ONET2511TA [TI]
2.5 GBPS TRANSIMPEDANCE AMPLIFIER WITH RSSI; 2.5Gbps的跨导，带有RSSI放大器
| 型号： | ONET2511TA |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 2.5 GBPS TRANSIMPEDANCE AMPLIFIER WITH RSSI |
| 文件： | 总12页 (文件大小：455K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Not Recommended for New Designs
ONET2511TA
www.ti.com
SLLS622 –SEPTEMBER 2004
2.5 GBPS TRANSIMPEDANCE AMPLIFIER WITH RSSI
Check for Samples: ONET2511TA
1
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
•
2.5 GHz Bandwidth
4.0 kΩ Differential Transimpedance
10 pA/√Hz Typical Input Referred Noise
2 mA Maximum Input Current
Offset Cancellation
The ONET2511TA is a high-speed transimpedance
amplifier used in SDH/SONET systems with data
rates up to 2.5Gbps. It features a low input referred
noise, 2.5GHz bandwidth, 4.0kΩ transimpedance,
and a received signal strength indicator.
Received Signal Strength Indication
Differential CML Data Outputs
Single +3.3V Supply
The ONET2511TA device is available in die form and
requires a single +3.3V supply. It is very power
efficient and dissipates less than 83 mW (typical). It is
characterized for operations from –40°C to 85°C.
Bare-Die Option
AVAILABLE OPTIONS
TA
APPLICATIONS
DIE
•
•
•
•
SONET OC-48
SDH STM-16
APD Preamplifier-Receivers
PIN Preamplifier-Receivers
–40°C to 85°C
ONET2511TAY
DETAILED DESCRIPTION
BLOCK DIAGRAM
The ONET2511TA is a high performance 2.5 Gbps transimpedance amplifier that can be segmented into the
signal path, filter, and offset cancellation block.
The signal path consists of a transimpedance amplifier stage, a voltage amplifier, and an output buffer.
The filter circuit provides a filtered VCC for the photodiode.
The offset correction circuit uses an internal low pass filter to cancel the DC on the input and it provides a signal
to monitor the received signal strength.
A simplified block diagram of the ONET2511TA is shown in Figure 1.
VCC
RSSI
750 W
Disable
Bandgap Voltage
Reference and
Bias Current
Generation
FILTER
Offset
Cancellation
R
F
+
+
OUT+
OUT−
IN
−
−
CML
Output
Buffer
Voltage
Amplifier
Transimpedance
Amplifier
GND
Figure 1. Simplified Block Diagram of the ONET2511TA
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004, Texas Instruments Incorporated
Not Recommended for New Designs
ONET2511TA
SLLS622 –SEPTEMBER 2004
www.ti.com
SIGNAL PATH
The first stage of the signal path is a transimpedance amplifier that takes the photodiode current and converts it
to a voltage signal. The second stage is a voltage amplifier that provides additional gain. The output of the
second stage feeds the output buffer and the offset cancellation circuitry. The third and final signal path stage of
the ONET2511TA is the output buffer. The output buffer provides CML outputs with an on-chip 50Ω
back-termination to VCC.
FILTER CIRCUITRY
The filter pin provides a filtered VCC for the photodiode bias. The on-chip low pass filter for the photodiode VCC
is implemented using a filter resistor of 750Ω and an internal capacitor. If additional filtering is required for the
application, an external capacitor should be connected to the FILTER pin.
OFFSET CANCELLATION AND RSSI
The offset cancellation circuitry performs low pass filtering of the output signal of the voltage amplifier. This
senses the DC offset at the input of the ONET2511TA. The circuitry subtracts current from the input to effectively
cancel the DC. The sensed current is mirrored and is used to generate the RSSI output through an external 10
kΩ resistor. To disable the offset correction loop, the FILTER pin should be tied to GND.
BOND PAD DESCRIPTION
The ONET2511TA is available as bare-die. The location of the bondpads is shown in Figure 2. The circuit is
characterized for ambient temperatures between –40°C and 85°C. Table 1 shows the pad descriptions for the
ONET2511TA.
6
7
7
6
VCC 8
IN 9
5 OUT+
4 OUT–
8
9
5
ONET
2511TA
N.C. 10
10
1
PAD#1
3
FILTER 1
4
ONET2511TA_B2003
2
1,030µm
origin
0,0
x
2
3
Figure 2. Bond Pad Assignment of ONET2511TA
Table 1. Pad Description of the ONET2511TA
PAD
SYMBOL TYPE
DESCRIPTION
1
FILTER
Analog
Bias voltage for photodiode (connects to an internal 750-Ω resistor to VCC). To disable offset correction
loop connect FILTER to GND.
2
RSSI
Analog-Out
Analog output voltage proportional to the input data amplitude. Indicates the strength of the received
signal (RSSI).
3, 6
4
GND
OUT-
Supply
Circuit ground.
Analog-Out
Inverted data output. On-chip 50-Ω back-terminated to VCC.
2
Submit Documentation Feedback
Copyright © 2004, Texas Instruments Incorporated
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
www.ti.com
SLLS622 –SEPTEMBER 2004
Table 1. Pad Description of the ONET2511TA (continued)
PAD
5
SYMBOL TYPE
DESCRIPTION
OUT+
VCC
IN
Analog-Out
Supply
Non-inverted data output. On-chip 50-Ω back-terminated to VCC
.
7, 8
9
3.3-V ± 10% supply voltage
Analog-In
Data input to TIA. Connect to anode of PIN or APD diode.
Not connected
10
NC
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
VCC
Supply voltage(2)
-0.3 to 4.0
V
VOUT+ VOUT- Voltage of OUT+ and Out-(2)
VFILTER VRSSI Voltage of FILTER and RSSI(2)
VCC –1.5 to VCC +0.5
V
-0.3 to 4.0
-4 to 4
-8 to 8
2
V
mA
IIN
Current into IN
IFILTER
ESD
Current into FILTER
mA
ESD rating at all pins except IN(3)
ESD rating at IN(3)
kV (HBM)
kV (HBM)
°C
1
TJmax
TSTG
TA
Maximum junction temperature
Storage temperature
150
-65 to 85
-40 to 85
°C
Operating free-air tempature
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) For optimum high-frequency performance, the input pin has reduced ESD protection.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Supply voltage
Operating free-air temperature
TEST CONDITIONS
MIN
3
NOM
MAX
3.6
UNIT
V
VCC
TA
3.3
-40
85
°C
DC ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, VCC = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER
Supply voltage
TEST CONDITIONS
MIN
TYP
3.3
MAX
3.6
35
UNIT
V
VCC
3
ICC
Supply current
25
mA
V
VIB
Input bias voltage
0.66
2
0.83
1.1
IIN-OVL
ROUT
RFILTER
DC input overload current
Ouput resistance (OUT+, OUT-)
Photodiode filter resistance (FILTER)
mA
Ω
Single-ended to VCC
50
750
Ω
Copyright © 2004, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
SLLS622 –SEPTEMBER 2004
www.ti.com
AC ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, VCC = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
5000
640
UNIT
mAp-p
µAp-p
V/A
IIN-OVL
AC input overload current
Input linear range
2
0.95 < linearity < 1.05
40
2000
4000
2.5
7
ARSSI
Z21
RSSI gain
10-kΩ load
Small-signal transimpedance
Small-signal bandwidth
Low-frequency -3dB bandwidth
Differential output
CEXTERNAL = 0.85 pF(1)
-3 dB, II N < 20 µA DC
3000
Ω
fH-3dB
fL-3dB
GHz
kHz
fH-3dB -RSSI RSSI bandwidth
4
kHz
IN-IN
DJ
Input referred RMS noise
470
10
nARMS
pA/√Hz
psp-p
psp-p
psp-p
mVp-p
dB
Input referred noise density
Deterministic jitter
IIN = 10 µA (K28.5 pattern)
IIN = 100 µA (K28.5 pattern)
IIN = 2 mA (K28.5 pattern)
21
25
16
VOD(MAX)
PSRR
Differential output voltage, maximum IIN = 1 mAp-p
Power supply rejection ratio f < 2 MHz
200
320
55
400
(1) CEXTERNAL= is the total capacitance comprising of the photodiode capacitance, board capacitance, and pad capacitance at the IN bond
pad.
4
Submit Documentation Feedback
Copyright © 2004, Texas Instruments Incorporated
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
www.ti.com
SLLS622 –SEPTEMBER 2004
APPLICATION INFORMATION
Basic Application Circuit
Figure 3 shows the ONET2511TA being used as a receiver in a typical fiber optic application. The ONET2511TA
converts the electrical current generated by the PIN or APD photodiode into a differential voltage output. The
FILTER input provides a DC bias voltage for the photodiode that is low pass filtered by the combination of the
internal 750-Ω resistor and internal capacitor. For additional power supply filtering, use an external capacitor
CFILTER. The RSSI output is used to mirror the photodiode output current and must be connected via a 10-kΩ
resistor to GND or left open. Within the ONET2511TA, the OUT+ and OUT- pins are back-terminated with 50 Ω
to VCC.
VCC
C
1
7
6
OUT+
8
9
5
750Ω
ONET
2511TA
C
2
10
1
PAD#1
3
OUT–
RSSI
4
ONET2511TA_B2003
2
C
FILTER
(optional)
10kW
GND
Figure 3. Basic Application Circuit
Board Layout
Careful attention to board layout parasitics and external components is necessary to achieve optimal
performance with a high performance transimpedance amplifier like the ONET2511TA.
Recommendations that optimize performance include:
1. Minimize total capacitance on the IN pad by using a low capacitance photodiode and paying attention to
stray capacitances. Place the photodiode close to the ONET2511TA die in order to minimize the bond wire
length and thus the parasitic inductance.
2. The external filter capacitance CFILTER may have an impact on the transfer function of the TIA and must be
chosen with care based on the module implementation.
3. Use identical termination and symmetrical transmission lines at the differential output pins OUT+ and OUT-.
4. Use short bond wire connections for the supply terminals VCC and GND. Provide sufficient supply voltage
filtering.
Copyright © 2004, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
SLLS622 –SEPTEMBER 2004
www.ti.com
CHIP DIMENSIONS AND PAD LOCATIONS
7
6
8
9
5
ONET
2511TA
10
PAD#1
3
4
1
ONET2511TA_B2003
2
1,030µm
origin
x
0,0
Figure 4. Chip Dimensions and Pad Locations
Figure 5. Chip Layout
Table 2. Pad Locations and Description
PAD LOWER LEFT
COORDINATE
UPPER RIGHT
COORDINATE
SYMBOL TYPE
DESCRIPTION
x [µm] y [µm] x [µm] y [µm]
1
2
3
4
5
6
7
8
9
10
30
84
115
292
469
971
971
469
292
115
115
115
169
115
115
197
594
619
619
619
469
319
FILTER
RSSI
GND
OUT-
OUT+
GND
VCC
VCC
IN
Analog
Bias voltage for photodiode
207
384
886
886
384
207
30
30
Analog out RSSI output voltage signal
Supply Circuit ground
30
112
509
534
534
534
384
234
Analog out Inverted data output
Analog out Non-inverted data output
Supply
Supply
Supply
Circuit ground
+3.3 V ± 10% supply voltage
+3.3 V ± 10% supply voltage
30
Analog in Data input to TIA
Not connected
30
NC
6
Submit Documentation Feedback
Copyright © 2004, Texas Instruments Incorporated
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
www.ti.com
SLLS622 –SEPTEMBER 2004
TO46 Layout Example
An example for a suggested layout in a 5-pin TO46 ROSA is given in Figure 6 (top view).
0.65mm
OUT+
OUT–
GND
VCC
RSSI
Figure 6. TO46 Layout Example Using the ONET2511TA
Copyright © 2004, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
SLLS622 –SEPTEMBER 2004
www.ti.com
TYPICAL CHARACTERISTICS
VCC = +3.3 V and TA = +25°C (unless otherwise noted)
INPUT REFERRED NOISE
INPUT REFERRED NOISE
vs
vs
AVERAGE INPUT CURRENT
FREE-AIR TEMPERATURE
2400
2200
600
550
500
450
400
350
2000
1800
1600
1400
1200
1000
800
300
250
600
200
400
−40 −20
0
20
40
60
80
100
1
10
100
1000
Free−Air Tempature − 5C
Average Input Current − mA
Figure 7.
Figure 8.
TRANSIMPEDANCE
vs
FREE-AIR TEMPERATURE
DC TRANSFER CHARACTERISTIC (OFFSET
CANCELLATION DISABLED)
75
74
200
150
100
73
72
50
71
70
0
69
−50
68
67
−100
−150
66
65
−200
−40 −20
0
20
40
60
80
100
−100 −80 −60 −40 −20
0
20 40 60 80 100
Free−Air Tempature − 5C
Input Current − mA
Figure 9.
Figure 10.
8
Submit Documentation Feedback
Copyright © 2004, Texas Instruments Incorporated
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
www.ti.com
SLLS622 –SEPTEMBER 2004
TYPICAL CHARACTERISTICS (continued)
VCC = +3.3 V and TA = +25°C (unless otherwise noted)
SMALL SIGNAL BANDWIDTH
vs
RSSI OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
AVERAGE INPUT CURRENT
3.0
2.9
2.8
2.5
2
2.7
2.6
1.5
2.5
1
2.4
2.3
0.5
2.2
2.1
0
−40 −20
0
20
40
60
80
100
0
200
400
600
800
1000
1200
Free−Air Tempature − 5C
Average Input Current − mA
Figure 11.
Figure 12.
DETERMINISTIC JITTER
vs
INPUT CURRENT
100
90
80
70
60
50
40
30
20
10
0
10
100
1000
10k
Input Current − mA
p−p
Figure 13.
Copyright © 2004, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): ONET2511TA
Not Recommended for New Designs
ONET2511TA
SLLS622 –SEPTEMBER 2004
www.ti.com
TYPICAL CHARACTERISTICS (continued)
VCC = +3.3 V and TA = +25°C (unless otherwise noted)
OUTPUT EYE-DIAGRAM AT 2.5 GBPS and 20µAp-p INPUT CURRENT USING A K28.5 PATTERN
Time − 100ps/Div
Figure 14.
OUTPUT EYE-DIAGRAM AT 2.5 GBPS and 2 mAp-p INPUT CURRENT USING A K28.5 PATTERN
Time − 100ps/Div
Figure 15.
10
Submit Documentation Feedback
Copyright © 2004, Texas Instruments Incorporated
Product Folder Link(s): ONET2511TA
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
ONET2511TAY
NRND
DIESALE
Y
0
Green (RoHS
& no Sb/Br)
Call TI
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Transportation and Automotive www.ti.com/automotive
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connctivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明