PTH08T231W [TI]
6-A, 4.5-V to 14-V INPUT, NON-ISOLATED, WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans⑩; 6 -A ， 4.5 V至14 V输入，非隔离，宽输出，具有TurboTrans⑩调节电源模块
| 型号： | PTH08T231W |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 6-A, 4.5-V to 14-V INPUT, NON-ISOLATED, WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans⑩ |
| 文件： | 总36页 (文件大小：1417K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PTH08T230W, PTH08T231W
www.ti.com
SLTS265F–NOVEMBER 2005–REVISED MAY 2007
6-A, 4.5-V to 14-V INPUT, NON-ISOLATED,
WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TurboTrans™
1
FEATURES
2
•
Up to 6-A Output Current
•
•
TurboTrans™ Technology
•
•
•
•
•
4.5-V to 14-V Input Voltage
Designed to meet Ultra-Fast Transient
Requirements up to 300 A/s
Wide-Output Voltage Adjust (0.69 V to 5.5 V)
±1.5% Total Output Voltage Variation
Efficiencies up to 95%
•
SmartSync Technology
APPLICATIONS
Output Overcurrent Protection
(Nonlatching, Auto-Reset)
•
•
•
Complex Multi-Voltage Systems
Microprocessors
Bus Drivers
•
•
Operating Temperature: –40°C to 85°C
Safety Agency Approvals
–
UL/IEC/CSA-C22.2 60950-1
•
•
•
•
•
•
Prebias Startup
On/Off Inhibit
Differential Output Voltage Remote Sense
Adjustable Undervoltage Lockout
Auto-Track™ Sequencing
Ceramic Capacitor Version (PTH08T231W)
DESCRIPTION
The PTH08T230/231W is the higher input voltage (4.5V to 14V) version of the PTH04T230/231W (2.2V to 5.5V),
6-A rated, non-isolated power module. This regulator represents the 2nd generation of the PTH series of power
modules which include a reduced footprint and improved features. The PTH08T231W is optimized to be used in
applications requiring all ceramic capacitors.
Operating from an input voltage range of 4.5V to 14V, the PTH08T230/231W requires a single resistor to set the
output voltage to any value over the range, 0.69V to 5.5V. The wide input voltage range makes the
PTH08T230/231W particularly suitable for advanced computing and server applications that use a loosely
regulated 8-V to 12-V intermediate distribution bus. Additionally, the wide input voltage range increases design
flexibility by supporting operation with tightly regulated 5-V, 8-V, or 12-V intermediate bus architectures.
The module incorporates a comprehensive list of features. Output over-current and over-temperature shutdown
protects against most load faults. A differential remote sense ensures tight load regulation. An adjustable
under-voltage lockout allows the turn-on voltage threshold to be customized. Auto-Track™ sequencing is a
popular feature that greatly simplifies the simultaneous power-up and power-down of multiple modules in a
power system.
The PTH08T230/231W includes new patent pending technologies, TurboTrans™ and SmartSync. The
TurboTrans feature optimizes the transient response of the regulator while simultaneously reducing the quantity
of external output capacitors required to meet a target voltage deviation specification. Additionally, for a target
output capacitor bank, TurboTrans can be used to significantly improve the regulator's transient response by
reducing the peak voltage deviation. SmartSync allows for switching frequency synchronization of multiple
modules, thus simplifying EMI noise suppression tasks and reduces input capacitor RMS current requirements.
Double-sided surface mount construction provides a low profile and compact footprint. Package options include
both through-hole and surface mount configurations that are lead (Pb) - free and RoHS compatible.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
TurboTrans, Auto-Track, TMS320 are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2007, Texas Instruments Incorporated
PTH08T230W, PTH08T231W
www.ti.com
SLTS265F–NOVEMBER 2005–REVISED MAY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PTH08T230W
SmartSync
TurboTrans
Auto−Track
R
TT
1%
9
1
8
0.05 W
(Optional)
V
I
Track SYNC
TT
+Sense
2
5
4
6
+Sense
V
I
V
O
V
O
PTH08T230W
Inhibit
10
INH/UVLO
−Sense
V Adj
L
O
A
D
C 1
O
200 µF
C 2
O
GND
3
O
[D]
+
100 µF
(Required)
+
7
R
SET
Ceramic
(Required)
C
I
1%
0.05 W
(Required)
330 µF
(Required)
−Sense
GND
(Notes B and C)
GND
A. RSET required to set the output voltage to a value higher than 0.69 V. See the Electrical Characteristics table.
B. An additional 22-µF ceramic input capacitor is recommended to reduce RMS ripple current.
C. For VI greater than 8 V, the minimum required CI may be reduced to 220 µF plus a 22-µF ceramic capacitor.
D. 200 µF of output capacitance can be achieved by using two 100-µF ceramic capacitors or four 47-µF ceramic
capacitors.
PTH08T231W - Ceramic Capacitor Version
SmartSync
TurboTrans
8
Auto−Track
RTT
1%
0.05W
(Optional)
9
1
Track SYNC
TT
VI
2
5
4
6
+Sense
Vo
Vi
+Sense
Vo
PTH08T231W
Inhibit
10
INH/UVLO
−Sense
C
O
200 µF
Ceramic
(Required)
L
O
A
D
[B]
GND
3
VoAdj
7
R
CI
SET
1%
300 uF
(Required)
0.05 W
(Required)
(Note A)
−Sense
GND
GND
A. RSET required to set the output voltage to a value higher than 0.69 V. See the Electrical Characteristics table.
B. 200 µF of output capacitance can be achieved by using two 100-µF ceramic capacitors or four 47-µF ceramic
capacitors.
2
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Copyright © 2005–2007, Texas Instruments Incorporated
Product Folder Link(s): PTH08T230W PTH08T231W
PTH08T230W, PTH08T231W
www.ti.com
SLTS265F–NOVEMBER 2005–REVISED MAY 2007
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see
the TI website at www.ti.com.
DATASHEET TABLE OF CONTENTS
DATASHEET SECTION
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS TABLE (PTH08T230W)
ELECTRICAL CHARACTERISTICS TABLE (PTH08T231W)
PIN-OUT AND TERMINAL FUNCTIONS
TYPICAL CHARACTERISTICS (VI = 12V)
TYPICAL CHARACTERISTICS (VI = 5V)
ADJUSTING THE OUTPUT VOLTAGE
CAPACITOR RECOMMENDATIONS
TURBOTRANS™ INFORMATION
PAGE NUMBER
3
4
6
8
9
10
11
13
17
22
23
23
23
24
24
25
26
29
31
UNDERVOLTAGE LOCKOUT (UVLO)
SOFT-START POWER-UP
OVER-CURRENT PROTECTION
OVER-TEMPERATURE PROTECTION
OUTPUT ON/OFF INHIBIT
REMOTE SENSE
SYCHRONIZATION (SMARTSYNC)
AUTO-TRACK SEQUENCING
PREBIAS START-UP
TAPE & REEL AND TRAY DRAWINGS
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
(Voltages are with respect to GND)
UNIT
V
VTrack Track pin voltage
VSYNC SYNC pin voltage
–0.3 to VI + 0.3
–0.3 to 6.0
V
TA
Operating temperature range Over VI range
–40 to 85
Surface temperature of module body or pins
(5 seconds maximum)
Twave Wave soldering temperature
Treflow Solder reflow temperature
AH and AD suffix
260
°C
AS suffix
AZ suffix
235(1)
260(1)
–55 to 125(2)
500
Surface temperature of module body or pins
Tstg
Storage temperature
Mechanical shock
Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted
Suffix AH and AD
Suffix AS and AZ
20
G
Mechanical vibration
Mil-STD-883D, Method 2007.2, 20-2000 Hz
15
Weight
2.5
grams
Flammability
Meets UL94V-O
(1) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the
stated maximum.
(2) The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65C.
Copyright © 2005–2007, Texas Instruments Incorporated
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3
Product Folder Link(s): PTH08T230W PTH08T231W
PTH08T230W, PTH08T231W
www.ti.com
SLTS265F–NOVEMBER 2005–REVISED MAY 2007
ELECTRICAL CHARACTERISTICS
TA =25°C, VI = 5V, VO = 3.3V, CI = 330µF, CO1 = 200µF ceramic, CO2 = 100µF, IO = IOmax (unless otherwise stated)
PARAMETER
TEST CONDITIONS
PTH08T230W
MIN
TYP
MAX
UNIT
IO
VI
Output current
Over VO range
Over IO range
Over IO range
25°C, natural convection
0
6
A
11 × VO
0.69 ≤ VO ≤ 1.2
4.5
(1)
Input voltage range
V
1.2 < VO ≤ 3.6
3.6 < VO ≤ 5.5
4.5
VO +1(2)
0.69
14
14
Output adjust range
Set-point voltage tolerance
Temperature variation
Line regulaltion
5.5
V
(3)
±1.0
%Vo
%Vo
mV
–40°C < TA < 85°C
±0.25
±3
VO
Over VI range
Load regulation
Over IO range
±2
mV
(3)
Total output variation
Includes set-point, line, load, –40°C ≤ TA ≤ 85°C
±1.5
%VO
RSET = 169 Ω, VI = 8.0 V, VO = 5.0V
95%
92%
90%
88%
87%
85%
83%
79%
1
RSET = 1.21 kΩ, VO = 3.3 V
RSET = 2.37 kΩ, VO = 2.5 V
RSET = 4.75 kΩ, VO = 1.8 V
RSET = 6.98 kΩ, VO = 1.5 V
RSET = 12.1 kΩ, VO = 1.2 V
RSET = 20.5 kΩ, VO = 1.0 V
RSET = 681 Ω, VO = 0.7 V
η
Efficiency
IO = 6 A
VO Ripple (peak-to-peak)
Overcurrent threshold
20-MHz bandwidth
%VO
A
ILIM
Reset, followed by auto-recovery
10
Recovery Time
VO Overshoot
Recovery Time
70
µSec
mV
w/o TurboTrans
CO1 = 200 µF, ceramic
150
100
(4)
w/o TurboTrans
CO1 = 200 µF, ceramic
CO2 = 330 µF, Type B
µSec
2.5 A/µs load step
50% to 100% IOmax
VO = 2.5 V
Transient response
VO Overshoot
100
150
mV
with TurboTrans
Recovery Time
µSec
CO1 = 200 µF, ceramic
CO2 = 330 µF, Type B
RTT = 11.3 kΩ
VO Overshoot
60
mV
(5)
IIL
Track input current (pin 9)
Pin to GND
-130
µA
dVtrack/dt Track slew rate capability
CO ≤ CO (max)
1
V/ms
VI increasing, RUVLO = OPEN
VI decreasing, RUVLO = OPEN
Hysteresis, RUVLO ≤ 52.3 kΩ
4.3
4.2
0.5
4.45
Adjustable Under-voltage lockout
UVLOADJ
(pin 10)
4.0
V
Input high voltage (VIH
)
Open(6)
0.6
V
Inhibit control (pin 10)
Input low voltage (VIL)
-0.2
Input low current (IIL), Pin 10 to GND
235
5
µA
mA
kHz
Iin
Input standby current
Switching frequency
Inhibit (pin 10) to GND, Track (pin 9) open
Over VI and IO ranges, SmartSync (pin 1) to GND
f s
300
(1) The maximum input voltage is duty cycle limited to (VO × 11)V or 14V, whichever is less. The maximum allowable input voltage is a
function of switching frequency, and may increase or decrease when the SmartSync feature is used. Please review the SmartSync
section of the Application Information for further guidance.
(2) The minimum input voltage is 4.5V or (VO+1)V, whichever is greater. Additional input capacitance may be required when VI < (VO+2)V.
(3) The set-point voltage tolerance is affected by the tolerance and stability of RSET. The stated limit is unconditionally met if RSET has a
tolerance of 1% with 100 ppm/C or better temperature stability.
(4) Without TurboTrans, the minimum ESR limit of 7 mΩ must not be violated.
(5) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 9. The
open-circuit voltage is less than 6.5 Vdc.
(6) This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when
input power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. For additional information, see the related
application information section.
4
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Copyright © 2005–2007, Texas Instruments Incorporated
Product Folder Link(s): PTH08T230W PTH08T231W
PTH08T230W, PTH08T231W
www.ti.com
SLTS265F–NOVEMBER 2005–REVISED MAY 2007
ELECTRICAL CHARACTERISTICS (continued)
TA =25°C, VI = 5V, VO = 3.3V, CI = 330µF, CO1 = 200µF ceramic, CO2 = 100µF, IO = IOmax (unless otherwise stated)
PARAMETER
TEST CONDITIONS
PTH08T230W
MIN
TYP
MAX
400
5.5
UNIT
kHz
V
fSYNC
VSYNCH
VSYNCL
tSYNC
CI
Synchronization (SYNC) frequency
SYNC High-Level Input Voltage
SYNC Low-Level Input Voltage
SYNC Minimum Pulse Width
External input capacitance
240
2
SmartSync Control
0.8
V
200
nSec
µF
(7)
330
(8)
(8)
(9)
Nonceramic
Ceramic
0
100
5000
Capacitance value
µF
without
TurboTrans
200
500
Equivalent series resistance (non-ceramic)
Capacitance value
7
mΩ
µF
CO
External output capacitance
see table
10,000
(10)
(11)
with
Turbotrans
Capacitance × ESR product (CO × ESR)
1000
6.7
10,000 µF×mΩ
Per Telcordia SR-332, 50% stress,
TA = 40°C, ground benign
106 Hr
MTBF
Reliability
(7) A 330 µF electrolytic input capacitor is required for proper operation. The capacitor must be rated for a minimum of 450 mA rms of ripple
current. An additional 22-µF ceramic input capacitor is recommended to reduce rms ripple current. When operating at VI > 8V, the
minimum required CI may be reduced to a 220-µF electrolytic plus a 22-µF ceramic.
(8) 200 µF ceramic external output capacitance is required for basic operation. The required ceramic output capacitance can be made up of
2×100µF or 4×47µF. The minimum output capacitance requirement increases when TurboTrans™ (TT) technology is used. See the
Application Information for more guidance.
(9) This is the calculated maximum disregarding TurboTrans™ technology. When the TurboTrans feature is used, the minimum output
capacitance must be increased. See the TurboTrans application notes for further guidance.
(10) When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESR
capacitors are required for proper operation. See the TurboTrans application notes for further guidance.
(11) This is the calaculated maximum when using the TurboTrans feature. Additionally, low ESR capacitors are required for proper operation.
See the TurboTrans application notes for further guidance.
Copyright © 2005–2007, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): PTH08T230W PTH08T231W
PTH08T230W, PTH08T231W
www.ti.com
SLTS265F–NOVEMBER 2005–REVISED MAY 2007
ELECTRICAL CHARACTERISTICS
TA =25°C, VI = 5 V, VO = 3.3 V, CI = 330 µF, CO1 = 200 µF ceramic, and IO = IO max (unless otherwise stated)
PARAMETER
TEST CONDITIONS
PTH08T231W
MIN
TYP
MAX
UNIT
IO
VI
Output current
Over VO range
Over IO range
Over IO range
25°C, natural convection
0
6
A
11 × VO
0.69 ≤ VO ≤ 1.2
4.5
(1)
Input voltage range
V
1.2 < VO ≤ 3.6
3.6 < VO ≤ 5.5
4.5
VO +1(2)
0.69
14
14
Output adjust range
Set-point voltage tolerance
Temperature variation
Line regulaltion
5.5
V
(3)
±1.0
%Vo
%Vo
mV
–40°C < TA < 85°C
±0.25
±3
VO
Over VI range
Load regulation
Over IO range
±2
mV
(3)
Total output variation
Includes set-point, line, load, –40°C ≤ TA ≤ 85°C
±1.5
%VO
RSET = 169 Ω, VI = 8.0 V, VO = 5.0V
95%
92%
90%
88%
87%
85%
83%
79%
1
RSET = 1.21 kΩ, VO = 3.3 V
RSET = 2.37 kΩ, VO = 2.5 V
RSET = 4.75 kΩ, VO = 1.8 V
RSET = 6.98 kΩ, VO = 1.5 V
RSET = 12.1 kΩ, VO = 1.2 V
RSET = 20.5 kΩ, VO = 1.0 V
RSET = 681 Ω, VO = 0.7 V
η
Efficiency
IO = 6 A
VO Ripple (peak-to-peak)
Overcurrent threshold
20-MHz bandwidth
%VO
A
ILIM
Reset, followed by auto-recovery
10
Recovery Time
VO Overshoot
Recovery Time
VO Overshoot
Recovery Time
80
µSec
mV
w/o TurboTrans
CO1 = 200 µF, ceramic
85
2.5 A/µs load step
50% to 100% IOmax
VI = 12 V
(4)
120
75
µSec
mV
w/o TurboTrans
CO1 = 400 µF, ceramic
Transient response
VO = 3.3 V
with TurboTrans
CO1 = 400 µF, ceramic
RTT = 8.06 kΩ
220
µSec
VO Overshoot
45
mV
(5)
IIL
Track input current (pin 9)
Pin to GND
-130
µA
dVtrack/dt Track slew rate capability
CO ≤ CO (max)
1
V/ms
VI increasing, RUVLO = OPEN
VI decreasing, RUVLO = OPEN
Hysteresis, RUVLO ≤ 52.3 kΩ
4.3
4.2
0.5
4.45
Adjustable Under-voltage lockout
UVLOADJ
(pin 10)
4.0
V
Input high voltage (VIH
)
Open(6)
0.6
V
Inhibit control (pin 10)
Input low voltage (VIL)
-0.2
Input low current (IIL), Pin 10 to GND
235
5
µA
mA
kHz
Iin
Input standby current
Switching frequency
Inhibit (pin 10) to GND, Track (pin 9) open
Over VI and IO ranges, SmartSync (pin 1) to GND
f s
300
(1) The maximum input voltage is duty cycle limited to (VO × 11)V or 14V, whichever is less. The maximum allowable input voltage is a
function of switching frequency, and may increase or decrease when the SmartSync feature is used. Please review the SmartSync
section of the Application Information for further guidance.
(2) The minimum input voltage is 4.5V or (VO+1)V, whichever is greater. Additional input capacitance may be required when VI < (VO+2)V.
(3) The set-point voltage tolerance is affected by the tolerance and stability of RSET. The stated limit is unconditionally met if RSET has a
tolerance of 1% with 100 ppm/C or better temperature stability.
(4) Without TurboTrans, the minimum ESR limit of 7 mΩ must not be violated.
(5) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 9. The
open-circuit voltage is less than 6.5 Vdc.
(6) This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when
input power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. For additional information, see the related
application information section.
6
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Copyright © 2005–2007, Texas Instruments Incorporated
Product Folder Link(s): PTH08T230W PTH08T231W
PTH08T230W, PTH08T231W
www.ti.com
SLTS265F–NOVEMBER 2005–REVISED MAY 2007
ELECTRICAL CHARACTERISTICS (continued)
TA =25°C, VI = 5 V, VO = 3.3 V, CI = 330 µF, CO1 = 200 µF ceramic, and IO = IO max (unless otherwise stated)
PARAMETER
TEST CONDITIONS
PTH08T231W
MIN TYP
MAX
400
5.5
UNIT
kHz
V
fSYNC
VSYNCH
VSYNCL
tSYNC
CI
Synchronization (SYNC) frequency
SYNC High-Level Input Voltage
SYNC Low-Level Input Voltage
SYNC Minimum Pulse Width
External input capacitance
240
2
SmartSync Control
0.8
V
200
nSec
µF
(7)
300
without
TurboTrans
(8)
Capacitance value
Capacitance value
Ceramic
Ceramic
200
5000
µF
CO
External output capacitance
see table
(10)
5000
µF
(9)
with
Turbotrans
Capacitance × ESR product (CO × ESR)
100
6.7
1000 µF×mΩ
Per Telcordia SR-332, 50% stress,
TA = 40°C, ground benign
106 Hr
MTBF
Reliability
(7) 300 µF of ceramic or 330 µF of electrolytic input capacitance is required for proper operation. Electrolytic capacitance must be rated for
a minimum of 450 mA rms of ripple current. An additional 22-µF ceramic input capacitor is recommended to reduce rms ripple current.
(8) 200 µF ceramic external output capacitance is required for basic operation. The required ceramic output capacitance can be made up of
2×100µF or 4×47µF. The minimum output capacitance requirement increases when TurboTrans™ (TT) technology is used. See the
Application Information for more guidance.
(9) When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESR
capacitors are required for proper operation. See the TurboTrans application notes for further guidance.
(10) This is the calaculated maximum when using the TurboTrans feature. Additionally, low ESR capacitors are required for proper operation.
See the TurboTrans application notes for further guidance.
Copyright © 2005–2007, Texas Instruments Incorporated
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Product Folder Link(s): PTH08T230W PTH08T231W
PTH08T230W, PTH08T231W
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
PTH08T230/231W
(TOP VIEW)
1
2
10
9
8
7
6
5
3
4
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
VI
NO.
2
The positive input voltage power node to the module, which is referenced to common GND.
The regulated positive power output with respect to the GND.
VO
4
This is the common ground connection for the VI and VO power connections. It is also the 0 Vdc reference for
the control inputs.
GND
3
The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low level
ground signal to this input disables the module’s output and turns off the output voltage. When the Inhibit control
is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, the
module produces an output whenever a valid input source is applied.
Inhibit and
UVLO(1)
10
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin to
GND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For more
information, see the Application Information section.
A 0.05 W 1% resistor must be directly connected between this pin and pin 6 (– Sense) to set the output voltage
to a value higher than 0.69 V. The temperature stability of the resistor should be 100 ppm/°C (or better). The
setpoint range for the output voltage is from 0.69 V to 5.5 V. If left open circuit, the output voltage will default to
its lowest value. For further information, on output voltage adjustment see the related application note.
VO Adjust
7
The specification table gives the preferred resistor values for a number of standard output voltages.
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy, +Sense must be connected to VO, close to the load.
+ Sense
– Sense
5
6
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy, –Sense must be connected to GND (pin 3), very close to the module (within 10
cm).
This is an analog control input that enables the output voltage to follow an external voltage. This pin becomes
active typically 20 ms after the input voltage has been applied, and allows direct control of the output voltage
from 0 V up to the nominal set-point voltage. Within this range the module's output voltage follows the voltage at
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulates
at its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules powered
from the same input bus. If unused, this input should be connected to VI.
Track
9
NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltage
during power up. For more information, see the related application note.
This input pin adjusts the transient response of the regulator. To activate the TurboTrans feature, a 1%, 0.05 W
resistor must be connected between this pin and pin 5 (+Sense) very close to the module. For a given value of
output capacitance, a reduction in peak output voltage deviation is achieved by using this feature. If unused, this
pin must be left open-circuit. The resistance requirement can be selected from the TurboTrans resistor table in
the Application Information section. External capacitance must never be connected to this pin unless the
TurboTrans resistor is a short, 0Ω.
TurboTrans™
SmartSync
8
1
This input pin sychronizes the switching frequency of the module to an external clock frequency. The SmartSync
feature can be used to sychronize the switching fequency of multiple PTH08T230/231W modules, aiding EMI
noise suppression efforts. If unused, this pin should be connected to GND (pin 3). For more information, please
review the Application Information section.
(1) Denotes negative logic: Open = Normal operation, Ground = Function active
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TYPICAL CHARACTERISTICS(1)(2)
CHARACTERISTIC DATA ( VI = 12 V)
EFFICIENCY
vs
OUTPUT CURRENT
OUTPUT RIPPLE
vs
OUTPUT CURRENT
POWER DISSIPATION
vs
OUTPUT CURRENT
25
20
100
2.5
V
= 3.3 V
V
= 5 V
O
V
= 5 V
O
O
95
90
V
= 5 V
O
2
1.5
1
V
= 3.3 V
O
85
80
75
15
10
5
V
= 2.5 V
O
V = 3.3 V
O
V
= 2.5 V
O
V
= 2.5 V
O
V
= 1.8 V
O
V
= 1.8 V
O
70
65
60
55
50
V
= 1.5 V
O
V
= 1.5 V
O
V
= 1.2 V
O
0.5
0
V
= 1.2 V
O
V
= 1.8 V
1
V
= 1.5 V
3
V
O
= 1.2 V
5 6
O
O
0
0
1
2
3
4
5
6
0
2
4
0
1
2
3
4
5
6
I
− Output Current − A
O
I
− Output Current − A
I
O
− Output Current − A
O
Figure 1.
Figure 2.
Figure 3.
AMBIENT TEMPERATURE
vs
AMBIENT TEMPERATURE
vs
AMBIENT TEMPERATURE
vs
OUTPUT CURRENT
OUTPUT CURRENT
OUTPUT CURRENT
90
80
70
60
50
40
90
80
70
60
50
40
90
80
70
60
50
40
Nat Conv
100 LFM
Nat Conv
100 LFM
Nat Conv
V
= 5 V
V
= 3.3 V
V = 1.2 V
O
O
O
30
20
30
20
30
20
0
1
2
3
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
I
O
− Output Current − A
I
O
− Output Current − A
I − Output Current − A
O
Figure 4.
Figure 5.
Figure 6.
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
Applies to Figure 4 and Figure 5.
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TYPICAL CHARACTERISTICS(1)(2)
CHARACTERISTIC DATA ( VI = 5 V)
EFFICIENCY
vs
OUTPUT CURRENT
OUTPUT RIPPLE
vs
OUTPUT CURRENT
POWER DISSIPATION
vs
OUTPUT CURRENT
10
8
100
1.6
1.4
1.2
1
V
= 3.3 V
V
= 2.5 V
O
O
95
90
85
80
75
70
65
60
V
= 3.3 V
O
V
= 1.8 V
V
O
V
= 3.3 V
O
= 2.5 V
O
V
O
= 2.5 V
6
4
2
0
O
0.8
0.6
V
V
= 1.5 V
O
V
= 1.8 V
V
= 1.8 V
O
= 1.2 V
O
V
= 1.5 V
O
0.4
0.2
0
V
= 1.2 V
V
= 0.7 V
O
O
V
= 1.5 V
V = 0.7 V
O
V
= 1.2 V
O
O
V
= 0.7 V
3
O
0
1
2
4
5
6
0
1
2
3
4
5
6
0
1
2
3
4
5
6
I
− Output Current − A
O
I
− Output Current − A
I
O
− Output Current − A
O
Figure 7.
Figure 8.
Figure 9.
AMBIENT TEMPERATURE
vs
OUTPUT CURRENT
90
80
70
60
50
40
Nat Conv
ALL V
O
30
20
0
1
2
3
4
5
6
I
O
− Output Current − A
Figure 10.
(1) The electrical characteristic data has been developed from actual products tested at 25C. This data is considered typical for the
converter. Applies to Figure 7, Figure 8, and Figure 9.
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
Applies to Figure 10.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
APPLICATION INFORMATION
ADJUSTING THE OUTPUT VOLTAGE
The VO Adjust control (pin 7) sets the output voltage of the PTH08T230/231W. The adjustment range is 0.69V to
5.5V. The adjustment method requires the addition of a single external resistor, RSET, that must be connected
directly between the VO Adjust and the –Sense pins. Table 1 gives the standard value of the external resistor for
a number of standard voltages, along with the actual output voltage that this resistance value provides.
For other output voltages, the required resistor value can either be calculated using the following formula, or
simply selected from the values given in Table 2. Figure 11 shows the placement of the required resistor.
0.69
- 1.43 k W
R
= 10 kW x
SET
V
- 0.69
O
(1)
Table 1. Preferred Values of RSET for Standard Output Voltages
VO (Standard) (V)
RSET (Standard Value) (kΩ)
VO (Actual) (V)
5.01
(1)
5.0
3.3
0.169
1.2
3.30
2.5
1.8
1.5
2.37
4.7
2.51
1.81
6.98
12.1
20.5
681
1.51
(2)
1.2
1.0
0.7
1.20
(2)
(2)
1.01
0.70
(1) For VO > 3.6 V, the minimum input voltage is (VO + 1) V.
(2) The maximum input voltage is (VO × 11) V or 14 V, whichever is less. The maximum allowable input
voltage is a function of switching frequency and may increase or decrease when the Smart Sync
feature is used. Review the Smart Sync application section for further guidance.
+Sense
5
+Sense
V
O
4
V
O
PTH08T230W
6
−Sense
GND
3
VoAdj
7
R
SET
1%
0.05 W
−Sense
GND
(1) RSET: Use a 0.05 W resistor with a tolerance of 1% and temperature stability of 100 ppm/°C (or better). Connect the
resistor directly between pins 7 and 6, as close to the regulator as possible, using dedicated PCB traces.
(2) Never connect capacitors from VO Adjust to either GND, VO, or +Sense. Any capacitance added to the VO Adjust pin
affects the stability of the regulator.
Figure 11. VO Adjust Resistor Placement
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Table 2. Output Voltage Set-Point Resistor Values
VO Required
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.10
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
2.50
2.60
2.70
2.80
2.90
RSET (kΩ)
0.681
0.113
61.9
41.2
31.6
24.9
20.5
15.4
12.1
9.88
8.25
6.98
6.04
5.36
4.75
4.22
3.83
3.40
3.09
2.87
2.61
2.37
2.15
2.00
1.82
1.69
VO Required (V)
3.00
RSET (Ω)
1.54 k
1.43 k
1.33 k
1.21 k
1.13 k
1.02 k
931
3.10
3.20
3.30
3.40
3.50
3.60
3.70
866
3.80
787
3.90
715
4.00
649
4.10
590
4.20
536
4.30
475
4.40
432
4.50
383
4.60
332
4.70
287
4.80
249
4.90
210
5.00
169
5.10
133
5.20
100
5.30
66.5
34.8
4.99
5.40
5.50
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
CAPACITOR RECOMMENDATIONS FOR THE PTH08T230/231W POWER MODULE
Capacitor Technologies
Electrolytic Capacitors
When using electrolytic capacitors, high quality, computer-grade electrolytic capacitors are recommended.
Aluminum electrolytic capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz,
and are suitable when ambient temperatures are above -20°C. For operation below -20°C, tantalum,
ceramic, or OS-CON type capacitors are required.
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic
capacitors have a low ESR and a resonant frequency higher than the bandwidth of the regulator. They can
be used to reduce the reflected ripple current at the input as well as improve the transient response of the
output.
Tantalum, Polymer-Tantalum Capacitors
Tantalum type capacitors may only used on the output bus, and are recommended for applications where the
ambient operating temperature is less than 0°C. The AVX TPS series and Kemet capacitor series are
suggested over many other tantalum types due to their lower ESR, higher rated surge, power dissipation,
and ripple current capability. Tantalum capacitors that have no stated ESR or surge current rating are not
recommended for power applications.
Input Capacitor (Required)
The PTH08T231W requires a minimum input capacitance of 300µF of ceramic type. (330 µF of electrolytic input
capacitance may also be used. See the following paragraph for the required electrolytic capacitor ratings.)
The PTH08T230W requires a minimum input capacitance of 330µF. The ripple current rating of the capacitor
must be at least 450mArms. An optional 22-µF X5R/X7R ceramic capacitor is recommended to reduce the RMS
ripple current. When operating with an input voltage greater than 8 V, the minimum required input capacitance
may be reduced to a 220-µF electrolytic plus a 22-µF ceramic.
Input Capacitor Information
The size and value of the input capacitor is determined by the converter’s transient performance capability. This
minimum value assumes that the converter is supplied with a responsive, low inductance input source. This
source should have ample capacitive decoupling, and be distributed to the converter via PCB power and ground
planes.
Ceramic capacitors should be located as close as possible to the module's input pins, within 0.5 inch (1,3 cm).
Adding ceramic capacitance is necessary to reduce the high-frequency ripple voltage at the module's input. This
will reduce the magnitude of the ripple current through the electroytic capacitor, as well as the amount of ripple
current reflected back to the input source. Additional ceramic capacitors can be added to further reduce the RMS
ripple current requirement for the electrolytic capacitor.
Increasing the minimum input capacitance to 680µF is recommended for high-performance applications, or
wherever the input source performance is degraded.
The main considerations when selecting input capacitors are the RMS ripple current rating, temperature stability,
and less than 100 mΩ of equivalent series resistance (ESR).
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommended
minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability. No
tantalum capacitors were found with a sufficient voltage rating to meet this requirement.
When the operating temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these
applications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
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Output Capacitor (Required)
The PTH08T231W requires a minimum output capacitance of 200µF of ceramic type.
The PTH08T230W requires a minimum output capacitance of 200µF ceramic type. An optional 100 µF of
non-ceramic, low-ESR capacitance is recommended for improved performance. See the Electrical
Characteristics table for maximum capacitor limits.
The required capacitance above the minimum will be determined by actual transient deviation requirements. See
the TurboTrans Technology application section within this document for specific capacitance selection.
Output Capacitor Information
When selecting output capacitors, the main considerations are capacitor type, temperature stability, and ESR.
When using the TurboTrans feature, the capacitance x ESR product should also be considered (see the following
section).
Ceramic output capacitors added for high-frequency bypassing should be located as close as possible to the
load to be effective. Ceramic capacitor values below 10µF should not be included when calculating the total
output capacitance value.
When the operating temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these
applications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
TurboTrans Output Capacitance
TurboTrans allows the designer to optimize the output capacitance according to the system transient design
requirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness. When
using TurboTrans, the capacitor's capacitance (in µF) × ESR (in mΩ) product determines its capacitor type; Type
A, B, or C. These three types are defined as follows:
Type A = (100 ≤ capacitance × ESR ≤ 1000) (e.g. ceramic)
Type B = (1000 < capacitance × ESR ≤ 5000) (e.g. polymer-tantalum)
Type C = (5000 < capacitance × ESR ≤ 10,000) (e.g. OS-CON)
When using more than one type of output capacitor, select the capacitor type that makes up the majority of your
total output capacitance. When calculating the C × ESR product, use the maximum ESR value from the capacitor
manufacturer's data sheet.
Working Examples:
A capacitor with a capacitance of 330µF and an ESR of 5mΩ, has a C×ESR product of 1650µFxmΩ (330 × 5).
This is a Type B capacitor. A capacitor with a capacitance of 1000µF and an ESR of 8mΩ, has a C×ESR product
of 8000µFxmΩ (1000 × 8). This is a Type C capacitor.
See the TurboTrans Technology application section within this document for specific capacitance selection.
Table 3 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.
Non-TurboTrans Output Capacitance
If the TurboTrans feature is not used, minimum ESR and maximum capacitor limits must be followed. System
stability may be effected and increased output capacitance may be required without TurboTrans.
When using the PTH08T230W without the TurboTrans feature, observe the minimum ESR of the entire output
capacitor bank. The minimum ESR limit of the output capacitor bank is 7mΩ. A list of preferred low-ESR type
capacitors, are identified in Table 3. Large amounts of capacitance may reduce system stability when not using
the TurboTrans feature.
When using the PTH08T231W without the TurboTrans feature, the maximum amount of capacitance is tbd µF of
ceramic type. Large amounts of capacitance may reduce system stability.
Using the TurboTrans feature improves system stability, improves transient response, and reduces the
amount of output capacitance required to meet system transient design requirements.
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Designing for Fast Load Transients
The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of
2.5A/µs. The typical voltage deviation for this load transient is given in the Electrical Characteristics table using
the minimum required value of output capacitance. As the di/dt of a transient is increased, the response of a
converter’s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent
limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with
additional low ESR ceramic capacitor decoupling. Generally, with load steps greater than 100A/µs, adding
multiple 10µF ceramic capacitors plus 10×1µF, and numerous high frequency ceramics (≤0.1µF) is all that is
required to soften the transient higher frequency edges. The PCB location of these capacitors in relation to the
load is critical. DSP, FPGA and ASIC vendors identify types, location and amount of capacitance required for
optimum performance. Low impedance buses, unbroken PCB copper planes, and components located as close
as possible to the high frequency devices are essential for optimizing transient performance.
Table 3. Input/Output Capacitors(1)
Capacitor Characteristics
Quantity
(2)
Max
Max.
Output Bus
Capacitor Vendor,
Type Series (Style)
Ripple
Working Value
ESR
at 100
kHz
Physical
Size (mm)
Input
Bus
No
Turbo-
Trans
Turbo-
Trans
Current
at 85°C
(Irms)
Vendor Part No.
Voltage
(µF)
Cap Type(3)
Panasonic
FC (Radial)
25 V
25 V
35 V
35 V
1000 43mΩ 1690mA
16 × 15
12 × 20
1
1
1
1
≥ 2
≥ 1
≥ 1
≥ 2
N/R(4)
N/R(4)
N/R(4)
N/R(4)
EEUFC1E102S
FC (Radial)
820
470
38mΩ 1655mA
43mΩ 1690mA
EEUFC1E821S
EEVFC1V471N
EEVFK1V102M
FC (SMD)
16 × 16,5
16 ×16,5
FK (SMD)
1000 35mΩ 1800mA
United Chemi-Con
PTB, Poly-Tantalum(SMD)
LXZ, Aluminum (Radial)
PS, Poly-Alum (Radial)
PS, Poly-Alum (Radial)
PXA, Poly-Alum (SMD)
PXA, Poly-Alum (Radial)
Nichicon, Aluminum
PM (Radial)
6.3 V
35 V
16 V
6.3 V
16 V
10 V
330
680
330
390
330
330
25mΩ 2600mA 7,3×4,3×2.8 N/R(5)
1 ~ 4
1 ~ 3
1 ~ 3
1 ~ 2
1 ~ 3
1 ~ 2
C ≥ 2(6)
N/R(4)
B ≥ 2(6)
B ≥ 1(6)
B ≥ 2(6)
B ≥ 1(6)
6PTB337MD6TER (VO≤ 5.1V)(7)
LXZ35VB681M12X20LL
16PS330MJ12
6PS390MH11 (VO≤ 5.1V)(7)
PXA16VC331MJ12TP
PXA10VC331MH12
38mΩ 1660mA
14mΩ 5060mA
12mΩ 5500mA
14mΩ 5050mA
14mΩ 4420mA
12,5 × 20
10 × 12,5
8 × 12,5
10 × 12,2
8 × 12,2
1
1
N/R(5)
1
N/R(5)
25 V
35 V
2.0 V
1000 43mΩ 1520mA
18 × 15
10 × 20
1
1
≥ 2
≥ 2
N/R(8)
N/R(4)
N/R(4)
B ≥ 2(6)
UPM1E102MHH6
HD (Radial)
470
390
23mΩ 1820mA
5mΩ
UHD1V471HR
EEFSE0J391R(VO≤ 1.6V)(7)
Panasonic, Poly-Aluminum
4000mA 7,3×4,3×4,2 N/R(5)
(1) Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products.
RoHS, Lead-free and Material Details
See the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.
Component designators or part number deviations can occur when material composition or soldering requirements are updated.
(2) Additional output capacitance must include the required 200 µF of ceramic type.
(3) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor Selection
Capacitor Types:
a. Type A = (100 < capacitance × ESR ≤ 1000)
b. Type B = (1,000 < capacitance × ESR ≤ 5,000)
c. Type C = (5,000 < capacitance × ESR ≤ 10,000)
(4) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher
ESR capacitors can be used in conjunction with lower ESR capacitance.
(5) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
(6) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor Selection
Capacitor Types:
a. Type A = (100 < capacitance × ESR ≤ 1000)
b. Type B = (1,000 < capacitance × ESR ≤ 5,000)
c. Type C = (5,000 < capacitance × ESR ≤ 10,000)
(7) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
(8) N/R – Not recommended. The ESR value of this capacitor is below the required minimum when not using TurboTrans.
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Table 3. Input/Output Capacitors (continued)
Capacitor Characteristics
Quantity
(2)
Max
Output Bus
Max.
ESR
at 100
kHz
Capacitor Vendor,
Type Series (Style)
Ripple
Current
at 85°C
(Irms)
Working Value
Physical
Size (mm)
Input
Bus
No
Turbo-
Trans
Turbo-
Trans
Vendor Part No.
Voltage
(µF)
Cap Type(3)
Sanyo
TPE, Poscap (SMD)
TPE, Poscap (SMD)
TPD, Poscap (SMD)
SEP, OS-CON (Radial)
SEPC, OS-CON (Radial)
SVP, OS-CON (SMD)
AVX, Tantalum
10 V
2.5 V
2.5 V
16 V
16 V
16 V
330
470
1000
330
470
330
25mΩ 3300mA
7,3×4,3
7,3×4,3
7,3×4,3
10 × 13
10 × 13
10 × 12,6
N/R(9)
N/R(9)
N/R(9)
1 ~ 3
1 ~ 2
N/R(12)
1 ~ 2
1 ~ 2
1 ~ 2
C ≥ 1(10)
B ≥ 2(10)
B ≥ 1(10)
B ≥ 1(10)
B ≥ 2(10)
B ≥ 1(10)
10TPE330MF(11)
7mΩ
5mΩ
4400mA
6100mA
2R5TPE470M7(VO≤ 1.8V)(11)
2R5TPD1000M5(VO≤ 1.8V)(11)
16SEP330M
16mΩ 4700mA
10mΩ 6100mA
16mΩ 4700mA
1
1
1
16SEPC470M
16SVP330M
TPM Multianode
10 V
10 V
4 V
330
330
23mΩ 3000mA 7,3×4,3×4,1 N/R(9)
40mΩ 1830mA 7,3×4,3×4,1 N/R(9)
1 ~ 3
1 ~ 6
1 ~ 5
C ≥ 2(10)
N/R(13)
N/R(13)
TPME337M010R0035
TPS Series III (SMD)
TPS Series III (SMD)
Kemet, Poly-Tantalum
T520 (SMD)
TPSE337M010R0040 (VO≤ 5V)(14)
TPSV108K004R0035 (VO≤ 2.1V)(14)
1000 25mΩ 2400mA 7,3×6,1×3.5 N/R(9)
10 V
6.3 V
4 V
330
330
25mΩ 2600mA 7,3×4,3×4,1 N/R(9)
15mΩ 3800mA 7,3×4,3×4,1 N/R(9)
1 ~ 3
2 ~ 3
N/R(12)
N/R(12)
C ≥ 2(10)
B ≥ 2(10)
B ≥ 1(10)
B ≥ 1(10)
T520X337M010ASE025(11)
T530X337M010ASE015(11)
T530X687M004ASE005 (VO≤ 3.5V)(11)
T530X108M2R5ASE005 (VO≤ 2.0V)(11)
T530 (SMD)
T530 (SMD)
680
5mΩ
5mΩ
7300mA 7,3×4,3×4,1 N/R(9)
7300mA 7,3×4,3×4,1 N/R(9)
T530 (SMD)
2.5 V
1000
Vishay-Sprague
597D, Tantalum (SMD)
94SA, OS-CON (Radial)
94SVP OS-CON(SMD)
Kemet, Ceramic X5R
(SMD)
10 V
16 V
16 V
16 V
6.3 V
6.3 V
6.3 V
25 V
16 V
6.3 V
6.3 V
16 V
16 V
330
470
330
10
35mΩ 2500mA 7,3×5,7×4,1 N/R(9)
1 ~ 5
1 ~ 3
N/R(13)
C ≥ 2(10)
C ≥ 1(10)
A(10)
A(10)
A(10)
A(10)
A(10)
A(10)
A(10)
597D337X010E2T
94SA477X0016GBP
94SVP337X06F12
C1210C106M4PAC
C1210C476K9PAC
GRM32ER60J107M
GRM32ER60J476M
GRM32ER61E226K
GRM32DR61C106K
C3225X5R0J107MT
C3225X5R0J476MT
C3225X5R1C106MT0
C3225X5R1C226MT
20mΩ 6080mA
17mΩ 4500mA
12 × 22
10 × 12,7
3225
1
2
1
2 ~ 3
2mΩ
2mΩ
2mΩ
–
≥ 1(15)
≥ 1(15)
≥ 1(15)
≥ 1(15)
≥ 1(15)
≥ 1(15)
≥ 1(15)
≥ 1(15)
≥ 1(15)
≥ 1(15)
47
N/R(9)
N/R(9)
N/R(9)
1
Murata, Ceramic X5R
(SMD)
100
47
–
3225
22
10
1
TDK, Ceramic X5R
(SMD)
100
47
2mΩ
–
3225
N/R(9)
N/R(9)
1
A(10)
A(10)
A(10)
10
22
1
(9) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
(10) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor Selection
Capacitor Types:
a. Type A = (100 < capacitance × ESR ≤ 1000)
b. Type B = (1,000 < capacitance × ESR ≤ 5,000)
c. Type C = (5,000 < capacitance × ESR ≤ 10,000)
(11) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
(12) N/R – Not recommended. The ESR value of this capacitor is below the required minimum when not using TurboTrans.
(13) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher
ESR capacitors can be used in conjunction with lower ESR capacitance.
(14) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 50% of the working voltage.
(15) Any combination of ceramic capacitor values is limited as listed in the Electrical Characteristics table.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
TURBOTRANS
TurboTrans™ Technology
TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules.
TurboTrans optimizes the transient response of the regulator with added external capacitance using a single
external resistor. Benefits of this technology include reduced output capacitance, minimized output voltage
deviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. The
amount of output capacitance required to meet a target output voltage deviation will be reduced with TurboTrans
activated. Likewise, for a given amount of output capacitance, with TurboTrans engaged, the amplitude of the
voltage deviation following a load transient will be reduced. Applications requiring tight transient voltage
tolerances and minimized capacitor footprint area will benefit greatly from this technology.
TurboTrans™ Selection
Using TurboTrans requires connecting a resistor, RTT, between the +Sense pin (pin5) and the TurboTrans pin
(pin8). The value of the resistor directly corresponds to the amount of output capacitance required. All T2
products require a minimum value of output capacitance whether or not TurboTrans is used. For the
PTH08T230W, the minimum required capacitance is 200µF. When using TurboTrans, capacitors with a
capacitance × ESR product below 10,000 µF×mΩ are required. (Multiply the capacitance (in µF) by the ESR (in
mΩ) to determine the capacitance × ESR product.) See the Capacitor Selection section of the datasheet for a
variety of capacitors that meet this criteria.
Figure 12 through Figure 17 show the amount of output capacitance required to meet a desired transient voltage
deviation with and without TurboTrans for several capacitor types; TypeA (e.g. ceramic), TypeB (e.g.
polymer-tantalum), and TypeC (e.g. OS-CON). To calculate the proper value of RTT, first determine your required
transient voltage deviation limits and magnitude of your transient load step. Next, determine what type of output
capacitors will be used. (If more than one type of output capacitor is used, select the capacitor type that makes
up the majority of your total output capacitance). Knowing this information, use the chart in Figure 12 through
Figure 17 that corresponds to the capacitor type selected. To use the chart, begin by dividing the maximum
voltage deviation limit (in mV) by the magnitude of your load step (in Amps). This gives a mV/A value. Find this
value on the Y-axis of the appropriate chart. Read across the graph to the 'With TurboTrans' plot. From this
point, read down to the X-axis which lists the minimum required capacitance, CO, to meet that transient voltage
deviation. The required RTT resistor value can then be calculated using the equation or selected from the
TurboTrans table. The TurboTrans tables include both the required output capacitance and the corresponding
RTT values to meet several values of transient voltage deviation for 25%(1.5A), 50%(3A), and 75%(4.5A) output
load steps.
The chart can also be used to determine the achievable transient voltage deviation for a given amount of output
capacitance. Selecting the amount of output capacitance along the X-axis, reading up to the 'With TurboTrans'
curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output capacitance.
The required RTT resistor value can be calculated using the equation or selected from the TurboTrans table.
As an example, let's look at a 12-V application requiring a 45mV deviation during an 3A, 50% load transient. A
majority of 330µF, 10mΩ ouput capacitors are used. Use the 12V, Type B capacitor chart, Figure 14. Dividing
45mV by 3A gives 15mV/A transient voltage deviation per amp of transient load step. Select 15mV/A on the
Y-axis and read across to the 'With TurboTrans' plot. Following this point down to the X-axis gives us a minimum
required output capacitance of approximately 850µF. The required RTT resistor value for 850µF can then be
calculated or selected from Table 5. The required RTT resistor is 1.82 kΩ.
To see the benefit of TurboTrans, follow the 15mV/A marking across to the 'Without TurboTrans' plot. Following
that point down shows that you would need a minimum of 4000µF of output capacitance to meet the same
transient deviation limit. This is the benefit of TurboTrans. A typical TurboTrans schematic is shown in Figure 18.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
PTH08T231W Type A Capacitors
12-V INPUT
5-V INPUT
40
40
30
30
Without TurboTrans
Without TurboTrans
20
20
With TurboTrans
With TurboTrans
10
9
10
9
PTH08T231 Type A
Ceramic Capacitors
PTH08T231 Type A
Ceramic Capacitors
8
7
8
7
C − Capacitance − µF
C − Capacitance − µF
Figure 12. Capacitor Type A, 100 ≤ C(µF) x ESR(mΩ) ≤
Figure 13. Capacitor Type A, 100 ≤ C(µF) x ESR(mΩ) ≤
1000
1000
(e.g. Ceramic)
(e.g. Ceramic)
Table 4. Type A TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
12 V Input
5 V Input
CO
RTT
CO
RTT
25% load step
(1.5 A)
50% load step
(3 A)
75% load step
(4.5 A)
Minimum
Required Output
Capacitance (µF)
Required
TurboTrans
Resistor (kΩ)
Minimum
Required Output
Capacitance (µF)
Required
TurboTrans
Resistor (kΩ)
45
40
35
30
25
20
15
90
80
70
60
50
40
30
135
120
105
90
200
240
300
400
560
840
N/A
open
150
56.2
23.7
9.76
2.0
200
210
260
340
460
660
1450
open
634
97.6
37.4
16.5
5.9
75
60
45
N/A
short
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation:
1 - (C / 1000)
O
R
= 40 x
(k W)
TT
5 x (C / 1000) -1
O
(2)
Where CO is the total output capacitance in µF. CO values greater than or equal to 1000 µF require RTT to be
a short, 0 Ω.
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The
value of RTT must be calculated using the minimum required output capacitance determined from the
capacitor transient response charts above.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
PTH08T230W Type B Capacitors
12-V INPUT
5-V INPUT
60
60
50
50
40
40
30
Without TurboTrans
Without TurboTrans
30
20
20
With TurboTrans
10
9
10
9
With TurboTrans
8
7
8
7
C − Capacitance − µF
C − Capacitance − µF
Figure 14. Capacitor Type B, 1000 < C(µF) x ESR(mΩ) ≤
Figure 15. Capacitor Type B, 1000 < C(µF) x ESR(mΩ) ≤
5000
5000
(e.g. Polymer-Tantalum)
(e.g. Polymer-Tantalum)
Table 5. Type B TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
12 V Input
5 V Input
CO
RTT
CO
RTT
25% load step
(1.5 A)
50% load step
(3 A)
75% load step
(4.5 A)
Minimum
Required Output
Capacitance (µF)
Required
TurboTrans
Resistor (kΩ)
Minimum
Required Output
Capacitance (µF)
Required
TurboTrans
Resistor (kΩ)
75
60
50
40
30
25
20
15
150
120
100
80
225
180
150
120
90
200
260
320
420
600
740
980
3800
open
100
200
270
open
82.5
41.2
19.6
7.68
3.40
short
short
45.3
21.0
8.06
3.83
0.205
short
330
430
60
610
50
75
760
40
60
1000
4500
30
45
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation:
1 - (C / 1000)
O
R
= 40 x
(k W)
TT
5 x (C / 1000) -1
O
(3)
Where CO is the total output capacitance in µF. CO values greater than or equal to 1000 µF require RTT to be
a short, 0 Ω.
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The
value of RTT must be calculated using the minimum required output capacitance determined from the
capacitor transient response charts above.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
PTH08T230W Type C Capacitors
12-V INPUT
5-V INPUT
60
60
50
50
40
40
30
Without TurboTrans
Without TurboTrans
30
20
20
With TurboTrans
10
9
10
9
With TurboTrans
8
7
8
7
C − Capacitance − µF
C − Capacitance − µF
Figure 16. Capacitor Type C, 5000 < C(µF) x ESR(mΩ) ≤
Figure 17. Capacitor Type C, 5000 < C(µF) x ESR(mΩ) ≤
10,000
10,000
(e.g. OS-CON)
(e.g. OS-CON)
Table 6. Type C TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
12 V Input
5 V Input
CO
RTT
CO
RTT
25% load step
(1.5 A)
50% load step
(3 A)
75% load step
(4.5 A)
Minimum
Required Output
Capacitance (µF)
Required
TurboTrans
Resistor (kΩ)
Minimum
Required Output
Capacitance (µF)
Required
TurboTrans
Resistor (kΩ)
75
60
50
40
30
25
20
15
150
120
100
80
225
180
150
120
90
200
230
300
390
570
720
960
3100
open
205
200
250
310
400
580
730
980
4000
open
121
56.2
25.5
9.31
4.32
0.422
short
49.9
24.3
8.87
4.12
0.205
short
60
50
75
40
60
30
45
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming equation:
1 - (C / 1000)
O
R
= 40 x
(k W)
TT
5 x (C / 1000) -1
O
(4)
Where CO is the total output capacitance in µF. CO values greater than or equal to 1000 µF require RTT to be
a short, 0 Ω.
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The
value of RTT must be calculated using the minimum required output capacitance determined from the
capacitor transient response charts above.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
TurboTransTM
R
TT
0 kW
+Sense
AutoTrack SYNC TT
V
I
+Sense
V
I
V
O
V
O
PTH08T230W
−Sense
INH/UVLO
GND
VoAdj
C 1
C 2
O
O
C
I
200 mF
1200 mF
R
SET
330 mF
(Required)
Ceramic
(Required)
Type B
1%
0.05 W
−Sense
GND
GND
A. The value of RTT must be calculated using the total value of output capacitance.
Figure 18. Typical TurboTrans Schematic
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
UNDERVOLTAGE LOCKOUT (UVLO)
The PTH08T230/231W power modules incorporate an input undervoltage lockout (UVLO). The UVLO feature
prevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. This
enables the module to provide a clean, monotonic powerup for the load circuit, and also limits the magnitude of
current drawn from the regulator’s input source during the power-up sequence.
The UVLO characteristic is defined by the ON threshold (VTHD) voltage. Below the ON threshold, the Inhibit
control is overridden, and the module does not produce an output. The hysteresis voltage, which is the difference
between the ON and OFF threshold voltages, is set at 500 mV. The hysteresis prevents start-up oscillations,
which can occur if the input voltage droops slightly when the module begins drawing current from the input
source.
The UVLO feature of the PTH08T230/231W module allows for limited adjustment of the ON threshold voltage.
The adjustment is made via the Inhibit/UVLO control pin (pin 10) using a single resistor (see Figure 19). When
pin 10 is left open circuit, the ON threshold voltage is internally set to its default value, which is 4.3 V. The ON
threshold might need to be raised if the module is powered from a tightly regulated 12-V bus. Adjusting the
threshold prevents the module from operating if the input bus fails to completely rise to its specified regulation
voltage.
Threshold Adjust
Equation 5 determines the value of RUVLO required to adjust VTHD to a new value. The default value is 4.3 V, and
it may be adjusted, but only to a higher value.
70.74 - V
THD
k W
R
=
UVLO
V
- 4.26
THD
(5)
Calculated Values
Table 7 shows a chart of standard resistor values for RUVLO for different values of the ON threshold (VTHD
)
voltage.
Table 7. Standard RUVLO values for Various VTHD values
VTHD (V)
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
RUVLO (kΩ)
88.7
52.3
37.4
28.7
23.2
19.6
16.9
14.7
13.0
11.8
10.5
9.76
8.87
PTH08T230W
V
I
2
V
I
Inhibit/
UVLO Prog
10
C
I
+
GND
3
R
UVLO
GND
Figure 19. UVLO Implementation
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
Soft-Start Power Up
The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from the
Track pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Track
pin should be directly connected to the input voltage, VI (see Figure 20).
VI (5 V/div)
Track
PTH08T230W
V
I
VO (2 V/div)
2
V
I
GND
3
C
II (2 A/div)
I
GND
t - Time = 4 ms/div
Figure 20. Defeating the Auto-Track Function
Figure 21. Power-Up Waveform
When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. This
allows the module to power up entirely under the control of its internal soft-start circuitry. When power up is
under soft-start control, the output voltage rises to the set-point at a quicker and more linear rate. From the
moment a valid input voltage is applied, the soft-start control introduces a short time delay (typically 2ms–10ms)
before allowing the output voltage to rise. The output then progressively rises to the module’s setpoint voltage.
Figure 21 shows the soft-start power-up characteristic of the PTH08T230W operating from a 12-V input bus and
configured for a 3.3-V output. The waveforms were measured with a 6-A constant current load and the
Auto-Track feature disabled. The initial rise in input current when the input voltage first starts to rise is the charge
current drawn by the input capacitors. Power-up is complete within 20 ms.
Overcurrent Protection
For protection against load faults, all modules incorporate output overcurrent protection. Applying a load that
exceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, a
module periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode of
operation, whereby the module continues in a cycle of successive shutdown and power up until the load fault is
removed. During this period, the average current flowing into the fault is significantly reduced. Once the fault is
removed, the module automatically recovers and returns to normal operation.
Overtemperature Protection (OTP)
A thermal shutdown mechanism protects the module’s internal circuitry against excessively high temperatures. A
rise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If the
internal temperature exceeds the OTP threshold, the module’s Inhibit control is internally pulled low. This turns
the output off. The output voltage drops as the external output capacitors are discharged by the load circuit. The
recovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreases
by about 10°C below the trip point.
The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator.
Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-term
reliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits for
the worst-case conditions of ambient temperature and airflow.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
Output On/Off Inhibit
For applications requiring output voltage on/off control, the PTH08T230/231W incorporates an output Inhibit
control pin. The inhibit feature can be used wherever there is a requirement for the output voltage from the
regulator to be turned off.
The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated output
whenever a valid source voltage is connected to VI with respect to GND.
Figure 22 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit input
has its own internal pull-up. An external pull-up should never be connected to the inhibit pin. The input is not
compatible with TTL logic devices. An open-collector (or open-drain) discrete transistor is recommended for
control.
VO (2 V/div)
V
I
2
V
I
PTH08T230W
II (1 A/div)
10
Inhibit /
UVLO
GND
3
C
I
Q1
VINH (2 V/div)
1 = Inhibit
BSS138
GND
t - Time = 4 ms/div
Figure 23. Power-Up Response from Inhibit Control
Figure 22. On/Off Inhibit Control Circuit
Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is then
turned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within 15
ms. Figure 23 shows the typical rise in both the output voltage and input current, following the turn-off of Q1. The
turn off of Q1 corresponds to the rise in the waveform, VINH. The waveforms were measured with a 6-A constant
current load.
Remote Sense
Differential remote sense improves the load regulation performance of the module by allowing it to compensate
for any IR voltage drop between its output and the load in either the positive or return path. An IR drop is caused
by the output current flowing through the small amount of pin and trace resistance. Connecting the +Sense (pin
5) and –Sense (pin 6) pins to the respective positive and ground reference of the load terminals improves the
load regulation of the output voltage at the connection points.
With the sense pins connected at the load, the difference between the voltage measured directly between the VO
and GND pins, and that measured at the Sense pins, is the amount of IR drop being compensated by the
regulator. This should be limited to a maximum of 300mV.
If the remote sense feature is not used at the load, connect the +Sense pin to VO (pin4) and connect the –Sense
pin to the module GND (pin 3).
The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequency
dependent components that may be placed in series with the converter output. Examples include OR-ing
diodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote sense
connection they are effectively placed inside the regulation control loop, which can adversely affect the
stability of the regulator.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
Smart Sync
Smart Sync is a feature that allows multiple power modules to be synchronized to a common frequency. Driving
the Smart Sync pins with an external oscillator set to the desired frequency, synchronizes all connected modules
to the selected frequency. The synchronization frequency can be higher or lower than the nominal switching
frequency of the modules within the range of 240 kHz to 400 kHz (see Electrical Specifications table for
frequency limits). Synchronizing modules powered from the same bus, eliminates beat frequencies reflected back
to the input supply, and also reduces EMI filtering requirements. These are the benefits of Smart Sync. Power
modules can also be synchronized out of phase to minimize source current loading and minimize input
capacitance requirements. Figure 24 shows a standard circuit with two modules syncronized 180° out of phase
using a D flip-flop.
0o
Track SYNC TT
VI = 5 V
+Sense
V
I
VO1
V
PTH08T230W
O
INH/UVLO
SN74LVC2G74
-Sense
GND VoAdj
V
CC
C
1
CLR
PRE
O
C 1
I
200 mF
330 mF
Q
CLK
D
R
1
SET
f
= 2 x f
modules
clock
Q
GND
GND
180o
Track SYNC TT
+Sense
V
I
VO2
V
PTH08T240W
O
INH/UVLO
-Sense
GND VoAdj
C
2
O
C 2
I
200 mF
R
2
330 mF
SET
GND
Figure 24. Typical SmartSync Circuit
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
Smart Sync Input Voltage Limits
The maximum input voltage allowed for proper synchronization is duty cycle limited. When using Smart Sync, the
maximum allowable input voltage varies as a function of output voltage and switching frequency. Operationally,
the maximum input voltage is inversely proportional to switching frequency. Synchronizing to a higher frequency
causes greater restrictions on the input voltage range. For a given switching frequency, Figure 25 shows how the
maximum input voltage varies with output voltage.
For example, for a module operating at 400kHz and an output voltage of 1.2V, the maximum input voltage is
10V. Exceeding the maximum input voltage may cause in an increase in output ripple voltage and increased
output voltage variation.
As shown in Figure 25, input voltages below 6V can operate down to the minimum output voltage over the entire
synchronization frequency range. See the Electrical Characteristics table for the synchronization frequency range
limits.
15
240 kHz
14
13
12
11
400 kHz
10
350 kHz
300 kHz
9
8
7
6
5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
V - Output Voltage - V
O
Figure 25. Input Voltage vs Output Voltage
Auto-Track™ Function
The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Track
was designed to simplify the amount of circuitry required to make the output voltage from each module power up
and power down in sequence. The sequencing of two or more supply voltages during power up is a common
requirement for complex mixed-signal applications that use dual-voltage VLSI ICs such as the TMS320™ DSP
family, microprocessors, and ASICs.
How Auto-Track™ Works
(1)
Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin
.
This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage is
raised above the set-point voltage, the module output remains at its set-point (2). As an example, if the Track pin
of a 2.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the regulated
output does not go higher than 2.5 V.
When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on a
volt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages follow
a common signal during power up and power down. The control signal can be an externally generated master
ramp waveform, or the output voltage from another power supply circuit (3). For convenience, the Track input
incorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable rising
waveform at power up.
26
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
Typical Auto-Track™ Application
The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Track
compliant modules. Connecting the Track inputs of two or more modules forces their track input to follow the
same collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a common
Track control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltage
supervisor IC. See U3 in Figure 26.
To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should be
done at or before input power is applied to the modules. The ground signal should be maintained for at least
20 ms after input power has been applied. This brief period gives the modules time to complete their internal
soft-start initialization (4), enabling them to produce an output voltage. A low-cost supply voltage supervisor IC,
that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at power
up.
Figure 26 shows how the TL7712A supply voltage supervisor IC (U3) can be used to coordinate the sequenced
power up of PTH08T230/231W modules. The output of the TL7712A supervisor becomes active above an input
voltage of 3.6 V, enabling it to assert a ground signal to the common track control well before the input voltage
has reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately 28
ms after the input voltage has risen above U3's voltage threshold, which is 10.95 V. The 28-ms time period is
controlled by the capacitor C3. The value of 2.2 µF provides sufficient time delay for the modules to complete
their internal soft-start initialization. The output voltage of each module remains at zero until the track control
voltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises. This
causes the output voltage of each module to rise simultaneously with the other modules, until each reaches its
respective set-point voltage.
Figure 27 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, VO1
and VO2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively.
VTRK, VO1, and VO2 are shown rising together to produce the desired simultaneous power-up characteristic.
The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltage
threshold, the ground signal is re-applied to the common track control. This pulls the track inputs to zero volts,
forcing the output of each module to follow, as shown in Figure 28. Power down is normally complete before the
input voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once the
modules recognize that an input voltage is no longer present, their outputs can no longer follow the voltage
applied at their track input. During a power-down sequence, the fall in the output voltage from the modules is
limited by the Auto-Track slew rate capability.
Notes on Use of Auto-Track™
1. The Track pin voltage must be allowed to rise above the module set-point voltage before the module
regulates at its adjusted set-point voltage.
2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with ramp
speeds of up to 1 V/ms.
3. The absolute maximum voltage that may be applied to the Track pin is the input voltage VI.
4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization.
This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, it
is recommended that the Track pin be held at ground potential.
5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (VI). When Auto-Track is
disabled, the output voltage rises at a quicker and more linear rate after input power has been applied.
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
RTT
U1
AutoTrack TurboTrans
+Sense
V
= 12 V
I
VI
VO
PTH08T210W
VO 1 = 3.3V
Inhibit /
UVLOProg
–Sense
VoAdj
GND
+
CO
1
CI 1
RSET
1
U3
8
1.21 kW
V
CC
7
2
1
3
SENSE
RESIN
5
6
RESET
TL7712A
REF
RESET
RTT
U2
CT
AutoTrack TurboTrans
GND
Smart
+Sense
4
Sync
CREF
0.1 mF
CT
RRST
2.2 mF
10 kW
VI
PTH08T230W
VO
VO 2 = 1.8V
Inhibit /
–Sense
UVLOProg
GND
VoAdj
+
CO
2
CI 2
RSET
2
4.75 kW
Figure 26. Sequenced Power Up and Power Down Using Auto-Track
VTRK (1 V/div)
VTRK (1 V/div)
VO1 (1 V/div)
VO1 (1 V/div)
VO2 (1 V/div)
VO2 (1 V/div)
t - Time = 400 ms/div
t - Time = 20 ms/div
Figure 27. Simultaneous Power Up With Auto-Track
Control
Figure 28. Simultaneous Power Down With Auto-Track
Control
28
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
Prebias Startup Capability
A prebias startup condition occurs as a result of an external voltage being present at the output of a power
module prior to its output becoming active. This often occurs in complex digital systems when current from
another power source is backfed through a dual-supply logic component, such as an FPGA or ASIC. Another
path might be via clamp diodes as part of a dual-supply power-up sequencing arrangement. A prebias can cause
problems with power modules that incorporate synchronous rectifiers. This is because under most operating
conditions, these types of modules can sink as well as source output current.
The PTH family of power modules incorporate synchronous rectifiers, but does not sink current during startup(1),
or whenever the Inhibit pin is held low. However, to ensure satisfactory operation of this function, certain
conditions must be maintained(2). Figure 30 shows an application demonstrating the prebias startup capability.
The startup waveforms are shown in Figure 29. Note that the output current (IO) is negligible until the output
voltage rises above the voltage backfed through the intrinsic diodes.
The prebias start-up feature is not compatible with Auto-Track. When the module is under Auto-Track control, it
sinks current if the output voltage is below that of a back-feeding source. To ensure a pre-bias hold-off one of
two approaches must be followed when input power is applied to the module. The Auto-Track function must
either be disabled(3), or the module’s output held off (for at least 50 ms) using the Inhibit pin. Either approach
ensures that the Track pin voltage is above the set-point voltage at start up.
1. Startup includes the short delay (approximately 10 ms) prior to the output voltage rising, followed by the rise
of the output voltage under the module’s internal soft-start control. Startup is complete when the output
voltage has risen to either the set-point voltage or the voltage at the Track pin, whichever is lowest.
2. To ensure that the regulator does not sink current when power is first applied (even with a ground signal
applied to the Inhibit control pin), the input voltage must always be greater than the output voltage throughout
the power-up and power-down sequence.
3. The Auto-Track function can be disabled at power up by immediately applying a voltage to the module’s
Track pin that is greater than its set-point voltage. This can be easily accomplished by connecting the Track
pin to VI.
VIN (1 V/div)
VO (1 V/div)
IO (2 A/div)
t - Time = 4 ms/div
Figure 29. Prebias Startup Waveforms
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
3.3 V
Track
+Sense
V
VI = 5 V
Vo = 2.5 V
Io
V
PTH08T230W
I
O
Inhibit GND Vadj
-Sense
VCCIO
VCORE
CO
200 mF
++ CI
R
SET
2.37 kW
330 mF
ASIC
Figure 30. Application Circuit Demonstrating Prebias Startup
30
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SLTS265F–NOVEMBER 2005–REVISED MAY 2007
TRAY AND TAPE & REEL DRAWINGS
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
PTH08T230WAD
PTH08T230WAS
PTH08T230WAST
PTH08T230WAZ
PTH08T230WAZT
PTH08T231WAD
PTH08T231WAS
PTH08T231WAST
PTH08T231WAZ
PTH08T231WAZT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
DIP MOD
ULE
ECL
10
10
10
10
10
10
10
10
10
10
36
Pb-Free
(RoHS)
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
N / A for Pkg Type
DIP MOD
ULE
ECM
ECM
BCM
BCM
ECL
36
TBD
Level-1-235C-UNLIM
Level-1-235C-UNLIM
Level-3-260C-168 HR
Level-3-260C-168 HR
N / A for Pkg Type
DIP MOD
ULE
250
36
TBD
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
250
36
Pb-Free
(RoHS)
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
ECM
ECM
BCM
BCM
36
TBD
Level-1-235C-UNLIM
Level-1-235C-UNLIM
Level-3-260C-168 HR
Level-3-260C-168 HR
DIP MOD
ULE
250
36
TBD
DIP MOD
ULE
Pb-Free
(RoHS)
DIP MOD
ULE
250
Pb-Free
(RoHS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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