LP2985AITP-1.8 [TI]
Micropower 150 mA Low-Noise Low-Dropout Regulator; 微150毫安低噪声低压降稳压器
| 型号： | LP2985AITP-1.8 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Micropower 150 mA Low-Noise Low-Dropout Regulator |
| 文件： | 总17页 (文件大小：933K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 2004
LP2985LV
Micropower 150 mA Low-Noise Low-Dropout Regulator
in SOT-23 and micro SMD packages for Applications
with Output Voltages ≤ 2.3V
Designed for Use with Very Low ESR Output Capacitors
General Description
Features
n Guaranteed 150 mA output current
n Smallest possible size (micro SMD)
n Requires minimum external components
n Stable with low-ESR output capacitor
The LP2985LV is a 150 mA, fixed-output voltage regulator
designed to providehigh performance and low noise in ap-
<
plications requiring output voltages 2.3V.
™
Using an optimized VIP (Vertically Integrated PNP) pro-
cess, the LP2985LV delivers unequalled performance in all
specifications critical to battery-powered designs:
<
n
1 µA quiescent current when shut down
n Low ground pin current at all loads
n Output voltage accuracy 1% (A Grade)
n High peak current capability
@
Ground Pin Current: Typically 825 µA 150 mA load, and
@
75 µA 1 mA load.
Enhanced Stability: The LP2985LV is stable with output
capacitor ESR as low as 5 mΩ, which allows the use of
ceramic capacitors on the output.
n Wide supply voltage range (16V max)
n Low ZOUT: 0.3Ω typical (10 Hz to 1 MHz)
n Overtemperature/overcurrent protection
n −40˚C to +125˚C junction temperature range
n Custom voltages available
Sleep Mode: Less than 1 µA quiescent current when ON/
OFF pin is pulled low.
Smallest Possible Size: micro SMD package uses absolute
minimum board space.
Applications
Precision Output: 1% tolerance output voltages available
(A grade).
n Cellular Phone
n Palmtop/Laptop Computer
n Personal Digital Assistant (PDA)
n Camcorder, Personal Stereo, Camera
Low Noise: By adding a 10 nF bypass capacitor, output
noise can be reduced to 30 µV (typical).
Block Diagram
10129501
™
VIP is a trademark of National Semiconductor Corporation.
© 2005 National Semiconductor Corporation
DS101295
www.national.com
Basic Application Circuit
10129502
*ON/OFF input must be actively terminated. Tie to V if this function is not to be used.
IN
**Minimum capacitance is shown to ensure stability (may be increased without limit). Ceramic capacitor required for output (see Application Hints).
***Reduces output noise (may be omitted if application is not noise critical). Use ceramic or film type with very low leakage current (see Application Hints).
Connection Diagrams
5-Lead Small Outline Package (M5)
micro SMD, 5 Bump Package (BPA05 & BLA05)
10129503
Top View
See NS Package Number MF05A
For ordering information see Table 1
10129523
Note: The actual physical placement of the package marking will vary from
part to part. Package marking contains date code and lot traceability
information, and will vary considerably. Package marking does not correlate
to device type.
Top View
See NS Package Number BPA05 & BLA05
Pin Descrption
Name
Pin Number
micro SMD
Function
SOT-23
VIN
1
2
3
4
5
C3
A1
A3
B2
C1
Input Voltage
GND
Common Ground (device substrate)
Logic high enable input
ON/OFF
BYPASS
VOUT
Bypass capacitor for low noise operation
Regulated output voltage
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2
Ordering Information
TABLE 1. Package Marking and Ordering Information
Package
Order Information
Output Voltage (V)
Grade
Supplied as:
Marking
5-Lead Small Outline Package (M5)
1.35
1.35
1.35
1.35
1.5
1.5
1.5
1.5
1.8
1.8
1.8
1.8
2.0
2.0
2.0
2.0
A
A
LP2985AIM5X-135
LP2985AIM5-135
LP2985IM5X-135
LP2985IM5-135
LP2985AIM5X-1.5
LP2985AIM5-1.5
LP2985IM5X-1.5
LP2985IM5-1.5
LF7A
LF7A
LF7B
LF7B
LCHA
LCHA
LCHB
LCHB
LAYA
LAYA
LAYB
LAYB
LCDA
LCDA
LCDB
LCDB
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
3000 Units on Tape and Reel
1000 Units on Tape and Reel
STD
STD
A
A
STD
STD
A
LP2985AIM5X-1.8
LP2985AIM5-1.8
LP2985IM5X-1.8
LP2985IM5-1.8
A
STD
STD
A
LP2985AIM5X-2.0
LP2985AIM5-2.0
LP2985IM5X-2.0
LP2985IM5-2.0
A
STD
STD
micro SMD, 5 Bump Package (BPA05 - 170 µm ball)
1.5
1.5
1.5
1.5
1.8
1.8
1.8
1.8
A
A
LP2985AIBP-1.5
LP2985AIBPX-1.5
LP2985IBP-1.5
LP2985IBPX-1.5
LP2985AIBP-1.8
LP2985AIBPX-1.8
LP2985IBP-1.8
LP2985IBPX-1.8
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
STD
STD
A
A
STD
STD
micro SMD, 5 Bump Package (BLA05 - 300 µm ball)
1.8
1.8
1.8
1.8
A
LP2985AIBL-1.8
LP2985AIBLX-1.8
LP2985IBL-1.8
LP2985IBLX-1.8
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
A
STD
STD
micro SMD, 5 Bump Package (TPA05 - 170 µm ball)
1.5
1.5
1.5
1.5
1.8
1.8
1.8
1.8
A
A
LP2985AITP-1.5
LP2985AITPX-1.5
LP2985ITP-1.5
LP2985ITPX-1.5
LP2985AITP-1.8
LP2985AITPX-1.8
LP2985ITP-1.8
LP2985ITPX-1.8
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
250 Units on Tape and Reel
3000 Units on Tape and Reel
STD
STD
A
A
STD
STD
3
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Absolute Maximum Ratings (Note 1)
Input Supply Voltage (Survival)
Input Supply Voltage (Operating)
Shutdown Input Voltage (Survival)
Output Voltage (Survival, (Note 4))
IOUT (Survival)
−0.3V to +16V
2.2V to +16V
−0.3V to +16V
−0.3V to +9V
Short Circuit
Protected
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range
Operating Junction Temperature
Range
−65˚C to +150˚C
−40˚C to +125˚C
260˚C
Input-Output Voltage (Survival,
(Note 5))
−0.3V to +16V
Lead Temp. (Soldering, 5 sec.)
ESD Rating (Note 2)
2 kV
Power Dissipation (Note 3)
Internally Limited
Electrical Characteristics (Note 10)
Limits in standard typeface are for TJ = 25˚C. and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: VIN = VO(NOM) + 1V, IL = 1 mA, CIN = 1 µF, COUT = 4.7 µF, VON/OFF = 2V.
LP2985AI-X.X
LP2985I-X.X
Symbol
∆VO
Parameter
Conditions
IL = 1 mA
Typ
(Note 6)
(Note 6)
Units
Min
−1.0
−1.5
−2.5
−2.5
−3.5
Max
1.0
Min
−1.5
−2.5
−3.5
−3.0
−4.0
Max
1.5
Output Voltage
Tolerance
1 mA ≤ IL ≤ 50 mA
1.5
2.5
2.5
3.5
%VNOM
1 mA ≤ IL ≤ 150 mA
VO(NOM)+1V ≤ VIN ≤ 16V
2.5
3.0
3.5
4.0
Output Voltage
0.007
0.014
0.014
%/V
Line Regulation
Ground Pin Current
0.032
0.032
IGND
IL = 0
65
75
95
125
110
170
220
400
500
900
1200
2000
0.8
95
125
110
170
220
400
500
900
1200
2000
0.8
IL = 1 mA
IL = 10 mA
IL = 50 mA
IL = 150 mA
120
300
825
µA
<
VON/OFF 0.3V
0.01
0.05
2.05
<
VON/OFF 0.15V
2
2
V
IN(min)
Minimum Input Voltage
Required To maintain
Output Regulation
(Note 9)
2.20
2.20
V
IL = 50mA
120
280
150
250
350
600
150
250
350
600
Dropout Voltage
(Note 9)
VIN - VOUT
mV
IL = 150mA
VON/OFF
ION/OFF
en
ON/OFF Input Voltage
(Note 7)
High = O/P ON
Low = O/P OFF
VON/OFF = 0
1.4
0.55
0.01
5
1.6
1.6
V
0.15
−2
0.15
−2
ON/OFF Input Current
µA
VON/OFF = 5V
15
15
Output Noise
BW = 300 Hz to 50 kHz,
COUT = 10 µF
Voltage (RMS)
30
µV
CBYPASS = 10 nF
VOUT = 1.8V
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4
Electrical Characteristics (Note 10) (Continued)
Limits in standard typeface are for TJ = 25˚C. and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: VIN = VO(NOM) + 1V, IL = 1 mA, CIN = 1 µF, COUT = 4.7 µF, VON/OFF = 2V.
LP2985AI-X.X
LP2985I-X.X
Symbol
Parameter
Conditions
Typ
(Note 6)
(Note 6)
Units
Min
Max
Min
Max
Ripple Rejection
f = 1 kHz, CBYPASS = 10 nF
COUT = 10 µF
45
dB
IO(SC)
IO(PK)
Short Circuit Current
Peak Output Current
RL = 0 (Steady State)
(Note 8)
400
350
mA
mA
VOUT ≥ Vo(NOM) −5%
Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the
device outside of its rated operating conditions.
Note 2: The ESD rating of pins 3 and 4 for the SOT-23 package, or pins 5 and 2 for the micro SMD package, is 1 kV.
Note 3: The maximum allowable power dissipation is a function of the maximum junction temperature, T (MAX), the junction-to-ambient thermal resistance, θ
,
J-A
J
and the ambient temperature, T . The maximum allowable power dissipation at any ambient temperture is calculated using:
A
Where the value of θ for the SOT-23 package is 220˚C/W in a typical PC board mounting. Exceeding the maximum allowable dissipation will cause excessive die
J-A
temperature, and the regulator will go into thermal shutdown.
Note 4: If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2985LV output must be diode-clamped to ground.
Note 5: The output PNP structure contains a diode between the V to V
terminals that is normally reverse-biased. Reversing the polarity from V to V
will
OUT
IN
OUT
IN
turn on this diode, and possibly damage the device (See Application Hints).
Note 6: Limits are 100% production tested at 25˚C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National’s Average Outgoing Quality Level (AOQL).
Note 7: The ON/OFF input must be properly driven to prevent possible misoperation. For details, refer to Application Hints.
>
Note 8: The LP2985LV has foldback current limiting which allows a high peak current when V
is forced to ground (see Typical Performance Characteristics curves).
0.5V, and then reduces the maximum output current as V
OUT
OUT
Note 9: V must be the greater of 2.2V or V
+ Dropout Voltage to maintain output regulation. Dropout Voltage is defined as the input to output differential
OUT(nom)
IN
at which the output voltage drops 2% below ther value measured with a 1V differential.
Note 10: Exposing the micro SMD device to direct sunlight will cause misoperation. See Application Hints for additional information.
5
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Typical Performance Characteristics Unless otherwise specified: CIN = 1µF, COUT = 4.7µF,
VIN = VOUT(NOM) +1, VOUT = 1.8V, TA = 25˚C, ON/OFF pin is tied to VIN
VOUT vs Temperature
Short-Circuit Current
Ripple Rejection
Short-Circuit Current
10129516
10129507
Short-Circuit Current vs Output Voltage
10129517
10129518
Ripple Rejection
COUT = 4.7µF, Bypass = 10nF
COUT = 4.7µF, No Bypass
10129525
10129526
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6
Typical Performance Characteristics Unless otherwise specified: CIN = 1µF, COUT = 4.7µF,
VIN = VOUT(NOM) +1, VOUT = 1.8V, TA = 25˚C, ON/OFF pin is tied to VIN (Continued)
Output Impedance vs Frequency
Output Impedance vs Frequency
10129527
10129532
Noise Density
Noise Density
10129533
10129537
Ground Pin vs Load Current
Minimum Input Voltage vs Temperature
10129513
10129509
7
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Typical Performance Characteristics Unless otherwise specified: CIN = 1µF, COUT = 4.7µF,
VIN = VOUT(NOM) +1, VOUT = 1.8V, TA = 25˚C, ON/OFF pin is tied to VIN (Continued)
Minimum Input Voltage vs Temperature
Input Current vs VIN
10129541
10129510
Input Current vs VIN
Input Current vs VIN
10129511
10129512
Ground Pin Current vs Temperature
Instantaneous Short Circuit Current
10129515
10129514
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Typical Performance Characteristics Unless otherwise specified: CIN = 1µF, COUT = 4.7µF,
VIN = VOUT(NOM) +1, VOUT = 1.8V, TA = 25˚C, ON/OFF pin is tied to VIN (Continued)
Output Characteristics
Load Transient
10129542
10129508
Load Transient
Load Transient
10129543
10129544
Line Transient
Line Transient
10129545
10129546
9
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Typical Performance Characteristics Unless otherwise specified: CIN = 1µF, COUT = 4.7µF,
VIN = VOUT(NOM) +1, VOUT = 1.8V, TA = 25˚C, ON/OFF pin is tied to VIN (Continued)
Line Transient
Turn-On Time
Turn-On Time
Line Transient
Turn-On Time
Turn-On Time
10129547
10129549
10129550
10129548
10129552
10129551
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Application Hints
EXTERNAL CAPACITORS
Like any low-dropout regulator, the LP2985LV requires ex-
ternal capacitors for regulator stability. These capacitors
must be correctly selected for good performance.
Input Capacitor
An input capacitor whose capacitance is ≥ 1 µF is required
between the LP2985LV input and ground (the amount of
capacitance may be increased without limit).
This capacitor must be located a distance of not more than 1
cm from the input pin and returned to a clean analog ground.
Any good quality ceramic, tantalum, or film capacitor may be
used at the input.
Important: Tantalum capacitors can suffer catastrophic fail-
ure due to surge current when connected to
a low-
impedance source of power (like a battery or very large
capacitor). If a Tantalum capacitor is used at the input, it
must be guaranteed by the manufacturer to have a surge
current rating sufficient for the application.
10129520
FIGURE 2. LP2985LV 4.7µF Stable ESR Range
There are no requirements for ESR on the input capacitor,
but tolerance and temperature coefficient must be consid-
ered when selecting the capacitor to ensure the capacitance
will be ≥ 1 µF over the entire operating temperature range.
Important: The output capacitor must maintain its ESR
within the stable region over the full operating temperature
range of the application to assure stability.
The LP2985LV requires a minimum of 2.2 µF on the output
(output capacitor size can be increased without limit).
Output Capacitor
It is important to remember that capacitor tolerance and
variation with temperature must be taken into consideration
when selecting an output capacitor so that the minimum
required amount of output capacitance is provided over the
full operating temperature range. It should be noted that
ceramic capacitors can exhibit large changes in capacitance
with temperature (see next section, Capacitor Characteris-
tics).
The LP2985LV is designed specifically to work with ceramic
output capacitors, utilizing circuitry which allows the regula-
tor to be stable across the entire range of output current with
an output capacitor whose ESR is as low as 5 mΩ. It may
also be possible to use Tantalum or film capacitors at the
output, but these are not as attractive for reasons of size and
cost (see next sectionCapacitor Characteristics).
The output capacitor must meet the requirement for mini-
mum amount of capacitance and also have an ESR (equiva-
lent series resistance) value which is within the stable range.
Curves are provided which show the stable ESR range as a
function of load current (see ESR graphs Figure 1 and
Figure 2).
The output capacitor must be located not more than 1 cm
from the output pin and returned to a clean analog ground.
Noise Bypass Capacitor
Connecting a 10 nF capacitor to the Bypass pin significantly
reduces noise on the regulator output. It should be noted that
the capacitor is connected directly to a high-impedance cir-
cuit in the bandgap reference.
Because this circuit has only a few microamperes flowing in
it, any significant loading on this node will cause a change in
the regulated output voltage. For this reason, DC leakage
current through the noise bypass capacitor must never ex-
ceed 100 nA, and should be kept as low as possible for best
output voltage accuracy.
The types of capacitors best suited for the noise bypass
capacitor are ceramic and film. High-quality ceramic capaci-
tors with either NPO or COG dielectric typically have very
low leakage. 10 nF polypropolene and polycarbonate film
capacitors are available in small surface-mount packages
and typically have extremely low leakage current.
CAPACITOR CHARACTERISTICS
10129519
The LP2985LV was designed to work with ceramic capaci-
tors on the output to take advantage of the benefits they
offer: for capacitance values in the 2.2 µF to 4.7 µF range,
ceramics are the least expensive and also have the lowest
ESR values (which makes them best for eliminating high-
frequency noise). The ESR of a typical 2.2 µF ceramic
capacitor is in the range of 10 mΩ to 20 mΩ, which easily
meets the ESR limits required for stability by the LP2985LV.
FIGURE 1. LP2985LV 2.2µF Stable ESR Range
11
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Caution: the regulator output voltage can not be guaranteed
if a slow-moving AC (or DC) signal is applied that is in the
range between the specified turn-on and turn-off voltages
listed under the electrical specification VON/OFF (see Electri-
cal Characteristics).
Application Hints (Continued)
One disadvantage of ceramic capacitors is that their capaci-
tance can vary with temperature. Most large value ceramic
capacitors (≥ 2.2 µF) are manufactured with the Z5U or Y5V
temperature characteristic, which results in the capacitance
dropping by more than 50% as the temperature goes from
25˚C to 85˚C.
REVERSE INPUT-OUTPUT VOLTAGE
The PNP power transistor used as the pass element in the
LP2985LV has an inherent diode connected between the
regulator output and input. During normal operation (where
the input voltage is higher than the output) this diode is
reverse-biased.
This could cause problems if a 2.2 µF capacitor were used
on the output since it will drop down to approximately 1 µF at
high ambient temperatures (which could cause the
LP2985LV to oscillate). If Z5U or Y5V capacitors are used on
the output, a minimum capacitance value of 4.7 µF must be
observed.
However, if the output is pulled above the input, this diode
will turn ON and current will flow into the regulator output. In
such cases, a parasitic SCR can latch which will allow a high
current to flow into VIN (and out the ground pin), which can
damage the part.
A better choice for temperature coefficient in ceramic capaci-
tors is X7R, which holds the capacitance within 15%. Un-
fortunately, the larger values of capacitance are not offered
by all manufacturers in the X7R dielectric.
In any application where the output may be pulled above the
input, an external Schottky diode must be connected from
VIN to VOUT (cathode on VIN, anode on VOUT), to limit the
reverse voltage across the LP2985LV to 0.3V (see Absolute
Maximum Ratings).
Tantalum
Tantalum capacitors are less desirable than ceramics for use
as output capacitors because they are more expensive when
comparing equivalent capacitance and voltage ratings in the
1 µF to 4.7 µF range.
MICRO SMD MOUNTING
The micro SMD package requires specific mounting tech-
niques which are detailed in National Semiconductor Appli-
Another important consideration is that Tantalum capacitors
have higher ESR values than equivalent size ceramics. This
means that while it may be possible to find a Tantalum
capacitor with an ESR value within the stable range, it would
have to be larger in capacitance (which means bigger and
more costly) than a ceramic capacitor with the same ESR
value.
#
cation Note 1112. Referring to the section Surface Mount
Technology (SMT) Assembly Considerations, it should be
noted that the pad style which must be used with the 5-pin
package is the NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the
PC board may be used to facilitate placement of the micro
SMD device.
It should also be noted that the ESR of a typical Tantalum will
increase about 2:1 as the temperature goes from 25˚C down
to −40˚C, so some guard band must be allowed.
MICRO SMD LIGHT SENSITIVITY
On/off Input Operation
Exposing the micro SMD device to direct sunlight will cause
misoperation of the device. Light sources such as Halogen
lamps can also affect electrical performance if brought near
to the device.
The LP2985LV is shut off by driving the ON/OFF input low,
and turned on by pulling it high. If this feature is not to be
used, the ON/OFF input should be tied to VIN to keep the
regulator output on at all times.
The wavelenghts which have the most detrimental effect are
reds and infra-reds, which means that the fluorescent light-
ing used inside most buildings has very little effect on per-
formance. A micro SMD test board was brought to within 1
cm of a fluorescent desk lamp and the effect on the regu-
lated output voltage was negligible, showing a deviation of
less than 0.1% from nominal.
To assure proper operation, the signal source used to drive
the ON/OFF input must be able to swing above and below
the specified turn-on/turn-off voltage thresholds listed in the
Electrical Characteristics section under VON/OFF. To prevent
mis-operation, the turn-on (and turn-off) voltage signals ap-
plied to the ON/OFF input must have a slew rate which is
≥ 40 mV/µs.
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12
Physical Dimensions inches (millimeters) unless otherwise noted
5-Lead Small Outline Package (M5)
NS Package Number MF05A
For Order Numbers, refer to Table 1 in the “Ordering Information” section of this document.
13
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER
CLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6.NO JEDEC REGISTRATION AS OF AUG.1999.
micro SMD, 5 Bump, Package (BPA05 - 170 µm ball)
NS Package Number BPA05A
For Order Numbers, refer to Table 1 “Ordering Information” section of this document.
The dimensions for X1, X2 and X3 are as given:
X1 = 0.930 +/− 0.030mm
X2 = 1.107 +/− 0.030mm
X3 = 0.945 +/− 0.100mm
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14
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER
CLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6.NO JEDEC REGISTRATION AS OF AUG.1999.
micro SMD, 5 Bump, Package (BLA05 - 300 µm ball)
NS Package Number BLA05A
For Order Numbers, refer to Table 1 “Ordering Information” section of this document.
The dimensions for X1, X2 and X3 are as given:
X1 = 1.057 +/− 0.030mm
X2 = 1.412 +/− 0.030mm
X3 = 0.945 +/− 0.100mm
15
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN 1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTER
CLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6.NO JEDEC REGISTRATION AS OF AUG.1999.
micro SMD, 5 Bump, Package (TPA05 - 170 µm ball)
NS Package Number TPA05
For Order Numbers, refer to Table 1 “Ordering Information” section of this document.
The dimensions for X1, X2 and X3 are as given:
X1 = 0.930 +/− 0.030mm
X2 = 1.107 +/− 0.030mm
X3 = 0.500 +/− 0.075mm
www.national.com
16
Notes
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
Leadfree products are RoHS compliant.
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