PTH08T240FAZT [TI]
10-A, 4.5-V to 14-V INPUT, NON-ISOLATED POWER MODULE FOR 3-GHz DSP SYSTEMS; 10 -A ， 4.5 V至14 V输入，非隔离式电源模块，用于3 GHz的DSP系统
| 型号： | PTH08T240FAZT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10-A, 4.5-V to 14-V INPUT, NON-ISOLATED POWER MODULE FOR 3-GHz DSP SYSTEMS |
| 文件： | 总37页 (文件大小：1356K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PTH08T240F
www.ti.com ........................................................................................................................................ SLTS277C–DECEMBER 2006–REVISED DECEMBER 2008
10-A, 4.5-V to 14-V INPUT, NON-ISOLATED
POWER MODULE FOR 3-GHz DSP SYSTEMS
1
FEATURES
2
•
•
•
•
•
•
Up to 10-A Output Current
•
•
TurboTrans™ Technology
4.5-V to 14-V Input Voltage
Designed to meet Ultra-Fast Transient
Requirements for 3-GHz DSP Systems
Wide-Output Voltage Adjust (0.69 V to 2.0 V)
±1.5% Total Output Voltage Variation
Efficiencies up to 93%
•
15 mV Output Voltage Deviation
(CO = 2000 µF, ΔI = 3 A)
Output Overcurrent Protection
(Nonlatching, Auto-Reset)
APPLICATIONS
•
Wireless Infrastructure Base Stations
•
•
Operating Temperature: –40°C to 85°C
Safety Agency Approvals:
–
UL/IEC/CSA-C22.2 60950-1
•
•
•
•
•
•
Prebias Startup
On/Off Inhibit
Differential Output Voltage Remote Sense
Adjustable Undervoltage Lockout
Auto-Track™ Sequencing
SmartSync Technology
DESCRIPTION
The PTH08T240F is a high-performance 10-A rated, non-isolated power module designed to meet ultra-fast
transient requirements for 3-GHz DSP systems like Texas Instrument's TMS320TCI6488. This module is an
addition to the 2nd generation of the popular PTH series power modules which include a reduced footprint and
additional features.
Operating from an input voltage range of 4.5 V to 14 V, the PTH08T240F requires a single resistor to set the
output voltage to any value over the range, 0.69 V to 2.0 V. The output voltage range makes the PTH08T240F
particularly suitable for the 3-GHz DSP's core voltage requirements.
The module incorporates a comprehensive list of features. Output over-current and over-temperature shutdown
protects against most load faults. A differential remote sense ensures tight load regulation. An adjustable
under-voltage lockout allows the turn-on voltage threshold to be customized. Auto-Track™sequencing is a
popular feature that greatly simplifies the simultaneous power-up and power-down of multiple modules in a
power system.
The PTH08T240F includes new patented technologies, TurboTrans™ and SmartSync. The TurboTrans feature
optimizes the transient response of the regulator while simultaneously reducing the quantity of external output
capacitors required to meet a target voltage deviation specification. TurboTrans allows PTH08T240F to meet the
tight transient voltage tolerances required by 3-GHz DSPs with minimal output capacitance. SmartSync allows for
switching frequency synchronization of multiple modules, thus simplifying EMI noise suppression tasks and
reducing input capacitor RMS current requirements. The module uses double-sided surface mount construction
to provide a low profile and compact footprint. Package options include both through-hole and surface mount
configurations that are lead (Pb) - free and RoHS compatible.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
Auto-Track, TurboTrans, TMS320 are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2008, Texas Instruments Incorporated
PTH08T240F
SLTS277C–DECEMBER 2006–REVISED DECEMBER 2008........................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SmartSync
Track
TurboTrans
RTT
1%
10
1
9
0.05W
(Required)
Track SYNC
TT
V
I
2
6
+Sense
+Sense
V
I
5
7
V
O
PTH08T240F
V
O
Inhibit
11
INH/UVLO
GND GND
-Sense
Adj
L
O
A
D
V
O
C
O
1000 mF
+
+
[A]
3
4
8
R
SET
R
UVLO
2
1%
0.05 W
(Required)
(Required)
C
C
I
1%
0.05 W
(Optional)
I
220 mF
22 mF
(Required) (Recommended)
-Sense
GND
GND
UDG-07125
A. RSET required to set the output voltage to a value higher than 0.69 V. See Electrical Characteristics table.
2
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www.ti.com ........................................................................................................................................ SLTS277C–DECEMBER 2006–REVISED DECEMBER 2008
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
DATASHEET TABLE OF CONTENTS
DATASHEET SECTION
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS TABLE
TERMINAL FUNCTIONS
PAGE NUMBER
3
4
5
TYPICAL CHARACTERISTICS (VI = 5V)
TYPICAL CHARACTERISTICS (VI = 8V)
TYPICAL CHARACTERISTICS (VI = 12V)
ADJUSTING THE OUTPUT VOLTAGE
INPUT & OUTPUT CAPACITOR RECOMMENDATIONS
TURBOTRANS™ INFORMATION
UNDERVOLTAGE LOCKOUT (UVLO)
SOFT-START POWER-UP
6
7
8
9
11
15
21
22
23
24
24
24
25
26
29
31
OUTPUT INHIBIT
OVER-CURRENT PROTECTION
OVER-TEMPERATURE PROTECTION
REMOTE SENSE
SYCHRONIZATION (SMARTSYNC)
AUTO-TRACK SEQUENCING
PREBIAS START-UP
TAPE & REEL AND TRAY DRAWINGS
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
(Voltages are with respect to GND)
UNIT
VTrack Track pin voltage
–0.3 to VI + 0.3
–40 to 85
260
V
TA
Operating temperature range Over VI range
Surface temperature of module body or
pins for 5 seconds maximum.
Twave Wave soldering temperature
Treflow Solder reflow temperature
suffix AD
°C
suffix AS
suffix AZ
235(1)
260(1)
Surface temperature of module body or
pins
Tstg
Storage temperature
Mechanical shock
–55 to 125(2)
Per Mil-STD-883D, Method 2002.3 1
msec, 1/2 sine, mounted
suffix AH & AD
suffix AS & AZ
500
250
15
G
Mechanical vibration
Weight
Mil-STD-883D, Method 2007.2 20-2000 Hz
5
grams
Flammability
Meets UL94V-O
(1) During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the
stated maximum.
(2) The shipping tray or tape and reel cannot be used to bake parts at temperatures higher than 65°C.
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ELECTRICAL CHARACTERISTICS
PTH08T240F
TA = 25°C, VI = 5 V, VO = 1.0 V, CI = 220 µF, CO = 1000 µF, and IO = IO max (unless otherwise stated)
PARAMETER
TEST CONDITIONS
PTH08T240F
TYP
UNIT
MIN
0
MAX
IO
Output current
Over VO range
Over IO range
Over IO range
25°C, natural convection
10
A
V
(1)
0.69V ≤ VO < 1.3V
1.3V ≤ VO ≤ 2.0
4.5
4.5
0.69
14
VI
Input voltage range
14
VOADJ
Output voltage adjust range
Set-point voltage tolerance
Temperature variation
Line regulaltion
2.0
V
(2)
±0.5
±0.3
±3
±1
%VO
%VO
mV
–40°C < TA < 85°C
Over VI range
VO
Load regulation
Over IO range
±2
mV
(2)
Total output variation
Includes set-point, line, load, –40°C ≤ TA ≤ 85°C
RSET = 4.78 kΩ, VO = 1.8 V
±1.5
%VO
90%
88%
87%
85%
RSET = 7.09 kΩ, VO = 1.5 V
IO = 10 A
η
Efficiency
RSET = 12.1 kΩ, VO = 1.2 V
RSET = 20.8 kΩ, VO = 1.0 V
20-MHz bandwidth
(1)
VO Ripple (peak-to-peak)
Overcurrent threshold
10
mVPP
A
ILIM
ttr
Reset, followed by auto-recovery
20
500
25
Recovery time
VO over/undershoot
Recovery time
µs
CO = 1000 µF, Type C
RTT=open
2.5 A/µs load step
0.5 A to 3.5 A step
VO = 0.9 V
ΔVtr
ttrTT
ΔVtrTT
IIL
mV
µs
Transient response
800
14
CO = 2000 µF, Type C
RTT=24.3＝kΩ
VO over/undershoot
mV
µA
Track input current (pin 10)
Pin to GND
–130(3)
1
dVtrack/dt Track slew rate capability
CO ≤ CO (max)
V/ms
VI increasing, RUVLO = OPEN
VI decreasing, RUVLO = OPEN
Hysteresis, RUVLO ≤ 52.3 kΩ
4.3
4.2
0.5
4.45
Adjustable Under-voltage lockout
UVLOADJ
(pin 11)
3.7
V
Input high voltage (VIH
)
Open(4)
0.8
V
Inhibit control (pin 11)
Input low voltage (VIL)
-0.2
Input low current (IIL), Pin 11 to GND
-235
5
µA
mA
kHz
kHz
V
Iin
Input standby current
Inhibit (pin 11) to GND, Track (pin 10) open
f s
Switching frequency
Over VI and IO ranges, SmartSync (pin 1) to GND
260
240
2
300
340
400
5.5
0.8
fSYNC
VSYNCH
VSYNCL
tSYNC
Synchronization frequency
SYNC High-Level Input Voltage
SYNC Low-Level Input Voltage
SYNC Minimum Pulse Width
V
200
nSec
(5)
Nonceramic
220
CI
External input capacitance
µF
µF
(5)
Ceramic
22
(6)
Capacitance Value
Nonceramic 1000
10000
CO
External output capacitance
Reliability
Capacitance × ESR product (CO × ESR)
Telcordia SR-332, 50% stress, TA= 40°C, ground benign
1000
6.1
10000 µF×mΩ
106 Hr
MTBF
(1) For output voltages less than 1.3 V, the ripple may increase (up to 2×) when operating at input voltages greater than (VO × 11). See the
SmartSync section and the TurboTrans section of the datasheet for additional information.
(2) The set-point voltage tolerance is affected by the tolerance and stability of RSET. The stated limit is unconditionally met if RSET has a
tolerance of 1% with 100 ppm/°C or better temperature stability.
(3) A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 10. The
open-circuit voltage is less than 8 Vdc
.
(4) This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when
input power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. For additional information, see the related
application information section.
(5) A 220 µF electrolytic input capacitor is required for proper operation. The electrolytic capacitor must be rated for a minimum of 500 mA
rms of ripple current. An additional 22-µF ceramic input capacitor is recommended to reduce rms ripple current.
(6) 1000 µF of external low-ESR output capacitance is required for basic operation. See the Capacitor Recommendation section and
TurboTrans Application Information section for more guidance.
4
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www.ti.com ........................................................................................................................................ SLTS277C–DECEMBER 2006–REVISED DECEMBER 2008
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
VI
NO.
2
The positive input voltage power node to the module, which is referenced to common GND.
The regulated positive power output with respect to GND.
VO
5
This is the common ground connection for the VI and VO power connections. It is also the 0 Vdc reference for the
control inputs.
GND
3, 4
The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low level
ground signal to this input disables the module’s output and turns off the output voltage. When the Inhibit control
is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, the
module produces an output whenever a valid input source is applied.
Inhibit(1) and
UVLO
11
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin to
GND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For more
information, see the Application Information section.
A 0.05 W 1% resistor must be directly connected between this pin and pin 7 (–Sense) to set the output voltage
to a value higher than 0.69 V. The temperature stability of the resistor should be 100 ppm/°C (or better). The
setpoint range for the output voltage is from 0.69 V to 2.0 V. If left open circuit, the output voltage will default to
its lowest value. For further information, on output voltage adjustment see the related application note.
Vo Adjust
8
The specification table gives the preferred resistor values for a number of standard output voltages.
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy, +Sense must be connected to VO, very close to the load.
+ Sense
– Sense
6
7
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy –Sense must be connected to GND (pin 4) very close to the module (within 10 cm).
This is an analog control input that enables the output voltage to follow an external voltage. This pin becomes
active typically 20 ms after the input voltage has been applied, and allows direct control of the output voltage
from 0 V up to the nominal set-point voltage. Within this range the module's output voltage follows the voltage at
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulates
at its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules powered
from the same input bus. If unused, this input should be connected to VI.
Track
10
NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltage
during power up. For more information, see the related application note.
This input pin adjusts the transient response of the regulator. To activate the TurboTrans™ feature, a 1%,
50 mW resistor must be connected between this pin and pin 6 (+Sense) very close to the module. For a given
value of output capacitance, a reduction in peak output voltage deviation is achieved by utililizing this feature.
The resistance requirement can be selected from the TurboTrans™ resistor table in the Application Information
section. External capacitance must never be connected to this pin unless the TurboTrans resistor value is a
short, 0 Ω.
TurboTrans™
9
1
This input pin sychronizes the switching frequency of the module to an external clock frequency. The SmartSync
feature can be used to sychronize the switching fequency of multiple PTH08T240F modules, aiding EMI noise
suppression efforts. If unused, this pin should be connected to GND (pin 3). For more information, please review
the Application Information section.
SmartSync
(1) Denotes negative logic: Open = Normal operation, Ground = Function active
11
1
10
9
2
8
7
PTH08T240F
(Top View)
6
3
4
5
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TYPICAL CHARACTERISTICS(1)(2)
CHARACTERISTIC DATA (VI = 5 V)
EFFICIENCY
vs
LOAD CURRENT
OUTPUT RIPPLE
vs
LOAD CURRENT
POWER DISSIPATION
vs
LOAD CURRENT
12
2.5
100
95
V
= 5 V
V
I
= 5 V
V
= 5 V
2.0 V
I
I
10
8
90
85
80
75
70
65
60
55
50
2.0
1.5
1.1 V
2.0 V
1.1 V
6
4
2.0 V
0.9 V
1.1 V
0.9 V
1.0
0.5
0.9 V
V
(V)
V
(V)
V
(V)
O
O
O
2.0
1.1
0.9
2
0
2.0
1.1
0.9
2.0
1.1
0.9
0
0
2
4
6
8
10
0
2
4
6
- Output Current - A
8
10
0
2
4
6
8
10
I
I
- Output Current - A
O
O
I
- Output Current - A
O
Figure 1.
Figure 2.
Figure 3.
SAFE OPERATING AREA
90
80
Natural
Convection
70
60
50
40
30
20
V
= 5 V
I
All V
O
0
2
4
6
8
10
I
- Output Current - A
O
Figure 4.
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for more
information. Applies to Figure 4.
6
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TYPICAL CHARACTERISTICS(1)(2)
CHARACTERISTIC DATA (VI = 8 V)
EFFICIENCY
vs
LOAD CURRENT
OUTPUT RIPPLE
vs
LOAD CURRENT
POWER DISSIPATION
vs
LOAD CURRENT
10
8
100
95
3.0
V
= 8 V
V
= 8 V
V
I
= 8 V
I
I
2.0 V
2.5
2.0
90
85
80
75
70
65
60
55
50
2.0 V
2.0 V
1.1 V
6
4
0.9 V
1.1 V
1.5
1.1 V
1.0
0.5
V
(V)
V
(V)
V
(V)
O
O
O
2
0
2.0
1.1
0.9
2.0
1.1
0.9
2.0
1.1
0.9
0.9 V
0.9 V
0
0
2
4
6
8
10
0
2
4
6
8
10
0
2
4
6
8
10
I
- Output Current - A
O
I
- Output Current - A
I
- Output Current - A
O
O
Figure 5.
Figure 6.
Figure 7.
SAFE OPERATING AREA
90
80
70
60
50
40
Natural
Convection
V
= 8 V
I
30
20
All V
O
0
2
4 6
- Output Current - A
8
10
I
O
Figure 8.
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 5, Figure 6, and Figure 7.
(2) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for more
information. Applies to Figure 8.
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TYPICAL CHARACTERISTICS(1)(2)(3)
CHARACTERISTIC DATA (VI = 12 V)
EFFICIENCY
vs
OUTPUT CURRENT
OUTPUT RIPPLE
vs
OUTPUT CURRENT
POWER DISSIPATION
vs
OUTPUT CURRENT
3.0
100
95
16
14
12
10
8
V
= 12 V
V
= 12 V
V
= 12 V
I
I
I
2.5
2.0
2.0 V
90
85
80
75
70
65
60
55
50
0.9 V
2.0 V
2.0 V
1.1 V
1.5
1.0
1.1 V
0.9 V
0.9 V
(V)
6
4
V
(V)
O
V
O
V
(V)
O
2.0
1.1
0.9
0.5
0
2.0
1.1
0.9
2.0
1.1
0.9
2
1.1 V
0
0
2
4
6
8
10
0
2
4
6
8
10
0
2
4
6
8
10
I
- Output Current - A
I
- Output Current - A
O
O
I
- Output Current - A
O
Figure 9.
Figure 10. See Note 2 below
SAFE OPERATING AREA
Figure 11.
90
80
Natural
Convection
70
60
50
40
30
20
V
= 12 V
I
All V
O
0
2
4
6
8
10
I
- Output Current - A
O
Figure 12.
(1) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to , Figure 9, Figure 11 and Figure 10.
(2) Output ripple may increase up to 2x when operating at input voltages greater than (VO x 11). See the Smart Sync section of the
datasheet for input voltage and frequency limitations.
(3) The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for more
information. Applies to Figure 12.
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APPLICATION INFORMATION
ADJUSTING THE OUTPUT VOLTAGE
The VOAdjust control (pin 8) sets the output voltage of the PTH08T240F. The adjustment range is 0.69 V to
2.0 V. The adjustment method requires the addition of a single external resistor, RSET, that must be connected
directly between the VOAdjust and – Sense pins. Table 1 gives the standard value of the external resistor for a
number of standard voltages, along with the actual output voltage that this resistance value provides.
For other output voltages, the value of the required resistor can either be calculated using the following formula,
or simply selected from the range of values given in Table 2. Figure 13 shows the placement of the required
resistor.
0.69
- 0.69
R
= 10 kW x
- 1.43 kW
SET
V
O
(1)
Table 1. Standard Values of RSET for Standard Output Voltages
VO (Standard) (V)
RSET (Standard Value) (kΩ)
VO (Actual) (V)
1.807
1.8
1.5
1.2
1.1
1
4.75
6.98
12.1
15.4
20.5
31.6
1.510
1.200
1.100
1.004
0.9
0.899
6
+Sense
+Sense
V
O
5
V
O
PTH08T240F
7
−Sense
VoAdj
8
GND
GND
+
4
3
C
O
R
SET
1%
0.05 W
−Sense
GND
UDG−06077
(1) RSET: Use a 0.05-W resistor with a tolerance of 1% and temperature stability of 100 ppm/°C (or better). Connect the
resistor directly between pins 8 and 7, as close to the regulator as possible, using dedicated PCB traces.
(2) Never connect capacitors to VOAdjust (pin 8). Any capacitance added to the VOAdjust pin affects the stability of the
regulator.
Figure 13. VO Adjust Resistor Placement
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Table 2. Output Voltage Set-Point Resistor Values (Standard Values)
VO Required (V)
RSET (kΩ)
681
(1)
0.70
(1)
0.75
113
(1)
0.80
61.9
41.2
31.6
24.9
20.5
17.8
15.4
13.3
12.1
10.7
9.88
9.09
8.25
7.68
6.98
6.49
6.04
5.76
5.36
5.11
4.75
4.53
4.22
4.02
3.83
(1)
0.85
(1)
0.90
(1)
0.95
(1)
1.00
(1)
1.05
(1)
1.10
(1)
1.15
(1)
1.20
1.25(1)
1.30
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.70
1.75
1.80
1.85
1.90
1.95
2.00
(1) For output voltages less than 1.3 V, the ripple may increase (up to 2×) when operating at input
voltages greater than (VO × 11). See the SmartSync section and the TurboTrans section of the
datasheet for more information.
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CAPACITOR RECOMMENDATIONS FOR THE PTH08T240F POWER MODULE
Capacitor Technologies
Electrolytic Capacitors
When using electrolytic capacitors, high quality, computer-grade electrolytic capacitors are recommended.
Aluminum electrolytic capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz,
and are suitable when ambient temperatures are above -20°C. For operation below -20°C, tantalum,
ceramic, or OS-CON type capacitors are required.
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic
capacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. They
can be used to reduce the reflected ripple current at the input as well as improve the transient response of
the output.
Tantalum, Polymer-Tantalum Capacitors
Tantalum type capacitors may only used on the output bus, and are recommended for applications where the
ambient operating temperature is less than 0°C. The AVX TPS series and Kemet capacitor series are
suggested over many other tantalum types due to their lower ESR, higher rated surge, power dissipation,
and ripple current capability. Tantalum capacitors that have no stated ESR or surge current rating are not
recommended for power applications.
Input Capacitor (Required)
The PTH08T240F requires a minimum input capacitance of 220 µF electrolytic type. The ripple current rating of
the electrolytic capacitor must be at least 500 mArms. An additional 22-µF X5R/X7R ceramic is recommended to
reduce the RMS ripple current.
Input Capacitor Information
The size and value of the input capacitor is determined by the converter’s transient performance capability. This
minimum value assumes that the converter is supplied with a responsive, low inductance input source. This
source should have ample capacitive decoupling, and be distributed to the converter via PCB power and ground
planes.
Ceramic capacitors should be located as close as possible to the module's input pins, within 0.5 inch (1,3 cm).
Adding ceramic capacitance is necessary to reduce the high-frequency ripple voltage at the module's input. This
will reduce the magnitude of the ripple current through the electroytic capacitor, as well as the amount of ripple
current reflected back to the input source. Additional ceramic capacitors can be added to further reduce the RMS
ripple current requirement for the electrolytic capacitor.
Increasing the minimum input capacitance to 680 µF is recommended for high-performance applications, or
wherever the input source performance is degraded.
The main considerations when selecting input capacitors are the RMS ripple current rating, temperature stability,
and less than 100 mΩ of equivalent series resistance (ESR).
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommended
minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability.
No tantalum capacitors were found with a sufficient voltage rating to meet this requirement.
When the operating temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these
applications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
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Output Capacitor (Required)
The PTH08T240F requires a minimum output capacitance of 1000 µF of aluminum, polymer-aluminum, tantulum,
or polymer-tantalum type.
The required capacitance above the minimum is determined by actual transient deviation requirements. See the
TurboTrans Technology application section within this document for specific capacitance selection.
Output Capacitor Information
When selecting output capacitors, the main considerations are capacitor type, temperature stability, and ESR.
Consider the capacitance X ESR product (see the following section).
Ceramic output capacitors added for high-frequency bypassing should be located as close as possible to the
load to be effective. Ceramic capacitor values below 10 µF should not be included when calculating the total
output capacitance value.
When the operating temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these
applications, OS-CON, poly-aluminum, and polymer-tantalum types should be considered.
TurboTrans Output Capacitance
TurboTrans allows the designer to optimize the output capacitance according to the system transient design
requirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness. The
capacitor's capacitance (µF) × ESR (mΩ) product determines its capacitor type; Type B, or C. Capacitor types
are defined as follows:
Type B = (1000 < capacitance × ESR ≤ 5000) (e.g. polymer-tantalum)
Type C = (5000 < capacitance × ESR ≤ 10,000) (e.g. OS-CON)
When using more than one type of output capacitor, select the capacitor type that makes up the majority of your
total output capacitance. When calculating the C×ESR product, use the maximum ESR value from the capacitor
manufacturer's datasheet.
Working Examples:
A capacitor with a capacitance of 330 µF and an ESR of 5 mΩ, has a C × ESR product of 1650 µF x mΩ (330 µF
× 5 mΩ). This is a Type B capacitor. A capacitor with a capacitance of 1000 µF and an ESR of 8 mΩ, has a
C × ESR product of 8000 µF x mΩ (1000 µF × 8 mΩ). This is a Type C capacitor.
See the TurboTrans Technology application section within this document for specific capacitance selection.
Table 3 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.
Designing for Fast Load Transients
The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of
2.5 A/µs. The typical voltage deviation for this load transient is given in the Electrical Characteristics table using
the minimum required value of output capacitance. As the di/dt of a transient is increased, the response of a
converter’s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent
limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with
additional low ESR ceramic capacitor decoupling. Generally, with load steps greater than 100 A/µs, adding
multiple 10 µF ceramic capacitors plus 10 × 1 µF, and numerous high frequency ceramics (≤ 0.1 µF) is all that is
required to soften the transient higher frequency edges. The PCB location of these capacitors in relation to the
load is critical. DSP, FPGA and ASIC vendors identify types, location and amount of capacitance required for
optimum performance. Low impedance buses, unbroken PCB copper planes, and components located as close
as possible to the high frequency devices are essential for optimizing transient performance.
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Table 3. Input/Output Capacitors(1)
Capacitor Characteristics
Quantity
Output Bus
Max
Max
Ripple
Capacitor Vendor,
Type Series (Style)
Working
Voltage
(V)
ESR
at 100
kHz
Value
(µF)
Current
at 85°C
(Irms)
(mA)
Physical
Size (mm)
Input
Bus
Vendor Part No.
TurboTrans
Cap Type(2)
(mΩ)
Panasonic
FC (Radial)
25
25
25
25
270
560
470
470
90
65
65
80
755
1205
1200
850
10 × 12,5
12,5 × 15
12,5 × 16,5
10 ×10,2
≥1(3)
≥1(3)
≥1(3)
≥1(3)
N/R(4)
N/R(4)
N/R(4)
N/R(4)
EEUFC1E271
FC (Radial)
EEUFC1E561S
EEVFC1E471LQ
EEVFK1E471P
FC(SMD)
FK(SMD)
United Chemi-Con
PTB(SMD) Poly-Tantalum
LXZ, Aluminum (Radial)
PS, Poly-Alum(Radial)
PXA, Poly-Alum(SMD)
PS, Poly-Alum(Radial)
PXA, Poly-Alum(Radial)
Nichicon, Aluminum
HD (Radial)
6.3
25
16
16
10
10
330
330
330
330
270
330
25
90
14
14
14
14
2600
760
7,3x4,3x2.8
10 × 12,5
10 × 12,5
10 × 12,2
8 × 11,5
N/R(5)
≥1(3)
≥1(3)
≥1(3)
≥1(3)
≥1(3)
C ≥ 3(2)
N/R(4)
B ≥ 3(2)
B ≥ 3(2)
B ≥ 4(2)
B ≥ 3(2)
4PTB337MD6TER
LXZ25VB331M10X12LL
16PS330MJ12
5060
5050
4420
4420
PXA16VC331MJ12TP
10PS270MH11
8 × 12
PXA10VC331MH12
25
25
35
2.0
220
330
560
390
72
95
48
5
760
750
8 × 11,5
10 × 15
≥1(3)
≥1(3)
≥1(3)
N/R(4)
N/R(4)
N/R(4)
B ≥ 3(2)
UHD1E221MPR
PM (Radial)
UPM1E331MPH6
PM (Radial)
1360
4000
16 × 15
UPM1V561MHH6
EEFSE0J391R (VO≤ 1.6V)(6)
Panasonic, Poly-Aluminum
Sanyo
7,3×4,3×4,2
N/R(5)
TPE, Poscap (SMD)
TPE Poscap(SMD)
TPD Poscap (SMD)
SEP, OS-CON (Radial)
SP OS-CON ( Radial)
SEPC, OS-CON (Radial)
SVP, OS-CON (SMD)
10
2.5
2.5
16
16
16
16
330
470
1000
330
270
270
330
25
7
3000
4400
6100
4700
4400
5000
4700
7,3 × 4,3
7,3 × 4,3
7,3 × 4,3
10 ×13
≥1(3)
N/R(5)
N/R(5)
≥1(3)
≥1(3)
≥1(3)
C ≥ 3(2)
B ≥ 2(2)
B ≥ 1(2)
B ≥ 3(2)
B ≥ 4(2)
B ≥ 4(2)
B ≥ 3(2)(7)
10TPE330MF (VI ≤ 8V)
2R5TPE470M7
2R5TPD1000M5
16SEP330M
5
16
18
11
16
10 × 11,5
8 × 13
16SP270M
16SEPC270M
16SVP330M
10 × 12,6
≥1(3)
(1) Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products.
RoHS, Lead-free and Material Details
See the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.
Component designators or part number deviations can occur when material composition or soldering requirements are updated.
(2) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor Selection
Capacitor Types:
a. Type B = (1,000 < capacitance × ESR ≤ 5,000)
b. Type C = (5,000 < capacitance × ESR ≤ 10,000)
(3) In addition to the required input electrolytic capacitance, ≥ 22 µF of ceramic capacitance is recommended to reduce the high-frequency
reflected ripple current.
(4) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher capacitance × ESR products. Aluminum and higher
ESR capacitors can be used in conjunction with lower ESR capacitance.
(5) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
(6) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
(7) Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic
capacitance.
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Table 3. Input/Output Capacitors (continued)
Capacitor Characteristics
Quantity
Output Bus
Max
Max
Ripple
Capacitor Vendor,
Type Series (Style)
Working
Voltage
(V)
ESR
at 100
kHz
Value
(µF)
Current
at 85°C
(Irms)
(mA)
Physical
Size (mm)
Input
Bus
Vendor Part No.
TurboTrans
Cap Type(2)
(mΩ)
Kemet, Poly-Tantalum
T520 (SMD)
10
6.3
4
330
330
25
15
5
2600
3800
7300
7300
7,3×4,3×4,1
7,3×4,3×4,1
7,3×4,3×4,1
7,3 × 4,3
≥1(8)
C ≥ 3(9)
B ≥ 3(9)
B ≥ 2(9)
B ≥ 1(9)
T520X337M010ASE025 (VI ≤ 8V)
T530X337M006ASE015
T530 (SMD)
N/R(10)
N/R(10)
N/R(10)
T530 (SMD)
680
T530X687M004ASE005
T530 (SMD)
2.5
1000
5
T530X108M2R5ASE005
Vishay-Sprague
597D, Tantalum (SMD)
94SP, OS-CON (Radial)
94SVP OS-CON(SMD)
Kemet, Ceramic X5R (SMD)
Murata, Ceramic X5R
(SMD)
16
16
16
16
25
16
16
16
220
270
330
10
40
18
17
2
2300
4400
4500
–
7,2×5,7×4,1
10 × 10,5
10 × 12,7
3225
≥1(8)
≥1(8)
≥1(8)
≥2(8)
≥1(8)
≥2(8)
≥2(8)
≥1(8)
C ≥ 5(11)(9)
B ≥ 4(9)
B ≥ 3(9)
N/R
597D227X16E2T
94SP277X0016FBP
94SVP337X016F12
C1210C106M4PAC
GRM32ER61E226K
GRM32DR61C106K
C3225X5R1C106MT0
C3225X5R1C226MT
22
2
–
3225
N/R
10
N/R
TDK, Ceramic X5R
(SMD)
10
2
–
3225
N/R
22
N/R
(8) In addition to the required input electrolytic capacitance, ≥ 22 µF of ceramic capacitance is recommended to reduce the high-frequency
reflected ripple current.
(9) Required capacitors with TurboTrans. See the TurboTrans Application information for Capacitor Selection
Capacitor Types:
a. Type B = (1,000 < capacitance × ESR ≤ 5,000)
b. Type C = (5,000 < capacitance × ESR ≤ 10,000)
(10) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
(11) Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic
capacitance.
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TurboTrans™ Technology
TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules.
TurboTrans optimizes the transient response of the regulator with added external capacitance using a single
external resistor. Benefits of this technology include reduced output capacitance, minimized output voltage
deviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. The
amount of output capacitance required to meet a target output voltage deviation is reduced with TurboTrans
activated. Likewise, for a given amount of output capacitance, the amplitude of the voltage deviation following a
load transient is reduced. Applications requiring tight transient voltage tolerances and minimized capacitor
footprint area benefits greatly from this technology.
TurboTrans™ Selection
Utilizing TurboTrans requires connecting a resistor, RTT, between the +Sense pin (pin 6) and the TurboTrans pin
(pin 9). The value of the resistor directly corresponds to the amount of output capacitance required. All T2
products require a minimum value of output capacitance. For the PTH08T240F, the minimum required
capacitance is 1000 µF. Capacitors with a capacitance × ESR product above 1000 µF×mΩ and below 10,000
µF×mΩ are required. (Multiply the capacitance (in µF) by the ESR (in mΩ) to determine the capacitance × ESR
product.) See the Capacitor Selection section of the datasheet for a variety of capacitors that meet this criteria.
Figure 14 thru Figure 21 show the amount of output capacitance required to meet a desired transient voltage
deviation for Type B (e.g. polymer-tantalum) and Type C (e.g. OS-CON) capacitors. To calculate the proper
value of RTT, first determine your required transient voltage deviation limits and magnitude of your transient load
step. Next, determine what type of output capacitors are used. (If more than one type of output capacitor is used,
select the capacitor type that makes up the majority of your total output capacitance.) Knowing this information,
use the chart (Figure 14 thru Figure 21) that corresponds to the capacitor type selected. To use the chart, begin
by dividing the maximum voltage deviation limit (in mV) by the magnitude of your load step (in Amps). This gives
a mV/A value. Find this value on the Y-axis of the appropriate chart. Read across the graph to the 'TurboTrans'
plot. From this point, read down to the X-axis which lists the minimum required capacitance, CO, to meet that
transient voltage deviation. The required RTT resistor value can then be calculated using the equation or selected
from the TurboTrans table. The TurboTrans tables include both the required output capacitance and the
corresponding RTT values to meet several values of transient voltage deviation for 25% (2.5 A), 50% (5 A), and
75% (7.5 A) output load steps.
The chart can also be used to determine the achievable transient voltage deviation for a given amount of output
capacitance. By selecting the amount of output capacitance along the X-axis, reading up to the desired
'TurboTrans'' curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output
capacitance. The required RTT resistor value can be calculated using the equation or selected from the
TurboTrans table.
As an example, let's look at a 5-V application requiring a 15-mV deviation during a 3-A load transient. A majority
of 680-µF, 10-mΩ ouput capacitors will be used. (680 (in µF) × 10 (in mΩ) = 6,800; therefore this is Type C
capacitance). Use the 5-V, Type C capacitor chart, Figure 19. Dividing 15 mV by 3 A gives 5 mV/A transient
voltage deviation per amp of transient load step. Select 5 mV/A on the Y-axis and read across to the
'TurboTrans'' plot. Following this point down to the X-axis gives a minimum required output capacitance of
approximately 1800 µF. The required RTT resistor value for 1800 µF can then be calculated or selected from
Table 4. The required RTT resistor is approximately 32.0 kΩ.
Applications operating from an input bus greater than 8 V may encounter reduced transient performance when
the output voltage is less than VI/11. Additional output capacitance may be required in order to achieve the
expected transient performance. See Figure 17 and Figure 21 when operating at an increased VI to VO ratio.
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PTH08T240F Type B Capacitors
8-V Input
5-V Input
10
9
10
9
8
7
8
7
6
5
6
5
4
3
4
3
2
2
1
1
C - Capacitance - mF
C - Capacitance - mF
Figure 14. Capacitor Type B,
1000 < C(µF)×ESR(mΩ) ≤ 5000
(e.g. Polymer-Tantalum)
Figure 15. Capacitor Type B,
1000 < C(µF)×ESR(mΩ) ≤ 5000
(e.g. Polymer-Tantalum)
Table 4. Type B TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
8-V Input
5-V Input
25% load step
(2.5 A)
50% load step
(5 A)
75% load step
(7.5 A)
CO
Minimum
RTT
Required
CO
Minimum
RTT
Required
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
20
18
16
14
12
10
8
40
36
32
28
24
20
16
12
60
54
48
42
36
30
24
18
1000
1040
1200
1440
1760
2230
3000
4350
open
866
1060
1200
1400
1660
2020
2550
3400
4900
576
147
147
71.5
40.2
23.2
12.7
5.36
0.205
64.9
34.0
18.2
8.06
1.54
6
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming, see Equation 2.
é
ù
)
û
40´ 1- C 5000
(
O
ë
R
=
kW
( )
TT
é
ë
ù
C
(
1000 -1
)
û
O
(2)
Where CO is the total output capacitance in µF. CO values greater than or equal to 5000 µF require RTT to be a
short, 0 Ω. (RTT results in a negative value when CO > 5000 µF).
To ensure stability, the value of RTT must be calculated using the minimum required output capacitance
determined from the capacitor transient response charts above.
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PTH08T240F Type B Capacitors (12-V)
12-V INPUT; VO ≥ (VI ÷ 11)
12-V INPUT; VO < (VI ÷ 11)
10
9
10
9
8
7
8
7
6
5
6
5
4
3
4
3
2
2
1
1
C - Capacitance - mF
C - Capacitance - mF
Figure 16. (VO ≥ VI ÷ 11)
Figure 17. VO < (VI ÷ 11)
Capacitor Type B
Capacitor Type B
Table 5. Type B TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
VO ≥ VI/11
VO < VI/11
25% load step
(2.5 A)
50% load step
(5 A)
75% load step
(7.5 A)
CO
Minimum
RTT
Required
CO
Minimum
RTT
Required
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
25
20
18
15
12
10
8
50
40
36
30
24
20
16
10
75
60
54
45
36
30
24
15
1000
1000
1050
1300
1760
2250
3000
7900
open
open
634
1000
1600
open
46.4
23.7
8.06
0.255
-
2000
97.6
34.0
17.4
8.06
short
3000
4900
exceeds max
exceeds max
exceeds max
-
5
-
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming, see Equation 3.
é
ù
)
û
40´ 1- C 5000
(
O
ë
R
=
kW
( )
TT
é
ë
ù
C
(
1000 -1
)
û
O
(3)
Where CO is the total output capacitance in µF. CO values greater than or equal to 5000 µF require RTT to be a
short, 0 Ω. (RTT results in a negative value when CO > 5000 µF).
To ensure stability, the value of RTT must be calculated using the minimum required output capacitance
determined from the capacitor transient response charts above.
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PTH08T240F Type C Capacitors
8-V Input
5-V Input
10
9
10
9
8
7
8
7
6
5
6
5
4
3
4
3
2
2
1
1
C - Capacitance - mF
C - Capacitance - mF
Figure 18. Capacitor Type C,
5000 < C(µF)×ESR(mΩ) ≤ 10,000
(e.g. OS-CON)
Figure 19. Capacitor Type C,
5000 < C(µF)×ESR(mΩ) ≤ 10,000
(e.g. OS-CON)
Table 6. Type C TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
8-V Input
5-V Input
25% load step
(2.5 A)
50% load step
(5 A)
75% load step
(7.5 A)
CO
Minimum
RTT
Required
CO
Minimum
RTT
Required
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
20
18
16
14
12
10
8
40
36
32
28
24
20
16
12
60
54
48
42
36
30
24
18
1000
1000
1100
1300
1600
2050
2750
4050
open
open
340
1040
1180
1350
1600
1930
2420
3200
4560
787
169
82.5
45.3
26.7
14.7
6.49
1.0
97.6
45.3
22.6
10.5
2.49
6
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming, see Equation 4 .
é
ù
)
û
40´ 1- C 5000
(
O
ë
R
=
kW
( )
TT
é
ë
ù
C
(
1000 -1
)
û
O
(4)
Where CO is the total output capacitance in µF. CO values greater than or equal to 5000 µF require RTT to be a
short, 0 Ω. (RTT results in a negative value when CO > 5000 µF).
To ensure stability, the value of RTT must be calculated using the minimum required output capacitance
determined from the capacitor transient response charts above.
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PTH08T240F Type C Capacitors (12-V)
12-V INPUT; VO ≥ (VI ÷ 11)
12-V INPUT; VO < (VI ÷ 11)
10
9
10
9
8
7
8
7
6
5
6
5
4
3
4
3
2
2
1
1
C - Capacitance - mF
C - Capacitance - mF
Figure 20. VO ≥ (VI ÷ 11)
Figure 21. VO < (VI ÷ 11)
Capacitor Type C
Capacitor Type C
Table 7. Type C TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
VO ≥ VI/11
VO < VI/11
25% load step
(2.5 A)
50% load step
(5 A)
75% load step
(7.5 A)
CO
Minimum
RTT
Required
CO
Minimum
RTT
Required
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
Required Output
Capacitance (µF)
TurboTrans
Resistor (kΩ)
25
20
18
15
12
10
8
50
40
36
30
24
20
16
10
75
60
54
45
36
30
24
15
1000
1000
1000
1200
1600
2050
2750
5400
open
open
open
150
1000
1450
open
63.4
29.4
9.76
0.887
-
1850
2800
45.3
22.6
10.2
short
4600
exceeds max
exceeds max
exceeds max
-
5
-
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming, see Equation 5.
é
ù
)
û
40´ 1- C 5000
(
O
ë
R
=
kW
( )
TT
é
ë
ù
C
(
1000 -1
)
û
O
(5)
Where CO is the total output capacitance in µF. CO values greater than or equal to 5000 µF require RTT to be a
short, 0 Ω. (RTT results in a negative value when CO > 5000 µF).
To ensure stability, the value of RTT must be calculated using the minimum required output capacitance
determined from the capacitor transient response charts above.
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Application Diagram and Waveforms
TurboTrans
RTT
24.3 kW
10
9
Track
TT
6
5
7
+Sense
1
SmartSync
+Sense
V
V
V
I
I
O
2
PTH08T240F
V
O
11
INH/UVLO
-Sense
V Adj
GND
L
O
A
D
O
+
+
3
4
8
C
O
2000 mF
Type B
R
SET
1%
0.05 W
C
I
220 mF
22 mF
-Sense
GND
GND
UDG-07126
Figure 22. Typical TMS320TCI6488 Application
Without TurboTrans
50 mV/div
With TurboTrans
50 mV/div
2.5 A/ms
50% Load Step
Figure 23. Typical TurboTrans Waveforms (5-V Input)
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UNDERVOLTAGE LOCKOUT (UVLO)
The PTH08T240F power modules incorporate an input undervoltage lockout (UVLO). The UVLO feature
prevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. This
enables the module to provide a clean, monotonic powerup for the load circuit, and also limits the magnitude of
current drawn from the regulator’s input source during the power-up sequence.
The UVLO characteristic is defined by the ON threshold (VTHD) voltage. Below the ON threshold, the Inhibit
control is overridden, and the module does not produce an output. The hysteresis voltage, which is the difference
between the ON and OFF threshold voltages, is set at 500 mV. The hysteresis prevents start-up oscillations,
which can occur if the input voltage droops slightly when the module begins drawing current from the input
source.
The UVLO feature of the PTH08T240F module allows for limited adjustment of the ON threshold voltage. The
adjustment is made via the Inhbit/UVLO Prog control pin (pin 11) using a single resistor (see Figure 24). When
pin 11 is left open circuit, the ON threshold voltage is internally set to its default value, which is 4.3 V. The ON
threshold might need to be raised if the module is powered from a tightly regulated 12-V bus. Adjusting the
threshold prevents the module from operating if the input bus fails to completely rise to its specified regulation
voltage.
Equation 6 determines the value of RUVLO required to adjust VTHD to a new value. The default value is 4.3 V, and
it may only be adjusted to a higher value.
9690 * ǒ137 VIǓ
( )
kW
R
+
UVLO
ǒ137 V * 585
IǓ
(6)
Table 8 shows a chart of standard resistor values for RUVLO for different options of the on-threshold (VTHD
)
voltage.
Table 8. Standard RUVLO values for Various VTHD values
VTHD (V)
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
RUVLO (kΩ)
88.7
52.3
37.4
28.7
23.2
19.6
16.9
14.7
V
I
2
V
I
PTH08T240F
11
Inhibit/
UVLO Prog
+
GND
4
RUVLO
C
I
3
GND
UDG-07127
Figure 24. Undervoltage Lockout Adjustment Resistor Placement
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Soft-Start Power Up
The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from the
Track pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Track
pin should be directly connected to the input voltage, VI (see Figure 25).
When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. This
allows the module to power up entirely under the control of its internal soft-start circuitry. When power up is
under soft-start control, the output voltage rises to the set-point at a quicker and more linear rate.
From the moment a valid input voltage is applied, the soft-start control introduces a short time delay (typically
between 5 ms and 15 ms) before allowing the output voltage to rise.
10
V
I
Track
(2 V/div)
V
I
2
V
I
PTH08T240F
V
O
(1 V/div)
+
GND
C
I
3
4
GND
I
I
UDG-07128
(2 A/div)
T − Time − 4 ms/div
Figure 25. Defeating the Auto-Track Function
Figure 26. Power-Up Waveform
The output then progressively rises to the module’s setpoint voltage. Figure 26 shows the soft-start power-up
characteristic of the PTH08T240F operating from a 5-V input bus and configured for a 1.1-V output. The
waveforms were measured with a 10-A constant current load and the Auto-Track feature disabled. The initial rise
in input current when the input voltage first starts to rise is the charge current drawn by the input capacitors.
Power-up is complete within 30 ms.
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On/Off Inhibit
For applications requiring output voltage on/off control, the PTH08T240F incorporates an Inhibit control pin. The
inhibit feature can be used wherever there is a requirement for the output voltage from the regulator to be turned
off.
The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated output
whenever a valid source voltage is connected to VI with respect to GND.
Figure 27 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit input
has its own internal pull-up. An external pull-up resistor should never be used with the inhibit pin. The input is not
compatible with TTL logic devices. An open-collector (or open-drain) discrete transistor is recommended for
control.
Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is then
turned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within 15
ms. Figure 28 shows the typical rise in both the output voltage and input current, following the turn-off of Q1. The
turn off of Q1 corresponds to the rise in the waveform, VINH. The waveforms were measured with a 10-A constant
current load.
V
I
2
V
I
I
I
PTH08T240F
GND
(2 A/div)
11
V
O
(1 V/div)
+
C
I
3
4
1=Inhibit
GND
Q1
BSS 138
V
INH
UDG-07130
(1 V/div)
T − Time − 4 ms/div
Figure 27. On/Off Inhibit Control Circuit
Figure 28. Power-Up Response from Inhibit Control
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Overcurrent Protection
For protection against load faults, all modules incorporate output overcurrent protection. Applying a load that
exceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, the
module periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode of
operation, whereby the module continues in a cycle of successive shutdown and power up until the load fault is
removed. During this period, the average current flowing into the fault is significantly reduced. Once the fault is
removed, the module automatically recovers and returns to normal operation.
Overtemperature Protection (OTP)
A thermal shutdown mechanism protects the module’s internal circuitry against excessively high temperatures. A
rise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If the
internal temperature exceeds the OTP threshold, the module’s Inhibit control is internally pulled low. This turns
the output off. The output voltage drops as the external output capacitors are discharged by the load circuit. The
recovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreases
by about 10°C below the trip point.
The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator.
Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-term
reliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits for
the worst-case conditions of ambient temperature and airflow.
Differential Output Voltage Remote Sense
Differential remote sense improves the load regulation performance of the module by allowing it to compensate
for any IR voltage drop between its output and the load in either the positive or return path. An IR drop is caused
by the output current flowing through the small amount of pin and trace resistance. With the sense pins
connected, the difference between the voltage measured directly between the VO and GND pins, and that
measured at the Sense pins, is the amount of IR drop being compensated by the regulator. This should be
limited to a maximum of 0.3 V. Connecting the +Sense (pin 6) to the positive load terminal improves the load
regulation at the connection point. For optimal behavior the –Sense (pin 7) must be connected to GND (pin 4)
close to the module (within 10 cm).
If the remote sense feature is not used at the load, connect the +Sense pin to VO (pin 5) and connect the –Sense
pin to the module GND (pin 4).
The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequency
dependent components that may be placed in series with the converter output. Examples include OR-ing
diodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote sense
connection they are effectively placed inside the regulation control loop, which can adversely affect the
stability of the regulator.
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Smart Sync
Smart Sync is a feature that allows multiple power modules to be synchronized to a common frequency. Driving
the Smart Sync pins with an external oscillator set to the desired frequency, synchronizes all connected modules
to the selected frequency. The synchronization frequency can be higher or lower than the nominal switching
frequency of the modules within the range between 240 kHz and 400 kHz (see Electrical Specifications table for
frequency limits). Synchronizing modules powered from the same bus, eliminates beat frequencies reflected back
to the input supply, and also reduces EMI filtering requirements. Eliminating the low beat frequencies (usually <
10 kHz) allows the EMI filter to be designed to attenuate only the synchronization frequency. Power modules can
also be synchronized out of phase to minimize source current loading and minimize input capacitance
requirements. If unused, connect the Smart Sync pin to GND (pin 3). Figure 29 shows a standard circuit with two
modules syncronized 180° out-of-phase using a D flip-flop.
0°
Track
Sync
TurboTrans
+Sense
V = 5 V
I
V
V 1
I
O
PTH08T220W
V
O
a
SN74LVC2G74
Inhibit/
UVLO
+
-Sense
+
V
CC
C 1
GND
V Adj
O
O
C 1
I
220 mF
CLK
CLK
D
PRE
Q
330 mF
f
= 2 x f
MOD
CLK
GND
R
SET1
180°
GND
Q
Track
Sync
TurboTrans
+Sense
V
V 2
I
O
PTH08T240F
V
O
Inhibit/
UVLO
+
-Sense
V Adj
C 2
I
220 mF
GND
+
O
C 2
O
1000 mF
R
GND
SET2
UDG-07132
Figure 29. Smart Sync Schematic
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To achieve the output voltage ripple specified in the electrical characteristics table, the maximum input voltage
for a given output voltage is limited. The input voltage to output voltage ratio limit is 11 to 1 for the PTH08T240F.
However, when using SmartSync, the maximum allowable input voltage varies as a function of output voltage
and switching frequency. Operationally, the maximum input voltage is inversely proportional to switching
frequency. Synchronizing to a higher frequency causes greater restrictions on the input voltage range. For a
given switching frequency, Figure 30 shows how the recommended maximum input voltage varies with output
voltage.
For example, a module operating at 375 kHz and an output voltage of 0.9 V, the maximum input voltage is 8 V.
Exceeding the maximum input voltage may cause in an increase in output ripple voltage and increased output
voltage variation.
As shown in Figure 30, input voltages below 6 V can operate down to the minimum output voltage over the entire
synchronization frequency range. See the Electrical Characteristics table for the synchronization frequency range
and pulse limits.
RECOMMENDED INPUT VOLTAGE
vs
OUTPUT VOLTAGE
15
14
240
13
12
11
400
10
f
(kHz)
SW
375
350
325
300
9
8
275
250
240
250
275
300
325
350
375
400
7
6
5
0.7
0.9
1.1
V
1.3
1.5
1.7
1.9
2.1
- Output Voltage - V
O
Figure 30.
Auto-Track™ Function
The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Track
was designed to simplify the amount of circuitry required to make the output voltage from each module power up
and power down in sequence. The sequencing of two or more supply voltages during power up is a common
requirement for complex mixed-signal applications that use dual-voltage VLSI devices such as the TMS320™
DSP family, microprocessors, and ASICs.
How Auto-Track™ Works
(1)
Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin
.
This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage is
raised above the set-point voltage, the module output remains at its set-point (2). As an example, if the Track pin
of a 1.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the regulated
output does not go higher than 1.5 V.
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When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on a
volt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages follow
a common signal during power up and power down. The control signal can be an externally generated master
ramp waveform, or the output voltage from another power supply circuit (3). For convenience, the Track input
incorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable rising
waveform at power up.
Typical Sequencing Application
The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Track
compliant modules. Connecting the Track inputs of two or more modules forces their track input to follow the
same collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a common
Track control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltage
supervisor IC. See U3 in Figure 31.
To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should be
done at or before input power is applied to the modules. The ground signal should be maintained for at least
20 ms after input power has been applied. This brief period gives the modules time to complete their internal
soft-start initialization (4), enabling them to produce an output voltage. A low-cost supply voltage supervisor IC,
that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at power
up.
Figure 31 shows how the TL7712A supply voltage supervisor IC (U3) can be used to coordinate the sequenced
power up of PTH08T240F modules. The output of the TL7712A supervisor becomes active above an input
voltage of 3.6 V, enabling it to assert a ground signal to the common track control well before the input voltage
has reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately 28
ms after the input voltage has risen above U3's voltage threshold, which is 4.3 V. The 28-ms time period is
controlled by the capacitor CT. The value of 2.2 µF provides sufficient time delay for the modules to complete
their internal soft-start initialization. The output voltage of each module remains at zero until the track control
voltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises. This
causes the output voltage of each module to rise simultaneously with the other modules, until each reaches its
respective set-point voltage.
Figure 32 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, VO1
and VO2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively.
VTRK, VO1, and VO2 are shown rising together to produce the desired simultaneous power-up characteristic.
The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltage
threshold, the ground signal is re-applied to the common track control. This pulls the track inputs to 0 V, forcing
the output of each module to follow, as shown in Figure 33. Power down is normally complete before the input
voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once the modules
recognize that an input voltage is no longer present, their outputs can no longer follow the voltage applied at their
track input. During a power-down sequence, the fall in the output voltage from the modules is limited by the
Auto-Track slew rate capability.
Notes on Use of Auto-Track™
1. The Track pin voltage must be allowed to rise above the module set-point voltage before the module
regulates at its adjusted set-point voltage.
2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with ramp
speeds of up to 1 V/ms.
3. The absolute maximum voltage that may be applied to the Track pin is the input voltage VI.
4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization.
This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, it
is recommended that the Track pin be held at ground potential.
5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (VI). When Auto-Track is
disabled, the output voltage rises according to its soft-start rate after input power has been applied.
6. The Auto-Track pin should never be used to regulate the module's output voltage for long-term, steady-state
operation.
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R
1
V
TT
I
12 V
AutoTrack
TurboTrans
+Sense
V
I
V
O
SmartSync
V 1
O
3.3 V
U1
PTH08T240W
8
V
CC
+
+
7
2
SENSE
C
1
I
-Sense
C 1
O
RESET
5
6
RESIN
Inhibit/UVLO
V Adj
GND
O
U3
TL7712A
R
R
1
RESET
SET
10 kW
1
3
REF
CT
RESET
GND
1.62 kW
GND
4
C
C
T
REF
R
2
TT
0.1 mF
2.2 mF
AutoTrack
TurboTrans
+Sense
V
O
V 2
O
1.8 V
U2
PTH08T240F
V
I
+
-Sense
C 2
O
+
Inhibit/UVLO
V Adj
GND
O
C
I
2
R
2
SET
4.75 kW
GND
UDG-07133
Figure 31. Sequenced Power Up and Power Down Using Auto-Track
V
(1 V/div)
TRK
V
(1 V/div)
TRK
V
1 (1 V/div)
V
1 (1 V/div)
2 (1 V/div)
O
O
V
V
2 (1 V/div)
O
O
t − Time − 20 ms/div
t − Time − 400 ms/div
Figure 32. Simultaneous Power Up
With Auto-Track Control
Figure 33. Simultaneous Power Down
With Auto-Track Control
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Prebias Startup Capability
A prebias startup condition occurs as a result of an external voltage being present at the output of a power
module prior to its output becoming active. This often occurs in complex digital systems when current from
another power source is backfed through a dual-supply logic component, such as an FPGA or ASIC. Another
path might be via clamp diodes as part of a dual-supply power-up sequencing arrangement. A prebias can cause
problems with power modules that incorporate synchronous rectifiers. This is because under most operating
conditions, these types of modules can sink as well as source output current.
The PTH family of power modules incorporate synchronous rectifiers, but does not sink current during startup(1),
or whenever the Inhibit pin is held low. However, to ensure satisfactory operation of this function, certain
conditions must be maintained(2). Figure 34 shows an application demonstrating the prebias startup capability.
The startup waveforms are shown in Figure 35. Note that the output current (IO) is negligible until the output
voltage rises above the voltage backfed through the intrinsic diodes.
The prebias start-up feature is not compatible with Auto-Track. When the module is under Auto-Track control, it
sinks current if the output voltage is below that of a back-feeding source. To ensure a pre-bias hold-off one of
two approaches must be followed when input power is applied to the module. The Auto-Track function must
either be disabled(3), or the module’s output held off (for at least 50 ms) using the Inhibit pin. Either approach
ensures that the Track pin voltage is above the set-point voltage at start up.
1. Startup includes the short delay (approximately 10 ms) prior to the output voltage rising, followed by the rise
of the output voltage under the module’s internal soft-start control. Startup is complete when the output
voltage has risen to either the set-point voltage or the voltage at the Track pin, whichever is lowest.
2. To ensure that the regulator does not sink current when power is first applied (even with a ground signal
applied to the Inhibit control pin), the input voltage must always be greater than the output voltage throughout
the power-up and power-down sequence.
3. The Auto-Track function can be disabled at power up by immediately applying a voltage to the module’s
Track pin that is greater than its set-point voltage. This can be easily accomplished by connecting the Track
pin to VI.
3.3 V
Track
+Sense
V
VI = 5 V
Vo = 2.5 V
Io
V
PTH08T240W
I
O
Inhibit GND Vadj
-Sense
VCCIO
VCORE
+
CO
+
+
R
CI
SET
2.37 kW
ASIC
Figure 34. PreBias Startup Application Circuit
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VIN (1 V/div)
VO (1 V/div)
IO (2 A/div)
t - Time - 4 ms/div
Figure 35. Prebias Startup Waveforms
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TAPE AND REEL
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TRAY
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
PACKAGING INFORMATION
Orderable Device
PTH08T240FAD
PTH08T240FAS
PTH08T240FAST
PTH08T240FAZ
PTH08T240FAZT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
DIP MOD
ULE
EBS
11
11
11
11
11
49
Pb-Free
(RoHS)
Call TI
Call TI
Call TI
Call TI
Call TI
N / A for Pkg Type
DIP MOD
ULE
EBT
EBT
BBT
BBT
49
TBD
Level-1-235C-UNLIM/
Level-3-260C-168HRS
DIP MOD
ULE
250
49
TBD
Level-1-235C-UNLIM/
Level-3-260C-168HRS
DIP MOD
ULE
Pb-Free
(RoHS)
Level-3-260C-168 HR
DIP MOD
ULE
250
Pb-Free
(RoHS)
Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
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