MC3487DRG4 [TI]

QUADRUPLE DIFFERENTIAL LINE DRIVER; 四路差动线路驱动器
MC3487DRG4
型号: MC3487DRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

QUADRUPLE DIFFERENTIAL LINE DRIVER
四路差动线路驱动器

线路驱动器或接收器 驱动程序和接口 接口集成电路 光电二极管
文件: 总16页 (文件大小:940K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀ ꢁꢂ ꢃꢄ ꢅ  
ꢆ ꢇꢈꢉꢊ ꢇꢋꢌ ꢍ ꢉꢎ ꢏꢏ ꢍꢊ ꢍꢐꢑ ꢎꢈ ꢌ ꢌ ꢎꢐ ꢍ ꢉ ꢊꢎ ꢒ ꢍꢊ  
SLLS098C − MAY 1980 − REVISED FEBRUARY 2004  
D, N, OR NS PACKAGE  
(TOP VIEW)  
D
Meets or Exceeds Requirements of ANSI  
TIA/EIA-422-B and ITU  
Recommendation V.11  
V
1A  
1Y  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
CC  
D
D
D
D
D
3-State, TTL-Compatible Outputs  
Fast Transition Times  
4A  
4Y  
4Z  
1Z  
High-Impedance Inputs  
1,2EN  
2Z  
12 3,4EN  
11 3Z  
Single 5-V Supply  
2Y  
Power-Up and Power-Down Protection  
10  
9
3Y  
3A  
2A  
GND  
description/ordering information  
The MC3487 offers four independent differential line drivers designed to meet the specifications of ANSI  
TIA/EIA-422-B and ITU Recommendation V.11. Each driver has a TTL-compatible input buffered to reduce  
current and minimize loading.  
The driver outputs utilize 3-state circuitry to provide high-impedance states at any pair of differential outputs  
when the appropriate output enable is at a low logic level. Internal circuitry is provided to ensure the  
high-impedance state at the differential outputs during power-up and power-down transition times, provided the  
output enable is low.  
The MC3487 is designed for optimum performance when used with the MC3486 quadruple line receiver. It is  
supplied in a 16-pin dual-in-line package and operates from a single 5-V supply.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP − N  
Tube  
MC3487N  
MC3487N  
Tube  
MC3487D  
0°C to 70°C  
SOIC − D  
SOP − NS  
MC3487  
MC3487  
Tape and reel  
Tape and reel  
MC3487DR  
MC3487NSR  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
FUNCTION TABLE  
(each driver)  
OUTPUTS  
OUTPUT  
ENABLE  
INPUT  
Y
H
L
Z
L
H
L
H
H
L
H
Z
X
Z
H = TTL high level, L = TTL low level,  
X = irrelevant, Z = High impedance  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢑꢟ  
Copyright 2004, Texas Instruments Incorporated  
ꢛ ꢟ ꢜ ꢛꢔ ꢕꢩ ꢗꢖ ꢚ ꢢꢢ ꢠꢚ ꢘ ꢚ ꢙ ꢟ ꢛ ꢟ ꢘ ꢜ ꢤ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁ ꢂꢃ ꢄꢅ  
ꢆꢇ ꢈ ꢉꢊ ꢇ ꢋꢌ ꢍ ꢉꢎ ꢏ ꢏꢍ ꢊꢍ ꢐꢑ ꢎ ꢈꢌ ꢌꢎ ꢐ ꢍ ꢉꢊ ꢎ ꢒꢍ ꢊ  
SLLS098C − MAY 1980 − REVISED FEBRUARY 2004  
logic diagram (positive logic)  
4
1
7
1,2EN  
1A  
2
3
1Y  
1Z  
6
5
2Y  
2Z  
2A  
12  
9
3,4EN  
3A  
10  
11  
3Y  
3Z  
14  
13  
15  
4Y  
4Z  
4A  
schematics of inputs and outputs  
EQUIVALENT OF EACH INPUT  
CC  
TYPICAL OF ALL OUTPUTS  
V
V
CC  
Input  
9 NOM  
Output  
2
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SLLS098C − MAY 1980 − REVISED FEBRUARY 2004  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V  
CC  
Input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V  
I
Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
O
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values, except differential output voltage, V  
, are with respect to the network ground terminal.  
OD  
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions  
MIN NOM  
MAX  
UNIT  
V
V
V
V
Supply voltage  
4.75  
2
5
5.25  
CC  
IH  
IL  
High-level input voltage  
Low-level input voltage  
Operating free-air temperature  
V
0.8  
70  
V
T
A
0
°C  
3
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ꢀ ꢁ ꢂꢃ ꢄꢅ  
ꢆꢇ ꢈ ꢉꢊ ꢇ ꢋꢌ ꢍ ꢉꢎ ꢏ ꢏꢍ ꢊꢍ ꢐꢑ ꢎ ꢈꢌ ꢌꢎ ꢐ ꢍ ꢉꢊ ꢎ ꢒꢍ ꢊ  
SLLS098C − MAY 1980 − REVISED FEBRUARY 2004  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted)  
PARAMETER  
Input clamp voltage  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
V
V
V
I = −18 mA  
−1.5  
V
V
V
IK  
I
High-level output voltage  
Low-level output voltage  
Differential output voltage  
Change in magnitude of  
differential output voltage  
Common-mode output voltage  
Change in magnitude of  
V
V
= 0.8 V,  
= 0.8 V,  
= 100 ,  
V
V
= 2 V,  
= 2 V,  
I
I
= −20 mA  
= 48 mA  
2.5  
OH  
OL  
IL  
IH  
OH  
0.5  
IL  
IH  
OL  
|V  
|
R
See Figure 1  
2
OD  
L
|V  
|
|
R
R
= 100 ,  
= 100 ,  
See Figure 1  
See Figure 1  
0.4  
3
V
V
OD  
L
L
V
OC  
|V  
R
= 100 ,  
See Figure 1  
0.4  
V
OC  
L
common-mode output voltage  
V
O
V
O
V
O
V
O
= 6 V  
100  
−100  
100  
I
Output current with power off  
V
= 0  
µA  
O
CC  
= −0.25 V  
= 2.7 V  
= 0.5 V  
I
I
High-impedance-state output current  
Output enables at 0.8 V  
V = 5.5 V  
µA  
µA  
OZ  
−100  
Input current at maximum input  
voltage  
100  
I
I
I
I
I
High-level input current  
Low-level input current  
V = 2.7 V  
50  
µA  
µA  
IH  
I
V = 0.5 V  
I
−400  
IL  
§
Short-circuit output current  
V = 2 V  
I
40 −140  
mA  
OS  
Outputs disabled  
Outputs enabled,  
105  
85  
I
Supply current (all drivers)  
mA  
CC  
No load  
|V  
| and |V  
| are the changes in magnitude of V  
OC OD  
and V , respectively, that occur when the input is changed from a high level to a low  
OC  
OD  
level.  
§
In ANSI Standard TIA/EIA-422-B, V , which is the average of the two output voltages with respect to ground, is called output offset voltage,  
OC  
V
.
OS  
Only one output at a time should be shorted, and duration of the short circuit should not exceed one second.  
switching characteristics over recommended operating free-air temperature range, V  
= 5 V  
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
20  
20  
UNIT  
t
t
t
t
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
Skew time  
PLH  
PHL  
sk  
C
= 15 pF,  
See Figure 2  
ns  
L
C
C
= 15 pF,  
= 15 pF,  
See Figure 2  
See Figure 3  
6
20  
30  
30  
25  
30  
ns  
ns  
L
L
Differential-output transition time  
Output enable time to high level  
Output enable time to low level  
Output disable time from high level  
Output disable time from low level  
t(OD)  
t
t
t
t
PZH  
PZL  
PHZ  
PLZ  
C
C
= 50 pF,  
= 50 pF,  
See Figure 4  
See Figure 4  
ns  
ns  
L
L
4
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ꢀ ꢁꢂ ꢃꢄ ꢅ  
ꢆ ꢇꢈꢉꢊ ꢇꢋꢌ ꢍ ꢉꢎ ꢏꢏ ꢍꢊ ꢍꢐꢑ ꢎꢈ ꢌ ꢌ ꢎꢐ ꢍ ꢉ ꢊꢎ ꢒ ꢍꢊ  
SLLS098C − MAY 1980 − REVISED FEBRUARY 2004  
PARAMETER MEASUREMENT INFORMATION  
50 Ω  
V
OD  
V
OC  
50 Ω  
Figure 1. Differential and Common-Mode Output Voltages  
3 V  
0 V  
1.5 V  
1.5 V  
Input  
t
PHL  
t
PLH  
V
OH  
5 V  
200 Ω  
1.5 V  
1.5 V  
Y Output  
SW1  
V
OL  
Generator  
(see Note A)  
Skew  
t
Skew  
50 Ω  
C
= 15 pF  
t
PHL  
L
PLH  
1.5 V  
(see Note B)  
V
V
OH  
3 V  
Z Output  
1.5 V  
See Note C  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
NOTES: A. The input pulse is supplied by a generator having the following characteristics: t 5 ns, t 5 ns, PRR 1 MHz, duty cycle = 50%,  
r
f
Z
C
= 50 .  
O
L
B.  
includes probe and stray capacitance.  
C. All diodes are 1N916 or 1N3064.  
Figure 2. Test Circuit and Voltage Waveforms  
3 V  
C
R
= 100 Ω  
L
L
Input  
Output  
Generator  
(see Note A)  
0 V  
t
50 Ω  
3 V  
t
t(OD)  
t(OD)  
C
= 15 pF  
L
90%  
10%  
Output  
(see Note B)  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
NOTES: A. The input pulse is supplied by a generator having the following characteristics: t 5 ns, t 5 ns, PRR 1 MHz, duty cycle = 50%,  
r
f
Z
C
= 50 .  
O
L
B.  
includes probe and stray capacitance.  
Figure 3. Test Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢆꢇ ꢈ ꢉꢊ ꢇ ꢋꢌ ꢍ ꢉꢎ ꢏ ꢏꢍ ꢊꢍ ꢐꢑ ꢎ ꢈꢌ ꢌꢎ ꢐ ꢍ ꢉꢊ ꢎ ꢒꢍ ꢊ  
SLLS098C − MAY 1980 − REVISED FEBRUARY 2004  
PARAMETER MEASUREMENT INFORMATION  
5 V  
Output  
200 Ω  
SW3  
SW1  
0 V or 3 V  
C
= 15 pF  
See Note C  
L
1 kΩ  
(see Note B)  
Generator  
(see Note A)  
50 Ω  
SW2  
TEST CIRCUIT  
Output  
Enable Input  
Output  
Enable Input  
3 V  
0 V  
3 V  
1.5 V  
1.5 V  
0 V  
t
t
PHZ  
PZL  
SW1 Closed  
SW2 Open  
V
OH  
0.5 V  
0.5 V  
SW1 Closed  
SW2 Closed  
1.5 V  
1.5 V  
Output  
Output  
Output  
Output  
V
V
OL  
t
PZH  
t
PLZ  
1.5 V  
OH  
SW1 Closed  
SW2 Closed  
1.5 V  
SW1 Open  
SW2 Closed  
V
OL  
VOLTAGE WAVEFORMS  
NOTES: A. The input pulse is supplied by a generator having the following characteristics: t 5 ns, t 5 ns, PRR 1 MHz, duty cycle = 50%,  
r
f
Z
C
= 50 .  
O
L
B.  
includes probe and stray capacitance.  
C. All diodes are 1N916 or 1N3064.  
Figure 4. Driver Test Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
MC3487D  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
16  
16  
16  
16  
16  
16  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
MC3487  
MC3487DE4  
MC3487DG4  
MC3487DR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
D
D
D
40  
Green (RoHS  
& no Sb/Br)  
0 to 70  
MC3487  
MC3487  
MC3487  
MC3487  
MC3487  
40  
Green (RoHS  
& no Sb/Br)  
0 to 70  
2500  
2500  
2500  
Green (RoHS  
& no Sb/Br)  
0 to 70  
MC3487DRE4  
MC3487DRG4  
Green (RoHS  
& no Sb/Br)  
0 to 70  
Green (RoHS  
& no Sb/Br)  
0 to 70  
MC3487J  
MC3487N  
OBSOLETE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
TBD  
Call TI  
Call TI  
-55 to 125  
0 to 70  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
MC3487N  
MC3487N  
MC3487  
MC3487  
MC3487  
MC3487NE4  
MC3487NSR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SO  
N
16  
16  
16  
16  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
0 to 70  
0 to 70  
0 to 70  
0 to 70  
NS  
NS  
NS  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
MC3487NSRE4  
MC3487NSRG4  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Apr-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
MC3487DR  
MC3487DR  
SOIC  
SOIC  
D
D
16  
16  
2500  
2500  
330.0  
330.0  
16.4  
16.4  
6.5  
6.5  
10.3  
10.3  
2.1  
2.1  
8.0  
8.0  
16.0  
16.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Apr-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
MC3487DR  
MC3487DR  
SOIC  
SOIC  
D
D
16  
16  
2500  
2500  
333.2  
367.0  
345.9  
367.0  
28.6  
38.0  
Pack Materials-Page 2  
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
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supplied at the time of order acknowledgment.  
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and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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