首页 |元器件品牌

LP3981IMMX-2.5/NOPB [TI]

300-mA, high-accuracy, low-dropout voltage regulator with enable 8-VSSOP -40 to 125;
LP3981IMMX-2.5/NOPB
型号： LP3981IMMX-2.5/NOPB
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

300-mA, high-accuracy, low-dropout voltage regulator with enable 8-VSSOP -40 to 125

线性稳压器IC 调节器 电源电路 光电二极管 输出元件
文件： 总21页 (文件大小：1065K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
 查看货源
LP3981  
www.ti.com  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
LP3981 Micropower, 300mA Ultra Low-Dropout CMOS Voltage Regulator  
Check for Samples: LP3981  
1
FEATURES  
APPLICATIONS  
2
•
•
Small, Space Saving VSSOP-8  
•
•
•
•
•
CDMA Cellular Handsets  
Low Thermal Resistance in WSON-6 Package  
Gives Excellent Power Capability  
Wideband CDMA Cellular Handsets  
GSM Cellular Handsets  
•
•
Logic Controlled Enable  
Portable Information Appliances  
Tiny 3.3V ± 5% to 2.5V, 300mA Converter  
Stable with Ceramic and High Quality  
Tantalum Capacitors  
•
•
Fast Turn-On  
DESCRIPTION  
The LP3981's performance is optimized for battery  
powered systems to deliver ultra low noise, extremely  
low dropout voltage and low quiescent current.  
Regulator ground current increases only slightly in  
dropout, further prolonging the battery life.  
Thermal Shutdown and Short-Circuit Current  
Limit  
KEY SPECIFICATIONS  
•
•
•
•
•
2.5 to 6.0V Input Range  
300mA Output  
Power supply rejection is better than 60 dB at low  
frequencies. This high power supply rejection is  
maintained down to lower input voltage levels  
common to battery operated circuits.  
60dB PSRR at 1kHz  
≤1μA Quiescent Current when Shut Down  
Fast Turn-On Time: 120 μs (Typ.) with CBYPASS  
= 0.01uF  
The device is ideal for mobile phone and similar  
battery powered wireless applications. It provides up  
to 300 mA, from a 2.5V to 6V input, consuming less  
than 1µA in disable mode.  
•
•
•
132mV Typ Dropout with 300mA Load  
35μVrms Output Noise over 10Hz to 100kHz  
The LP3981 is available in VSSOP-8 package. For  
LP3981 in WSON-6 package, contact TI sales offices.  
Performance is specified for −40°C to +125°C  
temperature range. The device available in the  
following output voltages; 2.5V, 2.7V, 2.8V, 2.83V,  
3.0V, 3.03V and 3.3V as standard. Other output  
options can be made available, please contact your  
local TI sales office.  
−40 to +125°C Junction Temperature Range for  
Operation  
•
2.5V, 2.7V, 2.8V, 2.83V, 3.0V, 3.03V, and 3.3V  
Outputs Standard  
Typical Application Circuit  
Note: Pin Numbers in parenthesis indicate WSON-6 package.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2001–2013, Texas Instruments Incorporated  
LP3981  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
www.ti.com  
Block Diagram  
PIN DESCRIPTIONS  
Name  
VEN  
VSSOP-8  
WSON-6  
Function  
Enable Input Logic, Enable High.  
Common Ground. Connect to PAD.  
Output Voltage of the LDO.  
7
5
1
2
6
4
6
4
1
2
5
3
GND  
VOUT  
VIN  
Input Voltage of the LDO.  
Bypass  
VOUT-SENSE  
Optional bypass capacitor for noise reduction.  
Output. Voltage Sense Pin. Should be connected to  
VOUT for proper operation.  
N.C.  
3, 8  
GND  
PAD  
Common Ground. Connect to pin 4.  
Connection Diagrams  
1
2
3
6
5
4
V
V
OUT  
EN  
Device  
Code  
Bypass  
GND  
V
IN  
V
OUT-SENSE  
GND  
Figure 1. Top View  
VSSOP-8 Package  
See Package Number DGK  
Figure 2. Top View  
WSON-6 Package  
See Package Number NGC0006D  
2
Submit Documentation Feedback  
Copyright © 2001–2013, Texas Instruments Incorporated  
Product Folder Links: LP3981  
LP3981  
www.ti.com  
WSON-6  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
ORDERING INFORMATION(1)(2)  
LP3981 Supplied as  
1000 Units  
LP3981 Supplied as  
Output Voltage  
Grade  
4500 Units  
Package Marking  
Tape and Reel  
Tape and Reel  
2.5V  
LP3981ILD-2.5  
LP3981ILD-2.7  
LP3981ILD-2.8  
LP3981ILD-2.83  
LP3981ILD-3.0  
LP3981ILD-3.03  
LP3981ILD-3.3  
LP3981ILDX-2.5  
LP3981ILDX-2.7  
LP3981ILDX-2.8  
LP3981ILDX-2.83  
LP3981ILDX-3.0  
LP3981ILDX-3.03  
LP3981ILDX-3.3  
LO1UB  
LO1VB  
LO1ZB  
L01SB  
L017B  
LO1YB  
LO1XB  
2.7V  
2.8V  
2.83V  
STD  
3.0V  
3.03V  
3.3V  
VSSOP-8 Package  
LP3981 Supplied as  
1000 Units  
LP3981 Supplied as  
3500 Units  
Output Voltage  
Grade  
Package Marking  
Tape and Reel  
Tape and Reel  
2.5V  
2.7V  
2.8V  
2.83V  
3.0V  
3.03V  
3.3V  
LP3981IMM-2.5  
LP3981IMM-2.7  
LP3981IMM-2.8  
LP3981IMM-2.83  
LP3981IMM-3.0  
LP3981IMM-3.03  
LP3981IMM-3.3  
LP3981IMMX-2.5  
LP3981IMMX-2.7  
LP3981IMMX-2.8  
LP3981IMMX-2.83  
LP3981IMMX-3.0  
LP3981IMMX-3.03  
LP3981IMMX-3.3  
LFKB  
LFLB  
LFTB  
LDUB  
LF3B  
LFPB  
LFNB  
STD  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Copyright © 2001–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: LP3981  
LP3981  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
www.ti.com  
Absolute Maximum Ratings(1)(2)(3)  
VIN, VEN  
−0.3 to 6.5V  
−0.3 to VIN + 0.3, Max 6.5V  
150°C  
VOUT, VOUT-SENSE  
Junction Temperature  
Storage Temperature  
Lead Temp.  
−65°C to +150°C  
Pad Temp.  
(4)  
Power Dissipation  
θJA (VSSOP-8)  
θJA (WSON-6)  
210°C/W  
50°C/W  
Maximum Power Dissipation at 25°C  
VSSOP-8  
WSON-6  
595mW  
2.5W  
ESD Rating(5)  
Human Body Model  
Machine Model  
2kV  
200V  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to the potential at the GND pin.  
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.  
(4) The figures given for Absolute Maximum Power dissipation for the device are calculated using the following  
equations:  
where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θ JA is the  
junction-to-ambient thermal resistance. E.g. for the WSON package θ JA=50°C/W, TJ(MAX)=150°C and using TA=25°C the maximum  
power dissipation is found to be 2.5W. The derating factor (−1/θJA) = −20mW/°C, thus below 25°C the power dissipation figure can be  
increased by 20 mW per degree, and similarity decreased by this factor for temperatures above 25°C  
(5) The human body model is 100pF discharged through 1.5kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged  
directly into each pin.  
Operating Ratings(1)(2)  
VIN  
2.7 to 6V  
0 to VIN  
VEN  
Junction Temperature  
−40°C to +125°C  
(3)  
Maximum Power Dissipation  
VSSOP-8  
476mW  
2.0W  
WSON-6  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to the potential at the GND pin.  
(3) As for the Maximum Power dissipation, the maximum power in operation is dependant on the ambient temperature. This can be  
calculated in the same way using TJ=125°C, giving 2W as the maximum power dissipation for the WSON package in operation. The  
same derating factor applies.  
4
Submit Documentation Feedback  
Copyright © 2001–2013, Texas Instruments Incorporated  
Product Folder Links: LP3981  
 
 
LP3981  
www.ti.com  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
Electrical Characteristics  
Unless otherwise specified: VEN = 1.2V, VIN = VOUT + 0.5V, CIN = 2.2 µF, CBP = 0.033 µF, IOUT = 1mA, COUT = 2.2 µF. Typical  
values and imits appearing in standard typeface are for TJ = 25°C. Limits appearing in boldface type apply over the entire  
junction temperature range for operation, −40°C to +125°C.(1)(2)  
Limit  
Symbol  
Parameter  
Conditions  
Typ  
Units  
Min  
Max  
Output Voltage  
Tolerance  
−2  
−3  
2
3
% of  
VOUT(nom)  
VIN = VOUT + 0.5V to 6.0V, TA < +85°C  
VIN = VOUT + 0.5V to 6.0V, TJ ≤125°C  
IOUT = 1 mA to 300 mA  
0.005  
−0.1  
−0.2  
0.1  
0.2  
%/V  
%/V  
ΔVOUT  
Line Regulation Error  
Load Regulation Error  
0.0003  
50  
0.005  
%/mA  
(3)  
VIN = VOUT(nom) + 1V,  
f = 1 kHz,  
IOUT = 50 mA (Figure 4)  
(4)  
PSRR  
IQ  
Power Supply Rejection Ratio  
Quiescent Current  
dB  
VIN = VOUT(nom) + 1V,  
f = 10 kHz,  
IOUT = 50 mA (Figure 4)  
55  
VEN = 1.2V, IOUT = 1 mA  
70  
120  
210  
VEN = 1.2V, IOUT = 1 to 300 mA,  
VOUT = 2.5V(5)  
170  
µA  
VEN = 0.4V  
0.003  
0.5  
1.5  
5
IOUT = 1 mA  
IOUT = 200 mA  
IOUT = 300 mA  
(6)  
Dropout Voltage  
88  
133  
200  
mV  
132  
600  
ISC  
en  
Short Circuit Current Limit  
Output Noise Voltage  
Output Grounded  
(Steady State)  
mA  
BW = 10 Hz to 100 kHz,  
CBP = 0.033µF  
35  
µVrms  
Thermal Shutdown Temperature  
Thermal Shutdown Hysteresis  
Peak Output Current  
160  
20  
°C  
°C  
TSD  
IOUT(PK)  
IEN  
V
OUT ≥ VOUT (nom) - 5%  
455  
300  
Maximum Input Current at VEN  
Logic Low Input threshold  
Logic High Input threshold  
VEN = 0 and VIN  
VIN = 2.7 to 6.0V  
VIN = 2.7 to 6.0V  
CBYPASS = 0.033 µF  
0.001  
µA  
V
VIL  
0.4  
VIH  
1.4  
V
(4) (7)  
TON  
Turn-On Time  
240  
350  
µs  
(1) Min and Max Limits are specified by design, test, or statistical analysis. Typical (Typ.) numbers are not verified, but do represent the  
most likely norm.  
(2) The target output voltage, which is labeled VOUT(nom), is the desired voltage option.  
(3) An increase in the load current results in a slight decrease in the output voltage and vice versa.  
(4) Specified by design. Not production tested.  
(5) For VOUT > 2.5C, Increase IQ(MAX) by 2.5µA for every 0.1V increase in VOUT(NOM).i.e. IQ(MAX) = 210 + ((VOUT(NOM) - 2.5) * 25)µA  
(6) Dropout voltage is the input-to-output voltage difference at which the output voltage is 100mV below its nominal value. This specification  
does not apply for input voltages below 2.5V.  
(7) Turn-on time is time measured between the enable input just exceeding VIH and the output voltage just reaching 95% of its nominal  
value.  
Copyright © 2001–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links: LP3981  
 
LP3981  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
www.ti.com  
Units  
Electrical Characteristics Output Capacitor, Recommended Specification  
Limit  
Symbol  
Parameter  
Conditions  
Typ  
Min  
2.2  
Max  
COUT  
Output Capacitor  
Capacitance  
ESR  
22  
500  
µF  
5
mΩ  
Figure 3. Line Transient Response Input Perturbation  
Figure 4. PSRR Input Perturbation  
6
Submit Documentation Feedback  
Copyright © 2001–2013, Texas Instruments Incorporated  
Product Folder Links: LP3981  
LP3981  
www.ti.com  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
Typical Performance Characteristics  
Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to  
VIN.  
Output Voltage  
Dropout Voltage  
vs.  
vs.  
Temperature (VOUT = 2.83V)  
Temperature (VOUT = 2.85V)  
Ground Current  
vs.  
Load Current (VOUT = 2.85V)  
Output Short Circuit Current  
Output Short Circuit Current  
Ripple Rejection (VIN = VOUT + 1V)  
Copyright © 2001–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Links: LP3981  
LP3981  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
www.ti.com  
Typical Performance Characteristics (continued)  
Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to  
VIN.  
Ripple Rejection (VIN = VOUT + 1V)  
Ripple Rejection (VIN = VOUT + 1V)  
Load Transient Response (VIN = 3.5V)  
Load Transient Response (VIN = 3.5V)  
Line Transient Response  
(VIN = VOUT + 1V to VOUT + 1.6V)  
Line Transient Response  
(VIN = VOUT + 1V to VOUT + 1.6V)  
8
Submit Documentation Feedback  
Copyright © 2001–2013, Texas Instruments Incorporated  
Product Folder Links: LP3981  
LP3981  
www.ti.com  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
Typical Performance Characteristics (continued)  
Unless otherwise specified, CIN = COUT = 2.2 µF Ceramic, CBP = 0.033 µF, VIN = VOUT + 0.5V, TA = 25°C, Enable pin is tied to  
VIN.  
Line Transient Response  
(VIN = VOUT + 1V to VOUT + 1.6V)  
Line Transient Response  
(VIN = VOUT + 1V to VOUT + 1.6V)  
Enable Response (TON  
)
Enable Response (TON)  
Copyright © 2001–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Links: LP3981  
LP3981  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
www.ti.com  
APPLICATION HINTS  
POWER DISSIPATION AND DEVICE OPERATION  
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from  
the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus, the power  
dissipation is dependant on the ambient temperature and the thermal resistance across the various interfaces  
between the die and ambient air.  
As stated in the notes for Absolute Maximum Ratings and Operating Ratings, the allowable power dissipation for  
the device in a given package can be calculated using the equation:  
(1)  
With a θJA = 50°C/W, the device in the WSON package returns a value of 2.0W with a maximum junction  
temperature of 125°C and an ambient temperature of 25°C. The device in a VSSOP package returns a figure of  
0.476W, ( θJA = 210°C/W).  
The actual power dissipation across the device can be represented by the following equation:  
PD = (VIN − VOUT) x IOUT  
(2)  
This establishes the relationship between the power dissipation allowed due to thermal considerations, the  
voltage drop across the device, and the continuous current capability of the device. The device can deliver  
300mA but care must be taken when choosing the continuous current output for the device under the operating  
load conditions.  
EXTERNAL CAPACITORS  
Like any low-dropout regulator, the LP3981 requires external capacitors for regulator stability. The LP3981 is  
specifically designed for portable applications requiring minimum board space and smallest components. These  
capacitors must be correctly selected for good performance.  
INPUT CAPACITOR  
An input capacitance of ≊ 2.2µF is required between the LP3981 input pin and ground (the amount of the  
capacitance may be increased without limit).  
This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean  
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.  
Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-  
impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input,  
it must be specified by the manufacturer to have a surge current rating sufficient for the application.  
There are no requirements for the ESR on the input capacitor, but tolerance and temperature coefficient must be  
considered when selecting the capacitor to ensure the capacitance will be ≊ 2.2µF over the entire operating  
temperature range.  
OUTPUT CAPACITOR  
The LP3981 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor  
(dielectric types Z5U, Y5V or X7R) in 2.2 to 22 µF range with 5mΩ to 500mΩ ESR range is suitable in the  
LP3981 application circuit.  
It may also be possible to use tantalum or film capacitors at the output, but these are not as attractive for  
reasons of size and cost (see CAPACITOR CHARACTERISTICS).  
The output capacitor must meet the requirement for minimum amount of capacitance and also have an ESR  
(Equivalent Series Resistance) value which is within a stable range (5 mΩ to 500 mΩ).  
NO-LOAD STABILITY  
The LP3981 will remain stable and in regulation with no external load. This is specially important in CMOS RAM  
keep-alive applications.  
10  
Submit Documentation Feedback  
Copyright © 2001–2013, Texas Instruments Incorporated  
Product Folder Links: LP3981  
LP3981  
www.ti.com  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
NOISE BYPASS CAPACITOR  
Connecting a 0.033µF capacitor between the CBP pin and ground significantly reduces noise on the regulator  
output. This cap is connected directly to a high impedance node in the bad gap reference circuit. Any significant  
loading on this node will cause a change on the regulated output voltage. For this reason, DC leakage current  
through this pin must be kept as low as possible for best output voltage accuracy.  
The types of capacitors best suited for the noise bypass capacitor are ceramic and film. Hight-quality ceramic  
capacitors with either NPO or COG dielectric typically have very low leakage. Polypropolene and polycarbonate  
film capacitors are available in small surface-mount packages and typically have extremely low leakage current.  
Unlike many other LDO's, addition of a noise reduction capacitor does not effect the transient response of the  
device.  
CAPACITOR CHARACTERISTICS  
The LP3981 is designed to work with ceramic capacitors on the output to take advantage of the benefits they  
offer: for capacitance values in the range of 1µF to 4.7µF range, ceramic capacitors are the smallest, least  
expensive and have the lowest ESR values (which makes them best for eliminating high frequency noise). The  
ESR of a typical 1µF ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily meets the ESR  
requirement for stability by the LP3981.  
The ceramic capacitor's capacitance can vary with temperature. Most large value ceramic capacitors (≊ 2.2µF)  
are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by  
more than 50% as the temperature goes from 25°C to 85°C.  
A better choice for temperature coefficient in a ceramic capacitor is X7R, which holds the capacitance within  
±15%.  
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more  
expensive when comparing equivalent capacitance and voltage ratings in the 1µF to 4.7µF range.  
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size  
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the  
stable range, it would have to be larger in capacitance (which means bigger and more costly ) than a ceramic  
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about  
2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed.  
ON/OFF INPUT OPERATION  
The LP3981 is turned off by pulling the VEN pin low, and turned on by pulling it high. If this feature is not used,  
the VEN pin should be tied to VIN to keep the regulator output on at all time. To assure proper operation, the  
signal source used to drive the VEN input must be able to swing above and below the specified turn-on/off voltage  
thresholds listed in the Electrical Characteristics section under VIL and VIH.  
FAST ON-TIME  
The LP3981 utilizes a speed up circuitry to ramp up the internal VREF voltage to its final value to achieve a fast  
output turn on time.  
Copyright © 2001–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Links: LP3981  
 
LP3981  
SNVS159G –OCTOBER 2001–REVISED MAY 2013  
www.ti.com  
REVISION HISTORY  
Changes from Revision F (May 2013) to Revision G  
Page  
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 11  
12  
Submit Documentation Feedback  
Copyright © 2001–2013, Texas Instruments Incorporated  
Product Folder Links: LP3981  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
1000  
1000  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LP3981ILD-2.5  
NRND  
ACTIVE  
WSON  
WSON  
NGC  
6
6
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LO1UB  
LP3981ILD-2.5/NOPB  
NGC  
Green (RoHS  
& no Sb/Br)  
Level-3-260C-168 HR  
LO1UB  
L01ZB  
L017B  
LO1XB  
LO1UB  
LO1VB  
L01ZB  
LO1SB  
LO1YB  
LP3981ILD-2.8/NOPB  
LP3981ILD-3.0/NOPB  
LP3981ILD-3.3/NOPB  
LP3981ILDX-2.5/NOPB  
LP3981ILDX-2.7/NOPB  
LP3981ILDX-2.8/NOPB  
LP3981ILDX-2.83/NOPB  
LP3981ILDX-3.03/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
6
6
6
6
6
6
6
6
1000  
1000  
1000  
4500  
4500  
4500  
4500  
4500  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN | Call TI  
CU SN  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Green (RoHS  
& no Sb/Br)  
CU SN  
Green (RoHS  
& no Sb/Br)  
CU SN  
Green (RoHS  
& no Sb/Br)  
CU SN  
Green (RoHS  
& no Sb/Br)  
CU SN  
Green (RoHS  
& no Sb/Br)  
CU SN  
LP3981IMM-2.5  
NRND  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LFKB  
LFKB  
LP3981IMM-2.5/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP3981IMM-2.7/NOPB  
LP3981IMM-2.8/NOPB  
LP3981IMM-3.0/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
8
8
8
1000  
1000  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
LFLB  
LFTB  
LF3B  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
LP3981IMM-3.03  
NRND  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LFPB  
LFPB  
LP3981IMM-3.03/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
LP3981IMM-3.3  
NRND  
VSSOP  
VSSOP  
DGK  
DGK  
8
8
1000  
1000  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 125  
-40 to 125  
LFNB  
LFNB  
LP3981IMM-3.3/NOPB  
ACTIVE  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Nov-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
LP3981IMMX-2.5/NOPB  
LP3981IMMX-3.3/NOPB  
ACTIVE  
VSSOP  
VSSOP  
DGK  
8
8
3500  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
LFKB  
LFNB  
ACTIVE  
DGK  
3500  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 125  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Nov-2013  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP3981ILD-2.5  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
6
6
6
6
6
6
6
6
6
6
8
8
8
8
8
8
8
8
1000  
1000  
1000  
1000  
1000  
4500  
4500  
4500  
4500  
4500  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
1000  
178.0  
178.0  
178.0  
178.0  
178.0  
330.0  
330.0  
330.0  
330.0  
330.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
12.4  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
5.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.3  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
3.4  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
LP3981ILD-2.5/NOPB  
LP3981ILD-2.8/NOPB  
LP3981ILD-3.0/NOPB  
LP3981ILD-3.3/NOPB  
LP3981ILDX-2.5/NOPB  
LP3981ILDX-2.7/NOPB  
LP3981ILDX-2.8/NOPB  
LP3981ILDX-2.83/NOPB WSON  
LP3981ILDX-3.03/NOPB WSON  
LP3981IMM-2.5  
VSSOP  
LP3981IMM-2.5/NOPB VSSOP  
LP3981IMM-2.7/NOPB VSSOP  
LP3981IMM-2.8/NOPB VSSOP  
LP3981IMM-3.0/NOPB VSSOP  
LP3981IMM-3.03  
LP3981IMM-3.03/NOPB VSSOP  
LP3981IMM-3.3 VSSOP  
VSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP3981IMM-3.3/NOPB VSSOP  
LP3981IMMX-2.5/NOPB VSSOP  
LP3981IMMX-3.3/NOPB VSSOP  
DGK  
DGK  
DGK  
8
8
8
1000  
3500  
3500  
178.0  
330.0  
330.0  
12.4  
12.4  
12.4  
5.3  
5.3  
5.3  
3.4  
3.4  
3.4  
1.4  
1.4  
1.4  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP3981ILD-2.5  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
WSON  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
NGC  
DGK  
DGK  
DGK  
DGK  
6
6
6
6
6
6
6
6
6
6
8
8
8
8
1000  
1000  
1000  
1000  
1000  
4500  
4500  
4500  
4500  
4500  
1000  
1000  
1000  
1000  
210.0  
213.0  
213.0  
213.0  
213.0  
367.0  
367.0  
367.0  
367.0  
367.0  
210.0  
210.0  
210.0  
210.0  
185.0  
191.0  
191.0  
191.0  
191.0  
367.0  
367.0  
367.0  
367.0  
367.0  
185.0  
185.0  
185.0  
185.0  
35.0  
55.0  
55.0  
55.0  
55.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP3981ILD-2.5/NOPB  
LP3981ILD-2.8/NOPB  
LP3981ILD-3.0/NOPB  
LP3981ILD-3.3/NOPB  
LP3981ILDX-2.5/NOPB  
LP3981ILDX-2.7/NOPB  
LP3981ILDX-2.8/NOPB  
LP3981ILDX-2.83/NOPB  
LP3981ILDX-3.03/NOPB  
LP3981IMM-2.5  
LP3981IMM-2.5/NOPB  
LP3981IMM-2.7/NOPB  
LP3981IMM-2.8/NOPB  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Oct-2013  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP3981IMM-3.0/NOPB  
LP3981IMM-3.03  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
VSSOP  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
DGK  
8
8
8
8
8
8
8
1000  
1000  
1000  
1000  
1000  
3500  
3500  
210.0  
210.0  
210.0  
210.0  
210.0  
367.0  
367.0  
185.0  
185.0  
185.0  
185.0  
185.0  
367.0  
367.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
LP3981IMM-3.03/NOPB  
LP3981IMM-3.3  
LP3981IMM-3.3/NOPB  
LP3981IMMX-2.5/NOPB  
LP3981IMMX-3.3/NOPB  
Pack Materials-Page 3  
MECHANICAL DATA  
NGC0006D  
LDC06D (Rev B)  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

相关型号：

SI9130DB

 5- and 3.3-V Step-Down Synchronous Converters

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1-E3

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135_11

 SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9136_11

 Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130CG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130LG-T1-E3

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130_11

 Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137DB

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137LG

 Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9122E

 500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明