MSP430FG6626IZQW_技术文档

MSP430FG6626, MSP430FG6625

MSP430FG6426, MSP430FG6425

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SLAS874B – MAY 2015 – REVISED SEPTEMBER 2020

MSP430FG662x, MSP430FG642x Mixed-Signal Microcontrollers

•

Enhanced UART with automatic baud-rate

detection

1 Features

•

Low supply voltage range:

3.6 V down to 1.8 V

•

IrDA encoder and decoder

Synchronous SPI

•

High-performance integrated signal chain

– Continuous-time sigma-delta 16-bit analog-to-

digital converter (ADC) with internal reference

with 10 external analog inputs, 6 single-ended

and 4 selectable as differential or single-ended

– Dual operational amplifiers

– Quad low-impedance ground switches

– Voltage comparator

Dual 12-bit digital-to-analog converters (DACs)

with synchronization

Integrated LCD driver with contrast control for up

to 160 segments

MSP430FG662x: Full-speed universal serial bus

(USB)

– Integrated USB-PHY

– Integrated 3.3-V and 1.8-V USB power system

– Integrated USB-PLL

– Eight input and eight output endpoints

Ultra-low power consumption

– USCI_B0 and USCI_B1

•

I²C

Synchronous SPI

•

RTC with calibration logic for time offset correction,

operation in LPM 3.5

16-bit RISC architecture, extended memory, up to

20-MHz system clock

Flexible power-management system

– Fully integrated LDO with programmable

regulated core supply voltage

– Supply voltage supervision, monitoring, and

brownout

•

Unified clock system

– FLL control loop for frequency stabilization

– Low-power low-frequency internal clock source

(VLO)

– Low-frequency trimmed internal reference

source (REFO)

•

– 32-kHz crystals (XT1)

– Active mode (AM),

– High-frequency crystals up to 32 MHz (XT2)

Separate voltage supply for backup subsystem

– 32-kHz low-frequency oscillator (XT1)

– RTC

– Backup memory (8 bytes)

Development tools and software (also see Tools

and Software)

– MSP-TS430PZ100AUSB 100-pin target

development board

– MSP430Ware^™code examples

Wake up from standby mode in 3 µs (typical)

Serial onboard programming, no external

programming voltage needed

all system clocks active:

250 µA/MHz at 8 MHz, 3.0 V, flash program

execution (typical)

•

– Standby mode (LPM3):

watchdog with crystal, and supply supervisor

operational, full RAM retention, fast wakeup:

3.2 µA at 2.2 V, 3.4 µA at 3.0 V (typical)

– Shutdown RTC mode (LPM3.5):

shutdown mode, active RTC with crystal:

0.9 µA at 3.0 V (typical)

– Shutdown mode (LPM4.5):

0.2 µA at 3.0 V (typical)

Intelligent digital peripherals

•

Available in 100-pin LQFP and 113-pin Microstar

Junior^™BGA packages

Device Comparison summarizes the available

family members

– Two 16-bit timers with three capture/compare

registers each

– One 16-bit timer with five capture/compare

registers

– One 16-bit timer with seven capture/compare

registers

– 6-channel internal DMA

– Hardware multiplier supports 32-bit operations

Four universal serial communication interfaces

(USCIs)

2 Applications

•

Analog sensor systems

Digital sensor systems

Hand-held meters

Medical diagnostic meters

Hand-held industrial testers

Measurement equipment

•

– USCI_A0 and USCI_A1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

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3 Description

The Texas Instruments MSP430FG662x and MSP430FG642x microcontrollers (MCUs) are part of the

MSP430TM Metrology and Monitoring portfolio. The architecture and integrated peripherals, combined with five

extensive low-power modes, are optimized to achieve extended battery life in portable and battery-powered

measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant

generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the

devices to wake up from low-power modes to active mode in less than 5 µs.

The MSP430FG662x MCUs are targeted at small signal-monitoring applications and include a 16-bit sigma-delta

ADC, dual low-power operational amplifiers, dual 12-bit DACs, voltage comparator, four USCIs (two USCI_A

modules and two USCI_B modules), four 16-bit timers, a hardware multiplier, a DMA module, an RTC module,

an LCD driver with integrated contrast control for up to 160 segments, integrated full-speed USB, an auxiliary

supply system, up to 128KB flash, 10KB SRAM and 73 I/O pins in 100‑pin devices and 113‑pin devices.

The MSP430FG642x MCUs are targeted at small-signal monitoring applications and include a 16-bit sigma-delta

ADC, dual low-power operational amplifiers, dual 12-bit DACs, voltage comparator, four USCIs (two USCI_A

modules and two USCI_B modules), four 16-bit timers, a hardware multiplier, a DMA module, an RTC module,

an LCD driver with integrated contrast control for up to 160 segments, an auxiliary supply system, up to 128KB

of flash, 10KB of SRAM, and 73 I/O pins in 100‑pin devices and 113‑pin devices.

Typical applications for these microcontrollers include small signal-monitoring applications such as handheld test

and measurement equipment, field transmitters, and blood glucose meters. These microcontrollers can reduce

overall system cost through high analog integration and enable long battery life by low-power operation.

The MSP430FG662x and MSP430FG642x MCUs are supported by an extensive hardware and software

ecosystem with reference designs and code examples to get your design started quickly. Development kits

include the MSP-TS430PZ100AUSB 100-pin target development board. TI also provides free MSP430Ware^™

software, which is available as a component of Code Composer Studio^™IDE desktop and cloud versions within

TI Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and online

support through the TI E2E^™support forums.

For complete module descriptions, see the MSP430F5xx and MSP430F6xx Family User's Guide.

Device Information

PART NUMBER⁽¹⁾

MSP430FG6626IPZ

PACKAGE

BODY SIZE⁽²⁾

14 mm × 14 mm

7 mm × 7 mm

PZ (100)

MSP430FG6626IZCA

nFBGA (113)

MSP430FG6626IZQW⁽³⁾

MicroStar Junior^™BGA (113)

(1) For the most current part, package, and ordering information for all available devices, see the

Package Option Addendum in Section 12, or see the TI website at www.ti.com.

(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the

Mechanical Data in Section 12.

(3) All orderable part numbers in the ZQW (MicroStar Junior BGA) package have been changed to a

status of Last Time Buy. Visit the Product life cycle page for details on this status.

2

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4 Functional Block Diagrams

Figure 4-1 shows the functional block diagram for the MSP430FG6626 and MSP430FG6625 devices.

PA

PB

PC

PD

XIN XOUT

DV_CCDV_SS

AV_CCAV_SS

RST/NMI

VCORE

NR

P1.x P2.x P3.x P4.x P5.x P6.x P7.x P8.x

P9.x

DP, DM, PUR

XT2IN

8KB

RAM

I/O Ports

P1, P2

2×8 I/Os

Interrupt

Capability

I/O Ports

P3, P4

2×8 I/Os

Interrupt

Capability

I/O Ports

P5, P6

1×7 I/Os

1×8 I/Os

I/O Ports

P7, P8

1×6 I/Os

1×8 I/Os

I/O Ports

P9

1×8 I/Os

USCI0,1

USB

ACLK

SYS

Power

Management

Unified

Clock

System

128KB

64KB

Ax: UART,

IrDA, SPI

Full-Speed

XT2OUT

Watchdog

SMCLK

+2KB RAM

USB Buffer

P2 Port

Mapping

Controller

LDO

SVM, SVS

Brownout

PE

1×8 I/Os

Bx: SPI, I²C

Flash

MCLK

+8B Backup

RAM

PA

1×16 I/Os

PB

1×16 I/Os

PC

1×15 I/Os

PD

1×14 I/Os

CPUXV2

and

DMA

Working

Registers

6 Channel

EEM

(L: 8+2)

CTSD16

Sigma-Delta

ADC

Operational

Amplifiers

OA0, OA1

Reference

TA1 and

TA2

RTC_B

TA0

TB0

DAC12_A

LCD_B

JTAG,

SBW

Interface

1.5 V,

2.0 V,

2.5 V

Timer_A

5 CC

Registers

Timer_B

7 CC

Registers

Comp_B

12 bit

2 channels

voltage out

MPY32

CRC16

2 Timer_A

each with

3 CC

14 inputs

(6 SE ext,

4 SE/diff ext,

4 int)

160

Segments

Quad

Ground

Switches

Battery

Backup

System

Port PJ

Registers

1.16 V

VREFBG

Figure 4-1. Functional Block Diagram – MSP430FG6626, MSP430FG6625

Figure 4-2 shows the functional block diagram for the MSP430FG6426 and MSP430FG6425 devices.

PU.0,

PU.1

PA

PB

PC

PD

XIN XOUT

DV_CCDV_SS

AV_CCAV_SS

RST/NMI

VCORE

NR

LDOO LDOI

P1.x P2.x P3.x P4.x P5.x P6.x P7.x P8.x

P9.x

XT2IN

I/O Ports

P1, P2

2×8 I/Os

Interrupt

Capability

I/O Ports

P3, P4

2×8 I/Os

Interrupt

Capability

I/O Ports

P5, P6

1×7 I/Os

1×8 I/Os

I/O Ports

P7, P8

1×6 I/Os

1×8 I/Os

I/O Ports

P9

1×8 I/Os

USCI0,1

PU Port

LDO

ACLK

SYS

Power

Management

Unified

Clock

System

128KB

64KB

10KB

RAM

Ax: UART,

IrDA, SPI

XT2OUT

Watchdog

SMCLK

P2 Port

Mapping

Controller

LDO

SVM, SVS

Brownout

+8B Backup

RAM

PE

1×8 I/Os

Bx: SPI, I²C

Flash

MCLK

PA

1×16 I/Os

PB

1×16 I/Os

PC

1×15 I/Os

PD

1×14 I/Os

CPUXV2

and

DMA

Working

Registers

6 Channel

EEM

(L: 8+2)

CTSD16

Sigma-Delta

ADC

Reference

Operational

Amplifiers

OA0, OA1

LCD_B

TA1 and

TA2

RTC_B

DAC12_A

TA0

TB0

1.5 V,

2.0 V,

2.5 V

JTAG,

SBW

Interface

160

Segments

12 bit

2 channels

voltage out

Comp_B

MPY32

CRC16

2 Timer_A

each with

3 CC

Timer_A

5 CC

Registers

Timer_B

7 CC

Registers

14 inputs

(6 SE ext,

4 SE/dif ext,

4 int)

Quad

Ground

Switches

Battery

Backup

System

Port PJ

Registers

1.16 V

VREFBG

Figure 4-2. Functional Block Diagram – MSP430FG6426, MSP430FG6425

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Table of Contents

1 Features............................................................................1

2 Applications.....................................................................1

3 Description.......................................................................2

4 Functional Block Diagrams............................................ 3

5 Revision History.............................................................. 5

6 Device Comparison.........................................................6

6.1 Related Products........................................................ 7

7 Terminal Configuration and Functions..........................8

7.1 Pin Diagrams.............................................................. 8

7.2 Pin Attributes.............................................................11

7.3 Signal Descriptions................................................... 18

7.4 Pin Multiplexing.........................................................25

7.5 Buffer Type................................................................25

7.6 Connection of Unused Pins...................................... 26

8 Specifications................................................................ 27

8.1 Absolute Maximum Ratings ..................................... 27

8.2 ESD Ratings............................................................. 27

8.3 Recommended Operating Conditions.......................27

8.4 Active Mode Supply Current Into V_CCExcluding

9.5 Interrupt Vector Addresses....................................... 79

9.6 USB BSL...................................................................80

9.7 UART BSL................................................................ 80

9.8 JTAG Operation........................................................ 81

9.9 Flash Memory........................................................... 81

9.10 RAM........................................................................81

9.11 Backup RAM........................................................... 82

9.12 Peripherals..............................................................82

9.13 Input/Output Diagrams............................................96

9.14 Device Descriptors................................................136

9.15 Memory.................................................................136

9.16 Identification..........................................................152

10 Applications, Implementation, and Layout............. 153

10.1 Device Connection and Layout Fundamentals..... 153

10.2 Peripheral- and Interface-Specific Design

Information................................................................ 157

11 Device and Documentation Support........................168

11.1 Getting Started......................................................168

11.2 Device Nomenclature............................................168

11.3 Tools and Software................................................170

11.4 Documentation Support........................................ 172

11.5 Related Links........................................................ 173

11.6 Support Resources............................................... 173

11.7 Trademarks........................................................... 173

11.8 Electrostatic Discharge Caution............................173

11.9 Export Control Notice............................................173

11.10 Glossary..............................................................174

12 Mechanical, Packaging, and Orderable

External Current.......................................................... 29

8.5 Low-Power Mode Supply Currents (Into V_CC

)

Excluding External Current..........................................30

8.6 Low-Power Mode With LCD Supply Currents

(Into V_CC) Excluding External Current.........................31

8.7 Thermal Resistance Characteristics ........................ 32

8.8 Timing and Switching Characteristics....................... 32

9 Detailed Description......................................................76

9.1 Overview...................................................................76

9.2 CPU.......................................................................... 76

9.3 Instruction Set...........................................................77

9.4 Operating Modes...................................................... 78

Information.................................................................. 175

12.1 Packaging Information.......................................... 175

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5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from revision A to revision B

Changes from September 27, 2018 to September 11, 2020

Page

•

Updated the numbering for sections, tables, figures, and cross-references throughout the document..............1

Updated Section 1, Features .............................................................................................................................1

Added nFBGA package (ZCA) information throughout document......................................................................2

Added note about status change for all orderable part numbers in the ZQW package in Device Information .. 2

Updated Section 3, Description ......................................................................................................................... 2

Corrected the signal name and description (changed DVCC to AVCC) on pin 16 (or H1, G2) in Table 7-2,

Signal Descriptions ..........................................................................................................................................18

Changed the MAX value of the I_ERASEand I_MERASE, I_BANKparameters in Section 8.8.19.1, Flash Memory ... 75

•

Changes from initial release to revision A

Changes from May 22, 2015 to September 26, 2018

Page

•

Added Section 6.1, Related Products ................................................................................................................7

Added typical conditions statements at the beginning of Section 8, Specifications .........................................27

Updated notes (1) and (2) and added note (3) in Section 8.8.4.1, Wake-up Times From Low-Power Modes

and Reset ........................................................................................................................................................ 37

Removed duplicate symbol and removed note (5) on Ri_(VREFBG), Ri_(VeREF+)parameter in Section 8.8.13.4, 12-

Bit DAC, Reference Input Specifications ......................................................................................................... 64

Added "CBPWRMD = 00 or 01" to Test Conditions of the first row of the t_{EN_CMP}parameter; Added second

row for t_{EN_CMP}with Test Conditions of "CBPWRMD = 10" and MAX value of 100 µs in Section 8.8.16.1,

Comparator_B ................................................................................................................................................. 70

Added Section 8.8.18, LDO-PWR (LDO Power System) ................................................................................ 74

Throughout document, changed all instances of "bootstrap loader" to "bootloader"........................................85

Changed decoupling capacitor recommendation from "one 10 µF and one 100 nF" to "one 1 µF and one

100 nF" for consistency with Section 10.1.1 ..................................................................................................157

Changed decoupling capacitor recommendation from "one 10 µF and one 100 nF" to "one 1 µF and one

100 nF" for consistency with Section 10.1.1 ..................................................................................................158

Changed decoupling capacitor recommendation from "one 10 µF and one 100 nF" to "one 1 µF and one

100 nF" for consistency with Section 10.1.1 ..................................................................................................161

Added Section 10.2.5, DAC12 Peripheral ..................................................................................................... 165

Added Section 10.2.6, USB Module .............................................................................................................. 166

Added Section 10.2.7, LDO Module .............................................................................................................. 167

Replaced former section Development Tools Support with Section 11.3, Tools and Software ......................170

Changed format and added content to Section 11.4, Documentation Support ..............................................172

•

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6.1 Related Products

For information about other devices in this family of products or related products, see the following links.

Products for TI microcontrollers

TI's low-power and high-performance MCUs, with wired and wireless connectivity options, are optimized for a

broad range of applications.

Products for MSP430 ultra-low-power microcontrollers

One platform. One ecosystem. Endless possibilities. Enabling the connected world with innovations in ultra-low-

power microcontrollers with advanced peripherals for precise sensing and measurement.

Companion products for MSP430FG6626

Review products that are frequently purchased or used with this product.

Reference designs for MSP430FG6626

Find reference designs that leverage the best in TI technology to solve your system-level challenges.

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7 Terminal Configuration and Functions

7.1 Pin Diagrams

Figure 7-1 shows the pinout for the MSP430FG6626 and MSP430FG6625 devices in the 100-pin PZ package.

P6.4/CB4/AD0+/OA0O

P6.5/CB5/AD0-/OA0IN0

P6.6/CB6/AD1+/G0SW0

P6.7/CB7/AD1-/G0SW1

P7.4/CB8/AD2+/OA1O

P7.5/CB9/AD2-/OA1IN0

P7.6/CB10/AD3+/G1SW0

P7.7/CB11/AD3-/G1SW1

P5.0/VREFBG/VeREF+

P5.1/A4/DAC0

1

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

P9.7/S0

2

P9.6/S1

3

P9.5/S2

4

P9.4/S3

5

P9.3/S4

6

P9.2/S5

7

P9.1/S6

8

P9.0/S7

9

P8.7/S8

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

P8.6/UCB1SOMI/UCB1SCL/S9

P8.5/UCB1SIMO/UCB1SDA/S10

DVCC2

P5.6/A5/DAC1

NR

MSP430FG6626

MSP430FG6625

DVSS2

AVSS1

XOUT

XIN

P8.4/UCB1CLK/UCA1STE/S11

P8.3/UCA1RXD/UCA1SOMI/S12

P8.2/UCA1TXD/UCA1SIMO/S13

P8.1/UCB1STE/UCA1CLK/S14

P8.0/TB0CLK/S15

P4.7/TB0OUTH/SVMOUT/S16

P4.6/TB0.6/S17

P4.5/TB0.5/S18

P4.4/TB0.4/S19

P4.3/TB0.3/S20

P4.2/TB0.2/S21

P4.1/TB0.1/S22

AVCC

CPCAP

P2.0/P2MAP0/DAC0

P2.1/P2MAP1/DAC1

P2.2/P2MAP2

P2.3/P2MAP3

P2.4/P2MAP4/R03

P2.5/P2MAP5

P2.6/P2MAP6/LCDREF/R13

P2.7/P2MAP7/R23

CAUTION: LCDCAP/R33 must be connected to DV_SSif not used.

Figure 7-1. 100-Pin PZ Package (Top View), MSP430FG6626IPZ, MSP430FG6625IPZ

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Figure 7-2 shows the pinout for the MSP430FG6426 and MSP430FG6425 devices in the 100-pin PZ package.

P6.4/CB4/AD0+/OA0O

P6.5/CB5/AD0-/OA0IN0

P6.6/CB6/AD1+/G0SW0

P6.7/CB7/AD1-/G0SW1

P7.4/CB8/AD2+/OA1O

P7.5/CB9/AD2-/OA1IN0

P7.6/CB10/AD3+/G1SW0

P7.7/CB11/AD3-/G1SW1

P5.0/VREFBG/VeREF+

P5.1/A4/DAC0

1

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

P9.7/S0

2

P9.6/S1

3

P9.5/S2

4

P9.4/S3

5

P9.3/S4

6

P9.2/S5

7

P9.1/S6

8

P9.0/S7

9

P8.7/S8

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

P8.6/UCB1SOMI/UCB1SCL/S9

P8.5/UCB1SIMO/UCB1SDA/S10

DVCC2

P5.6/A5/DAC1

NR

MSP430FG6426

MSP430FG6425

DVSS2

AVSS1

XOUT

XIN

P8.4/UCB1CLK/UCA1STE/S11

P8.3/UCA1RXD/UCA1SOMI/S12

P8.2/UCA1TXD/UCA1SIMO/S13

P8.1/UCB1STE/UCA1CLK/S14

P8.0/TB0CLK/S15

P4.7/TB0OUTH/SVMOUT/S16

P4.6/TB0.6/S17

P4.5/TB0.5/S18

P4.4/TB0.4/S19

P4.3/TB0.3/S20

P4.2/TB0.2/S21

P4.1/TB0.1/S22

AVCC

CPCAP

P2.0/P2MAP0/DAC0

P2.1/P2MAP1/DAC1

P2.2/P2MAP2

P2.3/P2MAP3

P2.4/P2MAP4/R03

P2.5/P2MAP5

P2.6/P2MAP6/LCDREF/R13

P2.7/P2MAP7/R23

A. CAUTION: LCDCAP/R33 must be connected to DV_SSif not used.

Figure 7-2. 100-Pin PZ Package (Top View), MSP430FG6426IPZ, MSP430FG6425IPZ

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Figure 7-3 shows the pinout for the 113-pin ZCA or ZQW package.

A1

B1

C1

D1

E1

F1

G1

H1

J1

A2

B2

C2

D2

E2

F2

G2

H2

J2

A3

B3

C3

A4

B4

A5

B5

A6

B6

A7

B7

A8

B8

A9

B9

A10

B10

A11

B11

C11

D11

E11

F11

G11

H11

J11

A12

B12

C12

D12

E12

F12

G12

H12

J12

D4

E4

F4

G4

H4

J4

D5

E5

F5

G5

H5

J5

D6

E6

D7

E7

D8

E8

F8

G8

H8

J8

D9

E9

F9

G9

H9

J9

H6

J6

H7

J7

K1

L1

K2

L2

K11

L11

M11

K12

L12

M12

L3

L4

L5

L6

L7

L8

L9

L10

M1

M2

M3

M4

M5

M6

M7

M8

M9

M10

NOTE: For terminal assignments, see Section 7.3.

Figure 7-3. 113-Pin ZCA or ZQW Package (Top View), MSP430FG6626IZCA, MSP430FG6625IZCA,

MSP430FG6426IZCA, MSP430FG6425IZCA, MSP430FG6626IZQW, MSP430FG6625IZQW,

MSP430FG6426IZQW, MSP430FG6425IZQW

10

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7.2 Pin Attributes

Table 7-1 describes the attributes of the pins.

Table 7-1. Pin Attributes

PIN NO.

ZCA, ZQW

POWER

RESET STATE

SIGNAL NAME ^{(1) (2)}

SIGNAL TYPE ⁽³⁾BUFFER TYPE ⁽⁴⁾

SOURCE⁽⁵⁾

AFTER BOR ^{(6) (7)}

PZ

P6.4

I/O

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

LVCMOS

Analog

DVCC

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

CB4

I

1

A1

B2

B1

C3

C2

C1

D4

D2

AD0+

OA0O

P6.5

I

O

I/O

CB5

I

2

3

4

5

6

7

8

AD0-

OA0IN0

P6.6

I

I/O

CB6

I

AD1+

G0SW0

P6.7

I

I/O

CB7

I

AD1-

G0SW1

P7.4

I

I/O

CB8

I

AD2+

OA1O

P7.5

I

O

I/O

CB9

I

AD2-

OA1IN0

P7.6

I

I/O

CB10

AD3+

G1SW0

P7.7

I

I/O

I

CB11

AD3-

G1SW1

P5.0

I

I/O

O

I

9

D1

E4

E2

VREFBG

VeREF+

P5.1

I/O

I

DVCC

10

11

A4

DAC0

P5.6

O

I/O

I

A5

DAC1

O

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Table 7-1. Pin Attributes (continued)

PIN NO.

ZCA, ZQW

POWER

RESET STATE

SIGNAL NAME ^{(1) (2)}

SIGNAL TYPE ⁽³⁾BUFFER TYPE ⁽⁴⁾

SOURCE⁽⁵⁾

AFTER BOR ^{(6) (7)}

PZ

12

13

14

15

16

17

E1

F2

NR

I

Analog

Power

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

AVSS1

XOUT

XIN

P

N/A

F1

O

Analog

N/A

G1

I

Analog

N/A

H1, G2

G4

AVCC

CPCAP

P2.0

P

Power

N/A

I/O

O

Analog

DVCC

N/A

LVCMOS

Analog

18

19

H2

J1

P2MAP0

DAC0

P2.1

I/O

O

LVCMOS

Analog

P2MAP1

DAC1

P2.2

I/O

I

LVCMOS

Analog

20

21

H4

J2

P2MAP2

P2.3

P2MAP3

P2.4

22

23

K1

K2

P2MAP4

R03

P2.5

LVCMOS

Analog

P2MAP5

P2.6

P2MAP6

LCDREF

R13

24

L2

I/O

P

Analog

DVCC

N/A

P2.7

LVCMOS

Analog

25

L3

P2MAP7

R23

26

27

28

L1

M1

M2

DVCC1

DVSS1

VCORE

LCDCAP

R33

Power

P

Power

N/A

P

Power

DVCC

I/O

O

Analog

29

30

M3

J4

Analog

COM0

P5.3

Analog

I/O

O

LVCMOS

Analog

31

32

L4

COM1

S42

O

Analog

P5.4

I/O

O

LVCMOS

Analog

M4

COM2

S41

O

P5.5

I/O

O

LVCMOS

Analog

33

34

J5

L5

COM3

S40

P1.0

I/O

LVCMOS

12

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Table 7-1. Pin Attributes (continued)

PIN NO.

POWER

RESET STATE

SIGNAL NAME ^{(1) (2)}

SIGNAL TYPE ⁽³⁾BUFFER TYPE ⁽⁴⁾

SOURCE⁽⁵⁾

AFTER BOR ^{(6) (7)}

PZ

ZCA, ZQW

TA0CLK

ACLK

S39

I

LVCMOS

Analog

DVCC

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

O

P1.1

I/O

O

LVCMOS

Analog

TA0.0

BSLTX

S38

35

36

M5

J6

O

P1.2

I/O

I

LVCMOS

Analog

TA0.1

BSLRX

S37

O

P1.3

I/O

O

LVCMOS

Analog

37

38

39

40

41

H6

M6

L6

TA0.2

S36

P1.4

I/O

O

LVCMOS

Analog

TA0.3

S35

P1.5

I/O

O

LVCMOS

Analog

TA0.4

S34

P1.6

I/O

O

LVCMOS

Analog

J7

TA0.1

S33

P1.7

I/O

O

LVCMOS

Analog

M7

TA0.2

S32

P3.0

I/O

I

LVCMOS

Analog

TA1CLK

CBOUT

S31

42

L7

O

P3.1

I/O

O

LVCMOS

Analog

43

44

45

H7

M8

L8

TA1.0

S30

P3.2

I/O

O

LVCMOS

Analog

TA1.1

S29

P3.3

I/O

O

LVCMOS

Analog

TA1.2

S28

P3.4

I/O

I

LVCMOS

Analog

TA2CLK

SMCLK

S27

46

47

J8

O

M9

P3.5

I/O

LVCMOS

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Table 7-1. Pin Attributes (continued)

PIN NO.

ZCA, ZQW

POWER

RESET STATE

SIGNAL NAME ^{(1) (2)}

SIGNAL TYPE ⁽³⁾BUFFER TYPE ⁽⁴⁾

SOURCE⁽⁵⁾

AFTER BOR ^{(6) (7)}

PZ

TA2.0

I/O

O

LVCMOS

Analog

DVCC

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

S26

P3.6

I/O

O

LVCMOS

Analog

48

49

50

51

52

53

54

55

56

L9

M10

J9

TA2.1

S25

P3.7

I/O

O

LVCMOS

Analog

TA2.2

S24

P4.0

I/O

O

LVCMOS

Analog

TB0.0

S23

P4.1

I/O

O

LVCMOS

Analog

M11

L10

M12

L12

L11

K11

TB0.1

S22

P4.2

I/O

O

LVCMOS

Analog

TB0.2

S21

P4.3

I/O

O

LVCMOS

Analog

TB0.3

S20

P4.4

I/O

O

LVCMOS

Analog

TB0.4

S19

P4.5

I/O

O

LVCMOS

Analog

TB0.5

S18

P4.6

I/O

O

LVCMOS

Analog

TB0.6

S17

P4.7

I/O

I

LVCMOS

Analog

TB0OUTH

SVMOUT

S16

57

58

59

K12

J11

J12

O

P8.0

I/O

I

LVCMOS

Analog

TB0CLK

S15

O

P8.1

I/O

O

LVCMOS

Analog

UCB1STE

UCA1CLK

S14

P8.2

I/O

O

LVCMOS

Analog

UCA1TXD

UCA1SIMO

S13

60

H11

I/O

O

14

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Table 7-1. Pin Attributes (continued)

PIN NO.

POWER

RESET STATE

SIGNAL NAME ^{(1) (2)}

SIGNAL TYPE ⁽³⁾BUFFER TYPE ⁽⁴⁾

SOURCE⁽⁵⁾

AFTER BOR ^{(6) (7)}

PZ

ZCA, ZQW

P8.3

I/O

I

LVCMOS

Analog

DVCC

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

OFF

N/A

HiZ

UCA1RXD

UCA1SOMI

S12

61

H12

I/O

O

P8.4

I/O

O

LVCMOS

Analog

UCB1CLK

UCA1STE

S11

62

G11

63

64

G12

F12

DVSS2

DVCC2

P8.5

P

Power

P

Power

N/A

I/O

O

LVCMOS

Analog

DVCC

N/A

UCB1SIMO

UCB1SDA

S10

65

66

F11

G9

P8.6

I/O

O

LVCMOS

Analog

UCB1SOMI

UCB1SCL

S9

P8.7

I/O

O

LVCMOS

Analog

67

68

69

70

71

72

73

74

E12

E11

F9

S8

P9.0

I/O

O

LVCMOS

Analog

S7

P9.1

I/O

O

LVCMOS

Analog

S6

P9.2

I/O

O

LVCMOS

Analog

D12

D11

E9

S5

P9.3

I/O

O

LVCMOS

Analog

S4

P9.4

I/O

O

LVCMOS

Analog

S3

P9.5

I/O

O

LVCMOS

Analog

C12

C11

S2

P9.6

I/O

O

LVCMOS

Analog

S1

P9.7

I/O

O

LVCMOS

Analog

75

76

77

D9

B11, B12

A12

S0

VSSU

PU.0

P

Power

I/O

HVCMOS

VBUS

DP

N/A

HVCMOS/open-

drain

PUR (FG662x only)

I/O

VBUS

HiZ

78

79

B10

A11

NC (FG642x only)

I/O

N/A

HiZ

N/A

PU.1

DM

HVCMOS

VBUS

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Table 7-1. Pin Attributes (continued)

PIN NO.

ZCA, ZQW

POWER

RESET STATE

SIGNAL NAME ^{(1) (2)}

SIGNAL TYPE ⁽³⁾BUFFER TYPE ⁽⁴⁾

SOURCE⁽⁵⁾

AFTER BOR ^{(6) (7)}

PZ

VBUS

I

Power

Analog

Power

N/A

External

N/A

OFF

N/A

OFF

N/A

OFF

N/A

80

A10

A9

LDOI

VUSB

O

–

81

LDOO

Analog

Power

VBUS

N/A

V18 (FG662x only)

NC (FG642x only)

AVSS2

82

83

84

B9

A8

B8

N/A

P

Power

N/A

P7.2

I/O

I

LVCMOS

Analog

LVCMOS

Analog

Power

DVCC

N/A

XT2IN

P7.3

I/O

O

I/O

P

85

B7

XT2OUT

VBAK

86

87

A7

D8

VBAT

N/A

P5.7

I/O

I

LVCMOS

Power

DVCC

N/A

88

D7

DMAE0

RTCCLK

DVCC3

DVSS3

O

P

89

90

A6

A5

P

Power

N/A

No Emu: PD

Emu: PD

TEST

I

LVCMOS

DVCC

91

92

B6

B5

SBWTCK

PJ.0

I

LVCMOS

DVCC

N/A

I/O

OFF

No Emu: OFF

Emu: DRIVE0

TDO

PJ.1

TDI

O

I/O

I

LVCMOS

DVCC

OFF

No Emu: OFF

Emu: PU

93

A4

No Emu: OFF

Emu: OFF

TCLK

PJ.2

TMS

PJ.3

TCK

I

I/O

I

LVCMOS

DVCC

OFF

94

95

E7

D6

No Emu: OFF

Emu: PU

I/O

I

OFF

No Emu: OFF

Emu: PU

RST

NMI

I/O

LVCMOS

Analog

DVCC

PU

N/A

PU

96

97

A3

B4

I

SBWTDIO

P6.0

CB0

A0

I/O

OFF

N/A

OFF

N/A

OFF

N/A

I

Analog

P6.1

CB1

A1

I/O

LVCMOS

Analog

98

99

B3

A2

I

Analog

P6.2

CB2

I/O

I

LVCMOS

Analog

16

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Table 7-1. Pin Attributes (continued)

PIN NO.

POWER

RESET STATE

SIGNAL NAME ^{(1) (2)}

SIGNAL TYPE ⁽³⁾BUFFER TYPE ⁽⁴⁾

SOURCE⁽⁵⁾

AFTER BOR ^{(6) (7)}

PZ

ZCA, ZQW

A2

I

Analog

LVCMOS

Analog

DVCC

N/A

OFF

N/A

OA0IP0

P6.3

CB3

I

I/O

I

100

N/A

D5

A3

OA1IP0

E5, E6, E8,

F4, F5, F8,

G5, G8, H5,

H8, H9

Reserved

-

–

(1) For each multiplexed pin, the signal that is listed first in this table is the reset default.

(2) To determine the pin mux encodings for each pin, refer to Section 9.13.

(3) Signal Types: I = Input, O = Output, I/O = Input or Output, P = power

(4) Buffer Types: LVCMOS, HVCMOS, Analog, or Power (see Table 7-3 for details).

(5) The power source shown in this table is the I/O power source, which may differ from the module power source.

(6) Reset States:

OFF = High-impedance input with pullup or pulldown disabled (if available)

HiZ = High-impedance (neither input nor output)

PD = High-impedance input with pulldown enabled

PU = High-impedance input with pullup enabled

DRIVE0 = Drive output low

DRIVE1 = Drive output high

N/A = Not applicable

(7) For Debug pins: Emu = with emulator attached at reset, No Emu = without emulator attached at reset

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7.3 Signal Descriptions

Table 7-2 describes the signals for all device variants and package options.

Table 7-2. Signal Descriptions

PIN NO.

SIGNAL

NAME

FUNCTION

DESCRIPTION

TYPE⁽¹⁾

ZCA,

ZQW

PZ

A0

A1

A2

A3

A4

A5

97

98

99

100

10

11

1

B4

B3

A2

D5

E4

E2

A1

B2

B1

C3

C2

C1

D4

D2

D1

J6

I

ADC analog single ended input A0

ADC analog single ended input A1

I

ADC analog single ended input A2

I

ADC analog single ended input A3

I

ADC analog single ended input A4

I

ADC analog single ended input A5

AD0+

AD0-

I

ADC positive analog differential input AD0+

ADC negative analog differential input AD0-

ADC positive analog differential input AD1+

ADC negative analog differential input AD1-

ADC positive analog differential input AD2+

ADC negative analog differential input AD2-

ADC positive analog differential input AD3+

ADC negative analog differential input AD3-

Input for an external reference voltage to the ADC and DAC

BSL receive input

ADC

2

I

AD1+

AD1-

3

I

4

I

AD2+

AD2-

5

I

6

I

AD3+

AD3-

7

I

8

I

VeREF+

BSLRX

BSLTX

9

I

36

35

I

BSL

M5

O

BSL transmit output

Capacitor for backup subsystem. Do not load this pin externally. For

capacitor values, see C_BAKin Section 8.3.

VBAK

VBAT

86

87

A7

D8

I/O

P

Backup

Backup or secondary supply voltage. If backup voltage is not supplied,

connect to DVCC externally.

Charge Pump CPCAP

ACLK

17

34

88

46

15

14

84

85

97

98

99

100

1

G4

L5

I/O

O

I

Capacitor for op amp and CTSD16 rail-to-rail charge pump

ACLK output (divided by 1, 2, 4, 8, 16, or 32)

RTCCLK output

RTCCLK

D7

J8

SMCLK

SMCLK output

Clock

XIN

G1

F1

B8

B7

B4

B3

A2

D5

A1

B2

B1

C3

C2

C1

D4

D2

L7

Input terminal for crystal oscillator XT1

Output terminal of crystal oscillator XT1

Input terminal for crystal oscillator XT2

Output terminal of crystal oscillator XT2

Comparator_B input CB0

XOUT

XT2IN

XT2OUT

CB0

O

I

O

I

CB1

I

Comparator_B input CB1

CB2

I

Comparator_B input CB2

CB3

I

Comparator_B input CB3

CB4

I

Comparator_B input CB4

CB5

2

I

Comparator_B input CB5

Comparator

CB6

3

I

Comparator_B input CB6

CB7

4

I

Comparator_B input CB7

CB8

5

I

Comparator_B input CB8

CB9

6

I

Comparator_B input CB9

CB10

CB11

CBOUT

7

I

Comparator_B input CB10

8

I

Comparator_B input CB11

42

O

Comparator_B output

18

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FUNCTION

SLAS874B – MAY 2015 – REVISED SEPTEMBER 2020

Table 7-2. Signal Descriptions (continued)

PIN NO.

SIGNAL

NAME

DESCRIPTION

TYPE⁽¹⁾

ZCA,

ZQW

PZ

10

18

E4

H2

DAC0

O

DAC output channel 0

DAC output channel 1

DAC

DMA

11

19

E2

J1

DAC1

DMAE0

SBWTCK

TCK

88

91

95

93

92

91

94

96

34

35

36

37

38

39

40

41

D7

B6

D6

A4

B5

B6

E7

A3

L5

I

DMA external trigger input

Spy-Bi-Wire input clock

Test clock

I

TCLK

TDI

I

Test clock input

I

Test data input

Debug

TDO

O

Test data output

TEST

TMS

I

Test mode pin; selects digital I/O on JTAG pins

Test mode select

I

SBWTDIO

P1.0

I/O

Spy-Bi-Wire data input/output

General-purpose digital I/O with port interrupt

P1.1

M5

J6

P1.2

P1.3

H6

M6

L6

P1.4

P1.5

P1.6

J7

P1.7

M7

General-purpose digital I/O with port interrupt and mappable secondary

function

P2.0

P2.1

P2.2

P2.3

P2.4

P2.5

P2.6

P2.7

18

19

20

21

22

23

24

25

H2

J1

I/O

General-purpose digital I/O with port interrupt and mappable secondary

function

General-purpose digital I/O with port interrupt and mappable secondary

function

H4

J2

General-purpose digital I/O with port interrupt and mappable secondary

function

GPIO

General-purpose digital I/O with port interrupt and mappable secondary

function

K1

K2

L2

L3

General-purpose digital I/O with port interrupt and mappable secondary

function

General-purpose digital I/O with port interrupt and mappable secondary

function

General-purpose digital I/O with port interrupt and mappable secondary

function

P3.0

P3.1

P3.2

P3.3

P3.4

P3.5

P3.6

P3.7

P4.0

42

43

44

45

46

47

48

49

50

L7

H7

M8

L8

I/O

General-purpose digital I/O with port interrupt

J8

M9

L9

M10

J9

GPIO

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Table 7-2. Signal Descriptions (continued)

PIN NO.

SIGNAL

NAME

FUNCTION

DESCRIPTION

TYPE⁽¹⁾

ZCA,

PZ

ZQW

M11

L10

M12

L12

L11

K11

K12

D1

P4.1

51

52

53

54

55

56

57

9

I/O

General-purpose digital I/O with port interrupt

General-purpose digital I/O

P4.2

P4.3

P4.4

P4.5

P4.6

P4.7

P5.0

P5.1

P5.3

P5.4

P5.5

P5.6

P5.7

P6.0

P6.1

P6.2

P6.3

P6.4

P6.5

P6.6

P6.7

P7.2

P7.3

P7.4

P7.5

P7.6

P7.7

P8.0

P8.1

P8.2

P8.3

P8.4

P8.5

P8.6

P8.7

P9.0

P9.1

P9.2

P9.3

P9.4

P9.5

P9.6

P9.7

10

31

32

33

11

88

97

98

99

100

1

E4

General-purpose digital I/O

L4

General-purpose digital I/O

M4

J5

General-purpose digital I/O

E2

General-purpose digital I/O

D7

General-purpose digital I/O

B4

General-purpose digital I/O

B3

General-purpose digital I/O

A2

General-purpose digital I/O

D5

General-purpose digital I/O

A1

General-purpose digital I/O

2

B2

General-purpose digital I/O

3

B1

General-purpose digital I/O

4

C3

General-purpose digital I/O

84

85

5

B8

General-purpose digital I/O

B7

General-purpose digital I/O

C2

General-purpose digital I/O

6

C1

General-purpose digital I/O

7

D4

General-purpose digital I/O

8

D2

General-purpose digital I/O

58

59

60

61

62

65

66

67

68

69

70

71

72

73

74

75

J11

J12

H11

H12

G11

F11

G9

General-purpose digital I/O

E12

E11

F9

General-purpose digital I/O

D12

D11

E9

General-purpose digital I/O

GPIO

General-purpose digital I/O

C12

C11

D9

General-purpose digital I/O

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FUNCTION

SLAS874B – MAY 2015 – REVISED SEPTEMBER 2020

Table 7-2. Signal Descriptions (continued)

PIN NO.

SIGNAL

NAME

DESCRIPTION

TYPE⁽¹⁾

ZCA,

ZQW

PZ

PJ.0

92

93

94

95

B5

A4

E7

D6

I/O

General-purpose digital I/O

PJ.1

PJ.2

PJ.3

General-purpose digital I/O - controlled by USB control register (FG662x

devices) or PU control register

PU.0

77

79

3

A12

A11

B1

I/O

General-purpose digital I/O - controlled by USB control register (FG662x

devices) or PU control register

PU.1

I/O

Analog switch to AVSS. Internally connected to ADC positive analog

differential input AD1+.

G0SW0

G0SW1

G1SW0

G1SW1

I

Analog switch to AVSS. Internally connected to ADC negative analog

differential input AD1-.

4

C3

Ground Switch

Analog switch to AVSS. Internally connected to ADC positive analog

differential input AD3+.

7

D4

Analog switch to AVSS. Internally connected to ADC negative analog

differential input AD3-.

8

D2

UCB1SCL

UCB1SDA

COM0

66

65

30

31

32

33

G9

F11

J4

I/O

O

USCI_B1 I²C clock

I²C

USCI_B1 I²C data

LCD common output COM0 for LCD backplane

LCD common output COM1 for LCD backplane

LCD common output COM2 for LCD backplane

LCD common output COM3 for LCD backplane

COM1

L4

O

COM2

M4

J5

O

COM3

I/O

LCD capacitor connection

CAUTION: LCDCAP/R33 must be connected to DV_SSif not used.

LCDCAP

29

M3

I/O

LCDREF

R03

24

22

24

25

L2

K1

L2

L3

I

External reference voltage input for regulated LCD voltage

Input/output port of lowest analog LCD voltage (V5)

I/O

R13

Input/output port of third most positive analog LCD voltage (V3 or V4)

Input/output port of second most positive analog LCD voltage (V2)

LCD

R23

Input/output port of most positive analog LCD voltage (V1)

CAUTION: LCDCAP/R33 must be connected to DV_SSif not used.

R33

29

M3

I/O

S0

75

74

73

72

71

70

69

68

67

66

65

62

61

60

59

58

D9

C11

C12

E9

O

LCD segment output S0

LCD segment output S1

LCD segment output S2

LCD segment output S3

LCD segment output S4

LCD segment output S5

LCD segment output S6

LCD segment output S7

LCD segment output S8

LCD segment output S9

LCD segment output S10

LCD segment output S11

LCD segment output S12

LCD segment output S13

LCD segment output S14

LCD segment output S15

S1

S2

S3

S4

D11

D12

F9

S5

S6

S7

E11

E12

G9

S8

S9

S10

S11

S12

S13

S14

S15

F11

G11

H12

H11

J12

J11

LCD

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Table 7-2. Signal Descriptions (continued)

PIN NO.

SIGNAL

NAME

FUNCTION

DESCRIPTION

TYPE⁽¹⁾

ZCA,

PZ

ZQW

K12

K11

L11

L12

M12

L10

M11

J9

S16

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

O

LCD segment output S16

LCD segment output S17

LCD segment output S18

LCD segment output S19

LCD segment output S20

LCD segment output S21

LCD segment output S22

LCD segment output S23

LCD segment output S24

LCD segment output S25

LCD segment output S26

LCD segment output S27

LCD segment output S28

LCD segment output S29

LCD segment output S30

LCD segment output S31

LCD segment output S32

LCD segment output S33

LCD segment output S34

LCD segment output S35

LCD segment output S36

LCD segment output S37

LCD segment output S38

LCD segment output S39

LCD segment output S40

LCD segment output S41

LCD segment output S42

S17

S18

S19

S20

S21

S22

S23

S24

S25

S26

S27

S28

S29

S30

S31

S32

S33

S34

S35

S36

S37

S38

S39

S40

S41

S42

M10

L9

M9

J8

L8

M8

H7

L7

M7

J7

L6

M6

H6

J6

M5

L5

J5

M4

L4

Default mapping: USCI_B0 SPI slave transmit enable; USCI_A0 clock

input/output

P2MAP0

18

H2

I/O

Mapping Options: See Table 9-8

Default mapping: USCI_B0 SPI slave in/master out; USCI_B0 I²C data

Mapping Options: See Table 9-8

P2MAP1

P2MAP2

19

20

J1

I/O

Default mapping: USCI_B0 SPI slave out/master in; USCI_B0 I²C clock

Mapping Options: See Table 9-8

H4

Default mapping: USCI_B0 clock input/output; USCI_A0 SPI slave

transmit enable

Mapping Options: See Table 9-8

P2MAP3

P2MAP4

P2MAP5

21

22

23

J2

K1

K2

I/O

Mappable

Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in/

master out

Mapping Options: See Table 9-8

Default mapping: USCI_A0 UART receive data; USCI_A0 slave out/

master in

Mapping Options: See Table 9-8

Default mapping: no secondary function

Mapping Options: See Table 9-8

P2MAP6

P2MAP7

24

25

L2

L3

I/O

Default mapping: no secondary function

Mapping Options: See Table 9-8

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FUNCTION

SLAS874B – MAY 2015 – REVISED SEPTEMBER 2020

Table 7-2. Signal Descriptions (continued)

PIN NO.

SIGNAL

NAME

DESCRIPTION

TYPE⁽¹⁾

ZCA,

ZQW

PZ

12

6

Noise

Reduction

NR

E1

C1

I

Noise reduction. Connect pin to analog ground.

OA1 negative input internally connected to ADC negative analog

differential input AD2-

OA1IN0

OA0 negative input internally connected to ADC negative analog

differential input AD0-

OA0IN0

OA0IP0

OA0O

2

99

1

B2

A2

A1

D5

C2

I

OA0 positive input internally connected to ADC analog input A2

Op Amp

OA0 output internally connected to ADC positive analog differential input

AD0+

O

I

OA1IP0

OA1O

100

5

OA1 positive input internally connected to ADC analog input A3

OA1 output internally connected to ADC positive analog differential input

AD2+

O

AVSS1

AVSS2

AVCC

13

83

16

26

64

89

27

63

90

80

81

F2

A8

P

I

Analog ground supply

H1, G2

L1

Analog power supply

DVCC1

DVCC2

DVCC3

DVSS1

DVSS2

DVSS3

LDOI

Digital power supply

F12

A6

Digital power supply

Power

M1

Digital ground supply

G12

A5

Digital ground supply

A10

A9

LDO input (not available on FG662x devices)

LDO output (not available on FG662x devices)

LDOO

O

Regulated core power supply (internal use only, no external current

loading)

VCORE⁽²⁾

VREFBG

NC

28

9

M2

D1

O

REF

Output of reference voltage to the ADC and DAC

Not connected (not available on FG662x devices)

78

82

B10

B9

I/O

E5, E6,

E8, F4,

F5, F8,

G5, G8,

H5, H8,

H9

Reserved

Reserved. Internally connected to DVSS. TI recommends external

connection to ground (DVSS).

Reserved

–

UCA1CLK

UCA1SIMO

UCA1SOMI

UCA1STE

UCB1CLK

UCB1SIMO

UCB1SOMI

UCB1STE

NMI

59

60

61

62

65

66

59

96

57

35

36

J12

H11

H12

G11

F11

G9

I/O

I

USCI_A1 clock input/output

USCI_A1 SPI slave in/master out

USCI_A1 SPI slave out/master in

USCI_A1 SPI slave transmit enable

USCI_B1 clock input/output

SPI

USCI_B1 SPI slave in/master out

USCI_B1 SPI slave out/master in

USCI_B1 SPI slave transmit enable

Nonmaskable interrupt input

J12

A3

System

RST

A3

I/O

O

Reset input (active low)⁽³⁾

SVMOUT

TA0.0

K12

M5

SVM output

I/O

Timer TA0 CCR0 capture: CCI0A input, compare: Out0 output

Timer TA0 CCR1 capture: CCI1A input, compare: Out1 output

Timer_A

TA0.1

J6

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Table 7-2. Signal Descriptions (continued)

PIN NO.

SIGNAL

NAME

FUNCTION

DESCRIPTION

TYPE⁽¹⁾

ZCA,

PZ

ZQW

J7

40

37

41

38

39

34

43

44

45

42

47

48

49

46

50

51

52

53

54

55

56

58

57

59

61

60

79

77

I/O

I

Timer TA0 CCR1 capture: CCI1B input, compare: Out1 output

Timer TA0 CCR2 capture: CCI2A input, compare: Out2 output

Timer TA0 CCR2 capture: CCI2B input, compare: Out2 output

Timer TA0 CCR3 capture: CCI3A input compare: Out3 output

Timer TA0 CCR4 capture: CCI4A input, compare: Out4 output

Timer TA0 clock signal TACLK input

H6

TA0.2

M7

M6

L6

TA0.3

TA0.4

TA0CLK

TA1.0

L5

H7

I/O

I

Timer TA1 capture CCR0: CCI0A input, compare: Out0 output

Timer TA1 capture CCR1: CCI1A input, compare: Out1 output

Timer TA1 capture CCR2: CCI2A input, compare: Out2 output

Timer TA1 clock input

TA1.1

M8

L8

TA1.2

TA1CLK

TA2.0

L7

M9

L9

I/O

I

Timer TA2 capture CCR0: CCI0A input, compare: Out0 output

Timer TA2 capture CCR1: CCI1A input, compare: Out1 output

Timer TA2 capture CCR2: CCI2A input, compare: Out2 output

Timer TA2 clock input

TA2.1

TA2.2

M10

J8

TA2CLK

TB0.0

J9

I/O

I

Timer TB0 capture CCR0: CCI0A input, compare: Out0 output

Timer TB0 capture CCR1: CCI1A input, compare: Out1 output

Timer TB0 capture CCR2: CCI2A input, compare: Out2 output

Timer TB0 capture CCR3: CCI3A input, compare: Out3 output

Timer TB0 capture CCR4: CCI4A input, compare: Out4 output

Timer TB0 capture CCR5: CCI5A input, compare: Out5 output

Timer TB0 capture CCR6: CCI6A input, compare: Out6 output

Timer TB0 clock input

TB0.1

M11

L10

M12

L12

L11

K11

J11

K12

J12

H12

H11

A11

A12

TB0.2

TB0.3

Timer_B

TB0.4

TB0.5

TB0.6

TB0CLK

TB0OUTH

UCA1CLK

UCA1RXD

UCA1TXD

DM

I

Timer TB0: switch all PWM outputs to high impedance

USCI_A1 clock input/output

I/O

I

UART

USCI_A1 UART receive data

O

USCI_A1 UART transmit data

I/O

USB data terminal DM (not available on FG6426 and FG6425 devices)

USB data terminal DP (not available on FG6426 and FG6425 devices)

DP

USB pullup resistor pin (open drain). The voltage level at the PUR pin is

used to invoke the default USB BSL.

Recommended 1-MΩ resistor to ground. See Section 9.6 for more

information.

PUR

78

B10

I/O

Not available on FG6426 and FG6425 devices.

USB

(FG662x only)

USB regulated power (internal use only, no external current loading) (not

available on FG6426 and FG6425 devices)

V18

82

80

B9

O

I

USB LDO input (connect to USB power source) (not available on FG6426

and FG6425 devices)

VBUS

A10

B11

B12

VSSU

VUSB

76

81

P

USB PHY ground supply

A9

O

USB LDO output (not available on FG6426 and FG6425 devices)

(1) I = input, O = output, I/O = input or output, P = power

(2) VCORE is for internal use only. No external current loading is possible. VCORE must be connected to the recommended capacitor

value, C_VCORE

(3) When this pin is configured as reset, the internal pullup resistor is enabled by default.

.

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7.4 Pin Multiplexing

Pin multiplexing for these devices is controlled by both register settings and operating modes (for example, if the

device is in test mode). For details of the settings for each pin and schematics of the multiplexed ports, see

Section 9.13.

7.5 Buffer Type

Table 7-3 describes the buffer types that are referenced in Table 7-1.

Table 7-3. Buffer Type

NOMINAL

OUTPUT DRIVE

STRENGTH

(mA)

BUFFER TYPE

(STANDARD)

NOMINAL

VOLTAGE

PU OR PD

STRENGTH

(µA)

OTHER

CHARACTERISTICS

HYSTERESIS

PU OR PD

N/A

See analog modules in

Section 8, Specifications for

details

Analog⁽²⁾

HVCMOS

3.0 V

5.0 V

N

Y

N/A

See Section

8.8.5.7, Typical

Characteristics –

Outputs

N/A

See Section

8.8.5.7, Typical

Characteristics –

Outputs

See Section

8.8.5, General-

Purpose I/Os

LVCMOS

3.0 V

Y⁽¹⁾

Programmable

SVS enables hysteresis on

DVCC

Power (DVCC)⁽³⁾

Power (AVCC)⁽³⁾

3.0 V

0 V

N

N/A

Power (DVSS

and AVSS)⁽³⁾

(1) Only for input pins

(2) This is a switch, not a buffer.

(3) This is supply input, not a buffer.

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7.6 Connection of Unused Pins

Table 7-4 lists the correct termination of all unused pins.

Table 7-4. Connection of Unused Pins

⁽¹⁾PIN

POTENTIAL

DV_CC

COMMENT

AVCC

AVSS

DV_SS

Open

DV_SS

Open

CPCAP

LCDCAP

LDOI

For devices where the charge pump is not used (no rail-to-rail OA and no rail-to-rail CTSD16).

For devices with LDO-PWR module when not being used in the application.

LDOO

NC

PJ.0/TDO

PJ.1/TDI

PJ.2/TMS

PJ.3/TCK

The JTAG pins are shared with general-purpose I/O function (PJ.x). If not being used, these must

be switched to port function, output direction (PJDIR.n = 1). When used as JTAG pins, these pins

must remain open.

Open

PU.0/DP

PU.1/DM

Open

DV_SS

Open

For USB devices only when USB module is not being used in the application

PUR⁽³⁾

Switched to port function, output direction (PxDIR.n = 1). Px.y represents port x and bit y of port x

(for example, P1.0, P1.1, P2.2, PJ.0, PJ.1)

Px.y

RST/NMI

Reserved

TEST

DV_CCor V_CC

DV_SS

47-kΩ pullup or internal pullup selected with 10-nF (2.2 nF) pulldown⁽²⁾

Open

This pin always has an internal pulldown enabled.

V18

Open

For USB devices only when USB module is not being used in the application

For devices where no separate battery backup supply is used in the system. Set bit BAKDIS = 1.

For USB devices only when USB module is not being used in the application

VBAK

Open

VBAT

DV_CC

VBUS, VSSU

VUSB

DV_SS

Open

For dedicated XIN pins only. XIN pins with shared GPIO functions must be programmed to GPIO

and follow Px.y recommendations.

XIN

DV_SS

Open

DV_SS

Open

For dedicated XOUT pins only. XOUT pins with shared GPIO functions must be programmed to

GPIO and follow Px.y recommendations.

XOUT

XT2IN

XT2OUT

For dedicated XT2IN pins only. XT2IN pins with shared GPIO functions must be programmed to

GPIO and follow Px.y recommendations.

For dedicated XT2OUT pins only. XT2OUT pins with shared GPIO functions must be programmed

to GPIO and follow Px.y recommendations.

(1) Any unused pin with a secondary function that is shared with general-purpose I/O should follow the Px.y unused pin connection

guidelines.

(2) The pulldown capacitor should not exceed 2.2 nF when using devices with Spy-Bi-Wire interface in Spy-Bi-Wire mode or in 4-wire

JTAG mode with TI tools such as FET interfaces or GANG programmers.

(3) The default USB BSL evaluates the state of the PUR pin after a BOR reset. If it is pulled high externally, then the BSL is invoked.

Therefore, unless invoking the BSL, it is important to keep PUR pulled low after a BOR reset, even if BSL or USB is never used. TI

recommends a 1-MΩ resistor to ground.

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8 Specifications

All graphs in this section are for typical conditions, unless otherwise noted.

Typical (TYP) values are specified at V_CC= 3.3 V and T_A= 25°C, unless otherwise noted.

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

4.1

UNIT

V

Voltage applied at V_CCto V_SS

–0.3

Voltage applied to any pin (excluding VCORE, VBUS, V18, LDOI) ⁽²⁾

V_CC+ 0.3

±2

V

Diode current at any device pin

mA

°C

(3)

Storage temperature, T_stg

–55

150

Maximum junction temperature, T_J

95

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages referenced to V_SS. VCORE is for internal device use only. No external DC loading or voltage should be applied.

(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow

temperatures not higher than classified on the device label on the shipping boxes or reels.

8.2 ESD Ratings

VALUE

±1000

±250

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

V_(ESD)Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as

±1000 V may actually have higher performance.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as

±250 V may actually have higher performance.

8.3 Recommended Operating Conditions

Typical values are specified at V_CC= 3.3 V and T_A= 25°C (unless otherwise noted)

MIN

1.8

2.0

2.2

2.4

1.8

2.0

2.2

2.4

2.2

2.4

NOM

MAX UNIT

PMMCOREV = 0

3.6

Supply voltage during program execution and flash

PMMCOREV = 0, 1

PMMCOREV = 0, 1, 2

PMMCOREV = 0, 1, 2, 3

PMMCOREV = 0

3.6

V

3.6

V_CC

programming (AVCC = DVCC1 = DVCC2 = DVCC3 =

(1) (2) (3)

DV_CC= V_CC

)

3.6

PMMCOREV = 0, 1

PMMCOREV = 0, 1, 2

PMMCOREV = 0, 1, 2, 3

PMMCOREV = 2

Supply voltage during USB operation, USB PLL disabled

(USB_EN = 1, UPLLEN = 0)

3.6

V

3.6

(2)

V_CC,USB

3.6

V

Supply voltage during USB operation, USB PLL enabled

⁽⁴⁾(USB_EN = 1, UPLLEN = 1)

PMMCOREV = 2, 3

V_SS

Supply voltage (AVSS1 = AVSS2 = AVSS3 = DVSS1 = DVSS2 = DVSS3 = V_SS

)

0

T_A= 0°C to 85°C

T_A= –40°C to 85°C

I version

1.55

1.70

1.20

–40

1

3.6

V

V_BAT,RTC

Backup-supply voltage with RTC operational

3.6

V_BAT,MEM

T_A

Backup-supply voltage with backup memory retained

Operating free-air temperature

3.6

85

10

V

°C

nF

T_J

Operating junction temperature

I version

C_BAK

Capacitance at pin VBAK

4.7

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8.3 Recommended Operating Conditions (continued)

Typical values are specified at V_CC= 3.3 V and T_A= 25°C (unless otherwise noted)

MIN

NOM

MAX UNIT

C_VCORE

C_DVCC

C_VCORE

Capacitor at VCORE⁽⁵⁾

470

nF

/

Capacitor ratio of DVCC to VCORE

10

0

PMMCOREV = 0,

1.8 V ≤ V_CC≤ 3.6 V

(default condition)

8.0

PMMCOREV = 1,

2 V ≤ V_CC≤ 3.6 V

Processor frequency (maximum MCLK frequency) ^{(6) (7)}

(see Figure 8-1)

0

12.0

MHz

f_SYSTEM

PMMCOREV = 2,

2.2 V ≤ V_CC≤ 3.6 V

16.0

20.0

PMMCOREV = 3,

2.4 V ≤ V_CC≤ 3.6 V

0

f_{SYSTEM_USB}Minimum processor frequency for USB operation

USB_wait Wait state cycles during USB operation

1.5

MHz

16

cycles

(1) TI recommends powering AV_CCand DV_CCfrom the same source. A maximum difference of 0.3 V between AV_CCand DV_CCcan be

tolerated during power up and operation.

(2) Some modules may have reduced recommended ranges of operation.

(3) The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the threshold parameters in Section

8.8.6.2 for the exact values and further details.

(4) USB operation with USB PLL enabled requires PMMCOREV ≥ 2 for proper operation.

(5) A capacitor tolerance of ±20% is required.

(6) The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse duration of the

specified maximum frequency.

(7) Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.

25

20

3

16

2, 3

2

12

8

1, 2

1, 2, 3

1

0

0, 1

0, 1, 2

0, 1, 2, 3

0

1.8

2.0

2.2

2.4

3.6

Supply Voltage - V

NOTE: The numbers within the fields denote the supported PMMCOREVx settings.

Figure 8-1. Frequency vs Supply Voltage

28

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8.4 Active Mode Supply Current Into V_CCExcluding External Current

over recommended operating free-air temperature (unless otherwise noted)^{(1) (2) (3)}

FREQUENCY (f_DCO= f_MCLK= f_SMCLK

8 MHz 12 MHz

TYP MAX

)

EXECUTION

MEMORY

PARAMETER

V_CC

PMMCOREV

1 MHz

20 MHz

UNIT

TYP

MAX

TYP

MAX

TYP

MAX

0

1

2

3

0

1

2

3

0.31

0.35

0.37

0.4

0.36

2.0

2.3

2.5

2.7

1.1

1.3

1.5

1.6

2.4

3.4

3.8

4.0

I_{AM, Flash}

Flash

RAM

3 V

mA

6.6

0.2

0.23

1.2

0.22

0.24

0.26

1.9

2.2

2.4

2.1

I_{AM, RAM}

3 V

mA

3.9

(1) All inputs are tied to 0 V or to V_CC. Outputs do not source or sink any current.

(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external

load capacitance are chosen to closely match the required 12.5 pF.

(3) Characterized with program executing typical data processing. FG6626 and FG6625 USB disabled (VUSBEN = 0, SLDOEN = 0).

FG6426 and FG6425 LDO disabled (LDOEN = 0).

f_ACLK= 32786 Hz, f_DCO= f_MCLK= f_SMCLKat specified frequency.

XTS = CPUOFF = SCG0 = SCG1 = OSCOFF = SMCLKOFF = 0.

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8.5 Low-Power Mode Supply Currents (Into V_CC) Excluding External Current

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)^{(1) (2)}

TEMPERATURE (T_A)

PARAMETER

V_CC

PMMCOREV

–40°C

TYP MAX

72

25°C

60°C

TYP MAX

81

85°C

UNIT

TYP MAX

2.2 V

3 V

0

3

0

3

0

1

2

0

1

2

3

0

1

2

3

0

1

2

3

77

92

87

105

9.9

11

87

104

12

98

117

17

I_LPM0,1MHzLow-power mode 0^{(3) (9)}

µA

86

97

2.2 V

3 V

6.9

7.5

8.5

3.2

3.6

4.0

3.4

3.8

4.2

1.5

1.6

1.8

0.9

1.0

1.1

8.5

I_LPM2

Low-power mode 2^{(4) (9)}

7.9

9.7

14

20

2.8

3.7

4.2

7.6

8.2

8.8

7.9

8.5

9.0

9.1

5.8

6.1

6.5

5.4

5.6

5.9

6.0

13.5

2.2 V

3.1

4.6

3.5

5.1

Low-power mode 3,

crystal mode^{(5) (9)}

I_LPM3,XT1LF

3.0

4.0

4.4

14

µA

3.3

4.9

3 V

3.7

5.3

3.7

4.8

2.1

5.3

16

1.2

2.4

12.5

Low-power mode 3,

VLO mode, Watchdog

enabled^{(6) (9)}

1.4

2.6

I_LPM3,

3 V

µA

VLO,WDT

1.6

2.8

1.6

2.6

1.8

2.9

14

0.6

1.9

11.5

0.7

2.0

I_LPM4

Low-power mode 4^{(7) (9)}

0.8

2.2

0.8

2.1

2.2

13

Low-power mode 3.5

(LPM3.5) current with

active RTC into primary

I_LPM3.5,

3 V

0.2

0.7

0.9

1.7

µA

RTC,VCC

(10)

supply pin DV_CC

Low-power mode 3.5

(LPM3.5) current with

active RTC into backup

supply pin VBAT⁽¹¹⁾

I_LPM3.5,

1.2

RTC,VBAT

Total low-power mode 3.5

(LPM3.5) current with

active RTC⁽¹²⁾

I_LPM3.5,

3 V

0.8

0.9

0.2

1.0

1.6

0.8

2.9

1.9

µA

RTC,TOT

Low-power mode 4.5

(LPM4.5)⁽⁸⁾

I_LPM4.5

0.12

0.6

0.32

(1) All inputs are tied to 0 V or to V_CC. Outputs do not source or sink any current.

(2) The currents are characterized with a Micro Crystal CC4V-T1A SMD crystal with a load capacitance of 9 pF. The internal and external

load capacitance are chosen to closely match the required 9 pF.

(3) Current for watchdog timer clocked by SMCLK included. ACLK = low-frequency crystal operation (XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0), f_ACLK= 32768 Hz, f_MCLK= 0 MHz, f_SMCLK= f_DCO= 1 MHz

FG6626 and FG6625 USB disabled (VUSBEN = 0, SLDOEN = 0). FG6426 and FG6425 LDO disabled (LDOEN = 0).

(4) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation

(XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2), f_ACLK= 32768 Hz, f_MCLK= 0 MHz, f_SMCLK= f_DCO= 0 MHz; DCO

setting = 1 MHz operation, DCO bias generator enabled.

FG6626 and FG6625 USB disabled (VUSBEN = 0, SLDOEN = 0). FG6426 and FG6425 LDO disabled (LDOEN = 0).

(5) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation

(XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), f_ACLK= 32768 Hz, f_MCLK= f_SMCLK= f_DCO= 0 MHz

FG6626 and FG6625 USB disabled (VUSBEN = 0, SLDOEN = 0). FG6426 and FG6425 LDO disabled (LDOEN = 0).

(6) Current for watchdog timer clocked by VLO included.

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), f_ACLK= f_MCLK= f_SMCLK= f_DCO= 0 MHz

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FG6626 and FG6625 USB disabled (VUSBEN = 0, SLDOEN = 0). FG6426 and FG6425 LDO disabled (LDOEN = 0).

(7) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4), f_DCO= f_ACLK= f_MCLK= f_SMCLK= 0 MHz

FG6626 and FG6625 USB disabled (VUSBEN = 0, SLDOEN = 0). FG6426 and FG6425 LDO disabled (LDOEN = 0).

(8) Internal regulator disabled. No data retention.

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF = 1 (LPM4.5), f_DCO= f_ACLK= f_MCLK= f_SMCLK= 0 MHz

(9) Current for brownout included. Low-side supervisor and monitors disabled (SVS_L, SVM_L). High-side supervisor and monitor disabled

(SVS_H, SVM_H). RAM retention enabled.

(10) V_VBAT= V_CC– 0.2 V, f_DCO= f_MCLK= f_SMCLK= 0 MHz, f_ACLK= 32768 Hz, PMMREGOFF = 1, RTC in backup domain active

(11) V_VBAT= V_CC– 0.2 V, f_DCO= f_MCLK= f_SMCLK= 0 MHz, f_ACLK= 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no

current drawn on VBAK

(12) f_DCO= f_MCLK= f_SMCLK= 0 MHz, f_ACLK= 32768 Hz, PMMREGOFF = 1, RTC in backup domain active, no current drawn on VBAK

8.6 Low-Power Mode With LCD Supply Currents (Into V_CC) Excluding External Current

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)^{(1) (2)}

TEMPERATURE (T_A)

PARAMETER

V_CC

PMMCOREV

–40°C

TYP MAX

25°C

TYP

60°C

TYP

85°C

TYP

UNIT

MAX

0

1

2

3

0

1

2

3

0

1

2

0

1

2

3

3.7

4.1

4.5

4.2

4.7

5.1

5.0

4.3

4.7

4.9

5.5

5.9

6.3

6.5

6.0

6.6

7.1

7.0

9.0

9.6

15.0

Low-power mode 3

I_LPM3,LCD, (LPM3) current, LCD 4-

3 V

µA

ext. bias

mux mode, external

5.1

10.2

10.4

9.6

biasing^{(1) (2)}

5.2

5.8

5.4

18.0

17.0

4.8

Low-power mode 3

(LPM3) current, LCD 4-

mux mode, internal

biasing, charge pump

disabled^{(1) (3)}

5.4

10.4

11.0

I_LPM3,LCD,

int. bias

3 V

2.2 V

3 V

µA

5.8

5.7

6.4

19.0

6.4

6.77

7.13

6.53

7.0

Low-power mode 3

(LPM3) current, LCD 4-

mux mode, internal

biasing, charge pump

enabled^{(1) (4)}

I_LPM3

LCD,CP

7.43

7.6

(1) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low-frequency crystal operation

(XTS = 0, XT1DRIVEx = 0).

CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3), f_ACLK= 32768 Hz, f_MCLK= f_SMCLK= f_DCO= 0 MHz

Current for brownout included. Low-side supervisor (SVS_L) and low-side monitor (SVM_L) disabled. High-side supervisor (SVS_H) and

high-side monitor (SVM_H) disabled. RAM retention enabled.

(2) LCDMx = 11 (4-mux mode), LCDREXT = 1, LCDEXTBIAS = 1 (external biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 0 (charge pump

disabled), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (f_LCD= 32768 Hz / 32 / 4 = 256 Hz)

Current through external resistors not included (voltage levels are supplied by test equipment).

Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.

(3) LCDMx = 11 (4-mux mode), LCDREXT = 0, LCDEXTBIAS = 0 (internal biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 0 (charge pump

disabled), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (f_LCD= 32768 Hz / 32 / 4 = 256 Hz)

Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.

(4) LCDMx = 11 (4-mux mode), LCDREXT = 0, LCDEXTBIAS = 0 (internal biasing), LCD2B = 0 (1/3 bias), LCDCPEN = 1 (charge pump

enabled), VLCDx = 1000 (V_LCD= 3 V, typical), LCDSSEL = 0, LCDPREx = 101, LCDDIVx = 00011 (f_LCD= 32768 Hz / 32 / 4 = 256 Hz)

Even segments S0, S2,... = 0, odd segments S1, S3,... = 1. No LCD panel load.

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8.7 Thermal Resistance Characteristics

PARAMETER

Junction-to-ambient thermal resistance, still air ⁽¹⁾

VALUE

122

108

83

UNIT

QFP (PZ)

θ_JA

°C/W

BGA (ZQW)

QFP (PZ)

θ_JC(TOP)

Junction-to-case (top) thermal resistance ⁽²⁾

Junction-to-board thermal resistance ⁽³⁾

°C/W

BGA (ZQW)

QFP (PZ)

72

98

θ_JB

BGA (ZQW)

76

(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board,

as specified in JESD51-7, in an environment described in JESD51-2a.

(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

8.8 Timing and Switching Characteristics

8.8.1 Power Supply Sequencing

TI recommends powering AVCC and DVCC pins from the same source. At a minimum, during power up, power

down, and device operation, the voltage difference between AVCC and DVCC must not exceed the limits

specified in Absolute Maximum Ratings. Exceeding the specified limits may cause malfunction of the device

including erroneous writes to RAM and flash.

Section 8.8.1.1 lists the device reset requirements.

8.8.1.1 Brownout and Device Reset Power Ramp Requirements

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

| dDV_CC/d_t| < 3 V/s

MIN

TYP

MAX UNIT

V_{(DVCC_BOR_IT–)}

V_{(DVCC_BOR_IT+)}

V_{(DVCC_BOR_hys)}

BOR_Hon voltage, DV_CCfalling level

BOR_Hoff voltage, DV_CCrising level

BOR_Hhysteresis

1.47

1.55

250

V

0.80

60

1.30

mV

8.8.2 Reset Timing

Section 8.8.2.1 lists the reset input timing.

8.8.2.1 Reset Input

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TYP UNIT

t_RESET

Pulse duration required at RST/NMI pin to accept a reset

2

µs

32

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8.8.3 Clock Specifications

Section 8.8.3.1 lists the characteristics of XT1 in low-frequency mode.

8.8.3.1 Crystal Oscillator, XT1, Low-Frequency Mode

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 1

0.075

Differential XT1 oscillator crystal

current consumption from lowest

drive setting, LF mode

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 2

ΔI_DVCC,LF

3 V

0.170

0.290

32768

µA

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 3

XT1 oscillator crystal frequency,

LF mode

f_XT1,LF0

XTS = 0, XT1BYPASS = 0

Hz

XT1 oscillator logic-level square-

wave input frequency, LF mode

f_XT1,LF,SW

XTS = 0, XT1BYPASS = 1^{(2) (3)}

10 32.768

210

50 kHz

XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 0,

f_XT1,LF= 32768 Hz, C_L,eff= 6 pF

Oscillation allowance for

LF crystals⁽⁴⁾

OA_LF

kΩ

XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 1,

f_XT1,LF= 32768 Hz, C_L,eff= 12 pF

300

XTS = 0, XCAPx = 0⁽⁶⁾

XTS = 0, XCAPx = 1

XTS = 0, XCAPx = 2

XTS = 0, XCAPx = 3

1

5.5

Integrated effective load

capacitance, LF mode⁽⁵⁾

C_L,eff

pF

8.5

12.0

XTS = 0, Measured at ACLK,

f_XT1,LF= 32768 Hz

Duty cycle, LF mode

30%

10

70%

Oscillator fault frequency,

LF mode⁽⁷⁾

f_Fault,LF

XTS = 0⁽⁸⁾

10000

Hz

ms

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 0,

C_L,eff= 6 pF

1000

500

t_START,LF

Start-up time, LF mode

3 V

f_OSC= 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 3,

C_L,eff= 12 pF

(1) To improve EMI on the XT1 oscillator, observe the following guidelines.

•

Keep the trace between the device and the crystal as short as possible.

Design a good ground plane around the oscillator pins.

Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.

Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.

If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.

(2) When XT1BYPASS is set, XT1 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined in

the Schmitt-trigger Inputs section of this data sheet.

(3) Maximum frequency of operation of the entire device cannot be exceeded.

(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the

XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following

guidelines, but should be evaluated based on the actual crystal selected for the application:

•

For XT1DRIVEx = 0, C_L,eff≤ 6 pF

For XT1DRIVEx = 1, 6 pF ≤ C_L,eff≤ 9 pF

For XT1DRIVEx = 2, 6 pF ≤ C_L,eff≤ 10 pF

For XT1DRIVEx = 3, C_{L,ef f}≥ 6 pF

(5) Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, verify

the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the

specification of the used crystal.

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(6) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.

(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.

Frequencies between the MIN and MAX specifications might set the flag.

(8) Measured with logic-level input frequency but also applies to operation with crystals.

Section 8.8.3.2 lists the characteristics of XT2.

8.8.3.2 Crystal Oscillator, XT2

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)^{(1) (2)}

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

f_OSC= 4 MHz, XT2OFF = 0, T_A= 25°C,

XT2BYPASS = 0, XT2DRIVEx = 0

200

f_OSC= 12 MHz, XT2OFF = 0, T_A= 25°C,

XT2BYPASS = 0, XT2DRIVEx = 1

260

325

450

XT2 oscillator crystal current

consumption

I_DVCC,XT2

3 V

µA

f_OSC= 20 MHz, XT2OFF = 0, T_A= 25°C,

XT2BYPASS = 0, XT2DRIVEx = 2

f_OSC= 32 MHz, XT2OFF = 0, T_A= 25°C,

XT2BYPASS = 0, XT2DRIVEx = 3

XT2 oscillator crystal frequency,

mode 0

f_XT2,HF0

f_XT2,HF1

f_XT2,HF2

f_XT2,HF3

f_XT2,HF,SW

XT2DRIVEx = 0, XT2BYPASS = 0⁽³⁾

XT2DRIVEx = 1, XT2BYPASS = 0⁽³⁾

XT2DRIVEx = 2, XT2BYPASS = 0⁽³⁾

XT2DRIVEx = 3, XT2BYPASS = 0⁽³⁾

XT2BYPASS = 1^{(3) (4)}

4

8

MHz

XT2 oscillator crystal frequency,

mode 1

16 MHz

24 MHz

32 MHz

XT2 oscillator crystal frequency,

mode 2

16

24

0.7

XT2 oscillator crystal frequency,

mode 3

XT2 oscillator logic-level square-

wave input frequency

XT2DRIVEx = 0, XT2BYPASS = 0,

f_XT2,HF0= 6 MHz, C_L,eff= 15 pF

450

320

200

XT2DRIVEx = 1, XT2BYPASS = 0,

f_XT2,HF1= 12 MHz, C_L,eff= 15 pF

Oscillation allowance for

HF crystals⁽⁵⁾

OA_HF

Ω

XT2DRIVEx = 2, XT2BYPASS = 0,

f_XT2,HF2= 20 MHz, C_L,eff= 15 pF

XT2DRIVEx = 3, XT2BYPASS = 0,

f_XT2,HF3= 32 MHz, C_L,eff= 15 pF

f_OSC= 6 MHz,

XT2BYPASS = 0, XT2DRIVEx = 0,

T_A= 25°C, C_L,eff= 15 pF

0.5

0.3

t_START,HF

Start-up time

3 V

ms

pF

f_OSC= 20 MHz,

XT2BYPASS = 0, XT2DRIVEx = 3,

T_A= 25°C, C_L,eff= 15 pF

Integrated effective load

C_L,eff

1

capacitance, HF mode^{(6) (1)}

Duty cycle

Measured at ACLK, f_XT2,HF2= 20 MHz

XT2BYPASS = 1⁽⁸⁾

40%

30

50%

60%

300 kHz

f_Fault,HF

Oscillator fault frequency⁽⁷⁾

(1) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.

(2) To improve EMI on the XT2 oscillator, observe the following guidelines.

•

Keep the traces between the device and the crystal as short as possible.

Design a good ground plane around the oscillator pins.

Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.

Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.

Use assembly materials and processes that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.

If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.

(3) Maximum frequency of operation of the entire device cannot be exceeded.

(4) When XT2BYPASS is set, the XT2 circuit is automatically powered down.

(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.

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(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, verify

the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the

specification of the used crystal.

(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.

Frequencies between the MIN and MAX specifications might set the flag.

(8) Measured with logic-level input frequency but also applies to operation with crystals.

Section 8.8.3.3 lists the characteristics of the VLO.

8.8.3.3 Internal Very-Low-Power Low-Frequency Oscillator (VLO)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

VLO frequency

VLO frequency temperature drift

TEST CONDITIONS

V_CC

MIN

TYP

9.4

0.5

4

MAX UNIT

14 kHz

%/°C

f_VLO

Measured at ACLK

1.8 V to 3.6 V

6

df_VLO/d_T

Measured at ACLK⁽¹⁾

Measured at ACLK⁽²⁾

Measured at ACLK

df_VLO/dV_CCVLO frequency supply voltage drift

Duty cycle

%/V

40%

50%

60%

(1) Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))

(2) Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)

Section 8.8.3.4 lists the characteristics of the REFO.

8.8.3.4 Internal Reference, Low-Frequency Oscillator (REFO)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

REFO oscillator current

consumption

I_REFO

T_A= 25°C

1.8 V to 3.6 V

3

µA

Hz

REFO frequency calibrated

Measured at ACLK

Full temperature range

T_A= 25°C

1.8 V to 3.6 V

3 V

32768

f_REFO

±3.5%

REFO absolute tolerance

calibrated

±1.5%

df_REFO/d_T

REFO frequency temperature drift Measured at ACLK⁽¹⁾

1.8 V to 3.6 V

0.01

1.0

%/°C

%/V

REFO frequency supply voltage

Measured at ACLK⁽²⁾

drift

df_REFO/dV_CC

1.8 V to 3.6 V

Duty cycle

Measured at ACLK

40%/60% duty cycle

1.8 V to 3.6 V

40%

50%

25

60%

t_START

REFO start-up time

µs

(1) Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C) / (85°C – (–40°C))

(2) Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)

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Section 8.8.3.5 lists the characteristics of the DCO frequency.

8.8.3.5 DCO Frequency

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

DCORSELx = 0, DCOx = 0, MODx = 0

DCORSELx = 0, DCOx = 31, MODx = 0

DCORSELx = 1, DCOx = 0, MODx = 0

DCORSELx = 1, DCOx = 31, MODx = 0

DCORSELx = 2, DCOx = 0, MODx = 0

DCORSELx = 2, DCOx = 31, MODx = 0

DCORSELx = 3, DCOx = 0, MODx = 0

DCORSELx = 3, DCOx = 31, MODx = 0

DCORSELx = 4, DCOx = 0, MODx = 0

DCORSELx = 4, DCOx = 31, MODx = 0

DCORSELx = 5, DCOx = 0, MODx = 0

DCORSELx = 5, DCOx = 31, MODx = 0

DCORSELx = 6, DCOx = 0, MODx = 0

DCORSELx = 6, DCOx = 31, MODx = 0

DCORSELx = 7, DCOx = 0, MODx = 0

DCORSELx = 7, DCOx = 31, MODx = 0

MIN

0.07

0.70

0.15

1.47

0.32

3.17

0.64

6.07

1.3

TYP

MAX UNIT

0.20 MHz

1.70 MHz

0.36 MHz

3.45 MHz

0.75 MHz

7.38 MHz

1.51 MHz

14.0 MHz

3.2 MHz

f_DCO(0,0)

f_DCO(0,31)

f_DCO(1,0)

f_DCO(1,31)

f_DCO(2,0)

f_DCO(2,31)

f_DCO(3,0)

f_DCO(3,31)

f_DCO(4,0)

f_DCO(4,31)

f_DCO(5,0)

f_DCO(5,31)

f_DCO(6,0)

f_DCO(6,31)

f_DCO(7,0)

f_DCO(7,31)

DCO frequency (0, 0)⁽¹⁾

DCO frequency (0, 31)⁽¹⁾

DCO frequency (1, 0)⁽¹⁾

DCO frequency (1, 31)⁽¹⁾

DCO frequency (2, 0)⁽¹⁾

DCO frequency (2, 31)⁽¹⁾

DCO frequency (3, 0)⁽¹⁾

DCO frequency (3, 31)⁽¹⁾

DCO frequency (4, 0)⁽¹⁾

DCO frequency (4, 31)⁽¹⁾

DCO frequency (5, 0)⁽¹⁾

DCO frequency (5, 31)⁽¹⁾

DCO frequency (6, 0)⁽¹⁾

DCO frequency (6, 31)⁽¹⁾

DCO frequency (7, 0)⁽¹⁾

DCO frequency (7, 31)⁽¹⁾

12.3

2.5

28.2 MHz

6.0 MHz

23.7

4.6

54.1 MHz

10.7 MHz

88.0 MHz

19.6 MHz

135 MHz

39.0

8.5

60

Frequency step between range

DCORSEL and DCORSEL + 1

S_DCORSEL

S_DCO

S_RSEL= f_{DCO(DCORSEL+1,DCO)}/f_{DCO(DCORSEL,DCO)}

1.2

2.3 ratio

Frequency step between tap

DCO and DCO + 1

S_DCO= f_{DCO(DCORSEL,DCO+1)}/f_{DCO(DCORSEL,DCO)}

Measured at SMCLK

1.02

40%

1.12 ratio

Duty cycle

50%

0.1

60%

%/°C

%/V

df_DCO/dT

DCO frequency temperature drift f_DCO= 1 MHz,

DCO frequency voltage drift f_DCO= 1 MHz

df_DCO/dV_CC

1.9

(1) When selecting the proper DCO frequency range (DCORSELx), the target DCO frequency, f_DCO, should be set to reside within the

range of f_{DCO(n, 0),MAX}≤ f_DCO≤ f_{DCO(n, 31),MIN}, where f_{DCO(n, 0),MAX}represents the maximum frequency specified for the DCO frequency,

range n, tap 0 (DCOx = 0) and f_{DCO(n,31),MIN}represents the minimum frequency specified for the DCO frequency, range n, tap 31

(DCOx = 31). This ensures that the target DCO frequency resides within the range selected. It should also be noted that if the actual

f_DCOfrequency for the selected range causes the FLL or the application to select tap 0 or 31, the DCO fault flag is set to report that the

selected range is at its minimum or maximum tap setting.

100

V_CC= 3.0 V

T_A= 25°C

10

DCOx = 31

1

DCOx = 0

0.1

0

1

2

3

4

5

6

7

DCORSEL

Figure 8-2. Typical DCO Frequency

36

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8.8.4 Wake-up Characteristics

Section 8.8.4.1 lists the characteristics of the wake-up times.

8.8.4.1 Wake-up Times From Low-Power Modes and Reset

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

f_MCLK≥ 4 MHz

3

6.5

Wake-up time from LPM2,

LPM3, or LPM4 to active

mode⁽¹⁾

PMMCOREV = SVSMLRRL = n

(where n = 0, 1, 2, or 3),

SVSLFP = 1

t_WAKE-UP-FAST

µs

1 MHz < f_MCLK

4 MHz

<

4

8.0

Wake-up time from LPM2,

LPM3, or LPM4 to active

mode^{(2) (3)}

PMMCOREV = SVSMLRRL = n

(where n = 0, 1, 2, or 3),

SVSLFP = 0

t_WAKE-UP-SLOW

150

165

µs

Wake-up time from LPM3.5

or LPM4.5 to active mode⁽⁴⁾

t_WAKE-UP-LPM5

t_{WAKE-UP-RESET}

2

3

ms

Wake-up time from RST or

BOR event to active mode⁽⁴⁾

(1) This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the

performance mode of the low-side supervisor (SVS_L) and low-side monitor (SVM_L). t_WAKE-UP-FASTis possible with SVS_Land SVM_Lin

full performance mode or disabled. For specific register settings, see the Low-Side SVS and SVM Control and Performance Mode

Selection section in the Power Management Module and Supply Voltage Supervisor chapter of the MSP430F5xx and MSP430F6xx

Family User's Guide.

(2) This value represents the time from the wake-up event to the first active edge of MCLK. The wake-up time depends on the

performance mode of the low-side supervisor (SVS_L) and low-side monitor (SVM_L). t_WAKE-UP-SLOWis set with SVS_Land SVM_Lin

normal mode (low current mode). For specific register settings, see the Low-Side SVS and SVM Control and Performance Mode

Selection section in the Power Management Module and Supply Voltage Supervisor chapter of the MSP430F5xx and MSP430F6xx

Family User's Guide.

(3) The wake-up times from LPM0 and LPM1 to AM are not specified. They are proportional to MCLK cycle time but are not affected by

the performance mode settings as for LPM2, LPM3, and LPM4.

(4) This value represents the time from the wake-up event to the reset vector execution.

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8.8.5 General-Purpose I/Os

Section 8.8.5.1 lists the characteristics of the Schmitt-trigger inputs.

8.8.5.1 Schmitt-Trigger Inputs – General-Purpose I/O

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

V_CC

1.8 V

3 V

MIN

0.80

1.50

0.45

0.75

0.3

TYP

MAX UNIT

1.40

V

2.10

V_IT+

V_IT–

V_hys

Positive-going input threshold voltage

1.8 V

3 V

1.00

V

1.65

Negative-going input threshold voltage

1.8 V

3 V

0.8

V

1.0

Input voltage hysteresis (V_IT+– V_IT–

)

0.4

For pullup: V_IN= V_SS

For pulldown: V_IN= V_CC

R_Pull

C_I

Pullup or pulldown resistor

Input capacitance

20

35

5

50

kΩ

pF

V_IN= V_SSor V_CC

(1) The same parametrics apply to clock input pin when crystal bypass mode is used on XT1 (XIN) or XT2 (XT2IN).

Section 8.8.5.2 lists the characteristics of P1, P2, P3, and P4 .

8.8.5.2 Inputs – Ports P1, P2, P3, and P4

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

V_CC

MIN

MAX UNIT

Port P1, P2, P3, P4: P1.x to P4.x,

External trigger pulse duration to set interrupt flag

t_(int)

External interrupt timing⁽²⁾

2.2 V, 3 V

20

ns

(1) Some devices may contain additional ports with interrupts. See the block diagram and terminal function descriptions.

(2) An external signal sets the interrupt flag every time the minimum interrupt pulse duration t_(int)is met. It may be set by trigger signals

shorter than t_(int)

.

Section 8.8.5.3 lists the leakage current of the GPIOs.

8.8.5.3 Leakage Current – General-Purpose I/O

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

See ^{(1) (2)}

V_CC

MIN

MAX UNIT

I_lkg(Px.x)

High-impedance leakage current

1.8 V, 3 V

±50 nA

(1) The leakage current is measured with V_SSor V_CCapplied to the corresponding pin(s), unless otherwise noted.

(2) The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is

disabled.

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Section 8.8.5.4 lists the output characteristics of the GPIOs.

8.8.5.4 Outputs – General-Purpose I/O (Full Drive Strength)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

I_(OHmax)= –3 mA⁽¹⁾

V_CC

MIN

V_CC– 0.25

V_CC– 0.60

V_CC– 0.25

V_CC– 0.60

MAX UNIT

V_CC

1.8 V

I_(OHmax)= –10 mA⁽²⁾

I_(OHmax)= –5 mA⁽¹⁾

I_(OHmax)= –15 mA⁽²⁾

I_(OLmax)= 3 mA⁽¹⁾

I_(OLmax)= 10 mA⁽²⁾

I_(OLmax)= 5 mA⁽¹⁾

I_(OLmax)= 15 mA⁽²⁾

V_CC

V_OH

High-level output voltage

V

V_CC

3 V

1.8 V

3 V

V_CC

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

V_OL

Low-level output voltage

V

(1) The maximum total current, I_(OHmax)and I_(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage

drop specified.

(2) The maximum total current, I_(OHmax)and I_(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage

drop specified.

Section 8.8.5.5 lists the output characteristics of the GPIOs.

8.8.5.5 Outputs – General-Purpose I/O (Reduced Drive Strength)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽³⁾

PARAMETER

TEST CONDITIONS

I_(OHmax)= –1 mA⁽¹⁾

V_CC

MIN

V_CC– 0.25

V_CC– 0.60

V_CC– 0.25

V_CC– 0.60

MAX UNIT

V_CC

1.8 V

I_(OHmax)= –3 mA⁽²⁾

I_(OHmax)= –2 mA⁽¹⁾

I_(OHmax)= –6 mA⁽²⁾

I_(OLmax)= 1 mA⁽¹⁾

I_(OLmax)= 3 mA⁽²⁾

I_(OLmax)= 2 mA⁽¹⁾

I_(OLmax)= 6 mA⁽²⁾

V_CC

V_OH

High-level output voltage

V

V_CC

3 V

1.8 V

3 V

V_CC

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

V_SSV_SS+ 0.25

V_SSV_SS+ 0.60

V_OL

Low-level output voltage

V

(1) The maximum total current, I_(OHmax)and I_(OLmax), for all outputs combined, should not exceed ±48 mA to hold the maximum voltage

drop specified.

(2) The maximum total current, I_(OHmax)and I_(OLmax), for all outputs combined, should not exceed ±100 mA to hold the maximum voltage

drop specified.

(3) Selecting reduced drive strength may reduce EMI.

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Section 8.8.5.6 lists the frequency characteristics of the GPIOs.

8.8.5.6 Output Frequency – Ports P1, P2 and P3

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

MAX UNIT

V_CC= 1.8 V

PMMCOREVx = 0

8

Port output frequency

(with load)

P3.4/TA2CLK/SMCLK/S27

f_Px.y

MHz

20

C_L= 20 pF, R_L= 1 kΩ⁽¹⁾or 3.2 kΩ^{(2) (3)}

V_CC= 3 V

PMMCOREVx = 3

V_CC= 1.8 V

PMMCOREVx = 0

P1.0/TA0CLK/ACLK/S39

P3.4/TA2CLK/SMCLK/S27

P2.0/P2MAP0 (P2MAP0 = PM_MCLK )

C_L= 20 pF⁽³⁾

8

f_{Port_CLK}

Clock output frequency

MHz

20

V_CC= 3 V

PMMCOREVx = 3

(1) Full drive strength of port: A resistive divider with 2 × 0.5 kΩ between V_CCand V_SSis used as load. The output is connected to the

center tap of the divider.

(2) Reduced drive strength of port: A resistive divider with 2 × 1.6 kΩ between V_CCand V_SSis used as load. The output is connected to

the center tap of the divider.

(3) The output voltage reaches at least 10% and 90% V_CCat the specified toggle frequency.

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8.8.5.7 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

25.0

20.0

15.0

10.0

5.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

T_A= 25°C

T_A= 85°C

T_A= 25°C

T_A= 85°C

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

V_OL– Low-Level Output Voltage – V

V_CC= 1.8 V

P3.2

V_CC= 3.0 V

P3.2

Figure 8-4. Typical Low-Level Output Current vs

Low-Level Output Voltage

Figure 8-3. Typical Low-Level Output Current vs

Low-Level Output Voltage

0.0

−1.0

−2.0

−3.0

−4.0

−5.0

−10.0

−15.0

T_A= 85°C

T_A= 25°C

−5.0

−6.0

−7.0

−8.0

T_A= 85°C

−20.0

T_A= 25°C

−25.0

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

V_OH– High-Level Output Voltage – V

V_CC= 1.8 V

P3.2

V_CC= 3.0 V

P3.2

Figure 8-6. Typical High-Level Output Current Vs

High-Level Output Voltage

Figure 8-5. Typical High-Level Output Current Vs

High-Level Output Voltage

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8.8.5.8 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

60.0

24

T_A= 25°C

55.0

T_A= 25°C

T_A= 85°C

50.0

45.0

40.0

35.0

30.0

25.0

20.0

15.0

10.0

5.0

20

16

12

8

T_A= 85°C

4

0

0.0

0.5

1.0

1.5

2.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

V_OL– Low-Level Output Voltage – V

V_CC= 1.8 V

P3.2

V_CC= 3.0 V

P3.2

Figure 8-8. Typical Low-Level Output Current vs

Low-Level Output Voltage

Figure 8-7. Typical Low-Level Output Current vs

Low-Level Output Voltage

0.0

−5.0

0

−10.0

−15.0

−20.0

−25.0

−30.0

−35.0

−40.0

−4

−8

−12

T_A= 85°C

−16

−45.0

T_A= 85°C

−50.0

−55.0

T_A= 25°C

−60.0

T_A= 25°C

−20

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

0.0

0.5

1.0

1.5

2.0

V_OH– High-Level Output Voltage – V

V_CC= 3.0 V

P3.2

V_CC= 1.8 V

P3.2

Figure 8-9. Typical High-Level Output Current vs

High-level Output Voltage

Figure 8-10. Typical High-Level Output Current vs

High-level Output Voltage

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8.8.6 PMM

Section 8.8.6.1 lists the characteristics of the PMM core voltage.

8.8.6.1 PMM, Core Voltage

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Core voltage, active mode,

PMMCOREV = 3

V_CORE3(AM)

V_CORE2(AM)

V_CORE1(AM)

V_CORE0(AM)

V_CORE3(LPM)

V_CORE2(LPM)

V_CORE1(LPM)

V_CORE0(LPM)

2.4 V ≤ DV_CC≤ 3.6 V, 0 mA ≤ I(V_CORE) ≤ 21 mA

1.90

V

Core voltage, active mode,

PMMCOREV = 2

2.2 V ≤ DV_CC≤ 3.6 V, 0 mA ≤ I(V_CORE) ≤ 21 mA

2 V ≤ DV_CC≤ 3.6 V, 0 mA ≤ I(V_CORE) ≤ 17 mA

1.8 V ≤ DV_CC≤ 3.6 V, 0 mA ≤ I(V_CORE) ≤ 13 mA

2.4 V ≤ DV_CC≤ 3.6 V, 0 µA ≤ I(V_CORE) ≤ 30 µA

2.2 V ≤ DV_CC≤ 3.6 V, 0 µA ≤ I(V_CORE) ≤ 30 µA

2 V ≤ DV_CC≤ 3.6 V, 0 µA ≤ I(V_CORE) ≤ 30 µA

1.8 V ≤ DV_CC≤ 3.6 V, 0 µA ≤ I(V_CORE) ≤ 30 µA

1.80

1.60

1.40

1.94

1.84

1.64

1.44

V

Core voltage, active mode,

PMMCOREV = 1

Core voltage, active mode,

PMMCOREV = 0

Core voltage, low-current mode,

PMMCOREV = 3

Core voltage, low-current mode,

PMMCOREV = 2

Core voltage, low-current mode,

PMMCOREV = 1

Core voltage, low-current mode,

PMMCOREV = 0

Section 8.8.6.2 lists the characteristics of the SVS high side.

8.8.6.2 PMM, SVS High Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

SVSHE = 0, DV_CC= 3.6 V

0

nA

I_(SVSH)

SVS current consumption

SVSHE = 1, DV_CC= 3.6 V, SVSHFP = 0

SVSHE = 1, DV_CC= 3.6 V, SVSHFP = 1

SVSHE = 1, SVSHRVL = 0

200

2.0

µA

1.59

1.79

1.98

2.10

1.62

1.88

2.07

2.20

2.32

2.56

2.85

1.64

1.84

2.04

2.16

1.74

1.94

2.14

2.26

2.40

2.70

3.00

2.5

1.69

SVSHE = 1, SVSHRVL = 1

1.91

V

V_{(SVSH_IT–)}SVS_Hon voltage level⁽¹⁾

SVSHE = 1, SVSHRVL = 2

2.11

SVSHE = 1, SVSHRVL = 3

2.23

1.81

2.01

2.21

SVSHE = 1, SVSMHRRL = 0

SVSHE = 1, SVSMHRRL = 1

SVSHE = 1, SVSMHRRL = 2

SVSHE = 1, SVSMHRRL = 3

2.33

V

V_{(SVSH_IT+)}SVS_Hoff voltage level⁽¹⁾

SVSHE = 1, SVSMHRRL = 4

2.48

SVSHE = 1, SVSMHRRL = 5

2.84

3.15

SVSHE = 1, SVSMHRRL = 6

SVSHE = 1, SVSMHRRL = 7

SVSHE = 1, dV_DVCC/dt = 10 mV/µs, SVSHFP = 1

SVSHE = 1, dV_DVCC/dt = 1 mV/µs, SVSHFP = 0

SVSHE = 0→1, SVSHFP = 1

SVSHE = 0→1, SVSHFP = 0

t_pd(SVSH)

SVS_Hpropagation delay

µs

20

12.5

100

t_(SVSH)

SVS_Hon or off delay time

DV_CCrise time

dV_DVCC/dt

0

1000

V/s

(1) The SVS_Hsettings available depend on the VCORE (PMMCOREV) setting. See the Power Management Module and Supply Voltage

Supervisor chapter in the MSP430F5xx and MSP430F6xx Family User's Guide on recommended settings and use.

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Section 8.8.6.3 lists the characteristics of the SVM high side.

8.8.6.3 PMM, SVM High Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

SVMHE = 0, DV_CC= 3.6 V

0

nA

I_(SVMH)

SVM_Hcurrent consumption

SVMHE = 1, DV_CC= 3.6 V, SVMHFP = 0

SVMHE = 1, DV_CC= 3.6 V, SVMHFP = 1

SVMHE = 1, SVSMHRRL = 0

200

2.0

µA

1.86

1.65

1.85

2.02

2.18

2.32

2.56

2.85

1.74

1.94

2.14

2.26

2.40

2.70

3.00

3.75

2.5

SVMHE = 1, SVSMHRRL = 1

2.02

SVMHE = 1, SVSMHRRL = 2

2.22

SVMHE = 1, SVSMHRRL = 3

2.35

V_(SVMH)

SVM_Hon or off voltage level⁽¹⁾

SVMHE = 1, SVSMHRRL = 4

2.48

2.84

3.15

V

SVMHE = 1, SVSMHRRL = 5

SVMHE = 1, SVSMHRRL = 6

SVMHE = 1, SVSMHRRL = 7

SVMHE = 1, SVMHOVPE = 1

SVMHE = 1, dV_DVCC/dt = 10 mV/µs, SVMHFP = 1

SVMHE = 1, dV_DVCC/dt = 1 mV/µs, SVMHFP = 0

SVMHE = 0→1, SVSMFP = 1

t_pd(SVMH)SVM_Hpropagation delay

µs

20

12.5

100

t_(SVMH)

SVM_Hon or off delay time

SVMHE = 0→1, SVMHFP = 0

(1) The SVM_Hsettings available depend on the VCORE (PMMCOREV) setting. See the Power Management Module and Supply Voltage

Supervisor chapter in the MSP430F5xx and MSP430F6xx Family User's Guide on recommended settings and use.

Section 8.8.6.4 lists the characteristics of the SVS low side.

8.8.6.4 PMM, SVS Low Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

SVSLE = 0, PMMCOREV = 2

0

nA

µA

µs

I_(SVSL)

SVS_Lcurrent consumption

SVSLE = 1, PMMCOREV = 2, SVSLFP = 0

SVSLE = 1, PMMCOREV = 2, SVSLFP = 1

SVSLE = 1, dV_CORE/dt = 10 mV/µs, SVSLFP = 1

SVSLE = 1, dV_CORE/dt = 1 mV/µs, SVSLFP = 0

SVSLE = 0→1, SVSLFP = 1

200

2.0

2.5

20

t_pd(SVSL)SVS_Lpropagation delay

12.5

100

t_(SVSL)

SVS_Lon or off delay time

µs

SVSLE = 0→1, SVSLFP = 0

44

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Section 8.8.6.5 lists the characteristics of the SVM low side.

8.8.6.5 PMM, SVM Low Side

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

SVMLE = 0, PMMCOREV = 2

0

nA

µA

µs

I_(SVML)

SVM_Lcurrent consumption

SVMLE = 1, PMMCOREV = 2, SVMLFP = 0

SVMLE = 1, PMMCOREV = 2, SVMLFP = 1

SVMLE = 1, dV_CORE/dt = 10 mV/µs, SVMLFP = 1

SVMLE = 1, dV_CORE/dt = 1 mV/µs, SVMLFP = 0

SVMLE = 0→1, SVMLFP = 1

200

2.0

2.5

20

t_pd(SVML)SVM_Lpropagation delay

12.5

100

t_(SVML)

SVM_Lon or off delay time

µs

SVMLE = 0→1, SVMLFP = 0

8.8.7 Timers

Section 8.8.7.1 lists the characteristics of Timer_A.

8.8.7.1 Timer_A, Timers TA0, TA1, and TA2

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

MAX UNIT

Internal: SMCLK or ACLK,

External: TACLK,

f_TA

Timer_A input clock frequency

1.8 V, 3 V

20 MHz

Duty cycle = 50% ±10%

All capture inputs, minimum pulse

duration required for capture

t_TA,capTimer_A capture timing

1.8 V, 3 V

20

ns

Section 8.8.7.2 lists the characteristics of Timer_B.

8.8.7.2 Timer_B, Timer TB0

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

MAX UNIT

Internal: SMCLK or ACLK,

External: TBCLK,

f_TB

Timer_B input clock frequency

1.8 V, 3 V

20 MHz

Duty cycle = 50% ±10%

All capture inputs, minimum pulse

duration required for capture

t_TB,capTimer_B capture timing

1.8 V, 3 V

20

ns

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8.8.8 Battery Backup

Section 8.8.8.1 lists the characteristics of the battery backup.

8.8.8.1 Battery Backup

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

0.43

MAX UNIT

T_A= –40°C

VBAT = 1.7 V,

DVCC not connected,

RTC running

T_A= 25°C

T_A= 60°C

T_A= 85°C

T_A= –40°C

T_A= 25°C

T_A= 60°C

T_A= 85°C

T_A= –40°C

T_A= 25°C

T_A= 60°C

T_A= 85°C

General

0.52

0.58

0.66

0.50

Current into VBAT terminal in VBAT = 2.2 V,

0.59

I_VBAT

case no primary battery is

connected.

DVCC not connected,

RTC running

µA

0.64

0.72

0.68

VBAT = 3 V,

DVCC not connected,

RTC running

0.75

0.79

0.86

V_{SVSH_IT-}

SVSHRL = 0

SVSHRL = 1

SVSHRL = 2

SVSHRL = 3

1.59

1.79

1.98

2.10

1.69

Switch-over level (V_CCto

VBAT)

V_SWITCH

C_VCC= 4.7 µF

1.91

2.11

2.23

V

ON-resistance of switch

between VBAT and VBAK

R_{ON_VBAT}

V_BAT= 1.8 V

0 V

0.35

1

kΩ

1.8 V

3 V

0.6

1.0

1.2

2.7

±5%

2.9

VBAT to ADC:

V_BATdivided,

V_BAT3= V_BAT/3

V_BAT3

V

3.6 V

V_CHVx

Charger end voltage

CHVx = 2

2.65

CHCx = 1

CHCx = 2

CHCx = 3

5.2

R_CHARGE

Charge limiting resistor

10.2

20

kΩ

46

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8.8.9 USCI

Section 8.8.9.1 lists the characteristics of the USCI in UART mode.

8.8.9.1 USCI (UART Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

MAX UNIT

Internal: SMCLK or ACLK,

External: UCLK,

f_USCI

USCI input clock frequency

f_SYSTEMMHz

Duty cycle = 50% ±10%

f_BITCLKBITCLK clock frequency (equals baud rate in MBaud)

t_τ

UART receive deglitch time⁽¹⁾

1

600

MHz

ns

2.2 V

3 V

50

(1) Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are

correctly recognized, their duration should exceed the maximum specification of the deglitch time.

Section 8.8.9.2 lists the characteristics of the USCI in SPI master mode.

8.8.9.2 USCI (SPI Master Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

(see Figure 8-11 and Figure 8-12)

PARAMETER

TEST CONDITIONS

V_CC

MIN

MAX UNIT

f_USCI

USCI input clock frequency

SMCLK, ACLK, duty cycle = 50% ±10%

f_SYSTEMMHz

1.8 V

3 V

55

38

30

25

0

PMMCOREV = 0

PMMCOREV = 3

PMMCOREV = 0

PMMCOREV = 3

t_SU,MI

SOMI input data setup time

SOMI input data hold time

SIMO output data valid time⁽²⁾

SIMO output data hold time⁽³⁾

ns

2.4 V

3 V

1.8 V

3 V

0

t_HD,MI

ns

2.4 V

3 V

0

1.8 V

3 V

20

UCLK edge to SIMO valid,

C_L= 20 pF, PMMCOREV = 0

18

ns

16

t_VALID,MO

2.4 V

3 V

UCLK edge to SIMO valid,

C_L= 20 pF, PMMCOREV = 3

15

1.8 V

3 V

–10

–8

C_L= 20 pF, PMMCOREV = 0

C_L= 20 pF, PMMCOREV = 3

t_HD,MO

ns

2.4 V

3 V

–10

–8

(1) f_UCxCLK= 1/2t_LO/HIwith t_LO/HI≥ max(t_{VALID,MO(USCI)}+ t_SU,SI(Slave), t_SU,MI(USCI)+ t_{VALID,SO(Slave)}

)

For the slave parameters t_SU,SI(Slave)and t_{VALID,SO(Slave)}, see the SPI parameters of the attached slave.

(2) Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams

in Figure 8-11 and Figure 8-12.

(3) Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data

on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure

8-11 and Figure 8-12.

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1/f_UCxCLK

CKPL = 0

UCLK

CKPL = 1

t_LO/HI

t_SU,MI

t_HD,MI

SOMI

SIMO

t_HD,MO

t_VALID,MO

Figure 8-11. SPI Master Mode, CKPH = 0

1/f_UCxCLK

CKPL = 0

CKPL = 1

UCLK

t_LO/HI

t_HD,MI

t_SU,MI

SOMI

SIMO

t_HD,MO

t_VALID,MO

Figure 8-12. SPI Master Mode, CKPH = 1

48

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Section 8.8.9.3 lists the characteristics of the USCI in SPI slave mode.

8.8.9.3 USCI (SPI Slave Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)⁽¹⁾

(see Figure 8-13 and Figure 8-14)

PARAMETER

TEST CONDITIONS

V_CC

1.8 V

3 V

MIN

11

8

MAX UNIT

PMMCOREV = 0

t_STE,LEAD

t_STE,LAG

t_STE,ACC

t_STE,DIS

t_SU,SI

STE lead time, STE low to clock

ns

2.4 V

3 V

7

PMMCOREV = 3

PMMCOREV = 0

PMMCOREV = 3

PMMCOREV = 0

PMMCOREV = 3

PMMCOREV = 0

PMMCOREV = 3

PMMCOREV = 0

PMMCOREV = 3

PMMCOREV = 0

PMMCOREV = 3

6

1.8 V

3 V

3

STE lag time, Last clock to STE high

ns

2.4 V

3 V

3

1.8 V

3 V

66

50

ns

36

STE access time, STE low to SOMI data out

2.4 V

3 V

30

1.8 V

3 V

30

ns

30

STE disable time, STE high to SOMI high

impedance

2.4 V

3 V

30

1.8 V

3 V

5

2

5

SIMO input data setup time

SIMO input data hold time

SOMI output data valid time⁽²⁾

SOMI output data hold time⁽³⁾

ns

2.4 V

3 V

1.8 V

3 V

t_HD,SI

ns

2.4 V

3 V

1.8 V

3 V

76

UCLK edge to SOMI valid,

C_L= 20 pF, PMMCOREV = 0

60

ns

44

t_VALID,SO

2.4 V

3 V

UCLK edge to SOMI valid,

C_L= 20 pF, PMMCOREV = 3

40

1.8 V

3 V

12

C_L= 20 pF, PMMCOREV = 0

C_L= 20 pF, PMMCOREV = 3

t_HD,SO

ns

2.4 V

3 V

(1) f_UCxCLK= 1/2t_LO/HIwith t_LO/HI≥ max(t_{VALID,MO(Master)}+ t_SU,SI(USCI), t_{SU,MI(Master)}+ t_{VALID,SO(USCI)}

)

For the master parameters t_{SU,MI(Master)}and t_{VALID,MO(Master)}, see the SPI parameters of the attached master.

(2) Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams

in Figure 8-13 and Figure 8-14.

(3) Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure

8-13 and Figure 8-14.

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t_STE,LEAD

t_STE,LAG

STE

1/f_UCxCLK

CKPL = 0

UCLK

CKPL = 1

t_SU,SI

t_LO/HI

t_HD,SI

SIMO

SOMI

t_HD,SO

t_VALID,SO

t_STE,ACC

t_STE,DIS

Figure 8-13. SPI Slave Mode, CKPH = 0

t_STE,LEAD

t_STE,LAG

STE

1/f_UCxCLK

CKPL = 0

CKPL = 1

UCLK

t_LO/HI

t_HD,SI

t_SU,SI

SIMO

SOMI

t_HD,MO

t_VALID,SO

t_STE,ACC

t_STE,DIS

Figure 8-14. SPI Slave Mode, CKPH = 1

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Section 8.8.9.4 lists the characteristics of the USCI in I²C mode.

8.8.9.4 USCI (I²C Mode)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see

Figure 8-15)

PARAMETER

TEST CONDITIONS

V_CC

MIN

MAX UNIT

Internal: SMCLK or ACLK,

External: UCLK,

f_USCI

USCI input clock frequency

f_SYSTEMMHz

Duty cycle = 50% ±10%

f_SCL

SCL clock frequency

2.2 V, 3 V

0

4.0

0.6

4.7

0.6

0

400 kHz

µs

f_SCL≤ 100 kHz

f_SCL> 100 kHz

f_SCL≤ 100 kHz

f_SCL> 100 kHz

t_HD,STA

Hold time (repeated) START

t_SU,STA

Setup time for a repeated START

2.2 V, 3 V

µs

t_HD,DAT

t_SU,DAT

Data hold time

Data setup time

2.2 V, 3 V

ns

250

4.0

0.6

50

f_SCL≤ 100 kHz

f_SCL> 100 kHz

t_SU,STO

Setup time for STOP

2.2 V, 3 V

µs

2.2 V

3 V

600

ns

600

t_SP

Pulse duration of spikes suppressed by input filter

50

t_HD,STA

t_SU,STA

t_HD,STA

t_BUF

SDA

SCL

t_LOW

t_HIGH

t_SP

t_SU,DAT

t_SU,STO

t_HD,DAT

Figure 8-15. I²C Mode Timing

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8.8.10 LCD Controller

Section 8.8.10.1 lists the operating conditions of the LCD controller.

8.8.10.1 LCD_B Operating Conditions

PARAMETER

CONDITIONS

MIN

NOM

MAX UNIT

V_{CC,LCD_B,}

Supply voltage range, charge

pump enabled, V_LCD≤ 3.6 V

LCDCPEN = 1, 0000 < VLCDx ≤ 1111

(charge pump enabled, V_LCD≤ 3.6 V)

2.2

3.6

V

CP en,3.6

V_{CC,LCD_B,}

Supply voltage range, charge

pump enabled, V_LCD≤ 3.3 V

LCDCPEN = 1, 0000 < VLCDx ≤ 1100

(charge pump enabled, V_LCD≤ 3.3 V)

2.0

2.4

CP en,3.3

Supply voltage range, internal

biasing, charge pump disabled

V_{CC,LCD_B, int. bias}

LCDCPEN = 0, VLCDEXT = 0

Supply voltage range, external

biasing, charge pump disabled

V_{CC,LCD_B, ext. bias}

Supply voltage range, external

LCD voltage, internal or external

biasing, charge pump disabled

V_{CC,LCD_B,}

LCDCPEN = 0, VLCDEXT = 1

2.0

2.4

3.6

V

VLCDEXT

External LCD voltage at LCDCAP/

R33, internal or external biasing,

charge pump disabled

V_LCDCAP/R33

Capacitor on LCDCAP when

charge pump enabled

LCDCPEN = 1, VLCDx > 0000

(charge pump enabled)

C_LCDCAP

f_Frame

4.7

32

10

µF

Hz

f_LCD= 2 × mux × f_FRAME

(mux = 1 (static), 2, 3, 4)

LCD frame frequency range

0

100

f_ACLK,in

C_Panel

ACLK input frequency range

Panel capacitance

30

40 kHz

100-Hz frame frequency

10000

pF

V

V_CC

+

V_R33

Analog input voltage at R33

Analog input voltage at R23

LCDCPEN = 0, VLCDEXT = 1

2.4

V_R13

V_R03

0.2

LCDREXT = 1, LCDEXTBIAS = 1,

LCD2B = 0

V_R03+ 2/3 ×

V_R23,1/3bias

V_R13,1/3bias

V_R13,1/2bias

V_R03

V_R33

V

(V_R33– V_R03

V_R03+ 1/3 ×

(V_R33– V_R03

V_R03+ 1/2 ×

(V_R33– V_R03

)

Analog input voltage at R13 with

1/3 biasing

LCDREXT = 1, LCDEXTBIAS = 1,

LCD2B = 0

V_R23

V_R33

)

Analog input voltage at R13 with

1/2 biasing

LCDREXT = 1, LCDEXTBIAS = 1,

LCD2B = 1

V_R03

V_SS

2.4

V

)

Analog input voltage at R03

R0EXT = 1

Voltage difference between V_LCD

and R03

V_CC

+ 0.2

V_LCD-V_R03

LCDCPEN = 0, R0EXT = 1

External LCD reference voltage

applied at LCDREF/R13

V_LCDREF/R13

VLCDREFx = 01

0.8

1.2

1.5

V

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Section 8.8.10.2 lists the characteristics of the LCD controller.

8.8.10.2 LCD_B, Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

V_CC

MAX UNIT

VLCDx = 0000, VLCDEXT = 0

LCDCPEN = 1, VLCDx = 0001

LCDCPEN = 1, VLCDx = 0010

LCDCPEN = 1, VLCDx = 0011

LCDCPEN = 1, VLCDx = 0100

LCDCPEN = 1, VLCDx = 0101

LCDCPEN = 1, VLCDx = 0110

LCDCPEN = 1, VLCDx = 0111

LCDCPEN = 1, VLCDx = 1000

LCDCPEN = 1, VLCDx = 1001

LCDCPEN = 1, VLCDx = 1010

LCDCPEN = 1, VLCDx = 1011

LCDCPEN = 1, VLCDx = 1100

LCDCPEN = 1, VLCDx = 1101

LCDCPEN = 1, VLCDx = 1110

LCDCPEN = 1, VLCDx = 1111

2.4 V to 3.6 V

2 V to 3.6 V

2.2 V to 3.6 V

2.60

2.66

2.72

2.79

2.85

2.92

2.98

3.05

3.10

3.17

3.24

3.30

3.36

3.42

3.48

V_LCD

LCD voltage

V

3.6

Peak supply currents due to

charge pump activities

I_CC,Peak,CP

LCDCPEN = 1, VLCDx = 1111

2.2 V

400

100

µA

C_LCD= 4.7 µF,

LCDCPEN = 0→1,

VLCDx = 1111

Time to charge C_LCDwhen

discharged

t_LCD,CP,on

500

ms

Maximum charge pump load

current

I_CP,Load

LCDCPEN = 1, VLCDx = 1111

2.2 V

50

µA

kΩ

LCD driver output impedance, LCDCPEN = 1, VLCDx = 1000,

segment lines I_LOAD= ±10 µA

R_LCD,Seg

R_LCD,COM

10

LCD driver output impedance, LCDCPEN = 1, VLCDx = 1000,

common lines I_LOAD= ±10 µA

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8.8.11 CTSD16

Note

The delta-sigma analog-to-digital converter uses the CTSD16. The CTSD16 is proceeded by a unity-

gain buffer stage following the channel muxing as shown in Figure 9-2. See Section 8.8.14.1 for the

electrical characteristics of the PGA buffer stages.

Section 8.8.11.1 lists the operating conditions of the CTSD16.

8.8.11.1 CTSD16, Power Supply and Operating Conditions

PARAMETER

TEST CONDITIONS

AVSS = DVSS = 0 V

V_CC

MIN

TYP

MAX UNIT

V_CC

Supply voltage range

2.2

3.6

V

Analog plus digital supply

current per converter

(reference current not

included)

GAIN: 1, 2, 4, 8, 16

3 V

190⁽¹⁾

CTSD16OSRx = 256,

CTSD16RRI = 0

I_CTSD16

µA

GAIN: 1, 16

300⁽¹⁾

This is requested when CTSD16 is converting, or

CTSD16RRIBURST = 0, or when OA is in rail-to-

rail input mode (OARRI = 1), or when OA charge

pump is on. The current should only be counted

once even if both OA and CTSD16 are requesting

the clock.

CTSD16 clock current

consumption

I_CTSD16CLK

3 V

205

240

µA

(1) See Table 8-1 to calculate total current from CTSD16 for different use cases.

Table 8-1 explains how to compute the total current, I_TOTAL, when the CTSD, along with associated modules, are

used. See Section 8.8.14.2 for a similar table for the OA. A "yes" means it must be included in computing I_TOTAL

.

Here is an example current calculation for CTS16D in rail-to-rail input mode (CTSD16RRI = 1) using the internal

reference (CTSD16REFS = 1) and OA0 and OA1 enabled in rail-to-rail input modes, OARRI = 1.

As an example, assume that the application uses the CTS16D in rail-to-rail input mode (CTSD16RRI = 1) with

the internal reference (CTSD16REFS = 1) and OA0 and OA1 are enabled in rail-to-rail input modes, OARRI = 1.

The total current, I_TOTAL, would be computed as follows:

I_TOTAL= I_CTSD16+ I_CTSD16CLK+ I_CP+ I_REFBG+ 2 × I_OA

(1)

Table 8-1. CTSD16, Current Calculation

USE CASE

DETAILS

(1)

(2)

(3)

(4)

USE CASE NAME

CTSD16

CTSD16 rail-to-rail inputs CTSD16RRI = 1

I_CTSD16

I_CTSD16CLK

I_CP

no

yes

I_REFBG

I_REF

yes

yes if CTSD16REFS = 1

no if CTSD16REFS = 0

yes

yes if CTSD16REFS = 1

no if CTSD16REFS = 0

yes

(1) Count this only once no matter how many modules use it. OA can also use this when rail-to-rail input is selected.

(2) Count this only once no matter how many modules use it. OA also uses this. This current is listed in Section 8.8.14.1.

(3) Count this only once no matter how many modules use it. DAC can use this as well as internal reference when it is available externally,

REFOUT = 1. This current is listed in Section 8.8.12.1.

(4) Count this only once no matter how many modules use it. This current is listed in Section 8.8.14.1. If I_REFBGis used that includes I_REF

current.

Section 8.8.11.2 lists the characteristics of the CTSD16 external voltage reference.

8.8.11.2 CTSD16, External Voltage Reference

PARAMETER

Input voltage range

Input current

TEST CONDITIONS

CTSD16REFS = 0

V_CC

3 V

MIN

TYP

MAX UNIT

V_VeREF+

I_VeREF+

1.0

1.2

1.5

50

V

nA

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Section 8.8.11.3 lists the characteristics of the CTSD16 input range.

8.8.11.3 CTSD16, Input Range

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

Differential full-scale input

voltage range

V_ID,FSR

V_I,FSR

V_ID= V_I,A+– V_I,A–

–V_R/Gain

+V_R/Gain

V

Single-ended full-scale input

voltage range

V_ID= V_I,A+– V_R

negative input is tied to V_R

V_R– V_R/

Gain

V_R+ V_R/

Gain

CTSD16GAINx = 1

±928

±464

±232

±116

±58

CTSD16GAINx = 2

CTSD16REFS = 1 CTSD16GAINx = 4

CTSD16GAINx = 8

Differential input voltage range

for specified performance⁽²⁾

V_ID

mV

CTSD16GAINx = 16

V_R

(0.8 × V_R/

Gain)

–

V_R+

(0.8 × V_R/

Gain)

Single-ended input voltage

range for specified performance

V_I

Z_I

V

Input impedance

(pin Ax or ADx+ or ADx- to

AVSS)

CTSD16GAINx = 1, 16

3 V

20

35

MΩ

Differential input impedance

(pin ADx+ to pin ADx-)

Z_ID

V_I

MΩ

V

Absolute input voltage range

AVSS

V_CC

Common-mode input voltage

range

V_IC

V

(1) All parameters pertain to each CTSD16 input.

(2) The full-scale range is defined by V_FSR+= +V_R/GAIN and V_FSR-= -V_R/GAIN; FSR = V_FSR+- V_FSR-= 2xV_R/GAIN. If V_Ris sourced

externally, the analog input range should not exceed 80% of V_FSR+or V_FSR-; that is, V_ID= 0.8 V_FSR-to 0.8 V_FSR+. If V_Ris sourced

internally, the given V_IDranges apply.

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Section 8.8.11.4 lists the performance characteristics of the CTSD16.

8.8.11.4 CTSD16, Performance

CTSD16OSRx = 256, CTSD164REFS = 1 (see Figure 8-16, Figure 8-17, and Figure 8-18)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

f_M

Modulator clock

1.024

MHz

CTSD16GAINx = 1, input ADx+ and

ADx- (differential)

84

87

86

85

82

77

83

82

78

72

66

CTSD16GAINx = 2, input ADx+ and

ADx- (differential)

Signal-to-noise +

distortion ratio for

differential inputs

CTSD16GAINx = 4, input ADx+ and

ADx- (differential)

SINAD

f_IN= 50 Hz⁽¹⁾

3 V

dB

CTSD16GAINx = 8, input ADx+ and

ADx- (differential)

CTSD16GAINx = 16, input ADx+ and

ADx- (differential)

CTSD16GAINx = 1, input Ax (single-

ended)

CTSD16GAINx = 2, input Ax (single-

ended)

Signal-to-noise +

distortion ratio for

single-ended input

CTSD16GAINx = 4, input Ax (single-

ended)

SINAD

f_IN= 50 Hz⁽¹⁾

3 V

dB

CTSD16GAINx = 8, input Ax (single-

ended)

CTSD16GAINx = 16, input Ax (single-

ended)

CTSD16GAINx = 1

CTSD16GAINx = 2

CTSD16GAINx = 4

CTSD16GAINx = 8

CTSD16GAINx = 16

1

2

G

Nominal gain

Gain error

3 V

4

8

16

CTSD16GAINx: 1, 8, or 16 with external reference (1.2

V)

E_G

3 V

–1%

+1%

Gain error

temperature

coefficient, internal

reference

ppm/

ΔE_G/ΔT

CTSD16GAINx: 1, 8, or 16

3

50

°C

Gain error

temperature

coefficient, external

reference

CTSD16GAIN: 1, 8, or 16 with external reference

(1.2 V)

ppm/

ΔE_G/ΔT

3 V

4

15

°C

ΔE_G/ ΔVCC Gain error vs VCC

CTSD16GAINx: 1, 8, or 16

CTSD16GAINx = 1

0.02

%/V

±4.1

mV

E_OS

Offset error

3 V

CTSD16GAINx = 16

±3.4

Offset error

temperature

coefficient

ppm

±10 FSR/

°C

ΔEOS/ΔT

CTSD16GAINx = 1, 16

±1

11

ΔEOS/

ΔVCC

Offset error vs VCC

3 V

µV/V

dB

CTSD16GAINx = 1, V_ID= 928 mV, f_IN= 50 Hz

CTSD16GAINx = 16, V_ID= 58 mV, f_IN= 50 Hz

78

80

CMRR,

50Hz

Common-mode

rejection ratio at 50 Hz

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8.8.11.4 CTSD16, Performance (continued)

CTSD16OSRx = 256, CTSD164REFS = 1 (see Figure 8-16, Figure 8-17, and Figure 8-18)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

CTSD16GAINx: 1, V_CC= 3 V ±50 mV × sin(2π × f_Vcc

t), f_Vcc= 50 Hz,

Inputs grounded (no analog signal applied)

×

95

CTSD16GAINx: 8, V_CC= 3 V ±50 mV × sin(2π × f_Vcc

t), f_Vcc= 50 Hz,

Inputs grounded (no analog signal applied)

AC power supply

rejection ratio

AC PSRR

DC PSRR

105

dB

CTSD16GAINx: 16, V_CC= 3 V ±50 mV × sin(2π × f_Vcc

t), f_Vcc= 50 Hz,

×

Inputs grounded (no analog signal applied)

CTSD16GAINx: (1, 8, 16), V_CC= 2.2 V to 3.6 V, (PSRR

[dB] = –20 log(dVout/dVcc) with dVout observed as

change in the digital conversion result; assumed to be

dominated by reference)

DC power supply

rejection ratio

90

dB

(1) The following voltages were applied to the CTSD16 inputs:

V_I,A+(t) = 0 V + V_PP/2 × sin(2π × f_IN× t)

V_I,A–(t) = 0 V – V_PP/2 × sin(2π × f_IN× t)

resulting in a differential voltage of V_ID= V_IN,A+(t) – V_IN,A-(t) = V_PP× sin(2π × f_IN× t) with V_PPbeing selected as the maximum value

allowed for a given range (according to CTSD16 input range).

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0

-0.2

-0.4

-0.6

-0.8

-1

3

2.5

2

1.5

1

0.5

Gain = 1

-1.2

Gain = 16

-1.4

-40

0

0.25

0.55

0.85

1.2

1.5

1.8

2.1

2.4

2.7

-20

0

20

40

60

80

100

Common-Mode Voltage (V)

Temperature (°C)

A.

Gain = 1

OSR = 256

DIfferential Signal = 300

Average of four typical devices

Figure 8-17. CTSD16 Typical Offset Voltage vs

Common-Mode Voltage

Figure 8-16. CTSD16 Offset Voltage vs

Temperature

90

85

80

75

70

65

60

55

50

10

100

1000

OSR

CTSD16REFS = 1 CTSD16GAINx = 1

Figure 8-18. SINAD Performance vs OSR

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Section 8.8.11.5 lists the characteristics of the built-in V_ccsense.

8.8.11.5 Built-in V_ccSense

PARAMETER

AV_CCdivider

TEST CONDITIONS

MIN

TYP

MAX UNIT

0.95 ×

(AVCC / 2)

1.05 ×

V

V_CC,sense

CTSD16ON = 1, CTSD16INCH = 0111

AVCC / 2

(AVCC / 2)

Section 8.8.11.6 lists the characteristics of the temperature sensor.

8.8.11.6 Temperature Sensor

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

CTSD16ON = 1, CTSD16INCH = 110,

V_CC= 3 V, T_A= 30°C

V_sensorTemperature sensor output voltage^{(1) (2)}

800

mV

CTSD16ON = 1, CTSD16INCH = 110,

T_A= 85°C

I_sensorTemperature sensor quiescent current consumption

2

uA

(1) The temperature sensor offset can be as much as ±30°C. TI recommends a single-point calibration to minimize the offset error of the

built-in temperature sensor.

(2) The device descriptor structure contains calibration values for 30°C ±3°C and 85°C ±3°C for each of the available reference voltage

levels. The sensor voltage can be computed as V_SENSE= TC_SENSOR* (Temperature, °C) + V_SENSOR, where TC_SENSORand V_SENSOR

can be computed from the calibration values for higher accuracy.

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8.8.12 REF

Section 8.8.12.1 lists the characteristics of the REF and REFBG built-in reference.

8.8.12.1 REF and REFBG, Built-In Reference

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

Operating supply current into AVCC

terminal⁽¹⁾

I_REFBG

V_REFBG

I_REF

V_CC= 3.0 V, REFON = 1 and REFOUT = 1

110

130

1.174

20

µA

V

V_CC= 3.0 V,

VeREF+ ≤ 1.5 V if used

Bandgap output voltage calibrated

1.146

1.16

15

Operating supply current into AVCC

terminal⁽¹⁾

V_CC= 3.0 V, REFON = 1

µA

REFVSEL = {2} for 2.5 V, REFON = 1

REFVSEL = {1} for 2.0 V, REFON = 1

REFVSEL = {0} for 1.5 V, REFON = 1

DAC12SREFx = 0, REFVSEL = {0} for 1.5 V

DAC12SREFx = 0, REFVSEL = {1} for 2 V

DAC12SREFx = 0, REFVSEL = {2} for 2.5 V

V_CC= 2.2 V to 3.6 V, T_A= 25°C

2.5

2.0

1.5

±1%

Positive built-in reference voltage

output

V_REF

V

2.2

2.3

2.8

AVCC minimum voltage, Positive

built-in reference active

AV_CC(min)

PSRR_DC Power supply rejection ratio (DC)

PSRR_AC Power supply rejection ratio (AC)

50

µV/V

V_CC= 2.2 V to 3.6 V, T_A= 25°C,

f = 1 kHz, ΔVpp = 100 mV

1.5

mV/V

Bandgap reference temperature

TC_REF+

I_VREF+= 0 A

15

50 ppm/°C

coefficient⁽²⁾

Settling time of V_REFBGreference

AV_CC= AV_{CC (min)}through AV_CC(max)

REFON = 0 → 1

,

t_SETTLE

120

µs

voltage⁽³⁾

C_VREFBG

I_LOAD

Capacitance at VREFBG terminal

VREFBG maximum load current

See ⁽⁴⁾

1

nF

REFOUT = REFON = 1

I_(VREF+)= +1 mA or –1 mA,

AV_CC= AV_{CC (min)}

REFON = REFOUT = 1

mA

Load-current regulation, VREFBG

terminal⁽⁵⁾

I_L(VREFBG)

,

3.5 mV/mA

(1) The internal reference current is supplied from terminal AVCC. Consumption is independent of the CTSD16ON control bit, unless a

conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion.

(2) Calculated using the box method: (MAX(–40°C to 85°C) – MIN(–40°C to 85°C)) / MIN(–40°C to 85°C)/(85°C – (–40°C)).

(3) The condition is that the error in a conversion started after t_REFONis less than ±0.5 LSB.

(4) There is no capacitance required on VREFBG if the reference voltage is not used externally. However, TI recommends a capacitance

close to the maximum value to reduce any reference voltage noise.

(5) Contribution only due to the reference and buffer including package. This does not include resistance due to PCB traces or other

external factors.

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8.8.13 DAC

Section 8.8.13.1 lists the supply specifications of the DAC.

8.8.13.1 12-Bit DAC, Supply Specifications

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

AV_CC

Analog supply voltage

AV_CC= DV_CC, AV_SS= DV_SS= 0 V

2.2

3.6

V

DAC12AMPx = 2, DAC12IR = 0,

DAC12OG = 1,

DAC12_xDAT = 0800h,

VeREF+ = VREFBG = 1.16 V

3 V

65

110

DAC12AMPx = 2, DAC12IR = 1,

DAC12_xDAT = 0800h,

VeREF+ = AV_CC

125

250

750

70

165

350

I_DD

Supply current, single DAC channel^{(1) (2)}

µA

DAC12AMPx = 5, DAC12IR = 1,

DAC12_xDAT = 0800h,

VeREF+ = AV_CC

2.2 V to

3.6 V

DAC12AMPx = 7, DAC12IR = 1,

DAC12_xDAT = 0800h,

VeREF+ = AV_CC

1100

DAC12_xDAT = 800h,

VeREF+ = 1.16 V or 1.5 V,

ΔAV_CC= 100 mV

2.2 V to

3.6 V

PSRR Power supply rejection ratio^{(3) (4)}

dB

DAC12_xDAT = 800h,

VeREF+ = 1.16 V or 2.5 V

ΔAV_CC= 100 mV

3 V

70

(1) No load at the output pin, DAC12_0 or DAC12_1, assuming that the control bits for the shared pins are set properly.

(2) Current into reference terminals not included. If DAC12IR = 1 current flows through the input divider; see Reference Input

specifications Section 8.8.13.4.

(3) PSRR = 20 log (ΔAV_CC/ ΔV_{DAC12_xOUT}

(4) The internal reference is not used.

)

DAC V_OUT

V_R+

DAC Output

R_Load= ¥

Ideal transfer

function

AV_CC

2

Offset Error

Positive

Gain Error

C_Load= 100 pF

Negative

DAC Code

Figure 8-19. Linearity Test Load Conditions, Gain and Offset Definition

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Section 8.8.13.2 lists the linearity specifications of the DAC.

8.8.13.2 12-Bit DAC, Linearity Specifications

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see

Figure 8-19)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

Resolution

12-bit monotonic

12

bits

V_eREF+= 1.16 V, DAC12AMPx = 7, DAC12IR = 1

V_eREF+= 2.5 V, DAC12AMPx = 7, DAC12IR = 1

V_eREF+= 1.16 V, DAC12AMPx = 7, DAC12IR = 1

V_eREF+= 2.5 V, DAC12AMPx = 7, DAC12IR = 1

2.2 V, 3 V

±2

±4

INL

Integral nonlinearity⁽¹⁾

LSB

±4

±0.4

±1

Differential

DNL

LSB

±1

nonlinearity⁽¹⁾

V_eREF+= 1.16 V,

DAC12AMPx = 7,

DAC12IR = 1

2.2 V, 3 V

±21

Without calibration^{(1) (2)}

V_eREF+= 2.5 V,

DAC12AMPx = 7,

DAC12IR = 1

±21

mV

E_O

Offset voltage

V_eREF+= 1.16 V,

DAC12AMPx = 7,

±1.5

DAC12IR = 1

With calibration^{(1) (2)}

V_eREF+= 2.5 V,

DAC12AMPx = 7,

DAC12IR = 1

2.2 V, 3 V

±1.5

Offset error temperature

coefficient⁽¹⁾

d_E(O)/d_T

With calibration

±10

10

µV/°C

V_eREF+= 1.16 V

V_eREF+= 2.5 V

2.2 V, 3 V

±2.5

%FSR

±2.5

E_G

Gain error

ppm of

FSR/

°C

Gain temperature

coefficient⁽¹⁾

d_E(G)/d_T

2.2 V, 3 V

DAC12AMPx = 2

165

Time for offset

calibration⁽³⁾

t_{Offset_Cal}

DAC12AMPx = 3, 5

DAC12AMPx = 4, 6, 7

66

ms

16.5

(1) Parameters calculated from the best-fit curve from 0x0F to 0xFFF. The best-fit curve method is used to deliver coefficients "a" and "b"

of the first-order equation: y = a + bx. V_{DAC12_xOUT}= E_O+ (1 + E_G) × (Ve_REF+/4095) × DAC12_xDAT, DAC12IR = 1.

(2) The offset calibration works on the output operational amplifier. Offset Calibration is triggered setting bit DAC12CALON

(3) The offset calibration can be done if DAC12AMPx = {2, 3, 4, 5, 6, 7}. The output operational amplifier is switched off with

DAC12AMPx = {0, 1}. TI recommends configuring the DAC12 module before initiating calibration. Port activity during calibration may

affect accuracy and is not recommended.

62

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Section 8.8.13.3 lists the output specifications of the DAC.

8.8.13.3 12-Bit DAC, Output Specifications

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

No load, V_eREF+= AV_CC

,

DAC12_xDAT = 0h, DAC12IR = 1,

DAC12AMPx = 7

0

0.005

No load, V_eREF+= AV_CC

DAC12_xDAT = 0FFFh, DAC12IR = 1,

DAC12AMPx = 7

,

AV_CC

0.05

–

AV_CC

Output voltage

range⁽¹⁾(see Figure

8-20)

V_O

2.2 V, 3.6 V

V

R_Load= 3 kΩ, V_eREF+= AV_CC

,

DAC12_xDAT = 0h, DAC12IR = 1,

DAC12AMPx = 7

0

0.1

R_Load= 3 kΩ, V_eREF+= AV_CC

DAC12_xDAT = 0FFFh, DAC12IR = 1,

DAC12AMPx = 7

,

AV_CC

0.13

–

AV_CC

Maximum DAC12

load capacitance

C_L(DAC12)

2.2 V, 3.6 V

100

pF

DAC12AMPx = 2, DAC12_xDAT = 0FFFh,

V_O/P(DAC12)> AV_CC– 0.3

–1

Maximum DAC12

load current

I_L(DAC12)

mA

DAC12AMPx = 2, DAC12_xDAT = 0h,

V_O/P(DAC12)< 0.3 V

1

250

6

R_Load= 3 kΩ, V_O/P(DAC12) < 0.3 V,

DAC12AMPx = 2, DAC12_xDAT = 0h

150

Output resistance

(see Figure 8-20)

R_Load= 3 kΩ, V_O/P(DAC12)> AV_CC– 0.3 V,

DAC12_xDAT = 0FFFh

R_O/P(DAC12)

2.2 V, 3.6 V

Ω

R_Load= 3 kΩ,

0.3 V ≤ V_O/P(DAC12)≤ AV_CC– 0.3 V

(1) Data is valid after the offset calibration of the output amplifier.

R_{O/P(DAC12_x)}

Max

R_Load

I_Load

AV_CC

DAC12

2

C_Load= 100 pF

O/P(DAC12_x)

Min

0.3

AV_CC– 0.3 V

V_OUT

AV_CC

Figure 8-20. DAC12_x Output Resistance Tests

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Section 8.8.13.4 lists the reference input specificaitons of the DAC.

8.8.13.4 12-Bit DAC, Reference Input Specifications

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

DAC12IR = 0^{(1) (2)}

V_CC

MIN

TYP

MAX UNIT

AV_CC/ 3 AV_CC+ 0.2

AV_CCAV_CC+ 0.2

Reference input voltage

range

V_eREF+

2.2 V to 3.6 V

V

DAC12IR = 1^{(3) (4)}

DAC12_0 DAC12IR =

DAC12_1 DAC12IR = 0

20

MΩ

DAC12_0 DAC12IR = 1,

DAC12_1 DAC12IR = 0

52

Ri_(VREFBG), Reference input

Ri_(VeREF+)resistance

DAC12_0 DAC12IR = 0,

DAC12_1 DAC12IR = 1

2.2 V, 3 V

kΩ

DAC12_0 DAC12IR =

DAC12_1 DAC12IR = 1,

DAC12_0 DAC12SREFx =

DAC12_1 DAC12SREFx⁽⁵⁾

26

(1) For a full-scale output, the reference input voltage can be as high as 1/3 of the maximum output voltage swing (AVCC).

(2) The maximum voltage applied at reference input voltage terminal VeREF+ = [AV_CC– V_E(O)] / [3 × (1 + E_G)].

(3) For a full-scale output, the reference input voltage can be as high as the maximum output voltage swing (AVCC).

(4) The maximum voltage applied at reference input voltage terminal VeREF+ = [AV_CC– V_E(O)] / (1 + E_G).

(5) When DAC12IR = 1 and DAC12SREFx = 0 or 1 for both channels, the reference input resistive dividers for each DAC are in parallel

and reduce the reference input resistance.

Section 8.8.13.5 and Section 8.8.13.6 list the dynamic specifications of the DAC.

8.8.13.5 12-Bit DAC, Dynamic Specifications

V_REF= V_CC, DAC12IR = 1 (see Figure 8-21 and Figure 8-22), over recommended ranges of supply voltage and

operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

DAC12AMPx = 0 → {2, 3, 4}

60

120

DAC12_xDAT = 800h,

Error_V(O)< ±0.5 LSB⁽¹⁾

(see Figure 8-21)

t_ON

DAC12 on time

DAC12AMPx = 0 → {5, 6}

DAC12AMPx = 0 → 7

DAC12AMPx = 2

2.2 V, 3 V

15

30

12

µs

6

100

40

200

80

DAC12_xDAT =

80h → F7Fh → 80h

t_S(FS)

t_S(C-C)

SR

Settling time, full scale

DAC12AMPx = 3, 5

DAC12AMPx = 4, 6, 7

DAC12AMPx = 2

2.2 V, 3 V

15

30

5

DAC12_xDAT =

3F8h → 408h → 3F8h,

BF8h → C08h → BF8h

Settling time, code to

code

DAC12AMPx = 3, 5

DAC12AMPx = 4, 6, 7

DAC12AMPx = 2

2

1

0.05

0.35

1.50

0.35

1.10

5.20

DAC12_xDAT =

Slew rate

DAC12AMPx = 3, 5

DAC12AMPx = 4, 6, 7

2.2 V, 3 V

V/µs

nV-s

80h → F7Fh → 80h⁽²⁾

DAC12_xDAT =

800h → 7FFh → 800h

Glitch energy

DAC12AMPx = 7

35

(1) R_Loadand C_Loadconnected to AV_SS(not AV_CC/2) in Figure 8-21.

(2) Slew rate applies to output voltage steps ≥ 200 mV.

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Conversion 1

Conversion 2

1/2 LꢀS

Conversion 3

V_OUT

DAC Output

Glitch

Energy

R_Load= 3 kW

I_Load

AV_CC

2

1/2 LꢀS

C_Load= 100 pF

R_O/P(DAC12.x)

t_settleLH

t_settleHL

Figure 8-21. Settling Time and Glitch Energy Testing

Conversion 1

Conversion 2

Conversion 3

V_OUT

90%

10%

t_SRLH

t_SRHL

Figure 8-22. Slew Rate Testing

8.8.13.6 12-Bit DAC, Dynamic Specifications (Continued)

over recommended ranges of supply voltage and T_A= 25°C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

DAC12AMPx = {2, 3, 4}, DAC12SREFx = 2,

DAC12IR = 1, DAC12_xDAT = 800h

40

3-dB bandwidth,

V_DC= 1.5 V,

V_AC= 0.1 V_PP

(see Figure 8-23)

DAC12AMPx = {5, 6}, DAC12SREFx = 2,

DAC12IR = 1, DAC12_xDAT = 800h

BW_–3dB

2.2 V, 3 V

180

550

kHz

DAC12AMPx = 7, DAC12SREFx = 2,

DAC12IR = 1, DAC12_xDAT = 800h

DAC12_0DAT = 800h, No load,

DAC12_1DAT = 80h ↔ F7Fh, R_Load= 3 kΩ,

f_{DAC12_1OUT}= 10 kHz at 50/50 duty cycle

–80

Channel-to-channel crosstalk⁽¹⁾

(see Figure 8-24)

2.2 V, 3 V

dB

DAC12_0DAT = 80h ↔ F7Fh, R_Load= 3 kΩ,

DAC12_1DAT = 800h, No load,

f_{DAC12_0OUT}= 10 kHz at 50/50 duty cycle

(1) R_Load= 3 kΩ, C_Load= 100 pF

R_Load= 3 kW

I_Load

Ve_REF+

AV_CC

2

DAC12_x

DACx

AC

DC

C_Load= 100 pF

Figure 8-23. Test Conditions for 3-dB Bandwidth Specification

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R_Load

I_Load

AV_CC

2

DAC12_xDA

T

080h

F7Fh

080h

F7Fh

DAC12_0

DAC0

V_OUT

C_Load= 100 pF

R_Load

V_REF+

V_{DAC12_yOUT}

I_Load

V_{DAC12_xOUT}

AV_CC

2

DAC12_1

1/f_Toggle

DAC1

C_Load= 100 pF

Figure 8-24. Crosstalk Test Conditions

8.8.14 Operational Amplifier

Section 8.8.14.1 lists the characteristics of the OA.

8.8.14.1 Operational Amplifier, OA0, OA1, PGA Buffers

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX

UNIT

V_CC

Analog supply voltage AV_CC= DV_CC, AV_SS= DV_SS= 0 V

2.2

20

3.6

24

V

External charge pump

C_CPCAP

Required when charge pump is enabled

capacitor to AVSS.

22

1.6

nF

mA

μA

Charge pump peak

OARRI = 0h to 1h, I_{CP_LOAD}= 0 μA

current

I_{CP_PEAK}

I_CP

Charge pump average

OARRI = 1h, I_{CP_LOAD}= 100 μA

current

570⁽¹⁾

710⁽¹⁾

OARRI = 0h to 1h, I_{CP_LOAD}= 0 μA,

Charge pump enable

time fast

AFE biases previously enabled and settled

which can be done with REFON=1 or other

modules requesting REFON.

t_{CP_EN_fast}

50

75

μs

OARRI = 0h to 1h, I_{CP_LOAD}= 0 μA,

Includes AFE bias settling

Charge pump enable

time slow

t_{CP_EN_slow}

Supply current, per

opamp

I_O= 0 mA,

OARRI = 0h (charge pump disabled)

I_OA

105⁽¹⁾

±2

130⁽¹⁾

μA

mV

V_OS

Input offset voltage

Noninverting, unity gain

Input offset voltage

temperature drift

dV_OS/dT

±1

μV/°C

Input offset voltage

voltage drift

dV_OS/dV

C_in

Noninverting, unity gain

±3

μV/V

Differential

4

6

pF

Input capacitance

Common mode

Power supply rejection Noninverting, unity gain,

PSRR_DC

50

μV/V

V

ratio, DC

V_INP= positive input of OA = 1 V

OARRI = 0h,

0.1

V_CC- 1.0

V_CC- 0.1

Noninverting, unity gain

Common mode

voltage range⁽²⁾

V_CM

OARRI = 1h,

V

Noninverting, unity gain

Common mode

rejection ratio, DC

CMRR_DC

Over common-mode voltage range

110

dB

f = 100 Hz, OARRI = 0h or 1h

f = 50 kHz, OARRI = 0h or 1h

3.0 V

90

25

Input voltage noise

density

e_n

nV/√Hz

dB

Open-loop voltage

gain, DC

A_OL

95

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over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX

UNIT

Gain-bandwidth

product

GBW

SR

C_L= 100 pF, OAM = 1h

800

kHz

Noninverting, unity gain,

C_L= 100 pF, OAM = 1h

Slew rate

0.4

5.3

5

V/μs

μs

Noninverting, unity gain,

2.0-V step, 0.1%, OAM = 1h

t_SETTLE

V_O

Settling time

3.0 V

Voltage output swing

from rail

–250 μA ≤ I_O≤ 250 μA,

Noninverting, unity gain (OAM = 1h)

55

7

mV

Noninverting, unity gain,

OAM = 0h transition to 1h,

AFE biases previously enabled and settled

which can be done with REFON = 1 or other

modules requesting REFON⁽³⁾

t_{EN_FAST}

Enable time fast

3

μs

Noninverting,unity gain,

OARRI = 0h transition to 1h,

OAM = 0h transition to 1h,

Includes AFE bias and charge pump

settling⁽³⁾

t_{EN_SLOW}

Enable time slow

Disable time

190

0.4

225

μs

t_DIS

(1) See Section 8.8.14.2 to calculate total current from OA for different use cases.

(2) The common-mode input range is measured with the OA in a unity-gain source-follower configuration. The input signal is swept from 0

V to V_CC, and the output of the OA is monitored. The minimum and maximum values represent when the input and output differ more

than 10 mV, not including the offset, V_OS

.

(3) The AFE bias is used by several modules including the OA charge pump, OA, and CTSD16. Any of these modules will request the

AFE bias when enabled. The AFE bias is generated by the REF module, so enabling the REF module also enables the AFE bias.

Section 8.8.14.2 explains how to compute the total current, I_TOTAL, when the OA and associated modules are

used. See Table 8-1 for a similar table for the CTSD16. A "yes" means it must be included in computing I_TOTAL

.

As an example, assume that the application uses the CTS16D in rail-to-rail input mode (CTSD16RRI = 1) with

the internal reference (CTSD16REFS = 1) and OA0 and OA1 are enabled in rail-to-rail input modes, OARRI = 1.

The total current, I_TOTAL, would be computed as follows:

I_TOTAL= I_CTSD16+ I_CTSD16CLK+ I_CP+ I_REFBG+ 2 × I_OA

700

650

600

550

500

450

400

350

300

250

200

150

100

160

140

120

100

80

60

40

20

0

50

0

0.5

1

1.5

2

2.5

Offset Voltage Drift (µV/°C)

3

3.5

4

4.5

0.4

0.6

0.8

1

1.2

1.5

1.6

1.8

2

2.2

2.4

2.6

Offset Voltage (mV)

Figure 8-26. OA Offset Voltage Drift Sample

Production Distribution

Figure 8-25. OA Offset Voltage Sample Production

Distribution

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8.8.14.2 OA, Current Calculation

(1)

(2)

(3)

USE CASE NAME

USE CASE DETAILS

I_OA

yes

I_CTSD16CLK

no

I_CP

no

I_REF

OA

OARRI = 0

OARRI = 1

yes

OA with rail-to-rail input

yes

(CTSD16SC = 0) AND

(CTSD16RRI = 1) AND

(CTSD16RRIBURST = 0) OR

((OARRI = 1 (for any OA))

AND (OAM = 0))

Rail-to-rail input up, module off

no

yes

(1) Count this current only once no matter how many modules use it. CTSD16 and the charge pump also use this. This current is listed in

Section 8.8.11.1.

(2) Count this current only once no matter how many modules use it. CTSD16 also uses this when rail-to-rail inputs are selected.

(3) Count this current only once no matter how many modules use it. This current is listed in Section 8.8.14.1. If I_REFBGis used, that

includes the I_REFcurrent.

8.8.15 Switches

Section 8.8.15.1 lists the characteristics of the ground switches.

8.8.15.1 Ground Switches (GSW0A, GSW0B, GSW1A, GSW1B)

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

V_CC

I_LKG

Supply voltage

2.2

3.6

V

T_A= 0°C to 60°C

±0.25

Input leakage⁽¹⁾

nA

T_A= –40°C to 85°C

±50

100

I_IN

Input current switch to AVSS

0

µA

Ω

I_IN= 100 µA,

T_A= –40°C to 85°C

R_ON

Switch ON resistance with switch closed

9.5

18.5

T_A= –40°C to 85°C,

Input signal frequency < 100 Hz

R_OFF

Switch OFF resistance with switch open

100

MΩ

µs

t_ON/OFFEnable or disable time

T_A= –40°C to 85°C

0.25

(1) Ground switches are shared with general-purpose I/Os. This leakage includes all leakage seen at the device pin, not only leakage

caused by the switch itself.

4

DV_CC= 2.2 V

DV_CC= 3 V

DV_CC= 3.6 V

3.5

3

2.5

2

1.5

1

0.5

0

5

10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85

Temperature (°C)

Average of three typical devices

Figure 8-27. Ground Switch Input Leakage Current vs Temperature

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Section 8.8.15.2 lists the characteristics of the OA switches.

8.8.15.2 Operational Amplifier Switches

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

V_CC

I_LKG

Supply voltage

2.2

3.6

V

T_A= 0°C to 60°C

±0.25

Input leakage⁽¹⁾

nA

T_A= –40°C to 85°C

±50

100

I_IN

Input current through switch

0

µA

kΩ

I_IN= 100 µA,

T_A= –40°C to 85°C

R_ON

Switch ON resistance with switch closed⁽²⁾

1

T_A= –40°C to 85°C,

Input signal frequency < 100 Hz

R_OFF

Switch OFF resistance with switch open

100

MΩ

µs

t_ON/OFFEnable or disable time

T_A= –40°C to 85°C

0.45

(1) This leakage includes all leakage seen at the device pin, not only leakage caused by the switch itself. It assumes a total of five

switches present and a shared digital I/O.

(2) The resistance varies with input voltage range. This resistance represents the peak resistance at the worst case input range (see

Figure 8-29).

0.30

0.25

0.20

0.15

0.10

0.05

0.00

-0.05

1400

1200

1000

800

600

400

200

0

DV_CC= 2.2 V

DV_CC= 2.3 V

DV_CC= 3 V

DV_CC= 3.6 V

T_A= –40°C

T_A= 25°C

T_A= 85°C

0.2

0.6

1.0

1.4

1.8

2.2

2.6

3.0

0

5

10 15 20 25 30 35 40 45 50 55 60 65

Temperature (°C)

Common-Mode Voltage (V)

Average of three typical devices

Figure 8-28. OA Switch Input Leakage Current vs

Temperature

Figure 8-29. OA Switch R_ONvs Common-Mode

Voltage

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8.8.16 Comparator

Section 8.8.16.1 lists the characteristics of the comparator.

8.8.16.1 Comparator_B

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_CC

MIN

TYP

MAX UNIT

V_CC

Supply voltage

1.8

3.6

40

50

65

V

1.8 V

2.2 V

3 V

CBPWRMD = 00, CBON = 1,

CBRSx = 00

30

40

Comparator operating supply

I_{AVCC_COMP}current into AVCC, Excludes

reference resistor ladder

µA

CBPWRMD = 01, CBON = 1,

CBRSx = 00

2.2 V, 3 V

10

30

CBPWRMD = 10, CBON = 1,

CBRSx = 00

0.5

1.3

Quiescent current of resistor

ladder into AVCC, Includes

REF module current

CBREFACC = 1, CBREFLx = 01,

CBRSx = 10, REFON = 0, CBON = 0

I_{AVCC_REF}

2.2 V, 3 V

10

22

µA

V_IC

Common mode input range

0

–20

–10

V_CC– 1

20

V

CBPWRMD = 00

V_OFFSET

C_IN

Input offset voltage

mV

CBPWRMD = 01 or 10

10

Input capacitance

5

3

pF

kΩ

On (switch closed)

4

R_SIN

Series input resistance

Off (switch open)

50

MΩ

CBPWRMD = 00, CBF = 0

CBPWRMD = 01, CBF = 0

CBPWRMD = 10, CBF = 0

450

600

50

ns

µs

Propagation delay, response

time

t_PD

CBPWRMD = 00, CBON = 1, CBF = 1,

CBFDLY = 00

0.35

0.6

1.0

1.8

0.6

1.0

1.8

3.4

1

1.5

1.8

3.4

6.5

2

CBPWRMD = 00, CBON = 1, CBF = 1,

CBFDLY = 01

Propagation delay with filter

active

t_PD,filter

µs

CBPWRMD = 00, CBON = 1, CBF = 1,

CBFDLY = 10

CBPWRMD = 00, CBON = 1, CBF = 1,

CBFDLY = 11

CBON = 0 → 1,

CBPWRMD = 00 or 01

t_{EN_CMP}

Comparator enable time

µs

CBON = 0 → 1,

CBPWRMD = 10

100

1.5

t_{EN_REF}

Resistor reference enable time CBON = 0 → 1

1.0

Temperature coefficient of

V_{CB_REF}

ppm/

°C

TC_{CB_REF}

50

VIN ×

Reference voltage for a given VIN = reference into resistor ladder,

V_{CB_REF}

(n + 0.5) / (n + 1) / (n + 1.5) /

32 32 32

V

tap

n = 0 to 31

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8.8.17 USB

Section 8.8.17.1 lists the characteristics of PU.0 and PU.1.

8.8.17.1 Ports PU.0 and PU.1

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

V_USB= 3.3 V ±10%, I_OH= –25 mA

V_USB= 3.3 V ±10%, I_OL= 25 mA

V_USB= 3.3 V ±10%

MIN

MAX

UNIT

V_OHHigh-level output voltage (see Figure 8-31)

V_OLLow-level output voltage (see Figure 8-30)

2.4

V

0.4

V_IH

V_IL

High-level input voltage (see Figure 8-32)

Low-level input voltage (see Figure 8-32)

2.0

V_USB= 3.3 V ±10%

0.8

90

80

70

60

50

40

30

20

10

V_CC= 3.0 V

T_A= 25ºC

V_CC= 3.0 V

T_A= 85ºC

V_CC= 1.8 V

T_A= 25ºC

V_CC= 1.8 V

T_A= 85ºC

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

1.1

1.2

V

_OL- Low-Level Output Voltage - V

Figure 8-30. Ports PU.0, PU.1 Typical Low-Level Output Characteristics

0

-10

-20

-30

V_CC= 1.8 V

T_A= 85ºC

-40

-50

V_CC= 3.0 V

T_A= 85ºC

-60

-70

-80

-90

V_CC= 1.8 V

T_A= 25ºC

V_CC= 3.0 V

T_A= 25ºC

0.5

1

1.5

2

2.5

3

V_OH- High-Level Output Voltage - V

Figure 8-31. Ports PU.0, PU.1 Typical High-Level Output Characteristics

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2.0

T_A= 25°C, 85°C

1.8

V_IT+, postive-going input threshold

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

V_IT–, negative-going input threshold

0.0

1.8

2.2

2.6

3

3.4

VUSB Supply Voltage, V_USB- V

Figure 8-32. Ports PU.0, PU.1 Typical Input Threshold Characteristics

Section 8.8.17.2 and Section 8.8.17.3 list the characteristics of the DP and DM ports.

8.8.17.2 USB Output Ports DP and DM

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

D+, D– single ended

D+, D– impedance

Rise time

TEST CONDITIONS

MIN

2.8

0

MAX UNIT

V_OH

USB 2.0 load conditions

3.6

0.3

44

V

V_OL

Z_(DRV)

t_RISE

t_FALL

Including external series resistor of 27 Ω

28

4

Ω

Full speed, differential, C_L= 50 pF, 10%/90%, Rpu on D+

20

ns

Fall time

4

20

8.8.17.3 USB Input Ports DP and DM

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

MIN

MAX UNIT

V_(CM)

Z_(IN)

V_CRS

V_IL

Differential input common mode range

Input impedance

0.8

2.5

V

kΩ

V

300

1.3

Crossover voltage

2.0

Static SE input logic low level

Static SE input logic high level

Differential input voltage

0.8

V

V_IH

2.0

0.2

V

VDI

V

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Section 8.8.17.4 lists the characteristics of the USB power system.

8.8.17.4 USB-PWR (USB Power System)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

V_LAUNCHV_BUSdetection threshold

3.75

5.5

V

V_BUS

V_USB

V₁₈

USB bus voltage

Normal operation

3.76

USB LDO output voltage

Internal USB voltage⁽¹⁾

3.3

1.8

±9%

V

I_{USB_EXT}Maximum external current from VUSB terminal⁽²⁾

I_DET

USB LDO current overload detection⁽³⁾

I_SUSPENDOperating supply current into VBUS terminal⁽⁴⁾

USB LDO is on

12

100

250

mA

µA

µF

nF

60

USB LDO is on, USB PLL disabled

C_BUS

C_USB

C₁₈

VBUS terminal recommended capacitance

VUSB terminal recommended capacitance

V18 terminal recommended capacitance

4.7

220

Within 2%,

recommended capacitances

t_ENABLE

RPUR

Settling time V_USBand V₁₈

2

ms

Ω

Pullup resistance of PUR terminal

70

110

150

(1) This voltage is for internal use only. No external DC loading should be applied.

(2) This represents additional current that can be supplied to the application from the VUSB terminal beyond the needs of the USB

operation.

(3) A current overload is detected when the total current supplied from the USB LDO, including I_{USB_EXT}, exceeds this value.

(4) Does not include current contribution of Rpu and Rpd as outlined in the USB specification.

Section 8.8.17.5 lists the characteristics of the USB PLL.

8.8.17.5 USB-PLL (USB Phase-Locked Loop)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

MIN

TYP

MAX UNIT

I_PLL

Operating supply current

PLL frequency

7

mA

MHz

ms

f_PLL

48

f_UPD

t_LOCK

t_Jitter

PLL reference frequency

PLL lock time

1.5

3

2

PLL jitter

1000

ps

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8.8.18 LDO-PWR (LDO Power System)

Section 8.8.18.1 lists the characteristics of the LDP power system.

8.8.18.1 LDO-PWR (LDO Power System)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

LDO input detection threshold

LDO input voltage

TEST CONDITIONS

MIN

TYP

MAX UNIT

V_LAUNCH

V_LDOI

3.75

5.5

V

3.76

V_LDO

LDO output voltage

3.3

±9%

LDOO terminal input voltage with LDO

disabled

V_{LDO_EXT}

I_LDOO

LDO disabled

1.8

60

3.6

V

Maximum external current from LDOO

terminal

LDO is on

20

mA

I_DET

LDO current overload detection ⁽¹⁾

LDOI terminal recommended capacitance

LDOO terminal recommended capacitance

Settling time V_LDO

100

mA

µF

nF

C_LDOI

C_LDOO

t_ENABLE

4.7

220

Within 2%, recommended capacitances

2

ms

(1) A current overload will be detected when the total current supplied from the LDO exceeds this value.

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8.8.19 Flash

Section 8.8.19.1 lists the characteristics of the flash memory.

8.8.19.1 Flash Memory

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

T_J

MIN

TYP

MAX UNIT

DV_{CC(PGM/ERASE)}Program and erase supply voltage

1.8

3.6

5

V

mA

I_PGM

Average supply current from DV_CCduring program

3

6

I_ERASE

Average supply current from DV_CCduring erase

Average supply current from DV_CCduring mass erase or bank erase

Cumulative program time⁽¹⁾

15

16

mA

I_MERASE, I_BANK

t_CPT

mA

ms

Program and erase endurance

10⁴

100

64

10⁵

cycles

years

µs

t_Retention

t_Word

Data retention duration

25°C

Word or byte program time⁽²⁾

85

65

t_{Block, 0}

Block program time for first byte or word⁽²⁾

49

µs

Block program time for each additional byte or word, except for last byte or

word⁽²⁾

t_{Block, 1–(N–1)}

37

49

µs

t_{Block, N}

Block program time for last byte or word⁽²⁾

55

23

73

32

µs

t_{Seg Erase}

Erase time for segment, mass erase, and bank erase when available⁽²⁾

ms

MCLK frequency in marginal read mode

(FCTL4.MGR0 = 1 or FCTL4.MGR1 = 1)

f_MCLK,MGR

0

1

MHz

(1) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming

methods: individual word or byte write and block write modes.

(2) These values are hardwired into the state machine of the flash controller.

8.8.20 Debug and Emulation

Section 8.8.20.1 lists the characteristics of the JTAG and SBW interface.

8.8.20.1 JTAG and Spy-Bi-Wire Interface

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

V_CC

MIN

TYP

MAX UNIT

f_SBW

Spy-Bi-Wire input frequency

2.2 V, 3 V

0

20 MHz

t_SBW,Low

t_{SBW, En}

t_SBW,Rst

Spy-Bi-Wire low clock pulse duration

0.025

15

1

µs

Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge)⁽¹⁾

Spy-Bi-Wire return to normal operation time

15

0

100

5

µs

2.2 V

3 V

MHz

f_TCK

TCK input frequency (4-wire JTAG)⁽²⁾

Internal pulldown resistance on TEST

0

10 MHz

80 kΩ

R_internal

2.2 V, 3 V

45

60

(1) Tools that access the Spy-Bi-Wire interface must wait for the t_SBW,Entime after pulling the TEST/SBWTCK pin high before applying the

first SBWTCK clock edge.

(2) f_TCKmay be restricted to meet the timing requirements of the module selected.

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9 Detailed Description

9.1 Overview

The MSP430FG6626 and MSP430FG6625 are microcontroller configurations with a high-performance 16-bit

ADC, dual 12-bit DACs, dual low-power operational amplifiers, a comparator (COMPB), two USCIs, USB 2.0, a

hardware multiplier (MPY32), DMA, four 16-bit timers, an RTC module with alarm capabilities, an LCD driver,

and up to 73 I/O pins.

The MSP430FG6426 and MSP430FG6425 are microcontroller configurations with a high-performance 16-bit

ADC, dual 12-bit DACs, dual low-power operational amplifiers, a comparator (COMPB), two USCIs, a 3.3-V

LDO, a hardware multiplier (MPY32), DMA, four 16-bit timers, an RTC module with alarm capabilities, an LCD

driver, and up to 73 I/O pins.

9.2 CPU

The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations,

other than program-flow instructions, are performed as register operations in conjunction with seven addressing

modes for source operand and four addressing modes for destination operand.

The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-register

operation execution time is one cycle of the CPU clock. Four of the registers, R0 to R3, are dedicated as

program counter, stack pointer, status register, and constant generator, respectively. The remaining registers are

general-purpose registers (see Figure 9-1).

Peripherals are connected to the CPU using data, address, and control buses. Peripherals can be managed with

all instructions.

Program Counter

PC/R0

SP/R1

SR/CG1/R2

CG2/R3

R4

Stack Pointer

Status Register

Constant Generator

General-Purpose Register

R5

R6

R7

R8

R9

R10

R11

R12

R13

R14

R15

Figure 9-1. Integrated CPU Registers

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9.3 Instruction Set

The instruction set consists of the original 51 instructions with three formats and seven address modes and

additional instructions for the expanded address range. Each instruction can operate on word and byte data.

Table 9-1 lists examples of the three types of instruction formats, and Table 9-2 lists the address modes.

Table 9-1. Instruction Word Formats

INSTRUCTION WORD FORMAT

Dual operands, source and destination

Single operands, destination only

EXAMPLE

ADD R4,R5

CALL R8

JNE

OPERATION

R4 + R5 → R5

PC → (TOS), R8 → PC

Jump-on-equal bit = 0

Relative jump, unconditional or conditional

Table 9-2. Address Mode Descriptions

ADDRESS MODE

Register

S⁽¹⁾

✓

D⁽¹⁾

✓

SYNTAX

EXAMPLE

OPERATION

MOV Rs,Rd

MOV R10,R11

R10 → R11

Indexed

✓

MOV X(Rn),Y(Rm)

MOV EDE,TONI

MOV &MEM, &TCDAT

MOV @Rn,Y(Rm)

MOV 2(R5),6(R6)

M(2+R5) → M(6+R6)

M(EDE) → M(TONI)

M(MEM) → M(TCDAT)

M(R10) → M(Tab+R6)

Symbolic (PC relative)

Absolute

✓

Indirect

✓

MOV @R10,Tab(R6)

MOV @R10+,R11

MOV #45,TONI

M(R10) → R11

R10 + 2 → R10

Indirect auto-increment

Immediate

✓

MOV @Rn+,Rm

MOV #X,TONI

#45 → M(TONI)

(1) S = source, D = destination

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9.4 Operating Modes

The devices have one active mode and seven software-selectable low-power modes of operation. An interrupt

event can wake up the device from any of the low-power modes, service the request, and restore back to the

low-power mode on return from the interrupt program.

Software can configure the following operating modes:

•

Active mode (AM)

– All clocks are active

•

Low-power mode 0 (LPM0)

– CPU is disabled

– ACLK and SMCLK remain active, MCLK is disabled

– FLL loop control remains active

Low-power mode 1 (LPM1)

•

– CPU is disabled

– FLL loop control is disabled

– ACLK and SMCLK remain active, MCLK is disabled

Low-power mode 2 (LPM2)

– CPU is disabled

– MCLK, FLL loop control, and DCOCLK are disabled

– DC generator of the DCO remains enabled

– ACLK remains active

•

Low-power mode 3 (LPM3)

– CPU is disabled

– MCLK, FLL loop control, and DCOCLK are disabled

– DC generator of the DCO is disabled

– ACLK remains active

Low-power mode 4 (LPM4)

– CPU is disabled

– ACLK is disabled

– MCLK, FLL loop control, and DCOCLK are disabled

– DC generator of the DCO is disabled

– Crystal oscillator is stopped

– Complete data retention

•

Low-power mode 3.5 (LPM3.5)

– Internal regulator disabled

– No data retention

– RTC enabled and clocked by low-frequency oscillator

– Wake-up input from RST/NMI, RTC_B, P1, P2, P3, and P4

Low-power mode 4.5 (LPM4.5)

– Internal regulator disabled

– No data retention

– Wake-up input from RST/NMI, P1, P2, P3, and P4

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9.5 Interrupt Vector Addresses

The interrupt vectors and the power-up start address are in the address range 0FFFFh to 0FF80h (see Table

9-3). The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.

Table 9-3. Interrupt Sources, Flags, and Vectors

SYSTEM

INTERRUPT

WORD

ADDRESS

INTERRUPT SOURCE

INTERRUPT FLAG

PRIORITY

System Reset

Power-up, External reset

Watchdog time-out, key violation

Flash memory key violation

WDTIFG, KEYV (SYSRSTIV)^{(1) (3)}

Reset

0FFFEh

0FFFCh

0FFFAh

63, highest

System NMI

PMM

Vacant memory access

JTAG mailbox

SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,

VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,

JMBOUTIFG (SYSSNIV)⁽¹⁾

(Non)maskable

62

61

User NMI

NMI

Oscillator fault

NMIIFG, OFIFG, ACCVIFG, BUSIFG (SYSUNIV)

(1) (3)

Flash memory access violation

Comp_B

Comparator B interrupt flags (CBIV)^{(1) (2)}

TB0CCR0 CCIFG0⁽²⁾

Maskable

0FFF8h

0FFF6h

60

59

Timer TB0

TB0CCR1 CCIFG1 to TB0CCR6 CCIFG6,

TB0IFG (TBIV)^{(1) (2)}

Timer TB0

Maskable

0FFF4h

58

Watchdog interval timer mode

USCI_A0 receive or transmit

USCI_B0 receive or transmit

CTSD16

WDTIFG

Maskable

0FFF2h

0FFF0h

0FFEEh

0FFECh

0FFEAh

57

56

55

54

53

UCA0RXIFG, UCA0TXIFG (UCA0IV)^{(1) (2)}

UCB0RXIFG, UCB0TXIFG (UCB0IV)^{(1) (2)}

CTSD16IFG0, CTSD16OVIFG0^{(1) (2)}

TA0CCR0 CCIFG0⁽²⁾

Timer TA0

TA0CCR1 CCIFG1 to TA0CCR4 CCIFG4,

TA0IFG (TA0IV)^{(1) (2)}

Timer TA0

Maskable

0FFE8h

0FFE6h

52

51

USB_UBM⁽⁵⁾

LDO-PWR ⁽⁶⁾

USB interrupts (USBIV)^{(1) (2)}

LDOOFFIG, LDOONIFG, LDOOVLIFG

DMA0IFG, DMA1IFG, DMA2IFG, DMA3IFG,

DMA4IFG, DMA5IFG (DMAIV)^{(1) (2)}

DMA

Maskable

0FFE4h

0FFE2h

0FFE0h

50

49

48

Timer TA1

TA1CCR0 CCIFG0⁽²⁾

TA1CCR1 CCIFG1 to TA1CCR2 CCIFG2,

TA1IFG (TA1IV)^{(1) (2)}

I/O Port P1

USCI_A1 receive or transmit

USCI_B1 receive or transmit

I/O port P2

P1IFG.0 to P1IFG.7 (P1IV)^{(1) (2)}

UCA1RXIFG, UCA1TXIFG (UCA1IV)^{(1) (2)}

UCB1RXIFG, UCB1TXIFG (UCB1IV)^{(1) (2)}

P2IFG.0 to P2IFG.7 (P2IV)^{(1) (2)}

Maskable

0FFDEh

0FFDCh

0FFDAh

0FFD8h

0FFD6h

47

46

45

44

43

LCD_B

LCD_B Interrupt Flags (LCDBIV)⁽¹⁾

RTCRDYIFG, RTCTEVIFG, RTCAIFG,

RTC_B

Maskable

0FFD4h

42

RT0PSIFG, RT1PSIFG, RTCOFIFG (RTCIV)^{(1) (2)}

DAC12_A

Timer TA2

DAC12_0IFG, DAC12_1IFG^{(1) (2)}

TA2CCR0 CCIFG0⁽²⁾

Maskable

0FFD2h

0FFD0h

41

40

TA2CCR1 CCIFG1 to TA2CCR2 CCIFG2,

TA2IFG (TA2IV)^{(1) (2)}

Timer TA2

Maskable

0FFCEh

39

I/O port P3

I/O port P4

P3IFG.0 to P3IFG.7 (P3IV)^{(1) (2)}

P4IFG.0 to P4IFG.7 (P4IV)^{(1) (2)}

Maskable

0FFCCh

0FFCAh

0FFC8h

⋮

38

37

36

⋮

Reserved

Reserved⁽⁴⁾

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Table 9-3. Interrupt Sources, Flags, and Vectors (continued)

SYSTEM

INTERRUPT

WORD

ADDRESS

INTERRUPT SOURCE

INTERRUPT FLAG

PRIORITY

0FF80h

0, lowest

(1) Multiple source flags

(2) Interrupt flags are in the module.

(3) A reset is generated if the CPU tries to fetch instructions from within peripheral space or vacant memory space.

(Non)maskable: the individual interrupt enable bit can disable an interrupt event, but the general interrupt enable bit cannot disable it.

(4) Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To

maintain compatibility with other devices, TI recommends reserving these locations.

(5) Only on devices with peripheral module USB (MSP430FG6626 and MSP430FG6625)

(6) Only on devices with peripheral module LDO-PWR (MSP430FG6426 and MSP430FG6425)

9.6 USB BSL

The devices MSP430FG6626 and MSP430FG6625 are preprogrammed with the USB BSL. Use of the USB BSL

requires external access to six pins (see Table 9-4). In addition to these pins, the application must support

external components necessary for normal USB operation; for example, the proper crystal on XT2IN and

XT2OUT, proper decoupling, and so on. For additional information, see the MSP430™ Flash Device Bootloader

(BSL) User's Guide.

Table 9-4. USB BSL Pin Requirements and Functions

DEVICE SIGNAL

RST/NMI/SBWTDIO

PU.0/DP

BSL FUNCTION

Entry sequence signal

USB data terminal DP

USB data terminal DM

USB pullup resistor terminal

USB bus power supply

USB ground supply

PU.1/DM

PUR

VBUS

VSSU

Note

The default USB BSL evaluates the logic level of the PUR pin after a BOR reset. If it is pulled high

externally, then the BSL is invoked. Therefore, unless the application is invoking the BSL, it is

important to keep PUR pulled low after a BOR reset, even if BSL or USB is never used. TI

recommends applying a 1-MΩ resistor to ground.

9.7 UART BSL

Devices without a USB module (MSP430FG642x) come preprogrammed with the UART BSL. A UART BSL is

also available for devices with the USB module (MSP430FG662x), and it can be programmed by the user into

the BSL memory by replacing the preprogrammed factory-supplied USB BSL. Use of the UART BSL requires

external access to six pins (see Table 9-5). For additional information, see the MSP430™ Flash Device

Bootloader (BSL) User's Guide.

Table 9-5. UART BSL Pin Requirements and Functions

DEVICE SIGNAL

BSL FUNCTION

Entry sequence signal

Data transmit

RST/NMI/SBWTDIO

TEST/SBWTCK

P1.1

P1.2

VCC

VSS

Data receive

Power supply

Ground supply

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9.8 JTAG Operation

9.8.1 JTAG Standard Interface

The MSP430 family supports the standard JTAG interface, which requires four signals for sending and receiving

data. The JTAG signals are shared with general-purpose I/Os. The TEST/SBWTCK pin is used to enable the

JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430

development tools and device programmers. Table 9-6 lists the JTAG pin requirements. For further details on

interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide. For a

complete description of the features of the JTAG interface and its implementation, see MSP430 Programming

With the JTAG Interface.

Table 9-6. JTAG Pin Requirements and Functions

DEVICE SIGNAL

DIRECTION

FUNCTION

JTAG clock input

JTAG state control

JTAG data input, TCLK input

JTAG data output

Enable JTAG pins

External reset

PJ.3/TCK

IN

PJ.2/TMS

PJ.1/TDI/TCLK

PJ.0/TDO

IN

OUT

IN

TEST/SBWTCK

RST/NMI/SBWTDIO

VCC

IN

Power supply

VSS

Ground supply

9.8.2 Spy-Bi-Wire Interface

In addition to the standard JTAG interface, the MSP430 family supports the two-wire Spy-Bi-Wire interface. Spy-

Bi-Wire can be used to interface with MSP430 development tools and device programmers. Table 9-7 lists the

Spy-Bi-Wire interface pin requirements. For further details on interfacing to development tools and device

programmers, see the MSP430 Hardware Tools User's Guide. For a complete description of the features of the

JTAG interface and its implementation, see MSP430 Programming With the JTAG interface.

Table 9-7. Spy-Bi-Wire Pin Requirements and Functions

DEVICE SIGNAL

TEST/SBWTCK

RST/NMI/SBWTDIO

VCC

DIRECTION

FUNCTION

Spy-Bi-Wire clock input

Spy-Bi-Wire data input/output

Power supply

IN

IN, OUT

VSS

Ground supply

9.9 Flash Memory

The flash memory can be programmed through the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the

CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the

flash memory include:

•

Flash memory has n segments of main memory and four segments of information memory (A to D) of

128 bytes each. Each segment in main memory is 512 bytes in size.

Segments 0 to n may be erased in one step, or each segment may be individually erased.

Segments A to D can be erased individually, or as a group with segments 0 to n. Segments A to D are also

called information memory.

•

Segment A can be locked separately.

9.10 RAM

The RAM is made up of n sectors. Each sector can be completely powered down to save leakage; however, all

data is lost. Features of the RAM include:

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•

RAM has n sectors. The size of a sector can be found in Section 9.15.

Each sector 0 to n can be complete disabled; however, data retention is lost.

Each sector 0 to n automatically enters low-power retention mode when possible.

For devices that contain USB memory, the USB memory can be used as normal RAM if USB is not required.

9.11 Backup RAM

The backup RAM provides a limited number of bytes of RAM that are retained during LPMx.5 and during

operation from a backup supply if the Battery Backup System module is implemented.

There are 8 bytes of backup RAM. It can be word-wise accessed through the control registers BAKMEM0,

BAKMEM1, BAKMEM2, and BAKMEM3.

9.12 Peripherals

Peripherals are connected to the CPU through data, address, and control buses. The peripherals can be

managed using all instructions. For complete module descriptions, see the MSP430F5xx and MSP430F6xx

Family User's Guide.

9.12.1 Digital I/O

Up to nine 8-bit I/O ports are implemented: P1 through P9 are complete except P5.2, and port PJ contains four

individual I/O ports.

•

All individual I/O bits are independently programmable.

Any combination of input, output, and interrupt conditions is possible.

Programmable pullup or pulldown on all ports.

Programmable drive strength on all ports.

Edge-selectable interrupt input capability for all the eight bits of ports P1, P2, P3, and P4.

Read and write access to port-control registers is supported by all instructions.

Ports can be accessed byte-wise (P1 through P9) or word-wise (P1 through P8) in pairs (PA through PD).

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9.12.2 Port Mapping Controller

The port mapping controller allows the flexible and reconfigurable mapping of digital functions to port P2 (see

Table 9-8).

Table 9-8. Port Mapping Mnemonics and Functions

VALUE

PxMAPy MNEMONIC

INPUT PIN FUNCTION

OUTPUT PIN FUNCTION

0

PM_NONE

None

DVSS

Comparator_B output

PM_CBOUT

–

1

2

3

PM_TB0CLK

Timer TB0 clock input

–

Reserved

–

Reserved

PM_DMAE0

DMAE0 Input

–

PM_SVMOUT

PM_TB0OUTH

PM_TB0CCR0B

PM_TB0CCR1B

PM_TB0CCR2B

PM_TB0CCR3B

PM_TB0CCR4B

PM_TB0CCR5B

PM_TB0CCR6B

PM_UCA0RXD

PM_UCA0SOMI

PM_UCA0TXD

PM_UCA0SIMO

PM_UCA0CLK

PM_UCB0STE

PM_UCB0SOMI

PM_UCB0SCL

PM_UCB0SIMO

PM_UCB0SDA

PM_UCB0CLK

PM_UCA0STE

PM_MCLK

–

SVM output

Timer TB0 high impedance input TB0OUTH

Timer TB0 CCR0 capture input CCI0B

Timer TB0 CCR1 capture input CCI1B

Timer TB0 CCR2 capture input CCI2B

Timer TB0 CCR3 capture input CCI3B

Timer TB0 CCR4 capture input CCI4B

Timer TB0 CCR5 capture input CCI5B

Timer TB0 CCR6 capture input CCI6B

–

4

5

Timer TB0: TB0.0 compare output Out0

Timer TB0: TB0.1 compare output Out1

Timer TB0: TB0.2 compare output Out2

Timer TB0: TB0.3 compare output Out3

Timer TB0: TB0.4 compare output Out4

Timer TB0: TB0.5 compare output Out5

Timer TB0: TB0.6 compare output Out6

6

7

8

9

10

USCI_A0 UART RXD (Direction controlled by USCI – input)

11

12

13

14

15

16

USCI_A0 SPI slave out master in (direction controlled by USCI)

USCI_A0 UART TXD (Direction controlled by USCI – output)

USCI_A0 SPI slave in master out (direction controlled by USCI)

USCI_A0 clock input/output (direction controlled by USCI)

USCI_B0 SPI slave transmit enable (direction controlled by USCI – input)

USCI_B0 SPI slave out master in (direction controlled by USCI)

USCI_B0 I²C clock (open drain and direction controlled by USCI)

USCI_B0 SPI slave in master out (direction controlled by USCI)

USCI_B0 I²C data (open drain and direction controlled by USCI)

USCI_B0 clock input/output (direction controlled by USCI)

USCI_A0 SPI slave transmit enable (direction controlled by USCI – input)

17

–

MCLK

DVSS

18-30

Reserved

None

Disables the output driver and the input Schmitt-trigger to prevent parasitic cross currents when

applying analog signals.

31 (0FFh)⁽¹⁾

PM_ANALOG

(1) The value of the PM_ANALOG mnemonic is set to 0FFh. The port mapping registers are 5 bits wide, and the upper bits are ignored,

which results in a read value of 31.

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Table 9-9 lists the default settings for all pins that support port mapping.

Table 9-9. Default Mapping

PxMAPy

MNEMONIC

INPUT PIN FUNCTION

OUTPUT PIN FUNCTION

PM_UCB0STE,

PM_UCA0CLK

USCI_B0 SPI slave transmit enable (direction controlled by USCI – input),

USCI_A0 clock input/output (direction controlled by USCI)

P2.0/P2MAP0

P2.1/P2MAP1

P2.2/P2MAP2

P2.3/P2MAP3

P2.4/P2MAP4

P2.5/P2MAP5/R23

PM_UCB0SIMO,

PM_UCB0SDA

USCI_B0 SPI slave in master out (direction controlled by USCI),

USCI_B0 I²C data (open drain and direction controlled by USCI)

PM_UCB0SOMI,

PM_UCB0SCL

USCI_B0 SPI slave out master in (direction controlled by USCI),

USCI_B0 I²C clock (open drain and direction controlled by USCI)

PM_UCB0CLK,

PM_UCA0STE

USCI_B0 clock input/output (direction controlled by USCI),

USCI_A0 SPI slave transmit enable (direction controlled by USCI – input)

PM_UCA0TXD,

PM_UCA0SIMO

USCI_A0 UART TXD (direction controlled by USCI – output),

USCI_A0 SPI slave in master out (direction controlled by USCI)

PM_UCA0RXD,

PM_UCA0SOMI

USCI_A0 UART RXD (direction controlled by USCI – input),

USCI_A0 SPI slave out master in (direction controlled by USCI)

P2.6/P2MAP6/R03

PM_NONE

-

DVSS

P2.7/P2MAP7/LCDREF/R13

9.12.3 Oscillator and System Clock

The clock system in the MSP430FG662x and MSP430FG642x devices are supported by the Unified Clock

System (UCS) module that includes support for a 32-kHz watch crystal oscillator (in XT1 LF mode; XT1 HF

mode is not supported), an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-

frequency oscillator (REFO), an integrated internal digitally controlled oscillator (DCO), and a high-frequency

crystal oscillator XT2. The UCS module is designed to meet the requirements of both low system cost and low

power consumption. The UCS module features digital frequency locked loop (FLL) hardware that, in conjunction

with a digital modulator, stabilizes the DCO frequency to a programmable multiple of the watch crystal frequency.

The internal DCO provides a fast turnon clock source and stabilizes in 3 µs (typical). The UCS module provides

the following clock signals:

•

Auxiliary clock (ACLK), sourced from a 32-kHz watch crystal (XT1), a high-frequency crystal (XT2), the

internal low-frequency oscillator (VLO), the trimmed low-frequency oscillator (REFO), or the internal digitally-

controlled oscillator (DCO).

•

Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources available to

ACLK.

Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by

same sources available to ACLK.

ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.

9.12.4 Power Management Module (PMM)

The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains

programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor

(SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit

provides the proper internal reset signal to the device during power on and power off. The SVS and SVM

circuitry detect if the supply voltage drops below a user-selectable level and supports both supply voltage

supervision (the device is automatically reset) and supply voltage monitoring (the device is not automatically

reset). SVS and SVM circuitry is available on the primary supply and the core supply.

9.12.5 Hardware Multiplier (MPY32)

The multiplication operation is supported by a dedicated peripheral module. The module performs operations

with 32-, 24-, 16-, and 8-bit operands. The module supports signed and unsigned multiplication as well as signed

and unsigned multiply-and-accumulate operations.

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9.12.6 Real-Time Clock (RTC_B)

The RTC_B module can be configured for real-time clock (RTC) or calendar mode providing seconds, minutes,

hours, day of week, day of month, month, and year. Calendar mode integrates an internal calendar which

compensates for months with less than 31 days and includes leap year correction. The RTC_B also supports

flexible alarm functions and offset-calibration hardware. The implementation on this device supports operation in

LPM3.5 mode and operation from a backup supply.

9.12.7 Watchdog Timer (WDT_A)

The primary function of the WDT_A module is to perform a controlled system restart after a software problem

occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed

in an application, the module can be configured as an interval timer and can generate interrupts at selected time

intervals.

9.12.8 System Module (SYS)

The SYS module handles many of the system functions within the device. These include power-on reset and

power-up clear handling, NMI source selection and management, reset interrupt vector generators, bootloader

entry mechanisms, and configuration management (device descriptors). SYS also includes a data exchange

mechanism through JTAG called a JTAG mailbox that can be used in the application. Table 9-10 lists the SYS

module interrupt vector registers.

Table 9-10. System Module Interrupt Vector Registers

INTERRUPT VECTOR REGISTER

INTERRUPT EVENT

No interrupt pending

Brownout (BOR)

RST/NMI (BOR)

PMMSWBOR (BOR)

LPM3.5 or LPM4.5 wake up (BOR)

Security violation (BOR)

SVSL (POR)

WORD ADDRESS

OFFSET

00h

PRIORITY

02h

Highest

04h

06h

08h

0Ah

0Ch

0Eh

10h

SVSH (POR)

SVML_OVP (POR)

SVMH_OVP (POR)

PMMSWPOR (POR)

WDT time-out (PUC)

WDT key violation (PUC)

KEYV flash key violation (PUC)

Reserved

SYSRSTIV, System Reset

019Eh

12h

14h

16h

18h

1Ah

1Ch

1Eh

20h

Peripheral area fetch (PUC)

PMM key violation (PUC)

Reserved

22h to 3Eh

00h

Lowest

Highest

No interrupt pending

SVMLIFG

02h

SVMHIFG

04h

DLYLIFG

06h

SYSSNIV, System NMI

DLYHIFG

019Ch

08h

VMAIFG

0Ah

0Ch

0Eh

10h

JMBINIFG

JMBOUTIFG

SVMLVLRIFG

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Table 9-10. System Module Interrupt Vector Registers (continued)

INTERRUPT VECTOR REGISTER

INTERRUPT EVENT

SVMHVLRIFG

Reserved

WORD ADDRESS

OFFSET

PRIORITY

Lowest

12h

14h to 1Eh

00h

No interrupt pending

NMIFG

02h

Highest

OFIFG

04h

SYSUNIV, User NMI

019Ah

0198h

ACCVIFG

06h

BUSIFG

08h

Reserved

0Ah to 1Eh

00h

Lowest

No interrupt pending

USB wait state time-out

Reserved

SYSBERRIV, Bus Error

02h

Highest

Lowest

04h to 1Eh

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9.12.9 DMA Controller

The DMA controller allows movement of data from one memory address to another without CPU intervention.

For example, the DMA controller can be used to move data from the ADC conversion memory to RAM. Using

the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system

power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or

from a peripheral.

The USB timestamp generator also uses the channel 0, 1, and 2 DMA trigger assignments (see Table 9-11). The

USB timestamp generator is available only on devices with the USB module (MSP430FG662x).

Table 9-11. DMA Trigger Assignments

CHANNEL

TRIGGER⁽¹⁾

0

1

2

3

4

5

0

DMAREQ

1

TA0CCR0 CCIFG

TA0CCR2 CCIFG

TA1CCR0 CCIFG

TA1CCR2 CCIFG

TA2CCR0 CCIFG

TA2CCR2 CCIFG

TBCCR0 CCIFG

TBCCR2 CCIFG

Reserved

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Reserved

UCA0RXIFG

UCA0TXIFG

UCB0RXIFG

UCB0TXIFG

UCA1RXIFG

UCA1TXIFG

UCB1RXIFG

UCB1TXIFG

CTSD16IFG0

DAC12_0IFG

DAC12_1IFG

USB FNRXD⁽²⁾

USB ready⁽²⁾

MPY ready

DMA5IFG

DMA0IFG

DMA1IFG

DMA2IFG

DMAE0

DMA3IFG

DMA4IFG

(1) Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers do not cause any DMA trigger event when

selected.

(2) Only on devices with peripheral module USB (MSP430FG662x), otherwise reserved (MSP430FG642x).

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9.12.10 Universal Serial Communication Interface (USCI)

The USCI modules are used for serial data communication. The USCI module supports synchronous

communication protocols such as SPI (3- or 4-pin) and I²C, and asynchronous communication protocols such as

UART, enhanced UART with automatic baudrate detection, and IrDA. Each USCI module contains two portions,

A and B.

The USCI_An module provides support for SPI (3- or 4-pin), UART, enhanced UART, or IrDA.

The USCI_Bn module provides support for SPI (3- or 4-pin) or I²C.

The MSP430FG662x and MSP430FG642x include two complete USCI modules (n = 0 to 1).

9.12.11 Timer TA0

Timer TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. TA0 supports multiple

capture/compares, PWM outputs, and interval timing (see Table 9-12). It also has extensive interrupt capabilities.

Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare

registers.

Table 9-12. Timer TA0 Signal Connections

INPUT PIN NUMBER

DEVICE

INPUT

SIGNAL

MODULE

INPUT

SIGNAL

MODULE

OUTPUT

SIGNAL

DEVICE

OUTPUT

SIGNAL

OUTPUT PIN NUMBER

MODULE

BLOCK

PZ

ZCA, ZQW

PZ

ZCA, ZQW

34-P1.0

L5-P1.0

TA0CLK

ACLK

SMCLK

TA0CLK

TA0.0

DV_SS

TACLK

ACLK

SMCLK

TACLK

CCI0A

CCI0B

GND

Timer

CCR0

CCR1

CCR2

CCR3

CCR4

NA

TA0

TA1

TA2

TA3

TA4

NA

34-P1.0

35-P1.1

L5-P1.0

M5-P1.1

35-P1.1

M5-P1.1

TA0.0

TA0.1

TA0.2

TA0.3

TA0.4

DV_SS

DV_CC

TA0.1

DV_SS

V_CC

36-P1.2

40-P1.6

J6-P1.2

J7-P1.6

CCI1A

CCI1B

GND

36-P1.2

40-P1.6

J6-P1.2

J7-P1.6

DV_CC

TA0.2

DV_SS

V_CC

37-P1.3

41-P1.7

H6-P1.3

M7-P1.7

CCI2A

CCI2B

GND

37-P1.3

41-P1.7

H6-P1.3

M7-P1.7

DV_CC

TA0.3

DV_SS

V_CC

38-P1.4

39-P1.5

M6-P1.4

L6-P1.5

CCI3A

CCI3B

GND

38-P1.4

39-P1.5

M6-P1.4

L6-P1.5

DV_SS

DV_CC

TA0.4

DV_SS

V_CC

CCI4A

CCI4B

GND

DV_SS

DV_CC

V_CC

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9.12.12 Timer TA1

Timer TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA1 supports multiple

capture/compares, PWM outputs, and interval timing (see Table 9-13). It also has extensive interrupt capabilities.

Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare

registers.

Table 9-13. Timer TA1 Signal Connections

INPUT PIN NUMBER

DEVICE

INPUT

SIGNAL

MODULE

INPUT

SIGNAL

MODULE

OUTPUT

SIGNAL

DEVICE

OUTPUT

SIGNAL

OUTPUT PIN NUMBER

MODULE

BLOCK

PZ

ZCA, ZQW

PZ

ZCA, ZQW

42-P3.0

L7-P3.0

TA1CLK

ACLK

TACLK

ACLK

SMCLK

TACLK

CCI0A

CCI0B

GND

Timer

CCR0

NA

SMCLK

TA1CLK

TA1.0

42-P3.0

43-P3.1

L7-P3.0

H7-P3.1

43-P3.1

44-P3.2

H7-P3.1

M8-P3.2

DV_SS

TA0

TA1.0

DV_SS

DV_CC

V_CC

44-P3.2

45-P3.3

M8-P3.2

L8-P3.3

TA1.1

CCI1A

DAC12_A

DAC12_0, DAC12_1

(internal)

CBOUT

(internal)

CCI1B

CCR1

CCR2

TA1

TA2

TA1.1

TA1.2

DV_SS

DV_CC

TA1.2

GND

V_CC

CCI2A

45-P3.3

L8-P3.3

ACLK

(internal)

CCI2B

DV_SS

DV_CC

GND

V_CC

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9.12.13 Timer TA2

Timer TA2 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA2 supports multiple

capture/compares, PWM outputs, and interval timing (see Table 9-14). It also has extensive interrupt capabilities.

Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare

registers.

Table 9-14. Timer TA2 Signal Connections

INPUT PIN NUMBER

DEVICE

INPUT

SIGNAL

MODULE

INPUT

SIGNAL

MODULE

OUTPUT

SIGNAL

DEVICE

OUTPUT

SIGNAL

OUTPUT PIN NUMBER

MODULE

BLOCK

PZ

ZCA, ZQW

PZ

ZCA, ZQW

46-P3.4

J8-P3.4

TA2CLK

ACLK

TACLK

ACLK

SMCLK

TACLK

CCI0A

CCI0B

GND

Timer

CCR0

NA

SMCLK

TA2CLK

TA2.0

46-P3.4

47-P3.5

J8-P3.4

M9-P3.5

47-P3.5

48-P3.6

M9-P3.5

L9-P3.6

DV_SS

TA0

TA2.0

DV_SS

DV_CC

V_CC

48-P3.6

49-P3.7

L9-P3.6

TA2.1

CCI1A

CBOUT

(internal)

CCI1B

CCR1

CCR2

TA1

TA2

TA2.1

TA2.2

DV_SS

DV_CC

TA2.2

GND

V_CC

M10-P3.7

CCI2A

49-P3.7

M10-P3.7

ACLK

(internal)

CCI2B

DV_SS

DV_CC

GND

V_CC

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9.12.14 Timer TB0

Timer TB0 is a 16-bit timer/counter (Timer_B type) with seven capture/compare registers. TB0 supports multiple

capture/compares, PWM outputs, and interval timing (see Table 9-15). It also has extensive interrupt capabilities.

Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare

registers.

Table 9-15. Timer TB0 Signal Connections

INPUT PIN NUMBER

DEVICE

INPUT

SIGNAL

MODULE

INPUT

SIGNAL

MODULE

OUTPUT

SIGNAL

DEVICE

OUTPUT

SIGNAL

OUTPUT PIN NUMBER

MODULE

BLOCK

PZ

ZCA, ZQW

PZ

ZCA, ZQW

58-P8.0

J11-P8.0

TB0CLK

P2MAPx⁽¹⁾

ACLK

Timer

NA

SMCLK

58-P8.0

J11-P8.0

TB0CLK

P2MAPx⁽¹⁾

50-P4.0

J9-P4.0

TB0.0

DV_SS

DV_CC

TB0.1

DV_SS

DV_CC

TB0.2

CCI0A

CCI0B

GND

50-P4.0

J9-P4.0

P2MAPx⁽¹⁾

CCR0

CCR1

TB0

TB1

TB0.0

TB0.1

V_CC

51-P4.1

M11-P4.1

CCI1A

CCI1B

GND

51-P4.1

M11-P4.1

P2MAPx⁽¹⁾

V_CC

52-P4.2

L10-P4.2

CCI2A

CCI2B

52-P4.2

L10-P4.2

P2MAPx⁽¹⁾

DAC12_A

DAC12_0, DAC12_1

(internal)

CCR2

TB2

TB0.2

DV_SS

GND

DV_CC

TB0.3

DV_SS

DV_CC

TB0.4

DV_SS

DV_CC

TB0.5

DV_SS

DV_CC

TB0.6

DV_SS

DV_CC

V_CC

CCI3A

CCI3B

GND

53-P4.3

M12-P4.3

53-P4.3

M12-P4.3

P2MAPx⁽¹⁾

CCR3

CCR4

CCR5

CCR6

TB3

TB4

TB5

TB6

TB0.3

TB0.4

TB0.5

TB0.6

V_CC

54-P4.4

L12-P4.4

CCI4A

CCI4B

GND

54-P4.4

L12-P4.4

P2MAPx⁽¹⁾

V_CC

55-P4.5

L11-P4.5

CCI5A

CCI5B

GND

55-P4.5

L11-P4.5

P2MAPx⁽¹⁾

V_CC

56-P4.6

K11-P4.6

CCI6A

CCI6B

GND

56-P4.6

K11-P4.6

P2MAPx⁽¹⁾

V_CC

(1) Timer functions are selectable by the port mapping controller.

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9.12.15 Comparator_B

The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,

battery voltage supervision, and monitoring of external analog signals.

9.12.16 Signal Chain

All devices include all the building blocks to construct a complete signal chain. These blocks include two digital-

to-analog converter (DAC) channels, two integrated operational amplifiers (OAs), a sigma-delta analog-to-digital

converter (CTSD16), and low-ohmic switches (GSW). Figure 9-2 shows the various signal chain blocks and their

interconnections in the overall system.

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NR

Device Boundary

P5.0/VREFBG/VeREF+

CTSD16

P6.0/CB0/A0

P6.1/CB1/A1

P6.2/CB2/A2/OA0IP0

P6.3/CB3/A3/OA1IP0

P5.1/A4/DAC0

A0

A1

A2

A3

A4

A5

P5.6/A5/DAC1

Temp

Sense

REFON

A6

A7

A8

+

OR

CTSD16REFS AND CTD16SC

AVCC

Sense

BUF

Request to

shared reference

-

VBAT

Sense

Bandgap voltage

from shared reference

~1.16 V nominal

+

-

+

AD0+

AD0-

Delta

Sigma

PGA

+

AD1+

AD1-

-

BUF

-

AD2+

AD2-

AD3+

AD3-

V_REFBG/V_eREF+

AD4+

AD4-

AD4+

AD4-

DAC0

V_REFBG/V_eREF+

P6.2/CB2/A2/OA0IP0

OA0

PSW

4

DAC12_A

PSW0

PSW1

PSW2

PSW3

DAC12_0

12 bit

DAC12AMP>0 & !DAC12OPS

OAM

DAC12AMP>0 & DAC12OPS

+

NSW

P6.4/CB4/AD0+/OA0O

5

NSW0

P2.0/P2MAP0/DAC0

-

NSW1

NSW2

NSW3

NSW4

P5.1/A4/DAC0

P5.6/A5/DAC1

P6.5/CB5/AD0-/OA0IN0

P6.6/CB6/AD1+/G0SW0

P6.7/CB7/AD1-/G0SW1

GSW0

GSW1

PSW

OA1

4

PSW0

DAC12_1

12 bit

PSW1

PSW2

PSW3

DAC12AMP>0 & !DAC12OPS

OAM

DAC12AMP>0 & DAC12OPS

+

NSW

P7.4/CB8/AD2+/OA1O

5

NSW0

P2.1/P2MAP1/DAC1

P6.3/CB3/A3/OA1IP0

-

NSW1

NSW2

NSW3

NSW4

P7.5/CB9/AD2-/OA1IN0

P7.6/CB10/AD3+/G1SW0

P7.7/CB11/AD3-/G1SW1

GSW0

GSW1

Device Boundary

A. See the MSP430F5xx and MSP430F6xx Family User's Guide for additional module details.

Figure 9-2. Signal Chain

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9.12.16.1 CTSD16

The CTSD16 module integrates a single sigma-delta ADC with ten external inputs and four internal inputs. The

converter is designed with a fully differential analog input pair and a programmable gain amplifier input stage.

The converter is based on second-order over-sampling sigma-delta modulators and digital decimation filters. The

decimation filters are comb type filters with selectable oversampling ratios of up to 256.

The CTSD16 is proceeded by an analog multiplexer which is used for channel selection, followed by a unity gain

buffer stage useful when sampling high impedance sensors.

The CTSD16 can use as its reference the internal bandgap voltage from the REF module or an external

reference at the VeREF+ pin.

9.12.16.2 DAC12_A

The DAC12_A module is a 12-bit R-ladder voltage-output DAC. The DAC12_A can be used in 8-bit or 12-bit

mode, and can be used in conjunction with the DMA controller. When multiple DAC12_A modules are present,

they may be grouped together for synchronous operation. Two complete channels are available, DAC12_0 and

DAC12_1.

9.12.16.3 Operational Amplifiers (OA)

The device integrates two low-power operational amplifiers. The operational amplifiers can perform signal

conditioning of low-level analog signals before conversion by the ADC. Each operational amplifier can be

individually controlled by software.

9.12.16.4 Ground Switches (GSW)

The device integrates four low-ohmic switches to ground that are individually controllable in software. These can

switch in and out various components in the measurement system.

9.12.17 REF Voltage Reference

The reference module (REF) generates all of the critical reference voltages that can be used by the various

analog peripherals in the device.

9.12.18 CRC16

The CRC16 module produces a signature based on a sequence of entered data values and can be used for data

checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.

9.12.19 LCD_B

The LCD_B driver generates the segment and common signals that are required to drive a liquid crystal display

(LCD). The LCD_B controller has dedicated data memories to hold segment drive information. Common and

segment signals are generated as defined by the mode. Static, 2-mux, 3-mux, and 4-mux LCDs are supported.

The module can provide a LCD voltage independent of the supply voltage with its integrated charge pump. It is

possible to control the level of the LCD voltage, and thus contrast, by software. The module also provides an

automatic blinking capability for individual segments.

9.12.20 USB Universal Serial Bus

The USB module is a fully integrated USB interface that is compliant with the USB 2.0 specification. The module

supports full-speed operation of control, interrupt, and bulk transfers. The module includes an integrated LDO,

PHY, and PLL. The PLL is highly flexible and can support a wide range of input clock frequencies. USB RAM,

when not used for USB communication, can be used by the system.

The USB module is only available on the MSP430FG662x devices.

9.12.21 LDO and PU Port

The integrated 3.3-V power system incorporates an integrated 3.3-V LDO regulator that allows the entire

MSP430 microcontroller to be powered from nominal 5-V LDOI when it is made available for the system.

Alternatively, the power system can supply power only to other components within the system, or it can be

unused altogether.

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The Port U pins (PU.0 and PU.1) function as general-purpose high-current I/O pins. These pins must be

configured together as either both inputs or both outputs. Port U is supplied by the LDOO rail. If the 3.3-V LDO is

not used in the system (disabled), the LDOO pin can be supplied externally.

The LDO-PWR module (LDO and PU port) is available only on the MSP430FG6426 and MSP430FG6425

devices.

9.12.22 Embedded Emulation Module (EEM) (L Version)

The EEM supports real-time in-system debugging. The L version of the EEM has the following features:

•

Eight hardware triggers or breakpoints on memory access.

Two hardware triggers or breakpoints on CPU register write access.

Up to ten hardware triggers can be combined to form complex triggers or breakpoints.

Two cycle counters

Sequencer

State storage

Clock control on module level

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9.13 Input/Output Diagrams

9.13.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger

Figure 9-3 shows the port diagram. Table 9-16 summarizes the selection of the port function.

Pad Logic

S32...S39

LCDS32...LCDS39

P1REN.x

DV_SS

DV_CC

0

1

P1DIR.x

0

1

Direction

0: Input

1: Output

P1OUT.x

0

1

Module X OUT

P1.0/TA0CLK/ACLK/S39

P1.1/TA0.0/S38

P1.2/TA0.1/S37

P1.3/TA0.2/S36

P1.4/TA0.3/S35

P1.5/TA0.4/S34

P1.6/TA0.1/S33

P1.7/TA0.2/S32

P1DS.x

0: Low drive

1: High drive

P1SEL.x

P1IN.x

Bus

Keeper

EN

D

Module X IN

P1IRQ.x

P1IE.x

EN

Q

P1IFG.x

Set

P1SEL.x

P1IES.x

Interrupt

Edge

Select

Figure 9-3. Port P1 (P1.0 to P1.7) Diagram

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Table 9-16. Port P1 (P1.0 to P1.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P1.x)

x

FUNCTION

LCDS32 to

LCDS39

P1DIR.x

P1SEL.x

P1.0 (I/O)

Timer TA0.TA0CLK

ACLK

I: 0; O: 1

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

P1.0/TA0CLK/ACLK/S39

P1.1/TA0.0/S38

P1.2/TA0.1/S37

P1.3/TA0.2/S36

P1.4/TA0.3/S35

P1.5/TA0.4/S34

P1.6/TA0.1/S33

0

1

S39

X

P1.1 (I/O)

I: 0; O: 1

Timer TA0.CCI0A capture input

Timer TA0.0 output

S38

0

1

2

3

4

5

6

7

1

X

P1.2 (I/O)

I: 0; O: 1

Timer TA0.CCI1A capture input

Timer TA0.1 output

S37

0

1

X

P1.3 (I/O)

I: 0; O: 1

Timer TA0.CCI2A capture input

Timer TA0.2 output

S36

0

1

X

P1.4 (I/O)

I: 0; O: 1

Timer TA0.CCI3A capture input

Timer TA0.3 output

S35

0

1

X

P1.5 (I/O)

I: 0; O: 1

Timer TA0.CCI4A capture input

Timer TA0.4 output

S34

0

1

X

P1.6 (I/O)

I: 0; O: 1

Timer TA0.CCI1B capture input

Timer TA0.1 output

S33

0

1

X

P1.7 (I/O)

I: 0; O: 1

Timer TA0.CCI2B capture input

Timer TA0.2 output

S32

0

1

X

P1.7/TA0.2/S32

(1) X= don't care

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9.13.2 Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger

Figure 9-4 shows the port diagram. Table 9-17 summarizes the selection of the port function.

0

Pad Logic

Dvss

1

2

0 if DAC12AMPx=0

1 if DAC12AMPx=1

2 if DAC12AMPx>1

From DAC12_A

to LCD_B

from LCD_B

P2REN.x

DV_SS

DV_CC

0

1

P2DIR.x

P2OUT.x

0

1

Direction

0: Input

1: Output

0

1

From Port Mapping

DAC12AMPx>0

P2.0/P2MAP0/DAC0

DAC12OPS

P2DS.x

0: Low drive

1: High drive

P2.1/P2MAP1/DAC1

P2.2/P2MAP2

P2.3/P2MAP3

P2.4/P2MAP4/R03

P2.5/P2MAP5

P2SEL.x

P2IN.x

P2.6/P2MAP6/LCDREF/R13

P2.7/P2MAP7/R23

From Port Mapping

EN

D

To Port Mapping

P2IRQ.x

P2IE.x

EN

Q

P2IFG.x

Set

P2SEL.x

P2IES.x

Interrupt

Edge

Select

Figure 9-4. Port P2 (P2.0 to P2.7) Diagram

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Table 9-17. Port P2 (P2.0 to P2.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P2.x)

x

FUNCTION

P2DIR.x

P2SEL.x

P2MAPx

DAC12OPS

DAC12AMPx

P2.0 (I/O)

I: 0; O: 1

0

1

X

0

Mapped secondary digital

function

P2.0/P2MAP0/DAC0

P2.1/P2MAP1/DAC1

0

X

≤ 19

= 31

0

DAC0

X

0

1

>1

0

P2.1 (I/O)

I: 0; O: 1

X

Mapped secondary digital

function

1

X

1

≤ 19

= 31

X

0

DAC1

X

0

1

>1

0

P2.2 (I/O)

I: 0; O: 1

X

P2.2/P2MAP2

P2.3/P2MAP3

2

3

Mapped secondary digital

function

X

I: 0; O: 1

X

1

0

1

0

1

≤ 19

X

0

P2.3 (I/O)

Mapped secondary digital

function

P2.4 (I/O)

I: 0; O: 1

X

Mapped secondary digital

function

P2.4/P2MAP4/R03

P2.5/P2MAP5

4

5

6

≤ 19

= 31

R03

X

1

0

X

0

P2.5 (I/O

I: 0; O: 1

Mapped secondary digital

function

X

I: 0; O: 1

X

1

0

1

≤ 19

X

0

P2.6 (I/O)

Mapped secondary digital

function

P2.6/P2MAP6/LCDREF/R13

≤ 19

= 31

LCDREF/R13

P2.7 (I/O)

X

1

0

X

0

I: 0; O: 1

Mapped secondary digital

function

P2.7/P2MAP7/R23

7

X

1

≤ 19

= 31

X

0

R23

(1) X= Don't care

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9.13.3 Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger

Figure 9-5 shows the port diagram. Table 9-18 summarizes the selection of the port function.

Pad Logic

S24...S31

LCDS24...LCDS31

P3REN.x

DV_SS

DV_CC

0

1

P3DIR.x

0

1

Direction

0: Input

1: Output

P3OUT.x

0

1

Module X OUT

P3.0/TA1CLK/CBOUT/S31

P3.1/TA1.0/S30

P3.2/TA1.1/S29

P3DS.x

0: Low drive

1: High drive

P3SEL.x

P3IN.x

P3.3/TA1.2/S28

P3.4/TA2CLK/SMCLK/S27

P3.5/TA2.0/S26

P3.6/TA2.1/S25

Bus

Keeper

EN

D

P3.7/TA2.2/S24

Module X IN

P3IRQ.x

P3IE.x

EN

Q

P3IFG.x

Set

P3SEL.x

P3IES.x

Interrupt

Edge

Select

Figure 9-5. Port P3 (P3.0 to P3.7) Diagram

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Table 9-18. Port P3 (P3.0 to P3.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P3.x)

x

FUNCTION

LCDS24 to

LCDS31

P3DIR.x

P3SEL.x

P3.0 (I/O)

Timer TA1.TA1CLK

CBOUT

I: 0; O: 1

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

P3.0/TA1CLK/CBOUT/S31

P3.1/TA1.0/S30

0

1

S31

X

P3.1 (I/O)

I: 0; O: 1

Timer TA1.CCI0A capture input

0

1

2

3

4

5

6

7

Timer TA1.0 output

1

S30

X

P3.2 (I/O)

I: 0; O: 1

Timer TA1.CCI1A capture input

0

P3.2/TA1.1/S29

Timer TA1.1 output

1

S29

X

P3.3 (I/O)

I: 0; O: 1

Timer TA1.CCI2A capture input

0

P3.3/TA1.2/S28

Timer TA1.2 output

1

S28

X

P3.4 (I/O)

I: 0; O: 1

Timer TA2.TA2CLK

0

P3.4/TA2CLK/SMCLK/S27

P3.5/TA2.0/S26

SMCLK

1

S27

X

P3.5 (I/O)

I: 0; O: 1

Timer TA2.CCI0A capture input

Timer TA2.0 output

S26

0

1

X

P3.6 (I/O)

I: 0; O: 1

Timer TA2.CCI1A capture input

Timer TA2.1 output

S25

0

P3.6/TA2.1/S25

1

X

P3.7 (I/O)

I: 0; O: 1

Timer TA2.CCI2A capture input

Timer TA2.2 output

S24

0

1

X

P3.7/TA2.2/S24

(1) X= don't care

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9.13.4 Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger

Figure 9-6 shows the port diagram. Table 9-19 summarizes the selection of the port function.

Pad Logic

S16...S23

LCDS16...LCDS23

P4REN.x

DV_SS

DV_CC

0

1

P4DIR.x

0

1

Direction

0: Input

1: Output

P4OUT.x

0

1

Module X OUT

P4.0/TB0.0/S23

P4.1/TB0.1/S22

P4.2/TB0.2/S21

P4.3/TB0.3/S20

P4.4/TB0.4/S19

P4.5/TB0.5/S18

P4.6/TB0.6/S17

P4DS.x

0: Low drive

1: High drive

P4SEL.x

P4IN.x

Bus

Keeper

EN

D

P4.7/TB0OUTH/SVMOUT/S16

Module X IN

P4IRQ.x

P4IE.x

EN

Q

P4IFG.x

Set

P4SEL.x

P4IES.x

Interrupt

Edge

Select

Figure 9-6. Port P4 (P4.0 to P4.7) Diagram

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Table 9-19. Port P4 (P4.0 to P4.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P4.x)

x

FUNCTION

LCDS16 to

LCDS23

P4DIR.x

P4SEL.x

P4.0 (I/O)

I: 0; O: 1

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

Timer TB0.CCI0A capture input

Timer TB0.0 output⁽²⁾

S23

0

P4.0/TB0.0/S23

P4.1/TB0.1/S22

P4.2/TB0.2/S21

P4.3/TB0.3/S20

P4.4/TB0.4/S19

P4.5/TB0.5/S18

P4.6/TB0.6/S17

0

1

X

P4.1 (I/O)

I: 0; O: 1

Timer TB0.CCI1A capture input

Timer TB0.1 output⁽²⁾

S22

0

1

2

3

4

5

6

7

1

X

P4.2 (I/O)

I: 0; O: 1

Timer TB0.CCI2A capture input

Timer TB0.2 output⁽²⁾

S21

0

1

X

P4.3 (I/O)

I: 0; O: 1

Timer TB0.CCI3A capture input

Timer TB0.3 output⁽²⁾

S20

0

1

X

P4.4 (I/O)

I: 0; O: 1

Timer TB0.CCI4A capture input

Timer TB0.4 output⁽²⁾

S19

0

1

X

P4.5 (I/O)

I: 0; O: 1

Timer TB0.CCI5A capture input

Timer TB0.5 output⁽²⁾

S18

0

1

X

P4.6 (I/O)

I: 0; O: 1

Timer TB0.CCI6A capture input

Timer TB0.6 output⁽²⁾

S17

0

1

X

P4.7 (I/O)

I: 0; O: 1

Timer TB0.TB0OUTH

SVMOUT

0

1

X

P4.7/TB0OUTH/ SVMOUT/S16

(1) X= don't care

S16

(2) Setting TB0OUTH causes all Timer_B configured outputs to be set to high impedance.

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9.13.5 Port P5 (P5.0) Input/Output With Schmitt Trigger

Figure 9-7 shows the port diagram. Table 9-20 summarizes the selection of the port function.

Pad Logic

To/From

Reference

P5REN.x

DV_SS

DV_CC

0

1

P5DIR.x

0

1

P5OUT.x

0

1

Module X OUT

P5.0/VREFBG/VeREF+

P5DS.x

0: Low drive

1: High drive

P5SEL.x

P5IN.x

Bus

Keeper

EN

D

Module X IN

Figure 9-7. Port P5 (P5.0) Diagram

Table 9-20. Port P5 (P5.0) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P5.x)

x

FUNCTION

P5DIR.x

P5SEL.x

REFOUT

REFON⁽⁵⁾

CTSD16REFS⁽⁶⁾

P5.0 (I/O)⁽²⁾

I: 0; O: 1

0

1

X

0

1

X

1

X

0

1

P5.0/VREFBG/VeREF+

0

VeREF+⁽³⁾

VREFBG⁽⁴⁾

X

(1) X = Don't care

(2) Default condition

(3) Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying

analog signals. An external voltage can be applied to VeREF+ and used as the reference for the CTSD16 or DAC.

(4) Setting the P5SEL.0 bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying

analog signals. The internal reference voltage signal, V_REFBG, is available at the pin.

(5) If a module is requesting a reference then REFON need not be set to 1 for VREFBG to be selected on P5.0.

(6) If CTSD16 is active, this bit must be set as shown in the table. Otherwise if set to 1, it will force VREFBG to be selected regardless of

REFOUT setting and if P5SEL.x is set to 0 it will cause possible contention on the I/O.

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9.13.6 Port P5 (P5.1 and P5.6) Input/Output With Schmitt Trigger

Figure 9-8 shows the port diagram. Table 9-21 summarizes the selection of the port function.

0

Pad Logic

Dvss

1

2

0 if DAC12AMPx=0

1 if DAC12AMPx=1

2 if DAC12AMPx>1

From DAC12_A

To ADC

INCHx = y

DAC12AMPx>0

DAC12OPS

P5REN.x

DV_SS

DV_CC

0

1

P5DIR.x

P5OUT.x

P5.1/A4/DAC0

P5.6/A5/DAC1

P5DS.x

0: Low drive

1: High drive

P5SEL.x

P5IN.x

Bus

Keeper

Figure 9-8. Port P5 (P5.1 and P5.6) Diagram

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Table 9-21. Port P5 (P5.1 and P5.6) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

x

FUNCTION

P5DIR.x

P5SEL.x

DAC12OPS

DAC12AMPx

P5.1(I/O)

A4^{(2) (3)}

DAC0

I: 0; O: 1

0

1

X

0

1

X

0

P5.1/A4/DAC0

1

X

>1

0

P5.6(I/O)

A5^{(2) (3)}

DAC1

I: 0; O: 1

X

0

P5.6/A5/DAC1

1

X

0

>1

(1) X = Don't care

(2) Setting the P5SEL.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying

analog signals.

(3) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

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9.13.7 Port P5 (P5.3 to P5.5, P5.7) Input/Output With Schmitt Trigger

Figure 9-9 shows the port diagram. Table 9-22 summarizes the selection of the port function.

Pad Logic

S40...S42

LCDS40...LCDS42

P5REN.x

DV_SS

DV_CC

0

1

P5DIR.x

0

1

Direction

0: Input

1: Output

P5OUT.x

0

1

Module X OUT

P5.3/COM1/S42

P5.4/COM2/S41

P5.5/COM3/S40

P5.7/DMAE0/RTCCLK

P5DS.x

0: Low drive

1: High drive

P5SEL.x

P5IN.x

Bus

Keeper

EN

D

Module X IN

Figure 9-9. Port P5 (P5.3 to P5.5 and P5.7) Diagram

Table 9-22. Port P5 (P5.3 to P5.5, P5.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P5.x)

x

FUNCTION

LCDS40 to

LCDS42

P5DIR.x

P5SEL.x

P5.3 (I/O)

COM1

I: 0; O: 1

0

1

0

1

0

1

0

1

0

X

P5.3/COM1/S42

3

X

S42

X

1

P5.4 (I/O)

COM2

I: 0; O: 1

0

P5.4/COM2/S41

4

5

7

X

S41

X

1

P5.5 (I/O)

COM3

I: 0; O: 1

0

P5.5/COM3/S40

X

S40

X

1

P5.7 (I/O)

DMAE0

RTCCLK

I: 0; O: 1

na

P5.7/DMAE0/RTCCLK

0

1

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9.13.8 Port P6 (P6.0 to P6.1) Input/Output With Schmitt Trigger

Figure 9-10 shows the port diagram. Table 9-23 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

P6REN.x

DV_SS

DV_CC

0

1

P6DIR.x

P6OUT.x

P6.0/CB0/A0

P6.1/CB1/A1

P6DS.x

0: Low drive

1: High drive

P6SEL.x

P6IN.x

Bus

Keeper

Figure 9-10. Port P6 (P6.0 to P6.1) Diagram

Table 9-23. Port P6 (P6.0 to P6.1) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

x

FUNCTION

P6DIR.x

I: 0; O: 1

P6SEL.x

CBPD.x

P6.0 (I/O)

CB0

0

X

1

0

X

1

0

1

X

0

1

X

P6.0/CB0/A0

0

X

A0^{(2) (3)}

P6.1 (I/O)

CB1

X

I: 0; O: 1

P6.1/CB1/A1

1

X

A1^{(2) (3)}

(1) X= Don't care

(2) Setting the P6SEL.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying

analog signals.

(3) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

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9.13.9 Port P6 (P6.2 and P6.3) Input/Output With Schmitt Trigger

Figure 9-11 shows the port diagram. Table 9-24 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

P6REN.x

DV_SS

DV_CC

0

1

P6DIR.x

P6OUT.x

P6.2/CB2/A2/OA0IP0

P6.3/CB3/A3/OA1IP1

P6DS.x

0: Low drive

1: High drive

P6SEL.x

P6IN.x

Bus

Keeper

+

OAx

-

Figure 9-11. Port P6 (P6.2 and P6.3) Diagram

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Table 9-24. Port P6 (P6.2 and P6.3) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

x

FUNCTION

P6DIR.x

P6SEL.x⁽³⁾

CBPD.x⁽³⁾

P6.2 (I/O)

CB2

I: 0; O: 1

0

X

1

0

X

1

0

1

X

P6.2/CB2/A2/OA0IP0

2

A2 ⁽²⁾

X

0

OA0IP0⁽³⁾

P6.2 (I/O)

CB3

X

I: 0; O: 1

X

1

P6.3/CB3/A3/OA1IP0

(1) X = Don't care

3

A3 ⁽³⁾

X

OA1IP0⁽³⁾

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting the P6SEL.x bit or CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when

applying analog signals.

110

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9.13.10 Port P6 (P6.4) Input/Output With Schmitt Trigger

Figure 9-12 shows the port diagram. Table 9-25 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

OAMx

P6REN.x

DV_SS

DV_CC

0

1

P6DIR.x

P6OUT.x

P6.4/CB4/AD0+/OA0O

P6DS.x

0: Low drive

1: High drive

P6SEL.x

P6IN.x

Bus

Keeper

+

OA0

-

Figure 9-12. Port P6 (P6.4) Diagram

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Table 9-25. Port P6 (P6.4) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

P6.4/CB4/AD0+/OA0O

(1) X = Don't care

x

FUNCTION

P6DIR.x

P6SEL.x⁽³⁾

CBPD.x⁽³⁾

OAMx

0⁽⁴⁾

P6.4 (I/O)

CB4

I: 0; O: 1

0

X

1

0

1

X

0⁽⁴⁾

4

AD0+ ⁽²⁾

OA0O

X

0⁽⁴⁾

X

= 1⁽⁴⁾

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting the P6SEL.x bit, the CBPD.x bit, or the OAMx bit disables the output driver and the input Schmitt trigger to prevent parasitic

cross currents when applying analog signals.

(4) Setting OAMx = 0 disables the operational amplifier and its output is high impedance. Setting OAMx = 1 enables the operational

amplifier output. Because the operational amplifier output is shared with the ADC channel, selection of the respective ADC channel

allows for direct measurement of the output voltage of the amplifier.

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9.13.11 Port P6 (P6.5) Input/Output With Schmitt Trigger

Figure 9-13 shows the port diagram. Table 9-26 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

P6REN.x

DV_SS

DV_CC

0

1

P6DIR.x

P6OUT.x

P6.5/CB5/AD0-/OA0IN0

P6DS.x

0: Low drive

1: High drive

P6SEL.x

P6IN.x

Bus

Keeper

+

OA0

-

Figure 9-13. Port P6 (P6.5) Diagram

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Table 9-26. Port P6 (P6.5) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

P6.5/CB5/AD0-/OA0IN0

(1) X = Don't care

x

FUNCTION

P6DIR.x

P6SEL.x⁽³⁾

CBPD.x⁽³⁾

P6.5 (I/O)

CB5

I: 0; O: 1

0

X

1

0

1

X

5

AD0- ⁽²⁾

OA0IN0⁽³⁾

X

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting the P6SEL.x bit or CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when

applying analog signals.

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9.13.12 Port P6 (P6.6) Input/Output With Schmitt Trigger

Figure 9-14 shows the port diagram. Table 9-27 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

GSW0

P6REN.x

DV_SS

DV_CC

0

1

P6DIR.x

P6OUT.x

P6.6/CB6/AD1+/G0SW0

P6DS.x

0: Low drive

1: High drive

P6SEL.x

P6IN.x

Bus

Keeper

+

OA0

-

GSW0

GSW1

to P6.7

Figure 9-14. Port P6 (P6.6) Diagram

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Table 9-27. Port P6 (P6.6) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

P6.6/CB6/AD1+/G0SW0

(1) X = Don't care

x

FUNCTION

P6DIR.x

P6SEL.x⁽³⁾

CBPD.x⁽³⁾

GSW0⁽³⁾

P6.6 (I/O)

CB6

I: 0; O: 1

0

X

1

0

1

0

1

X

6

AD1+ ⁽²⁾

G0SW0⁽⁴⁾

X

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting the P6SEL.x bit, the CBPD.x bit, or the GSW0 bit disables the output driver and the input Schmitt trigger to prevent parasitic

cross currents when applying analog signals.

(4) Setting GSW0 = 1 closes the switch and forces the pin to be switched to ground. All switches are independent of each other, so

different settings can impose different voltages on the pin. Application must ensure there are no conflicts.

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9.13.13 Port P6 (P6.7) Input/Output With Schmitt Trigger

Figure 9-15 shows the port diagram. Table 9-28 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

GSW1

P6REN.x

DV_SS

DV_CC

0

1

P6DIR.x

P6OUT.x

P6.7/CB7/AD1-/G0SW1

P6DS.x

0: Low drive

1: High drive

P6SEL.x

P6IN.x

Bus

Keeper

+

OA0

-

GSW0

to P6.6

GSW1

Figure 9-15. Port P6 (P6.7) Diagram

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Table 9-28. Port P6 (P6.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

P6.7/CB7/AD1-/G0SW1

(1) X = Don't care

x

FUNCTION

P6DIR.x

P6SEL.x⁽³⁾

CBPD.x⁽³⁾

GSW1⁽³⁾

P6.7 (I/O)

CB7

I: 0; O: 1

0

X

1

0

1

0

1

X

7

AD1- ⁽²⁾

G0SW1⁽³⁾

X

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting GSW1 = 1 closes the switch and forces the pin to be switched to ground. All switches are independent of each other, so

different settings can impose different voltages on the pin. Application must ensure there are no conflicts.

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9.13.14 Port P7 (P7.2 and P7.3) Input/Output With Schmitt Trigger

Figure 9-16 and Figure 9-17 show the port diagrams. Table 9-29 summarizes the selection of the port function.

Pad Logic

To XT2

P7REN.2

DV_SS

DV_CC

0

1

P7DIR.2

P7OUT.2

0

1

P7.2/XT2IN

P7DS.2

0: Low drive

1: High drive

P7SEL.2

P7IN.2

Bus

Keeper

Figure 9-16. Port P7 (P7.2) Diagram

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Pad Logic

To XT2

P7REN.3

DV_SS

DV_CC

0

1

P7DIR.3

0

1

P7OUT.3

P7SEL.2

P7.3/XT2OUT

P7DS.3

0: Low drive

1: High drive

XT2BYPASS

P7SEL.3

P7IN.3

Bus

Keeper

Figure 9-17. Port P7 (P7.3) Diagram

Table 9-29. Port P7 (P7.2 and P7.3) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P7.x)

x

FUNCTION

P7DIR.x

P7SEL.2

P7SEL.3

XT2BYPASS

P7.2 (I/O)

I: 0; O: 1

0

1

0

1

X

0

1

X

0

1

P7.2/XT2IN

2

XT2IN crystal mode⁽²⁾

XT2IN bypass mode⁽²⁾

P7.3 (I/O)

X

I: 0; O: 1

P7.3/XT2OUT

3

XT2OUT crystal mode⁽³⁾

P7.3 (I/O)⁽³⁾

X

(1) X= Don't care

(2) Setting P7SEL.2 causes the general-purpose I/O to be disabled. Pending the setting of XT2BYPASS, P7.2 is configured for crystal

mode or bypass mode.

(3) Setting P7SEL.2 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P7.3 can be used as

general-purpose I/O.

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9.13.15 Port P7 (P7.4) Input/Output With Schmitt Trigger

Figure 9-18 shows the port diagram. Table 9-30 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

OAMx

P7REN.x

DV_SS

DV_CC

0

1

P7DIR.x

P7OUT.x

P7.4/CB8/AD2+/OA1O

P7DS.x

0: Low drive

1: High drive

P7SEL.x

P7IN.x

Bus

Keeper

+

OA1

-

Figure 9-18. Port P7 (P7.4) Diagram

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Table 9-30. Port P7 (P7.4) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P6.x)

P7.4/CB8/AD2+/OA1O

(1) X = Don't care

x

FUNCTION

P6DIR.x

P7SEL.x⁽³⁾

CBPD.x⁽³⁾

OAMx⁽³⁾

0⁽³⁾

P7.4 (I/O)

CB8

I: 0; O: 1

0

X

1

0

1

X

0⁽³⁾

4

AD2+ ⁽²⁾

OA1O

X

0⁽³⁾

X

1⁽³⁾

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting OAMx = 0 disables the operational amplifier and its output is high impedance. Setting OAMx = 1 enables the operational

amplifier output. Because the operational amplifier output is shared with the ADC channel, selection of the respective ADC channel

allows for direct measurement of the output voltage of the amplifier.

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9.13.16 Port P7 (P7.5) Input/Output With Schmitt Trigger

Figure 9-19 shows the port diagram. Table 9-31 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

P7REN.x

DV_SS

DV_CC

0

1

P7DIR.x

P7OUT.x

P7.5/CB9/AD2-/OA1IN0

P7DS.x

0: Low drive

1: High drive

P7SEL.x

P7IN.x

Bus

Keeper

+

OA1

-

Figure 9-19. Port P7 (P7.5) Diagram

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Table 9-31. Port P7 (P7.5) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P7.x)

P7.5/CB9/AD2-/OAIN0

(1) X = Don't care

x

FUNCTION

P7DIR.x

P7SEL.x⁽³⁾

CBPD.x⁽³⁾

P7.5 (I/O)

CB9

I: 0; O: 1

0

X

1

0

1

X

5

AD2- ⁽²⁾

OAIN0⁽³⁾

X

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting the P7SEL.x bit or the CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents

when applying analog signals.

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9.13.17 Port P7 (P7.6) Input/Output With Schmitt Trigger

Figure 9-20 shows the port diagram. Table 9-32 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

GSW0

P7REN.x

DV_SS

DV_CC

0

1

P7DIR.x

P7OUT.x

P7.6/CB10/AD3+/G1SW0

P7DS.x

0: Low drive

1: High drive

P7SEL.x

P7IN.x

Bus

Keeper

+

OA1

-

GSW0

GSW1

to P7.7

Figure 9-20. Port P7 (P7.6) Diagram

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Table 9-32. Port P7 (P7.6) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P7.x)

P7.6/CB10/AD3+/G1SW0

(1) X = Don't care

x

FUNCTION

P6DIR.x

P7SEL.x⁽³⁾

CBPD.x⁽³⁾

GSW0⁽³⁾

P7.6 (I/O)

CB10

I: 0; O: 1

0

X

1

0

1

0

1

X

6

AD3+ ⁽²⁾

G1SW0⁽⁴⁾

X

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting the P7SEL.x bit, the CBPD.x bit, or the GSW0 disables the output driver and the input Schmitt trigger to prevent parasitic cross

currents when applying analog signals.

(4) Setting GSW0 = 1 closes the switch and forces the pin to be switched to ground. All switches are independent of each other, so

different settings can impose different voltages on the pin. Application must ensure there are no conflicts.

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9.13.18 Port P7 (P7.7) Input/Output With Schmitt Trigger

Figure 9-21 shows the port diagram. Table 9-33 summarizes the selection of the port function.

Pad Logic

To ADC

INCHx = y

To Comparator_B

From Comparator_B

CBPD.x

GSW1

P7REN.x

DV_SS

DV_CC

0

1

P7DIR.x

P7OUT.x

P7.7/CB11/AD3-/G1SW1

P7DS.x

0: Low drive

1: High drive

P7SEL.x

P7IN.x

Bus

Keeper

+

OA1

-

GSW0

to P7.6

GSW1

Figure 9-21. Port P7 (P7.7) Diagram

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Table 9-33. Port P7 (P7.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P7.x)

P7.7/CB11/AD3-/G1SW1

(1) X = Don't care

x

FUNCTION

P6DIR.x

P7SEL.x⁽³⁾

CBPD.x⁽³⁾

GSW1⁽³⁾

P7.7 (I/O)

CB11

I: 0; O: 1

0

X

1

0

1

0

1

X

7

AD3- ⁽²⁾

G1SW1⁽⁴⁾

X

(2) The ADC channel Ax is connected internally to AV_SSif not selected by the respective INCHx bits.

(3) Setting the P7SEL.x bit, the CBPD.x bit, or the GSW1 bit disables the output driver and the input Schmitt trigger to prevent parasitic

cross currents when applying analog signals.

(4) Setting GSW1 = 1 closes the switch and forces the pin to be switched to ground. All switches are independent of each other, so

different settings can impose different voltages on the pin. Application must ensure there are no conflicts.

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9.13.19 Port P8 (P8.0 to P8.7) Input/Output With Schmitt Trigger

Figure 9-22 shows the port diagram. Table 9-34 summarizes the selection of the port function.

Pad Logic

S8...S15

LCDS8...LCDS15

P8REN.x

DV_SS

DV_CC

0

1

P8DIR.x

0

1

Direction

0: Input

1: Output

From module

0

1

P8OUT.x

Module X OUT

P8.0/TB0CLK/S15

P8DS.x

0: Low drive

1: High drive

P8.1/UCB1STE/UCA1CLK/S14

P8.2/UCA1TXD/UCA1SIMO/S13

P8.3/UCA1RXD/UCA1SOMI/S12

P8.4/UCB1CLK/UCA1STE/S11

P8.5/UCB1SIMO//UCB1SDA/S10

P8.6/UCB1SOMI/UCB1SCL/S9

P8.7/S8

P8SEL.x

P8IN.x

Bus

Keeper

EN

D

Module X IN

Figure 9-22. Port P8 (P8.0 to P8.7) Diagram

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Table 9-34. Port P8 (P8.0 to P8.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P9.x)

x

FUNCTION

P8DIR.x

P8SEL.x

LCDS8 to 16

P8.0 (I/O)

I: 0; O: 1

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

1

X

0

X

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

P8.0/TB0CLK/S15

0

Timer TB0.TB0CLK clock input

0

S15

X

P8.1 (I/O)

I: 0; O: 1

P8.1/UCB1STE/UCA1CLK/S14

P8.2/UCA1TXD/UCA1SIMO/S13

P8.3/UCA1RXD/UCA1SOMI/S12

P8.4/UCB1CLK/UCA1STE/S11

P8.5/UCB1SIMO/UCB1SDA/S10

P8.6/UCB1SOMI/UCB1SCL/S9

1

2

3

4

5

UCB1STE/UCA1CLK

X

S14

X

P8.2 (I/O)

I: 0; O: 1

UCA1TXD/UCA1SIMO

X

S13

X

P8.3 (I/O)

I: 0; O: 1

UCA1RXD/UCA1SOMI

X

S12

X

P8.4 (I/O)

I: 0; O: 1

UCB1CLK/UCA1STE

X

S11

X

P8.5 (I/O)

I: 0; O: 1

UCB1SIMO/UCB1SDA

X

S10

X

P8.6 (I/O)

I: 0; O: 1

6

7

UCB1SOMI/UCB1SCL

X

S9

X

I: 0; O: 1

X

P8.7 (I/O)

S8

P8.7/S8

(1) X= don't care

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9.13.20 Port P9 (P9.0 to P9.7) Input/Output With Schmitt Trigger

Figure 9-23 shows the port diagram. Table 9-35 summarizes the selection of the port function.

Pad Logic

S0...S7

LCDS0...LCDS7

P9REN.x

0

1

DV_SS

DV_CC

1

Direction

0: Input

1: Output

P9DIR.x

P9OUT.x

P9.0/S7

P9.1/S6

P9.2/S5

P9.3/S4

P9.4/S3

P9.5/S2

P9.6/S1

P9.7/S0

P9DS.x

0: Low drive

1: High drive

P9IN.x

Bus

Keeper

Figure 9-23. Port P9 (P9.0 to P9.7) Diagram

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Table 9-35. Port P9 (P9.0 to P9.7) Pin Functions

CONTROL BITS OR SIGNALS⁽¹⁾

PIN NAME (P9.x)

x

FUNCTION

LCDS0 to

LCDS7

P9DIR.x

P9SEL.x

P9.0 (I/O)

S7

I: 0; O: 1

0

X

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

P9.0/S7

0

1

2

3

4

5

6

7

X

P9.1 (I/O)

S6

I: 0; O: 1

P9.1/S6

X

0

P9.2 (I/O)

S5

I: 0; O: 1

P9.2/S5

X

0

P9.3 (I/O)

S4

I: 0; O: 1

P9.3/S4

X

0

P9.4 (I/O)

S3

I: 0; O: 1

P9.4/S3

X

0

P9.5 (I/O)

S2

I: 0; O: 1

P9.5/S2

X

I: 0; O: 1

X

0

P9.6 (I/O)

S1

P9.6/S1

X

0

P9.7 (I/O)

S0

I: 0; O: 1

X

P9.7/S0

X

(1) X= don't care

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9.13.21 Port U (PU.0/DP, PU.1/DM, PUR) USB Ports for MSP430FG662x

Figure 9-24 shows the port diagram. Table 9-36 and Table 9-37 summarize the port function selection.

PUSEL

VUSB

VSSU

Pad Logic

PUOPE

0

1

USB output enable

PUOUT0

0

1

PU.0/DP

USB DP output

PUIN0

USB DP input

PUIPE

PUIN1

USB DM input

PUOUT1

0

1

PU.1/DM

USB DM output

VUSB

VSSU

Pad Logic

PUREN

PUR

“1”

PUSEL

PURIN

Figure 9-24. Port U (PU.0 and PU.1) Diagram

Table 9-36. Port U (PU.0/DP, PU.1/DM) Output Functions for MSP430FG662x

CONTROL BITS

PIN NAME

FUNCTION

PUSEL

PUDIR PUOUT1

PUOUT0

PU.1/DM

PU.0/DP

0

1

0

X

0

1

0

1

X

Hi-Z

0

Hi-Z

0

Outputs off

Outputs enabled

1

X

0

1

X

0

1

Outputs enabled

1

0

Outputs enabled

1

Outputs enabled

DM

DP

Direction set by USB module

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Table 9-37. Port U (PUR) Input Functions

CONTROL BITS

FUNCTION

PUSEL

PUREN

Input disabled

Pullup disabled

0

1

0

Input disabled

Pullup enabled

1

0

1

Input enabled

Pullup disabled

Input enabled

Pullup enabled

9.13.22 Port J (J.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output

Figure 9-25 shows the port diagram. Table 9-38 summarizes the selection of the port function.

Pad Logic

PJREN.0

0

1

DV_SS

DV_CC

1

PJDIR.0

DVCC

0

1

PJOUT.0

0

1

From JTAG

PJ.0/TDO

PJDS.0

0: Low drive

1: High drive

From JTAG

PJIN.0

EN

D

Figure 9-25. Port PJ (PJ.0) Diagram

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9.13.23 Port J (J.1 to J.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output

Figure 9-26 shows the port diagram. Table 9-38 summarizes the selection of the port function.

Pad Logic

PJREN.x

0

1

DV_SS

DV_CC

1

PJDIR.x

DVSS

0

1

PJOUT.x

0

1

From JTAG

PJ.1/TDI/TCLK

PJ.2/TMS

PJ.3/TCK

PJDS.x

0: Low drive

1: High drive

From JTAG

PJIN.x

EN

D

To JTAG

Figure 9-26. Port PJ (PJ.1 to PJ.3) Diagram

Table 9-38. Port PJ (PJ.0 to PJ.3) Pin Functions

CONTROL BITS

OR SIGNALS⁽¹⁾

PIN NAME (PJ.x)

x

FUNCTION

PJDIR.x

I: 0; O: 1

X

PJ.0 (I/O)⁽²⁾

TDO⁽³⁾

PJ.0/TDO

0

1

2

3

PJ.1 (I/O)⁽²⁾

TDI/TCLK^{(3) (4)}

PJ.2 (I/O)⁽²⁾

TMS^{(3) (4)}

I: 0; O: 1

X

PJ.1/TDI/TCLK

PJ.2/TMS

I: 0; O: 1

X

PJ.3 (I/O)⁽²⁾

TCK^{(3) (4)}

I: 0; O: 1

X

PJ.3/TCK

(1) X= don't care

(2) Default condition

(3) The pin direction is controlled by the JTAG module.

(4) In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are don't care.

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9.14 Device Descriptors

Table 9-39 summarizes the contents of the device descriptor tag-length-value (TLV) structure.

Table 9-39. Device Descriptor Table

VALUE

SIZE

(bytes)

DESCRIPTION

Info length

ADDRESS

FG6626

06h

FG6625

FG6426

06h

FG6425

01A00h

01A01h

01A02h

01A04h

01A06h

01A07h

01A08h

01A09h

01A0Ah

01A0Eh

01A10h

01A12h

01A14h

01A15h

01A16h

01A18h

01A1Ah

01A1Ch

1

2

1

4

2

1

2

06h

CRC length

CRC value

06h

Per unit

8234h

Per unit

08h

Per unit

8235h

Per unit

08h

Per unit

8237h

Per unit

08h

Info Block

Device ID

8236h

Per unit

08h

Hardware revision

Firmware revision

Die record tag

Die record length

Lot/wafer ID

0Ah

Per unit

1Dh

Per unit

1Dh

Per unit

1Dh

Per unit

1Dh

Die Record

Die X position

Die Y position

Test results

CTSD16 calibration tag

CTSD16 calibration length

CTSD16 gain factor gain = 1

CTSD16 gain factor gain = 16

CTSD16 offset gain = 1

CTSD16 offset gain = 16

0Ch

Per unit

CTSD16 Calibration

CTSD16 internal reference

temperature sensor 30°C

01A1Eh

01A20h

2

Per unit

CTSD16 internal reference

temperature sensor 85°C

9.15 Memory

Table 9-40 summarizes the memory organization for all devices.

Table 9-40. Memory Organization

VALUE^{(1) (2)}

MSP430FG6626

MSP430FG6625

MSP430FG6426

MSP430FG6425

Memory (flash)

Main: interrupt vector

128KB

00FFFFh to 00FF80h

64KB

128KB

64KB

Total Size

Bank 3

00FFFFh to 00FF80h 00FFFFh to 00FF80h 00FFFFh to 00FF80h

32KB

0243FFh to 01C400h

32KB

0243FFh to 01C400h

NA

32KB

01C3FFh to 014400h

32KB

01C3FFh to 014400h

Bank 2

Main: code memory

32KB

0143FFh to 00C400h

32KB

0143FFh to 00C400h

32KB

0143FFh to 00C400h

32KB

0143FFh to 00C400h

Bank 1

32KB

00C3FFh to 004400h

32KB

00C3FFh to 004400h

32KB

00C3FFh to 004400h

32KB

00C3FFh to 004400h

Bank 0

2KB

Sector 3

Sector 2

Sector 1

0043FFh to 003C00h

2KB

RAM

003BFFh to 003400h

2KB

0033FFh to 002C00h

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Table 9-40. Memory Organization (continued)

VALUE^{(1) (2)}

MSP430FG6626

MSP430FG6625

MSP430FG6426

MSP430FG6425

2KB

Sector 0

Sector 7

A

002BFFh to 002400h

2KB

RAM⁽³⁾

NA

0023FFh to 001C00h

2KB

USB RAM⁽⁴⁾

NA

0023FFh to 001C00h

128 bytes

001BFFh to 001B80h

128 bytes

001BFFh to 001B80h 001BFFh to 001B80h 001BFFh to 001B80h

128 bytes

001B7Fh to 001B00h

128 bytes

001B7Fh to 001B00h

128 bytes

001B7Fh to 001B00h

128 bytes

001B7Fh to 001B00h

B

TI factory memory

(ROM)

128 bytes

001AFFh to 001A80h

128 bytes

C

001AFFh to 001A80h 001AFFh to 001A80h 001AFFh to 001A80h

128 bytes

001A7Fh to 001A00h

128 bytes

001A7Fh to 001A00h

128 bytes

001A7Fh to 001A00h

128 bytes

001A7Fh to 001A00h

D

128 bytes

0019FFh to 001980h

128 bytes

0019FFh to 001980h

128 bytes

0019FFh to 001980h

128 bytes

0019FFh to 001980h

Info A

Info B

Info C

Info D

BSL 3

BSL 2

BSL 1

BSL 0

Size

128 bytes

00197Fh to 001900h

128 bytes

00197Fh to 001900h

128 bytes

00197Fh to 001900h

128 bytes

00197Fh to 001900h

Information memory

(flash)

128 bytes

0018FFh to 001880h

128 bytes

0018FFh to 001880h

128 bytes

0018FFh to 001880h

128 bytes

0018FFh to 001880h

128 bytes

00187Fh to 001800h

128 bytes

00187Fh to 001800h

128 bytes

00187Fh to 001800h

128 bytes

00187Fh to 001800h

512 bytes

0017FFh to 001600h

512 bytes

0017FFh to 001600h

512 bytes

0017FFh to 001600h

512 bytes

0017FFh to 001600h

512 bytes

0015FFh to 001400h

512 bytes

0015FFh to 001400h

512 bytes

0015FFh to 001400h

512 bytes

0015FFh to 001400h

Bootloader (BSL)

memory (flash)

512 bytes

0013FFh to 001200h

512 bytes

0013FFh to 001200h

512 bytes

0013FFh to 001200h

512 bytes

0013FFh to 001200h

512 bytes

0011FFh to 001000h

512 bytes

0011FFh to 001000h

512 bytes

0011FFh to 001000h

512 bytes

0011FFh to 001000h

4KB

Peripherals

000FFFh to 000000h

(1) N/A = Not available.

(2) Backup RAM is accessed through the control registers BAKMEM0, BAKMEM1, BAKMEM2, and BAKMEM3.

(3) Only available on FG642x.

(4) Only available on FG662x. USB RAM can be used as general-purpose RAM when not used for USB operation.

9.15.1 Peripheral File Map

Table 9-41 lists all of the the available peripherals and their base addresses. Table 9-42 through Table 9-78 list

the registers and their offset addresses for each peripheral.

Table 9-41. Peripherals

MODULE NAME

Special Functions (see Table 9-42)

PMM (see Table 9-43)

BASE ADDRESS

OFFSET ADDRESS RANGE⁽¹⁾

000h to 01Fh

0100h

0120h

000h to 010h

Flash Control (see Table 9-44)

CRC16 (see Table 9-45)

0140h

000h to 00Fh

0150h

000h to 007h

RAM Control (see Table 9-46)

Watchdog (see Table 9-47)

UCS (see Table 9-48)

0158h

000h to 001h

015Ch

000h to 001h

0160h

000h to 01Fh

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Table 9-41. Peripherals (continued)

MODULE NAME

BASE ADDRESS

OFFSET ADDRESS RANGE⁽¹⁾

000h to 01Fh

000h to 001h

000h to 003h

000h to 007h

000h to 01Fh

000h to 00Bh

000h to 01Fh

000h to 02Eh

000h to 01Fh

000h to 02Fh

000h to 00Fh

000h to 00Ah

000h to 01Fh

000h to 00Fh

000h to 014h

000h to 01Fh

000h to 014h

000h to 05Fh

000h to 00Fh

SYS (see Table 9-49)

0180h

Shared Reference (see Table 9-50)

Port Mapping Control (see Table 9-51)

Port Mapping Port P2 (see Table 9-51)

Port P1, P2 (see Table 9-52)

01B0h

01C0h

01D0h

0200h

0220h

0240h

0260h

0280h

0320h

0340h

0380h

03C0h

0400h

0480h

04A0h

04C0h

0500h

0510h

0520h

0530h

0540h

0550h

0560h

05C0h

05E0h

0600h

0620h

0780h

08C0h

0900h

0920h

0900h

0A00h

0A80h

0AE0h

0AF0h

Port P3, P4 (see Table 9-53)

Port P5, P6 (see Table 9-54)

Port P7, P8 (see Table 9-55)

Port P9 (see Table 9-56)

Port PJ (see Table 9-57)

Timer TA0 (see Table 9-58)

Timer TA1 (see Table 9-59)

Timer TB0 (see Table 9-60)

Timer TA2 (see Table 9-61)

Battery Backup (see Table 9-62)

RTC_B (see Table 9-63)

32-Bit Hardware Multiplier (see Table 9-64)

DMA General Control (see Table 9-65)

DMA Channel 0 (see Table 9-65)

DMA Channel 1 (see Table 9-65)

DMA Channel 2 (see Table 9-65)

DMA Channel 3 (see Table 9-65)

DMA Channel 4 (see Table 9-65)

DMA Channel 5 (see Table 9-65)

USCI_A0 (see Table 9-66)

USCI_B0 (see Table 9-67)

USCI_A1 (see Table 9-68)

USCI_B1 (see Table 9-69)

DAC12_A (see Table 9-70)

Comparator_B (see Table 9-71)

USB configuration (see Table 9-72)⁽²⁾

USB control (see Table 9-73)⁽²⁾

LDO-PWR; LDO and Port U configuration (see Table 9-74) ⁽³⁾

LCD_B control (see Table 9-75)

CTSD16 (see Table 9-76)

OA0 and GSW0 (see Table 9-77)

OA1 and GSW1 (see Table 9-78)

(1) For a detailed description of the individual control register offset addresses, see the MSP430F5xx and MSP430F6xx Family User's

Guide.

(2) Only on devices with peripheral module USB.

(3) Only on devices with peripheral module LDO-PWR.

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Table 9-42. Special Function Registers (Base Address: 0100h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

SFR interrupt enable

SFR interrupt flag

SFRIE1

SFRIFG1

SFRRPCR

02h

SFR reset pin control

04h

Table 9-43. PMM Registers (Base Address: 0120h)

REGISTER DESCRIPTION

REGISTER

PMMCTL0

PMMCTL1

SVSMHCTL

SVSMLCTL

PMMIFG

OFFSET

00h

PMM control 0

PMM control 1

02h

SVS high-side control

SVS low-side control

PMM interrupt flags

PMM interrupt enable

PMM power mode 5 control

04h

06h

0Ch

0Eh

PMMIE

PM5CTL0

10h

Table 9-44. Flash Control Registers (Base Address: 0140h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

Flash control 1

Flash control 3

Flash control 4

FCTL1

FCTL3

04h

FCTL4

06h

Table 9-45. CRC16 Registers (Base Address: 0150h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

CRC data input

CRC result

CRC16DI

CRC16INIRES

04h

Table 9-46. RAM Control Registers (Base Address: 0158h)

REGISTER DESCRIPTION

REGISTER

OFFSET

RAM control 0

RCCTL0

00h

Table 9-47. Watchdog Registers (Base Address: 015Ch)

REGISTER DESCRIPTION

REGISTER

OFFSET

Watchdog timer control

WDTCTL

00h

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Table 9-48. UCS Registers (Base Address: 0160h)

REGISTER DESCRIPTION

REGISTER

UCSCTL0

UCSCTL1

UCSCTL2

UCSCTL3

UCSCTL4

UCSCTL5

UCSCTL6

UCSCTL7

UCSCTL8

OFFSET

UCS control 0

UCS control 1

UCS control 2

UCS control 3

UCS control 4

UCS control 5

UCS control 6

UCS control 7

UCS control 8

00h

02h

04h

06h

08h

0Ah

0Ch

0Eh

10h

Table 9-49. SYS Registers (Base Address: 0180h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

System control

SYSCTL

Bootloader configuration area

JTAG mailbox control

SYSBSLC

SYSJMBC

SYSJMBI0

SYSJMBI1

SYSJMBO0

SYSJMBO1

SYSBERRIV

SYSUNIV

02h

06h

JTAG mailbox input 0

08h

JTAG mailbox input 1

0Ah

0Ch

0Eh

18h

JTAG mailbox output 0

JTAG mailbox output 1

Bus error vector generator

User NMI vector generator

System NMI vector generator

Reset vector generator

1Ah

1Ch

1Eh

SYSSNIV

SYSRSTIV

Table 9-50. Shared Reference Registers (Base Address: 01B0h)

REGISTER DESCRIPTION

REGISTER

OFFSET

Shared reference control

REFCTL

00h

Table 9-51. Port Mapping Registers

(Base Address of Port Mapping Control: 01C0h, Port P2: 01D0h)

REGISTER DESCRIPTION

REGISTER

PMAPPWD

PMAPCTL

P2MAP0

P2MAP1

P2MAP2

P2MAP3

P2MAP4

P2MAP5

P2MAP6

P2MAP7

OFFSET

00h

Port mapping password

Port mapping control

Port P2.0 mapping

Port P2.1 mapping

Port P2.2 mapping

Port P2.3 mapping

Port P2.4 mapping

Port P2.5 mapping

Port P2.6 mapping

Port P2.7 mapping

02h

00h

01h

02h

03h

04h

05h

06h

07h

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Table 9-52. Port P1, P2 Registers (Base Address: 0200h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

02h

04h

06h

08h

0Ah

0Eh

18h

1Ah

1Ch

01h

03h

05h

07h

09h

0Bh

1Eh

19h

1Bh

1Dh

Port P1 input

P1IN

Port P1 output

P1OUT

P1DIR

P1REN

P1DS

Port P1 direction

Port P1 resistor enable

Port P1 drive strength

Port P1 selection

P1SEL

P1IV

Port P1 interrupt vector word

Port P1 interrupt edge select

Port P1 interrupt enable

Port P1 interrupt flag

Port P2 input

P1IES

P1IE

P1IFG

P2IN

Port P2 output

P2OUT

P2DIR

P2REN

P2DS

Port P2 direction

Port P2 resistor enable

Port P2 drive strength

Port P2 selection

P2SEL

P2IV

Port P2 interrupt vector word

Port P2 interrupt edge select

Port P2 interrupt enable

Port P2 interrupt flag

P2IES

P2IE

P2IFG

Table 9-53. Port P3, P4 Registers (Base Address: 0220h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

02h

04h

06h

08h

0Ah

0Eh

18h

1Ah

1Ch

01h

03h

05h

07h

09h

0Bh

1Eh

19h

1Bh

1Dh

Port P3 input

P3IN

Port P3 output

P3OUT

P3DIR

P3REN

P3DS

Port P3 direction

Port P3 resistor enable

Port P3 drive strength

Port P3 selection

P3SEL

P3IV

Port P3 interrupt vector word

Port P3 interrupt edge select

Port P3 interrupt enable

Port P3 interrupt flag

Port P4 input

P3IES

P3IE

P3IFG

P4IN

Port P4 output

P4OUT

P4DIR

P4REN

P4DS

Port P4 direction

Port P4 resistor enable

Port P4 drive strength

Port P4 selection

P4SEL

P4IV

Port P4 interrupt vector word

Port P4 interrupt edge select

Port P4 interrupt enable

Port P4 interrupt flag

P4IES

P4IE

P4IFG

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Table 9-54. Port P5, P6 Registers (Base Address: 0240h)

REGISTER DESCRIPTION

REGISTER

OFFSET

Port P5 input

P5IN

00h

02h

04h

06h

08h

0Ah

01h

03h

05h

07h

09h

0Bh

Port P5 output

P5OUT

P5DIR

P5REN

P5DS

Port P5 direction

Port P5 resistor enable

Port P5 drive strength

Port P5 selection

Port P6 input

P5SEL

P6IN

Port P6 output

P6OUT

P6DIR

P6REN

P6DS

Port P6 direction

Port P6 resistor enable

Port P6 drive strength

Port P6 selection

P6SEL

Table 9-55. Port P7, P8 Registers (Base Address: 0260h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

Port P7 input

P7IN

Port P7 output

P7OUT

P7DIR

P7REN

P7DS

02h

Port P7 direction

Port P7 resistor enable

Port P7 drive strength

Port P7 selection

Port P8 input

04h

06h

08h

P7SEL

P8IN

0Ah

01h

Port P8 output

P8OUT

P8DIR

P8REN

P8DS

03h

Port P8 direction

Port P8 resistor enable

Port P8 drive strength

Port P8 selection

05h

07h

09h

P8SEL

0Bh

Table 9-56. Port P9 Register (Base Address: 0280h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

Port P9 input

P9IN

Port P9 output

P9OUT

P9DIR

P9REN

P9DS

02h

Port P9 direction

Port P9 resistor enable

Port P9 drive strength

Port P9 selection

04h

06h

08h

P9SEL

0Ah

Table 9-57. Port J Registers (Base Address: 0320h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

Port PJ input

PJIN

Port PJ output

PJOUT

PJDIR

02h

Port PJ direction

Port PJ resistor enable

Port PJ drive strength

04h

PJREN

PJDS

06h

08h

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Table 9-58. TA0 Registers (Base Address: 0340h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

TA0 control

TA0CTL

TA0CCTL0

TA0CCTL1

TA0CCTL2

TA0CCTL3

TA0CCTL4

TA0R

Capture/compare control 0

Capture/compare control 1

Capture/compare control 2

Capture/compare control 3

Capture/compare control 4

TA0 counter

02h

04h

06h

08h

0Ah

10h

Capture/compare 0

Capture/compare 1

Capture/compare 2

Capture/compare 3

Capture/compare 4

TA0 expansion 0

TA0CCR0

TA0CCR1

TA0CCR2

TA0CCR3

TA0CCR4

TA0EX0

12h

14h

16h

18h

1Ah

20h

TA0 interrupt vector

TA0IV

2Eh

Table 9-59. TA1 Registers (Base Address: 0380h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

TA1 control

TA1CTL

Capture/compare control 0

Capture/compare control 1

Capture/compare control 2

TA1 counter

TA1CCTL0

TA1CCTL1

TA1CCTL2

TA1R

02h

04h

06h

10h

Capture/compare 0

Capture/compare 1

Capture/compare 2

TA1 expansion 0

TA1CCR0

TA1CCR1

TA1CCR2

TA1EX0

12h

14h

16h

20h

TA1 interrupt vector

TA1IV

2Eh

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Table 9-60. TB0 Registers (Base Address: 03C0h)

REGISTER DESCRIPTION

REGISTER

OFFSET

TB0 control

TB0CTL

00h

02h

04h

06h

08h

0Ah

0Ch

0Eh

10h

12h

14h

16h

18h

1Ah

1Ch

1Eh

20h

2Eh

Capture/compare control 0

Capture/compare control 1

Capture/compare control 2

Capture/compare control 3

Capture/compare control 4

Capture/compare control 5

Capture/compare control 6

TB0 counter

TB0CCTL0

TB0CCTL1

TB0CCTL2

TB0CCTL3

TB0CCTL4

TB0CCTL5

TB0CCTL6

TB0R

Capture/compare 0

TB0CCR0

TB0CCR1

TB0CCR2

TB0CCR3

TB0CCR4

TB0CCR5

TB0CCR6

TB0EX0

Capture/compare 1

Capture/compare 2

Capture/compare 3

Capture/compare 4

Capture/compare 5

Capture/compare 6

TB0 expansion 0

TB0 interrupt vector

TB0IV

Table 9-61. TA2 Registers (Base Address: 0400h)

REGISTER DESCRIPTION

REGISTER

OFFSET

00h

TA2 control

TA2CTL

Capture/compare control 0

Capture/compare control 1

Capture/compare control 2

TA2 counter

TA2CCTL0

TA2CCTL1

TA2CCTL2

TA2R

02h

04h

06h

10h

Capture/compare 0

Capture/compare 1

Capture/compare 2

TA2 expansion 0

TA2CCR0

TA2CCR1

TA2CCR2

TA2EX0

12h

14h

16h

20h

TA2 interrupt vector

TA2IV

2Eh

Table 9-62. Battery Backup Registers (Base Address: 0480h)

REGISTER DESCRIPTION

REGISTER

BAKMEM0

BAKMEM1

BAKMEM2

BAKMEM3

BAKCTL

OFFSET

00h

Battery backup memory 0

Battery backup memory 1

Battery backup memory 2

Battery backup memory 3

Battery backup control

Battery charger control

02h

04h

06h

1Ch

BAKCHCTL

1Eh

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Table 9-63. Real-Time Clock Registers (Base Address: 04A0h)

REGISTER DESCRIPTION

REGISTER

RTCCTL0

RTCCTL1

RTCCTL2

RTCCTL3

RTCPS0CTL

RTCPS1CTL

RTCPS0

OFFSET

00h

01h

02h

03h

08h

0Ah

0Ch

0Dh

0Eh

10h

11h

RTC control 0

RTC control 1

RTC control 2

RTC control 3

RTC prescaler 0 control

RTC prescaler 1 control

RTC prescaler 0

RTC prescaler 1

RTC interrupt vector word

RTC seconds

RTCPS1

RTCIV

RTCSEC

RTC minutes

RTCMIN

RTC hours

RTCHOUR

RTCDOW

RTCDAY

12h

13h

14h

15h

16h

17h

18h

19h

1Ah

1Bh

1Ch

1Eh

RTC day of week

RTC days

RTC month

RTCMON

RTCYEARL

RTCYEARH

RTCAMIN

RTCAHOUR

RTCADOW

RTCADAY

BIN2BCD

BCD2BIN

RTC year low

RTC year high

RTC alarm minutes

RTC alarm hours

RTC alarm day of week

RTC alarm days

Binary-to-BCD conversion

BCD-to-binary conversion

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Table 9-64. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)

REGISTER DESCRIPTION

REGISTER

OFFSET

16-bit operand 1 – multiply

MPY

00h

02h

04h

06h

08h

0Ah

0Ch

0Eh

10h

12h

14h

16h

18h

1Ah

1Ch

1Eh

20h

22h

24h

26h

28h

2Ah

2Ch

16-bit operand 1 – signed multiply

16-bit operand 1 – multiply accumulate

16-bit operand 1 – signed multiply accumulate

16-bit operand 2

MPYS

MAC

MACS

OP2

16 × 16 result low word

RESLO

RESHI

16 × 16 result high word

16 × 16 sum extension register

SUMEXT

MPY32L

MPY32H

MPYS32L

MPYS32H

MAC32L

MAC32H

MACS32L

MACS32H

OP2L

32-bit operand 1 – multiply low word

32-bit operand 1 – multiply high word

32-bit operand 1 – signed multiply low word

32-bit operand 1 – signed multiply high word

32-bit operand 1 – multiply accumulate low word

32-bit operand 1 – multiply accumulate high word

32-bit operand 1 – signed multiply accumulate low word

32-bit operand 1 – signed multiply accumulate high word

32-bit operand 2 – low word

32-bit operand 2 – high word

OP2H

32 × 32 result 0 – least significant word

32 × 32 result 1

RES0

RES1

32 × 32 result 2

RES2

32 × 32 result 3 – most significant word

MPY32 control 0

RES3

MPY32CTL0

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Table 9-65. DMA Registers (Base Address DMA General Control: 0500h,

DMA Channel 0: 0510h, DMA Channel 1: 0520h, DMA Channel 2: 0530h, DMA Channel 3: 0540h, DMA

Channel 4: 0550h, DMA Channel 5: 0560h)

REGISTER DESCRIPTION

REGISTER

DMACTL0

DMACTL1

DMACTL2

DMACTL3

DMACTL4

DMAIV

OFFSET

00h

02h

04h

06h

08h

0Ah

00h

02h

04h

06h

08h

0Ah

00h

02h

04h

06h

08h

0Ah

00h

02h

04h

06h

08h

0Ah

00h

02h

04h

06h

08h

0Ah

00h

02h

04h

06h

08h

0Ah

00h

02h

04h

06h

08h

0Ah

DMA general control: DMA module control 0

DMA general control: DMA module control 1

DMA general control: DMA module control 2

DMA general control: DMA module control 3

DMA general control: DMA module control 4

DMA general control: DMA interrupt vector

DMA channel 0 control

DMA0CTL

DMA0SAL

DMA0SAH

DMA0DAL

DMA0DAH

DMA0SZ

DMA channel 0 source address low

DMA channel 0 source address high

DMA channel 0 destination address low

DMA channel 0 destination address high

DMA channel 0 transfer size

DMA channel 1 control

DMA1CTL

DMA1SAL

DMA1SAH

DMA1DAL

DMA1DAH

DMA1SZ

DMA channel 1 source address low

DMA channel 1 source address high

DMA channel 1 destination address low

DMA channel 1 destination address high

DMA channel 1 transfer size

DMA channel 2 control

DMA2CTL

DMA2SAL

DMA2SAH

DMA2DAL

DMA2DAH

DMA2SZ

DMA channel 2 source address low

DMA channel 2 source address high

DMA channel 2 destination address low

DMA channel 2 destination address high

DMA channel 2 transfer size

DMA channel 3 control

DMA3CTL

DMA3SAL

DMA3SAH

DMA3DAL

DMA3DAH

DMA3SZ

DMA channel 3 source address low

DMA channel 3 source address high

DMA channel 3 destination address low

DMA channel 3 destination address high

DMA channel 3 transfer size

DMA channel 4 control

DMA4CTL

DMA4SAL

DMA4SAH

DMA4DAL

DMA4DAH

DMA4SZ

DMA channel 4 source address low

DMA channel 4 source address high

DMA channel 4 destination address low

DMA channel 4 destination address high

DMA channel 4 transfer size

DMA channel 5 control

DMA5CTL

DMA5SAL

DMA5SAH

DMA5DAL

DMA5DAH

DMA5SZ

DMA channel 5 source address low

DMA channel 5 source address high

DMA channel 5 destination address low

DMA channel 5 destination address high

DMA channel 5 transfer size

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Table 9-66. USCI_A0 Registers (Base Address: 05C0h)

REGISTER DESCRIPTION

REGISTER

UCA0CTL0

UCA0CTL1

UCA0BR0

OFFSET

USCI control 0

00h

01h

06h

07h

08h

0Ah

0Ch

0Eh

10h

12h

13h

1Ch

1Dh

1Eh

USCI control 1

USCI baud rate 0

USCI baud rate 1

UCA0BR1

USCI modulation control

USCI status

UCA0MCTL

UCA0STAT

UCA0RXBUF

UCA0TXBUF

UCA0ABCTL

UCA0IRTCTL

UCA0IRRCTL

UCA0IE

USCI receive buffer

USCI transmit buffer

USCI LIN control

USCI IrDA transmit control

USCI IrDA receive control

USCI interrupt enable

USCI interrupt flags

USCI interrupt vector word

UCA0IFG

UCA0IV

Table 9-67. USCI_B0 Registers (Base Address: 05E0h)

REGISTER DESCRIPTION

REGISTER

UCB0CTL0

UCB0CTL1

UCB0BR0

UCB0BR1

UCB0STAT

UCB0RXBUF

UCB0TXBUF

UCB0I2COA

UCB0I2CSA

UCB0IE

OFFSET

00h

USCI synchronous control 0

USCI synchronous control 1

USCI synchronous bit rate 0

USCI synchronous bit rate 1

USCI synchronous status

01h

06h

07h

0Ah

0Ch

0Eh

10h

USCI synchronous receive buffer

USCI synchronous transmit buffer

USCI I2C own address

USCI I2C slave address

USCI interrupt enable

12h

1Ch

1Dh

1Eh

USCI interrupt flags

UCB0IFG

USCI interrupt vector word

UCB0IV

Table 9-68. USCI_A1 Registers (Base Address: 0600h)

REGISTER DESCRIPTION

REGISTER

UCA1CTL0

UCA1CTL1

UCA1BR0

OFFSET

00h

USCI control 0

USCI control 1

01h

USCI baud rate 0

06h

USCI baud rate 1

UCA1BR1

07h

USCI modulation control

USCI status

UCA1MCTL

UCA1STAT

UCA1RXBUF

UCA1TXBUF

UCA1ABCTL

UCA1IRTCTL

UCA1IRRCTL

UCA1IE

08h

0Ah

0Ch

0Eh

10h

USCI receive buffer

USCI transmit buffer

USCI LIN control

USCI IrDA transmit control

USCI IrDA receive control

USCI interrupt enable

USCI interrupt flags

USCI interrupt vector word

12h

13h

1Ch

1Dh

1Eh

UCA1IFG

UCA1IV

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Table 9-69. USCI_B1 Registers (Base Address: 0620h)

REGISTER DESCRIPTION

REGISTER

UCB1CTL0

UCB1CTL1

UCB1BR0

UCB1BR1

UCB1STAT

UCB1RXBUF

UCB1TXBUF

UCB1I2COA

UCB1I2CSA

UCB1IE

OFFSET

00h

USCI synchronous control 0

USCI synchronous control 1

USCI synchronous bit rate 0

USCI synchronous bit rate 1

USCI synchronous status

01h

06h

07h

0Ah

0Ch

0Eh

10h

USCI synchronous receive buffer

USCI synchronous transmit buffer

USCI I2C own address

USCI I2C slave address

USCI interrupt enable

12h

1Ch

1Dh

1Eh

USCI interrupt flags

UCB1IFG

USCI interrupt vector word

UCB1IV

Table 9-70. DAC12_A Registers (Base Address: 0780h)

REGISTER DESCRIPTION

REGISTER

DAC12_0CTL0

DAC12_0CTL1

DAC12_0DAT

OFFSET

00h

DAC12_A channel 0 control 0

DAC12_A channel 0 control 1

DAC12_A channel 0 data

02h

04h

DAC12_A channel 0 calibration control

DAC12_A channel 0 calibration data

DAC12_A channel 1 control 0

DAC12_A channel 1 control 1

DAC12_A channel 1 data

DAC12_0CALCTL

DAC12_0CALDAT

DAC12_1CTL0

DAC12_1CTL1

DAC12_1DAT

06h

08h

10h

12h

14h

DAC12_A channel 1 calibration control

DAC12_A channel 1 calibration data

DAC12_A interrupt vector word

DAC12_1CALCTL

DAC12_1CALDAT

DAC12IV

16h

18h

1Eh

Table 9-71. Comparator_B Registers (Base Address: 08C0h)

REGISTER DESCRIPTION

REGISTER

CBCTL0

CBCTL1

CBCTL2

CBCTL3

CBINT

OFFSET

00h

Comp_B control 0

Comp_B control 1

Comp_B control 2

Comp_B control 3

Comp_B interrupt

02h

04h

06h

0Ch

Comp_B interrupt vector word

CBIV

0Eh

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Table 9-72. USB Configuration Registers (Base Address: 0900h)

REGISTER DESCRIPTION

REGISTER

USBKEYID

USBCNF

OFFSET

USB key/ID

00h

02h

04h

08h

0Ah

10h

12h

14h

USB module configuration

USB PHY control

USBPHYCTL

USBPWRCTL

USBPWRVSR

USBPLLCTL

USBPLLDIV

USBPLLIR

USB power control

USB power voltage setting

USB PLL control

USB PLL divider

USB PLL interrupts

Table 9-73. USB Control Registers (Base Address: 0920h)

REGISTER DESCRIPTION

REGISTER

USBIEPCNF_0

USBIEPBCNT_0

USBOEPCNFG_0

USBOEPBCNT_0

USBIEPIE

OFFSET

00h

Input endpoint_0 configuration

Input endpoint_0 byte count

Output endpoint_0 configuration

Output endpoint_0 byte count

Input endpoint interrupt enables

Output endpoint interrupt enables

Input endpoint interrupt flags

Output endpoint interrupt flags

USB interrupt vector

01h

02h

03h

0Eh

0Fh

10h

USBOEPIE

USBIEPIFG

USBOEPIFG

USBIV

11h

12h

USB maintenance

USBMAINT

USBTSREG

USBFN

16h

Time stamp

18h

USB frame number

1Ah

1Ch

1Dh

1Eh

1Fh

USB control

USBCTL

USB interrupt enables

USB interrupt flags

USBIE

USBIFG

Function address

USBFUNADR

Table 9-74. LDO and Port U Configuration Registers (Base Address: 0900h)

REGISTER DESCRIPTION

REGISTER

LDOKEYPID

PUCTL

OFFSET

00h

LDO key and ID

PU port control

04h

LDO power control

LDOPWRCTL

08h

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Table 9-75. LCD_B Registers (Base Address: 0A00h)

REGISTER DESCRIPTION

REGISTER

OFFSET

000h

002h

004h

006h

008h

00Ah

00Ch

00Eh

012h

01Eh

020h

021h

⋮

LCD_B control 0

LCDBCTL0

LCDBCTL1

LCDBBLKCTL

LCDBMEMCTL

LCDBVCTL

LCDBPCTL0

LCDBPCTL1

LCDBPCTL2

LCDBCTL0

LCDBIV

LCD_B control 1

LCD_B blinking control

LCD_B memory control

LCD_B voltage control

LCD_B port control 0

LCD_B port control 1

LCD_B port control 2

LCD_B charge pump control

LCD_B interrupt vector word

LCD_B memory 1

LCDM1

LCD_B memory 2

LCDM2

⋮

LCD_B memory 22

LCD_B blinking memory 1

LCD_B blinking memory 2

⋮

LCDM22

035h

040h

041h

⋮

LCDBM1

LCDBM2

⋮

LCD_B blinking memory 22

LCDBM22

055h

Table 9-76. CTSD16 Registers (Base Address: 0A80h)

REGISTER DESCRIPTION

REGISTER

CTSD16CTL

CTSD16CCTL0

CTSD16INCTL0

CTSD16PRE0

CTSD16IFG

CTSD16IE

OFFSET

00h

CTSD16 control

CTSD16 channel 0 control

02h

CTSD16 channel 0 input control

CTSD16 channel 0 preload

CTSD16 interrupt flag

04h

06h

2Ch

2Eh

30h

CTSD16 interrupt enable

CTSD16 interrupt vector

CTSD16IV

CTSD16 channel 0 conversion memory

CTSD16MEM0

32h

Table 9-77. OA0 Registers (Base Address: 0AE0h)

REGISTER DESCRIPTION

REGISTER

OA0CTL0

OA0PSW

OA0NSW

OA0GSW

OFFSET

00h

OA0 control 0

OA0 positive input terminal switches

OA0 negative input terminal switches

OA0 ground switches

02h

04h

0Eh

Table 9-78. OA1 Registers (Base Address: 0AF0h)

REGISTER DESCRIPTION

REGISTER

OA1CTL0

OA1PSW

OA1NSW

OA1GSW

OFFSET

00h

OA1 control 0

OA1 positive input terminal switches

OA1 negative input terminal switches

OA1 ground switches

02h

04h

0Eh

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9.16 Identification

9.16.1 Revision Identification

The device revision information is shown as part of the top-side marking on the device package. The device-

specific errata sheet describes these markings. For links to all of the errata sheets for the devices in this data

sheet, see Section 11.4.

The hardware revision is also stored in the Device Descriptor structure in the Info Block section. For details on

this value, see the "Hardware Revision" entries in Section 9.14.

9.16.2 Device Identification

The device type can be identified from the top-side marking on the device package. The device-specific errata

sheet describes these markings. For links to all of the errata sheets for the devices in this data sheet, see

Section 11.4.

A device identification value is also stored in the Device Descriptor structure in the Info Block section. For details

on this value, see the "Device ID" entries in Section 9.14.

9.16.3 JTAG Identification

Programming through the JTAG interface, including reading and identifying the JTAG ID, is described in detail in

the MSP430 Programming With the JTAG Interface.

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10 Applications, Implementation, and Layout

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes. Customers should validate and test their design

implementation to confirm system functionality.

10.1 Device Connection and Layout Fundamentals

This section discusses the recommended guidelines when designing with the MSP430. These guidelines are to

make sure that the device has proper connections for powering, programming, debugging, and optimum analog

performance.

10.1.1 Power Supply Decoupling and Bulk Capacitors

TI recommends connecting a combination of a 1-µF plus a 100-nF low-ESR ceramic decoupling capacitor to

each AVCC and DVCC pin. Higher-value capacitors may be used but can impact supply rail ramp-up time.

Decoupling capacitors must be placed as close as possible to the pins that they decouple (within a few

millimeters). Additionally, separated grounds with a single-point connection are recommend for better noise

isolation from digital to analog circuits on the board and are especially recommended to achieve high analog

accuracy.

DVCC

Digital

Power Supply

Decoupling

+

1 µF

100 nF

DVSS

AVCC

Analog

Power Supply

Decoupling

+

1 µF

AVSS

Figure 10-1. Power Supply Decoupling

10.1.2 External Oscillator

Depending on the device variant (see Section 6), the device can support a low-frequency crystal (32 kHz) on the

XT1 pins, a high-frequency crystal on the XT2 pins, or both. External bypass capacitors for the crystal oscillator

pins are required.

It is also possible to apply digital clock signals to the XIN and XT2IN input pins that meet the specifications of the

respective oscillator if the appropriate XT1BYPASS or XT2BYPASS mode is selected. In this case, the

associated XOUT and XT2OUT pins can be used for other purposes. If they are left unused, they must be

terminated according to Table 7-4.

Figure 10-2 shows a typical connection diagram.

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XIN

or

XOUT

or

XT2IN

XT2OUT

C_L1

C_L2

Figure 10-2. Typical Crystal Connection

See MSP430 32-kHz Crystal Oscillators for more information on selecting, testing, and designing a crystal

oscillator with the MSP430 devices.

10.1.3 JTAG

With the proper connections, the debugger and a hardware JTAG interface (such as the MSP-FET or MSP-

FET430UIF) can be used to program and debug code on the target board. In addition, the connections also

support the MSP-GANG production programmers, thus providing an easy way to program prototype boards, if

desired. Figure 10-3 shows the connections between the 14-pin JTAG connector and the target device required

to support in-system programming and debugging for 4-wire JTAG communication. Figure 10-4 shows the

connections for 2-wire JTAG mode (Spy-Bi-Wire).

The connections for the MSP-FET and MSP-FET430UIF interface modules and the MSP-GANG are identical.

Both can supply VCC to the target board (through pin 2). In addition, the MSP-FET and MSP-FET430UIF

interface modules and MSP-GANG have a VCC sense feature that, if used, requires an alternate connection (pin

4 instead of pin 2). The VCC-sense feature senses the local VCC present on the target board (that is, a battery

or other local power supply) and adjusts the output signals accordingly. Figure 10-3 and Figure 10-4 show a

jumper block that supports both scenarios of supplying VCC to the target board. If this flexibility is not required,

the desired VCC connections may be hard-wired to eliminate the jumper block. Pins 2 and 4 must not be

connected at the same time.

For additional design information regarding the JTAG interface, see the MSP430 Hardware Tools User’s Guide.

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V_CC

Important to connect

MSP430FGxxxx

AVCC/DVCC

J1 (see Note A)

J2 (see Note A)

C2

10 µF

C3

0.1 µF

R1

47 kW

JTAG

RST/NMI/SBWTDIO

VCC TOOL

TDO/TDI

TDI

TDO/TDI

TDI

2

1

VCC TARGET

4

3

TMS

6

5

7

TEST

TCK

8

TCK

GND

RST

10

12

14

9

11

13

TEST/SBWTCK

AVSS/DVSS

C1

2.2 nF

See Note B

A. If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used, make connection

J2.

B. The upper limit for C1 is 2.2 nF when using current TI tools.

Figure 10-3. Signal Connections for 4-Wire JTAG Communication

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V_CC

Important to connect

MSP430FGxxxx

J1 (see Note A)

J2 (see Note A)

AVCC/DVCC

C2

10 µF

C3

0.1 µF

R1

47 kΩ

See Note B

JTAG

VCC TOOL

TDO/TDI

2

1

3

5

7

9

RST/NMI/SBWTDIO

VCC TARGET

4

6

TCK

8

GND

10

12

14

11

13

TEST/SBWTCK

AVSS/DVSS

C1

2.2 nF

See Note B

A. Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the debug or

programming adapter.

B. The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during JTAG access, and any

capacitance that is attached to this signal may affect the ability to establish a connection with the device. The upper limit for C1 is 2.2 nF

when using current TI tools.

Figure 10-4. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire)

10.1.4 Reset

The reset pin can be configured as a reset function (default) or as an NMI function in the Special Function

Register (SFR), SFRRPCR.

In reset mode, the RST/NMI pin is active low, and a pulse applied to this pin that meets the reset timing

specifications generates a BOR-type device reset.

Setting SYSNMI causes the RST/NMI pin to be configured as an external NMI source. The external NMI is edge

sensitive, and its edge is selectable by SYSNMIIES. Setting the NMIIE enables the interrupt of the external NMI.

When an external NMI event occurs, the NMIIFG is set.

The RST/NMI pin can have either a pullup or pulldown that is enabled or not. SYSRSTUP selects either pullup or

pulldown, and SYSRSTRE causes the pullup (default) or pulldown to be enabled (default) or not. If the RST/NMI

pin is unused, it is required either to select and enable the internal pullup or to connect an external 47-kΩ pullup

resistor to the RST/NMI pin with a 2.2-nF pulldown capacitor. The pulldown capacitor should not exceed 2.2 nF

when using devices with Spy-Bi-Wire interface in Spy-Bi-Wire mode or in 4-wire JTAG mode with TI tools like

FET interfaces or GANG programmers.

See the MSP430F5xx and MSP430F6xx Family User's Guide for more information on the referenced control

registers and bits.

10.1.5 Unused Pins

For details on the connection of unused pins, see Section 7.6.

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10.1.6 General Layout Recommendations

•

Proper grounding and short traces for external crystal to reduce parasitic capacitance. See MSP430 32-kHz

Crystal Oscillators for recommended layout guidelines.

•

Proper bypass capacitors on DVCC, AVCC, and reference pins if used.

Avoid routing any high-frequency signal close to an analog signal line. For example, keep digital switching

signals such as PWM or JTAG signals away from the oscillator circuit.

•

Proper ESD level protection should be considered to protect the device from unintended high-voltage

electrostatic discharge. See MSP430 System-Level ESD Considerations for guidelines.

10.1.7 Do's and Don'ts

TI recommends powering AVCC and DVCC pins from the same source. At a minimum, during power up, power

down, and device operation, the voltage difference between AVCC and DVCC must not exceed the limits

specified in Section 8.1. Exceeding the specified limits may cause malfunction of the device including erroneous

writes to RAM and flash.

10.2 Peripheral- and Interface-Specific Design Information

10.2.1 CTSD16 Peripheral

For internal connections between signal chain modules such as CTSD16, OA, and DAC12, see Section 9.12.16.

When internal connections are available, they should be chosen over external connections to reduce noise and

save pins.

Solid decoupling on both the digital and analog supplies is also required (best with two capacitors, one 1 µF and

one 100 nF [see Section 10.1.1]).

V_REFBG/V_eREF+

(see Note A)

1 nF

CPCAP

(see Note B)

22 nF

AVSS

A. The capacitor reduces noise when using internal V_REFBGsetting. This pin is also used for the external reference input for the CTSD16 or

DAC, and when doing so the capacitor is not needed. Because of the shared signal path and pin, the internal and external references

(V_REFBGand V_eREF+, respectively) cannot be used at the same time.

B. The capacitor on CPCAP is required when the charge pump is enabled. The charge pump can be enabled by rail-to-rail operation of the

CTSD16 or by the OA module. See the register settings for each module in the MSP430F5xx and MSP430F6xx Family User's Guide for

enabling this operation.

Figure 10-5. CTSD16 Partial Schematic

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10.2.1.1 Example Measurement Schematic – Differential Input

V_m

<10 kHz

RC filter

R₁

(see Note A)

CTSD16

AD0+

R₂

V_in

AD0–

R₁

A. TI recommends an external RC antialiasing low-pass filter for the CTSD16 to prevent aliasing of the input signal. The cutoff frequency

should be <10 kHz for a 1-MHz modulator clock and OSR = 256. The cutoff frequency may be set to a lower frequency for applications

that have lower bandwidth requirements. It is up to the user to determine the configuration and type of low-pass filter used.

Figure 10-6. CTSD16 Measurement Schematic – Differential Input

10.2.1.2 Example Measurement Schematic – Single-Ended Input

V_m

<10 kHz

RC filter

R₁

A0 or

AD0+

(see Note A)

CTSD16

R₂

AD0–

V_REFBG/V_eREF+

A. TI recommends an external RC antialiasing low-pass filter for the CTSD16 to prevent aliasing of the input signal. The cutoff frequency

should be <10 kHz for a 1-MHz modulator clock and OSR = 256. The cutoff frequency may be set to a lower frequency for applications

that have lower bandwidth requirements. It is up to the user to determine the configuration and type of low-pass filter used.

Figure 10-7. CTSD16 Measurement Schematic – Single-Ended Input

10.2.1.3 Design Requirements

As with any high-resolution ADC, appropriate printed circuit board layout and grounding techniques should be

followed to eliminate ground loops, unwanted parasitic effects, and noise.

Ground loops are formed when return current from the ADC flows through paths that are common with other

analog or digital circuitry. If care is not taken, this current can generate small unwanted offset voltages that can

add to or subtract from the reference or input voltages of the ADC. Therefore, solid decoupling on both the digital

and analog supplies is required (best with two capacitors, one 1 µF and one 100 nF [see Section 10.1.1]).

In addition to grounding, ripple and noise spikes on the power-supply lines due to digital switching or switching

power supplies can corrupt the conversion result. TI recommends a noise-free design using separate analog and

digital ground planes with a single-point connection to achieve high accuracy.

If the internal reference is used, the reference voltage should be buffered externally by connecting a small

(approximately 1 nF) capacitor to the VREFBG pin to reduce the noise on the reference.

The CTSD16 has a fixed 1.024-MHz clock (f_M). Fault flags for this oscillator are described in the CTSD16 and

UCS section of the MSP430F5xx and MSP430F6xx Family User's Guide.

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Rail-to-rail operation mode is available when the OA module is used to buffer the CTSD16 inputs. For more

information, see the CTSD16 and the OA modules in the MSP430F5xx and MSP430F6xx Family User's Guide.

10.2.1.4 Detailed Design Procedure

10.2.1.4.1 OSR and Sampling Frequency

A simple equation guides the relationship between effective sampling frequency and oversampling ratio (OSR)

for CTSD16.

f

m

f =

s

OSR

(2)

Where

•

f_s= effective sampling frequency

f_m= modulation frequency

For the CTSD16, the modulation frequency is set to 1.024 MHz. Using Equation 2 with an example OSR of 256,

the effective sampling frequency would be 4 kHz. The OSR value also affects the number of bits in the digital

filter output. See the CTSD16 chapter in the MSP430F5xx and MSP430F6xx Family User's Guide for additional

information and available OSR values.

10.2.1.4.2 Differential Input Range Explanation

The following equations can give guidance on the input range for the CTSD16 while using an external reference.

Keep in mind the absolute bounds of an external reference as mentioned in the specifications section of this

module. The external and internal references cannot be used at the same time, because they share the same

signal path and pin. For internal reference ranges, see Section 8.8.11.

+V

R

V

=

FSR+

GAIN

(3)

(4)

–V

R

V

=

FSR–

GAIN

V

R

Full-Scale Range = V

FSR+

– V = 2 ×

FSR–

GAIN

(5)

(6)

V

= 0.8 V

FSR–

to 0.8 V , with externally sourced V

FSR+ R

ID

Where

•

V_FSRis the full-scale range voltage

V_IDis the differential input voltage

V_Ris the reference voltage

The differential input voltage range with internal voltage reference at different GAIN settings is given in Section

8.8.11. Using Equation 3 through Equation 6, determine the absolute maximum differential input ranges for the

CTSD16 with a given external voltage reference. Equation 7 corresponds to the example circuit in Figure 10-6

and can be used after a range is chosen to limit differential input voltage to acceptable levels by solving for the

external resistors R1 and R2.

R

1

2

V

= V

×

in

m

R

+ 2R

1

eff

2

1 +

2R

in

(7)

Where

•

R_eff= (R₂× 2R₁) / ((R₂+ 2R₁)

V_inis the differential voltage input to CTSD16

V_mis the voltage to measure

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•

R_inis the internal resistance of the CTSD16 (see Section 8.8.11)

10.2.1.4.3 Single-Ended Input Mode

The CTSD16 has six single-ended analog inputs and four differential inputs that can be placed in single-ended

mode by the CTSDINCHx bits in the CTSD16INCTLx registers. These single-ended modes use the fully

differential path of the CTSD16 by internally tying the negative input to the V_REFBG/V_eREF+signal. This means for

the differential inputs in single-ended mode, the external pin normally tied to the negative input can be used for

its alternate functions. Equation 8 through Equation 11 apply for full-scale range while in single-ended mode.

V

R

V

= V

+

FSR+

R

GAIN

(8)

(9)

V

R

V

= V

–

FSR–

R

GAIN

æ

ç

è

V

ö

÷

ø

æ

ç

è

V

ö

÷

ø

V

R

Full-Scale Range = V

– V

FSR–

=

V

+

–

V –

R

= 2 ×

FSR+

R

GAIN

(10)

(11)

æ

ç

è

V

ö

æ

ç

è

V

ö

÷

ø

R

V = V – 0.8 ×

R

to V + 0.8 ×

R

÷

I

GAIN

ø

Where

•

V_FSRis the full-scale range voltage

V_Iis the single-ended input voltage range for data-sheet specified performance

V_Ris the reference voltage

To ensure the measured voltage is within the single-ended voltage range, a simple voltage divider circuit can be

used to condition the desired input signal. In single-ended mode, additional error may be introduced by noise

when compared to a fully differential measurement. Equation 12 corresponds to the example circuit in Figure

10-7 and can be used after a range is chosen to limit differential input voltage to acceptable levels by solving for

the external resistors R1 and R2.

R

2

V

= V

×

in

m

R

+ R

2

1

(12)

Where

•

V_inis the single-ended voltage input to CTSD16

V_mis the voltage to measure

10.2.1.4.4 Offset Calibration

In some applications, it is necessary to calibrate the module for offset error. This module allows an easy way to

do this by providing internal connections from input to VREF or DAC0. To short AD4+ and AD4- to VREF or

DAC0, change the CTSD16INCHx setting for each channel to 0x11 for VREF and 0x12 for DAC0. This allows

calibration of the CTSD16 input stage by what is measured from the ideal value. The total signal chain offset

depends on the impedance of the external circuitry; thus, the actual offset seen at any of the analog inputs may

be different.

10.2.1.5 Layout Guidelines

Components that are shown in the partial schematic (see Figure 10-5) should be placed as close as possible to

the respective device pins. Avoid long traces, because they add additional parasitic capacitance, inductance,

and resistance on the signal.

Avoid routing analog input signals close to a high-frequency pin (for example, a high-frequency PWM), because

the high-frequency switching can be coupled into the analog signal.

The analog differential input signals must be routed closely together to minimize the effect of noise on the

resulting signal.

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10.2.2 Operational Amplifier With Ground Switches Peripheral

For internal connections between signal chain modules such as CTSD16, OA, and DAC12, see Section 9.12.16.

When internal connections are available, they should be chosen over external connections to reduce noise and

save pins.

Solid decoupling on both the digital and analog supplies is also required (best with two capacitors, one 1 µF and

one 100 nF [see Section 10.1.1]).

10.2.2.1 Reference Schematic

CPCAP

(see Note A)

22 nF

AVSS

A. The capacitor on CPCAP is required when the charge pump is enabled. The charge pump can be enabled by rail-to-rail operation of the

PGA buffers of the CTSD16 or by the OA module. See the register settings for each module in the MSP430F5xx and MSP430F6xx

Family User's Guide for enabling this operation.

Figure 10-8. Op Amp Partial Schematic

10.2.2.2 Design Requirements

As with any analog signals, appropriate printed-circuit-board layout and grounding techniques should be

followed to eliminate ground loops, unwanted parasitic effects, and noise.

In addition to grounding, ripple and noise spikes on the power-supply lines due to digital switching or switching

power supplies can corrupt the signal. TI recommends a noise-free design using separate analog and digital

ground planes with a single-point connection to achieve high accuracy. For more information about noise and its

effects on op amps, see Noise Analysis in Operational Amplifiers.

Rail-to-rail operation mode is available with the OA module at the cost of increased current. This should be used

when OA input is near the AVCC rail. See the V_CMspecification (see Section 8.8.14) to see if rail-to-rail

operation is required for your application. For more information, see the OA chapter of the MSP430F5xx and

MSP430F6xx Family User's Guide.

Ground switches are also available for use. See Section 9.12.16 for connections. These ground switches

provide a low-ohmic connection to ground to both internal connections and to the external pin. When a ground

switch is active, the Digital I/O logic for the corresponding pin is ignored.

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10.2.2.3 Detailed Design Procedure

Operational amplifiers are a diverse and useful tool in many applications. Some common configurations that

might prove to be useful to the user are transimpedance amplifiers to convert currents to voltage, voltage-gain

amplifiers, and buffering configurations. For more information about how to design these circuits along with other

common configurations, see the following documents.

•

Op Amps for Everyone (ISBN: 978-0128116487)

Handbook of Operational Amplifier Applications

Understanding Basic Analog – Ideal Op Amps

An Applications Guide for Op Amps

10.2.2.4 Layout Guidelines

Components that are shown in the partial schematic (see Figure 10-8) should be placed as close as possible to

the respective device pins. Avoid long traces, because they add additional parasitic capacitance, inductance,

and resistance on the signal. Avoid routing analog input signals close to a high-frequency pin (for example, a

high-frequency PWM), because the high-frequency switching can be coupled into the analog signal. When

possible, use internal connections to other modules to limit the potential of error introduction.

10.2.3 RTC_B With Battery Backup System

If not using a separate battery backup supply in the system, see Section 7.6 for VBAT and VBAK connections.

10.2.3.1 Partial Schematic

C_BAK

VBAK

–

+

VBAT

BAT

(see Note A)

A. BAT can be a battery or super-capacitor. See Section 8.8.8 for specifications.

Figure 10-9. RTC_B With Battery Backup Partial Schematic

10.2.3.2 Retaining an Accurate Real-Time Clock (RTC) Through Main Supply Interrupts

The RTC_B module with Battery Backup System is designed to keep an accurate RTC during main supply

interruptions and during low-power modes. For more details on when the Backup Battery System engages, see

the Battery Backup System chapter in the MSP430F5xx and MSP430F6xx Family User's Guide. See Using the

MSP430 RTC_B Module With Battery Backup Supply for more information and example code on how to keep an

accurate RTC through power loss.

10.2.3.3 Charging Super-Capacitors With Built-In Resistive Charger

In applications that use a super-capacitor instead of a battery for secondary supply, the charging circuit

functionality of the Battery Backup System can be used to charge the super-capacitor. The resistive charger

circuit connects VBAT to DVCC with selectable resistor values found in Section 8.8.8. This means that if DVCC

is not present, you cannot use this feature to charge a super-capacitor connected to VBAT. The CTSD16 module

can be used to sense the voltage level on VBAT divided by a factor of three. Typical values during VBAT sensing

are listed in Section 8.8.8. Channel A8 of the CTSD16 is routed internally for this. See the CTSD16 chapter of

the MSP430F5xx and MSP430F6xx Family User's Guide for more information. The BAKADC bit in the BAKCTL

register must also be enabled for this feature to operate. Additionally, RTC interrupts can be used to wake up

from LPMx.5 states to charge the super-capacitor. While in an LPMx.5 state, the super-capacitor on VBAT

drains. This means that the "wakeup to charge" interrupt interval must be designed so that charging starts before

the leftover charge in the super-capacitor is too small to accommodate the worst-case backup time if the system

were to suddenly lose power. To estimate this time, use Equation 13 for capacitor discharge in an RC circuit.

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–t

V(t) = V_Oe^RC

(13)

Where

•

V_O= initial voltage of capacitor

t = time

R = circuit resistance

C = capacitance

Because the operational current is given for when RTC is operating within the specifications section, R can be

replaced with V_O/I_LPM3.5by Ohm's law. By setting V(t) to the minimum voltage for RTC operation while in backup

supply, V_Oas voltage of capacitor when fully charged, and C as the super-capacitor capacitance, the estimated

RTC operation time can be calculated. If periodic wakeups from LPM3.5 are not desirable for a given application,

external means of charging the super-capacitor must be implemented by the user.

For a detailed list of when the secondary supply VBAT powers the backup-supplied subsystem, see the Battery

Backup System chapter in the MSP430F5xx and MSP430F6xx Family User's Guide.

10.2.4 LCD_B Peripheral

10.2.4.1 Partial Schematic

Required LCD connections greatly vary by the type of display that is used (static or multiplexed), whether

external or internal biasing is used, and also whether the on-chip charge pump is employed. For any display

used, there is flexibility as to how the segment (Sx) and common (COMx) signals are connected to the MCU

which (assuming that the correct choices are made) can be advantageous for the PCB layout and for the design

of the application software.

Because LCD connections are application specific, it is difficult to provide a single one-fits-all schematic.

However for an example of a schematic using the LCD_B module with an MSP430F6638, see the Ultra Low

Power Blood Pressure And Heart Rate Monitor Reference Design.

10.2.4.2 Design Requirements

Due to the flexibility of the LCD_B peripheral module to accommodate various segment-based LCDs, selecting

the right display for the application in combination with determining specific design requirements is often an

iterative process. There can be well-defined requirements in terms of how many individually addressable LCD

segments need to be controlled, what the requirements for LCD contrast are, which device pins are available for

LCD use and which are required by other application functions, and what the power budget is, to name just a

few. TI strongly recommends reviewing the LCD_B peripheral module chapter in the MSP430F5xx and

MSP430F6xx Family User's Guide during the initial design requirements and decision process. The following

table provides a brief overview over different choices that can be made and their impact.

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OPTION OR FEATURE

IMPACT OR USE CASE

•

Enable displays with more segments

Use fewer device pins

LCD contrast decreases as mux level increases

Power consumption increases with mux level

Requires multiple intermediate bias voltages

Multiplexed LCD

•

Limited number of segments that can be addressed

Use a relatively large number of device pins

Use the least amount of power

Static LCD

Use only V_CCand GND to drive LCD signals

•

Simpler solution – no external circuitry

Independent of V_LCDsource

Internal Bias Generation

Somewhat higher power consumption

•

Requires external resistor ladder divider

Resistor size depends on display

Ability to adjust drive strength to optimize tradeoff between power consumption and good drive of large

segments (high capacitive load)

External Bias Generation

Internal Charge Pump

•

External resistor ladder divider can be stabilized through capacitors to reduce ripple

Helps ensure a constant level of contrast despite decaying supply voltage conditions (battery-powered

applications)

•

Programmable voltage levels allow software-driven contrast control

Requires an external capacitor on the LCDCAP pin

Higher current consumption than simply using V_CCfor the LCD driver

10.2.4.3 Detailed Design Procedure

A major component in designing the LCD solution is determining the exact connections between the LCD_B

peripheral module and the display itself. Two basic design processes can be employed for this step, although in

reality often a balanced co-design approach is necessary:

•

PCB layout-driven design

Software-driven design

In the PCB layout-driven design process, the segment Sx and common COMx signals are connected to

respective MSP430 device pins so that the routing of the PCB can be optimized to minimize signal crossings and

to keep signals on one side of the PCB only, typically the top layer. For example, using a multiplexed LCD, it is

possible to arbitrarily connect the Sx and COMx signals between the LCD and the MSP430 device as long as

segment lines are swapped with segment lines and common lines are swapped with common lines. It is also

possible to not contiguously connect all segment lines but rather skip LCD_B module segment connections to

optimize layout or to allow access to other functions that may be multiplexed on a particular device port pin.

Employing a purely layout-driven design approach, however, can result in the LCD_B module control bits that

are responsible for turning on and off segments to appear scattered throughout the memory map of the LCD

controller (LCDMx registers). This approach potentially places a rather large burden on the software design that

may also result in increased energy consumption due to the computational overhead required to work with the

LCD.

The other extreme is a purely software-driven approach that starts with the idea that control bits for LCD

segments that are frequently turned on and off together should be co-located in memory in the same LCDMx

register or in adjacent registers. For example, in case of a 4-mux display that contains several 7‑segment digits,

from a software perspective it can be very desirable to control all 7 segments of each digit though a single byte-

wide access to an LCDMx register. And consecutive segments are mapped to consecutive LCDMx registers.

This allows use of simple look-up tables or software loops to output numbers on an LCD, reducing computational

overhead and optimizing the energy consumption of an application. Establishing the most convenient memory

layout must be performed in conjunction with the specific LCD that is being used to understand its design

constraints in terms of which segment and which common signals are connected to, for example, a digit.

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For design information regarding the LCD controller input voltage selection including internal and external

options, contrast control, and bias generation, refer to the LCD_B controller chapter in the MSP430F5xx and

MSP430F6xx Family User's Guide.

For additional design information, see Designing With MSP430 and Segment LCD.

10.2.4.4 Layout Guidelines

LCD segment (Sx) and common (COMx) signal traces are continuously switching while the LCD is enabled and

should, therefore, be kept away from sensitive analog signals such as ADC inputs to prevent any noise coupling.

TI recommends keeping the LCD signal traces on one side of the PCB grouped together in a bus-like fashion. A

ground plane underneath the LCD traces and guard traces employed alongside the LCD traces can provide

shielding.

If the internal charge pump of the LCD module is used, the externally provided capacitor on the LCDCAP pin

should be located as close as possible to the MCU. The capacitor should be connected to the device using a

short and direct trace and also have a solid connection to the ground plane that is supplying the V_SSpins of the

MCU.

For an example layout of the LCD_B module with an MSP430F6638, see the Ultra Low Power Blood Pressure

And Heart Rate Monitor reference design.

10.2.5 DAC12 Peripheral

For internal connections between signal chain modules such as CTSD16, OA, and DAC12, see Section 9.12.16.

When available, internal connections should be chosen over external ones to reduce noise and save pins.

Solid decoupling on both the digital and analog supplies is required (best with two capacitors per supply, one

1 µF and one 100 nF [see Section 10.1.1]).

10.2.5.1 Partial Schematic

V_REFBG/V_eREF+

(see Note)

1 nF

AVSS

A. The capacitor is used to reduce noise when using internal VREFBG setting. This pin is also used for the external reference input for the

CTSD16 or DAC. When using the external reference, the capacitor is not needed. Because of the shared signal path and pin, the internal

and external references (V_REFBGand V_eREF+, respectively) cannot be used at the same time.

Figure 10-10. DAC12 Partial Schematic

10.2.5.2 Design Requirements

As with any analog signals, appropriate printed-circuit-board layout and grounding techniques must be followed

to eliminate ground loops, unwanted parasitic effects, and noise.

In addition to grounding, ripple and noise spikes on the power-supply lines due to digital switching or switching

power supplies can corrupt the signal. TI recommends a noise-free design using separate analog and digital

ground planes with a single-point connection to achieve high accuracy.

10.2.5.3 Detailed Design Procedure

Digital-to-analog converters (DACs) can be used in a variety of applications and configurations. This section

provides some resources for the user to help get started in a design. For details on example DAC applications,

see Bridging the Divide: a DAC Applications Tutorial (Precision Signal Path).

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Some DAC applications may need an output buffer to reduce the affect of a load on the DAC output. This buffer

can be an external op amp or, on some MSP430 devices, the integrated op amp can be used. For more

information on how to configure an op amp for this function, see Section 10.2.2.

For more information about DAC applications, see the following application notes:

Digital-to-Analog High-Speed Data Converters Basics

Design for a Wideband Differential Transimpedance DAC Output

10.2.5.4 Layout Guidelines

Application circuits attached to the DAC output should be placed as close as possible to the respective device

pins. Avoid long traces because they add additional parasitic capacitance, inductance, and resistance on the

signal. Avoid routing analog signals close to a high-frequency pin (for example, a high-frequency PWM) because

the high-frequency switching can be coupled into the analog signal. When possible, use internal connections to

other modules to limit the potential of error introduction.

10.2.6 USB Module

See the following resources for help with USB design. The application notes contain hardware, software, and

application guides and implementations.

Starting a USB Design Using MSP430 MCUs

USB Field Firmware Updates on MSP430 MCUs

MSP430 USB Developers Package

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10.2.7 LDO Module

Solid decoupling on both the digital and analog supplies is required (best with two capacitors per supply, one

1 µF and one 100 nF [see Section 10.1.1]).

The LDO module is in its own power domain on chip (separate from DVCC). To use the Port U pins (PU.0 and

PU.1) this domain must be powered. If use of the Port U pins is needed and no voltage is supplied to LDOI, then

a 3.3-V supply to LDOO is needed. LDOO can act as an input only when the 3.3-V LDO is not enabled. When

the 3.3-V LDO is not needed in applications, keep LDOI tied low to make sure that the LDO module does not

draw excessive current when disabled.

10.2.7.1 Partial Schematic

LDOI

5 V

4.7 µF

LDOO

VSSU

220 nF

DVCC

(see Note)

A. Connection between LDOO and DVCC is optional. If connected, the LDO powers the device. LDOO can also supply other subsystems in

the application if the maximum output current for the LDO is not exceeded (see the LDO power system specifications in Section

8.8.18.1).

Figure 10-11. LDO Partial Schematic

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11 Device and Documentation Support

11.1 Getting Started

For more information on the MSP430^™family of devices and the tools and libraries that are available to help with

your development, visit the MSP430 ultra-low-power sensing & measurement MCUs overview.

11.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP

MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These

prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully

qualified production devices (MSP).

XMS – Experimental device that is not necessarily representative of the final device's electrical specifications

MSP – Fully qualified production device

XMS devices are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated

fully. TI's standard warranty applies.

Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices.

TI recommends that these devices not be used in any production system because their expected end-use failure

rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature

range, package type, and distribution format. Figure 11-1 provides a legend for reading the complete device

name.

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MSP 430 F 5 438 A I PM T -EP

Processor Family

MCU Platform

Device Type

Series

Feature Set

Optional: Additional Features

Optional: Tape and Reel

Packaging

Optional: Temperature Range

Optional: Revision

Processor Family

CC = Embedded RF Radio

MSP = Mixed-Signal Processor

XMS = Experimental Silicon

PMS = Prototype Device

MCU Platform

Device Type

430 = MSP430 low-power microcontroller platform

Memory Type

C = ROM

F = Flash

FR = FRAM

G = Flash

L = No nonvolatile memory

Specialized Application

AFE = Analog front end

BQ = Contactless power

CG = ROM medical

FE = Flash energy meter

FG = Flash medical

FW = Flash electronic flow meter

Series

1 = Up to 8 MHz

2 = Up to 16 MHz

3 = Legacy

4 = Up to 16 MHz with LCD driver

5 = Up to 25 MHz

6 = Up to 25 MHz with LCD driver

0 = Low-voltage series

Feature Set

Various levels of integration within a series

Updated version of the base part number

Optional: Revision

Optional: Temperature Range S = 0°C to 50°C

C = 0°C to 70°C

I = –40°C to 85°C

T = –40°C to 105°C

Packaging

http://www.ti.com/packaging

Optional: Tape and Reel

T = Small reel

R = Large reel

No markings = Tube or tray

Optional: Additional Features -EP = Enhanced product (–40°C to 105°C)

-HT = Extreme temperature parts (–55°C to 150°C)

-Q1 = Automotive Q100 qualified

Figure 11-1. Device Nomenclature

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11.3 Tools and Software

All MSP microcontrollers are supported by a wide variety of software and hardware development tools. Tools are

available from TI and various third parties. See them all at MSP430 ultra-low-power MCUs – Tools & software.

Table 11-1 lists the debug features of the MSP430FG662x and MSP430FG642x MCUs. See the Code

Composer Studio IDE for MSP430 MCUs User's Guide for details on the available features.

Table 11-1. Hardware Debug Features

BREAK-

POINTS

(N)

RANGE

BREAK-

POINTS

LPMx.5

DEBUGGING

SUPPORT

MSP430

ARCHITECTURE

4-WIRE

JTAG

2-WIRE

JTAG

CLOCK

CONTROL

STATE

SEQUENCER

TRACE

BUFFER

EnergyTrace++™

TECHNOLOGY

MSP430Xv2

Yes

8

Yes

No

Design Kits and Evaluation Modules

MSP-TS430PZ100AUSB - 100-pin target development board for MSP430FG6x MCUs

The MSP-TS430PZ100AUSB is a stand-alone 100-pin ZIF socket target board used to program and debug the

MSP430 MCU in system through the JTAG interface or the Spy-Bi-Wire (2-wire JTAG) protocol.

Educational BoosterPack MKII

The Educational BoosterPack MKII offers a high level of integration for developers to quickly prototype complete

solutions. Various analog and digital inputs/outputs are at your disposal including an analog joystick,

environmental and motion sensors, RGB LED, microphone, buzzer, color LCD display, and more.

Software

MSP430Ware^™software

MSP430Ware software is a collection of code examples, data sheets, and other design resources for all

MSP430 devices delivered in a convenient package. In addition to providing a complete collection of existing

MSP430 design resources, MSP430Ware software also includes a high-level API called MSP Driver Library. This

library makes it easy to program MSP430 hardware. MSP430Ware software is available as a component of

Code Composer Studio^™IDE or as a stand-alone package.

MSP430FG662x, MSP430FG642x code examples

C code examples are available for every MSP device that configures each of the integrated peripherals for

various application needs.

MSP Driver Library

The abstracted API of MSP Driver Library provides easy-to-use function calls that free you from directly

manipulating the bits and bytes of the MSP430 hardware. Thorough documentation is delivered through a

helpful API Guide, which includes details on each function call and the recognized parameters. Developers can

use Driver Library functions to write complete projects with minimal overhead.

Capacitive Touch Software Library

Free C libraries for enabling capacitive touch capabilities on MSP430 MCUs. The MSP430 MCU version of the

library features several capacitive touch implementations including the RO and RC method.

MSP EnergyTrace^™Technology

EnergyTrace technology for MSP430 microcontrollers is an energy-based code analysis tool that measures and

displays the energy profile of the application and helps to optimize it for ultra-low-power consumption.

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ULP (Ultra-Low Power) Advisor

ULP Advisor^™software is a tool for guiding developers to write more efficient code to fully use the unique ultra-

low-power features of MSP and MSP432 microcontrollers. Aimed at both experienced and new microcontroller

developers, ULP Advisor checks your code against a thorough ULP checklist to help minimize the energy

consumption of your application. At build time, ULP Advisor provides notifications and remarks to highlight areas

of your code that can be further optimized for lower power.

IEC60730 Software Package

The IEC60730 MSP430 software package helps customers comply with IEC 60730-1:2010 (Automatic Electrical

Controls for Household and Similar Use – Part 1: General Requirements) for up to Class B products, which

includes home appliances, arc detectors, power converters, power tools, e-bikes, and many others. The

IEC60730 MSP430 software package can be embedded in customer applications running on MSP430 MCUs to

help simplify the customer’s certification efforts of functional safety-compliant consumer devices to IEC

60730-1:2010 Class B.

Fixed Point Math Library for MSP

The MSP IQmath and Qmath Libraries are a collection of highly optimized and high-precision mathematical

functions for C programmers to seamlessly port a floating-point algorithm into fixed-point code on MSP430 and

MSP432 MCUs. These routines are typically used in computationally intensive real-time applications where

optimal execution speed, high accuracy, and ultra-low energy are critical. By using the IQmath and Qmath

libraries, it is possible to achieve execution speeds considerably faster and energy consumption considerably

lower than equivalent code written using floating-point math.

Floating Point Math Library for MSP430

Continuing to innovate in the low-power and low-cost microcontroller space, TI provides MSPMATHLIB.

Leveraging the intelligent peripherals of our devices, this floating-point math library of scalar functions that are up

to 26 times faster than the standard MSP430 math functions. Mathlib is easy to integrate into your designs. This

library is free and is integrated in both Code Composer Studio IDE and IAR Embedded Workbench IDE.

Development Tools

Code Composer Studio^™Integrated Development Environment for MSP Microcontrollers

Code Composer Studio integrated development environment (IDE) supports all MSP microcontroller devices.

Code Composer Studio IDE comprises a suite of embedded software utilities used to develop and debug

embedded applications. Code Composer Studio IDE includes an optimizing C/C++ compiler, source code editor,

project build environment, debugger, profiler, and many other features.

Command-Line Programmer

MSP Flasher is an open-source shell-based interface for programming MSP microcontrollers through a FET

programmer or eZ430 using JTAG or Spy-Bi-Wire (SBW) communication. MSP Flasher can download binary

files (.txt or .hex) directly to the MSP microcontroller without an IDE.

Uniflash Standalone Flash Tool for TI Microcontrollers

CCS Uniflash is a standalone tool used to program on-chip flash memory on TI MCUs and on-board flash

memory for Sitara processors. Uniflash has a GUI, command line, and scripting interface. CCS Uniflash is

available free of charge.

MSP-GANG Production Programmer

The MSP Gang Programmer is an MSP430 or MSP432 device programmer that can program up to eight

identical MSP430 or MSP432 flash or FRAM devices at the same time. The MSP Gang Programmer connects to

a host PC using a standard RS-232 or USB connection and provides flexible programming options that let the

user fully customize the process.

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11.4 Documentation Support

The following documents describe the MSP430FG662x and MSP430FG642x MCUs. Copies of these documents

are available on the Internet at www.ti.com.

Receiving Notification of Document Updates

To receive notification of documentation updates—including silicon errata—go to the product folder for your

device on ti.com (for links to the product folders, see Section 11.5). In the upper right corner, click the "Alert me"

button. This registers you to receive a weekly digest of product information that has changed (if any). For change

details, check the revision history of any revised document.

Errata

MSP430FG6626 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430FG6625 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430FG6426 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430FG6425 Device Erratasheet

Describes the known exceptions to the functional specifications.

User's Guides

MSP430F5xx and MSP430F6xx Family User's Guide

Detailed information on the modules and peripherals available in this device family.

MSP430 Flash Device Bootloader (BSL) User's Guide

The MSP430 bootloader (BSL) lets users communicate with embedded memory in the MSP430 microcontroller

during the prototyping phase, final production, and in service. Both the programmable memory (flash memory)

and the data memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap

loader programs found in some digital signal processors (DSPs) that automatically load program code (and data)

from external memory to the internal memory of the DSP.

MSP430 Programming With the JTAG Interface

This document describes the functions that are required to erase, program, and verify the memory module of the

MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. The

document also describes how to program the JTAG access security fuse that is available on all MSP430

devices. This document describes device access using both the standard 4-wire JTAG interface and the 2-wire

JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).

MSP430 Hardware Tools User's Guide

This manual describes the hardware of the TI MSP-FET430 flash emulation tool (FET). The FET is the program

development tool for the MSP430 ultra-low-power microcontroller.

Application Reports

Designing With MSP430 MCUs and Segment LCDs

Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of

applications from smart meters to electronic shelf labels (ESLs) to medical equipment. This application note

helps explain how segmented LCDs work, the different features of the various LCD modules across the MSP430

MCU family, LCD hardware layout tips, guidance on writing efficient and easy-to-use LCD driver software, and

an overview of the portfolio of MSP430 devices that include different LCD features to aid in device selection.

172 Submit Document Feedback

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MSP430FG6626, MSP430FG6625

MSP430FG6426, MSP430FG6425

SLAS874B – MAY 2015 – REVISED SEPTEMBER 2020

www.ti.com

MSP430 32-kHz Crystal Oscillators

Selection of the correct crystal, correct load circuit, and proper board layout are important for a stable crystal

oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the

correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout

are given. The document also contains detailed information on the possible oscillator tests to ensure stable

oscillator operation in mass production.

MSP430 System-Level ESD Considerations

System-level ESD has become increasingly demanding with silicon technology scaling towards lower voltages

and the need for designing cost-effective and ultra-low-power components. This application report addresses

different ESD topics to help board designers and OEMs understand and design robust system-level designs.

Using the MSP430 RTC_B Module With Battery Backup Supply

Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages,

and other events. This application note describes how to use RTC_B with battery backup supply functionality to

retain the time and keep the RTC counting through loss of main power supply and how to reinitialize when the

main power supply is restored.

11.5 Related Links

Table 11-2 lists quick access links. Categories include technical documents, support and community resources,

tools and software, and quick access to sample or buy.

Table 11-2. Related Links

TECHNICAL

DOCUMENTS

TOOLS &

SOFTWARE

SUPPORT &

COMMUNITY

PARTS

PRODUCT FOLDER

ORDER NOW

MSP430FG6626

MSP430FG6625

MSP430FG6426

MSP430FG6425

Click here

11.6 Support Resources

TI E2E^™support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.7 Trademarks

MSP430Ware^™, Microstar Junior^™, Code Composer Studio^™, TI E2E^™, MicroStar Junior^™, MSP430^™,

EnergyTrace^™, ULP Advisor^™, are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.8 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

11.9 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as

defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled

product restricted by other applicable national regulations, received from disclosing party under nondisclosure

obligations (if any), or any direct product of such technology, to any destination to which such export or re-export

Submit Document Feedback 173

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MSP430FG6626, MSP430FG6625

MSP430FG6426, MSP430FG6425

SLAS874B – MAY 2015 – REVISED SEPTEMBER 2020

www.ti.com

is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.

Department of Commerce and other competent Government authorities to the extent required by those laws.

11.10 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

174 Submit Document Feedback

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MSP430FG6626, MSP430FG6625

MSP430FG6426, MSP430FG6425

SLAS874B – MAY 2015 – REVISED SEPTEMBER 2020

www.ti.com

12 Mechanical, Packaging, and Orderable Information

12.1 Packaging Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback 175

Product Folder Links: MSP430FG6626 MSP430FG6625 MSP430FG6426 MSP430FG6425

PACKAGE MATERIALS INFORMATION

www.ti.com

26-Feb-2019

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0

B0

K0

P1

W

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

MSP430FG6425IPZR

LQFP

PZ

100

113

1000

2500

330.0

24.4

16.4

17.0

7.3

17.0

7.3

2.1

1.5

20.0

12.0

24.0

16.0

Q2

Q1

MSP430FG6425IZQWR BGA MI

ZQW

CROSTA

R JUNI

OR

MSP430FG6426IPZR

LQFP

PZ

100

113

1000

2500

330.0

24.4

16.4

17.0

7.3

17.0

7.3

2.1

1.5

20.0

12.0

24.0

16.0

Q2

Q1

MSP430FG6426IZQWR BGA MI

ZQW

CROSTA

R JUNI

OR

MSP430FG6625IPZR

LQFP

PZ

100

113

1000

2500

330.0

24.4

16.4

17.0

7.3

17.0

7.3

2.1

1.5

20.0

12.0

24.0

16.0

Q2

Q1

MSP430FG6625IZQWR BGA MI

ZQW

CROSTA

R JUNI

OR

MSP430FG6626IPZR

LQFP

PZ

100

113

1000

2500

330.0

24.4

16.4

17.0

7.3

17.0

7.3

2.1

1.5

20.0

12.0

24.0

16.0

Q2

Q1

MSP430FG6626IZQWR BGA MI

ZQW

CROSTA

R JUNI

OR

MSP430FG6626IZQWT BGA MI

CROSTA

ZQW

113

250

180.0

16.4

7.3

1.5

12.0

16.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

26-Feb-2019

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0

B0

K0

P1

W

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

R JUNI

OR

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

MSP430FG6425IPZR

LQFP

PZ

100

113

1000

2500

350.0

43.0

MSP430FG6425IZQWR BGA MICROSTAR

JUNIOR

ZQW

MSP430FG6426IPZR

LQFP

PZ

100

113

1000

2500

350.0

43.0

MSP430FG6426IZQWR BGA MICROSTAR

JUNIOR

ZQW

MSP430FG6625IPZR

LQFP

PZ

100

113

1000

2500

350.0

43.0

MSP430FG6625IZQWR BGA MICROSTAR

JUNIOR

ZQW

MSP430FG6626IPZR

LQFP

PZ

100

113

1000

2500

350.0

43.0

MSP430FG6626IZQWR BGA MICROSTAR

JUNIOR

ZQW

MSP430FG6626IZQWT BGA MICROSTAR

JUNIOR

ZQW

113

250

213.0

191.0

55.0

Pack Materials-Page 2

PACKAGE OUTLINE

NFBGA - 1 mm max height

PLASTIC BALL GRID ARRAY

ZCA0113A

A

7.1

6.9

B

BALL A1 CORNER

7.1

6.9

1 MAX

C

SEATING PLANE

0.08 C

0.25

0.15

BALL TYP

5.5

TYP

(0.75) TYP

SYMM

M

L

K

J

(0.75) TYP

H

G

F

E

D

C

SYMM

5.5

TYP

0.35

0.25

113X Ø

B

A

0.15

0.05

C

A B

1

2

3

4

5

6

7

8

9 10 11 12

0.5 TYP

4225149/A 08/2019

NanoFree is a trademark of Texas Instruments.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

NFBGA - 1 mm max height

PLASTIC BALL GRID ARRAY

ZCA0113A

(0.5) TYP

1

2

3

4

5

6

7

8

9

10 11 12

A

B

C

D

E

F

113X (Ø0.25)

SYMM

G

H

J

K

L

M

SYMM

LAND PATTERN EXAMPLE

SCALE: 10X

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

METAL UNDER

SOLDER MASK

EXPOSED

METAL

(Ø 0.25)

METAL

(Ø 0.25)

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

OPENING

NON- SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4225149/A 08/2019

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. Refer to Texas Instruments

Literature number SNVA009 (www.ti.com/lit/snva009).

www.ti.com

EXAMPLE STENCIL DESIGN

NFBGA - 1 mm max height

PLASTIC BALL GRID ARRAY

ZCA0113A

(0.5) TYP

1

2

3

4

5

6

7

8

9

10 11 12

A

B

C

D

E

F

(R0.05)

SYMM

G

H

J

METAL TYP

113X ( 0.25)

K

L

M

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.100 mm THICK STENCIL

SCALE: 10X

4225149/A 08/2019

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

www.ti.com

MECHANICAL DATA

MTQF013A – OCTOBER 1994 – REVISED DECEMBER 1996

PZ (S-PQFP-G100)

PLASTIC QUAD FLATPACK

0,27

0,17

0,50

75

M

0,08

51

50

76

26

100

0,13 NOM

1

25

12,00 TYP

Gage Plane

14,20

SQ

13,80

0,25

16,20

SQ

0,05 MIN

0°–7°

15,80

1,45

1,35

0,75

0,45

Seating Plane

0,08

1,60 MAX

4040149/B 11/96

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-026

1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

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warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	MSP430FG6626IZQW
厂家：	TEXAS INSTRUMENTS
描述：	MSP430FG662x, MSP430FG642x Mixed-Signal Microcontrollers 微控制器
文件：	总186页 (文件大小：5140K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MSP430FG6626IZQW [TI]

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