OPA2835TDA1 [TI]

OPA2835-DIE 超低功耗、轨到轨输出、负电源轨输入、VFB 运算放大器 | TD | 0 | 25 to 25;


型号：	OPA2835TDA1
厂家：	TEXAS INSTRUMENTS
描述：	OPA2835-DIE 超低功耗、轨到轨输出、负电源轨输入、VFB 运算放大器 \| TD \| 0 \| 25 to 25 放大器信息通信管理运算放大器
文件：	总6页 (文件大小：357K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

OPA2835-DIE

www.ti.com.cn

ZHCSAO0 –JANUARY 2013

极低功耗，轨至轨输出，负轨输入，电压反馈型 (VFB) 运算放大器

查询样品: OPA2835-DIE

特性

•

超低功耗

应用范围

–

静态电流：250µA（典型值）

断电模式：0.5μA (典型值)

•

低功耗信号调节

音频模数转换器 (ADC) 输入缓冲器

•

带宽：56MHz

低功耗逐次逼近 (SAR) 和三角积分 (ΔΣ) 模数转换

器 (ADC) 驱动器

转换速率： 160V/μs

上升时间：10ns (2V_步长

稳定时间：45ns (2V_步长

•

便携式系统

低功耗系统

高密度系统

超声流量计

)

过驱动恢复时间：195ns

共模抑制比 (CMRR)：113dB

输出驱动电流：40mA

RRO - 轨至轨输出

说明

由于使用了业界领先水平 BiCom-3x（SiGe 互补双极）工艺制造，OPA2835 是一款单通道和双通道超低功耗、轨

到轨输出、负电源轨输入、电压反馈运算放大器。这些放大器每个通道的电流消耗仅为 250μA，并具有 56MHz 的

单位增益带宽，从而为轨至轨放大器设定了一个业界领先水平的功耗－性能比。

对于功耗十分关键的电池供电型便携式应用而言，OPA2835 的低功耗及高频性能为设计人员提供了采用其他器件

所无法获得的性能与功耗比。与可将电流减小至小于 1.5μA 的节能模式组合在一起，这些器件为电池供电型应用

中的高频放大器提供了一款极具吸引力的解决方案。

ORDERING INFORMATION⁽¹⁾

PACKAGE

DESIGNATOR

PRODUCT

PACKAGE

ORDERABLE PART NUMBER

PACKAGE QUANTITY

OPA2835TDA1

OPA2835TDA2

400

Bare Die In Waffle

Pack⁽²⁾

OPA2835

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality

Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room

temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not

warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

English Data Sheet: SLOS826

OPA2835-DIE

ZHCSAO0 –JANUARY 2013

www.ti.com.cn

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

BARE DIE INFORMATION

BACKSIDE

POTENTIAL

BOND PAD

METALLIZATION COMPOSITION

BOND PAD

THICKNESS

DIE THICKNESS

BACKSIDE FINISH

6 mils.

Silicon with backgrind

Floating

Al5TiN

675 nm

OPA2835-DIE

www.ti.com.cn

ZHCSAO0 –JANUARY 2013

Table 1. Bond Pad Coordinates in Microns

DESCRIPTION

PAD NUMBER

X MIN

Y MIN

817.8

680.1

427.6

247.85

76.1

X MAX

Y MAX

902.8

765.1

512.6

332.85

161.1

VOUT1

VIN1-

VIN1+

VS-

PD1

mountpad

N/C

270.35

507.5

744.65

1009

744.65

507.5

270.35

355.35

592.5

829.65

1094

829.65

592.5

355.35

mountpad

PD2

76.1

161.1

332.85

512.6

765.1

902.8

N/C

247.85

427.6

680.1

817.8

VIN2+

VIN2-

VOUT2

VS+

N/C

VS+

PACKAGE OPTION ADDENDUM

www.ti.com

16-Aug-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

OPA2835TDA1

OPA2835TDA2

ACTIVE

400

RoHS & Green

Call TI

N / A for Pkg Type

25 to 25

Samples

Call TI

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

16-Aug-2022

Addendum-Page 2

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