OPA1604AID [TI]
High-Performance, Bipolar-Input AUDIO OPERATIONAL AMPLIFIERS; 高性能，双极输入音频运算放大器
| 型号： | OPA1604AID |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High-Performance, Bipolar-Input AUDIO OPERATIONAL AMPLIFIERS |
| 文件： | 总28页 (文件大小：1095K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA1602
OPA1604
Burr-Brown Audio
www.ti.com
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
™ High-Performance, Bipolar-Input
AUDIO OPERATIONAL AMPLIFIERS
Check for Samples: OPA1602, OPA1604
1
FEATURES
DESCRIPTION
The
OPA1602
and
OPA1604
bipolar-input
234
•
SUPERIOR SOUND QUALITY
operational amplifiers achieve very low 2.5nV/√Hz
noise density with an ultralow distortion of 0.00003%
at 1kHz. The OPA1602 and OPA1604 series of op
amps offer rail-to-rail output swing to within 600mV
with 2kΩ load, which increases headroom and
maximizes dynamic range. These devices also have
a high output drive capability of ±30mA.
•
•
•
•
•
•
•
ULTRALOW NOISE: 2.5nV/√Hz at 1kHz
ULTRALOW DISTORTION: 0.00003% at 1kHz
HIGH SLEW RATE: 20V/μs
WIDE BANDWIDTH: 35MHz (G = +1)
HIGH OPEN-LOOP GAIN: 120dB
UNITY GAIN STABLE
These devices operate over a very wide supply range
of ±2.25V to ±18V, on only 2.6mA of supply current
per channel. The OPA1602 and OPA1604 are
unity-gain stable and provide excellent dynamic
behavior over a wide range of load conditions.
LOW QUIESCENT CURRENT:
2.6mA PER CHANNEL
•
•
•
RAIL-TO-RAIL OUTPUT
WIDE SUPPLY RANGE: ±2.25V to ±18V
DUAL AND QUAD VERSIONS AVAILABLE
These devices also feature completely independent
circuitry for lowest crosstalk and freedom from
interactions between channels, even when overdriven
or overloaded.
APPLICATIONS
•
•
•
•
•
PROFESSIONAL AUDIO EQUIPMENT
BROADCAST STUDIO EQUIPMENT
ANALOG AND DIGITAL MIXERS
HIGH-END A/V RECEIVERS
The OPA1602 and OPA1604 are specified
from –40°C to +85°C. SoundPlus™
HIGH-END BLU-RAY™ PLAYERS
V+
Pre-Output Driver
OUT
IN-
IN+
V-
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
4
SoundPlus is a trademark of Texas Instruments Incorporated.
BLU-RAY is a trademark of Blu-ray Disc Association.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
OPA1602
OPA1604
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted).
VALUE
UNIT
V
Supply Voltage
VS = (V+) – (V–)
40
(V–) – 0.5 to (V+) + 0.5
±10
Input Voltage
V
Input Current (All pins except power-supply pins)
Output Short-Circuit(2)
Operating Temperature
Storage Temperature
mA
Continuous
–55 to +125
°C
°C
°C
kV
kV
V
–65 to +150
Junction Temperature
200
4
Human Body Model (HBM)
ESD Ratings
Charged Device Model (CDM)
Machine Model (MM)
1
200
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) Short-circuit to VS/2 (ground in symmetrical dual supply setups), one amplifier per package.
PACKAGE INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
O1602A
SO-8
D
DGK
D
OPA1602
MSOP-8
OCKQ
SO-14
O1604A
OPA1604
TSSOP-14
PW
O1604A
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
PIN CONFIGURATIONS
OPA1602
SO-8, MSOP-8
OPA1604
SO-14, TSSOP-14
(TOP VIEW)
(TOP VIEW)
OUT A
-IN A
+IN A
V-
1
2
3
4
8
7
6
5
V+
Out A
-In A
+In A
V+
Out D
-In D
+In D
V-
1
2
3
4
5
6
7
14
13
12
11
10
9
A
OUT B
-IN B
+IN B
B
A
D
+ In B
-In B
Out B
+ In C
-In C
Out C
B
C
8
2
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): OPA1602 OPA1604
OPA1602
OPA1604
www.ti.com
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V
At TA = +25°C and RL = 2kΩ, unless otherwise noted. VCM = VOUT = midsupply, unless otherwise noted.
OPA1602, OPA1604
PARAMETER
AUDIO PERFORMANCE
CONDITIONS
MIN
TYP MAX
UNIT
Total Harmonic Distortion + Noise
THD+N
IMD
0.00003
%
G = +1, f = 1kHz, VO = 3VRMS
G = +1, VO = 3VRMS
–130
dB
Intermodulation Distortion
0.00003
–130
%
dB
%
SMPTE/DIN Two-Tone, 4:1 (60Hz and 7kHz)
0.00003
–130
DIM 30
(3kHz square wave and 15kHz sine wave)
dB
%
0.00003
–130
CCIF Twin-Tone (19kHz and 20kHz)
dB
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Full Power Bandwidth(1)
Overload Recovery Time
NOISE
GBW
SR
G = +1
G = –1
35
20
3
MHz
V/μs
MHz
μs
VO = 1VP
G = –10
1
Input Voltage Noise
Input Voltage Noise Density
f = 20Hz to 20kHz
f = 100Hz
2.5
2.5
2.5
2.2
1.8
μVPP
en
In
nV/√Hz
nV/√Hz
pA/√Hz
pA/√Hz
f = 1kHz
Input Current Noise Density
f = 100Hz
f = 1kHz
OFFSET VOLTAGE
Input Offset Voltage
VOS
VS = ±15V
VS = ±2.25V to ±18V
f = 1kHz
±0.1
0.5
±1
mV
μV/V
dB
vs Power Supply
PSRR
2
Channel Separation (Dual and Quad)
INPUT BIAS CURRENT
Input Bias Current
-130
IB
VCM = 0V
VCM = 0V
±20
±20
±200
±200
nA
nA
Input Offset Current
IOS
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
VCM
(V–) + 2
114
(V+) – 2
V
CMRR
(V–) + 2V ≤ VCM ≤ (V+) – 2V, VS ≥ ±5V
(V–) + 2V ≤ VCM ≤ (V+) – 2V, VS < ±5V
120
110
dB
dB
100
INPUT IMPEDANCE
Differential
20k || 2
Ω || pF
Ω || pF
109 || 2.5
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
AOL
(V–) + 0.6V ≤ VO ≤ (V+) – 0.6V, RL = 2kΩ, VS ≥ ±5V
(V–) + 0.6V ≤ VO ≤ (V+) – 0.6V, RL = 2kΩ, VS < ±5V
114
106
120
114
dB
dB
OUTPUT
Voltage Output
VOUT
RL = 2kΩ, AOL ≥ 114dB, VS ≥ ±5V
RL = 2kΩ, AOL ≥ 106dB, VS < ±5V
(V–) + 0.6
(V–) + 0.6
(V+) – 0.6
(V+) – 0.6
V
V
Output Current
IOUT
ZO
See Typical Characteristics
mA
Ω
Open-Loop Output Impedance
Short-Circuit Current(2)
Capacitive Load Drive
f = 1MHz
25
ISC
+70/–60
mA
pF
CLOAD
See Typical Characteristics
(1) Full-power bandwidth = SR/(2π × VP), where SR = slew rate.
(2) One channel at a time.
Copyright © 2011, Texas Instruments Incorporated
3
Product Folder Link(s): OPA1602 OPA1604
OPA1602
OPA1604
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V (continued)
At TA = +25°C and RL = 2kΩ, unless otherwise noted. VCM = VOUT = midsupply, unless otherwise noted.
OPA1602, OPA1604
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
Specified Voltage
Quiescent Current(3)
xx Dual, per channel
VS
IQ
±2.25
±18
3.2
3.4
V
IOUT = 0A
IOUT = 0A
2.6
2.8
mA
mA
Quad, per channel
TEMPERATURE RANGE
Specified Range
IQ
–40
–55
+85
°C
°C
Operating Range
+125
(3) IQ value is based on flash test.
THERMAL INFORMATION: OPA1602
OPA1602
OPA1602
DGK
THERMAL METRIC(1)
D
8 PINS
105.4
58.6
64.2
14.1
66.5
N/A
UNITS
8 PINS
154.7
49.7
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
107.9
2.5
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
106.7
N/A
θJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA1604
OPA1604
D
OPA1604
PW
THERMAL METRIC(1)
UNITS
14 PINS
92.8
14 PINS
122.5
36.5
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
44.4
39.6
53.9
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
10.4
2.5
ψJB
39.3
53.2
θJCbot
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): OPA1602 OPA1604
OPA1602
OPA1604
www.ti.com
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
INPUT VOLTAGE NOISE DENSITY AND
INPUT CURRENT NOISE DENSITY vs FREQUENCY
0.1Hz TO 10Hz NOISE
100
10
Voltage Noise
Density
Current Noise
Density
1
Time (1s/div)
0.1
1
10
100
1k
10k
100k
Frequency (Hz)
Figure 1.
Figure 2.
VOLTAGE NOISE vs SOURCE RESISTANCE
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
15
12.5
10
10k
1k
VS
=
15V
Maximum output
voltage without slew-
rate induced distortion
OPA160x
EO
RS
7.5
5
100
10
1
VS
VS
=
5V
OPA164x
2.5
0
=
2.25V
Resistor
Noise
EO2 = en2 + (in RS)2 + 4kTRS
10k 100k 1M
10k
100k
Frequency (Hz)
1M
10M
100
1k
Source Resistance, RS (W)
Figure 3.
Figure 4.
GAIN AND PHASE vs FREQUENCY
CLOSED-LOOP GAIN vs FREQUENCY
140
120
100
80
180
135
90
25
20
G = +10
Gain
15
10
G = +1
5
60
0
-5
40
-10
-15
-20
-25
Phase
20
45
G = -1
0
-20
0
100k
1M
10M
100M
10
100
1k
10k
100k
1M
10M
100M
Frequency (Hz)
Frequency (Hz)
Figure 5.
Figure 6.
Copyright © 2011, Texas Instruments Incorporated
5
Product Folder Link(s): OPA1602 OPA1604
OPA1602
OPA1604
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
THD+N RATIO vs FREQUENCY
THD+N RATIO vs FREQUENCY
-80
-100
0.01
0.001
0.001
RS = 0W
G = +1, RL = 600W
G = +1, RL = 2kW
G = -1, RL = 600W
G = -1, RL = 2kW
G = +10, RL = 600W
G = +10, RL = 2kW
+15V
RS = 300W
RS = 600W
RS = 1kW
RSOURCE
OPA1602
-15V
RL
-100
-120
-140
-120
0.0001
RL = 600W
0.0001
0.00001
VOUT = 3VRMS
BW = 80kHz
RL = 2kW
VOUT = 3VRMS,BW = 80kHz
-140
0.00001
10
100
1k
10k 20k
10
100
1k
10k 20k
Frequency (Hz)
Frequency (Hz)
Figure 7.
Figure 8.
THD+N RATIO vs FREQUENCY
THD+N RATIO vs FREQUENCY
-80
-80
0.01
0.001
0.01
0.001
RS = 0W
G = +1, RL = 600W
G = +1, RL = 2kW
G = -1, RL = 600W
G = -1, RL = 2kW
G = +10, RL = 600W
G = +10, RL = 2kW
+15V
RS = 300W
RS = 600W
RS = 1kW
RSOURCE
OPA1602
-15V
RL
-100
-120
-140
-100
-120
-140
RL = 600W
0.0001
0.00001
0.0001
0.00001
RL = 2kW
VOUT = 3VRMS
BW > 500kHz
VOUT = 3VRMS
BW > 500kHz
10
100
1k
10k
100k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 9.
Figure 10.
INTERMODULATION DISTORTION vs
OUTPUT AMPLITUDE
THD+N RATIO vs OUTPUT AMPLITUDE
0.01
0.001
-80
0.1
-60
G = +1
G = +1, RL = 600W
G = +1, RL = 2kW
G = -1, RL = 600W
G = -1, RL = 2kW
G = +10, RL = 600W
G = +10, RL = 2kW
SMPTE/DIN
Two-Tone, 4:1
(60Hz and 7kHz)
0.01
0.001
-80
DIM30
(3kHz square wave,
15kHz sine wave)
-100
-120
-140
-100
-120
-140
0.0001
RL = 600W
0.0001
0.00001
0.00001
0.000001
1kHz Signal
BW = 80kHz
RSOURCE = 0W
CCIF Twin-Tone
(19kHz and 20kHz)
RL = 2kW
-160
0.1
1
10
20
0.1
1
10
20
Output Amplitude (VRMS
)
Output Amplitude (VRMS
)
Figure 11.
Figure 12.
6
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): OPA1602 OPA1604
OPA1602
OPA1604
www.ti.com
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
CHANNEL SEPARATION vs FREQUENCY
CMRR AND PSRR vs FREQUENCY (Referred to Input)
-100
140
VO = 3VRMS
CMRR
-105
G = +1
120
100
80
60
40
20
0
-110
-115
-PSRR
-120
RL = 600W
-125
-130
+PSRR
-135
-140
-145
-150
RL = 2kW
RL = 5kW
10
100
1k
10k
100k
1
10
100
1k
10k 100k
1M
10M 100M
Frequency (Hz)
Frequency (Hz)
Figure 13.
Figure 14.
SMALL-SIGNAL STEP RESPONSE
(100mV)
SMALL-SIGNAL STEP RESPONSE
(100mV)
G = +1
CL = 50pF
G = -1
CL = 50pF
RF = 2kW
+15V
OPA1602
-15V
+15V
RI = 2kW
OPA1602
RL
CL
CL
-15V
Time (0.1ms/div)
Time (0.1ms/div)
Figure 15.
Figure 16.
LARGE-SIGNAL STEP RESPONSE
LARGE-SIGNAL STEP RESPONSE
G = -1
CL = 50pF
G = +1
CL = 50pF
RF = 0W
RF = 100W
See Application Information,
Input Protection section
Time (1ms/div)
Time (1ms/div)
Figure 17.
Figure 18.
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OPA1602
OPA1604
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs CAPACITIVE LOAD (100mV Output Step)
SMALL-SIGNAL OVERSHOOT
vs CAPACITIVE LOAD (100mV Output Step)
50
40
30
20
10
0
50
G = -1
G = +1
RF = 2kW
RI = 2kW
RS = 0W
+15V
RS = 0W
RS
+15V
40
OPA1602
RS
OPA1602
RL
CL
RS = 25W
-15V
CL
30
20
10
0
-15V
RS = 25W
RS = 50W
RS = 50W
0
100 200 300 400 500 600 700 800 900 1000
Capacitive Load (pF)
0
100
200
300
400
500
600
Capacitive Load (pF)
Figure 19.
Figure 20.
SMALL-SIGNAL OVERSHOOT
vs FEEDBACK CAPACITOR (100mV Output Step)
OPEN-LOOP GAIN vs TEMPERATURE
50
2
RL = 2kW
CF
RF = 2kW
RI = 2kW
40
30
20
10
0
1.5
1
+15V
RS
OPA1602
CL
-15V
G = -1
0.5
0
RI = RF = 2kW
RS = 0W
CL = 100pF
0
0.5
1
1.5
2
2.5
3
3.5
4
-40
-15
10
35
60
85
Feedback Capacitor, CF (pF)
Temperature (°C)
Figure 21.
Figure 22.
IB AND IOS vs TEMPERATURE
IB AND IOS vs COMMON-MODE VOLTAGE
40
30
10
5
VS
= 18V
Average of 60 Units
-IOS
Common-Mode Range
20
0
10
-5
0
-10
-15
-20
-25
-30
-IB
-10
-20
-30
-40
-IB
IOS
+IB
+IB
50
-18 -14 -10
-6
-2
2
6
10
14
18
-50
-25
0
25
75
100
125
Common-Mode Voltage (V)
Temperature (°C)
Figure 23.
Figure 24.
8
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): OPA1602 OPA1604
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SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = ±15V, and RL = 2kΩ, unless otherwise noted.
QUIESCENT CURRENT vs TEMPERATURE
QUIESCENT CURRENT vs SUPPLY VOLTAGE
4
3
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2
OPA1604
3.5
OPA1604
3
OPA1602
2.5
OPA1602
2
<−−−−−− Specified Temperature Range −−−−−−>
1.5
−40
<−−−−−− Specified Supply−Voltage Range −−−−−>
−15
10
35
60
85
110
0
4
8
12
16
20
24
28
32
36
Temperature (°C)
Supply Voltage (V)
G017
G018
Figure 25.
Figure 26.
IQ WARMUP
(Difference from IQ at Startup, Per Channel)
SHORT-CIRCUIT CURRENT vs TEMPERATURE
75
0.3
0.25
0.2
+ISC
VS
= 18V
70
65
60
55
50
45
40
35
30
OPA1604
OPA1602
0.15
0.1
-ISC
0.05
0
-50
-25
0
25
50
75
100
125
0
60
120
180
240
300
360
Temperature (°C)
Time (s)
Figure 27.
Figure 28.
OPEN-LOOP OUTPUT IMPEDANCE vs
FREQUENCY
OUTPUT VOLTAGE vs OUTPUT CURRENT
18
16
10k
1k
VS
= 18V
14
+125°C
+85°C
+25°C
0°C
12
10
100
10
1
-10
-12
-14
-16
-18
-25°C
-40°C
20
30
40
50
60
70
80
10
100
1k
10k
100k
1M
10M
100M
Output Current (mA)
Frequency (Hz)
Figure 29.
Figure 30.
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Product Folder Link(s): OPA1602 OPA1604
OPA1602
OPA1604
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
www.ti.com
APPLICATION INFORMATION
applications do not require equal positive and
negative output voltage swing. With the OPA160x
series, power-supply voltages do not need to be
equal. For example, the positive supply could be set
to +25V with the negative supply at –5V.
The OPA1602 and OPA1604 are unity-gain stable,
precision dual and quad op amps with very low noise.
Applications with noisy or high-impedance power
supplies require decoupling capacitors close to the
device pins. In most cases, 0.1μF capacitors are
adequate. Figure 31 shows a simplified schematic of
the OPA160x (one channel shown).
In all cases, the common-mode voltage must be
maintained within the specified range. In addition, key
parameters are assured over the specified
temperature range of TA
= –40°C to +85°C.
OPERATING VOLTAGE
Parameters that vary significantly with operating
voltage or temperature are shown in the Typical
Characteristics.
The OPA160x series op amps operate from ±2.25V
to ±18V supplies while maintaining excellent
performance. The OPA160x series can operate with
as little as +4.5V between the supplies and with up to
+36V between the supplies. However, some
V+
Pre-Output Driver
OUT
IN-
IN+
V-
Figure 31. OPA160x Simplified Schematic
10
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INPUT PROTECTION
The equation in Figure 33 shows the calculation of
the total circuit noise, with these parameters:
The input terminals of the OPA1602 and OPA1604
are protected from excessive differential voltage with
back-to-back diodes, as Figure 32 illustrates. In most
circuit applications, the input protection circuitry has
no consequence. However, in low-gain or G = +1
circuits, fast ramping input signals can forward bias
these diodes because the output of the amplifier
cannot respond rapidly enough to the input ramp.
This effect is illustrated in Figure 17 of the Typical
Characteristics. If the input signal is fast enough to
create this forward bias condition, the input signal
current must be limited to 10mA or less. If the input
signal current is not inherently limited, an input series
resistor (RI) and/or a feedback resistor (RF) can be
used to limit the signal input current. This resistor
degrades the low-noise performance of the OPA160x
and is examined in the following Noise Performance
section. Figure 32 shows an example configuration
when both current-limiting input and feeback resistors
are used.
•
•
•
•
•
en = Voltage noise
in = Current noise
RS = Source impedance
k = Boltzmann’s constant = 1.38 × 10–23 J/K
T = Temperature in degrees Kelvin (K)
10k
OPA160x
EO
1k
RS
100
OPA164x
10
Resistor
Noise
EO2 = en2 + (in RS)2 + 4kTRS
1
100
1k
10k
100k
1M
Source Resistance, RS (W)
RF
Figure 33. Noise Performance of the OPA160x in
Unity-Gain Buffer Configuration
-
BASIC NOISE CALCULATIONS
OPA160x
Output
RI
Design of low-noise op amp circuits requires careful
+
Input
consideration of
a
variety of possible noise
contributors: noise from the signal source, noise
generated in the op amp, and noise from the
feedback network resistors. The total noise of the
circuit is the root-sum-square combination of all noise
components.
Figure 32. Pulsed Operation
The resistive portion of the source impedance
produces thermal noise proportional to the square
root of the resistance. Figure 33 plots this equation.
The source impedance is usually fixed; consequently,
select the op amp and the feedback resistors to
minimize the respective contributions to the total
noise.
NOISE PERFORMANCE
Figure 33 shows the total circuit noise for varying
source impedances with the op amp in a unity-gain
configuration (no feedback resistor network, and
therefore no additional noise contributions).
The OPA160x (GBW = 35MHz, G = +1) is shown with
total circuit noise calculated. The op amp itself
contributes both a voltage noise component and a
current noise component. The voltage noise is
commonly modeled as a time-varying component of
the offset voltage. The current noise is modeled as
the time-varying component of the input bias current
and reacts with the source resistance to create a
voltage component of noise. Therefore, the lowest
noise op amp for a given application depends on the
source impedance. For low source impedance,
current noise is negligible, and voltage noise
generally dominates. The low voltage noise of the
OPA160x series op amps makes them a better
choice for low source impedances of less than 1kΩ.
Figure 34 illustrates both inverting and noninverting
op amp circuit configurations with gain. In circuit
configurations with gain, the feedback network
resistors also contribute noise. The current noise of
the op amp reacts with the feedback resistors to
create additional noise components. The feedback
resistor values can generally be chosen to make
these noise sources negligible. The equations for
total noise are shown for both configurations.
Copyright © 2011, Texas Instruments Incorporated
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A) Noise in Noninverting Gain Configuration
Noise at the output:
R2
2
2
2
R2
R2
R1
R2
R1
2
EO
2
en
2
2
es
e12 + e2
+
R1
1 +
1 +
=
+
R1
EO
4kTRS
4kTR1
4kTR2
Where eS =
e1 =
= thermal noise of RS
= thermal noise of R1
= thermal noise of R2
RS
VS
e2 =
B) Noise in Inverting Gain Configuration
Noise at the output:
R2
2
2
2
R2
EO2 = 1 +
R2
R2
R1 + RS
2
2
2
en
+
e12 + e2
+
es
R1
R1 + RS
R1 + RS
EO
RS
4kTRS
4kTR1
4kTR2
Where eS =
e1 =
= thermal noise of RS
= thermal noise of R1
= thermal noise of R2
VS
e2 =
Note: For the OPA160x series of op amps at 1kHz, en = 2.5nV/√Hz and in = 1.8pA√Hz.
Figure 34. Noise Calculation in Gain Configurations
12
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SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
TOTAL HARMONIC DISTORTION
MEASUREMENTS
The validity of this technique can be verified by
duplicating measurements at high gain and/or high
frequency where the distortion is within the
measurement capability of the test equipment.
Measurements for this data sheet were made with an
Audio Precision System Two distortion/noise
analyzer, which greatly simplifies such repetitive
measurements. The measurement technique can,
however, be performed with manual distortion
measurement instruments.
The OPA160x series op amps have excellent
distortion characteristics. THD + noise is below
0.00008% (G = +1, VO = 3VRMS, BW = 80kHz)
throughout the audio frequency range, 20Hz to
20kHz, with
a
2kΩ load (see Figure
7
for
characteristic performance).
The distortion produced by the OPA160x series op
amps is below the measurement limit of many
commercially available distortion analyzers. However,
a special test circuit (such as Figure 35 shows) can
be used to extend the measurement capabilities.
CAPACITIVE LOADS
The dynamic characteristics of the OPA1602 and
OPA1604 have been optimized for commonly
encountered gains, loads, and operating conditions.
The combination of low closed-loop gain and high
capacitive loads decreases the phase margin of the
amplifier and can lead to gain peaking or oscillations.
As a result, heavier capacitive loads must be isolated
from the output. The simplest way to achieve this
isolation is to add a small resistor (RS equal to 50Ω,
for example) in series with the output.
Op amp distortion can be considered an internal error
source that can be referred to the input. Figure 35
shows a circuit that causes the op amp distortion to
be gained up (refer to the table in Figure 35 for the
distortion gain factor for various signal gains). The
addition of R3 to the otherwise standard noninverting
amplifier configuration alters the feedback factor or
noise gain of the circuit. The closed-loop gain is
unchanged, but the feedback available for error
correction is reduced by the distortion gain factor,
thus extending the resolution by the same amount.
Note that the input signal and load applied to the op
amp are the same as with conventional feedback
without R3. The value of R3 should be kept small to
minimize its effect on the distortion measurements.
This small series resistor also prevents excess power
dissipation if the output of the device becomes
shorted. Figure 19 illustrates a graph of Small-Signal
Overshoot vs Capacitive Load for several values of
RS. Also, refer to Applications Bulletin AB-028
(literature number SBOA015, available for download
from the TI web site) for details of analysis
techniques and application circuits.
R1
R2
SIGNAL DISTORTION
R1
R2
R3
GAIN
+1
GAIN
101
¥
1kW
10W
R3
OPA160x
VO = 3VRMS
-1
101
4.99kW 4.99kW 49.9W
549W 4.99kW 49.9W
R2
R1
Signal Gain = 1+
+10
110
R2
Distortion Gain = 1+
R1 II R3
Generator
Output
Analyzer
Input
Audio Precision
System Two(1)
Load
with PC Controller
(1) For measurement bandwidth, see Figure 7 through Figure 12.
Figure 35. Distortion Test Circuit
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POWER DISSIPATION
When the operational amplifier connects into a circuit
such as that illustrated in Figure 36, the ESD
protection components are intended to remain
inactive and not become involved in the application
circuit operation. However, circumstances may arise
where an applied voltage exceeds the operating
voltage range of a given pin. Should this condition
occur, there is a risk that some of the internal ESD
protection circuits may be biased on, and conduct
current. Any such current flow occurs through
steering diode paths and rarely involves the
absorption device.
The OPA1602 and OPA1604 series op amps are
capable of driving 2kΩ loads with a power-supply
voltage up to ±18V and full operating temperature
range. Internal power dissipation increases when
operating at high supply voltages. Copper leadframe
construction used in the OPA160x series op amps
improves heat dissipation compared to conventional
materials. Circuit board layout can also help minimize
junction temperature rise. Wide copper traces help
dissipate the heat by acting as an additional heat
sink. Temperature rise can be further minimized by
soldering the devices to the circuit board rather than
using a socket.
Figure 36 depicts a specific example where the input
voltage, VIN, exceeds the positive supply voltage
(+VS) by 500mV or more. Much of what happens in
the circuit depends on the supply characteristics. If
+VS can sink the current, one of the upper input
steering diodes conducts and directs current to +VS.
Excessively high current levels can flow with
increasingly higher VIN. As a result, the datasheet
specifications recommend that applications limit the
input current to 10mA.
ELECTRICAL OVERSTRESS
Designers often ask questions about the capability of
an operational amplifier to withstand electrical
overstress. These questions tend to focus on the
device inputs, but may involve the supply voltage pins
or even the output pin. Each of these different pin
functions have electrical stress limits determined by
the voltage breakdown characteristics of the
particular semiconductor fabrication process and
specific circuits connected to the pin. Additionally,
internal electrostatic discharge (ESD) protection is
built into these circuits to protect them from
accidental ESD events both before and during
product assembly.
If the supply is not capable of sinking the current, VIN
may begin sourcing current to the operational
amplifier, and then take over as the source of positive
supply voltage. The danger in this case is that the
voltage can rise to levels that exceed the operational
amplifier absolute maximum ratings. In extreme but
rare cases, the absorption device triggers on while
+VS and –VS are applied. If this event happens, a
direct current path is established between the +VS
and –VS supplies. The power dissipation of the
absorption device is quickly exceeded, and the
extreme internal heating destroys the operational
amplifier.
It is helpful to have a good understanding of this
basic ESD circuitry and its relevance to an electrical
overstress event. Figure 36 illustrates the ESD
circuits contained in the OPA160x (indicated by the
dashed line area). The ESD protection circuitry
involves several current-steering diodes connected
from the input and output pins and routed back to the
internal power-supply lines, where they meet at an
absorption device internal to the operational amplifier.
This protection circuitry is intended to remain inactive
during normal circuit operation.
Another common question involves what happens to
the amplifier if an input signal is applied to the input
while the power supplies +VS and/or –VS are at 0V.
Again, it depends on the supply characteristic while at
0V, or at a level below the input signal amplitude. If
the supplies appear as high impedance, then the
operational amplifier supply current may be supplied
by the input source via the current steering diodes.
This state is not a normal bias condition; the amplifier
most likely will not operate normally. If the supplies
are low impedance, then the current through the
steering diodes can become quite high. The current
level depends on the ability of the input source to
deliver current, and any resistance in the input path.
An ESD event produces
a
short duration,
high-voltage pulse that is transformed into a short
duration, high-current pulse as it discharges through
a semiconductor device. The ESD protection circuits
are designed to provide a current path around the
operational amplifier core to prevent it from being
damaged. The energy absorbed by the protection
circuitry is then dissipated as heat.
When an ESD voltage develops across two or more
of the amplifier device pins, current flows through one
or more of the steering diodes. Depending on the
path that the current takes, the absorption device
may activate. The absorption device internal to the
OPA160x triggers when a fast ESD voltage pulse is
impressed across the supply pins. Once triggered, it
quickly activates, clamping the ESD pulse to a safe
voltage level.
14
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SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
If there is an uncertainty about the ability of the
supply to absorb this current, external zener diodes
may be added to the supply pins as shown in
Figure 36.
The zener voltage must be selected such that the
diode does not turn on during normal operation.
However, its zener voltage should be low enough so
that the zener diode conducts if the supply pin begins
to rise above the safe operating supply voltage level.
TVS
RF
+VS
+V
OPA160x
RI
ESD Current-
Steering Diodes
-In
Out
Op-Amp
Core
RS
+In
Edge-Triggered ESD
Absorption Circuit
RL
ID
(1)
VIN
-V
-VS
TVS
(1) VIN = +VS + 500mV.
Figure 36. Equivalent Internal ESD Circuitry and Its Relation to a Typical Circuit Application (Single
Channel Shown)
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OPA1602
OPA1604
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
www.ti.com
APPLICATION CIRCUIT
An additional application idea is shown in Figure 37.
820W
2200pF
0.1mF
+VA
(+15V)
330W
IOUTL+
OPA160x
2700pF
-VA
(-15V)
680W
620W
0.1mF
+VA
(+15V)
0.1mF
Audio DAC
with Differential
Current
Outputs
100W
L Ch
Output
820W
OPA160x
8200pF
2200pF
-VA
(-15V)
0.1mF
0.1mF
+VA
(+15V)
680W
620W
IOUTL-
OPA160x
2700pF
330W
-VA
(-15V)
0.1mF
Figure 37. Audio DAC I/V Converter and Output Filter
16
Copyright © 2011, Texas Instruments Incorporated
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OPA1604
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SBOS474B –APRIL 2011–REVISED NOVEMBER 2011
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (April, 2011) to Revision B
Page
•
•
•
•
•
•
•
•
•
•
•
Revised minimum and typical Common-mode rejection ratio specifications ........................................................................ 3
Added footnote (2) to Electrical Characteristics table ........................................................................................................... 3
Added separate quiescent current specifications for dual and quad versions ..................................................................... 4
Added footnote (3) to Electrical Characteristics table ........................................................................................................... 4
Corrected product identification and values in OPA1602 Thermal Information table ........................................................... 4
Added values to OPA1604 Thermal Information table. ........................................................................................................ 4
Updated device name in Figure 3 ......................................................................................................................................... 5
Updated Figure 25 to show both devices ............................................................................................................................. 9
Updated Figure 26 to show both devices ............................................................................................................................. 9
Updated device name in Figure 33 ..................................................................................................................................... 11
Changed Power Dissipation section ................................................................................................................................... 14
Copyright © 2011, Texas Instruments Incorporated
17
Product Folder Link(s): OPA1602 OPA1604
PACKAGE OPTION ADDENDUM
www.ti.com
12-Dec-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
OPA1602AID
OPA1602AIDGK
OPA1602AIDGKR
OPA1602AIDR
OPA1604AID
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
MSOP
MSOP
SOIC
D
DGK
DGK
D
8
8
75
80
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
8
2500
2500
50
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
SOIC
D
14
14
14
14
Green (RoHS
& no Sb/Br)
OPA1604AIDR
OPA1604AIPW
OPA1604AIPWR
SOIC
D
2500
90
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
PW
PW
Green (RoHS
& no Sb/Br)
2000
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Dec-2011
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Dec-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA1602AIDGKR
OPA1602AIDR
OPA1604AIDR
MSOP
SOIC
SOIC
DGK
D
8
8
2500
2500
2500
330.0
330.0
330.0
12.4
12.4
16.4
5.3
6.4
6.5
3.4
5.2
9.0
1.4
2.1
2.1
8.0
8.0
8.0
12.0
12.0
16.0
Q1
Q1
Q1
D
14
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Dec-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA1602AIDGKR
OPA1602AIDR
OPA1604AIDR
MSOP
SOIC
SOIC
DGK
D
8
8
2500
2500
2500
358.0
346.0
346.0
335.0
346.0
346.0
35.0
29.0
33.0
D
14
Pack Materials-Page 2
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相关型号：
OPA1612AIDRGT
SoundPlus™ Audio Operational Amplifier with 1.1nV/√Hz Noise, Low THD and Precision 8-SON -40 to 85
TI
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