MAX3222CDWRG4_技术文档

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SLLS408G − JANUARY 2000 − REVISED MARCH 2004

DB, DW, OR PW PACKAGE

(TOP VIEW)

D

RS-232 Bus-Pin ESD Protection Exceeds

15 kV Using Human-Body Model (HBM)

D

Meets or Exceeds the Requirements of

TIA/EIA-232-F and ITU v.28 Standards

EN

C1+

V+

C1−

C2+

C2−

V−

1

2

3

4

5

6

7

8

9

10

20 PWRDOWN

19

18

17

16

15

14

13

12

11

V

CC

D

Operates With 3-V to 5.5-V V Supply

CC

GND

DOUT1

RIN1

ROUT1

NC

DIN1

DIN2

NC

Operates Up To 250 kbit/s

Two Drivers and Two Receivers

Low Standby Current . . . 1 µA Typical

External Capacitors . . . 4 × 0.1 µF

DOUT2

RIN2

ROUT2

Accepts 5-V Logic Input With 3.3-V Supply

Alternative High-Speed Pin-Compatible

Device (1 Mbit/s)

− SNx5C3222

NC − No internal connection

D

Applications

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

The MAX3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with

15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the

requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication

controller and the serial-port connector. The charge pump and four small external capacitors allow operation

from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum

of 30-V/µs driver output slew rate.

ORDERING INFORMATION

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

T

A

PACKAGE

Tube of 25

Reel of 2000

Tube of 70

Reel of 2000

Tube of 70

Reel of 2000

Tube of 25

Reel of 2000

Tube of 70

Reel of 2000

Tube of 70

Reel of 2000

MAX3222CDW

MAX3222CDWR

MAX3222CDB

MAX3222CDBR

MAX3222CPW

MAX3222CPWR

MAX3222IDW

MAX3222IDWR

MAX3222IDB

SOIC (DW)

SSOP (DB)

TSSOP (PW)

SOIC (DW)

SSOP (DB)

TSSOP (PW)

MAX3222C

MA3222C

MAX3222I

MB3222I

−0°C to 70°C

−40°C to 85°C

MAX3222IDBR

MAX3222IPW

MAX3222IPWR

MB3222I

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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Copyright  2004, Texas Instruments Incorporated

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1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLLS408G − JANUARY 2000 − REVISED MARCH 2004

description/ordering information (continued)

The MAX3222 can be placed in the power-down mode by setting PWRDOWN low, which draws only 1 µA from

the power supply. When the device is powered down, the receivers remain active while the drivers are placed

in the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to

V

, and V− is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting

CC

EN high.

Function Tables

EACH DRIVER

INPUTS

OUTPUT

DOUT

DIN

X

PWRDOWN

L

H

Z

H

L

H

H = high level, L = low level, X = irrelevant,

Z = high impedance

EACH RECEIVER

INPUTS

OUTPUT

ROUT

RIN

L

EN

L

H

L

H

L

X

H

L

Z

H

Open

H = high level, L = low level, X = irrelevant,

Z = high impedance (off), Open = input

disconnected or connected driver off

logic diagram (positive logic)

13

17

DIN1

DOUT1

DOUT2

12

20

8

DIN2

Powerdown

PWRDOWN

1

EN

15

16

9

ROUT1

RIN1

RIN2

10

ROUT2

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢚ

SLLS408G − JANUARY 2000 − REVISED MARCH 2004

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V

CC

Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V

Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V

Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V

Input voltage range, V : Drivers, EN, PWRDOWN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V

I

Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V

Output voltage range, V : Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V

O

Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V

+ 0.3 V

CC

Package thermal impedance, θ (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W

JA

DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W

PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W

Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

J

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltages are with respect to network GND.

2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable

J

JA

A

ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.

D

J

A

JA

J

3. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 4 and Figure 5)

MIN NOM

MAX

3.6

UNIT

V

= 3.3 V

= 5 V

3

4.5

2

3.3

5

CC

Supply voltage

V

5.5

CC

V

= 3.3 V

= 5 V

CC

V

IH

Driver and control high-level input voltage

V

DIN, EN, PWRDOWN

2.4

CC

V

Driver and control low-level input voltage

Driver and control input voltage

Receiver input voltage

DIN, EN, PWRDOWN

0.8

5.5

25

70

85

V

IL

0

−25

0

I

MAX3222C

MAX3222I

T

A

Operating free-air temperature

°C

−40

NOTE 4: Test conditions are C1−C4 = 0.1 µF at V

CC

= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.

CC

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted) (see Note 4 and Figure 5)

‡

PARAMETER

Input leakage current (EN, PWRDOWN)

Supply current

TEST CONDITIONS

MIN TYP

MAX

1

UNIT

µA

I

0.01

0.3

1

I

No load, PWRDOWN at V

CC

1

mA

µA

CC

Supply current (powered off)

No load, PWRDOWN at GND

10

‡

All typical values are at V

CC

= 3.3 V or V = 5 V, and T = 25°C.

CC A

NOTE 4: Test conditions are C1−C4 = 0.1 µF at V

= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V

= 5 V 0.5 V.

CC

3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLLS408G − JANUARY 2000 − REVISED MARCH 2004

DRIVER SECTION

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted) (see Note 4 and Figure 5)

†

PARAMETER

High-level output voltage

Low-level output voltage

High-level input current

Low-level input current

TEST CONDITIONS

DOUT at R = 3 kΩ to GND, DIN = GND

DIN = V

MIN TYP

MAX

UNIT

V

5

5.4

−5.4

0.01

OH

L

DOUT at R = 3 kΩ to GND,

−5

V

OL

L

CC

I

IH

V = V

I CC

1

µA

I

IL

V at GND

I

V

= 3.6 V,

V

= 0 V

CC

O

‡

I

Short-circuit output current

35

60

mA

OS

= 5.5 V,

= 0 V

r

Output resistance

, V+, and V− = 0 V,

=

2 V

300

10M

Ω

o

PWRDOWN = GND,

= 3 V to 3.6 V

V

O

12 V,

25

V

CC

PWRDOWN = GND,

= 4.5 V to 5.5 V

I

off

Output leakage current

µA

V

O

=

10 V,

V

CC

†

‡

All typical values are at V

= 3.3 V or V

CC

= 5 V, and T = 25°C.

CC

A

Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output

should be shorted at a time.

NOTE 4: Test conditions are C1−C4 = 0.1 µF at V

CC

= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.

CC

switching characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted) (see Note 4 and Figure 5)

†

PARAMETER

TEST CONDITIONS

MIN TYP

MAX

UNIT

C

= 1000 pF,

R

L

= 3 kΩ,

See Figure 1

L

Maximum data rate

150

250

300

kbit/s

One DOUT switching,

C

= 150 pF to 2500 pF,

R

= 3 kΩ to 7 kΩ,

L

§

t

Pulse skew

ns

sk(p)

See Figure 2

C

= 150 pF to 1000 pF

= 150 pF to 2500 pF

6

4

30

Slew rate, transition region

(See Figure 1)

R

V

= 3 kΩ to 7 kΩ,

L

SR(tr)

V/µs

= 3.3 V

CC

†

§

All typical values are at V

CC

= 3.3 V or V = 5 V, and T = 25°C.

CC A

Pulse skew is defined as |t

− t

| of each channel of the same device.

PLH PHL

NOTE 4: Test conditions are C1−C4 = 0.1 µF at V

= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.

CC

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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ꢚ

SLLS408G − JANUARY 2000 − REVISED MARCH 2004

RECEIVER SECTION

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted) (see Note 4 and Figure 5)

†

PARAMETER

High-level output voltage

TEST CONDITIONS

MIN

TYP

MAX

UNIT

V

I

= −1 mA

= 1.6 mA

V

CC

− 0.6 V

V

− 0.1 V

OH

CC

Low-level output voltage

0.4

2.4

V

OL

V

CC

V

CC

V

CC

V

CC

= 3.3 V

= 5 V

1.5

1.8

V

IT+

Positive-going input threshold voltage

V

= 3.3 V

= 5 V

0.6

0.8

1.2

V

Negative-going input threshold voltage

IT−

1.5

Input hysteresis (V

IT+

− V

)

0.3

V

hys

IT−

I

Output leakage current

EN = V

CC

0.05

10

7

µA

kΩ

off

r

Input resistance

V = 3 V to 25 V

I

3

5

i

†

All typical values are at V

CC

= 3.3 V or V = 5 V, and T = 25°C.

CC A

NOTE 4: Test conditions are C1−C4 = 0.1 µF at V

= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V

= 5 V 0.5 V.

CC

switching characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted) (see Note 4)

†

PARAMETER

TEST CONDITIONS

150 pF, See Figure 3

MIN TYP

MAX

UNIT

ns

t

Propagation delay time, low- to high-level output

Propagation delay time, high- to low-level output

C

300

PLH

L =

C = 150 pF, See Figure 3

ns

PHL

L

C = 150 pF, R = 3 kΩ,

See Figure 4

L

t

Output enable time

Output disable time

200

ns

en

C = 150 pF, R = 3 kΩ,

L

t

200

300

ns

dis

See Figure 4

‡

Pulse skew

See Figure 3

sk(p)

†

‡

All typical values are at V

CC

= 3.3 V or V = 5 V, and T = 25°C.

CC A

Pulse skew is defined as |t

− t

| of each channel of the same device.

= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V

PLH PHL

NOTE 4: Test conditions are C1−C4 = 0.1 µF at V

CC

= 5 V 0.5 V.

CC

5

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SLLS408G − JANUARY 2000 − REVISED MARCH 2004

PARAMETER MEASUREMENT INFORMATION

3 V

0 V

Input

1.5 V

RS-232

Output

Generator

(see Note B)

50 Ω

C

L

t

R

t

TLH

THL

L

(see Note A)

3 V

PWRDOWN

V

OH

3 V

−3 V

3 V

−3 V

Output

OL

TEST CIRCUIT

VOLTAGE WAVEFORMS

6 V

or t

SR(tr) +

t

THL

TLH

NOTES: A.

C includes probe and jig capacitance.

L

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

O

r

f

Figure 1. Driver Slew Rate

3 V

0 V

Input

1.5 V

RS-232

Output

Generator

(see Note B)

50 Ω

C

t

PLH

L

PHL

R

L

(see Note A)

V

OH

3 V

PWRDOWN

50%

Output

OL

TEST CIRCUIT

C includes probe and jig capacitance.

L

VOLTAGE WAVEFORMS

NOTES: A.

B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

O

r

f

Figure 2. Driver Pulse Skew

EN

0 V

3 V

Input

1.5 V

−3 V

Output

Generator

(see Note B)

50 Ω

t

PLH

PHL

C

L

(see Note A)

V

OH

50%

Output

OL

TEST CIRCUIT

VOLTAGE WAVEFORMS

NOTES: A.

C

includes probe and jig capacitance.

L

B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

O

r

f

Figure 3. Receiver Propagation Delay Times

6

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ ꢁꢂ ꢃ ꢄꢄ ꢄ

ꢃ ꢅꢆ ꢇ ꢈ ꢉ ꢊꢉ ꢅꢆ ꢀ ꢋꢌꢇ ꢍꢎꢏ ꢁꢐꢐꢑ ꢌ ꢒꢓ ꢅꢄꢃ ꢄ ꢌ ꢍꢐꢑ ꢔꢒꢍ ꢆꢑ ꢒꢕꢒꢑ ꢎꢑ ꢍ ꢆ ꢑꢒ

ꢖ ꢍꢇ ꢏ ꢗ ꢉ ꢅꢘ ꢆ ꢑꢓ ꢔ ꢙꢒꢈ ꢇꢑ ꢎ ꢇꢍ ꢈ ꢐ

ꢚ

SLLS408G − JANUARY 2000 − REVISED MARCH 2004

PARAMETER MEASUREMENT INFORMATION

3 V

0 V

V

CC

S1

GND

Input

1.5 V

R

L

t

PZH

PHZ

S1 at GND)

(S1 at GND)

3 V or 0 V

Output

V

OH

C

L

Output

50%

(see Note A)

EN

0.3 V

t

PLZ

(S1 at V

Generator

(see Note B)

)

CC

50 Ω

Output

50%

V

OL

t

PZL

(S1 at V

)

CC

TEST CIRCUIT

VOLTAGE WAVEFORMS

NOTES: A.

C includes probe and jig capacitance.

L

B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

O

r

f

Figure 4. Receiver Enable and Disable Times

7

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

ꢀ

ꢁ

ꢂ

ꢃꢄ

ꢄ

ꢚ

ꢃ

ꢅ

ꢆ

ꢇꢈ

ꢉ

ꢊ

ꢉꢅ

ꢆ

ꢀ

ꢋ

ꢌꢇ

ꢍ

ꢎ

ꢏ

ꢁ

ꢐ

ꢑ

ꢌ

ꢒ

ꢓ

ꢅ

ꢄ

ꢃ

ꢄ

ꢌ

ꢍ

ꢐ

ꢑ

ꢔ

ꢒ

ꢍ

ꢆ

ꢑ

ꢒ

ꢕ

ꢒ

ꢑ

ꢎ

ꢑ

ꢍ

ꢆ

ꢑ

ꢒ

ꢖ

ꢍ

ꢇ

ꢏ

ꢗ

ꢉꢅ

ꢘ

ꢆ

ꢑ

ꢓ

ꢔ

ꢙ

ꢒ

ꢈ

ꢇ

ꢑ

ꢎ

ꢇꢍ

ꢈ

ꢐ

SLLS408G − JANUARY 2000 − REVISED MARCH 2004

APPLICATION INFORMATION

1

20

EN

Powerdown

PWRDOWN

2

19

18

17

V

C1+

V+

CC

+

−

C

BYPASS

= 0.1 µF

+

3

4

GND

C1

+

−

†

C3

DOUT1

RIN1

C1−

C2+

C2−

V−

16

15

14

13

12

11

5

+

−

C2

C4

6

ROUT1

NC

7

−

+

8

DOUT2

RIN2

DIN1

9

DIN2

NC

10

ROUT2

†

C3 can be connected to V

CC

or GND.

NOTES: A. Resistor values shown are nominal.

B. NC − No internal connection

C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be

connected as shown.

V

CC

vs CAPACITOR VALUES

V

C1

C2, C3, and C4

0.1 µF

CC

0.1 µF

0.047 µF

0.1 µF

3.3 V " 0.3 V

5 V " 0.5 V

3 V to 5.5 V

0.33 µF

0.47 µF

Figure 5. Typical Operating Circuit and Capacitor Values

8

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

18-Sep-2008

PACKAGING INFORMATION

Orderable Device

MAX3222CDB

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SSOP

DB

20

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3222CDBE4

MAX3222CDBG4

MAX3222CDBR

MAX3222CDBRE4

MAX3222CDBRG4

MAX3222CDW

SSOP

SOIC

DB

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DB

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DB

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DB

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DW

PW

DB

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3222CDWE4

MAX3222CDWG4

MAX3222CDWR

MAX3222CDWRE4

MAX3222CDWRG4

MAX3222CPW

SOIC

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

SSOP

SOIC

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3222CPWE4

MAX3222CPWG4

MAX3222CPWR

MAX3222CPWRE4

MAX3222CPWRG4

MAX3222IDB

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3222IDBE4

MAX3222IDBG4

MAX3222IDBR

DB

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DB

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DB

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3222IDBRE4

MAX3222IDBRG4

MAX3222IDW

DB

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DB

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

DW

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

18-Sep-2008

Orderable Device

MAX3222IDWE4

MAX3222IDWG4

MAX3222IDWR

MAX3222IDWRE4

MAX3222IDWRG4

MAX3222IPW

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOIC

DW

20

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

DW

PW

25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SOIC

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

MAX3222IPWE4

MAX3222IPWG4

MAX3222IPWR

MAX3222IPWRE4

MAX3222IPWRG4

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0 (mm)

B0 (mm)

K0 (mm)

P1

W

Pin1

Diameter Width

(mm) W1 (mm)

(mm) (mm) Quadrant

MAX3222CDBR

MAX3222CDWR

MAX3222CPWR

MAX3222IDBR

MAX3222IDWR

MAX3222IPWR

SSOP

SOIC

DB

DW

PW

DB

20

2000

330.0

16.4

24.4

16.4

24.4

16.4

8.2

10.8

6.95

8.2

7.5

13.0

7.1

2.5

2.7

1.6

2.5

2.7

1.6

12.0

8.0

16.0

24.0

16.0

24.0

16.0

Q1

TSSOP

SSOP

SOIC

7.5

12.0

8.0

DW

PW

10.8

6.95

13.0

7.1

TSSOP

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

11-Mar-2008

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

MAX3222CDBR

MAX3222CDWR

MAX3222CPWR

MAX3222IDBR

MAX3222IDWR

MAX3222IPWR

SSOP

SOIC

DB

DW

PW

DB

20

2000

346.0

33.0

41.0

33.0

41.0

33.0

TSSOP

SSOP

SOIC

DW

PW

TSSOP

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

28

M

0,15

15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

1

14

0,25

A

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

14

16

20

24

28

30

38

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

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Digital Control

Medical

Amplifiers

Data Converters

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Clocks and Timers

Interface

amplifier.ti.com

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RF/IF and ZigBee® Solutions www.ti.com/lprf

www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	MAX3222CDWRG4
厂家：	TEXAS INSTRUMENTS
描述：	DUAL LINE TRANSCEIVER, PDSO20, GREEN, PLASTIC, SOIC-20 驱动光电二极管接口集成电路驱动器
文件：	总16页 (文件大小：438K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MAX3222CDWRG4 [TI]

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