5  
Max  
1.25  
2.0  
ΔVO  
Output Voltage Tolerance  
IL = 1mA  
1 mA < IL < 100 mA  
%VNOM  
%/V  
2.5  
3.5  
Output Voltage  
Line Regulation  
Dropout Voltage(2)  
VO(NOM) + 1V  
VIN 16V  
IL = 0  
0.007  
1
0.014  
0.032  
3
0.014  
0.032  
3
VIN–VO  
mV  
5
5
IL = 1 mA  
IL = 25 mA  
IL = 100 mA  
IL = 0  
7
10  
10  
15  
15  
70  
100  
150  
250  
375  
95  
100  
150  
250  
375  
95  
200  
65  
IGND  
Ground Pin Current  
μA  
125  
110  
170  
300  
550  
800  
1500  
0.8  
125  
110  
170  
300  
550  
800  
1500  
0.8  
IL = 1 mA  
IL = 25 mA  
IL = 100 mA  
80  
200  
600  
VON/OFF < 0.3V  
VON/OFF < 0.15V  
High = O/P ON  
Low = O/P OFF  
VON/OFF = 0  
0.01  
0.05  
1.4  
2
2
VON/OFF  
ON/OFF Input Voltage(3)  
ON/OFF Input Current  
1.6  
1.6  
V
0.50  
0.01  
5
0.15  
1  
0.15  
1  
ION/OFF  
μA  
VON/OFF = 5V  
15  
15  
IO(PK)  
en  
Peak Output Current  
Output Noise  
V
OUT VO(NOM) 5%  
400  
160  
150  
150  
mA  
BW = 300 Hz–50 kHz,  
COUT = 10 μF  
μV  
Voltage (RMS)  
Ripple Rejection  
f = 1 kHz  
63  
dB  
COUT = 10 μF  
IO(MAX)  
Short Circuit Current  
RL = 0 (Steady State)(4)  
150  
mA  
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using  
Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).  
(2) Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a  
1V differential.  
(3) The ON/OFF inputs must be properly driven to prevent misoperation. For details, refer to APPLICATION HINTS.  
(4) See TYPICAL PERFORMANCE CHARACTERISTICS curve(s).  
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TYPICAL APPLICATION CIRCUIT  
*ON/OFF input must be actively terminated. Tie to VIN if this function is not to be used.  
**Minimum Output Capacitance is shown to insure stability over full load current range. More capacitance provides  
superior dynamic performance and additional stability margin (see APPLICATION HINTS).  
***Do not make connections to this pin.  
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LP2981-N  
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SNOS773K MARCH 2000REVISED APRIL 2013  
TYPICAL PERFORMANCE CHARACTERISTICS  
Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF all voltage options, ON/OFF pin tied to  
VIN.  
Output Voltage vs  
Temperature  
Output Voltage vs  
Temperature  
Figure 2.  
Figure 3.  
Output Voltage vs  
Temperature  
Dropout Characteristics  
Figure 4.  
Figure 5.  
Dropout Characteristics  
Dropout Characteristics  
Figure 6.  
Figure 7.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF all voltage options, ON/OFF pin tied to  
VIN.  
Dropout Voltage vs  
Temperature  
Dropout Voltage vs  
Load Current  
Figure 8.  
Figure 9.  
Ground Pin Current vs  
Temperature  
Ground Pin Current vs  
Load Current  
Figure 10.  
Figure 11.  
Input Current vs VIN  
Input Current vs VIN  
Figure 12.  
Figure 13.  
6
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF all voltage options, ON/OFF pin tied to  
VIN.  
Line Transient Response  
Line Transient Response  
Figure 14.  
Figure 15.  
Load Transient Response  
Load Transient Response  
Figure 16.  
Figure 17.  
Load Transient Response  
Load Transient Response  
Figure 18.  
Figure 19.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF all voltage options, ON/OFF pin tied to  
VIN.  
Instantaneous Short Circuit  
Current vs Temperature  
Short Circuit Current  
Figure 20.  
Figure 21.  
Instantaneous Short Circuit  
Current vs Output Voltage  
Short Circuit Current  
Figure 22.  
Figure 23.  
Output Impedance vs  
Frequency  
Ripple Rejection  
Figure 24.  
Figure 25.  
8
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SNOS773K MARCH 2000REVISED APRIL 2013  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF all voltage options, ON/OFF pin tied to  
VIN.  
Output Impedance vs  
Output Noise Density  
Frequency  
Figure 26.  
Figure 27.  
Input to Output Leakage  
vs Temperature  
Output Reverse Leakage vs  
Temperature  
Figure 28.  
Figure 29.  
Turn-On Waveform  
Turn-Off Waveform  
Figure 30.  
Figure 31.  
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7 μF, CIN = 1 μF all voltage options, ON/OFF pin tied to  
VIN.  
ON/OFF Pin Current vs  
VON/OFF  
ON/OFF Threshold  
vs Temperature  
Figure 32.  
Figure 33.  
10  
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SNOS773K MARCH 2000REVISED APRIL 2013  
APPLICATION HINTS  
EXTERNAL CAPACITORS  
Like any low-dropout regulator, the external capacitors used with the LP2981-N must be carefully selected to  
assure regulator loop stability.  
Input Capacitor:  
An input capacitor whose value is 1 μF is required with the LP2981-N (amount of capacitance can be increased  
without limit).  
This capacitor must be located a distance of not more than 0.5from the input pin of the LP2981-N and returned  
to a clean analog ground. Any good quality ceramic or tantalum can be used for this capacitor.  
Output Capacitor:  
The output capacitor must meet both the requirement for minimum amount of capacitance and E.S.R. (equivalent  
series resistance) value. Curves are provided which show the allowable ESR range as a function of load current  
for various output voltages and capacitor values (refer to Figure 34, Figure 35, Figure 36, and Figure 37).  
NOTE  
Important: The output capacitor must maintain its ESR in the stable region over the full  
operating temperature range to assure stability. Also, capacitor tolerance and variation  
with temperature must be considered to assure the minimum amount of capacitance is  
provided at all times.  
This capacitor should be located not more than 0.5from the output pin of the LP2981-N and returned to a clean  
analog ground.  
CAPACITOR CHARACTERISTICS  
Tantalum:  
Tantalum capacitors are the best choice for use with the LP2981-N. Most good quality tantalums can be used  
with the LP2981-N, but check the manufacturer's data sheet to be sure the ESR is in range.  
It is important to remember that ESR increases at lower temperatures and a capacitor that is near the upper limit  
for stability at room temperature can cause instability when it gets cold.  
In applications which must operate at very low temperatures, it may be necessary to parallel the output tantalum  
capacitor with a ceramic capacitor to prevent the ESR from going up too high (see below for important  
information on ceramic capacitors).  
Ceramic:  
Ceramic capacitors are not recommended for use at the output of the LP2981-N. This is because the ESR of a  
ceramic can be low enough to go below the minimum stable value for the LP2981-N. A 2.2 μF ceramic was  
measured and found to have an ESR of about 15 mΩ, which is low enough to cause oscillations.  
If a ceramic capacitor is used on the output, a 1Ω resistor should be placed in series with the capacitor.  
Aluminum:  
Because of large physical size, aluminum electrolytics are not typically used with the LP2981-N. They must meet  
the same ESR requirements over the operating temperature range, more difficult because of their steep increase  
at cold temperature.  
An aluminum electrolytic can exhibit an ESR increase of as much as 50X when going from 20°C to 40°C. Also,  
some aluminum electrolytics are not operational below 25°C because the electrolyte can freeze.  
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Figure 34. 5V/3.3 μF ESR Curves  
Figure 35. 5V/10 μF ESR Curves  
Figure 36. 3V/3.3 μF ESR Curves  
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Figure 37. 3V/10 μF ESR Curves  
REVERSE CURRENT PATH  
The internal PNP power transistor used as the pass element in the LP2981-N has an inherent diode connected  
between the regulator output and input. During normal operation (where the input voltage is higher than the  
output) this diode is reverse biased (See Figure 38).  
LP2981-N  
V
V
OUT  
IN  
PNP  
GND  
Figure 38. LP2981-N Reverse Current Path  
However, if the input voltage is more than a VBE below the output voltage, this diode will turn ON and current will  
flow into the regulator output. In such cases, a parasitic SCR can latch which will allow a high current to flow into  
the VIN pin and out the ground pin, which can damage the part.  
The internal diode can also be turned on if the input voltage is abruptly stepped down to a voltage which is a VBE  
below the output voltage.  
In any application where the output voltage may be higher than the input voltage, an external Schottky diode  
must be connected from VIN to VOUT (cathode on VIN, anode on VOUT. See Figure 39), to limit the reverse voltage  
across the LP2981-N to 0.3V (see Absolute Maximum Ratings)  
SCHOTTKY DIODE  
LP2981-N  
V
V
OUT  
IN  
PNP  
GND  
Figure 39. Adding External Schottky Diode Protection  
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ON/OFF INPUT OPERATION  
The LP2981-N is shut off by pulling the ON/OFF input low, and turned on by driving the input high. If this feature  
is not to be used, the ON/OFF input should be tied to VIN to keep the regulator on at all times (the ON/OFF input  
must not be left floating).  
To ensure proper operation, the signal source used to drive the ON/OFF input must be able to swing above and  
below the specified turn-on/turn-off voltage thresholds which specify an ON or OFF state (see ELECTRICAL  
CHARACTERISTICS).  
The ON/OFF signal may come from either a totem-pole output, or an open-collector output with pull-up resistor to  
the LP2981-N input voltage or another logic supply. The high-level voltage may exceed the LP2981-N input  
voltage, but must remain within the Absolute Maximum Ratings for the ON/OFF pin.  
It is also important that the turn-on/turn-off voltage signals applied to the ON/OFF input have a slew rate which is  
greater than 40 mV/μs.  
NOTE  
IMPORTANT: The regulator shutdown function will not operate correctly if a slow-moving  
signal is applied to the ON/OFF input.  
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REVISION HISTORY  
Changes from Revision J (April 2013) to Revision K  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 14  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
1000  
1000  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LP2981AIM5-2.5  
NRND  
ACTIVE  
SOT-23  
SOT-23  
DBV  
5
5
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0CA  
L0CA  
LP2981AIM5-2.5/NOPB  
DBV  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981AIM5-3.0/NOPB  
ACTIVE  
SOT-23  
DBV  
5
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L05A  
LP2981AIM5-3.3  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L04A  
L04A  
LP2981AIM5-3.3/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981AIM5-3.6  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0JA  
L0JA  
LP2981AIM5-3.6/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981AIM5-5.0  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L03A  
L03A  
LP2981AIM5-5.0/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981AIM5X-3.0/NOPB  
ACTIVE  
SOT-23  
DBV  
5
3000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L05A  
LP2981AIM5X-3.3  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L04A  
L04A  
LP2981AIM5X-3.3/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981AIM5X-3.6/NOPB  
ACTIVE  
SOT-23  
DBV  
5
3000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L0JA  
LP2981AIM5X-5.0  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L03A  
L03A  
LP2981AIM5X-5.0/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981IM5-2.5  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L0CB  
L0CB  
LP2981IM5-2.5/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981IM5-3.0/NOPB  
ACTIVE  
SOT-23  
DBV  
5
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L05B  
LP2981IM5-3.3  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L04B  
L04B  
LP2981IM5-3.3/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LP2981IM5-3.6/NOPB  
ACTIVE  
SOT-23  
DBV  
5
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L0JB  
LP2981IM5-5.0  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L03B  
L03B  
LP2981IM5-5.0/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981IM5X-3.0/NOPB  
ACTIVE  
SOT-23  
DBV  
5
3000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L05B  
LP2981IM5X-3.3  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L04B  
L04B  
LP2981IM5X-3.3/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP2981IM5X-3.6/NOPB  
ACTIVE  
SOT-23  
DBV  
5
3000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
L0JB  
LP2981IM5X-5.0  
NRND  
SOT-23  
SOT-23  
DBV  
DBV  
5
5
3000  
3000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
L03B  
L03B  
LP2981IM5X-5.0/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP2981AIM5-2.5  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
1000  
1000  
1000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
LP2981AIM5-2.5/NOPB SOT-23  
LP2981AIM5-3.0/NOPB SOT-23  
LP2981AIM5-3.3  
LP2981AIM5-3.3/NOPB SOT-23  
LP2981AIM5-3.6 SOT-23  
LP2981AIM5-3.6/NOPB SOT-23  
LP2981AIM5-5.0 SOT-23  
SOT-23  
LP2981AIM5-5.0/NOPB SOT-23  
LP2981AIM5X-3.0/NOPB SOT-23  
LP2981AIM5X-3.3  
SOT-23  
LP2981AIM5X-3.3/NOPB SOT-23  
LP2981AIM5X-3.6/NOPB SOT-23  
LP2981AIM5X-5.0  
SOT-23  
LP2981AIM5X-5.0/NOPB SOT-23  
LP2981IM5-2.5  
SOT-23  
SOT-23  
SOT-23  
LP2981IM5-2.5/NOPB  
LP2981IM5-3.0/NOPB  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP2981IM5-3.3  
LP2981IM5-3.6/NOPB  
LP2981IM5-5.0  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
LP2981IM5-5.0/NOPB  
LP2981IM5X-3.0/NOPB SOT-23  
LP2981IM5X-3.3 SOT-23  
LP2981IM5X-3.3/NOPB SOT-23  
LP2981IM5X-3.6/NOPB SOT-23  
LP2981IM5X-5.0  
SOT-23  
LP2981IM5X-5.0/NOPB SOT-23  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP2981AIM5-2.5  
LP2981AIM5-2.5/NOPB  
LP2981AIM5-3.0/NOPB  
LP2981AIM5-3.3  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
1000  
1000  
1000  
1000  
1000  
1000  
1000  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP2981AIM5-3.3/NOPB  
LP2981AIM5-3.6  
LP2981AIM5-3.6/NOPB  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Sep-2013  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP2981AIM5-5.0  
LP2981AIM5-5.0/NOPB  
LP2981AIM5X-3.0/NOPB  
LP2981AIM5X-3.3  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
3000  
3000  
3000  
3000  
3000  
3000  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP2981AIM5X-3.3/NOPB  
LP2981AIM5X-3.6/NOPB  
LP2981AIM5X-5.0  
LP2981AIM5X-5.0/NOPB  
LP2981IM5-2.5  
LP2981IM5-2.5/NOPB  
LP2981IM5-3.0/NOPB  
LP2981IM5-3.3  
LP2981IM5-3.6/NOPB  
LP2981IM5-5.0  
LP2981IM5-5.0/NOPB  
LP2981IM5X-3.0/NOPB  
LP2981IM5X-3.3  
LP2981IM5X-3.3/NOPB  
LP2981IM5X-3.6/NOPB  
LP2981IM5X-5.0  
LP2981IM5X-5.0/NOPB  
Pack Materials-Page 3  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
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anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
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of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
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Applications  
Audio  
www.ti.com/audio  
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Copyright © 2013, Texas Instruments Incorporated  

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