OPA2541AM [TI]

Dual High Power OPERATIONAL AMPLIFIER;


型号：	OPA2541AM
厂家：	TEXAS INSTRUMENTS
描述：	Dual High Power OPERATIONAL AMPLIFIER 局域网放大器
文件：	总12页 (文件大小：199K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

OPA2541

Dual High Power

OPERATIONAL AMPLIFIER

FEATURES

DESCRIPTION

● OUTPUT CURRENTS TO 5A

● POWER SUPPLIES TO ±40V

● FET INPUT

The OPA2541 is a dual power operational amplifier

capable of operation from power supplies up to ±40V

and output currents of 5A continuous. With two mono-

lithic power amplifiers in a single package it provides

unequaled functional density.

● ELECTRICALLY ISOLATED CASE

The industry-standard 8-pin TO-3 package is isolated

from all internal circuitry allowing it to be mounted

directly to a heat sink without insulators which de-

grade thermal performance. Internal circuitry limits

output current to approximately 6A.

APPLICATIONS

● MOTOR DRIVER

● SERVO AMPLIFIER

The OPA2541 is available in both industrial and

military temperature range versions.

● SYNCRO/RESOLVER EXCITATION

● VOICE COIL DRIVER

● BRIDGE AMPLIFIER

● PROGRAMMABLE POWER SUPPLY

● AUDIO AMPLIFIER

+V_S(2)

–In

(4, 8)

+In

(3, 7)

Out

(5, 1)

–V_S(6)

International Airport Industrial Park

•

Mailing Address: PO Box 11400

Cable: BBRCORP

•

Tucson, AZ 85734

•

Street Address: 6730 S. Tucson Blvd.

• Tucson, AZ 85706

Tel: (520) 746-1111 Twx: 910-952-1111

•

Telex: 066-6491

•

FAX: (520) 889-1510

•

Immediate Product Info: (800) 548-6132

PDS-768B

Printed in U.S.A. October, 1993

SBOS157

SPECIFICATIONS

ELECTRICAL

At T_C= +25°C and V_S= ±35VDC, unless otherwise noted.

OPA2541AM

TYP

OPA2541BM, SM

TYP

PARAMETER

CONDITIONS

MIN

MAX

MIN

MAX

UNITS

INPUT OFFSET VOLTAGE

V_OS

±2

±10

±40

±10

±60

±0.25

±15

±1

±30

vs Temperature

vs Supply Voltage

vs Power

Specified Temperature Range

_S= ±10V to ±V_MAX

±20

±2.5

±20

µV/°C

µV/V

µV/W

INPUT BIAS CURRENT

I_B

Note 1

Specified Temperature Range

INPUT OFFSET CURRENT

I_OS

±5

Note 1

±30

Specified Temperature Range

INPUT CHARACTERISTICS

Common-Mode Voltage Range

Common-Mode Rejection

Input Capacitance

±(|V_S| –6)

±(|V_S| –3)

106

_CM= (|±V_S| –6V)

Input Impedance, DC

10¹²Ω

GAIN CHARACTERISTICS

Open Loop Gain at 10Hz

Gain-Bandwidth Product

R_L= 6Ω

1.6

MHz

OUTPUT

Voltage Swing

I_O= 5A

I_O= 2A

_O= 0.5A

+25°C

+85°C

±(|V_S| –5.5) ±(|V_S| –4.5)

±(|V_S| –4.5) ±(|V_S| –3.6)

±(|V_S| –4) ±(|V_S| –3.2)

Current, Continuous

7.0

5.0

+125°C (SM grade only)

3.5

AC PERFORMANCE

Slew Rate

Power Bandwidth

Settling Time to 0.1%

V/µs

kHz

µs

R_L= 8Ω, V_O= 20Vrms

2V Step

Capacitive Load

Specified Temperature Range, G = 1

Specified Temperature Range, G >10

Specified Temperature Range, R_L= 8Ω

1kHz, R_L= 6Ω

3.3

SOA

Phase Margin

Channel Separation

Degrees

POWER SUPPLY

Power Supply Voltage, ±V_S

Current, Quiescent

Specified Temperature Range

Total—Both Amplifiers

±10

±30

±35

±40

THERMAL RESISTANCE

θ_JC, (Junction-to-Case)

θ_JC

Both Amplifiers⁽²⁾, AC Output f > 60Hz

Both Amplifiers⁽²⁾, DC Output

One Amplifier, AC Output f > 60Hz

One Amplifier, DC Output

0.8

0.9

1.25

1.4

1.0

1.2

1.5

1.9

°C/W

θ_JA, (Junction-to-Ambient)

No Heat Sink

TEMPERATURE RANGE

Case

AM, BM

–25

+85

°C

–55

+125

*Specification same as OPA2541AM.

NOTES: (1) Input bias and offset current approximately doubles for every 10°C increase in temperature. (2) Assumes equal dissipation in both amplifiers.

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

OPA2541

ABSOLUTE MAXIMUM RATINGS

CONNECTION DIAGRAM

Supply Voltage, +V_Sto –V_S.................................................................. 80V

Output Current ............................................................................. see SOA

Power Dissipation, Internal⁽¹⁾............................................................ 125W

Input Voltage: Differential ..................................................................... ±V_S

Common-mode ............................................................. ±V_S

Temperature: Pin Solder, 10s ........................................................ +300°C

Junction⁽¹⁾............................................................... +150°C

Temperature Range:

Top View

TO-3

+V_S

+In_A

Out_B

–In_B

–In_A

Out_A

Storage .................................................... –65°C to +150°C

Operating (Case) ..................................... –55°C to +125°C

–V_S

NOTE: (1) Long term operation at the maximum junction temperature will

result in reduced product life. Derate internal power dissipation to achieve

high MTTF.

+In_B

PACKAGE INFORMATION

PACKAGE DRAWING

MODEL

PACKAGE

NUMBER⁽¹⁾

OPA2541AM

OPA2541BM

OPA2541SM

TO-3

030

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix D of Burr-Brown IC Data Book.

ORDERING INFORMATION

MODEL

PACKAGE

TEMPERATURE RANGE

OPA2541AM

OPA2541BM

OPA2541SM

TO-3

–25°C to +85°C

–55°C to +125°C

TYPICAL PERFORMANCE CURVES

T_A= +25°C and V_S= ±35VDC, unless otherwise noted.

INPUT BIAS CURRENT vs TEMPERATURE

100

OPEN-LOOP GAIN AND PHASE vs FREQUENCY

110

100

–45

–90

–135

–180

Phase

Z_L= 2kΩ

Z_L= 3.3nF

Gain

0.1

Z_L= 2kΩ

0.01

–10

Z_L= 3.3nF

0.001

–25

100

125

100

10k

100k

10M

Junction Temperature (°C)

Frequency (Hz)

OPA2541

TYPICAL PERFORMANCE CURVES (CONT)

T_A= +25°C and V_S= ±35VDC, unless otherwise noted.

NORMALIZED QUIESCENT CURRENT

vs TOTAL POWER SUPPLY VOLTAGE

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

1.3

1.2

1.1

1.0

0.9

0.8

(+V_S) – V_O

T_C= –25°C

|–V_S| – |V_O|

T_C= +25°C

T_C= +125°C

0.7

0.6

I_OUT(A)

+V_S+ |–V_S| (V)

TOTAL HARMONIC DISTORTION vs FREQUENCY

VOLTAGE NOISE DENSITY vs FREQUENCY

1.0

0.1

P_O= 100mW

100

P_O= 5W

P_O= 50W

0.01

0.001

100

10k

100k

100

10k

100k

Frequency (Hz)

COMMON-MODE REJECTION vs FREQUENCY

OUTPUT CURRENT vs TEMPERATURE

120

110

100

I_OUT

–

I_OUT

100

10k

100k

–50

–25

100

125

Frequency (Hz)

Case Temperature (°C)

OPA2541

TYPICAL PERFORMANCE CURVES (CONT)

T_A= +25°C and V_S= ±35VDC, unless otherwise noted.

DYNAMIC RESPONSE

Z_LOAD= ∞, V_S= ±35V, A_V= +1

Z_LOAD= 4700pF, V_S= ±35V, A_V= +1

INSTALLATION

INSTRUCTIONS

POWER SUPPLIES

The OPA2541 is specified for operation from power sup-

plies up to ±40V. It can also be operated from an unbalanced

or a single power supply so long as the total power supply

voltage does not exceed 80V (70V for “AM” grade). The

power supplies should be bypassed with low series imped-

ance capacitors such as ceramic or tantalum. These should

be located as near as practical to the amplifier’s power

supply pins. Good power amplifier circuit layout is, in

general, like good high-frequency layout. Consider the path

of large power supply and output currents. Avoid routing

these connections near low-level input circuitry to avoid

waveform distortion and instability.

pation (total of both amplifiers) times the appropriate ther-

mal resistance—

∆ T_JC= (P_Dtotal) (θ_JC).

Sufficient heat sinking must be provided to keep the case

temperature within safe limits for the maximum ambient

temperature and power dissipation. The thermal resistance

of the heat sink required may be calculated by:

θ_HS= (150°C – ∆ T_JC– T_A)/P_D.

Commercially available heat sinks usually specify thermal

resistance. These ratings are often suspect, however, since

they depend greatly on the mounting environment and air

flow conditions. Actual thermal performance should be

verified by measurement of case temperature under the

required load and environmental conditions.

Signal dependent load current can modulate the power

supply voltage with inadequate power supply bypassing.

This can affect both amplifiers’ outputs. Since the second

amplifier’s signal may not be related to the first, this will

degrade the inherent channel separation of the OPA2541.

No insulating hardware is required when using the OPA2541.

Since mica and other similar insulators typically add

0.7°C/W thermal resistance, this is a significant advantage.

See Burr-Brown Application Note AN-83 for further details

on heat sinking.

HEAT SINKING

Most applications will require a heat sink to prevent junction

temperatures from exceeding the 150°C maximum rating.

The type of heat sink required will depend on the output

signals, power dissipation of each amplifier, and ambient

temperature. The thermal resistance from junction-to-case,

θ_JC, depends on how the power dissipation is distributed on

the amplifier die.

SAFE OPERATING AREA

The Safe Operating Area (SOA) curve provides comprehen-

sive information on the power handling abilities of the

OPA2541. It shows the allowable output current as a func-

tion of the voltage across the conducting output transistor

(see Figure 1). This voltage is equal to the power supply

voltage minus the output voltage. For example, as the

amplifier output swings near the positive power supply

voltage, the voltage across the output transistor decreases

and the device can safely provide large output currents

demanded by the load.

DC output concentrates the power dissipation in one output

transistor. AC output distributes the power dissipation equally

between the two output transistors and therefore has lower

thermal resistance. Similarly, the power dissipation may be

all in one amplifier (worst case) or equally distributed

between the two amplifiers (best case). Thermal resistances

are provided for each of these possibilities. The case-to-

junction temperature rise is the product of the power dissi-

OPA2541

The internal current limit will not provide short-circuit

protection in most applications. When the amplifier output is

shorted to ground, the full power supply voltage is im-

pressed across the conducting output transistor. For in-

stance, with V_S= ±35V, a short circuit to ground would

impress 35V across the conducting power transistor. The

maximum safe output current at this voltage is 1.8A, so the

internal current limit would not protect the amplifier. The

unit-to-unit variation and temperature dependence of the

internal current limit suggest that it be used to handle

abnormal conditions and not activated in commonly encoun-

tered circuit operation.

APPLICATIONS CIRCUITS

+V_S

10µF

0.1µF

D₁

Inductive-

or EMF-

Generating

Load

D₂

SAFE OPERATING AREA

0.1µF

T_C= +25°C

T_C= +85°C

10µF

T_C= +125°C

–V_S

1.0

D₁– D₂: IN4003

FIGURE 2. Clamping Output for EMF-Generating Loads.

*Depending on temperature, maximum output may

be restricted by internal current limit. See output

current specifications and typical curves.

+35V

0.1µF

0.1

100

|V_S– V_OUT| (V)

R₂

10kΩ

FIGURE 1. Safe Operating Area.

30pF

Reactive, or EMF generating loads such as DC motors can

present demanding SOA requirements. With a purely reac-

tive load, output voltage current occurs when the output

voltage is zero and the voltage across the conducting transis-

tor is equal to the full power supply voltage. See Burr-

Brown Application Note AN-123 for further information on

evaluating SOA.

V_O

0.5Ω

V_IN

R₁

2.5kΩ

0.1µF

A_V= 1 + R₂/R₁= 5

–35V

Applications with inductive or EMF-generating loads which

can produce “kick back” voltage surges to the amplifiers

should include clamp diodes from the output terminals to the

power supplies. These diodes should be chosen to limit the

peak amplifier output voltage surges to less than 2V beyond

the power supply rail voltage. Common 1A rated rectifier

diodes will suffice in most applications.

FIGURE 3. Isolating Capacitive Loads.

R₂

100kΩ

20pF

R₁

A_V= –R₂/R₁= –10

10kΩ

V_IN

0.1Ω

10kΩ

Master

20pF

0.1Ω

Slave

FIGURE 4. Paralleled Operation, Extended SOA.

OPA2541

+60V

0.1µF

25kΩ

0-2mA

DAC80-CBI-I

V_O

0-50V

0.1µF

Protects DAC

During Slewing

–8V

FIGURE 5. Programmable Voltage Source.

+15V

+35V

1µF

Digital Word Input

100pF

MSB

0.5Ω

1/2

OPA2541

V_OUT= –30V to +30V

1µF

DAC702

–35V

+15V

±1mA

10kΩ

1µF

10kΩ⁽¹⁾

LSB

OPA27

1µF

5kΩ⁽¹⁾

1µF

–15V

NOTE: (1) TCR Tracking Resistors.

–15V

FIGURE 6. 16-Bit Programmable Voltage Source.

OPA2541

V_IN

10kΩ

0.1Ω

10kΩ

+35V

PMI MOD907

1/2

OPA2541

EMF

OPA2541

0.6Ω

–35V

5kΩ

INA105KP

25kΩ

5kΩ

Regulation

Adjust

25kΩ

+15V

–15V

FIGURE 7. Bridge Amplifier Motor-Speed Controller.

+V_S

750mA Continuous

(1)

V_IN

–V_S

NOTE: (1) Midwest Components Inc. 288D01006

FIGURE 8. Limiting Output Current.

OPA2541

PACKAGE OPTION ADDENDUM

www.ti.com

17-May-2012

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

OPA2541AM

NRND

TO-3

LMF

Pb-Free (RoHS

Exempt)

N / A for Pkg Type

OPA2541AM-BI

OPA2541BM

NRND

ZZ (BB)

TO-3

ZZ030

LMF

TBD

Call TI

Pb-Free (RoHS

Exempt)

N / A for Pkg Type

OPA2541SM

NRND

TO-3

LMF

Pb-Free (RoHS

Exempt)

N / A for Pkg Type

OPA2541SMQ

Pb-Free (RoHS

Exempt)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE DRAWING

MMBC004

MECHANICAL DATA

MMBC005 – APRIL 2001

LMF (O–MBCY–W8)

METAL CYLINDRICAL PACKAGE

1.550 (39,37)

1.510 (38,35)

0.770 (19,56)

0.105 (2,67)

0.080 (2,03)

0.745 (18,92)

0.300 (7,62)

0.260 (6,60)

Seating Plane

0.500 (12,70)

0.400 (10,16)

0.042 (1,07)

0.038 (0,97)

1.192 (30,28)

1.182 (30,02)

0.596 (15,14)

0.591 (15,01)

0.161 (4,09)

0.151 (3,84)

40°

1.020 (25,91)

0.980 (24,89)

0.500 (12,70)

4202491/A 03/01

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Leads in true position within 0.010 (0,25) R @ MMC at seating plane.

D. Pin numbers shown for reference only. Numbers may not be marked on package.

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