PCM3500EG4 [TI]
低电压、低功耗、16 位、单声道 SoundPlus™ 语音/调制解调器编解码器 | DB | 24;型号: | PCM3500EG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 低电压、低功耗、16 位、单声道 SoundPlus™ 语音/调制解调器编解码器 | DB | 24 光电二极管 消费电路 商用集成电路 编解码器 调制解调器 |
文件: | 总28页 (文件大小:216K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
PCM3500
PCM3500
For most current data sheet and other product
information, visit www.burr-brown.com
Low Voltage, Low Power, 16-Bit, Mono
TM
VOICE/MODEM CODEC
FEATURES
● 16-BIT DELTA-SIGMA DAC AND ADC
● POWER SUPPLY: Single +2.7V to +3.6V
● SMALL PACKAGE: SSOP-24
● DESIGNED FOR MODEM ANALOG FRONT END:
Supports up to 56kbps Operation
● ANALOG PERFORMANCE:
APPLICATIONS
Sampling Frequency: 7.2kHz to 26kHz
Dynamic Range: 88dB (typ) at fS = 8kHz, f = 1kHz
● SYSTEM CLOCK: 512fS
● MASTER OR SLAVE OPERATION
● ON-CHIP CRYSTAL OSCILLATOR CIRCUIT
● ADC-TO-DAC LOOP-BACK MODE
● TIME SLOT MODE SUPPORTS UP TO
FOUR CODECs ON A SINGLE SERIAL
INTERFACE
IN
● SOFTWARE MODEMS FOR:
Personal Digital Assistant
Notebook and Hand-Held PCs
Set-Top Box
Digital Television
Embedded Systems
● PORTABLE VOICE RECORDER/PLAYER
● SPEECH RECOGNITION/SYNTHESIS
● TELECONFERENCING PRODUCTS
● POWER-DOWN MODE: 60µA (typ)
DESCRIPTION
digital-to-analog and analog-to-digital converters, in-
put anti-aliasing filter, digital high-pass filter for DC
blocking, and an output low-pass filter. The synchro-
nous serial interface provides for a simple, or glue-free
interface to popular DSP and RISC processors. The
serial interface also supports Time Division Multiplex-
ing (TDM), allowing up to four CODECs to share a
single 4-wire serial bus.
The PCM3500 is a low cost, 16-bit CODEC designed
for modem Analog Front End (AFE) and speech pro-
cessing applications. The PCM3500’s low power op-
eration from +2.7V to +3.6V power supplies, along
with an integrated power-down mode, make it ideal for
portable applications.
The PCM3500 integrates all of the functions needed for
a modem or voice CODEC, including delta-sigma
VIN
∆Σ
Modulator
(ADC)
Decimation
Digital Filter
AAF
HPF
FS
AGND
BCK
DIN
Loop
V
REF1
VCOM
VREF
Reference
2
DOUT
VOUT
∆Σ
Modulator
Interpolation
Digital Filter
Multi-Level
DAC
SMF
FSO
AGND
Clock
Gen/
OSC
SCKIO
Power
Mode Control
VCC
AGND DGND
VDD PDWN
LOOP
HPFD
M/S
TSC
XTO
XTI
International Airport Industrial Park
•
Mailing Address: PO Box 11400, Tucson, AZ 85734
•
Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706
•
Tel: (520) 746-1111
Twx: 910-952-1111 Internet: http://www.burr-brown.com/
•
•
Cable: BBRCORP Telex: 066-6491
•
•
FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
© 1999 Burr-Brown Corporation
Printed in U.S.A. February, 2000
PDS-1524B
SBAS117
SPECIFICATIONS
All specifications at +25°C, VDD = VCC = 3.3V, fS = 8kHz, and nominal system clock (XTI) = 512fS, unless otherwise noted. Measurement band is 100Hz to 0.425fS.
PCM3500E
PARAMETER
RESOLUTION
CONDITIONS
MIN
TYP
MAX
UNITS
16
Bits
DATA FORMAT
Serial Data Interface Format
DSP Format
16
Serial Data Bit Length
Serial Data Format
Bits
MSB-First, Binary Two’s Complement
Sampling Frequency, fS
System Clock Frequency, 512fS
ADC and DAC
7.2
8
26
kHz
3.686
4.096
13.312
MHz
DIGITAL INPUT/OUTPUT
Logic Family
CMOS
(1)
Input Logic Level: VIH
0.7 • VDD
VDC
VDC
µA
(1)
VIL
0.3 • VDD
±1
(2)
Input Logic Current: IIN
(3)
IIN
100
µA
(4)
Output Logic Level: VOH
IOUT = –1mA
IOUT = +1mA
VDD – 0.3
VDC
VDC
(4)
VOL
0.3
ADC CHARACTERISTICS
DC ACCURACY
Input Voltage
Gain Error
0.6 VCC
±2
Vp-p
% of FSR
% of FSR
kΩ
±5
Offset Error
High-Pass Filter Disabled
±2
Input Resistance
50
AC ACCURACY
THD+N
Dynamic Range
fIN = 1kHz, VIN = –0.5dB
Without A-Weighting
–85
88
–80
dB
dB
82
82
80
Signal-to-Noise Ratio
Crosstalk
Without A-Weighting
DAC Channel Idle, 0dB Input
0.0002fS to 0.425fS
88
85
dB
dB
dB
dB
dB
dB
dB
sec
Passband Ripple (internal HPF enabled)
Passband Ripple (internal HPF disabled)
Roll-Off at 0.00002fS
Roll-Off at 0.56fS
±0.05
±0.05
–3
0fS to 0.425fS
High-Pass Filter Enabled
High-Pass Filter Enabled
0.58fS to fS
–30
–65
18/fS
Stopband Rejection
Group Delay
4m
DAC CHARACTERISTICS
DC ACCURACY
Output Voltage
Gain Error
0.6 VCC
±1
Vp-p
% of FSR
% of FSR
kΩ
±5
Offset Error
High Pass Filter Disabled
±1
Load Resistance
10
AC ACCURACY
THD+N
Dynamic Range
Signal-to-Noise Ratio
Crosstalk
fIN = 1kHz, VOUT = 0dB
Without A-Weighted
Without A-Weighted
ADC Channel Idle, 0dB Input
0fS to 0.425fS
–90
92
–82
dB
dB
dB
dB
dB
sec
84
84
84
92
92
Passband Ripple
Group Delay
±0.4
12/fS
4m
POWER SUPPLY REQUIREMENTS
Voltage Range
Supply Current, ICC + IDD
VCC, VDD
VCC = 3.3V
2.7
3.3
9
3.6
12
VDC
mA
Total Supply Current in Power-Down Mode
Total Power Dissipation
VCC = VDD = 3.3V, XTI Stopped
VCC = VDD = 3.3V
60
30
µA
mW
40
TEMPERATURE RANGE
Operating
Storage
–25
–55
+85
+125
°C
°C
Thermal Resistance, ΘJA
100
°C/W
NOTES: (1) Pins 6, 7, 8, 9, 10, 15, 17, 18, 19, 20 (M/S, TSC, BCK, FS, DIN, SCKIO, XTI, HPFD, LOOP, PDWN). (2) Pins 8, 9, 10, 15, 17 (BCK, FS, DIN, SCKIO
(Schmitt-Trigger input) XTI. (3) Pins 6, 7, 18, 19, 20 (M/S, TSC, HPFD, LOOP, PDWN; Schmitt-Trigger input with internal pull-down). (4) Pins 8, 9, 11, 12, 15,
16 (BCK, FS, DOUT, FSO, SCKIO, XTO).
®
PCM3500
2
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
Supply Voltage, +VDD, +VCC ............................................................. +6.5V
Supply Voltage Differences............................................................... ±0.1V
GND Voltage Differences.................................................................. ±0.1V
Digital Input Voltage ................................................... –0.3V to VDD + 0.3V
Input Current (any pins except supply) ........................................... ±10mA
Power Dissipation .......................................................................... 300mW
Operating Temperature Range ......................................... –25°C to +85°C
Storage Temperature ...................................................... –55°C to +125°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 5s).................................................. +260°C
(reflow, 10s) ................................................................................ +235°C
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING
NUMBER
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(1)
TRANSPORT
MEDIA
PRODUCT
PACKAGE
PCM3500E
"
24-Lead SSOP
"
338
"
–25°C to +85°C
PCM3500E
"
PCM3500E
PCM3500E/2K
Rails
Tape and Reel
"
NOTES: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2,000 pieces
of “PCM3500E/2K” will get a single 2000-piece Tape and Reel.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no
responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN
product for use in life support devices and/or systems.
®
3
PCM3500
PIN CONFIGURATION
Top View
SSOP
PCM3500
1
2
3
4
5
6
7
8
9
VCOM
VREF
VCC 24
AGND 23
VOUT 22
AGND 21
PDWN 20
LOOP 19
HPFD 18
XTI 17
1
VREF2
VIN
AGND
M/S
TSC
BCK
FS
XTO 16
10 DIN
SCKIO 15
DGND 14
VDD 13
11 DOUT
12 FSO
PIN ASSIGNMENTS
PIN
NAME
I/O
DESCRIPTION
1
2
3
4
5
6
VCOM
OUT
—
Common-Mode Voltage (0.5VCC). This pin should be connected to ground through a capacitor.
Decouple Pin for Reference Voltage 1 (0.99VCC). This pin should be connected to ground through a capacitor.
Decouple Pin for Reference Voltage 2 (0.2VCC). This pin should be connected to ground through a capacitor.
Analog Input for the ADC.
VREF
1
VREF2
—
VIN
IN
AGND
M/S
—
Analog Ground for the ADC Input Signal.
IN
Master/Slave Select. This pin is used to determine the operating mode for the serial interface. A logic ‘0’ on this pin selects the Slave
Mode. A logic ‘1’ on this pin selects the Master Mode.(2)
7
8
9
TSC
BCK
FS
IN
I/O
I/O
Time Slot Mode Control. This pin is used to select the time slot operating mode. A logic ‘0’ on this pin disables Time Slot Mode. A
logic ‘1’ on this pin enables Time Slot Mode.(2)
Bit Clock. This pin serves as the bit (or shift) clock for the serial interface. This pin is an input in Slave Mode and an output in Master
Mode.(1)
Frame Sync. This pin serves as the frame synchronization clock for the serial interface. This pin is an input in Slave Mode and an
output in Master Mode.(1)
10
11
12
DIN
DOUT
FSO
IN
Serial Data Input. This pin is used to write 16-bit data to the DAC.(1)
Serial Data Output. The ADC outputs 16-bit data on this pin.(3)
OUT
OUT
Frame Sync Output. Active only when Time Slot Mode is enabled. This pin is set to a high impedance state when Time Slot mode
is disabled (TSC = 0).
13
VDD
—
Digital Power Supply. Used to power the digital section of the ADC and DAC, as well as the serial interface and mode control logic.
This pin is not internally connected to VCC
.
14
15
DGND
SCKIO
—
Digital Ground. Internally connected through the substrate to analog ground.
I/O
System Clock Input/Output. This pin is a system clock output when using the crystal oscillator or XTI as the system clock input; when
XTI is connected to ground, this pin is a system clock input.(1)
16
17
18
19
20
XTO
XTI
OUT
IN
Crystal Oscillator Output.
Crystal Oscillator Input or an External System Clock Input.
HPFD
LOOP
PDWN
IN
High-Pass Filter Disable. When this pin is set to a logic ‘1’, the HPF function in the ADC is disabled.(2)
ADC-to-DAC Loop-Back Control. When this pin is set to logic ‘1’, the ADC data is fed to the DAC input.(2)
IN
IN
Power Down and Reset Control. When this pin is logic ‘0’, Power-Down Mode is enabled. The PCM3500 is reset on the rising edge
of this signal.(2)
21
22
23
24
AGND
VOUT
—
OUT
—
Analog Ground for the DAC Output Signal.
Analog Output from the DAC Output Filter.
AGND
VCC
Analog Ground. This is the ground for the internal analog circuitry.
Analog Power Supply. Used to power the analog circuitry of the ADC and DAC.
—
NOTES: (1) Schmitt-Trigger input. (2) Schmitt-Trigger input with an internal pull-down resistor. (3) Tri-state output in Time Slot Mode.
®
PCM3500
4
TYPICAL PERFORMANCE CURVES
DAC SECTION
DIGITAL FILTER
INTERPOLATION FILTER
PASSBAND RIPPLE CHARACTERISTICS
INTERPOLATION FILTER FREQUENCY RESPONSE
0
0.2
0.0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–0.2
–0.4
–0.6
–0.8
–1.0
0
1
2
3
4
0
0.1
0.2
0.3
0.4
0.5
Normalized Frequency (• fS)
Normalized Frequency (• fS Hz)
ANALOG FILTER
OUTPUT FILTER FREQUENCY RESPONSE
STOPBAND CHARACTERISTICS
OUTPUT FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10
100
1k
10k
100k
1M
10M
1
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
®
5
PCM3500
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and fSIGNAL = 1kHz, unless otherwise specified.
DAC SECTION
DAC OUTPUT SPECTRA
DAC OUTPUT SPECTRUM (–0dB, N = 8192)
DAC OUTPUT SPECTRUM (–60dB, N = 8192)
0
–20
0
–20
–40
–40
–60
–60
–80
–80
–100
–120
–140
–100
–120
–140
0
1
2
3
4
0
1
2
3
4
Frequency (kHz)
Frequency (kHz)
TOTAL HARMONIC DISTORTION + NOISE
vs SIGNAL NOISE
DAC OUT-OF-BAND NOISE SPECTRUM
(BPZ, N = 2048)
0
–20
0
–20
–40
–40
–60
–80
–60
–100
–120
–140
THD+N fluctuates with signal level
as harmonics are limited to second
and third components.
–80
–100
–96
–84
–72
–60
–48
–36
–24
–12
0
0
8
16
24
32
40
48
56
64
Signal Level (dB)
Frequency (kHz)
®
PCM3500
6
TYPICAL PERFORMANCE CURVES (Cont.)
DAC SECTION
DAC CHARACTERISTICS vs TEMPERATURE, SUPPLY, AND SAMPLING FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs TEMPERATURE
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs TEMPERATURE
(TA = –25°C to +85°C)
(TA = –25°C to +85°C)
–88
–90
–92
–94
–96
96
94
92
90
88
SNR
Dynamic Range
–50
–25
0
25
50
75
100
–50
–25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
TOTAL HARMONIC DISTORTION + NOISE
vs SUPPLY VOLTAGE
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SUPPLY VOLTAGE
(VCC = VDD = +2.7V to +3.6V)
(VCC = VDD = +2.7V to +3.6V)
–88
–90
–92
–94
–96
96
94
92
90
88
Dynamic Range
SNR
2.4
2.7
3.0
3.3
3.6
3.9
2.4
2.7
3.0
3.3
3.6
3.9
Supply Voltage (V)
Supply Voltage (V)
TOTAL HARMONIC DISTORTION + NOISE
vs SAMPLING FREQUENCY
(fS = 8kHz to 26kHz)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SAMPLING FREQUENCY
(fS = 8kHz to 26kHz)
–88
–90
–92
–94
–96
96
94
92
90
88
BW = 3.4kHz
BW = 3.4kHz
SNR
Dynamic Range
0
8
16
24
32
0
8
16
24
32
f
S (kHz)
f
S (kHz)
®
7
PCM3500
TYPICAL PERFORMANCE CURVES
ADC SECTION
DIGITAL FILTER
DECIMATION FILTER
STOPBAND ATTENUATION CHARACTERISTICS
DECIMATION FILTER FREQUENCY RESPONSE
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–20
–40
–60
–80
–100
–120
–140
–160
–180
–200
0
0.2
0.4
0.6
0.8
1.0
0
8
16
24
32
Normalized Frequency (• fS Hz)
Normalized Frequency (• fS Hz)
DECIMATION FILTER TRANSITION
BAND CHARACTERISTICS
DECIMATION FILTER
PASSBAND RIPPLE CHARACTERISTICS
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10
0.2
0.0
–4.13dB at 0.5 • fS
–0.2
–0.4
–0.6
–0.8
–1.0
0.45 0.46 0.47 0.48 0.49 0.50 0.51 0.52 0.53 0.54 0.55
Normalized Frequency (• fS Hz)
0
0.1
0.2
0.3
0.4
0.5
Normalized Frequency (• fS Hz)
HIGH-PASS FILTER FREQUENCY RESPONSE
STOPBAND CHARACTERISTICS
HIGH-PASS FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–10
0
0.1
0.2
0.3
0.4
0.5
0
1
2
3
4
Normalized Frequency (• fS/1000 Hz)
Normalized Frequency (• fS/1000 Hz)
®
PCM3500
8
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and fSIGNAL = 1kHz, unless otherwise specified.
ADC SECTION
ANALOG FILTER
ANTI-ALIASING FILTER
ANTI-ALIASING FILTER
STOPBAND CHARACTERISTICS
PASSBAND CHARACTERISTICS
0
–5
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–10
–15
–20
–25
–30
–35
–40
–45
–50
100
1k
10k
100k
1M
10M
1
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
ADC OUTPUT SPECTRA
ADC OUTPUT SPECTRUM (–60dB, N = 8192)
ADC OUTPUT SPECTRUM (–0.5dB, N = 8192)
0
–20
0
–20
–40
–40
–60
–60
–80
–80
–100
–120
–140
–100
–120
–140
0
1
2
3
4
0
1
2
3
4
Frequency (kHz)
Frequency (kHz)
TOTAL HARMONIC DISTORTION + NOISE
vs SIGNAL NOISE
0
–20
–40
–60
–80
THD+N fluctuates with signal level
as harmonics are limited to second
and third components.
–100
–96
–84
–72
–60
–48
–36
–24
–12
0
Signal Level (dB)
®
9
PCM3500
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and fSIGNAL = 1kHz, unless otherwise specified.
ADC SECTION
ADC CHARACTERISTICS vs TEMPERATURE, SUPPLY AND SAMPLING FREQUENCY
TOTAL HARMONIC DISTORTION + NOISE
vs TEMPERATURE
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs TEMPERATURE
(TA = –25°C to +85°C)
(TA = –25°C to +85°C)
–84
–86
–88
–90
–92
92
90
88
86
84
SNR
Dynamic Range
–50
–25
0
25
50
75
100
–50
–25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
TOTAL HARMONIC DISTORTION + NOISE
vs SUPPLY VOLTAGE
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SUPPLY VOLTAGE
(VCC = VDD = +2.7V to +3.6V)
(VCC = VDD = +2.7V to +3.6V)
–84
–86
–88
–90
–92
92
90
88
86
84
Dynamic Range
SNR
2.4
2.7
3.0
3.3
3.6
3.9
2.4
2.7
3.0
3.3
3.6
3.9
Supply Voltage (V)
Supply Voltage (V)
TOTAL HARMONIC DISTORTION + NOISE
vs SAMPLING FREQUENCY
(fS = 8kHz to 26kHz)
DYNAMIC RANGE AND SIGNAL-TO-NOISE RATIO
vs SAMPLING FREQUENCY
(fS = 8kHz to 26kHz)
–84
–86
–88
–90
–92
96
94
92
90
88
BW = 3.4kHz
BW = 3.4kHz
SNR
Dynamic Range
0
8
16
24
32
0
8
16
24
32
fS (kHz)
f
S (kHz)
®
PCM3500
10
TYPICAL PERFORMANCE CURVES (Cont.)
TA = +25°C, VCC = VDD = +3.3V, fS = 8kHz, and fSIGNAL = 1kHz, unless otherwise specified.
SUPPLY CURRENT vs SUPPLY VOLTAGE AND SAMPLING FREQUENCY
SUPPLY CURRENT vs SUPPLY VOLTAGE
SUPPLY CURRENT vs SUPPLY VOLTAGE
12
10
8
12
10
8
ICC + IDD
ICC + IDD
ICC
ICC
6
6
4
4
IDD
IDD
2
2
ICC + IDD at Power Down
ICC + IDD at Power Down
0
0
2.4
2.7
3.0
3.3
3.6
3.9
2.4
2.7
3.0
3.3
3.6
3.9
Supply Voltage (V)
Supply Voltage (V)
®
11
PCM3500
SAMPLING FREQUENCY (kHz)
SYSTEM CLOCK FREQUENCY (MHz)
SYSTEM CLOCK AND RESET/
POWER DOWN
8
11.025
16
22.05
24
4.096
5.6448
8.192
11.2896
12.288
SYSTEM CLOCK INPUT AND OUTPUT
The PCM3500 requires a system clock for operating the
digital filters and delta-sigma data converters.
TABLE I. System Clock Frequencies for Common Sam-
pling Frequencies.
The system clock may be supplied from an external master
clock or generated using the on-chip crystal oscillator cir-
cuit. Figure 1 shows the required connections for external
and crystal clock operation. The system clock must operate
at 512 times the sampling frequency, fS, with sampling
frequencies from 7.2kHz to 26kHz. This gives an effective
system clock frequency range of 3.6864MHz to 13.312MHz.
For either case, XTO (pin 16) should be left open. The system
clock source should be free of noise and exhibit low phase
jitter in order to obtain optimal dynamic performance from
the PCM3500. Figure 2 shows the system clock timing
requirements associated with an external master clock.
Table I shows system clock frequencies for common sam-
pling frequencies.
For crystal oscillator operation, a crystal is connected be-
tween XTI (pin 17) and XTO (pin 16), along with the
necessary load capacitors (10pF to 33pF per pin, as shown
in Figure 1). A fundamental-mode, parallel resonant crystal
is required.
For external clock operation, XTI (pin 17) or SCKIO (pin 15)
is driven by a master clock source. If SCKIO is used as the
system clock input, then XTI must be connected to ground.
SCKIO
SCKIO
SCKIO
External
Clock
C1
Crystal
XTI
XTI
XTI
External
Clock
R
R
R
C2
XTO
XTO
XTO
C1, C2 = 10pF to 33pF
PCM3500
PCM3500
PCM3500
EXTERNAL CLOCK INPUT-XTI
(XTO must be open)
EXTERNAL CLOCK INPUT-SCKIO
(XTO must be open)
CRYSTAL RESONATOR
CONNECTION
FIGURE 1. System Clock Generation.
tCLKIH
"H"
"L"
XTI
or
SCKIO
0.7VDD
0.3VDD
1/512fS
tCLKIL
System Clock Pulse Width HIGH tCLKIH
System Clock Pulse Width LOW tCLKIL
20ns (min)
20ns (min)
FIGURE 2. External System Clock Timing Requirements.
®
PCM3500
12
PDWN causes the reset initialization sequence to start.
During the initialization sequence, the DAC output is forced
to AGND, and the ADC output is forced to a high impedance
state. After the initialization sequence has completed, the
DAC and ADC outputs experience a delay before they
output a valid signal or data. Refer to Figures 4 and 5 for
external reset and post-reset delay timing.
Reset and Power Down
The PCM3500 supports power-on reset, external reset, and
power-down operations. Power-on reset is performed by
internal circuitry automatically at power up, while the exter-
nal reset is initiated using the PDWN input (pin 20).
Power-on reset occurs when power and system clock are
initially applied to the PCM3500. The internal reset cir-
cuitry requires that the system clock be active at power up,
with at least three system clock cycles occurring prior to
VDD = 2.2V. When VDD exceeds 2.2V, the power-on reset
comparator enables the initialization sequence, which re-
quires 1024 system clock periods for completion. During
the initialization sequence, the DAC output is forced to
AGND, and the ADC output is forced to a high impedance
state. After the initialization sequence has completed, the
DAC and ADC outputs experience a delay before they
output a valid signal or data. Refer to Figures 3 and 5 for
power-on reset and post-reset delay timing.
Power-down mode is enabled by setting PDWN = ‘0’.
During power-down mode, minimum current is drawn when
the system clock is removed, resulting in 60µA (typical)
power supply current. The PDWN input includes an internal
pull-down resistor, which places the PCM3500 in power-
down mode at power-up if the PDWN pin is left uncon-
nected. Ideally, the PDWN input should be driven by active
logic in order to control reset and power-down operation. If
the PDWN pin is to be unused in the system application, it
should be connected to VDD to enable normal operation. By
setting PDWN = ‘1’ when exiting power-down mode, the
PCM3500 will initiate an external reset as described earlier
in this section.
External reset is performed by first setting PDWN = ‘0’ and
then setting PDWN = ‘1’. The LOW to HIGH transition on
2.4V
2.2V
2.0V
VDD
Reset
Reset Removal
Internal Reset
1024 System Clock Periods
System Clock
FIGURE 3. Power-On Reset Timing.
PWDN = LOW Pulse Width
RST = 40ns minimum
t
PDWN
tRST
Reset
Reset Removal
Internal Reset
1024 System Clock Periods
System Clock
FIGURE 4. External Reset Timing.
Reset Removal or Power Down OFF
Internal Reset
or Power Down
Ready/Operation
Reset
Power Down
tDACDLY1 (2048/fS)
VCOM
DAC VOUT
GND
(0.5VCC
tADCDLY1 (2304/fS)
High Impedance
)
(1)
ADC DOUT
NOTE: (1) The HPF transient response (exponentially attenuated signal from ±0.2% DC of FSR with 200ms time constant) appears initially.
FIGURE 5. DAC and ADC Output for Reset and Power Down.
®
13
PCM3500
SERIAL INTERFACE
anteed in Master Mode). Data for DIN is clocked into the
serial interface on the rising edge of BCK, while data for
DOUT is clocked out of the serial interface on the falling
edge of BCK.
The serial interface of the PCM3500 is a 4-wire synchronous
serial port. It includes FS (pin 9), BCK (pin 8), DIN (pin 10)
and DOUT (pin 11). FS is the frame synchronization clock,
BCK is the serial bit or shift clock, DIN is the serial data input
for the DAC, and DOUT is the serial data output for the ADC.
Figure 6 shows the serial interface format for the PCM3500.
The serial data for DIN and DOUT must be in Binary Two’s
Complement, MSB-first format. Figures 7 and 8 show the
timing specifications for the serial interface when used in
Slave and Master Modes.
The frame sync, FS, operates at the sampling frequency (fS).
The bit clock, BCK, operates at 16fS for normal operation.
DIN and DOUT also operate at the bit clock rate. Both FS
and BCK must be synchronous with the system clock (guar-
FS
BCK
DIN
15 14 13 12 11
MSB
5
5
4
4
3
3
2
2
1
1
0
15 14 13 12 11
5
5
4
4
3
3
2
2
1
1
0
LSB MSB
LSB
DOUT
15 14 13 12 11
MSB
0
15 14 13 12 11
0
LSB MSB
LSB
1/fS
16-Bit/Frame
FIGURE 6. Serial Interface Format.
tFSP
tFSW
FS
(input)
0.5VDD
0.5VDD
0.5VDD
0.5VDD
tFSSU
tFSHD
tBCKP
BCK
(input)
tBCKH
tBCKL
DIN
(input)
tDIHD
tDISU
DOUT
(output)
tCKDO
NOTES: Timing measurement reference level is (V /V )/2. RIsing and falling time is measured
IH IL
from 10% to 90% of IN/OUT signal swing. Load capacitance of DOUT signal is 50pF.
SYMBOL DESCRIPTION
MIN
TYP
MAX
UNITS
tBCKP
BCK Period
2400
800
ns
ns
ns
ns
tBCKH
tBCKL
tFSW
tFSP
BCK Pulse Width HIGH
BCK Pulse Width LOW
800
FS Pulse Width HIGH
tBCKP – 60
tBCKP
1/fS
tBCKP + 60
FS Period
tFSSU
tFSHD
tDISU
tDIHD
tCKDO
tR
FS Set Up Time to BCK Rising Edge
FS Hold Time to BCK Rising Edge
DIN Set Up Time to BCK Rising Edge
DIN Hold Time to BCK Rising Edge
Delay Time BCK Falling Edge to DOUT
Rising Time of All Signals
Falling Time of All Signals
60
60
60
60
0
ns
ns
ns
ns
ns
ns
ns
80
30
30
tF
FIGURE 7. Serial Interface Timing for Slave Mode.
®
PCM3500
14
tFSP
tFSW
FS
(output)
0.5VDD
0.5VDD
0.5VDD
0.5VDD
tCKFS
tBCKP
BCK
(output)
tBCKH
tBCKL
DIN
(input)
tDIHD
tDISU
DOUT
(output)
tCKDO
NOTES: Timing measurement reference level is (V /V )/2. Rising and falling time is measured from
IH IL
10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, FS, BCK signal is 50pF.
SYMBOL DESCRIPTION
MIN
TYP
MAX
UNITS
tBCKP
tBCKH
tBCKL
tCKFS
tFSW
tFSP
BCK Period
2400
1200
16000
8000
ns
ns
ns
ns
ns
BCK Pulse Width HIGH
BCK Pulse Width LOW
1200
8000
Delay Time BCK Falling Edge to FS
FS Pulse Width HIGH
– 40
40
tBCKP – 60
tBCKP
1/fS
tBCKP + 60
FS Period
tDISU
tDIHD
tCKDO
tR
DIN Set Up Time to BCK Rising Edge
DIN Hold Time to BCK Rising Edge
Delay Time BCK Falling Edge to DOUT
Rising Time of All Signals
Falling Time of All Signals
60
60
0
ns
ns
ns
ns
ns
80
30
30
tF
FIGURE 8. Serial Interface Timing for Master Mode.
System
Clock
System
Clock
PCM3500
PCM3500
XTI
FS
XTI
FS
BCK
BCK
DIN
Controller
Controller
DIN
GND
GND
VDD
M/S
DOUT
M/S
TSC
DOUT
GND
TSC
Slave Mode
Master Mode
FIGURE 9. Slave and Master Mode Connections.
Slave Mode Operation
MASTER/SLAVE OPERATION
In Slave Mode, the FS and BCK pins are inputs to the
PCM3500. Both FS and BCK should be derived from the
system clock signal (XTI or SCKIO) to ensure proper
synchronization. Slave Mode is best suited for applications
where the DSP or controller is capable of generating the FS,
BCK, and system clocks using an on-chip serial port and/or
timing generator.
The serial interface supports both Slave and Master Mode
operation. The mode is selected by the M/S input (pin 6).
Table II shows mode and pin settings corresponding to the
M/S input selection. Figure 9 shows connections for Slave
and Master mode operation.
SERIAL
INTERFACE
Master Mode Operation
M/S (PIN 6)
MODE
FS (PIN)
BCK (PIN 8)
In Master Mode operation, both FS and BCK are clock
outputs generated by the PCM3500 from the system clock
input (XTI, SCKIO, or a crystal). In Master Mode, the timing
and phase relationships between system clock, FS, and BCK
are managed internally to provide optimal synchronization.
0
1
Slave
Input
Input
Master
Output
Output
TABLE II. Master/Slave Mode Selection.
®
15
PCM3500
interface bus. This is useful for system applications that
require multiple modem or voice channels. Figure 11 shows
examples of Time Slot Mode connections.
SYNCHRONIZATION REQUIREMENTS
The PCM3500 requires that FS and BCK be synchronous
with the system clock. Internal circuitry is included to detect
a loss of synchronization between FS and the system clock
input. If the phase relationship between FS and the system
clock varies more than ± 1.5 BCK periods, the PCM3500
will detect a loss of synchronization. Upon detection, the
DAC output is forced to 0.5VCC and the DOUT pin is forced
to a high impedance state. This occurs within one sampling
clock (FS) period of initial detection. Figure 10 shows the
loss of synchronization operation and the DAC and ADC
output delays associated with it.
Time Slot Mode defines a 64-bit long frame, composed of
four time slots. Each slot is 16 bits long and corresponds to
one of four CODECs. The FS pin on the first PCM3500
(CODEC A, Slot 0) is used as the master frame sync, and
operates at the sampling frequency, fS. The bit clock, BCK,
operates at 64fS. DIN and DOUT of each CODEC also
operate at 64fS. Figure 12 shows the operation of the Time
Slot Mode.
Time Slot operation is enabled or disabled using the TSC
input (pin 7). The state of the TSC pin is updated at power-
on reset, or on the rising edge of PWDN input (if using
external reset or power-down mode). A forced reset is
required when changing from Slave to Master Mode, or visa
versa, in real time.
TIME SLOT OPERATION
The PCM3500 serial interface supports Time Division
Multiplexing (TDM) using the Time Slot Mode. Up to four
PCM3500s may be connected on the same 4-wire serial
Synchronization
Lost
Resynchronization
State of
Synchronization
Synchronous
Asynchronous
Synchronous
within
1/fS
tDACDLY2 (32/fS)
VCOM
(0.5 VCC
VCOM
(0.5 VCC
Undefined Data
Normal
)
)
DAC VOUT
Normal
tADCDLY2 (32/fS)
Undefined Data
Normal
High Impedance
Normal(1)
ADC DOUT
NOTE: (1) The HPF transient response (exponentially attenuated signal from ±0.2% DC of FSR
with 200ms time constant) appears initially.
FIGURE 10. Loss of Synchronization Operation and Timing.
PCM3500
(CODEC A, Slot 0)
SCKIO
FS
XTI
Controller
XTO
BCK
DIN
VDD
VDD
M/S
DOUT
FSO
TSC
PCM3500
(CODEC B, Slot 1)
SCKIO
FS
XTI
XTO
BCK
DIN
M/S
GND
VDD
DOUT
FSO
TSC
To Two PCM3500s
FIGURE 11. Time Slot Mode Connections.
®
PCM3500
16
One Frame = 1/fS, 64 Bits per Frame, 16 Bits per Slot
CODEC A
CODEC B
CODEC C
CODEC D
Slot 0, 16 Bits
Slot 1, 16 Bits
Slot 2, 16 Bits
Slot 3, 16 Bits
FS
BCK
FS (A)
FSO (A)
FS (B)
FSO (B)
FS (C)
FSO (C)
FS (D)
FSO (D)
DIN
DOUT (A)
DOUT (B)
DOUT (C)
DOUT (D)
MSB
LSB
High Impedance
High Impedance
High Impedance
High Impedance
High Impedance
FIGURE 12. Time Slot Mode Operation.
®
17
PCM3500
ate in Loop-Back Mode, allowing the host to read the ADC
data at the DOUT pin.
Table III shows the TSC pin settings and corresponding
mode selections. When Time Slot Mode is enabled, FSO
(pin 12) is used as a frame sync output, which is connected
to the FS input of the next PCM3500 in the Time Slot
sequence. Figures 13 and 14 provide detailed timing for
Time Slot Mode operation.
LOOP (PIN 19)
LOOP-BACK MODE
0
1
Loop-Back Mode Disabled, Normal Operation
Loop-Back Mode Enabled
TABLE IV. Loop-Back Mode Selection.
TSC (PIN 7)
TIME SLOT MODE
0
1
Time Slot Mode Disabled, Normal Operation
Time Slot Operation Enable
HIGH-PASS FILTER
The PCM3500 includes a digital high-pass filter in the ADC
which may be used to remove the DC offset created by the
analog front-end (AFE) section. The high-pass filter response
is shown in Figure 15. The high-pass filter may be enabled or
disabled using the HPFD input (pin 18). Table V shows the
HPFD pin settings and corresponding mode selections.
TABLE III. Time Slot Mode Selection.
ADC-TO-DAC LOOP BACK
The PCM3500 includes a Loop-Back Mode, which directly
feeds the ADC data to the DAC input. This mode is designed
for diagnostic testing and system adjustment. Loop-Back
Mode is enabled and disabled using the LOOP input (pin
19). Table IV shows the LOOP pin settings and correspond-
ing mode selections. The serial interface continues to oper-
HPFD (PIN 18)
HIGH-PASS FILTER MODE
0
1
High-Pass Filter On
High-Pass Filter Off
TABLE V. High-Pass Filter Mode Selection.
tFSP
tFSW
FS
(input)
0.5VDD
tFSSU
tFSHD
tBCKP
BCK
(input)
0.5VDD
tBCKL
tBCKH
DIN
(input)
0.5VDD
tDIHD
High Impedance
tDISU
High Impedance
0.5VDD
DOUT
(output)
tHZDO
tCKDO
tDOHZ
FSO
(output)
0.5VDD
tBFSO
tFSOW
NOTES: Timing measurement reference level is (V /V )/2. Rising and falling time is measured from
IH IL
10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, and FSO signal is 50pF.
SYMBOL
DESCRIPTION
MIN
TYP
MAX
UNITS
tBCKP
tBCKH
tBCKL
tFSW
tFSP
BCK Period
600
200
ns
ns
ns
ns
BCK Pulse Width HIGH
BCK Pulse Width LOW
200
FS Pulse Width HIGH
tBCKP – 60
tBCKP
1/fS
tBCKP + 60
FS Period
tFSSU
tFSHD
tDISU
tDIHD
tCKDO
tHZDO
tDOHZ
tFSOW
tBFSO
tR
FS Set Up TIme to BCK Rising Edge
FS Hold TIme to BCK RIsing Edge
DIN Set Up Time to BCK Rising Edge
DIN Hold Time to BCK Rising Edge
Delay Time BCK Falling Edge to DOUT
Delay Time BCK Falling Edge to DOUT Active
Delay Time BCK Falling Edge to DOUT Inactive
FSO Pulse Width HIGH
60
60
60
60
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
80
20
19.5
tBCKP
tBCKP – 60
0
tBCKP + 60
Delay Time BCK Falling Edge to FSO
Rising Time of All Signals
80
30
30
tF
Falling Time of All Signals
FIGURE 13. Serial Interface Timing for Time Slot Mode Operation (Slave Mode).
®
PCM3500
18
tFSP
tFSW
FS
(output)
0.5VDD
0.5VDD
0.5VDD
tBCKP
tCKFS
BCK
(output)
tBCKL
tBCKH
DIN
(input)
tDIHD
High Impedance
tDISU
High Impedance
0.5VDD
DOUT
(output)
tHZDO
tCKDO
tDOHZ
FSO
(output)
0.5VDD
tBFSO
tFSOW
NOTES: Timing measurement reference level is (V /V )/2. Rising and falling time is measured from
IH IL
10% to 90% of IN/OUT signal swing. Load capacitance of DOUT, FSO, FS, and BCK signal is 50pF.
SYMBOL
DESCRIPTION
MIN
TYP
MAX
UNITS
tBCKP
tBCKH
tBCKL
tCKFS
tFSW
tFSP
BCK Period
600
300
4000
2000
ns
ns
ns
ns
ns
BCK Pulse Width HIGH
BCK Pulse Width LOW
300
2000
Delay Time BCK Falling Edge to FS
FS Pulse Width HIGH
–40
40
tBCKP – 60
tBCKP
1/fS
tBCKP + 60
FS Period
tDISU
tDIHD
tCKDO
tHZDO
tDOHZ
tFSOW
tBFSO
tR
DIN Set Up Time to BCK Rising Edge
DIN Hold Time to BCK Rising Edge
Delay Time BCK Falling Edge to DOUT
Delay Time BCK Falling Edge to DOUT Active
Delay Time BCK Falling Edge to DOUT Inactive
FSO Pulse Width HIGH
60
60
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
80
20
19.5
tBCKP
tBCKP – 60
0
tBCKP + 60
Delay Time BCK Falling Edge to FSO
Rising Time of All Signals
80
30
30
tF
Falling Time of All Signals
FIGURE 14. Serial Interface Timing for Time Slot Mode Operation (Master Mode).
HIGH-PASS FILTER FREQUENCY RESPONSE
STOPBAND CHARACTERISTICS
HIGH-PASS FILTER FREQUENCY RESPONSE
PASSBAND CHARACTERISTICS
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0.0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–10
0
0.1
0.2
0.3
0.4
0.5
0
1
2
3
4
Normalized Frequency (• fS/1000 Hz)
Normalized Frequency (• fS/1000 Hz)
FIGURE 15. High-Pass Filter Response.
®
19
PCM3500
unbuffered on pin 1 for decoupling. A 1µF to 10µF alumi-
num electrolytic or tantalum capacitor is recommended for
decoupling purposes. This capacitor should be located as
close as possible to pin 1.
APPLICATIONS INFORMATION
BASIC CIRCUIT CONNECTIONS
The basic connection diagram for the PCM3500 is shown in
Figure 16. Included are the required power supply bypass and
reference decoupling capacitors. The DAC output, VOUT, and
the ADC input, VIN, should be AC-coupled to external cir-
cuitry.
The VCOM voltage is typically equal to VCC/2, and may be
used to bias external input and output circuitry. However,
since the VCOM pin is not a buffered output, it must drive a
high impedance load to avoid excessive loading. Buffering
the VCOM pin with an external op amp configured as a
voltage follower is recommended when driving multiple bias
nodes. Figure 17 shows examples of using VCOM with
external circuitry.
Reference Pin Connections
The VCOM voltage is used internally to bias the input and
output amplifier stages of the PCM3500. It is brought out
PCM3500
C3
C4
C5
+
+
+
+3.3V
1
2
3
4
5
6
7
8
9
VCOM
VREF
VCC 24
AGND 23
VOUT 22
AGND 21
PDWN 20
LOOP 19
HPFD 18
XTI 17
+
C1
1
V
REF2
VIN
External Reset
Power-Down Control
AGND
M/S
TSC
BCK
FS
XTO 16
Serial
Interface
External Clock System
10 DIN
SCKIO 15
DGND 14
VDD 13
C2
11 DOUT
12 FSO
+
+
+
C6
C7
Analog Line Interface Circuit
Telecom Line
C1, C2: Power supply bypass capacitors. Parallel combination of a 1µF to 10µF aluminum electrolytic capacitor and 0.1µF ceramic capacitor.
C3, C4, C5: VREF and VCOM bypass capacitors. Use a 1µF to 10µF aluminum electrolytic capacitor.
C6, C7: Input/output AC-coupling capacitors. Use a 0.1µF to 10µF aluminum electrolytic capacitor.
FIGURE 16. Basic Connection Diagram.
(a) Biasing an External Active Filter Stage
VCC
Non-Polarized
1µF
PCM3500
(b) Using a Buffer to Provide Bias for Multiple or
Low Input Impedance Nodes
VOUT
OPA343
VCOM
Use voltage follower
to buffer VCOM
+
4.7µF
PCM3500
VCOM
To Bias
Nodes
+
OPA340
4.7µF
FIGURE 17. Using VCOM to Bias External Circuitry.
®
PCM3500
20
VREF1 (pin 2) and VREF2 (pin 3) are reference voltages used
by the delta-sigma modulators. They are brought out strictly
for decoupling purposes. VREF1 and VREF2 are not to be
used to bias external circuits. A 1µF to 10µF aluminum
electrolytic or tantalum capacitor is recommended for
decoupling on each pin. These capacitors should be located
as close as possible to pins 2 and 3.
by a split ground plane, with the PCM3500 positioned
entirely over the analog section of the board. The AGNDs
(pins 5, 20, and 23) and DGND (pin 14) are connected
directly to the analog ground plane. The power supply pins,
VCC (pin 13) and VDD (pin 24), are routed directly to the
+2.7V to +3.6V analog power supply using wide copper
traces (100 mils or wider recommended) or a power plane.
Power supply bypass and reference decoupling capacitors
are shown located as close as possible to the PCM3500.
Power Supplies and Grounding
VCC (pin 24) and VDD (pin 13) should be connected directly
to the +2.7V to +3.6V analog power supply, as shown in
Figure 16. The AGNDs (pins 5, 21, and 23) and DGND (pin
14) should be connected directly to the analog ground.
Power supply bypass capacitors should be located as close
to the power supply pins as possible in order to ensure a low
impedance connection. A combination of a 10µF aluminum
electrolytic or tantalum capacitor in parallel with a 0.1µF
The PCM3500 is oriented so that the digital pins are facing
the ground plane split. Digital connections should be made
as short and direct as possible to limit high frequency
radiation and coupling. Series resistors (from 20Ω to 100Ω)
may be put in series with the system clock, FS, BCK, and
FSO lines to reduce or eliminate overshoot on clock edges,
further reducing radiated emissions. The split ground plane
should be connected at one point by a trace, wire, or ferrite
bead. Often the board will be designed to have several
jumper points for the common ground connection, so that
the best performance can be derived through experimenta-
tion.
ceramic capacitor is recommended for both VCC and VDD
.
VDD and VCC should not be connected to separate digital and
analog power supplies. This can lead to an SCR latch-up
condition, which can cause either degraded device perfor-
mance or catastrophic failures.
An alternative technique, using a single power supply or
battery, is shown in Figure 19. This technique is more
suitable for portable applications.
PCB LAYOUT GUIDELINES
The recommended PCB layout technique is shown in Figure
18. The analog and digital section of the board are separated
Digital Power
Supply
Analog Power
Supply
Common
Supply
Ferrite
Beads
Common
Connection
+3.3V
+3.3V
VCC
VDD
Host
and
VCC
VDD
PCM3500
Host
and
Logic
AGND DGND
PCM3500
Logic
AGND DGND
Digital I/Os
DIGITAL SECTION
Digital I/Os
DIGITAL SECTION
ANALOG SECTION
ANALOG SECTION
Split Grounds
Split Grounds
Analog
Ground
Digital
Ground
Analog
Ground
Digital
Ground
FIGURE 18. Recommended PCB Layout Technique.
FIGURE 19. PCB Layout Using a Single-Supply or Battery.
®
21
PCM3500
OUTPUT FILTER CIRCUITS FOR THE DAC
noise requirements for a particular system. Generally, a 2nd-
order or better low-pass circuit will be required, with the
cut-off frequency set to fS/2 or less.
The PCM3500’s DAC uses delta-sigma conversion tech-
niques. It uses oversampling and noise shaping to improve
in-band (f = fS/2) signal-to-noise performance at the expense
of increased out-of-band noise. The DAC output must be
low-pass filtered to attenuate the out-of-band noise to a
reasonable level.
Burr-Brown Application Bulletin AB-034 provides infor-
mation for designing both Multiple Feedback and Sallen-
Key active filter circuits using software available from Burr-
Brown’s web site. Another excellent reference for both
passive and active filter design is the “Electronic Filter
Design Handbook, Third Edition” by Williams and Taylor,
published by McGraw-Hill.
The PCM3500 includes a low-pass filter in the on-chip
output amplifier circuit. The frequency response for this
filter is shown in Figure 20. Although this filter helps to
lower the out-of-band noise, it is not adequate for many
applications. This is especially true for applications where
the sampling frequency is below 16kHz, since the out-of-
band noise above fS/2 is in the audio spectrum. An external
filter circuit, either passive or active, is required to provide
additional attenuation of the out-of-band noise. The low-
pass filter order will be dependent upon the out-of-band
ON-CHIP ANALOG FRONT END FOR THE ADC
The PCM3500 A/D converter includes a fully differential
input delta-sigma modulator. In order to simplify connection
for single-ended applications, an analog front end (AFE)
circuit has been included on the PCM3500 just prior to the
modulator. The AFE circuit is shown in Figure 21.
OUTPUT FILTER
OUTPUT FILTER
STOPBAND FREQUENCY RESPONSE
0
PASSBAND FREQUENCY RESPONSE
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10
100
1k
10k
100k
1M
10M
1
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
FIGURE 20. DAC Output Amplifier Filter Response.
1.0µF
50kΩ
VIN
4
+
(+)
(–)
Delta-Sigma
Modulator
VCOM
1
2
3
VREF
VREF
1
2
+
+
Reference
+
FIGURE 21. On-Chip AFE Circuit for the ADC.
®
PCM3500
22
The AFE circuit consists of a single-ended-to-differential
converter, with the first stage of the circuit doubling as a
low-pass, anti-alias filter. The frequency response for the
filter is shown in Figure 22. Since the delta-sigma modulator
oversamples the input at 64fS, the anti-alias filter require-
ments are relaxed, with only a single-pole filter being re-
quired. If an application requires further band limiting of the
input signal, a simple RC filter at the VIN input (pin 4) can
be used, as shown in Figure 23.
provide the complete modem function. Figure 24 shows a
simplified block diagram of a software modem using the
PCM3500.
The DAA provides the interface between the CODEC and
two-wire telephone line. The DAA provides numerous
functions, including two-to-four wire conversion, modem-
side to line-side isolation, ring detection, hook switch con-
trol, line current compensation, and overvoltage protection.
The host CPU provides the data pump and supervisory
functions for the software modem application. The host
executes modem software code, which includes the neces-
sary routines for transmit and receive functions, error detec-
tion and correction, echo cancellation, and CODEC/DAA
control and supervision.
SOFTWARE MODEM
APPLICATIONS
The PCM3500 was designed to meet the requirements for
software-based analog modems, supporting up to 56kbps(1).
In a software modem application, the PCM3500 is paired
with a Data Access Arrangement (DAA) and a host CPU to
NOTE: (1) Data transmission is limited to 53kbps over standard telephone
lines. Actual transmission rates vary depending upon the quality of the
lines and switching equipment for a given connection.
ANTI-ALIASING FILTER
ANTI-ALIASING FILTER
PASSBAND CHARACTERISTICS
0
STOPBAND CHARACTERISTICS
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
1
10
100
1k
10k
100k
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
FIGURE 22. Anti-Alias Filter Frequency Response.
Modem
Software
PCM3500
R
Analog
Input
+
VIN
Data
Access
Arrangement
(DAA)
Tip
Ring
Host
CPU
PCM3500
CODEC
C
Data
1
2π RC
f–3dB
=
Controls (ring detect, off hook, etc.)
FIGURE 23. Optional External Low-Pass Filter for the
ADC.
FIGURE 24. Software Modem Block Diagram.
®
23
PCM3500
I S O L A T I O N B A R R I E R
I S O L A T I O N B A R R I E
®
PCM3500
24
Software Modem AFE Application Circuit
wide dynamic range and excellent power supply rejection
performance. The input signal is sampled at a 64x
oversampling rate, eliminating the need for a sample-and-
hold circuit, and simplifying anti-alias filtering require-
ments. The 5th-order delta-sigma noise shaper consists of
five integrators which use a switched-capacitor topology, a
comparator, and a feedback loop consisting of a one-bit
DAC. The delta-sigma modulator shapes the quantization
noise, shifting it out of the audio band in the frequency
domain. The high order of the modulator enables it to
randomize the modulator outputs, reducing idle tone levels.
Figure 25 shows an applications circuit which utilizes the
PCM3500 and the DAA2000 from Infineon Technologies
(Siemens) to implement a complete modem AFE. The
DAA2000 provides modem-side (DM207) and line-side
(DL207) interfaces, with optical isolation separating the
functions. The PCM3500 is connected to the modem-side of
the DAA2000. The PCM3500’s serial interface and hard-
ware mode controls are connected to the host CPU.
The 64fS one-bit data stream from the modulator is con-
verted to 1fS, 16-bit data words by the decimation filter,
which also acts as a low-pass filter to remove the shaped
quantization noise. The DC components can be removed by
a high-pass filter function contained within the decimation
filter.
THEORY OF OPERATION
ADC SECTION
The PCM3500 A/D converter consists of two reference
circuits, a mono single-to-differential converter, a fully dif-
ferential 5th-order delta-sigma modulator, a decimation fil-
ter (including digital high pass), and a serial interface circuit.
The block diagram on the front page of this data sheet
illustrates the architecture of the ADC section, Figure 21
shows the single-to-differential converter, and Figure 26
illustrates the architecture of the 5th-order delta-sigma modu-
lator and transfer functions.
DAC SECTION
The delta-sigma DAC section of PCM3500 is based on a 5-
level amplitude quantizer and a 3rd-order noise shaper. This
section converts the oversampled input data to 5-level delta-
sigma format. A block diagram of the 5-level delta-sigma
modulator is shown in Figure 27. This 5-level delta-sigma
modulator has the advantage of stability and clock jitter
sensitivity over the typical one-bit (2 level) delta-sigma
modulator. The combined oversampling rate of the delta-
sigma modulator and the internal 8x interpolation filter is
64fS for a 512fS system clock. The theoretical quantization
noise performance of the 5-level delta-sigma modulator is
An internal reference circuit with three external capacitors
provides all reference voltages which are required by the
ADC, which defines the full-scale range for the converter.
The internal single-to-differential voltage converter saves
the design, space and extra parts needed for external cir-
cuitry required by many delta-sigma converters. The internal
full-differential signal processing architecture provides a
shown in Figure 28.
Analog In
X(z)
–
–
+
–
1st SW-CAP
Integrator
+
2nd SW-CAP
Integrator
3rd SW-CAP
Integrator
+
4th SW-CAP
Integrator
5th SW-CAP
Integrator
Qn(z)
Digital Out
Y(z)
+
+
+
+
+
+
+
+
H(z)
Comparator
1-Bit
DAC
Y(z) = STF(z) • X(z) + NTF(z) • Qn(z)
Signal Transfer Function
Noise Transfer Function
STF(z) = H(z)/[1 + H(z)]
NTF(z) = 1/[1 + H(z)]
FIGURE 26. Simplified 5th-Order Delta-Sigma Modulator.
®
25
PCM3500
+
–
+
–
+
+
+
+
Z–1
Z–1
Z–1
In
8fS
18-Bit
+
+
+
5-level Quantizer
4
3
2
1
0
Out
64fS
FIGURE 27. 5-Level Delta-Sigma Modulator Block Digram.
3rd-ORDER ∆Σ MODULATOR
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
–140
–150
0
5
10
15
20
25
30
Frequency (kHz)
FIGURE 28. Quantization Noise Spectrum.
®
PCM3500
26
PACKAGE OPTION ADDENDUM
www.ti.com
3-Oct-2003
PACKAGING INFORMATION
ORDERABLE DEVICE
STATUS(1)
PACKAGE TYPE
PACKAGE DRAWING
PINS
PACKAGE QTY
PCM3500E
ACTIVE
ACTIVE
SSOP
SSOP
DB
DB
24
24
58
PCM3500E/2K
2000
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, maskworkright, orotherTIintellectualpropertyrightrelatingtoanycombination, machine, orprocess
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
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is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
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Amplifiers
amplifier.ti.com
www.ti.com/audio
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dataconverter.ti.com
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www.ti.com/automotive
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dsp.ti.com
Broadband
Digital Control
Military
www.ti.com/broadband
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www.ti.com/military
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Logic
interface.ti.com
logic.ti.com
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Microcontrollers
power.ti.com
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www.ti.com/opticalnetwork
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Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated
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