LPV801 [TI]
单路、5.5V、8kHz、超低静态电流 (450nA)、1.6V 最小电源电压、RRO 运算放大器;型号: | LPV801 |
厂家: | TEXAS INSTRUMENTS |
描述: | 单路、5.5V、8kHz、超低静态电流 (450nA)、1.6V 最小电源电压、RRO 运算放大器 放大器 运算放大器 |
文件: | 总28页 (文件大小:1204K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LPV801, LPV802
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
LPV801/LPV802 320nA 毫微功耗运算放大器
1 特性
3 说明
1
•
•
•
•
•
•
•
•
•
•
•
•
毫微功耗电源电流:320nA/通道
LPV801(单通道)和 LPV802(双通道)组成了超低
功耗运算放大器系列,适用于由电池供电的无线和低功
耗有线设备 中的 感测应用。LPV80x 放大器的带宽为
8kHz,静态电流为 320nA,可最大限度降低运行电池
寿命至关重要的设备(如 CO 检测器、烟雾检测器和
PIR 运动检测器)消耗的功率。
偏移电压:3.5mV(最大值)
TcVos:1µV/°C
单位增益带宽:8kHz
宽电源电压范围:1.6V 至 5.5V
低输入偏置电流:0.1pA
单位增益稳定
除超低功耗特性外,LPV80x 放大器还具有实现毫微微
安偏置电流的 CMOS 输入级。LPV80x 放大器还特有
一个负轨感测输入级和一个相对于电源轨的摆幅为毫伏
级的轨到轨输出级,从而尽可能保持最宽的动态范围。
LPV80x 设有电磁干扰 (EMI) 保护,可降低来自手机、
WiFi、无线电发射器和标签阅读器的无用射频信号对系
统造成的影响。
轨到轨输出
无输出反转
EMI 保护
温度范围:–40℃ 至 125℃
行业标准封装:
–
5 引脚小外形尺寸晶体管 (SOT)-23 封装(单通
道版本)
LPV8xx 系列毫微功耗放大器
电源
–
8 引脚超薄小外形尺寸 (VSSOP) 封装(双通道
版本)
电流
(典型值/通
道)
偏移电压
(最大值)
器件编号
通道
2 应用
•
•
•
•
•
•
•
气体检测器(CO 和 O2 传感器)
LPV801
LPV802
LPV811
LPV812
1
2
1
2
500nA
320nA
450nA
405nA
3.5mV
3.5mV
300µV
300µV
PIR 运动检测器
离子化烟雾报警器
温度调节装置
物联网 (IoT) 远程传感器
有效的射频识别 (RFID) 阅读器和标签
便携式医疗设备
器件信息(1)
器件型号
封装
封装尺寸
LPV801
LPV802
SOT-23 (5)
VSSOP (8)
2.90mm x 1.60mm
3.00mm × 3.00mm
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。
电化学传感器中的毫微功耗放大器
PIR 运动检测器中的毫微功耗放大器
CE
RE
WE
+
VREF
LPV802a
+
Output to
Comparator
LPV802a
IR
VREF
+
CF
RF
LPV802b
RLoad
VOUT
+
VREF
LPV802b
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNOSCZ3
LPV801, LPV802
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 12
8
9
Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application: Three Terminal CO Gas Sensor
Amplifier ................................................................... 14
8.3 Do's and Don'ts ...................................................... 17
Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
11 器件和文档支持 ..................................................... 18
11.1 器件支持 ............................................................... 18
11.2 接收文档更新通知 ................................................. 18
11.3 社区资源................................................................ 18
11.4 相关链接................................................................ 18
11.5 商标....................................................................... 18
11.6 静电放电警告......................................................... 18
11.7 Glossary................................................................ 18
12 机械、封装和可订购信息....................................... 18
7
4 修订历史记录
Changes from Original (August 2016) to Revision A
Page
•
已更改 “产品预览”至“量产数据”............................................................................................................................................... 1
2
Copyright © 2016, Texas Instruments Incorporated
LPV801, LPV802
www.ti.com.cn
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
5 Pin Configuration and Functions
LPV802 8-Pin VSSOP
DGK Package
Top View
LPV801 5-Pin SOT-23
DBV Package
Top View
OUT A
-IN A
+IN A
V-
1
2
3
4
8
7
6
5
V+
A
OUT
V-
1
2
3
5
4
V+
OUT B
-IN B
+IN B
B
+IN
-IN
Pin Functions: LPV801 DBV
PIN
I/O
DESCRIPTION
NAME
OUT
-IN
NUMBER
1
4
3
2
5
O
I
Output
Inverting Input
+IN
V-
I
Non-Inverting Input
P
P
Negative (lowest) power supply
Positive (highest) power supply
V+
Pin Functions: LPV802 DGK
PIN
I/O
DESCRIPTION
NAME
OUT A
-IN A
+IN A
V-
NUMBER
1
2
3
4
5
6
7
8
O
I
Channel A Output
Channel A Inverting Input
Channel A Non-Inverting Input
Negative (lowest) power supply
Channel B Non-Inverting Input
Channel B Inverting Input
Channel B Output
I
P
I
+IN B
-IN B
OUT B
V+
I
O
P
Positive (highest) power supply
Copyright © 2016, Texas Instruments Incorporated
3
LPV801, LPV802
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN
–0.3
MAX
6
UNIT
V
Supply voltage, Vs = (V+) - (V-)
(2) (3)
Voltage
Common mode
Differential
(V-) - 0.3
(V-) - 0.3
-10
(V+) + 0.3
(V+) + 0.3
10
V
Input pins
V
Input pins
Current
mA
Output short
current
Continuous Continuous
(4)
Operating temperature
Storage temperature, Tstg
Junction temperature
–40
–65
125
150
150
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Not to exceed -0.3V or +6.0V on ANY pin, referred to V-
(3) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should
be current-limited to 10 mA or less.
(4) Short-circuit to Vs/2, one amplifer per package. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±750 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.6
NOM
MAX
5.5
UNIT
V
Supply voltage (V+ – V–)
Specified temperature
-40
125
°C
6.4 Thermal Information
LPV801
DBV
LPV802
DGK
THERMAL METRIC(1)
UNIT
5 PINS
8 PINS
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
177.4
133.9
36.3
184.2
75.3
θJCtop
θJB
Junction-to-board thermal resistance
105.5
13.5
ºC/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
23.6
ψJB
35.7
103.9
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2016, Texas Instruments Incorporated
LPV801, LPV802
www.ti.com.cn
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
6.5 Electrical Characteristics
TA = 25°C, VS = 1.8V to 5 V, VCM = VOUT = VS/2, and RL≥ 10 MΩ to VS / 2, unless otherwise noted.(1)
PARAMETER
OFFSET VOLTAGE
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VS = 1.8V, 3.3V, and 5V,
VCM = V-
0.55
±3.5
±3.5
VOS
Input offset voltage
mV
VS = 1.8V, 3.3V, and 5V,
VCM = (V+) – 0.9 V
0.55
1
ΔVOS/ΔT Input offset drift
PSRR Power-supply rejection
ratio
INPUT VOLTAGE RANGE
VCM = V-
TA = –40°C to 125°C
µV/°C
µV/V
VS = 1.8V to 5V,
VCM = V-
1.6
60
VCM
Common-mode voltage
range
VS = 5 V
0
4.1
V
Common-mode rejection
ratio
CMRR
(V–) ≤ VCM ≤ (V+) – 0.9 V, VS= 5V
80
98
dB
INPUT BIAS CURRENT
IB
Input bias current
Input offset current
VS = 1.8V
VS = 1.8V
±100
±100
fA
IOS
INPUT IMPEDANCE
Differential
7
3
pF
Common mode
NOISE
En
Input voltage noise
ƒ = 0.1 Hz to 10 Hz
ƒ = 100 Hz
6.5
340
420
µVp-p
en
Input voltage noise
density
nV/√Hz
ƒ = 1 kHz
OPEN-LOOP GAIN
AOL
Open-loop voltage gain
(V–) + 0.3 V ≤ VO ≤ (V+) – 0.3 V, RL = 100 kΩ
VS = 1.8V, RL = 100 kΩ to V+/2
120
3.5
dB
OUTPUT
VOH
Voltage output swing
from positive rail
10
mV
VOL
Voltage output swing
from negative rail
VS = 1.8V, RL = 100 kΩ to V+/2
VS = 3.3V, Short to VS/2
ƒ = 1 KHz, IO = 0 A
2.5
4.7
90
10
ISC
ZO
Short-circuit current
mA
Open loop output
impedance
kΩ
FREQUENCY RESPONSE
GBP
Gain-bandwidth product
CL = 20 pF, RL = 10 MΩ, VS = 5V
8
2
kHz
G = 1, Rising Edge, CL = 20 pF, VS = 5V
G = 1, Falling Edge, CL = 20 pF, VS = 5V
SR
Slew rate (10% to 90%)
V/ms
2.1
POWER SUPPLY
IQ-LPV801 Quiescent Current
VCM = V-, IO = 0, VS = 3.3 V
VCM = V-, IO = 0, VS = 3.3 V
500
320
550
415
nA
nA
Quiescent Current,
IQ-LPV802
Per Channel
(1) LPV801 Specifications are Preliminary until released.
Copyright © 2016, Texas Instruments Incorporated
5
LPV801, LPV802
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
www.ti.com.cn
6.6 Typical Characteristics
at TA = 25°C, RL = 10MΩ to VS/2 ,CL = 20pF, VCM = VS / 2V unless otherwise specified.
1000
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
+125°C
+25°C
+125°C
+25°C
-40°C
-40°C
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Supply Voltage (V)
Supply Voltage (V)
C001
C001
VCM = V-
LPV801
RL=No Load
VCM = V-
LPV802
RL=No Load
Figure 1. Supply Current vs. Supply Voltage, LPV801
Figure 2. Supply Current vs. Supply Voltage, LPV802
500
500
+125°C
+25°C
-40°C
+125°C
+25°C
-40°C
400
300
400
300
200
200
100
100
0
0
œ100
œ200
œ300
œ400
œ500
œ100
œ200
œ300
œ400
œ500
0
0.15
0.3
0.45
0.6
0.75
0.9
0
0.4
0.8
1.2
1.6
2
2.4
Common Mode Voltage (V)
Common Mode Voltage (V)
C003
C003
VS= 1.8V
RL= 10MΩ
VS= 3.3V
RL= 10MΩ
Figure 3. Typical Offset Voltage vs. Common Mode Voltage
Figure 4. Typical Offset Voltage vs. Common Mode Voltage
500
1k
+125°C
400
+25°C
300
-40°C
200
100
10
100
0
1
œ100
œ200
œ300
œ400
œ500
100m
10m
1m
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0
25
50
75
100
125
œ50
œ25
Common Mode Voltage (V)
Temperature (°C)
C003
C001
VS= 5V
RL= 10MΩ
VS= 5V
TA = -40 to 125
VCM = Vs/2
Figure 5. Typical Offset Voltage vs. Common Mode Voltage
Figure 6. Input Bias Current vs. Temperature
6
Copyright © 2016, Texas Instruments Incorporated
LPV801, LPV802
www.ti.com.cn
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
Typical Characteristics (continued)
at TA = 25°C, RL = 10MΩ to VS/2 ,CL = 20pF, VCM = VS / 2V unless otherwise specified.
100
100
80
80
60
60
40
40
20
20
0
0
œ20
œ40
œ60
œ80
œ100
œ20
œ40
œ60
œ80
œ100
0.0
0.2
0.3
0.5
0.6
0.8
0.9
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Common Mode Voltage (V)
Common Mode Voltage (V)
C001
C002
VS= 1.8V
TA = -40°C
VS= 5V
TA = -40°C
Figure 7. Input Bias Current vs. Common Mode Voltage
Figure 8. Input Bias Current vs. Common Mode Voltage
1000
800
1000
800
600
600
400
400
200
200
0
0
œ200
œ400
œ600
œ800
œ1000
œ200
œ400
œ600
œ800
œ1000
0.0
0.2
0.3
0.5
0.6
0.8
0.9
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Common Mode Voltage (V)
Common Mode Voltage (V)
C004
C005
VS= 1.8V
TA = 25°C
VS= 5V
TA = 25°C
Figure 9. Input Bias Current vs. Common Mode Voltage
Figure 10. Input Bias Current vs. Common Mode Voltage
500
400
500
400
300
300
200
200
100
100
0
0
œ100
œ200
œ300
œ400
œ500
œ100
œ200
œ300
œ400
œ500
0.0
0.2
0.3
0.5
0.6
0.8
0.9
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Common Mode Voltage (V)
Common Mode Voltage (V)
C003
C006
VS= 1.8V
TA = 125°C
VS= 5V
TA = 125°C
Figure 11. Input Bias Current vs. Common Mode Voltage
Figure 12. Input Bias Current vs. Common Mode Voltage
Copyright © 2016, Texas Instruments Incorporated
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LPV801, LPV802
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
www.ti.com.cn
Typical Characteristics (continued)
at TA = 25°C, RL = 10MΩ to VS/2 ,CL = 20pF, VCM = VS / 2V unless otherwise specified.
10
10
+125°C
+25°C
-40°C
+125°C
+25°C
-40°C
1
1
100m
10m
1m
100m
10m
1m
100ꢀ
100ꢀ
1ꢀ
10ꢀ
100ꢀ
1m
10m
1ꢀ
10ꢀ
100ꢀ
1m
10m
Output Sourcing Current (A)
Output Sinking Current (A)
C003
C006
VS= 5V
RL= No Load
VS= 1.8V
RL= No Load
Figure 13. Output Swing vs. Sourcing Current, 1.8V
Figure 14. Output Swing vs. Sinking Current, 1.8V
10
10
+125°C
+25°C
-40°C
+125°C
+25°C
-40°C
1
100m
10m
1m
1
100m
10m
1m
100ꢀ
100ꢀ
1ꢀ
10ꢀ
100ꢀ
1m
10m
1ꢀ
10ꢀ
100ꢀ
1m
10m
Output Sourcing Current (A)
Output Sinking Current (A)
C001
C005
VS= 3.3V
RL= No Load
VS= 3.3V
RL= No Load
Figure 15. Output Swing vs. Sourcing Current, 3.3V
Figure 16. Output Swing vs. Sinking Current, 3.3V
10
10
+125°C
+25°C
-40°C
+125°C
+25°C
-40°C
1
100m
10m
1m
1
100m
10m
1m
100ꢀ
100ꢀ
1ꢀ
10ꢀ
100ꢀ
1m
10m
1ꢀ
10ꢀ
100ꢀ
1m
10m
Output Sourcing Current (A)
Output Sinking Current (A)
C002
C004
VS= 5V
RL= No Load
VS= 5V
RL= No Load
Figure 17. Output Swing vs. Sourcing Current, 5V
Figure 18. Output Swing vs. Sinking Current, 5V
8
Copyright © 2016, Texas Instruments Incorporated
LPV801, LPV802
www.ti.com.cn
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
Typical Characteristics (continued)
at TA = 25°C, RL = 10MΩ to VS/2 ,CL = 20pF, VCM = VS / 2V unless otherwise specified.
500 us/div
500 us/div
C002
C002
TA = 25
RL= 10MΩ
Vout = 200mVpp
AV = +1
TA = 25
RL= 10MΩ
Vout = 200mVpp
VS= ±0.9V
CL= 20pF
VS= ±2.5V
CL= 20pF
AV = +1
Figure 19. Small Signal Pulse Response, 1.8V
Figure 20. Small Signal Pulse Response, 5V
500 us/div
500 us/div
C002
C002
TA = 25
RL= 10MΩ
Vout = 1Vpp
AV = +1
TA = 25
RL= 10MΩ
Vout = 2Vpp
AV = +1
VS= ±0.9V
CL= 20pF
VS= ±2.5V
CL= 20pF
Figure 21. Large Signal Pulse Response, 1.8V
Figure 22. Large Signal Pulse Response, 5V
110
100
90
80
70
60
50
40
30
20
10
0
140
120
100
80
+PSRR
-PSRR
60
40
20
0
10
100
1k
10k
1
10
100
1k
10k
Frequency (Hz)
RL= 10MΩ
CL= 20p
Frequency (Hz)
RL= 10MΩ
CL= 20p
C001
C001
TA = 25
VS= 3.3V
VCM = Vs/2
ΔVS = 0.5Vpp
TA = 25
VS= 5V
ΔVCM = 0.5Vpp
AV = +1
VCM = Vs/2
AV = +1
Figure 24. ±PSRR vs Frequency
Figure 23. CMRR vs Frequency
Copyright © 2016, Texas Instruments Incorporated
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LPV801, LPV802
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
www.ti.com.cn
Typical Characteristics (continued)
at TA = 25°C, RL = 10MΩ to VS/2 ,CL = 20pF, VCM = VS / 2V unless otherwise specified.
160
140
120
100
80
180
158
135
113
90
160
140
120
100
80
180
125°C
25°C
-40°C
125°C
25°C
-40°C
158
135
113
90
GAIN
GAIN
60
68
60
68
PHASE
PHASE
40
45
40
45
20
23
20
23
0
0
0
0
œ20
-23
œ20
-23
1m
10m 100m
1
10
100
1k
10k 100k
1m
10m 100m
1
10
100
1k
10k 100k
Frequency (Hz)
Frequency (Hz)
C001
C002
TA = -40, 25, 125°C
VS= 5V
RL= 10MΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
TA = -40, 25, 125°C
VS= 3.3V
RL= 10MΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
Figure 25. Open Loop Gain and Phase, 5V, 10 MΩ Load
Figure 26. Open Loop Gain and Phase, 3.3V, 10 MΩ Load
160
180
158
135
113
90
160
180
158
135
113
90
125°C
25°C
-40°C
125°C
25°C
-40°C
140
120
100
80
140
120
100
80
GAIN
GAIN
60
68
60
68
PHASE
PHASE
40
45
40
45
20
23
20
23
0
0
0
0
œ20
-23
œ20
-23
1m
10m 100m
1
10
100
1k
10k 100k
1m
10m 100m
1
10
100
1k
10k 100k
Frequency (Hz)
Frequency (Hz)
C003
C002
TA = -40, 25, 125°C
VS= 5V
RL= 1MΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
TA = -40, 25, 125°C
VS= 3.3V
RL= 1MΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
Figure 27. Open Loop Gain and Phase, 5V, 1 MΩ Load
Figure 28. Open Loop Gain and Phase, 3.3V, 1 MΩ Load
160
180
158
135
113
90
160
180
158
135
113
90
125°C
25°C
-40°C
125°C
25°C
-40°C
140
120
100
80
140
120
100
80
GAIN
GAIN
60
68
60
68
PHASE
PHASE
40
45
40
45
20
23
20
23
0
0
0
0
œ20
-23
œ20
-23
1m
10m 100m
1
10
100
1k
10k 100k
1m
10m 100m
1
10
100
1k
10k 100k
Frequency (Hz)
Frequency (Hz)
C001
C002
TA = -40, 25, 125°C
VS= 5V
RL= 100kΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
TA = -40, 25, 125°C
VS= 3.3V
RL= 100kΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
Figure 29. Open Loop Gain and Phase, 5V, 100kΩ Load
Figure 30. Open Loop Gain and Phase, 3.3V, 100kΩ Load
10
Copyright © 2016, Texas Instruments Incorporated
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Typical Characteristics (continued)
at TA = 25°C, RL = 10MΩ to VS/2 ,CL = 20pF, VCM = VS / 2V unless otherwise specified.
1M
100k
10k
1k
160
140
120
100
80
180
158
135
113
90
125°C
25°C
-40°C
GAIN
60
68
PHASE
40
45
20
23
0
0
œ20
-23
100
1m
10m 100m
1
10
100
1k
10k 100k
100m
1
10
100
1k
10k
100k
Frequency (Hz)
C003
Frequency (Hz)
VS= 5 V
C001
TA = -40, 25, 125°C
VS= 1.8V
RL= 10MΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
TA = 25°C
RL= 10MΩ
Figure 32. Open Loop Output Impedance
Figure 31. Open Loop Gain and Phase, 1.8V, 10 MΩ Load
160
180
158
135
113
90
10000
1000
100
125°C
25°C
-40°C
140
120
100
80
GAIN
60
68
PHASE
40
45
20
23
0
0
œ20
-23
1m
10m 100m
1
10
100
1k
10k 100k
10
100m
1
10
100
1k
10k
Frequency (Hz)
C003
Frequency (Hz)
RL= 1MΩ
C001
TA = -40, 25, 125°C
VS= 1.8V
RL= 1MΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
TA = 25
VS= 5V
VCM = Vs/2
CL= 20pF
AV = +1
Figure 33. Open Loop Gain and Phase, 1.8V, 1 MΩ Load
Figure 34. Input Voltage Noise vs Frequency
120
100
80
60
40
20
0
160
180
158
135
113
90
LPV802, -20dBm
LPV802, -10dBm
LPV802, 0dBm
125°C
25°C
-40°C
140
120
100
80
GAIN
60
68
PHASE
40
45
20
23
0
0
œ20
-23
10k 100k
1m
10m 100m
1
10
100
1k
10
100
1000
Frequency (Hz)
C003
Frequency (MHz)
RL= 1MΩ
C001
TA = -40, 25, 125°C
VS= 1.8V
RL= 100kΩ
CL= 20pF
VOUT = 200mVPP
VCM = Vs/2
TA = 25
VCM = Vs/2
VS= 3.3V
CL= 20pF
AV = +1
Figure 35. Open Loop Gain and Phase, 1.8V, 100kΩ Load
Figure 36. EMIRR Performance
Copyright © 2016, Texas Instruments Incorporated
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LPV801, LPV802
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7 Detailed Description
7.1 Overview
The LPV801 (single) and LPV802 (dual) series nanoPower CMOS operational amplifiers are designed for long-
life battery-powered and energy harvested applications. They operate on a single supply with operation as low as
1.6V. The output is rail-to-rail and swings to within 3.5mV of the supplies with a 100kΩ load. The common-mode
range extends to the negative supply making it ideal for single-supply applications. EMI protection has been
employed internally to reduce the effects of EMI.
Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics
curves.
7.2 Functional Block Diagram
7.3 Feature Description
The amplifier's differential inputs consist of a non-inverting input (+IN) and an inverting input (–IN). The amplifer
amplifies only the difference in voltage between the two inputs, which is called the differential input voltage. The
output voltage of the op-amp VOUT is given by Equation 1:
VOUT = AOL (IN+ – IN–)
where
•
AOL is the open-loop gain of the amplifier, typically around 120 dB (1,000,000x, or 1,000,000 Volts per
microvolt).
(1)
7.4 Device Functional Modes
7.4.1 Negative-Rail Sensing Input
The input common-mode voltage range of the LPV80x extends from (V-) to (V+) – 0.9 V. In this range, low offset
can be expected with a minimum of 80dB CMRR. The LPV80x is protected from output "inversions" or
"reversals".
7.4.2 Rail to Rail Output Stage
The LPV80x output voltage swings 3.5 mV from rails at 1.8 V supply, which provides the maximum possible
dynamic range at the output. This is particularly important when operating on low supply voltages.
The LPV80x Maximum Output Voltage Swing graph defines the maximum swing possible under a particular
output load.
7.4.3 Design Optimization for Nanopower Operation
When designing for ultralow power, choose system feedback components carefully. To minimize quiecent current
consumption, select large-value feedback resistors. Any large resistors will react with stray capacitance in the
circuit and the input capacitance of the operational amplifier. These parasitic RC combinations can affect the
stability of the overall system. A feedback capacitor may be required to assure stability and limit overshoot or
gain peaking.
12
Copyright © 2016, Texas Instruments Incorporated
LPV801, LPV802
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Device Functional Modes (continued)
When possible, use AC coupling and AC feedback to reduce static current draw through the feedback elements.
Use film or ceramic capacitors since large electolytics may have large static leakage currents in the nanoamps.
7.4.4 Driving Capacitive Load
The LPV80x is internally compensated for stable unity gain operation, with a 8 kHz typical gain bandwidth.
However, the unity gain follower is the most sensitive configuration to capacitive load. The combination of a
capacitive load placed directly on the output of an amplifier along with the amplifier’s output impedance creates a
phase lag, which reduces the phase margin of the amplifier. If the phase margin is significantly reduced, the
response will be under damped which causes peaking in the transfer and, when there is too much peaking, the
op amp might start oscillating.
In order to drive heavy (>50pF) capacitive loads, an isolation resistor, RISO, should be used, as shown in
Figure 37. By using this isolation resistor, the capacitive load is isolated from the amplifier’s output. The larger
the value of RISO, the more stable the amplifier will be. If the value of RISO is sufficiently large, the feedback loop
will be stable, independent of the value of CL. However, larger values of RISO result in reduced output swing and
reduced output current drive. The recommended value for RISO is 30-50kΩ.
R
ISO
-
V
OUT
V
IN
+
C
L
Figure 37. Resistive Isolation Of Capacitive Load
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LPV80x is a ultra-low power operational amplifier that provides 8 kHz bandwidth with only 320nA typical
quiescent current, and near precision drift specifications. These rail-to-rail output amplifiers are specifically
designed for battery-powered applications. The input common-mode voltage range extends to the negative
supply rail and the output swings to within millivolts of the rails, maintaining a wide dynamic range.
8.2 Typical Application: Three Terminal CO Gas Sensor Amplifier
R1
10 kꢀ
C1
0.1µF
Potentiostat (Bias Loop)
CE
R2
10 kΩ
2.5V
RE
CO Sensor
U1
+
VREF
WE
Transimpedance Amplifier (I to V conversion)
RF
ISENS
Riso
49.9 kꢀ
RL
U2
VTIA
+
VREF
C2
1µF
Figure 38. Three Terminal Gas Sensor Amplifer Schematic
8.2.1 Design Requirements
Figure 38 shows a simple micropower potentiostat circuit for use with three terminal unbiased CO sensors,
though it is applicable to many other type of three terminal gas sensors or electrochemical cells.
The basic sensor has three electrodes; The Sense or Working Electrode (“WE”), Counter Electrode (“CE”) and
Reference Electrode (“RE”). A current flows between the CE and WE proportional to the detected concentration.
The RE monitors the potential of the internal reference point. For an unbiased sensor, the WE and RE electrodes
must be maintained at the same potential by adjusting the bias on CE. Through the Potentiostat circuit formed by
U1, the servo feedback action will maintain the RE pin at a potential set by VREF
.
R1 is to maintain stability due to the large capacitence of the sensor. C1 and R2 form the Potentiostat integrator
and set the feedback time constant.
U2 forms a transimpedance amplifer ("TIA") to convert the resulting sensor current into a proportional voltage.
The transimpedance gain, and resulting sensitivity, is set by RF according to Equation 2.
VTIA = (-I * RF) + VREF
(2)
RL is a load resistor of which the value is normally specified by the sensor manufacturer (typically 10 ohms). The
potential at WE is set by the applied VREF. Riso provides capacitive isolation and, combined with C2, form the
output filter and ADC reservoir capacitor to drive the ADC.
14
Copyright © 2016, Texas Instruments Incorporated
LPV801, LPV802
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Typical Application: Three Terminal CO Gas Sensor Amplifier (continued)
8.2.2 Detailed Design Procedure
For this example, we will be using a CO sensor with a sensitivity of 69nA/ppm. The supply votlage and maximum
ADC input voltage is 2.5V, and the maximum concentration is 300ppm.
First the VREF voltage must be determined. This voltage is a compromise between maximum headroom and
resolution, as well as allowance for "footroom" for the minimum swing on the CE terminal, since the CE terminal
generally goes negative in relation to the RE potential as the concentration (sensor current) increases. Bench
measurements found the difference between CE and RE to be 180mV at 300ppm for this particular sensor.
To allow for negative CE swing "footroom" and voltage drop across the 10k resistor, 300mV was chosen for
VREF
.
Therefore +300mV will be used as the minimum VZERO to add some headroom.
VZERO = VREF = +300mV
where
•
•
VZERO is the zero concentration voltage
VREF is the reference voltage (300mV)
(3)
Next we calculate the maximum sensor current at highest expected concentration:
ISENSMAX = IPERPPM * ppmMAX = 69nA * 300ppm = 20.7uA
where
•
•
•
ISENSMAX is the maximum expected sensor current
IPERPPM is the manufacturer specified sensor current in Amps per ppm
ppmMAX is the maximum required ppm reading
(4)
(5)
Now find the available output swing range above the reference voltage available for the measurement:
VSWING = VOUTMAX – VZERO = 2.5V – 0.3V = 2.2V
where
•
•
VSWING is the expected change in output voltage
VOUTMAX is the maximum amplifer output swing (usually near V+)
Now we calculate the transimpedance resistor (RF) value using the maximum swing and the maximum sensor
current:
RF = VSWING / ISENSMAX = 2.2V / 20.7µA = 106.28 kΩ (we will use 110 kΩ for a common value)
(6)
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LPV801, LPV802
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www.ti.com.cn
Typical Application: Three Terminal CO Gas Sensor Amplifier (continued)
8.2.3 Application Curve
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
Vc
Vw
Vtia
Vdif
0
15
30
45
60
75
90
105
120
135
150
Time (sec)
C007
Figure 39. Monitored Voltages when exposed to 200ppm CO
Figure 39 shows the resulting circuit voltages when the sensor was exposed to 200ppm step of carbon monoxide
gas. VC is the monitored CE pin voltage and clearly shows the expected CE voltage dropping below the WE
voltage, VW, as the concentration increases.
VTIA is the output of the transimpedance amplifer U2. VDIFF is the calculated difference between VREF and VTIA
,
which will be used for the ppm calculation.
20
18
16
14
12
10
8
300
250
200
150
100
50
6
4
2
0
0
0
15
30
45
60
75
90 105 120 135 150
0
15
30
45
60
75
90 105 120 135 150
Time (sec)
Time (sec)
C002
C003
Figure 40. Calculated Sensor Current
Figure 41. Calculated ppm
Figure 40 shows the calculated sensor current using the formula in Equation 7 :
ISENSOR = VDIFF / RF = 1.52V / 110 kΩ = 13.8uA
(7)
(8)
Equation 8 shows the resulting conversion of the sensor current into ppm.
ppm = ISENSOR / IPERPPM = 13.8µA / 69nA = 200
Total supply current for the amplifier section is less than 700 nA, minus sensor current. Note that the sensor
current is sourced from the amplifier output, which in turn comes from the amplifier supply voltage. Therefore,
any continuous sensor current must also be included in supply current budget calculations.
16
Copyright © 2016, Texas Instruments Incorporated
LPV801, LPV802
www.ti.com.cn
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
8.3 Do's and Don'ts
Do properly bypass the power supplies.
Do add series resistance to the output when driving capacitive loads, particularly cables, Muxes and ADC inputs.
Do add series current limiting resistors and external schottky clamp diodes if input voltage is expected to exceed
the supplies. Limit the current to 1mA or less (1KΩ per volt).
9 Power Supply Recommendations
The LPV80x is specified for operation from 1.6 V to 5.5 V (±0.8 V to ±2.75 V) over a –40°C to 125°C temperature
range. Parameters that can exhibit significant variance with regard to operating voltage or temperature are
presented in the Typical Characteristics.
CAUTION
Supply voltages larger than 6 V can permanently damage the device.
For proper operation, the power supplies must be properly decoupled. For decoupling the supply lines it is
suggested that 100 nF capacitors be placed as close as possible to the operational amplifier power supply pins.
For single supply, place a capacitor between V+ and V– supply leads. For dual supplies, place one capacitor
between V+ and ground, and one capacitor between V– and ground.
Low bandwidth nanopower devices do not have good high frequency (> 1 kHz) AC PSRR rejection against high-
frequency switching supplies and other 1 kHz and above noise sources, so extra supply filtering is recommended
if kilohertz or above noise is expected on the power supply lines.
10 Layout
10.1 Layout Guidelines
The V+ pin should be bypassed to ground with a low ESR capacitor.
The optimum placement is closest to the V+ and ground pins.
Care should be taken to minimize the loop area formed by the bypass capacitor connection between V+ and
ground.
The ground pin should be connected to the PCB ground plane at the pin of the device.
The feedback components should be placed as close to the device as possible to minimize strays.
10.2 Layout Example
Figure 42. SOT-23 Layout Example (Top View)
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LPV801, LPV802
ZHCSFD7A –AUGUST 2016–REVISED AUGUST 2016
www.ti.com.cn
11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
TINA-TI 基于 SPICE 的模拟仿真程序,http://www.ti.com.cn/tool/cn/tina-ti
DIP 适配器评估模块,http://www.ti.com.cn/tool/cn/dip-adapter-evm
TI 通用运行放大器评估模块,http://www.ti.com.cn/tool/cn/opampevm
TI FilterPro 滤波器设计软件,http://www.ti.com.cn/tool/cn/filterpro
11.2 接收文档更新通知
如需接收文档更新通知,请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后,即可每周定期收到已更改的产品信息。有关更改的详细信息,请查阅已修订文档中包含的修订历史记录。
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 相关链接
以下表格列出了快速访问链接。范围包括技术文档、支持与社区资源、工具和软件,并且可以快速访问样片或购买
链接。
表 1. 相关链接
器件
产品文件夹
请单击此处
请单击此处
样片与购买
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
支持与社区
请单击此处
请单击此处
LPV801
LPV802
11.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
18
版权 © 2016, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
20-Sep-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
LPV801DBVR
LPV801DBVT
LPV802DGKR
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
VSSOP
DBV
DBV
DGK
5
5
8
3000 RoHS & Green
250 RoHS & Green
2500 RoHS & Green
250 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
15VM
15VM
Samples
Samples
Samples
SN
NIPDAUAG | SN
LPV
802
LPV802DGKT
ACTIVE
VSSOP
DGK
8
NIPDAUAG | SN
Level-1-260C-UNLIM
-40 to 125
LPV
802
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
20-Sep-2022
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LPV801DBVR
LPV801DBVT
LPV802DGKR
LPV802DGKR
LPV802DGKT
LPV802DGKT
SOT-23
SOT-23
VSSOP
VSSOP
VSSOP
VSSOP
DBV
DBV
DGK
DGK
DGK
DGK
5
5
8
8
8
8
3000
250
178.0
178.0
330.0
330.0
330.0
178.0
8.4
8.4
3.2
3.2
5.3
5.3
5.3
5.3
3.2
3.2
3.4
3.4
3.4
3.4
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q1
Q1
Q1
Q1
2500
2500
250
12.4
12.4
12.4
13.4
12.0
12.0
12.0
12.0
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LPV801DBVR
LPV801DBVT
LPV802DGKR
LPV802DGKR
LPV802DGKT
LPV802DGKT
SOT-23
SOT-23
VSSOP
VSSOP
VSSOP
VSSOP
DBV
DBV
DGK
DGK
DGK
DGK
5
5
8
8
8
8
3000
250
208.0
208.0
364.0
366.0
366.0
202.0
191.0
191.0
364.0
364.0
364.0
201.0
35.0
35.0
27.0
50.0
50.0
28.0
2500
2500
250
250
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
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