PTCAN1463DYYRQ1 [TI]
具有 INH 和 WAKE 引脚的低功耗信号改进 CAN FD 收发器 | DYY | 14 | -40 to 150;型号: | PTCAN1463DYYRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 INH 和 WAKE 引脚的低功耗信号改进 CAN FD 收发器 | DYY | 14 | -40 to 150 |
文件: | 总58页 (文件大小:2746K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TCAN1463-Q1
ZHCSQV1C –MARCH 2020 –REVISED DECEMBER 2022
TCAN1463-Q1 具有睡眠模式的
汽车类信号改进CAN FD 收发器
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100(1 级)标准
• 提供功能安全
• 车身电子装置和照明
• 汽车网关
• 高级驾驶辅助系统(ADAS)
• 信息娱乐系统与仪表组
• 混合动力、电动和动力总成系统
• 个人交通工具- 电动自行车
• 工业运输
– 可帮助进行功能安全系统设计的文档
• 符合ISO 11898-2:2016 的要求
• 实现信号改善功能(SIC),在CiA 601-4 中定义
– 通过消除振铃和增强位对称性来积极改进总线信
号
• 支持高达8Mbps 的传统CAN 和CAN FD
• 宽工作输入电压范围
• VIO 电平转换支持:1.7V 至5.5V
• 工作模式:
– 正常模式
3 说明
TCAN1463-Q1 是一款高速控制器局域网 (CAN) 收发
器,满足 ISO 11898-2:2016 高速 CAN 规范的物理层
要求和 CiA 601-4 SIC 规范。该器件支持高达 8 兆位
每秒 (Mbps) 的传统 CAN 和 CAN FD(灵活数据速
率)数据速率。
– 静音模式
– 待机模式
– 低功耗睡眠模式
TCAN1463-Q1 可减少显性到隐性边沿的信号振铃,并
能在复杂的网络拓扑中实现更高的吞吐量。借助SIC,
应用能够在具有多个未端接存根的大型网络中以
2Mbps、5Mbps 或更高的速率运行,从而发挥 CAN
FD 的真正优势。当不使用 INH_MASK 功能
(INH_MASK 引脚悬空或连接到 GND)时,该器件与
传统 CAN FD 收发器(例如 TCAN1043A-Q1 或
TCAN1043-Q1)的引脚兼容。
• 高压INH 输出,用于系统电源控制
• INH_MASK 引脚可在虚假唤醒事件期间使INH 保
持禁用状态
• 支持通过WAKE 引脚实现本地唤醒
• 如果出现系统电源故障或软件故障,睡眠唤醒错误
(SWE) 计时器可将系统从待机模式安全转换为睡眠
模式。
– 支持长时间上电
封装信息
封装1
• 定义了未上电时的行为
– 总线和IO 终端为高阻抗(运行总线或应用上无
负载)
封装尺寸(标称值)
4.20mm x 2.00mm
8.65mm x 3.90mm
4.50mm x 3.00mm
器件型号
SOT (DYY)
TCAN1463-Q1
SOIC (D)
• 保护特性:
VSON (DMT)
– ±58V CAN 总线容错
– VSUP 上支持负载突降
1. 如需了解所有可用封装,请参阅数据表末尾的可订
购产品附录。
– IEC ESD 保护
– 欠压保护
– 热关断保护
3
k
EN
VIN
22 nF
VBAT
33
100 nF
k
– TXD 显性状态超时(TXD DTO)
• 采用具有可湿性侧面的14 引脚引线式(SOT 和
SOIC)封装以及无引线(VSON) 封装,从而提高自
动光学检测(AOI) 能力
100
k
VREG
VSUP
10
5
V
VOUT
INH
WAKE
7
9
VCC
3
VIO
100 nF
VIO
CANH
5
6
13
100 nF
VDD
TCAN1463
EN
nSTB
nFAULT
GPIO
GPIO
GPIO
14
8
MCU
CANL
12
1
4
CAN FD
Controller
TXD
Optional:
Terminating
Node
RXD
Optional:
Filtering,
Transient and
ESD
2
11
INH_MASK
(leave floating or
connect to GND)
简化原理图
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLSFE5
TCAN1463-Q1
ZHCSQV1C –MARCH 2020 –REVISED DECEMBER 2022
www.ti.com.cn
Table of Contents
8 Parameter Measurement Information..........................13
9 Detailed Description......................................................18
9.1 Overview...................................................................18
9.2 Functional Block Diagram.........................................20
9.3 Feature Description...................................................21
9.4 Device Functional Modes..........................................28
10 Application Information Disclaimer...........................40
10.1 Application Information........................................... 40
11 Device and Documentation Support..........................45
11.1 Documentation Support.......................................... 45
11.2 接收文档更新通知................................................... 45
11.3 支持资源..................................................................45
11.4 商标.........................................................................45
11.5 Electrostatic Discharge Caution..............................45
11.6 术语表..................................................................... 45
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 说明(续).........................................................................2
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 ESD Ratings - IEC Specifications...............................4
7.4 Recommended Operating Conditions.........................5
7.5 Thermal Information....................................................5
7.6 Power Dissipation Ratings..........................................5
7.7 Power Supply Characteristics.....................................6
7.8 Electrical Characteristics.............................................7
7.9 Timing Requirements..................................................9
7.10 Switching Characteristics........................................10
7.11 Typical Characteristics............................................ 12
Information.................................................................... 45
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision B (November 2022) to Revision C (December 2022)
Page
• 删除了封装信息表中D 封装的“产品预发布”说明...........................................................................................1
• Changed text From: "The CAN Transceiver blocks its transmitter and receiver" To: "The CAN transceiver
blocks its transmitter" in the CAN Active section.............................................................................................. 37
Changes from Revision A (July 2022) to Revision B (November 2022)
Page
• 删除了封装信息表中DYY 封装的“产品预发布”说明......................................................................................1
Changes from Revision * (March 2021) to Revision A (July 2022)
Page
• 将文档从预告信息更改为量产数据....................................................................................................................1
5 说明(续)
TCAN1463-Q1 可通过 INH 输出引脚选择性地启用系统上可能存在的各种电源,从而减少整个系统级别的电池电
流消耗。这使得在低电流睡眠模式中,功率传送到除TCAN1463-Q1 以外的所有系统元件,同时对CAN 总线进行
监控。检测到唤醒事件时,TCAN1463-Q1 通过将INH 驱动至高电平来启动系统。
TCAN1463-Q1 具有一个SWE 计时器,可在无操作4 分钟(tINACTIVE) 后,从待机模式安全转换为睡眠模式。如果
MCU 出现故障,无法将器件转换为正常模式,这一特性也可以保证器件转换为低功耗的睡眠模式。
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6 Pin Configuration and Functions
TXD
1
2
3
4
5
6
7
14
13
12
11
10
9
nSTB
CANH
CANL
TXD
1
2
3
4
5
6
7
14
13
12
11
10
9
nSTB
GND
VCC ꢀ
GND
CANH
CANL
RXD
VIO ꢀ
INH_MASK
VSUP ꢀ
VCC
RXD
VIO
Thermal
Pad
INH_MASK
VSUP
EN
WAKE
INH
8
nFAULT
EN
WAKE
nFAULT
INH
8
Not to scale
图6-1. D and DYY Packages, 14 Pin (SOIC)
and (SOT) (Top View)
Not to scale
图6-2. DMT Package, 14 Pin (VSON)
(Top View)
PINS
TYPE (1)
DESCRIPTION
NAME
NO.
1
TXD
GND
VCC
I
GND
P
CAN transmit data input, integrated pull-up
2
Ground connection
3
5 V transceiver supply
RXD
VIO
4
O
P
CAN receive data output, tri-state when VIO < UVIO
I/O supply voltage
5
EN
6
I
Enable input for mode control, integrated pull-down
Inhibit pin to control system voltage regulators and supplies, high-voltage
Fault output, inverted logic
INH
7
O
O
I
nFAULT
WAKE
VSUP
8
9
Local WAKE input terminal, high voltage
High-voltage supply from battery
10
P
INH_MASK pin used to activate/deactivate INH functionality. Internal pull-down to GND. Can
be left floating or connected to GND if INH_MASK functionality is not needed. Do not
connect to power supply.
INH_MASK
11
I
CANL
12
13
14
I/O
I/O
I
Low-level CAN bus input/output line
CANH
High-level CAN bus input/output line
nSTB
Standby mode control input, integrated pull-down
Connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief
Thermal Pad
—
(1) I = input, O = output, P = power, GND = ground
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–58
-58
MAX
45
6
UNIT
VSUP
VCC
Supply voltage(2)
V
V
V
V
V
Supply voltage
VIO
Supply voltage I/O level shifter
CAN bus I/O voltage (CANH, CANL)
CAN bus differential voltage (VDIFF = VCANH - VCANL
6
VBUS
VDIFF
58
58
)
45 and VI ≤
VSUP+0.3
VWAKE
WAKE input voltage
INH pin voltage
V
V
–45
45 and VO ≤
VINH
-0.3
VSUP+0.3
VLOGIC
IO(LOGIC)
IO(INH)
IO(WAKE)
TJ
Logic pin voltage
6
8
V
–0.3
Logic pin output current
Inhibit pin output current
WAKE pin output current
Junction temperature
Storage temperature
mA
mA
mA
°C
6
3
165
150
–40
–65
TSTG
°C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not
sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,
performance, and shorten the device lifetime.
(2) Able to support load dumps of up to 45 V for 300ms
7.2 ESD Ratings
VALUE
UNIT
VSUP, CANH, CANL, and WAKE with
respect to ground. HBM ESD
classification level 3B
± 8000
V
Human body model (HBM), per AEC
Q100-002(1)
VESD Electrostatic discharge
All pins except VSUP, CANH, CANL, and
WAKE. HBM ESD classification level 3A
± 4000
± 750
V
V
Charged device model (CDM), per AEC
Q100-011
All pins. CDM ESD classification level C5
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 ESD Ratings - IEC Specifications
VALUE
UNIT
Unpowered Contact Discharge per ISO
10605 (1)
CANH, CANL, VSUP, and WAKE terminal to
GND
VESD Electrostatic discharge
± 8000
V
SAE J2962-2 per ISO 10605
Powered Contact Discharge (2)
VESD Electrostatic discharge
VESD Electrostatic discharge
CANH and CANL terminal to GND
CANH and CANL terminal to GND
± 8000
V
V
SAE J2962-2 per ISO 10605
Powered Air discharge (2)
± 15000
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VALUE
- 100
75
UNIT
Pulse 1
Pulse 2
Pulse 3a
Pulse 3b
V
V
V
V
Transient voltage per
CAN, VSUP, WAKE terminal to GND
CAN terminal to GND
ISO-7637-2 (1)
- 150
100
VTRAN
Direct coupling capacitor "slow transient
pulse" with 100 nF coupling capacitor -
powered
Transient voltage per
± 30
V
(2)
ISO-7637-3
(1) Results given here are specific to the IEC 62228-3 Integrated circuits –EMC evaluation of transceivers –Part 3: CAN transceivers.
Testing performed by IBEE Zwickau, EMC report available upon request.
(2) Results given here are specific to the SAE J2962-2 Communication Transceivers Qualification Requirements - CAN. Testing performed
by OEM-approved independent 3rd party, EMC report available upon request.
7.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
4.5
1.7
4.5
–2
NOM
MAX
40
UNIT
V
VSUP
VIO
Supply voltage
I/O supply voltage
5.5
5.5
V
VCC
CAN transceiver supply voltage
Digital output high-level current
Digital output low-level current
Inhibit output current
V
IOH(DO)
IOL(DO)
IO(INH)
TJ
mA
mA
mA
°C
°C
°C
°C
2
4
Operating junction temperature
Thermal shutdown
-40
175
160
150
TSDR
TSDF
TSD(HYS)
Thermal shutdown release
Thermal shutdown hysteresis
10
7.5 Thermal Information
TCAN1463-Q1
DMT (VSON)
UNIT
THERMAL METRIC (1)
D (SOIC)
DYY (SOT)
RΘJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
87.1
41.8
43.7
8.5
39.7
41.1
15.9
0.9
91.0
41.7
25.6
25.4
1.1
°C/W
RΘJC(top)
RΘJB
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ΨJT
43.3
N/A
15.9
6.6
ΨJB
RΘJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.6 Power Dissipation Ratings
POWER
DISSIPATION
PARAMETER
TEST CONDITIONS
UNIT
VSUP = 14 V, VCC = 5 V, VIO = 5 V, TJ = 27°C, RL = 60 Ω,
nSTB = 5 V, EN = 5 V, CL_RXD = 15 pF. Typical CAN
operating conditions at 500 kbps with 25% transmission
(dominant) rate.
62
mW
PD
Average power dissipation
VSUP = 14 V, VCC = 5.5 V, VIO = 5.5 V, TJ = 150°C, RL = 50
Ω, nSTB = 5.5 V, EN = 5.5 V, CL_RXD = 15 pF. Typical high
load CAN operating conditions at 1 Mbps with 50%
transmission (dominant) rate and loaded network.
135
mW
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7.7 Power Supply Characteristics
Over recommended operating conditions with TJ = -40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Supply Voltage and Current Characteristics
Supply current
ISUP_NORMAL
Normal mode, silent mode, and go-to-sleep mode
Standby mode (2)
140
60
µA
µA
µA
µA
CAN active
Supply current, Standby mode
ISUP_STBY
ISUP_SLEEP
ISUP_BIAS
CAN autonomous: inactive
Supply current
Sleep mode
18
30
CAN autonomous: inactive
Supply current
5.5 V < VSUP ≤28 V (1)
See 图8-3
50
Additional current when in CAN autonomous: active
UVSUP(R)
UVSUP(F)
Undervoltage VSUP threshold rising
Undervoltage VSUP threshold falling
Ramp up
3.85
3.5
4.4
V
V
Ramp down
4.25
Normal mode
TXD = 0 V, RL = 60 Ω, CL = open
See 图8-3
Supply current
CAN active: dominant
60
70
110
5
mA
mA
mA
mA
µA
Normal mode
TXD = 0 V, RL = 50 Ω, CL = open
See 图8-3
Supply current
CAN active: dominant
ICC_NORMAL
Normal mode
TXD = 0 V, RL = open, CL = open, CANH = -25 V
See 图8-3
VCC supply current normal mode
Dominant with bus fault
Normal mode
TXD = 0 V, RL = 50 Ω, CL = open
See 图8-3
Supply current
CAN active: recessive
ICC_NORMAL
Standby mode, TJ = -40 °C to 85 °C
EN = nSTB = 0 V
See 图8-3
Supply current
CAN autonomous: inactive
ICC_STBY
2
Standby mode
EN = nSTB = 0 V
See 图8-3
Supply current
CAN autonomous: inactive
ICC_STBY
5
µA
Silent and go-to-sleep mode
TXD = nSTB = VIO, RL = 50 Ω, CL = open
See 图8-3
Supply current
ICC_SILENT
2.5
2
mA
µA
Sleep mode, TJ = -40 °C to 85 °C
EN = 0 V or VIO, nSTB = 0 V
See 图8-3
Supply current
CAN autonomous: inactive
ICC_SLEEP
Sleep mode
EN = 0 V or VIO, nSTB = 0 V
See 图8-3
Supply current
CAN autonomous: inactive
5
µA
UVCC(R)
Undervoltage VCC threshold rising
Undervoltage VCC threshold falling
Hysteresis voltage on UVCC
Ramp up
4.1
3.9
4.4
V
V
UVCC(F)
Ramp down
3.5
50
VHYS(UVCC)
250
320
350
mV
Normal mode
RXD floating, TXD = 0 V
I/O supply current
I/O supply current
I/O supply current
I/O supply current
µA
µA
µA
µA
IIO_NORMAL
Normal mode, standby mode, or go-to-sleep mode
RXD floating, TXD = VIO
5
Sleep mode, TJ = -40 °C to 85 °C
nSTB = 0 V
2.5
IIO_SLEEP
Sleep mode
nSTB = 0 V
5
UVIO(R)
Under voltage VIO threshold rising
Under voltage VIO threshold falling
Hysteresis voltage on UVIO
Ramp up
1.4
1.25
60
1.65
V
V
UVIO(F)
Ramp down
1
VHYS(UVIO)
30
160
mV
(1) ISUP(BIAS) is calculated by subtracting the supply current in CAN autonomous inactive mode from the total supply current in CAN
autonomous active mode
(2) After a valid wake-up, the CAN transceiver switches to CAN autonomous active mode and the ISUP(BIAS) current needs to be added to
the specified ISUP current in CAN autonomous inactive mode.
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7.8 Electrical Characteristics
Over recommended operating conditions with TJ = –40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
CAN Driver Characteristics
CANH
CANL
2.75
0.5
4.5
V
V
TXD = 0 V, 50 ≤RL ≤65 Ω, CL = open, RCM
= open
See 图8-1 and 图8-4
Dominant output voltage
Bus biasing active
VO(D)
2.25
TXD = VIO, RL = open (no load), RCM = open
See 图8-1 and 图8-4
Recessive output voltage
Bus biasing active
VO(R)
2
3
V
nSTB= VIO, RL = 60 Ω, CSPLIT = 4.7 nF, CL
=
Driver symmetry
Bus biasing active
(VO(CANH) + VO(CANL) ) / VCC
Open, RCM = Open, TXD = 250 kHz, 1 MHz,
2.5 MHz
VSYM
0.9
1.1
V/V
See 图8-1 and 图8-4
DC Driver symmetry
Bus biasing active
nSTB= VIO, RL = 60 Ω, CL = open
See 图8-1 and 图8-4
VSYM_DC
400
3
mV
V
–400
1.5
V
CC –VO(CANH) –VO(CANL)
nSTB =VIO, TXD = 0 V, 50 Ω ≤RL ≤65 Ω, CL
= open
See 图8-1 and 图8-4
CANH - CANL
CANH - CANL
CANH - CANL
CANH - CANL
Differential output voltage
Bus biasing active
Dominant
nSTB =VIO, TXD = 0 V, 45 Ω ≤RL ≤70 Ω,
CL = open
See 图8-1 and 图8-4
VOD(DOM)
1.4
3.3
5
V
nSTB =VIO, TXD = 0 V, RL = 2240 Ω, CL
open
See 图8-1 and 图8-4
=
=
1.5
V
Differential output voltage
Bus biasing active
Recessive
nSTB =VIO, TXD = VIO, RL = open Ω, CL
open
See 图8-1 and 图8-4
VOD(REC)
50
mV
–50
nSTB =0 V, TXD = VIO, RL = open (no load),
CL = open
See 图8-1 and 图8-4
CANH
-0.1
0.1
V
Differential output voltage
Bus biasing inactive
Recessive
nSTB =0 V, TXD = VIO, RL = open (no load),
CL = open
See 图8-1 and 图8-4
VOD(STB)
CANL
-0.1
-0.2
0.1
0.2
V
nSTB =0 V, TXD = VIO, RL = open (no load),
CL = open
CANH - CANL
V
See 图8-1 and 图8-4
nSTB = VIO, TXD = 0 V
-15 V ≤V(CANH) ≤40 V
See 图8-1 and 图8-8
mA
mA
mA
–100
Short-circuit steady-state output current
Bus biasing active
Dominant
IOS(DOM)
nSTB = VIO, TXD = 0 V
-15 V ≤V(CANL) ≤40 V
See 图8-1 and 图8-8
100
3
nSTB = VIO, VBUS = CANH = CANL
-27 V ≤VBUS ≤42 V
Short-circuit steady-state output current
Bus biasing active
IOS(REC)
–3
Recessive
See 图8-1 and 图8-8
RID(dom)
Differential input resistance in dominant phase
40
60
ohm
ohm
See 图9-2
See 图9-2
Differential input resistance in active recessive
drive phase
RID(active_rec)
CAN Receiver Characteristics
Receiver dominant state input voltage range
Bus biasing active
VIT(DOM)
VIT(REC)
0.9
-3
8
V
V
nSTB = VIO, -12 V ≤VCM ≤12 V
See 图8-5 and 表9-6
Receiver recessive state input voltage range
Bus biasing active
0.5
nSTB = VIO
See 图8-5 and 表9-6
Hysteresis voltage for input threshold
Bus biasing active
VHYS
135
mV
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7.8 Electrical Characteristics (continued)
Over recommended operating conditions with TJ = –40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Receiver dominant state input voltage range
Bus biasing inactive
VDIFF(DOM)
VDIFF(REC)
1.150
8
V
V
nSTB = 0 V, -12 V ≤VCM ≤12 V
See 图8-5 and 表9-6
Receiver recessive state input voltage range
Bus biasing inactive
-3
0.4
nSTB = VIO
VCM
Common mode range
12
V
See 图8-5 and 表9-6
–12
Power-off (unpowered) bus input leakage
current
IOFF(LKG)
CI
VSUP = 0 V, CANH = CANL = 5 V
2.5
40
µA
pF
Input capacitance to ground (CANH or CANL)
TXD = VCC = VIO
TXD = VCC = VIO
(1)
CID
RID
RIN
Differential input capacitance (1)
Differential input resistance
20
100
50
pF
kΩ
kΩ
30
15
TXD = VCC = VIO = 5 V, nSTB = 5 V
-12 V ≤VCM ≤12 V
Input resistance (CANH or CANL)
Input resistance matching:
[1 –RIN(CANH) / RIN(CANL)] × 100%
RIN(M)
RCBF
V(CANH) = V(CANL) = 5 V
RCM = RL, CL = open
3
%
–3
Valid differential load impedance range for bus
fault circuitry
45
70
Ω
TXD Characteristics
VIH
High-level input voltage
0.7
VIO
VIO
µA
µA
µA
VIL
Low-level input voltage
0.3
1
IIH
High-level input leakage current
Low-level input leakage current
Unpowered leakage current
Pull-up resistance to VIO
Input Capacitance
TXD = VIO = 5.5 V
–2.5
–115
–1
IIL
TXD = 0 V, VIO = 5.5 V
TXD = 5.5 V, VSUP = VIO = 0 V
–2.5
1
ILKG(OFF)
RPU
CI
40
60
5
80
kΩ
VIN = 0.4 x sin(2 × π× 2 × 106 × t) + 2.5 V
pF
RXD Characteristics
IO = –2 mA
See 图8-5
VOH
High-level output voltage
0.8
VIO
IO = 2 mA
See 图8-5
VOL
Low-level output voltage
0.2
1
VIO
µA
ILKG(OFF)
Unpowered leakage current
RXD = 5.5 V, VSUP = VIO = 0 V
-1
nSTB Characteristics
VIH
High-level input voltage
0.7
VIO
VIO
µA
µA
µA
VIL
Low-level input voltage
0.3
115
1
IIH
High-level input leakage current
Low-level input leakage current
Unpowered leakage current
Pull-down resistance to GND
nSTB = VIO = 5.5 V
0.5
–1
–1
40
IIL
nSTB = 0 V, VIO = 5.5 V
nSTB = 5.5 V, VIO = 0 V
ILKG(OFF)
RPD
1
60
80
kΩ
nFAULT Characteristics
VOH
High-level output voltage
IO = -2 mA
0.8
–1
0.7
VIO
VIO
µA
VOL
Low-level output voltage
IO = 2 mA
0.2
1
ILKG(OFF)
Unpowered leakage current
nFAULT = 5.5 V, VIO = 0 V
INH_MASK Characteristics
VIH
High-level input voltage
VIO
VIO
µA
µA
µA
kΩ
VIL
Low-level input voltage
0.3
115
1
IIH
High-level input leakage current
Low-level input leakage current
Unpowered leakage current
Pull-down resistance to GND (1)
INH_MASK = VCC = VIO = 5.5 V
INH_MASK = 0 V, VCC = VIO = 5.5 V
INH_MASK = 5.5 V, VCC = VIO = 0 V
0.5
-1
IIL
ILKG(OFF)
RPD
-1
1
40
60
80
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7.8 Electrical Characteristics (continued)
Over recommended operating conditions with TJ = –40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
EN Characteristics
VIH
High-level input voltage
0.7
VIO
VIL
Low-level input voltage
0.3
115
1
VIO
µA
µA
µA
kΩ
IIH
High-level input leakage current
Low-level input leakage current
Unpowered leakage current
Pull-down resistance to GND
EN = VCC = VIO = 5.5 V
0.5
-1
IIL
EN = 0 V, VCC = VIO = 5.5 V
EN = 5.5 V, VCC = VIO = 0 V
ILKG(OFF)
RPD
WAKE Characteristics
-1
1
40
60
80
VIH
VIL
IIH
High-level input voltage
VSUP - 2
V
V
Sleep mode
Low-level input voltage
VSUP - 3.5
High-level input leakage current
Low-level input leakage current
-3
µA
µA
WAKE = VSUP –1 V
IIL
WAKE = 1 V
3
INH Characteristics
High-level voltage drop from VSUP to INH
(VSUP - VINH
0.5
4
1
V
ΔVH
IINH = –6 mA
)
ILKG(INH)
RPD
Sleep mode leakage current
Pull-down resistance
INH = 0 V
0.5
5.6
µA
–0.5
Sleep mode
2.5
MΩ
(1) Specified by design and verified via bench characterization
7.9 Timing Requirements
Over recommended operating conditions with TJ = -40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Supply Characteristics
Time required for INH active after VSUP
UVSUP(R)
≥
tPWRUP
340
µs
ms
µs
See 图8-12
CC ≤UVCC or VIO ≤UVIO
(1)
tUV
Undervoltage filter time VCC and VIO
100
350
200
V
Time for device to return to normal operation from
a UVCC or UVIO undervoltage event
tUV(RE-ENABLE)
Re-enable time after undervoltage event (1)
Device Characteristics
Total loop delay, driver input (TXD) to receiver
output (RXD) Recessive to dominant
RL = 60 Ω, CL = 100 pF, CL(RXD) = 15 pF
See 图8-6
tPROP(LOOP1)
100
110
190
ns
Total loop delay, driver input (TXD) to receiver
output (RXD) Dominant to recessive
RL = 60 Ω, CL = 100 pF, CL(RXD) = 15 pF
See 图8-6
tPROP(LOOP2)
tWK(TIMEOUT)
tWK(FILTER)
190
2
ns
ms
µs
Bus wake-up timeout value (1)
0.8
0.5
Bus time to meet filtered bus requirements for
wake-up request (1)
1.8
Timer is reset and restarted, when bus changes
from dominant to recessive or vice versa
tSILENCE
tINACTIVE
Timeout for bus inactivity (1)
0.6
3
1.2
5
s
Standby mode hardware timer for power-up inactivity
Measured from the start of a
4
min
dominant-recessive-dominant
Bus bias
nSTB = EN = 0 V, RL = 60 Ω, CSPLIT = 4.7 nF
See 图8-9 and 图10-3
tBIAS
200
µs
reaction time (1) sequence (each phase 6 μs)
until VSYM ≥0.1
45 ≤RCM ≤70 Ω
CL = open
tCBF
Bus fault-detection time
2.5
5
µs
µs
Hold time for which WAKE pin voltage should be stable after the rising or falling edge on WAKE pin to
recognize LWU
tWAKE_HT
50
Mode Change Characteristics
tINH_SLP_STB
Time after WUP or LWU event until INH asserted (1)
100
µs
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7.9 Timing Requirements (continued)
Over recommended operating conditions with TJ = -40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Hold time for which INH_MASK should be stable after the rising or falling edge to enable/disable
INH_MASK function
tINH_MASK
50
µs
See 图8-10 and 图8-11
Mode change time from leaving the Sleep mode to Time measured from VCC and VIO crossing UV
tMODE1
20
µs
entering Normal or Silent mode (1)
thresholds to entering normal or silent mode.
Mode change time between normal, silent and
Mode change time between normal, silent and
tMODE2
10
50
µs
µs
standby mode and from sleep to standby mode (1) standby mode and from sleep to standby mode
Minimum hold time for transition to sleep mode (1) EN = H and nSTB = L
tGOTOSLEEP
20
(1) Specified by design and verified via bench characterization
7.10 Switching Characteristics
Over recommended operating conditions with TJ = -40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Driver Characteristics
tprop(TxD-
Propagation delay time, high-to-low TXD edge to bus
dominant (recessive to dominant)
80
80
ns
ns
busdom)
RL = 60 Ω, CL = 100 pF, RCM = open
See 图8-4
tprop(TxD-
Propagation delay time, low-to-high TXD edge to bus
recessive (dominant to recessive)
busrec)
tsk(p)
tR
Pulse skew (|tprop(TxD-busdom) - tprop(TxD-busrec)|)
Differential output signal rise time
3
25
25
ns
ns
ns
RL = 60 Ω, CL = 100 pF, RCM = open
See 图8-4
tF
Differential output signal fall time
TXD = 0 V, RL = 60 Ω, CL = open
See 图8-7
tTXDDTO
Dominant timeout
1.2
3.8
ms
Receiver Characteristics
tprop(busdom-
Propagation delay time, bus dominant input to RxD low
output
110
110
ns
ns
RxD)
CL(RXD) = 15 pF
See 图8-5
tprop(busrec-
Propagation delay time, bus to recessive input to RXD
high output
RxD)
tR
tF
Output signal rise time (RXD)
Output signal fall time (RXD)
3
3
ns
ns
CL(RXD) = 15 pF
See 图8-5
RL = 60 Ω, CL = open
See 图8-5
tBUSDOM
Dominant time out
1.4
3.8
ms
CAN FD Characteristics
Bit time on CAN bus output pins with tBIT(TXD) = 500 ns
490
190
115
510
210
135
520
210
135
15
ns
ns
ns
ns
ns
ns
ns
ns
ns
(1)
tBIT(BUS)
Bit time on CAN bus output pins with tBIT(TXD) = 200 ns
Bit time on CAN bus output pins with tBIT(TXD) = 125 ns(2)
Bit time on RXD output pins with tBIT(TXD) = 500 ns
Bit time on RXD output pins with tBIT(TXD) = 200 ns
Bit time on RXD output pins with tBIT(TXD) = 125 ns(2)
Receiver timing symmetry with tBIT(TXD) = 500 ns
Receiver timing symmetry with tBIT(TXD) = 200 ns
Receiver timing symmetry with tBIT(TXD) = 125 ns(2)
470
170
95
RL = 60 Ω, CL1 = open, CL2 = 100 pF,
CL(RXD) = 15
ΔtREC = tBIT(RXD) - tBIT(BUS)
See 图8-6
(1)
tBIT(RXD)
–20
–20
–20
(1)
15
ΔtREC
15
Signal Improvement Characteristics
Time from rising edge of the TxD
signal to the end of the signal
improvement phase
tSIC_TX_base
Signal improvement time TX-based
530
10
ns
ns
Bus recessive bit length variation
relative to TxD bit length, see 图8-6
ΔtBit(Bus) = tBit(Bus) - tBit(TxD)
Transmitted bit width variation
ΔtBit(Bus)
–10
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7.10 Switching Characteristics (continued)
Over recommended operating conditions with TJ = -40°C to 150°C, unless otherwise noted. All typical values are taken at
25°C, VSUP = 12 V, VIO = 3.3 V, VCC = 5 V and RL = 60 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RxD recessive bit length variation
relative to TXD bit length, see 图8-6
ΔtBit(RxD) = tBit(RxD) - tBit(TxD)
Received bit width variation
20
ns
ΔtBIT(RxD)
–30
RXD recessive bit length variation
relative to bus bit length, see 图8-6
ΔtREC = tBit(RxD) - tBit(Bus)
Receiver timing symmetry
15
ns
ΔtREC
–20
(1) The input signal on TXD shall have rise times and fall times (10% to 90%) of less than 10 ns
(2) Specified by design and verified via bench characterization
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7.11 Typical Characteristics
3.5
3
2.5
2.25
2
VCC = 4.5 V
VCC = 5 V
VCC = 5.5 V
2.5
2
1.75
1.5
1.25
1
1.5
1
0.5
0
-40 -20
0
20
40
60
80 100 120 140 160
-40 -20
0
20
40
60
80 100 120 140 160
Junction Temperature (C)
Junction Temperature (C)
CL = Open
RCM = Open
RL = 60 Ω
CL = Open
RCM = Open
RL = 60 Ω
VCC = 5 V
VIO = 3.3 V
VIO = 3.3 V
图7-2. ICC Recessive vs Temperature
图7-1. VOD(DOM) vs Temperature and VCC
150
145
140
135
130
125
120
115
110
105
100
95
35
30
25
20
15
10
VIO = 1.7 V
VIO = 3.3 V
VIO = 5.5 V
VSUP = 4.5 V
VSUP = 7 V
VSUP = 12 V
VSUP = 18 V
VSUP = 28 V
VSUP = 40 V
90
-40 -20
0
20
40
60
80 100 120 140 160
Junction Temperature (C)
-40 -20
0
20
40
60
80 100 120 140 160
Junction Temperature (C)
CL = 100 pF
CL(RXD) = 15 pF
RL = 60 Ω
VCC = 5 V
VSUP = 12 V
CL = Open
VIO = 3.3 V
RCM = Open
RL = 60 Ω
VCC = 5 V
图7-4. Loop Propagation Delay vs VIO and Temperature
图7-3. ISUP in Sleep Mode vs VSUP and Temperature
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8 Parameter Measurement Information
CANH
2.5 V
RXD
Bias
Unit
GND
CANL
图8-1. Common-Mode Bias Unit and Receiver
CANH
RL/2
RL/2
TXD
CL2
CL1
CANL
nSTB
RXD
CL(RXD)
图8-2. Test Circuit
CANH
TXD
RL
CL
CANL
图8-3. Supply Test Circuit
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RCM
CANH
VIO
70%
TXD
30%
TXD
RL
CL
VOD
VCM
0V
Tprop(TXD-busdom)
Tprop(TXD-busrec)
VO(CANH)
90%
10%
CANL
RCM
0.9V
VO(CANL)
VOD
0.5V
tR
tF
图8-4. Driver Test Circuit and Measurement
CANH
0.9V
VID
IO
0.5V
RXD
0V
VID
tprop(busdom-RXD)
tprop(busrec-RXD)
VOH
VO
CL_RXD
CANL
90%
10%
70%
VO(RXD)
30%
VOL
tF
tR
图8-5. Receiver Test Circuit and Measurement
TXD
VI
70%
tPROP(LOOP1)
30%
30%
CANH
CANL
0V
TXD
5 x tBIT(TXD)
tBIT(TXD)
VI
RL
CL
tBIT(BUS)
900mV
500mV
RXD
VDIFF
VO
CL_RXD
RXD
VOH
70%
30%
tBIT(RXD)
VOL
tPROP(LOOP2)
图8-6. Transmitter and Receiver Timing Behavior Test Circuit and Measurement
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VIH
0V
CANH
TXD
TXD
RL
CL
VOD
VOD(D)
CANL
0.9V
VOD
0.5V
0V
tTXDDTO
图8-7. TXD Dominant Time Out Test Circuit and Measurement
200
s
IOS
CANH
TXD
VBUS
IOS
VCANH
,
VCANL
CANL
VBUS
0V
or
0V
VCANH
,
VCANL
VBUS
图8-8. Driver Short-Circuit Current Test and Measurement
VDIFF
2.0 V
1.15 V
0.4 V
t > tWK_FILTER(MAX)
t > tWK_FILTER(MAX)
t > tWK_FILTER(MAX)
VSYM
0.1
tBIAS
图8-9. Bias Reaction Time Measurement
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Device in Silent Mode
VIH
0.7 VIO
INH_MASK
nFAULT1
0 V
t > tINH_MASK
1
INH
tINH_SLP_STB
INH Enabled
INH Disabled
1. nFAULT clears upon exiting silent mode
图8-10. INH Disable Timing Diagram
Device in Silent Mode
VIH
INH_MASK
nFAULT1
0.3 VIO
0 V
t > tINH_MASK
1
INH
tINH_SLP_STB
INH Disabled
INH Enabled
1. nFAULT clears upon exiting silent mode
图8-11. INH Enable Timing Diagram
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VSUP
UVSUP(R)
VSUP
INH
VSUP
0V
VO
CVSUP
tPWRUP
TCAN1463
INH = H
VSUP -1V
INH
图8-12. Power-Up Timing
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9 Detailed Description
9.1 Overview
The TCAN1463-Q1 is a high-speed Controller Area Network (CAN) transceiver that meets the physical layer
requirements of the ISO 11898-2:2016 and CiA 601-4 high speed CAN specifications. The TCAN1463-Q1 is
data rate agnostic making it backward compatible for supporting classical CAN applications while also
supporting CAN FD networks up to 8 megabits per second (Mbps).
The transceiver has three separate supply inputs, VSUP, VCC, and VIO. By using VIO, the TCAN1463-Q1 can
interface directly to a 1.8 V, 2.5 V, 3.3 V, or 5 V controller without the need for a level shifter. The TCAN1463-Q1
allows for system-level reductions in battery current consumption by selectively enabling the various power
supplies that may be present in the system via the INH output pin. This enables a low-current sleep state in
which power is gated to all system components except for the TCAN1463-Q1, which remains in a low-power
state while monitoring the CAN bus. When a wake-up pattern is detected on the bus or when a local wake up is
requested via the WAKE input, the device initiates node start-up by driving INH high.
The TCAN1463-Q1 includes many protection and diagnostic features including undervoltage detection, CAN bus
fault detection, SWE timer, battery connection detection, thermal shutdown (TSD), driver dominant timeout (TXD
DTO), and bus fault protection up to ±58 V.
9.1.1 Signal Improvement
The TCAN1463-Q1 includes the Signal Improvement Capability (SIC) that enhances the maximum data rate
achievable in complex star topologies by minimizing signal ringing. Signal ringing is the result of reflections
caused by impedance mismatch at various points in a complex CAN network.
An example of a star network is shown 图9-1.
ECU 1
(terminated)
ECU 5
ECU 4
ECU 6
ECU 2
ECU 8
(terminated)
ECU 7
ECU 3
图9-1. CAN network: Star Topology
Recessive-to-dominant signal edge is usually clean as it’s strongly driven by the transmitter. Transmitter output
impedance of CAN transceiver is RID(dom) and matches to the network characteristic impedance. For a regular
CAN FD transceiver, dominant-to-recessive edge is when the driver output impedance goes to ~60 kΩ and
signal reflected back experiences impedance mismatch which causes ringing. The TCAN1463-Q1 resolves this
issue by TX-based Signal improvement capability (SIC). The TCAN1463-Q1 continues to drive the bus recessive
strongly till tSIC_TX_base to minimize the reflections and the recessive bit is clean at the sampling point. In the
active recessive phase, transmitter output impedance is low (RID(active_rec)). After this phase, the device enters
into a passive recessive phase where the driver goes into high impedance state. This phenomenon is explained
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using 图 9-2. For further information, please refer to the white paper on how SIC unlocks the real potential of
CAN-FD transceivers.
TXD
VI
70%
30%
0 V
tprop(TXD-busrec)
tprop(TXD-busdom)
900 mV
500 mV
VDIFF
~ 60 k
RID ~ 60 k
Recessive
RID
Recessive
tSIC_TX_base
RID(active_rec)
RID(dom)
Dominant
Active
Recessive
图9-2. TX based Signal Improvement Capability
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9.2 Functional Block Diagram
VCC
VIO
VSUP
10
VLDO
3
5
VCC
VIO
1
7
DOMINANT
TIME OUT
TXD
VSUP
13
12
CANH
CANL
INH
*1
VSUP
SIC
Driver
9
WAKE
nSTB
WAKE
14
EN
CONTROL and MODE
LOGIC
6
8
OVER
TEMP
nFAULT
INH_MASK
11
High Speed Receiver
UNDER
VOLTAGE
VIO
4
RXD
Logic Output
MUX
Low Power Receiver
WUP
Detect
2
GND
1. A pull-down resistor of 4 MΩ(typical) is activated on INH pin when the device is in Sleep mode.
图9-3. TCAN1463-Q1 Functional Block Diagram
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9.3 Feature Description
9.3.1 Supply Pins
The TCAN1463-Q1 implements three independent supply inputs for regulating different portions of the device.
9.3.1.1 VSUP Pin
This pin is connected to the battery supply. It provides the supply to the internal regulators that support the digital
core and the low power CAN receiver.
9.3.1.2 VCC Pin
This pin provides the 5 V supply voltage for the CAN transceiver.
9.3.1.3 VIO Pin
This pin provides the digital I/O voltage to match the CAN FD controller's I/O voltage. It supports I/O voltages
from 1.7 V to 5.5 V providing a wide range of controller support.
9.3.2 Digital Inputs and Outputs
9.3.2.1 TXD Pin
TXD is a logic-level input signal, referenced to VIO, from a CAN FD controller to the TCAN1463-Q1. TXD is
biased to the VIO level to force a recessive input in case the pin floats.
9.3.2.2 RXD Pin
RXD is a logic-level signal output, referenced to VIO, from the TCAN1463-Q1 to a CAN FD controller. The RXD
pin is driven to the VIO level as logic-high outputs once a valid VIO is present.
When a power-on or wake-up event takes place, the RXD pin is pulled low.
9.3.2.3 nFAULT Pin
nFAULT is a logic-level output signal, referenced to VIO, from the TCAN1463-Q1 to a CAN FD controller. The
nFAULT output is driven to the VIO level as logic-high output.
The nFAULT output is used to transmit the TCAN1463-Q1 status indicator flags to the CAN FD controller. Please
see 表 9-1 for the specific fault scenarios that are indicated externally via the nFAULT pin. The TCAN1463-Q1
puts the nFAULT pin in the high-impedance state in the Sleep mode to conserve power because there are no
fault scenarios that are indicated externally in the Sleep mode.
9.3.2.4 EN Pin
EN is a logic-level input signal, referenced to VIO, from a CAN FD controller to the TCAN1463-Q1. The EN input
pin is for mode selection in conjunction with the nSTB pin. EN is internally pulled low to prevent excessive
system power and false wake-up events.
9.3.2.5 nSTB Pin
nSTB is a logic-level input signal, referenced to VIO, from a CAN FD controller to the TCAN1463-Q1. The nSTB
input pin is for mode selection in conjunction with the EN pin. nSTB is internally pulled low to prevent excessive
system power and false wake-up events.
9.3.2.6 INH_MASK Pin
INH_MASK is a logic-level input signal, referenced to VIO, from a CAN FD controller to the TCAN1463-Q1. The
INH_MASK input pin can be used to disable and enable the INH function when in Silent mode. This feature can
be used to control the power supply to any power-intensive system blocks to avoid powering up the system
blocks from low-power mode due to spurious wake-up events. INH_MASK function should not be used if the INH
is used to control the power supply to the transceiver or the controller behind the transceiver - using INH_MASK
in such a scenario would prevent the device from entering silent mode and enabling the INH function. See 图
10-2 for an example application schematic for using INH_MASK function.
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INH_MASK has a pull-down resistor that forces the INH feature to the enable state upon a cold start. To activate
INH_MASK, the transceiver must be in silent mode. Once in silent mode, the INH_MASK pin is pulled high for t >
tINH_MASK, disabling INH. The TCAN1463-Q1 latches this value and retains it through VCC and VIO power cycles
and state transitions. The latched value is lost if the TCAN1463-Q1 enters an undervoltage fault on VSUP. To
enable INH function again, the transceiver must be in Silent mode, and the INH_MASK pin must be pulled low
for t > tINH_MASK. See 图8-10 and 图8-11 for the procedure to use the INH_MASK feature.
The TCAN1463-Q1 reports a change in state of INH_MASK to the system controller by the driving nFAULT low
while in silent mode. To use nFAULT=low as an acknowledgment for the change in state of INH_MASK , nFAULT
must be high (that is, no pre-existing faults) before initiating the change in state of INH_MASK. A mode transition
into normal, standby, go-to-sleep, or sleep mode clears the nFAULT pin.
9.3.3 GND
GND is the ground pin of the transceiver, it must be connected to the PCB ground.
9.3.4 INH Pin
The INH pin is a high-voltage output. It can be used to control external regulators. These regulators are usually
used to support the microprocessor and VIO pin. The INH function is on in all modes except for sleep mode. In
sleep mode, the INH pin is turned off, going into a high-impedance state. This allows the node to be placed into
the lowest power state while in sleep mode. A 100 kΩ load can be added to the INH output for a fast transition
time from the driven high state to the low state and to force the pin low when left floating.
This terminal should be considered a high-voltage logic terminal, not a power output. The INH pin should be
used to drive the EN terminal of the system’s power management device and should not be used as a switch
for the power management supply itself. This terminal is not reverse-battery protected and thus should not be
connected outside the system module.
The INH function can be disabled/enabled using the INH_MASK pin in Silent mode. Refer to INH_MASK Pin for
details.
9.3.5 WAKE Pin
The WAKE pin is a high-voltage reverse-blocked input used for the local wake-up (LWU) function. The WAKE pin
is bi-directional edge-triggered and recognizes a local wake-up (LWU) on either a rising or falling edge of WAKE
pin transition. The LWU function is explained further in the Local Wake-Up (LWU) via WAKE Input Terminal
section.
9.3.6 CAN Bus Pins
These are the CAN high and CAN low, CANH and CANL, differential bus pins. These pins are internally
connected to the CAN transceiver and the low-voltage wake receiver.
9.3.7 Faults
9.3.7.1 Internal and External Fault Indicators
The following device status indicator flags are implemented to allow for the MCU to determine the status of the
device and the system. In addition to faults, the nFAULT terminal also signals wake-up requests and a “cold”
power-up sequence on the VSUP battery terminal so the system can do any diagnostics or cold booting sequence
necessary. The RXD terminal indicates wake-up request and the faults are multiplexed (ORed) to the nFAULT
output.
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表9-1. TCAN1463-Q1 Transceiver Status Indicator
EVENT
FLAG NAME
CAUSE
INDICATORS(1)
FLAG IS CLEARED
COMMENT
nFAULT = low upon entering
silent mode from standby or
sleep mode
A cold start condition generates
a local wake-up WAKERQ,
WAKESR and a PWRON flag.
Power up on VSUP and any return of VSUP
after it has been below UVSUP
After a transition to normal
mode
Power-up
PWRON
Wake-up request may only be
set from standby, go-to-sleep, or
sleep mode.
Resets timers for UVVCC or
UVVIO.
After a transition to normal
mode
or VCC < UVCC(F)
nFAULT = RXD = low after
wake-up upon entering
standby mode
Wake-up Request
WAKERQ (2)
or VIO < UVIO(F) for t ≥tUV
Available upon entering
normal mode(4)
nFAULT = low indicates a
local wake-up event from the
WAKE pin
nFAULT = high indicates a
remote wake-up event from
the CAN bus
Wake-up event on CAN bus, state
transition on WAKE pin, or initial power up
After four recessive-to-
dominant edges on TXD in
normal mode,
leaving normal mode,
or VCC < UVCC(F)
A cold start condition generates
a local wake-up WAKERQ,
WAKESR and a PWRON flag.
Wake-up Source
Recognition(3)
WAKESR
or VIO < UVIO(F) for t ≥tUV
To use nFAULT as the flag
A mode transition into normal, indicator, nFAULT must be high
INH_MASK
Change
nFAULT = low after entering
silent mode
INHMASK
INH_MASK value changed
standby, go-to-sleep, or sleep
modes
before initiating change in state
of INH_MASK (e.g. there should
be no pre-existing faults)
VCC > UVCC(R),
or a wake-up request occurs
UVCC
UVIO
VCC < UVCC(F)
VIO < UVIO(F)
Not externally indicated
Not externally indicated
VIO > UVIO(R),
or a wake-up request occurs
Undervoltage
A VSUP undervoltage event
generates a cold start condition
once VSUP > UVSUP(R)
UVSUP
VSUP < UVSUP(F)
Not externally indicated
VSUP > UVSUP(R)
Upon leaving normal mode,
or if no CAN bus fault is
nFAULT = low in normal mode detected for four consecutive
CAN bus fault must persist for
four consecutive dominant-to-
recessive transitions
CAN Bus Fault
CBF
See CAN Bus Fault
only(5)
dominant-to-recessive
transitions of the TXD pin while
in normal mode
CAN driver remains disabled
until the TXDCLP is cleared.
CAN receiver remains active
during the TXDCLP fault
TXD low when CAN active mode is
entered
TXDCLP
TXDDTO
RXD = low & TXD = high,
TXD = high &
a mode transition into normal,
standby, go-to-sleep, or sleep
modes
TXD dominant time out, dominant (low)
signal for t ≥tTXDDTO
CAN driver remains disabled
until the TXDDTO is cleared.
CAN receiver remains active
during the TXDDTO fault
CAN driver remains disabled
until the TXDRXD is cleared.
CAN receiver remains active
during the TXDRXD fault
TXD and RXD pins are shorted together
for t ≥tTXDDTO
nFAULT = low upon entering
silent mode from normal
mode
TXDRXD
CANDOM
Local Faults
RXD = high,
CAN bus dominant fault, when dominant
bus signal received for t ≥tBUSDOM
or a transition into normal,
standby, go-to-sleep, or sleep
modes
CAN driver remains enabled
during CANDOM fault
TJ < TSDF and
RXD = low & TXD = high,
or transition into normal,
standby, go-to-sleep, or sleep
modes
CAN driver remains disabled
until the TSD event is cleared
TSD
Thermal shutdown, TJ ≥TSDR
(1) VIO and VSUP are present
(2) Transitions to go-to-sleep mode is blocked until WAKERQ flag is cleared
(3) Wake-up source recognition reflects the first wake up source. If additional wake-up events occur the source still indicates the original
wake-up source
(4) Indicator is only available in normal mode until the flag is cleared
(5) CAN Bus failure flag is indicated after four dominant-to-recessive edges on TXD
9.3.7.1.1 Power-Up (PWRON Flag)
This is an internal and external flag that can be used to control the power-up sequence of the system. When a
new battery connection to the transceiver is made the PWRON flag is set signifying a cold start condition. The
TCAN1463-Q1 treats any undervoltage conditions on the VSUP, VSUP < UVSUP(F), as a cold start. Therefore,
when the VSUP > UVSUP(R) condition is met the TCAN1463-Q1 sets the PWRON flag which can be used by the
system to enter a routine that is only called upon in cold start situations. The PWRON flag is indicated by
nFAULT driven low after entering silent mode from either standby mode or sleep mode. This flag is cleared after
a transition to normal mode.
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Go to normal
mode:
nSTB = high
EN = high
System
preconditioning
routine
Yes
Standby mode:1
INH = high in STB
mode
Silent mode2
nSTB = high
EN = low
Read nFAULT
low = cold start
high = wake-up request
nFAULT = low?
No
1 On entering Standby mode from power-up or Sleep mode
Go to normal
mode:
nSTB = high
EN = high
Read nFAULT 3
WAKESR flag
low = local wake-up
high = remote wake-up
2 VCC and VIO are present
3 Optional
Normal mode
图9-4. Distinguishing between PWRON and Wake Request by Entering Silent Mode
9.3.7.1.2 Wake-Up Request (WAKERQ Flag)
This is an internal and external flag that can be set in standby, go-to-sleep, or sleep mode. This flag is set when
either a valid local wake-up (LWU) request occurs, or a valid remote wake request occurs, or on power up on
VSUP. The setting of this flag clears the tUV timer for the UVCC or UVIO fault detection. This flag is cleared upon
entering normal mode or during an undervoltage event on VCC or VIO.
9.3.7.1.3 Undervoltage Faults
The TCAN1463-Q1 device implements undervoltage detection circuits on all supply terminals: VSUP, VCC, and
VIO. The undervoltage flags are internal indicator flags and are not indicated on the nFAULT output pin.
9.3.7.1.3.1 Undervoltage on VSUP
UVSUP is set when the voltage on VSUP drops below the undervoltage detection voltage threshold, UVSUP. The
PWRON and WAKERQ flags are set once VSUP > UVSUP(R)
.
9.3.7.1.3.2 Undervoltage on VCC
UVCC is set when the voltage on VCC drops below the undervoltage detection voltage threshold, UVCC, for longer
than the tUV undervoltage filter time.
9.3.7.1.3.3 Undervoltage on VIO
UVIO is set when the voltage on VIO drops below the undervoltage detection voltage threshold, UVIO, for longer
than the tUV undervoltage filter time.
9.3.7.1.4 CAN Bus Fault (CBF Flag)
The TCAN1463-Q1 device can detect the following six fault conditions and set the nFAULT pin low as an
interrupt so that the controller can be notified and act if a CAN bus fault exists. These failures are detected while
transmitting a dominant signal on the CAN bus. If one of these fault conditions persists for four consecutive
dominant-to-recessive bit transitions, the nFAULT indicates a CAN bus failure flag in Normal mode by driving the
nFAULT pin low. The CAN bus driver remains active. 表 9-2 shows what fault conditions can be detected by the
TCAN1463-Q1.
表9-2. Bus Fault Pin State and Detection Table
FAULT
Condition
1
2
3
4
5
6
CANH Shorted to VBAT
CANH Shorted to VCC
CANH Shorted to GND
CANL Shorted to VBAT
CANL Shorted to VCC
CANL Shorted to GND
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Bus fault detection is a system level situation. If the fault is occurring at the ECU the general communication of
the bus may be compromised. Until a diagnostic determination can be made the transceiver remains in CAN
active mode during a CAN bus fault enabling the ECU to transmit data to the CAN bus and receive data from the
CAN bus. For complete coverage of a node, a system level diagnostic step should be performed for each node
and the information should be communicated back to a central point.
While in normal mode, if no CAN bus fault is detected for four consecutive dominant-to-recessive transitions on
the TXD pin then the CBF flag is cleared and nFAULT is driven high. The bus fault failure circuitry is able to
detect bus faults for a range of differential resistance loads (RCBF) and for any time greater than tCBF
.
9.3.7.1.5 TXD Clamped Low (TXDCLP Flag)
TXDCLP is an external flag that is set if the transceiver detects that the TXD is clamped low before entering CAN
active mode. If a TXDCLP condition exists the nFAULT pin is driven low upon entering silent mode from normal
mode and the CAN bus driver is disabled until the fault is cleared. The TXDCLP flag is cleared at power-up,
when entering CAN active mode with TXD recessive, or when TXD is recessive while RXD is dominant, if no
other local failures exist.
9.3.7.1.6 TXD Dominant State Timeout (TXDDTO Flag)
TXDDTO is an external flag that is set if the TXD pin is held dominant for t > tTXDDTO. If a TXD DTO condition
exists, the nFAULT pin is driven low upon entering silent mode from normal mode. The TXDDTO flag is cleared
on the next dominant-to-recessive transition on TXD or upon a transition into normal, standby, go-to-sleep, or
sleep modes.
9.3.7.1.7 TXD Shorted to RXD Fault (TXDRXD Flag)
TXDRXD is an external flag that is set if the transceiver detects that the TXD and RXD lines have been shorted
together for t ≥ tTXDDTO. If a TXDRXD condition exists the nFAULT pin is driven low upon entering silent mode
from normal mode and the CAN bus driver is disabled until the TXDRXD fault is cleared. The TXDRXD flag is
cleared on the next dominant-to-recessive transition with TXD high and RXD low or upon a transition into
normal, standby, go-to-sleep, or sleep modes.
9.3.7.1.8 CAN Bus Dominant Fault (CANDOM Flag)
CANDOM is an external flag that is set if the CAN bus is stuck dominant state for t > tBUSDOM. If a CANDOM
condition exists the nFAULT pin is driven low upon entering silent mode from normal mode. The CANDOM flag is
cleared on the next dominant-to-recessive transition on RXD or upon a transition into normal, standby, go-to-
sleep, or sleep modes.
9.3.8 Local Faults
Local faults are detected in both normal mode and silent mode, but are only indicated via the nFAULT pin when
the TCAN1463-Q1 transitions from normal mode to silent mode. All other mode transitions clear the local fault
flag indicators.
9.3.8.1 TXD Clamped Low (TXDCLP)
If the TXD pin is clamped low prior to entering CAN active mode the CAN driver is disabled releasing the bus line
to the recessive level. The CAN driver will be activated again when entering normal mode with TXD recessive,
when TXD is recessive while RXD is dominant, if no other local failures exist, or on power-up. During a TXDCLP
fault the high-speed receiver remains active and the RXD output pin will mirror the CAN bus.
9.3.8.2 TXD Dominant Timeout (TXD DTO)
While the CAN driver is in active mode a TXD dominant state timeout circuit prevents the local node from
blocking network communication in event of a hardware or software failure where TXD is held dominant longer
than the timeout period, t > tTXDDTO. The TXD dominant state timeout circuit is triggered by a falling edge on the
TXD pin. If no rising edge is seen before on TXD before t > tTXDDTO than the CAN driver is disabled releasing the
bus lines to the recessive level. This keeps the bus free for communication between other nodes on the network.
The CAN driver will be activated again on the next dominant-to-recessive transition on the TXD pin. During a
TXDDTO fault the high-speed receiver remains active and the RXD output pin will mirror the CAN bus.
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Fault is repaired & transmission capability
restored
TXD fault stuck dominant: example PCB failure or bad software
tTXDDTO
TXD (driver)
Driver disabled freeing bus for other nodes
Normal CAN communication
Bus would be —stuck dominant“ blocking communication for the whole network but TXD DTO
prevents this and frees the bus for communication after the time tTXDDTO
.
CAN Bus Signal
tTXDDTO
Communication from other bus node(s)
Communication from repaired node
RXD (receiver)
Communication from local node
Communication from other bus node(s)
Communication from repaired local node
图9-5. Timing Diagram for TXD DTO
The minimum dominant TXD time allowed by the dominant state timeout circuit limits the minimum possible
transmitted data rate of the transceiver. The CAN protocol allows a maximum of eleven successive dominant bits
to be transmitted in the worst case, where five successive dominant bits are followed immediately by an error
frame. The minimum transmitted data rate may be calculated using the minimum tTXDDTO time in 方程式1.
Minimum Data Rate = 11 bits / tTXDDTO = 11 bits / 1.2 ms = 9.2 kbps
(1)
9.3.8.3 Thermal Shutdown (TSD)
If the junction temperature of the TCAN1463-Q1 exceeds the thermal shutdown threshold the device turns off
the CAN driver circuits thus blocking the TXD to bus transmission path. The CAN bus terminals are biased to
recessive level during a TSD fault and the receiver to RXD path remains operational. The TSD fault condition is
cleared when the junction temperature, TJ, of the device drops below the thermal shutdown release temperature,
TSDF, of the device. If the fault condition that caused the TSD fault is still present, the temperature may rise again
and the device will enter thermal shutdown again. Prolonged operation with TSD fault conditions may affect
device reliability. The TSD circuit includes hysteresis to avoid any oscillation of the driver output. During the fault
the TSD fault condition is indicated to the CAN FD controller via the nFAULT terminal.
9.3.8.4 Undervoltage Lockout (UVLO)
The supply terminals, VSUP, VIO and VCC, are monitored for undervoltage events. If an undervoltage event
occurs the TCAN1463-Q1 enters a protected state where the bus pins present no load to the CAN bus. This
protects the CAN bus and system from unwanted glitches and excessive current draw that could impact
communication between other CAN nodes on the CAN bus.
If an undervoltage event occurs on VSUP in any mode, the TCAN1463-Q1 CAN transceiver enters the CAN off
state.
If an undervoltage event occurs on VCC, the TCAN1463-Q1 remains in normal or silent mode but the CAN
transceiver changes to the CAN autonomous active state. During a UVCC event, RXD remains high as long as
VIO is present and the wake-up circuitry is inactive. See 图 9-12. If the undervoltage event persists longer than
tUV, the TCAN1463-Q1 transitions to sleep mode.
If an undervoltage event occurs on the VIO, the TCAN1463-Q1 transitions to standby mode. If the undervoltage
event persists longer than tUV, the TCAN1463-Q1 transitions to sleep mode.
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Once an undervoltage condition is cleared and the supplies have returned to valid levels, the device typically
needs 200 µs to transition to normal operation.
9.3.8.5 Unpowered Devices
The device is designed to be a passive or no load to the CAN bus if it is unpowered. The CANH and CANL pins
have low leakage currents when the device is unpowered, so they present no load to the bus. This is critical if
some nodes of the network are unpowered while the rest of the of network remains in operation.
The logic terminals also have low leakage currents when the device is unpowered so they do not load down
other circuits which may remain powered.
9.3.8.6 Floating Terminals
The TCAN1463-Q1 has internal pull-ups and pull-downs on critical pins to make sure a known operating
behavior if the pins are left floating. See 表9-3 for the pin fail-safe biasing protection description.
表9-3. Pin Fail-safe Biasing
PIN
TXD
FAIL-SAFE PROTECTION
VALUE
COMMENT
Recessive level
Weak pull-up to VIO
EN
Low-power mode
Weak pull-down to GND
Weak pull-down to GND
Weak pull-down to GND
nSTB
Low-power mode
60 kΩ
INH_MASK
INH_MASK pin pulled to GND to disable
INH_MASK function at powerup and when
the feature is not needed.
This internal bias should not be relied upon by design but rather a fail-safe option. Special care needs to be
taken when the transceiver is used with a CAN FD controller that has open-drain outputs. The TCAN1463-Q1
implements a weak internal pull-up resistor on the TXD pin. The bit timing requirements for CAN FD data rates
require special consideration and the pull-up strength should be considered carefully when using open-drain
outputs. An adequate external pull-up resistor must be used to make sure the TXD output of the CAN FD
controller maintains proper bit timing input to the CAN device.
9.3.8.7 CAN Bus Short-Circuit Current Limiting
The TCAN1463-Q1 has several protection features that limit the short-circuit current when a CAN bus line is
shorted. These include CAN driver current limiting in the dominant and recessive states and TXD dominant state
timeout which prevents permanently having the higher short-circuit current of a dominant state in case of a
system fault.
During CAN communication the bus switches between the dominant and recessive states, thus the short-circuit
current may be viewed either as the current during each bus state or as an average current. The average short-
circuit current should be used when considering system power for the termination resistors and common-mode
choke. The percentage of time that the driver can be dominant is limited by the TXD dominant state timeout and
the CAN protocol which has forced state changes and recessive bits such as bit stuffing, control fields, and
interframe spacing. These makes sure there is a minimum recessive time on the bus even if the data field
contains a high percentage of dominant bits.
The short-circuit current of the bus depends on the ratio of recessive to dominant bits and their respective short-
circuit currents. The average short-circuit current may be calculated using 方程式2.
IOS(AVG) = %Transmit × [(%REC_Bits × IOS(SS)_REC) + (%DOM_Bits × IOS(SS)_DOM)] + [%Receive × IOS(SS)_REC
]
(2)
Where:
• IOS(AVG) is the average short-circuit current
• %Transmit is the percentage the node is transmitting CAN messages
• %Receive is the percentage the node is receiving CAN messages
• %REC_Bits is the percentage of recessive bits in the transmitted CAN messages
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• %DOM_Bits is the percentage of dominant bits in the transmitted CAN messages
• IOS(SS)_REC is the recessive steady state short-circuit current
• IOS(SS)_DOM is the dominant steady state short-circuit current
The short-circuit current and possible fault cases of the network should be taken into consideration when sizing
the power ratings of the termination resistance and other network components.
9.4 Device Functional Modes
The TCAN1463-Q1 has six operating modes: normal, standby, silent, go-to-sleep, sleep, and off mode.
Operating mode selection is controlled using the nSTB pin and EN pin in conjunction with supply conditions,
temperature conditions, and wake events.
VSUP < UVVSUP(F)
Power Off
CAN: High impedance
INH: High impedance
RXD: High impedance
Power On
Start Up
Normal Mode
CAN: Bus bias active
INH: VSUP level
Standby Mode
CAN: Bus bias autonomous
WAKE sources: WUP & LWU
INH: VSUP level
(EN = low and nSTB = low) or
VIO < UVIO
EN = high and nSTB = high and VIO > UVIO
SWE timer inactive3
INH_MASK Input: Ignored
EN = low and
nSTB = high
and VIO > UVIO
SWE timer active3
EN = low and nSTB = high
INH_MASK Input: Ignored
EN = high and
nSTB = high
Silent Mode
CAN: Bus bias active
INH: VSUP level
EN = high and
nSTB = low
SWE timer
(EN = low or WAKERQ
set) and nSTB = low
expires:
SWE timer inactive/active3
INH_MASK Input: Disable/Enables
INH6
5
t > tINACTIVE
EN = high and nSTB =
low and WAKERQ
Cleared
EN = high and nSTB = low
and WAKERQ Cleared
EN = high
and
nSTB = high
Wake-Up Event:
WUP or LWU
3,5
EN = low and
nSTB = high
Sleep Mode
Go-To-Sleep Mode
CAN: Bus bias autonomous
WAKE sources: WUP & LWU
INH: VSUP level
SWE timer inactive
INH_MASK Input: Ignored
CAN: Bus bias autonomous
4 or 5
EN: x1
(EN = low and t < tGOTOSLEEP
)
or WUP or LWU
WAKE sources: WUP & LWU
INH: High impedance
nFAULT: High impedance
SWE timer inactive
4
EN = high and t > tGOTOSLEEP
INH_MASK Input: Ignored
4 or 5
VCC falls below UVCC or
Vio falls below UVIO
2,4
for t > tUV
From any other
mode
图9-6. TCAN1463-Q1 State Machine
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1. The enable pin can be in a logical high or low state while in sleep mode but since it has an internal pull-
down, the lowest possible power consumption occurs when the pin is left either floating or pulled low
externally.
2. At power-up, the undervoltage timers for VCC and VIO are disabled, allowing for longer period for VCC and
VIO supplies to power up (up to tINACTIVE). VCC or VIO need to be above UVCC(R) and UVIO(R) respectively to
enable their respective tUV timers. The VCC undervoltage timer starts when VCC falls below UVCC(F), while
VIO undervoltage timer starts when VIO falls below UVIO(F). When either of these timers exceed tUV, the
device enters sleep mode.
3. The Sleep Wake Error (SWE) timer starts as soon as the device enters Standby mode. The timer halts and
resets as soon as the device enters Normal mode. If the device enters Silent mode from Standby mode, the
SWE timer does not halt and the device needs to be transitioned to Normal mode before the SWE timer
expires. If the device enters Silent mode from Normal mode, the SWE timer will not be active in Silent mode.
4. When the Sleep mode is entered from Go-To-Sleep Mode or from a UVCC or UVIO event, a low-to-high
transition on nSTB is required to move the device into Normal or Silent mode. If EN is high during the rising
edge on nSTB, the device moves to Normal mode. If EN is low during the rising edge on nSTB, the device
moves to Silent mode. VIO must be above UVIO(R) in order to leave Sleep mode using the EN and nSTB
signals.
5. When Sleep mode is entered due to an SWE timer timeout (>tINACTIVE), there is an extra requirement to exit
Sleep mode and transition into Normal or Silent mode directly using the EN and nSTB signals. To move to
Normal mode, the nSTB pin must be high and a low-to-high transition must occur on EN. To move to Silent
mode, the nSTB pin must be high and a high-to-low transition must occur on EN. If the device entered Sleep
mode while the nSTB was already high, there must be a transition on the EN pin while nSTB is low prior to
the sequence described above. See 图9-7 for more information. VIO must be above UVIO(R) to leave Sleep
mode by using the EN and nSTB signals.
6. The device recognizes the change in state of INH_MASK pin only in Silent mode to enable/disable INH
functionality. Device latches the changed value of INH_MASK in Silent mode and retains this value through
mode transitions. The latched value is lost only due to an UVSUP event. The INH_MASK input is ignored in
all other modes.
Sleep to Normal
Sleep to Silent
>tMODE1(max)1
>tMODE1(max)1
nSTB
EN
nSTB
EN
Sleep
Normal
Sleep
Silent
1. nSTB must remain low for a minimum of tMODE1 after the edge on EN. Once this tMODE1 has elapsed, nSTB
may be driven high. The following edge on EN will cause the device to exit Sleep mode. The final edge on
EN does not have any minimum delay from the rising edge of nSTB. The enable pin can be in a logical high
or low state while in sleep mode, but since it has an internal pull-down, the lowest possible power
consumption occurs when the pin is left either floating or pulled low externally.
图9-7. TCAN1463-Q1 Transitioning from Sleep Mode to Normal or Silent Mode if Sleep Mode is Entered
Due to SWE Timer Timeout
表9-4. TCAN1463-Q1 Mode Overview
MODE
Normal
Silent
VCC and VIO
VSUP
EN
High
Low
nSTB
High
High
WAKERQ FLAG
DRIVER
Enabled
Disabled
RECEIVER
RXD
INH
On
On
> UVCC and > UVIO
> UVCC and > UVIO
> UVSUP
> UVSUP
X
X
Enabled
Mirrors bus state
Mirrors bus state
Enabled
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表9-4. TCAN1463-Q1 Mode Overview (continued)
MODE
VCC and VIO
VSUP
EN
nSTB
WAKERQ FLAG
DRIVER
RECEIVER
RXD
INH
Low power bus monitor
enabled
> UVCC and > UVIO
> UVSUP
High
Low
Set
Disabled
Low signals wake-up
On
Low power bus monitor
enabled
Standby
> UVCC and > UVIO
> UVCC and < UVIO
> UVCC and > UVIO
> UVSUP
> UVSUP
> UVSUP
Low
Low
High
Low
Low
Low
X
X
Disabled
Disabled
Disabled
Low signals wake-up
High impedance
On
On
Low power bus monitor
enabled
Low power bus monitor High or high impedance
enabled (no VIO
Go-to-sleep(1)
Sleep(3)
Cleared
On(2)
)
High
Low power bus monitor High or high impedance
enabled (no VIO
> UVCC and > UVIO
> UVSUP
High
Low
Cleared
Disabled
)
Impedance
Low power bus monitor High or high impedance
High
impedance
< UVCC or <UVIO
> UVSUP
< UVSUP
X
X
X
X
X
X
Disabled
Disabled
enabled
(no VIO
)
High
impedance
Protected
X
Disabled
High impedance
(1) Go-to-sleep: Transitional mode for EN = H, nSTB = L until tGOTOSLEEP timer has expired.
(2) The INH pin transitions to high impedance after the tGOTOSLEEP timer has expired.
(3) Mode change from go-to-sleep mode to sleep mode once tGOTOSLEEP timer has expired.
9.4.1 Operating Mode Description
9.4.1.1 Normal Mode
This is the normal operating mode of the device. The CAN driver and receiver are fully operational and CAN
communication is bi-directional. The driver is translating a digital input on TXD to a differential output on CANH
and CANL. The receiver is translating the differential signal from CANH and CANL to a digital output on RXD.
Entering normal mode clears both the WAKERQ and the PWRON flags.
The SWE timer halts and resets upon entering normal mode.
9.4.1.2 Silent Mode
Silent mode is commonly referred to as listen only and receive only mode. In this mode, the CAN driver is
disabled but the receiver is fully operational and CAN communication is unidirectional into the device. The
receiver is translating the differential signal from CANH and CANL to a digital output on the RXD terminal.
In silent mode, PWRON and Local Failure flags are indicated on the nFAULT pin.
If the device enters silent mode from standby mode, the SWE timer does not halt and the device needs to be
transitioned to normal mode before the SWE timer expires. If the SWE timer expires in silent mode, the device is
transitioned to sleep mode.
9.4.1.3 Standby Mode
Standby mode is a low-power mode where the driver and receiver are disabled, reducing current consumption.
However, this is not the lowest power mode of the device since the INH terminal is on, allowing the rest of the
system to resume normal operation.
During standby mode, a wake-up request (WAKERQ) is indicated by the RXD terminal being low. The wake-up
source is identified via the nFAULT pin after the device is returned to normal mode.
In standby mode, a fail-safe timer called Sleep Wake Error (SWE) timer is enabled. The timer adds an additional
layer of protection by requiring the system controller to configure the transceiver to normal mode before it
expires. This feature forces the TCAN1463-Q1 to transition to its lowest power mode, sleep mode, after tINACTIVE
if the processor does not come up properly and fails to transition the device to Normal mode.
9.4.1.4 Go-To-Sleep Mode
Go-to-sleep mode is the transitional mode of the device from any state to sleep. In this state the driver and
receiver are disabled, reducing the current consumption. The INH pin is active in order to supply an enable to the
VIO controller which allows the rest of the system to operate normally. If the device is held in this state for t ≥
tGOTOSLEEP the device transitions to sleep mode and the INH turns off transitioning to the high impedance state.
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If any wake-up events persist, the TCAN1463-Q1 remains in standby mode until the device is switched into
normal mode to clear the pending wake-up events.
9.4.1.5 Sleep Mode
Sleep mode is the lowest power mode of the TCAN1463-Q1. In sleep mode, the CAN transmitter and the main
receiver are switched off and the transceiver cannot send or receive data. The low power receiver is able to
monitor the bus for any activity that validates the wake-up pattern (WUP) requirements, and the WAKE
monitoring circuit monitors for state changes on the WAKE terminal for a local wake-up (LWU) event. ISUP
current is reduced to its minimum level when the CAN transceiver is in CAN autonomous inactive state. The INH
pin is switched off in sleep mode causing any system power supplies controlled by INH to be switched off thus
reducing system power consumption.
Sleep mode is exited:
• If a valid wake-up pattern (WUP) is received via the CAN bus pins
• On a local WAKE (LWU) event
• On a low-to-high transition of the nSTB pin
When the Sleep mode is entered due to an SWE timer timeout (>tINACTIVE), there is an extra requirement to
enter Normal or Silent mode directly (without entering Standby mode via LWU or WUP) using the EN and nSTB
signals. In order to move to the Normal mode, the nSTB pin must be high and a low-to-high transition must occur
on EN. In order to move to the Silent mode, the nSTB pin must be high and a high-to-low transition must occur
on EN. If the device entered the Sleep mode while the nSTB was already high, there must be a transition on the
EN pin while nSTB is low prior to the sequence described above. See 图 9-7 for more information. VIO must be
above UVIO(R) in order to leave the Sleep mode using the EN and nSTB signals.
9.4.1.5.1 Remote Wake Request via Wake-Up Pattern (WUP)
The TCAN1463-Q1 implements a low-power wake receiver in the standby and sleep mode that uses the multiple
filtered dominant wake-up pattern (WUP) defined in the ISO11898-2:2016 standard.
The wake-up pattern (WUP) consists of a filtered dominant bus, then a filtered recessive bus time followed by a
second filtered dominant bus time. The first filtered dominant initiates the WUP and the bus monitor is now
waiting on a filtered recessive; other bus traffic will not reset the bus monitor. Once a filtered recessive is
received the bus monitor is now waiting on a filtered dominant, and again, other bus traffic will not reset the bus
monitor. Immediately upon receiving of the second filtered dominant the bus monitor will recognize the WUP and
drive the RXD terminal low, if a valid VIO is present signaling to the controller the wake-up request. If a valid VIO
is not present when the wake-up pattern is received the transceiver drives the RXD output pin low once VIO
UVIOR
>
.
The WUP consists of:
• A filtered dominant bus of at least tWK(FILTER) followed by
• A filtered recessive bus time of at least tWK(FILTER) followed by
• A second filtered dominant bus time of at least tWK(FILTER)
For a dominant or recessive to be considered “filtered,” the bus must be in that state for more than tWK(FILTER)
time. Due to variability in the tWK(FILTER) the following scenarios are applicable. Bus state times less than the
tWK(FILTER) minimum will never be detected as part of a WUP and thus no wake request will be generated. Bus
state times between tWK(FILTER) minimum and tWK(FILTER) maximum may be detected as part of a WUP and a
wake request may be generated. Bus state times more than tWK(FILTER) maximum will always be detected as part
of a WUP and thus a wake request will always be generated. See 图9-8 for the timing diagram of the WUP.
The pattern and tWK(FILTER) time used for the WUP and wake request prevents noise and bus stuck dominant
faults from causing false wake requests while allowing any CAN or CAN FD message to initiate a wake request.
ISO11898-2:2016 has two sets of times for a short and long wake-up filter times. The tWK(FILTER) timing for the
TCAN1463-Q1 has been picked to be within the min and max values of both filter ranges. This timing has been
chosen such that a single bit time at 500 kbps, or two back to back bit times at 1 Mbps will trigger the filter in
either bus state.
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For an additional layer of robustness and to prevent false wake-ups, the transceiver implements the tWK(TIMEOUT)
timer. For a remote wake-up event to successfully occur, the entire wake-up pattern must be received within the
timeout value. If the full wake-up pattern is not received before the tWK(TIMEOUT) expires then the internal logic is
reset and the transceiver remains in sleep mode without waking up. The full pattern must then be transmitted
again within the tWK(TIMEOUT) window. See 图9-8.
A recessive bus of at least tWK(FILTER) must separate the next WUP pattern if the CAN bus is dominant when the
tWK(TIMEOUT) expires.
Wake-Up Pattern (WUP) received in t < tWK_TIMEOUT
Wake Request
Filtered
Dominant
Filtered
Dominant
Filtered
Recessive
Waiting for
Filtered
Dominant
Waiting for
Filtered
Recessive
Bus
Bus VDiff
WUP Detect
Mode
≥ tWK_FILTER
≥ tWK_FILTER
≥ tWK_FILTER
*
tINH_SLP_STB
Sleep Mode
Standby Mode
*The RXD pin is only driven once VIO is present.
图9-8. Wake-Up Pattern (WUP)
9.4.1.5.2 Local Wake-Up (LWU) via WAKE Input Terminal
The WAKE terminal is a bi-directional high-voltage reverse-battery protected input which can be used for local
wake-up (LWU) requests via a voltage transition. A LWU event is triggered on either a low-to-high or high-to-low
transition since it has bi-directional input thresholds. The WAKE pin could be used with a switch to VSUP or to
ground. If the terminal is unused it should be pulled to VSUP or ground to avoid unwanted parasitic wake-up
events.
图9-9. WAKE Circuit Example
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图 9-9 shows two possible configurations for the WAKE pin, a low-side and high-side switch configuration. The
objective of the series resistor, RSERIES, is to protect the WAKE input of the device from over current conditions
that may occur in the event of a ground shift or ground loss. The minimum value of RSERIES can be calculated
using the maximum supply voltage, VSUPMAX, and the maximum allowable current of the WAKE pin, IIO(WAKE)
.
RSERIES is calculated using:
RSERIES = VSUPMAX / IIO(WAKE)
(3)
With absolute maximum voltage, VSUPMAX, of 45 V and maximum allowable IIO(WAKE) of 3 mA, the minimum
required RSERIES value is 15 kΩ.
The RBIAS resistor is used to set the static voltage level of the WAKE input when the switch is released. When
the switch is in use in a high-side switch configuration, the RBIAS resistor in combination with the RSERIES resistor
sets the WAKE pin voltage above the VIH threshold. The maximum value of RBIAS can be calculated using the
maximum supply voltage, VSUPMAX, the maximum WAKE threshold voltage VIH, the maximum WAKE input
current IIH and the series resistor value RSERIES. RBIAS is calculated using:
RBIAS < ((VSUPMAX - VIH) / IIH) - RSERIES
(4)
With VSUPMAX of 45 V, VIH of 44 V at IIH of 3 µA, the RBIAS resistor value must be less than 330 kΩ. It is
recommended to use RSeries less than 50 kΩ to provide better margin for the WAKE pin voltage to rise above
VIH when the switch is released.
The LWU circuitry is active in sleep mode.
The WAKE circuitry is switched off in normal mode.
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WAKE
threshold
not
t
tWAKE_HT
t > tWAKE_HT
wake-up
no wake-up
crossed
Wake
LWU Request
tINH_SLP_STB
INH
*
RXD
Mode
Sleep Mode
Standby Mode
* RXD is driven with valid VIO
图9-10. LWU Request Rising Edge
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WAKE
threshold
not
t
tWAKE_HT
t > tWAKE_HT
wake-up
no wake-up
crossed
Wake
LWU Request
tINH_SLP_STB
INH
*
RXD
Mode
Sleep Mode
Standby Mode
* RXD is driven with valid VIO
图9-11. LWU Request Falling Edge
9.4.2 CAN Transceiver
9.4.2.1 CAN Transceiver Operation
The TCAN1463-Q1 supports the ISO 11898-2:2016 CAN physical layer standard autonomous bus biasing
scheme. Autonomous bus biasing enables the transceiver to switch between CAN active, CAN autonomous
active, and CAN autonomous inactive which helps to reduce RF emissions.
9.4.2.1.1 CAN Transceiver Modes
The TCAN1463-Q1 CAN transceiver has four modes of operation; CAN off, CAN autonomous active, CAN
autonomous inactive and CAN active.
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CAN Active
CAN Transmitter: on2
CAN Receiver: on
RXD: Mirrors CAN bus
CANH & CANL: VCC/2 (~2.5 V)
From any mode
VSUP < UVSUP(F)
CAN Off
CAN Transmitter: off
CAN Receiver: off
RXD: High impedance
CANH and CANL: High impedance
CAN Autonomous: Inactive
CAN Autonomous: Active
CAN wake-up or ((normal or silent) and
(VCC < UVCC or VIO < UVIO))
CAN Transmitter: off
CAN Receiver: off
RXD: wake-up/high
CAN Transmitter: off
CAN Receiver: off
VSUP > UVSUP(R)
RXD: low signals wake-up1
CANH and CANL: bias to 2.5 V from VSUP
t > tSILENCE and (standby or go-to-sleep or
sleep)
CANH and CANL: bias to GND
1. Wake-up is inactive in normal or silent mode.
2. CAN transmitter is off in silent mode.
图9-12. TCAN1463-Q1 CAN Transceiver State Machine
9.4.2.1.1.1 CAN Off Mode
In CAN off mode, the CAN transceiver is switched off and the CAN bus lines are truly floating. In this mode, the
device presents no load to the CAN bus while preventing reverse currents from flowing into the device if the
battery or ground connection is lost.
The CAN off state is entered if:
• VSUP < UVSUPF
The CAN transceiver switches between the CAN off state and CAN autonomous inactive mode if:
• VSUP > UVSUPR
9.4.2.1.1.2 CAN Autonomous: Inactive and Active
When the CAN transceiver is in standby, go-to-sleep or sleep mode, the bias circuit can be in either the CAN
autonomous inactive or CAN autonomous active state. In the autonomous inactive state, the CAN pins are
biased to GND. When a remote wake-up (WUP) event occurs, the CAN bus is biased to 2.5 V and the CAN
transceiver enters the CAN autonomous active state. If the controller does not transition the transceiver into
normal mode before the tSILENCE timer expires, the CAN transceiver enters the CAN autonomous inactive state.
The CAN transceiver switches to the CAN autonomous mode if any of the following conditions are met:
• The operating mode changes from CAN off mode to CAN autonomous inactive
• The operating mode changes from normal or silent mode to standby, go-to-sleep, or sleep mode:
– If the bus was inactive for t < tSILENCE before the mode change, the transceiver enters autonomous active
state
– If the bus was inactive for t > tSILENCE before the mode change, the transceiver enters autonomous
inactive state
• VCC < UVCC(F)
• VIO < UVIO(F)
The CAN transceiver switches from the CAN autonomous inactive mode to the CAN autonomous active mode if:
• A remote wake-up event occurs
• The transceiver transitions to normal or silent mode and VCC < UVCC(F) or VIO < UVIO(F)
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The CAN transceiver switches from the CAN autonomous active mode to the CAN autonomous inactive mode if:
• The transceiver is in standby, go-to-sleep, or sleep mode and t > tSILENCE
9.4.2.1.1.3 CAN Active
When the transceiver is in normal or silent mode, the CAN transceiver is in active mode. In normal mode, the
CAN driver and receiver are fully operational and CAN communication is bi-directional. In silent mode, the CAN
driver is off but the CAN receiver is fully operational. The CAN bias voltage in CAN active mode is derived from
VCC and is held at VCC/2
The CAN transceiver switches from the CAN autonomous inactive or CAN autonomous active modes to the CAN
active mode if:
• The transceiver transitions to normal mode and VCC > UVCC(R), VIO > UVIO(R)
The CAN transceiver blocks its transmitter after entering CAN active mode if the TXD pin is asserted low before
leaving standby mode. This prevents disruptions to CAN bus in the event that the TXD pin is stuck Low
(TXDCLP).
The CAN transceiver switches from the CAN active mode to the CAN autonomous inactive mode if:
• The transceiver switches to standby, go-to-sleep, or sleep modes and t > tSILENCE
The CAN transceiver switches from the CAN active mode to the CAN autonomous active mode if:
• The transceiver switches to standby, go-to-sleep, or sleep modes and t < tSILENCE
• VCC < UVCC(F)
• VIO < UVIO(F)
9.4.2.1.2 Driver and Receiver Function Tables
表9-5. Driver Function Table
BUS OUTPUTS
DEVICE MODE TXD INPUTS(1)
DRIVEN BUS STATE(2)
CANH
CANL
Low
High
Low
Dominant
VCC/2
Normal
High or Open High impedance High impedance
Silent
Standby
Sleep
x
x
x
High impedance High impedance
High impedance High impedance
High impedance High impedance
VCC/2
Autonomous biasing
Autonomous biasing
(1) x = irrelevant
(2) For bus states and typical bus voltages see 图9-13
表9-6. Receiver Function Table
CAN DIFFERENTIAL INPUTS
DEVICE MODE
BUS STATE
RXD TERMINAL
VID = VCANH –VCANL
Dominant
Indeterminate
Recessive
Open
Low
Indeterminate
High
VID ≥0.9 V
0.5 V < VID < 0.9 V
VID ≤0.5 V
Normal / Silent
High
Open (VID ≈0 V)
VID ≥1.15 V
Dominant
Indeterminate
Recessive
Open
0.4 V < VID < 1.15 V
VID ≤0.4
High
Standby
Low if wake-up event persists
Open (VID ≈0 V)
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表9-6. Receiver Function Table (continued)
CAN DIFFERENTIAL INPUTS
DEVICE MODE
BUS STATE
RXD TERMINAL
VID = VCANH –VCANL
Dominant
Indeterminate
Recessive
Open
VID ≥1.15 V
0.4 V < VID < 1.15 V
VID ≤0.4 V
High
Tri-state if VIO or VSUP are not
present
Sleep / Go-to-
sleep(1)
Open (VID ≈0 V)
(1) Low power wake-up receiver is active
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9.4.2.1.3 CAN Bus States
The CAN bus has two logical states during operation: recessive and dominant. See 图9-13.
A dominant bus state occurs when the bus is driven differentially and corresponds to a logic low on the TXD and
RXD pins. A recessive bus state occurs when the bus is biased to one half of the CAN transceiver supply
voltage via the high resistance internal input resistors (RIN) of the receiver and corresponds to a logic high on the
TXD and RXD pins.
A dominant state overwrites the recessive state during arbitration. Multiple CAN nodes may be transmitting a
dominant bit at the same time during arbitration, and in this case the differential voltage of the CAN bus is
greater than the differential voltage of a single CAN driver. The TCAN1463-Q1 CAN transceiver implements low-
power standby and sleep modes which enable a third bus state where, if the CAN bus is inactive for t > tSILENCE
the bus pins are biased to ground via the high-resistance internal resistors of the receiver.
,
Normal or Silent or all other Modes with t < tSILENCE
Standby, Go-to-sleep or Sleep Mode t > tSILENCE
CANH
VDIFF
VDIFF
CANL
Recessive
Dominant
Recessive
Time, t
图9-13. Bus States
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10 Application Information Disclaimer
备注
以下应用部分中的信息不属于TI 器件规格的范围,TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计,以确保系统功能。
10.1 Application Information
The TCAN1463-Q1 transceiver is typically used in applications with a host microprocessor or FPGA that
includes the data link layer portion of the CAN protocol. These types of applications usually also include power
management technology that allows for power to be gated to the application via an enable (EN) or inhibit (INH)
pin. A single 5-V regulator can be used to drive both VCC and VIO, or independent 5-V and 3.3-V regulators can
be used to drive VCC and VIO separately as shown in 图 10-1. The bus termination is shown for illustrative
purposes.
The TCAN1463-Q1 features an INH_MASK feature. The INH_MASK input pin can be used to disable and
enable the INH function as long as the INH is not controlling the power supply to the transceiver or the controller
behind the transceiver. This feature can be used to control the power supply to any power-intensive system
blocks to avoid powering up the system blocks from low-power mode due to spurious wake-up events which
saves power. See 图10-2 for an example application schematic.
10.1.1 Typical Application
3 k
EN
VIN
22 nF
VBAT
33 k
100 nF
100 k
VREG
VSUP
10
5 V VOUT
INH
WAKE
7
9
VCC
3
5
VIO
100 nF
VIO
CANH
13
100 nF
VDD
TCAN1463
EN
nSTB
nFAULT
GPIO
GPIO
GPIO
6
14
8
MCU
CANL
12
1
4
CAN FD
Controller
TXD
Optional:
Terminating
Node
RXD
Optional:
Filtering,
Transient and
ESD
2
11
INH_MASK
(leave floating or
connect to GND)
图10-1. Typical Application (Not Using INH_MASK feature)
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3 k
VIN
22 nF
VBAT
33 k
EN
100 nF
VREG
VSUP
10
5 V VOUT
WAKE
9
VCC
3
5
VIO
100 nF
VIO
CANH
13
100 nF
EN
VDD
TCAN1463
GPIO
GPIO
GPIO
6
nSTB
14
8
nFAULT
MCU
INH_MASK
11
1
CANL
12
CAN FD
TXD
RXD
Controller
Optional:
4
2
Terminating
Node
Optional:
Filtering,
Transient and
ESD
7
INH
100 k
VIN
VIN
EN
VDD
VREG
Power-intensive
system block
VOUT
图10-2. Typical Application (Using INH_MASK feature)
10.1.2 Design Requirements
10.1.2.1 Bus Loading, Length and Number of Nodes
A typical CAN application may have a maximum bus length of 40 meters and maximum stub length of 0.3 m.
However, with careful design, users can have longer cables, longer stub lengths, and many more nodes to a
bus. A high number of nodes requires a transceiver with high input impedance such as the TCAN1463-Q1.
Many CAN organizations and standards have scaled the use of CAN for applications outside the original
ISO11898-2:2016 standard. They made system level trade off decisions for data rate, cable length, and parasitic
loading of the bus. Examples of these CAN systems level specifications are ARINC825, CANopen, DeviceNet,
SAEJ2284, SAEJ1939, and NMEA200.
A CAN network system design is a series of tradeoffs. In the ISO 11898-2:2016 specification the differential
output driver is specified with a bus load that can range from 50 Ωto 65 Ωwhere the differential output must be
greater than 1.5 V. The TCAN1463-Q1 is specified to meet the 1.5-V requirement down to 50 Ωand is specified
to meet 1.4-V differential output at 45Ωbus load. The differential input resistance, RID, of the TCAN1463-Q1 is a
minimum of 50 kΩ. If 100 TCAN1463-Q1 transceivers are in parallel on a bus, this is equivalent to a 500-Ω
differential load in parallel with the nominal 60 Ω bus termination which gives a total bus load of approximately
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54 Ω. Therefore, the TCAN1463-Q1 theoretically supports over 100 transceivers on a single bus segment.
However, for CAN network design margin must be given for signal loss across the system and cabling, parasitic
loadings, timing, network imbalances, ground offsets and signal integrity thus a practical maximum number of
nodes is often lower. Bus length may also be extended beyond 40 meters by careful system design and data
rate tradeoffs. For example, CANopen network design guidelines allow the network to be up to 1 km with
changes in the termination resistance, cabling, less than 64 nodes and significantly lowered data rate.
This flexibility in CAN network design is one of its key strengths allowing for these system level network
extensions and additional standards to build on the original ISO11898-2 CAN standard. However, when using
this flexibility, the CAN network system designer must take the responsibility of good network design for a robust
network operation.
10.1.3 Detailed Design Procedure
10.1.3.1 CAN Termination
Termination may be a single 120-Ω resistor at each end of the bus, either on the cable or in a terminating node.
If filtering and stabilization of the common-mode voltage of the bus is desired then split termination may be used,
see 图10-3. Split termination improves the electromagnetic emissions behavior of the network by filtering higher-
frequency common-mode noise that may be present on the differential signal lines.
Standard Termination
Split Termination
CANH
CANH
RTERM/2
RTERM
TCAN Transceiver
TCAN Transceiver
CSPLIT
RTERM/2
CANL
CANL
图10-3. CAN Bus Termination Concepts
10.1.4 Application Curves
50
40
30
20
10
0
4.5 4.6 4.7 4.8 4.9
5
5.1 5.2 5.3 5.4 5.5
VCC (V)
图10-4. Current Consumption (ICC(D)) in Dominant Mode vs VCC Supply
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10.1.5 Power Supply Recommendations
The TCAN1463-Q1 is designed to operate off of three supply rails; VSUP, VCC, and VIO. VSUP is a high-voltage
supply pin designed to connect to the VBAT rail, VCC is a low-voltage supply pin with an input voltage range from
4.5 V to 5.5 V that supports the CAN transceiver and VIO is a low-voltage supply pin with an input voltage range
from 1.7 V to 5.5 V that provides the I/O voltage to match the system controller. For a reliable operation, a 100
nF decoupling capacitor should be placed as close to the supply pins as possible. This helps to reduce supply
voltage ripple present on the output of switched-mode power supplies, and also helps to compensate for the
resistance and inductance of the PCB power planes.
10.1.6 Layout
Robust and reliable CAN node design may require special layout techniques depending on the application and
automotive design requirements. Since transient disturbances have high frequency content and a wide
bandwidth, high-frequency layout techniques should be applied during PCB design.
10.1.6.1 Layout Guidelines
The layout example provides information on components around the device. Place the protection and filtering
circuitry as close to the bus connector, J1, to prevent transients, ESD and noise from propagating onto the
board. Transient voltage suppression (TVS) device can be added for extra protection, shown as D1. The
production solution can be either a bi-directional TVS diode or varistor with ratings matching the application
requirements. This example also shows optional bus filter capacitors C6 and C7. A series common-mode choke
(CMC) is placed on the CANH and CANL lines between the device and connector J1.
Design the bus protection components in the direction of the signal path. Do not force the transient current to
divert from the signal path to reach the protection device. Use supply and ground planes to provide low
inductance. Note that high-frequency currents follow the path of least impedance and not the path of least
resistance. Use at least two vias for supply and ground connections of bypass capacitors and protection devices
to minimize trace and via inductance.
• Bypass and bulk capacitors should be placed as close as possible to the supply terminals of transceiver,
examples are C1 on VCC, C2 on VIO, and C3 and C4 on the VSUP supply.
• VIO pin of the transceiver is connected to the microcontroller IO supply voltage 'µC V'.
• Bus termination: this layout example shows split termination. This is where the termination is split into two
resistors, R3 and R4, with the center or split tap of the termination connected to ground via capacitor C5. Split
termination provides common-mode filtering for the bus. When bus termination is placed on the board instead
of directly on the bus, additional care must be taken to make sure the terminating node is not removed from
the bus thus also removing the termination.
• INH, pin 7, can have a 100 kΩresistor (R1) to ground.
• WAKE, pin 9, can recognize either a rising or a falling edge of a wake signal and is usually connected to an
external switch. It should be configured as shown with C8 which is a 22 nF capacitor to GND where R5 is 33
kΩand R6 is 3 kΩ.
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10.1.6.2 Layout Example
TXD
GND
nSTB
CANH
CANL
C6
TXD
GND
nSTB
R3
C5
GND
Choke
C1
D1
VCC
VCC
RXD
R4
R5
INH_MASK
RXD
GND
VIO
C7
VSUP C3 C4
WAKE
VSUP
µC V
C2
EN
GND
EN
INH
To Switch
C8
INH
nFAULT
WAKE
R1
R6
GND
VSUP GND
图10-5. Example Layout
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11 Device and Documentation Support
11.1 Documentation Support
11.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.4 商标
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTCAN1463DRQ1
TCAN1463DMTRQ1
ACTIVE
ACTIVE
SOIC
D
14
14
2500
TBD
Call TI
Call TI
-40 to 150
-40 to 150
Samples
Samples
VSON
DMT
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
TCAN
1463
TCAN1463DRQ1
ACTIVE
SOIC
D
14
14
2500 RoHS & Green
3000 RoHS & Green
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 150
-40 to 150
TCAN1463
Samples
Samples
TCAN1463DYYRQ1
ACTIVE SOT-23-THIN
DYY
TCAN1463
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Jun-2023
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TCAN1463DMTRQ1
TCAN1463DRQ1
VSON
SOIC
DMT
D
14
14
14
3000
2500
3000
330.0
330.0
330.0
12.4
16.4
12.4
3.3
6.5
4.8
4.8
9.0
3.6
1.2
2.1
1.6
8.0
8.0
8.0
12.0
16.0
12.0
Q1
Q1
Q3
TCAN1463DYYRQ1
SOT-23-
THIN
DYY
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TCAN1463DMTRQ1
TCAN1463DRQ1
VSON
SOIC
DMT
D
14
14
14
3000
2500
3000
367.0
356.0
336.6
367.0
356.0
336.6
35.0
35.0
31.8
TCAN1463DYYRQ1
SOT-23-THIN
DYY
Pack Materials-Page 2
PACKAGE OUTLINE
SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE
DYY0014A
C
3.36
3.16
SEATING PLANE
PIN 1 INDEX
AREA
A
0.1 C
12X 0.5
14
1
4.3
4.1
NOTE 3
2X
3
7
8
0.31
0.11
14X
0.1
C A
B
1.1 MAX
2.1
1.9
B
0.2
0.08
TYP
SEE DETAIL A
0.25
GAUGE PLANE
0°- 8°
0.1
0.0
0.63
0.33
DETAIL A
TYP
4224643/B 07/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.15 per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.50 per side.
5. Reference JEDEC Registration MO-345, Variation AB
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EXAMPLE BOARD LAYOUT
SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE
DYY0014A
SYMM
14X (1.05)
1
14
14X (0.3)
SYMM
12X (0.5)
8
7
(R0.05) TYP
(3)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
NON- SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224643/B 07/2021
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE
DYY0014A
SYMM
14X (1.05)
1
14
14X (0.3)
SYMM
12X (0.5)
8
7
(R0.05) TYP
(3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 20X
4224643/B 07/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
GENERIC PACKAGE VIEW
DMT 14
3 x 4.5, 0.65 mm pitch
VSON - 0.9 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225088/A
www.ti.com
PACKAGE OUTLINE
DMT0014B
VSON - 1 mm max height
SCALE 3.200
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
4.6
4.4
0.1 MIN
(0.13)
1.0
0.8
SECTION A-A
SCALE 30.000
SECTION A-A
TYPICAL
C
SEATING PLANE
0.08 C
0.05
0.00
1.6 0.1
SYMM
EXPOSED
THERMAL PAD
(0.2) TYP
7
8
(0.19) TYP
A
A
2X
3.9
15
SYMM
4.2 0.1
14
1
12X 0.65
0.35
0.25
14X
0.45
0.35
PIN 1 ID
14X
0.1
C A B
(OPTIONAL)
0.05
C
4225087/B 01/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.6)
14X (0.6)
14X (0.3)
SYMM
1
14
2X
(1.85)
12X (0.65)
SYMM
15
(4.2)
(0.69)
TYP
(
0.2) VIA
TYP
8
7
(R0.05) TYP
(0.55) TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225087/B 01/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMT0014B
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.47)
15
14X (0.6)
1
14
14X (0.3)
(1.18)
12X (0.65)
SYMM
(1.38)
(R0.05) TYP
METAL
TYP
8
7
SYMM
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 15
77.4% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4225087/B 01/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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