O3850AQDCARQ1 [TI]
适用于安全 MCU、具有 350mA I/O 电压轨、符合功能安全性标准的多轨电源 | DCA | 48 | -40 to 125;
| 型号： | O3850AQDCARQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于安全 MCU、具有 350mA I/O 电压轨、符合功能安全性标准的多轨电源 | DCA | 48 | -40 to 125 |
| 文件： | 总14页 (文件大小：1725K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS653850A-Q1,TPS653852A-Q1
SLVSF96A – JANUARY 2020 – REVISED FEBRUARY 2021
TPS653850A-Q1 and TPS653852A-Q1 Multirail Power Supply for Microcontrollers in
Safety-Relevant Applications
– Voltage Monitoring Circuitry, Including
1 Features
Independent Bandgap Reference, Supplied
•
AEC-Q100 Qualified with the Following Results:
– Device Temperature Grade 1: –40°C to +125°C
Ambient Operating Temperature
from Separate Battery Voltage Input Pin
– Self-Check on All Voltage Monitoring (During
Power-Up and After Power-Up Initiated by
External MCU)
– All Supplies Protected with Current Limit and
Overtemperature Prewarning and Shutdown
Microcontroller Interface
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C4B
Functional Safety-Compliant
•
•
– Developed for Functional Safety Applications
– Documentation Available to Aid ISO 26262
System Design up to ASIL D
– Open and Close Window or Question-Answer
Watchdog Function
– Monitor for Functional Safety MCU Fault output
(PWM or level), MCU Error-Signal Monitor
– DIAGNOSTIC state for Performing Device Self-
Tests and System Diagnostics
– SAFE State for Device and System Protection
upon Detected System Failure
– Clock Monitor for Internal Oscillator
– Analog and Logic Built-In Self-Test
– CRC on Non-Volatile Memory as well as Device
and System Configuration Registers and SPI
Communications
– Reset Circuit for MCU
– Diagnostic Output Pin
SPI With CRC on Command Plus Data
Error Reporting Through SPI Registers for Errors
on System Level and Device Level
– Systematic Capability and Hardware Integrity
up to ASIL D
Input Voltage Range
– 7 to 36-V for Initial Battery Power Up
– 4 to 36-V Full Functionality After Initial Battery
Power Up
– Minimum 2.3 V During Operation After Wake-up
Supply Rails (With Internal FETs)
– 6-V Synchronous Buck-Boost Preregulator
– 5-V, 285-mA LDO (CAN, Peripherals or ADC
REF 1% Accuracy with 20 to 120 mA Load)
– 3.3-V or 5-V, 350-mA LDO (MCU)
TPS653850A-Q1. 3.3-V 350-mA or 5-V 500 mA
LDO (MCU) TPS653852A-Q1
•
•
•
•
– 2 LDOs Protected for Sensor Supply or
Peripherals
•
•
•
Enable-Drive Output for Disabling External Power-
Stages on Any Detected System Failure
Wake-up through IGN Pin (Ignition) or CAN_WU
Pin (Transceiver or Other Function)
48-Pin HTSSOP PowerPAD™ IC Package
•
•
•
120 mA for Sensor Supply 1 (VSOUT1), 100
mA for Sensor Supply 2 (VSOUT2)
Configurable Tracking Mode (Tracking Input
Pin), or 3.3-V or 5-V Fixed Output Voltage
Short-to-Ground and Battery Protection
– Charge Pump: 6-V Minimum, 11-V Maximum
Above Battery Voltage
Monitoring and Protection
– Independent Undervoltage and Overvoltage
Monitoring on All Regulator Outputs, Battery
Voltage, and Internal Supplies
2 Applications
•
•
Automotive Safety-Relevent Applications
Industrial Safety-Relevant Applications
•
3 Description
The TPS653850A-Q1 and TPS653852A-Q1 device is a multirail power supply designed to supply
microcontrollers in safety relevant applications, such as those found in the automotive industry. The device
supports functional safety microcontrollers with dual-core lockstep (LS) and other multi-core architectures.
The TPS653850A-Q1 and TPS653852A-Q1 device integrates multiple supply rails to power the MCU, CAN or
FlexRay, and external sensors. A buck-boost converter with internal FETs converts the input battery voltage
between 2.3 V and 36 V to a 6-V preregulator output that supplies the other regulators. An integrated charge
pump provides an overdrive voltage for the internal regulators, and can also be used to drive an external NMOS
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS653850A-Q1, TPS653852A-Q1
SLVSF96A – JANUARY 2020 – REVISED FEBRUARY 2021
www.ti.com
FET as reverse battery protection. The device supports wake-up from an ignition signal (IGN pin) or wake-up
from a CAN transceiver or other signal (CAN_WU pin).
An independent voltage monitoring unit inside the device monitors undervoltage and overvoltage on all internal
supply rails and regulator outputs of the battery supply. Regulator current limits and temperature protections are
also implemented. The TPS653850A-Q1 and TPS653852A-Q1 device features a question-answer watchdog,
MCU error-signal monitor, clock monitoring on internal oscillator, self-check on clock monitor, cyclic redundancy
check (CRC) on non-volatile memory and SPI communication, a diagnostic output pin allowing MCU to observe
device internal analog and digital signals, a reset circuit for the MCU (NRES pin) and a safing output (ENDRV
pin) to disable external power-stages on any detected system-failure. The device automatically runs a built-in
self-test (BIST) at start up and the MCU may re-run the BIST during system run time through software control if
needed. A dedicated DIAGNOSTIC state allows the MCU to check TPS653850A-Q1 and TPS653852A-Q1
functionality.
The TPS653850A-Q1 and TPS653852A-Q1 device also has an error reporting capability through the SPI
register. The device has separate status bits in the SPI register for each specific error on the system level or
device level. When the device detects a particular error condition, it sets the appropriate status bit and keeps this
status bit set until the MCU reads-out the SPI register in which this status bit was set. Based on which status bit
was set, the MCU can decide whether it must keep the system in a safe state or whether it can resume with the
operation of the system.
The TPS653850A-Q1 and TPS653852A-Q1 device is available in a 48-pin HTSSOP PowerPAD™ IC package.
Device Information (1)
PART NUMBER
TPS653850A-Q1
PACKAGE
BODY SIZE
HTSSOP (48)
12.50 mm × 6.10 mm
TPS653852A-Q1
(1) For more information, see Section 6.
Copyright © 2021 Texas Instruments Incorporated
2
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Product Folder Links: TPS653850A-Q1 TPS653852A-Q1
TPS653850A-Q1, TPS653852A-Q1
SLVSF96A – JANUARY 2020 – REVISED FEBRUARY 2021
www.ti.com
3.1 Typical Application Diagram
Battery Voltage
(2.3 V to 36 V)
5 V
TPS65385xx-Q1
CAN Interface
CAN wakeup
Multirail Power Supply
Ignition
EN
FETs
3.3 V / 5 V
DRVOFF
6 × PWM
Voltage Monitor
ENDRV
RESET
NRES
3 × HS
M
Motor-Driver
(DRV320x)
ERROR
Error Signal
Monitor
3 × LS
Dual-Core Lock-Step
Microcontroller
SPI
Watchdog
SPI
SPI
TPS653850A-Q1 TPS653851A-Q1 TPS653852A-Q1 TPS653853A-Q1 TPS653854A-Q1
TPS65385xx TPS653853 Func onal safety ASIL-D ASIL ISO26262 26262 buck boost buck-
boost 2MHz low power mode synchronous AEC-Q100 grade-1 grade-0 grade grade SBC
sensor supply tracking ciency pre-regulator, state machine window Q&A watchdog safe
D
1
0
e
state controller Build in self test BIST ABIST LBIST power management
DIAG_OUT
In neon www.in neon.com
IFX TLF35584 TLS35585 TLF11251
AURIX AURIXTM Tricore
TC3xx TC39x TC399 TC397 TC277 TC297 TC299 TC35 TC36 TC37 TC38 TC39 TC3E
TLF35584 TLF35584QVVS2 TLF35584QVVS2 TLF35584QKVS1 TLF35584QKVS2 TLF35584QV
VS1/VS2 TLF35584QK VS1/VS2 PRO-SIL
DIAG_OUT
NXP nxp.com
FS26 FS2600 FS45 FS4500 FS65 FS6500 FS66 FS6600 FS84 FS8400 FS85 FS8500 Qorivva
MPC57xx MPMC57 MPC574 MPC577 MPC56 MPC56xx
S32 S32S S32S24 S32K S32K1 S32K2 S32G S32P S32D SafeAssure
Kine
s KEA
STM st.com SPC5 SPC5 SPC56 SPC56L SPC57 SPC57K SPC572L SPC58 SPC58E SPC58N
Chorus Line Chorus Series Chorus MCU
Allegro MicroSystems A²-SIL A4412 ARG81400 ARG82800 ARG82801
3.3 V, 5 V
3.3 V / 5 V
Renesas RAA27000 R270000 R270005
RH850 RH850/F1L RH850/F1K RH850/P1H-C RH850/F1H RH850/D1M RH850/F1H
RH850/C1M RH850/U2A16
Sensor 1
Sensor 2
Safety Microcontroller MCU uC
AUTOSAR
FMEA safety case Automo ve motor control body chassis BMS Ba!ery Management system
EPS Electric Power Steering Belt Starter Generator xSG Tracꢀon Inverter Braking Electric Park
Brake EPB DSG transmission gear shi"er transfer case engine management ADAS fusion
body control module ADAS domain controller, suspension, DC/DC, charger, gateway HEV/EV
Copyright © 2021 Texas Instruments Incorporated
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TPS653850A-Q1, TPS653852A-Q1
SLVSF96A – JANUARY 2020 – REVISED FEBRUARY 2021
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
3.1 Typical Application Diagram........................................3
4 Revision History.............................................................. 4
5 Device and Documentation Support..............................5
5.1 Documentation Support.............................................. 5
5.2 Receiving Notification of Documentation Updates......5
5.3 Support Resources..................................................... 5
5.4 Trademarks.................................................................5
5.5 Electrostatic Discharge Caution..................................5
5.6 Glossary......................................................................5
6 Mechanical, Packaging, and Orderable Information....5
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (Janurary 2020) to Revision A (February 2021)
Page
•
•
Added the Functional Safety-Compliant status to the Features section. ...........................................................1
Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: TPS653850A-Q1 TPS653852A-Q1
TPS653850A-Q1, TPS653852A-Q1
SLVSF96A – JANUARY 2020 – REVISED FEBRUARY 2021
www.ti.com
5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
For related documentation see the following:
•
Texas instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Packages
application report
•
•
Texas instruments, PowerPAD™ Made Easy application report
Texas instruments, PowerPad™ Thermally Enhanced Package application report
5.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.4 Trademarks
PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: TPS653850A-Q1 TPS653852A-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Feb-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
O3850AQDCARQ1
O3852AQDCARQ1
ACTIVE
ACTIVE
HTSSOP
HTSSOP
DCA
DCA
48
48
2000 RoHS & Green
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
O3850A
O3852A
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
1-Feb-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Feb-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
O3850AQDCARQ1
O3852AQDCARQ1
HTSSOP DCA
HTSSOP DCA
48
48
2000
2000
330.0
330.0
24.4
24.4
8.6
8.6
13.0
13.0
1.8
1.8
12.0
12.0
24.0
24.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Feb-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
O3850AQDCARQ1
O3852AQDCARQ1
HTSSOP
HTSSOP
DCA
DCA
48
48
2000
2000
350.0
350.0
350.0
350.0
43.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DCA 48
12.5 x 6.1, 0.5 mm pitch
HTSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224608/A
www.ti.com
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