LP5520TL/NOPB [TI]
RGB 背光 LED 驱动器 | YZR | 25 | -30 to 85;
| 型号： | LP5520TL/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | RGB 背光 LED 驱动器 | YZR | 25 | -30 to 85 驱动 驱动器 |
| 文件： | 总46页 (文件大小：782K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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LP5520
SNVS440B –MAY 2007–REVISED MARCH 2016
LP5520 RGB Backlight LED Driver
1 Features
3 Description
The LP5520 is an RGB backlight LED driver for small
format color LCDs. RGB backlights enable better
colors on the display and power savings compared
with white LED backlights. The device offers a small
and simple driver solution without need for optical
feedback. Calibration in display module production
can be done in one temperature. The LP5520
produces true white light over a wide temperature
range. Three independent LED drivers have accurate
programmable current sinks and PWM modulation
control. Using internal calibration memory and
external temperature sensor, the RGB LED currents
are adjusted for perfect white balance independent of
the brightness setting or temperature. The user
programmable calibration memory has intensity vs
temperature data for each color. This white balance
calibration data can be programmed to the memory
on the production line of a backlight module.
1
•
Temperature Compensated LED Intensity and
Color
•
•
•
•
Individual Calibration Coefficients for Each Color
Color Accuracy ΔX and ΔY ≤ 0.003
12-Bit ADC for Measurement of 2 Sensors
Adjustable Current Outputs for Red, Green, and
Blue (RGB) LED
•
•
•
•
•
•
•
•
•
0.2% Typical LED Output Current Matching
PWM Control Inputs for Each Color
SPI™ and I2C-Compatible Interface
Stand-Alone Mode With One-Wire Control
Sequential Mode for One Color at a Time
Magnetic High Efficiency Boost Converter
Programmable Output Voltage from 5 V to 20 V
Adaptive Output Voltage Control Option
< 2-µA Typical Shutdown Current
The device has a magnetic boost converter that
creates a supply voltage of up to 20 V LED from the
battery voltage. The output can be set at 1-V steps
from 5 V to 20 V. In adaptive mode the circuit
automatically adjusts the output voltage to minimum
sufficient level for lowest power consumption.
Temperature is measured using an external
temperature sensor placed close to the LEDs. The
second ADC input can be used, for example, for
ambient light measurement.
2 Applications
•
•
Color LCD Display Backlighting
LED Lighting Applications
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (MAX)
LP5520
DSBGA (25)
2.787 mm × 2.621 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
D1
L1
2.9 œ 5.5V
5 œ 20V
4.7 mH
C
C
C
VDDA
VDDD
IN
C
OUT
2 x
100 nF
100 nF
4.7 mF
4.7 mF
1 mF
V
V
DDD
SW
DDA
V
LDO
C
VLDO
S1_IN
S2_IN
CALIBRATION
MEMORY
FB
ADC
BOOST
V
LDO
LM 20
NRST
SS/SDA
SCK/SCL
LP5520
MCU
WITH
I2C
SPI/I2C
INTER-
FACE
LP55XX
SI/A0
SO
OR
SPI
IFSEL
V
DDIO
COLOR AND
BRIGHTNESS
PWM LOGIC
LED
DRIVERS
ROUT
GOUT
BOUT
PWMR
PWMG
PWMB
BRC
C
VDDIO
100 nF
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP5520
SNVS440B –MAY 2007–REVISED MARCH 2016
www.ti.com
Table of Contents
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 18
7.5 Programming........................................................... 22
7.6 Register Maps......................................................... 28
Application and Implementation ........................ 33
8.1 Application Information............................................ 33
8.2 Typical Applications ............................................... 33
Power Supply Recommendations...................... 37
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Function........................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
8
9
10 Layout................................................................... 37
10.1 Layout Guidelines ................................................. 37
10.2 Layout Example .................................................... 38
11 Device and Documentation Support ................. 39
11.1 Device Support...................................................... 39
11.2 Documentation Support ........................................ 39
11.3 Community Resources.......................................... 39
11.4 Trademarks........................................................... 39
11.5 Electrostatic Discharge Caution............................ 39
11.6 Glossary................................................................ 39
6.6 RGB Driver Electrical Characteristics (ROUT, GOUT,
BOUT Outputs) .......................................................... 5
6.7 Logic Interface Characteristics.................................. 6
6.8 Magnetic Boost DC-DC Converter Electrical
Characteristics ........................................................... 6
6.9 I2C Timing Parameters ............................................. 7
6.10 SPI Timing Requirements ....................................... 7
6.11 Typical Characteristics............................................ 8
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 40
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2013) to Revision B
Page
•
•
•
Changed "R, G and B" to "Red, Green, and Blue"................................................................................................................. 1
Deleted "Non-Linear Temperature Compensation" and "Ambient Light Compensation" from Applications ......................... 1
Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information
tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply
Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable
Information sections................................................................................................................................................................ 1
•
•
•
•
•
•
Changed "MAIN, SUB" to " ROUT, GOUT, BOUT"................................................................................................................ 4
Changed "come" to "are loaded".......................................................................................................................................... 12
Changed ", and also the variable" to ". The variable parameter"......................................................................................... 18
Changed "makes possible" to "allows"................................................................................................................................. 19
Changed "read" to "loaded".................................................................................................................................................. 19
Changed "The stand-alone mode must be inhibited in automatic and manual modes by writing the control bit
<brc_off> high and by keeping BRC input low." to new text .............................................................................................. 19
Changes from Original (April 2013) to Revision A
Page
•
Changed layout of National Data Sheet to TI format ........................................................................................................... 32
2
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Product Folder Links: LP5520
LP5520
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SNVS440B –MAY 2007–REVISED MARCH 2016
5 Pin Configuration and Function
YZR Packge
25-Pin DSBGA
Top View
YZR Packge
25-Pin DSBGA
Bottom View
SI/
A0
SI/
A0
5
4
3
2
1
SW
FB
PWMR
GNDA
PWMB
BOUT
D
VDDD
IFSEL
PWMG
S2_IN
S1_IN
C
SO
SO
VDDD
IFSEL
PWMG
S2_IN
FB
SW
5
4
3
2
1
GND
_SW
SS/
SDA
SCK/
SCL
GND
_SW
SS/
SDA
SCK/
SCL
PWMR
GNDA
PWMB
GND
_LED
GND
_LED
NRST
BRC
GNDT
B
VDDIO
VLDO
VDDA
A
VDDIO
VLDO
NRST
BRC
ROUT
GOUT
E
ROUT
VDDA
GNDT
S1_IN
BOUT
GOUT
A
B
C
D
E
Pin Functions
PIN
TYPE
Power
DESCRIPTION
NUMBER
NAME
VDDA
GNDT
S1_IN
BOUT
GOUT
VLDO
BRC
1A
1B
1C
1D
1E
2A
2B
2C
2D
2E
3A
3B
3C
3D
3E
4A
4B
4C
4D
4E
5A
5B
5C
5D
5E
Supply voltage for analog circuitry
Ground/Test
Ground
Input
ADC input 1, input for temperature sensor
Blue LED output
Output
Output
Green LED output
Power
Internal LDO output
Logic Input
Input
Brightness control for all LED outputs
ADC input 2, input for optional second sensor
PWM control for output B
Red LED output
S2_IN
PWMB
ROUT
VDDIO
NRST
PWMG
GNDA
GND_LED
SS/SDA
SCK/SCL
IFSEL
PWMR
GND_SW
SO
Logic Input
Output
Power
Supply voltage for input/output buffers and drivers
Master reset, active low
Logic Input
Logic Input
Ground
PWM control for output G
Ground for analog circuitry
Ground
Ground for LED currents
Logic Input/Output
Logic Input
Logic Input
Logic Input
Ground
Slave select (SPI), serial data in/out (I2C)
Clock (SPI/I2C)
Interface selection (SPI or I2C-compatible, IF_SEL = 1 for SPI)
PWM control for output R
Power switch ground
Logic Output
Logic Input
Power
Serial data out (SPI)
SI/A0
Serial input (SPI), address select (I2C)
Supply voltage for digital circuitry
Boost converter feedback
VDDD
FB
Input
SW
Output
Boost converter power switch
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN
–0.3
–0.3
MAX
22
UNIT
V
V (SW, FB, ROUT, GOUT, BOUT)
VDDA, VDDD, VDDIO, VLDO
6
V
0.3 V with 6 V
maximum
Voltage on logic pins
–0.3 V to VDDIO
V
Continuous power dissipation(4)
Junction temperature, TJ-MAX
Storage temperature, Tstg
Internally limited
125
150
°C
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typical) and
disengages at TJ = 140°C (typical).
6.2 ESD Ratings
VALUE
±2000
±200
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
21
UNIT
V (SW, FB, ROUT, GOUT, BOUT)
0
2.9
1.65
0
V
V
VDDA,DDD
5.5
VDDIO
VDDA
60
V
Recommended load current (ROUT, GOUT, BOUT) per driver
Junction temperature, TJ
mA
°C
°C
–30
–30
125
85
(2)
Ambient temperature, TA
(1) All voltages are with respect to the potential at the GND pins.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.4 Thermal Information
LP5520
THERMAL METRIC(1)
YZR (DSBGA)
UNIT
25 PINS
58.2
0.3
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
7.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.5
ψJB
7.9
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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SNVS440B –MAY 2007–REVISED MARCH 2016
6.5 Electrical Characteristics
Unless otherwise noted typical limits are for TJ = 25°C, minimum and maximum limits apply over the operating ambient
temperature range (–30°C < TJ < +85°C), and specifications apply to the LP5520 Functional Block Diagram with: CVDDA/D
100 nF, COUT = 2 × 4.7 µF, 25 V, CIN= 10 µF, 6.3 V, L1 = 4.7 µH.(1)(2)(3)
=
PARAMETER
TEST CONDITIONS
NSTBY = L, VDDIO ≥ 1.65 V
NSTBY = L , VDDIO = 0 V
MIN
TYP
1.7
1
MAX
UNIT
7
Standby supply current
µA
(VDDA + VDDD
)
No-boost supply current
NSTBY = H,
EN_BOOST = L
IVDD
0.9
1.4
(VDDA + VDDD
No-load supply current
(VDDA + VDDD
)
mA
NSTBY = H, EN_BOOST = H
AUTOLOAD = L
)
IVDDIO
VLDO
ILDO
VDDIO standby supply current
Internal LDO output voltage
Internal LDO output current
NSTBY = L
1
2.84
1
µA
V
VIN ≥ 2.9 V, TJ = 25°C
Current to external load
2.77
2.80
mA
(1) All voltages are with respect to the potential at the GND pins.
(2) Minimum and maximum limits are specified by design, test or statistical analysis. Typical numbers represent the most likely norm.
(3) Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
6.6 RGB Driver Electrical Characteristics (ROUT, GOUT, BOUT Outputs)
Typical limits are for TJ = 25°C, minimum and maximum limits apply over the operating ambient temperature range
(–30°C < TJ < +85°C); over operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
µA
ROUT, GOUT, BOUT pin
leakage current
ILEAKAGE
IMAX
0.1
1
Outputs ROUT, GOUT, BOUT control = 255
(FFH)
mA
Maximum sink current
60
19
–5%
54
20
60
21
5%
mA
mA
Output current set to 20 mA
Output current set to 60 mA
Current accuracy of ROUT,
GOUT, and BOUT
IR
66
–10%
10%
±2%
IMATCH
tPWM
Matching(1)
Between ROUT, GOUT, BOUT at 20 mA current
Accuracy proportional to internal clock frequency
<pwm_fast> = 0
±0.2%
820
PWM cycle time
µs
1.22
19.52
550
kHz
ƒRGB
RGB switching frequency
Saturation voltage(2)
<pwm_fast> = 1
VSAT
ƒMAX
I(LED) = 60 mA
mV
External PWM maximum
frequency
I(LED) = 60 mA, TJ = 25°C
1
MHz
(1) Matching is the maximum difference from the average when all outputs are set to same current.
(2) Saturation voltage is defined as the voltage when the LED current has dropped 10% from the value measured at 2 V.
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6.7 Logic Interface Characteristics
Typical limits are for TJ = 25°C, minimum and maximum limits apply over the operating ambient temperature range
(–30°C < TJ < +85°C); over operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LOGIC INPUTS SS, SI/A0, SCK/SCL, IFSEL, NRST, PWMR, PWMG, PWMB and BRC
VIL
VIH
II
Input low level
0.2 × VDDIO
V
V
Input high level
Logic input current
0.8 × VDDIO
−1
1
0.4
13
µA
I2C mode
SPI mode, VDDIO > 1.8 V
ƒSCK/SLC
Clock frequency
MHz
SPI mode, 1.65 V < VDDIO
1.8 V
<
5
LOGIC INPUT NRST
VIL
VIH
II
Input low level
05
1
V
V
Input high level
1.2
–1
10
Logic input current
Reset pulse width
µA
µs
tNRST
LOGIC OUTPUT SO
ISO = 3 mA
VDDIO > 1.8 V
0.3
0.3
0.5
0.5
V
V
V
VOL
Output low level
ISO = 2 mA
1.65 V < VDDIO < 1.8 V
ISO = –3 mA
VDDIO > 1.8 V
VDDIO − 0.5
VDDIO − 0.5
VDDIO − 0.3
VDDIO − 0.3
VOH
Output high level
ISO = –2 mA
1.65 V < VDDIO < 1.8 V
V
IL
Output leakage current
VSO = 2.8 V
ISDA = 3 mA
1
µA
LOGIC OUTPUT SDA
VOL Output low level
0.3
0.5
V
6.8 Magnetic Boost DC-DC Converter Electrical Characteristics
Typical limits are for TJ = 25°C, minimum and maximum limits apply over the operating ambient temperature range
(–30°C < TJ < +85°C); over operating free-air temperature range (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Maximum continuous load
current
2.9V = VIN, VOUT = 20 V
TJ = 25°C
mA
ILOAD
70
2.9 ≤ VIN ≤ 5.5 V, VOUT = 20 V
TJ = 25°C
–1.7%
–5%
1.7%
5%
VOUT
Output voltage accuracy (FB pin)
2.9 ≤ VIN ≤ 5.5 V, VOUT = 20 V
ISW = 0.5 A
RDSON
ƒPWM
Switch ON resistance
Frequency accuracy
0.3
Ω
TJ = 25°C
−6%
±3%
6%
9%
–9%
tPULSE
tSTARTUP
IMAX
Switch pulse minimum width
Start-up time
no load
50
20
ns
ms
mA
SW pin current limit
1100
6
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6.9 I2C Timing Parameters
VDD1,2 = 3 V to 4.5 V, VDDIO = 1.8 V To VDD1,2; see Figure 1.
MIN
MAX
UNIT
µs
µs
ns
1
Hold time (repeated) START condition
Clock low time
0.6
2
1.3
3
Clock high time
600
4
Setup time for a repeated START condition
Data hold time (output direction, delay generated by LP5520)
Data hold time (input direction, delay generated by Master)
Data setup time
600
ns
5
300
900
900
ns
5
0
100
ns
6
ns
7
Rise time of SDA and SCL
20 + 0.1Cb
15 + 0.1Cb
600
300
300
ns
8
Fall time of SDA and SCL
ns
9
Setup time for STOP condition
ns
10
Cb
Bus free time between a STOP and a START condition
Capacitive load for each bus line
1.3
µs
pF
10
200
6.10 SPI Timing Requirements
See Figure 2.
MIN
MAX
UNIT
ns
1
Cycle time
70
35
35
35
35
0
2
Enable lead time
Enable lag time
Clock low time
Clock high time
Data setup time
Data hold time
Data access time
Disable time
ns
3
ns
4
ns
5
ns
6
ns
7
25
ns
8
30
20
40
ns
9
ns
10
11
Data valid
ns
Data hold time
0
ns
SDA
SCL
10
8
7
6
1
7
8
2
5
1
4
9
3
Figure 1. I2C Timing Diagram
SS
5
3
12
2
1
4
SCK
SI
7
6
MSB IN BIT 14
BIT 9
BIT 8
R/W
BIT 7
BIT 1
LSB IN
11
8
9
10
MSBOUT
BIT 1
LSB OUT
SO
Address
Data
Figure 2. SPI Timing Diagram
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6.11 Typical Characteristics
6.11.1 RGB Driver Typical Characteristics
60.0
50.0
40.0
30.0
20.0
10.0
0.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0.0
0.2
0.4
0.6
0.8
1.0
hÜÇtÜÇ ëh[Ç!D9 (ë)
hÜÇtÜÇ ëh[Ç!D9 (ë)
Figure 3. VSAT vs ILED
Figure 4. VSAT vs ILED
6.11.2 Boost Converter Typical Characteristics
VIN = 3.6 V, VOUT = 15 V, if not otherwise stated.
600
20.0
18.0
16.0
INDUCTOR TDK VLF3010 - 4.7 mH
600
500
450
400
350
300
250
200
150
I
= 60 mA
LOAD
V
= 20V
OUT
V
= 3.6V
IN
14.0
12.0
10.0
8.0
V
=1 5V
OUT
V
IN
= 2.9V
V
OUT
= 10V
6.0
INDUCTOR TDK VLF3010 - 4.7 mH
4.0
2.9
3.1
3.3
3.5
3.7
3.9
4.1
0
60
120
180
240
300
360
BATTERY VOLTAGE (V)
OUTPUT CURRENT (mA)
Figure 6. Battery Current vs Voltage
Figure 5. Boost Maximum Output Voltage vs Current
8.0
8.0
7.0
V
BOOST
7.0
6.0
6.0
5.0
V
LOAD
AUTOLOAD ON
5.0
4.0
4.0
3.0
AUTOLOAD OFF
3.0
2.0
V
DRIVER
2.0
1.0
1.0
0.0
5.0
8.0
11.0
14.0
17.0
20.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
TIME (s)
hÜÇtÜÇ ëh[Ç!D9 (ë)
Figure 7. Auto-Load Effect on Input Current, No Load
Figure 8. Adaptive Output Voltage Operation
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7 Detailed Description
7.1 Overview
The LP5520 is an RGB backlight LED driver for small format color LCDs. The LP5520 offers a small and simple
driver solution without need for optical feedback. Calibration in display module production can be done in one
temperature. The LP5520 produces true white light over a wide temperature range.
Three independent LED drivers have accurate programmable current sinks with up to 60 mA current capability
and PWM modulation control. Using internal calibration memory and external temperature sensor, the RGB LED
currents are adjusted for perfect white balance independent of the brightness setting or temperature. The user
programmable calibration memory has intensity vs temperature data for each color. This white balance
calibration data can be programmed to the memory on the production line of a backlight module.
The LP5520 has a magnetic boost converter that creates supply voltage up to 20-V LED from the battery
voltage. The output can be set at 1-V step from 5 V to 20 V. In adaptive mode the circuit automatically adjusts
the output voltage to minimum sufficient level for lowest power consumption.
Temperature is measured using an external temperature sensor placed close to the LEDs. The second ADC
input can be used, for example, for ambient light measurement.
7.2 Functional Block Diagram
Optional EMI
Optional HF
filter
close to SW pin
R
SW
C
SW
capacitor
C
HF
68 pF
330 pF 3.9 W
D1
5 V œ 20V
2.9 Vœ 5.5V
C
L1
4.7 mH
C
C
IN
VDDD
100 nF
VDDA
L
SW
100 nF
4.7 mF
Optional
Ferrite
Bead
V
DDD
V
DDA
SW
C
VLDO
1 mF
V
LDO
LP5520
S1_IN
S2_IN
TEMP
SENSOR
LM20
FB
BOOST
ADC
ANALOG
SUPPORT
C
OUT
2 x
4.7 mF
CURRENT
DACS
RST
SS/SDA
SCK/SCL
SI/A0
SPI/I2C
INTER-
FACE
AND
CONTROL
CALIBRATION
EEPROM
MCU or
TESTER
with SPI
interface
SO
IFSEL
ROUT
GOUT
BOUT
0 œ 60 mA
V
DDIO
LED
DRIVERS
0 œ 60 mA
0 œ 60 mA
COLOR
PWM
LOGIC
PWMR
PWMG
PWMB
BRC
C
VDDIO
100 nF
GND_T
GND_A
GND_LED
GND_SW
7.3 Feature Description
7.3.1 Start-Up Powering
VDDD and VDDA must be tied together and turned on first. VDDIO must be turned on at the same time as VDDD or
later. In the power-off sequence VDDIO must be turned off before VDDD or at the same time.
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Feature Description (continued)
Power ON
Power OFF
V
DDD
and V
DDA
V
DDIO
Figure 9. Power-On Signal Timing
7.3.2 RGB Driver Functionality
7.3.2.1 White Balance Control
The LP5520 is designed to provide spectrally rich white light using a three-color RGB LED. White light is
obtained when the red, green, and blue LED intensities are in proper balance. The LED intensities change
independently with temperature. For maintaining the purity of the white color and the targeted total intensity,
precise temperature dependent intensity control for each LED is required. The color coordinates in this document
refer to the CIE 1931 color graph (x,y system).
0.9
Y
520
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
540
Green
Target for white
light
560
500
580
600
620
490
Red
700
480
Blue
470
460
X
380
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0
Figure 10. CIE 1931 Color Graph
Figure 11 shows a typical RGB LED intensity behavior on a 12-bit scale (0 to 4095) at constant 20-mA LED
currents. Figure 12 shows the typical color coordinate change for an uncompensated RGB LED. Figure 13 shows
the corresponding PWM values for achieving constant intensity white light across the temperature range. The
PWM values have been saturated at 104°C to avoid overheating the LED and to better utilize the PWM range.
The white balance is not maintained above 104°C in this case.
4000
3500
3000
Red
Blue
2500
2000
1500
Green
1000
500
0
-40
-20
0
20
40
60
80
TEMPERATURE
Figure 11. LED Intensity vs Temperature
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Feature Description (continued)
0.34
Y
0.32
0.31
0.29
X
0.28
0.26
-40
-14
12
38
64
90
TEMPERATURE,°C
Figure 12. Typical Color Coordinates vs Temperature for Uncompensated RGB LED
The compensation values for the measured temperatures can be easily calculated when the intensity vs
temperature information is available. For the best accuracy the iterative calibration approach must be used.
4000
Red
3500
3000
Green
2500
2000
Blue
1500
1000
500
0
-40 -20
0
20 40 60 80 100 120
TEMPERATURE
Figure 13. Compensation PWM Values
The compensation values must be converted to 16°C intervals when they are programmed to the calibration
EEPROM. The evaluation software has import function, which can be used to convert the measured
compensation data to the 16°C interval format. The measured data can have any temperature points, and the
software fits a curve through the measured points and calculate new PWM values in fixed temperatures using the
curves.
Typical color coordinate and intensity stability over temperature are shown in Figure 14 and Figure 15.
0.310
0.305
X
0.300
Y
0.295
0.290
-40
-20
0
20
40
60
80
TEMPERATURE, °C
Figure 14. Compensated Color Coordinates vs Temperature
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Feature Description (continued)
1500
1450
1400
1350
1300
-40
-20
0
20
40
60
80
TEMPERATURE, °C
Figure 15. Compensated Blue LED Intensity vs Temperature
7.3.2.2 LED Brightness Control
The LED brightness is defined by two factors, the current through the LED and the PWM duty cycle. The
constant current outputs ROUT, GOUT, and BOUT can be independently set to sink between 0 and 60 mA. The
8-bit current control has 255 levels, and the step size is 235 µA. In manual mode the current is defined with the
current control (R/G/B) registers (01H, 02H, and 03H). In automatic mode the current settings are loaded from
the EEPROM.
The PWM control has 12-bit resolution, which means 4095 steps. The minimum pulse width is 200 ns, and the
frequency can be set to either 1.2 kHz or 19.2 kHz. The duty cycle range is from 0 to 100% (0 to 4095). The
output PWM value is obtained by multiplication of three factors. The first factor is the temperature-based value
from the EEPROM. The second factor is the correction register setting, which is independent for each color. The
third factor is the brightness register setting, which is common to all colors.
The temperature-based PWM values are stored in the EEPROM at 16°C intervals starting from –40°C and
ending to 120°C. PWM values for the temperatures between the stored points are interpolated.
LED brightness has 3-bit logarithmic control. The control bits are in the pwm_brightness (04H) register. The 3-bit
value defines a multiplier for the 12-bit PWM value obtained from the memory according to Table 1.
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Feature Description (continued)
Table 1. PWM Value Multipliers
CONTROL BYTE <bri[2:0]>(1)
MULTIPLIER
0.008
INTENSITY ( %)
0
1
2
3
4
5
6
7
0.8
1.6
3.1
6.3
12.5
25
0.016
0.031
0.063
0.125
0.250
0.500
50
1.000
100
(1) PWM Brightness register control
The brightness correction can be used for aging compensation or other fine-tuning. There is an 8-bit correction
register for each output. The PWM value obtained from the memory is multiplied by the correction value. The
default correction value is 1. Correction range is from 0 to 2 and the LSB is 0.78% (1/128).
TEMP
SENSOR
ROUT
BRIGHTNESS
0.8 œ 100%
CORRECTION R
0 œ 200%
8 STEP LOG
(AGEING COMP)
SELF
HEATING
COMPENS.
8
12
12
12
12
12
PWM
GEN
R
G
B
ADC
+
LOGIC
EEPROM
+
LOGIC
5 MHz
S1_IN
8
CURRENT R
0 œ 60mA
PWM_R
Shown complete only for red channel
Figure 16. LED Control Principle
7.3.2.3 LED PWM Control
The PWM frequency can be selected of two alternatives, slow and fast, with the control bit <pwm_fast>. The
slow frequency is 1.2 kHz. In the fast mode the PWM frequency is multiplied by 16, and the frequency is 19.2
kHz. Fast mode is the default mode after reset. The single pulse in normal PWM is split in 16 narrow pulses in
fast PWM. Higher frequency helps eliminate possible noise from the ceramic capacitors and it also reduces the
ripple in the boost voltage. Minimum pulse length is 200 ns in both modes.
The PWM pulses of each output do not start simultaneously in order to avoid high current spike. Red starts in the
beginning of the PWM cycle, Green is symmetric with the cycle center and Blue ends in the end of the cycle. For
PWM values less than 33% for each output, the output currents are completely non-overlapping. With higher
PWM values the overlapping increases.
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0%
100%
50%
ROUT
GOUT
BOUT
819 ms/1.22 kHz in normal PWM
52 ms/19.2 kHz in fast PWM
Figure 17. Pulse Positions in the PWM Cycle
7.3.2.4 Sequential Mode
Completely non-overlapping timing can be obtained by using the sequential mode as shown in Figure 18. The
timing is defined with external PWM control inputs. The minimum trigger pulse width in the PWM inputs is 1 µs.
There is no limitation on the maximum width of the pulse as long as it is shorter than the whole sequence.
Dead time
Internal PWM cycle
PWMR
ROUT
4
1
3
2
PWMG
GOUT
4
1
2
3
3.333 ms
3.333 ms
3.333 ms
PWMB
BOUT
3
4
1
2
10 ms/100 Hz
Figure 18. Non-Overlapping External Synchronized Sequential Mode
In sequential mode the PWM cycle is synchronized to trigger pulses and the amount of PWM pulses per trigger
can be defined to 2, 3 or 4 using the <seq_mode0> and <seq_mode1> control bits. This makes possible to use
sequence lengths of about 5 ms, 7.5 ms or 10 ms. Fast PWM can be used in sequential mode, but the frame
timing is as with normal PWM.
The PWM timing and synchronization timing originate from different clock sources. Some margin must be
allowed for clock tolerances. This margin shows as a dead time in the waveform graph. Some dead time must be
allowed so that no PWM pulse is clipped. Clipping would distort the intensity balance between the LEDs. The
dead time causes some intensity reduction, but assures the current balance.
PWM mode is defined by <seq_mode1> and <seq_mode2> control bits of rgb_control (00H) register:
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Table 2. PWM Mode
<seq_mode1>
(BIT 7)
<seq_mode0>
MODE
(BIT 6)
0
0
1
1
0
1
0
1
Normal mode
Sequential mode with 2 PWM pulses per trigger
Sequential mode with 3 PWM pulses per trigger
Sequential mode with 4 PWM pulses per trigger
7.3.2.5 Current Control of the LEDs
The LP5520 has a separate 8-bit current control for each LED output. In manual mode the current for red LED is
controlled with the current_control_r (01H) register, the green LED is controlled with the current_control_g
(02H), and the blue LED with current_control_b (03H). Output current can be calculated with formula: current
(mA) = code × 0.235; for example, a 20-mA current is obtained with code 85 (55H).
In automatic and stand-alone modes the LED current values programmed in EEPROM are used, and the current
control registers have no effect. There are two ways to change the default current if needed. The defaults can be
changed permanently by programming new values to the EEPROM. The other option is to make a temporary
change by writing new current values in SRAM.
7.3.2.6 Output Enables
ROUT, GOUT, and BOUT output activity is controlled with 3 enable bits of the rgb_control (00H) register:
Table 3. Output Enable Bits
<en_b> (bit 2)
<en_g> (bit 1)
<en_r> (bit 0)
0
1
0
1
0
1
Blue LED output BOUT disabled
Blue LED output BOUT enabled
Green LED output GOUT disabled
Green LED output GOUT enabled
Red LED output ROUT disabled
Red LED output ROUT enabled
PWM control inputs PWMR, PWMG and PWMB can be used as external output enables in normal and automatic
mode. In the sequential mode these inputs are the trigger inputs for respective outputs.
7.3.2.7 Fade In and Fade Out
The LP5520 has an automatic fade in and out for the LED outputs. Fading makes the transitions smooth in on
and off switching or when brightness is changed. It is not applied for the changes caused by the compensation
algorithm. The fade can be turned on and off using the <en_fade> bit in the rgb_control (00H) register. The
fade time is constant 520 ms, and it does not depend on how big the brightness change is. The white balance is
maintained during fading. Fading is off in the stand-alone mode.
Table 4. Fade In and Fade Out With <en_fade> Bit
0
1
Automatic fade disabled
Automatic fade enabled
<en_fade>(bit 5)
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Fading only works in automatic mode. The LED current registers must be written to 0 for proper fade operation.
When the LEDs are turned on with fading, it is best to set the brightness first and then enable the outputs and
automatic mode. The LEDs can be turned off then by turning off the automatic mode (write rgb_auto to 0).
7.3.2.8 Temperature and Light Measurement
The LP5520 has a 12-bit analog-to-digital converter (ADC) for the measurements. The ADC has two inputs.
S1_IN input is intended for the LM20 temperature sensor and S2_IN input for light measurement or any DC
voltage measurement. The conversion results are filtered with average filter for 134 ms. The <adc_ch> bit in the
Control register selects, which conversion result can be read out from the registers ADC_hi_byte and
ADC_low_byte. The ADC_hi_byte must be read first. The <comp_ch> bit selects, which input is used for
compensation. The ADC uses the LDO voltage 2.8 V as the reference voltage. The input signal range is 0 V to
2.8 V, and the inputs are buffered on the chip.
If S2_IN is used for light measurement using TDK optical sensor BCS2015G1 as shown in the Functional Block
Diagram, the measurement range is from 10 to 20 000 lux when using a 100-kΩ resistor.
Table 5. ADC Configuration
adc_ch(bit5)
0
1
0
1
S1 input can be read
S2 input can be read
comp_sel(bit4)
S1 input is used for compensation
S2 input is used for compensation
S1_IN
S2_IN
S1_RESULT
S2_RESULT
2:1
MUX
1:2
MUX
12 BIT ADC
AVERAGE
Figure 19. ADC Operation Block Diagram
7.3.3 Magnetic High-Voltage Boost DC-DC Converter
The LP5520 boost DC-DC converter generates a 5-V to 20-V supply voltage for the LEDs from single Li-Ion
battery (2.9 V to 4.5V). The output voltage is controlled with four bits in 18 steps. In adaptive mode the output
voltage is automatically adjusted so that the LED drivers have enough voltage for proper operation. The
converter is a magnetic switching PWM mode DC-DC converter with a current limit. Switching frequency is 1
MHz. Boost converter options are controlled with few bits of Control (06H) register.
Table 6. Boost DC-DC Converter Control
<en_autoload> (bit 3)
<vout_auto> (bit 2)
<en_boost> (bit 1)
<nstby> (bit 0)
0
1
0
1
0
1
0
1
Internal boost converter loader off
Internal boost converter loader on
Manual boost output adjustment
Adaptive boost output adjustment
Boost converter standby mode
Boost converter active mode
LP5520 standby mode
LP5520 active mode
The LP5520 boost converter uses pulse-skipping elimination to stabilize the noise spectrum. Even with light load
or no load a minimum length current pulse is fed to the inductor. An active load is used to remove the excess
charge from the output capacitor at very light loads. Active load can be disabled with the <en_autoload> bit.
Disabling active load increases slightly the efficiency at light loads, but the downside is that pulse skipping
occurs. The boost converter must be stopped when there is no load to minimize the current consumption.
The topology of the magnetic boost converter is called current programmed mode (CPM) control, where the
inductor current is measured and controlled with the feedback. The user can program the output voltage of the
boost converter. The output voltage control changes the resistor divider in the feedback loop.
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Figure 20 shows the boost topology with the protection circuitry. Four different protection schemes are
implemented:
1. Overvoltage protection: limits the maximum output voltage and:
–
–
Keeps the output below breakdown voltage.
Prevents boost operation if battery voltage is much higher than desired output.
2. Overcurrent protection: limits the maximum inductor current and:
Voltage over switching NMOS is monitored; voltages too high turn off the switch.
–
3. Feedback break protection: prevents uncontrolled operation if FB pin is disconnected.
4. Duty cycle limiting done with digital control.
V
V
OUT
IN
1 MHz clock
Duty control
SW
FB
UVCOMP
R
S
R
-
+
2V
OVPCOMP
SWITCH
+
-
R
R
RESETCOMP
+
-
-
+
ERRORAMP
+
-
ACTIVE
LOAD
R
R
+
SLOPER
OLPCOMP
LOOPC
-
OCPCOMP
+
-
I
MAX
Figure 20. Boost Converter Topology
7.3.3.1 Boost Control
User can set the boost converter to standby mode by writing the register bit <en_boost> low. When <en_boost>
is written high, the converter starts for 50 ms in low current PWM mode and then goes to normal PWM mode.
User can control the boost output voltage by boost output boost_output (05H) register.
Table 7. Boost Output Voltage Control
BOOST OUTPUT [7:0]
REGISTER 0DH
BOOST OUTPUT
VOLTAGE (TYPICAL)
Bin
00101
00110
00111
...
Dec
5
5 V
6 V
6
7
7 V
...
...
01100
01101
01110
...
12
13
14
...
12 V
13 V
14 V
...
10010
10011
10100
18
19
20
18 V
19 V
20 V
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If register value is lower than 5, then value of 5 is used internally. If register value is higher than 20, then value of
20 is used internally.
7.3.3.2 Adaptive Output Voltage Control
When automatic boost voltage control is selected using the <vout_auto> bit in the Control (06H) register, the
user-defined boost output voltage is ignored. The boost output voltage is adjusted for sufficient operating
headroom by monitoring all enabled LED driver outputs. The boosted voltage is adjusted so that the lowest driver
voltage is from 0.85 V to 1.35 V when the LED output currents are below 30 mA and from 1 V to 1.5V when any
LED current is above 30 mA. The output voltage range is from 5 V to 20 V in adaptive mode.
The adaptive voltage control helps saving energy by always setting the boost voltage to minimum sufficient
value. It eliminates the need for extra voltage margins due to LED forward voltage variation or temperature
variation. With very small brightness settings, when the PWM pulses in LED outputs are very narrow, the
adaptive voltage setting gives higher than necessary boost voltage. This does not harm the overall efficiency,
because this happens only at low power levels.
After reset the adaptive control is on by default. In stand-alone mode the adaptive output voltage is always used.
7.4 Device Functional Modes
The LP5520 has three different operating modes: manual mode, automatic mode, and stand-alone mode.
Automatic mode has two sub modes: normal mode and sequential mode. In manual and automatic modes the
device is controlled through the serial interface. In stand-alone mode only BRC input must be controlled, and all
registers have the default values. The modes are controlled according Table 8.
Table 8. Device Operating Modes Control
<RGB_auto>
(RBG control bit 3)
<seq_mode[0:1]>
(RBG control bits 6 and 7)
DEVICE OPERATING MODE
0
1
1
00
00
Manual mode
Automatic mode, normal operation (overlapping)
01, 10, or 11
Automatic mode, sequential operation with 2, 3, or 4 pulses per sequence
7.4.1 Manual Mode
In the manual mode the automatic LED intensity adjustment is not in use. The internal PWM control is disabled,
and the LEDs are driven with DC current. The user can set the LED currents through the serial port using three
current control registers, current_control_R/G/B, and use the external PWM control inputs to adjust LED
intensities if needed. There is an independent PWM control pin for each output. If PWM control is not used, the
PWMR, PWMG, and PWMR inputs must be tied to the VDDIO. All the functions implemented with the internal
PWM control are unavailable in manual mode (logarithmic brightness control from PWM Control register,
temperature compensation, fading, sequential mode).
7.4.2 Automatic Mode
In the automatic mode the LED intensities are controlled with the 12-bit PWM values obtained from the EEPROM
memory according to the temperature information. PWM values are stored at 16°C intervals for the
–40°C to +120°C temperature range, and the PWM values for the intermediate temperatures are linearly
interpolated.
When creating white light from a RGB LED, the intention is to program PWM values, which keep the individual
LED intensities constant in all temperatures. For possible other applications, other kind of PWM behavior can be
programmed. The variable parameter can be other than temperature if the sensor is changed to, for example, a
light sensor.
12-bit ADC is used for the measurements. The ADC has two inputs: S1_IN and S2_IN. The temperature
measurement result from the S1_IN input is converted to EEPROM address using the sensor calibration data
from EEPROM. This EEPROM address is then used to get the PWM values for each output. The second input
S2_IN can be used for example for ambient light measurement. The ADC data from selected input can be read
through the serial interface. Control bit <comp_sel> can be used to select which input is used for compensation.
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Current setting for each LED comes from EEPROM in the automatic mode. The same current values must be
programmed as were used in the calibration. Current control range is from 0 to 60 mA with 8-bit resolution and
the step size is 235 µA.
Common brightness control for all LEDs can be done using the pwm_brightness (05H) register. The
pwm_brightness register makes 8 level logarithmic brightness control with 3 bits. An automatic fade function
allows smooth turnon, turnoff, and brightness changes of the LEDs. White balance is maintained during fading.
A brightness correction value can be given for each LED. The PWM value obtained from the EEPROM memory
is multiplied by this correction value. This feature can be used for example for LED aging compensation or for
color adjustment by user. These values are kept in R_correction (0AH), G_correction (0BH) and B_correction
(0CH) registers. The correction multiplier can be between 0 and 2.
Due to LED self-heating, the temperature sensor and the LED temperatures will differ. The difference depends
on the thermal structure of the display module and the distance between the sensor and the LEDs. This
temperature difference can be compensated by storing the temperature difference value at highest power (100%
red LED PWM) in the EEPROM memory. The system then corrects the measured temperature based on the
actual PWM value used. The correction assumes that the red LED PWM value is representing the whole RGB
LED power consumption.
Sequential (non-overlapping) drive is possible using external PWM control inputs to trigger a new sequence in
each LED output. 60 mA maximum current setting makes possible 20 mA maximum averaged current for each
output in the non-overlapping mode.
7.4.3 Stand-Alone Mode
In stand-alone mode the operation is controlled through a single PWM brightness input, BRC. After power-up or
reset the LP5520 is ready for stand-alone operation without any setup through the serial interface. The stand-
alone mode is entered with a rising edge in the BRC input. The boost converter operates in adaptive mode. The
LED current settings are loaded from EEPROM. The LED brightness is controlled with a PWM signal in the BRC
input. The BRC PWM frequency must be from 2 to 10 kHz. The PWM signal in the BRC input is not used as
such for the LED outputs, but it is converted to 3-bit value and a logarithmic brightness control is based on this 3-
bit value, as shown in Table 9. There is hysteresis in the conversion to avoid blinking when the BRC duty cycle is
close to a threshold. When the PWM pulses end in the BRC input and the input stays low, the circuit goes to the
standby mode.
Figure 21 shows the waveforms in BRC input and ROUT output in the stand-alone mode. The circuit is in
standby mode until the first rising edge in BRC input is detected. The circuit starts up, and the outputs activate
after 30 ms from the first rising edge in BRC. The BRC frequency is assumed to 2 kHz in this example giving 0.5
ms BRC period. When the duty cycle changes in BRC, it takes two BRC periods before the change is reflected in
the output. When BRC goes permanently low, the circuit enters standby mode after 15 ms from the last BRC
pulse.
All controls through the serial interface can be used in the stand-alone mode. In Automatic and Manual mode the
control bit <brc_off> must be written high and BRC input kept low to prevent the LP5520 device from entering
stand-alone mode.
Table 9. Stand-Alone Mode Brightness Control
BRC DUTY CYCLE THRESHOLD VALUES (%)
INTENSITY
RECOMMENDED BRC PWM CONTROL VALUES
(% of maximum)
INCREASING
DECREASING
INCREASING
DECREASING
0
off
0.8
1.6
3.1
6.3
12.5
25
0
1
15
28
42
52
62
75
90
10
28
40
53
63
75
88
99
10
22
32
47
58
70
85
20
35
48
58
68
82
97
50
100
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BRC
period
200 ms
2 periods
BRC
ROUT
50 ms
30 ms
Turn on delay
15 ms
Turn off
delay
Change
delay
PWM
cycle
Figure 21. LP5520 Control and Output Waveforms in Stand-Alone Mode
L1
2.9 œ 5.5V
C
C
IN
C
VDDD
4.7 mH
VDDA
ADAPTIVE
100 nF
DDD
4.7 mF
5 œ 20V
100 nF
C
VLDO
V
V
DDA
SW
V
LDO
1 mF
LP5520
FB
S1_IN
S2_IN
TEMP
SENSOR
LM20
BOOST
ADC
ANALOG
SUPPORT
C
OUT
10 mF
CURRENT
DACS
V
DDIO
SS/SDA
SPI / I2C
INTER-
FACE
AND
CONTROL
C
VDDIO
CALIBRATION
EEPROM
SCK/SCL
SI/A0
100 nF
SO
IFSEL
NRST
ROUT
GOUT
BOUT
20 mA
20 mA
20 mA
LED
DRIVERS
COLOR
PWM
LOGIC
PWMR
PWMG
PWMB
BRC
PWM INPUT
GND_A
GND_LED
GND_SW
GND_T
ON/OFF/
BRIGHTNESS
Figure 22. LP5520 Connections in Stand-Alone Mode
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7.4.4 Start-Up Sequence
RESET:
In the RESET mode all the internal registers are reset to the default values, and the chip goes to
STANDBY mode after reset. <NSTBY> control bit is low after reset by default. Reset is entered
always if NRST input is low or internal power on reset (POR) is active. POR activates during the
chip start-up or when the supply voltage VDD falls below 1.5 V. Once VDD rises above 1.5 V, POR
inactivates, and the device continues to the STANDBY mode.
STANDBY: The STANDBY mode is entered if the register bit <NSTBY> is LOW. This is the low-power
consumption mode, when all circuit functions are disabled. Registers can be written in this mode,
and the control bits are effective immediately after power up.
STARTUP: When <NSTBY> bit is written high or there is a rising edge in the BRC input, the INTERNAL
STARTUP SEQUENCE powers up all the needed internal blocks (Vref, Bias, Oscillator, etc.). To
ensure the correct initialization, a 10-ms delay is generated by the internal state-machine after the
trim EEPROM values are read. If the chip temperature rises too high, the thermal shutdown (TSD)
disables the chip operation, and STARTUP mode is entered until no TSD event is present.
BOOST STARTUP: Soft start for boost output is generated in the BOOST STARTUP mode. The boost output is
raised in PWM mode during the 20-ms delay generated by the state machine. All LED outputs are
off during the 20-ms delay to ensure smooth start-up. The boost start-up is entered from internal
start-up sequence if <EN_BOOST> is HIGH or from Normal mode when <EN_BOOST> is written
HIGH.
NORMAL: During NORMAL mode the user controls the chip using the control registers or the BRC input in
stand-alone mode. The registers can be written in any sequence and any number of bits can be
altered in a register in one write.
NRST = L
RESET
or
POR = H
NSTBY = L and NRST = H
STANDBY
NSTBY = L or BRC = L
NRST = H
and
NRST = H
and
NSTBY = H or BRC = H
INTERNAL
STARTUP SEQUENCE
TSD = H
1
= 95% OK
V
REF
EEPROM AND EEPROM
READING (~1 ms)
~10 ms DELAY
1
1
EN_BOOST = H
EN_BOOST = L
BOOST STARTUP
1
EN_BOOST
RISING EDGE
~20 ms DELAY
NORMAL MODE
1) TSD = L
Figure 23. Device Functional Modes
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7.5 Programming
7.5.1 Control Interface
The LP5520 supports two different interface modes:
•
•
SPI interface (4-wire, serial), and
I2C-compatible interface (2-wire, serial)
User can define the serial interface by IF_SEL pin. IF_SEL = 0 selects the I2C mode.
7.5.1.1 I2C Compatible Interface
7.5.1.1.1 I2C Signals
The serial interface is in I2C mode when IF_SEL = 0. The SCL pin is used for the I2C clock and the SDA pin is
used for bidirectional data transfer. Both these signals need a pullup resistor according to I2C specification. The
values of the pullup resistors are determined by the capacitance of the bus (typical resistance is 1.8 kΩ). Signal
timing specifications are shown in I2C Timing Parameters .
7.5.1.1.2 I2C Data Validity
The data on SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, state of
the data line can only be changed when CLK is LOW.
SCL
SDA
data
change
allowed
data
change
allowed
data
change
allowed
data
valid
data
valid
Figure 24. I2C Signals: Data Validity
7.5.1.1.3 I2C Start and Stop Conditions
START and STOP bits classify the beginning and the end of the I2C session. START condition is defined as SDA
signal transitioning from HIGH to LOW while SCL line is HIGH. STOP condition is defined as the SDA
transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and STOP bits.
The I2C bus is considered to be busy after START condition and free after STOP condition. During data
transmission, I2C master can generate repeated START conditions. First START and repeated START
conditions are equivalent, function-wise.
SDA
SCL
S
P
START condition
STOP condition
Figure 25. I2C Start and Stop Conditions
7.5.1.1.4 Transferring Data
Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) being transferred first.
Each byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated
by the master. The transmitter releases the SDA line (HIGH) during the acknowledge clock pulse. The receiver
must pull down the SDA line during the 9th clock pulse, signifying an acknowledge. A receiver which has been
addressed must generate an acknowledge after each byte has been received.
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Programming (continued)
After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an
eighth bit which is a data direction bit (R/W). The LP5520 address is 20h when SI=0 and 21h when SI=1. For the
eighth bit, a 0 indicates a WRITE and a 1 indicates a READ. The second byte selects the register to which the
data is written. The third byte contains data to write to the selected register.
MSB
LSB
ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 R/W
Bit7
bit6
2
bit5
bit4
bit3
bit2
bit1
bit0
I C SLAVE address (chip address)
Figure 26. I2C Chip Address
ack from slave
ack from slave
ack from slave
start
msb Chip Address lsb
w
ack
msb Register Add lsb
ack
msb DATA lsb ack stop
SCL
SDA
start
Id = 20h or 21H
w
ack
addr = 00h
ack address 00h œ data 41h ack
stop
w = write (SDA = 0)
r = read (SDA = 1)
ack = acknowledge (SDA pulled down by either master or slave)
rs = repeated start
id = 7-bit chip address, 20h when SI=0 and 21h when SI=1 for LP5520.
Figure 27. I2C Write Cycle
When a READ function is to be accomplished, a WRITE function must precede the READ function, as shown in
the I2C Read Cycle waveform.
ack from slave data from slave
ack from slave
repeated start
noack from master
ack from slave
start
msb Chip Address lsb
w
msb Register Add lsb
rs
msb Chip Address lsb
r
msb DATA lsb stop
SCL
SDA
no
stop
ack
start
Id = 20h or 21h
w
ack
addr = 05h
ack rs
Id = 20h or 21h
r
ack Address 05h - data 08h
Figure 28. I2C Read Cycle
7.5.1.2 SPI Interface
The LP5520 is compatible with SPI serial-bus specification, and it operates as a slave. The transmission consists
of 16-bit write and read cycles. One cycle consists of 7 address bits, 1 read/write (RW) bit, and 8 data bits. RW-
bit high state defines a write cycle and low defines a read cycle. SO output is normally in high-impedance state,
and it is active only when data is sent out during a read cycle. The address and data are transmitted MSB first.
The slave select signal (SS) must be low during the cycle transmission. SS resets the interface when high, and it
must be taken high between successive cycles. Data is clocked in on the rising edge of the SCK clock signal,
while data is clocked out on the falling edge of SCK.
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Programming (continued)
SS
SCK
1
R/W
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
SI
SO
Figure 29. SPI Write Cycle
SS
SCK
SI
R/W
0
A6
A5
A4
A3
A2
A1
A0
Don't Care
SO
D7
D6
D5
D4
D3
D2
D1
D0
Figure 30. SPI Read Cycle
7.5.1.2.1 SPI Incremental Addressing
The LP5520 supports incremental addressing for memory read and write.
7.5.2 EEPROM Memory
The 1-kbit calibration EEPROM memory is organized as 128 × 8 bits. It stores the 12-bit calibration PWM values
for each output at 16°C intervals. Ten temperature points are used to cover the range from –40 to +120°C. The
temperature or light sensor calibration data, self-heating factor, and LED currents are also stored in the memory.
The memory contents and detailed memory map are shown in Table 10 and Table 11.
Table 10. EEPROM Contents
DATA
LENGTH
TOTAL BITS
10 PWM values for red
12
8
120
80
120
80
120
80
12
12
8
10 coefficients for red between the points
10 PWM values for green
12
8
10 coefficients for green between the points
10 PWM values for blue
12
8
10 coefficients for blue between the points
0°C reading for temperature sensor
Coefficient for temperature sensor
Maximum self-heating (100% red PWM)
Default current for ROUT
12
12
8
8
8
Default current for GOUT
8
8
Default current for BOUT
8
8
Free memory for user data
8
368
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Table 11. EEPROM Memory Map
ADDRESS
00
01
02
03
04
05
06
07
08
09
0a
0b
0c
BITS [7:4]
RB0[7:0]
BITS [3:0]
DEFINITION
Base PWM value for red
(8 LSB bits)
–40...–25
–24...–9
–8...+7
8...23
RB1[7:0]
RB2[7:0]
RB3[7:0]
RB4[7:0]
RB5[7:0]
RB6[7:0]
RB7[7:0]
RB8[7:0]
RB9[7:0]
GB0[7:0]
GB1[7:0]
GB2[7:0]
GB3[7:0]
GB4[7:0]
GB5[7:0]
GB6[7:0]
GB7[7:0]
GB8[7:0]
GB9[7:0]
BB0[7:0]
BB1[7:0]
BB2[7:0]
BB3[7:0]
BB4[7:0]
BB5[7:0]
BB6[7:0]
BB7[7:0]
BB8[7:0]
BB9[7:0]
LM20K[7:0]
LM20B[7:0]
24..39
40...55
56...71
72...87
88...103
from 104
–40...–25
–24...–9
–8...+7
8...23
Base PWM value for green
(8 LSB bits)
0d
0e
0f
24..39
40...55
56...71
72...87
88...103
from 104
–40...–25
–24...–9
–8...+7
8...23
10
11
12
13
14
15
16
17
18
19
1a
1b
1c
Base PWM value for blue
(8 LSB bits)
24..39
40...55
56...71
72...87
88...103
from 104
K
1d
1e
1f
Scaling values for LM20 sensor
B
20
...
Not used
3f
40
41
42
43
44
45
46
47
48
49
RC0[7:0]
RC1[7:0]
RC2[7:0]
RC3[7:0]
RC4[7:0]
RC5[7:0]
RC6[7:0]
RC7[7:0]
RC8[7:0]
RC9[7:0]
Coefficient PWM value for red
–40...–25
–24...–9
–8...+7
8...23
24..39
40...55
56...71
72...87
88...103
From 104
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Table 11. EEPROM Memory Map (continued)
ADDRESS
4a
4b
4c
BITS [7:4]
GC0[7:0]
BITS [3:0]
DEFINITION
Coefficient PWM value for green
–40...–25
–24...–9
–8...+7
8...23
GC1[7:0]
GC2[7:0]
GC3[7:0]
GC4[7:0]
GC5[7:0]
GC6[7:0]
GC7[7:0]
GC8[7:0]
GC9[7:0]
BC0[7:0]
BC1[7:0]
BC2[7:0]
BC3[7:0]
BC4[7:0]
BC5[7:0]
BC6[7:0]
BC7[7:0]
BC8[7:0]
BC9[7:0]
SHF[7:0]
RED_CUR
GREEN_CUR
BLUE_CUR
4d
4e
4f
24..39
40...55
56...71
72...87
88...103
From 104
–40...–25
–24...–9
–8...+7
8...23
50
51
52
53
54
55
56
57
58
59
5a
5b
5c
Coefficient PWM value for blue
24..39
40...55
56...71
72...87
88...103
From 104
5d
5e
5f
Self-heating factor
Red LED current
Green LED current
Blue LED current
Not used
60
61
62
...
6f
70
71
72
73
74
75
76
77
78
79
7a
7b
7c
LM20B[11:8]
BB9[11:8]
BB7[11:8]
BB5[11:8]
BB3[11:8]
BB1[11:8]
GB9[11:8]
GB7[11:8]
GB5[11:8]
GB3[11:8]
GB1[11:8]
RB9[11:8]
RB7[11:8]
RB5[11:8]
RB3[11:8]
RB1[11:8]
LM20K[11:8]
BB8[11:8]
BB6[11:8]
BB4[11:8]
BB2[11:8]
BB0[11:8]
GB8[11:8]
GB6[11:8]
GB4[11:8]
GB2[11:8]
GB0[11:8]
RB8[11:8]
RB6[11:8]
RB4[11:8]
RB2[11:8]
RB0[11:8]
Scaling values for LM20 sensor
Base PWM value for blue (high bits)
Base PWM value for green (high bits)
Base PWM value for red (high bits)
7d
7e
7f
The EEPROM data can be read, written, and erased through the serial interface. The boost converter is used to
generate the write and erase voltage for the memory. All operations are done in page mode. The page address
has to be written in the EEPROM_control register before access to the EEPROM. Incremental access can be
used both in I2C and SPI modes to speed up access. During EEPROM access the <rgb_auto> control bit in rgb
control register must be low.
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The EEPROM has 4 pages; only one page at time can be mirrored at the register map. For getting access to
page, the number of page must be set by <ee_page[1:0]> bits in the EEPROM_control register(0DH). The page
register address range is from 40H to 5FH.
Table 12. EEPROM Pages
00
01
10
11
page0 (00H-1FH)
page1 (20H-3FH)
page2 (40H-5FH)
page3 (60H-7FH)
<ee_page[1:0]>
(bits1-0)
The EEPROM consists of two types of memory, 128 × 8 EEPROM (non volatile memory) and 128 × 8
synchronous random access memory (SRAM). The EEPROM is used to store calibrated RGB control values
when the system is powered off. SRAM is used as working memory during operation.
EEPROM map
SRAM map
00H
00H
ee_page[1:0]
page0
page0
1FH
20H
1FH
20H
00
01
Register map
40H
5FH
page1
page2
page3
page1
page2
page3
3FH
40H
3FH
40H
10
11
5FH
60H
5FH
60H
7FH
7FH
Figure 31. EEPROM Memory
EEPROM content is copied into SRAM always when the chip is taken from stand-by mode to active mode.
Copying to SRAM can also be made during operation by writing the <ee_read> bit high and low in the EEPROM
control (0DH) register. For reading the data from the SRAM, the page number must be set with <ee_page[1:0]>
bits and the page read from addresses 40H – 5FH.
The EEPROM must be erased before programming. The erase command erases one page at time, which must
be selected with <ee_page[1:0]> bits. This operation starts after setting and resetting <ee_erase> and takes
about 100 ms after rising <ee_erase> bit. During erasing <ee_prog> bit of the EEPROM_CONTROL register is
low. Corresponding SRAM area is erased with this operation also. <ee_erase> and <ee_prog> can be set only
one command at a time (erase or program).
During programming the content of SRAM is copied to EEPROM, EEPROM programming cycle has two steps.
At first, write the whole content of the SRAM, all 4 pages. The whole page can be written during one SPI/I2C
cycle in the auto-increment mode. Second step is programming the EEPROM. This operation starts after writing
<ee_prog> high and back low and takes about 100 ms after rising <ee_prog> bit. During programming
<ee_prog> bit of the EEPROM_CONTROL register is low. For EEPROM erasing and programming the chip has
to be in active mode (<NSTBY> high), the boost must be off (<in_boost> low) and the boost voltage set to 18 V
(boost output register value 12H).
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7.6 Register Maps
7.6.1 LP5520 Registers, Control Bits, and Default Values
All registers have their default value after power-on or reset. Default value for correction registers is 1000 0000
(multiplier = 1). Default value for adaptive voltage control and fast PWM is on. Default value for current set
registers is 55H which sets the current to 20 mA. Default value for all other register bits is 0. Note that in
automatic compensation mode the LED currents are obtained from the EEPROM.
Bits with r/o are read-only bits.
ADR
00H
REG NAME
D7
D6
D5
D4
D3
D2
D1
D0
DEFAULT
rgb
control
seq_
mode[1]
seq_
mode[0]
en_fade
pwm_
fast
rgb_auto
en_b
en_g
en_r
0001 0000
01H
02H
03H
04H
current
control (R)
cc_r[7]
cc_g[7]
cc_b[7]
cc_r[6]
cc_g[6]
cc_b[6]
cc_r[5]
cc_g[5]
cc_b[5]
cc_r[4]
cc_g[4]
cc_b[4]
cc_r[3]
cc_g[3]
cc_b[3]
brc_off
cc_r[2]
cc_g[2]
cc_b[2]
bri2
cc_r[1]
cc_g[1]
cc_b[1]
bri1
cc_r[0]
cc_g[0]
cc_b[0]
bri0
0101 0101
0101 0101
0101 0101
0000 0000
current
control (G)
current
control (B)
pwm
brightness
05H
06H
boost output
control
vprog[4] vprog[3]
vprog[2]
vprog[1]
vprog[0]
nstby
0000 0000
0000 0100
adc_ch
comp_
sel
en_
autoload
vout_
auto
en_boost
08H
09H
ADC_
hi_byte
bit11
(r/o)
bit10
(r/o)
bit9
(r/o)
bit8
(r/o)
ADC_
bit7
bit6
bit5
bit4
bit3
bit2
bit1
bit0
low_byte
(r/o)
(r/o)
(r/o)
(r/o)
(r/o)
(r/o)
(r/o)
(r/o)
0AH
0BH
0CH
0DH
R correction
G correction
B correction
corr_r[7]
corr_g[7]
corr_b[7]
corr_r[6]
corr_r[5] corr_r[4] corr_r[3]
corr_r[2]
corr_r[1]
corr_g[1]
corr_b[1]
corr_r[0]
corr_g[0]
corr_b[0]
1000 0000
1000 0000
1000 0000
0000 0000
corr_g[6] corr_g[5] corr_g[4] corr_g[3] corr_g[2]
corr_b[6] corr_b[5] corr_b[4] corr_b[3] corr_b[2]
ee_erase ee_prog ee_read
EEPROM
Control
ee_ready
(r/o)
ee_page[1 ee_page[0]
]
Register addresses from 40H to 5FH contain the EEPROM page. EEPROM access is described in the
Calibration Memory chapter.
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7.6.1.1 Register Bit Conventions
Each register is shown with a key indicating the accessibility of the each individual bit, and the initial condition:
Table 13. Register Bit Accessibility And Initial Condition
Key
rw
Bit Accessibility
Read/write
r
Read only
–0, –1
Condition after POR
rgb_control (00H) – RGB LEDs Control Register
7
6
5
4
3
2
1
0
seq_mode1
rw-0
seq_mode0
rw-0
en_fade
rw-0
pwm_fast
rw-1
rgb_auto
rw-0
en_b
rw-0
en_g
rw-0
en_r
rw-0
0 0 – overlapping PWM mode
0 1 – sequential mode with 2 PWM pulses
1 0 – sequential mode with 3 PWM pulses
1 1 – sequential mode with 4 PWM pulses
seq_mode[1:0]
Bits 6 - 7
0 – automatic fade disabled
1 – automatic fade enabled
en_fade
pwm_fast
rgb_auto
en_b
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0 – normal PWM frequency 1.22 kHz
1 – high PWM frequency 19.52 kHz
0 – automatic compensation disabled
1 – automatic compensation enabled
0 – blue LED output BOUT disabled
1 – blue LED output BOUT enabled
0 – green LED output GOUT disabled
1 – green LED output GOUT enabled
en_g
0 – red LED output ROUT disabled
1 – red LED output ROUT enabled
en_r
current_control_R (01H) – Red LED Current Control Register
7
6
5
4
3
2
1
0
cc_r[7]
rw-0
cc_r[6]
rw-1
cc_r[5]
rw-0
cc_r[4]
rw-1
cc_r[3]
rw-0
cc_r[2]
rw-1
cc_r[1]
rw-0
cc_r[0]
rw-1
Adjustment
cc_r[7:0]
Typical driver current (mA)
0000 0000
0000 0001
0000 0010
0000 0011
...
0
0.234
0.468
0.702
...
cc_r[7:0]
Bits 7 - 0
1111 1101
1111 1110
1111 1111
59.202
59.436
59.670
current_control_G (02H) – Green LED Current Control Register
7
6
5
4
3
2
1
0
cc_g[7]
rw-0
cc_g[6]
rw-1
cc_g[5]
rw-0
cc_g[4]
rw-1
cc_g[3]
rw-0
cc_g[2]
cc_g[1]
cc_g[0]
rw-1
rw-1
rw-0
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current_control_B (03H) – Blue LED Current Control Register
7
6
5
4
3
2
1
0
cc_b[7]
rw-0
cc_b[6]
rw-1
cc_b[5]
rw-0
cc_b[4]
rw-1
cc_b[3]
rw-0
cc_b[2]
rw-1
cc_b[1]
rw-0
cc_b[0]
rw-1
pwm_brightness (04H) – Brightness Control Register
7
6
5
4
3
2
1
0
brc_off
r-0
bri[2]
rw-0
bri[1]
rw-0
bri[0]
rw-0
r-0
r-0
r-0
rw-0
brc_off = 0 - stand-alone mode,
brightness is defined with external BRC signal
brc_off = 1 - brightness is defined with bri[2:0]
Control
0
Multiplier
0.008
0.016
0.031
0.063
0.125
0.250
0.500
1.000
Intensity %
0.8
1.6
3.1
6.3
12.5
25
1
brc_off
bri[2:0]
Bit 4
Bits 2-0
10
11
100
101
110
111
50
100
boost_output (05H) – Boost Output Voltage Control Register
7
6
5
4
vprog[4]
r-0
3
2
1
0
vprog[3]
rw-0
vprog[2]
rw-0
vprog[1]
rw-0
vprog[0]
rw-0
r-0
r-0
r-0
Adjustment
vprog[4:0]
Typical boost output voltage (V)
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
10000
10001
10010
10011
10100
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
14.0
15.0
16.0
17.0
18.0
19.0
20.0
vprog[4:0]
Bits 4 - 0
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control (06H) – Control Register
7
6
5
4
3
2
1
0
adc_ch
rw-0
comp_sel
rw-0
en_autoload
rw-0
vout_auto
rw-1
en_boost
rw-0
nstby
rw-0
r-0
r-0
0 – compensation depends from the external LM20 temperature sensor
1 – compensation depends from forward voltage of the red LED as temperature sensor
adc_ch
comp_sel
en_autoload
vout_auto
en_boost
nstby
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0 – compensation based on S1_IN input
1 – compensation based on S2_IN input
0 – internal boost converter loader off
1 – internal boost converter loader off
0 – manual boost output adjustment with boost_output register
1 – automatic adaptive boost output adjustment
0 – boost converter disabled
1 – boost converter enabled
0 – LP5520 standby mode
1 – LP5520 active mode
ADC_hi_byte (08H) – Analog Digital Converter Output, bits 8-11
7
6
5
4
3
2
1
0
adc[11]
r-0
adc[10]
r-0
adc[9]
r-0
adc[8]
r-0
r-0
r-0
r-0
r-0
ADC_low_byte (09H) – Analog Digital Converter Output, bits 0-7
7
6
5
4
3
2
1
0
adc[7]
r-0
adc[6]
r-0
adc[5]
r-0
adc[4]
r-0
adc[3]
r-0
adc[2]
r-0
adc[1]
r-0
adc[0]
r-0
r_correction (0AH) – Additional Brightness Correction Value Register for Red LED
7
6
5
4
3
2
1
0
corr_r[7]
rw-1
corr_r[6]
rw-0
corr_r[5]
rw-0
corr_r[4]
rw-0
corr_r[3]
rw-0
corr_r[2]
rw-0
corr_r[1]
rw-0
corr_r[0]
rw-0
Correction
corr_r[7:0]
Multiplier
0
0000 0000
0000 0001
0000 0010
...
0.0078
0.0156
...
corr_r[7:0]
Bits 7-0
1000 0000
...
1.000
...
1111 1101
1111 1110
1111 1111
1.991
1.999
2.000
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g_correction (0BH) – Additional Brightness Correction Value Register for Green LED
7
6
5
4
3
2
1
0
corr_g[7]
rw-1
corr_g[6]
rw-0
corr_g[5]
rw-0
corr_g[4]
rw-0
corr_g[3]
rw-0
corr_g[2]
rw-0
corr_g[1]
rw-0
corr_g[0]
rw-0
b_correction (0CH) – Additional Brightness Correction Value Register for Blue LED
7
6
5
4
3
2
1
0
corr_b[7]
rw-1
corr_b[6]
rw-0
corr_b[5]
rw-0
corr_b[4]
rw-0
corr_b[3]
rw-0
corr_b[2]
rw-0
corr_b[1]
rw-0
corr_b[0]
rw-0
EEPROM_control (0DH) – EEPROM Control Register
7
ee_ready
r-1
6
5
4
3
2
1
0
ee_erase
rw-0
ee_prog
rw-0
ee_read
r-0
ee_page[1]
rw-0
ee_page[0]
rw-0
r-0
r-0
ee_ready
Bit 7
EEPROM operations ready bit (read only)
Start bit for erasing sequence
ee_erase
ee_prog
ee_read
Bit 6
Bit 5
Start bit for programming sequence
Read EEPROM data to SRAM
Bit 4
Bits 1-0
ee_page[1]
ee_page[0]
page
EEPROM addresses
0
0
1
1
0
1
0
1
0
1
2
4
00H-1FH (0-31)
20H-3FH (32-63)
40H-5FH (64-95)
60H-7FH (96-127)
ee_page[1:0]
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LP5520 is an RGB backlight LED driver for small format color LCDs. The device has a magnetic boost
converter that creates an up to 20-V LED supply voltage from the battery voltage. Three current sinks can drive
up to 60 mA of current per string. Figure 32 and Figure 35 show the connections when using LP5520 in
automatic mode and in stand-alone mode.
8.2 Typical Applications
8.2.1 Typical Application: I2C-Bus Control
In this typical application LP5520 is controlled with an I2C bus. Operation mode is automatic without external
PWM control.
D1
L1
2.9 œ 5.5V
5 œ 20V
4.7 mH
C
C
C
VDDA
VDDD
IN
C
OUT
2 x
100 nF
100 nF
4.7 mF
4.7 mF
1 mF
V
V
DDD
SW
DDA
V
LDO
C
VLDO
S1_IN
S2_IN
CALIBRATION
MEMORY
FB
ADC
BOOST
V
LDO
LM 20
NRST
SS/SDA
SCK/SCL
LP5520
MCU
WITH
I2C
SPI/I2C
INTER-
FACE
SI/A0
SO
OR
SPI
IFSEL
V
DDIO
COLOR AND
BRIGHTNESS
PWM LOGIC
LED
DRIVERS
ROUT
GOUT
BOUT
PWMR
PWMG
PWMB
BRC
C
VDDIO
100 nF
GND
Figure 32. LP5520 Typical I2C-Bus Application
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Typical Applications (continued)
8.2.1.1 Design Requirements
For typical RGB backlight LED-driver I2C-bus applications, use the parameters listed in Table 14.
Table 14. Design Parameters
DESIGN PARAMETER
Input voltage range
Maximum output voltage
LED configuration
LED current
EXAMPLE VALUE
2.9 V to 5.5 V
20 V
3 strings with 6 LEDs in series
Maximum 60 mA per string
I2C
Brightness control
Operation mode
Input capacitor
Automatic/normal
10 µF, 6.3 V
Output capacitors
Inductor
2 × 4.7 µF, 25 V
4.7 µH
Temperature sensor
LM20
8.2.1.2 Detailed Design Procedure
8.2.1.2.1 Recommended External Components
8.2.1.2.1.1 Output Capacitor: COUT
The output capacitor COUT directly affects the magnitude of the output ripple voltage. In general, the higher the
value of COUT, the lower the output ripple magnitude. Multilayer ceramic capacitors with low ESR are the best
choice. Capacitor voltage rating must be sufficient; TI recommends 25 V or greater. Examples of suitable
capacitors are: TDK C3216X5R1E475K, Panasonic ECJ3YB1E475K, and Panasonic ECJ4YB1E475K.
Some ceramic capacitors, especially those in small packages, exhibit a strong capacitance reduction with the
increased applied voltage (DC bias effect). The capacitance value can fall below half of the nominal capacitance.
Output capacitance that is too low can make the boost converter unstable. Output capacitor value reduction due
to DC bias must be less than 70% at 20 V (minimum 3 µF of real capacitance remaining).
8.2.1.2.1.2 Input Capacitor: CIN
The input capacitor CIN directly affects the magnitude of the input ripple voltage and to a lesser degree the VOUT
ripple. A higher value CIN gives a lower VIN ripple.
8.2.1.2.1.3 Output Diode: DOUT
A schottky diode must be used for the output diode. To maintain high efficiency the average current rating of the
Schottky diode must be greater than the peak inductor current (1 A). Schottky diodes with a low forward drop and
fast switching speeds are ideal for increasing efficiency in portable applications. Choose a reverse breakdown
voltage of the schottky diode significantly larger (approximately 30 V) than the output voltage. Do not use
ordinary rectifier diodes, because slow switching speeds and long recovery times cause the efficiency and the
load regulation to suffer. A schottky diode with low parasitic capacitance helps in reducing EMI noise. Examples
of suitable diodes are Central Semiconductor CMMSH1-40 and Infineon BAS52-02V.
8.2.1.2.1.4 EMI Filter Components: CSW, RSW, LSW And CHF
EMI filter (RSW, CSW and LSW ) on the SW pin may be needed to slow down the fast switching edges and reduce
ringing. These components must be as near as possible to the SW pin to ensure reliable operation. High
frequency capacitor (CSW) in the boost output helps in suppressing the high frequency noise from the switcher.
50V or greater voltage rating is recommended for the capacitors. The ferrite bead DC resistance must be less
than 0.1 Ω and current rating 1 A or above. The impedance at 100 MHz must be from 30 Ω to 300 Ω. Examples
of suitable types are TDK MPZ1608S101A and Taiyo-Yuden FBMH 1608HM600-T.
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8.2.1.2.1.5 Inductor: L1
A 4.7-µH shielded inductor is suggested for LP5520 boost converter. The inductor must have a higher saturation
current rating than the peak current it receives during circuit operation (0.5 A – 1 A depending on the output
current). Equivalent series resistance (ESR) less than 500-mΩ is suggested for high efficiency. Open core
inductors cause flux linkage with circuit components and interfere with the normal operation of the circuit. This
must be avoided. For high efficiency, choose an inductor with a high-frequency core material such as ferrite to
reduce the core losses. To minimize radiated noise, use a toroid, pot core or shielded core inductor. The inductor
must be connected to the SW pin as close to the device as possible. Examples of suitable inductors are: TDK
VLF3010AT-4R7MR70 and Coilcraft LPS3010-472NL.
8.2.1.2.1.6 List Of Recommended External Components
SYMBOL
CVDDA
SYMBOL EXPLANATION
C between VDDA and GND
VALUE
100
UNIT
nF
TYPE
Ceramic, X7R / X5R
Ceramic, X7R, X5R
Ceramic, X7R / X5R
Ceramic, X7R / X5R
CVDDD
C between VDDD and GND
C between VLDO and GND
C between VDDIO and GND
100
nF
CVLDO
1
µF
CVDDIO
100
nF
2 × 4.7
µF
Ceramic, X7R / X5R, tolerance ±10%, DC bias
effect approximately 30% at 20 V
COUT
C between FB and GND
CIN
L1
C between battery voltage and GND
L between SW and VBAT
10
4.7
µF
µH
V
Ceramic, X7R / X5R
Shielded, low ESR, ISAT 0.5 A
0. 3 – 0.5
Schottky diode, reverse voltage 30 V, repetitive
peak current 0.5 A
D1
Rectifying diode (Vƒ at maximum load)
CSW
RSW
CHF
Optional C in EMI filter
330
3.9
pF
Ω
Ceramic, X7R / X5R, 50V
±1%
Optional R in EMI filter
Optional high frequency output C
33 - 100
30 - 300
pF
Ceramic, X7R, X5R, 50V
Ω
LSW
Ferrite bead in SW pin
at 100 Mhz
LEDs
User Defined
8.2.1.3 Application Curves
ꢀ0.0
88.0
I
= 60 mA
LOAD
80 mA
20 mA
86.0
84.0
40 mA
82.0
80.0
INDUCTOR TDK VLF 3010 œ 4.7 mH
3.2 3.5 3.7 4.0
{Ütt[ò ëh[Ç!D9 (ë)
0
0.5
1.0
1.5
2.0
2.5
3.0
4.2
TIME (ms)
Figure 33. Boost Converter Efficiency
Figure 34. Boost Typical Waveforms at 60-mA Load
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8.2.2 Stand-Alone Typical Application
In stand-alone mode the operation is controlled through a single PWM brightness input, BRC. After power-up or
reset the LP5520 is ready for stand-alone operation without any setup through the serial interface. The stand-
alone mode is entered with a rising edge in the BRC input. The boost converter operates in adaptive mode. The
LED current settings are read from EEPROM. The LED brightness is controlled with a PWM signal in the BRC
input. The BRC PWM frequency must be between 2 and 10 kHz.
L1
2.9 œ 5.5V
C
C
IN
C
VDDD
4.7 mH
VDDA
ADAPTIVE
100 nF
DDD
4.7 mF
5 œ 20V
100 nF
C
VLDO
V
V
DDA
SW
V
LDO
1 mF
LP5520
FB
S1_IN
S2_IN
TEMP
SENSOR
LM20
BOOST
ADC
ANALOG
SUPPORT
C
OUT
10 mF
CURRENT
DACS
V
DDIO
SS/SDA
SPI / I2C
INTER-
FACE
AND
CONTROL
C
VDDIO
CALIBRATION
EEPROM
SCK/SCL
SI/A0
100 nF
SO
IFSEL
NRST
ROUT
GOUT
BOUT
20 mA
20 mA
20 mA
LED
DRIVERS
COLOR
PWM
LOGIC
PWMR
PWMG
PWMB
BRC
PWM INPUT
GND_A
GND_LED
GND_SW
GND_T
ON/OFF/
BRIGHTNESS
Figure 35. Typical Stand-Alone Application
8.2.2.1 Design Requirements
For typical RGB backlight LED-driver stand-alone applications, use the parameters listed in Table 14.
Table 15. Design Parameters
DESIGN PARAMETER
Input voltage range
Maximum output voltage
LED configuration
LED current
EXAMPLE VALUE
2.9 V to 5.5 V
20 V
3 strings with 6 LEDs in series
Maximum 60 mA per string
With BRC input, 2-kHz PWM signal; 8 steps
Stand-alone operation
10 µF, 6.3 V
Brightness control
Operation mode
Input capacitor
Output capacitors
Inductor
2 × 4.7 µF, 25 V
4.7 µH
Temperature sensor
LM20
8.2.2.2 Detailed Design Procedure
See Detailed Design Procedure.
8.2.2.3 Application Curves
See Application Curves.
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9 Power Supply Recommendations
The device is designed to operate with an input voltage supply range from 2.9 V to 5.5 V. In typical application
this is from single Li-ion battery cell. This input supply must be well regulated and able to withstand maximum
input current and maintain stable voltage without voltage drop even at load transition condition (start-up or rapid
brightness change). The resistance of the input supply rail must be low enough that the input current transient
does not cause a drop below the 2.9-V level in the LP5520 supply voltage.
10 Layout
10.1 Layout Guidelines
Figure 36 shows a layout recommendation for the LP5520 used to demonstrate the principles of good layout.
This layout can be adapted to the actual application layout if or where possible. It is important that all boost
components are close to the chip, and the high current traces must be wide enough. By placing boost
components on one side of the chip it is easy to keep the ground plane intact below the high current paths. This
way other chip pins can be routed more easily without splitting the ground plane. Bypass VLDO capacitor must
as close as possible to the device.
Here are main points to help with the PCB layout work:
•
Current loops need to be minimized:
–
For low frequency the minimal current loop can be achieved by placing the boost components as close to
the SW and GND_SW pins as possible. Input and output capacitor grounds must be close to each other to
minimize current loop size.
–
Minimal current loops for high frequencies can be achieved by making sure that the ground plane is intact
under the current traces. High-frequency return currents try to find route with minimum impedance, which
is the route with minimum loop area, not necessarily the shortest path. Minimum loop area is formed when
return current flows just under the positive current route in the ground plane, if the ground plane is intact
under the route.
•
•
•
•
GND plane must be intact under the high current boost traces to provide the shortest possible return path and
smallest possible current loops for high frequencies.
Current loops when the boost switch is conducting and not conducting must be on the same direction in
optimal case.
Inductor must be placed so that the current flows in the same direction as in the current loops. Rotating
inductor 180° changes current direction.
Use separate power and noise-free grounds or ground areas. Power ground is used for boost converter
return current and noise-free ground for more sensitive signals, like LDO bypass capacitor grounding as well
as grounding the GNDA pin of the device itself.
•
Boost output feedback voltage to LEDs must be taken out after the output capacitors, not straight from the
diode cathode.
•
•
•
•
Place LDO 1-µF bypass capacitor as close to the LDO pin as possible.
Input and output capacitors need strong grounding (wide traces, many vias to GND plane).
If two output capacitors are used they need symmetrical layout to get both capacitors working ideally.
Output ceramic capacitors have DC-bias effect. If the output capacitance is too low, it can cause boost to
become unstable on some loads; this increases EMI. DC bias characteristics should be obtained from the
component manufacturer; DC bias is not taken into account on component tolerance. TI recommends
X5R/X7R capacitors.
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10.2 Layout Example
Route in
different layer
VDDD cap
Grounded to noise
free GND plane
SI/
FB
SO
A0
VDDD
IFSEL
PWMG
S2_IN
S1_IN
SW
SS/
SDA
SCK
/SCL
GND
_SW
PWMR
VBOOST rail
VBATT rail
GND
_LED
VDDIO cap
VLDO cap
VDDIO
VLDO
NRST
BRC
GNDA
PWMB
BOUT
ROUT
GOUT
VDDA
GNDT
VDDA cap
Power GND
Area
Pin A1
Vias to GND plane
Grounded to noise
free GND plane
LED outputs
Figure 36. LP5520 Layout Example
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Documentation Support
11.2.1 Related Documentation
For additional information, see the following:
DSBGA Wafer Level Chip Scale Package (SNVA009)
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LP5520TL/NOPB
LP5520TLX/NOPB
ACTIVE
ACTIVE
DSBGA
DSBGA
YZR
YZR
25
25
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-30 to 85
-30 to 85
5520
5520
3000 RoHS & Green
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP5520TL/NOPB
LP5520TLX/NOPB
DSBGA
DSBGA
YZR
YZR
25
25
250
178.0
178.0
8.4
8.4
2.67
2.67
2.95
2.95
0.76
0.76
4.0
4.0
8.0
8.0
Q1
Q1
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP5520TL/NOPB
LP5520TLX/NOPB
DSBGA
DSBGA
YZR
YZR
25
25
250
208.0
208.0
191.0
191.0
35.0
35.0
3000
Pack Materials-Page 2
MECHANICAL DATA
YZR0025xxx
0.600±0.075
D
E
TLA25XXX (Rev D)
D: Max = 2.787 mm, Min =2.727 mm
E: Max = 2.621 mm, Min =2.561 mm
4215055/A
12/12
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
NOTES:
www.ti.com
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