RF37S114 [TI]

Tag-it HF-I 5 类 NFC,ISO15693 应答器,4mm × 4mm;
RF37S114
型号: RF37S114
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Tag-it HF-I 5 类 NFC,ISO15693 应答器,4mm × 4mm

文件: 总9页 (文件大小:560K)
中文:  中文翻译
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RF37S114  
ZHCSEP8 NOVEMBER 2015  
RF37S114 Tag-it™ HF-I 5 NFCISO/IEC 15693 应答器,4mm ×  
4mm  
1 器件概述  
1.1 特性  
1
• ISO/IEC 15693-2ISO/IEC 15693-  
3ISO/IEC 180003NFC 标签类型 5  
• 256 位用户存储器,分为八个 32 位存储块  
应用系列标识符 (AFI)  
集成天线  
快速同步识别(防冲突)  
• 13.56MHz 工作频率  
1.2 应用  
产品认证  
资产管理  
医疗  
供应链管理  
1.3 说明  
TI Tag-it™HF-I 5 NFC 应答器符合 ISO/IEC 15693 ISO/IEC 18000-3 全球开放式标准。本产品具有  
用户可访问的 256 位存储器,分为 8 个存储块,并且拥有一个经过优化的命令集。本应答器产品随附集成  
天线,因此可直接应用,无需连接外部天线。  
(1)  
器件信息  
封装  
部件号  
RF37S114HTFJB  
封装尺寸  
RFIDP (0)  
4mm × 4mm × 0.66mm  
(1) 要获得最新的器件、封装和订购信息,请参见封装选项附录6)。  
应答器如1-1 所示。  
1-1. RF37S114HTFJB 应答器  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SCBS907  
 
 
 
 
 
RF37S114  
ZHCSEP8 NOVEMBER 2015  
www.ti.com.cn  
内容  
1
器件概.................................................... 1  
1.1 特性 ................................................... 1  
1.2 应用 ................................................... 1  
1.3 说明 ................................................... 1  
修订历史记录............................................... 2  
Specifications ............................................ 3  
3.1 Absolute Maximum Ratings .......................... 3  
3.2 ESD Ratings.......................................... 3  
3.3 Recommended Operating Conditions ................ 3  
3.4 Electrical Characteristics ............................. 3  
3.5 Physical Characteristics .............................. 3  
Detailed Description..................................... 4  
4.1 Supported Command Set ............................ 4  
4.2 Memory Organization................................. 4  
器件和文档支............................................ 5  
5.1 器件支持 .............................................. 5  
5.2 文档支持 .............................................. 6  
5.3 社区资源 .............................................. 6  
5.4 商标 ................................................... 6  
5.5 静电放电警告 ......................................... 7  
5.6 出口管制提示 ......................................... 7  
5.7 Glossary .............................................. 7  
机械、封装和可订购信息 ................................. 7  
5
2
3
6
4
2 修订历史记录  
日期  
修订版本  
注释  
2015 11 月  
*
最初发布版本  
2
修订历史记录  
Copyright © 2015, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Links: RF37S114  
 
RF37S114  
www.ti.com.cn  
ZHCSEP8 NOVEMBER 2015  
3 Specifications  
3.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–25  
–40  
MAX  
70  
UNIT  
°C  
TA  
Operating temperature  
Storage temperature  
TSTG  
85  
°C  
3.2 ESD Ratings  
Device is fully encapsulated and protected. No ESD classification applies.  
3.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX  
UNIT  
TA  
Operating temperature  
–25  
70  
°C  
3.4 Electrical Characteristics  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
RF37S114HTFJB  
Supported standard  
ISO/IEC 15693-2, ISO/IEC 15693-3, ISO/IEC 18000-3  
Recommended operating frequency  
Typical read activation field strength (at 25°C)  
Typical write activation field strength (at 25°C)  
Factory programmed read-only number  
Memory (user programmable)  
13.56 MHz  
136.0 dBµA/m  
136.0 dBµA/m  
64 bits  
256 bits organized in eight 32-bit blocks  
Typical programming cycles (at 25°C)  
Data retention time (at 55°C)  
100000  
>10 years  
Simultaneous identification of tags  
Up to 50 tags per second (reader and antenna dependent)  
3.5 Physical Characteristics  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
RF37S114HTFJB  
Dimensions  
4 mm × 4 mm × 0.66 mm ±0.1 mm  
Copyright © 2015, Texas Instruments Incorporated  
Specifications  
3
Submit Documentation Feedback  
Product Folder Links: RF37S114  
RF37S114  
ZHCSEP8 NOVEMBER 2015  
www.ti.com.cn  
4 Detailed Description  
4.1 Supported Command Set  
Table 4-1 summarizes the ISO/IEC 15693 mandatory and optional commands that are supported by this  
transponder.  
Table 4-1. Supported Command Set (ISO/IEC 15693 Mandatory and Optional Commands)  
(1)  
REQUEST MODE  
REQUEST  
Inventory  
REQUEST  
CODE  
OPTIONAL  
FLAG  
INVENTORY  
ADDRESSED  
NONADDRESSED  
AFI  
0x01  
0x02  
0x20  
0x21  
0x22  
0/–  
0/–  
–/1  
–/1  
–/1  
Stay Quiet  
Read_Single_Block  
Write_Single_Block  
Lock_Block  
(1) = Implemented, = Not applicable  
4.2 Memory Organization  
Figure 4-1 shows the organization of the user-accessible memory on this transponder.  
32 bits  
Lock  
Bit  
Block  
Address  
0x00  
0x01  
0x02  
0x03  
0x04  
User data  
(256 bits)  
0x05  
0x06  
0x07  
UID Number  
(64 bits)  
0x08  
0x09  
X
0x0A  
AFI  
Figure 4-1. Memory Organization  
4
Detailed Description  
版权 © 2015, Texas Instruments Incorporated  
提交文档反馈意见  
产品主页链接: RF37S114  
 
 
RF37S114  
www.ti.com.cn  
ZHCSEP8 NOVEMBER 2015  
5 器件和文档支持  
5.1 器件支持  
5.1.1 开发支持  
5.1.1.1 入门和下一步  
德州仪器 (TI) RFID 产品可为各类应用提供终极 解决方案。TI RFID 采用 HDX 专利技术,可在读取范  
围、读取速率以及稳健性等方面提供无与伦比的性能。TI 提供应答器、嵌体、阅读器模块和阅读器集成电路  
(IC) 的一站式采购。更多信息,请参见 NFC / RFID 概述页面。  
5.1.2 器件命名规则  
为了标明产品开发周期的阶段,TI 为所有器件的部件号分配了前缀。每个商业系列成员都具有以下三个前缀  
中的一个:xp或无前缀(例如,xRF37S114HTFJB)。这些前缀代表了产品开发的发展阶段:从工程原  
型(前缀 x)直到完全合格的生产器件和工具(无前缀)。  
器件开发进化流程:  
xRF... 试验器件不一定代表最终器件的电气技术规格  
pRF... 最终器件符合最终产品的电气技术规格,但是未经完整的质量和可靠性验证  
RF... 完全合格的生产器件  
具有 x p 前缀的器件供货时附带如下免责声明:  
开发的产品用于内部评估用途。”  
生产器件已进行完全特性化,并且器件的质量和可靠性已经完全论证。TI 的标准保修证书适用。  
预测显示原型器件的故障率大于标准生产器件。由于这些器件的预计最终使用故障率仍未定义,德州仪器  
(TI) 建议不要将它们用于任何生产系统。只有合格的生产器件将被使用。  
TI 器件的命名规则也包括一个带有器件系列名称的后缀。该后缀包括封装类型(例如 TEL)以及可选项温度  
范围(例如 T)。5-1 提供了读取任一系列产品成员完整器件名称的图例。  
RF 37 S 114 H TFJ  
B
Packing  
Package  
Temperature  
Form Factor  
Device Family  
Function Type  
Family  
Form Factor  
RF = Integrated circuit  
37 = Family  
Device Family  
Function Type  
S = Security  
Family  
114 = Device Type  
Temperature Range  
Package  
H = –25°C to 70°C  
TFJ = RFIDP  
B = Bulk  
Packing  
5-1. 器件命名规则  
5.2 文档支持  
版权 © 2015, Texas Instruments Incorporated  
器件和文档支持  
5
提交文档反馈意见  
产品主页链接: RF37S114  
 
RF37S114  
ZHCSEP8 NOVEMBER 2015  
www.ti.com.cn  
以下文档对 RF37S114HTFJB 器件进行了介绍。www.ti.com 网站上提供了这些文档的副本。  
SPAT178  
RFID 系统产品技术规格。 德州仪器 (TI) 射频识别系统是射频识别 (RFID) 技术的行业领导  
者,也是全球领先的 TI-RFid™标签、TI-RFid 智能标签和 TI-RFid 阅读器系统集成制造商。TI  
制造的 RFID 标签已达 10 亿以上,TI-RFid 技术广泛出现在 全球范围内的 RFID 应用中。TI  
是许多标准化机构中的活跃成员,其中包括 ISOISO/IECECMA InternationalETSI 以及  
其他几个推广 RFID 技术全球标准的国家标准化机构。  
5.3 社区资源  
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商按照原样提供。这些内容并不构成 TI 技术  
规范,并且不一定反映 TI 的观点;请参见 TI 的《使用条款》。  
TI E2E™ 在线社区  
TI 工程师间 (E2E) 社区。 此社区的创建目的在于促进工程师之间的协作。在  
e2e.ti.com 中,您可以咨询问题、共享知识、探索思路,在同领域工程师的帮助下解决问题。  
5.4 商标  
Tag-it, TI-RFid, E2E are trademarks of Texas Instruments.  
6
器件和文档支持  
版权 © 2015, Texas Instruments Incorporated  
提交文档反馈意见  
产品主页链接: RF37S114  
RF37S114  
www.ti.com.cn  
ZHCSEP8 NOVEMBER 2015  
5.5 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
5.6 出口管制提示  
接收方同意:如果美国或其他适用法律限制或禁止将通过非披露义务的披露方获得的任何产品或技术数据  
(其中包括软件)(见美国、欧盟和其他出口管理条例之定义)、或者其他适用国家条例限制的任何受管制  
产品或此项技术的任何直接产品出口或再出口至任何目的地,那么在没有事先获得美国商务部和其他相关政  
府机构授权的情况下,接收方不得在知情的情况下,以直接或间接的方式将其出口。  
5.7 Glossary  
TI Glossary This glossary lists and explains terms, acronyms, and definitions.  
6 机械、封装和可订购信息  
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知  
且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2015, Texas Instruments Incorporated  
机械、封装和可订购信息  
7
提交文档反馈意见  
产品主页链接: RF37S114  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Sep-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
RF37S114HTFJB  
ACTIVE  
RFIDN  
TFJ  
0
5000  
RoHS &  
non-Green  
Call TI  
Level-1-260C-UNLIM  
-25 to 70  
Samples  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担  
保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。  
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。  
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成  
本、损失和债务,TI 对此概不负责。  
TI 提供的产品受 TI 的销售条款ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改  
TI 针对 TI 产品发布的适用的担保或担保免责声明。  
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE  
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2022,德州仪器 (TI) 公司  

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