OPT4048DTST [TI]

高速高精度三色 XYZ 颜色传感器 | DTS | 8 | -40 to 85;
OPT4048DTST
型号: OPT4048DTST
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

高速高精度三色 XYZ 颜色传感器 | DTS | 8 | -40 to 85

传感器
文件: 总45页 (文件大小:1897K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
OPT4048  
ZHCSNT7 DECEMBER 2022  
OPT4048 高速高精度三XYZ 颜色传感器  
• 自动白平衡  
楼宇自动化与控制  
1 特性  
照明控制系统  
平板电脑和笔记本电脑  
• 通过高I2C 接口实现高精度、高速颜色光/数转换  
• 使用精密光学滤波器的四通道感应  
XYZ 三色通道CIE 1931 光谱密切匹配具有  
出色的红外抑制功能  
– 清晰的宽带宽通道  
3 说明  
OPT4048 是一款单芯片高分辨率颜色传感器能够测  
量四个通道每个通道具有特定设计的光谱响应。四个  
通道中的三个通道与 CIE 三色光谱非常匹配第四个  
通道具有宽带光谱响应。通过从这些通道进行测量可  
以提取照明环境的重要特性例如 (i) 光强度 (lux)(ii)  
CIE XY 中的颜色、LUV 坐标以及 (iii) 相关色温。  
OPT4048 采用小SOT-5X3 封装。  
CIE XY 中的高分辨率颜色测量、LUV 空间、相关  
(CCT) 以及环境照度测量  
• 半对数输出7 个二进制对数满标度照度范  
在每个范围内具有高度线性响应  
• 内置自动满标度照度范围选择逻辑可根据输入光  
条件切换测量范围范围之间具有良好的增益匹配  
26 位有效动态范围2.15mlux 144klux  
12 个可配置转换时间每个通道600μs 到  
800ms适用于各种高速和高精度应用  
• 针对硬件同步触发和中断的外部引脚中断  
• 低工作电流24μA具有超低待机功耗2μA  
• 工作温度范围40°C +85°C  
• 宽电源范围1.6V 3.6V  
OPT4048 具有可选寻址方案可在共享的 I2C 总线上  
启用多达 4 个器件。这些通道的光谱响应经过专门调  
可紧密模拟 CIE 三色光谱从而实现超精确的颜  
色检测同时强烈抑制远离其各自峰值的波长尤其是  
NIR850nm 940nm区域。这些滤波器采用先进  
的滤波技术即使在更高的光入射角下也能提供出色的  
滤波性能。该器件具有高精度颜色检测功能支持多种  
需要精确检测环境光颜色和色温的应用。  
• 耐5.5V 电压I/O  
• 可选择I2C 地址  
• 小巧的外形:  
器件信息  
封装(1)  
封装尺寸标称值)  
器件型号  
OPT4048  
2.1mm x 1.9mm x 0.6mm SOT-5X3 封装  
2.10mm X 1.90mm X  
0.6mm  
SOT-5X3 (8)  
2 应用  
(1) 要了解所有可用封装请参见数据表末尾的封装选项附录。  
显示亮度和颜色调整  
• 摄像头图像校正  
2
CH0 (X)  
CH1 (Y)  
1.8  
CH2 (Z)  
CH3 (W)  
1.6  
CIE X  
CIE Y  
CIE Z  
1.4  
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
Cover Glass  
OPT4048  
lux  
CIE XYZ/U'V'  
CCT in K  
I2C  
350  
450  
550  
650  
750  
850  
950  
Wavelength (nm)  
归一化光谱响应  
本文档旨在为方便起见提供有TI 产品中文版本的信息以确认产品的概要。有关适用的官方英文版本的最新信息请访问  
www.ti.com其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前请务必参考最新版本的英文版本。  
English Data Sheet: SBOSA84  
 
 
 
 
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Table of Contents  
8.4 Register Maps...........................................................24  
9 Application and Implementation..................................33  
9.1 Application Information............................................. 33  
9.2 Typical Application.................................................... 33  
9.3 Do's and Don'ts.........................................................36  
9.4 Power Supply Recommendations.............................37  
9.5 Layout....................................................................... 37  
10 Device and Documentation Support..........................39  
10.1 Documentation Support.......................................... 39  
10.2 接收文档更新通知................................................... 39  
10.3 支持资源..................................................................39  
10.4 Trademarks.............................................................39  
10.5 Electrostatic Discharge Caution..............................39  
10.6 术语表..................................................................... 39  
11 Mechanical, Packaging, and Orderable  
1 特性................................................................................... 1  
2 应用................................................................................... 1  
3 说明................................................................................... 1  
4 Revision History.............................................................. 2  
5 说明.........................................................................3  
6 Pin Configuration and Functions...................................3  
7 Specifications.................................................................. 4  
7.1 Absolute Maximum Ratings........................................ 4  
7.2 ESD Ratings............................................................... 4  
7.3 Recommended Operating Conditions.........................4  
7.4 Thermal Information....................................................4  
7.5 Electrical Characteristics.............................................5  
7.6 Typical Characteristics................................................7  
8 Detailed Description........................................................9  
8.1 Overview.....................................................................9  
8.2 Functional Block Diagram.........................................10  
8.3 Feature Description...................................................10  
Information.................................................................... 39  
4 Revision History  
以前版本的页码可能与当前版本的页码不同  
DATE  
REVISION  
NOTES  
December 2022  
*
Initial release.  
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5 说明)  
OPT4048 上设计的光学滤波器提供了强大的红外抑制功能尽管传感器放置在深色玻璃下这是最终产品工业设  
计出于美学考虑的常见要求),但这一功能也有助于保持高精度。  
OPT4048 专为需要照度级别检测的系统而设计通过提供有关照明强度和照明颜色的信息来增强用户体验。  
OPT4048 器件可通过每个通12 个步骤配置为以 600μs 800ms 的光转换时间运行从而能够根据应用需要  
提供系统灵活性。转换时间包括光采集时间ADC 转换时间。测量分辨率由光强度和采集时间两者决定能够有  
效地测量低2.15mlux 的光强度变化。  
数字操作可灵活用于系统集成。测量可以是连续的也可以通过寄存器写入或硬件引脚单次触发。此器件提供了  
阈值检测逻辑这允许处理器进入睡眠状态直到传感器检测到适当的唤醒事件并通过中断引脚进行报告。  
数字输出表示通过兼I2C SMBus 的双线制串行接口报告照度级别。  
OPT4048 兼具低功耗和低电源电压功能有助于延长电池供电系统的电池寿命。  
6 Pin Configuration and Functions  
SDA  
INT  
NC  
1
2
3
4
8
7
6
5
VDD  
ADDR  
NC  
GND  
SCL  
6-1. DTS Package, 8-Pin SOT-5X3, Top View  
6-1. Pin Functions  
PIN  
TYPE  
DESCRIPTION  
NO.  
1
NAME  
VDD  
ADDR  
NC  
Power  
Digital input  
No Connection  
Power  
Device power. Connect to a 1.6-V to 3.6-V supply.  
2
Address pin. This pin sets the LSBs of the I2C address.  
3
No Connection  
4
GND  
SCL  
NC  
Ground  
I2C clock. Connect with a 10-kΩresistor to a 1.6-V to 5.5-V supply.  
5
Digital input  
No Connection  
Digital I/O  
6
No Connection  
7
INT  
Interrupt input/output open-drain. Connect with a 10-kΩresistor to a 1.6-V to 5.5-  
V supply.  
I2C data. Connect with a 10-kΩresistor to a 1.6-V to 5.5-V supply.  
8
SDA  
Digital I/O  
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7 Specifications  
7.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
MIN  
0.5  
0.5  
MAX  
6
UNIT  
V
Voltage  
VDD to GND  
SDA and SCL to GND  
6
V
Current in to any pin  
10  
mA  
°C  
TJ  
Junction temperature  
Storage temperature  
150  
150(2)  
Tstg  
°C  
65  
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply  
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If  
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully  
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.  
(2) Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per ANSI/ESDA/  
JEDEC JS-001, all pins(1)  
±2000  
V(ESD)  
Electrostatic discharge  
V
Charged device model (CDM), per ANSI/ESDA/  
JEDEC JS-002, all pins(2)  
±500  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
1.6  
NOM  
MAX  
3.6  
UNIT  
V
VDD  
TJ  
Supply voltage  
Junction temperature  
85  
°C  
40  
7.4 Thermal Information  
OPT4048  
THERMAL METRIC(1)  
DTS  
8 Pins  
112.2  
28.4  
22.1  
1.2  
UNIT  
RθJA  
RθJC(top)  
RθJB  
ΨJT  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
22  
ΨJB  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
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7.5 Electrical Characteristics  
All specifications at TA = 25°C, VDD = 3.3 V, 100-ms conversion-time per channel, automatic full-scale range, white LED and  
normal-angle incidence of light, unless otherwise specified. Spec parameters are preliminary, subject to change.over  
operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Optical  
Number of Channels  
4
600  
550  
460  
500  
CH0 (X)  
CH1(Y)  
CH2(Z)  
CH3(W)  
nm  
nm  
nm  
nm  
bits  
bits  
ms  
ms  
Peak irradiance spectral responsivity  
ʎpeak  
ADC resolution  
9
20  
Range determination  
3
25  
Conversion-time CT = 0x6  
Conversion-time CT = 0xB  
Tintg  
Light Integration-time per channel (4)  
800  
codes  
per  
CH0 (X) Lowest auto gain range, 800 ms  
conversion time per channel  
RCH0  
2770  
3960  
1910  
μW/cm2  
codes  
per  
μW/cm2  
CH1 (Y) Lowest auto gain range, 800 ms  
conversion time per channel  
RCH1  
RCH2  
RCH3  
Peak Responsivity  
codes  
per  
μW/cm2  
CH2 (Z) Lowest auto gain range, 800 ms  
conversion time per channel  
codes  
per  
μW/cm2  
CH3 (W) Lowest auto gain range, 800 ms  
conversion time per channel  
6950  
17.2  
Lowest auto gain range, 100 ms  
conversion-time per channel  
mlux  
ERlux  
Equivalent Resolution  
Lowest auto gain range, 800 ms  
conversion-time per channel  
2.15  
144284  
2000  
mlux  
lux  
EvFS  
Ev  
Full-scale equivalent Illuminance  
Measurement output result from lux  
measurement  
2000 lux input(1)  
All channels  
1800  
2200  
lux  
Relative accuracy between gain ranges  
0.6  
0.2  
%
%
(2)  
850nm near infra-red, all channels except  
for CH3 (W)  
EvIR  
Infrared response(6)  
Light source variation for lux  
measurement (incandescent, halogen,  
fluorescent)  
Bare device, no cover glass  
4
%
Input illuminance > 2254 lux , 100 ms  
conversion-time per channel, all channels  
2
5
%
%
Linearity  
Input illuminance <= 2254 lux , 100 ms  
conversion-time per channel, all channels  
Dark Measurement  
All channels  
CH0 (X)  
0
0.02  
0.02  
0.05  
0.05  
10 codes  
%/°C  
CH1 (Y)  
%/°C  
Drift across temperature  
CH2 (Z)  
%/°C  
CH3 (W)  
%/°C  
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7.5 Electrical Characteristics (continued)  
All specifications at TA = 25°C, VDD = 3.3 V, 100-ms conversion-time per channel, automatic full-scale range, white LED and  
normal-angle incidence of light, unless otherwise specified. Spec parameters are preliminary, subject to change.over  
operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
134  
121  
99  
MAX  
UNIT  
CH0 (X)  
CH1 (Y)  
CH2 (Z)  
CH3 (W)  
°
°
°
°
Angular response (FWHM)  
128  
VDD at 3.6 V and 1.6 V, 30 different  
sources, all channels  
PSRR  
Power-supply rejection ratio(3)  
0.2  
%/V  
POWER SUPPLY  
VDD  
VI2C  
Power supply  
Power supply for I2C pull up resistor  
1.6  
1.6  
3.6  
5.5  
V
V
I2C pullup resistor, VDD VI2C  
Dark  
24  
29  
2
µA  
µA  
µA  
µA  
V
IQACTIVE Active Current  
Full-scale lux  
Dark  
IQ  
Quiescent current  
Full-scale lux  
2.6  
0.8  
POR  
Power-on-reset threshold  
DIGITAL  
CIO  
I/O Pin Capacitance  
3
pF  
V
Low-level input voltage (SDA, SCL, and  
ADDR)  
0.3 X  
VDD  
VIL  
VIH  
0
High-level input voltage (SDA, SCL, and  
ADDR)  
0.7 X  
VDD  
5.5  
V
Low-level input current (SDA, SCL, and  
ADDR)  
IIL  
0.01  
0.01  
0.25(5)  
0.32  
µA  
V
VOL  
IZH  
Low-level output voltage (SDA and INT)  
IOL=3mA  
Output logic high, high-Z leakage current  
(SDA, INT)  
Measured with VDD at pin  
0.25(5)  
µA  
TEMPERATURE  
Specified temperature range  
85  
°C  
40  
(1) Tested with the white LED calibrated to 2000 lux.  
(2) Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.  
(3) PSRR is the percent change of the measured lux output from the current value, divided by the change in power supply voltage, as  
characterized by results from 3.6-V and 1.6-V power supplies.  
(4) The conversion-time, from start of conversion until the data are ready to be read, is the integration-time plus analog-to-digital  
conversion-time.  
(5) The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller.  
(6) Tested with a near infrared LED of 850nm wavelength.  
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7.6 Typical Characteristics  
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CONVERSION_TIME = 0xB), automatic full-scale range (RANGE =  
0xC), white LED, and normal-angle incidence of light, unless otherwise specified.  
2
1.8  
1.6  
1.4  
1.2  
1
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
CH0 (X)  
CH1 (Y)  
CH2 (Z)  
CH3 (W)  
CH0 (X)  
CH1 (Y)  
CH2 (Z)  
CH3 (W)  
CIE X  
CIE Y  
CIE Z  
0.8  
0.6  
0.4  
0.2  
0
-100 -80 -60 -40 -20  
0
20  
40  
60  
80 100  
350  
450  
550  
650  
750  
850  
950  
Illuminance Angle (°)  
Wavelength (nm)  
Normalized to 0°  
spacer  
Channels measurements scaled to match CIE curves  
spacer  
7-2. Device Response vs Illuminance Angle  
7-1. Spectral Response vs Wavelength  
1.5  
1.45  
1.4  
1.14  
1.12  
1.1  
1.35  
1.3  
1.08  
1.06  
1.04  
1.02  
1
1.25  
1.2  
1.15  
1.1  
0.98  
0.96  
0.94  
1.05  
1
0.001 0.01  
0.1  
1
10  
100 1000 10000 100000  
0.001 0.01  
0.1  
1
10  
100 1000 10000 100000  
Input Illuminance (Lux)  
Input Illuminance (Lux)  
Normalized to dark condition  
Normalized to dark condition  
7-3. Active Current vs Input Light Level  
7-4. Standby Current vs Input Light Level  
1.1  
1.08  
1.06  
1.04  
1.02  
1
1.05  
1.04  
1.03  
1.02  
1.01  
1
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
0.98  
0.96  
0.94  
0.92  
0.9  
1.6 1.8  
2
2.2 2.4 2.6 2.8  
Power Supply (V)  
3
3.2 3.4 3.6  
1.6 1.8  
2
2.2 2.4 2.6 2.8  
Power Supply (V)  
3
3.2 3.4 3.6  
Normalized to 3.3 V  
7-6. Standby Current vs Power Supply  
Normalized to 3.3 V  
7-5. Active Current vs Power Supply  
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7.6 Typical Characteristics (continued)  
At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CONVERSION_TIME = 0xB), automatic full-scale range (RANGE =  
0xC), white LED, and normal-angle incidence of light, unless otherwise specified.  
1.0029  
1.0026  
1.0023  
1.002  
1.036  
1.032  
1.028  
1.024  
1.02  
E=0  
E=1  
E=2  
E=3  
E=4  
E=5  
E=6  
1.0017  
1.0014  
1.0011  
1.0008  
1.0005  
1.0002  
0.9999  
0.9996  
1.016  
1.012  
1.008  
1.004  
1
100  
500 1000  
10000  
100000 300000  
1.6 1.8  
2
2.2 2.4 2.6 2.8  
Supply Voltage(V)  
3
3.2 3.4 3.6  
Input Illuminance (Lux)  
E denotes register EXPONENT_CHx  
Normalized to 25 ms  
Normalized to 3.3 V  
7-7. Device Response vs Power Supply  
7-8. Conversion Time at 25 ms per channel vs Input Light  
Level  
1.1  
1.08  
1.06  
1.04  
1.02  
1
1.4  
1.35  
1.3  
1.25  
1.2  
1.15  
1.1  
0.98  
0.96  
0.94  
0.92  
0.9  
1.05  
1
0.95  
-40  
-20  
0
20  
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Temperature (°C)  
Normalized to 25°C  
Normalized to 25°C  
spacer  
7-10. Standby Current vs Temperature  
7-9. Active Current vs Temperature  
1.05  
1.04  
1.03  
1.02  
1.01  
1
CH0 (X)  
CH1 (Y)  
CH2 (Z)  
CH3 (W)  
0.99  
0.98  
0.97  
0.96  
0.95  
0.94  
-40  
-20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Normalized to 25°C  
7-11. Device Response vs Temperature  
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8 Detailed Description  
8.1 Overview  
The OPT4048 measures the color properties of the light source that illuminates the device. This device  
measures four channels (X Channel, Y Channel, Z Channel, W Channel) with special spectral characteristics,  
which helps extract properties of the light source (i) the CIE XY/U'V' color coordinates (ii) the lux level and (iii)  
the correlated color temperature. Name of the channels correspond to the respective CIE tristimulus curves with  
additional W channel being the wide channel response.  
With close matching to the CIE tristimulus spectral profiles, OPT4048 measures the true color of any light source  
or environment. This helps applications where, measuring the precise characteristics of the lighting environment  
is critical like display brightness, color temperature adjustment, camera color temperature correction, object true  
color recognition & medical applications.  
Since CIE tristimulus curves are devised to mimic human color perception, matching the sensor spectral  
response to those curves is vital because color sensors are used to measure and help create excellent human  
lighting experiences. Strong rejection of infrared light, which a human does not see, is a crucial component of  
this matching. This matching makes the OPT4048 especially good for operation underneath windows that are  
visibly dark, but infrared transmissive  
OPT4048 is fully self-contained to measure the properties of light and report the result in ADC codes digitally  
over the I2C bus. The result can also be used to alert a system and interrupt a processor with the INT pin. The  
result can also be summarized with a programmable threshold comparison with a specified channel and  
communicated with the INT pin.  
OPT4048 is by default configured to operate in automatic full-scale range detection mode that always selects the  
best full-scale range setting for the given lighting conditions. There are 7 full-scale range settings, one of which  
can be selected manually as well. Setting the device to operate in automatic full-scale range detection mode  
frees the user from having to program their software for potential iterative cycles of measurement and  
readjustment of the full-scale range until good for any given measurement. With device exhibiting excellent  
linearity over the entire 26 bit dynamic range of measurement no additional linearity calibration is required at  
system level.  
The OPT4048 contains 4 channels, results of which are always available all the time as independent channel  
registers which can be digitally read over the I2C bus synchronously or asynchronously.  
The device measures light for 4 channels sequentially (X, Y, Z, W) with selectable conversion times from 600 μs  
per channel to 800 ms per channel in 12 steps. Measurements can be read asynchronously or interrupt pin  
based which can be configured to generate an interrupt every time a single channel completes conversion or  
every time all 4 channels complete conversion.  
The device starts up in a low-power shutdown state, such that the OPT4048 only consumes active-operation  
power after being programmed into an active state.  
OPT4048 optical filtering system is not excessively sensitive to small particles and micro-shadows on the optical  
surface. This reduced sensitivity is a result of the relatively minor device dependency on uniform density optical  
illumination of the sensor area for infrared rejection. Proper optical surface cleanliness is always recommended  
for best results on all optical devices.  
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8.2 Functional Block Diagram  
VDD  
2
OPT4048  
I C  
SCL  
CH0 (X)  
Interface  
Ambient  
AGC  
SDA  
Light  
CH0 (X)  
CH1 (Y)  
CH2 (Z)  
CH3 (W)  
CH1 (Y)  
ADC  
ADDR  
CH2 (Z)  
INT  
Controller  
CH3 (W)  
GND  
8.3 Feature Description  
8.3.1 Spectral Matching to CIE  
The OPT4048 spectral response closely matches CIE 1931 tristimulus spectra, which is modeled to be a close  
representation of how an average human perceives light. This is crucial to measure the characteristics of light  
such an color, intensity as close as possible to how humans perceive.  
OPT4048 also has excellent infrared light (IR) rejection. This IR rejection is especially important because many  
real-world lighting sources have significant infrared content that humans do not see. If the sensor measures  
infrared light that the human eye does not see, then a true human experience is not accurately represented.  
If the application demands hiding OPT4048 underneath dark window (such that the end-product user cannot see  
the sensor) the infrared rejection of the OPT4048 becomes significantly more important because many dark  
windows attenuate visible light but transmit infrared light. This attenuation of visible light and lack of attenuation  
of IR light amplifies the ratio of the infrared light to visible light that illuminates the sensor. Results can still be  
well matched to the human eye under this condition because of the high infrared rejection of the OPT4048.  
8.3.2 Automatic Full-Scale Range Setting  
The OPT4048 has an automatic full-scale range setting feature that eliminates the need to predict and set the  
best range for the device. Each channel has a auto-scaling algorithm and independently tracks light levels. In  
this mode, the OPT4048 automatically selects the best full-scale range for the given lighting condition. The  
OPT4048 has a high degree of result matching between the full-scale range settings. This matching eliminates  
the problem of varying results or the need for range-specific, user-calibrated gain factors when different full-scale  
ranges are chosen. The device has independent range detection logic making the device operate seamlessly  
with a wide range of light color and levels.  
8.3.3 Output Register CRC and Counter  
OPT4048 device features additional bits as part of the output register which helps in improving the reliability of  
light measurements for the application.  
8.3.3.1 Output Sample Counter  
The OPT4048 device features registers COUNTER_CHx as part of the output registers which increments for  
every successful measurement. This register can be read as part of the output registers which helps the  
application to keep track of measurements. The 4 bit counter starts at 0 on power-up and counts up to 15 after  
which the counter resets back to 0 and continues to count up. There are independent counters for each channel  
counting up every successful conversion.  
Host or the controller needs consecutive measurements. Utilizing the COUNTER_CHx registers allow the  
controller to compare samples and makes sure that the samples are in expected order without missing  
intermediate counter values.  
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As a safety feature where when light level are not changing, the controller can make sure that the  
measurements from OPT4048 are not stuck by comparing values of registers COUNTER_CHx between  
measurements. If the COUNTER_CHx values continue to change over samples, the device is updating the  
output register with the most recent measurement of light levels.  
8.3.3.2 Output CRC  
CRC_CHx registers consists of Cyclic Redundancy Checker bits part of the output registers calculated within the  
OPT4048 device and updated on every measurement. This feature helps in detecting communication related bit  
errors during the output readout from the device. The calculation method for the CRC bits is shown in the 图  
8-12, which can be independently verified in the controller or host firmware/software to validate if communication  
between the controller and the device was successful without bit errors during transmission.  
8.3.3.3 Threshold Detection  
OPT4048 features a threshold detection logic which can be programmed to indicate and update register flags if  
measured light levels cross thresholds set by the user. The threshold condition can be programmed to use one  
of the 4 channels as trigger determined by the THRESHOLD_CH_SEL register. There are independent low and  
high threshold target registers with independent flag registers to indicate the status of measured light level.  
Measured light level reaching below low threshold and above the high threshold are called faults. Users can  
program a fault count register, which counts consecutive number of faults before the flag registers are set.  
Details on the register and setting up the threshold is available in 8.3.4.2 and 8.3.4.5.  
8.3.4 Device Functional Modes  
8.3.4.1 Modes of Operation  
OPT4048 has output registers which are always available to readout to get measurements, the measurements  
themselves are updated based on the device mode of operation listed below. The OPT4048 device has the  
following modes of operation:  
Power-down mode: This is power-down or standby mode where the device enters a low power state. There  
is no active light sensing or conversion in this mode. Device still responds to I2C transactions which can be  
utilized to bring the device out of this mode.  
Continuous mode: In this mode OPT4048 measures all 4 channels in a round robin fashion continuously  
and updates their corresponding output registers. The conversion time register CONVERSION_TIME  
determines the time between each channel conversion and a hardware interrupt on pin INT is generated for  
every successful conversion on each channel or all 4 channels depending on INT_CFG register value. TI  
recommends to configure the INT pin in output mode using the INT_DIR register. The device active circuits  
are continuously kept active to minimize the interval between measurements.  
One shot mode of operation: There are several ways in which OPT4048 can be used in one shot mode of  
operation with one common theme which is that OPT4048 stays in standby mode and a conversion is  
triggered by a register write either by a register write to configuration register or hardware interrupt on the INT  
pin. Every trigger generates one measurement for 4 channels, effectively taking four times the time set by the  
CONVERSION_TIME register  
There are two types of one shot modes.  
Force auto-range one shot mode: Every one shot trigger forces a full reset on auto-ranging control logic  
and a fresh auto-range detection in initiated ignoring the previous measurements. This is particularly  
useful in situation where lighting conditions are expected to change a lot and one shot trigger frequency is  
not very often. There is small penalty on conversion time due for the auto-ranging logic to recover from  
reset state. The full reset cycle on the auto-ranging control logic takes around 500 μs which needs to be  
accounted for between measurements when this mode is used.  
Regular auto-range one shot mode: Auto-range selection logic utilizes the information from the previous  
measurements to decide on range for the current trigger. This mode is recommended only when the  
device needs time synchronized measurements with frequent triggers from the controller. In other words,  
this mode can be used as an alternative to continuous mode the key difference being that the interval  
between measurements in determined by the one shot triggers.  
One Shot can be triggered using by the following:  
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Hardware trigger: INT pin can be configured to be an input to trigger a measurement using INT_DIR  
register. Since INT pin is used as input, there is no hardware interrupt to indicate completion of  
measurement. The controller needs to keep time from the trigger mechanism and read out output  
registers.  
Register trigger: An I2C write to the M register triggers a measurement. The register value is reset after a  
successful measurement. INT pin can be configured to indicate measurement completion to read out  
output registers using the INT_DIR register.  
TI highly recommends to set the interval between subsequent triggers to account for all the aspects involved  
in the trigger mechanism like the I2C transaction time, device wake-up time, auto-range time (if used) and 4  
times the device conversion time.  
Since the device enters standby after each one shot trigger, measurement interval on the one shot trigger  
mechanism needs to account for additional time Tss as specified in the specification table for the circuits to  
recover from standby state. However setting the quick wake up register QWAKE eliminates the need for this  
additional Tss at the cost of not powering down the active circuit with device not entering the standby mode  
between triggers.  
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Continuous Mode (INT_CFG=3)  
Measurement  
Measurement  
Measurement  
Measurement  
(n+1)  
Output registers  
INT (output)  
(n+2)  
(n-1)  
(n)  
Interrupt(n+1)  
Interrupt(n)  
Interrupt(n-1)  
4 X Conversion Time  
Active Power  
Active Power  
Active Power  
Active Power  
Device Power  
Continuous Mode (INT_CFG=1)  
Measurement  
Measurement  
Measurement  
Measurement  
(n+1)  
Output registers  
INT (output)  
(n+2)  
(n-1)  
(n)  
Interrupt(n+1)  
Interrupt(n)  
Interrupt(n-1)  
1 X Conversion Time  
Active Power  
Active Power  
Active Power  
Active Power  
Device Power  
INT (input)  
One-shot Mode (Pin Trigger)  
Trigger(n)  
4 X Conversion Time  
Trigger(n+1)  
4 X Conversion Time  
Measurement  
Measurement  
(n)  
Measurement  
Standby  
Output registers  
Device Power  
(n-1)  
(n+1)  
Active Power  
Standby  
Active Power  
Standby  
Trigger biOts snet eby-Csonhtroolletr Mode (Register Trigger)  
Config register  
Trigger bits reset by Device  
Trigger(n+1)  
Trigger bits reset by Device  
Trigger(n)  
4 X Conversion Time  
4 X Conversion Time  
Measurement  
Measurement  
(n)  
Output registers  
Measurement  
(n-1)  
(n+1)  
INT (output)  
Interrupt(n)  
Standby  
Interrupt(n+1)  
Standby  
Active Power  
Active Power  
Standby  
Device Power  
8-1. Timing Diagrams for different Operating modes  
8.3.4.2 Interrupt Modes of Operation  
The device has an interrupt reporting system that allows the processor connected to the I2C bus to go to sleep,  
or otherwise ignore the device results, until a user-defined event occurs that requires possible action.  
Alternatively, this same mechanism can also be used with any system that can take advantage of a single digital  
signal that indicates whether the light is above or below levels of interest.  
Channel on which this behavior can be enabled is set by the register THRESHOLD_CH_SEL.  
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The INT pin has an open-drain output, which requires the use of a pull-up resistor. This open-drain output allows  
multiple devices with open-drain INT pins to be connected to the same line, thus creating a logical NOR or AND  
function between the devices. The polarity of the INT pin can be controlled by the INT_POL.  
There are two major types of interrupt reporting mechanism modes: latched window comparison mode and  
transparent hysteresis comparison mode. The configuration register LATCH controls which of these two modes  
is used. 8-2 and 8-1 summarize the function of these two modes. Additionally, the INT pin can either be  
used to indicate a fault in one of these modes (INT_CFG=0) or to indicate a conversion completion (INT_CFG  
>0). This is shown in 8-2.  
8-2. Interrupt Pin Status (for INT_CFG=0 setting) and Register Flag Behavior  
8-1. Interrupt Pin Status (for INT_CFG=0 setting) and Register Flag Behavior  
INT Pin State (when  
LATCH Setting  
FLAG_H Value  
FLAG_L Value  
Latching Behavior  
INT_CFG=0)  
INT pin indicates if  
measurement is above  
(INT active) or below (INT  
inactive) the threshold. If  
measurement is between  
the high and low threshold  
values then the previous  
INT value is maintained.  
This prevents the INT pin  
from repeated toggling  
when the measurement  
values are close to the  
threshold.  
0: If measurement is  
below the low limit  
1: If measurement is  
above the high limit  
If measurement is  
between high and low  
limits previous value is  
maintained  
0: If measurement is  
above the high limit  
1: If measurement is  
below the low limit  
If measurement is  
between high and low  
limits previous value is  
maintained  
Not latching: Values are  
updated after each  
conversion  
0: Transparent hysteresis  
mode  
INT pin becomes active if  
the measurement is  
outside the window (above  
high threshold or below  
the low threshold). The  
INT pin does not reset and  
return to the inactive state  
until register 0xC is read.  
Latching: INT pin,  
FLAG_H and FLAG_L  
values do not reset until  
the register 0x0C is read.  
1: If measurement is  
above the high limit  
1: If measurement is  
below the low limit  
1: Latched window mode  
The THRESHOLD_H, THRESHOLD_L, LATCH and FAULT_COUNT registers control the interrupt behavior. The  
LATCH field setting allows a choice between the latched window mode and transparent hysteresis mode as  
shown in the table. Interrupt reporting can be observed on INT pin, the FLAG_H, and the FLAG_L registers.  
Results from comparing the current sensor measurements with THRESHOLD_H and THRESHOLD_L registers  
are referred to as fault events. The calculations to set these registers can be found in 8.3.4.5. The  
FAULT_COUNT register dictates the number of continuous fault events required to trigger an interrupt event and  
subsequently change the state of the interrupt reporting mechanisms. For example, with a FAULT_COUNT value  
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of 2 corresponding to 4 fault counts, the INT pin, FLAG_H and FLAG_L states shown in the table are not  
realized unless 4 consecutive measurements are taken that satisfy the fault condition.  
INT pin function listed in 8-1 is valid only when INT_CFG=0. The INT pin function can be changed to indicate  
an end of conversion as well shown in 8-2. The FLAG_H and FLAG_L registers continue to behave as listed  
in 8-1 even while INT_CFG>0. The polarity of the INT pin is controlled by the INT_POL register.  
8-2. INT_CFG Setting and Resulting INT Pin Behavior  
INT_CFG Setting  
INT Pin Function  
0
As per 8-1  
INT pin asserted with 1us pulse width after conversion of every  
channel  
1
3
INT pin asserted with 1us pulse width every 4 conversions to indicate  
all channel measurements are complete  
8.3.4.3 Light Range Selection  
The OPT4048 has an automatic full-scale-range setting mode that eliminates the need for a user to predict and  
set the best range for the device. This mode is entered when register RANGE is set to 0xC. The device  
determines the appropriate full-scale range to take the measurement based on a combination of current lighting  
conditions and the previous measurement.  
If a measurement is towards the low side of full-scale, then the full-scale range is decreased by one or two  
settings for the next measurement. If a measurement is towards the upper side of full-scale, the full-scale range  
is increased by one setting for the next measurement.  
If the measurement exceeds the full-scale range, resulting from a fast increasing optical transient event, then the  
current measurement is aborted. This invalid measurement is not reported. If the scale is not at the maximum,  
then the device increases the scale by one step and a new measurement is retaken with that scale. Therefore,  
during a fast increasing optical transient in this mode, a measurement can possibly take longer to complete and  
report than indicated by the configuration register CONVERSION_TIME.  
The logic that determines the appropriate range settings for each channel is independent of each other, which  
verifies a support of a wide range of colors represented with the best accuracy.  
TI highly recommends to use this feature, since the device selects the best range setting based on lighting  
condition. However, there is an option to manually set the range. Setting the range manually turns off the  
automatic full-scale selection logic and the device operates for a particular range setting.  
8-3. Range Selection Table  
RANGE register setting  
Typical Full-scale Light level  
0
1
2254 lux  
4509 lux  
2
9018 lux  
3
18036 lux  
4
36071 lux  
72142 lux  
5
6
144284 lux  
12  
Determined by automatic full-scale range logic  
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8.3.4.4 Selecting Conversion Time  
OPT4048 device offers several conversion times to select from. Conversion Time is defined as the time to take  
for one measurement to complete for one channel and update the results in output register. Since OPT4048 is 4  
channel device the actual time to complete a 4 channel measurement is 4 times the time specified in the  
CONVERSION_TIME register. Measurement initiation is determined by the mode of operation as specified in 节  
8.3.4.1.  
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8-4. Conversion Time Selection  
CONVERSION_TIME Register  
Typical Conversion Time Per Channel  
0
1
600 μs  
1 ms  
2
1.8 ms  
3.4 ms  
6.5 ms  
12.7 ms  
25 ms  
3
4
5
6
7
50 ms  
8
100 ms  
200 ms  
400 ms  
800 ms  
9
10  
11  
8.3.4.5 Light and Color Measurement  
The OPT4048 device measures light on 4 independent channels and updates output registers with proportional  
ADC codes. Updated are based on the mode of operation as described in 8.3.4.1. If readout of output  
registers is performed before a successful completion of a measurement, the previous measurement is what  
would be read out. Output of the each channel is represented by two parts (i) 4 bits of EXPONENT_CHx and (ii)  
20 bits of MANTISSA_CHx. This arrangement of binary logarithmic full-scale range with linear representation  
with in a range, helps in covering a large dynamic range of measurements. MANTISSA here represents the  
linear ADC codes proportional to the measured light within a given full-scale range and the EXPONENT_CHx  
represents the current-full scale range selected. The selected range can be automatically determined by the  
auto-range selection logic or manually selected as per 8-3.  
Lux level can be determined using the following equations:  
MANTISSA_CHx=(RESULT_MSB_CHx<<8) + RESULT_LSB_CHx  
(1)  
or  
MANTISSA_CHx=(RESULT_MSB_CHx x 2^8) + RESULT_LSB_CHx  
(2)  
where RESULT_MSB_CHx, RESULT_LSB_CHx and EXPONENT_CHx are registers part of the output register  
for each channel  
RESULT_MSB_CHx register carries the most significant 12 bits of the MANTISSA_CHx and RESULT_LSB_CHx  
register carries the least significant 8 bits of the MANTISSA_CHx. MANTISSA_CHx is then computed using the  
above equations to get the 20 bit number. EXPONENT_CHx is directly read from the register which is 4 bits.  
Once the EXPONENT_CHx and MANTISSA_CHx portions are calculated the linearized ADC_CODES_CHx is  
calculated using the following equation:  
ADC_CODES_CHx = (MANTISSA_CHx<<EXPONENT_CHx)  
(3)  
or  
ADC_CODES_CHx = (MANTISSA_CHx x 2^EXPONENT_CHx)  
(4)  
With maximum value for register EXPONENT_CHx being 8 ADC_CODES is effectively a 28 bit number. The  
semi-logarithmic numbers have been converted to a linear ADC_CODES_CHx representation making simple to  
convert to lux and CIE XY color coordinates  
Conversion of the raw ADC codes to the CIE colorimetric X, Y and lux are given by the equation below  
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m0x m0y m0z m0l  
m1x m1y m1z m1l  
m2x m2y m2z m2l  
m3x m3y m3z m3l  
adc_codes_cℎ0 adc_codes_cℎ1 adc_codes_cℎ2 adc_codes_cℎ3 ∙  
= x y z lux  
(5)  
x
CIEx =  
CIEy =  
(6)  
(7)  
x + y + z  
y
x + y + z  
The conversion matrix can be customized based on target application and details for the same can be found in  
9.2.4.  
Lux Calculations  
As listed in the 方程式 5 lux values can be obtained along with the color information as part of the matrix.  
However, isolating the lux calculations from the matrix can be useful. In that case, the matrix can be simplified to  
remove lux calculations as shown below  
m0x m0y m0z  
m1x m1y m1z  
adc_codes_cℎ0 adc_codes_cℎ1 adc_codes_cℎ2 adc_codes_cℎ3 ∙  
= x y z  
(8)  
(9)  
m2x m2y m2z  
m3x m3y m3z  
Lux can be simply calculated using the following equation  
lux = adc_codes_ch1 x 2.15e-3  
Threshold Detection Calculations  
Threshold result registers THRESHOLD_H_RESULT and THRESHOLD_H_RESULT are 12 bit, while threshold  
exponent registers THRESHOLD_H_EXPONENT and THRESHOLD_L_EXPONENT are 4 bits. Since threshold  
is compared at linear ADC_CODES_CHx, the threshold registers are padded with zeros internally as shown to  
compare with the ADC_CODES_CHx  
ADC_CODES_TH = THRESHOLD_H_RESULT << (8 + THRESHOLD_H_EXPONENT)  
ADC_CODES_TH = THRESHOLD_H_RESULT x 2^(8 + THRESHOLD_H_EXPONENT)  
ADC_CODES_TL = THRESHOLD_L_RESULT << (8 + THRESHOLD_L_EXPONENT)  
ADC_CODES_TL=THRESHOLD_L_RESULT x 2^(8 + THRESHOLD_L_EXPONENT)  
(10)  
(11)  
(12)  
(13)  
(14)  
or  
and  
or  
Threshold are then compared as shown to detect Fault events.  
If ADC_CODES_CHx < ADC_CODES_TL a Fault Low is detected  
and  
If ADC_CODES_CHx > ADC_CODES_TH a Fault High is detected  
(15)  
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Based on the FAULT_COUNT register setting, with consecutive Fault High or Fault Low events, respective  
FLAG_H and FLAG_L registers are set. Clearly understanding the difference between  
THRESHOLD_H_EXPONENT,  
THRESHOLD_H_RESULT,  
THRESHOLD_L_EXPONENT,  
THRESHOLD_L_RESULT and the output registers is important to be able to set appropriate threshold based on  
application needs. More details can be found in 8.3.4.2.  
8.3.4.6 Light Resolution  
The OPT4048 device's effective resolution is dependent on both the conversion time setting and the full-scale  
light range. Although the LSB resolution of the linear ADC_CODES doesnt change, the effective or useful  
resolution of the device is dependent on the conversion time setting and the full-scale range as per the table  
below. In conversion times where the effective resolution is lower, the LSBs are padded with 0.  
8-5. Resolution Table  
EXPONENT  
0
1
2
3
4
5
6
MANTES  
SA  
effective  
bits  
CONVERSION_ Conversion  
Full-scale  
lux  
2254  
4509  
9018  
18036  
36071  
72142  
144284  
TIME register  
Time  
Effective Resolution in lux  
0
1
600 us  
1 ms  
9
4.4  
8.8  
4.4  
17.6  
8.8  
35.2  
17.6  
70.45  
35.2  
140.9  
70.45  
35.2  
281.8  
140.9  
70.45  
35.2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
2.2  
2
1.8 ms  
3.4 ms  
6.5 ms  
12.7 ms  
25 ms  
1.1  
2.2  
4.4  
8.8  
17.6  
3
550.4 m  
275.2 m  
137.6 m  
68.8 m  
34.4 m  
17.2 m  
8.6 m  
1.1  
2.2  
4.4  
8.8  
17.6  
4
550.4 m  
275.2 m  
137.6 m  
68.8 m  
34.4 m  
17.2 m  
8.6 m  
4.30 m  
1.1  
2.2  
4.4  
8.8  
17.6  
5
550.4 m  
275.2 m  
137.6 m  
68.8 m  
34.4 m  
17.2 m  
8.6 m  
1.1  
2.2  
4.4  
8.8  
6
550.4 m  
275.2 m  
137.6 m  
68.8 m  
34.4 m  
17.2 m  
1.1  
2.2  
4.4  
7
50 ms  
550.4 m  
275.2 m  
137.6 m  
68.8 m  
34.4 m  
1.1  
2.2  
8
100 ms  
200 ms  
400 ms  
800 ms  
550.4 m  
275.2 m  
137.6 m  
68.8 m  
1.1  
9
550.4 m  
275.2 m  
137.6 m  
10  
11  
4.30 m  
2.15 m  
As shown in the table above the resolution of the device is dependent on the CONVERSION_TIME and full-  
scale range. A similar scaling applies to the peak responsitivity for each channel.  
8.3.4.7 Programming  
The OPT4048 supports the transmission protocol for standard mode (up to 100 kHz), fast mode (up to 400 kHz),  
and high-speed mode (up to 2.6 MHz). Fast and standard modes are described as the default protocol, referred  
to as F/S. High-speed mode is described in the 8.3.4.7.2.1.  
8.3.4.7.1 I2C Bus Overview  
The OPT4048 offers compatibility with both I2C and SMBus interfaces. The I2C and SMBus protocols are  
essentially compatible with one another. The I2C interface is used throughout this document as the primary  
example with the SMBus protocol specified only when a difference between the two protocols is discussed.  
The device is connected to the bus with two pins: an SCL clock input pin and an SDA open-drain bidirectional  
data pin. The bus must have a controller device that generates the serial clock (SCL), controls the bus access,  
and generates start and stop conditions. To address a specific device, the controller initiates a start condition by  
pulling the data signal line (SDA) from a high logic level to a low logic level while SCL is high. All targets on the  
bus shift in the target address byte on the SCL rising edge, with the last bit indicating whether a read or write  
operation is intended. During the ninth clock pulse, the target being addressed responds to the controller by  
generating an acknowledge bit by pulling SDA low.  
Data transfer is then initiated and eight bits of data are sent, followed by an acknowledge bit. During data  
transfer, SDA must remain stable while SCL is high. Any change in SDA while SCL is high is interpreted as a  
start or stop condition. When all data are transferred, the controller generates a stop condition, indicated by  
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pulling SDA from low to high while SCL is high. The device includes a 28-ms timeout on the I2C interface to  
prevent locking up the bus. If the SCL line is held low for this duration of time, the bus state machine is reset.  
8.3.4.7.1.1 Serial Bus Address  
To communicate with the OPT4048, the controller must first initiate an I2C start command. Then, the controller  
must address target devices via a target address byte. The target address byte consists of a seven bit address  
and a direction bit that indicates whether the action is to be a read or write operation.  
Four I2C addresses are possible by connecting the ADDR pin to one of four pins: GND, VDD, SDA, or SCL.  
Table below summarizes the possible addresses with the corresponding ADDR pin configuration. The state of  
the ADDR pin is sampled on every bus communication and must be driven or connected to the desired level  
before any activity on the interface occurs.  
ADDR PIN CONNECTION  
DEVICE I2C ADDRESS  
GND  
VDD  
SDA  
SCL  
1000100  
1000101  
1000110  
1000101  
8.3.4.7.1.2 Serial Interface  
The OPT4048 operates as a target device on both the I2C bus and SMBus. Connections to the bus are made via  
the SCL clock input line and the SDA open-drain I/O line. The device supports the transmission protocol for  
standard mode (up to 100 kHz), fast mode (up to 400 kHz), and high-speed mode (up to 2.6 MHz). All data bytes  
are transmitted most-significant bits first.  
The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the effects  
of input spikes and bus noise. See the 9.2.1 for further details of the I2C bus noise immunity.  
8.3.4.7.2 Writing and Reading  
Accessing a specific register on the OPT4048 is accomplished by writing the appropriate register address during  
the I2C transaction sequence. Refer to 8.4 for a complete list of registers and their corresponding register  
addresses. The value for the register address (as shown in 8.4) is the first byte transferred after the target  
address byte with the R/W bit low.  
1
9
1
9
SCL  
SDA  
RA RA RA RA RA RA RA RA  
A0  
A1  
1
0
0
0
1
R/W  
7
6
5
4
3
2
1
0
Stop by  
Controller  
(optional)  
Start by  
Controller  
ACK by  
Device  
ACK by  
Device  
Frame 1: Two-Wire Device Address Byte (1)  
Frame 2: Register Address Byte  
8-3. Setting the I2C Register Address  
Writing to a register begins with the first byte transmitted by the controller. This byte is the target address with  
the R/W bit low. The device then acknowledges receipt of a valid address. The next byte transmitted by the  
controller is the address of the register that data are to be written to. The next two bytes are written to the  
register addressed by the register address. The device acknowledges receipt of each data byte. The controller  
can terminate the data transfer by generating a start or stop condition.  
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When reading from the device, the last value stored in the register address by a write operation determines  
which register is read during a read operation. To change the register address for a read operation, a new partial  
I2C write transaction must be initiated. This partial write is accomplished by issuing a target address byte with  
the R/W bit low, followed by the register address byte and a stop command. The controller then generates a start  
condition and sends the target address byte with the R/W bit high to initiate the read command. The next byte is  
transmitted by the target and is the most significant byte of the register indicated by the register address. This  
byte is followed by an acknowledge from the controller; then the target transmits the least significant byte. The  
controller acknowledges receipt of the data byte. The controller can terminate the data transfer by generating a  
not-acknowledge after receiving any data byte, or by generating a start or stop condition. If repeated reads from  
the same register are desired, continually sending the register address bytes is not necessary; the device retains  
the register address until that number is changed by the next write operation.  
8-4and 8-5show the write and read operation timing diagrams, respectively. Note that register bytes are  
sent most significant byte first, followed by the least significant byte.  
1
9
1
9
1
9
1
9
SCL  
SDA  
RA RA RA RA RA RA RA RA  
A0  
A1  
1
0
0
0
1
R/W  
D15 D14 D13 D12 D11 D10 D9 D8  
D7 D6 D5 D4 D3 D2 D1 D0  
7
6
5
4
3
2
1
0
Start by  
Controller  
ACK by  
Device  
ACK by  
Device  
ACK by  
Device  
Stop by  
Controller  
ACK by  
Device  
Frame 1 Two-Wire Device Address Byte (1)  
Frame 2 Register Address Byte  
Frame 3 Data MSByte  
Frame 4 Data LSByte  
8-4. I2C Write Example  
1
9
1
9
1
9
SCL  
SDA  
A1  
A0  
R/W  
1
0
0
0
1
D15 D14 D13 D12 D11 D10 D9 D8  
D7 D6 D5 D4 D3 D2 D1 D0  
No ACK  
by  
Controller(2)  
Stop by  
Controller  
Start by  
Controller  
ACK by  
Device  
From  
Device  
ACK by  
Controller  
From Device  
Frame 1 Two-Wire Device Address Byte (1)  
Frame 2 Data MSByte  
Frame 3 Data LSByte  
A. An ACK by the controller can also be sent.  
8-5. I2C Read Example  
8.3.4.7.2.1 High-Speed I2C Mode  
When the bus is idle, both the SDA and SCL lines are pulled high by the pullup resistors or active pullup devices.  
The controller generates a start condition followed by a valid serial byte containing the high-speed (HS)  
controller code 0000 1XXXb. This transmission is made in either standard mode or fast mode (up to 400 kHz).  
The device does not acknowledge the HS controller code but does recognize the code and switches the internal  
filters to support a 2.6-MHz operation.  
The controller then generates a repeated start condition (a repeated start condition has the same timing as the  
start condition). After this repeated start condition, the protocol is the same as F/S mode, except that  
transmission speeds up to 2.6 MHz are allowed. Instead of using a stop condition, use repeated start conditions  
to secure the bus in HS mode. A stop condition ends the HS mode and switches all internal filters of the device  
to support the F/S mode.  
8.3.4.7.2.2 Burst Read Mode  
OPT4048 supports I2C burst read mode which helps in minimizing the number of transactions on the bus for  
efficient data transfer from the device to the controller.  
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Before considering the burst mode, a regular I2C read transaction involves an I2C write operation to the device  
read pointer, followed by the actual I2C read operation. With the output registers in continuous locations, writing  
the register pointer every 2 bytes takes up several clock cycles. With the burst mode enabled, the read pointer  
address is auto incremented after every register read (2 bytes), eliminating the need write operations to set the  
pointer for subsequent register reads.  
Burst mode can be enabled by setting the register I2C_BURST. When a STOP command is issued the pointer  
resets to the original register address before the auto-increments.  
Register Write Operation  
Register  
Address  
data[15:8]  
Target Address  
data[7:0]  
W
Register Read Operation  
Register  
Address  
Target Address  
data[15:8]  
data[7:0]  
data[7:0]  
R
R
Target Address  
W
pointer set  
Register Address  
Register  
Address  
Target Address  
data[15:8]  
Target Address W  
Register Address+2  
data[15:8]  
Register Address+1  
Start  
data[15:8]  
data[7:0]  
data[7:0]  
Stop  
Register Address+4  
data[15:8]  
data[7:0]  
Register Address+3  
data[15:8]  
Pointer reset to  
Register Address  
data[7:0]  
pointer auto increments by 1 every 2 bytes  
8-6. I2C Operations  
8.3.4.7.2.3 General-Call Reset Command  
The I2C general-call reset allows the host controller in one command to reset all devices on the bus that respond  
to the general-call reset command. The general call is initiated by writing to the I2C address 0 (0000 0000b). The  
reset command is initiated when the subsequent second address byte is 06h (0000 0110b). With this transaction,  
the device issues an acknowledge bit and sets all registers to the power-on-reset default condition.  
8.3.4.7.2.4 SMBus Alert Response  
The SMBus alert response provides a quick identification for which device issued the interrupt. Without this alert  
response capability, the processor does not know which device pulled the interrupt line when there are multiple  
target devices connected.  
OPT4048 is designed to respond to the SMBus alert response address, when in the latched window-style  
comparison mode. The OPT4048 does not respond to the SMBus alert response when in transparent mode.  
The response behavior of the device to the SMBus alert response is shown in 8-7. When the interrupt line to  
the processor is pulled to active, the controller can broadcast the alert response target address. Following this  
alert response, any target devices that generated an alert identify themselves by acknowledging the alert  
response and sending respective I2C address on the bus. The alert response can activate several different  
target devices simultaneously. If more than one target attempts to respond, bus arbitration rules apply. The  
device with the lowest address wins the arbitration. If the OPT4048 loses the arbitration, the device does not  
acknowledge the I2C transaction and the INT pin remains in an active state, prompting the I2C controller  
processor to issue a subsequent SMBus alert response. When the OPT4048 wins the arbitration, the device  
acknowledges the transaction and sets the INT pin to inactive. The controller can issue that same command  
again, as many times as necessary to clear the INT pin. See 8.3.4.2 for additional details of how the flags and  
INT pin are controlled. The controller can obtain information about the source of the OPT4048 interrupt from the  
address broadcast in the above process. The FLAG_H value is sent as the final LSB of the address to provide  
the controller additional information about the cause of the OPT4048 interrupt. If the controller requires  
additional information, the result register or the configuration register can be queried. The FLAG_Hand FLAG_L  
registers are not cleared upon an SMBus alert response.  
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INT  
1
9
1
9
SCL  
SDA  
FH(1)  
0
0
0
1
1
0
0
R/ W  
1
0
0
0
1
A1  
A0  
Start By  
ACK By  
Device  
From  
Device  
NACK By  
Controller  
Stop By  
Controller  
Controller  
Frame 2 Target Address Byte(2)  
Frame 1 SMBus ALERT Response Address Byte  
A. FH is the FLAG_H register  
B. A1 and A0 are determined by the ADDR pin  
8-7. Timing Diagram for SMBus Alert Response  
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8.4 Register Maps  
8-8. ALL Register Map  
ADD  
00h  
01h  
02h  
03h  
04h  
05h  
06h  
07h  
08h  
09h  
0Ah  
0Bh  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
EXPONENT_CH0  
EXPONENT_CH1  
EXPONENT_CH2  
EXPONENT_CH3  
RESULT_MSB_CH0  
COUNTER_CH0  
RESULT_LSB_CH0  
RESULT_LSB_CH1  
RESULT_LSB_CH2  
RESULT_LSB_CH3  
CRC_CH0  
CRC_CH1  
CRC_CH2  
CRC_CH3  
RESULT_MSB_CH1  
COUNTER_CH1  
RESULT_MSB_CH2  
COUNTER_CH2  
RESULT_MSB_CH3  
COUNTER_CH3  
THRESHOLD_L_EXPONENT  
THRESHOLD_L_RESULT  
THRESHOLD_H_RESULT  
THRESHOLD_H_EXPONENT  
0
QWAKE  
RANGE  
128  
CONVERSION_TIME  
OPERATING_MODE  
THRESHOLD_CH_SEL INT_DIR  
LATCH  
INT_POL  
FAULT_COUNT  
INT_CFG  
OVERLOAD CONVERSI  
0
I2C_BURST  
FLAG_L  
0
FLAG_H  
_FLAG  
ON_READY  
_FLAG  
0Ch  
11h  
0
DIDL  
DIDH  
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8.4.1 ALL Register Map  
8.4.1.1 Register 0h (offset = 0h) [reset = 0h]  
8-9. Register 0h  
15  
7
14  
EXPONENT_CH0  
R-0h  
13  
12  
11  
10  
9
8
0
RESULT_MSB_CH0  
R-0h  
6
5
4
3
2
1
RESULT_MSB_CH0  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-10. Register 00 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
EXPONENT output CH0. Determines the full-scale range of  
the light measurement for the channel.  
15-12  
EXPONENT_CH0  
R
0h  
Result register MSB (Most significant bits) CH0. Used to  
calculate the MANTISSA representing light level within a  
given EXPONENT or full-scale range  
RESULT_MSB_C  
H0  
11-0  
R
0h  
8.4.1.2 Register 1h (offset = 1h) [reset = 0h]  
8-11. Register 1h  
15  
14  
13  
12  
11  
10  
2
9
1
8
0
RESULT_LSB_CH0  
R-0h  
7
6
5
4
3
COUNTER_CH0  
R-0h  
CRC_CH0  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-12. Register 01 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
Result register LSB(Least significant bits) CH0. Used to  
calculate MANTISSA representing light level within a given  
EXPONENT or full-scale range  
RESULT_LSB_C  
H0  
15-8  
R
0h  
Sample counter CH0. Rolling counter which increments for  
every conversion  
7-4  
3-0  
COUNTER_CH0  
CRC_CH0  
R
R
0h  
0h  
CRC bits CH0.  
R[19:0]=(RESULT_MSB_CH0[11:0]<<8)+RESULT_LSB_C  
H0[7:0]  
X[0]=XOR(EXPONENT_CH0[3:0],R[19:0],CRC_CH0[3:0])  
XOR of all bits  
X[1]=XOR(CRC_CH0[1],CRC_CH0[3],R[1],R[3],R[5],R[7],  
R[9],R[11],R[13],R[15],R[17],R[19],E[1],E[3])  
X[2]=XOR(CRC_CH0[3],R[3],R[7],R[11],R[15],R[19],E[3])  
X[3]=XOR(R[3],R[11],R[19])  
8.4.1.3 Register 2h (offset = 2h) [reset = 0h]  
8-13. Register 2h  
15  
14  
13  
12  
11  
10  
9
8
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8-13. Register 2h (continued)  
EXPONENT_CH1  
R-0h  
RESULT_MSB_CH1  
R-0h  
7
6
5
4
3
2
1
0
RESULT_MSB_CH1  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-14. Register 02 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
EXPONENT output CH1. Determines the full-scale range of  
the light measurement for the channel.  
15-12  
EXPONENT_CH1  
R
0h  
Result register MSB (Most significant bits) CH1. Used to  
calculate the MANTISSA representing light level within a  
given EXPONENT or full-scale range  
RESULT_MSB_C  
H1  
11-0  
R
0h  
8.4.1.4 Register 3h (offset = 3h) [reset = 0h]  
8-15. Register 3h  
15  
14  
13  
12  
11  
10  
2
9
1
8
0
RESULT_LSB_CH1  
R-0h  
7
6
5
4
3
COUNTER_CH1  
R-0h  
CRC_CH1  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-16. Register 03 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
Result register LSB(Least significant bits) CH1. Used to  
calculate MANTISSA representing light level within a given  
EXPONENT or full-scale range  
RESULT_LSB_C  
H1  
15-8  
R
0h  
Sample counter CH1. Rolling counter which increments for  
every conversion  
7-4  
3-0  
COUNTER_CH1  
CRC_CH1  
R
R
0h  
0h  
CRC bits CH1.  
R[19:0]=(RESULT_MSB_CH1[11:0]  
<<8)+RESULT_LSB_CH1[7:0]  
X[0]=XOR(EXPONENT_CH1[3:0],R[19:0],CRC_CH1[3:0])  
XOR of all bits  
X[1]=XOR(CRC_CH1[1],CRC_CH1[3],R[1],R[3],R[5],R[7],  
R[9],R[11],R[13],R[15],R[17],R[19],E[1],E[3])  
X[2]=XOR(CRC_CH1[3],R[3],R[7],R[11],R[15],R[19],E[3])  
X[3]=XOR(R[3],R[11],R[19])  
8.4.1.5 Register 4h (offset = 4h) [reset = 0h]  
8-17. Register 4h  
15  
14  
EXPONENT_CH2  
R-0h  
13  
12  
11  
10  
9
8
0
RESULT_MSB_CH2  
R-0h  
7
6
5
4
3
2
1
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8-17. Register 4h (continued)  
RESULT_MSB_CH2  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-18. Register 04 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
EXPONENT output CH2. Determines the full-scale range of  
the light measurement for the channel.  
15-12  
EXPONENT_CH2  
R
0h  
Result register MSB (Most significant bits) CH2. Used to  
calculate the MANTISSA representing light level within a  
given EXPONENT or full-scale range  
RESULT_MSB_C  
H2  
11-0  
R
0h  
8.4.1.6 Register 5h (offset = 5h) [reset = 0h]  
8-19. Register 5h  
15  
14  
13  
12  
11  
10  
2
9
1
8
0
RESULT_LSB_CH2  
R-0h  
7
6
5
4
3
COUNTER_CH2  
R-0h  
CRC_CH2  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-20. Register 05 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
Result register LSB(Least significant bits) CH2. Used to  
calculate MANTISSA representing light level within a given  
EXPONENT or full-scale range  
RESULT_LSB_C  
H2  
15-8  
R
0h  
Sample counter CH2. Rolling counter which increments for  
every conversion  
7-4  
3-0  
COUNTER_CH2  
CRC_CH2  
R
R
0h  
0h  
CRC bits CH2.  
R[19:0]=(RESULT_MSB_CH2[11:0]<<8)+RESULT_LSB_C  
H2[7:0]  
X[0]=XOR(EXPONENT_CH2[3:0],R[19:0],CRC_CH2[3:0])  
XOR of all bits  
X[1]=XOR(CRC_CH2[1],CRC_CH2[3],R[1],R[3],R[5],R[7],  
R[9],R[11],R[13],R[15],R[17],R[19],E[1],E[3])  
X[2]=XOR(CRC_CH2[3],R[3],R[7],R[11],R[15],R[19],E[3])  
X[3]=XOR(R[3],R[11],R[19])  
8.4.1.7 Register 6h (offset = 6h) [reset = 0h]  
8-21. Register 6h  
15  
14  
EXPONENT_CH3  
R-0h  
13  
12  
11  
10  
9
8
0
RESULT_MSB_CH3  
R-0h  
7
6
5
4
3
2
1
RESULT_MSB_CH3  
R-0h  
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LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-22. Register 06 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
EXPONENT output CH3. Determines the full-scale range of  
the light measurement for the channel.  
15-12  
EXPONENT_CH3  
R
0h  
Result register MSB (Most significant bits) CH3. Used to  
calculate the MANTISSA representing light level within a  
given EXPONENT or full-scale range  
RESULT_MSB_C  
H3  
11-0  
R
0h  
8.4.1.8 Register 7h (offset = 7h) [reset = 0h]  
8-23. Register 7h  
15  
14  
13  
12  
11  
10  
2
9
1
8
0
RESULT_LSB_CH3  
R-0h  
7
6
5
4
3
COUNTER_CH3  
R-0h  
CRC_CH3  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-24. Register 07 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
Result register LSB(Least significant bits) CH3. Used to  
calculate MANTISSA representing light level within a given  
EXPONENT or full-scale range  
RESULT_LSB_C  
H3  
15-8  
R
0h  
Sample counter CH3. Rolling counter which increments for  
every conversion  
7-4  
3-0  
COUNTER_CH3  
CRC_CH3  
R
R
0h  
0h  
CRC bits CH3.  
R[19:0]=(RESULT_MSB_CH3[11:0]<<8)+RESULT_LSB_C  
H3[7:0]  
X[0]=XOR(EXPONENT_CH3[3:0],R[19:0],CRC_CH3[3:0])  
XOR of all bits  
X[1]=XOR(CRC_CH3[1],CRC_CH3[3],R[1],R[3],R[5],R[7],  
R[9],R[11],R[13],R[15],R[17],R[19],E[1],E[3])  
X[2]=XOR(CRC_CH3[3],R[3],R[7],R[11],R[15],R[19],E[3])  
X[3]=XOR(R[3],R[11],R[19])  
8.4.1.9 Register 8h (offset = 8h) [reset = 0h]  
8-25. Register 8h  
15  
14  
13  
12  
11  
10  
9
8
0
THRESHOLD_L_EXPONENT  
R/W-0h  
THRESHOLD_L_RESULT  
R/W-0h  
7
6
5
4
3
2
1
THRESHOLD_L_RESULT  
R/W-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
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8-26. Register 08 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
THRESHOLD_L_  
EXPONENT  
15-12  
R/W  
0h  
Threshold low register exponent  
THRESHOLD_L_  
RESULT  
11-0  
R/W  
0h  
Threshold low register result  
8.4.1.10 Register 9h (offset = 9h) [reset = BFFFh]  
8-27. Register 9h  
15  
14  
13  
12  
11  
10  
9
8
0
THRESHOLD_H_EXPONENT  
R/W-Bh  
THRESHOLD_H_RESULT  
R/W-Fh  
7
6
5
4
3
2
1
THRESHOLD_H_RESULT  
R/W-FFh  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-28. Register 09 Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
THRESHOLD_H_  
EXPONENT  
15-12  
R/W  
Bh  
Threshold high register exponent  
Threshold high register result  
THRESHOLD_H_  
RESULT  
11-0  
R/W  
FFFh  
8.4.1.11 Register Ah (offset = Ah) [reset = 3208h]  
8-29. Register Ah  
15  
14  
13  
12  
11  
10  
9
8
QWAKE  
R/W-0h  
0
RANGE  
R/W-Ch  
CONVERSION_TIME  
R/W-2h  
W-0h  
7
6
5
4
3
2
1
0
CONVERSION_TIME  
R/W-0h  
OPERATING_MODE  
R/W-0h  
LATCH  
R/W-1h  
INT_POL  
R/W-0h  
FAULT_COUNT  
R/W-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-30. Register 0A Field Descriptions  
Bit  
Field  
QWAKE  
0
Type  
R/W  
W
Reset  
Description  
Quick Wake-up from Standby in one shot mode by not  
powering down all circuits. Applicable only in One-shot  
mode and helps get out of standby mode faster with penalty  
in power consumption compared to full standby mode.  
15-15  
14-14  
0h  
0h  
Must read or write 0  
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8-30. Register 0A Field Descriptions (continued)  
Bit  
Field  
Type  
Reset  
Description  
Controls the full-scale light level range of the device. The  
format of this register is same as the EXPONENT register  
for all values from 0 to 6.  
0 : 2.2klux  
1 : 4.5kux  
13-10  
RANGE  
R/W  
Ch  
2 : 9klux  
3 : 18klux  
4 : 36klux  
5 : 72klux  
6 : 144klux  
12 : Auto-Range  
Controls the device conversion time per channel  
0 : 600 us  
1 : 1 ms  
2 : 1.8 ms  
3 : 3.4 ms  
4 : 6.5 ms  
5 : 12.7 ms  
6 : 25 ms  
7 : 50 ms  
8 : 100 ms  
9 : 200 ms  
10 : 400 ms  
11 : 800 ms  
CONVERSION_TI  
ME  
9-6  
R/W  
8h  
Controls device mode of operation  
0 : Power-down  
1 : Forced auto-range OneShot  
2 : OneShot  
OPERATING_MO  
DE  
5-4  
R/W  
0h  
3 : Continuous  
Controls the functionality of the interrupt reporting  
mechanisms for INT pin for the threshold detection logic.  
3-3  
2-2  
LATCH  
R/W  
R/W  
1h  
0h  
Controls the polarity or active state of the INT pin.  
0 : Active Low  
INT_POL  
1 : Active High  
Fault count register instructs the device as to how many  
consecutive fault events are required to trigger the  
threshold mechanisms: the flag high (FLAG_H) and the flag  
low (FLAG_L) registers.  
1-0  
FAULT_COUNT  
R/W  
0h  
0 : One fault Count  
1 : Two Fault Counts  
2 : Four Fault Counts  
3 : Eight Fault Counts  
8.4.1.12 Register Bh (offset = Bh) [reset = 8011h]  
8-31. Register Bh  
15  
14  
13  
12  
11  
10  
0
9
0
8
0
1
0
0
0
0
R/W-1h  
R/W-0h  
W-0h  
W-0h  
W-0h  
R/W-0h  
R/W-0h  
R/W-0h  
7
0
6
5
4
3
2
1
0
0
THRESHOLD_CH_SEL  
R/W-0h  
INT_DIR  
R/W-1h  
INT_CFG  
R/W-0h  
I2C_BURST  
R/W-1h  
R/W-0h  
R/W-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-32. Register 0B Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
15-7  
128  
R/W  
80h  
Must read or write 128  
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8-32. Register 0B Field Descriptions (continued)  
Bit  
Field  
Type  
Reset  
Description  
Channel select for threshold logic  
0 : CH0 Selected  
1 : CH1 Selected  
THRESHOLD_CH  
_SEL  
6-5  
R/W  
0h  
2 : CH2 Selected  
3 : CH3 Selected  
Determines the direction of the INT pin.  
4-4  
3-2  
INT_DIR  
INT_CFG  
R/W  
R/W  
1h  
0h  
0 : Input  
1 : Output  
Controls the output interrupt mechanism after end of  
conversion  
0 : SMBUS Alert  
1 : INT Pin data ready for next channel  
3 : INT Pin data ready for all channels  
1-1  
0-0  
0
R/W  
R/W  
0h  
1h  
Must read or write 0  
When set enables I2C burst mode minimizing I2C read  
cycles by auto incrementing read register point by 1 after  
every register read  
I2C_BURST  
8.4.1.13 Register Ch (offset = Ch) [reset = 0h]  
8-33. Register Ch  
15  
14  
13  
12  
11  
10  
0
9
0
8
0
0
0
0
0
0
R/W-0h  
R/W-0h  
R/W-0h  
R/W-0h  
R/W-0h  
R/W-0h  
R/W-0h  
R/W-0h  
7
0
6
0
5
0
4
0
3
2
1
0
OVERLOAD_F CONVERSION  
FLAG_H  
FLAG_L  
LAG  
_READY_FLAG  
R/W-0h  
R/W-0h  
R/W-0h  
R/W-0h  
R-0h  
R-0h  
R-0h  
R-0h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-34. Register 0C Field Descriptions  
Bit  
Field  
Type  
Reset  
Description  
15-4  
0
R/W  
0h  
Must read or write 0  
Indicates when an overflow condition occurs in the data  
conversion process, typically because the light illuminating  
the device exceeds the full-scale range.  
OVERLOAD_FLA  
G
3-3  
2-2  
R
R
0h  
0h  
Conversion ready flag indicates when a conversion  
completes. The flag is set to 1 at the end of a conversion  
and is cleared (set to 0) when register address 0xA is either  
read or written with any non-zero value  
CONVERSION_R  
EADY_FLAG  
0 : Conversion in progress  
1 : Conversion is complete  
Flag high register identifies that the result of a conversion is  
measurement than a specified level of interest. FLAG_H is  
set to 1 when the result is larger than the level in the  
THRESHOLD_H_EXPONENT and  
1-1  
FLAG_H  
R
0h  
THRESHOLD_H_RESULT registers for a consecutive  
number of measurements defined by the FAULT_COUNT  
register.  
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8-34. Register 0C Field Descriptions (continued)  
Bit  
Field  
Type  
Reset  
Description  
Flag low register identifies that the result of a measurement  
is smaller than a specified level of interest. FLAG_L is set  
to 1 when the result is smaller than the level in the  
THRESHOLD_L_EXPONENT and  
0-0  
FLAG_L  
R
0h  
THRESHOLD_L_RESULT registers for a consecutive  
number of measurements defined by the FAULT_COUNT  
register.  
8.4.1.14 Register 11h (offset = 11h) [reset = 820h]  
8-35. Register 11h  
15  
14  
13  
12  
11  
10  
2
9
1
8
0
0
0
DIDL  
R-0h  
DIDH  
R-8h  
R/W-0h  
R/W-0h  
7
6
5
4
3
DIDH  
R-21h  
LEGEND: R/W = Read/Write; W = Write only; -n = value after reset  
8-36. Register 11 Field Descriptions  
Bit  
Field  
0
Type  
R/W  
R
Reset  
Description  
15-14  
13-12  
11-0  
0h  
Must read or write 0  
Device ID L  
DIDL  
DIDH  
8h  
R
21h  
Device ID H  
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9 Application and Implementation  
备注  
以下应用部分中的信息不属TI 器件规格的范围TI 不担保其准确性和完整性。TI 的客 户应负责确定  
器件是否适用于其应用。客户应验证并测试其设计以确保系统功能。  
9.1 Application Information  
Color sensors are used in a wide variety of applications that require precise measurement of light as perceived  
by human eye, since the color sensors have a specialized filter that mimic human eye. The following sections  
shows crucial information about integrating OPT4048 in applications.  
There are two categories of interface to the OPT4048: electrical and optical.  
9.2 Typical Application  
9.2.1 Electrical Interface  
The electrical interface is quite simple, as illustrated in 9-1below. Connect the OPT4048 I2C SDA and SCL  
pins to the same pins of an applications processor, micro controller, or other digital processor. If that digital  
processor requires an interrupt resulting from an event of interest from theOPT4048, then connect the INT pin to  
either an interrupt or general-purpose I/O pin of the processor. There are multiple uses for this INT pin, including  
triggering a measurement on one-shot mode, signaling the system to wake up from low-power mode, processing  
other tasks while waiting for an ambient light event of interest, or alerting the processor that a sample is ready to  
be read. Connect pullup resistors between a power supply appropriate for digital communication and the SDA  
and SCL pins (because the pins have open-drain output structures). If the INT pin is used, connect a pullup  
resistor to the INT pin. A typical value for these pullup resistors is 10 kΩ. The resistor choice can be optimized in  
conjunction to the bus capacitance to balance the system speed, power, noise immunity, and other  
requirements.  
Short or Open  
VIO: 1.6V to 5V  
0.1uF  
10k  
10k  
10k  
VDD:1.6V to 3.6V  
VDD  
Ambient  
Light  
VIO  
OPT4048SDA  
SDA  
SCL  
SCL  
GPIO/TimerPin  
INT  
ADDR  
Controller  
GND  
Micro Controller or Processor  
GND  
9-1. Typical Application Schematic  
The power supply and grounding considerations are discussed in the 9.4.  
Although spike suppression is integrated in the SDA and SCL pin circuits, use proper layout practices to  
minimize the amount of coupling into the communication lines. One possible introduction of noise occurs from  
capacitively coupling signal edges between the two communication lines themselves. Another possible noise  
introduction comes from other switching noise sources present in the system, especially for long communication  
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lines. In noisy environments, shield communication lines to reduce the possibility of unintended noise coupling  
into the digital I/O lines that can be incorrectly interpreted.  
9.2.2 Design Requirements  
9.2.2.1 Optical Interface  
1
8
A
A
0.39  
Section A  
9-2. Sensor Position  
Any physical component that affects the light which illuminates the sensing area of a light sensor also affects the  
performance of that light sensor. Therefore, for the best performance, make sure to understand and control the  
effect of these components. Design a window width and height to permit light from a sufficient field of view to  
illuminate the sensor. For best performance, use a field of view of at least ±35°, or preferably ±45° or more.  
Understanding and designing the field of view is discussed further in application report OPT3001: Ambient Light  
Sensor Application Guide (SBEA002)..  
9.2.3 Detailed Design Procedure  
9.2.3.1 Optomechanical Design  
After completing the electrical design, the next task is the optomechanical design. Window sizing and placement  
is discussed in more rigorous detail in OPT3001: Ambient Light Sensor Application Guide.  
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9.2.4 Application Curves  
Matrix values for Color determination  
ADC measurements from OPT4048 channels can be used to determine the intensity (lux) and the color (CIE X,Y  
coordinates) as per specified in 8.3.4.5. Here is an example of such measurements performed an RGB LED  
source TI LP5036EVM. The intensity of the Red, Green and Blue LEDs were varied independently and the  
corresponding color coordinates detected by OPT4048 (CIEx,CIEy) are plotted on the CIE XY and CIE UV color  
space.  
9-3. CIE XY and CIE UV space plots of color coordinates  
Value of matrix used for this calculation is as shown below  
2 . 34892992e 04 1.89652390e 05 1.20811684e 05  
0
4.07467441e 05 1.98958202e 04 1.58848115e 05 2.15e 3  
(16)  
9.28619404e 05 1.69739553e 05 6.74021520e 04  
0
0
0
0
0
Correlated Color Temperature  
The CIE XY and CIE UV color spaces shown in 9-3 and 9-4 has been annotated with the ideal black body  
curve and intersecting iso-thermal lines. The ideal black body curve represents the color perceived by human  
eye in CIE YX and CIE UV spaces when an ideal black body of certain Kelvins emit radiation. The intersecting  
lines with various kelvin markings are iso-thermal lines which represent the same color temperature and is  
commonly referred to as Correlated Color Temperature (CCT). CCT is a representation of how warm or cool a  
color source is which is a common terminology used in classifying light bulbs. CCT is often valid only around the  
ideal black body curve and does not make sense when there is too much deviation. Any color coordinate close  
to the ideal black body curve can be represented as having a particular CCT by using the formula below:  
3
2
CCT = 437n + 3601n + 6861n + 5517  
(17)  
where n is defined as  
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CIEx − 0.3320  
n =  
(18)  
0.1858 − CIEy  
These are highly non-linear functions and the estimation of the CCT is very sensitive to the CIE X and CIE Y  
coordinates. Small errors due to non-ideality in the system can cause an amplified error in CCT estimation.  
Set of off the shelf lamp sources were taken and the CCT values measured by OPT4048 is shown below.  
9-4. CIE XY and CIE UV Space Plots of Color Coordinates  
The CIE color space plots have been zoomed-in to see the points more clearly. The annotation in the plot specify  
the color temperature of the lamps as specified by the manufacturer. While the lamp manufacturers approximate  
the CCT in Kelvins to nearest 1000 s, 500 s or 100 s, OPT4048 estimates the CCT high resolution using the  
equations specified above.  
Color accuracy and the CCT accuracy can be further optimized based on the cavity design, cover glass and  
target application. More information is available at OPT4048.  
9.3 Do's and Don'ts  
As with any optical product, take special care when handling the OPT4048. The device is a piece of active  
silicon, without the mechanical protection of an epoxy-like package or other reinforcement. This design allows  
the device to be as thin as possible. Take extra care to handle the device gently to not crack or break the device.  
Use a properly-sized vacuum manipulation tool to handle the device.  
The optical surface of the device must be kept clean for best performance, both when prototyping with the  
device, and during mass production manufacturing procedures. Keep the optical surface clean of fingerprints,  
dust, and other optical-inhibiting contaminants.  
If the optical surface of the device requires cleaning, use a few gentle brushes with a soft swab of deionized  
water or isopropyl alcohol. Avoid potentially abrasive cleaning and manipulating tools and excessive force that  
can scratch the optical surface.  
If the OPT4048 performs less than optimally, then inspect the optical surface for dirt, scratches, or other optical  
artifacts.  
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9.4 Power Supply Recommendations  
Although the OPT4048 has low sensitivity to power-supply noise, good practices are always recommended. For  
best performance, the OPT4048 VDD pin must have a stable, low-noise power supply with a 100-nF bypass  
capacitor close to the device and solid grounding. There are many options for powering the OPT4048 because  
of the device low current consumption levels.  
9.5 Layout  
9.5.1 Layout Guidelines  
The PCB layout design for the OPT4048 requires a couple of considerations. Bypass the power supply with a  
capacitor placed close to the device. Note that optically reflective surfaces of components also affect the  
performance of the design. The three-dimensional geometry of all components and structures around the sensor  
must be taken into consideration to prevent unexpected results from secondary optical reflections. Placing  
capacitors and components at a distance of at least twice the height of the component is usually sufficient. The  
best optical layout is to place all close components on the opposite side of the PCB from the device. However,  
this approach is not practical for the constraints of every design.  
An example PCB layout with the OPT4048 is shown in 9-5.  
9.5.2 Layout Example  
OPT4048  
To VDD Power Supply  
To Processor  
Bypass Capacitor  
9-5. Example PCB Layout with the OPT4048 SOT-5X3 (8) Package  
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9.5.3 Soldering and Handling Recommendations  
Soldering temperature profile and guidelines are published in future revisions of this document.  
As with most optical devices, handle the OPT4048 with special care to ensure optical surfaces stay clean and  
free from damage. See 9.3 for more detailed recommendations. For best optical performance, solder flux and  
any other possible debris must be cleaned after soldering processes.  
备注  
The bottom side of the device features an angled feature to denote the PIN 1  
9-6. Identification Feature for PIN 1  
9-7. Identification Features for PIN 1 on Package  
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10 Device and Documentation Support  
10.1 Documentation Support  
10.1.1 Related Documentation  
OPT4048EVM User's Guide  
OPT3001: Ambient Light Sensor Application Guide  
10.2 接收文档更新通知  
要接收文档更新通知请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册即可每周接收产品信息更  
改摘要。有关更改的详细信息请查看任何已修订文档中包含的修订历史记录。  
10.3 支持资源  
TI E2E支持论坛是工程师的重要参考资料可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解  
答或提出自己的问题可获得所需的快速设计帮助。  
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范并且不一定反映 TI 的观点请参阅  
TI 《使用条款》。  
10.4 Trademarks  
TI E2Eis a trademark of Texas Instruments.  
所有商标均为其各自所有者的财产。  
10.5 Electrostatic Discharge Caution  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
10.6 术语表  
TI 术语表  
本术语表列出并解释了术语、首字母缩略词和定义。  
11 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
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PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
OPT4048DTSR  
OPT4048DTST  
ACTIVE  
ACTIVE  
SOT-5X3  
SOT-5X3  
DTS  
DTS  
8
8
3000 RoHS & Green  
250 RoHS & Green  
NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-40 to 85  
-40 to 85  
4048  
4048  
Samples  
Samples  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Dec-2022  
Addendum-Page 2  
PACKAGE OUTLINE  
FCSOT - 0.6 mm max height  
FLIPCHIP SOT  
DTS0008A  
1.3  
1.1  
B
A
PIN 1  
INDEX AREA  
1
8
7
6X (0.5)  
2
3
2.2  
2.0  
6
5
4
0.27  
8X  
0.17  
0.1  
C A B  
C
2.0  
1.8  
0.05  
SEATING PLANE  
0.18  
0.08  
C
0.6 MAX  
0.45  
8X  
0.05  
0.00  
0.25  
4
5
6
7
8
3
2
1
0.05 C  
4226132/B 07/2021  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Body dimensions do not incude mold flash, protrusions or gate burrs.  
Mold flash, interlead flash, protrusions or gate burrs shall not exceed 0.15 per end or side  
www.ti.com  
EXAMPLE BOARD LAYOUT  
FCSOT - 0.6 mm max height  
FLIPCHIP SOT  
DTS0008A  
(1.72)  
8X (0.72)  
8X (0.3)  
1
8
7
6
2
3
SYMM  
6X (0.5)  
5
4
SYMM  
(R0.05) TYP  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE: 30X  
METAL UNDER  
SOLDER MASK  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL  
NON SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4226132/B 07/2021  
NOTES: (continued)  
4. Publication IPC-7351 may have alternate designs.  
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
FCSOT - 0.6 mm max height  
FLIPCHIP SOT  
DTS0008A  
(1.72)  
8X (0.72)  
1
8
7
8X (0.3)  
2
3
SYMM  
6
5
6X (0.5)  
4
SYMM  
(R0.05) TYP  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE: 30X  
4226132/B 07/2021  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
7. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
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