OPA2234U-1/2K5G4 [TI]
DUAL OP-AMP, 250uV OFFSET-MAX, 0.35MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, SOIC-8;
| 型号： | OPA2234U-1/2K5G4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL OP-AMP, 250uV OFFSET-MAX, 0.35MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, SOIC-8 放大器 光电二极管 |
| 文件： | 总33页 (文件大小：1659K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA347
OPA2347
OPA4347
O
®
P
OPA347
O
A
P
3
4
A
7
3
4
7
O
O
P
P
A
4
A
2
3
3
4
4
7
7
SBOS167D – NOVEMBER 2000– REVISED JULY 2007
microPower, Rail-to-Rail
Operational Amplifiers
FEATURES
ꢀ LOW IQ: 20µA
DESCRIPTION
The OPA347 is a microPower, low-cost operational amplifier
available in micropackages. The OPA347 (single version) is
available in the SC-70 and SOT23-5 packages. The OPA2347
(dual version) is available in the SOT23-8 and WCSP-8
packages. Both are also available in the SO-8. The OPA347
is also available in the DIP-8. The OPA4347 (quad) is
available in the SO-14 and the TSSOP-14.
ꢀ microSIZE PACKAGES: WCSP-8, SC70-5
SOT23-5, SOT23-8, and TSSOP-14
ꢀ HIGH SPEED/POWER RATIO WITH
ꢀBANDWIDTH: 350kHz
ꢀ RAIL-TO-RAIL INPUT AND OUTPUT
ꢀ SINGLE SUPPLY: 2.3V to 5.5V
The small size and low power consumption (34µA per chan-
nel maximum) of the OPA347 make it ideal for portable and
battery-powered applications. The input range of the OPA347
extends 200mV beyond the rails, and the output range is
within 5mV of the rails. The OPA347 also features an
excellent speed/power ratio with a bandwidth of 350kHz.
APPLICATIONS
ꢀꢀPORTABLE EQUIPMENT
ꢀꢀBATTERY-POWERED EQUIPMENT
ꢀꢀ2-WIRE TRANSMITTERS
ꢀꢀSMOKE DETECTORS
The OPA347 can be operated with a single or dual power
supply from 2.3V to 5.5V. All models are specified for
operation from –55°C to +125°C.
ꢀꢀCO DETECTORS
OPA347
OPA347
Out
V–
1
2
3
5
4
V+
OPA4347
+In
V–
–In
1
2
3
5
4
V+
OPA2347
(bump side down)
Not to Scale
Out A
–In A
+In A
V+
1
2
3
4
5
6
7
14 Out D
13 –In D
12 +In D
11 V–
Out
+In
–In
SC70-5
A
B
D
C
V+
Out A
–In A
+In A
V–
1
2
3
4
8
7
6
5
SOT23-5
Out B
–In B
+In B
OPA347
OPA2347
+In B
–In B
Out B
10 +In C
NC
V+
NC
–In
+In
V–
1
8
Out A
–In A
+In A
V–
1
2
3
4
8
7
6
5
V+
9
8
–In C
A
2
3
4
7
6
5
Out B
–In B
+In B
Out C
WCSP-8
(top view)
B
Out
NC
TSSOP-14, SO-14
SO-8, DIP-8
SOT23-8, SO-8
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2000-2007, Texas Instruments Incorporated
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage, V+ to V–................................................................... 7.5V
Signal Input Terminals, Voltage(2) .................. (V–) – 0.5V to (V+) + 0.5V
Current(2) .................................................... 10mA
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper
handling and installation procedures can cause damage.
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–65°C to +150°C
Storage Temperature .....................................................–65°C to +150°C
Junction Temperature ...................................................................... 150°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only. Functional opera-
tion of the device at these conditions, or beyond the specified operating
conditions, is not implied. (2) Input terminals are diode-clamped to the
power-supply rails. Input signals that can swing more than 0.5V beyond the
supply rails should be current-limited to 10mA or less. (3) Short-circuit to
ground, one amplifier per package.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PACKAGE
MARKING
PRODUCT
PACKAGE/LEAD
OPA347NA
SOT23-5
DBV
A47
"
"
DIP-8
SO-8
"
SC-70
"
"
P
D
"
OPA347PA
OPA347PA
OPA347UA
OPA347UA
"
"
"
S47
"
OPA347SA
DCK
"
"
OPA2347EA
SOT23-8
DCN
B47
"
"
SO-8
"
"
D
"
"
OPA2347UA
OPA2347UA
"
"
OPA2347YED
"
OPA2347YZDR
WCSP-8
YED
"
YZD
YMD CCS
"
"
A9
Lead-Free WCSP-8
OPA4347EA
TSSOP-14
PW
"
OPA4347EA
"
"
SO-14
"
"
OPA4347UA
D
OPA4347UA
"
"
"
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com.
OPA347, 2347, 4347
2
SBOS167D
www.ti.com
ELECTRICAL CHARACTERISTICS: VS = 2.5V to 5.5V
Boldface limits apply over the specified temperature range, TA = –55°C to +125°C.
At TA = +25°C, RL = 100kΩ connected to VS/2 and VOUT = VS/2, unless otherwise noted.
OPA347NA, UA, PA, SA
OPA2347EA, UA, YED
OPA4347EA, UA
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage
over Temperature
Drift
vs Power Supply
over Temperature
Channel Separation, DC
VOS
VS = 5.5V, VCM = (V–) + 0.8V
2
2
3
6
7
mV
mV
dVOS/dT
PSRR
µV/°C
µV/V
µV/V
µV/V
dB
VS = 2.5V to 5.5V, VCM < (V+) – 1.7V
VS = 2.5V to 5.5V, VCM < (V+) – 1.7V
60
175
300
0.3
128
f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
over Temperature
VCM
CMRR
(V–) – 0.2
(V+) + 0.2
V
VS = 5.5V, (V–) – 0.2V < VCM < (V+) – 1.7V
VS = 5.5V, V– < VCM < (V+) – 1.7V
Vs = 5.5V, (V–) – 0.2V < VCM < (V+) + 0.2V
Vs = 5.5V, V– < VCM < V+
70
66
54
48
80
70
dB
dB
dB
dB
over Temperature
INPUT BIAS CURRENT(1)
Input Bias Current
Input Offset Current
Ib
IOS
±0.5
±0.5
±10
±10
pA
pA
INPUT IMPEDANCE
Differential
Common-Mode
1013 || 3
1013 || 6
Ω || pF
Ω || pF
NOISE
VCM < (V+) – 1.7V
Input Voltage Noise, f = 0.1Hz to 10Hz
Input Voltage Noise Density, f = 1kHz
Input Current Noise Density, f = 1kHz
12
60
0.7
µVPP
nV/√Hz
fA/√Hz
en
in
OPEN-LOOP GAIN
Open-Loop Voltage Gain
over Temperature
AOL VS = 5.5V, RL = 100kΩ, 0.015V < VO < 5.485V
VS = 5.5V, RL = 100k , 0.015V < VO < 5.485V
VS = 5.5V, RL = 5kΩ, 0.125V < VO < 5.375V
VS = 5.5V, RL = 5k , 0.125V < VO < 5.375V
100
88
100
88
115
115
115
dB
dB
dB
dB
dB
Ω
over Temperature
Ω
A
OL (SC-70 only) VS = 5.5V, RL = 5kΩ 0.125V < VO < 5.375V
96
OUTPUT
Voltage Output Swing from Rail
RL = 100kΩ, AOL > 100dB
5
15
15
125
125
mV
mV
mV
mV
mA
over Temperature
RL = 100kΩ, AOL > 88dB
RL = 5kΩ, AOL > 100dB
90
over Temperature
Short-Circuit Current
Capacitive Load Drive
RL = 5kΩ, AOL > 88dB
ISC
CLOAD
±17
See Typical Characteristics
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
0.01%
CL = 100pF
G = +1
VS = 5V, 2V Step, G = +1
VS = 5V, 2V Step, G = +1
VIN × Gain = VS
GBW
SR
tS
350
0.17
21
27
23
kHz
V/µs
µs
µs
µs
Overload Recovery Time
POWER SUPPLY
Specified Voltage Range
VS
2.5
5.5
V
V
V
µA
µA
Minimum Operating Voltage
Minimum Operating Voltage (OPA347SA)
Quiescent Current (per amplifier)
over Temperature
2.3
2.4
20
IQ
IO = 0
34
38
TEMPERATURE RANGE
Specified Range
Operating Range
–55
–65
–65
125
150
150
°C
°C
°C
Storage Range
Thermal Resistance
SOT23-5 Surface-Mount
SOT23-8 Surface-Mount
SO-8 Surface-Mount
SO-14 Surface-Mount
TSSOP-14 Surface-Mount
DIP-8
θJA
200
150
150
100
100
100
250
250
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
SC70-5 Surface-Mount
WCSP
NOTE: (1) Input bias current for the OPA2347YED package is specified in the absence of light. See the Photosensitivity section for further detail.
OPA347, 2347, 4347
3
SBOS167D
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
POWER-SUPPLY AND COMMON-MODE
REJECTION vs FREQUENCY
OPEN-LOOP GAIN/PHASE vs FREQUENCY
100
80
60
40
20
0
0
100
80
60
40
20
0
–30
–60
–90
–120
–150
–180
PSRR
CMRR
–20
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
VS = 5.5V
CHANNEL SEPARATION vs FREQUENCY
6
140
120
100
80
5
4
3
2
1
0
VS = 5.0V
VS = 2.5V
60
1k
10k
100k
Frequency (Hz)
1M
10
100
1k
10k
100k
1M
Frequency (Hz)
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
V+
(V+) – 1
(V+) – 2
30
25
20
15
10
25
20
15
10
5
Sourcing
–55°C
–55°C
125°C
25°C
IQ
2
1
0
Sinking
ISC
0
5
10
15
20
25
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Output Current (±mA)
Supply Voltage (V)
OPA347, 2347, 4347
4
SBOS167D
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN AND POWER-SUPPLY
REJECTION vs TEMPERATURE
COMMON-MODE REJECTION vs TEMPERATURE
100
130
120
110
100
90
90
V– < VCM < (V+) – 1.7V
AOL
80
70
V– < VCM < V+
60
PSRR
50
40
80
70
–75 –50 –25
0
25
50
75 100 125 150
–75 –50 –25
0
25
50
75 100 125 150
Temperature (°C)
Temperature (°C)
QUIESCENT AND SHORT-CIRCUIT CURRENT
vs TEMPERATURE
INPUT BIAS CURRENT vs TEMPERATURE
30
25
20
15
10
10k
1k
25
20
15
10
5
ISC
100
10
IQ
1
0.1
–50 –25
0
25
50
75
100 125 150
–75
125
–75 –50 –25
0
25
50
75
100
150
Temperature (°C)
Temperature (°C)
OFFSET VOLTAGE DRIFT MAGNITUDE
PRODUCTION DISTRIBUTION
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
25
20
15
10
5
18
16
14
12
10
8
Typical production
distribution of
packaged units.
6
4
2
0
0
1
2
3
4
5
6
7
8
9
10 11 12
–6 –5 –4 –3 –2 –1
0
1
2
3
4
5
6
Offset Voltage (mV)
Offset Voltage Drift (µV/°C)
OPA347, 2347, 4347
5
SBOS167D
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, and RL = 100kΩ connected to VS/2, unless otherwise noted.
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
60
50
40
30
20
10
0
G = –1V/V
G = ±5V/V
RFB = 100kΩ
RFB = 100kΩ
50
40
G = +1V/V
RL = 100kΩ
30
20
G = –1V/V
RFB = 5kΩ
10
0
10
100
1k
10k
10
100
1k
10k
Load Capacitance (pF)
Load Capacitance (pF)
SMALL-SIGNAL STEP RESPONSE
SMALL-SIGNAL STEP RESPONSE
G = +1V/V, RL = 100kΩ, CL = 100pF
G = +1V/V, RL = 5kΩ, CL = 100pF
10µs/div
10µs/div
LARGE-SIGNAL STEP RESPONSE
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
G = +1V/V, RL = 100kΩ, CL = 100pF
10k
1k
100
10
1.0
0.1
100
10
20µs/div
1
10
100
1k
10k
100k
Frequency (Hz)
OPA347, 2347, 4347
6
SBOS167D
www.ti.com
OPERATING VOLTAGE
APPLICATIONS INFORMATION
The OPA347 series op amps are unity-gain stable and can
operate on a single supply, making them highly versatile and
easy to use.
The OPA347 series op amps are fully specified and en-
sured from 2.5V to 5.5V. In addition, many specifications
apply from –55°C to +125°C. Parameters that vary signifi-
cantly with operating voltages or temperature are shown in
the Typical Characteristics.
Rail-to-rail input and output swing significantly increases dy-
namic range, especially in low supply applications. Figure 1
shows the input and output waveforms for the OPA347 in
unity-gain configuration. Operation is from VS = +5V with a
100kΩ load connected to VS/2. The input is a 5VPP sinusoid.
RAIL-TO-RAIL INPUT
The input common-mode voltage range of the OPA347
series extends 200mV beyond the supply rails. This is
achieved with a complementary input stage—an N-channel
input differential pair in parallel with a P-channel differential
pair, as shown in Figure 2. The N-channel pair is active for
input voltages close to the positive rail, typically (V+) – 1.3V
to 200mV above the positive supply, while the P-channel pair
is on for inputs from 200mV below the negative supply to
approximately (V+) – 1.3V. There is a small transition region,
typically (V+) – 1.5V to (V+) – 1.1V, in which both pairs are
on. This 400mV transition region can vary 300mV with
process variation. Thus, the transition region (both stages
on) can range from (V+) – 1.65V to (V+) – 1.25V on the low
end, up to (V+) – 1.35V to (V+) – 0.95V on the high end.
Within the 400mV transition region PSRR, CMRR, offset
voltage, and offset drift may be degraded compared to
operation outside this region. For more information on de-
signing with rail-to-rail input op amps, see Figure 3, Design
Optimization with Rail-to-Rail Input Op Amps.
Output voltage is approximately 4.995VPP
.
Power-supply pins should be bypassed with 0.01µF ceramic
capacitors.
G = +1, VS = +5V
Input
5V
1V/div
0V
Output (inverted on scope)
20µs/div
FIGURE 1. Rail-to-Rail Input and Output.
V+
Reference
Current
VIN
+
VIN
–
VBIAS1
Class AB
Control
VO
Circuitry
VBIAS2
V–
(Ground)
FIGURE 2. Simplified Schematic.
OPA347, 2347, 4347
7
SBOS167D
www.ti.com
DESIGN OPTIMIZATION WITH RAIL-TO-RAIL INPUT OP AMPS
Rail-to-rail op amps can be used in virtually any op amp
With a unity-gain buffer, for example, signals will traverse
this transition at approximately 1.3V below the V+ supply
and may exhibit a small discontinuity at this point.
configuration. To achieve optimum performance, how-
ever, applications using these special double-input-stage
op amps may benefit from consideration of their special
behavior.
The common-mode voltage of the noninverting amplifier
is equal to the input voltage. If the input signal always
remains less than the transition voltage, no discontinuity
will be created. The closed-loop gain of this configuration
can still produce a rail-to-rail output.
In many applications, operation remains within the com-
mon-mode range of only one differential input pair. How-
ever, some applications exercise the amplifier through the
transition region of both differential input stages. A small
discontinuity may occur in this transition. Careful selection
of the circuit configuration, signal levels, and biasing can
often avoid this transition region.
Inverting amplifiers have a constant common-mode volt-
age equal to VB. If this bias voltage is constant, no
discontinuity will be created. The bias voltage can gener-
ally be chosen to avoid the transition region.
Unity-Gain Buffer
Noninverting Amplifier
Inverting Amplifier
V+
V+
V+
VB
VIN
VO
VO
VO
VIN
VIN
VB
VCM = VIN = VO
VCM = VIN
VCM = VB
FIGURE 3. Design Optimization with Rail-to-Rail Input Op Amps.
COMMON-MODE REJECTION
The CMRR for the OPA347 is specified in several ways so
the best match for a given application may be used. First, the
CMRR of the device in the common-mode range below the
transition region (VCM < (V+) – 1.7V) is given. This specifica-
tion is the best indicator of the capability of the device when
the application requires use of one of the differential input
pairs. Second, the CMRR at VS = 5.5V over the entire
common-mode range is specified.
5.5V
0V
–0.5V
INPUT VOLTAGE
200µs/div
The input common-mode range extends from (V–) – 0.2V to
(V+) + 0.2V. For normal operation, inputs should be limited
to this range. The absolute maximum input voltage is 500mV
beyond the supplies. Inputs greater than the input
common-mode range but less than the maximum input
voltage, while not valid, will not cause any damage to the op
amp. Furthermore, if input current is limited the inputs may go
beyond the power supplies without phase inversion, as
shown in Figure 4, unlike some other op amps.
FIGURE 4. OPA347—No Phase Inversion with Inputs Greater
than the Power-Supply Voltage.
+5V
IOVERLOAD
Normally, input currents are 0.4pA. However, large inputs
(greater than 500mV beyond the supply rails) can cause
excessive current to flow in or out of the input pins. There-
fore, as well as keeping the input voltage below the maxi-
mum rating, it is also important to limit the input current to
less than 10mA. This is easily accomplished with an input
resistor, as shown in Figure 5.
10mA max
VOUT
OPA347
VIN
5kΩ
FIGURE 5. Input Current Protection for Voltages Exceeding
the Supply Voltage.
OPA347, 2347, 4347
8
SBOS167D
www.ti.com
RAIL-TO-RAIL OUTPUT
load, reducing the resistor values from 100kΩ to 5kΩ de-
creases overshoot from 40% to 8% (see the characteristic
curve Small-Signal Overshoot vs Load Capacitance). How-
ever, when large-valued resistors can not be avoided, a
small (4pF to 6pF) capacitor, CFB, can be inserted in the
feedback, as shown in Figure 7. This significantly reduces
overshoot by compensating the effect of capacitance, CIN,
which includes the amplifier input capacitance and PC board
A class AB output stage with common-source transistors is
used to achieve rail-to-rail output. This output stage is ca-
pable of driving 5kΩ loads connected to any potential be-
tween V+ and ground. For light resistive loads (> 100kΩ), the
output voltage can typically swing to within 5mV from supply
rail. With moderate resistive loads (10kΩ to 50kΩ), the output
can swing to within a few tens of millivolts from the supply
rails while maintaining high open-loop gain (see the typical
characteristic Output Voltage Swing vs Output Current).
parasitic capacitance.
CFB
RF
CAPACITIVE LOAD AND STABILITY
The OPA347 in a unity-gain configuration can directly drive
up to 250pF pure capacitive load. Increasing the gain en-
hances the amplifier’s ability to drive greater capacitive loads
(see the characteristic curve Small-Signal Overshoot vs
Capacitive Load). In unity-gain configurations, capacitive
load drive can be improved by inserting a small (10Ω to 20Ω)
resistor, RS, in series with the output, as shown in Figure 6.
This significantly reduces ringing while maintaining Direct
Current (DC) performance for purely capacitive loads. How-
ever, if there is a resistive load in parallel with the capacitive
load, a voltage divider is created, introducing a DC error at
the output and slightly reducing the output swing. The error
introduced is proportional to the ratio RS/RL, and is generally
negligible.
RI
VIN
VOUT
OPA347
CIN
CL
FIGURE 7. Adding a Feedback Capacitor In the Unity-Gain
Inverter Configuration Improves Capacitative
Load.
DRIVING ADCs
The OPA347 series op amps are optimized for driving
medium-speed sampling Analog-to-Digital Converters (ADCs).
The OPA347 op amps buffer the ADC’s input capacitance
and resulting charge injection while providing signal gain.
V+
RS
VOUT
OPA347
See Figure 8 for the OPA347 in a basic noninverting configu-
ration driving the ADS7822. The ADS7822 is a 12-bit,
microPower sampling converter in the MSOP-8 package.
When used with the low-power, miniature packages of the
OPA347, the combination is ideal for space-limited, low-
power applications. In this configuration, an RC network at
the ADC input can be used to provide for anti-aliasing filter
and charge injection current.
10Ω to
20Ω
VIN
CL
RL
FIGURE 6. Series Resistor in Unity-Gain Buffer Configura-
tion Improves Capacitive Load Drive.
See Figure 9 for the OPA2347 driving an ADS7822 in a
speech bandpass filtered data acquisition system. This small,
low-cost solution provides the necessary amplification and
signal conditioning to interface directly with an electret micro-
phone. This circuit will operate with VS = 2.7V to 5V with less
than 250µA typical quiescent current.
In unity-gain inverter configuration, phase margin can be
reduced by the reaction between the capacitance at the op
amp input, and the gain setting resistors, thus degrading
capacitive load drive. Best performance is achieved by using
small valued resistors. For example, when driving a 500pF
OPA347, 2347, 4347
9
SBOS167D
www.ti.com
+5V
0.1µF
0.1µF
1
VREF
8
V+
7
6
5
DCLOCK
DOUT
500Ω
+In
2
Serial
Interface
ADS7822
12-Bit ADC
OPA347
VIN
–In
CS/SHDN
3
3300pF
GND
4
VIN = 0V to 5V for
0V to 5V output.
NOTE: ADC Input = 0V to VREF
RC network filters high-frequency noise.
FIGURE 8. OPA347 in Noninverting Configuration Driving ADS7822.
V+ = +2.7V to 5V
Passband 300Hz to 3kHz
R9
510kΩ
R1
R4
R2
1.5kΩ
20kΩ
1MΩ
C3
C
1
33pF
1000pF
R7
51kΩ
R8
150kΩ
V
8
+
1
VREF
1/2
7
6
DCLOCK
DOUT
OPA2347
+IN
2
–IN
1/2
OPA2347
R3
1MΩ
ADS7822
12-Bit A/D
Electret
Microphone(1)
Serial
Interface
C2
1000pF
R6
100kΩ
5
CS/SHDN
3
4
G = 100
NOTE: (1) Electret microphone
powered by R1.
R5
20kΩ
GND
FIGURE 9. Speech Bandpass Filtered Data Acquisition System.
OPA347, 2347, 4347
10
SBOS167D
www.ti.com
OPA2347 WCSP PACKAGE
OPA2347YED
The OPA2347YED and OPA2347YZDR are die-level pack-
ages using bump-on-pad technology. The OPA2347YED de-
vice has tin-lead balls; the OPA2347YZDR has lead-free
balls. Unlike devices that are in plastic packages, these
devices have no molding compound, lead frame, wire bonds,
or leads. Using standard surface-mount assembly procedures,
the WCSP can be mounted to a printed circuit board without
additional under fill. Figures 10 and 11 detail pinout and
package marking.
Top View
Actual Size:
Package Marking Code:
YMD = year/month/day
CC = indicates OPA2347YED
A9 = indicates OPA2347YZD
S = for engineering purposes only
Exact Size:
1.008mm x 2.100mm
(bump side down)
FIGURE 11. Top View Package Marking.
PHOTOSENSITIVITY
OPA2347
(bump side down)
Not to Scale
Although the OPA2347YED/YZD package has a protective
backside coating that reduces the amount of light exposure
on the die, unless fully shielded, ambient light will still reach
the active region of the device. Input bias current for the
OPA2347YED/YZD package is specified in the absence of
light. Depending on the amount of light exposure in a given
application, an increase in bias current, and possible in-
creases in offset voltage should be expected. In circuit board
tests under ambient light conditions, a typical increase in bias
current reached 100pA. Flourescent lighting may introduce
noise or hum due to their time varying light output. Best
practice should include end-product packaging that provides
shielding from possible light souces during operation.
V+
Out A
–In A
+In A
V–
1
2
3
4
8
7
6
5
Out B
–In B
+In B
WCSP-8
(top view)
FIGURE 10. Pin Description.
RELIABILITY TESTING
To ensure reliability, the OPA2347YED and OPA2347YZDR
devices have been verified to successfully pass a series of
reliability stress tests. A summary of JEDEC standard reli-
ability tests is shown in Table I.
TEST
CONDITION
ACCEPT CRITERIA (ACTUAL)
SAMPLE SIZE
Temperature Cycle
–40°C to 125°C, 1 Cycle/hr, 15 Minute Ramp(1)
10 Minute Dwell
500 (1600) Cycles, R < 1.2X from R0
10 (129) Drops, R < 1.2X from R0
5K (6.23K) Cycles, R < 1.2X from R0
36
8
Drop
50cm
Key Push
100 Cycles/min,
8
1300 µε, Displacement = 2.7mm Max
3 Point Bend
Strain Rate 5 mm/min, 85 mm Span
R < 1.2X from R0
8
NOTE: (1) Per IPC9701.
TABLE I. Reliability Test Results.
OPA347, 2347, 4347
11
SBOS167D
www.ti.com
LAND PATTERNS AND ASSEMBLY
The recommended land pattern for the OPA2347YED pack-
age is detailed in Figure 12 with specifications listed in Table
II. The maximum amount of force during assembly should be
limited to 30 grams of force per bump.
FIGURE 12. Recommended Land Area.
SOLDER PAD
DEFINITION
SOLDER MASK
OPENING
COPPER
THICKNESS
COPPER PAD
STENCIL OPENING
STENCIL THICKNESS
Non-Solder Mask
Defined (NSMD)
275µm
(+0.0, –25µm)
375µm
(+0.0, –25µm)
1 oz max
275µm X 275µm, sq
125µm Thick
NOTES: (1) Circuit traces from NSMD-defined PWB lands should be less tham 100µm (preferrably = 75µm) wide in the exposed area inside the solder mask
opening. Wider trace widths will reduce device stand off and impact reliability. (2) Recommended solder paste is type 3 or type 4. (3) Best reliability results are
achieved when the PWB laminate glass transistion temperature is above the operating range of the intended application. (4) For PWB using an Ni/Au surface
finish, the gold thickness should be less than 0.5um to avoid solder embrittlement and a reduction in thermal fatigue performance. (5) Solder mask thickness
should be less than 20um on top of the copper circuit pattern. (6) Best solder stencil performance will be achieved using laser-cut stencils with electro polishing.
Use of chemically etched stencils results in inferior solder paste volume control. (7) Trace routing away from the WLCSP device should be balanced in X and
Y directions to avoid unintentional component movement due to solder wetting forces.
TABLE II. Recommended Land Pattern.
OPA347, 2347, 4347
12
SBOS167D
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
OPA2347EA/250
OPA2347EA/250G4
OPA2347EA/3K
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DCN
8
8
8
8
8
8
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
B47
B47
B47
B47
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DCN
DCN
DCN
D
250
3000
3000
75
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
OPA2347EA/3KG4
OPA2347UA
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
OPA
2347UA
OPA2347UA/2K5
OPA2347UA/2K5G4
SOIC
D
2500
2500
Green (RoHS
& no Sb/Br)
OPA
2347UA
SOIC
D
Green (RoHS
& no Sb/Br)
OPA
2347UA
OPA2347UA/2K5Q1
OPA2347UAG4
OBSOLETE
ACTIVE
SOIC
SOIC
D
D
8
8
TBD
Call TI
Call TI
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
OPA
2347UA
OPA2347YEDR
OPA2347YEDT
OPA2347YZDR
OBSOLETE
OBSOLETE
ACTIVE
DSBGA
DSBGA
DSBGA
YED
YED
YZD
8
8
8
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-55 to 125
-55 to 125
3000
250
250
250
3000
3000
50
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(A9 ~ OPA2347)
OPA2347
A47
OPA2347YZDT
OPA347NA/250
OPA347NA/250G4
OPA347NA/3K
OPA347NA/3KG4
OPA347PA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
SOT-23
SOT-23
SOT-23
SOT-23
PDIP
YZD
DBV
DBV
DBV
DBV
P
8
5
5
5
5
8
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Green (RoHS
& no Sb/Br)
A47
Green (RoHS
& no Sb/Br)
A47
Green (RoHS
& no Sb/Br)
A47
Green (RoHS
& no Sb/Br)
OPA347PA
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
OPA347PAG4
OPA347SA/250
OPA347SA/250G4
OPA347SA/3K
ACTIVE
PDIP
SC70
SC70
SC70
SC70
SOIC
P
8
5
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
OPA347PA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DCK
DCK
DCK
DCK
D
250
250
3000
3000
75
Green (RoHS
& no Sb/Br)
S47
S47
S47
S47
5
Green (RoHS
& no Sb/Br)
5
Green (RoHS
& no Sb/Br)
OPA347SA/3KG4
OPA347UA
5
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
OPA
347UA
OPA347UA/2K5
OPA347UA/2K5G4
OPA347UAG4
SOIC
D
8
2500
2500
75
Green (RoHS
& no Sb/Br)
OPA
347UA
SOIC
D
8
Green (RoHS
& no Sb/Br)
OPA
347UA
SOIC
D
8
Green (RoHS
& no Sb/Br)
OPA
347UA
OPA4347EA/250
OPA4347EA/250G4
OPA4347EA/2K5
OPA4347EA/2K5G4
OPA4347UA
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
D
14
14
14
14
14
14
14
14
250
250
2500
2500
50
Green (RoHS
& no Sb/Br)
OPA
4347EA
Green (RoHS
& no Sb/Br)
OPA
4347EA
Green (RoHS
& no Sb/Br)
OPA
4347EA
Green (RoHS
& no Sb/Br)
OPA
4347EA
Green (RoHS
& no Sb/Br)
OPA4347UA
OPA4347UA
OPA4347UA
OPA4347UA
OPA4347UA/2K5
OPA4347UA/2K5G4
OPA4347UAG4
SOIC
D
2500
2500
50
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
SOIC
D
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
OPA2347EA/250
OPA2347EA/3K
OPA347SA/250
OPA347SA/250
OPA347SA/3K
OPA347SA/3K
OPA347UA/2K5
OPA4347EA/250
OPA4347EA/2K5
OPA4347UA/2K5
SOT-23
SOT-23
SC70
DCN
DCN
DCK
DCK
DCK
DCK
D
8
8
250
3000
250
179.0
179.0
178.0
179.0
178.0
179.0
330.0
180.0
330.0
330.0
8.4
8.4
3.2
3.2
2.4
2.2
2.4
2.2
6.4
6.9
6.9
6.5
3.2
3.2
2.5
2.5
2.5
2.5
5.2
5.6
5.6
9.0
1.4
1.4
1.2
1.2
1.2
1.2
2.1
1.6
1.6
2.1
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q1
Q1
5
9.0
8.0
SC70
5
250
8.4
8.0
SC70
5
3000
3000
2500
250
9.0
8.0
SC70
5
8.4
8.0
SOIC
8
12.4
12.4
12.4
16.4
12.0
12.0
12.0
16.0
TSSOP
TSSOP
SOIC
PW
PW
D
14
14
14
2500
2500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Jun-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2347EA/250
OPA2347EA/3K
OPA347SA/250
OPA347SA/250
OPA347SA/3K
OPA347SA/3K
OPA347UA/2K5
OPA4347EA/250
OPA4347EA/2K5
OPA4347UA/2K5
SOT-23
SOT-23
SC70
DCN
DCN
DCK
DCK
DCK
DCK
D
8
8
250
3000
250
203.0
203.0
180.0
203.0
180.0
203.0
367.0
210.0
367.0
367.0
203.0
203.0
180.0
203.0
180.0
203.0
367.0
185.0
367.0
367.0
35.0
35.0
18.0
35.0
18.0
35.0
35.0
35.0
35.0
38.0
5
SC70
5
250
SC70
5
3000
3000
2500
250
SC70
5
SOIC
8
TSSOP
TSSOP
SOIC
PW
PW
D
14
14
14
2500
2500
Pack Materials-Page 2
D: Max = 2.092 mm, Min =2.031 mm
E: Max = 0.999 mm, Min =0.938 mm
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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SI9136_11
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SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
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