OPA2377 [TI]

5MHz, Low-Noise, Single, Dual, Quad CMOS Operational Amplifiers; 为5MHz ,低噪声,单路,双路,四路CMOS运算放大器
OPA2377
型号: OPA2377
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

5MHz, Low-Noise, Single, Dual, Quad CMOS Operational Amplifiers
为5MHz ,低噪声,单路,双路,四路CMOS运算放大器

运算放大器
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OPA377  
OPA2377  
OPA4377  
www.ti.com  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
5MHz, Low-Noise,  
Single, Dual, Quad CMOS Operational Amplifiers  
Check for Samples: OPA377, OPA2377, OPA4377  
1
FEATURES  
DESCRIPTION  
2
GAIN BANDWIDTH PRODUCT: 5.5MHz  
LOW NOISE: 7.5nV/Hz at 1kHz  
OFFSET VOLTAGE: 1mV (max)  
INPUT BIAS CURRENT: 0.2pA  
RAIL-TO-RAIL OUTPUT  
The OPA377 family of operational amplifiers are  
wide-bandwidth CMOS amplifiers that provide very  
low noise, low input bias current, and low offset  
voltage while operating on a low quiescent current of  
0.76mA (typ).  
The OPA377 op amps are optimized for low-voltage,  
UNITY-GAIN STABLE  
single-supply  
applications.  
The  
exceptional  
combination of ac and dc performance make them  
ideal for a wide range of applications, including small  
signal conditioning, audio, and active filters. In  
addition, these parts have a wide supply range with  
excellent PSRR, making them attractive for  
applications that run directly from batteries without  
regulation.  
EMI INPUT FILTERING  
QUIESCENT CURRENT: 0.76mA/ch  
SUPPLY VOLTAGE: 2.2V to 5.5V  
SMALL PACKAGES:  
SC70, SOT23, and MSOP  
APPLICATIONS  
The OPA377 is available in the SC70-5, SOT23-5,  
and SO-8 packages. The dual OPA2377 is offered in  
the SO-8 and MSOP-8, and the quad OPA4377 in the  
TSSOP-14 packages. All versions are specified for  
operation from 40°C to +125°C.  
PHOTODIODE PREAMP  
PIEZOELECTRIC SENSOR PREAMP  
SENSOR SIGNAL CONDITIONING  
AUDIO EQUIPMENT  
ACTIVE FILTERS  
CF  
INPUT BIAS CURRENT vs TEMPERATURE  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
RF  
VS  
VOUT  
OPA377  
VB  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Photodiode Preamplifier  
Temperature (°C)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
© 20102011, Texas Instruments Incorporated  
 
 
 
 
OPA377  
OPA2377  
OPA4377  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ABSOLUTE MAXIMUM RATING(1)  
Over operating free-air temperature range, unless otherwise noted.  
OPA377, OPA2377, OPA4377  
UNIT  
V
Supply Voltage  
VS = (V+) (V)  
+7  
(V) 0.5 to (V+) + 0.5  
±10  
Voltage(2)  
Current(2)  
V
Signal Input Terminals  
mA  
Output Short-Circuit(3)  
Operating Temperature  
Storage Temperature  
Junction Temperature  
Continuous  
40 to +150  
65 to +150  
+150  
TA  
TA  
TJ  
°C  
°C  
°C  
V
Human Body Model  
Charged Device Model  
Machine Model  
4000  
ESD Rating  
1000  
V
200  
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not supported.  
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should  
be current limited to 10mA or less.  
(3) Short-circuit to ground, one amplifier per package.  
PACKAGE INFORMATION(1)  
PRODUCT  
PACKAGE-LEAD  
PACKAGE DESIGNATOR  
PACKAGE MARKING  
OP377A  
SC70-5  
DCK  
DBV  
D
OPA377  
SOT23-5  
SO-8  
OP377A  
OP377A  
SO-8  
D
O2377A  
OPA2377  
OPA4377  
MSOP-8  
TSSOP-14  
DGK  
PW  
OTAQ  
O4377A  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the  
device product folder at www.ti.com.  
2
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© 20102011, Texas Instruments Incorporated  
Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
 
OPA377  
OPA2377  
OPA4377  
www.ti.com  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
ELECTRICAL CHARACTERISTICS: VS = +2.2V to +5.5V  
Boldface limits apply over the specified temperature range: TA = 40°C to +125°C.  
At TA = +25°C, RL = 10kconnected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.  
OPA377, OPA2377, OPA4377  
PARAMETERS  
OFFSET VOLTAGE  
CONDITIONS  
MIN TYP MAX  
UNIT  
Input Offset Voltage  
vs Temperature  
VOS  
dVOS/dT  
PSRR  
VS = +5V  
0.25  
0.32  
5
1
2
mV  
mV/°C  
mV/V  
mV/V  
µV/V  
40°C to +125°C  
vs Power Supply  
VS = +2.2V to +5.5V, VCM < (V+) 1.3V  
VS = +2.2V to +5.5V, VCM < (V+) 1.3V  
28  
Over Temperature  
5
Channel Separation, dc (dual, quad)  
INPUT BIAS CURRENT  
Input Bias Current  
0.5  
IB  
±0.2  
±10  
pA  
pA  
pA  
Over Temperature  
See Typical Characteristics  
Input Offset Current  
NOISE  
IOS  
±0.2  
±10  
Input Voltage Noise,  
Input Voltage Noise Density  
Input Current Noise  
INPUT VOLTAGE RANGE  
Common-Mode Voltage Range  
Common-Mode Rejection Ratio  
INPUT CAPACITANCE  
Differential  
en  
en  
in  
f = 0.1Hz to 10Hz  
f = 1kHz  
0.8  
7.5  
2
mVPP  
nV/Hz  
fA/Hz  
f = 1kHz  
VCM  
(V) 0.1  
(V+) + 0.1  
V
CMRR  
(V) < VCM < (V+) 1.3 V  
70  
90  
dB  
6.5  
13  
pF  
pF  
Common-Mode  
OPEN-LOOP GAIN  
Open-Loop Voltage Gain  
AOL  
50mV < VO < (V+) 50mV, RL = 10kΩ  
100mV < VO < (V+) 100mV, RL = 2kΩ  
VS = 5.5V  
112  
134  
126  
dB  
dB  
FREQUENCY RESPONSE  
Gain-Bandwidth Product  
Slew Rate  
GBW  
SR  
tS  
5.5  
2
MHz  
V/ms  
ms  
G = +1  
Settling Time 0.1%  
Settling Time 0.01%  
Overload Recovery Time  
THD + Noise  
2V Step , G = +1  
2V Step , G = +1  
VIN × Gain > VS  
1.6  
tS  
2
ms  
0.33  
0.00027  
ms  
THD+N VO = 1VRMS, G = +1, f = 1kHz, RL = 10kΩ  
%
OUTPUT  
Voltage Output Swing from Rail  
Over Temperature  
Short-Circuit Current  
Capacitive Load Drive  
Open-Loop Output Impedance  
POWER SUPPLY  
RL = 10kΩ  
10  
20  
mV  
mV  
mA  
RL = 10kΩ  
40  
ISC  
CLOAD  
RO  
+30/50  
See Typical Characteristics  
150  
Specified Voltage Range  
Quiescent Current per amplifier  
Over Temperature  
TEMPERATURE RANGE  
Specified Range  
VS  
2.2  
5.5  
1.05  
1.2  
V
IQ  
IO = 0, VS = +5.5V  
0.76  
mA  
mA  
40  
+125  
°C  
Thermal Resistance  
SC70-5  
qJA  
°C/W  
°C/W  
°C/W  
°C/W  
250  
200  
150  
SOT23-5  
MSOP-8, SO-8, TSSOP-14  
© 20102011, Texas Instruments Incorporated  
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Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
OPA377  
OPA2377  
OPA4377  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
www.ti.com  
PIN CONFIGURATIONS  
OPA377  
SOT23-5  
(TOP VIEW)  
OPA377  
SO-8  
(TOP VIEW)  
(1)  
(1)  
OUT  
V-  
1
2
3
5
4
V+  
NC  
1
2
3
4
8
7
6
5
NC  
V+  
-
+
-IN  
+IN  
V-  
+IN  
-IN  
OUT  
(1)  
NC  
OPA377  
SC70-5  
(TOP VIEW)  
OPA2377  
SO-8, MSOP-8  
(TOP VIEW)  
+IN  
V-  
1
5
V+  
2
3
OUT A  
-IN A  
+IN A  
V-  
1
2
3
4
8
7
6
5
V+  
-IN  
4
OUT  
OUT B  
-IN B  
+IN B  
OPA4377  
TSSOP-14  
(TOP VIEW)  
OUT A  
-IN A  
+IN A  
V+  
1
2
3
4
5
6
7
14 OUT D  
13 -IN D  
12 +IN D  
11 V-  
+IN B  
-IN B  
OUT B  
10 +IN C  
9
8
-IN C  
OUT C  
(1) NC denotes no internal connection.  
(2) Connect thermal die to V.  
4
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© 20102011, Texas Instruments Incorporated  
Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
OPA377  
OPA2377  
OPA4377  
www.ti.com  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
TYPICAL CHARACTERISTICS  
At TA = +25°C, VS = +5V, RL = 10kconnected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.  
POWER-SUPPLY AND COMMON-MODE  
OPEN-LOOP GAIN/PHASE vs FREQUENCY  
REJECTION RATIO vs FREQUENCY  
120  
100  
80  
60  
40  
20  
0
160  
140  
120  
100  
80  
0
V(+) Power-Supply Rejection Ratio  
-20  
-40  
Gain  
-60  
Phase  
Common-Mode  
Rejection Ratio  
-80  
60  
-100  
-120  
-140  
-160  
-180  
40  
V(-) Power-Supply Rejection Ratio  
20  
0
-20  
10  
100  
1k  
10k  
100k  
1M  
10M  
0.1  
1
10  
100  
1k  
10k  
100k 1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
Figure 1.  
Figure 2.  
OPEN-LOOP GAIN AND POWER-SUPPLY  
REJECTION RATIO vs TEMPERATURE  
0.1Hz to 10Hz  
INPUT VOLTAGE NOISE  
160  
140  
120  
100  
80  
Open-Loop Gain (RL = 10kW)  
Power-Supply Rejection Ratio  
(VS = 2.2V to 5.5V)  
1s/div  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Temperature (°C)  
Figure 3.  
Figure 4.  
TOTAL HARMONIC DISTORTION + NOISE  
vs FREQUENCY  
INPUT VOLTAGE NOISE SPECTRAL DENSITY  
100  
10  
1
1
VS = 5V, VCM = 2V, VOUT = 1VRMS  
0.1  
0.01  
Gain = 10V/V  
Gain = 1V/V  
0.001  
0.0001  
1
10  
100  
1k  
10k  
100k  
10  
100  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
Figure 5.  
Figure 6.  
© 20102011, Texas Instruments Incorporated  
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Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
OPA377  
OPA2377  
OPA4377  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VS = +5V, RL = 10kconnected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.  
COMMON-MODE REJECTION RATIO  
vs TEMPERATURE  
QUIESCENT CURRENT  
vs TEMPERATURE  
110  
100  
90  
1000  
900  
800  
700  
600  
500  
80  
70  
60  
50  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Temperature (°C)  
Temperature (°C)  
Figure 7.  
Figure 8.  
QUIESCENT AND SHORT-CIRCUIT CURRENT  
vs SUPPLY VOLTAGE  
SHORT-CIRCUIT CURRENT  
vs TEMPERATURE  
75  
50  
1000  
900  
800  
700  
600  
500  
50  
40  
30  
20  
10  
0
VS = ±2.75V  
ISC+  
ISC+  
25  
0
IQ  
-25  
-50  
-75  
-100  
ISC-  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
Temperature (°C)  
Supply Voltage (V)  
Figure 9.  
Figure 10.  
INPUT BIAS CURRENT vs TEMPERATURE  
OUTPUT VOLTAGE vs OUTPUT CURRENT  
3
2
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
VS = ±2.75  
1
+150°C  
+125°C  
+25°C  
-40°C  
0
-1  
-2  
-3  
0
10  
20  
30  
40  
50  
60  
70  
80  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Output Current (mA)  
Temperature (°C)  
Figure 11.  
Figure 12.  
6
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Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
OPA377  
OPA2377  
OPA4377  
www.ti.com  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VS = +5V, RL = 10kconnected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.  
OFFSET VOLTAGE  
PRODUCTION DISTRIBUTION  
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY  
6
5
4
3
2
1
0
VS = 5.5V  
VS = 5V  
VS = 2.5V  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Offset Voltage (mV)  
Figure 13.  
Figure 14.  
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE  
SMALL-SIGNAL PULSE RESPONSE  
50  
G = +1  
RL = 10kW  
G = +1V/V  
40  
30  
20  
10  
0
CL = 50pF  
10  
100  
1k  
Time (400ns/div)  
Load Capacitance (pF)  
Figure 15.  
Figure 16.  
LARGE-SIGNAL PULSE RESPONSE  
SETTLING TIME vs CLOSED-LOOP GAIN  
100  
10  
1
G = +1  
RL = 2kW  
CL = 50pF  
0.01%  
0.1%  
0.1  
Time (2ms/div)  
1
10  
100  
Closed-Loop Gain (V/V)  
Figure 17.  
Figure 18.  
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Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
OPA377  
OPA2377  
OPA4377  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VS = +5V, RL = 10kconnected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted.  
CHANNEL SEPARATION vs FREQUENCY  
OPEN-LOOP OUTPUT RESISTANCE vs FREQUENCY  
140  
120  
100  
80  
1k  
100  
10  
60  
400mA Load  
2mA Load  
40  
1
20  
0
0.1  
10  
100  
1k  
10k  
100k  
1M  
10M  
100M  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
Figure 19.  
Figure 20.  
8
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Product Folder Link(s): OPA377 OPA2377 OPA4377  
OPA377  
OPA2377  
OPA4377  
www.ti.com  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
APPLICATION INFORMATION  
OPERATING CHARACTERISTICS  
R2  
10kW  
The OPA377 family of amplifiers has parameters that  
are fully specified from 2.2V to 5.5V (±1.1V to  
±2.75V). Many of the specifications apply from 40°C  
to +125°C. Parameters that can exhibit significant  
variance with regard to operating voltage or  
temperature are presented in the Typical  
Characteristics.  
+5V  
C1  
100nF  
R1  
1kW  
GENERAL LAYOUT GUIDELINES  
VOUT  
OPA377  
For best operational performance of the device, good  
printed circuit board (PCB) layout practices are  
required. Low-loss, 0.1mF bypass capacitors must be  
connected between each supply pin and ground,  
placed as close to the device as possible. A single  
bypass capacitor from V+ to ground is applicable to  
single-supply applications.  
VIN  
VCM = 2.5V  
BASIC AMPLIFIER CONFIGURATIONS  
Figure 21. Basic Single-Supply Connection  
COMMON-MODE VOLTAGE RANGE  
The OPA377 family is unity-gain stable. It does not  
exhibit output phase inversion when the input is  
overdriven. A typical single-supply connection is  
shown in Figure 21. The OPA377 is configured as a  
basic inverting amplifier with a gain of 10V/V. This  
single-supply connection has an output centered on  
the common-mode voltage, VCM. For the circuit  
shown, this voltage is 2.5V, but may be any value  
within the common-mode input voltage range.  
The input common-mode voltage range of the  
OPA377 series extends 100mV beyond the supply  
rails. The offset voltage of the amplifier is low, from  
approximately (V) to (V+) 1V, as shown in  
Figure 22. The offset voltage increases as  
common-mode  
voltage  
exceeds  
(V+)  
1V.  
Common-mode rejection is specified from (V) to  
(V+) 1.3V.  
3
2
1
0
-1  
-2  
-V  
+V  
-3  
-0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
Input Common-Mode Voltage (V)  
Figure 22. Offset and Common-Mode Voltage  
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Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
 
 
OPA377  
OPA2377  
OPA4377  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
www.ti.com  
INPUT AND ESD PROTECTION  
CAPACITIVE LOAD AND STABILITY  
The OPA377 family incorporates internal electrostatic  
discharge (ESD) protection circuits on all pins. In the  
case of input and output pins, this protection primarily  
consists of current steering diodes connected  
between the input and power-supply pins. These ESD  
protection diodes also provide in-circuit, input  
overdrive protection, as long as the current is limited  
to 10mA as stated in the Absolute Maximum Ratings.  
Figure 23 shows how a series input resistor may be  
added to the driven input to limit the input current.  
The added resistor contributes thermal noise at the  
amplifier input and its value should be kept to a  
minimum in noise-sensitive applications.  
The OPA377 series of amplifiers may be used in  
applications where driving capacitive load is  
a
required. As with all op amps, there may be specific  
instances where the OPAx377 can become unstable,  
leading to oscillation. The particular op amp circuit  
configuration, layout, gain, and output loading are  
some of the factors to consider when establishing  
whether an amplifier will be stable in operation. An op  
amp in the unity-gain (+1V/V) buffer configuration and  
driving a capacitive load exhibits a greater tendency  
to be unstable than an amplifier operated at a higher  
noise gain. The capacitive load, in conjunction with  
the op amp output resistance, creates a pole within  
the feedback loop that degrades the phase margin.  
The degradation of the phase margin increases as  
the capacitive loading increases.  
V+  
IOVERLOAD  
The OPAx377 in a unity-gain configuration can  
directly drive up to 250pF pure capacitive load.  
Increasing the gain enhances the ability of the  
amplifier to drive greater capacitive loads; see the  
typical characteristic plot, Small-Signal Overshoot vs  
Capacitive Load. In unity-gain configurations,  
capacitive load drive can be improved by inserting a  
small (10to 20) resistor, RS, in series with the  
output, as shown in Figure 24. This resistor  
significantly reduces ringing while maintaining dc  
performance for purely capacitive loads. However, if  
there is a resistive load in parallel with the capacitive  
load, a voltage divider is created, introducing a gain  
error at the output and slightly reducing the output  
swing. The error introduced is proportional to the ratio  
RS/RL, and is generally negligible at low output  
current levels.  
10mA max  
VOUT  
OPA377  
VIN  
5kW  
Figure 23. Input Current Protection  
EMI SUSCEPTIBILITY AND INPUT FILTERING  
Operational amplifiers vary in susceptibility to  
electromagnetic interference (EMI). If conducted EMI  
enters the operational amplifier, the dc offset  
observed at the amplifier output may shift from the  
nominal value while the EMI is present. This shift is a  
result of signal rectification associated with the  
internal semiconductor junctions. While all amplifier  
pin functions can be affected by EMI, the input pins  
are likely to be the most susceptible. The OPA377  
operational amplifier family incorporates an internal  
input low-pass filter that reduces the amplifier  
response to EMI. Both common-mode and differential  
mode filtering are provided by the input filter. The  
V+  
RS  
VOUT  
OPA377  
10W to  
20W  
VIN  
CL  
RL  
filter is designed for  
a
cutoff frequency of  
approximately 75MHz (3dB), with a roll-off of 20dB  
per decade.  
Figure 24. Improving Capacitive Load Drive  
10  
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© 20102011, Texas Instruments Incorporated  
Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
 
OPA377  
OPA2377  
OPA4377  
www.ti.com  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
ACTIVE FILTERING  
DRIVING AN ANALOG-TO-DIGITAL  
CONVERTER  
The OPA377 series is well-suited for filter  
applications requiring a wide bandwidth, fast slew  
rate, low-noise, single-supply operational amplifier.  
Figure 25 shows a 50kHz, 2nd-order, low-pass filter.  
The components have been selected to provide a  
maximally-flat Butterworth response. Beyond the  
cutoff frequency, roll-off is 40dB/dec. The  
Butterworth response is ideal for applications  
requiring predictable gain characteristics such as the  
anti-aliasing filter used ahead of an analog-to-digital  
converter (ADC).  
The low noise and wide gain bandwidth of the  
OPA377 family make it an ideal driver for ADCs.  
Figure 26 illustrates the OPA377 driving an  
ADS8327, 16-bit, 250kSPS converter. The amplifier is  
connected as a unity-gain, noninverting buffer.  
+5V  
C1  
0.1mF  
+5V  
(1)  
R1  
R3  
100W  
+IN  
ADS8327  
Low Power  
16-Bit  
5.49kW  
OPA377  
(1)  
C3  
-IN  
1.2nF  
C2  
500kSPS  
VIN  
150pF  
REF IN  
+5V  
V+  
R1  
R2  
REF5040  
5.49kW  
12.4kW  
4.096V  
C4  
100nF  
OPA377  
VOUT  
C1  
1nF  
VIN  
(1) Suggested value; may require adjustment based on specific  
application.  
(2) Initial calibration recommended.  
Figure 26. Driving an ADS8327(2)  
(V+)/2  
Figure 25. Second-Order Butterworth 50kHz  
Low-Pass Filter  
© 20102011, Texas Instruments Incorporated  
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Product Folder Link(s): OPA377 OPA2377 OPA4377  
 
 
OPA377  
OPA2377  
OPA4377  
SBOS504B FEBRUARY 2010REVISED JANUARY 2011  
www.ti.com  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision A (October 2010) to Revision B  
Page  
Changed document status to production data ...................................................................................................................... 1  
Deleted cross-reference to note 2 and shading from DCK package in Package Information table ..................................... 2  
Updated Figure 22 ................................................................................................................................................................ 9  
Changes from Original (February 2010) to Revision A  
Page  
Deleted DFN from list of packages in final Features bullet .................................................................................................. 1  
Deleted DFN package from Description section ................................................................................................................... 1  
Updated Input Bias Current vs Temperature plot ................................................................................................................. 1  
Deleted cross-reference to note 2 and shading from all packages except SC70-5 in Package Information table .............. 2  
Deleted DFN-8 package from Package Information table .................................................................................................... 2  
Deleted Temperature Range, DFN-8 parameter from Electrical Characteristics table ........................................................ 3  
Deleted DFN-8 pin configuration .......................................................................................................................................... 4  
Updated Figure 11 ................................................................................................................................................................ 6  
12  
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© 20102011, Texas Instruments Incorporated  
Product Folder Link(s): OPA377 OPA2377 OPA4377  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Aug-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
OPA2377AID  
OPA2377AIDGKR  
OPA2377AIDGKT  
OPA2377AIDR  
OPA377AID  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
VSSOP  
VSSOP  
SOIC  
D
8
8
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
DGK  
DGK  
D
2500  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
8
Green (RoHS  
& no Sb/Br)  
8
2500  
75  
Green (RoHS  
& no Sb/Br)  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
OPA377AIDBVR  
OPA377AIDBVT  
OPA377AIDCKR  
OPA377AIDCKT  
OPA377AIDR  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DCK  
DCK  
D
5
3000  
250  
Green (RoHS  
& no Sb/Br)  
5
Green (RoHS  
& no Sb/Br)  
5
3000  
250  
Green (RoHS  
& no Sb/Br)  
SC70  
5
Green (RoHS  
& no Sb/Br)  
SOIC  
8
2500  
90  
Green (RoHS  
& no Sb/Br)  
OPA4377AIPW  
OPA4377AIPWR  
TSSOP  
TSSOP  
PW  
PW  
14  
14  
Green (RoHS  
& no Sb/Br)  
2000  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Aug-2012  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Aug-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
OPA2377AIDGKR  
OPA2377AIDGKT  
OPA2377AIDR  
VSSOP  
VSSOP  
SOIC  
DGK  
DGK  
D
8
8
2500  
250  
330.0  
180.0  
330.0  
180.0  
179.0  
180.0  
179.0  
179.0  
179.0  
330.0  
330.0  
12.4  
12.4  
12.4  
8.4  
5.3  
5.3  
6.4  
3.23  
3.2  
3.23  
3.2  
2.2  
2.2  
6.4  
6.9  
3.4  
3.4  
5.2  
3.17  
3.2  
3.17  
3.2  
2.5  
2.5  
5.2  
5.6  
1.4  
1.4  
2.1  
1.37  
1.4  
1.37  
1.4  
1.2  
1.2  
2.1  
1.6  
8.0  
8.0  
8.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
12.0  
12.0  
12.0  
8.0  
Q1  
Q1  
Q1  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q1  
Q1  
8
2500  
3000  
3000  
250  
OPA377AIDBVR  
OPA377AIDBVR  
OPA377AIDBVT  
OPA377AIDBVT  
OPA377AIDCKR  
OPA377AIDCKT  
OPA377AIDR  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DBV  
DBV  
DCK  
DCK  
D
5
5
8.4  
8.0  
5
8.4  
8.0  
5
250  
8.4  
8.0  
5
3000  
250  
8.4  
8.0  
SC70  
5
8.4  
8.0  
SOIC  
8
2500  
2000  
12.4  
12.4  
12.0  
12.0  
OPA4377AIPWR  
TSSOP  
PW  
14  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Aug-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
OPA2377AIDGKR  
OPA2377AIDGKT  
OPA2377AIDR  
VSSOP  
VSSOP  
SOIC  
DGK  
DGK  
D
8
8
2500  
250  
367.0  
210.0  
367.0  
202.0  
195.0  
202.0  
195.0  
195.0  
195.0  
367.0  
367.0  
367.0  
185.0  
367.0  
201.0  
200.0  
201.0  
200.0  
200.0  
200.0  
367.0  
367.0  
35.0  
35.0  
35.0  
28.0  
45.0  
28.0  
45.0  
45.0  
45.0  
35.0  
35.0  
8
2500  
3000  
3000  
250  
OPA377AIDBVR  
OPA377AIDBVR  
OPA377AIDBVT  
OPA377AIDBVT  
OPA377AIDCKR  
OPA377AIDCKT  
OPA377AIDR  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SC70  
DBV  
DBV  
DBV  
DBV  
DCK  
DCK  
D
5
5
5
5
250  
5
3000  
250  
SC70  
5
SOIC  
8
2500  
2000  
OPA4377AIPWR  
TSSOP  
PW  
14  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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