PTMAG5253A3IQDMRR [TI]
具有使能引脚、采用超小型 X2SON 封装的低功耗线性霍尔效应传感器 | DMR | 4 | -40 to 125;
| 型号： | PTMAG5253A3IQDMRR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有使能引脚、采用超小型 X2SON 封装的低功耗线性霍尔效应传感器 | DMR | 4 | -40 to 125 传感器 |
| 文件： | 总38页 (文件大小：2478K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG5253
ZHCSPM0 – MAY 2023
TMAG5253 采用超小型封装且具有 EN 引脚的低功耗线性霍尔效应传感器
1 特性
3 说明
•
业界先进的低功耗：
TMAG5253 是一款低功耗线性霍尔效应传感器，可按
比例响应磁通量密度。该器件具有使能引脚，可进入超
低功耗 (nA) 关断模式。TMAG5253 的启动时间很短
(< 25μs)，专为低功耗位置检测应用而设计。该器件采
用业界出色的 1.54mm2 超小型封装，适用于空间狭小
的应用。该器件具有宽电源电压范围，可在 1.65V 至
3.6V 电压范围内运行。
– 电源电压，VCC：1.65V - 3.6V
– 关断电流：< 20nA（25°C 时为 1.8V）
– 有效电流：2mA（25°C 时为 1.8V）
– 平均电流：100Hz 占空比时 < 10µA
专用使能引脚
快速开通时间：< 25µs
比例式模拟输出与 VCC 成比例
关断模式下的高阻抗输出
•
•
•
•
•
•
•
垂 直 于 封 装 顶 部 的 磁 通 量 由 器 件 感 应 ， 并 且
TMAG5253 提供双极灵敏度极性选项，其中北磁极和
南磁极会产生不同的输出电压。输出会随施加的磁通量
密度呈线性变化，四个灵敏度选项可以根据所需的感应
范围提供最大的输出电压摆幅。
低噪声输出，具有 ±1mA 的驱动能力
支持正负磁场的双极灵敏度选项
磁性灵敏度范围选项：
– A1：±20mT 范围
该器件使用比例式架构，当外部模数转换器 (ADC) 使
用相同的 VCC 作为其基准电压时，可消除 VCC 容差产
生的误差。此外，该器件还具有磁体温度补偿功能，可
抵消 -40°C 至 125°C 宽温度范围内的磁灵敏度漂移。
该器件还能够在关断模式下将输出置于高阻抗状态。这
使得多个器件能够连接到单个 ADC。
– A2：±40mT 范围
– A3：±80mT 范围
– A4：±160mT 范围
•
•
•
支持钕磁铁温漂的灵敏度补偿
超小型 X2SON 4 引脚封装：1.54 mm2
宽工作温度范围：–40°C 至 125°C
封装信息(1)
2 应用
器件型号
TMAG5253
封装
封装尺寸（标称值）
•
•
•
•
•
•
游戏控制器和外设
磁接近传感器
X2SON (4)
1.40 mm × 1.10 mm
移动机器人电机控制
无线电动工具
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
扫地机器人
无人机有效载荷控制
Supply Voltage
Load
S
N
OUT
ADC
VCC
GND
0.1µF
TMAG5253
µController
GPIO
EN
典型电路原理图
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBASAI5
TMAG5253
ZHCSPM0 – MAY 2023
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Comparison.........................................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................4
7.5 Electrical Characteristics.............................................5
7.6 Magnetic Characteristics.............................................5
7.7 Typical Characteristics................................................6
8 Detailed Description........................................................9
8.1 Overview.....................................................................9
8.2 Functional Block Diagram...........................................9
8.3 Feature Description.....................................................9
8.4 Device Functional Modes..........................................15
9 Application and Implementation..................................16
9.1 Application Information............................................. 16
9.2 Typical Applications.................................................. 20
9.3 Best Design Practices...............................................24
9.4 Power Supply Recommendations.............................25
9.5 Layout....................................................................... 25
10 Device and Documentation Support..........................26
10.1 Documentation Support.......................................... 26
10.2 接收文档更新通知................................................... 26
10.3 支持资源..................................................................26
10.4 Trademarks.............................................................26
10.5 静电放电警告.......................................................... 26
10.6 术语表..................................................................... 26
11 Mechanical, Packaging, and Orderable
Information.................................................................... 26
11.1 Package Option Addendum.................................... 30
11.2 Tape and Reel Information......................................31
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
*
Initial Release
May 2023
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5 Device Comparison
表 5-1. Device Comparison
MINIMUM LINEAR
MAGNETIC SENSING
RANGE (mT)
MAGNETIC RESPONSE
TYPICAL SENSITIVITY TEMPERATURE
COEFFICIENT (%/°C)
ORDERABLE
TYPE
TMAG5253BA1(1)
TMAG5253BA2(1)
TMAG5253BA3
TMAG5253BA4(1)
Bipolar
Bipolar
Bipolar
Bipolar
±20
±40
0.12
0.12
0.12
0.12
±80
±160
(1) Preview only.
6 Pin Configuration and Functions
Thermal
Pad
Not to scale
图 6-1. DMR Package 4-Pin X2SON Top View
表 6-1. Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
X2SON
Power supply. TI recommends connecting this pin to a ceramic capacitor to ground with a value
of at least 0.1 µF.
VCC
1
P
GND
EN
2
3
4
G
I
Ground reference
Enable pin
OUT
O
Analog output
No connect. This pin should be left floating or tied to ground. The pin should be soldered to the
board for mechanical support.
Thermal Pad
5
NC
(1) I = Input, O = Output, I/O = Input and Output, G = Ground, P = Power, NC = No Connect
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
Power supply voltage
VCC
–0.3
5.5
Output voltage
OUT
–0.3
VCC + 0.3
V
Magnetic flux density, BMAX
Operating junction temperature, TJ
Storage temperature, Tstg
Unlimited
–40
T
125
150
°C
°C
–65
(1) Operation outside theAbsolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC
JS-002(2)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification
ANSI/ESDA/JEDEC JS-002(3)
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
3.6
1
UNIT
V
VCC
CL
IO
Power supply voltage(1)
1.65
Load capacitance on OUT pin
Output continuous current
Operating ambient temperature(2)
nF
–1
1
mA
°C
TA
–40
125
(1) These are recommended supply ranges. For more details refer to Operating Vcc Ranges section
(2) Power dissipation and thermal limits must be observed.
7.4 Thermal Information
TMAG5253
THERMAL METRIC(1)
DMR (X2SON)
4 PINS
157.1
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
110.9
105
YJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-board (bottom) thermal resistance
2.4
YJB
101.9
RθJC(bot)
85.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
for VCC = 1.65 V to 3.6V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
2
MAX
3.3
5
UNIT
VCC = 1.8 V
ICC_ACTIV
Operating supply current
EN > VIH
mA
E
VCC = 3.3 V
2.6
8
ICC_SHDN Shutdown current
tON Power-on time
VCCramp VCC ramp rate
VCC = 3.3 V , EN < VIL
VCC > VCC(min)
T = 25 C
nA
µs
20
45
1
0.001
V / µs
V
VIH
Input high voltage for EN pin
0.65 × VCC
VIL
Input low voltage for EN pin
Input hysteresis voltage for EN pin
Sensing bandwidth ( -3 dB)
DC output resistance
0.35 × VCC
V
Vhys
fBW
0.1 × VCC
V
Rload = 100 KΩ, Cload=100 pF
EN > VIH
15
1.27
9
kHz
Ω
ROUT
ROUT
DC output resistance
EN < VIL
MΩ
(1) B is the applied magnetic flux density.
7.6 Magnetic Characteristics
for VCC = 1.65 V to 3.6V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX UNIT
VCC = 3.3 V ,
TMAG5253B
1.585
1.65
1.715
V
B = 0 mT, TA =
25°C
VQ
Quiescent voltage
VCC = 1.8 V,
TMAG5253B
0.86
-1.5
-3
0.9
0.94
TA = 0°C to 85°C versus
25°C
1.5
B = 0 mT
VQΔT
Quiescent voltage temperature drift
% VCC
3
TA = -40°C to 125°C
versus 25°C
VQRE
VQΔL
Quiescent voltage ratiometry error(2)
Quiescent voltage lifetime drift
TMAG5253B
±0.2
0.25
%
High-temperature operating stress for
1000 hours
% VCC
TMAG5253BA1
51
25.5
12.75
6.37
27.62
13.81
6.9
60
30
69
34.5
TMAG5253BA2
TMAG5253BA3
TMAG5253BA4
TMAG5253BA1
TMAG5253BA2
TMAG5253BA3
TMAG5253BA4
TMAG5253BA1
TMAG5253BA2
TMAG5253BA3
TMAG5253BA4
TMAG5253BA1
TMAG5253BA2
TMAG5253BA3
TMAG5253BA4
VCC = 3.3 V,
TA = 25°C
15
17.25
7.5
8.62
mV/mT
37.37
S
Sensitivity
32.5
16.25
8.12
4.06
18.68
9.33
4.66
VCC = 1.8 V,
TA = 25°C
3.45
±20
±40
VCC = 3.3 V,
TA = 25°C
±80
±160
±20
BL
Linear magnetic sensing range(3) (4)
mT
±40
VCC = 1.8 V,
TA = 25°C
±80
±160
0.2
VL
Linear range of output voltage(4)
TMAG5253B
VCC – 0.2
V
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for VCC = 1.65 V to 3.6V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX UNIT
TA = 0°C to
85°C versus
25°C
STC
Sensitivity temperature coefficient(5)
TMAG5253BA
TMAG5253B
0.04
0.12
0.2 %/°C
SLE
SSE
Sensitivity linearity error(4)
Sensitivity symmetry error(4)
VOUT is within VL
± 0.5
± 0.5
%
%
VOUT is within
VL
TA = 25°C,
VCC = 1.65 V -1.9 V , with respect to VCC
= 1.8V
–2
–3
2
3
%
%
SRE
Sensitivity ratiometry error(2)
TA = 25°C,
VCC = 3 V - 3.6 V , with respect to VCC =
3.3 V
High-temperature operating stress for
1000 hours
SΔL
Sensitivity lifetime drift
0.5
%
VCC = 3.3 V , Cload=100 pF
VCC = 1.8V , Cload=100 pF
170
350
BND
Input-referred RMS noise density
nT/√Hz
BND × 6.6 ×
√fBW , Cload =
100 pF
VCC = 3.3 V
VCC = 1.8 V
0.137
BN
Input-referred peak-to-peak noise
Output-referred peak-to-peak noise
mTPP
0.282
TMAG5253BA1
TMAG5253BA2
TMAG5253BA3
TMAG5253BA4
9.2
4.6
2.3
1.8
BN × S ,
VCC=3.3 V,
BW = 15 kHz
VN
mVPP
(1) B is the applied magnetic flux density.
(2) Refer to the Ratiometric Architecture section
(3) BL describes the minimum linear sensing range at 25°C taking into account the maximum VQ and Sensitivity tolerances.
(4) Refer to the Sensitivity Linearity section
(5) STC describes the rate the device increases Sensitivity with temperature. For more information, see the Magnetic Response section.
7.7 Typical Characteristics
for TA = 25°C (unless otherwise noted)
0.5
0.4
0.3
0.2
0.1
0
3.4
3.2
3
2.8
2.6
2.4
2.2
2
-0.1
-0.2
-0.3
-0.4
-0.5
VCC = 1.8 V
VCC = 3.3 V
1.8
1.6
-80
-60
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100 120 140
Temperature (oC)
Magnetic Field (mT)
TMAG5253BA3 Sensitivity Linearity Error , VCC = 3.3 V
TMAG5253BA3
图 7-1. Sensitivity Linearity Error vs Input Magnetic Field
图 7-2. Active Current vs Temperature
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7.7 Typical Characteristics (continued)
for TA = 25°C (unless otherwise noted)
0.96
0.94
0.92
0.9
1.8
1.775
1.75
1.725
1.7
1.675
1.65
1.625
1.6
0.88
0.86
0.84
0.82
0.8
1.575
1.55
1.525
1.5
3
3.1
3.2
3.3
3.4
3.5
3.6
1.625
1.675
1.725
Supply Voltage (V)
1.775
1.825
1.875
Supply Voltage (V)
TMAG5253BA3, 25°C
TMAG5253A3, 25°C
图 7-4. Quiescent Voltage vs Supply Voltage
图 7-3. Quiescent Voltage vs Supply Voltage
9.8
9.6
9.4
9.2
9
19.5
19
18.5
18
17.5
17
8.8
8.6
8.4
8.2
8
16.5
16
15.5
-40
-20
0
20
40
60
80
100 120 140
-40
-20
0
20
40
60
80
100 120 140
Temperature (oC)
Temperature (oC)
TMAG5253BA3, VCC = 3.3 V
图 7-6. Sensitivity vs Temperature
TMAG5253BA3, VCC =1.8 V
图 7-5. Sensitivity vs Temperature
18.6
18.3
18
9.2
9
17.7
17.4
17.1
16.8
16.5
16.2
15.9
15.6
15.3
15
8.8
8.6
8.4
8.2
8
7.8
3
3.1
3.2
3.3
3.4
3.5
3.6
1.625
1.675
1.725
Supply Voltage (V)
1.775
1.825
1.875
Supply Voltage (V)
VCC = 3.3V ±10%
VCC = 1.8 V ±10%
图 7-8. Sensitivity vs Supply Voltage
图 7-7. Sensitivity vs Supply Voltage
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7.7 Typical Characteristics (continued)
for TA = 25°C (unless otherwise noted)
1.65
1.55
1.45
1.35
1.25
1.15
1.05
0.95
0.85
VCC = 1.8 V
VCC = 3.3 V
-40
-20
0
20
40
60
80
100 120 140
Temperature (oC)
图 7-9. Quiescent Voltage vs Temperature
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8 Detailed Description
8.1 Overview
The TMAG5253 is a 4-pin, low-power linear Hall effect sensor with fully integrated signal conditioning,
temperature compensation circuits, mechanical stress cancellation, and output driver. The device supports wide
supply range and can operate on 1.8-V or 3.3-V power supplies, measures magnetic flux density, and outputs
a proportional analog voltage that is referenced to VCC. The device also features an enable pin that is used to
place the device in a ultra-low power (nA) mode when needed.
The device is offered in bipolar magnetic response version that is sensitive to both the north and the south
pole. TMAG5253 is also offered in 4 different sensitivity versions (±20 mT, ±40 mT, ±80 mT, or ±160 mT). This
allows the user to trade off sensitivity range and resolution to support low cost magnet selections or wider range
wherever it is needed.
The device is offered in magnetic temperature coefficient of 0.12%/°C to compensate for magnetic sensitivity
temperature coefficient of Neodymium magnet type.
8.2 Functional Block Diagram
VCC
Power Management
EN
0.1µF
(minimum)
GND
OUT
Clock
Memory
Temperature
compensation
Output
Driver
Precision
Amplifier
Offset
cancellation
Hall sensor
Bias
Optional Filter
8.3 Feature Description
8.3.1 Magnetic Flux Direction
As shown in 图 8-1, the TMAG5253 is sensitive to the magnetic field component that is perpendicular to the top
of the package.
B
X2SON
PCB
图 8-1. Direction of Sensitivity
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Magnetic flux that travels from the bottom to the top of the package is considered positive in this document. This
condition exists when a south magnetic pole is near the top (marked-side) of the package as shown in 图 8-2.
Magnetic flux that travels from the top to the bottom of the package results in negative millitesla values.
N
S
PCB
图 8-2. The Flux Direction for Positive B
8.3.2 Hall Element Location
图 8-3 shows the location of the sensing element inside each package option along with the tolerances.
X2SON
Top View
X2SON
Side View
130 µm
centered
±15 µm
±25 µm
图 8-3. Hall Element Location
8.3.3 Magnetic Response
图 8-4 shows the response of the bipolar device option (B), which is sensitive to both the positive and negative
magnetic fields.
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OUT
VCC
VL(MAX)
VQ
∆V
∆B
Sensitivity =
VL(MIN)
B
south
-Bmax
Bmax
0 mT
north
图 8-4. Magnetic Response for TMAG5253B (Bipolar) Version
At room temperature, use 方程式 1 to calculate the ideal first-order transfer function of the TMAG5253, where
the output voltage is a linear function of the input magnetic field and the supply voltage.
V
CC
V
= V + B × Sensitivity ×
Q
V
(1)
OUT
CC, NOM
where
•
VQ is the quiescent output voltage for a field of 0 mT.
– VQ = VCC /2 for Bipolar device option (B)
•
•
•
•
•
B is the applied magnetic flux density
Sensitivity refers to the magnetic sensitivity of the device
VOUT is the analog output voltage within the VL range
VCC refers to the supply voltage of the device
VCC,NOM is the nominal supply voltage where the sensitivity is defined, such as 1.8 V or 3.3 V
As an example, consider the TMAG5253BA3, a bipolar magnetic response version with a sensitivity of 15
mV/mT at 3.3-V supply voltage and at room temperature. With VCC = 3.4 V and an input field of 67 mT, you can
calculate the output voltage, VOUT for this example.
V
mT
3.4 V
= 2.735 V
3.3 V
V
= 1.7 V + 67 mT × 0.015
×
(2)
OUT
8.3.4 Sensitivity Linearity
The device produces a linear response when the output voltage is within the specified VL range. Outside this
range, sensitivity is reduced and nonlinear. 图 8-5 shows the linearity of the magnetic response for bipolar
version.
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VOUT (V)
VNL
SB
VQ
VL
Best fit linear
SB-
Measured data
-B
B
0
B(mT)
BL
图 8-5. Linearity of the Magnetic Response (Bipolar)
方程式 3 calculates parameter BL, the minimum linear sensing range at 25°C, and takes the maximum quiescent
voltage and sensitivity tolerance into account.
V
– V
L MAX
Q MAX
B
=
(3)
L MIN
S
MAX
Nonlinearity is the deviation of the output voltage from a linear relationship to the input current. Nonlinearity
voltage, as shown in 图 8-5, is the maximum voltage deviation from the best-fit line based on measured
parameters (see 方程式 4).
V
= V
– B × S
+ V
(4)
NL
OUT
IN
FIT Q
where
•
•
•
•
VOUT is the voltage output at maximum deviation from best fit
BIN is the magnetic flux density at maximum deviation from best fit
SFIT is the best fit sensitivity of the device
VQ is quiescent voltage at zero magnetic field
The parameter SLE, Sensitivity Linearity error is the nonlinearity voltage ,VNL specified as a percentage of the
full-scale linear output range (VFS) shown in 方程式 5.
V
NL
S
=
× 100%
(5)
LE
V
FS
The parameter SSE defines symmetry error as the difference in sensitivity between any positive B value, SB and
the negative B value of the same magnitude, S–B while the output voltage is within the VL range. This error only
applies to the bipolar device option. Use 方程式 6 to calculate the symmetry error.
S
– S
–B
B
S
=
× 100%
(6)
SE
0.5 ×
S
+ S
–B
B
where
•
•
SB refers to the sensitivity at a positive field B
S–B refers to the sensitivity at a negative field B
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8.3.5 Ratiometric Architecture
The TMAG5253 has a ratiometric analog architecture that scales the quiescent voltage and sensitivity linearly
with the power-supply voltage. For example, the quiescent voltage and sensitivity are 5% higher when VCC
=
3.465 V compared to VCC = 3.3 V. This ratiometric behavior enables an external ADC to digitize a consistent
value regardless of the power-supply voltage tolerance when the ADC uses VCC as its reference.
SVCC
Ideal
Actual sensor data
VCCNOM
VCC (V)
图 8-6. Sensitivity Ratiometry Error
Use 方程式 7 to calculate the sensitivity ratiometry error:
S
/S
VCC VCC, NOM
S
= 1 −
× 100%
(7)
RE
V
/V
VCC VCC, NOM
where
•
•
•
•
S(VCC) is the sensitivity at the current VCC voltage
S(NOM) is the sensitivity at a nominal VCC voltage
VVCC is the current VCC voltage
VVCC,NOM is the nominal VCC voltage that is 1.8 V or 3.3 V
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VQ_VCC
Ideal
Quiescent
Voltage (VQ) (V)
Actual sensor data
VCC/2
VCCNOM
VCC (V)
图 8-7. Quiescent Ratiometry Error
The TMAG5253 has a ratiometric architecture for the quiescent voltage of the bipolar device option. For the
bipolar device option, at 0 mT, the quiescent voltage is typically half of the supply voltage, VCC. Use 方程式 8 to
calculate the quiescent voltage ratiometry error:
V
/V
Q VCC
Q NOM
Q
= 1 −
× 100%
(8)
RE
V
/V
VCC VCC, NOM
where
•
•
•
•
VQ(VCC) is the quiescent voltage at the current VCC voltage
VQ(NOM) is the quiescent voltage at a nominal VCC voltage
VCC is the current VCC voltage
VVCC,NOM is the nominal VCC voltage that is 1.8 V or 3.3 V
8.3.6 Sensitivity Temperature Compensation
Magnets generally produce weaker fields as temperature increases. Different types of magnets have different
sensitivity temperature coefficients. The TMAG5253 compensates by increasing sensitivity with temperature, as
defined by the parameter STC. Use 方程式 9 to calculate the sensitivity at a fixed supply voltage. ℃
Sensitivity = Sensitivity
× 1 + S × T – 25℃
TC A
(9)
25℃
where
•
•
Sensitivity(25°C) depends on the polarity(unipolar/bipolar) and the four different device options (1, 2, 3, 4)
STC is typically 0.12%/°C for device options A1 – A4 , 0.20%/°C for device options B1 – B4 and 0%/°C for
device options Z1 – Z4
•
TA is the ambient temperature
8.3.7 Power-On Time
After the VCC voltage is applied, the TMAG5253 requires a short initialization time before the output settles to its
final value. The parameter TON describes the time from when VCC crosses VCC(MIN) until OUT is within 5% of the
final value, with a constant magnetic field and a typical load of 100 pF from OUT to ground. 图 8-8 shows this
timing diagram.
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VCC
1.65V
TON
time
Output
95% VOUT
Invalid
time
图 8-8. TON for VCC Ramp
TON is also used to describe the time from when EN pin is pulled above VIH until OUT is within 5% of the final
value, with a constant magnetic field and a typical load of 100 pF from OUT to ground. 图 8-8 shows this timing
diagram.
EN
VIH
TON
time
VOUT
95% VOUT
Invalid
time
图 8-9. TON When Using EN Pin
8.4 Device Functional Modes
The TMAG5253 has two modes of operations that apply when the Recommended Operating Conditions are met.
When the EN pin is connected to VCC, the part enters active mode, where the OUT pin provides an analog
output that corresponds to the magnetic sensitivity and the supply voltage.
When the EN pin is tied to GND, the TMAG5253 enters an ultra-low power shutdown mode that consumes only
20-nA current. During the shutdown mode, the OUT pin is driven to a high-impedance state.
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9 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
9.1.1 Selecting the Sensitivity Option
Select the highest TMAG5253 sensitivity option that can measure the required range of magnetic flux density so
that the output voltage swing is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to
a magnet. TI has developed online tools to provide assistance with magnetic field calculations that assist with
magnet selections and the mechanical placement of the sensor for the most common use cases.
9.1.2 Temperature Compensation for Magnets
The magnetic field of magnets based on Neodymium or the Ferrite magnets have a high temperature coefficient.
The residual induction (Br) of a magnet typically reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite
material. The TMAG5253 features sensitivity temperature compensation that is designed to directly compensate
the average drift of magnets. When the operating temperature range of a system is reduced, temperature drift
errors are also reduced.
For device options A1 – A4, the sensitivity at TA = 125°C is typically 12% higher than at TA = 25°C. These device
options are typically used when Neodymium magnets are used along with the TMAG5253.
9.1.3 Adding a Low-Pass Filter
As shown in Functional Block Diagram, an RC low-pass filter can be added to the device output for the purpose
of minimizing voltage noise when the full 15-kHz bandwidth is not needed. This output filter can improve the
signal-to-noise ratio (SNR) but at the expense of additional latency based on the external filter time constants.
9.1.4 Designing With Multiple Sensors
Some applications require multiple linear Hall sensors to detect position in different parts of the system. In those
cases, the primary challenge would be the availability of multiple ADC that are required to digitize the information
from the sensors. In cases where the sensor is placed remotely away from the microcontroller, this would also
mean multiple output lines between the sensor and microcontroller.
With the ability to place the output in high-impedance state during shutdown mode, multiple TMAG5253s can
share the analog output. This can minimize the system cost by using a single ADC. 图 9-1 shows two devices
that share the same analog output, with their respective EN pins controlled by the microcontroller. A pulldown
resistor can be used to pull the output to ground when both the devices are placed in shutdown mode.
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Supply Voltage
VCC
VCC
EN
GPIO1
Device 1
TMAG5253
GPIO2
ADC
VOUT
µController
100K
GND
GND
VCC
EN
Device 2
TMAG5253
VOUT
GND
图 9-1. Multiple Sensors With Shared Output
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B(mT)
B1
B2
time
V
VGPIO1
tmux
VGPIO2
ton
VOUT
time
Device 2
Device 1
图 9-2. Timing Diagram for Multiplexing the Sensor Outputs
图 9-2 shows how the GPIOs of the microcontroller can be used to multiplex the outputs from the two sensors.
When the GPIO1 goes high, Device 1 is enabled and drives the output line to the corresponding output after
the power-on time. During this time, GPIO2 is driven low and Device 2 is placed in shutdown mode. When the
output from the second device has to be measured, the first device must be turned off before the second device
is enabled, indicated by tmux in the timing diagram. B1 and B2 correspond to the magnetic fields seen by Device
1 and Device 2, respectively.
With the ability to support up to 1-nF capacitive loads, the TMAG5253 enables multiple sensors to be connected
to the same output. If the load capacitance on each sensor is about 20 pF, this would translate up to the ability of
50 sensors sharing the same output.
9.1.5 Duty-Cycled, Low-Power Design
For battery-powered applications where power is critical, the sensor can be duty-cycled using the EN pin. This
will ensure the average current consumption remains low to meet the system level power targets. In duty-cycled
applications, the start-up time must be very fast so the external ADC can sample the signal faster and shutdown
the device quickly to minimize average power. With very fast start-up and power-off times, the TMAG5253
enables low average power consumption for the system.
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Supply Voltage
S
N
ADC
VCC
OUT
TMAG5253
0.1 μF
µController
GND
EN
GPIO
图 9-3. Typical Application Diagram for Duty-Cycled Application
图 9-3 shows the typical application diagram when the EN pin is controlled by the microcontroller. 图 9-4 shows
the waveforms for this application where the EN pin is duty-cycled. The sampling time of the ADC should be
scheduled after the output settles down to the required resolution. Notice that the output line is pulled down
by the external resistor when EN is driven low. Also, if the input magnetic field is changed when the part is in
shutdown, the device provides the new output corresponding to the field after the device enters active state.
B (mT)
me
VVCC
me
tac ve
tsleep
VEN
me
Iac ve
Icc
Ishdn
me
VOUT
HiZ
HiZ
HiZ
HiZ
me
图 9-4. Timing Diagram for Duty-Cycled Application
表 9-1 shows the estimated average current consumption for the TMAG5253 versus the sleep time, for VCC = 1.8
V and the EN pin is tied high for 50 µs.
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表 9-1. Average Current Consumption
SLEEP TIME (ms)
AVERAGE CURRENT (µA)
1
10
90.5
9.4
1.9
0.9
0.1
50
100
1000
9.2 Typical Applications
Magnetic 1D sensors are very popular due to contactless and reliable measurements, especially in applications
requiring long-term measurements in rugged environments. The TMAG5253 offers design flexibility in a wide
range of industrial and personal electronics applications, because many possible magnet orientations and
movements produce a usable response from the sensor. In this section three common application examples are
discussed in detail.
9.2.1 Slide-By Displacement Sensing
图 9-5 shows one of the most common orientations, which uses the full north to south range of the sensor and
causes a close-to-linear change in magnetic flux density as the magnet moves across.
Travel Direc on
S
N
Airgap
PCB
d1
d2
Travel Distance
图 9-5. Slide-By Sensing Magnet Orientation
9.2.1.1 Design Requirements
Use the parameters listed in 表 9-2 for this design example.
表 9-2. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VCC
3.3 V
5 × 5 × 5 mm NdFeB
(Grade N52)
Magnet
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表 9-2. Design Parameters (continued)
DESIGN PARAMETER
EXAMPLE VALUE
Travel distance (d2 – d1)
Airgap
20 mm
2.5 mm (top of package to magnet) + 0.13 mm
(distance from top of package to sensor location)
Maximum B at sensor at 25°C
Device option
±75 mT
TMAG5253BA3
9.2.1.2 Detailed Design Procedure
When designing a linear magnetic sensing system, always consider these three variables: the magnet, sensing
distance, and the range of the sensor. Notice from 图 9-5, the magnetic flux density versus distance has both
positive and negative values as the magnet slides on top of the sensor. There is a region approximately the
same length of the magnet which produces a linear change in field. To measure the magnetic flux density across
the entire range, select the TMAG5253B version with the highest sensitivity that has a BL (linear magnetic
sensing range) that is larger than the maximum magnetic flux density in the application. With this input, the
user can monitor the change in position by measuring in the linear input region. 图 9-6 shows the magnetic flux
density across the three axes in the sensor location. The sensor is sensitive only to the magnetic field on Z axis,
and 图 9-7 shows the output voltage from the sensor, as the magnet slides on top of the sensor.
Notice that the linear region of sensing is only around ±2.5 mm, where the sensor output varies linearly with the
position of the magnet. This linear range of operation will increase linearly with the size of the magnet. Based on
the output voltage, it is determined that the sensor version with magnetic range of ±80 mT is able to cover the
entire magnetic field range that is seen by the sensor. TI recommends using magnetic field simulation software
and referring to magnet specifications and the mechanical placements to determine if the sensor with the right
sensitivity.
9.2.1.3 Application Curves
3
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
-12.5 -10 -7.5 -5 -2.5
0
2.5
5
7.5 10 12.5
Distance Along X Axis (mm)
图 9-6. Magnetic Field Across X, Y and Z Axes
When The Magnet Slides by on Top of the Sensor
图 9-7. Output Voltage of TMAG5253 When The
Magnet Slides by on Top of the Sensor
9.2.2 Head-On Displacement Sensing
图 9-8 shows another robust method for measuring linear position by using a magnet and the TMAG5253 in a
head-on configuration. For this configuration, the linear axis of measurement of the Hall position sensor is along
the path of travel, which results in a unique mapping of distance to magnetic flux density if the magnet is inline
with the sensing axis of the Hall position sensor.
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PCB
图 9-8. Head-On Displacement Sensing
9.2.2.1 Design Requirements
Use the parameters listed in 表 9-3 for this design example.
表 9-3. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
3.3 V
VCC
Magnet
5 × 5 × 5 mm NdFeB
5 mm
Travel distance
Travel distance range from magnet to sensor
Magnetic field range at the sensor at 25°C
Device option
10 mm to 5 mm
50 to 10 mT
TMAG5253BA3
9.2.2.2 Detailed Design Procedure
Unlike the Slide-By Displacement Sensing configuration, the head-on displacement configuration has a magnetic
flux density that is either entirely positive or entirely negative, depending on whether the south or north pole
of the magnet is closest to the sensor. As a result, the user can choose the sensors that are sensitive only
to south field for this mechanical configuration. In cases where it is not possible to control the polarity of
the magnet, the bipolar version (TMAG5253B) is chosen. The mapping of magnetic flux density to distance
depends on various factors, such as the material and dimensions of the magnet. 图 9-9 shows that the magnetic
flux density is always positive as the magnet travels towards the sensor. Based on the magnetic field range,
TMAG5253BA3 version with ±80 mT full scale range is chosen. 图 9-9 shows the output voltage of this sensor
as the magnet travels from a distance of 10 mm to a distance of 5 mm towards the sensor. The DRV5056
Distance Measurement Tool calculates the expected magnetic flux density to distance mapping in a head-on
configuration for different magnet specifications.
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9.2.2.3 Application Curve
60
55
50
45
40
35
30
25
20
15
10
2.64
2.56
2.48
2.4
BZ (mT)
VOUT(V)
2.32
2.24
2.16
2.08
2
1.92
1.84
4.5
5.5
6.5
7.5
8.5
9.5
10.5
Distance from Magnet to Sensor (mm)
图 9-9. Magnetic Field (BZ) and the Output Voltage of the Sensor (VOUT) vs the Distance from Magnet to
the Sensor
9.2.3 Remote-Sensing Applications
For remote-sensing applications where the sensor is not physically placed on the same board as the ADC or
the microcontroller, it is important to have the ability to drive a capacitive load from the wiring harness. The
TMAG5253 enables remote-sensing applications with the ability to support up to 1-nF capacitive load on the
OUT pin. With a typical cable capacitance of about 100 pF/m, the TMAG5253 can support up to 10 m in cable
length.
PCB
µController
TMAG5253
VCC
EN
VCC
ADC
OUT
Cable
VOUT
GND
图 9-10. Remote-Sensing Application With Wire Break Detection
Some remote-sensing applications might require a device to detect if interconnect wires open or short. The
TMAG5253 can support this feature with the ability to drive up to ±1-mA current load on the output. To design
for wire break detection, first select a sensitivity option that causes the output voltage to stay within the VL range
during normal operation. Second, add a pullup resistor between OUT and VCC. TI recommends a value between
20 kΩ to 100 kΩ, and the current through OUT must not exceed the IO specification, including current going
into an external ADC. Then, if the output voltage is ever measured to be within 100 mV of VCC or GND, a fault
condition exists. 图 9-10 shows the circuit, and 表 9-4 describes fault scenarios.
表 9-4. Fault Scenarios and the Resulting VOUT
FAULT SCENARIO
VOUT
VCC disconnects
Close to GND
Close to VCC
Close to VCC
Close to GND
GND disconnects
VCC shorts to OUT
GND shorts to OUT
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9.3 Best Design Practices
The Hall element is sensitive to magnetic fields that are perpendicular to the top of the package, therefore a
correct magnet approach must be used for the sensor to detect the field. 图 9-11 shows correct and incorrect
approaches.
CORRECT
N
S
S
N
N
S
INCORRECT
N
S
图 9-11. Correct and Incorrect Magnet Approaches
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9.4 Power Supply Recommendations
A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI
recommends using a ceramic capacitor with a value of at least 0.1 µF.
9.5 Layout
9.5.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed circuit boards, which makes placing the magnet on the
opposite side possible.
9.5.2 Layout Example
OUT
VCC
Thermal
Pad
GND
EN
图 9-12. Layout Example
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10 Device and Documentation Support
10.1 Documentation Support
10.1.1 Related Documentation
For related documentation see the following:
•
Texas Instruments, Absolute Angle Measurements for Rotational Motion Using Hall-Effect Sensors
application brief
•
•
Texas Instruments, Tracking Slide-By Displacement with Hall Effect Sensors application brief
Texas Instruments, Head-on Linear Displacement Sensing using Hall Effect Sensors application brief
10.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
10.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI
的《使用条款》。
10.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
10.5 静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
10.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
DMR0004A
X2SON - 0.4 mm max height
SCALE 9.000
PLASTIC SMALL OUTLINE - NO LEAD
1.1ꢀ
1.0ꢀ
A
B
PIN 1 INDEX AREA
1.4ꢀ
1.3ꢀ
C
0.4 MAX
SEATING PLANE
0.08 C
0.0ꢀ
0.00
2X 0.ꢀ
SYMM
2
3
EXPOSED
THERMAL PAD
ꢀ
SYMM
0.6 0.0ꢀ
0.2ꢀ
0.1ꢀ
4X
PIN 1 ID
(OPTIONAL)
4
1
0.27
0.17
4X
0.8 0.0ꢀ
0.1
C B
C
A
0.0ꢀ
422282ꢀ/A 03/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.ꢀM.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(0.6)
(1.4)
(
0.2) VIA
2
3
SYMM
(0.8)
LAND PATTERN EXAMPLE
SCALE:35X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222825/A 03/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.
It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
Copyright © 2023 Texas Instruments Incorporated
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English Data Sheet: SBASAI5
TMAG5253
ZHCSPM0 – MAY 2023
www.ti.com.cn
EXAMPLE STENCIL DESIGN
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(1.4)
(0.57)
METAL
TYP
2
3
SYMM
(0.76)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 5:
90% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4222825/A 03/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TMAG5253
English Data Sheet: SBASAI5
TMAG5253
ZHCSPM0 – MAY 2023
www.ti.com.cn
11.1 Package Option Addendum
Packaging Information
Orderable
Device
Package
Drawing
Lead/Ball
Finish(6)
MSL Peak
Temp(3)
Device
Status(1)
Package Type
Pins
Package Qty
Eco Plan(2)
Op Temp (°C)
Marking(4) (5)
PTMAG5253A3 ACTIVE
IQDMRR
X2SON
DMR
4
3000
RoHS & Green Call TI
Call TI
-40 to 125
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on
information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming
materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SBASAI5
30
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ZHCSPM0 – MAY 2023
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11.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
PTMAG5253A3IQDMR
R
X2SON
DMR
4
3000
180
8.4
1.27
1.57
0.50
4
8
Q1
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ZHCSPM0 – MAY 2023
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
DMR
SPQ
Length (mm) Width (mm)
200 183
Height (mm)
PTMAG5253A3IQDMRR
X2SON
4
3000
25
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SBASAI5
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PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PTMAG5253A3IQDMRR
ACTIVE
X2SON
DMR
4
3000
TBD
Call TI
Call TI
-40 to 125
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
DMR 4
1.1 x 1.4, 0.5 mm pitch
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4229480/A
www.ti.com
PACKAGE OUTLINE
DMR0004A
X2SON - 0.4 mm max height
SCALE 9.000
PLASTIC SMALL OUTLINE - NO LEAD
1.15
1.05
A
B
PIN 1 INDEX AREA
1.45
1.35
(0.13) TYP
C
0.4 MAX
SEATING PLANE
0.08 C
NOTE 4
0.05
0.00
2X 0.5
SYMM
2
3
NOTE 4
EXPOSED
THERMAL PAD
5
SYMM
0.6 0.1
0.25
0.15
4X
PIN 1 ID
(OPTIONAL)
4
1
0.27
0.17
4X
0.8 0.1
0.1
C B
C
A
0.05
4222825/B 05/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Quantity and shape of side wall metal may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(1.4)
(0.6)
(
0.2) VIA
2
3
SYMM
(0.8)
LAND PATTERN EXAMPLE
SCALE:35X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222825/B 05/2022
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.
It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMR0004A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
2X (0.5)
4X (0.22)
4X (0.4)
(R0.05) TYP
1
4
5
SYMM
(1.4)
(0.57)
METAL
TYP
2
3
SYMM
(0.76)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 5:
90% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4222825/B 05/2022
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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Copyright © 2023，德州仪器 (TI) 公司
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