LP3954TLX/NOPB [TI]
高级照明管理单元 | YZR | 36 | -30 to 85;型号: | LP3954TLX/NOPB |
厂家: | TEXAS INSTRUMENTS |
描述: | 高级照明管理单元 | YZR | 36 | -30 to 85 驱动 接口集成电路 |
文件: | 总59页 (文件大小:1005K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LP3954
www.ti.com
SNVS340D –JUNE 2005–REVISED MARCH 2013
Advanced Lighting Management Unit
Check for Samples: LP3954
1
FEATURES
DESCRIPTION
LP3954 is an advanced lighting management unit for
handheld devices. It drives any phone lights including
display backlights, RGB, keypad and camera flash
LEDs. The boost DC-DC converter drives high
current loads with high efficiency. White LED
backlight drivers are high efficiency low voltage
structures with excellent matching and automatic fade
in/ fade out function. The new stand-alone command
based RGB controller is feature rich and easy to
configure. Built-in audio synchronization feature
allows user to synchronize the color LEDs to audio
input. Integrated high current driver can drive camera
flash LED or motor/vibra. Internal ADC can be used
for ambient light or temperature sensing. The flexible
SPI/I2C interface allows easy control of LP3954.
Small DSBGA package together with minimum
number of external components is a best fit for
handheld devices.
2
•
•
Audio Synchronization for Color/RGB LEDs
Command Based PWM Controlled RGB LED
Drivers
•
•
High Current Driver for Flash LED With Built-in
Timing
4+2 or 6 Low Voltage Constant Current White
LED Drivers With Orogrammable 8-Bit
Adjustment (0…25mA/LED)
•
•
•
•
High Efficiency Boost DC-DC Converter
SPI / I2C Compatible Interface
Possibility for External PWM Dimming Control
Possibility for Clock Synchronization for RGB
Timing
•
•
Ambient Light and Temperature Sensing
Possibility
Small Package – DSBGA, 3.0 x 3.0 x 0.6mm
APPLICATIONS
•
•
Cellular Phones
PDAs, MP3 players
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
LP3954
SNVS340D –JUNE 2005–REVISED MARCH 2013
www.ti.com
Typical Application
D1
L1 4.7 mH
I
= 300...400 mA
C
C
C
MAX
V
OUT
IN
VDD
10 mF
= 4...5.3V
10 mF
100 nF
OUT
SW
FB
V
V
DD1
C
VDDA
DD2
WLED1
WLED2
WLED3
WLED4
1 éF
BATTERY
V
DDA
MAIN
BACKLIGHT
0...25 mA/LED
C
REF
V
REF
100 nF
R
RGB
IRGB
IRT
R
RT
SO
SUB
BACKLIGHT
0...25 mA/LED
WLED5
WLED6
SI
SCK/SCL
MCU
SS/SDA
SYNC/PWM
LP3954
R1
G1
B1
RGB1
Up to 40 mA/LED
V
DDIO
C
VDDIO
IF_SEL
100 nF
EN_FLASH
CAMERA
R2
RGB2
Up to 40 mA/LED
G2
B2
TEMP SENSOR
or
ASE
LIGHT
SENSOR
FLASH
Up to 300 mA
FLASH
IFLASH
or
or
AUDIO INPUT
GNDs
R
FLASH
2
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SNVS340D –JUNE 2005–REVISED MARCH 2013
Connection Diagrams
DSBGA Package, 3.0 x 3.0 x 0.6mm, 0.5mm pitch Package Number YZR0036AAA or
DSBGA Package, 3.0 x 3.0 x 0.65mm, 0.5mm pitch Package Number YPG0036AAA
6
5
4
3
2
1
SW
FB
FLASH
R1
G1
IRGB
SO
B1
B1
G1
IRGB
SO
R1
SS/SDA
SI
FLASH
FB
SW
6
5
4
3
2
1
GND_
SW
SS/
SDA
GND_
RGB
GND_
RGB
GND_
SW
GND
V
DDIO
GND
V
DDIO
GND_
WLED
SYNC_
PWM
SYNC_
PWM
GND_
WLED
IFLASH
SI
R2
G2
B2
R2
G2
B2
IFLASH
WLED
5
WLED
6
FLASH
_EN
SCK/
SCL
SCK/
SCL
FLASH
_EN
WLED
6
WLED
5
V
DD1
V
DD1
WLED
3
WLED
4
WLED
4
WLED
3
ASE
IRT
IF_SEL
IF_SEL
IRT
ASE
WLED
1
WLED
2
WLED
2
WLED
1
GNDA
V
REF
V
DDA
V
DD2
GNDA
V
V
V
REF
DD2
DDA
F
E
D
C
B
A
A
B
C
D
E
F
TOP VIEW
BOTTOM VIEW
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SNVS340D –JUNE 2005–REVISED MARCH 2013
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Table 1. Pin Descriptions
Pin No.
6F
Name
SW
Type
Output
Description
Boost Converter Power Switch
Boost Converter Feedback
High Current Flash Output
Red LED 1 Output
6E
6D
6C
6B
6A
5F
FB
Input
FLASH
R1
Output
Output
G1
Output
Green LED 1 Output
Blue LED 1 Output
B1
Output
GND_SW
GND
Ground
Ground
Power
Power Switch Ground
Ground
5E
5D
5C
5B
5A
4F
VDDIO
SS/SDA
IRGB
Supply Voltage for Input/output Buffers and Drivers
Slave Select (SPI), Serial Data In/Out (I2C)
Bias Current Set Resistor for RGB Drivers
Ground for RGB Currents
Logic Input/Output
Input
GND_RGB
GND_WLED
IFLASH
SYNC_PWM
SI
Ground
Ground
Input
Ground for WLED Currents
High Current Flash Current Set Resistor
External PWM Control for LEDs or External Clock for RGB Sync
Serial Input (SPI), Address Select (I2C)
Serial Data Out (SPI)
4E
4D
4C
4B
4A
3F
Logic Input
Logic Input
Logic Output
Output
SO
R2
Red LED 2 output
WLED5
WLED6
VDD1
EN_FLASH
SCK/SCL
G2
Output
White LED 5 output
3E
3D
3C
3B
3A
2F
Output
White LED 6 output
Power
Supply voltage
Logic Input
Logic Input
Output
Enable for High Current Flash
Clock (SPI/I2C)
Green LED 2 Output
WLED3
WLED4
ASE
Output
White LED 3 output
2E
2D
2C
2B
2A
1F
Output
White LED 4 output
Input
Audio Synchronization Input
Oscillator Frequency Resistor
Interface (SPI or I2C compatible) Selection (IF_SEL = 1 for SPI)
Blue LED 2 Output
IRT
Input
IF_SEL
B2
Logic Input
Output
WLED1
WLED2
GNDA
VREF
VDDA
VDD2
Output
White LED 1 Output
1E
1D
1C
1B
1A
Output
White LED 2 Output
Ground
Output
Ground for Analog Circuitry
Reference Voltage
Power
Internal LDO Output
Power
Supply Voltage
4
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SNVS340D –JUNE 2005–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1) (2)(3)
V (SW, FB, R1-2, G1-2, B1-2, FLASH, WLED1-6)(4) (5)
-0.3V to +7.2V
VDD1, VDD2, VDD_IO, VDDA
-0.3V to +6.0V
Voltage on ASE, IRT, IFLASH, IRGB, VREF
Voltage on Logic Pins
-0.3V to VDD1+0.3V with 6.0V max
-0.3V to VDD_IO +0.3V with 6.0V max
V(all other pins): Voltage to GND
-0.3V to 6.0V
10µA
I (VREF
)
I(R1, G1, B1, R2, G2, B2)
I(FLASH)(6)
100mA
400mA
Continuous Power Dissipation(7)
Internally Limited
150°C
Junction Temperature (TJ-MAX
Storage Temperature Range
)
-65°C to +150°C
260ºC
(8)
Maximum Lead Temperature (Soldering)
ESD Rating, Human Body Model(9)
2kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) Battery/Charger voltage should be above 6V no more than 10% of the operational lifetime.
(5) Voltage tolerance of LP3954 above 6.0V relies on fact that VDD1 and VDD2 (2.8V) are available (ON) at all conditions. If VDD1 and VDD2
are not available (ON) at all conditions, TI does not ensure any parameters or reliability for this device.
(6) The total load current of the boost converter in worst-case conditions should be limited to 300mA (min. input and max. output voltage).
(7) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160°C (typ.) and
disengages at TJ=140°C (typ.).
(8) For detailed soldering specifications and information, please refer to Application Note AN1112 : Micro SMD Wafer Level Chip Scale
Package SNVA009 or Application Note AN1412 : Micro SMDxt Wafer Level Chip Scale Package SNVA131.
(9) The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
Operating Ratings(1) (2)
V (SW, FB, WLED1-6, R1-2, G1-2, B1-2, FLASH)
VDD1,2 with external LDO
VDD1,2 with internal LDO
VDDA
0 to 6.0V
2.7 to 5.5V
3.0 to 5.5V
2.7 to 2.9V
VDD_IO
1.65V to VDD1
0.1V to VDDA –0.1V
0mA to 300mA
-30°C to +125°C
-30°C to +85°C
Voltage on ASE
Recommended Load Current
Junction Temperature (TJ) Range
Ambient Temperature (TA) Range(3)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Thermal Properties
Junction-to-Ambient Thermal Resistance(θJA), YZR0036AAA or YPG0036AAA Package(1)
60°C/W
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
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Electrical Characteristics(1) (2)
Limits in standard typeface are for TJ = 25° C. Limits in boldface type apply over the operating ambient temperature range (-
30°C < TA < +85°C). Unless otherwise noted, specifications apply to the LP3954 Block Diagram with: VDD1 = VDD2 = 3.6V,
VDDIO = 2.8V, CVDD = CVDDIO = 100nF, COUT = CIN = 10µF, CVDDA = 1µF, CREF = 100nF, L1 = 4.7µH, RFLASH =1.2k, RRGB =5.6k
(3)
and RRT =82k
.
Parameter
Standby supply current
(VDD1, VDD2
No-boost supply current
(VDD1, VDD2
Test Conditions
NSTBY = L
SCK, SS, SI
Min
Typ
Max
8
Unit
IVDD
1
µA
)
NSTBY = H,
EN_BOOST = L
SCK, SS, SI
400
µA
)
Audio sync and LEDs OFF
No-load supply current
(VDD1, VDD2
NSTBY = H,
EN_BOOST = H
SCK, SS, SI
1
mA
)
Audio sync and LEDs OFF
Autoload OFF
RGB drivers
CC mode at R1, G1, B1 and R2, G2,
B2 set to 15mA
150
µA
µA
µA
(VDD1, VDD2
)
SW mode
150
500
WLED drivers
4+2 banks IOUT/LED 25mA
(VDD1, VDD2
)
Audio synchronization
Audio sync ON
VDD1,2 = 2.8V
VDD1,2 = 3.6V
(VDD1, VDD2
)
390
700
2
Flash
I(RFLASH)=1mA
Peak current during flash
mA
µA
(VDD1, VDD2
)
IVDDIO
VDDIO Standby Supply current
NSTBY = L
1
SCK, SS, SI = H
VDDIO supply current
1MHz SCK frequency in SPI mode,
CL = 50pF at SO pin
20
µA
IEXT_LDO
VDDA
External LDO output current
7V tolerant application only
IBOOST = 300mA
6.5
mA
(VDD1, VDD2, VDDA
)
(4)
Output voltage of internal LDO
for analog parts
2.72
-3
2.80
2.88
+3
V
%
(1) All voltages are with respect to the potential at the GND pins.
(2) Min and Max limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely
norm.
(3) Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
(4) VDDA output is not recommended for external use.
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SNVS340D –JUNE 2005–REVISED MARCH 2013
DETAILED DESCRIPTION
Block Diagram
L1
4.7 µH
I
= 300...400 mA
MAX
D1
V
= 4...5.3 V
OUT
SW
C
OUT
FB
10 µF
V
C
C
VDD
DD1
IN
10 µF 100 nF
Logic supply
LDO
BG
V
DD2
PWM
Li-Ion
Battery
Or
V
DDA
POR
GND_SW
WLED1
Charger
V
REF
BOOST
THSD
OSC
REF
C
C
VDDA
REF
100 nF
IRGB
8-Bit
IDAC
1 µF
WLED2
WLED3
WLED4
MAIN
BACKLIGHT
0...25 mA/LED
BIAS
D
A
IRT
GND_WLED
R
RGB
R
RT
8-Bit
IDAC
WLED5
WLED6
SUB
BACKLIGHT
0...25 mA/LED
SO
SI
D
A
CONTROL
SCK/SCL
SS/SDA
IF_SEL
MCU
SPI
I2C
SYNC/PWM
R1
G1
B1
V
DDIO
RGB1
Up to
40 mA/LED
C
VDDIO
100 nF
COMMAND
BASED
PATTERN
GENERATOR
R2
G2
B2
RGB2
Up to
40 mA/LED
SINGLE ENDED
ANALOG
AUDIO
ASE
AUDIO SYNC
GND_RGB
FLASH
FLASH
Up to 300 mA
EN_FLASH
FLASH
CTRL
CAMERA
FLASH
LOGIC
IFLASH
GNDA
GND
R
FLASH
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Modes of Operation
RESET: In the RESET mode all the internal registers are reset to the default values and the chip goes to
STANDBY mode after reset. NSTBY control bit is low after reset by default. Reset is entered always if
Reset Register is written or internal Power On Reset is active. There is no dedicated Reset pin available.
LP3954 can be reset by writing any data to Reset Register in address 60H. Power On Reset (POR) will
activate during the chip startup or when the supply voltage VDD2 falls below 1.5V. Once VDD2 rises
above 1.5V, POR will inactivate and the chip will continue to the STANDBY mode.
STANDBY: The STANDBY mode is entered if the register bit NSTBY is LOW. This is the low power
consumption mode, when all circuit functions are disabled. Registers can be written in this mode and the
control bits are effective immediately after power up.
STARTUP: When NSTBY bit is written high, the INTERNAL STARTUP SEQUENCE powers up all the needed
internal blocks (Vref, Bias, Oscillator etc..). To ensure the correct oscillator initialization, a 10ms delay is
generated by the internal state-machine. If the chip temperature rises too high, the Thermal Shutdown
(THSD) disables the chip operation and STARTUP mode is entered until no thermal shutdown event is
present.
BOOST STARTUP:Soft start for boost output is generated in the BOOST STARTUP mode. The boost output is
raised in PFM mode during the 10ms delay generated by the state-machine. The Boost startup is entered
from Internal Startup Sequence if EN_BOOST is HIGH or from Normal mode when EN_BOOST is written
HIGH. During the 10ms Boost Startup time all LED outputs are switched off to ensure smooth start-up.
NORMAL: During NORMAL mode the user controls the chip using the Control Registers. The registers can be
written in any sequence and any number of bits can be altered in a register in one write
RESET
Reset Register write
or POR = H
POR = L
STANDBY
NSTBY = L
NSTBY = H
INTERNAL
STARTUP
SEQUENCE
VREF = 95% OK*
THSD = H
~10 ms Delay
EN_BOOST = H*
EN_BOOST = L*
BOOST STARTUP
~10 ms Delay
EN_BOOST
rising edge*
NORMAL MODE
* THSD = L
Figure 1. Modes of Operation
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SNVS340D –JUNE 2005–REVISED MARCH 2013
Magnetic Boost DC/DC Converter
The LP3954 Boost DC/DC Converter generates a 4.0 – 5.3V voltage for the LEDs from single Li-Ion battery
(3V…4.5V). The output voltage is controlled with an 8-bit register in 9 steps. The converter is a magnetic
switching PWM mode DC/DC converter with a current limit. The converter has three options for switching
frequency, 1MHz, 1.67MHz and 2MHz (default), when timing resistor RT is 82kohm. Timing resistor defines the
internal oscillator frequency and thus directly affects boost frequency and all circuit's internally generated timing
(RGB, Flash, WLED fading).
The LP3954 Boost Converter uses pulse-skipping elimination to stabilize the noise spectrum. Even with light load
or no load a minimum length current pulse is fed to the inductor. An active load is used to remove the excess
charge from the output capacitor at very light loads. At very light load and when input and output voltages are
very close to each other, the pulse skipping is not completely eliminated. Output voltage should be at least 0.5V
higher than input voltage to avoid pulse skipping. Reducing the switching frequency will also reduce the required
voltage difference.
Active load can be disabled with the en_autoload bit. Disabling will increase the efficiency at light loads, but the
downside is that pulse skipping will occur. The Boost Converter should be stopped when there is no load to
minimise the current consumption.
The topology of the magnetic boost converter is called CPM control, current programmed mode, where the
inductor current is measured and controlled with the feedback. The user can program the output voltage of the
boost converter. The output voltage control changes the resistor divider in the feedback loop.
The following figure shows the boost topology with the protection circuitry. Four different protection schemes are
implemented:
1. Over voltage protection, limits the maximum output voltage
–
–
Keeps the output below breakdown voltage.
Prevents boost operation if battery voltage is much higher than desired output.
2. Over current protection, limits the maximum inductor current
Voltage over switching NMOS is monitored; too high voltages turn the switch off.
–
3. Feedback break protection. Prevents uncontrolled operation if FB pin gets disconnected.
4. Duty cycle limiting, done with digital control.
V
V
OUT
2 MHz clock
Duty control
IN
SW
FBNCCOMP
FB
+
-
R
S
R
R
OVPCOMP
SWITCH
+
-
RESETCOMP
+
-
-
+
R
ERRORAMP
ACTIVE
LOAD
+
-
R
+
-
LOOPC
OLPCOMP
SLOPER
Figure 2. Boost Converter Topology
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MAGNETIC BOOST DC/DC CONVERTER ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
3.0V ≤ VIN
VOUT = 5V
Min
Typ
Max
Unit
ILOAD
Load Current
0
300
mA
3.0V ≤ VIN
VOUT = 4V
0
400
VOUT
Output Voltage Accuracy
(FB Pin)
3.0V ≤ VIN ≤ VOUT - 0.5
VOUT = 5.0V
−5
+5
%
Output Voltage
(FB Pin)
1 mA ≤ ILOAD ≤ 300 mA
VIN > 5V + V(SCHOTTKY)
VIN–V(SCHOTT
V
Ω
KY)
RDSON
fPWF
Switch ON Resistance
VDD1,2 = 2.8V, ISW = 0.5A
0.4
0.8
PWM Mode Switching Frequency RT = 82 kΩ
freq_sel[2:0] = 1XX
2
MHz
Frequency Accuracy
2.7 ≤ VDDA ≤ 2.9
RT = 82 kΩ
−6
−9
±3
+6
%
+9
tPULSE
Switch Pulse Minimum Width
Startup Time
no load
25
10
ns
tSTARTUP
ISW_MAX
Boost startup from STANDBY
ms
SW Pin Current Limit
700
800
900
mA
550
950
BOOST STANDBY MODE
User can stop the Boost Converter operation by writing the Enables register bit EN_BOOST low. When
EN_BOOST is written high, the converter starts for 10ms in PFM mode and then goes to PWM mode.
BOOST OUTPUT VOLTAGE CONTROL
User can control the boost output voltage by boost output 8-bit register.
Boost Output [7:0]
Register 0DH
Boost Output
Voltage (typical)
Bin
Hex
00
01
03
07
0F
1F
3F
7F
FF
0000 0000
0000 0001
0000 0011
0000 0111
0000 1111
0001 1111
0011 1111
0111 1111
1111 1111
4.00
4.25
4.40
4.55
4.70
4.85
5.00 Default
5.15
5.30
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Figure 3. Boost Output Voltage Control
BOOST FREQUENCY CONTROL
freq_sel[2:0](1)
frequency
2.00 MHz
1.67 MHz
1.00 MHz
1XX
01X
001
(1) Register ‘boost freq’ (address 0EH). Register default value after
reset is 07H.
Boost Converter Typical Performance Characteristics
Vin = 3.6V, Vout = 5.0V if not otherwise stated
Boost Converter Efficiency
Boost Typical Waveforms at 100mA Load
TIME (200 ns/DIV)
Figure 4.
Figure 5.
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Vin = 3.6V, Vout = 5.0V if not otherwise stated
Battery Current vs Voltage
Battery Current vs Voltage
Figure 6.
Figure 7.
Boost Line Regulation
Boost Startup with No Load
Figure 8.
Figure 9.
Boost Load Transient, 50 mA–100 mA
Boost Switching Frequency
Figure 10.
Figure 11.
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Vin = 3.6V, Vout = 5.0V if not otherwise stated
Output Voltage vs Load Current
Efficiency At Low Load vs Autoload
90
80
70
60
50
40
30
20
5.2
5.0
4.8
4.6
V
= 3V
IN
4.4
4.2
4.0
3.8
3.6
f = 2 MHz
L - TDK VLF0410 4.7 mH
C
= C = 10 mF
OUT
IN
Autoload ON
Autoload OFF
0
5
10
15
20
25
30
0
100
200
300
400
500
LOAD CURRENT (mA)
OUTPUT CURRENT (mA)
Figure 12.
Figure 13.
Functionality of Color LED Outputs (R1, G1, B1; R2, G2, B2)
LP3954 has 2 sets of RGB/color LED outputs. Both sets have 3 outputs and the sets can be controlled in 4
different ways:
1. Command based pattern generator control (internal PWM)
2. Audio synchronization control
3. Direct ON/OFF control
4. External PWM control
By using command based pattern generator user can program any kind of color effect patterns. LED intensity,
blinking cycles and slopes are independently controlled with 8 16-bit commands. Also real time commands are
possible as well as loops and step by step control. If analog audio is available on system, the user can use
audio synchronization for synchronizing LED blinking to the music. The different modes together with the
various sub modes generate very colorful and interesting lighting effects. Direct ON/OFF control is mainly for
switching on and off LEDs. External PWM control is for applications where external PWM signal is available
and required to control the color LEDs. PWM signal can be connected to any color LED separately as shown
later.
COLOR LED CONTROL MODE SELECTION
The RGB_SEL[1:0] bits in the Enables register (08H) control the output modes for RGB1 (R1, G1, B1) and RGB2
(R2, G2, B2) outputs. The following table shows the RGB_SEL functionality.
Command Based Pattern Generator
RGB_SEL[1:0]
Audio Sync Connected To
Connected To
RGB1 & RGB2
RGB2
00
01
10
11
none
RGB1
RGB2
RGB1
RGB1 & RGB2
none
RGB Control register (00H) has control bits for direct on/off control of all color LEDs. Note that the LEDs have
to be turned on in order to control them with audio synchronization or pattern generator.
The external PWM signal controls any LED depending on the control register setup. The controls are in the Ext.
PWM Control register (address 07H) except the FLASH control in HC_Flash (10H) register as follows:
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Ext. PWM Control(1)
PWM controls WLED 1-4
wled1-4_pwm
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
wled5-6_pwm
r1_pwm
PWM controls WLED 5-6
PWM controls R1 output
PWM controls G1 output
PWM controls B1 output
PWM controls R2 output
PWM controls G2 output
PWM controls B2 output
HC_Flash
g1_pwm
b1_pwm
r2_pwm
g2_pwm
b2_pwm
hc_pwm
bit 5
PWM controls high current flash
(1) Note: If DISPL=1, wled1-4pwm controls WLED1-6
Note: Maximum external PWM frequency is 1kHz. If during the
external PWM control the internal PWM is on the result will be
product of both functions.
CURRENT CONTROL OF COLOR LED OUTPUTS (R1, R2, G1, G2, B1, B2)
Both RGB output sets can be separately controlled as constant current sinks or as switches. This is done using
cc_rgb1/2 bits in the RGB control register. In constant current mode one or both RGB output sets are controlled
with constant current sinks (no external ballast resistors required). The maximum output current for both drivers
is set by one external resistor RRGB. User can decrease the maximum current for an individual LED driver by
programming as shown later.
The maximum current for all RGB drivers is set with RRGB. The equation for calculating the maximum current is
IMAX = 100 ×1.23V / (RRGB + 50Ω)
(1)
where
IMAX - maximum RGB current in any RGB output in constant current mode
1.23V - reference voltage
100 - internal current mirror multiplier
RRGB- resistor value in Ohms
50Ω - internal resistor in the IRGB input
For example if 22mA is required for maximum RGB current RRGB equals to
RRGB = 100 × 1.23V / IMAX –50Ω = 123V / 0.022A –50Ω = 5.54kΩ
(2)
Each individual RGB output has a separate maximum current programming. The control bits are in registers
RGB1 max current and RGB2 max current (12H and 13H) and programming is shown in table below. The
default value after reset is 00.
IR1[1:0], IG1[1:0],
Maximum
IB1[1:0], IR2[1:0],
Current/Output
IG2[1:0], IB2[1:0]
00
01
10
11
0.25 × IMAX
0.50 × IMAX
0.75 × IMAX
1.00 × IMAX
SWITCH MODE
The switch mode is used if there is a need to connect parallel LEDs to output or if the RGB output current needs
to be increased.
Please note that the switch mode requires an external ballast resistors at each output to limit the LED current.
The switch/current mode and on/off controls for RGB are in the RGB_ctrl register (00H) as follows:
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Table 2. RGB_ctrl Register (00H)
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
R1, G1 and B1 are switches → limit current with ballast resistor
CC_RGB1
CC_RGB2
r1sw
bit7
bit6
bit5
bit4
bit3
bit2
bit1
bit0
R1, G1 and B1 are constant current sinks, current limited internally
R2, G2 and B2 are switches → limit current with ballast resistor
R2, G2 and B2 are constant current sinks, current limited internally
R1 is on
R1 is off
G1 is on
G1 is off
B1 is on
B1 is off
R2 is on
R2 is off
G2 is on
G2 is off
B2 is on
B2 is off
g1sw
b1sw
r2sw
g2sw
b2sw
V
OUT
V
OUT
RR1
R1
G1
R1
RR2
RG1
R1
control
R1
control
G1
B1
RG2
RB1
RB2
G1
control
G1
control
B1
B1
control
B1
control
RGB1 output as a constant
current sink (CC)
RGB1 output as switch (SW)
Command Based Pattern Generator for Color LEDs
The LP3954 has a unique stand-alone command based pattern generator with 8 user controllable 16-bit wide
commands. Since write registers are 8-bit long one command requires 2 write cycles. Each command has
intensity level for each LED, command execution time (CET) and transition time (TT). The command structure is
shown in following two figures.
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16 bits
RED[2:0]
GREEN[2:0]
CET [3:0]
BLUE[2:0]
TT[2:0]
16 bits
16 bits
ADDESS[7:0]
RED[2:0]
GREEN[2:0]
CET[3:2]
NEXT ADDESS[7:0]
CET[1:0]
BLUE[2:0]
TT[2:0]
COMMAND REGISTER WITH 8 COMMANDS
COMMAND 1
COMMAND 2
COMMAND 3
COMMAND 4
COMMAND 5
COMMAND 6
COMMAND 7
COMMAND 8
ADDRESS 50H
ADDRESS 51H
ADDRESS 52H
ADDRESS 53H
ADDRESS 54H
ADDRESS 55H
ADDRESS 56H
ADDRESS 57H
ADDRESS 58H
ADDRESS 59H
ADDRESS 5AH
ADDRESS 5BH
ADDRESS 5CH
ADDRESS 5DH
ADDRESS 5EH
ADDRESS 5FH
R2
CET1
R2
R1
CET0
R1
R0
B2
R0
B2
R0
B2
R0
B2
R0
B2
R0
B2
R0
B2
R0
B2
G2
B1
G2
B1
G2
B1
G2
B1
G2
B1
G2
B1
G2
B1
G2
B1
G1
B0
G1
B0
G1
B0
G1
B0
G1
B0
G1
B0
G1
B0
G1
B0
G0
TT2
G0
CET3
TT1
CET2
TT0
CET3
TT1
CET2
TT0
CET1
R2
CET0
R1
TT2
G0
CET3
TT1
CET2
TT0
CET1
R2
CET0
R1
TT2
G0
CET3
TT1
CET2
TT0
CET1
R2
CET0
R1
TT2
G0
CET3
TT1
CET2
TT0
CET1
R2
CET0
R1
TT2
G0
CET3
TT1
CET2
TT0
CET1
R2
CET0
R1
TT2
G0
CET3
TT1
CET2
TT0
CET1
R2
CET0
R1
TT2
G0
CET3
TT1
CET2
TT0
CET1
CET0
TT2
COLOR INTENSITY CONTROL
Each color, Red, Green and Blue, has 3-bit intensity levels. The level control is logarithmic. 2 logarithmic curves
are available. The LOG bit in Pattern_gen_ctrl register (11H) defines the curve used. The values for both
logarithmic curves are shown in following table.
CURRENT
[% × IMAX(COLOR)
R[2:0], G[2:0],
]
B[2:0]
LOG=0
0
LOG=1
000
001
010
011
100
101
110
111
0
1
7
14
2
21
4
32
10
21
46
100
46
71
100
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100
80
60
40
20
0
LOG=0
LOG=1
000 001 010 011 100 101 110 111
R[2:0], G[2:0], B[2:0]
COMMAND EXECUTION TIME (CET) AND TRANSITION TIME (TT)
The command execution CET time is the duration of one single command. Command execution times CET are
defined as follows, when RT=82k:
CET [3:0]
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
CET duration, ms
197
393
590
786
983
1180
1376
1573
1769
1966
2163
2359
2556
2753
2949
3146
Transition time TT is duration of transition from the previous RGB value to programmed new value. Transition
times TT are defined as follows:
TT [2:0]
000
Transition time, ms
0
001
55
010
110
221
442
885
1770
3539
011
100
101
110
111
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The figure below shows an example of RGB CET and TT times.
COMMAND EXECUTION TIME = CET
CET
TT
CET
3
1
2
TT
3
TRANSITION TIME = TT
2
1
BLUE
GREEN
RED
TT < CET
The command execution time also may be less than the transition time – the figure below illuminates this case.
TRANSITION TIME = TT
1
COMMAND EXECUTION TIME = CET
CET
CET
1
2
3
TT
2
TT
3
Target values
BLUE
GREEN
RED
TT > CET
TT < CET
TT < CET
3
1
1
2
2
3
LOOP CONTROL
Pattern generator commands can be looped using the LOOP bit (D1) in Pattern gen ctrl register (11H). If
LOOP=1 the program will be looped from the command 8 register or if there is 0000 0000 and 0000 0000 in one
command register. The loop will start from command 1 and continue until stopped by writing rgb_start=0 or
loop=0. The example of loop is shown in following figure:
IF 0000 0000 and 0000 0000 then ‰ LOOP
LOOP=1
ADDRESS 50H
COMMAND 1
ADDRESS 51H
ADDRESS 52H
COMMAND 2
ADDRESS 53H
ADDRESS 54H
ADDRESS 55H
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
COMMAND 3
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SINGLE PROGRAM
If control bit LOOP=0 the program will start from Command 1 and run to either last command or to empty “0000
0000 / 0000 0000” command.
IF 0000 0000 and 0000 0000 then ‰ STOP
LOOP=0
ADDRESS 50H
start
COMMAND 1
COMMAND 2
ADDRESS 51H
ADDRESS 52H
ADDRESS 53H
ADDRESS 54H
ADDRESS 55H
stop
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
COMMAND 3
The LEDs maintain the brightness of the last command when the single program stops. Changes in command
register will not be effective in this phase. The RGB_START bit has to be toggled off and on to make changes
effective.
START BIT
Pattern_gen_ctrl register’s RGB_START bit will enable command execution starting from Command 1.
Pattern gen ctrl register (11H)
0 – Pattern generator disabled
1 – execution pattern starting from command 1
rgb_start
loop
Bit 2
Bit 1
Bit 0
0 – pattern generator loop disabled (single pattern)
1 – pattern generator loop enabled (execute until stopped)
0 – color intensity mode 0
1 – color intensity mode 1
log
HARDWARE ON/OFF CONTROL AND DIMMING
PWM_LED input can be used as direct ON/OFF control or PWM dimming control for selected RGB outputs or
the WLED groups. PWM_LED control can be enabled with the control bits in the Ext. PWM Control register.
Audio Synchronization
The color LEDs connected to RGB outputs can be synchronized to incoming audio with Audio Synchronization
feature. Audio Sync has 2 modes. Amplitude mode synchronizes color LEDs based on input signal’s peak
amplitude. In the amplitude mode the user can select between 3 different amplitude mapping modes and 4
different speed configurations. The frequency mode synchronizes the color LEDs based on bass, middle and
treble amplitudes (= low pass, band pass and high pass filters). User can select between 2 different frequency
responses and 4 different speed configurations for best audio-visual user experience. Programmable gain and
AGC function are also available for adjustment of input signal amplitude to light response. The Audio Sync
functionality is described more closely below.
USING A DIGITAL PWM AUDIO SIGNAL AS AN AUDIO SYNCHRONIZATION SOURCE
If the input signal is a PWM signal, use a first or second order low pass filter to convert the digital PWM audio
signal into an analog waveform. There are two parameters that need to be known to get the filter to work
successfully: frequency of the PWM signal and the voltage level of the PWM signal. Suggested cut-off frequency
(-3dB) should be around 2 kHz to 4 kHz and the stop-band attenuation at sampling frequency should be around -
48dB or better. Use a resistor divider to reduce the digital signal amplitude to meet the specification of the analog
audio input. Because a low-order low-pass filter attenuates the high-frequency components from audio signal,
MODE_CONTROL=[01] selection is recommended when frequency synchronization mode is enabled.
Application example 5 shows an example of a second order RC-filter for 29 kHz PWM signal with 3.3V
amplitude. Active filters, such as a Sallen-Key filter, may also be applied. An active filter gives better stop-band
attenuation and cut-off frequency can be higher than for a RC-filter.
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To make sure that the filter rolls off sufficiently quickly, connect your filter circuit to the audio input(s), turn on the
audio synchronization feature, set manual gain to maximum, apply the PWM signal to the filter input and keep an
eye on LEDs. If they are blinking without an audio signal (modulation), a sharper roll-off after the cut-off
frequency, more stop-band attenuation, or smaller amplitude of the PWM signal is required.
AUDIO SYNCHRONIZATION SIGNAL PATH
LP3954 audio synchronization is mainly done digitally and it consists of the following signal path blocks:
•
•
•
•
•
•
•
•
•
•
•
•
Input Buffers
AD Converter
DC Remover
Automatic Gain Control (AGC)
Programmable Gain
3 Band Digital Filter
Peak Detector
Look-up Tables (LUT)
Mode Selector
Integrators
PWM Generator
Output Drivers
MODE
HIGH / LOW
3 FILTERS
EN
GAIN
SPEED
INT
LUT
LUT
R
G
B
ASE
PW
M
DC
REMOVER
LED
DRIVER
ADC
AGC
BUFFER
PEAK
DETECTOR
The digitized input signal has DC component that is removed by digital DC REMOVER (-3dB at 400Hz). Since
the light response of input audio signal is very much amplitude dependent the AGC adjusts the input signal to
suitable range automatically. User can disable AGC and the gain can be set manually with PROGRAMMABLE
GAIN. LP3954 has 2 audio synchronization modes: amplitude and frequency. For amplitude based
synchronization the PEAK DETECTION method is used. For frequency based synchronization 3 BAND FILTER
separates high pass, low pass and band bass signals. For both modes the predefined LUT is used to optimize
the audio visual effect. MODE SELECTOR selects the synchronization mode. Different response times to music
beat can be selected using INTEGRATOR speed variables. Finally PWM GENERATOR sets the driver FET duty
cycles.
INPUT SIGNAL TYPE AND BUFFERING
LP3954 supports single ended audio input as shown in the figure below. The electric parameters of the buffer are
described in the Audio Synch table. The buffer is rail-to-rail input operational amplifier connected as a voltage
follower. DC level of the input signal is set by a simple resistor divider
V
DDA
1 MW
ASE
10 nF
1 MW
AGND
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AUDIO SYNC ELECTRICAL PARAMETERS
Symbol
ZIN
Parameter
Input Impedance of ASE
Test Conditions
Min
250
0.1
Typ
Max
Unit
kOhm
V
500
AIN
Audio Input Level Range (peak-to-peak)
Gain = 21dB
Gain = 0 dB
VDDA - 0.1
f3dB
Crossover Frequencies (-3 dB)
Narrow Frequency Response
Low Pass
0.5
Band Pass
1.0 and
1.5
High Pass
Low Pass
Band Pass
2.0
1.0
kHz
Wide Frequency Response
2.0 and
3.0
High Pass
4.0
CONTROL OF AUDIO SYNCHRONIZATION
The following table describes the controls required for audio synchronization.
Audio_sync_CTRL1 (2AH)
Input signal gain control. Range 0...21 dB, step 3 dB:
[000] = 0 dB (default) [011] = 9 dB
[110] = 18 dB
[111] = 21 dB
GAIN_SEL[2:0]
Bits 7-5
[001] = 3 dB
[010] = 6 dB
[100] = 12 dB
[101] = 15 dB
Synchronization mode selector.
SYNC_MODE
EN_AGC
Bit 4
Bit 3
SYNCMODE = 0 → Amplitude Mode (default)
SYNCMODE = 1 → Frequency Mode
Automatic Gain Control enable
1 = enabled
0 = disabled (Gain Select enabled) (default)
Audio synchronization enable
1 = Enabled
Note : If AGC is enabled, AGC gain starts from current GAIN_SEL gain value.
0 = Disabled (default)
EN_SYNC
Bit 2
[00] = Single ended input signal, ASE.
[01] = Temperature measurement
[10] = Ambient light measurement
[11] = No input (default)
INPUT_SEL[1:0]
Bits 1-0
Audio_sync_CTRL2 (2BH)
0 – average disabled (not applicable in audio synchronization mode)
1 – average enabled (not applicable in audio synchronization mode)
EN_AVG
Bit 4
MODE_CTRL[1:0]
Bits 3-2
See below: Mode control
Sets the LEDs light response time to audio input.
[00] = FASTEST (default)
[01] = FAST
SPEED_CTRL[1:0]
Bits 1-0
[10] = MEDIUM
[11] = SLOW
(For SLOW setting in amplitude mode fMAX=3.8Hz,
Frequency mode fMAX=7.6Hz)
MODE CONTROL IN FREQUENCY MODE
Mode control has two setups based on audio synchronization mode select: the frequency mode and the
amplitude mode. During the frequency mode user can select two filter options by MODE_CTRL as shown
below. User can select the filters based on the music type and light effect requirements. In the first mode the
frequency range extends to 8 kHz in the secont to 4 kHz.
The lowpass filter is used for the red, the bandpass filter for the blue and the hipass filter for the green LED.
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0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
BANDPASS
LOWPASS
HIPASS
BANDPASS
LOWPASS
HIPASS
1.0 2.0 3.0 4.0 5.0 6.0 7.0
kHz
0.5 1.0 1.5 2.0 2.5 3.0 3.5
kHz
0
8.0
0
4.0
Figure 14. Higher frequency mode
MODE_CTRL = 00 and SYNC_MODE = 1
Figure 15. Lower frequency mode
MODE_CTRL = 01 and SYNC_MODE = 1
MODE CONTROL IN AMPLITUDE MODE
During the amplitude synchronization mode user can select between three different amplitude mappings by
using MODE_CTRL select. These three mapping option gives different light response. The modes are shown in
the tables below.
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
BLUE
GREEN
RED
BLUE
GREEN
RED
0
10 20 30 40 50 60 70 80 90 100
INPUT AMPLITUDE (%)
0
10 20 30 40 50 60 70 80 90 100
INPUT AMPLITUDE (%)
Figure 16. Non-overlapping mode
MODE_CTRL[1:0] = [01]
Figure 17. Partly overlapping mode
MODE_CTRL[1:0] = [00]
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5.00
100
90
80
70
60
50
40
30
20
10
0
BLUE
GREEN
3.00
2.50
2.00
1.50
1.00
0.50
0.30
0.25
0.20
0.15
0.10
RED
0.05
0
3
6
9
12
15
18
21
0
10 20 30 40 50 60 70 80 90 100
INPUT AMPLITUDE (%)
GAIN (dB)
Figure 18. Overlapping mode MODE_CTRL[1:0] =
[10]
Figure 19. Peak Input Signal Level
Range vs Gain Setting
RGB OUTPUT SYNCHRONIZATION TO EXTERNAL CLOCK
The RGB pattern generator and high current flash driver timing can be synchronized to external clock with
following configuration.
1. Set PWM_SYNC bit in Enables register to 1
2. Feed PWM_SYNC pin with 5 MHz clock
By this the internal 5 MHz clock is disabled from pattern generator and flash timing circuitry.
The external clock signal frequency will fully determine the timings related to RGB and Flash.
Note: The boost converter will use internal 5 MHz clock even if the external clock is available.
RGB Driver Typical Performance Characteristics
RGB DRIVER ELECTRICAL CHARACTERISTICS (R1, G1, B1, R2, G2, B2 OUTPUTS)
Parameter
Test Conditions
Min
Typ
Max
1
Unit
ILEAKAGE
IMAX(RGB)
R1, G1, B1, R2, G2, B2 pin
leakage current
0.1
µA
Maximum recommended sink CC mode
40
50
mA
mA
%
current(1)
SW mode
Accuracy at 37mA
Current mirror ratio
RRGB=3.3 kΩ ±1%, CC mode
CC mode
±5
1:100
±5
RGB1 and RGB2 current
mismatch
IRGB=37mA, CC mode
%
RSW
Switch resistance
SW mode
2.5
20
4
Ω
ƒRGB
RGB switching frequency
Accuracy proportional to internal
clock freq.
18.2
21.8
kHz
If external SYNC 5MHz is in use
20
kHz
(1) Note: RGB current should be limited as follows:
constant current mode – limit by external RRGB resistor;
switch mode – limit by external ballast resistors
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Figure 20. Output Current vs Pin Voltage (Current
Sink Mode)
Figure 21. Pin Voltage vs Output Current (Switch
Mode)
Figure 22. Output Current vs RRGB (Current Sink Mode)
Single High Current Driver
LP3954 has internal constant current driver that is capable for driving high current mainly targeted for FLASH
LED in camera phone applications.
MAXIMUM CURRENT SETUP FOR FLASH
The user sets the maximum current of FLASH with RFLASH resistor based on following equation:
IMAX = 300 × 1.23V / (RFLASH + 50Ω),
(3)
where
Imax = maximum flash current in Amps (ie. 0.3A)
1.23V = reference voltage
300 = internal current mirror multiplier
RFLASH = Resistor value in Ohms
50Ω = Internal resistor in the IFLASH input
For example if 300mA is required for maximum flash current RFLASH equals to
RFLASH = 300 × 1.23V / IMAX – 50Ω = 369V / 0.3A – 50Ω = 1.18kΩ
(4)
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CURRENT CONTROL FOR FLASH
To minimize the internal current consumption, the flash function has an enable bit EN_HCFLASH in the
HC_Flash register.
EN_HCFLASH
0
1
FLASH disabled, no extra current consumption through RFLASH
FLASH enabled, IFLASH set by HC_SW[1:0] (see below)
HC[1:0] bits in the HC_Flash register control the FLASH current as show in following table.
HC[1:0]
00
I(FLASH)
0.25 × IMAX(FLASH)
0.50 × IMAX(FLASH)
0.75 × IMAX(FLASH)
1.00 × IMAX(FLASH)
01
10
11
Figure 23 shows the internal structure for the FLASH driver.
L
OUT
LED
1 mA
1 mA
FLASH
1.23V
+
-
up to 300 mA
IFLASH
(1.23V)
1 mA
R
FLASH
Figure 23. Internal Structure of Flash Driver
FLASH TIMING
Flash output is turned on in lower current View finder mode when the EN_HCFLASH bit is written high. The
actual Flash at maximum current starts when the EN_FLASH i/o-pin goes high. The Flash length can be selected
from 3 pre-defined values or EN_FLASH pin pulse length can determine the length. The pulse length is
controlled by the FT_T[1:0] bits as show in the table below.
Current During View
FL_T[1:0]
Flash Duration Typ
Current During FLASH
Finder/Focusing
Set by HC[1:0]
Set by HC[1:0]
Set by HC[1:0]
Set by HC[1:0]
00
01
10
11
200ms
400ms
HC[11] = IMAX(FLASH)
HC[11] = IMAX(FLASH)
HC[11] = IMAX(FLASH)
HC[11] = IMAX(FLASH)
600ms
EN_FLASH on duration
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Figure 24 shows the functionality of the built-in flash.
Current
HIGH CURRENT
FLASH
VIEW FINDER / FOCUS
HC[1:0] = 11
HC[1:0] = 10
HC[1:0] = 01
HC[1:0] = 00
FL_T[1:0]
HC[11] = IMAX
HC[1:0]
For mode
FL_T[1:0]=11
Time
FLASH_EN input
EN_HCFLASH bit
Figure 24. Built-In Flash
HIGH CURRENT DRIVER ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
Typ
Max
2
Unit
µA
ILEAKAGE
FLASH pin leakage current
Maximum Sink Current
Accuracy at 300 mA
Current mirror ratio
0.1
IMAX(FLASH)
400
±10
mA
%
RFLASH=1.18 kΩ ±1%
±5
1:300
Backlight Drivers
LP3954 has 2 independent backlight drivers. Both drivers are regulated constant current sinks. LED current for
both LED banks (WLED1…4 and WLED5…6) are controlled by 8-bit current mode DACs with 0.1 mA step.
WLED1…4 and WLED5…6 can be also controlled with one DAC for better matching allowing the use of larger
displays having up to 6 white LEDs in parallel.
Display configuration is controlled with DISPL bit as shown below.
DISPL
Configuration
Matching
Main display up to 4 LEDs
Sub display up to 2 LEDs
Large display up to 6 LEDs
Good btw WLED1…4
Good btw WLED5…6
Good btw WLED 1…6
0
1
Display backlight enables
1
0
1
0
WLED1-4 enabled
EN_W1-4
EN_W5-6
WLED1-4 disabled
WLED5-6 enabled
WLED5-6 disabled
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External PWM
WLED1-4_pwm
&
8-Bit IDAC
WLED1-4
WLED1-4[7:0]
EN_W1-4
Figure 25. Main Display up to 4 LEDs (WLED1…4)
External PWM
&
WLED5-6_pwm
8-Bit IDAC
WLED5-6
WLED5-6[7:0]
EN_W5-6
Figure 26. Sub Display Driver up to 2 LEDs (WLED5…6)
External PWM
&
WLED1-4_pwm
8-Bit IDAC
WLED1-4
WLED1-4[7:0]
EN_W1-4
Figure 27. Main Display up to 6 LEDs (WLED1…6) (DISPL=1)
BACKLIGHT DRIVER ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
Typical
25.5
Max
29.4
1
Unit
mA
µA
mA
%
IMAX
Maximum Sink Current
Leakage Current
21.3
ILeakage
IWLED1
VFB =5V
0.03
WLED1 Current tolerance
IWLED1 set to 12.8mA (80H)
10.52
-18
12.8
14.78
+16
IMatch1-4
IMatch5-6
IMatch1-6
Sink Current Matching
Sink Current Matching
Sink Current Matching
ISINK=13mA, Between WLED1…4
ISINK=13mA, Between WLED5…6
ISINK=13mA, Between WLED1…6
0.2
0.2
0.3
%
%
%
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ADJUSTMENT
WLED1-4[7:0]
WLED5-6[7:0]
Driver Current,
mA (typical)
0000 0000
0000 0001
0000 0010
0000 0011
…
0
0.1
0.2
0.3
…
…
…
1111 1101
1111 1110
1111 1111
25.3
25.4
25.5
30
25
20
15
10
5
25oC
85oC
-40oC
0
0
0.05 0.10 0.15 0.20 0.25 0.30
WLED OUTPUT VOLTAGE (V)
Figure 28. WLED Output Current vs. Voltage
FADE IN / FADE OUT
LP3954 has an automatic fade in and out for main and sub backlight. The fade function is enabled with
EN_FADE bit. The slope of the fade curve is set by the SLOPE bit. Fade control for main and sub display is set
by FADE_SEL bit.
0
1
0
1
0
1
Automatic fade disabled
Automatic fade enabled
Fade execution time 1.3s
Fade execution time 0.65s
Fade controls WLED1-4
Fade controls WLED5-6
EN_FADE
SLOPE
FADE_SEL
Recommended fading sequence:
1. ASSUMPTION: Current WLED value in register
2. Set SLOPE
3. Set FADE_SEL
4. Set EN_FADE = 1
5. Set target WLED value
6. Fading will be done either within 0.5s or 1s based on Slope selection
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100
80
60
40
20
0
100
80
60
40
20
0
FADE OUT
FADE IN
FADE OUT
FADE IN
0
0.1
0.5 0.6 0.7
0
0.2
0.1 1.2 1.4
0.2 0.3 0.4
TIME (s)
0.4 0.6 0.8
TIME (s)
Figure 29. WLED Dimming, SLOPE=0
Figure 30. WLED Dimming, SLOPE=1
Ambient Light and Temperature Measurement with LP3954
The Analog-to-Digital converter (ADC) in the Audio Syncronization block can be also used for ambient light
measurement or temperature measurement.
The selection between these modes is controlled with input selector bits INPUT_SEL[1:0] as follows
INPUT_SEL[1:0]
Mode
00
Audio synchronization
Temperature measurement
(voltage input)
01
Ambient light measurement
(current input)
10
11
No input
AMBIENT LIGHT MEASUREMENT
The ambient light measurement requires only one external component: Ambient light sensor (photo transistor or
diode). The ADC reads the current level at ASE pin and converts the result in digital word. User can read the
ADC output from the ADC output register. The known ambient light condition allows user to set the backlight
current to optimal level thus saving power especially in low light and bright sunlight condition.
V
DDA
I
BIAS
R
1 mA
S2
AMBIENT
LIGHT
AIN
ADC
DDA
SENSOR
-
+
S1
S3
V
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FF
E0
C0
A0
80
60
40
20
00
0
1
2
3
4
5
6
7
INPUT CURRENT (mA)
Figure 31. ADC Code vs Input Current in Light Measurement Mode
TEMPERATURE MEASUREMENT
The temperature measurement requires two external components: resistor and thermistor (resistor that has
known temperature vs resistance curve). The ADC reads the voltage level at ASE pin and converts the result in
digital word. User can read the ADC output from register. The known temperature allows for example to monitor
the temperature inside the display module and decrease the current level of the LEDs if temperature raises too
high. This function may increase lifetime of LEDs in some applications.
R
ADC
-
+
V
V
DDA
DDA
TEMPERATURE
SENSOR
AIN
S1
S2
Figure 32. Temperature Sensor Connection Example
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FF
E0
C0
A0
80
60
40
20
00
100
10
1
0.1
0.01
-40 -20
0
20 40 60 80 100 120
0
0.2
0.4
0.6
0.8
1
TEMPERATURE (°C)
INPUT VOLTAGE × V
DDA
Figure 33. ADC Code vs Input Voltage in
Temperature Measurement Mode
Figure 34. Example Curve for Thermistor
EXAMPLE TEMP SENSOR READING AT DIFFERENT TEMPERATURES (R(25°C)=1MΩ)
T°C
-40
0
R(MΩ)
Rt(MΩ)
60
V(ASE)
2.7540984
2.24
1
1
1
1
1
4
25
1
1.4
60
0.2
0.04
0.4666667
0.1076923
100
7V Shielding
To shield LP3954 from high input voltages 6…7.2V the use of external 2.8V LDO is required. This 2.8V voltage
protects internally the device against high voltage condition. The recommended connection is as shown in the
picture below. Internally both logic and analog circuitry works at 2.8V supply voltage. Both supply voltage pins
should have separate filtering capacitors.
4.7 mH
BATTERY
C
IN
10 mF
SW
Digital
supply
voltage
V
V
DD1
DD2
V
DDA
2.8V
LDO
2.8V
LDO
C
VDDA
1 mF
C
VDD
100 nF
Analog
supply
voltage
LP3954
In cases where high voltage is not an issue the connection is as shown below.
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4.7 ꢀH
BATTERY
C
IN
10 ꢀF
C
VDD
100 nF
SW
Digital
supply
voltage
V
V
DD1
DD2
V
DDA
2.8V
LDO
C
VDDA
1 mF
Analog
supply
voltage
LP3954
Logic Interface Characteristics
(1.65V ≤ VDDIO ≤ VDD1,2V) (Unless otherwise noted)
Parameter
Test Conditions
Min
Typ
Max
Unit
LOGIC INPUTS SS, SI, SCK/SCL, SYNC/PWM, IF_SEL, EN_FLASH
VIL
VIH
II
Input Low Level
Input High Level
Logic Input Current
0.2 ×
VDDIO
V
V
0.8 ×
VDDIO
−1.0
1.0
µA
I2C Mode
400
kHz
SPI Mode,
VDDIO > 1.8V
13
5
MHz
MHz
fSCL
Clock Frequency
SPI Mode,
1.65V ≤ VDDIO < 1.8V
LOGIC OUTPUT SO
ISO = 3 mA
VDDIO > 1.8V
0.3
0.3
0.5
0.5
VOL
Output Low Level
V
V
ISO = 2 mA
1.65V ≤ VDDIO < 1.8V
ISO = −3 mA
VDDIO > 1.8V
VDDIO
0.5
−
VDDIO
0.3
−
−
VOH
Output High Level
ISO = -2 mA
1.65V ≤ VDDIO < 1.8V
VDDIO
0.5
−
VDDIO
0.3
IL
Output Leakage Current
VSO = 2.8V
ISDA = 3 mA
1.0
0.5
µA
V
LOGIC OUTPUT SDA
VOL
Output Low Level
0.3
Control Interface
The LP3954 supports two different interface modes:
•
•
SPI interface (4 wire, serial)
I2C compatible interface (2 wire, serial)
User can define the serial interface by IF_SEL pin. IF_SEL=0 selects the I2C mode.
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SPI INTERFACE
LP3954 is compatible with SPI serial bus specification and it operates as a slave. The transmission consists of
16-bit Write and Read Cycles. One cycle consists of 7 Address bits, 1 Read/Write (RW) bit and 8 Data bits. RW
bit high state defines a Write Cycle and low defines a Read Cycle. SO output is normally in high-impedance state
and it is active only when Data is sent out during a Read Cycle. A pull-up resistor may be needed in SO line if a
floating logic signal can cause unintended current consumption in the input circuits where SO is connected.The
Address and Data are transmitted MSB first. The Slave Select signal SS must be low during the Cycle
transmission. SS resets the interface when high and it has to be taken high between successive Cycles. Data is
clocked in on the rising edge of the SCK clock signal, while data is clocked out on the falling edge of SCK.
SS
SCK
1
R/W
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SI
SO
Figure 35. SPI Write Cycle
SS
SCK
SI
R/W
0
A6
A5
A4
A3
A2
A1
A0
Don't Care
D4 D3
SO
D7
D6
D5
D2
D1
D0
Figure 36. SPI Read Cycle
SS
5
3
12
2
1
4
SCK
SI
7
6
MSB IN BIT 14
BIT 9
BIT 8
R/W
BIT 7
BIT 1
LSB IN
11
8
9
10
MSBOUT
BIT 1
LSB OUT
SO
Address
Data
Figure 37. SPI Timing Diagram
SPI Timing Parameters
VDD = VDD_IO = 2.775V
Limit(1)
Symbol
Parameter
Unit
Min
Max
1
2
Cycle Time
Enable Lead Time
70
35
ns
ns
(1) Note: Data ensured by design.
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Unit
Limit(1)
Symbol
Parameter
Min
35
35
35
20
0
Max
3
4
Enable Lag Time
Clock Low Time
Clock High Time
Data Setup Time
Data Hold Time
Data Access Time
Disable Time
ns
ns
ns
ns
ns
ns
ns
ns
ns
5
6
7
8
20
10
20
9
10
11
Data Valid
Data Hold Time
0
I2C COMPATIBLE INTERFACE
I2C Signals
In I2C mode the LP3954 pin SCK is used for the I2C clock SCL and the pin SS is used for the I2C data signal
SDA. Both these signals need a pull-up resistor according to I2C specification. SI pin is the address select pin.
I2C address for LP3954 is 54h when SI = 0 and 55h when SI = 1. Unused pin SO can be left unconnected.
I2C Data Validity
The data on SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, state of
the data line can only be changed when CLK is LOW.
SCL
SDA
data
change
allowed
data
change
allowed
data
change
allowed
data
valid
data
valid
Figure 38. I2C Signals: Data Validity
I2C Start and Stop Conditions
START and STOP bits classify the beginning and the end of the I2C session. START condition is defined as SDA
signal transitioning from HIGH to LOW while SCL line is HIGH. STOP condition is defined as the SDA
transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and STOP bits.
The I2C bus is considered to be busy after START condition and free after STOP condition. During data
transmission, I2C master can generate repeated START conditions. First START and repeated START
conditions are equivalent, function-wise.
SDA
SCL
S
P
START condition
STOP condition
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Transferring Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) being transferred first.
Each byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated
by the master. The transmitter releases the SDA line (HIGH) during the acknowledge clock pulse. The receiver
must pull down the SDA line during the 9th clock pulse, signifying an acknowledge. A receiver which has been
addressed must generate an acknowledge after each byte has been received.
After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (R/W). The LP3954 address is 54h or 55H as selected with SI pin. For the
eighth bit, a “0” indicates a WRITE and a “1” indicates a READ. The second byte selects the register to which the
data will be written. The third byte contains data to write to the selected register.
MSB
LSB
ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 R/W
Bit7
bit6
2
bit5
bit4
bit3
bit2
bit1
bit0
I C SLAVE address (chip address)
Figure 39. I2C Chip Address
Register changes take an effect at the SCL rising edge during the last ACK from slave.
ack from slave
ack from slave
ack from slave
msb Chip Address lsb
w
ack
msb Register Add lsb
ack
msb DATA lsb
ack
stop
start
SCL
SDA
start
Id = 54h
w
ack
addr = 02h
ack
address 02h data
ack
stop
w = write (SDA = “0”)
r = read (SDA = “1”)
ack = acknowledge (SDA pulled down by either master or slave)
rs = repeated start
id = 7-bit chip address, 54h (SI=0) or 55h (SI=1) for LP3954.
Figure 40. I2C Write Cycle
When a READ function is to be accomplished, a WRITE function must precede the READ function, as shown in
the Read Cycle waveform.
ack from slave
repeated start
ack from slave data from slave ack from master
ack from slave
start
msb Chip Address lsb
w
msb Register Add lsb
rs
msb Chip Address lsb
r
msb DATA lsb
stop
SCL
SDA
start
Id = 54h
w
ack
addr = h00
ack rs
Id = 54h
r
ack
Address 00h data ack stop
Figure 41. I2C Read Cycle
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SDA
10
8
7
6
1
7
8
2
SCL
5
1
4
9
3
Figure 42. I2C Timing Diagram
I2C Timing Parameters (VDD1,2 = 3.0 to 4.5V, VDD_IO = 1.65V to VDD1,2
)
Limit(1)
Symbol
Parameter
Hold Time (repeated) START Condition
Unit
Min
0.6
1.3
600
600
300
0
Max
1
2
µs
µs
ns
ns
ns
ns
ns
ns
ns
ns
µs
pF
Clock Low Time
3
Clock High Time
4
Setup Time for a Repeated START Condition
Data Hold Time (Output direction, delay generated by LP3954)
Data Hold Time (Input direction, delay generated by the Master)
Data Setup Time
5
900
900
5
6
100
7
Rise Time of SDA and SCL
20+0.1Cb
15+0.1Cb
600
300
300
8
Fall Time of SDA and SCL
9
Set-up Time for STOP condition
10
Cb
Bus Free Time between a STOP and a START Condition
Capacitive Load for Each Bus Line
1.3
10
200
(1) NOTE: Data ensured by design
Autoincrement mode is available, with this possible read or write few byte with autoincreasing addresses, but
LP3954 has holes in address register map, and is recommended to use autoincrement mode only for the pattern
command registers.
Recommended External Components
OUTPUT CAPACITOR, COUT
The output capacitor COUT directly affects the magnitude of the output ripple voltage. In general, the higher the
value of COUT, the lower the output ripple magnitude. Multilayer ceramic capacitors with low ESR are the best
choice. At the lighter loads, the low ESR ceramics offer a much lower Vout ripple that the higher ESR tantalums
of the same value. At the higher loads, the ceramics offer a slightly lower Vout ripple magnitude than the
tantalums of the same value. However, the dv/dt of the Vout ripple with the ceramics is much lower that the
tantalums under all load conditions. Capacitor voltage rating must be sufficient, 10V or greater is recommended.
Some ceramic capacitors, especially those in small packages, exhibit a strong capacitance reduction
with the increased applied voltage. The capacitance value can fall to below half of the nominal
capacitance. Too low output capacitance will increase the noise and it can make the boost converter
unstable.
INPUT CAPACITOR, CIN
The input capacitor CIN directly affects the magnitude of the input ripple voltage and to a lesser degree the VOUT
ripple. A higher value CIN will give a lower VIN ripple. Capacitor voltage rating must be sufficient, 10V or greater is
recommended.
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OUTPUT DIODE, DOUT
A Schottky diode should be used for the output diode. To maintain high efficiency the average current rating of
the schottky diode should be larger than the peak inductor current (1A). Schottky diodes with a low forward drop
and fast switching speeds are ideal for increasing efficiency in portable applications. Choose a reverse
breakdown of the schottky diode larger than the output voltage. Do not use ordinary rectifier diodes, since slow
switching speeds and long recovery times cause the efficiency and the load regulation to suffer.
INDUCTOR, L1
The LP3954’s high switching frequency enables the use of the small surface mount inductor. A 4.7 µH shielded
inductor is suggested for 2 MHz operation, 10 µH should be used at 1 MHz. The inductor should have a
saturation current rating higher than the peak current it will experience during circuit operation (1A). Less than
300 mΩ ESR is suggested for high efficiency. Open core inductors cause flux linkage with circuit components
and interfere with the normal operation of the circuit. This should be avoided. For high efficiency, choose an
inductor with a high frequency core material such as ferrite to reduce the core losses. To minimize radiated
noise, use a toroid, pot core or shielded core inductor. The inductor should be connected to the SW pin as close
to the IC as possible.
LIST OF RECOMMENDED EXTERNAL COMPONENTS
Symbol
CVDD1
CVDD2
CVDDIO
CVDDA
COUT
Symbol Explanation
C between VDD1 and GND
Value
100
100
100
1
Unit
nF
nF
nF
µF
µF
µF
µH
nF
nF
kΩ
kΩ
kΩ
V
Type
Ceramic, X7R / X5R
Ceramic, X7R / X5R
Ceramic, X7R / X5R
Ceramic, X7R / X5R
Ceramic, X7R / X5R, 10V
Ceramic, X7R / X5R
Shielded,low ESR, Isat 1A
Ceramic, X7R
C between VDD2 and GND
C between VDDIO and GND
C between VDDA and GND
C between FB and GND
10
CIN
C between battery voltage and GND
L between SW and VBAT at 2 MHz
C between VREF and GND
10
LBOOST
CVREF
CVDDIO
RFLASH
RRBG
4.7
100
100
1.2
5.6
82
C between VDDIO and GND
R between IFLASH and GND
R between IRGB and GND
Ceramic, X7R
±1%
±1%
RRT
R between IRT and GND
±1%
DOUT
Rectifying Diode (Vf at maxload)
C between Audio input and ASE
0.3
100
Schottky diode
CASE
nF
Ceramic, X7R / X5R
LEDs
DLIGHT
User defined
Light Sensor
TDK BSC2015
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Application Examples
EXAMPLE 1
I
= 300...400 mA
= 4...5.3V
MAX
L1
4.7 éH
+
D1
V
OUT
C
OUT
10 éF
C
IN
10 éF
C
VDD1
100 nF
-
FB
SW
BATTERY
V
V
DD2
WLED1
DD1
WLED2
WLED3
MAIN
&
SUB
V
DDA
C
WLED4
BACKLIGHT
VDDA
V
REF
1 éF
C
REF
WLED5
WLED6
100 nF
IRGB
IRT
R1
R
RT
R
RGB
LP3954
G1
B1
FUNLIGHTS
SO
SI
SCK/SCL
MCU
SS/SDA
SYNC/PWM
VDDIO
VBAT
IF_SEL
R2
G2
B2
C
VDDIO
RGB
INDICATION
LED
100 nF
FLASH_EN
ASE
CAMERA
AUDIO
SINGLE
WHITE
FLASH LED
300 mA
FLASH
IFLASH
GNDS
GND
R
FLASH
•
•
•
•
•
MAIN BACKLIGHT
SUB BACKLIGHT
AUDIO SYNCHRONIZED FUNLIGHTS
RGB INDICATION LIGHT
FLASH LED
Figure 43. Flip Phone
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EXAMPLE 2
I
= 300...400 mA
= 4...5.3V
L1
4.7 éH
MAX
D1
V
OUT
C
C
VDD1
C
OUT
10 éF
IN
10 éF 100 nF
FB
SW
BATTERY
V
V
DD2
WLED1
DD1
WLED2
WLED3
SMART
PHONE
BACKLIGHT
V
V
DDA
C
WLED4
WLED5
VDDA
REF
1 éF
C
REF
100 nF
WLED6
IRGB
IRT
R1
R
R
RGB
RT
LP3954
KEYPAD
LEDS
G1
B1
SO
SI
SCK/SCL
MCU
SS/SDA
SYNC/PWM
VDDIO
VBAT
IF_SEL
R2
G2
B2
C
VDDIO
100 nF
RGB
INDICATION
LED
FLASH_EN
ASE
CAMERA
SINGLE
WHITE
FLASH LED
300 mA
LDO 2.8V
TEMPERATURE
SENSOR
FLASH
IFLASH
GNDS
R
FLASH
•
•
•
•
•
6 WHITE LED BACKLIGHT
KEY PAD LIGHTS
RGB INDICATION LED
WHITE SINGLE LED FLASH
TEMPERATURE SENSOR
Figure 44. Smart Phone
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EXAMPLE 3
L1
4.7 éH
I
= 300...400 mA
= 4...5.3V
MAX
D1
V
OUT
C
C
VDD1
C
OUT
10 éF
IN
10 éF 100 nF
FB
SW
BATTERY
V
V
DD2
WLED1
DD1
WLED2
WLED3
MAIN
BACKLIGHT
V
DDA
C
WLED4
VDDA
V
REF
1 éF
C
REF
100 nF
WLED5
IRGB
IRT
KEYPAD
LEDS
R
R
RT
RGB
WLED6
LP3954
SO
SI
R1
G1
SCK/SCL
MCU
SS/SDA
SYNC/PWM
VDDIO
AUDIO
SYNC
FUNLIGHTS
B1
R2
IF_SEL
C
VDDIO
100 nF
G2
B2
FLASH_EN
ASE
AUDIO
FLASH
IFLASH
VIBRA
GNDS
GND
R
FLASH
•
•
•
•
MAIN BACKLIGHT
KEYPAD LIGHTS
AUDIO SYNCHRONIZED FUNLIGHTS
VIBRA
Figure 45. Candybar Phone
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EXAMPLE 4
I
= 300...400 mA
= 4...5.3V
MAX
L1
4.7 éH
+
-
D1
V
OUT
C
IN
10 éF
C
C
OUT
10 éF
VDD1
100 nF
SW
FB
BATTERY
V
V
DD2
WLED1
WLED2
WLED3
C
DD1
DDA
VDDA
1 éF
V
C
REF
100 nF
V
REF
WLED4
R
RGB
IRGB
IRT
WLED5
WLED6
R
RT
SO
SI
SCK/SCL
R1
MCU
SS/SDA
SYNC/PWM
VDDIO
G1
B1
IF_SEL
C
VDDIO
100 nF
FLASH_EN
R4
100k
R3
100k
V
DDA
VBAT
R2
G2
B2
AUDIO
LMV321
+
-
ASE
C2
10 nF
R1
10k
C1
100 nF
R2
100k
FLASH
IFLASH
GNDS
•
•
•
•
MAIN BACKLIGHT
SUB BACKLIGHT
AUDIO SYNCHRONIZED FUNLIGHTS
RGB INDICATION LIGHT
There may be cases where the audio input signal going into the LP3954 is too weak for audio synchronization. This
figure presents a single-supply inverting amplifier connected to the ASE input for audio signal amplification. The
amplification is +20 dB, which is well enough for 20 mVp-p audio signal. Because the amplifier (LMV321) is operating
in single supply voltage, a voltage divider using R3 and R4 is implemented to bias the amplifier so the input signal is
within the input common-mode voltage range of the amplifier. The capacitor C1 is placed between the inverting input
and resistor R1 to block the DC signal going into the audio signal source. The values of R1 and C1 affect the cutoff
frequency, fc = 1/(2*Pi*R1*C1), in this case it is around 160 Hz. As a result, the LMV321 output signal is centered
around mid-supply, that is VDDA/2. The output can swing to both rails, maximizing the signal-to-noise ratio in a low
voltage system
Figure 46. Using Extra Amplifier
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EXAMPLE 5
I
= 300...400 mA
= 4...5.3V
L1
4.7 éH
MAX
+
D1
V
OUT
C
IN
10 éF
C
C
OUT
10 mF
VDD1
100 nF
-
SW
FB
BATTERY
V
V
DD2
WLED1
WLED2
WLED3
C
VDDA
DD1
DDA
1 éF
V
C
REF
100 nF
WLED4
V
REF
R
RGB
IRGB
IRT
WLED5
WLED6
R
RT
SO
SI
SCK/SCL
R1
MCU
SS/SDA
SYNC/PWM
VDDIO
G1
B1
IF_SEL
C
VDDIO
100 nF
FLASH_EN
PWM
AUDIO
SIGNAL
VBAT
C1
10 nF
R2
10k
R1
10k
R2
G2
B2
ASE
C2
10 nF
C3
10 nF
FLASH
IFLASH
GNDS
•
•
•
•
MAIN BACKLIGHT
SUB BACKLIGHT
AUDIO SYNCHRONIZED FUNLIGHTS
RGB INDICATION LIGHT
Here, a second order RC-filter is used on the ASE input to convert a PWM signal to an analog waveform.
Figure 47. Using PWM Signal
More application information is available in the document "LP3954 Evaluation Kit".
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SNVS340D –JUNE 2005–REVISED MARCH 2013
LP3954 Control Registers
Table 3. LP3954 Control Register Names and Default Values
ADDR
(HEX)
REGISTER
RGB Ctrl
D7
D6
D5
D4
D3
D2
D1
D0
00
cc_rgb1
cc_rgb2
r1sw
0
g1sw
0
b1sw
0
r2sw
0
g2sw
0
b2sw
0
1
1
07
Ext. PWM control
wled1_4
_pwm
wled5_6
_pwm
r1_pwm
g1_pwm
b1_pwm
r2_pwm
g2_pwm
b2_pwm
0
0
0
0
slope
0
0
fade_sel
0
0
en_fade
0
0
displ
0
0
en_w1_4
0
0
en_w5_6
0
08
09
0A
0B
WLED control
WLED1-4
WLED5-6
Enables
wled1_4[7:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
wled5_6[7:0]
0
0
pwm_
sync
nstby
en_
boost
en_
autoload
rgb_sel[1:0]
0
0
0
0
0
0
0
0
1
1
0
1
1
0
0
0
0
1
1
0C
0D
0E
10
ADC output
Boost output
Boost_frq
data[7:0]
0
1
0
1
boost[7:0]
1
freq_sel[2:0]
1
HC_Flash
hc_pwm
fl_t[1:0]
hc[1:0]
en_
hcflash
0
0
0
0
0
rgb_start
0
0
loop
0
0
log
0
11
12
13
2A
2B
50
51
52
53
54
55
56
57
Pattern gen ctrl
RGB1 max current
RGB2 max current
audio sync CTRL1
audio sync CTRL2
Command 1A
ir1[1:0]
ir2[1:0]
ig1[1:0]
ib1[1:0]
0
0
0
0
0
0
0
0
0
0
0
1
ig2[1:0]
ib2[1:0]
0
en_agc
0
gain_sel[2:0]
sync_mode
en_sync
input_sel[1:0]
0
0
0
0
en_avg
0
0
1
mode_ctrl[1:0]
speed_ctrl[1:0]
0
g[2:0]
0
0
0
0
0
0
0
0
0
0
0
0
r[2:0]
cet[3:2]
cet[3:2]
cet[3:2]
cet[3:2]
0
0
0
0
0
0
0
0
0
0
b[2:0]
0
0
tt[2:0]
0
0
0
0
0
0
0
0
0
Command 1B
cet[1:0]
0
0
0
0
0
0
0
0
r[2:0]
0
0
g[2:0]
0
Command 2A
0
b[2:0]
0
0
tt[2:0]
0
Command 2B
cet[1:0]
0
r[2:0]
0
0
g[2:0]
0
Command 3A
0
b[2:0]
0
0
tt[2:0]
0
Command 3B
cet[1:0]
cet[1:0]
0
r[2:0]
0
0
g[2:0]
0
Command 4A
0
b[2:0]
0
0
tt[2:0]
0
Command 4B
0
0
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Table 3. LP3954 Control Register Names and Default Values (continued)
ADDR
(HEX)
REGISTER
D7
D6
D5
D4
D3
D2
D1
D0
58
59
5A
5B
5C
5D
5E
5F
60
Command 5A
r[2:0]
g[2:0]
cet[3:2]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
b[2:0]
0
0
0
0
0
0
0
0
0
0
0
tt[2:0]
0
0
0
0
0
0
0
0
0
Command 5B
Command 6A
Command 6B
Command 7A
Command 7B
Command 8A
Command 8B
Reset
cet[1:0]
cet[1:0]
cet[1:0]
cet[1:0]
0
r[2:0]
0
0
g[2:0]
0
cet[3:2]
cet[3:2]
cet[3:2]
0
b[2:0]
0
0
tt[2:0]
0
0
r[2:0]
0
0
g[2:0]
0
0
b[2:0]
0
0
tt[2:0]
0
0
r[2:0]
0
0
g[2:0]
0
0
b[2:0]
0
0
tt[2:0]
0
0
0
Writing any data to Reset Register resets LP3954
LP3954 Registers
REGISTER BIT EXPLANATIONS
Each register is shown with a key indicating the accessibility of the each individual bit, and the initial condition:
Register Bit Accessibility and Initial Condition
Key
rw
Bit Accessibility
Read/write
r
Read only
–0,–1
Condition after POR
RGB CTRL (00H) – RGB LEDS CONTROL REGISTER
D7
cc_rgb1
rw-1
D6
cc_rgb2
rw-1
D5
D4
D3
D2
D1
D0
r1sw
rw-0
g1sw
rw-0
b1sw
rw-0
r2sw
rw-0
g2sw
rw-0
b2sw
rw-0
0 - R1, G1 and B1 are constant current sinks, current limited internally
1 - R1, G1 and B1 are switches, limit current with external ballast resistor
cc_rgb1
Bit 7
Bit 6
Bit 5
0 – R2, G2 and B2 are constant current sinks, current limited internally
1 – R2, G2 and B2 are switches, limit current with external ballast resistor
cc_rgb2
r1sw
0 – R1 disabled
1 – R1 enabled
0 – G1 disabled
1 – G1 enabled
g1sw
b1sw
r2sw
Bit 4
Bit 3
0 – B1 disabled
1 – B1 enabled
0 – R2 disabled
1 – R2 enabled
Bit 2
Bit 1
Bit 0
0 – G2 disabled
1 – G2 enabled
g2sw
b2sw
0 – B2 disabled
1 – B2 enabled
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EXT_PWM_CONTROL (07H) – EXTERNAL PWM CONTROL REGISTER
D7
D6
D5
r1_pwm
rw-0
D4
g1_pwm
rw-0
D3
b1_pwm
rw-0
D2
r2_pwm
rw-0
D1
g2_pwm
rw-0
D0
b2_pwm
rw-0
wled1_4_pwm wled5_6_pwm
rw-0
rw-0
0 – WLED1…WLED4 PWM control disabled
1 – WLED1…WLED4 PWM control enabled
wled1_4_pwm Bit 7
wled5_6_pwm Bit 6
0 – WLED5, WLED6 PWM control disabled
1 – WLED5, WLED6 PWM control enabled
0 – R1 PWM control disabled
1 – R1 PWM control enabled
r1_pwm
g1_pwm
b1_pwm
r2_pwm
g2_pwm
b2_pwm
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0 – G1 PWM control disabled
1 – G1 PWM control enabled
0 – RB PWM control disabled
1 – B1 PWM control enabled
0 – R2 PWM control disabled
1 – R2 PWM control enabled
0 – G2 PWM control disabled
1 – G2 PWM control enabled
0 – B2 PWM control disabled
1 – B2 PWM control enabled
WLED CONTROL (08H) – WLED CONTROL REGISTER
D7
r-0
D6
r-0
D5
D4
fade_sel
rw-0
D3
en_fade
rw-0
D2
D1
en_w1_4
rw-0
D0
en_w5_6
rw-0
slope
rw-0
displ
rw-0
0 – fade execution time 1.3 sec
1 – fade execution time 0.65 sec
slope
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0 – fade control for WLED1… WLED4
1 – fade control for WLED5, WLED6
fade_sel
en_fade
displ
0 – automatic fade disabled
1 – automatic fade enabled
0 – WLED1-4 and WLED5-6 are controlled separately
1 – WLED1-4 and WLED5-6 are controlled with WLED1-4 controls
0 – WLED1…WLED4 disabled
1 – WLED1…WLED4 enabled
en_w1_4
en_w5_6
0 – WLED5,WLED6 disabled
1 – WLED5,WLED6 enabled
WLED1-4 (09H) – WLED1…WLED4 BRIGHTNESS CONTROL REGISTER
D7
D6
D5
D4
D3
D2
D1
D0
wled1_4[7:0]
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
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Adjustment
Typical driver current (ma)
wled1_4[7:0]
0000 0000
0000 0001
0000 0010
0000 0011
0000 0100
…
0
0.1
0.2
0.3
0.4
…
wled1_4[7:0]
Bits 7-0
1111 1101
1111 1110
1111 1111
25.3
25.4
25.5
WLED5-6 (0AH) – WLED5, WLED6 BRIGHTNESS CONTROL REGISTER
D7
D6
D5
D4
D3
D2
D1
D0
wled5_5[7:0]
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
Adjustment
wled5_6[7:0]
0000 0000
0000 0001
0000 0010
0000 0011
0000 0100
…
Typical driver current (ma)
0
0.1
0.2
0.3
0.4
…
wled5_6[7:0]
Bits 7-0
1111 1101
1111 1110
1111 1111
25.3
25.4
25.5
ENABLES (0BH) – ENABLES REGISTER
D7
pwm_sync
rw-0
D6
D5
en_boost
rw-0
D4
r-0
D3
r-0
D2
en_autoload
rw-1
D1
D0
nstby
rw-0
rgb_sel[1:0]
rw-0
rw-0
0 – synchronization to external clock disabled
1 – synchronization to external clock enabled
pwm_sync
nstby
Bit 7
0 – LP3954 standby mode
1 – LP3954 active mode
Bit 6
Bit 5
Bit 2
0 – boost converter disabled
1 – boost converter enabled
en_boost
en_autoload
0 – internal boost converter active load off
1 – internal boost converter active load on
Color LED control mode selection
rgb_sel[1:0]
Audio sync connected
to
Pattern generator
connected to
00
01
10
11
none
RGB1
RGB1 & RGB2
RGB2
rgb_sel[1:0]
Bits 1-0
RGB2
RGB1
RGB1 & RGB2
none
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ADC_OUTPUT (0CH) – ADC DATA REGISTER
D7
D6
D5
r-0
D4
r-0
D3
r-0
D2
r-0
D1
r-0
D0
r-0
data[7:0]
r-0
r-0
data[7:0]
Bits 7-0
Data register ADC (Audio input, light or temperature sensors)
BOOST_OUTPUT (0DH) – BOOST OUTPUT VOLTAGE CONTROL REGISTER
D7
D6
D5
D4
D3
D2
rw-1
D1
D0
Boost[7:0]
rw-0
rw-0
rw-1
rw-1
rw-1
rw-1
rw-1
Adjustment
Boost[7:0]
0000 0000
0000 0001
0000 0011
0000 0111
0000 1111
0001 1111
0011 1111
0111 1111
1111 1111
Typical boost output (V)
4.00
4.25
4.40
Boost[7:0]
Bits 7-0
4.55
4.70
4.85
5.00 (default)
5.15
5.30
BOOST_FRQ (0EH) – BOOST FREQUENCY CONTROL REGISTER
D7
r-0
D6
r-0
D5
r-0
D4
r-0
D3
r-0
D2
D1
freq_sel[2:0]
rw-1
D0
rw-1
rw-1
Adjustment
freq_sel[2:0]
Frequency
freq_sel[2:0]
Bits 7-0
1xx
01x
00x
2.00 MHz
1.67 MHz
1.00 MHz
HC_FLASH (10H) – HIGH CURRENT FLASH DRIVER CONTROL REGISTER
D7
r-0
D6
r-0
D5
hc_pwm
rw-0
D4
D3
D2
D1
D0
en_hcflash
rw-0
fl_t[1:0]
hc[1:0]
rw-0
rw-0
rw-0
rw-0
0 – PWM for high current flash driver disabled
1 – PWM for high current flash driver enabled
hc_pwm
Bit 5
Flash duration for high current driver
fl_t[1:0]
00
Typical flash duration
200 ms
fl_t[1:0]
Bits 4-3
01
400 ms
600 ms
10
11
According EN_FLASH pin on duration
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Current control for high current flash driver
current
hc[1:0]
00
0.25×IMAX(FLASH)
hc[1:0]
Bits 2-1
Bit 0
01
0.50×IMAX(FLASH)
10
0.75×IMAX(FLASH)
11
1.00×IMAX(FLASH)
0 – high current flash driver disabled
1 – high current flash driver enabled
en_hcflash
PATTERN_GEN_CTRL (11H) – PATTERN GENERATOR CONTROL REGISTER
D7
r-0
D6
r-0
D5
r-0
D4
r-0
D3
r-0
D2
rgb_start
rw-0
D1
D0
log
loop
rw-0
rw-0
0 – Pattern generator disabled
1 – execution pattern starting from command 1
rgb_start
loop
Bit 2
Bit 1
Bit 0
0 – pattern generator loop disabled (single patter)
1 – pattern generator loop enabled (execute until stopped)
0 – color intensity mode 0
1 – color intensity mode 1
log
RGB1_MAX_CURRENT (12H) – RGB1 DRIVER INDIVIDUAL MAXIMUM CURRENT CONTROL REGISTER
D7
r-0
D6
r-0
D5
D4
D3
D2
D1
D0
ir1[1:0]
ig1[1:0]
ib1[1:0]
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
Maximum current for R1 driver
ir1[2:0]
Maximum output current
0.25×IMAX
00
01
10
11
ir1[1:0]
Bits 5-4
Bits 3-2
Bits 1-0
0.50×IMAX
0.75×IMAX
1.00×IMAX
1aximum current for G1 driver
ig2[1:0]
00
Maximum output current
0.25×IMAX
ig1[1:0]
ib1[1:0]
01
0.50×IMAX
10
0.75×IMAX
11
1.00×IMAX
Maximum current for B1 driver
ib1[1:0]
00
Maximum output current
0.25×IMAX
01
0.50×IMAX
10
0.75×IMAX
11
1.00×IMAX
RGB2_MAX_CURRENT (13H) – RGB2 DRIVER INDIVIDUAL MAXIMUM CURRENT CONTROL REGISTER
D7
D6
D5
D4
D3
D2
D1
D0
ir2[1:0]
ig2[1:0]
ib2[1:0]
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
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ir2[1:0]
SNVS340D –JUNE 2005–REVISED MARCH 2013
Maximum current for R2 driver
ir2[2:0]
00
Maximum output current
0.25×IMAX
Bits 5-4
Bits 3-2
Bits 1-0
01
0.50×IMAX
10
0.75×IMAX
11
1.00×IMAX
Maximum current for G2 driver
ig2[1:0]
00
Maximum output current
0.25×IMAX
ig2[1:0]
ib2[1:0]
01
0.50×IMAX
10
0.75×IMAX
11
1.00×IMAX
Maximum current for B2 driver
ib2[1:0]
00
Maximum output current
0.25×IMAX
01
0.50×IMAX
10
0.75×IMAX
11
1.00×IMAX
AUDIO_SYNC_CTRL1 (2AH) – AUDIO SYNCHRONIZATION AND ADC CONTROL REGISTER 1
D7
D6
gain_sel[2:0]
rw-0
D5
D4
sync_mode
rw-0
D3
en_agc
rw-0
D2
en_sync
rw-0
D1
D0
input_sel[1:0]
rw-0
rw-0
rw-1
rw-1
Input signal gain control
gain, db
gain_sel[2:0]
000
0 (default)
001
3
6
010
gain_sel[2:0]
Bits 7-5
011
9
100
12
15
18
21
101
110
111
Input filter mode control
0 – Amplitude mode
sync_mode
Bit 4
1 – Frequency mode
0 – automatic gain control disabled
1 – automatic gain control enabled
en_agc
Bit 3
Bit 2
0 – audio synchronization disabled
1 – audio synchronization enabled
en_sync
ADC input selector
input_sel[1:0]
Input
00
01
10
11
Single ended input signal (ASE)
Temperature measurement
Ambient light measurement
No input (default)
input_sel[1:0]
Bits 1-0
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AUDIO_SYNC_CTRL2 (2BH) – AUDIO SYNCHRONIZATION AND ADC CONTROL REGISTER 2
D7
r-0
D6
r-0
D5
r-0
D4
en_avg
rw-0
D3
D2
D1
D0
mode_ctrl[1:0]
speed_ctrl[1:0]
rw-0
rw-0
rw-0
rw-0
0 – averaging disabled
1 – averaging enabled
en_avg
Bit 4
mode_ctrl[1:0]
Bits 3-2
Filtering mode control
LEDs light response time to audio input
speed_ctrl[1:0]
Response
FASTEST (default)
FAST
00
01
10
11
speed_ctrl[1:0]
Bits 1-0
MEDIUM
SLOW
PATTERN CONTROL REGISTERS
Command_[1:8]A – Pattern Control Register A
D7
D6
D5
D4
D3
D2
D1
D0
r[2:0]
rw-0
g[2:0]
rw-0
cet[3:2]
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
Command_[1:8]B – Pattern Control Register B
D7
D6
D5
D4
D3
D2
D1
D0
cet[1:0]
b[2:0]
rw-0
tt[2:0]
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
rw-0
Red color intensity
current, %
r[2:0]
log=0
log=1
000
001
010
011
100
101
110
111
0×IMAX
0×IMAX
7%×IMAX
14%×IMAX
21%×IMAX
32%×IMAX
46%×IMAX
71%×IMAX
100%×IMAX
1%×IMAX
2%×IMAX
Bits
7-5A
r[2:0]
4%×IMAX
10%×IMAX
21%×IMAX
46%×IMAX
100%×IMAX
* log bit is in pattern_gen_ctrl register
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SNVS340D –JUNE 2005–REVISED MARCH 2013
Green color intensity
current, %
g[2:0]
log=0
log=1
0×IMAX
000
0×IMAX
001
7%×IMAX
14%×IMAX
21%×IMAX
32%×IMAX
46%×IMAX
71%×IMAX
100%×IMAX
1%×IMAX
2%×IMAX
4%×IMAX
10%×IMAX
21%×IMAX
46%×IMAX
100%×IMAX
010
Bits
4-2A
g[2:0]
011
100
101
110
111
* log bit is in pattern_gen_ctrl register
Command execution time
cet[3:0]
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
CET duration, ms
197
393
590
786
983
1180
1376
1573
1769
1966
2163
2359
2556
2753
2949
3146
Bits
1-0A
7-6B
cet[3:0]
Blue color intensity
current, %
b[2:0]
log=0
log=1
0×IMAX
000
001
010
011
100
101
110
111
0×IMAX
7%×IMAX
14%×IMAX
21%×IMAX
32%×IMAX
46%×IMAX
71%×IMAX
100%×IMAX
1%×IMAX
2%×IMAX
4%×IMAX
10%×IMAX
21%×IMAX
46%×IMAX
100%×IMAX
Bits
5-3B
b[2:0]
* log bit is in pattern_gen_ctrl register
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Transition time
Transition time, ms
tt[2:0]
000
001
010
011
100
101
110
111
0
55
110
221
442
885
1770
3539
Bits
2-0B
tt[2:0]
RESET (60H) - RESET REGISTER
D7
r-0
D6
r-0
D5
Writing any data to Reset Register in address 60H can reset LP3954
r-0 r-0 r-0 r-0
D4
D3
D2
D1
r-0
D0
r-0
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SNVS340D –JUNE 2005–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 52
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PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LP3954TL/NOPB
LP3954TLX/NOPB
ACTIVE
ACTIVE
DSBGA
DSBGA
YZR
YZR
36
36
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-30 to 85
-30 to 85
D49B
D49B
Samples
Samples
1000 RoHS & Green
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2022
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-May-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP3954TL/NOPB
LP3954TLX/NOPB
DSBGA
DSBGA
YZR
YZR
36
36
250
178.0
178.0
12.4
12.4
3.21
3.21
3.21
3.21
0.76
0.76
8.0
8.0
12.0
12.0
Q1
Q1
1000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-May-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP3954TL/NOPB
LP3954TLX/NOPB
DSBGA
DSBGA
YZR
YZR
36
36
250
208.0
208.0
191.0
191.0
35.0
35.0
1000
Pack Materials-Page 2
MECHANICAL DATA
YZR0036xxx
D
0.600±0.075
E
TLA36XXX (Rev D)
D: Max = 3.013 mm, Min =2.952 mm
E: Max = 3.013 mm, Min =2.952 mm
4215058/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
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