MCR01MRTJ750 [TI]

Tivaâ¢ C Series TM4C1294 Connected LaunchPad Evaluation Kit;


型号：	MCR01MRTJ750
厂家：	TEXAS INSTRUMENTS
描述：	Tivaâ¢ C Series TM4C1294 Connected LaunchPad Evaluation Kit
文件：	总42页 (文件大小：853K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Tiva™ C Series TM4C1294 Connected

LaunchPad Evaluation Kit

EK-TM4C1294XL

User's Guide

Literature Number: SPMU365C

March 2014–Revised October 2016

Contents

Board Overview ................................................................................................................... 4

1.1

1.2

1.3

1.4

1.5

1.6

Kit Contents................................................................................................................... 5

Using the Connected LaunchPad ......................................................................................... 5

Features....................................................................................................................... 5

BoosterPacks................................................................................................................. 6

Energīa........................................................................................................................ 6

Specifications................................................................................................................. 6

Hardware Description ........................................................................................................... 7

2.1

Functional Description ...................................................................................................... 7

2.1.1 Microcontroller....................................................................................................... 7

2.1.2 Ethernet Connectivity............................................................................................... 8

2.1.3 USB Connectivity ................................................................................................... 8

2.1.4 Motion Control....................................................................................................... 8

2.1.5 User Switches and LED's.......................................................................................... 8

2.1.6 BoosterPacks and Headers ....................................................................................... 9

Power Management........................................................................................................ 20

2.2.1 Power Supplies .................................................................................................... 20

2.2.2 Low Power Modes ................................................................................................ 21

2.2.3 Clocking ............................................................................................................ 21

2.2.4 Reset................................................................................................................ 21

Debug Interface............................................................................................................. 21

2.3.1 In-Circuit Debug Interface (ICDI)................................................................................ 21

2.3.2 External Debugger ................................................................................................ 22

2.3.3 Virtual COM Port .................................................................................................. 22

2.2

2.3

Software Development ........................................................................................................ 23

3.1

3.2

3.3

3.4

Software Description....................................................................................................... 23

Source Code ................................................................................................................ 23

Tool Options ................................................................................................................ 23

Programming the Connected LaunchPad............................................................................... 24

References, PCB Layout, and Bill of Materials ....................................................................... 25

4.1

4.2

4.3

References .................................................................................................................. 25

Component Locations ..................................................................................................... 26

Bill of Materials ............................................................................................................. 27

Schematic ......................................................................................................................... 30

Revision History.......................................................................................................................... 31

Contents

SPMU365C–March 2014–Revised October 2016

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List of Figures

1-1. Tiva C Series Connected LaunchPad Evaluation Board ............................................................... 4

2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram ........................................................ 7

2-2. Default Jumper Locations ................................................................................................. 20

4-1. Connected LaunchPad Dimensions and Component Locations ..................................................... 26

List of Tables

1-1. EK-TM4C1294XL Specifications........................................................................................... 6

2-1. BoosterPack 1 GPIO and Signal Muxing ................................................................................. 9

2-2. BoosterPack 2 GPIO and Signal Muxing ............................................................................... 12

2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing .......................................... 16

2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing ......................................... 17

4-1. Connected LaunchPad Bill of Materials ................................................................................. 27

SPMU365C–March 2014–Revised October 2016

List of Figures

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Chapter 1

SPMU365C–March 2014–Revised October 2016

Board Overview

The Tiva™ C Series TM4C1294 Connected LaunchPad Evaluation Board (EK-TM4C1294XL) is a low-cost

evaluation platform for ARM® Cortex™-M4F-based microcontrollers. The Connected LaunchPad design

highlights the TM4C1294NCPDT microcontroller with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0,

hibernation module, motion control pulse-width modulation and a multitude of simultaneous serial

connectivity. The Connected LaunchPad also features two user switches, four user LEDs, dedicated reset

and wake switches, a breadboard expansion option and two independent BoosterPack XL expansion

connectors. The pre-programmed quickstart application on the Connected LaunchPad also enables

remote monitoring and control of the evaluation board from an internet browser anywhere in the world.

The web interface is provided by 3rd party, Exosite. Each Connected LaunchPad is enabled on the

Exosite platform allowing users to create and customize their own Internet-of-Things applications.

Figure 1-1 shows a photo of the Connected LaunchPad with key features highlighted.

Figure 1-1. Tiva C Series Connected LaunchPad Evaluation Board

Tiva is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Board Overview

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Kit Contents

1.1 Kit Contents

The Connected LaunchPad Evaluation Kit contains the following items:

•

Tiva™ C Series TM4C1294 Evaluation Board (EK-TM4C1294XL)

Retractable Ethernet cable

USB Micro-B plug to USB-A plug cable

README First document

1.2 Using the Connected LaunchPad

The recommended steps for using the Connected LaunchPad Evaluation Kit are:

1. Follow the README First document included in the kit. The README First helps you get the

Connected LaunchPad up and running in minutes. Within just a few minutes you can be controlling and

monitoring the Connected LaunchPad through the internet using Exosite and the pre-programmed

quickstart application.

2. Experiment with BoosterPacks. This evaluation kit conforms to the latest revision of the BoosterPack

pinout standard. It has two independent BoosterPack connections to enable a multitude of expansion

opportunities.

3. Take the first step towards developing your own applications. The Connected LaunchPad is

supported by TivaWare for C Series. After installing TivaWare, look in the installation directory for

examples\boards\ek-tm4c1294xl. You can find pre-configured example applications for this board as

well as for this board with selected BoosterPacks. Alternately, use Energīa for a wiring framework-

based cross-platform, fast-prototyping environment that works with this and other TI LaunchPads. See

Chapter 3 of this document for more details about software development. TivaWare can be

downloaded from the TI website at http://www.ti.com/tool/sw-tm4c. Energīa can be found at

http://energia.nu.

4. Customize and integrate the hardware to suit your end application. This evaluation kit can be

used as a reference for building your own custom circuits based on Tiva C microcontrollers or as a

foundation for expansion with your custom BoosterPack or other circuit. This manual can serve as a

starting point for this endeavor.

5. Get Trained. You can also download hours of written and video training materials on this and related

LaunchPads. Visit the Tiva C Series LaunchPad Workshop Wiki for more information.

6. More Resources. See the TI MCU LaunchPad web page for more information and available

BoosterPacks. (http://www.ti.com/tiva-c-launchpad)

1.3 Features

Your Connected LaunchPad includes the following features:

•

Tiva TM4C1294NCPDTI microcontroller

Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY Motion Control PWM

USB 2.0 Micro A/B connector

4 user LEDs

2 user buttons

1 independent hibernate wake switch

1 independent microcontroller reset switch

Jumper for selecting power source:

–

ICDI USB

USB Device

BoosterPack

•

Preloaded Internet-of-Things Exosite quickstart application

I/O brought to board edge for breadboard expansion

Two independent BoosterPack XL standard connectors featuring stackable headers to maximize

expansion through BoosterPack ecosystem

SPMU365C–March 2014–Revised October 2016

Board Overview

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BoosterPacks

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–

For a complete list of BoosterPacks, see the TI MCU LaunchPad web page:

http://www.ti.com/launchpad

1.4 BoosterPacks

The Connected LaunchPad provides an easy and inexpensive way to develop applications with the

TM4C1294NCPDTI microcontroller. BoosterPacks are add-on boards that follow a pin-out standard

created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the

peripherals and potential applications that you can easily explore with the Connected LaunchPad.

You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas

Instruments even helps you promote your BoosterPack to other members of the community. TI offers a

variety of avenues for you to reach potential customers with your solutions.

1.5 Energīa

Energīa is an open-source electronics prototyping platform started in January of 2012 with the goal of

bringing the Wiring and Arduino framework to the TI LaunchPad community. Energīa includes an

integrated development environment (IDE) that is based on Processing.

Together with Energīa, LaunchPads can be used to develop interactive objects, taking inputs from a

variety of switches or sensors, and controlling a variety of lights, motors, and other physical outputs.

LaunchPad projects can be stand-alone (only run on the target board, i.e. your LaunchPad), or they can

communicate with software running on your computer (Host PC). Energīa projects are highly portable

between supported LaunchPad platforms. Projects written for your Connected LaunchPad can be run on

other LaunchPads with little or no modifications.

More information is available at http://energia.nu.

1.6 Specifications

Table 1-1 summarizes the specifications for the Connected LaunchPad.

Table 1-1. EK-TM4C1294XL Specifications

Parameter

Value

4.75 V_DCto 5.25 V_DCfrom one of the following sources:

•

Debug USB U22 (ICDI) USB Micro-B cable connected to PC or other compatible

power source.

•

Target USB (U7) USB Micro-B cable connected to PC or other compatible power

source.

Board Supply Voltage

•

BoosterPack 1 (X8-4)

BoosterPack 2 (X6-4)

Breadboard expansion header (X11-2 or X11-97).

See schematic symbol JP1 for power input selection.

Dimensions

Break-out Power Output

RoHS Status

4.9 in x 2.2 in x .425 in (12.45 cm x 5.59 cm x 10.8 mm) (L x W x H)

•

5 V_DCto BoosterPacks, current limited by TPS2052B. Nominal rating 1 Amp.

Board input power supply limitations may also apply.

3.3 V_DCto BoosterPacks, limited by output of TPS73733 LDO. This 3.3-V plane is

shared with on-board components. Total output power limit of TPS73733 is 1

Amp.

Compliant

Board Overview

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Chapter 2

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Hardware Description

The Connected LaunchPad includes a TM4C1294NCPDTI microcontroller with an integrated 10/100

Ethernet MAC and PHY. This advanced ARM® Cortex™ M4F MCU has a wide range of peripherals that

are made available to users via the on-board accessories and the BoosterPack connectors. This chapter

explains how those peripherals operate and interface to the microcontroller.

Figure 2-1 provides a high-level block diagram of the Connected LaunchPad.

Figure 2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram

2.1 Functional Description

2.1.1 Microcontroller

The TM4C1294NCPDTI is a 32-bit ARM Cortex-M4F based microcontroller with 1024-kB Flash memory,

256-kB SRAM, 6-kB EEPROM, and 120 MHz operation; integrated 10/100 Ethernet MAC and PHY;

integrated USB 2.0 connectivity with external high-speed USB 3.0 PHY capability; a hibernation module, a

multitude of serial connectivity and motion control PWM; as well as a wide range of other peripherals. See

the TM4C1294NCPDTI microcontroller data sheet for more complete details.

Most of the microcontroller’s signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder

pads. An internal multiplexor allows different peripheral functions to be assigned to each of these GPIO

pads. When adding external circuitry, consider the additional load on the evaluation board power rails.

The TM4C1294NCPDTI microcontroller is factory-programmed with a quickstart demo program. The

quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the

quickstart application has been replaced with a user program. The quickstart application automatically

connects to http://ti.exosite.com when an internet connection is provided through the RJ45 Ethernet jack

on the evaluation board.

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2.1.2 Ethernet Connectivity

The Connected LaunchPad is designed to connect directly to an Ethernet network using RJ45 style

connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration

creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for both the

uIP and LwIP TCP/IP protocol stacks. The embedded Ethernet on this device can be programmed to act

as an HTTP server, client or both. The design and integration of the circuit and microcontroller also enable

users to synchronize events over the network using the IEEE1588 precision time protocol.

When configured for Ethernet operation, it is recommended that the user configure LED D3 and D4 to be

controlled by the Ethernet MAC to indicate connection and transmit/receive status.

2.1.3 USB Connectivity

The Connected LaunchPad is designed to be USB 2.0 ready. A TPS2052B load switch is connected to

and controlled by the microcontroller USB peripheral, which manages power to the USB micro A/B

connector when functioning in a USB host. When functioning as a USB device, the entire Connected

LaunchPad can be powered directly from the USB micro A/B connector. Use JP1 to select the desired

power source.

USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B

connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB

external PHY control and data signals are provided on the breadboard expansion header X11.

2.1.4 Motion Control

The Connected LaunchPad includes the Tiva C Series Motion Control PWM technology, featuring a PWM

module capable of generating eight PWM outputs. The PWM module provides a great deal of flexibility

and can generate simple PWM signals – for example, those required by a simple charge pump – as well

as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three

generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter

bridge.

A quadrature encoder interface (QEI) is also available to provide motion control feedback.

See the BoosterPacks and Headers section of this document for details about the availability of these

signals on the BoosterPack interfaces.

2.1.5 User Switches and LED's

Two user switches are provided for input and control of the TM4C1294NCPDTI software. The switches

are connected to GPIO pins PJ0 and PJ1.

A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the

microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset

signal to the BoosterPack and Breadboard headers. The wake switch is one way to bring the device out of

hibernate mode.

Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These

LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and

PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller.

A power LED is also provided to indicate that 3.3 volt power is present on the board.

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Functional Description

2.1.6 BoosterPacks and Headers

2.1.6.1 BoosterPack 1

The Connected LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack 1, located around the ICDI portion of the

board, is fully compliant with the BoosterPack standard with the single exception of GPIO pin PA6 (X8-16), which does not provide analog

capability. PA6 is located near the bottom of the inner left BoosterPack XL header.

I2C is provided in both the original BoosterPack standard configuration as well as the updated standard location. Use of I2C on the bottom left of

the BoosterPack connections per the updated standard is highly encouraged whenever possible.

Motion control advanced PWM connections are provided on the inner right connector for motion control applications.

Table 2-1 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available on each pin. The TM4C1294NCPDTI

GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’

and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins.

Table 2-1. BoosterPack 1 GPIO and Signal Muxing

Digital Function (GPIOPCTL Bit Encoding)

Standard

Function

MCU

Header Pin

GPIO

Analog

+3.3 volts

Analog

UART RX

UART TX

GPIO

3.3V

PE4

PC4

PC5

PC6

PE5

PD3

PC7

PB2

PB3

123

124

AIN9

C1-

C1+

C0+

AIN8

AIN12

C0-

U1RI

SSI1XDAT0

EPI0S7

U7Rx

U7Tx

RTCCLK

EPI0S6

U5Rx

EPI0S5

Analog

SPI CLK

GPIO

SSIXDAT1

SSI2CLk

EPI0S4

I2C8SDA T1CCP1

U5Tx

I2C SCL

I2C SDA

+5 volts

ground

Analog

A out

I2C0SCL T5CCP0

I2C0SDA T5CCP1

USB0STP

USB0CLK

EPI0S27

EPI0S28

GND

PE0

PE1

PE2

PE3

PD7

PA6

PM4

PM5

128

AIN3

AIN2

AIN1

AIN0

AIN4

U1RTS

U1DSR

U1DCD

U1DTR

U2CTS

U2Rx

T4CCP1 USB0PFLT

NMI

SSI2XDAT2

I2C6SCL T3CCP0 USB0EPEN

SSI0XDAT2

EPI0S8

TMPR3

TMPR2

U0CTS

U0DCD

T4CCP0

T4CCP1

A out

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Table 2-1. BoosterPack 1 GPIO and Signal Muxing (continued)

Digital Function (GPIOPCTL Bit Encoding)

Standard

Function

MCU

Header Pin

GPIO

Analog

PWM

PF1

PF2

PF3

PG0

PL4

PL5

PL0

PL1

PL2

PL3

EN0LED2

M0PWM1

SSI3XDAT0

SSI3Fss

SSI3Clk

TRD1

M0PWM2

TRD0

PWM

M0PWM3

TRCLK

EPI0S11

EPI0S26

EPI0S33

EPI0S16

EPI0S17

EPI0S18

EPI0S19

PWM

I2C1SCL

EN0PPS

M0PWM4

Capture

GPIO

T0CCP0

USB0D4

USB0D5

USB0D0

USB0D1

USB0D2

USB0D3

T0CCP1

I2C2SDA

M0FAULT3

GPIO

I2C2SCL

PhA0

GPIO

C0o

C1o

PhB0

GPIO

IDX0

ground

PWM

GND

PM3

PH2

PH3

T3CCP1

EPI0S12

EPI0S2

EPI0S3

GPIO

U0DCD

U0DSR

GPIO

reset

RESET

SPI MOSI

SPI MISO

GPIO

PD1

PD0

PN2

PN3

PP2

AIN14

I2C7SDA T0CCP1

I2C7SCL T0CCP0

C1o

SSI2XDAT0

SSI2XDAT1

EPI0S29

AIN15

C0o

109

110

103

U1DCD

U1DSR

U0DTR

U2RTS

U2CTS

GPIO

EPI0S30

GPIO

USB0NXT

EPI0S29

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2.1.6.2 BoosterPack 2

The second BoosterPack XL interface is located near the middle of the board. This interface is fully compliant with the BoosterPack standard, and

adds features not covered by the BoosterPack standard that enable operation with additional BoosterPacks.

An additional analog signal is provided on the outer left header (X6-9). This signal can be used to monitor the touch panel on the popular Kentec

EB-LM4F120-L35 BoosterPack.

Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can be optionally routed to the BoosterPack 2

interface. The location of these signals is consistent with the CAN interface on the Tiva C Series TM4C123G LaunchPad and the Stellaris

LM4F120 LaunchPad. In the default configuration, UART0 is used for the ICDI virtual UART and CAN is not present on the BoosterPack headers.

In this configuration, the ROM serial bootloader can be used over the ICDI virtual UART. When the jumpers are configured for CAN on the

BoosterPack, then UART2 must be used for the ICDI virtual UART.

To comply with both the original and the new BoosterPack standard, I2C is provided on both sides of the BoosterPack connection. Use of I2C on

the bottom left of the BoosterPack connection is highly encouraged where possible, to be in compliance with the new BoosterPack standard. To

provide I2C capability on the right side of the connector, per the original standard, two zero-ohm resistors (R19 and R20) are used to combine the

SPI and I2C signals. These signals are not shared with any other pins on the LaunchPad and therefore removal of these zero-ohm resistors

should not be required. Software should be certain that unused GPIO signals are configured as inputs.

Table 2-2 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available at each pin. The TM4C1294NCPDT

GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’

and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins.

Table 2-2. BoosterPack 2 GPIO and Signal Muxing

Digital Function (FPIOPCTL Bit Encoding)

Standard

Function

MCU

Header Pin

GPIO

Analog

3.3V

Analog

PD2

PP0

PP1

PD4

PA0

PD5

PA1

PQ0

PP4

PN5

PN4

AIN13

I2C8SCL T1CCP0

C2o

SSI2Fss

SSI3XDAT2

SSI3XDAT3

SSI1XDAT2

UART RX

UART TX

118

119

125

C2+

U6Rx

U6Tx

U2Rx

U0Rx

U2Tx

U0Tx

C2-

AIN7

T3CCP0

GPIO

(See JP4)

I2C9SCL T0CCP0

T3CCP1

I2C9SDA T0CCP1

CANORx

126

AIN6

SSI1XDAT3

Analog

(See JP5)

CAN0Tx

SPI CLK

GPIO

SSI3Clk

EPI0S20

105

112

111

U3RTS

U1RI

U1DTR

U0DSR

USB0D7

I2C SCL

I2C SDA

U3CTS I2C2SCL

U3RTS I2C2SDA

EPIO0S35

EPIO0S34

GND

Analog

PB4

121

AIN10

U0CTS I2C5SCL

SSI1Fss

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Table 2-2. BoosterPack 2 GPIO and Signal Muxing (continued)

Digital Function (FPIOPCTL Bit Encoding)

Standard

Function

MCU

Header Pin

GPIO

Analog

A out

PB5

PK0

PK1

PK2

PK3

PA4

PA5

PG1

PK4

PK5

PM0

PM1

PM2

PH0

PH1

PK6

PK7

120

AIN11

U0RTS I2C5SDA

SSI1Clk

EPI0S0

AIN16

U4Rx

AIN17

U4Tx

EPI0S1

AIN18

U4RTS

EPI0S2

AIN19

u4CTS

EPI0S3

U3Rx

I2C7SCL T2CCP0

I2C7SDA T2CCP1

SSI0XDAT0

SSI0XDAT1

EPI0S10

EPI0S32

EPI0S31

EPI0S15

EPI0S14

EPI0S13

EPI0S0

A out

U3Tx

PWM

I2C1SDA

M0PWM5

PWM

I2C3SCL

EN0LED0

M0PWM6

PWM

I2C3SDA

EN0LED2

M0PWM7

PWM

T2CCP0

Capture

GPIO

T2CCP1

T3CCP0

U0RTS

U0CTS

GPIO

EPI0S1

GPIO

I2C4SCL

I2C4SDA

EN0LED1 M0FAULT1

RTCCLK M0FAULT2

GND

EPI0S25

EPI0S24

GPIO

U0RI

PWM

GPIO

PM7

PP5

PA7

106

TMPR0

U0RI

T5CCP1

U3CTS I2C2SDL

USB0D6

U2Tx

I2C6SDA T3CCP1 USB0PFLT

USB0EPEN SSI0XDAT3

EPI0S9

RESET

SPI MOSI PQ2

I2C PA3

SPI MISO PQ3

104

U4Tx

SSI3XDAT0

EPI0S22

SSI0Fss

EPI0S23

SSI0Clk

EPI0S30

EPI0S21

I2C8SDA T1CCP1

SSI3XDAT1

I2C

PA2

PP3

PQ1

PM6

U4Rx

U1CTS

I2C8SCL T1CCP0

GPIO

U0DCD

USB0DIR

SSI3Fss

TMPR1 U0DSR

T5CCP0

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2.1.6.3 Breadboard Connection

The breadboard adapter section of the board is a set of 98 holes on a 0.1 inch grid. Properly combined

with a pair of right angle headers, the entire Connected LaunchPad can be plugged directly into a

standard 300 mil (0.3 inch) wide solder-less breadboard. The right angle headers and breadboard are not

provided with this kit. Suggested part numbers are Samtec TSW-149-09-L-S-RE and TSW-149-08-L-S-RA

right angle pin headers and Twin industries TW-E40-1020 solder-less breadboard. Samtec TSW-149-09-

F-S-RE and TSW-149-09-F-S-RA may be substituted.

A detailed explanation of how to install the headers is available on the TI LaunchPad Wiki or at

http://users.ece.utexas.edu/~valvano/EE345L/Labs/Fall2011/LM3S1968soldering.pdf.

Nearly all microcontroller signals are made available at the breadboard adapter holes (X11). These signals

are grouped by function where possible. For example, all EPI signals are grouped on one side of the

connector. Many of the analog signals are grouped near VREF, and UART, SSI and I2C signals are

grouped by peripheral to make expansion and customization simpler.

Table 2-3 and Table 2-4 show the GPIO pin and signal muxing for the X11 breadboard adapter pads.

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Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing

Digital Function (GPIOPCTL Bit Encoding)

MCU

Port

Analog

3V3

GND

PB4

PB5

PH0

PH1

PH2

PH3

PC7

PC6

PC5

PC4

PA6

PA7

PG1

PG0

PM3

121

120

AIN10

U0CTS

U0RTS

U0CTS

U0DCD

U0DSR

U5Tx

U5Rx

U7Tx

U7Rx

U2Rx

U2Tx

I2C5SCL

SSI1Fss

SSI1Clk

EPI0S0

EPI0S1

EPI0S2

EPI0S3

EPI0S4

EPI0S5

EPI0S6

EPI0S7

EPI0S8

EPI0S9

EPI0S10

EPI0S11

EPI0S12

AIN11

I2C5SDA

C0-

C0+

C1+

RTCCLK

C1-

I2C6SCL

I2C6SDA

I2C1SDA

I2C1SCL

T3CCP0

USB0EPEN

SSI0XDAT2

T3CCP1

USB0PFLT

USB0EPEN SSI0XDAT3

M0PWM5

EN0PPS

M0PWM4

T3CCP1

GND

PM2

PM1

PM0

PL0

PL1

PL2

PL3

PQ0

PQ1

PQ2

PQ3

PK7

T3CCP0

EPI0S13

EPI0S14

EPI0S15

EPI0S16

EPI0S17

EPI0S18

EPI0S19

EPI0S20

EPI0S21

EPI0S22

EPI0S23

EPI0S24

T2CCP1

T2CCP0

I2C2SDA

M0FAULT3

USB0D0

USB0D1

USB0D2

USB0D3

SSI3Clk

SSI3Fss

SSI3XDAT0

SSI3XDAT1

I2C2SCL

PhA0

C0o

PhB0

C1o

IDX0

U0RI

I2C4SDA

GND

M0FAULT1

PK6

PL4

I2C4SCL

EN0LED1

EPI0S25

EPI0S26

T0CCP0

USB0D4

Hardware Description

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Functional Description

Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing (continued)

Digital Function (GPIOPCTL Bit Encoding)

MCU

Port

Analog

I2C0SCL

I2C0SDA

PB2

PB3

PP2

PP3

PK5

PK4

PL5

PN4

PN5

PN0

PN1

PN2

PN3

PQ4

T5CCP0

USB0STP

EPI0S27

EPI0S28

EPI0S29

EPI0S30

EPI0S31

EPI0S32

EPI0S33

EPI0S34

EPI0S35

T5CCP1

USB0CLK

103

104

U0DTR

U1CTS

USB0NXT

U0DCD

I2C3SDA

I2C3SCL

RTCCLK

USB0DIR

EN0LED2

M0PWM7

EN0LED0

M0PWM6

T0CCP1

USB0D5

111

112

107

108

109

110

102

U1DTR

U1RI

U1RTS

U1CTS

U1DCD

U1DSR

U1Rx

U3RTS

U3CTS

I2C2SDA

I2C2SCL

U2RTS

U2CTS

EPI0S29

EPI0S30

DIVSCLK

WAKE

Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing

Digital Function (GPIOPCTL Bit Encoding)

MCU

Port

Analog

GND

PA2

PA3

PA4

PA5

PE0

PE1

PE2

PE3

PE4

PE5

U4Rx

U4Tx

I2C8SCL

T1CCP0

SSI0Clk

I2C8SDA

T1CCP1

SSI0Fss

U3Rx

U3Tx

I2C7SCL

T2CCP0

SSI0XDAT0

I2C7SDA

T2CCP1

SSI0XDAT1

AIN3

AIN2

AIN1

AIN0

AIN9

AIN8

U1RTS

U1DSR

U1DCD

U1DTR

U1RI

123

124

SSI1XDAT0

SSI1XDAT1

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Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued)

Digital Function (GPIOPCTL Bit Encoding)

Analog

MCU

Port

PK0

PK1

PK2

PK3

AIN16

AIN17

AIN18

AIN19

U4Rx

U4Tx

EPI0S0

EPI0S1

EPI0S2

EPI0S3

U4RTS

U4CTS

VREF

GND

PD5

PD4

PD7

PD6

PD3

PD1

PD0

PD2

PP0

PP1

PB0

PB1

126

125

128

127

AIN6

AIN7

U2Tx

U2Rx

U2CTS

U2RTS

T3CCP1

T3CCP0

T4CCP1

T4CCP0

T1CCP1

T0CCP1

T0CCP0

T1CCP0

SSI1XDAT3

SSI1XDAT2

SSI2XDAT2

SSI2XDAT3

SSI2Clk

AIN4

USB0PFLT

NMI

AIN5

USB0EPEN

AIN12

AIN14

AIN15

AIN13

C2+

I2C8SDA

I2C7SDA

I2C7SCL

I2C8SCL

C1o

SSI2XDAT0

SSI2XDAT1

SSI2Fss

C0o

C2o

118

119

U6Rx

U6Tx

U1Rx

U1Tx

SSI3XDAT2

SSI3XDAT3

C2-

USB0ID

USB0VBUS

I2C5SCL

I2C5SDA

T4CCP0

T4CCP1

CAN1Rx

CAN1Tx

GND

PF4

PF0

PF1

PF2

PF3

PA0

PA1

PP4

PP5

PJ0

PJ1

PM7

PM6

PM5

EN0LED1

M0FAULT0

SSI3XDAT2

TRD3

EN0LED0

M0PWM0

SSI3XDAT1

TRD2

EN0LED2

M0PWM1

SSI3XDAT0

TRD1

M0PWM2

SSI3Fss

TRD0

M0PWM3

SSI3Clk

TRCLK

U0Rx

U0Tx

U3RTS

U3CTS

U3Rx

U3Tx

U0RI

U0DSR

U0DCD

I2C9SCL

T0CCP0

CAN0Rx

I2C9SDA

T0CCP1

CAN0Tx

105

106

116

117

U0DSR

USB0D7

I2C2SCL

USB0D6

TMPR0

TMPR1

TMPR2

T5CCP1

T5CCP0

T4CCP1

Hardware Description

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Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued)

Digital Function (GPIOPCTL Bit Encoding)

Analog

MCU

Port

PM4

TMPR3

U0CTS

T4CCP0

RESET

GND

3V3

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2.1.6.4 Other Headers and Jumpers

JP1 is provided to select the power input source for the Connected LaunchPad. The top position is for

BoosterPack power; this position also disconnects both USB voltages from the board’s primary 5-volt

input. In the top position, the TPS2052B does not limit current so additional care should be exercised. The

middle position draws power from the USB connector on the left side of the board near the Ethernet jack.

The bottom position is the default, in which power is drawn from the ICDI (Debug) USB connection.

JP2 separates the MCU 3.3-volt power domain from the rest of the 3.3-volt power on the board allowing

an ammeter to be used to obtain more accurate measurements of microcontroller power consumption.

JP3 isolates the output of the TPS73733 LDO from the board’s 3.3-V power domain.

JP4 and JP5 are used to configure CAN signals to the BoosterPack 2 interface. In the default horizontal

configuration, CAN is not present on the BoosterPack. UART2 goes to the BoosterPack and UART 0 goes

to the ICDI virtual serial port to provide ROM serial bootloader capability. In the vertical CAN-enabled

configuration, UART2 goes to the ICDI virtual serial port and CAN signals are available on the

BoosterPack. The ROM serial bootloader is not available to the ICDI virtual serial port while the jumpers

are in the CAN position.

Figure 2-2 shows the default configuration and relative location of the jumpers on the board.

Figure 2-2. Default Jumper Locations

2.2 Power Management

2.2.1 Power Supplies

The Connected LaunchPad can be powered from three different input options:

•

On-board ICDI USB cable (Debug, Default)

Target USB cable

BoosterPack or Breadboard adapter connection

The JP1 power-select jumper is used to select one of the power sources.

In addition, the JP3 power jumper can be used to isolate the 3.3-volt output of the TPS73733 from the

board’s 3.3-volt rail.

A TPS2052B load switch is used to regulate and control power to the Target USB connector when the

microcontroller is acting in USB host mode. This load switch also limits current to the BoosterPack and

Breadboard adapter headers when the JP1 jumper is in the ICDI position.

Hardware Description

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Power Management

2.2.2 Low Power Modes

The Connected LaunchPad demonstrates several low power microcontroller modes. In run mode, the

microcontroller can be clocked from several sources such as the internal precision oscillator or an external

crystal oscillator. Either of these sources can then optionally drive an internal PLL to increase the effective

frequency of the system up to 120 MHz. In this way, the run mode clock speed can be used to manage

run mode current consumption.

The microcontroller also provides sleep and deep sleep modes and internal voltage adjustments to the

flash and SRAM to further refine power consumption when the processor is not in use but peripherals

must remain active. Each peripheral can be individually clock gated in these modes so that current

consumption by unused peripherals is minimized. A wide variety of conditions from internal and external

sources can trigger a return to run mode.

The lowest power setting of the microcontroller is hibernation, which requires a small amount of supporting

external circuitry available on the Connected LaunchPad. The Connected LaunchPad can achieve

microcontroller current consumption modes under 2 micro-Amps using hibernate VDD3ON mode.

Hibernation with VDD3ON mode is not supported on this board. The Connected LaunchPad can be woken

from hibernate by several triggers including the dedicated wake button, the reset button, an internal RTC

timer and a subset of the device GPIO pins. The hibernation module provides a small area of internal

SRAM that can preserve data through a hibernate cycle.

2.2.3 Clocking

The Connected LaunchPad uses a 25 MHz crystal (Y1) to drive the main TM4C1294NCPDTI internal

clock circuit. Most software examples use the internal PLL to multiply this clock to higher frequencies up to

120 MHz for core and peripheral timing. The 25-MHz crystal is required when using the integrated

Ethernet MAC and PHY.

The Hibernation module is clocked from an external 32.768-KHz crystal (Y3).

2.2.4 Reset

The RESET signal to the TM4C1294NCPDTI microcontroller connects to the RESET switch, BoosterPack

connectors, Breadboard adapter and to the ICDI circuit for a debugger-controller reset.

External reset is asserted (active low) under the following conditions:

•

Power-on reset (filtered by and R-C network)

RESET switch is held down.

By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be

supported by all debuggers)

•

By an external circuit attached to the BoosterPack or Breadboard connectors.

2.3 Debug Interface

2.3.1 In-Circuit Debug Interface (ICDI)

The Connected LaunchPad comes with an on-board ICDI. The ICDI allows for the programming and

debugging of the TM4C1294NCPDTI using LM Flash Programmer and/or any of the supported tool

chains. Note that ICDI only supports JTAG debugging at this time. It is possible to use other JTAG

emulators instead of the on board ICDI, by connecting to U6. When the ICDI detects an external debug

adapter connection on the JTAG connector U6 and disables the ICDI outputs to allow the external debug

adapter to drive the debug circuit. For more information, see Section 2.3.2.

Debug out of the ICDI is possible by removing resistors R6, R7, R8, R10, R11, R15, R16 and R40 from

the Connected LaunchPad and use the ICDI to drive JTAG signals out on U6 for the purpose of

programming or debugging other boards. To restore the connection to the on-board TM4C1294NCPDTI

microcontroller, install jumpers from the odd to even pins of X1 or re-install the resistors. Removal of R40

disables the detection of an attached external debugger. R40 must be installed to use an external debug

adapter to program or debug the Connected LaunchPad.

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2.3.2 External Debugger

The connector U6 is provided for the attachment of an external debug adapter such as the IAR J-Link or

Keil ULINK. This connector follows the ARM standard 10-pin JTAG pinout. This interface can use either

JTAG or SWD if supported by the external debug adapter.

2.3.3 Virtual COM Port

When plugged into a USB host, the ICDI enumerates as both a debugger and a virtual COM port. JP4 and

JP5 control the selection of which UART from the TM4C1294NCPDTI is connected to the virtual COM

port. In the default configuration, UART0 maps to the virtual COM port of the ICDI. In the CAN jumper

configuration, UART2 maps to the virtual COM port of the ICDI.

Hardware Description

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Chapter 3

SPMU365C–March 2014–Revised October 2016

Software Development

This chapter provides general information on software development as well as instructions for flash

memory programming.

3.1 Software Description

The TivaWare software provides drivers for all of the peripheral devices supplied in the design. The Tiva C

Series Peripheral Driver Library is used to operate the on-chip peripherals as part of TivaWare.

TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These

applications demonstrate the capabilities of the TM4C1294NCPDTI microcontroller, as well as provide a

starting point for the development of the final application for use on the Connected LaunchPad evaluation

board. Example applications are also provided for the Connected LaunchPad when paired with selected

BoosterPacks.

3.2 Source Code

The complete source code including the source code installation instructions are provided at

http://www.ti.com/tool/sw-tm4c. The source code and binary files are installed in the TivaWare software

tree.

3.3 Tool Options

The source code installation includes directories containing projects, makefiles, and binaries for the

following tool-chains:

•

Keil ARM RealView^®Microcontroller Development System

IAR Embedded Workbench for ARM

Sourcery Codebench

Generic GNU C Compiler

Texas Instruments' Code Composer Studio™ IDE

Download evaluation versions of these tools from the Tools & Software section of www.ti.com/tiva. Due to

code size restrictions, the evaluation tools may not build all example programs. A full license is necessary

to re-build or debug all examples.

For detailed information on using the tools, see the documentation included in the tool chain installation or

visit the website of the tools supplier.

SPMU365C–March 2014–Revised October 2016

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3.4 Programming the Connected LaunchPad

The Connected LaunchPad software package includes pre-built binaries for each of the example

applications. If you installed the TivaWare™ software to the default installation path of

C:\ti\TivaWare_C_Series_<version>, you can find the example applications in C:\ti\TivaWare_C_Series-

<version>\examples\boards\ek-tm4c129xl. The on-board ICDI is used with the LM Flash Programmer tool

to program applications on the Connected LaunchPad.

Follow these steps to program example applications into the Connected LaunchPad evaulation board

using the ICDI:

1. Install LM Flash Programmer on a PC running Microsoft Windows.

2. Place JP1 into the ICDI position on the Connected LaunchPad.

3. Connect the USB-A cable plug in to an available USB port on the PC and plug the Micro-B plug to the

Debug USB port (U22) on the Connected LaunchPad.

4. Verify that LED D0 at the top of the board is illuminated.

5. Install Windows ICDI and Virtual COM Port drivers if prompted. Installation instructions can be found at

http://www.ti.com/lit/pdf/spmu287.

6. Run the LM Flash Programmer application on the PC.

7. In the Configuration tap, use the Quick Set control to select “TM4C1294XL LaunchPad”.

8. Move to the Program tab and click the Browse button. Navigate to the example applications directory

(the default location is C:\ti\TivaWare_C_Series_<version>\examples\boards\ek-tm4c1294xl\)

9. Each example application has its own directory. Navigate to the example directory that you want to

load and then into the sub-directory for one of the supported tool chains which contains the binary

(*.bin) file. Select the binary file and click Open.

10. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check

Reset MCU After Program. The example program starts execution once the verify process is complete.

Software Development

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Chapter 4

SPMU365C–March 2014–Revised October 2016

References, PCB Layout, and Bill of Materials

4.1 References

In addition to this document the following references are available for download at www.ti.com.

•

TivaWare for C Series (http://www.ti.com/tool/sw-tm4c)

TivaWare Peripheral Driver Library Users' Guide (literature number SPMU298)

EK-TM4C1294XL Getting Started Guide (literature number SPMZ858)

LM Flash Programmer Tool (http://www.ti.com/lmflashprogrammer)

TPS73733 Low-Dropout Regulator with Reverse Current Protection

(http://www.ti.com/product/tps79733)

•

Texas Instruments Code Composer Studio website (http://www.ti.com/ccs)

Tiva C Series TM4C1294NCPDT Microcontroller Data Sheet (http://www.ti.com/lit/gpn/tm4c1294ncpdt)

Build Your Own BoosterPack information regarding the BoosterPack standard (http://www.ti.com/byob)

ICDI Driver Installation Guide (literature number SPMU287)

Additional Support:

•

Keil RealView MDK-ARM (http://www.keil.com/arm/mdk.asp)

IAR Embedded Workbench for ARM (http://iar.com/ewarm/)

Sourcery CodeBench development tools (http://www.mentor.com/embedded-software/sourcery-

tools/sourcery-codebench/overview)

•

Exosite (http://ti.exosite.com)

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Component Locations

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4.2 Component Locations

Figure 4-1 is a dimensioned drawing of the Connected LaunchPad. This figure shows the location of

selected features of the board as well as the component locations.

Figure 4-1. Connected LaunchPad Dimensions and Component Locations

References, PCB Layout, and Bill of Materials

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Bill of Materials

4.3 Bill of Materials

Table 4-1 is the Connected LaunchPad bill of materials list.

Table 4-1. Connected LaunchPad Bill of Materials

Item

Ref

Qty

Description

Mfg

Part Number

Capacitor, 1000pF, 2kV,

20%, X7R, 1210

Kemet

C1210C102MGRACTU

C3, C4, C5, C10, C11, C12,

C13, C16, C17, C18, C19,

C21, C22, C23, C24, C25,

C26, C27, C28, C29, C30,

C40, C41, C42, C43, C46

Capacitor, 0.1uF 16V,

10%,0402 X7R

Taiyo Yuden

EMK105B7104KV-F

Capacitor, 4700pF, 2kV,

10%,X7R, 1812

C31

AVX

TDK

1812GC472KAT1A

C1608X7R1H332K

Capacitor, 3300pF, 50V,

10%, X7R, 0603

C32, C33

C6, C14

Capacitor, 1uF , X5R, 10V,

Low ESR, 0402

Johanson

Dielectrics Inc

100R07X105KV4T

Capacitor, 2.2uF, 16V,

10%, 0603, X5R

C7, C15, C20

Murata

GRM188R61C225KE15D

GRM1555C1H120JZ01D

C8, C9, C44,

C45, C47, C48

Capacitor, 12pF, 50V,

5%, 0402, COG

D0, D1, D2, D3, D4

Green LED 0603

Everlight

19-217/G7C-AL1M2B/3T

969102-0000-DA

151-8000-E

J1, J2, J3,

J4, J5, J6, J7

Jumper, 0.100, Gold,

Black, Open

Kobiconn

Header, 2x3, 0.100, T-Hole,

Vertical Unshrouded,

0.230 Mate, gold

JP1

FCI

67996-206HLF

FCI

961102-6404-AR

68001-102HLF

1x2-head

Header, 1x2, 0.100, T-Hole,

Vertical Unshrouded, 0.220

Mate

JP2, JP3

JP4, JP5

Anyone

FCI

Header, 2x2, 0.100, T-Hole,

Vertical Unshrouded, 0.230

Mate

67997-104HLF

4UCON

Yageo

00998

R1, R2, R3, R4,

R5, R29, R35, R44

Resistor, 10k ohm, 1/10W,

5%, 0402 Thick Film

RC0402FR-0710KL

R17, R26, R36

R18, R51

100k 5% 0402 resistor smd

Resistor 0402 100 ohm 5%

Resistor 49.9 ohm 0402. 1 %

Resistor 4.87k 1% 0402 smd

Rohm

MCR01MRTJ104

MCR1MRTJ101

R23, R21, R22, R24

R25

MCR01MRTF49R9

MCR01MRTF4871

Resistor, 5.6k ohm,

1/10W, 5%, 0402

R28

Panasonic

Rohm

ERJ-2GEJ562X

MCR01MRTJ750

ERJ-3GEYJ105V

R32, R43, R45, R46

R34, R52

resistor 75 ohm 0402 5%

Resistor, 1M OH,

1/10W, 5% 0603 SMD

Panasonic

Resistor, 51 ohm,

1/10W, 5%, 0402

R38

Panasonic

ERJ-2GEJ510X

SPMU365C–March 2014–Revised October 2016

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Bill of Materials

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Table 4-1. Connected LaunchPad Bill of Materials (continued)

Item

Ref

R42

Qty

Description

Mfg

Part Number

Resistor, 1M Ohm,

1/10W, 5%, 0402

Rohm

MCR01MRTF1004

ERJ-8GEYJ105V

ERJ-3GEYJ202V

R47

RES 1M OHM 5% 1206 TF

Panasonic

Resistor, 2.0k ohm,

1/10W, 5%, 0402

R49, R50

R6, R7, R8, R10, R11,

R15, R16, R19, R20, R39,

R40, R41

Resistor, 0 ohm,

1/10W, 5%, 0402

Panasonic

ERJ-2GE0R00X

Resistor, 330 ohm,

1/10W, 5%, 0402

R9, R27, R30, R31, R33

Yageo

Omron

RC0402FR-07330RL

B3S-1000

RESET, USR_SW1,

USR_SW2, WAKE

Switch, Tact 6mm SMT,

160gf

Tiva, MCU TM4C1294NCPDT Texas Instruments

128 QFP with Ethernet MAC

TM4C1294NCPDT

XM4C1294NCPDT

Texas Instruments

+ PHY

Transformer, ethernet, 1 to 1.

Pulse Electronics

SOIC 16

U10

U13

U14

U2, U3

U20

U22

HX1198FNL

SLVU2.8-4.TBT

1-406541-5

Diode, 8 chan, +/-15KV, ESD

Semtech

Protection Array, SO-8

Connector, RJ45 NO MAG,

TE Connectivity

shielded THRU HOLE

IC 4CH ESD SOLUTION

Texas Instruments

W/CLAMP 6SON

TPD4S012DRYR

TM4C123GH6PMI

10118194-0001LF

TPS2052BDRBR

Stellaris TIVA MCU

Texas Instruments

TM4C123GH6PMI

USB Micro B receptacle

FCI

right angle with guides

Fault protected power switch,

Texas Instruments

dual channel, 8-SON

3.3V LDO TI TPS73733DRV

Texas Instruments

TPS73733DRV

SHF-105-01-S-D-SM

C44-10BSA1-G

fixed out 5V in

Samtec

Header 2x5, 0.050, SM,

Don Connex

Electronics

Vertical Shrouded

USB Micro AB receptacle.

Right angle with through

guides

Hirose

ZX62D-AB-5P8

Samtec

SSW-110-23-S-D

SSHQ-110-D-08-F-LF

Header, 2x10, T-Hole Vertical

unshrouded stacking

X6, X7, X8, X9

Major League

Electronics

Crystal 25 MHz 3.2 x 2.5 mm

NDK

nx3225ga-25.000m-std-crg-2

NX3225GA-16.000M-STD-CRG-2

Crystal 16 MHz 3.2 x 2.5 mm

4 pin

NDK

Crystal, 32.768 KHz Radial

Can

Citizen Finetech

Miyota

CMR200T-32.768KDZY-UT

References, PCB Layout, and Bill of Materials

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Bill of Materials

Table 4-1. Connected LaunchPad Bill of Materials (continued)

Item

Ref

Qty

Description

Mfg

Part Number

PCB Do Not Populate List (Shown for information only)

Capacitor, 0.1uF 16V,

Taiyo Yuden

McMaster

EMK105B7104KV-F

90077A112

10%, 0402 X7R

Screw, #4 x 0.625" Pan

Head, Sheet Metal,

Phillips/Slotted

H1, H4, H6

(for fan)

Resistor, 5.6k ohm,

1/10W, 5%, 0402

R12, R13, R14

R48

Panasonic

Rohm

ERJ-2GEJ562X

Resistor 0402 1% 52.3k

TRR01MZPF5232

TP1, TP2, TP3, TP4, TP5,

TP6, TP7, TP8, TP9,

TP10, TP11, TP12, TP13,

TP14, TP15, TP16, TP17

Terminal, Test Point Miniature

Loop, Red, T-Hole

Keystone

FCI

5000

Header, 2x7, 0.100, T-Hole,

Vertical, Unshrouded, 0.230

Mate

67997-114HLF

Valvano style bread board

connect. Right Angle

extended, 1 x 49 0.100 pitch.

X11A

X11B

Samtec

TSW-149-09-F-S-RE

TSW-149-08-F-S-RA

valvano style breadboard

header.

SPMU365C–March 2014–Revised October 2016

References, PCB Layout, and Bill of Materials

Submit Documentation Feedback

Chapter 5

SPMU365C–March 2014–Revised October 2016

Schematic

This section contains the complete schematics for the Tiva C Series TM4C1294 Connected LaunchPad.

•

Microcontroller, USB, Buttons, and LED's

BoosterPack connectors

Breadboard connector

Ethernet and Ethernet LED's

Power

In-Circuit Debug Interface

Schematic

SPMU365C–March 2014–Revised October 2016

Submit Documentation Feedback

TP4

TP5

TP6

TP7

TARGET_VBUS/3.2C

USBD_N

convienence test points for ground

TP14

GPIO

U7G$1

VBUS

GND

U1G$1

P$33

P$34

P$35

P$36

P$37

P$38

P$40

P$41

P$95

P$96

P$91

P$92

P$121

P$120

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PB0

USBD_P

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PB0

PB1

PB2

PB3

PB4

PB5

TP15

TP16

TP17

TARGET_VBUS/3.2C

PB2

PB3

PB4

PB5

TARGET_ID

GND

C32

P$100

P$99

P$98

P$97

P$25

P$24

P$23

P$22

P$1

P$2

P$3

P$4

P$125

P$126

P$127

P$128

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

3300pF

TARGET_TCK/SWCLK/6.1A

TARGET_TMS/SWDIO/6.1A

TARGET_TDI/6.1E

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

USBD_N

TPD4S012_DRY_6

TARGET_TDO/SWO/6.1E

TARGET_ID

PC4

PC5

PC6

PC7

GND

TARGET_VBUS/3.2C

D+

D-

VBUS

N.C.

GND

R18

100

PB0/3.2C

GND

P$15

P$14

P$13

P$12

P$123

P$124

P$42

P$43

P$44

P$45

P$46

PE0

PE1

PE2

PE3

PE4

PE5

PF0

PF1

PF2

PF3

PF4

PE0

PE1

PE2

PE3

PE4

PE5

PF0

PF1

PF2

PF3

PF4

USBD_P

GND

NOTE: TPD4S012 all protection circuits are identical.

Connections chosen for simple routing.

P$49

P$50

P$29

P$30

P$31

P$32

PG0

PG1

PH0

PH1

PH2

PH3

PG0

PG1

PH0

PH1

PH2

PH3

P$116

P$117

PJ0

PJ1

PN0/3.4D

PN1/3.4D

PJ0

PJ1

P$18

P$19

P$20

P$21

P$63

P$62

P$61

P$60

P$81

P$82

P$83

P$84

P$85

P$86

P$94

P$93

PK0

PK1

PK2

PK3

PK4

PK5

PK6

PK7

PL0

PL1

PL2

PL3

PL4

PL5

PK0

PK1

PK2

PK3

PK4

PK5

PK6

PK7

PL0

PL1

PL2

PL3

PL4

PL5

PL6

PL7

USBD_P

USBD_N

P$78

P$77

P$76

P$75

P$74

P$73

P$72

P$71

P$107

P$108

P$109

P$110

P$111

P$112

PM0

PM1

PM2

PM3

PM4

PM5

PM6

PM7

PN0

PN1

PN2

PN3

PN4

PN5

PM0

PM1

PM2

PM3

PM4

PM5

PM6

PM7

PN0

PN1

PN2

PN3

PN4

PN5

GND

See PF0 and PF4 for additional LED's used for

Ethernet or user application

USR_SW1

P$118

P$119

P$103

P$104

P$105

P$106

P$5

P$6

P$11

P$27

P$102

PP0

PP1

PP2

PP3

PP4

PP5

PQ0

PQ1

PQ2

PQ3

PQ4

PJ0/3.2D

PP0

PP1

PP2

PP3

PP4

PP5

PQ0

PQ1

PQ2

PQ3

PQ4

SWITCH_TACTILE

USR_SW2

PJ1/3.2D

TM4C1294NCPDT

SWITCH_TACTILE

GND

+5V

X8-2

TSW-110-02-S-D

X8-1

GND/1.6B

X9-2

TSW-110-02-S-D

X9-1

PF1

GND/1.6B

X8-4

X8-6

X8-8

X8-10

X8-12

X8-14

X8-16

X8-18

X8-20

PE4

PC4

PC5

PC6

PE5

PD3

PC7

PB2

PB3

PF2

PF3

PG0

PL4

PL5

PL0

PL1

PL2

PL3

PM3

PH2

PH3

X8-3

X8-5

X8-7

X9-3

X9-5

X9-7

X9-9

X9-11

X9-13

X9-15

X9-17

X9-19

X9-4

X9-6

X9-8

PE0

PE1

PE2

PE3

PD7

PA6

PM4

PM5

C23

C24

0.1uF

TARGET_RESET/3.2D

X8-9

X9-10

0.1uF

X8-11

X8-13

X8-15

X8-17

X8-19

PD1

X9-12

X9-14

X9-16

X9-18

X9-20

PD0

PN2

PN3

PP2

GND

BoosterPack 1 Interface

GND/1.6B

X7-2

+5V

JP4 and JP5 CAN and ICDI UART Selection:

Populate Jumpers from 1-2 and 3-4 for Default Mode

This enables ROM UART boot loader. UART 0 to ICDI

PM7

PP5

PA7

X7-4

X7-6

X7-8

Populate from 1-3 and 2-4 for controller area network

on the boosterpack. UART2 is then availabe to ICDI.

TSW-110-02-S-D

X6-1

X6-2

TSW-110-02-S-D

X7-1

PG1

PK4

PK5

PM0

GND/1.6B

TARGET_RESET/3.2D

X6-4

X7-10

R19 and R20 can be populated to enable I2C on

PD2

X6-3

X6-5

X6-7

X7-3

X7-5

X7-7

C25

JP4

PP0

PP1

PB4

PB5

PK0

PK1

PK2

PK3

PA4

PA5

PA3

X6-6

X6-8

X7-12

X7-14

Right side of BP2 interface. This is for legacy

support and the Sensor Hub BoosterPack.

C26

TARGET_RXD/6.1D

PD4/1.4B

PA0/3.2C

BP2_A2.5

R19

0.1uF

PM1

PM2

PH0

PQ2

PA2

BP2_A2.5

BP2_A2.6

X6-13

X6-15

X6-17

X6-19

X6-9

X6-11

X6-10

X6-12

X6-14

X6-16

X6-18

X6-20

X7-9

I2C and SSI are available on the corresponding

BoosterPack 1 interface pins without modification to

the board.

0.1uF

X7-11

X7-13

X7-15

X7-17

X7-19

PQ0

PP4

PN5

PN4

R20

PH1

PK6

PK7

PQ3

PP3

PQ1

PM6

GND

PA6 and PA7 are also used by the onboard radio.

Configure the radio to tri-state these GPIO before

using them on the boosterpack interface.

GND

X7-16

X7-18

X7-20

JP5

TARGET_TXD/6.1D

PD5/1.4B

PA1/3.2C

BP2_A2.6

BoosterPack 2 Interface

+5V

This is the breadboard connection header.

C28

Samtec TSW-149-08-F-S-RA and TSW-149-09-F-S-RE

can be used together to create a breadboard

connector

C27

0.1uF

see the Users Manual for more information.

TSW-149-02-S-D

X11-2

X11-4

X11-1

X11-3

X11-5

GND

PA2

GND

PB4

X11-6

X11-8

PA3

PA4

PA5

PE0

PE1

PE2

PE3

PE4

PE5

PK0

PK1

PK2

PK3

PB5

PH0

PH1

PH2

PH3

PC7

PC6

PC5

PC4

PA6

PA7

PG1

PG0

PM3

X11-7

X11-9

X11-10

X11-12

X11-14

X11-16

X11-18

X11-20

X11-22

X11-24

X11-26

X11-28

X11-30

X11-32

X11-34

X11-36

X11-38

X11-40

X11-42

X11-44

X11-46

X11-48

X11-50

X11-52

X11-54

X11-56

X11-58

X11-60

X11-62

X11-64

X11-66

X11-68

X11-70

X11-72

X11-74

X11-76

X11-78

X11-80

X11-82

X11-84

X11-86

X11-88

X11-90

X11-92

X11-94

X11-96

X11-98

X11-11

X11-13

X11-15

X11-17

X11-19

X11-21

X11-23

X11-25

X11-27

X11-29

X11-31

X11-33

X11-35

X11-37

X11-39

X11-41

X11-43

X11-45

X11-47

X11-49

X11-51

X11-53

X11-55

X11-57

X11-59

X11-61

X11-63

X11-65

X11-67

X11-69

X11-71

X11-73

X11-75

X11-77

X11-79

X11-81

X11-83

X11-85

X11-87

X11-89

X11-91

X11-93

X11-95

X11-97

NOTE: PB0 and PB1 are used in some

configurations with 5V signals especially in USB

Host or OTG mode. Be aware the 5V may be

present on these pins depending on system jumper

configuration

VREF+/5.5B

GND/2.3C

GND/4.1A

PD5

PD4

PD7

PD6

PD3

PD1

PD0

PD2

PP0

PP1

PB0

PM2

PM1

PM0

PL0

PL1

PL2

PL3

PQ0

PQ1

PQ2

PQ3

PK7

These pins are only 5V tolerant when configured for

USB mode applications.

TARGET_VBUS/1.6B

GND/2.3C

PF4

GND/4.1A

PK6

PL4

PB2

PB3

PP2

PP3

PK5

PK4

PL5

PN4

PN5

PN0

PN1

PN2

PN3

PQ4

PF0

PF1

PF2

PF3

PA0

PA1

PP4

PP5

PJ0

PJ1

PM7

PM6

PM5

PM4

TARGET_RESET/2.4D

GND/2.3C

WAKE/5.5A

+5V

C29

C30

0.1uF

GND

Place pull up resistors and C16-C17 near TM4C MCU.

MCU_3V3/5.2A

C17

C16

0.1uF

GND

Place C18 and C22 near pin 2 and pin 7 of U$10

U10

P$16

P$1

P$2

P$3

EN0TXO_P/5.3B

EN0TXO_N/5.3B

P$1

P$2

P$3

U13

U14

P$1

P$8

TX+

TX-

RX+

TERM1A

TERM1B

RX-

TERM2A

TERM2B

CHASSIS

P$14

P$2

P$3

P$7

P$6

R32

P$15

P$11

P$6

P$7

P$8

EN0RXI_P/5.3B

EN0RXI_N/5.3B

P$6

P$7

P$8

P$4

P$5

P$9

R43

P$10

C31

4700pF

U10 May be populated with either HX1188FNL or HX1198FNL.

HX1198FNL preferred for best Ethernet performance.

GND

PF4/3.2C

PF0/3.2C

GND

For Ethernet example Applications:

LED4 is default configured as Ethernet Link OK

LED3 is default configured as Ethernet TX/RX activity

GND

User may re-configure these pins / LED's for any

application usage.

JP2 can be used to measure MCU current

consumption with a multi-meter.

WAKE

JP2

MCU_3V3/4.1A

SWITCH_TACTILE

GND

TP10

C47

C48

TP11

R39

CRYATL_32K_SMD

12pF

P$2

P$1

WAKE/3.3D

PP$$12

R42

TP9

Power Control Jumper:

TARGET_RESET/3.2D

0.1uF

U1G$2

1) To power from Debug install jumper on pins 5 - 6

2) To power from Target USB install jumper on pins 3 - 4

GND

R38

R38 and C3 Used to meet

VBAT rise time requirements

R51

100

P$66

P$67

P$65

P$64

P$68

XOSC0

XOSC1

HIB

WAKE

VBAT

C46

3) To power from BoosterPack 5V install jumper on pins 1 - 2

This is also the off position if BoosterPack does not

supply power

TP13

R41

P$70

RESET

0.1uF

P$8

P$9

GND

VDDA

VREFA+

P$88

P$89

When powered from BoosterPack TPS2052B does not

provide current limit protection.

OSC0

OSC1

R49

P$7

R41 may be removed and precision

reference applied to TP13

When powered by BoosterPack, USB host mode does not

supply power to connected devices

VDD

P$53

P$54

P$56

P$57

P$59

P$16

P$26

P$28

P$39

P$47

P$51

P$52

P$69

P$79

P$90

P$101

P$113

P$122

EN0RXI_N

EN0RXIN

EN0RXIP

EN0TXON

EN0TXOP

RBIAS

EN0RXI_P

EN0TXO_N

EN0TXO_P

RBIAS

JP1

GND

VBUS

MCU_3V3/6.2A

TARGET_VBUS/3.2C

DEBUG_VBUS/6.4A

C44

12pF

C40

C41

C42

C43

0.1uF

P$10

GNDA

P$17

P$48

P$55

P$58

P$80

P$114

GND

TP12

GND

C45

MOUNT-HOLE3.2

P$87

P$115

VDDC

12pF

MOUNT-HOLE3.2

0.1uF

C14

C15

GND

1.0uF

2.2uF

GND

MOUNT-HOLE3.2

GND

VBUS

+5V

TP8

TPS2052B provides current limit for main 5V power.

Also provides power switching for USB host/OTG modes

TPS2052B_DRB_8

For Host/OTG:

PD6 configured as USB0EPEN peripheral function.

*EN1

OUT1

*OC1

R36

100k

VBUS

PQ4 configure as individual pin interrupt. Indicates

power fault on the USB bus. USB0PFLT peipheral pin

not available due to pin mux and use on BoosterPacks.

PD6/3.2B

*EN2

Primary 3.3V regulator

Disconnect JP3 to power device from 3V3 BoosterPack

USB Host mode does not supply power to devices

when powered from a BoosterPack

TARGET_VBUS/3.2C

GND

EPAD

OUT2

*OC2

PQ4/3.4D

For Applications that do not use USB:

Configure PD6 as input with internal pull-down

enabled. Turns off power to TARGET_VBUS

+5V

C20

GND

TPS73733_DRV_6

2.2uF

OUT

TP3

C21

0.1uF

NR/FB

GND

EPAD

C19

0.1uF

GND

Use this for JTAG IN from external debugger. See X1

jumpers for information about debug out to an

external target.

R40 must be removed for debug out.

R40 must be instaled for debug in.

JTAG PULL-UPS

5.6k

R28

10k

DEBUG_VBUS/5.1B

10k

TARGET_TCK/SWCLK/1.2A

R29

MCU_3V3/5.6B

GND

10k

TARGET_TMS/SWDIO/1.2B

P10

DEBUG_PC1/TMS/SWDIO

DEBUG_PC0/TCK/SWCLK

DEBUG_PC3/TDO/SWO

DEBUG_PC2/TDI

VTARGET

EXTDBG

GND

P$7

GND1

TMS

TCK

TDO

TDI

RESET

R40

P$17

P$18

P$19

P$20

P$21

P$22

P$23

P$24

P$45

VCP_RXD

VCP_TXD

EXTERNAL_DEBUG

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

P$46

P$47

P$48

P$58

P$57

P$1

U20

TM4C123GH6PMI

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC3/TDO/SWO

DEBUG_PC2/TDI

VERSION_1

VERSION_2

10k

ICDI_TCK

DEBUG_RESET_OUT

10k

JTAG_ARM_10PIN

TP2

ICDI_TMS

DEBUG_RESET_OUT

P$4

EXTERNAL_DEBUG

GND

EXTERNAL_DEBUG pull low to use external debugger

to debug the target. Causes ICDI chip to tri-state the JTAG lines

P$52

P$51

P$50

P$49

P$16

P$15

P$14

P$13

P$61

P$62

P$63

P$64

P$43

P$44

P$53

P$10

VERSION_0

PC0/TCK

PC1/TMS

PC2/TDI

PC3/TDO

PC4

PC5

PC6

PC7

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

TP1

U22G$1

DEBUG_ACTIVE

DEBUG_VBUS/5.1B

VBUS

GND

ICDI_USBD_N

ICDI_USBD_P

GND

ICDI_TCK

ICDI_TMS

ICDI_TDI

DEBUG_PC3/TDO/SWO

ICDI_TDO

RTCK

RESET

VTREF

TDO

P$9

P$8

P$7

P$6

P$59

P$60

P$28

P$29

P$30

P$31

P$5

PE0

PE1

PE2

PE3

PE4

PE5

PF0

PF1

PF2

PF3

PF4

ICDI_RESET

DEBUG_PC1/TMS/SWDIO

DEBUG_PC0/TCK/SWCLK

PE4 ETM_ENn Leave Open

use GPIO Internal weak pullup.

PE5 LS_PRESENTn Leave Open

use GPIO internal weak pullup

ICDI_TDO

C33

GND

TRST

TCK

3300pF

OMIT

P$38

P$32

P$33

P$37

P$2

RESET

WAKE

HIB

GND

TMS

P$41

P$40

GND

OSC1

OSC0

TDI

VBAT

VDDA

P$34

P$35

P$36

XOSC0

GNDX

XOSC1

U21

C10 C11 C12 C13

P$11

P$26

P$42

P$54

R50

VDD0

VDD1

VDD2

VDD3

GND

0.1uF 0.1uF 0.1uF 0.1uF

P$3

GNDA

P$12

P$27

P$39

P$55

GND0

GND1

GND2

GND3

12pF

P$25

P$56

GND

VDDC0

VDDC1

ICDI_VDDC

ICDI_RESET

OMIT

GND

TM4C123xH6PMI

0.1uF

0.1uF 1.0uF 2.2uF

VERSION RESISTOR TABLE:

*use internal GPIO weak pullups.

ALL OMITTED: Legacy mode. (Stellaris ICDI)

ALL POPULATED: Everything enabled

Version 0 populated: UART CTS/RTS and Analog inputs

GND

TPD4S012_DRY_6

GND

R13

Jumpers to bridge from ICDI to Target portion of LaunchPad

OMIT

VERSION_1

12pF

5.6k

R14

TARGET_TXD/2.5D

VCP_RXD

VCP_TXD

ICDI_USBD_P

ICDI_USBD_N

DEBUG_VBUS/5.1B

D+

D-

VBUS

N.C.

GND

OMIT

VERSION_2

GND

5.6k

R12

TARGET_RXD/2.5D

OMIT

VERSION_0

GND

5.6k

TARGET_TCK/SWCLK/1.2A

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC2/TDI

OMIT

GND

TARGET_TXD/2.5D

VCP_RXD

VCP_TXD

X1-14 X1-13

X1-12 X1-11

X1-10 X1-9

TARGET_TMS/SWDIO/1.2B

TARGET_RXD/2.5D

TARGET_TCK/SWCLK/1.2A

TARGET_TMS/SWDIO/1.2B

TARGET_TDI/1.2B

DEBUG_PC0/TCK/SWCLK

DEBUG_PC1/TMS/SWDIO

DEBUG_PC2/TDI

R10

X1-8

X1-6

X1-4

X1-2

X1-7

X1-5

X1-3

X1-1

TARGET_TDI/1.2B

TARGET_TDO/SWO/1.2B

TARGET_RESET/5.2A

DEBUG_PC3/TDO/SWO

DEBUG_RESET_OUT

R11

TSW-107-02-S-D

TARGET_TDO/SWO/1.2B

DEBUG_PC3/TDO/SWO

DEBUG_RESET_OUT

R15

X1 omitted by default

To debug out from ICDI to off board MCU remove

0 ohm jumper resistors. To go back from debug

out to debugging the target MCU install X1 and

place jumpers on all pins.

TARGET_RESET/5.2A

R16

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Revision History

Changes from B Revision (May 2015) to C Revision ...................................................................................................... Page

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GLOBAL: Updated/Changed all instances of "UART4" to "UART2"................................................................ 4

SPMU365C–March 2014–Revised October 2016

Revision History

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STANDARD TERMS FOR EVALUATION MODULES

1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance

with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not

finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For

clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions

set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,

or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production

system.

Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License

Agreement.

2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by

neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have

been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications

or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control

techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)

business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit

User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty

period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or

replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be

warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day

warranty period.

Regulatory Notices:

3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:

FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software

associated with the kit to determine whether to incorporate such items in a finished product and software developers to write

software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or

otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition

that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.

Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must

operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not

cause harmful interference, and (2) this device must accept any interference received, including interference that may cause

undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to

operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of

the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is

operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not

installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.

Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to

correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of

the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance

with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference

will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more

of the following measures:

•

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:

(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may

cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation

est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit

accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)

gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type

and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for

successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types

listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited

for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et

d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage

radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope

rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le

présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le

manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne

non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de

l'émetteur

3.3 Japan

3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。

http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified

by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the

instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs

(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):

1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for

Enforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to

EVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan

with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note

that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けて

いないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの

措置を取っていただく必要がありますのでご注意ください。

1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。

2. 実験局の免許を取得後ご使用いただく。

3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ

ンスツルメンツ株式会社

東京都新宿区西新宿６丁目２４番１号

西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/

/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

3.4 European Union

3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):

This is a class A product intended for use in environments other than domestic environments that are connected to a

low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this

product may cause radio interference in which case the user may be required to take adequate measures.

EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT

LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling

or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information

related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and

customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input

and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or

property damage. If there are questions concerning performance ratings and specifications, User should contact a TI

field representative prior to connecting interface electronics including input power and intended loads. Any loads applied

outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible

permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any

load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit

components may have elevated case temperatures. These components include but are not limited to linear regulators,

switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the

information in the associated documentation. When working with the EVM, please be aware that the EVM may become

very warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the

dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.

User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,

affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic

and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely

limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and

liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or

designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,

state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all

responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and

liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local

requirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate

as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as

accurate, complete, reliable, current, or error-free.

6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT

LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL

FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT

NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS

FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE

SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE

CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR

INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE

EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR

IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS

LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,

EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY

HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY

WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL

THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE

TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF

SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR

REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,

OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF

USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI

MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS

OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED

HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN

CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR

EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE

CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)

will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in

a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable

order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),

excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,

without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to

these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.

Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief

in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES

Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,

reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are

developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you

(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of

this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

enhancements, improvements and other changes to its TI Resources.

You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your

applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications

(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You

represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)

anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that

might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you

will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any

testing other than that specifically described in the published documentation for a particular TI Resource.

You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include

the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO

ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY

RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or

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TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR

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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT

LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF

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You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your non-

compliance with the terms and provisions of this Notice.

This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.

These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation

modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

MCR01MRTJ750 [TI]

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