OPT8241NBN [TI]

QVGA 分辨率 3D 飞行时间 (ToF) 传感器 | NBN | 78 | 0 to 70;


型号：	OPT8241NBN
厂家：	TEXAS INSTRUMENTS
描述：	QVGA 分辨率 3D 飞行时间 (ToF) 传感器 \| NBN \| 78 \| 0 to 70 PC 传感器
文件：	总35页 (文件大小：1602K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

OPT8241 3D 飞行时间传感器

1 特性

2 应用

•

成像阵列：

•

深度感测：

–

320 × 240 阵列

1/3” 光学格式

–

位置和临近感测

3D 扫描

像素间距：15µm

高达 150 帧/秒

3D 机器视觉

安全和监控

手势控制

•

光学属性：

–

响应度：850nm 时为 0.35A/W

解调对比度：50MHz 时为 45%

解调频率：10MHz 至 100MHz

增强现实和虚拟现实

3 说明

OPT8241 飞行时间 (ToF) 传感器属于 TI 3D ToF 图像

传感器系列。该器件将 ToF 感应功能与经优化设计的

模数转换器 (ADC) 和通用可编程定时发生器 (TG) 相

结合。该器件以高达 150 帧/秒的帧速率（600 读出/

秒）提供四分之一的视频图形阵列 (QVGA 320 x 240)

分辨率数据。

输出数据格式：

–

12 位相位相关数据

4 位共模（环境）

•

芯片集接口：

与 TI 的飞行时间控制器 OPT9221 兼容

传感器输出接口：

–

CMOS 数据接口（50MHz DDR，16 通道数

据、时钟和帧标记）

内置 TG 控制复位、调制、读出和数字化序列。 TG 具

备可编程性，可灵活优化各项深度感应性能指标（例如

功率、运动稳健性、信噪比和环境消除）。

–

LVDS：

–

600Mbps，3 个数据对

器件信息⁽¹⁾

1LVDS 位时钟对，1LVDS 采样时钟对

器件型号

OPT8241

封装

COG (78)

封装尺寸（标称值）

•

定时发生器 (TG)：

7.859mm × 8.757mm

–

可编程感兴趣区域 (ROI) 的寻址引擎

(1) 要了解所有可用封装，请参见数据表末尾的封装选项附录。

调制控制

抗混叠

方框图

主/从同步操作

用于控制的 I²C 从接口

OPT8241

DMIX0,

DMIX1

•

ILLUM_P

CLK Generator

MCLK

Mix Drivers

Modulation Block

ILLUM_N

电源：

ILLUM_EN

CLK,

CTRL

–

3.3V I/O，模拟

Row

Sensor Core

Addressing

Engine

Reset

1.8V 模拟，数字，I/O

1.5V 解调（典型值）

Column

CLK,

CTRL

Analog

Timing Generator

Analog Processing

•

经优化的光学封装 (COG-78)：

VD_IN

Temperature

Sensor

Analog

ADC

–

8.757mm × 7.859mm × 0.7mm

CLK,

CTRL

CLK,

CTRL

REG

I²C

集成光学带通滤波器

（830nm 至 867nm）

Digital

Serializer

LVDS

VD_FR

VD_QD

VD_SF

–

便于对齐的光学基准点

Output Block

CMOS Data

CLKOUT

HD_QD

工作温度范围：0°C 至 70°C

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SBAS704

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

7.3 Feature Description................................................. 12

7.4 Device Functional Modes........................................ 13

7.5 Programming .......................................................... 13

Application and Implementation ........................ 14

8.1 Application Information............................................ 14

8.2 Typical Applications ................................................ 15

Power Supply Recommendations...................... 24

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

Pin Configuration and Functions......................... 3

Specifications......................................................... 6

6.1 Absolute Maximum Ratings ...................................... 6

6.2 ESD Ratings.............................................................. 6

6.3 Recommended Operating Conditions....................... 6

6.4 Thermal Information.................................................. 7

6.5 Electrical Characteristics........................................... 7

6.6 Timing Requirements................................................ 8

6.7 Switching Characteristics.......................................... 8

6.8 Optical Characteristics .............................................. 9

6.9 Typical Characteristics............................................ 10

Detailed Description ............................................ 11

7.1 Overview ................................................................. 11

7.2 Functional Block Diagram ....................................... 11

10 Layout................................................................... 24

10.1 Layout Guidelines ................................................. 24

10.2 Layout Example .................................................... 26

10.3 Mechanical Assembly Guidelines ......................... 27

11 器件和文档支持 ..................................................... 28

11.1 文档支持................................................................ 28

11.2 社区资源................................................................ 28

11.3 商标....................................................................... 28

11.4 静电放电警告......................................................... 28

11.5 Glossary................................................................ 28

12 机械、封装和可订购信息....................................... 28

4 修订历史记录

注：之前版本的页码可能与当前版本有所不同。

Changes from Revision A (June 2015) to Revision B

Page

•

已通篇更改计算公式以更正格式 ............................................................................................................................................ 1

Changed name of Function column in Pin Functions table ................................................................................................... 4

Changed SCL and SDATA pin descriptions in Pin Functions table ...................................................................................... 5

Added parameter names to Sensor section of Electrical Characteristics table .................................................................... 7

Changed depth resolution description in Table 5 ................................................................................................................ 21

Changes from Original (June 2015) to Revision A

Page

•

已发布为量产数据................................................................................................................................................................... 1

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

5 Pin Configuration and Functions

NBN Package

COG-78

Top View (Representative, Not to Scale)

ILLUM_

AVDD_

PLL

GPO[0]

SDATA

GND

VMIXH

GND

VMIXH

GND

ILLUM_P ILLUM_N

DVDDH

GND

AVDDH

SUB_

BIAS

GPO[1]

VD_IN

SCLK

RSTZ

MCLK

DEMOD_

CLK

RFU

HD_QD

VD_QD

VD_FR

IOVSS

AVDD

TP2

QPORT

IOVDD

DVSS

AVSS

PVDD

AVSS_

PLL

REFM

REFP

AVDD

AVSS

IOVDD

AVSS

DVDD

SUM_M

DIFF1_M

DCLKM

CMOS[14]

CMOS[13]

CMOS[12]

VD_SF

CMOS[15]

CMOS[11]

TP1

SUM_P

DIFF1_P

CMOS[10] CMOS[9] CMOS[8] CLKOUT CMOS[7] CMOS[6] CMOS[5] CMOS[4] CMOS[3] CMOS[2] CMOS[1] CMOS[0] PCLK_P PCLK_M DIFF0_P DIFF0_M

DCLKP

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

Pin Functions

DESCRIPTION

NAME

AVDD

NO.

D3, G17

A18

A17

E3, H3, H17

F17

FUNCTION

I/O BANK

Power

GND

—

1.8-V analog VDD

AVDD_PLL

AVDDH

—

1.8-V PLL VDD

3.3-V analog VDD

Analog ground

PLL GND

—

AVSS

—

AVSS_PLL

CLKOUT

CMOS[0]

CMOS[1]

CMOS[2]

CMOS[3]

CMOS[4]

CMOS[5]

CMOS[6]

CMOS[7]

CMOS[8]

CMOS[9]

CMOS[10]

CMOS[11]

CMOS[12]

CMOS[13]

CMOS[14]

CMOS[15]

DCLKM

—

IOVDD

LVDS

Parallel data clock output

Parallel data output bit 0

Parallel data output bit 1

Parallel data output bit 2

Parallel data output bit 3

Parallel data output bit 4

Parallel data output bit 5

Parallel data output bit 6

Parallel data output bit 7

Parallel data output bit 8

Parallel data output bit 9

Parallel data output bit 10

Parallel data output bit 11

Parallel data output bit 12

Parallel data output bit 13

Parallel data output bit 14

Parallel data output bit 15

Negative LVDS bit clock

Positive LVDS bit clock

M13

M12

M11

M10

L19

DCLKP

M18

Demodulation clock input (optional).

This pin has a weak internal pulldown resistor.

DEMOD_CLK

C19

IOVDD

DIFF0_M

DIFF0_P

DIFF1_M

DIFF1_P

DVDD

M17

LVDS

—

Negative LVDS DIFF0 data pin

Positive LVDS DIFF0 data pin

Negative LVDS DIFF1 data pin

Positive LVDS DIFF1 data pin

1.8-V digital VDD

M16

K19

L17

H19

Power

GND

DVDDH

DVSS

A14

—

3.3-V digital VDD

G19

—

Digital GND

GND

A4, A7, A8, A11, A15

—

Ground

GPO[0]

GPO[1]

HD_QD

ILLUM_EN

ILLUM_N

ILLUM_P

IOVDD

DVDDH

—

General-purpose output

Quad-frame line sync output

Illumination enable

A16

A13

A12

H1, F19

Illumination modulation signal; active low

Illumination modulation signal; active high

1.8-V to 3.3-V IOVDD

Power

GND

IOVSS

—

I/O GND

Main clock input for TG.

This pin has a weak internal pulldown resistor.

MCLK

B19

IOVDD

A1, A19, C17, M1,

M19

—

No connection

PCLK_M

M15

LVDS

Negative LVDS pixel clock

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

Pin Functions (continued)

DESCRIPTION

NAME

PCLK_P

PVDD

NO.

M14

E17

FUNCTION

I/O BANK

LVDS

—

Positive LVDS pixel clock

Power

3.3-V pixel VDD

Debug port.

QPORT

REFM

REFP

E19

I/O

IOVDD

—

Pullup with an external 1-kΩ resistor to IOVDD instead.

Analog In

Analog Out

Connect REFM to GND

ADC reference; connect a 10-nF capacitor close to REFM and

REFP.

—

RFU

D17

RFU

—

IOVDD

—

Reserved for future use

RSTZ

Sensor reset input. This pin has a weak internal pullup resistor.

Clock I²C slave interface

Data I²C slave interface

SCL

SDATA

SUB_BIAS

SUM_M

SUM_P

TP1

I/O

B17

J19

K17

J17

D19

Power

Substrate bias

LVDS

—

Negative LVDS sum data

Positive LVDS sum data

Debug pin 1, connect to a test pad on the board

Debug pin 2, connect to a test pad on the board

Frame sync output

TP2

—

VD_FR

VD_IN

VD_QD

VD_SF

VMIXH

IOVDD

—

Frame sync input (optional)

Quad-frame sync output

Sub-frame sync output

A5, A6, A9, A10

Power

—

Mix driver power

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

MAX

UNIT

IOVDD

AVDDH

DVDDH

PVDD

AVDD

VMIXH

DVDD

AVDD_PLL

V_I

Digital I/O supply

Analog supply

4.0

Digital I/O supply

Pixel supply

4.0

Analog supply

2.2

Mix supply

2.5

Digital supply

2.2

PLL supply

2.2

Input voltage at input pins

Operating junction temperature

Storage temperature

VCC + 0.3⁽²⁾

T_J

125

°C

T_stg

–40

125

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) VCC refers to the I/O bank voltage.

6.2 ESD Ratings

VALUE

±1000

±250

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾

V_(ESD)

Electrostatic discharge

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

1.7

3.0

1.7

1.4

1.7

NOM

1.8 to 3.3

3.3

MAX

3.6

1.9

2.0

1.9

UNIT

IOVDD

AVDDH

DVDDH

PVDD

Digital I/O supply

Analog supply

Digital I/O supply

Pixel supply

3.3

AVDD

Analog supply

1.8

VMIXH

DVDD

AVDD_PLL

T_A

Mix supply

1.5

Digital supply

1.8

PLL supply

1.8

Operating ambient temperature

°C

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

6.4 Thermal Information

OPT8241

THERMAL METRIC⁽¹⁾

NBN (COG)

78 PINS

79.2

UNIT

Without underfill

With underfill

°C/W

R_θJA

Junction-to-ambient thermal resistance

41.0

R_θJC(top)

R_θJB

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

18.6

51.0

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

6.3

ψ_JB

51.1

R_θJC(bot)

18.6

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

All specifications at T_A= 25°C, V_AVDDH= 3.3 V, V_AVDD= 1.8 V, V_VMIXH= 1.5 V, V_DVDD= 1.8 V, V_DVDDH= 3.3 V, V_PVDD= 3.3 V,

V_{SUB_BIAS}= 0 V, integration duty cycle = 10%, system clock frequency = 48 MHz, modulation frequency = 50 MHz, and 850

nm illumination, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SENSOR

Maximum rows

240

Rows

Maximum columns

Pixel pitch

320 Columns

P_P

μm

POWER (Normal Operation)

I_{AVDD_PLL}

PLL supply current

Without dynamic power-down

With dynamic power-down

I_AVDD

Analog supply current

3.3-V digital supply current

3.3-V analog supply current

Pixel VDD current

I_DVDDH

I_AVDDH

I_PVDD

Without dynamic power-down

With dynamic power-down

10% integration duty cycle

100% integration duty cycle

600

I_VMIXH

Demodulation current

I/O supply current (CMOS mode)

I/O supply current (LVDS mode)

Digital supply current

I_IOVDD

I_DVDD

POWER (Standby)

I_IOVDD

I_{AVDD_PLL}

I_AVDD

I/O supply current

0.7

0.3

0.6

1.1

0.2

PLL supply current

Analog supply current

Digital supply current

3.3-V digital supply current

3.3-V analog supply current

Demodulation current

Pixel VDD current

I_DVDD

I_DVDDH

I_AVDDH

I_VMIXH

I_PVDD

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

Electrical Characteristics (continued)

All specifications at T_A= 25°C, V_AVDDH= 3.3 V, V_AVDD= 1.8 V, V_VMIXH= 1.5 V, V_DVDD= 1.8 V, V_DVDDH= 3.3 V, V_PVDD= 3.3 V,

V_{SUB_BIAS}= 0 V, integration duty cycle = 10%, system clock frequency = 48 MHz, modulation frequency = 50 MHz, and 850

nm illumination, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

CMOS I/Os

V_IH

V_IL

Input high-level threshold

Input low-level threshold

0.7 × VCC⁽¹⁾

0.3 × VCC⁽¹⁾

VCC⁽¹⁾– 0.45

VCC⁽¹⁾– 0.5

I_OH= –2 mA

V_OH

Output high level

Output Low Level

I_OH= –8 mA

I_OL= 2 mA

0.35

0.65

±50

V_OL

I_OL= 8 mA

Pins with pullup, pulldown resistor

I_I

Input pin leakage current

µA

Pins without pullup, pulldown

resistor

±10

C_I

Input capacitance

Output current

I_OH

I_OL

(1) VCC is equal to IOVDD or DVDDH, based on the I/O bank listed in the Pin Functions table.

6.6 Timing Requirements

MIN

NOM

MAX

52%

UNIT

MCLK duty cycle

48%

MCLK frequency

MHz

VD_IN pulse duration

RTSZ low pulse duration (reset)

2 × MCLK period

100

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted); V_DVDD= 1.8 V, V_DVDDH= 3.3 V, and V_IOVDD= 1.8 V

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

DDR LVDS MODE

t_SU

Data setup time

Data valid to zero crossing of DCLKP, DCLKM

Zero crossing of DCLKP, DCLKM to data becoming invalid

Rise time measured from –100 mV to +100 mV

0.48

0.54

0.35

t_H

Data hold time

t_FALL, t_RISE

Data fall time, data rise time

t_CLKRISE

t_CLKFALL

Output clock rise time,

output clock fall time

Rise time measured from –100 mV to +100 mV

0.35

PARALLEL CMOS MODE

t_SU

Data setup time

Data valid to zero crossing of CLKOUT

1.5

3.5

2.5

t_H

Data hold time

Zero crossing of CLKOUT to data becoming invalid

Rise time measured from 30% to 70% of IOVDD

t_FALL, t_RISE

Data fall time, data rise time

t_CLKRISE

t_CLKFALL

Output clock rise time,

output clock fall time

Rise time measured from 30% to 70% of IOVDD

2.2

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

6.8 Optical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

Glass side

TEST CONDITIONS

MIN

TYP

Top

MAX

UNIT

Side

0° incident angle

30° incident angle

0° incident angle

30° incident angle

813 to 893

798 to 877

830 to 881

838 to 867

Passband

(50% relative transmittance⁽¹⁾

)

Passband

(90% relative transmittance⁽¹⁾

)

AOI

Recommended angle of incidence

Maximum absolute transmittance

35 Degrees

0° incident angle

30° incident angle

87.34% at 863

81.89% at 855

(1) Relative transmittance is a ratio of transmittance to maximum absolute transmittance at the same angle of incidence.

DCLKM

Output Clock

DCLKP

t_SU

t_H

t_SU

t_H

Output Data Pair

Dn⁽¹⁾

Dn+1⁽¹⁾

(1) Dn = bits D0, D2, D4, and so forth. Dn+1 = bits D1, D3, D5, and so forth.

Figure 1. LVDS Switching Diagram

Output Clock

CLKOUT

t_SU

t_H

t_SU

t_H

Output Data

CMOSn

Dn⁽¹⁾

(2) Dn = bits D0, D1, D2, and so forth.

Figure 2. CMOS Switching Diagram

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

6.9 Typical Characteristics

At V_AVDDH= 3.3 V, V_AVDD= 1.8 V, V_VMIXH= 1.5 V, V_DVDD= 1.8 V, V_DVDDH= 3.3 V, V_PVDD= 3.3 V, V_{SUB_BIAS}= 0 V, and

integration duty cycle = 10%, unless otherwise noted.

1.4

1.2

0.8

0.6

0.4

0.2

-10

-8

-7

-6

-5

-4

-3

-2

-1

0.3

0.6

0.9

1.2

1.5

1.8

2.1

2.4

2.7

V_{SUB_BIAS}(V)

V_VMIXH(V)

Normalized to V_MIXH= 1.5 V

Figure 3. Normalized V_MIXHSupply Current vs

V_MIXHSupply Voltage

Figure 4. V_{SUB_BIAS}Supply Current vs

V_{SUB_BIAS}Supply Voltage

Incident Angle = 0 è

Incident Angle = 30 è

350

450

550

650

750

850

950

1050

Light Wavelength (nm)

Figure 5. Optical Filter Transitivity vs

Light Wavelength

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

7 Detailed Description

7.1 Overview

The OPT8241 is a high-performance quarter video graphics array (QVGA) resolution, 3D sensor device that

senses depth information based on the time of flight (ToF) technique. The OPT8241 has a CMOS image sensor

core with an integrated analog-to-digital converter (ADC), an addressing engine for the sensor core, an low-

voltage differential signaling (LVDS) serializer, and an I²C slave device. The device supports configurable timings

to optimize power and performance.

The OPT8241 includes the following blocks:

•

Timing generator (TG)

Sensor core

Addressing engine

ADC and overload detection

Modulation block

Output block

Temperature sensor

I²C control interface

7.2 Functional Block Diagram

OPT8241

DMIX0,

DMIX1

ILLUM_P

ILLUM_N

Modulation Block

CLK Generator

MCLK

Mix Drivers

ILLUM_EN

CLK, CTRL

Row

Sensor Core

Reset

Addressing Engine

Column

CLK, CTRL

Analog

Timing Generator

Analog Processing

VD_IN

Analog

Temperature Sensor

CLK, CTRL

ADC

I²C

REG

Digital

Serializer

LVDS

VD_FR

VD_QD

VD_SF

Output Block

CMOS Data

CLKOUT

HD_QD

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

7.3 Feature Description

7.3.1 Output Block

The output block provides the output data, clock, and frame boundary signals. The positions of the following

frame boundary marker signals are programmable. Table 1 lists signals that can be used by the host processor

to reconstruct the frame.

Table 1. Output Frame Marker Signals

SIGNAL

VD_FR

VD_SF

VD_QD

HD_QD

TYPE

Output

DESCRIPTION

Frame sync

Sub-frame sync

Quad sync

Row sync

7.3.1.1 Serializer and LVDS Output Interface

The sensor has an option for a serial LVDS interface. The digitized data from the ADCs are serialized and sent

on three LVDS data pairs and one LVDS pixel clock pair. The DIFF0, DIFF1 pairs provide the differential data

(A-B). The differential data for each pixel is 12 bits long. The pixel clock pair is 0 for the first six data bits and 1

for the next six data bits. The pixel clock can be used by the external host to identify the boundary of the 12-bit

data for each pixel. The LVDS waveforms are shown in Figure 6.

DCLKP, DCLKM

PCLK_P, PCLK_M

DIFFx_P, DIFFx_M

D11

D10

…

D11

SUM_P, SUM_M

Bits 11-0

Channel 0: A - B

DIFF0_P, DIFF0_M

DIFF1_P, DIFF1_M

SUM_P, SUM_M

Bits 11-0

Channel 1: A - B

Bits 11-8

Bits 7-4

Bits 3-0

0000

Channel 0: A + B

Channel 1: A + B

Figure 6. LVDS Output Waveforms

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

7.3.1.2 Parallel CMOS Output Interface

The sensor has options for both serial and parallel data output interfaces. The output data on the parallel CMOS

interface toggles on both edges of the clock (DDR rate) with the output clock frequency being equal to the

system clock frequency. The CMOS parallel data waveforms are shown in Figure 7.

CLKOUT

(50 MHz)

CMOS[15:0]

Frame ID

Channel 1,

Pixel 1,

Channel 2,

Pixel 1,

Channel 1,

Pixel 1,

Channel 2,

Pixel 1,

Row 1

Row 2

CMOS[15:12]

A + B

CMOS[11:0]

CMOS[15:0]

A - B

Figure 7. CMOS Output waveforms

Following the VD start, the first sample set is a frame ID that denotes the quadrant (quad) number. The frame ID

format is given in Table 2.

Table 2. Frame ID Word Format

SF[3:0]

Q[3:0]

Note that Q[3:0] is the quad number and SF[3:0] denotes the sub-frame number.

7.3.2 Temperature Sensor

The on-die temperature sensor can measure temperatures in the range of –25°C to 125°C. The temperature is

updated every 3 ms. The temperature value is stored in a register that can be read through the I²C interface.

7.4 Device Functional Modes

All OPT8241 control commands are directed through the OPT9221 time-of-flight controller. For more details on

the functional modes of the chipset, see the OPT9221 datasheet.

7.5 Programming

The device registers are programmed by the OPT9221 time-of-flight controller. Therefore, in a typical system, the

I²C interface is connected to the OPT9221 sensor control I²C bus; see the OPT9221 datasheet for more details.

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

ToF cameras provide the complete depth map of a scene. In contrast with the scanning type light detection and

ranging (LIDAR) systems, the depth map of the entire scene is captured at the same instant with an array of ToF

pixels. A broad classification of applications for a 3D camera include:

•

Presence detection,

Object location,

Movement detection, and

3D scanning.

The OPT8241 ToF sensor, along with TI's OPT9221 ToF controller, forms a two-chip solution for creating a 3D

camera. The block diagram of a complete 3D ToF camera implementation using the OPT8241 is shown in

Figure 8.

Illumination

Optics

Illumination

Modulation

Scene

DDR

Timing Generation

Computation

Depth 5ata

(OPT9221)

ADC

Pixel Array

Lens

OPT8241

Figure 8. 3D ToF Camera

The TI ToF estimator tool can be used to estimate the performance of a ToF camera with various configurations.

The estimator allows control of the following parameters:

•

Depth resolution

2D resolution (number of pixels)

Distance range

Frame rate

Field of view (FoV)

Ambient light (in watts × nm × m²around the sensor filter bandwidth)

Reflectivity of the objects

For more details on how to choose the above parameters, see the white paper on the ToF system design.

OPT8241

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8.2 Typical Applications

8.2.1 Presence Detection for Industrial Safety

Processing 3D information and a separate foreground from the background is computationally less intensive

when compared to using color information from a reg, green, blue (RGB) camera. 3D information can also be

used to extract the form of the object and classify the object detected as being a human, robot, vehicle, and so

forth, as shown in Figure 9.

Figure 9. Industrial Safety

8.2.1.1 Design Requirements

Table 3. Industrial Safety Requirements

SPECIFICATION

Depth resolution

VALUE

UNITS

COMMENTS

Temporal standard deviation of measured

distance without the use of any software filters

7.5

Percentage of distance

For reactions fast enough to trigger a machine

shut down

Frame rate

Frames per second

Field of view

74.4 × 59.3

Degrees (H × V)

Meters

Example only, requirements may vary

Minimum distance

Maximum distance

Meters

Minimum reflectivity of objects at which

the depth resolution is specified

320 × 240

0.1

Percentage

Assuming Lambertian reflection

Using a full array

Number of pixels

Rows x columns

W × nm × m²around

850 nm

Ambient light

Low-intensity diffused sunlight

Laser + diffuser for diffusing light uniformly

through the scene

Illumination source

Laser

—

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

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8.2.1.2 Detailed Design Procedure

Using the TI ToF estimator tool, the ToF camera design requirements can be input and the power numbers

required for achieving the desired specifications can be obtained. The choice of inputs to the estimator tool is

explained in the following section.

8.2.1.2.1 Frequencies of Operation

The frequencies of operation are limited by the sensor bandwidth because the illumination source is a laser.

Frequencies around 75 MHz can be used to obtain a good demodulation figure of merit. Two frequencies are

used to implement de-aliasing and extend the unambiguous range because frequencies around 75 MHz provide

a very short unambiguous range. The two frequencies chosen for de-aliasing are 70 MHz and 80 MHz. The

unambiguous range is now given by Equation 1.

299792458.0 ms

Unambiguous Range =

=14.990 m

2ìGCD f ,f

2ìGCD 70 MHz,80 MHz

(

)

(

)

(1)

For the purpose of power requirement calculations, the average frequency of 75 MHz can be used in the

estimator tool.

8.2.1.2.2 Number of Sub-Frames and Quads

In this example, two sub-frames and six quads are used to obtain good dynamic range and account for wide

ranges of reflectivity and distance. Also, six quads (minimum) are required for implementing de-aliasing. A depth

resolution of 5% instead of the requirement of 7.5% is used as the resolution input to the estimator tool to allow

for margins resulting from the additional noise when using de-aliasing.

8.2.1.2.3 Field of View (FoV)

Field of view in the horizontal direction is 74.4 degrees. The diagonal FoV can be calculated using Equation 2.

’

74.4

≈

FoV Diagonal = 2ìtan^-1ìtan

ö 87è

÷Ÿ

(

)

…

∆

◊

⁄

(2)

The ratio of 5/4 is used to represent the ratio of the diagonal length to the horizontal length of the sensor.

8.2.1.2.4 Lens

A lens with a 1/3” image circle must be chosen. The FoV of the lens must match the requirements (that is, the

FoV must be equal to 87 degrees, as calculated in Equation 2). A lower f.no is always better. For this example,

use an f.no of 1.2.

8.2.1.2.5 Integration Duty Cycle

An integration duty cycle of less than 50% is chosen to keep the sensor cool in an industrial housing with no

airflow. Choosing an even lower integration duty cycle can result in a marked increase in the peak illumination

power. Higher peak illumination power results in a higher number of illumination elements and, thus, an increase

in system cost.

OPT8241

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8.2.1.2.6 Design Summary

A screen shot of the system estimator tool is shown in Figure 10.

Figure 10. Screen Shot of the Estimator Tool

The illumination peak optical power of 1.98 W can be supplied using one high-power laser.

8.2.1.3 Application Curve

250

r = 10 %

225

r = 40 %

r = 100 %

200

175

150

125

100

1.4 1.8 2.2 2.6

3.4 3.8 4.2 4.6

Object Distance (m)

ρ represents object reflectivity

Figure 11. Example Industrial Safety Object Distance vs Depth Resolution

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

8.2.2 People Counting and Locating

Locating and tracking people is a complex problem to solve using regular RGB cameras. With the additional

information of distance to each point in the scene, the algorithmic challenges become more surmountable, as

shown in Figure 9.

Figure 12. People Counting

8.2.2.1 Design Requirements

Table 4. People Counting Requirements

SPECIFICATION

Depth resolution

VALUE

UNITS

COMMENTS

200

For basic identification of shapes

Reasonable update rate for moderate object

movement speeds

Frame rate

Frames per second

Degrees (H × V)

Higher FoVs are better for more coverage but are

worse from a power requirement point of view

Field of view

100.0 × 83.6

Minimum distance

Maximum distance

Meters

Example only, requirements may vary

Assuming objects reflect very little infrared light

and assuming Lambertian reflection.

Typical reflectivity of objects

Number of pixels

320 × 240

Percentage

Rows × columns

W × nm × m²around

850 nm

Using a full array

Ambient light

Indoor lighting conditions

LED + lens optics

Illumination source

LED

—

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

8.2.2.2 Detailed Design Procedure

Using the TI ToF estimator tool, the ToF camera design requirements can be input and the power numbers

required for achieving the desired specifications can be obtained by following the procedures discussed in this

section.

8.2.2.2.1 Frequencies of Operation

The frequencies of operation are limited by the LED bandwidth because the source of illumination is an LED.

Frequencies around 24 MHz can be used to obtain a good demodulation figure of merit if a fast-switching

infrared (IR) LED is used. The unambiguous range is given by Equation 3.

299792458.0 ms

2ì24 MHz

Unambiguous Range =

= 6.246 m

2ìf

(3)

8.2.2.2.2 Number of Sub-Frames and Quads

In this example, one sub-frame and four quads are used to minimize the effects of the sensor reset noise.

8.2.2.2.3 Field of View (FoV)

Field of view in the horizontal direction is 74.4 degrees. The diagonal field of view can be calculated using

Equation 2.

’

100.0

≈

FoV Diagonal = 2ìtan^-1ìtan

ö112.3è

÷Ÿ

(

)

…

∆

◊

⁄

(4)

The ratio of 5/4 is used to represent the ratio of the diagonal length to the horizontal length of the sensor.

8.2.2.2.4 Lens

A lens with a 1/3” image circle must be chosen. The field of view of the lens must match the requirements (that

is, the FoV must be equal to 112.3 degrees, as calculated in Equation 4 ). A lower f.no is always better. For this

example, use an f.no of 1.2.

8.2.2.2.5 Integration Duty Cycle

An integration duty cycle of 60% is chosen to keep the peak illumination power requirements low. Higher peak

illumination power results in a higher number of illumination elements and, thus, an increase in system cost.

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

8.2.2.2.6 Design Summary

A screen shot of the system estimator tool is shown in Figure 13.

Figure 13. Screen Shot of the Estimator Tool

The illumination peak optical power of 2.0 W can be supplied using a single high-power LED.

8.2.2.3 Application Curve

200

r = 10 %

180

r = 40 %

r = 100 %

160

140

120

100

1.5

2.5

3.5

4.5

5.5

Object Distance (m)

ρ represents object reflectivity

Figure 14. Example People-Counting Object Distance vs Depth Resolution

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

8.2.3 People Locating and Identification

A skeletal structure can be used to classify identified shapes (such as humans, machines, pets, and so forth).

Other possibilities include classification of people (such as children and elderly). Even identification of humans by

matching the shape and movement to an existing database is possible. Such information can lend itself for use in

a variety of retail solutions, home safety, security, and public and private surveillance systems, as shown in

Figure 15.

Figure 15. People Counting and Identification

8.2.3.1 Design Requirements

Table 5. People Counting and Identification Requirements

SPECIFICATION

Depth resolution

VALUE

UNITS

COMMENTS

To obtain skeletal structure and gait accurately

and identify humans from other objects.

1.5

Percentage of distance

Reasonable update rate for moderate object

movement speeds

Frame rate

Frame per second

Degrees (H X V)

Higher FoVs are better for more coverage but

worse from a power requirement point of view

Field of view

100.0 x 83.6

Minimum distance

Maximum distance

Meters

Example only, requirements may vary

Assuming objects reflect very little infrared light

and assuming Lambertian reflection

Typical reflectivity of objects

No of pixels

320 x 240

Percentage

Rows x columns

W × nm × m²around

850 nm

Using full array

Ambient light

Indoor lighting conditions

Laser + diffuser for diffusing light uniformly

through the scene

Illumination source

Laser

—

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

8.2.3.2 Detailed Design Procedure

Using the TI ToF estimator tool, the ToF camera design requirements can be input and the power numbers

required for achieving the desired specifications can be obtained. The choice of inputs to the estimator tool is

explained in the following section.

8.2.3.2.1 Frequencies of Operation

The frequencies of operation are limited by the sensor bandwidth because the illumination source is a laser.

Frequencies around 75 MHz can be used to obtain a good demodulation figure of merit. Two frequencies are

used to implement de-aliasing and extend the unambiguous range because frequencies around 75 MHz provide

a very short unambiguous range. The two frequencies chosen for de-aliasing are 70 MHz and 80 MHz. The

unambiguous range is now given by Equation 5.

299792458.0 ms

Unambiguous Range =

=14.990 m

2ìGCD f ,f

2ìGCD 70 MHz,80 MHz

(

)

(

)

(5)

For the purpose of power requirement calculations, the average frequency of 75 MHz can be used in the

estimator tool.

8.2.3.2.2 Number of Sub-Frames and Quads

In this example, one sub-frame and six quads are used to minimize the effects of the sensor reset noise. A depth

resolution of 1% instead of the requirement of 1.5% is used as the resolution input to the estimator tool to allow

for margins resulting from the additional noise when using de-aliasing.

8.2.3.2.3 Field of View (FoV)

Field of view in the horizontal direction is 74.4 degrees. The diagonal FoV can be calculated using Equation 6.

’

100.0

≈

FoV Diagonal = 2ìtan^-1ìtan

ö112.3è

÷Ÿ

(

)

…

∆

◊

⁄

(6)

The ratio of 5/4 is used to represent the ratio of the diagonal length to the horizontal length of the sensor.

8.2.3.2.4 Lens

A lens with a 1/3” image circle must be chosen. The FoV of the lens must match the requirements (that is, the

FoV must be equal to 112.3 degrees, as calculated in Equation 6). A lower f.no is always better. For this

example, use an f.no of 1.2.

8.2.3.2.5 Integration Duty Cycle

An integration duty cycle of 70% is chosen to keep the peak illumination power requirements low. Higher peak

illumination power results in a higher number of illumination elements and, thus, an increase in system cost.

OPT8241

www.ti.com.cn

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

8.2.3.2.6 Design Summary

A screen shot of the system estimator tool is shown in Figure 16.

Figure 16. Screen Shot of the Estimator Tool

The illumination peak optical power of 3.54 W can be supplied using two high-power lasers.

8.2.3.3 Application Curve

r = 10 %

r = 40 %

r = 100 %

1.5

2.5

3.5

4.5

5.5

Object Distance (m)

ρ represents object reflectivity

Figure 17. Example People Identification Object Distance vs Depth Resolution

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

9 Power Supply Recommendations

The sensor reset noise is sensitive to AVDDH and PVDD supplies. Therefore, linear regulators are

recommended for supplying power to the AVDD and PVDD supplies. DC-DC regulators can be used to supply

power to the rest of the supplies. Ripple voltage on the VMIX and the SUB_BIAS supplies must be kept at a

minimum (< 50 mV) to minimize phase noise resulting from differences between quads. The VMIX regulator must

have the bandwidth to supply surge current requirements within a short time of less than 10 µs after the

integration period begins because VMIX currents have a pulsed profile.

There is no strict order for the power-on or -off sequence. The VMIX supplies are recommended to be turned on

after all supplies have ramped to 90% of their respective values to avoid any power-up surges resulting from high

VMIX currents in a non-reset device state.

10 Layout

10.1 Layout Guidelines

10.1.1 MIX Supply Decapacitors

The VMIXH supply has a peak load current requirement of approximately 600 mA during the integration phase.

Moreover, a break-before-make circuit is used during the reversal of the demodulation polarity to avoid high

through currents. The break-before-make strategy results in a pulse with a drop and a subsequent rise of

demodulation current. The pulse duration is typically approximately 1 ns. In order to effectively support the rise in

currents, VMIXH decoupling capacitors must be placed very close to the package. Furthermore, use multiple

capacitors to reduce the effect of equivalent series inductance and resistance of the decoupling capacitors. Use

a combination of 10-nF and 1-nF capacitors per VMIXH pin. Using vias for routing the trace from decoupling

capacitors to the package pins must be avoided.

10.1.2 LVDS Transmitters

Each LVDS data output pair must be routed as a 100-Ω differential pair. When used with the OPT9221, 100-Ω

termination resistors must be placed close to the OPT9221.

10.1.3 Optical Centering

The lens mount placement on the printed circuit board (PCB) must be such that the lens optical center aligns

with the pixel array optical center. Note that the pixel array center is different from the package center.

OPT8241

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ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

Layout Guidelines (continued)

10.1.4 Image Orientation

The sensor orientation for obtaining an upright image is shown in Figure 18.

Captured

Image

Sensor

Lens

Scene

Pin 1

240, 320

240, 0

Readout

0, 320

0, 0

When used with the OPT9221,

the default sensor readout direction is shown in grey.

Figure 18. Sensor Orientation for Obtaining an Upright Image

10.1.5 Thermal Considerations

In some applications, special care must be taken to avoid high sensor temperatures because demodulation

power is considerably high for the size of the package. Lower sensor temperatures help lower the thermal noise

floor as well as reduce the leakage currents. Two recommended methods for achieving better package to PCB

thermal coupling are listed below:

•

Use a thermal pad below the sensor on both sides of the PCB with stitched vias.

Use a compatible underfill.

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

10.2 Layout Example

Figure 19. Example Layout

OPT8241

www.ti.com.cn

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

10.3 Mechanical Assembly Guidelines

10.3.1 Board-Level Reliability

TI chip-on-glass products are designed and tested with underfill to ensure excellent board-level reliability in

intended applications. If a customer chooses to underfill a chip-on-glass product, following the guidelines below

is recommended to maximize the board level reliability:

•

The underfill material must extend partially up the package edges. Underfill that ends at the bottom (ball side)

of the die degrades reliability.

The underfill material must have a coefficient of thermal expansion (CTE) closely matched to the CTE of the

solder interconnect.

The underfill material must have a glass transition temperature (Tg) above the expected maximum exposure

temperature.

Thermoset ME-525 is a good example of a compatible underfill.

10.3.2 Handling

To avoid dust particles on the sensor, the sensor tray must only be opened in a cleanroom facility. In case of

accidental exposure to dust, the recommended method to clean the sensors is to use an IPA solution with a

micro-fiber cloth swab with no lint. Do not handle the sensor edges with hard or abrasive materials (such as

metal tweezers) because the sensor package has a glass outline. Such handling may lead to cracks that can

negatively affect package reliability and image quality.

OPT8241

ZHCSE82B –JUNE 2015–REVISED OCTOBER 2015

www.ti.com.cn

11 器件和文档支持

11.1 文档支持

11.1.1 相关文档

《OPT9221 数据表》，SBAS703

《飞行时间 (ToF) 系统设计简介》，SBAU219

11.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可

能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可

能会导致器件与其发布的规格不相符。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不

对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

OPT8241NBN

OPT8241NBNL

ACTIVE

COG

NBN

240

RoHS & Green

SNAGCU

Level-3-260C-168 HR

0 to 70

OPT8241

2400 RoHS & Green

SNAGCU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

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10-Dec-2020

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jan-2022

TRAY

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device

Package Package Pins SPQ Unit array

Max

matrix temperature

(°C)

L (mm)

Name

Type

(mm) (µm) (mm) (mm) (mm)

OPT8241NBN

OPT8241NBNL

NBN

COG

240

10 x 24

150

315 135.9 7620 12.75 10.58 13.75

2400

Pack Materials-Page 1

PACKAGE OUTLINE

NBN0078A

COG - 0.745 mm max height

SCALE 1.800

CHIP ON GLASS

8.797

8.717

(0.0172)

PIXEL AREA CTR

BALL 1 CORNER

INDEX AREA

7.899

7.819

(1.17945)

PIXEL AREA CTR

PIXEL AREA

(0.1)

DIE

(0.04)

(0.5)

SCALE

(0.06)

SEE DETAIL A

DETAIL A

0.745 MAX

SEATING PLANE

0.05 C

0.213

TYP

BALL TYP

0.187

(8.37) TYP

(5.95)

(0.194) TYP

(0.19) TYP

DIE

PKG

(7.48)

TYP

(6.91)

0.285

0.235

9 10 11 12 13 14 15

PKG

18 19

16 17

78X

44X (0.68)

36X (0.465)

4222085/A 06/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.

4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

www.ti.com

EXAMPLE BOARD LAYOUT

NBN0078A

COG - 0.745 mm max height

CHIP ON GLASS

4X (3.255)

20X (3.305)

4X (2.79)

10 11

13 14 15 16

36X (0.465)

44X (0.68)

18 19

78X ( 0.22)

26X (3.79)

12X (3.74)

SYMM

LAND PATTERN EXAMPLE

SCALE:10X

METAL UNDER

SOLDER MASK

0.05 MAX

0.05 MIN

0.22)

METAL

(

0.22)

SOLDER MASK

OPENING

SOLDER MASK

OPENING

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4222085/A 06/2015

NOTES: (continued)

5. PCB pads shift from original positions to prevent solder balls from touching sensor. X and Y direction: 0.05 mm. Corner pads: 0.03 mm.

6. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For information, see Texas Instruments literature number SSYZ015 (www.ti.com/lit/ssyz015).

www.ti.com

EXAMPLE STENCIL DESIGN

NBN0078A

COG - 0.745 mm max height

CHIP ON GLASS

4X (3.255)

20X (3.305)

4X (2.79)

36X (0.465) TYP

44X (0.68)

10 11 12 13 14 15 16

17 18 19

METAL

TYP

26X (3.79)

12X (3.74)

SYMM

(R0.05) TYP

78X ( 0.25)

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:12X

4222085/A 06/2015

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

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