LP8543 [TI]

High-Voltage DC/DC Boost Converter With Integrated FET; 高电压DC / DC升压转换器具有集成FET
LP8543
型号: LP8543
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High-Voltage DC/DC Boost Converter With Integrated FET
高电压DC / DC升压转换器具有集成FET

转换器 升压转换器
文件: 总40页 (文件大小:1197K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LP8543  
www.ti.com  
SNVS604D AUGUST 2009REVISED MARCH 2013  
SMBus/I2C Controlled WLED Driver for Medium-Sized LCD Backlight  
Check for Samples: LP8543  
1
FEATURES  
DESCRIPTION  
The LP8543 is a white LED driver with integrated  
boost converter. It has 7 adjustable current sinks  
which can be controlled by SMBus or I2C-compatible  
serial interface, PWM input and Ambient Light Sensor  
(ALS).  
2
High-Voltage DC/DC Boost Converter with  
Integrated FET  
5.5V to 22V Input Voltage Range to Support 2x,  
3x and 4x Li-Ion Batteries.  
PWM Phase Shift Control with Adaptive Boost  
Output to Increase Efficiency Compared to  
Conventional Boost Converters Topologies  
The boost converter has adaptive output voltage  
control based on the LED driver voltages. This  
feature minimizes the power consumption by  
adjusting the voltage to lowest sufficient level in all  
conditions. Phase Shift PWM dimming offers further  
power saving especially when there is poor matching  
in the forward voltages of the LED strings. Boost  
voltage can also be controlled through the  
SMBus/I2C.  
PWM Brightness Control for Single Wire  
Control and Stand-Alone Use  
Digital Ambient Light Sensor Interface with  
User-Programmed Ambient Light to Backlight  
Brightness Curve  
Easy-to-Use EEPROM Calibration for Current,  
Intensity and Ambient Light Response Setting  
Internal EEPROM stores the data for backlight  
brightness and ambient light sensor calibration.  
Brightness can be calibrated during the backlight unit  
production so that all units produce the same  
brightness. EEPROM also stores the coefficients for  
the LED control equations and the default LED  
current value. LED current has 8–bit adjustment from  
0 to 60 mA.  
Seven LED Drivers with LED Fault  
(Short/open) Detection  
Eight-Bit LED Current Control  
Internal Thermal Protection and Backlight  
Safety Dimming Feature  
Two Wire, SMBus/ I2C-Compatible Control  
Interface  
The LP8543 has several safety and diagnostic  
features. Low-input voltage detection turns the chip  
off if the system gets stuck and battery fully  
discharges. Input voltage detection threshold is  
adjustable for different battery configurations.  
Thermal regulation reduces backlight brightness  
above a set temperature. LED fault detection reports  
open or LED short fault. Boost over-current fault  
detection protects the chip in case of over-current  
event.  
Low-Input Voltage Detection and Shutdown  
Minimum Number of External Components  
WQFN 24-Pin Package, 4 x 4 x 0.8 mm  
APPLICATIONS  
Medium Sized (>10 inches) LCD Display  
Backlight  
LED Lighting  
LP8543 is available in the WQFN 24-pin package.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2013, Texas Instruments Incorporated  
LP8543  
SNVS604D AUGUST 2009REVISED MARCH 2013  
www.ti.com  
Typical Application  
10V œ 38V  
210 mA œ 400 mA  
L1  
D1  
V
IN  
5.5V œ 22V  
15 mH  
5V  
VLDO  
470 nF  
C
IN  
C
OUT  
DIGITAL  
AMBIENT  
LIGHT  
10 mF  
C
4.7 mF  
SENSOR  
DISPLAY1  
SW  
V
IN  
V
LDO  
FB  
ALSO  
ALSI  
UP TO 60 LEDS  
ALS  
OUT1  
V
reference voltage  
OUT2  
OUT3  
OUT4  
DDIO  
V
DDIO  
ADR  
IF_SEL  
LP8543  
OUT5  
OUT6  
SCLK  
SDA  
MCU  
PWM  
FAULT  
EN  
OUT7  
DISPLAY2  
GNDs  
UP TO 10 LEDS  
Typical Application, Using 7 Outputs for Display1  
10V œ 38V  
210 mA œ 400 mA  
L1  
D1  
V
IN  
5.5V œ 22V  
15 mH  
5V  
VLDO  
470 nF  
C
IN  
C
OUT  
DIGITAL  
AMBIENT  
LIGHT  
C
10 mF  
4.7 mF  
SENSOR  
DISPLAY1  
SW  
V
IN  
V
LDO  
FB  
ALSO  
ALSI  
UP TO 70 LEDS  
ALS  
OUT1  
V
reference voltage  
DDIO  
OUT2  
OUT3  
OUT4  
V
DDIO  
ADR  
IF_SEL  
LP8543  
OUT5  
OUT6  
OUT7  
SCLK  
SDA  
MCU  
PWM  
FAULT  
EN  
GNDs  
2
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LP8543  
www.ti.com  
SNVS604D AUGUST 2009REVISED MARCH 2013  
Typical Application, Stand-Alone Mode  
10V œ 38V  
210 mA œ 400 mA  
L1  
D1  
V
IN  
5.5V œ 22V  
15 mH  
C
IN  
10 mF  
C
OUT  
C
VLDO  
4.7 mF  
470 nF  
DISPLAY1  
SW  
V
V
IN  
LDO  
ALSO  
ALSI  
FB  
UP TO 60 LEDS  
OUT1  
V
DDIO  
reference voltage  
OUT2  
OUT3  
OUT4  
V
DDIO  
ADR  
IF_SEL  
LP8543  
SCLK  
SDA  
OUT5  
OUT6  
MCU or  
PWM  
generator  
PWM  
FAULT  
EN  
OUT7  
GNDs  
Connection Diagrams  
PIN 1 ID  
PIN 1 ID  
1
2
3
4
5
6
6
5
4
3
2
1
24  
23  
22  
21  
20  
19  
7
8
7
8
24  
23  
22  
21  
20  
19  
9
9
10  
11  
12  
10  
11  
12  
18  
17  
16  
15  
14  
13  
13  
14  
15  
16  
17  
18  
Figure 1. 24–pin WQFN Package Number  
RTW0024A  
Figure 2. 24–pin WQFN Package Number  
RTW0024A  
4.0 x 4.0 x 0.8mm, 0.5 mm pitch  
Bottom View  
4.0 x 4.0 x 0.8mm, 0.5 mm pitch  
Top View  
Pin Functions  
PIN DESCRIPTIONS(1)  
Pin #  
Name  
GND_SW  
PWM  
Type  
Description  
1
2
G
I
Boost ground  
PWM dimming input. This pin must be connected to GND if not  
used.  
3
4
IF_SEL  
EN  
I
I
Serial interface mode selection: IF_SEL= Low for I2C-compatible  
interface and IF_SEL=High for SMBus interface.  
Enable input pin  
(1) A: Analog Pin, G: Ground Pin, P: Power Pin, I: Input Pin, I/O: Input/Output Pin, O: Output Pin, OD: Open Drain Pin  
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LP8543  
SNVS604D AUGUST 2009REVISED MARCH 2013  
www.ti.com  
PIN DESCRIPTIONS(1) (continued)  
Pin #  
Name  
Type  
Description  
5
ALSI  
I
Ambient light sensor frequency input pin. This pin must be  
connected to GND if ALS is not used.  
6
7
8
ALSO  
FAULT  
VDDIO  
O
OD  
P
Ambient light sensor enable output  
Fault indication output  
Digital IO reference voltage 1.65V to 5.5V. Needed in SMBus/I2C  
and stand alone mode.  
9
GND_S  
SCLK  
SDA  
G
I
Signal ground  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
Serial clock. This pin must be connected to GND if not used.  
Serial data. This pin must be connected to GND if not used.  
Current sink output  
I/O  
A
A
A
G
A
A
A
A
I
OUT1  
OUT2  
OUT3  
GND_L  
OUT4  
OUT5  
OUT6  
OUT7  
ADR  
Current sink output  
Current sink output  
Ground for current sink outputs  
Current sink output  
Current sink output. Can be left floating if not used.  
Current sink output. Can be left floating if not used.  
Current sink output. Can be left floating if not used.  
Serial interface address selection. See SMBus/I2C Compatible Serial  
Bus Interface for details. This pin must be connected to GND if not  
used.  
21  
22  
FB  
A
A
Boost feedback input  
VLDO  
LDO output voltage. 470 nF capacitor should be connected to this  
pin.  
23  
24  
VIN  
P
A
Input power supply 5.5V to 22V  
Boost switch  
SW  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
4
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LP8543  
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SNVS604D AUGUST 2009REVISED MARCH 2013  
(1)(2)(3)  
Absolute Maximum Ratings  
VIN  
-0.3V to +24.0V  
-0.3V to +6.0V  
-0.3V to +6.0V  
-0.3V to VDDIO  
-0.3V to +44.0V  
Internally Limited  
125°C  
VDDIO, VLDO  
Voltage on Logic Pins (PWM, ADR EN, IF_SEL, ALSO, ALSI)  
Voltage on Logic Pins (SCLK, SDA, FAULT)  
V (OUT1...OUT7 SW, FB)  
(4)  
Continuous Power Dissipation  
Junction Temperature (TJ-MAX  
Storage Temperature Range  
)
-65°C to +150°C  
(5)  
Maximum Lead Temperature (Soldering)  
(6)  
ESD Rating  
Human Body Model:  
Machine Model:  
2 kV  
OUT7: 150V  
All other pins : 200V  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits  
and associated test conditions, see the Electrical Characteristics tables.  
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(3) All voltages are with respect to the potential at the GND pins.  
(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and  
disengages at TJ = 130°C (typ.).  
(5) For detailed soldering specifications and information, please refer to Texas Instruments AN1187: Leadless Leadframe Package (LLP).  
(6) The Human body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200 pF  
capacitor discharged directly into each pin. MIL-STD-883 3015.7  
(1)(2)  
Operating Ratings  
Input Voltage Range VIN  
5.5 to 22.0V  
1.65 to 5V  
VDDIO  
V (OUT1...OUT7, SW, FB)  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range  
0 to 40V  
40°C to +125°C  
40°C to +85°C  
(3)  
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under  
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits  
and associated test conditions, see the Electrical Characteristics tables.  
(2) All voltages are with respect to the potential at the GND pins.  
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may  
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP  
=
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the  
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).  
Thermal Properties  
Junction-to-Ambient Thermal Resistance (θJA), RTW Package  
(1)  
35 - 50°C/W  
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power  
dissipation exists, special care must be paid to thermal dissipation issues in board design.  
Copyright © 2009–2013, Texas Instruments Incorporated  
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SNVS604D AUGUST 2009REVISED MARCH 2013  
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(1)(2)  
Electrical Characteristics  
Limits in standard typeface are for TA = 25°C. Limits in boldface type apply over the full operating ambient temperature range  
(40°C < TA < +85°C). Unless otherwise specified: VIN = 12.0V, VDDIO = 2.8V, CVLDO = 470 nF, L1 = 15 μH, CIN = 10 μF, COUT  
(3)  
= 4.7 μF.  
Symbol  
Parameter  
Condition  
Internal LDO disabled  
Min  
Typ  
Max  
1
Units  
Standby supply current  
μA  
EN=L and PWM=L  
IIN  
Normal mode supply current  
LDO enabled, boost enabled, no current  
going through LED outputs  
3.5  
mA  
fOSC  
Internal Oscillator Frequency  
Accuracy  
-4  
-7  
4
7
%
VLDO  
ILDO  
Internal LDO Voltage  
4.5  
5.0  
5.5  
V
Internal LDO External Loading  
5.0  
mA  
(1) All voltages are with respect to the potential at the GND pins.  
(2) Min and Max limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely  
norm.  
(3) Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.  
Boost Converter Electrical Characteristics  
Symbol  
RDS-ON  
VMAX  
Parameter  
Condition  
Min  
Typ  
0.12  
38  
Max  
Units  
Switch ON resistance  
ISW = 0.5A  
Boost maximum output voltage  
V
Maximum Continuous Load  
Current  
V
IN 12V, VOUT = 38V  
400  
180  
ILOAD  
fSW  
mA  
VIN = 5.5V, VOUT = 38V  
Switching Frequency  
BOOST_FREQ_SEL = 0  
BOOST_FREQ_SEL = 1  
625  
1250  
kHz  
VBOOST = 38V  
VBOOST < 38V  
VBOOST + 1.6V  
VBOOST + 4V  
VOV  
Over-voltage protection voltage  
V
tPULSE  
tDELAY  
Switch pulse minimum width  
Startup delay  
no load  
50  
2
ns  
EN_STANDALONE = 1, PWM input  
active, EN is set from low to high  
(1)  
ms  
tSTARTUP Startup time  
8
ms  
A
IMAX_SEL[1:0] = 00  
IMAX_SEL[1:0] = 01  
IMAX_SEL[1:0] = 10  
IMAX_SEL[1:0] = 11  
0.9  
1.4  
2.0  
2.5  
IMAX  
SW pin current limit  
(1) Start-up time is measured from the moment boost is activated until the VOUT crosses 90% of its target value.  
LED Driver Electrical Characteristics  
Symbol  
ILEAKAGE Leakage current  
IMAX Maximum Source Current  
IOUT  
Parameter  
Condition  
Min  
-1  
Typ  
Max  
1
Units  
µA  
Outputs OUT1 to OUT7 (Voltage on pins  
40V)  
Outputs OUT1 to OUT7  
60  
mA  
%
Output current accuracy  
-3  
-4  
3
4
Output current set to 20 mA  
(1)  
(1)  
IMATCH  
IMATCH  
Matching OUT1-7  
Output current set to 20 mA  
Output current set to 20 mA  
fPWM_OUT 4883 Hz  
0.8  
0.5  
10  
9
1.5  
%
%
(1)  
Matching OUT1-6  
1.35  
PWMRES PWM output resolution  
fPWM_OUT = 9766Hz  
bit  
fPWM_OUT = 19531Hz  
8
(1) Output Current Accuracy is the difference between the actual value of the output current and programmed value of this current.  
Matching is the maximum difference from the average. For the constant current sinks on the part (OUT1 to OUT7), the following are  
determined: the maximum output current (MAX), the minimum output current (MIN), and the average output current of all outputs (AVG).  
Two matching numbers are calculated: (MAX-AVG)/AVG and (AVG-MIN/AVG). The largest number of the two (worst case) is  
considered the matching figure. The typical specification provided is the most likely norm of the matching figure for all parts. Note that  
some manufacturers have different definitions in use.  
6
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LP8543  
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SNVS604D AUGUST 2009REVISED MARCH 2013  
LED Driver Electrical Characteristics (continued)  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
PWM_FREQ[2:0] = 000b  
PSPWM_FREQ[1:0] = 00b,  
PWM_MODE = 0  
-4%  
-7%  
4%  
7%  
Min LED Switching Frequency  
229  
fLED  
Hz  
PWM_FREQ[2:0] = 111b,  
PSPWM_FREQ[1:0] = 11b,  
PWM_MODE = 0  
-4%  
-7%  
4%  
7%  
Max LED Switching Frequency  
19531  
270  
330  
Output current set to 20 mA  
Output current set to 60 mA  
200  
300  
(2)  
VSAT  
Saturation voltage  
mV  
400  
540  
(2) Saturation voltage is defined as the voltage when the LED current has dropped 10% from the value measured at 2V.  
Ambient Light Sensor Interface Characteristics  
Symbol  
Parameter  
ALS Frequency Range  
ALS Duty Cycle  
Condition  
Min  
0.2  
40  
Typ  
Max  
2000  
60  
Units  
kHz  
%
fALS  
tCONV  
Conversion Time  
500  
ms  
PWM Interface Characteristics  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
fPWM  
PWM Frequency Range  
0.1  
25  
kHz  
PWM input low time for turn off, stand-alone  
mode, slope disabled  
50  
tSTBY  
Turn Off Delay  
ms  
ns  
tPULSE  
PWM Input Pulse Width  
200  
fPWM_IN < 4.5 kHz  
fPWM_IN = 20 kHz  
10  
8
PWMRES PWM input resolution  
bit  
Under-Voltage Protection  
Symbol  
Parameter  
Condition  
UVLO_THR = 1, falling  
UVLO_THR = 1, rising  
UVLO_THR = 0, falling  
UVLO_THR = 0, rising  
Min  
2.55  
2.62  
5.11  
5.38  
Typ  
2.70  
2.76  
5.40  
5.70  
Max  
2.94  
3.00  
5.68  
5.98  
Units  
VUVLO  
UVLO Threshold Voltage  
V
Logic Interface Characteristics  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
0.4  
Units  
Logic Input PWM  
VIL  
VIH  
II  
Input Low Level  
Input High Level  
Input Current  
V
V
2.2  
-1.0  
1.0  
µA  
Logic Input EN  
VIL  
VIH  
II  
Input Low Level  
0.4  
V
V
Input High Level  
Input Current  
1.2  
-1.0  
1.0  
µA  
Logic Input SCLK, SDA, ADR, ALSI, IF_SEL  
VIL  
VIH  
II  
Input Low Level  
Input High Level  
Input Current  
0.2xVDDIO  
1.0  
V
V
0.8xVDDIO  
-1.0  
µA  
Logic Outputs SDA, FAULT  
VOL Output Low Level  
IOUT = 3 mA (pull-up current)  
0.3  
0.5  
V
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Logic Interface Characteristics (continued)  
Symbol  
Parameter  
Condition  
Min  
-1.0  
Typ  
Max  
1.0  
Units  
IL  
Output Leakage Current  
VOUT = 2.8V  
µA  
Logic Output ALSO  
VOL  
VOH  
IL  
Output Low Level  
IOUT = 3 mA (pull-up current)  
IOUT = –3 mA (pull-up current)  
VOUT = 2.8V  
0.3  
0.5  
1.0  
V
V
Output High Level  
VLDO - 0.5V VLDO - 0.3V  
Output Leakage Current  
-1.0  
µA  
(1)  
I2C Serial Bus Timing Parameters (SDA, SCLK)  
Limit  
Max  
400  
Symbol  
Parameter  
Units  
Min  
fSCLK  
1
Clock Frequency  
kHz  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
µs  
Hold Time (repeated) START Condition  
Clock Low Time  
0.6  
1.3  
600  
600  
50  
2
3
Clock High Time  
4
Setup Time for a Repeated START Condition  
Data Hold Time  
5
6
Data Setup Time  
100  
7
Rise Time of SDA and SCL  
Fall Time of SDA and SCL  
Set-up Time for STOP condition  
20+0.1Cb  
15+0.1Cb  
600  
300  
300  
8
9
10  
Bus Free Time between a STOP and a START  
Condition  
1.3  
Capacitive Load for Each Bus Line  
Load of 1 pF corresponds to 1 ns.  
Cb  
10  
200  
ns  
(1) ensured by design. VDDIO = 1.65V to 5.5V.  
(1)(2)  
SMBus Timing Parameters (SDA, SCLK)  
Limit  
Units  
Symbol  
Parameter  
Min  
10  
Max  
fSCLK  
Clock Frequency  
100  
kHz  
µs  
µs  
µs  
µs  
ns  
ns  
ns  
ns  
µs  
1
2
3
4
5
6
7
8
9
Hold Time (repeated) START Condition  
Clock Low Time  
4.0  
4.7  
4.0  
4.7  
300  
250  
Clock High Time  
50  
Setup Time for a Repeated START Condition  
Data Hold Time  
Data Setup Time  
Rise Time of SDA and SCL  
Fall Time of SDA and SCL  
Set-up Time for STOP condition  
1000  
300  
4.0  
(1) ensured by design. VDDIO = 1.65V to 5.5V.  
(2) The switching characteristics of the LP8543 fully meets or exceeds the published System Management Bus (SMBus) Specification  
Version 2.0.  
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SMBus Timing Parameters (SDA, SCLK) (1)(2) (continued)  
10  
Bus Free Time between a STOP and a START  
Condition  
4.7  
10  
µs  
Capacitive Load for Each Bus Line  
Load of 1 pF corresponds to 1 ns.  
Cb  
200  
ns  
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Typical Performance Characteristics  
Unless otherwise specified: VBATT = 12.0V, CVLDO = 470 nF, L1 = 15 μH, CIN = 10 μF, COUT = 4.7 μF  
LED Drive Efficiency, fLED = 19.5 kHz, PSPWM enabled  
Boost Converter Efficiency  
Figure 3.  
Figure 4.  
Boost Maximum Output Current at VBOOST = 38V  
Battery Current  
Figure 5.  
Figure 6.  
Boost Converter Typical Waveforms  
VBOOST = 38V, IOUT = 50 mA  
Boost Line Transient Response  
Figure 7.  
Figure 8.  
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Typical Performance Characteristics (continued)  
Unless otherwise specified: VBATT = 12.0V, CVLDO = 470 nF, L1 = 15 μH, CIN = 10 μF, COUT = 4.7 μF  
Typical Waveforms in PSPWM Mode, fLED = 4.2 kHz  
Typical Waveforms in Normal PWM Mode, fLED = 4.2 kHz  
Figure 9.  
Figure 10.  
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FUNCTIONAL OVERVIEW  
The LP8543 is a high-voltage LED driver for medium-sized LCD backlight applications. It includes 38V boost  
converter, 7 current sink outputs for the backlight and an interface for digital Ambient Light Sensor (ALS).  
LP8543 can be controlled through SMBus or I2C serial interface or PWM input. Light-to-frequency type ambient  
light sensor can be directly connected to LP8543 and the sensor response vs. LED brightness curve can be  
programmed in the on-chip EEPROM memory.  
LP8543 differs from conventional LED drivers due to following advanced features.  
1. PHASE SHIFT PWM FEATURE  
LP8543 supports a state-of-the-art feature called Phase Shift PWM (PSPWM). Key advantages of the  
PSPWM is improved power efficiency when there is variation in the forward voltages amongst the LED  
strings. Due to an unmatched LED VF there is a random difference in each string forward voltage.  
PSPWM optimizes the boost converter output voltage by turning off LED outputs periodically. The lower  
the brightness, the more strings can be simultaneously off. When the strings with higher forward voltages  
are turned off, the boost voltage is automatically lowered thereby improving efficiency. The second benefit  
of PSPWM control is that it will make the boost and battery loading more constant. In other words, the  
peak current needed from the battery is greatly reduced beause not all LED outputs are simultaneously  
on.  
2. PROGRAMMABLE OUTPUT STRINGS  
Programmability helps display manufacturers to fit LP8543 to several sizes of displays. The number of  
output strings in use is a parameter in EEPROM and can be fixed during the manufacturing process of  
displays. Based on the configuration the device will automatically adjust the phase Shift PWM function for  
a given number of output strings. LP8543 supports of minimum of 4 strings and a maximum of 7 strings.  
In this datasheet , strings 1 through 6 are classified as Display1, and string 7 is classified as Display2.  
3. INDIVIDUALLY CONTROLLED LED STRING FOR BACKSIDE DISPLAY BACKLIGHT  
OUT7 string can be either used for main backlight or for possible back side sub display. Separate control  
allows dimming through I2C interface and reduces extra components or ICs in display module.  
4. LED FAULT DETECTION  
LED fault detection enables higher yield in display manufacturing process and also makes possible to  
monitor backlight faults during normal operation. Fault test detects both open circuit (string with  
unconnected or open circuit LED) and short circuit of 2 or more shorted LEDs. Single LED short can also  
be detected if the amount of LEDs per string and/or the VF variation are sufficiently low. Threshold levels  
are EEPROM programmable. Fault information is available in the status register and in the open drain  
active low FAULT output.  
5. LED PWM TEMPERATURE REGULATION  
This feature will decrease the effect of high temperature LED lifetime reduction. LP8543 reduces output  
PWM of the LEDs at high temperatures and prevents overheating of the device and LEDs. Temperature  
threshold can be programmed to EEPROM.  
6. AMBIENT LIGHT SENSOR INTERFACE WITH USER PROGRAMMABLE CONTROL CURVE  
Ambient light sensing reduces power consumption and it allows natural backlight in any ambient light  
condition. Programmability allows display manufacturer and even end user to control sensor to backlight  
control loop. By integrating this feature LP8543 reduces external component count, wiring and complexity  
of the design. LP8543 supports digital light-to-frequency type sensors. Prescaler and compensation curve  
can be programmed in to the EEPROM.  
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Brightness Control Methods  
1. CURRENT CONTROL  
The 8-bit LED current default value is read from EEPROM when the chip is activated. Current value can  
be used for fine tuning the backlight brightness between panels. This current setting can be overridden by  
a register write from the serial interface. Current control range is from 0 to 60 mA with 0.23 mA step. This  
fine grained current control gives backlight manufacturer possibility to adapt different LED bins in one  
product and maintain the full PWM control range. There are separate controls for both Display1 and  
Display2.  
2. INTERNAL PWM CONTROL  
The basic brightness control is register based 8-bit PWM control. There is a piecewise linear transfer  
curve from register value to LED PWM value and the curve coefficients are stored in the EEPROM. This  
makes possible to calibrate the 100% brightness and the dimming behavior. LED PWM frequency is  
selectable from 229 Hz to 19.5 kHz. In addition PSPWM can be used.  
3. EXTERNAL PWM CONTROL  
An external PWM signal can be used to set the brightness of the display. LP8543 measures the duty  
cycle of this input signal to calculate the output PWM value. Input PWM frequency can vary from 100 Hz  
to 25 kHz. Based on the configuration selected, this external PWM control can linearly reduce the  
brightness from the value set by the Brightness Register. This external PWM control can also be used as  
the only control for LP8543. In this case, when PWM input is permanently low, the chip is turned off.  
When there is signal in PWM input, the chip turns on and adjusts brightness according to PWM signal  
duty cycle. In addition, PSPWM can also be used in this mode.  
4. AMBIENT LIGHT SENSING  
External ambient light sensor can be used for controlling the brightness of the LEDs. Light-to- Frequency  
type light sensor can be connected to ALSI input in LP8543 for ambient light compensation. Transfer  
curve coefficients for response setting are stored in EEPROM. LP8543 has an enable output, ALSO to  
activate the light sensor (active high/low, programmed to EEPROM). Light sensor supply voltage can be  
taken from the 5V regulator in LP8543. Ambient light control is possible for Display1 (4-7 outputs).  
Calibration  
LP8543 has an internal EEPROM to store different control parameters which allows calibrating the backlight  
brightness at various brightness settings so that every display has exactly the same brightness and several  
LP8543 circuits can be used in the same display if needed.  
Programming the EEPROM is easy. User needs to write the data in the shadow RAM memory and give the  
EEPROM write command. On-chip boost converter produces the needed erase and program voltages, no  
external voltages other than normal input voltage are required.  
Calibration in backlight or display production can be done according to the flowchart below  
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Write default values in RAM  
Turn the backlight on and check LED  
faults (read STATUS register)  
Measure display brightness  
Calculate new brightness constants  
and write to RAM  
Measure display brightness  
NO  
Brightness ok  
YES  
Erase EEPROM and write RAM  
content to EEPROM  
Energy Efficiency  
The voltage across the LED drivers is constantly monitored and boost voltage is adjusted to minimum sufficient  
voltage when adaptive boost mode is selected. Inductive boost converter maintains good efficiency over wide  
input and output operating voltage ranges. The boost output has over voltage protection limiting the maximum  
output to 38V. The boost is internally compensated and the output voltage can be either controlled with 5-bit  
register value or automatically adjusted based on the LED driver voltages.  
LP8543 has an internal 5V LDO with low current consumption. The 5V LDO can supply 5 mA current for external  
devices like ALS (Ambient Light Sensor). LDO is switched off in standby mode. The internal LDO is used for  
powering internal blocks as well; therefore the 470 nF CVLDO capacitor must be used even if external load is not  
used.  
Serial Communication  
LP8543 supports two serial protocols: SMBus and I2C. IF_SEL input is used to determine the selection. SMBus  
interface is selected when IF_SEL is high and I2C is selected when IF_SEL is low.  
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Block Diagram  
V
IN  
5.5 œ 22V  
V
IN  
V
SW  
FB  
LDO  
LDO  
OSC  
TSD  
TEMP  
SENSOR  
BOOST  
GND_SW  
LP8543  
ALSO  
ALSI  
OUT1  
OUT2  
OUT3  
OUT4  
ALS  
INTERFACE  
ALS  
V
DDIO  
LED  
DRIVER  
PWM  
PWM  
DETECTOR  
OUT5  
OUT6  
OUT7  
IF_SEL  
LOGIC  
I2C/  
SMBUS  
SCLK  
SDA  
ADR  
MCU  
INTERFACE  
GND_LED  
FAULT  
EN  
EEPROM  
GND  
LED Driver Control  
Basic Operation  
Principle of the LED driver control is shown in the following figure:  
PWM  
Duty Cycle  
Input Pin  
Measurement  
Ambient Light  
Compensation Curve  
2
Ambient  
Light  
Ambient  
Light  
SMBus/I C  
Sensor  
Interface  
Constant Current  
LED Drivers  
Current  
Value  
PWM  
Compensation Curve  
2
SMBus/I C  
Phase Shift  
PWM  
Brightness  
Value  
X
Temperature  
Limitation  
Internal  
Temperature  
Sensor  
threshold  
Figure 11. Principle of the LED Control Methods  
LP8543 is designed to be flexible to support backlighting needs for the main display as well as lighting needs of  
a sub display (also for e.g. keyboard lighting or status LED) when required. In addition, a variety of PWM options  
are supported to drive the backlight LED strings. Various configurations that are supported using a set of  
programmable internal registers and EEPROM are described below. Both the register map and the EEPROM  
memory map are listed at the end of this datasheet.  
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Output Grouping  
LP8543 features a total of 7 strings (OUT1-OUT7), which can be arranged into 2 groups (Display1 and Display2).  
Display1 refers to backlighting for main display and Display2 refers to lighting for a sub display. Number of  
outputs used for Display1 can be defined using EEPROM register bits, as shown in the table below. LP8543  
supports a minimum of 4 strings and a maximum of 7 strings for Display1. Outputs must be used in order starting  
from OUT1. Unused outputs can be left open. When needed OUT7 can be configured for Display2 and it has its  
own current and PWM control registers for independent control. EEPROM default factory setting is 6 outputs for  
Display1 and OUT7 for Display2.  
Table 1. Output Configurations  
OUTPUT_CONF[1:0]  
Outputs for Display1  
OUT1-OUT4  
Outputs for Display2  
00  
01  
10  
11  
OUT7  
OUT7  
OUT7  
-
OUT1-OUT5  
OUT1-OUT6  
OUT1-OUT7  
LED Current Control  
Two 8-bit EEPROM registers, Display1 current and Display2 current (addresses B0H and B1H) hold the  
default LED string current for the Display1 and Display2 groups respectively. The default values are read from  
EEPROM when the chip is activated. When required the LED current can be adjusted also in the registers  
Display1 and Display2 current (addresses 05H and 06H). Use of this register is enabled by setting bit 1 in  
Config2 register. Default value for <CURRENT SEL> bit is 0, which means that current values in EEPROM are  
used. Current control range is linear from 0 to 60 A with 0.23 mA step. Factory default current for Display1 and  
Display2 is 20 mA.  
LED On/Off Control  
LED strings can be activated with 100% PWM by writing <DRV[7:0]> bits high. All these controls are in Direct  
control register.  
PWM Control Selection  
PWM control of the LED strings can be established through 4 combinations of user configurable options as  
shown in the table below. <PM_MD> and <PWM_SEL> bits are part of Config1 Register.  
Default setting is external PWM input signal. Each of the option is explained in the following sections.  
Table 2. PWM Control Selection  
PWM_MD  
PWM_SEL  
PWM source  
PWM input (Direct control)  
1
0
1
0
1
1
0
0
PWM input pin (Duty cycle based), default  
Brightness register  
PWM input pin (Duty cycle based) and Brightness register  
In addition Ambient light sensor (when used) and on-chip temperature regulation also influence the output PWM  
control. This is described later.  
A. Direct PWM Input Control  
Display1 group can be directly controlled with external PWM signal (bypassing all the PWM logic) by setting  
<PWM_MD> and <PWM_SEL> bits high. Outputs will be active when the PWM input pin is high, and when the  
input is low the outputs will be off. Input PWM frequency can vary from 100 Hz to 25 kHz. Display2 is not  
controlled with this signal.  
Note: In this mode, Ambient Light sensor and PSPWM scheme do not influence the output PWM.  
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B. PWM Input Pin Control (Duty Cycle-based)  
An external PWM signal can be used to set the brightness of the Display1 group. LP8543 measures the duty  
cycle of this input signal to calculate the output PWM value. Input PWM frequency can vary from 100 Hz to 25  
kHz. Output PWM frequency is set by EEPROM registers.  
Note: In this mode, Ambient Light compensation and PSPWM scheme can be also used.  
C. PWM Control Using Brightness Register  
Generation of PWM for LED strings can be based on Brightness register value. For Display1 group, this scheme  
is enabled when <PWM_SEL> bit is set to 0 and <PWM_MD> is set to 1. Display2 group has the brightness  
register control enabled by default. Two separate 8-bit registers Displ1 brightness and Displ2 brightness store  
the brightness values for Display1 and Display2 respectively. For Display1, this 8-bit brightness value from the  
register is converted to 10-bit LED PWM value using a three-part piecewise linear transfer curve as shown  
below. This makes it possible to calibrate the 100% brightness and the dimming behavior. The curve coefficients  
are stored in the EEPROM and are user programmable if needed. The LED PWM frequency is set by EEPROM  
register.  
Note: In this mode, Ambient Light compensation and PSPWM scheme can be also used.  
Figure 12. Three-Segment Transfer Curve Example  
D. PWM Pin and Register Control  
In this mode, PWM control pin can linearly reduce the brightness of Display1 from the value set by the  
Brightness Register and Ambient Light sensor. Same controls can be used as in brightness register based PWM  
control. Output PWM frequency is set by EEPROM registers. This mode is compatible with Intel DPST (Display  
Power Saving Technology).  
Stand Alone Mode  
LP8543 can be set to operate in stand alone mode, where LP8543 operates without I2C / SMBus and EN and  
PWM input pins are the only controls for the device. To enable stand-alone mode, EEPROM bit  
<EN_STANDALONE> must be set to 1 in register B4h. In this mode PWM pin sets the brightness and with EN  
pin the backlight can be turned on. When PWM or EN input pin is permanently low, the chip is turned off. Turn off  
time is typically 50 ms. When there is signal in PWM input and EN is high, the chip turns on and adjusts  
brightness according to PWM signal duty cycle. All settings needed for operation like LED current, number of  
LEDs etc. are obtained from EEPROM. If only one signal control is needed, the EN and PWM pin can be tied  
together and PWM signal can be connected to this. Stand alone mode is useful in applications where I2C or  
SMBus control is not possible or available to use.  
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Ambient Light Compensation  
LP8543 supports an external ambient light sensor to control the backlight brightness (Display1) and its usage is  
controlled with two bits in the Config2 register, namely <ALSO_EN> and <ALSO_CALC_EN>. <ALSO_EN> bit  
controls enabling/disabling of the sensor itself, and <ALSO_CALC_EN> bit determines whether the ALS  
measurement data will be used by an external processor (Host) or by LP8543’s internal control logic to control  
the brightness.  
If <ALSO_EN> bit is 1 the ALSO output pin is set high and the input frequency measuring is enabled. Frequency  
is measured for 500 ms, and the result is divided with 10-bit prescaler (defined in EEPROM), resulting in a 10-bit  
value. This 10-bit result can be read from ALS MSB and ALS LSB registers. ALS MSB register must be read  
first followed by ALS LSB register. If ALS_CALC_EN bit is set to 0, then the measurement data is not used by  
LP8543’s internal PWM logic but left for the host to adjust the brightness.  
On the other hand if the ALS_CALC_EN bit is set to 1, ALS measurement result will control backlight brightness  
in all but direct external PWM control mode. The measured ALS value is converted to PWM value using a three  
segment linear curve. The calculated PWM value is used as a multiplier for the LED PWM value obtained from  
brightness register, PWM input pin or combination of both depending which mode is selected. The conversion  
curve parameters are stored in EEPROM memory. Conversion curve is similar as in PWM control.  
Smoothing filter is used to prevent rapid changes. Smoothing filter has EEPROM programmable slopes from 0 to  
2s. The slope defines the time it takes to change brightness from one value to next. Slope control can be also  
used to smooth changes to backlight brightness caused by other PWM controls (brightness register or external  
PWM input).  
Table 3. Slope Selections  
SLOPE_SEL[1:0]  
Slope  
130 ms  
0.5s  
00  
01  
10  
11  
1.0s  
2s  
ALSO output can be used as GPO if not used for ALS control. ALSO pin state is then controlled with  
<ALSO_EN> register bit.  
Phase Shift PWM (PSPWM)  
PSPWM improves the system efficiency by optimizing the boost converter voltage on a cycle by cycle basis  
instead of maintaining a constant voltage based on the highest VF string. PSPWM scheme can be used for  
Display1 group. Phase shift PWM control principle is illustrated in the picture below using an example of 6 string  
implementation and 41.7% brightness setting. In a 6-string implementation, each of the string supports a  
maximum of 16.67% (1/6) of the total backlight brightness. The brightness set value in this example is 41.7%.  
Hence two strings are fully on (2 x 16.67% = 33.33%) and one string is 50% on (0.5 x 16.67% = 8.34%). This  
pattern of two 100% and one 50% strings is then cycled through all 6 output strings. After 6 cycles the brightness  
value is changed to 83.33%, resulting in 5 LEDs fully on (5 x 16.67%).  
LED string  
LED string  
LED string  
LED string  
LED string  
LED string  
1
2
3
4
5
6
Time  
New PWM  
value  
Figure 13. Principle of the PSPWM Operation  
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Phase shift frequency can either be the same as the PWM frequency or a lower frequency can be selected with  
<PHASE_SHIFT_FREQ[1:0]> EEPROM bits. At highest 19.5 kHz PSPWM frequency, the boost will use a  
constant voltage based on the highest VF string because of timing constraints of the high PWM frequency.  
PSPWM is enabled by default, but it can be disabled by setting <DISABLE_PS> EEPROM bit to 1.  
Two PSPWM modes are available. PSPWM mode is selected with <PWM_MODE> EEPROM bit. Difference  
between modes is in the PWM frequencies available. PWM and PSPWM frequency settings are shown in  
Table 4.  
Number of strings simultaneously on in PSPWM mode with different PWM values and different output  
configurations is shown in the following diagram.  
100  
7
6
5
4
3
2
6
5
4
3
2
5
4
3
2
4
3
2
75  
50  
25  
0
1
1
1
1
1-4  
1-5  
1-6  
1-7  
DISPLAY1 CONFIG  
Figure 14. Number of Simultaneously Active Strings  
Table 4. PSPWM Frequency Selection in EEPROM Registers (N = number of strings used)  
PWM_MODE = 0  
PWM_MODE = 1  
PWM_FREQ[2:0] +  
PSPWM_FREQ[1:0]  
PWM Frequency  
(Hz)  
Shift Frequency  
(Hz)  
Output Frequency  
(Hz)  
Output Frequency  
Shift Frequency  
(Hz)  
(Hz)  
00000  
00001  
00010  
00011  
00100  
00101  
00110  
00111  
01000  
01001  
01010  
01011  
01100  
01101  
01110  
01111  
10000  
10001  
10010  
10011  
992  
992  
992  
496  
992/N  
496/N  
248/N  
124/N  
1526/N  
763/N  
382/N  
191/N  
1983/N  
993/N  
496/N  
248/N  
2441/N  
1221/N  
610/N  
305/N  
2974/N  
1487/N  
744/N  
372/N  
229  
229 x N  
305 x N  
381 x N  
458 x N  
534 x N  
610 x N  
687 x N  
763 x N  
839 x N  
916 x N  
992 x N  
1068 x N  
1144 x N  
1221 x N  
1297 x N  
1373 x N  
1450 x N  
1526 x N  
1602 x N  
1678 x N  
305  
992  
248  
381  
992  
124  
458  
1526  
1526  
1526  
1526  
1983  
1983  
1983  
1983  
2441  
2441  
2441  
2441  
2974  
2974  
2974  
2974  
1526  
763  
534  
610  
382  
687  
191  
763  
1983  
993  
839  
916  
496  
992  
248  
1068  
1144  
1221  
1297  
1373  
1450  
1526  
1602  
1678  
2441  
1221  
610  
305  
2974  
1487  
744  
372  
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Table 4. PSPWM Frequency Selection in EEPROM Registers (N = number of strings used) (continued)  
PWM_MODE = 0  
PWM_MODE = 1  
PWM_FREQ[2:0] +  
PSPWM_FREQ[1:0]  
PWM Frequency  
(Hz)  
Shift Frequency  
(Hz)  
Output Frequency  
(Hz)  
Output Frequency  
Shift Frequency  
(Hz)  
(Hz)  
1755  
1831  
1908  
1983  
2060  
2671  
3203  
3737  
4270  
4808  
9766  
19531  
10100  
10101  
10110  
10111  
11000  
11001  
11010  
11011  
11100  
11101  
11110  
11111  
3965  
3965  
3965  
3965  
4883  
4883  
4883  
4883  
19531  
19531  
19531  
19531  
3965  
1983  
991  
3965/N  
1983/N  
991/N  
1755 x N  
1831 x N  
1908 x N  
1983 x N  
2060 x N  
2671 x N  
3203 x N  
3737 x N  
4270 x N  
4808 x N  
9766 x N  
19531 x N  
496  
496/N  
4883  
2441  
1221  
610  
4883/N  
2441/N  
1221/N  
610/N  
19531  
9766  
4883  
2441  
19531/N  
9766/N  
4883/N  
2441/N  
Table 5. PWM Frequencies with Phase Shift Disabled  
PWM_MODE = 0  
PWM_MODE = 1  
PWM_FREQ[2:0] +  
PWM Frequency (Hz)  
Output Frequency (Hz)  
PSPWM_FREQ[1:0]  
00000  
00001  
00010  
00011  
00100  
00101  
00110  
00111  
01000  
01001  
01010  
01011  
01100  
01101  
01110  
01111  
10000  
10001  
10010  
10011  
10100  
10101  
10110  
10111  
11000  
11001  
11010  
11011  
11100  
992  
992  
229  
305  
992  
381  
992  
458  
1526  
1526  
1526  
1526  
1983  
1983  
1983  
1983  
2441  
2441  
2441  
2441  
2974  
2974  
2974  
2974  
3965  
3965  
3965  
3965  
4883  
4883  
4883  
4883  
19531  
534  
610  
687  
763  
839  
916  
992  
1068  
1144  
1221  
1297  
1373  
1450  
1526  
1602  
1678  
1755  
1831  
1908  
1983  
2060  
2671  
3203  
3737  
4270  
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Table 5. PWM Frequencies with Phase Shift Disabled (continued)  
PWM_MODE = 0  
PWM_MODE = 1  
PWM_FREQ[2:0] +  
PSPWM_FREQ[1:0]  
PWM Frequency (Hz)  
Output Frequency (Hz)  
11101  
11110  
11111  
19531  
19531  
19531  
4808  
9766  
19531  
Device Thermal Regulation  
LP8543 has an internal temperature sensor which can be used to measure the junction temperature of the  
device and protect the device from overheating. During thermal regulation, LED PWM is reduced by 4% of full  
scale per °C whenever the temperature threshold is reached. I.e., with 100% PWM value the PWM goes to 0%  
25°C above threshold temperature. With lower PWM start value 0% is reached earlier. Temperature regulation is  
enabled automatically when the chip is enabled. 11-bit temperature value can be read from Temp MSB and  
Temp LSB registers, MSB should be read first. Temperature limit can be programmed in EEPROM as shown in  
the following table.  
Table 6. Over Temperature Limit Settings  
TEMP_LIM[1:0]  
Over Temperature Limit (ºC)  
00  
01  
10  
11  
100  
110  
120  
130  
Figure 15. Internal Temperature Sensor Readings  
EEPROM  
EEPROM memory stores various parameters for chip control. The 256 bit EEPROM memory is organized as 32  
x 8 bits. The EEPROM structure consists of a SRAM front end and the Non-volatile memory (NVM). SRAM data  
can be read and written through the serial interface. To erase and write NVM, separate commands need to be  
sent. Erase and Write voltages are generated on-chip, no other voltages than normal input voltage are required.  
A complete EEPROM memory map is shown in the chapter LP8543 EEPROM Memory Map.  
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EEPROM structure is described in the figure below. User has read and write access to SRAM part of the  
EEPROM directly through I2C / SMBus when PWM calculation is not enabled; i.e., <BL_CTL> = 0 and external  
PWM pin = low. To see whether the EEPROM can be accessed user can read <EE_READY> bit. ALS and  
brightness coefficient curves (address A0h – Afh) and empty EEPROM cells (address B4h – BBh) have only  
NVM and SRAM. Other EEPROM cells have also EEPROM registers. For the cells which have also EEPROM  
registers, the changes made to SRAM does not take effect until update command is sent. This is done by setting  
EE_UPDATE and EE_READ bits to 1. After an update, these bits must be set back to 0. For EEPROM bits  
which do not have registers, changes take effect immediately.  
At startup the values in NVM part of the EEPROM is loaded to SRAM and to EEPROM registers. User can also  
load values from NVM to SRAM and EEPROM registers by writing EE_READ to 1.  
To write SRAM values to NVM user needs to first erase EEPROM and the program it. This is done by first writing  
EE_ERASE to 1 and then 0. At this point NVM is erased. To burn new values to NVM, user needs to write  
EE_PROG to 1 and then 0. The LP8543 generates the needed erase and write voltage from boost output  
voltage.  
EEPROM  
EE_PROG = 1  
NVM Interface  
Controls  
Calculation  
Unit  
Non Volatile  
Memory  
(NVM)  
Startup or  
EE_UPDATE=1  
+ EE_READ=1  
SRAM  
EEPROM  
registers  
Startup or  
EE_UPDATE=0 + EE_READ=1  
User  
Device  
Control  
EPROM for  
production  
testing/trimming  
REGISTERS  
Device Control  
Figure 16. EEPROM Memory Control and Usage Principle  
Boost Converter  
Operation  
The LP8543 boost DC/DC converter generates a 10…38V supply voltage for the LEDs from 5.5…22V input  
voltage. The output voltage is controlled with a 5-bit register in 1V steps. The converter is a magnetic switching  
PWM mode DC/DC converter with a current limit. The topology of the magnetic boost converter is called CPM  
(current programmed mode) control, where the inductor current is measured and controlled with the feedback.  
Switching frequency is selectable between 625 kHz and 1.25 MHz with EEPROM bit <BOOST_FREQ>. Boost is  
enabled with <EN_BOOST> bit.  
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User can program the output voltage of the boost converter or use adaptive mode where boost output voltage is  
adjusted automatically based on LED driver saturation. In adaptive mode the boost output voltage control steps  
are 0.25V. Enabling the adaptive mode is done with <BOOST_AUTO> bit in Boost Control register. If boost is  
started with adaptive mode enabled (default) then the initial voltage value is defined with EEPROM bits at  
address 29H in order to eliminate long iteration time when the chip is started. If adaptive mode is enabled after  
boost startup, then the boost will use register 07H values as initial voltage value. The output voltage control  
changes the resistor divider in the feedback loop. The following figure shows the boost topology with the  
protection circuitry.  
FB  
SW  
Startup  
Light  
Load  
OVP  
VREF  
+
gm  
-
+
R
S
R
R
R
-
Boost output  
voltage  
adjustment  
Switch  
Driver  
Osc/  
ramp  
OCP  
+
-
S
Active Load  
Protection  
Four different protection schemes are implemented:  
1. Over-voltage protection limit changes dynamically based on output voltage setting  
Over-voltage protection limit changes dynamically based on output voltage setting.  
Keeps the output below breakdown voltage.  
Prevents boost operation if battery voltage is much higher than desired output.  
2. SW current limiting, limits the maximum inductor current.  
3. Over-current protection enables fault flag and shuts down boost converter in over-current condition.  
4. Duty cycle limiting.  
Manual Output Voltage Control  
User can control the boost output voltage with Boost_output (07H) register when adaptive mode is disabled;  
i.e., <BOOST_AUTO> = 0.  
Table 7. Boost Output Voltage Controls  
VPROG[4:0]  
Voltage (typical)  
Bin  
Dec  
0
Volts  
10  
11  
12  
13  
14  
...  
00000  
00001  
00010  
00011  
00100  
...  
1
2
3
4
...  
27  
28  
11011  
11100  
37  
38  
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Adaptive Boost Control  
Adaptive boost control function adjusts the boost voltage to the minimum sufficient voltage for proper LED driver  
operation. When PSPWM is used the output voltage can be adjusted for every phase shift step separately except  
in 19.5 kHz PSPWM mode due to timing constraints. To enable PSPWM to each phase, the <BOOST_MODE>  
EEPROM bit must be 0. This enables power saving when strings have mismatch in VF voltages. The correct  
voltage for each string is stored and used in predicting when the boost has to start increasing voltage for the next  
step. The boost setup time can be defined with two EEPROM bits. Principle of the boost voltage adjustment with  
PSPWM is illustrated below. If higher PWM value is used then more strings are on at the same time, and voltage  
is adjusted based on highest VF on simultaneously active strings.  
Phase #  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
1
2
3
4
5
1
Boost voltage  
(dotted line)  
String Vf  
Boost  
advance  
adjust  
PSPWM cycle  
Figure 17. Boost Adaptive Voltage Control for 5–String PSPWM  
When adaptive boost mode is selected the voltages across the LED drivers are constantly monitored. There are  
three voltage thresholds used, Low, Mid and High. Low and High thresholds are adjustable with 3 EEPROM bits.  
Low threshold range is from 0.5V to 2.25V and High threshold range is from 3 to 10V. Mid threshold is set 0.5V  
above Low threshold. Threshold levels are listed in the table below. Adjustability is provided to enable adaptation  
to different conditions. If there is a lot of variation between LED string VF, then higher threshold levels must be  
used to avoid false fault indications. If there is low variation between LED string VF, then lower thresholds are  
recommended to maintain good efficiency. Fault detection chapter describes how these thresholds are used also  
for fault detection.  
Table 8. LED Voltage Comparator Thresholds  
EEPROM bits  
Threshold (V)  
LED_FAULT_THR[5:3] (HIGH comparator)  
DRV_HEADR_CTRL[2:0] (LOW comparator)  
Low  
High  
Mid  
000  
001  
010  
011  
100  
101  
110  
111  
0.50  
0.75  
1.00  
1.25  
1.50  
1.75  
2.00  
2.25  
3
4
5
6
Low + 0.5V  
7
8
9
10  
If only one string is on at a time (Brightness value lower than 100% divided by number of strings) the voltage for  
each string is adjusted so that the voltage across the driver will fall between Low and Mid threshold. If more  
strings are on at the same time (high PWM value, or PSPWM not used) the situation looks like in the following  
diagram. In this diagram 6 outputs are on at the same time. In normal operation voltages across all LED driver  
outputs are between high and low threshold.  
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High threshold  
Mid threshold (Low + 0.5V)  
Low threshold  
Figure 18. Normal Operation, High PWM Value  
If one LED driver voltage is below Low, boost voltage will be increased. This is seen in the following figure.  
This causes the boost  
voltage to rise!  
High threshold  
Mid threshold (Low + 0.5V)  
Low threshold  
Figure 19. Boost voltage too Low  
If all driver voltages are above Mid threshold (or any of the voltages in PSPWM adaptation mode and with low  
PWM value), boost voltage will be lowered. Decision is always based on number of strings active at the same  
time. In the illustrations 6 outputs are active, which basically means close to 100% PWM value with PSPWM.  
High threshold  
Mid threshold (Low + 0.5V)  
All voltages are above Mid threshold =>  
boost voltage needs to be adjusted down!  
Low threshold  
Figure 20. Boost voltage too High  
Fault Detection  
LP8543 has fault detection for LED fault, low-battery voltage, overcurrent and thermal shutdown. The open drain  
output pin (FAULT) can be used to indicate occurred fault. The cause for the fault can be read from status  
register. Refreshing the <BL_CTL> bit high will reset the fault register and fault pin state.  
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Led Fault Detection  
There are two methods of detecting the LED fault. First method is based on measuring the voltage on LED driver  
pins (analog fault detection) and another is based on adaptive boost voltage hopping between strings (digital  
fault detection). The used fault detection mode is selected in EEPROM as well as the threshold levels.  
<FAULT_SEL[1:0]> bits selects the used mode as follows:  
Table 9. LED Fault Mode Selection  
FAULT_SEL[1:0]  
Fault mode  
00  
01  
10  
11  
No fault detection  
Analog fault detection based on LED driver voltage  
Digital fault detection based on boost voltage hopping  
Both analog and digital fault detection  
Two fault detection methods are used to detect faults in different conditions. Analog detection works better with  
high PWM values (in PSPWM mode) where many strings are active at a same time. It does not work when only  
one string is active at a time, because it is based on comparing driver voltages on strings active simultaneously.  
Digital fault detection is used to complement this case.  
Digital fault detection works better with low PWM values, where not all strings are on at the same time. Digital  
short detection works only with cases where one string is active at the same time.  
Analog Fault Detection  
When analog fault detection mode is selected, the voltages across the LED drivers are constantly monitored. The  
same threshold levels (Low, Mid and High) are used for fault detection to adjust the boost voltage.  
If one of the LED strings has an open fault (LED driver output pin has no contact to LED string), the output pin  
voltage drops to 0V. When this happens the boost voltage will be adjusted higher to get enough headroom, but  
at some point the voltage for all other strings will rise over the high threshold. In this case the LP8543 detects  
open fault, and adjusts the boost voltage based on other LED strings needs, i.e., the faulty LED string voltage is  
not used anymore for adjusting boost output voltage. If the LED driver output pin is shorted to GND the fault  
detection works exactly the same. This situation with 6 LEDs active at the same time is illustrated in the following  
diagram:  
This causes the  
open fault!  
High threshold  
Mid threshold (Low + 0.5V)  
Low threshold  
Figure 21. Open Fault  
If one or more LEDs are shorted, this causes the voltage to rise in this LED driver output pin above the high  
threshold. This causes short fault detection as seen in the following figure:  
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This causes short fault!  
High threshold  
Mid threshold (Low + 0.5V)  
Low threshold  
Figure 22. Short Fault  
Digital Fault Detection  
With digital fault detection the voltage hopping between LED strings is monitored in PSPWM mode. In normal  
PWM mode or with high PWM values with PSPWM mode this does not apply.  
If there’s open in one of the LED strings, the LED driver output pin will drop to 0V. When this happens the boost  
will try to increase the voltage to get enough headroom for the driver. When the voltage for one string reaches  
maximum voltage (38V) and the difference between consecutive LED strings is higher than set threshold level an  
open LED fault is detected. If all voltages are close to 38V then the threshold condition is not met and no fault is  
detected. If the LED output is shorted to GND it will be detected same way. Open fault detection is seen in the  
following figure:  
Open fault in  
this string  
38V  
>Threshold  
Boost voltage  
PSPWM cycle  
Figure 23. Digital Open Fault Detection  
If there is one or more LEDs shorted in one string, the boost will drop the voltage for this string. When the  
difference between consecutive LED strings is higher than set threshold level a short LED fault is detected. This  
is described in the following figure:  
Shorted LEDs  
in this string  
>Threshold  
Boost voltage  
PSPWM cycle  
Figure 24. Digital Short Fault Detection  
Threshold level is programmed to EEPROM as shown in the following table. Threshold level adjustability is  
provided to allow adaptation to different LED VF used in the application.  
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Table 10. Digital LED Fault Detection Thresholds  
DIG_COMP[1:0]  
Threshold Voltage (V)  
00  
01  
10  
11  
3
5
7
9
When Fault is detected the FAULT pin will be pulled down (open drain output), and corresponding status register  
bit is set. To clear the fault user must read the status register.  
Note: LED fault output signal is generated only once for certain fault type. If, for example, open fault occurs, new  
open fault does not cause the FAULT pin to be pulled down uless chip is reset by setting EN pin low and high  
again. The faults will be seen in the register however. If LED fault is detected, the string which created the fault is  
no longer used for adjusting the boost voltage. Otherwise the LP8543 operates as normally.  
Note: Due to the nature of fault detection it is possible to generate false faults during startup etc. conditions.  
Therefore when fault is detected it is recommended to read the fault/status register twice to make sure that the  
first fault is real. If the second reading gives the same result then the fault is real.  
Under-Voltage Detection  
LP8543 has detection for too low VIN voltage. Threshold level for the voltage is set with EEPROM register bits as  
seen in the following table:  
Table 11. Under-Voltage Detection Thresholds  
UVLO_THR  
Threshold (V)  
0
1
6
3
Under voltage detection is always on. When under voltage is detected the LED outputs and boost will shutdown,  
Fault pin will be pulled down (open drain output) and corresponding fault bit is set in status register. Fault can be  
reset by reading the status register. LEDs and boost will start again when the voltage has increased above the  
threshold level. Hysteresis is implemented to threshold level to avoid continuous triggering of fault when  
threshold is reached.  
Note: Due to the nature of fault detection it is possible to generate false faults during startup etc. conditions.  
Therefore when fault is detected it is recommended to read the fault/status register twice to make sure that the  
first fault is real. If the second reading gives the same result then the fault is real.  
Over-Current Detection  
LP8543 has detection for too high loading on the boost converter. When over current fault is detected the  
LP8543 will shut down and set the fault flag.  
Thermal Shutdown  
If the LP8543 reaches thermal shutdown temperature (150°C) the LED outputs and boost will shut down to  
protect it from damage. Also the fault pin will be pulled down to indicate the fault state. Device will activate again  
when temperature drops below 130°C.  
SMBus/I2C Compatible Serial Bus Interface  
Interface Bus Overview  
The SMBus/I2C-compatible synchronous serial interface provides access to the programmable functions and  
registers on the device. This protocol uses a two-wire interface for bidirectional communications between the IC's  
connected to the bus. The two interface lines are the Serial Data Line (SDA), and the Serial Clock Line (SCL /  
SCLK). These lines should be connected to a positive supply, via a pull-up resistor and remain HIGH even when  
the bus is idle.  
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Every device on the bus is assigned a unique address and acts as either a Master or a Slave depending on  
whether it generates or receives the serial clock (SCLK). LP8543 is always a slave device.  
Data Transactions  
One data bit is transferred during each clock pulse. Data is sampled during the high state of the serial clock  
(SCL). Consequently, throughout the clock’s high period, the data should remain stable. Any changes on the  
SDA line during the high state of the SCLK and in the middle of a transaction, aborts the current transaction.  
New data should be sent during the low SCLK state. This protocol permits a single data line to transfer both  
command/control information and data using the synchronous serial clock.  
SDA  
SCL  
Data Line  
Stable:  
Data Valid  
Change  
of Data  
Allowed  
Figure 25. Bit Transfer  
Each data transaction is composed of a Start Condition, a number of byte transfers (set by the software) and a  
Stop Condition to terminate the transaction. Every byte written to the SDA bus must be 8 bits long and is  
transferred with the most significant bit first. After each byte, an Acknowledge signal must follow. The following  
sections provide further details of this process.  
Transmitter Stays off the  
Bus During the  
Acknowledge Clock  
Acknowledge Signal  
from Receiver  
1
2
3...6  
7
8
9
S
Start  
Condition  
Figure 26. Start and Stop  
The Master device on the bus always generates the Start and Stop Conditions (control codes). After a Start  
Condition is generated, the bus is considered busy and it retains this status until a certain time after a Stop  
Condition is generated. A high-to-low transition of the data line (SDA) while the clock (SCLK) is high indicates a  
Start Condition. A low-to-high transition of the SDA line while the SCLK is high indicates a Stop Condition.  
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SDA  
SCL  
S
P
Start  
Stop  
Condition  
Condition  
Figure 27. Start and Stop Conditions  
In addition to the first Start Condition, a repeated Start Condition can be generated in the middle of a transaction.  
This allows another device to be accessed, or a register read cycle.  
Acknowledge Cycle  
The Acknowledge Cycle consists of two signals: the acknowledge clock pulse the master sends with each byte  
transferred, and the acknowledge signal sent by the receiving device.  
The master generates the acknowledge clock pulse on the ninth clock pulse of the byte transfer. The transmitter  
releases the SDA line (permits it to go high) to allow the receiver to send the acknowledge signal. The receiver  
must pull down the SDA line during the acknowledge clock pulse and ensure that SDA remains low during the  
high period of the clock pulse, thus signaling the correct reception of the last data byte and its readiness to  
receive the next byte.  
“Acknowledge After Every Byte” Rule  
The master generates an acknowledge clock pulse after each byte transfer. The receiver sends an acknowledge  
signal after every byte received.  
There is one exception to the “acknowledge after every byte” rule. When the master is the receiver, it must  
indicate to the transmitter an end of data by not-acknowledging (“negative acknowledge”) the last byte clocked  
out of the slave. This “negative acknowledge” still includes the acknowledge clock pulse (generated by the  
master), but the SDA line is not pulled down.  
Addressing Transfer Formats  
Each device on the bus has a unique slave address. The LP8543 operates as a slave device with the 7-bit  
address combined with data direction bit. Slave address is pin-selectable as follows:  
Table 12. Address Selection  
ADR  
Slave Address Write (8 bits)  
Slave Address Read (8 bits)  
0
1
01011000 (58H)  
01011010 (5AH)  
01011001 (59H)  
01011011 (5BH)  
Before any data is transmitted, the master transmits the address of the slave being addressed. The slave device  
should send an acknowledge signal on the SDA line, once it recognizes its address.  
The slave address is the first seven bits after a Start Condition. The direction of the data transfer (R/W) depends  
on the bit sent after the slave address — the eighth bit.  
When the slave address is sent, each device in the system compares this slave address with its own. If there is a  
match, the device considers itself addressed and sends an acknowledge signal. Depending upon the state of the  
R/W bit (1:read, 0:write), the device acts as a transmitter or a receiver.  
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Figure 28. I2C Chip Address  
MSB  
LSB  
ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0 R/W  
Bit7  
bit6  
bit5  
bit4  
bit3  
bit2  
bit1  
bit0  
2
I C SLAVE address (chip address)  
Control Register Write Cycle  
Master device generates start condition.  
Master device sends slave address (7 bits) and the data direction bit (r/w = 0).  
Slave device sends acknowledge signal if the slave address is correct.  
Master sends control register address (8 bits).  
Slave sends acknowledge signal.  
Master sends data byte to be written to the addressed register.  
Slave sends acknowledge signal.  
If master will send further data bytes the control register address will be incremented by one after  
acknowledge signal.  
Write cycle ends when the master creates stop condition.  
Control Register Read Cycle  
Master device generates a start condition.  
Master device sends slave address (7 bits) and the data direction bit (r/w = 0).  
Slave device sends acknowledge signal if the slave address is correct.  
Master sends control register address (8 bits).  
Slave sends acknowledge signal.  
Master device generates repeated start condition.  
Master sends the slave address (7 bits) and the data direction bit (r/w = 1).  
Slave sends acknowledge signal if the slave address is correct.  
Slave sends data byte from addressed register.  
If the master device sends acknowledge signal, the control register address will be incremented by one. Slave  
device sends data byte from addressed register.  
Read cycle ends when the master does not generate acknowledge signal after data byte and generates stop  
condition.  
Table 13. Data Read and Write Cycles  
Address Mode  
<Start Condition>  
<Slave Address><r/w = 0>[Ack]  
<Register Addr.>[Ack]  
<Repeated Start Condition>  
<Slave Address><r/w = 1>[Ack]  
Data Read  
[Register Data]<Ack or NAck>  
… additional reads from subsequent register address possible  
<Stop Condition>  
<Start Condition>  
<Slave Address><r/w=’0’>[Ack]  
<Register Addr.>[Ack]  
<Register Data>[Ack]  
Data Write  
… additional writes to subsequent register address possible  
<Stop Condition>  
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<>Data from master [ ] Data from slave  
Register Read and Write Detail  
Slave Address  
Control Register Add.  
(8 bits)  
Register Data  
(8 bits)  
S
'0' A  
A
A P  
(7 bits)  
Data transfered, byte +  
Ack  
R/W  
From Slave to Master  
From Master to Slave  
A - ACKNOWLEDGE (SDA Low)  
S - START CONDITION  
P - STOP CONDITION  
Register Write Format  
Slave Address  
(7 bits)  
Slave Address  
(7 bits)  
Data- Data  
(8 bits)  
Control Register Add.  
A/  
NA  
S
'0' A  
A Sr  
'1' A  
P
(8 bits)  
Data transfered, byte +  
Ack/NAck  
R/W  
R/W  
Direction of the transfer  
will change at this point  
From Slave to Master  
From Master to Slave  
A
- ACKNOWLEDGE (SDA Low)  
NA - ACKNOWLEDGE (SDA High)  
- START CONDITION  
Sr - REPEATED START CONDITION  
- STOP CONDITION  
S
P
Register Read Format  
Recommended External Components  
Inductor Selection  
A 15 µH shielded inductor is suggested for LP8543 boost converter. Inductor maximum current can be calculated  
from the equations below.  
IOUTMAX  
ISAT  
>
+ IRIPPLE  
D‘  
VIN  
(VOUT œ VIN)  
x
Where IRIPPLE  
=
VOUT  
(2 x L x f)  
(VOUT œ VIN)  
and D‘ = (1-D)  
Where D =  
(VOUT  
)
IRIPPLE: Average to peak inductor current  
IOUTMAX: Maximum load current  
VIN: Maximum input voltage in application  
L: Min inductor value including worst case tolerances  
f: Minimum switching frequency  
VOUT: Output voltage  
(1)  
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Example using above equations:  
VIN = 12V  
VOUT = 38V  
IOUT = 400 mA  
L = 15 µH 20% = 12 µH  
f = 1.25 MHz  
ISAT = 1.6A  
As a result the inductor should be selected according to the ISAT. A more conservative and recommended  
approach is to choose an inductor that has a saturation current rating greater than the maximum current limit of  
0.9...2.5A (programmed to EEPROM). Maximum current limit needed for the application can be approximated  
with calculations above. A 15 μH inductor with a saturation current rating of 2.5A is recommended for most  
applications. The inductor’s resistance should be less than 300 mfor good efficiency. For high efficiency  
choose an inductor with high frequency core material such as ferrite to reduce core losses. To minimize radiated  
noise, use shielded core inductor. Inductor should be placed as close to the SW pin and the IC as possible.  
Special care should be used when designing the PCB layout to minimize radiated noise and to get good  
performance from the boost converter.  
Output Capacitor  
A ceramic capacitor with 50V voltage rating or higher is recommended for the output capacitor. The DC-bias  
effect can reduce the effective capacitance by up to 80%, which needs to be considered in capacitance value  
selection. For light loads (<100 mA) 4.7 µF capacitor is sufficient. For maximum output voltage/current 10 µF  
capacitor (4 uF effective capacitance @ 38V) is recommended to reduce the output ripple. Small 33 pF capacitor  
is recommended to use in parallel with the output capacitor to suppress high frequency noise.  
LDO Capacitor  
A 470 nF ceramic capacitor with 10V voltage rating is recommended for the LDO capacitor.  
Output Diode  
A schottky diode should be used for the output diode. Peak repetitive current should be greater than inductor  
peak current (0.9...2.5A) to ensure reliable operation. Average current rating should be greater than the  
maximum output current. Schottky diodes with a low forward drop and fast switching speeds are ideal for  
increasing efficiency in portable applications. Choose a reverse breakdown voltage of the Schottky diode  
significantly larger (~60V) than the output voltage. Do not use ordinary rectifier diodes, since slow switching  
speeds and long recovery times cause the efficiency and the load regulation to suffer.  
Ambient Light Sensor  
LP8543 uses light-to-frequency type ambient light sensor. Suitable frequency range for ALS is 200 Hz to 2 MHz.  
Table 14. LP8543 Register Map  
ADDR  
00H  
REGISTER  
Display1 PWM  
Config1  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
DEFAULT  
DISP1_PWM[7:0]  
1111 1111  
01H  
PWM_MD PWM_SEL  
OV_CUR THRM_SH  
BL_CTL 0000 0000  
02H  
Status  
2_CH_SD 1_CH_SD BL_STAT  
FAULT  
0000 0000  
R
DN  
LED_PAN  
EL  
03H  
04H  
05H  
Identification  
MFG[3:0]  
REV[2:0]  
1111 1001  
0000 0000  
0000 0000  
Output Control  
OUT[7:1]  
Display1  
Current  
DISP1_CURRENT[7:0]  
Display2  
Current  
06H  
DISP2_CURRENT[7:0]  
0000 0000  
BOOST_A EN_BOO  
UTO ST  
07H  
08H  
Boost Control  
Display2 PWM  
VPROG[4:0]  
0110 0000  
0000 0000  
DISP2_PWM[7:0]  
Copyright © 2009–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
33  
Product Folder Links: LP8543  
LP8543  
SNVS604D AUGUST 2009REVISED MARCH 2013  
www.ti.com  
DEFAULT  
Table 14. LP8543 Register Map (continued)  
ADDR  
REGISTER  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
CURRENT  
_SEL  
ALS_CALC  
_EN  
09H  
Config2  
ALS_SEL  
ALS_EN 0000 0000  
0AH  
0BH  
ALS MSB  
ALS LSB  
ALS[9:2]  
0000 0000  
0000 0000  
ALS[1:0]  
DISP2_FA DISP1_FA LED_OPE LED_SHO  
0CH  
Fault  
UVLO  
0000 0000  
ULT  
ULT  
N
RT  
0DH  
0EH  
TEMP MSB  
TEMP LSB  
TEMP[10:3]  
0000 0000  
0000 0000  
TEMP[2:0]  
EEPROM_con EE_READ  
EE_UPDAT EE_ERAS  
72H  
NSTBY  
EE_PROG EE_READ 0000 0000  
trol  
Y
E
E
Table 15. LP8543 EEPROM Memory Map  
ADDR  
A0H  
A1H  
A2H  
A3H  
A4H  
A5H  
A6H  
A7H  
A8H  
A9H  
AAH  
ABH  
ACH  
ADH  
AEH  
AFH  
B0H  
B1H  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
DEFAULT  
3DH  
0AH  
FFH  
00H  
ALS A1[7:0]  
ALS B1[7:0]  
ALS THR[7:0]  
ALS A2[7:0]  
ALS B2[7:0]  
FFH  
FFH  
00H  
ALS THR2[7:0]  
ALS A3[7:0]  
ALS B3[7:0]  
FFH  
40H  
PWM A1[7:0]  
PWM B1[7:0]  
00H  
PWM THR1[7:0]  
PWM A2[7:0]  
FFH  
00H  
PWM B2[7:0]  
FFH  
FFH  
00H  
PWM THR2[7:0]  
PWM A3[7:0]  
PWM B3[7:0]  
FFH  
62H  
DISP1_CURRENT[7:0]  
DISP2_CURRENT[7:0]  
62H  
OUTPUT_CONF[1:0  
]
ALSO_POLA BOOST_FRE  
RITY  
B2H  
B3H  
SLOPE_SEL[1:0]  
ALS_EN  
UVLO_THR  
21H  
A4H  
Q
EN_DISP2_ DIS_TEMP_  
EN_SLOPE  
reserved  
TEMP_LIM[1:0]  
FAULT_SEL[1:0]  
MON  
CALC  
EN_STANDALO  
NE  
EN_AUTOL BOOST_MO  
FILTER_TIM  
E
B4H  
B5H  
B6H  
B7H  
B8H  
B9H  
BAH  
BBH  
BCH  
BDH  
BEH  
BFH  
reserved  
reserved  
OAD  
DE  
DISABLE_PS  
45H  
BCH  
00H  
00H  
00H  
00H  
00H  
00H  
90H  
7CH  
7AH  
00H  
PWM_MODE  
BOOST_UP[1:0]  
PWM_FREQ[2:0]  
PSPWM_FREQ[1:0]  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
DIG_COMP[1:0]  
Reserved IMAX_SEL[1:0]  
LED_FAULT_THR[2:0]  
DRV_HEADR_CTRL[2:0]  
VPROG[4:0]  
ALS_PRESCALE[9:2]  
ALS_PRESCALE[1:0]  
Reserved Reserved Reserved  
Reserved  
Reserved  
Reserved  
34  
Submit Documentation Feedback  
Copyright © 2009–2013, Texas Instruments Incorporated  
Product Folder Links: LP8543  
 
LP8543  
www.ti.com  
SNVS604D AUGUST 2009REVISED MARCH 2013  
REVISION HISTORY  
Changes from Revision C (March 2013) to Revision D  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 34  
Copyright © 2009–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
35  
Product Folder Links: LP8543  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
LP8543SQ/NOPB  
LP8543SQE/NOPB  
LP8543SQX/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
WQFN  
WQFN  
WQFN  
RTW  
24  
24  
24  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
L8543SQ  
ACTIVE  
ACTIVE  
RTW  
RTW  
250  
Green (RoHS  
& no Sb/Br)  
-30 to 85  
-30 to 85  
L8543SQ  
L8543SQ  
4500  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LP8543SQ/NOPB  
LP8543SQE/NOPB  
LP8543SQX/NOPB  
WQFN  
WQFN  
WQFN  
RTW  
RTW  
RTW  
24  
24  
24  
1000  
250  
178.0  
178.0  
330.0  
12.4  
12.4  
12.4  
4.3  
4.3  
4.3  
4.3  
4.3  
4.3  
1.3  
1.3  
1.3  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
4500  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LP8543SQ/NOPB  
LP8543SQE/NOPB  
LP8543SQX/NOPB  
WQFN  
WQFN  
WQFN  
RTW  
RTW  
RTW  
24  
24  
24  
1000  
250  
210.0  
210.0  
367.0  
185.0  
185.0  
367.0  
35.0  
35.0  
35.0  
4500  
Pack Materials-Page 2  
MECHANICAL DATA  
RTW0024A  
SQA24A (Rev B)  
www.ti.com  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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