OPA2301AIDGKRG4 [TI]

Low-Noise, High-Speed, 16-Bit Accurate, CMOS OPERATIONAL AMPLIFIER; 低噪声,高速, 16位精度, CMOS运算放大器
OPA2301AIDGKRG4
型号: OPA2301AIDGKRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Low-Noise, High-Speed, 16-Bit Accurate, CMOS OPERATIONAL AMPLIFIER
低噪声,高速, 16位精度, CMOS运算放大器

运算放大器
文件: 总19页 (文件大小:497K)
中文:  中文翻译
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OPA300, OPA2300  
OPA301, OPA2301  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
Low-Noise, High-Speed, 16-Bit Accurate, CMOS  
OPERATIONAL AMPLIFIER  
FD EATURES  
DESCRIPTION  
High Bandwidth: 150MHz  
16-Bit Settling in 150ns  
Low Noise: 3nV/Hz  
The OPA300 and OPA301 series high-speed,  
voltage-feedback, CMOS operational amplifiers are  
designed for 16-bit resolution systems. The  
OPA300/OPA301 series are unity-gain stable and  
feature excellent settling and harmonic distortion  
specifications. Low power applications benefit from low  
quiescent current. The OPA300 and OPA2300 feature  
a digital shutdown (Enable) function to provide  
additional power savings during idle periods. Optimized  
for single-supply operation, the OPA300/OPA301  
series offer superior output swing and excellent  
common-mode range.  
D
D
D
D
D
D
D
Low Distortion: 0.003%  
Low Power: 9.5mA (typ) on 5.5V  
Shutdown to 5µA  
Unity-Gain Stable  
Excellent Output Swing:  
(V+) − 100mV to (V−) + 100mV  
Single Supply: +2.7V to +5.5V  
Tiny Packages: MSOP and SOT23  
D
D
The OPA300 and OPA301 series op amps have  
150MHz of unity-gain bandwidth, low 3nV/Hz voltage  
noise, and 0.1% settling within 30ns. Single-supply  
operation from 2.7V ( 1.35V) to 5.5V ( 2.75V) and an  
available shutdown function that reduces supply  
current to 5µA are useful for portable low-power  
applications. The OPA300 and OPA301 are available in  
SO-8 and SOT-23 packages. The OPA2300 is available  
in MSOP-10, and the OPA2301 is available in SO-8 and  
MSOP-8. All versions are specified over the industrial  
temperature range of −40°C to +125°C.  
AD PPLICATIONS  
16-Bit ADC Input Drivers  
Low-Noise Preamplifiers  
IF/RF Amplifiers  
D
D
D
Active Filtering  
130pF  
(mica)  
1820  
fS = 1.25MSPS  
f = 10kHz  
5V  
1820  
VIN  
10  
ADS8401  
OPA30x  
130pF  
(mica)  
1.5nF  
Typical Application  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
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Copyright 2003−2005, Texas Instruments Incorporated  
www.ti.com  
ꢂꢀꢉꢠ ꢡꢡ ꢢ ꢂꢀꢉ ꢣꢠꢡ ꢡ  
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www.ti.com  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
(1)  
PACKAGE/ORDERING INFORMATION  
PRODUCT  
OPA300  
OPA300  
OPA301  
OPA301  
OPA2300  
OPA2301  
OPA2301  
PACKAGE-LEAD  
PACKAGE DESIGNATOR  
PACKAGE MARKING  
SO-8  
D
300A  
A52  
SOT23-6  
SO-8  
DBV  
D
301A  
SOT23-5  
MSOP−10  
SO−8  
DBV  
DGS  
D
AUP  
C01  
OPA2301A  
C02  
MSOP−8  
DGK  
(1)  
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website  
at www.ti.com.  
ELECTROSTATIC DISCHARGE SENSITIVITY  
ABSOLUTE MAXIMUM RATINGS  
(1)  
over operating free-air temperature range unless otherwise noted  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be  
handledwith appropriate precautions. Failure to observe  
Power Supply V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V  
(2)  
Signal Input Terminals , Voltage . . . . . . . . . . . 0.5V to (V+) + 0.5V  
Current . . . . . . . . . . . . . . . . . . . . . 10mA  
proper handling and installation procedures can cause damage.  
(3)  
Open Short-Circuit Current  
. . . . . . . . . . . . . . . . . . . . Continuous  
ESD damage can range from subtle performance degradation to  
complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could  
cause the device not to meet its published specifications.  
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +125°C  
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +150°C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C  
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . . +300°C  
ESD Ratings  
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV  
Charged-Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . 500V  
(1)  
Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods  
may degrade device reliability. These are stress ratings only, and  
functional operation of the device at these or any other conditions  
beyond those specified is not implied.  
(2)  
(3)  
Input terminals are diode clamped to the power-supply rails. Input  
signals that can swing more than 0.5V beyond the supply rails  
should be current limited to 10mA or less.  
Short-circuit to ground; one amplifier per package.  
PIN ASSIGNMENTS  
Top View  
OPA300  
MSOP, SO, SOT  
OPA2300  
OPA300  
NC(1)  
1
2
3
4
8
7
6
5
Out  
1
2
3
6
5
4
V+  
Enable  
V+  
Out A  
1
2
3
4
5
10 V+  
In  
+In  
V
Enable  
In A  
9
8
7
6
Out B  
A
VOUT  
NC(1)  
In B  
+In  
In  
+In A  
B
V
+In B  
V
SOT236(2)  
Enable A  
Enable B  
SO8  
MSOP−10  
OPA301  
OPA301  
OPA2301  
NC(1)  
V+  
NC(1)  
1
2
3
4
8
7
6
5
Out  
1
2
3
5
4
V+  
Out A  
In A  
+In A  
1
8
7
6
5
V+  
In  
V
A
Out B  
In B  
+In B  
2
3
4
VOUT  
NC(1)  
+In  
+In  
In  
B
V
SOT23−5  
V
SO8  
SO−8, MSOP−8  
NOTE: (1) Not connected. (2) SOT23-6 pin 1 oriented as shown with reference to package marking.  
2
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www.ti.com  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
ELECTRICAL CHARACTERISTICS: V = 2.7V to 5.5V  
S
Boldface limits apply over the temperature range, T = −40°C to +125°C.  
A
All specifications at T = +25°C, R = 2kconnected to V /2, V  
= V /2, and V  
= V /2, unless otherwise noted.  
A
L
S
OUT  
S
CM S  
OPA300, OPA301  
OPA2300, OPA2301  
PARAMETER  
TEST CONDITIONS  
= 5V  
MIN  
TYP  
MAX  
UNITS  
OFFSET VOLTAGE  
Input Offset Voltage  
Over Temperature  
Drift  
V
V
1
5
mV  
mV  
OS  
S
7
dV /dT  
OS  
PSRR  
2.5  
50  
µV/°C  
µV/V  
dB  
vs. Power Supply  
V
= 2.7V to 5.5V, V  
CM  
< (V+) –0.9V  
200  
S
Channel Separation, dc  
f = 5MHz  
140  
100  
dB  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
Common-Mode Rejection Ratio  
INPUT BIAS CURRENT  
Input Bias Current  
V
(V−) − 0.2  
(V+) − 0.9  
V
CM  
CMRR  
(V−) − 0.2V < V  
CM  
< (V+) – 0.9V  
66  
80  
dB  
I
0.1  
0.5  
5
5
pA  
pA  
B
Input Offset Current  
I
OS  
INPUT IMPEDANCE  
13  
Differential  
10 || 3  
|| pF  
|| pF  
13  
Common-Mode  
10 || 6  
NOISE  
Input Voltage Noise, f = 0.1Hz to 1MHz  
Input Voltage Noise Density, f > 1MHz  
Input Current Noise Density, f < 1kHz  
Differential Gain Error  
Differential Phase Error  
40  
3
µV  
nV/Hz  
fA/Hz  
%
PP  
e
i
n
n
1.5  
0.01  
0.1  
NTSC, R = 150Ω  
L
NTSC, R = 150Ω  
°
L
OPEN-LOOP GAIN  
Open−Loop Voltage Gain  
Over Temperature  
A
V
= 5V, R = 2k, 0.1V < V < 4.9V  
95  
90  
95  
90  
106  
106  
dB  
dB  
dB  
dB  
OL  
S
L
O
V
= 5V, R = 2k, 0.1V < V < 4.9V  
S
L O  
V
= 5V, R = 100, 0.5V < V < 4.5V  
L O  
S
Over Temperature  
OUTPUT  
V
= 5V, R = 100, 0.5V < V < 4.5V  
S
L
O
Voltage Output Swing from Rail  
R
= 2k, A  
OL  
> 95dB  
> 95dB  
75  
300  
70  
100  
500  
mV  
mV  
mA  
L
R
= 100, A  
L
OL  
Short-Circuit Current  
Capacitive Load Drive  
FREQUENCY RESPONSE  
Gain-Bandwidth Product  
Slew Rate  
I
SC  
C
See Typical Characteristics  
LOAD  
GBW  
SR  
150  
80  
MHz  
V/µs  
ns  
G = +1  
Settling Time, 0.01%  
0.1%  
t
V
= 5V, 2V Step, G = +1  
90  
S
S
30  
ns  
Overload Recovery Time  
Total Harmonic Distortion + Noise  
POWER SUPPLY  
Gain = −1  
30  
ns  
THD+N  
V
= 5V, V = 3V , G = +1, f = 1kHz  
PP  
0.003  
%
S
O
Specified Voltage Range  
Operating Voltage Range  
Quiescent Current (per amplifier)  
Over Temperature  
V
2.7  
5.5  
V
V
S
2.7 to 5.5  
9.5  
I
I
= 0  
12  
mA  
mA  
Q
O
13  
SHUTDOWN  
t
t
40  
5
ns  
µs  
V
OFF  
ON  
V
(shutdown)  
(V−) − 0.2  
(V−) + 2.5  
(V−) + 0.8  
(V+) + 0.2  
10  
L
V
(amplifier is active)  
V
H
I
(per amplifier)  
3
µA  
QSD  
TEMPERATURE RANGE  
Specified Range  
−40  
−55  
−60  
+125  
+125  
+150  
°C  
°C  
°C  
Operating Range  
Storage Range  
Thermal Resistance  
SO-8, MSOP−8, MSOP-10  
SOT23-5, SOT23-6  
θ
JA  
°C/W  
°C/W  
°C/W  
150  
200  
3
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www.ti.com  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
TYPICAL CHARACTERISTICS  
All specifications at T = 25°C, V = 5V, and R = 150connected to V /2 unless otherwise noted.  
A
S
L
S
INVERTING GAIN  
SMALLSIGNAL FREQUENCY RESPONSE  
NONINVERTING GAIN  
SMALLSIGNAL FREQUENCY RESPONSE  
3
0
3
6
9
3
3
9
VO = 0.1VPP  
G = 1  
RF = 310 for G > 1  
G =  
1
G =  
2
G = 5  
G = 2  
G =  
5
G = 10  
G = 10  
12  
15  
VO = 0.1VPP  
RF = 310 for G > 1  
15  
1M  
10M  
100M  
Frequency (Hz)  
1G  
1M  
10M  
100M  
Frequency (Hz)  
1G  
SMALLSIGNAL STEP RESPONSE  
LARGESIGNAL STEP RESPONSE  
VOUT  
Time (50ns/div)  
Time (5ns/div)  
0.1dB GAIN FLATNESS FOR VARIOUS RF  
Gain = 2  
VO = 0.1VPP  
LARGESIGNAL ENABLE/DISABLE RESPONSE  
Enable Pin  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
RF = 825  
RF = 450  
Amplifier  
Output  
0.1  
0.2  
0.3  
RF = 205  
1
10  
Frequency (MHz)  
100  
µ
Time (100 s/div)  
4
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SBOS271B − MAY 2003 − REVISED JUNE 2005  
TYPICAL CHARACTERISTICS (continued)  
All specifications at T = 25°C, V = 5V, and R = 150connected to V /2 unless otherwise noted.  
A
S
L
S
HARMONIC DISTORTION vs OUTPUT VOLTAGE  
HARMONIC DISTORTION vs NONINVERTING GAIN  
VO = 2VPP  
50  
60  
70  
80  
90  
50  
60  
70  
80  
90  
RL = 200  
f = 1MHz  
RL = 200  
R
F = 310  
f = 1MHz  
THD  
G = 2  
RF = 310  
THD  
2ndHarmonic  
2ndHarmonic  
3rdHarmonic  
3rdHarmonic  
100  
110  
100  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
10  
1k  
1
10  
Gain (V/V)  
Output Voltage (VPP  
)
HARMONIC DISTORTION vs FREQUENCY  
VO = 2VPP  
HARMONIC DISTORTION vs INVERTING GAIN  
VO = 2VPP  
50  
60  
70  
80  
90  
50  
60  
70  
80  
90  
RL = 200  
RL = 200  
Gain = 2  
RF = 310  
f = 1MHz  
THD  
RF = 310  
THD  
2ndHarmonic  
3rdHarmonic  
2ndHarmonic  
3rdHarmonic  
100  
110  
120  
100  
110  
100k  
1M  
Frequency (Hz)  
10M  
1
Gain (V/V)  
INPUT VOLTAGE AND CURRENT NOISE  
SPECTRAL DENSITY vs FREQUENCY  
HARMONIC DISTORTION vs LOAD RESISTANCE  
VO = 2VPP  
60  
65  
70  
75  
80  
85  
90  
95  
10k  
f = 1MHz  
Gain = 2  
RF = 310  
THD  
Current Noise  
1k  
100  
10  
1
2ndHarmonic  
Voltage Noise  
3rdHarmonic  
100  
100  
10  
100  
1k  
10k  
100k  
1M  
10M  
Load Resistance ( )  
Frequency (Hz)  
5
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SBOS271B − MAY 2003 − REVISED JUNE 2005  
TYPICAL CHARACTERISTICS (continued)  
All specifications at T = 25°C, V = 5V, and R = 150connected to V /2 unless otherwise noted.  
A
S
L
S
FREQUENCY RESPONSE FOR VARIOUS RL  
Gain = 1  
FREQUENCY RESPONSE vs CAPACITIVE LOAD  
3
9
3
3
9
CLOAD = 1pF, RS = 75  
RLOAD = 1k  
VO = 0.1VPP  
3
9
CLOAD = 5pF  
RS = 55  
CLOAD = 10pF  
RLOAD = 150  
RS = 40  
15  
21  
27  
RLOAD = 50  
CLOAD = 47pF  
RS  
RS = 30  
15  
CL  
CLOAD = 100pF  
RS = 20  
21  
10M  
100M  
500  
10M  
100M  
Frequency (Hz)  
500  
Frequency (Hz)  
COMMONMODE REJECTION RATIO AND  
POWERSUPPLY REJECTION RATIO vs FREQUENCY  
OPENLOOP GAIN AND PHASE vs FREQUENCY  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
110  
0
PSRR V+  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
PSRR V  
CMRR  
30  
Gain  
Phase  
60  
90  
120  
150  
180  
10  
100  
1k  
10k  
100k  
1M  
10M 100M  
1G  
10k  
100k  
1M  
10M  
100M  
1G  
Frequency (Hz)  
Frequency (Hz)  
COMPOSITE VIDEO  
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT  
VS = 5V  
DIFFERENTIAL GAIN AND PHASE  
1.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0
_
25 C  
0.8  
0.6  
0.4  
0.2  
0
_
40 C  
_
55 C  
_
85 C  
_
125 C  
dP  
_
25 C  
dG  
1
2
3
4
0
10  
20  
30  
40  
50  
60  
70  
80  
Number of 150 Loads  
Output Current (mA)  
6
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SBOS271B − MAY 2003 − REVISED JUNE 2005  
TYPICAL CHARACTERISTICS (continued)  
All specifications at T = 25°C, V = 5V, and R = 150connected to V /2 unless otherwise noted.  
A
S
L
S
INPUT BIAS CURRENT vs TEMPERATURE  
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT  
VS = 2.7V  
1
2.7  
2.4  
2.1  
1.8  
1.5  
1.2  
0.9  
0.6  
0.3  
0
_
_
_
55 C  
_
25 C 40 C  
_
85 C  
125 C  
0.1  
0.01  
20  
40  
0
20  
40  
60  
80  
100 120 140  
0
10  
20  
30  
40  
50  
60  
70  
80  
_
Temperature ( C)  
Output Current (mA)  
QUIESCENT CURRENT vs TEMPERATURE  
INPUT BIAS CURRENT vs COMMONMODE VOLTAGE  
12  
11  
10  
9
2
1
0
1
2
VS  
=
2.5V  
8
7
6
1
40  
20  
0
20  
40  
60  
80  
100 120 140  
3
2
0
1
2
_
Temperature ( C)  
CommonMode Voltage (V)  
POWERSUPPLY REJECTION RATIO AND  
SHORTCIRCUIT CURRENT vs TEMPERATURE  
VS = 5.5V  
COMMONMODE REJECTION RATIO vs TEMPERATURE  
80  
60  
40  
20  
0
100  
95  
90  
85  
80  
75  
70  
65  
60  
PSRR  
CMRR  
VS = 5V  
VS = 3.5V  
VS = 2.7V  
20  
40  
60  
80  
VS = 5.5V  
20  
40  
0
20  
40  
60  
80  
100 120 140  
20  
40  
0
20  
40  
60  
80 100 120 140  
_
Temperature ( C)  
_
Temperature ( C)  
7
ꢂꢀꢉꢠ ꢡꢡ ꢢ ꢂꢀꢉ ꢣꢠꢡ ꢡ  
ꢂꢀꢉ ꢠꢡ ꢤ ꢢ ꢂꢀꢉ ꢣꢠꢡ ꢤ  
www.ti.com  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
TYPICAL CHARACTERISTICS (continued)  
All specifications at T = 25°C, V = 5V, and R = 150connected to V /2 unless otherwise noted.  
A
S
L
S
OUTPUT IMPEDANCE vs FREQUENCY  
QUIESCENT CURRENT vs SUPPLY VOLTAGE  
1000  
100  
10  
12  
11  
10  
9
G = 2  
G = 1  
8
1
7
0.1  
0.01  
6
5
10k  
100k  
1M  
Frequency (Hz)  
10M  
100M  
2.5  
3
3.5  
4
4.5  
5
5.5  
Supply Voltage (V)  
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY  
OPENLOOP GAIN vs TEMPERATURE  
5
4
3
2
1
0
120  
110  
100  
90  
RLOAD = 2k  
VS = 5V  
RLOAD = 2k  
VS = 2.7V  
RLOAD = 100  
80  
1
10  
100  
20  
40  
0
20  
40  
60  
80  
100 120 140  
Frequency (MHz)  
_
Temperature ( C)  
OFFSET VOLTAGE  
PRODUCTION DISTRIBUTION  
OUTPUT SETTLING TIME TO 0.1%  
20  
18  
16  
14  
12  
10  
8
0.2  
0.1  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
6
4
2
0
1
5
4
3
2
0
1
2
3
4
5
0
20  
40  
60  
Time (ns)  
80  
100  
Offset Voltage (mV)  
8
ꢂ ꢀꢉꢠ ꢡ ꢡ ꢢ ꢂ ꢀꢉ ꢣꢠꢡ ꢡ  
ꢂ ꢀꢉꢠ ꢡ ꢤꢢ ꢂ ꢀꢉ ꢣꢠꢡ ꢤ  
www.ti.com  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
TYPICAL CHARACTERISTICS (continued)  
All specifications at T = 25°C, V = 5V, and R = 150connected to V /2 unless otherwise noted.  
A
S
L
S
OFFSET VOLTAGE DRIFT  
PRODUCTION DISTRIBUTION  
20  
15  
10  
5
0
10 8 6 4 2  
0
2
4
6
8
10  
µ
_
Offset Voltage Drift ( V/ C)  
9
ꢂꢀꢉꢠ ꢡꢡ ꢢ ꢂꢀꢉ ꢣꢠꢡ ꢡ  
ꢂꢀꢉ ꢠꢡ ꢤ ꢢ ꢂꢀꢉ ꢣꢠꢡ ꢤ  
www.ti.com  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
PCB LAYOUT  
APPLICATIONS INFORMATION  
As with most high-speed operational amplifiers, board  
layout requires special attention to maximize AC and  
DC performance. Extensive use of ground planes, short  
lead lengths, and high-quality bypass capacitors will  
minimize leakage that can compromise signal quality.  
Guard rings applied with potential as near to the input  
pins as possible help minimize board leakage.  
The OPA300 and OPA301 series of single-supply  
CMOS op amps are designed to interface with  
high-speed 16-bit analog-to-digital converters (ADCs).  
Featuring wide 150MHz bandwidth, fast 150ns settling  
time to 16 bits, and high open loop gain, this series  
offers excellent performance in a small SO-8 and tiny  
SOT23 packages.  
INPUT AND ESD PROTECTION  
THEORY OF OPERATION  
All OPA300/OPA301 series op amps’ pins are static-  
protected with internal ESD protection diodes tied to the  
supplies, as shown in Figure 2. These diodes will  
provide overdrive protection if the current is externally  
limited to 10mA, as stated in the Absolute Maximum  
Ratings. Any input current beyond the Absolute  
Maximum Ratings, or long-term operation at maximum  
ratings, will shorten the lifespan of the amplifier.  
The OPA300 and OPA301 series op amps use a classic  
two-stage topology, shown in Figure 1. The differential  
input pair is biased to maximize slew rate without  
compromising stability or bandwidth. The folded  
cascode adds the signal from the input pair and  
presents a differential signal to the class AB output  
stage. The class AB output stage allows rail- to-rail  
output  
swing,  
with  
high-impedance  
loads  
(> 2k), typically 100mV from the supply rails. With 10Ω  
loads, a useful output swing can be achieved and still  
maintain high open-loop gain. See the typical  
characteristic Output Voltage Swing vs Output Current.  
+V  
External  
Pin  
Internal  
Circuitry  
+VS  
V
Figure 2. ESD Protection Diodes  
VOUT  
ENABLE FUNCTION  
VBIAS  
+
The shutdown function of the OPA300 and OPA2300 is  
referenced to the negative supply voltage of the  
operational amplifier. A logic level HIGH enables the op  
amp. A valid logic HIGH is defined as 2.5V above the  
negative supply applied to the enable pin. A valid logic  
LOW is defined as < 0.8V above the negative supply  
pin. If dual or split power supplies are used, care should  
be taken to ensure logic input signals are properly  
referred to the negative supply voltage. If this pin is not  
connected to a valid high or low voltage, the internal  
circuitry will pull the node high and enable the part to  
function.  
V
IN  
Figure 1. OPA30x Classic Two-Stage Topology  
OPERATING VOLTAGE  
The logic input is a high-impedance CMOS input. For  
battery-operated applications, this feature may be used  
to greatly reduce the average current and extend  
battery life. The enable time is 10µs; disable time is 1µs.  
When disabled, the output assumes a high-impedance  
state. This allows the OPA300 to be operated as a gated  
amplifier, or to have its output multiplexed onto a  
common analog output bus.  
OPA300/OPA301 series op amp parameters are fully  
specified from +2.7V to +5.5V. Supply voltages higher  
than 5.5V (absolute maximum) can cause permanent  
damage to the amplifier. Many specifications apply from  
–40°C to +125°C. Parameters that vary significantly  
with operating voltages or temperature are shown in the  
Typical Characteristics.  
10  
ꢂ ꢀꢉꢠ ꢡ ꢡ ꢢ ꢂ ꢀꢉ ꢣꢠꢡ ꢡ  
ꢂ ꢀꢉꢠ ꢡ ꢤꢢ ꢂ ꢀꢉ ꢣꢠꢡ ꢤ  
www.ti.com  
SBOS271B − MAY 2003 − REVISED JUNE 2005  
DRIVING CAPACITIVE LOADS  
DRIVING A 16-BIT ADC  
When using high-speed operational amplifiers, it is  
extremely important to consider the effects of  
capacitive loading on amplifier stability. Capacitive  
loading will interact with the output impedance of the  
operational amplifier, and depending on the capacitor  
value, may significantly decrease the gain bandwidth,  
as well as introduce peaking. To reduce the effects of  
capacitive loading and allow for additional capacitive  
load drive, place a series resistor between the output  
and the load. This will reduce available bandwidth, but  
permit stable operation with capacitive loading.  
Figure 3 illustrates the recommended relationship  
between the resistor and capacitor values.  
The OPA300/OPA301 series feature excellent  
THD+noise, even at frequencies greater than 1MHz,  
with a 16-bit settling time of 150ns. Figure 4 shows a  
total single supply solution for high-speed data  
acquisition. The OPA300/OPA301 directly drives the  
ADS8401, a 1.25 mega sample per second (MSPS)  
16-bit data converter. The OPA300/OPA301 is  
configured in an inverting gain of 1, with a 5V single  
supply. Results of the OPA300/OPA301 performance  
are summarized in Table 1.  
130pF  
(mica)  
100  
75  
50  
25  
0
1820  
f
S = 1.25MSPS  
f = 10kHz  
5V  
1820  
VIN  
10  
ADS8401  
OPA30x  
130pF  
(mica)  
1.5nF  
Figure 4. The OPA30x Drives the 16-Bit ADS8401  
1
10  
100  
Capacitive Load (pF)  
PARAMETER  
THD  
RESULTS (f = 10kHz)  
−99.3dB  
Figure 3. Recommended R and C Combinations  
S
L
SFDR  
101.2dB  
Amplifiers configured in unity gain are most susceptible  
to stability issues. The typical characteristic, Frequency  
Response vs Capacitive Load, describes the relation-  
ship between capacitive load and stability for the  
OPA300/OPA301 series. In unity gain, the  
OPA300/OPA301 series is capable of driving a few  
picofarads of capacitive load without compromising  
stability. Board level parasitic capacitance can often fall  
into the range of a picofarad or more, and should be  
minimized through good circuit-board layout practices  
to avoid compromising the stability of the  
OPA300/OPA301. For more information on detecting  
parasitics during testing, see the Application Note  
Measuring Board Parasitics in High-Speed Analog  
Design (SBOA094), available at the TI web site  
www.ti.com.  
THD+N  
SNR  
84.2dB  
84.3dB  
Table 1. OPA30x Performance Results Driving a  
1.25MSPS ADS8401  
11  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Nov-2005  
PACKAGING INFORMATION  
Orderable Device  
OPA2300AIDGSR  
OPA2300AIDGSRG4  
OPA2300AIDGST  
OPA2300AIDGSTG4  
OPA2301AID  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
MSOP  
DGS  
10  
10  
10  
10  
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
MSOP  
MSOP  
MSOP  
SOIC  
DGS  
DGS  
DGS  
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA2301AIDG4  
SOIC  
D
8
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA2301AIDGKR  
OPA2301AIDGKRG4  
OPA2301AIDGKT  
OPA2301AIDGKTG4  
OPA2301AIDR  
MSOP  
MSOP  
MSOP  
MSOP  
SOIC  
DGK  
DGK  
DGK  
DGK  
D
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
8
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
8
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA2301AIDRG4  
SOIC  
D
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
OPA300AID  
OPA300AIDBVR  
OPA300AIDBVT  
OPA300AIDR  
OPA301AID  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOT-23  
SOT-23  
SOIC  
D
DBV  
DBV  
D
8
6
6
8
8
5
5
8
100  
3000  
250  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
CU NIPDAU Level-3-235C-168 HR  
CU SNPB  
CU SNPB  
Level-2-240C-1 YEAR  
Level-2-240C-1 YEAR  
2500  
100  
CU NIPDAU Level-3-235C-168 HR  
CU NIPDAU Level-3-240C-168 HR  
CU NIPDAU Level-1-235C-UNLIM  
CU NIPDAU Level-1-235C-UNLIM  
CU NIPDAU Level-3-240C-168 HR  
SOIC  
D
OPA301AIDBVR  
OPA301AIDBVT  
OPA301AIDR  
SOT-23  
SOT-23  
SOIC  
DBV  
DBV  
D
3000  
250  
2500  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-Nov-2005  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  

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