OPA320SAIDBVR [TI]

高精度、零交叉 20MHz、0.9pA Ib、RRIO、CMOS 运算放大器 | DBV | 6 | -40 to 125;
OPA320SAIDBVR
型号: OPA320SAIDBVR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

高精度、零交叉 20MHz、0.9pA Ib、RRIO、CMOS 运算放大器 | DBV | 6 | -40 to 125

放大器 运算放大器 放大器电路
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OPA320, OPA2320  
OPA320S, OPA2320S  
www.ti.com  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
Precision, 20MHz, 0.9pA, Low-Noise, RRIO,  
CMOS Operational Amplifier with Shutdown  
Check for Samples: OPA320, OPA2320, OPA320S, OPA2320S  
1
FEATURES  
DESCRIPTION  
The OPA320 (single) and OPA2320 (dual) are a new  
generation of precision, low-voltage CMOS  
operational amplifiers optimized for very low noise  
and wide bandwidth while operating on a low  
quiescent current of only 1.45mA.  
23  
Precision with Zero-Crossover Distortion:  
Low Offset Voltage: 150μV (max)  
High CMRR: 114dB  
Rail-to-Rail I/O  
Low Input Bias Current: 0.9pA (max)  
Low Noise: 7nV/Hz at 10kHz  
Wide Bandwidth: 20MHz  
The OPA320 series is ideal for low-power,  
single-supply applications. Low-noise (7nV/Hz) and  
high-speed operation also make them well-suited for  
driving sampling analog-to-digital converters (ADCs).  
Other applications include signal conditioning and  
sensor amplification.  
Slew Rate: 10V/μs  
Quiescent Current: 1.45mA/ch  
Single-Supply Voltage Range: 1.8V to 5.5V  
OPA320S, OPA2320S:  
The OPA320 features a linear input stage with  
zero-crossover distortion that delivers excellent  
common-mode rejection ratio (CMRR) of typically  
114dB over the full input range. The input  
common-mode range extends 100mV beyond the  
negative and positive supply rails. The output voltage  
typically swings within 10mV of the rails.  
IQ in Shutdown Mode: 0.1μA  
Unity-Gain Stable  
Small Packages:  
SOT23, MSOP, DFN  
In addition, the OPAx320 have a wide supply voltage  
range from 1.8V to 5.5V with excellent PSRR (106dB)  
over the entire supply range, making them suitable  
for precision, low-power applications that run directly  
from batteries without regulation.  
APPLICATIONS  
High-Z Sensor Signal Conditioning  
Transimpedance Amplifiers  
Test and Measurement Equipment  
Programmable Logic Controllers (PLCs)  
Motor Control Loops  
The OPA320 (single version) is available in a  
SOT23-5 package; the OPA320S shut-down single  
version is available in an SOT23-6 package. The dual  
OPA2320 is offered in SO-8, MSOP-8, and DFN-8  
packages, and the OPA2320S (dual with shut-down)  
in an MSOP-10 package.  
Communications  
Input/Output ADC/DAC Buffers  
Active Filters  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
FilterPro is a trademark of Texas Instruments Incorporated.  
All other trademarks are the property of their respective owners.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20102011, Texas Instruments Incorporated  
OPA320, OPA2320  
OPA320S, OPA2320S  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
PACKAGE/ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PACKAGE MARKING,  
QUANTITY  
PRODUCT  
OPA320  
OPA320S(2)  
PACKAGE-LEAD  
SOT23-5  
SOT23-6  
MSOP-8  
DBV  
DBV  
DGK  
DRG  
D
RAC  
RAE  
OCLQ  
OCMQ  
O2320A  
TBD  
OPA2320  
DFN-8  
SO-8  
OPA2320S(2)  
MSOP-10  
DGS  
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or visit  
the device product folder at www.ti.com.  
(2) Product preview device.  
ABSOLUTE MAXIMUM RATINGS(1)  
Over operating free-air temperature range, unless otherwise noted.  
OPA320, OPA320S, OPA2320, OPA2320S  
UNIT  
V
Supply voltage, VS = (V+) (V)  
6
(V) 0.5 to (V+) + 0.5  
±10  
Voltage(2)  
Current(2)  
V
Signal input pins  
mA  
mA  
°C  
°C  
°C  
V
Output short-circuit current(3)  
Operating temperature, TA  
Storage temperature, TSTG  
Junction temperature, TJ  
Continuous  
40 to +150  
65 to +150  
+150  
Human body model (HBM)  
4000  
ESD ratings  
Charged device model (CDM)  
Machine model (MM)  
1000  
V
200  
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not implied.  
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should  
be current limited to 10mA or less.  
(3) Short-circuit to ground, one amplifier per package.  
2
Copyright © 20102011, Texas Instruments Incorporated  
 
 
OPA320, OPA2320  
OPA320S, OPA2320S  
www.ti.com  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V or ±0.9V to ±2.75V  
Boldface limits apply over the specified temperature range, TA = 40°C to +125°C.  
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, VOUT = VS/2, and SHDN x = VS+, unless otherwise noted.  
OPA320, OPA320S, OPA2320, OPA2320S  
PARAMETER  
OFFSET VOLTAGE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Input offset voltage  
vs Temperature  
VOS  
dVOS/dT  
PSR  
40  
1.5  
5
150  
5
μV  
μV/°C  
μV/V  
μV/V  
dB  
VS = +5.5V  
VS = +1.8V to +5.5V  
VS = +1.8V to +5.5V  
At 1kHz  
vs Power supply  
20  
Over temperature  
15  
130  
Channel separation  
INPUT VOLTAGE  
Common-mode voltage range  
Common-mode rejection ratio  
Over temperature  
VCM  
(V) 0.1  
100  
(V+) + 0.1  
V
CMRR  
VS = 5.5V, (V) 0.1V < VCM < (V+) + 0.1V  
114  
dB  
dB  
96  
INPUT BIAS CURRENT  
Input bias current  
IB  
±0.2  
±0.9  
±50  
pA  
pA  
pA  
pA  
pA  
pA  
pA  
TA = 40°C to +85°C  
Over temperature  
OPA2320, OPA2320S, TA = 40°C to +125°C  
OPA320, OPA320S, TA = 40°C to +125°C  
±400  
±600  
±0.9  
±50  
Input offset current  
IOS  
±0.2  
TA = 40°C to +85°C  
TA = 40°C to +125°C  
Over temperature  
±400  
NOISE  
Input voltage noise  
f = 0.1Hz to 10Hz  
f = 1kHz  
2.8  
8.5  
7
μVPP  
nV/Hz  
nV/Hz  
fA/Hz  
Input voltage noise density  
en  
in  
f = 10kHz  
Input current noise density  
INPUT CAPACITANCE  
Differential  
f = 1kHz  
0.6  
5
4
pF  
pF  
Common-mode  
OPEN-LOOP GAIN  
0.1V < VO < (V+) 0.1V, RL = 10kΩ  
0.1V < VO < (V+) 0.1V, RL = 10kΩ  
0.2V < VO < (V+) 0.2V, RL = 2kΩ  
0.2V < VO < (V+) 0.2V, RL = 2kΩ  
VS = 5V, CL = 50pF  
114  
100  
108  
96  
132  
130  
123  
130  
47  
dB  
dB  
Open-loop voltage gain  
AOL  
PM  
dB  
dB  
Phase margin  
Degrees  
FREQUENCY RESPONSE  
Gain bandwidth product  
Slew rate  
VS = 5.0V, CL = 50pF  
GBP  
SR  
Unity gain  
20  
10  
MHz  
V/μs  
μs  
G = +1  
To 0.1%, 2V step, G = +1  
To 0.01%, 2V step, G = +1  
To 0.0015%, 2V step, G = +1(1)  
0.25  
0.32  
0.5  
Settling time  
tS  
μs  
μs  
Overload recovery time  
VIN × G > VS  
100  
ns  
VO = 4VPP, G = +1, f = 10kHz, RL = 10kΩ  
VO = 2VPP, G = +1, f = 10kHz, RL = 600Ω  
0.0005  
0.0011  
%
Total harmonic distortion +  
noise(2)  
THD+N  
%
(1) Based on simulation.  
(2) Third-order filter; bandwidth = 80kHz at 3dB.  
Copyright © 20102011, Texas Instruments Incorporated  
3
 
 
 
OPA320, OPA2320  
OPA320S, OPA2320S  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V or ±0.9V to ±2.75V (continued)  
Boldface limits apply over the specified temperature range, TA = 40°C to +125°C.  
At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, VOUT = VS/2, and SHDN x = VS+, unless otherwise noted.  
OPA320, OPA320S, OPA2320, OPA2320S  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
OUTPUT  
RL = 10kΩ  
RL = 2kΩ  
RL = 10kΩ  
RL = 2kΩ  
VS = 5.5V  
10  
25  
20  
35  
30  
45  
mV  
mV  
mV  
mV  
mA  
Voltage output swing from  
both rails  
VO  
Over temperature  
Short-circuit current  
Capacitive load drive  
Open-loop output resistance  
SHUTDOWN(3)  
ISC  
CL  
RO  
±65  
See Typical Characteristics  
90  
IO = 0mA, f = 1MHz  
Ω
All amplifiers disabled, SHDN = V–  
0.1  
1.6  
1.6  
0.5  
μA  
mA  
mA  
V
Quiescent current per amplifier  
IQSD OPA2320S only, SHDN A = VS, SHDN B = VS+  
OPA2320S only, SHDN A = VS+, SHDN B = VS–  
High-level input voltage  
Low-level input voltage  
VIH  
VIL  
Amplifier enabled  
0.7 × VS+  
5.5  
Amplifier disabled  
0.3 × VS+  
V
G = 1, VOUT = 0.1 × VS/2, full shutdown(5)  
OPA2320S only, partial shutdown(5)  
G = 1, VOUT = 0.1 × VS/2  
VIH = 5V  
20  
6
μs  
Amplifier enable time(4)  
tON  
Amplifier disable time(4)  
tOFF  
3
μs  
μA  
μA  
0.13  
0.04  
SHDN pin input bias current (per pin)  
VIL = 0V  
POWER SUPPLY  
Specified voltage range  
Quiescent current per amplifier  
OPA320, OPA320S  
Over temperature  
OPA2320, OPA2320S  
Over temperature  
Power-on time  
VS  
IQ  
1.8  
5.5  
V
IO = 0mA, VS = +5.5V  
IO = 0mA, VS = +5.5V  
1.5  
1.45  
28  
1.75  
1.85  
1.6  
mA  
mA  
mA  
mA  
μs  
IO = 0mA, VS = +5.5V  
IO = 0mA, VS = +5.5V  
1.7  
V+ = 0V to 5V, to 90% IQ level  
TEMPERATURE  
Specified range  
40  
40  
+125  
+150  
°C  
°C  
Operating range  
(3) Specified by design and characterization; not production tested.  
(4) Disable time (tOFF) and enable time (tON) are defined as the time between the 50% point of the signal applied to the SHDN pin and the  
point at which the output voltage reaches the 10% (disable) or 90% (enable) level.  
(5) Full shutdown refers to the dual OPA2320S having both A and B channels disabled (SHDN A = SHDN B = VS). For partial shutdown,  
only one SHDN pin is exercised; in this mode, the internal biasing and oscillator remain operational and the enable time is shorter.  
4
Copyright © 20102011, Texas Instruments Incorporated  
 
 
 
OPA320, OPA2320  
OPA320S, OPA2320S  
www.ti.com  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
THERMAL INFORMATION: OPA320, OPA320S  
OPA320  
DBV (SOT23)  
5 PINS  
219.3  
OPA320S  
DBV (SOT23)  
6 PINS  
177.5  
THERMAL METRIC(1)  
UNITS  
θJA  
Junction-to-ambient thermal resistance  
Junction-to-case(top) thermal resistance  
Junction-to-board thermal resistance  
θJC(top)  
θJB  
107.5  
108.9  
57.5  
27.4  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case(bottom) thermal resistance  
7.4  
13.3  
ψJB  
56.9  
26.9  
θJC(bottom)  
N/A  
N/A  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
THERMAL INFORMATION: OPA2320, OPA2320S  
OPA2320  
DGK (MSOP)  
8 PINS  
174.8  
OPA2320S  
DGS (MSOP)  
10 PINS  
171.5  
THERMAL METRIC(1)  
D (SO)  
8 PINS  
122.6  
67.1  
DRG (DFN)  
8 PINS  
50.6  
UNITS  
θJA  
Junction-to-ambient thermal resistance  
Junction-to-case(top) thermal resistance  
Junction-to-board thermal resistance  
θJC(top)  
θJB  
43.9  
54.9  
43.0  
64.0  
95.0  
25.2  
91.4  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case(bottom) thermal resistance  
13.2  
2.0  
0.6  
1.9  
ψJB  
63.4  
93.5  
25.3  
89.9  
θJC(bottom)  
N/A  
N/A  
5.7  
N/A  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S  
 
OPA320, OPA2320  
OPA320S, OPA2320S  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
www.ti.com  
PIN CONFIGURATIONS  
DBV PACKAGE  
SOT23-5  
(TOP VIEW)  
DRG PACKAGE  
DFN-8  
(TOP VIEW)  
V+  
OUT  
V-  
1
2
3
5
4
8
V+  
OUT A  
-IN A  
+IN A  
V-  
1
2
3
4
Exposed  
Thermal  
Die Pad  
on  
7
6
5
OUT B  
-IN B  
+IN B  
-IN  
+IN  
Underside(2)  
DBV PACKAGE  
SOT23-6  
(TOP VIEW)  
D, DGK PACKAGES  
SO-8, MSOP-8  
(TOP VIEW)  
VOUT  
V-  
1
6
5
4
V+  
2
3
SHDN  
OUT A  
1
8
7
6
5
V+  
+IN  
-IN  
-IN A  
+IN A  
V-  
2
3
4
OUT B  
-IN B  
DGS PACKAGE  
MSOP-10  
+IN B  
(TOP VIEW)  
V+  
VOUT A  
1
2
3
4
5
10  
9
VOUT B  
-IN B  
+IN B  
-IN A  
+IN A  
A
8
B
V-  
7
SHDN B  
SHDN A  
6
(1) No internal connection.  
(2) Connect thermal pad to V.  
6
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Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S  
 
 
OPA320, OPA2320  
OPA320S, OPA2320S  
www.ti.com  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
TYPICAL CHARACTERISTICS  
At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted.  
OFFSET VOLTAGE PRODUCTION DISTRIBUTION  
OFFSET VOLTAGE DRIFT DISTRIBUTION  
14  
12  
10  
8
25  
20  
15  
10  
5
6
4
2
0
0
0.1  
0.5  
0.9  
1.3  
1.7  
2.1  
2.5  
2.9  
Offset Drift (mV/°C)  
Offset Voltage (mV)  
Figure 1.  
Figure 2.  
OFFSET VOLTAGE vs COMMON-MODE VOLTAGE  
OPEN-LOOP GAIN/PHASE vs FREQUENCY  
100  
160  
140  
120  
100  
80  
0
VS = ±2.5V  
80  
-20  
CL = 50pF  
60  
-40  
40  
-60  
Phase  
20  
-80  
0
60  
-100  
-120  
-140  
-160  
-180  
-20  
-40  
-60  
-80  
-100  
40  
Gain  
20  
Representative Units  
VS = ±2.75V  
0
-20  
-3 -2.5 -2 -1.5 -1 -0.5  
0
0.5  
1
1.5  
2
2.5  
3
1
10  
100  
1k  
10k 100k  
1M  
10M 100M  
Common-Mode Voltage (V)  
Frequency (Hz)  
Figure 3.  
Figure 4.  
OPEN-LOOP GAIN vs TEMPERATURE  
QUIESCENT CURRENT vs SUPPLY VOLTAGE  
140  
135  
130  
125  
120  
115  
110  
105  
100  
1.5  
1.45  
1.4  
+125°C  
10kW Load  
+85°C  
2kW Load  
+25°C  
1.35  
1.3  
-40°C  
1.25  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Temperature (°C)  
Supply Voltage (V)  
Figure 5.  
Figure 6.  
Copyright © 20102011, Texas Instruments Incorporated  
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Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S  
 
 
OPA320, OPA2320  
OPA320S, OPA2320S  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted.  
INPUT BIAS CURRENT vs SUPPLY VOLTAGE  
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE  
1
0.8  
6
5
4
0.6  
3
0.4  
2
0.2  
1
0
0
-1  
-2  
-3  
-4  
-5  
-6  
-0.2  
-0.4  
-0.6  
-0.8  
-1  
IB+  
IB-  
IOS  
IB-  
IB+  
0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9  
-3 -2.5 -2 -1.5 -1 -0.5  
0
0.5  
1
1.5  
2
2.5  
3
Supply Voltage (±V)  
Common-Mode Voltage (V)  
Figure 7.  
Figure 8.  
INPUT BIAS CURRENT DISTRIBUTION  
INPUT BIAS CURRENT vs TEMPERATURE  
40  
35  
30  
25  
20  
15  
10  
5
1300  
1200  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
IOS  
IB+  
IB-  
IB  
IOS  
-100  
0
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Temperature (°C)  
Input Bias Current (pA)  
Figure 9.  
Figure 10.  
CMRR AND PSRR vs FREQUENCY  
CMRR AND PSRR vs TEMPERATURE  
140  
130  
125  
120  
115  
110  
105  
100  
95  
VS = 1.8V to 5.5V  
120  
100  
80  
60  
40  
20  
0
CMRR  
PSRR  
PSRR  
CMRR  
90  
100  
1k  
10k  
100k  
1M  
10M  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Frequency (Hz)  
Temperature (°C)  
Figure 11.  
Figure 12.  
8
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Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S  
OPA320, OPA2320  
OPA320S, OPA2320S  
www.ti.com  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted.  
INPUT VOLTAGE NOISE SPECTRAL DENSITY vs  
FREQUENCY  
0.1Hz TO 10Hz INPUT VOLTAGE NOISE  
1000  
100  
10  
6
5
VS = 1.8V to 5.5V  
4
3
2
1
0
-1  
-2  
-3  
-4  
1
10  
100  
1k  
10k  
100k  
1M  
0
1
2
3
4
5
6
7
8
9
10  
Frequency (Hz)  
Time (1s/div)  
Figure 13.  
Figure 14.  
CLOSED-LOOP GAIN vs FREQUENCY  
CLOSED-LOOP GAIN vs FREQUENCY  
60  
40  
20  
0
60  
40  
20  
0
VS = +1.8V  
VS = +5.5V  
RL = 10kW  
RL = 10kW  
G = +100V/V  
G = +100V/V  
CL = 50pF  
CL = 50pF  
G = +10V/V  
G = +1V/V  
G = +10V/V  
G = +1V/V  
-20  
-20  
10k  
100k  
1M  
10M  
100M  
10k  
100k  
1M  
10M  
100M  
Frequency (Hz)  
Frequency (Hz)  
Figure 15.  
Figure 16.  
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT  
(MSOP-8)  
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY  
6
5
4
3
2
1
0
3
5.5VS  
2
1
3.3VS  
-40°C  
+25°C  
+125°C  
0
-1  
-2  
-3  
1.8VS  
RL = 10kW  
CL = 50pF  
VS = ±2.75 V  
60  
70 80  
10k  
100k  
1M  
10M  
0
10  
20  
30  
40  
50  
Frequency (Hz)  
Output Current (mA)  
Figure 17.  
Figure 18.  
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TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted.  
OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY  
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE  
1000  
70  
G = 1, VS = 1.8V  
VS = ±±2.7V  
60  
50  
40  
30  
20  
10  
0
G = 1, VS = 5.5V  
G = 10, VS = 1.8V  
G = 10, VS = 5.5V  
100  
10  
1
10  
100  
1k  
10k 100k  
1M  
10M 100M  
0
500  
1000  
1500  
2000  
2500  
3000  
Frequency (Hz)  
Capacitive Load (pF)  
Figure 19.  
Figure 20.  
THD+N vs AMPLITUDE  
THD+N vs FREQUENCY  
0.1  
0.1  
Frequency = 10kHz  
VIN = 2VPP  
VS = ±2.5V  
G = +1V/V  
0.01  
0.001  
0.01  
0.001  
Load = 600W  
Load = 600W  
Frequency = 10kHz  
VS = ±2.5V  
Load = 10kW  
Load = 10kW  
G = +1V/V  
0.0001  
0.0001  
10  
100  
1k  
10k  
100k  
0.01  
0.1  
1
10  
Frequency (Hz)  
VIN (VPP  
)
Figure 21.  
THD+N vs FREQUENCY  
Figure 22.  
CHANNEL SEPARATION vs FREQUENCY (for Dual)  
0.1  
0.01  
0
Frequency = 10kHz  
VS = ±2.75V  
VIN = 4VPP  
VS = ±2.5V  
G = +1V/V  
-20  
-40  
-60  
Load = 600W  
-80  
0.001  
0.0001  
-100  
-120  
-140  
Load = 10kW  
10  
100  
1k  
10k  
100k  
1k  
10k  
100k  
1M  
10M  
100M  
Frequency (Hz)  
Frequency (Hz)  
Figure 23.  
Figure 24.  
10  
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SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
TYPICAL CHARACTERISTICS (continued)  
At TA = +25°C, VCM = VOUT = mid-supply, and RL = 10kΩ, unless otherwise noted.  
SLEW RATE vs SUPPLY VOLTAGE  
SMALL-SIGNAL STEP RESPONSE  
12  
11.5  
11  
0.1  
0.075  
0.05  
Gain = +1  
VS = ±2.75V  
CL = 50pF  
VIN = 100mVPP  
0.025  
0
Rise  
10.5  
10  
Fall  
-0.025  
-0.05  
-0.075  
-0.1  
9.5  
9
VOUT  
VIN  
1.6  
2
2.4 2.8 3.2 3.6  
4
4.4 4.8 5.2 5.6  
-0.8  
-0.4  
0
0.4  
0.8  
1.2  
1.6  
Supply Voltage (V)  
Time (ms)  
Figure 25.  
Figure 26.  
SMALL-SIGNAL STEP RESPONSE  
LARGE-SIGNAL STEP RESPONSE vs TIME  
0.1  
1.5  
1
Gain = +1  
VS = ±2.75V  
0.075  
0.05  
VIN = 2VPP  
VIN  
0.5  
0
Gain = -1  
0.025  
0
VOUT  
VS = ±2.75V  
VIN = 100mVPP  
-0.025  
-0.05  
-0.075  
-0.1  
-0.5  
-1  
VOUT  
VIN  
-1.5  
-1.6  
-1.2  
-0.8  
-0.4  
0
0.4  
0.8  
-0.4  
0
0.4  
0.8  
1.2  
1.6  
Time (ms)  
Time (ms)  
Figure 27.  
Figure 28.  
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APPLICATION INFORMATION  
RAIL-TO-RAIL INPUT  
OPERATING VOLTAGE  
The OPA320 product family features true rail-to-rail  
input operation, with supply voltages as low as ±0.9V  
(1.8V). The design of the OPA320 amplifiers include  
an internal charge-pump that powers the amplifier  
input stage with an internal supply rail at  
approximately 1.6V above the external supply (VS+).  
This internal supply rail allows the single differential  
input pair to operate and remain very linear over a  
very wide input common-mode range. A unique  
zero-crossover input topology eliminates the input  
offset transition region typical of many rail-to-rail,  
complementary input stage operational amplifiers.  
This topology allows the OPA320 to provide superior  
The OPA320 series op amps are unity-gain stable  
and can operate on a single-supply voltage (1.8V to  
5.5V), or a split supply voltage (±0.9V to ±2.75V),  
making them highly versatile and easy to use. The  
power-supply pins should have local bypass ceramic  
capacitors (typically 0.001μF to 0.1μF). The OPA320  
amplifiers are fully specified from +1.8V to +5.5V and  
over the extended temperature range of 40°C to  
+125°C. Parameters that can exhibit variance with  
regard to operating voltage or temperature are  
presented in the Typical Characteristics.  
common-mode performance (CMRR  
>
110dB,  
INPUT AND ESD PROTECTION  
typical) over the entire common-mode input range,  
which extends 100mV beyond both power-supply  
rails. When driving analog-to-digital converters  
(ADCs), the highly linear VCM range of the OPA320  
assures maximum linearity and lowest distortion.  
The OPA320 incorporates internal electrostatic  
discharge (ESD) protection circuits on all pins. In the  
case of input and output pins, this protection primarily  
consists of current-steering diodes connected  
between the input and power-supply pins. These ESD  
protection diodes also provide in-circuit input  
overdrive protection, provided that the current is  
limited to 10mA as stated in the Absolute Maximum  
Ratings. Many input signals are inherently  
current-limited to less than 10mA; therefore, a limiting  
resistor is not required. Figure 29 shows how a series  
input resistor (RS) may be added to the driven input  
to limit the input current. The added resistor  
contributes thermal noise at the amplifier input and  
the value should be kept to the minimum in  
noise-sensitive applications.  
PHASE REVERSAL  
The OPA320 op amps are designed to be immune to  
phase reversal when the input pins exceed the supply  
voltages, therefore providing further in-system  
stability and predictability. Figure 30 shows the input  
voltage exceeding the supply voltage without any  
phase reversal.  
4
VIN  
VS = ±2.5V  
3
2
VOUT  
V+  
1
IOVERLOAD  
0
-1  
-2  
-3  
-4  
10mA, Max  
VOUT  
OPA320  
VIN  
RS  
Figure 29. Input Current Protection  
-500  
-250  
0
250  
500  
750  
1000  
Time (ms)  
Figure 30. No Phase Reversal  
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FEEDBACK CAPACITOR IMPROVES  
RESPONSE  
result of signal rectification associated with the  
internal semiconductor junctions. While all operational  
amplifier pin functions can be affected by EMI, the  
input pins are likely to be the most susceptible. The  
OPA320 operational amplifier family incorporates an  
internal input low-pass filter that reduces the  
amplifiers response to EMI. Both common-mode and  
differential mode filtering are provided by the input  
filter. The filter is designed for a cut-off frequency of  
approximately 580MHz (3dB), with a roll-off of 20dB  
per decade.  
For optimum settling time and stability with  
high-impedance feedback networks, it may be  
necessary to add a feedback capacitor across the  
feedback resistor, RF, as shown in Figure 31. This  
capacitor compensates for the zero created by the  
feedback network impedance and the OPA320 input  
capacitance (and any parasitic layout capacitance).  
The effect becomes more significant with higher  
impedance networks.  
CF  
OUTPUT IMPEDANCE  
The open-loop output impedance of the OPA320  
common-source output stage is approximately 90Ω.  
When the op amp is connected with feedback, this  
value is reduced significantly by the loop gain. For  
example, with 130dB (typ) of open-loop gain, the  
output impedance is reduced in unity-gain to less  
than 0.03Ω. For each decade rise in the closed-loop  
gain, the loop gain is reduced by the same amount,  
which results in a ten-fold increase in effective output  
impedance. While the OPA320 output impedance  
remains very flat over a wide frequency range, at  
higher frequencies the output impedance rises as the  
open-loop gain of the op amp drops. However, at  
these frequencies the output also becomes capacitive  
as a result of parasitic capacitance. This in turn  
prevents the output impedance from becoming too  
high, which can cause stability problems when driving  
large capacitive loads. As mentioned previously, the  
OPA320 has excellent capacitive load drive capability  
for an op amp with its bandwidth.  
RIN  
RF  
V+  
VIN  
CIN  
R
IN ´ CIN = RF ´ CF  
VOUT  
OPA320  
CL  
CIN  
NOTE: Where CIN is equal to the OPA320 input capacitance  
(approximately 9pF) plus any parasitic layout capacitance.  
Figure 31. Feedback Capacitor Improves  
Dynamic Performance  
It is suggested that a variable capacitor be used for  
the feedback capacitor because input capacitance  
may vary between op amps and layout capacitance is  
difficult to determine. For the circuit shown in  
Figure 31, the value of the variable feedback  
capacitor should be chosen so that the input  
resistance times the input capacitance of the OPA320  
(typically 9pF) plus the estimated parasitic layout  
capacitance equals the feedback capacitor times the  
feedback resistor:  
CAPACITIVE LOAD AND STABILITY  
The OPA320 is designed to be used in applications  
where driving a capacitive load is required. As with all  
op amps, there may be specific instances where the  
OPA320 can become unstable. The particular op amp  
circuit configuration, layout, gain, and output loading  
are some of the factors to consider when establishing  
whether an amplifier is stable in operation. An op  
amp in the unity-gain (+1V/V) buffer configuration and  
driving a capacitive load exhibits a greater tendency  
to become unstable than an amplifier operated at a  
higher noise gain. The capacitive load, in conjunction  
with the op amp output resistance, creates a pole  
within the feedback loop that degrades the phase  
margin. The degradation of the phase margin  
increases as the capacitive loading increases. When  
operating in the unity-gain configuration, the OPA320  
remains stable with a pure capacitive load up to  
approximately 1nF.  
R
IN × CIN = RF × CF  
Where:  
CIN is equal to the OPA320 input capacitance  
(sum of differential and common-mode) plus the  
layout capacitance.  
The capacitor value can be adjusted until  
optimum performance is obtained.  
EMI SUSCEPTIBILITY AND INPUT FILTERING  
Operational amplifiers vary in susceptibility to  
electromagnetic interference (EMI). If conducted EMI  
enters the operational amplifier, the dc offset  
observed at the amplifier output may shift from the  
nominal value while EMI is present. This shift is a  
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The equivalent series resistance (ESR) of some very  
large capacitors (CL > 1µF) is sufficient to alter the  
phase characteristics in the feedback loop such that  
the amplifier remains stable. Increasing the amplifier  
closed-loop gain allows the amplifier to drive  
increasingly larger capacitance. This increased  
capability is evident when observing the overshoot  
response of the amplifier at higher voltage gains, as  
shown in Figure 33. One technique for increasing the  
capacitive load drive capability of the amplifier  
operating in unity gain is to insert a small resistor  
(RS), typically 10Ω to 20Ω, in series with the output,  
as shown in Figure 32.  
OVERLOAD RECOVERY TIME  
Overload recovery time is the time it takes the output  
of the amplifier to come out of saturation and recover  
to the linear region. Overload recovery is particularly  
important in applications where small signals must be  
amplified in the presence of large transients.  
Figure 34 and Figure 35 show the positive and  
negative overload recovery times of the OPA320,  
respectively. In both cases, the time elapsed before  
the OPA320 comes out of saturation is less than  
100ns. In addition, the symmetry between the positive  
and negative recovery times allows excellent signal  
rectification without distortion of the output signal.  
This resistor significantly reduces the overshoot and  
ringing associated with large capacitive loads. A  
possible problem with this technique is that a voltage  
divider is created with the added series resistor and  
any resistor connected in parallel with the capacitive  
load. The voltage divider introduces a gain error at  
the output that reduces the output swing. The error  
contributed by the voltage divider may be  
insignificant. For instance, with a load resistance, RL  
= 10kΩ and RS = 20Ω, the gain error is only about  
0.2%. However, when RL is decreased to 600Ω,  
which the OPA320 is able to drive, the error  
increases to 7.5%.  
3
VS = ±2.75V  
2.5  
G = -10  
Output  
2
1.5  
1
0.5  
0
Input  
-0.5  
-1  
9.75  
10  
10.25  
10.5  
10.75  
11  
Time (250ns/div)  
V+  
Figure 34. Positive Recovery Time  
RS  
VOUT  
OPA320  
VIN  
10W to  
20W  
1
0.5  
0
RL  
CL  
Input  
-0.5  
-1  
Figure 32. Improving Capacitive Load Drive  
-1.5  
-2  
70  
G = 1, VS = 1.8V  
60  
50  
40  
30  
20  
10  
0
G = 1, VS = 5.5V  
G = 10, VS = 1.8V  
G = 10, VS = 5.5V  
Output  
VS = ±2.75V  
G = -10  
-2.5  
-3  
9.75  
10  
10.25  
10.5  
10.75  
11  
Time (250ns/div)  
Figure 35. Negative Recovery Time  
0
500  
1000  
1500  
2000  
2500  
3000  
Capacitive Load (pF)  
Figure 33. Small-Signal Overshoot versus  
Capacitive Load (100mVPPoutput step)  
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GENERAL LAYOUT GUIDELINES  
The key elements to a transimpedance design, as  
shown in Figure 36, are the expected diode  
capacitance (CD), which should include the parasitic  
input common-mode and differential-mode input  
capacitance (4pF + 5pF for the OPA320); the desired  
transimpedance gain (RF); and the gain-bandwidth  
(GBW) for the OPA320 (20MHz). With these three  
variables set, the feedback capacitor value (CF) can  
be set to control the frequency response. CF includes  
the stray capacitance of RF, which is 0.2pF for a  
typical surface-mount resistor.  
The OPA320 is a wideband amplifier. To realize the  
full operational performance of the device, good  
high-frequency printed circuit board (PCB) layout  
practices are required. The bypass capacitors must  
be connected between each supply pin and ground  
as close to the device as possible. The bypass  
capacitor traces should be designed for minimum  
inductance.  
LEADLESS DFN PACKAGE  
(1)  
CF  
The OPA320 series uses the DFN style package  
(also known as SON), which is a QFN with contacts  
on only two sides of the package bottom. This  
leadless package maximizes PCB space and offers  
enhanced thermal and electrical characteristics  
through an exposed pad. One of the primary  
advantages of the DFN package is its low height  
(0.8mm).  
< 1pF  
RF  
10MW  
V+  
l
DFN packages are physically small, have a smaller  
routing area, improved thermal performance, reduced  
electrical parasitics, and a pinout scheme that is  
consistent with other commonly-used packages (such  
as SO and MSOP). Additionally, the absence of  
external leads eliminates bent-lead issues.  
VOUT  
CD  
OPA320  
V-  
(1) CF is optional to prevent gain peaking. It includes the stray  
capacitance of RF.  
The DFN package can easily be mounted using  
standard PCB assembly techniques. See Application  
Report, QFN/SON PCB Attachment (SLUA271) and  
Application Report, Quad Flatpack No-Lead Logic  
Packages (SCBA017), both available for download at  
www.ti.com. The exposed leadframe die pad on the  
bottom of the DFN package should be connected  
to the most negative potential (V).  
Figure 36. Dual-Supply Transimpedance  
Amplifier  
To  
achieve  
a
maximally-flat,  
second-order  
Butterworth frequency response, the feedback pole  
should be set to:  
1
GBW  
=
2pRFCF  
4pRFCD  
(1)  
APPLICATION EXAMPLES  
Bandwidth is calculated by:  
TRANSIMPEDANCE AMPLIFIER  
GBW  
f
=
(Hz)  
-3dB  
Wide gain bandwidth, low input bias current, low input  
voltage, and current noise make the OPA320 an ideal  
wideband photodiode transimpedance amplifier.  
Low-voltage noise is important because photodiode  
capacitance causes the effective noise gain of the  
circuit to increase at high frequency.  
2pRFCD  
(2)  
For even higher transimpedance bandwidth, consider  
the high-speed CMOS OPA380 (90MHz GBW),  
OPA354 (100MHz GBW), OPA300 (180MHz GBW),  
OPA355 (200MHz GBW), or OPA656/57 (400MHz  
GBW).  
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For single-supply applications, the +IN input can be  
biased with a positive dc voltage to allow the output  
to reach true zero when the photodiode is not  
exposed to any light, and respond without the added  
delay that results from coming out of the negative rail;  
this configuration is shown in Figure 37. This bias  
voltage also appears across the photodiode,  
providing a reverse bias for faster operation.  
photodiode  
can  
significantly  
reduce  
its  
capacitance. Smaller photodiodes have lower  
capacitance. Use optics to concentrate light on a  
small photodiode.  
3. Noise increases with increased bandwidth. Limit  
the circuit bandwidth to only that required. Use a  
capacitor across the RF to limit bandwidth, even if  
not required for stability.  
(1)  
CF  
4. Circuit board leakage can degrade the  
performance of an otherwise well-designed  
amplifier. Clean the circuit board carefully. A  
circuit board guard trace that encircles the  
summing junction and is driven at the same  
voltage can help control leakage.  
< 1pF  
RF  
10MW  
For additional information, refer to the Application  
Bulletins Noise Analysis of FET Transimpedance  
Amplifiers (SBOA060), and Noise Analysis for  
High-Speed Op Amps (SBOA066), available for  
download at the TI web site.  
V+  
l
HIGH-IMPEDANCE SENSOR INTERFACE  
VOUT  
OPA320  
+VBIAS  
Many sensors have high source impedances that  
may range up to 10MΩ, or even higher. The output  
signal of sensors often must be amplified or  
otherwise conditioned by means of an amplifier. The  
input bias current of this amplifier can load the sensor  
output and cause a voltage drop across the source  
resistance, as shown in Figure 38, where (VIN+ = VS –  
IBIAS × RS). The last term, IBIAS × RS, shows the  
voltage drop across RS. To prevent errors introduced  
to the system as a result of this voltage, an op amp  
with very low input bias current must be used with  
high impedance sensors. This low current keeps the  
error contribution by IBIAS × RS less than the input  
voltage noise of the amplifier, so that it does not  
become the dominant noise factor. The OPA320  
series of op amps feature very low input bias current  
(typically 200fA), and are therefore ideal choices for  
such applications.  
(1) CF is optional to prevent gain peaking. It includes the stray  
capacitance of RF.  
Figure 37. Single-Supply Transimpedance  
Amplifier  
For additional information, refer to Application Bulletin  
(SBOA055), Compensate Transimpedance Amplifiers  
Intuitively, available for download at www.ti.com.  
OPTIMIZING THE TRANSIMPEDANCE  
CIRCUIT  
To achieve the best performance, components should  
be selected according to the following guidelines:  
1. For lowest noise, select RF to create the total  
required gain. Using a lower value for RF and  
adding gain after the transimpedance amplifier  
generally produces poorer noise performance.  
The noise produced by RF increases with the  
square-root of RF, whereas the signal increases  
linearly. Therefore, signal-to-noise ratio improves  
when all the required gain is placed in the  
transimpedance stage.  
RS  
100kW  
IB  
VIN+  
V+  
OPA320  
V-  
VOUT  
RF  
RG  
2. Minimize photodiode capacitance and stray  
capacitance at the summing junction (inverting  
input). This capacitance causes the voltage noise  
of the op amp to be amplified (increasing  
Figure 38. Noise as a Result of IBIAS  
amplification at high frequency). Using  
low-noise voltage source to reverse-bias  
a
a
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SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
DRIVING ADCS  
The OPA320 can be used to buffer the ADC switched  
input capacitance and resulting charge injection while  
providing signal gain. Figure 40 shows the OPA320  
configured to drive the ADS8326.  
The OPA320 series op amps are well-suited for  
driving sampling analog-to-digital converters (ADCs)  
with sampling speeds up to 1MSPS. The  
zero-crossover distortion input stage topology allows  
the OPA320 to drive ADCs without degradation of  
differential linearity and THD.  
+5V  
50kW  
(2.5V)  
8
RG  
REF1004-2.5  
R1  
R2  
4
100kW  
25kW  
+5V  
+5V  
R3  
R4  
25kW  
100kW  
1/2  
OPA2320  
1/2  
VOUT  
OPA2320  
RL  
10kW  
200kW  
G = 5 +  
RG  
Figure 39. Two Op Amp Instrumentation Amplifier with Improved High-Frequency Common-Mode  
Rejection  
+5V  
C1  
100nF  
+5V  
(1)  
R1  
V+  
OPA320  
V-  
100W  
+IN  
ADS8326  
16-Bit  
250kSPS  
(1)  
C3  
-IN  
1nF  
VIN  
0 to 4.096V  
REF IN  
Optional(2)  
+5V  
R2  
SD1  
BAS40  
50kW  
REF3240  
-5V  
4.096V  
C2  
C4  
100nF  
100nF  
(1) Suggested value; may require adjustment based on specific application.  
(2) Single-supply applications lose a small number of ADC codes near ground as a result of op amp output swing limitation. If a negative  
power supply is available, this simple circuit creates a 0.3V supply to allow output swing to true ground potential.  
Figure 40. Driving the ADS8326  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
17  
Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S  
 
 
OPA320, OPA2320  
OPA320S, OPA2320S  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
www.ti.com  
ACTIVE FILTER  
MFB and Sallen-Key, low-pass and high-pass filter  
synthesis is quickly accomplished using TIs  
FilterProprogram. This software is available as a  
free download at www.ti.com.  
The OPA320 is well-suited for active filter applications  
that require a wide bandwidth, fast slew rate,  
low-noise,  
single-supply  
operational  
amplifier.  
R3  
Figure 41 shows a 500kHz, second-order, low-pass  
filter using the multiplefeedback (MFB) topology.  
The components have been selected to provide a  
maximally-flat Butterworth response. Beyond the  
cutoff frequency, roll-off is 40dB/dec. The  
Butterworth response is ideal for applications  
requiring predictable gain characteristics, such as the  
anti-aliasing filter used in front of an ADC.  
549W  
C2  
150pF  
V+  
R1  
R2  
549W  
1.24kW  
One point to observe when considering the MFB filter  
is that the output is inverted, relative to the input. If  
this inversion is not required, or not desired, a  
noninverting output can be achieved through one of  
these options:  
VIN  
VOUT  
OPA320  
C1  
1nF  
V-  
1. adding an inverting amplifier;  
Figure 41. Second-Order Butterworth 500kHz  
Low-Pass Filter  
2. adding an additional second-order MFB stage; or  
3. using a noninverting filter topology, such as the  
Sallen-Key (shown in Figure 42).  
220pF  
V+  
19.5kW  
150kW  
1.8kW  
VIN = 1VRMS  
VOUT  
OPA320  
3.3nF  
47pF  
V-  
Figure 42. OPA320 Configured as a Three-Pole, 20kHz, Sallen-Key Filter  
18  
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Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S  
 
 
OPA320, OPA2320  
OPA320S, OPA2320S  
www.ti.com  
SBOS513D AUGUST 2010REVISED NOVEMBER 2011  
REVISION HISTORY  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision C (August 2011) to Revision D  
Page  
Changed status of OPA2320 SO-8 (D) to production data from product preview. ............................................................... 2  
Changes from Revision B (March 2010) to Revision C  
Page  
Added SHDN value to Electrical Characteristics condition line ............................................................................................ 3  
Added new test condition row for Input Bias Current Over Temperature parameter ........................................................... 3  
Changed test condition for Phase Margin parameter in Electrical Characteristics ............................................................... 3  
Added test condition to Short-Circuit Current parameter in Electrical Characteristics ......................................................... 4  
Changed Shutdown subsection of Electrical Characteristics along with associated notes .................................................. 4  
Changed Power Supply subsection of Electrical Characteristics ......................................................................................... 4  
Added values to Thermal Information tables, moved to new page, and updated format ..................................................... 5  
Removed D (SO-8) package pinout drawing from Pin Configurations section ..................................................................... 6  
Changed names of pins 2 and 6 for DGS (MSOP-10) package .......................................................................................... 6  
Changed Figure 4 ................................................................................................................................................................. 7  
Changed Figure 18 ............................................................................................................................................................... 9  
Changed 100µs to 100ns in first paragraph of Overload Recovery Time section .............................................................. 14  
Changed Figure 34 ............................................................................................................................................................. 14  
Changed Figure 35 ............................................................................................................................................................. 14  
Changed R2 value in Figure 40 from 500Ω to 50kΩ ........................................................................................................... 17  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
19  
Product Folder Link(s): OPA320 OPA2320 OPA320S OPA2320S  
PACKAGE OPTION ADDENDUM  
www.ti.com  
19-Nov-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
OPA2320AID  
OPA2320AIDGKR  
OPA2320AIDGKT  
OPA2320AIDR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
MSOP  
MSOP  
SOIC  
D
8
8
8
8
8
8
5
5
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
DGK  
DGK  
D
2500  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
Green (RoHS  
& no Sb/Br)  
2500  
1000  
250  
Green (RoHS  
& no Sb/Br)  
OPA2320AIDRGR  
OPA2320AIDRGT  
OPA320AIDBVR  
OPA320AIDBVT  
SON  
DRG  
DRG  
DBV  
DBV  
Green (RoHS  
& no Sb/Br)  
SON  
Green (RoHS  
& no Sb/Br)  
SOT-23  
SOT-23  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
19-Nov-2011  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Dec-2011  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
OPA2320AIDGKR  
OPA2320AIDGKT  
OPA2320AIDRGR  
OPA2320AIDRGT  
OPA320AIDBVR  
OPA320AIDBVT  
MSOP  
MSOP  
SON  
DGK  
DGK  
DRG  
DRG  
DBV  
DBV  
8
8
8
8
5
5
2500  
250  
330.0  
180.0  
330.0  
180.0  
180.0  
180.0  
12.4  
12.4  
12.4  
12.4  
8.4  
5.3  
5.3  
3.3  
3.3  
3.2  
3.2  
3.4  
3.4  
3.3  
3.3  
3.1  
3.1  
1.4  
1.4  
8.0  
8.0  
8.0  
8.0  
4.0  
4.0  
12.0  
12.0  
12.0  
12.0  
8.0  
Q1  
Q1  
Q2  
Q2  
Q3  
Q3  
1000  
250  
1.1  
SON  
1.1  
SOT-23  
SOT-23  
3000  
250  
1.39  
1.39  
8.4  
8.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
1-Dec-2011  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
OPA2320AIDGKR  
OPA2320AIDGKT  
OPA2320AIDRGR  
OPA2320AIDRGT  
OPA320AIDBVR  
OPA320AIDBVT  
MSOP  
MSOP  
SON  
DGK  
DGK  
DRG  
DRG  
DBV  
DBV  
8
8
8
8
5
5
2500  
250  
346.0  
210.0  
346.0  
210.0  
190.5  
190.5  
346.0  
212.7  
346.0  
212.7  
212.7  
212.7  
29.0  
35.0  
29.0  
35.0  
31.8  
31.8  
1000  
250  
SON  
SOT-23  
SOT-23  
3000  
250  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
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Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
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responsible or liable for any such statements.  
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Applications  
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amplifier.ti.com  
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