OPA2234M [TI]

LOW-POWER, PRECISION SINGLE-SUPPLY OPERATIONAL AMPLIFIERS; 低功耗,精密单电源运算放大器
OPA2234M
型号: OPA2234M
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LOW-POWER, PRECISION SINGLE-SUPPLY OPERATIONAL AMPLIFIERS
低功耗,精密单电源运算放大器

运算放大器
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OPA2234M  
www.ti.com  
SGDS040 FEBRUARY 2011  
LOW-POWER, PRECISION  
SINGLE-SUPPLY OPERATIONAL AMPLIFIERS  
Check for Samples: OPA2234M  
1
FEATURES  
x
x
2
Wide Supply Range:  
Single Supply: VS = 2.7 V to 36 V  
Dual Supply: VS = ±1.35 V to ±18 V  
OPA2234  
Specified Performance:  
2.7 V, 5 V, and ±15 V  
Out A  
In A  
+In A  
V–  
1
2
3
4
8
7
6
5
V+  
A
Out B  
In B  
+In B  
Low Quiescent Current: 250 μA/amp  
Low Input Bias Current: 35 nA Max  
Low Offset Voltage: 100 μV Typ  
High CMRR, PSRR, and AOL  
Dual Versions  
B
SO-8  
DESCRIPTION  
The OPA2234 series low-cost op amps are ideal for single-supply, low-voltage, low-power applications. The  
series provides lower quiescent current than older 1013-type products and comes in current industry-standard  
packages and pinouts. The combination of low offset voltage, high common-mode rejection, high power-supply  
rejection, and a wide supply range provides excellent accuracy and versatility. Dual versions have identical  
specifications for maximum design flexibility. These general-purpose op amps are ideal for portable and  
battery-powered applications.  
The OPA2234 series op amps operate from either single or dual supplies. In single-supply operation, the input  
common-mode range extends below ground and the output can swing to within 50mV of ground. Excellent phase  
margin makes the OPA2234 series ideal for demanding applications, including high load capacitance. Dual  
design features completely independent circuitry for lowest crosstalk and freedom from interaction.  
Single and dual packages are in an SO-8 surface-mount and are specified for 55°C to 125°C operation.  
ORDERING INFORMATION(1)  
PRODUCT  
PACKAGE  
PACKAGE MARKING  
OPA2234MDR  
SO-8 Surface-Mount  
2234M  
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
© 2011, Texas Instruments Incorporated  
OPA2234M  
SGDS040 FEBRUARY 2011  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
UNIT  
Supply Voltage, V+ to V  
Input Voltage  
(V) 0.7 to (V+) + 0.7  
V
Output Short-Circuit(1)  
Operating Temperature  
Storage Temperature  
Continuous  
55 to 125  
55 to 125  
150  
°C  
°C  
TJA  
TJC  
Junction Temperature  
°C/W  
°C  
39  
Lead Temperature (soldering, 10 s)  
300  
(1) Short-circuit to ground, one amplifier per package.  
2
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© 2011, Texas Instruments Incorporated  
Product Folder Link(s): OPA2234M  
OPA2234M  
www.ti.com  
SGDS040 FEBRUARY 2011  
ELECTRICAL CHARACTERISTICS: VS = 5 V  
At TA = 55°C to 125°C, VS = 5 V, RL = 10 kconnected to VS/2, and VOUT = VS/2, unless otherwise noted.  
PARAMETER  
OFFSET VOLTAGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
TA = 25°C, VCM = 2.5 V  
VCM = 2.5 V  
±40  
±100  
Input Offset Voltage  
VOS  
μV  
±600  
vs Temperature(1)  
vs Power Supply  
dVOS/dT  
PSRR  
Operating Temperature Range  
±3  
μV/°C  
µV/V  
VS = 2.7 V to 30 V,  
VCM = 1.7 V  
3
20  
vs Time  
0.2  
0.3  
μV/mo  
μV/V  
Channel Separation (Dual)  
INPUT BIAS CURRENT  
Input Bias Current(2)  
Input Offset Current  
NOISE  
IB  
VCM = 2.5 V  
VCM = 2.5 V  
f = 1 kHz  
15  
±1  
35  
±12  
nA  
nA  
IOS  
Input Voltage Noise Density  
Current Noise Density  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
Common-Mode Rejection  
INPUT IMPEDANCE  
Differential  
Vn  
In  
25  
80  
nV/Hz  
fA/Hz  
0.5  
86  
(V+) 1  
V
CMRR  
VCM = 0.5 V to 4 V  
106  
dB  
107 || 5  
1010 || 6  
|| pF  
|| pF  
Common-Mode  
VCM = 2.5 V  
OPEN-LOOP GAIN  
RL = 10 k, VO = 0.25 V to 4 V  
RL = 2 k, VO = 0.5 V to 4 V  
78  
75  
120  
96  
dB  
dB  
Open-Loop Voltage Gain  
AOL  
FREQUENCY RESPONSE  
Gain-Bandwidth Product  
Slew Rate  
GBW  
SR  
CL = 100 pF  
0.35  
0.2  
MHz  
V/µs  
Settling Time:  
G = 1, 3 V Step,  
CL = 100 pF  
0.1%  
15  
μs  
G = 1, 3 V Step,  
CL = 100 pF  
0.01%  
25  
16  
μs  
μs  
Overload Recovery Time  
OUTPUT  
(VIN) (Gain) = VS  
Voltage Output:  
Positive  
RL = 10 kto VS/2  
RL = 10 kto VS/2  
RL = 10 kto Ground  
RL = 10 kto Ground  
(V+) 1  
0.25  
(V+) 0.65  
0.05  
V
V
Negative  
Positive  
(V+) 1  
0.1  
(V+) 0.65  
0.05  
V
Negative  
V
Short-Circuit Current  
ISC  
±11  
mA  
Capacitive Load Drive (Stable  
Operation)(3)  
G = 1  
1000  
pF  
POWER SUPPLY  
Specified Operating Voltage  
Operating Voltage Range  
5
V
V
2.7  
36  
Quiescent Current (per amplifier) IQ  
IO = 0  
250  
550  
μA  
(1) Wafer-level tested to 95% confidence level.  
(2) Positive conventional current flows into the input terminals.  
(3) See Small-Signal Overshoot vs Load Capacitance typical curve.  
© 2011, Texas Instruments Incorporated  
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3
Product Folder Link(s): OPA2234M  
OPA2234M  
SGDS040 FEBRUARY 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = 5 V (continued)  
At TA = 55°C to 125°C, VS = 5 V, RL = 10 kconnected to VS/2, and VOUT = VS/2, unless otherwise noted.  
PARAMETER  
TEMPERATURE RANGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Specified Range  
Operating Range  
Storage  
55  
125  
125  
125  
°C  
°C  
55  
55  
°C  
Thermal Resistance  
θJA  
150  
°C/W  
4
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© 2011, Texas Instruments Incorporated  
Product Folder Link(s): OPA2234M  
OPA2234M  
www.ti.com  
SGDS040 FEBRUARY 2011  
ELECTRICAL CHARACTERISTICS: VS = 2.7 V  
At TA = 55°C to 125°C, VS = 2.7 V, RL = 10 kconnected to VS/2, and VOUT = VS/2, unless otherwise noted.  
PARAMETER  
OFFSET VOLTAGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
TA = 25°C, VCM = 1.35 V  
VCM = 1.35 V  
±40  
±100  
Input Offset Voltage  
VOS  
µV  
±600  
vs Temperature(1)  
vs Power Supply  
dVOS/dT  
PSRR  
Operating Temperature Range  
±3  
µV/°C  
µV/V  
VS = 2.7 V to 30 V,  
VCM = 1.7 V  
3
20  
vs Time  
0.2  
0.3  
µV/mo  
µV/V  
Channel Separation (Dual)  
INPUT BIAS CURRENT  
Input Bias Current(2)  
Input Offset Current  
NOISE  
IB  
VCM = 1.35 V  
VCM = 1.35 V  
f = 1 kHz  
15  
±1  
35  
±12  
nA  
nA  
IOS  
Input Voltage Noise Density  
Current Noise Density  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
Common-Mode Rejection  
INPUT IMPEDANCE  
Differential  
Vn  
In  
25  
80  
nV/Hz  
fA/Hz  
0.5  
86  
(V+) 1.1  
V
CMRR  
VCM = 0.5 V to 1.6 V  
VCM = 1.35 V  
106  
dB  
107 || 5  
1010 || 6  
|| pF  
|| pF  
Common-Mode  
OPEN-LOOP GAIN  
RL = 10 k, VO = 0.25 V to 1.7 V  
RL = 2 k, VO = 0.5 V to 1.7 V  
78  
69  
125  
96  
dB  
dB  
Open-Loop Voltage Gain  
AOL  
FREQUENCY RESPONSE  
Gain-Bandwidth Product  
Slew Rate  
GBW  
SR  
CL = 100 pF  
0.35  
0.2  
MHz  
V/µs  
Settling Time:  
G = 1, 1 V Step,  
CL = 100 pF  
0.1%  
6
µs  
G = 1, 1 V Step,  
CL = 100 pF  
0.01%  
16  
8
µs  
µs  
Overload Recovery Time  
OUTPUT  
(VIN) (Gain) = VS  
Voltage Output:  
Positive  
RL = 10 kto VS/2  
RL = 10 kto VS/2  
RL = 10 kto Ground  
RL = 10 kto Ground  
(V+) 1  
0.25  
(V+) 0.6  
0.05  
V
V
Negative  
Positive  
(V+) 1  
0.1  
(V+) 0.65  
0.05  
V
Negative  
V
Short-Circuit Current  
ISC  
±8  
mA  
Capacitive Load Drive (Stable  
Operation)(3)  
G = 1  
1000  
pF  
POWER SUPPLY  
Specified Operating Voltage  
Operating Voltage Range  
2.7  
V
V
2.7  
36  
Quiescent Current (per  
amplifier)  
IQ  
IO = 0  
250  
550  
μA  
(1) Wafer-level tested to 95% confidence level.  
(2) Positive conventional current flows into the input terminals.  
(3) See Small-Signal Overshoot vs Load Capacitance typical curve.  
© 2011, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): OPA2234M  
OPA2234M  
SGDS040 FEBRUARY 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = 2.7 V (continued)  
At TA = 55°C to 125°C, VS = 2.7 V, RL = 10 kconnected to VS/2, and VOUT = VS/2, unless otherwise noted.  
PARAMETER  
TEMPERATURE RANGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Specified Range  
Operating Range  
Storage  
55  
125  
125  
125  
°C  
°C  
55  
55  
°C  
Thermal Resistance  
θJA  
150  
°C/W  
6
Submit Documentation Feedback  
© 2011, Texas Instruments Incorporated  
Product Folder Link(s): OPA2234M  
OPA2234M  
www.ti.com  
SGDS040 FEBRUARY 2011  
ELECTRICAL CHARACTERISTICS: VS = ±15 V  
At TA = 55°C to 125°C, VS = ±15 V, RL = 10 kconnected to VS/2, and VOUT = VS/2, unless otherwise noted.  
PARAMETER  
OFFSET VOLTAGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
TA = 25°C, VCM = 0 V  
VCM = 0 V  
±70  
±250  
Input Offset Voltage  
VOS  
µV  
±750  
vs Temperature(1)  
vs Power Supply  
dVOS/dT  
PSRR  
Operating Temperature Range  
±3  
µV/°C  
µV/V  
VS = ±1.35 V to ±18 V,  
3
20  
VCM = 0 V  
vs Time  
0.2  
0.3  
µV/mo  
µV/V  
Channel Separation (Dual)  
INPUT BIAS CURRENT  
Input Bias Current(2)  
Input Offset Current  
NOISE  
IB  
VCM = 0 V  
VCM = 0 V  
f = 1 kHz  
12  
±1  
30  
±12  
nA  
nA  
IOS  
Input Voltage Noise Density  
Current Noise Density  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
Common-Mode Rejection  
INPUT IMPEDANCE  
Differential  
Vn  
In  
25  
80  
nV/Hz  
fA/Hz  
(V) + 1  
(V+) 1  
V
CMRR  
VCM = 14 V to 14 V  
86  
106  
dB  
107 || 5  
1010 || 6  
|| pF  
|| pF  
Common-Mode  
VCM = 0 V  
VO = 13.5 V to 13 V  
CL = 100 pF  
OPEN-LOOP GAIN  
Open-Loop Voltage Gain  
FREQUENCY RESPONSE  
Gain-Bandwidth Product  
Slew Rate  
AOL  
87  
120  
dB  
GBW  
SR  
0.35  
0.2  
MHz  
V/μs  
Settling Time:  
G = 1, 10 V Step,  
CL = 100 pF  
0.1%  
41  
μs  
G = 1, 10 V Step,  
CL = 100 pF  
0.01%  
47  
22  
μs  
μs  
Overload Recovery Time  
OUTPUT  
(VIN) (Gain) = VS  
Voltage Output:  
Positive  
(V+) 2  
(V+) 0.7  
(V) + 0.15  
±22  
V
V
Negative  
(V) + 1.5  
Short-Circuit Current  
ISC  
mA  
Capacitive Load Drive (Stable  
Operation)(3)  
G = 1  
1000  
pF  
POWER SUPPLY  
Specified Operating Voltage  
Operating Voltage Range  
±15  
V
V
±1.35  
±18  
Quiescent Current (per amplifier) IQ  
IO = 0  
±275  
±550  
μA  
(1) Wafer-level tested to 95% confidence level.  
(2) Positive conventional current flows into the input terminals.  
(3) See Small-Signal Overshoot vs Load Capacitance typical curve.  
© 2011, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): OPA2234M  
OPA2234M  
SGDS040 FEBRUARY 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = ±15 V (continued)  
At TA = 55°C to 125°C, VS = ±15 V, RL = 10 kconnected to VS/2, and VOUT = VS/2, unless otherwise noted.  
PARAMETER  
TEMPERATURE RANGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Specified Range  
Operating Range  
Storage  
55  
125  
°C  
°C  
55  
55  
125  
125  
°C  
Thermal Resistance  
θJA  
150  
°C/W  
8
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© 2011, Texas Instruments Incorporated  
Product Folder Link(s): OPA2234M  
OPA2234M  
www.ti.com  
SGDS040 FEBRUARY 2011  
TYPICAL CHARACTERISTICS  
POWER-SUPPLY AND COMMON-MODE REJECTION  
OPEN-LOOP GAIN/PHASE vs FREQUENCY  
vs FREQUENCY  
140  
120  
VS = 2.7 V  
120  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
+PSR  
CL = 100 pF  
100  
80  
VS = 5 V  
15 V  
30  
60  
90  
120  
150  
180  
CMR  
φ
60  
40  
VO = 0.25 V  
VS  
20  
0
G
V
S = 2.7 V, 5 V  
or 15 V  
VO  
=
2
VS = 2.7 V or 5 V  
VS 15 V  
20  
=
PSR  
0.1  
1
10  
100  
1k  
10k  
100k  
1M  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
Frequency (Hz)  
INPUT NOISE AND CURRENT NOISE  
SPECTRAL DENSITY vs FREQUENCY  
CHANNEL SEPARATION vs FREQUENCY  
RL = 10 k  
160  
140  
120  
100  
80  
1k  
Current Noise  
100  
Dual and quad devices.  
G = 1, all channels.  
Quad measured channel  
A to D or B to C—other  
combinations yield improved  
rejection.  
Voltage Noise  
10  
10  
100  
1k  
10k  
100k  
1
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
INPUT BIAS AND INPUT OFFSET CURRENT  
vs TEMPERATURE  
INPUT BIAS CURRENT  
vs INPUT COMMON-MODE VOLTAGE  
17  
16  
15  
14  
13  
12  
11  
10  
20  
VS = 2.7 V, 5 V  
VS = 5 V  
15  
10  
5  
IB  
VS  
=
15 V  
VS = 2.7 V  
VS  
= 15 V  
IOS  
0
5
75  
50  
25  
0
25  
50  
75  
100  
125  
15  
10  
5  
0
5
10  
15  
Common-Mode Voltage (V)  
Ambient Temperature (°C)  
© 2011, Texas Instruments Incorporated  
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Product Folder Link(s): OPA2234M  
OPA2234M  
SGDS040 FEBRUARY 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
OFFSET VOLTAGE  
PRODUCTION DISTRIBUTION  
OFFSET VOLTAGE  
PRODUCTION DISTRIBUTION  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
Typical production  
Typical production  
VS = 2.7 V, 5 V  
VS  
= 15 V  
distribution of packaged  
units. Single, dual,  
distribution of packaged  
units. Single, dual, and  
quad units included.  
and quad units included.  
0.7%  
0.3%  
0.1%  
0.3%  
0.5%  
0.1%  
0.1%  
0.2%  
0
0
Offset Voltage (µV)  
Offset Voltage (µV)  
OFFSET VOLTAGE DRIFT  
PRODUCTION DISTRIBUTION  
OFFSET VOLTAGE DRIFT  
PRODUCTION DISTRIBUTION  
35  
30  
25  
20  
15  
10  
5
35  
30  
25  
20  
15  
10  
5
VS = 5 V  
Typical production  
VS = 2.7 V  
Typical production  
distribution of packaged  
units. Single, dual,  
distribution of packaged  
units. Single, dual,  
and quad units included.  
and quad units included.  
0.3%  
0.5%  
0.3%  
0.2% 0.1%  
0.1%  
0.2% 0.1%  
0.1%  
0.1%  
0
0
Offset Voltage Drift (µV/°C)  
AOL, CMR, AND PSR vs TEMPERATURE  
Offset Voltage Drift (µV/°C)  
OFFSET VOLTAGE DRIFT  
PRODUCTION DISTRIBUTION  
140  
130  
120  
110  
100  
90  
VS = 2.7 V  
S = 5 V  
VS 15 V  
30  
25  
20  
15  
10  
5
Typical production  
V
AOL  
VS  
=
15 V  
distribution of packaged  
units. Single, dual,  
=
PSR  
and quad units included.  
CMR  
80  
0.4%  
0.3%  
0.2%  
0.1%  
70  
0.1%  
0.1%  
0.1%  
VCM = (V) 0.02 V to (V+) 1 V  
60  
0
75  
50  
25  
0
25  
50  
75  
100  
125  
Ambient Temperature ( °C)  
Offset Voltage Drift (µV/°C)  
10  
Submit Documentation Feedback  
© 2011, Texas Instruments Incorporated  
Product Folder Link(s): OPA2234M  
OPA2234M  
www.ti.com  
SGDS040 FEBRUARY 2011  
TYPICAL CHARACTERISTICS (continued)  
SMALL-SIGNAL STEP RESPONSE  
SMALL-SIGNAL STEP RESPONSE  
G = 1, C = 100 pF, V = 5 V  
G = 1, CL = 10,000 pF, VS = 5 V  
L
S
2 ms/div  
20 µs/div  
SETTLING TIME vs CLOSED-LOOP GAIN  
CL = 100 pF  
LARGE-SIGNAL STEP RESPONSE  
G = 1, C = 100 pF, V = 5 V  
1000  
100  
10  
L
S
V
= ±15 V,  
S
10 V Step  
V
= 5 V,  
S
3 V Step  
0.1%  
V
= 2.7 V,  
S
1 V Step  
0.01%  
1
1
10  
100  
10 ms/div  
Gain (V/V)  
SMALL-SIGNAL OVERSHOOT  
vs LOAD CAPACITANCE  
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT  
V+  
70  
60  
50  
40  
30  
20  
10  
0
(V+) 0.5  
(V+) 1.0  
(V+) 1.5  
(V+) 2.0  
(V+) 2.5  
(V+) 3.0  
25°C  
55°C  
VO = 100 mVp-p  
125°C  
G = 2  
85°C  
40°C  
G = 1,  
(V) +3.0  
(V) +2.5  
(V) +2.0  
(V) +1.5  
(V) +1.0  
(V) +0.5  
V–  
85°C  
G = 2  
40°C  
G = 1,  
VS 15 V  
25°C  
55°C  
125°C  
=
High output current may  
not be available at low  
supply voltages due to  
output swing limitations.  
G = 10  
G = 1,  
S = 2.7, 5 V  
V
0
5
10  
15  
10 pF  
100 pF  
1 nF  
Load Capacitance  
10 nF  
100 nF  
Output Current (mA)  
© 2011, Texas Instruments Incorporated  
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Product Folder Link(s): OPA2234M  
OPA2234M  
SGDS040 FEBRUARY 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
MAXIMUM OUTPUT VOLTAGE  
vs FREQUENCY  
QUIESCENT CURRENT AND SHORT-CIRCUIT CURRENT  
vs TEMPERATURE  
30  
25  
20  
15  
10  
5
70  
60  
50  
40  
30  
20  
10  
0
525  
450  
375  
300  
225  
150  
75  
VS = 2.7 V  
VS = 5 V  
VS  
= 15 V  
VS = 2.7 V or 5 V  
Maximum output voltage  
VS  
= 15 V  
without slew-rate induced  
distortion.  
IQ  
ISC  
VS = 5 V  
VS 2.7 V  
=
0
0
75  
50  
25  
0
25  
50  
75  
100  
125  
1k  
10k  
Frequency (Hz)  
100k  
Temperature (° C)  
12  
Submit Documentation Feedback  
© 2011, Texas Instruments Incorporated  
Product Folder Link(s): OPA2234M  
OPA2234M  
www.ti.com  
SGDS040 FEBRUARY 2011  
APPLICATION INFORMATION  
The OPA2234 series op amps are unity-gain stable and suitable for a wide range of general-purpose  
applications. Power-supply pins should be bypassed with 10 nF ceramic capacitors.  
OPERATING VOLTAGE  
The OPA2234 series op amps operate from single (2.7 V to 36 V) or dual (±1.35 V to ±18 V) supplies with  
excellent performance. Specifications are production tested with 2.7 V, 5 V, and ±15 V supplies. Most behavior  
remains unchanged throughout the full operating voltage range. Parameters which vary significantly with  
operating voltage are shown in the Typical Characteristic curves.  
© 2011, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Link(s): OPA2234M  
PACKAGE OPTION ADDENDUM  
www.ti.com  
3-Mar-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
OPA2234MDR  
ACTIVE  
SOIC  
D
8
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF OPA2234M :  
Catalog: OPA2234  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
OPA2234MDR  
SOIC  
D
8
2500  
330.0  
12.4  
6.4  
5.2  
2.1  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
OPA2234MDR  
D
8
2500  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
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performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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