OPA2356MDGKTEP [TI]
200-MHz, CMOS operational amplifier;
| 型号： | OPA2356MDGKTEP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 200-MHz, CMOS operational amplifier 放大器 光电二极管 |
| 文件： | 总19页 (文件大小：323K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
OPA356
O
OPA2356
P
A
3
5
6
O
P
A
2
3
5
6
O
P
A
2
3
5
6
SBOS212A – NOVEMBER, 2001
200MHz, CMOS
OPERATIONAL AMPLIFIER
DESCRIPTION
FEATURES
The OPAx356 series high-speed, voltage-feedback CMOS
operational amplifiers are designed for video and other
applications requiring wide bandwidth. The OPAx356 is unity
gain stable and can drive large output currents. Differential
gain is 0.02% and differential phase is 0.05°. Quiescent
current is only 8.3mA per channel.
● UNITY-GAIN BANDWIDTH: 450MHz
● WIDE BANDWIDTH: 200MHz GBW
● HIGH SLEW RATE: 360V/µs
● LOW NOISE: 5.8nV/√Hz
● EXCELLENT VIDEO PERFORMANCE:
DIFF GAIN: 0.02%, DIFF PHASE: 0.05°
0.1dB GAIN FLATNESS: 75MHz
OPAx356 is optimized for operation on single or dual sup-
plies as low as 2.5V (±1.25V) and up to 5.5V (±2.75V).
Common-mode input range for the OPAx356 extends 100mV
below ground and up to 1.5V from V+. The output swing is
within 100mV of the rails, supporting wide dynamic range.
● INPUT RANGE INCLUDES GROUND
● RAIL-TO-RAIL OUTPUT (within 100mV)
● LOW INPUT BIAS CURRENT: 3pA
● THERMAL SHUTDOWN
The OPAx356 series is available in single (SOT23-5 and SO-8),
and dual (MSOP-8 and SO-8) versions. Multichannel versions
feature completely independent circuitry for lowest crosstalk and
freedom from interaction. All are specified over the extended
–40°C to +125°C range.
● SINGLE-SUPPLY OPERATING RANGE: 2.5V to 5.5V
● MicroSIZE PACKAGES
OPAx356 RELATED PRODUCTS
APPLICATIONS
FEATURES
PRODUCT
● VIDEO PROCESSING
200MHz, Rail-to-Rail Output, CMOS, Shutdown
38MHz, Rail-to-Rail Input/Output, CMOS
75MHz, Rail-to-Rail Output
OPAx355
OPAx350
OPAx631
OPAx634
THS412x
● ULTRASOUND
● OPTICAL NETWORKING, TUNABLE LASERS
● PHOTODIODE TRANSIMPEDANCE AMPS
● ACTIVE FILTERS
150MHz, Rail-to-Rail Output
Differential Input/Output, 3.3V Supply
V+
● HIGH-SPEED INTEGRATORS
–VIN
● ANALOG-TO-DIGITAL (A/D) CONVERTER
Out
OPA356
INPUT BUFFERS
+VIN
● DIGITAL-TO-ANALOG (D/A) CONVERTER
OUTPUT AMPLIFIERS
V–
● BARCODE SCANNERS
● COMMUNICATIONS
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage, V+ to V– ................................................................... 7.5V
Signal Input Terminals, Voltage(2) .................... (V–) – 0.5V to (V+) + 0.5V
Current(2) ..................................................... 10mA
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. –55°C to +150°C
Storage Temperature ...................................................... –65°C to +150°C
Junction Temperature .................................................................... +160°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals
that can swing more than 0.5V beyond the supply rails should be current limited
to 10mA or less. (3) Short-circuit to ground one amplifier per package.
PACKAGE/ORDERING INFORMATION
SPECIFIED
PACKAGE
DESIGNATOR(1)
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(2)
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE-LEAD
OPA356AIDBV
SOT23-5
DBV
–40°C to +125°C
OAAI
OPA356AIDBVT
OPA356AIDBVR
Tape and Reel, 250
Tape and Reel, 3000
"
"
"
"
"
OPA356AID
SO-8
D
–40°C to +125°C
OPA356A
OPA356AID
Rails, 100
"
"
"
"
"
OPA356AIDR
Tape and Reel, 2500
OPA2356AIDGK
MSOP-8
DGK
–40°C to +125°C
AYI
OPA2356AIDGKT
OPA2356AIDGKR
Tape and Reel, 250
Tape and Reel, 2500
"
"
"
"
"
OPA2356AID
SO-8
D
–40°C to +125°C
OPA2356A
OPA2356AID
Rails, 100
"
"
"
"
"
OPA2356AIDR
Tape and Reel, 2500
NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com. (2) Models labeled with “T” indicate smaller quantity
tape and reel, “R” indicates large quantity tape and reel and “D” indicates rails of specified quantity.
PIN CONFIGURATIONS
Top View
OPA356
OPA2356
OPA356
NC(1)
V+
NC(1)
–In
1
2
3
4
8
7
6
5
Out A
–In A
+In A
V–
1
2
3
4
8
7
6
5
V+
Out
V–
1
2
3
5
4
V+
Out B
–In B
+In B
A
Out
+In
B
+In
–In
NC(1)
V–
SOT23
MSOP, SO
SO
NOTE: (1) NC means no internal connection.
OPA356, 2356
2
SBOS212A
ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Single Supply
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RF = 604Ω, RL = 150Ω, Connected to VS/2, unless otherwise noted.
OPA356AIDBV, AID,
OPA2356AIDGK, AID
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage
VOS
VS = +5V
±2
±9
mV
mV
Specified Temperature Range
Specified Temperature Range
VS = +2.7V to +5.5V, VCM = VS/2 – 0.15V
±15
vs Temperature
dVOS/dT
±7
±80
µV/°C
µV/V
vs Power Supply
PSRR
±350
INPUT BIAS CURRENT
Input Bias Current
IB
3
±50
±50
pA
pA
Input Offset Current
IOS
±1
NOISE
Input Noise Voltage Density
Current Noise Density
en
in
f = 1MHz
f = 1MHz
5.8
50
nV/√Hz
fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
VCM
(V–) – 0.1
(V+) – 1.5
V
CMRR
VS = +5.5V, –0.1V < VCM < +4.0V
66
80
dB
dB
Specified Temperature Range
66
INPUT IMPEDANCE
Differential
1013 || 1.5
1013 || 1.5
Ω || pF
Ω || pF
Common-Mode
OPEN-LOOP GAIN
VS = +5V, 0.3V < VO < 4.7V
VS = +5V, 0.3V < VO < 4.7V
VS = +5V, 0.4V < VO < 4.6V
84
80
80
92
dB
dB
dB
OPA356
OPA2356
FREQUENCY RESPONSE
Small-Signal Bandwidth
f–3dB
f–3dB
f–3dB
f–3dB
GBW
f0.1dB
SR
G
= +1, VO = 100mVp-p, RF = 0Ω
= +2, VO = 100mVp-p, RL = 50Ω
= +2, VO = 100mVp-p, RL = 150Ω
= +2, VO = 100mVp-p, RL = 1kΩ
G = +10, RL = 1kΩ
450
100
170
200
200
75
MHz
MHz
MHz
MHz
MHz
MHz
V/µs
ns
G
G
G
Gain-Bandwidth Product
Bandwidth for 0.1dB Gain Flatness
Slew Rate
G
= +2, VO = 100mVp-p, RF = 560Ω
VS = +5V, G = +2, 4V Output Step
G = +2, VO = 200mVp-p, 10% to 90%
300/–360
2.4
Rise-and-Fall Time
G
= +2, VO = 2Vp-p, 10% to 90%
8
ns
Settling Time, 0.1%
0.01%
VS = +5V, G = +2, 2V Output Step
VS = +5V, G = +2, 2V Output Step
VIN • Gain = VS
30
ns
120
8
ns
Overload Recovery Time
Harmonic Distortion
2nd Harmonic
ns
G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω
G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω
NTSC, RL = 150Ω
–81
–93
0.02
0.05
–90
dBc
dBc
3rd Harmonic
Differential Gain Error
Differential Phase Error
Channel-to-Channel Crosstalk
%
NTSC, RL = 150Ω
degrees
dB
OPA2356
f = 5MHz
OUTPUT
Voltage Output Swing from Rail
Voltage Output Swing from Rail
Voltage Output Swing from Rail
Ouput Current, Continuous(1)
Maximum Output Current, Peak(1)
Maximum Output Current, Peak(1)
Short Circuit Current
VS = +5V, RL = 150Ω, AOL > 84dB
VS = +5V, RL = 1kΩ
0.2
0.1
0.8
0.3
1
V
V
IO = ±100mA
V
IO
IO
IO
±60
mA
mA
mA
mA
Ω
VS = +5V
VS = +3V
±100
±80
+250/ –200
0.02
Closed-Loop Output Impedance
f < 100kHz
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
Quiescent Current (per amplifier)
VS
IQ
2.7
5.5
V
V
2.5 to 5.5
8.3
VS = +5V, IO = 0
11
mA
mA
Specified Temperature Range
14
OPA356, 2356
3
SBOS212A
ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Single Supply (Cont.)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RF = 604Ω, RL = 150Ω, Connected to VS/2, unless otherwise noted.
OPA356AIDBV, AID,
OPA2356AIDGK, AID
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
THERMAL SHUTDOWN
Junction Temperature
Shutdown
160
140
°C
°C
Reset from Shutdown
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
–40
–55
–65
125
150
150
°C
°C
°C
Thermal Resistance
SOT23-5, MSOP-8
SO-8
θJA
°C/W
°C/W
°C/W
150
125
NOTES: (1) See typical characteristic “Output Voltage Swing vs Output Current”.
OPA356, 2356
4
SBOS212A
TYPICAL CHARACTERISTICS
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
NON-INVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
INVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
6
3
3
0
VO = 0.1Vp-p
VO = 0.1Vp-p
G = +1
R
F = 0
G = –1
G = –2
0
–3
G = –5
–3
–6
–9
–12
–15
–6
G = +2
G = +5
G = +10
G = –10
–9
–12
–15
100k
1M
10M
100M
1G
100k
1M
10M
Frequency (Hz)
100M
1G
Frequency (Hz)
NON-INVERTING SMALL-SIGNAL
STEP RESPONSE
NON-INVERTING LARGE-SIGNAL
STEP RESPONSE
G = +2
G = +2
Time (20ns/div)
Time (20ns/div)
0.1dB GAIN FLATNESS FOR VARIOUS RF
HARMONIC DISTORTION vs OUTPUT VOLTAGE
0.5
0.4
–50
–60
f = 1MHz
VO = 0.1Vp-p
CL = 0pF
RL = 200Ω
RF = 604Ω
0.3
0.2
0.1
–70
0
2nd Harmonic
3rd Harmonic
–0.1
–0.2
–0.3
–0.4
–0.5
–80
RF = 560Ω
–90
RF = 500Ω
–100
1
10
Frequency (MHz)
100
0
1
2
3
4
Output Voltage (Vp-p)
OPA356, 2356
5
SBOS212A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
HARMONIC DISTORTION vs NON-INVERTING GAIN
HARMONIC DISTORTION vs INVERTING GAIN
–50
–60
–50
–60
VO = 2Vp-p
f = 1MHz
VO = 2Vp-p
f = 1MHz
RL = 200Ω
RL = 200Ω
–70
–70
2nd Harmonic
2nd Harmonic
–80
–80
3rd Harmonic
3rd Harmonic
–90
–90
–100
–100
1
10
10M
100M
1
10
Gain (V/V)
Gain (V/V)
HARMONIC DISTORTION vs FREQUENCY
HARMONIC DISTORTION vs LOAD RESISTANCE
–50
–60
–50
–60
VO = 2Vp-p
L = 200Ω
V
O = 2Vp-p
R
f = 1MHz
2nd Harmonic
–70
–70
–80
–80
2nd Harmonic
3rd Harmonic
–90
–90
3rd Harmonic
–100
–100
100k
1M
Frequency (Hz)
100
1k
RL (Ω)
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
FREQUENCY RESPONSE FOR VARIOUS RL
RL = 10kΩ
10k
1k
3
0
CL = 0pF
Current Noise
Voltage Noise
–3
V
O = 0.1Vp-p
RL = 50Ω
RL = 150Ω
100
10
1
–6
–9
RL = 1kΩ
–12
–15
10
100
1k
10k
100k
1M
10M
100k
1M
10M
100M
1G
Frequency (Hz)
Frequency (Hz)
OPA356, 2356
6
SBOS212A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
FREQUENCY RESPONSE FOR VARIOUS CL
RECOMMENDED RS vs CAPACITIVE LOAD
9
6
120
100
80
60
40
20
0
CL = 100pF
CL = 47pF
RS = 0Ω
O = 0.1Vp-p
V
3
0
–3
–6
–9
–12
–15
VIN
RS
CL = 5.6pF
VO
OPA356
CL
1kΩ
604Ω
(1kΩ is
Optional)
604Ω
100k
1M
10M
100M
1G
1
10
100
Frequency (Hz)
Capacitive Load (pF)
COMMON-MODE REJECTION RATIO AND
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
FREQUENCY RESPONSE vs CAPACITIVE LOAD
3
100
90
80
70
60
50
40
30
20
10
0
G = +2
O = 0.1Vp-p
V
–PSRR
0
–3
CL = 5.6pF
S = 80Ω
CL = 100pF
+PSRR
R
R
S = 24Ω
CMRR
VIN
RS
–6
VO
1kΩ
OPA356
CL = 47pF
S = 36Ω
R
CL
–9
604Ω
(1kΩ is
Optional)
–12
–15
604Ω
1M
10M
100M
1G
10k
100k
1M
10M
100M
1G
Frequency (Hz)
Frequency (Hz)
COMPOSITE VIDEO
DIFFERENTIAL GAIN AND PHASE
OPEN-LOOP GAIN AND PHASE
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
180
160
140
120
100
80
RL = 1kΩ
Phase
Gain
dP
dG
60
RL = 150Ω
40
20
0
–20
1
2
3
4
1k
10k
100k
1M
10M
100M
1G
Number of 150Ω Loads
Frequency (Hz)
OPA356, 2356
7
SBOS212A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
FOR VS = 3V
INPUT BIAS CURRENT vs TEMPERATURE
3
2
1
0
10n
1n
100
10
1
25°C
–55°C
125°C
Continuous currents above
60mA are not recommended
125°C
–55°C
25°C
0
30
60
90
120
150
–55 –35 –15
5
25
45
65
85 105 125 135
Output Current (mA)
Temperature (°C)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
FOR VS = 5V
SUPPLY CURRENT vs TEMPERATURE
VS = 5.5V
5
4
3
2
1
0
14
12
10
8
25°C
–55°C
125°C
Continuous currents above
60mA are not recommended
6
VS = 2.5V
VS = 3V
125°C
4
VS = 5V
–55°C
25°C
2
0
0
50
100
150
200
250
–55 –35 –15
5
25
45
65
85 105 125 135
Output Current (mA)
Temperature (°C)
CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
VS = 5.5V
100
10
6
5
4
3
2
1
0
Maximum Output
Voltage without
Slew-Rate
1
Induced Distortion
OPA356
VS = 2.7V
0.1
ZO
604Ω
0.01
0.001
604Ω
10k
100k
1M
10M
100M
1G
1
10
Frequency (MHz)
100
Frequency (Hz)
OPA356, 2356
8
SBOS212A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C and VS = 5V, G = +2, RF = 604Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN vs TEMPERATURE
OUTPUT SETTLING TIME TO 0.1%
110
100
90
0.2
0.1
VO = 2Vp-p
RL = 1kΩ
0
RL = 150Ω
–0.1
–0.2
–0.3
–0.4
80
70
60
–55 –35 –15
5
25
45
65
85 105 125 135
0
5
10
15 20 25
Time (ns)
30
35
40
45 50
Temperature (°C)
COMMON-MODE REJECTION RATIO AND
POWER-SUPPLY REJECTION RATIO vs TEMPERATURE
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
100
90
80
70
60
50
20
18
16
14
12
10
8
Power-Supply Rejection Ratio
Common-Mode Rejection Ratio
6
4
2
0
–55 –35 –15
5
25
45
65
85 105 125 135
–9 –8 –7 –6 –5 –4 –3 –2 –1 0
1 2 3 4 5 6 7 8 9
Temperature (°C)
Offset Voltage (mV)
CHANNEL-TO-CHANNEL CROSSTALK
0
–20
–40
–60
–80
OPA2356
(dual)
–100
–120
100k
1M
10M
100M
Frequency (Hz)
OPA356, 2356
9
SBOS212A
Parameters that vary significantly over supply voltage or
temperature are shown in the “Typical Characteristics” sec-
tion of this data sheet.
APPLICATIONS INFORMATION
The OPAx356 series is a CMOS, high-speed, voltage feed-
back, operational amplifier designed for video and other
general-purpose applications. It is available as a single or
dual op amp.
OUTPUT DRIVE
The OPAx356 output stage is capable of driving a standard
back-terminated 75Ω video cable. By back-terminating a
transmission line, it does not exhibit a capacitive load to its
driver. A properly back-terminated 75Ω cable does not ap-
pear as capacitance; it presents only a 150Ω resistive load to
the OPAx356 output.
The amplifier features a 200MHz gain bandwidth and
360V/µs slew rate, but it is unity-gain stable and can be
operated as a +1V/V voltage follower.
Its input common-mode voltage range includes ground, al-
lowing the OPAx356 to be used in virtually any single-supply
application up to a supply voltage of +5.5V.
The output stage can supply high short-circuit current (typi-
cally over 200mA). Therefore, an on-chip thermal shutdown
circuit is provided to protect the OPAx356 from dangerously
high junction temperatures. At 160°C, the protection circuit
will shut down the amplifier. Normal operation will resume
when the junction temperature cools to below 140°C.
PCB LAYOUT
Good high-frequency PC board layout techniques should be
employed for the OPAx356. Generous use of ground planes,
short direct signal traces, and a suitable bypass capacitor
located at the V+ pin will assure clean, stable operation.
Large areas of copper also provide a means of dissipating
heat that is generated within the amplifier in normal opera-
tion.
NOTE: It is not recommended to run a continuous DC current
in excess of ±60mA. Refer to the graph of “Output Voltage
Swing vs Output Current”, shown in the “Typical Character-
istics” section of this data sheet.
Sockets are definitely not recommended for use with any
high-speed amplifier.
INPUT AND ESD PROTECTION
A 10µF ceramic bypass capacitor is the minimum recom-
mended value; adding a 1µF or larger tantalum capacitor in
parallel can be beneficial when driving a low-resistance load.
Providing adequate bypass capacitance is essential to achiev-
ing very low harmonic and intermodulation distortion.
All OPAx356 pins are static protected with internal ESD
protection diodes tied to the supplies, as shown in Figure 1.
These diodes will provide overdrive protection if the current
is externally limited to 10mA by the source or by a resistor.
OPERATING VOLTAGE
+VCC
The OPAx356 is specified over a power-supply range of
+2.7V to +5.5V (±1.35 to ±2.75V). However, the supply
voltage may range from +2.5V to +5.5V (±1.25V to ±2.75V).
Supply voltages higher than 7.5V (absolute maximum) can
permanently damage the amplifier.
External
Pin
Internal
Circuitry
–VCC
FIGURE 1. Internal ESD Protection.
OPA356, 2356
10
SBOS212A
PACKAGE DRAWINGS
DBV (R-PDSO-G5)
MPDS018D – FEBRUARY 1996 – REVISED JANUARY 2001
PLASTIC SMALL-OUTLINE
0,50
0,30
M
0,20
0,95
5
4
0,15 NOM
1,70
1,50
3,00
2,60
1
3
Gage Plane
3,00
2,80
0,25
0°–8°
0,55
0,35
Seating Plane
0,10
1,45
0,95
0,05 MIN
4073253-4/F 10/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-178
OPA356, 2356
11
SBOS212A
PACKAGE DRAWINGS (Cont.)
DGK (R-PDSO-G8)
MPDS028B – JUNE 1997 – REVISED SEPTEMBER 2001
PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
M
0,65
8
0,08
5
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
0°–6°
1
4
0,69
3,05
2,95
0,41
Seating Plane
0,10
0,15
0,05
1,07 MAX
4073329/C 08/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-187
OPA356, 2356
12
SBOS212A
PACKAGE DRAWINGS (Cont.)
MSOI002B – JANUARY 1995 – REVISED SEPTEMBER 2001
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
0.020 (0,51)
0.014 (0,35)
0.050 (1,27)
8
0.010 (0,25)
5
0.244 (6,20)
0.228 (5,80)
0.008 (0,20) NOM
0.157 (4,00)
0.150 (3,81)
Gage Plane
1
4
0.010 (0,25)
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
0.069 (1,75) MAX
0.004 (0,10)
0.004 (0,10)
PINS **
8
14
16
DIM
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
A MIN
4040047/E 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
OPA356, 2356
13
SBOS212A
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
PACKAGING INFORMATION
Orderable Device
OPA2356AID
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
8
8
8
5
5
5
5
8
8
8
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OPA2356AIDG4
OPA2356AIDGKR
OPA2356AIDGKRG4
OPA2356AIDGKT
OPA2356AIDGKTG4
OPA2356AIDR
SOIC
MSOP
MSOP
MSOP
MSOP
SOIC
D
DGK
DGK
DGK
DGK
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OPA2356AIDRG4
OPA356AID
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
D
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OPA356AIDBVR
OPA356AIDBVRG4
OPA356AIDBVT
OPA356AIDBVTG4
OPA356AIDG4
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
D
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
100 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OPA356AIDR
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OPA356AIDRG4
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
(mm)
OPA2356AIDGKR
OPA2356AIDR
OPA356AIDR
DGK
D
8
8
8
CAR
CRS
CRS
0
0
0
0
0
0
5.3
6.4
6.4
3.4
5.2
5.2
1.4
2.1
2.1
8
8
8
12
12
12
Q1
Q1
Q1
D
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
OPA2356AIDGKR
OPA2356AIDR
OPA356AIDR
DGK
D
8
8
8
CAR
CRS
CRS
346.0
342.9
342.9
346.0
336.6
336.6
29.0
20.6
20.6
D
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
Pack Materials-Page 3
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amplifier.ti.com
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interface.ti.com
logic.ti.com
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power.ti.com
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Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
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www.ti.com/telephony
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Wireless
www.ti.com/video
www.ti.com/wireless
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