MSP430G2252TDA1 [TI]
MIXED SIGNAL MICROCONTROLLER; 混合信号微控制器
| 型号： | MSP430G2252TDA1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | MIXED SIGNAL MICROCONTROLLER |
| 文件： | 总5页 (文件大小：119K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MSP430G2252-DIE
www.ti.com
SLAS853 –APRIL 2012
MIXED SIGNAL MICROCONTROLLER
1
FEATURES
23
•
Low Supply Voltage Range: 1.8 V to 3.6 V
•
One 16-Bit Timer_A With Three
Capture/Compare Registers
•
Ultra-Low Power Consumption
Five Power-Saving Modes
•
•
Up to 16 Touch-Sense Enabled I/O Pins
•
•
•
•
Universal Serial Interface (USI) Supporting SPI
and I2C
Ultra-Fast Wake-Up From Standby Mode
16-Bit RISC Architecture
•
•
•
On-Chip Comparator for Analog
Brownout Detector
Basic Clock Module Configurations
–
Internal Frequencies up to 16 MHz With
Four Calibrated Frequencies
Serial Onboard Programming,
No External Programming Voltage Needed,
Programmable Code Protection by Security
Fuse
–
Internal Very-Low-Power Low-Frequency
(LF) Oscillator
–
–
32-kHz Crystal
•
On-Chip Emulation Logic With Spy-Bi-Wire
Interface
External Digital Clock Source
DESCRIPTION
The Texas Instruments MSP430™ family of ultra-low-power microcontrollers consist of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low-power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The MSP430G2252 is an ultra-low-power mixed signal microcontroller with a built-in 16-bit timer, and up to 16
I/O touch sense enabled pins and built-in communication capability using the universal serial communication
interface and has a versatile analog comparator. The MSP430G2252 has a 10-bit A/D converter. Typical
applications include low-cost sensor systems that capture analog signals, convert them to digital values, and
then process the data for display or for transmission to a host system.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
MSP430 is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
MSP430G2252-DIE
SLAS853 –APRIL 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE(2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
MSP430G2252TDA1
MSP430G2252TDA2
100
10
MSP430G2252
TD
Bare die in waffle pack
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
11 mils.
Silicon with backgrind
Floating
AlCu (0.5%)
800 nm
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
MSP430G2252-DIE
www.ti.com
SLAS853 –APRIL 2012
Table 1. Bond Pad Coordinates in Microns(1)
DESCRIPTION
DVCC
PAD NUMBER
X MIN
244
Y MIN
2253.65
2050.15
1810.15
1650.15
630.15
260.15
87.4
X MAX
Y MAX
2328.65
2125.15
1885.15
1725.15
705.15
335.15
162.4
1
2
319
P1.0/TA0CLK/ACLK/A0/CA0
P1.1/TA0.0/A1/CA1
P1.2/TA0.1/A2/CA2
87.4
162.4
3
87.4
162.4
4
87.4
162.4
P1.3/ADC10CLK/CAOUT/VREF-/VEREF-/A3/CA3
5
87.4
162.4
P1.4/TA0.2/SMCLK/A4/VREF+/VEREF+/CA4/TCK
6
87.4
162.4
P1.5/TA0.0/SCLK/A5/CA5/TMS
7
240.15
650.15
820.15
976.15
1130.15
1610.15
1800.15
2204.85
2362.6
2362.6
2362.6
2362.6
2362.6
1994.8
1859.8
404
315.15
725.15
895.15
1051.15
1205.15
1685.15
1875.15
2279.85
2437.6
2437.6
2437.6
2437.6
2437.6
2069.8
1934.8
479
P2.0
8
87.4
162.4
P2.1
9
87.4
162.4
P2.2
10
11
12
13
14
15
16
17
18
19
20
21
22
87.4
162.4
P2.3
87.4
162.4
P2.4
87.4
162.4
P2.5
87.4
162.4
P1.6/TA0.1/SDO/SCL/A6/CA6/TDI/TCLK
87.4
162.4
P1.7/SDI/SDA/CAOUT/A7/CA7/TDO/TDI
260.15
710.15
1254.8
1583.85
2096.15
2253.65
2253.65
2253.65
335.15
785.15
1329.8
1658.85
2171.15
2328.65
2328.65
2328.65
RST BAR/NMI/SBWTDIO
TEST/SBWTCK
XOUT/P2.7
XIN/P2.6/TA0.1
DVSS
DVSS
DVCC
(1) Substrate is floating.
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
MSP430G2252TDA1
MSP430G2252TDA2
ACTIVE
ACTIVE
0
0
100
10
TBD
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明