SA5532ADRG4 [TI]
DUAL LOW-NOISE OPERATIONAL AMPLIFIERS; 双路低噪声运算放大器
| 型号： | SA5532ADRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL LOW-NOISE OPERATIONAL AMPLIFIERS |
| 文件： | 总13页 (文件大小：439K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NE5532, NE5532A
SA5532, SA5532A
www.ti.com................................................................................................................................................... SLOS075I–NOVEMBER 1979–REVISED APRIL 2009
DUAL LOW-NOISE OPERATIONAL AMPLIFIERS
1
FEATURES
NE5532, NE5532A . . . D, P, OR PS PACKAGE
SA5532, SA5532A . . . D OR P PACKAGE
(TOP VIEW)
•
Equivalent Input Noise Voltage:
5 nV/√Hz Typ at 1 kHz
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
VCC–
VCC+
•
•
•
•
Unity-Gain Bandwidth: 10 MHz Typ
2OUT
2IN–
2IN+
Common-Mode Rejection Ratio: 100 dB Typ
High DC Voltage Gain: 100 V/mV Typ
Peak-to-Peak Output Voltage Swing 26 V Typ
With VCC± = ±15 V and RL = 600 Ω
•
High Slew Rate: 9 V/µs Typ
DESCRIPTION/ORDERING INFORMATION
The NE5532, NE5532A, SA5532, and SA5532A are high-performance operational amplifiers combining excellent
dc and ac characteristics. They feature very low noise, high output-drive capability, high unity-gain and
maximum-output-swing bandwidths, low distortion, high slew rate, input-protection diodes, and output
short-circuit protection. These operational amplifiers are compensated internally for unity-gain operation. These
devices have specified maximum limits for equivalent input noise voltage.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
NE5532P
TOP-SIDE MARKING
NE5532P
PDIP – P
SOIC – D
Tube of 50
NE5532AP
NE5532AP
Tube of 75
Reel of 2500
Tube of 75
Reel of 2500
NE5532D
N5532
NE5532DR
0°C to 70°C
NE5532AD
N5532A
NE5532ADR
NE5532PSR
NE5532APSR
SA5532P
N5532
SOP – PS
PDIP – P
Reel of 2000
Tube of 50
N5532A
SA5532P
SA5532AP
SA5532AP
Tube of 75
Reel of 2500
Tube of 75
Reel of 2500
SA5532D
–40°C to 85°C
SA5532
SA5532DR
SOIC – D
SA5532AD
SA5532A
SA5532ADR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1979–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
NE5532, NE5532A
SA5532, SA5532A
SLOS075I–NOVEMBER 1979–REVISED APRIL 2009................................................................................................................................................... www.ti.com
SCHEMATIC (EACH AMPLIFIER)
V
CC+
36 pF
IN+
37 pF
14 pF
15 W
OUT
7 pF
IN–
15 W
460 W
V
CC–
Component values shown are nominal.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VCC+
VCC–
22 V
VCC
Supply voltage(2)
–22 V
VCC±
Input voltage, either input(2)(3)
Input current(4)
±10 mA
Duration of output short circuit(5)
Unlimited
97°C/W
D package
P package
PS package
θJA
Package thermal impedance(6)(7)
85°C/W
95°C/W
TJ
Operating virtual-junction temperature
Storage temperature range
150°C
Tstg
–65°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–
.
(3) The magnitude of the input voltage must never exceed the magnitude of the supply voltage.
(4) Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless
some limiting resistance is used.
(5) The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the
maximum dissipation rating is not exceeded.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
(7) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
2
Submit Documentation Feedback
Copyright © 1979–2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
NE5532, NE5532A
SA5532, SA5532A
www.ti.com................................................................................................................................................... SLOS075I–NOVEMBER 1979–REVISED APRIL 2009
RECOMMENDED OPERATING CONDITIONS
MIN
5
MAX UNIT
VCC+
VCC–
Supply voltage
Supply voltage
15
–15
70
V
V
–5
0
NE5532, NE5532A
SA5532, SA5532A
TA
Operating free-air temperature
°C
–40
85
ELECTRICAL CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP
MAX UNIT
TA = 25°C
TA = Full range(2)
0.5
4
VIO
IIO
IIB
Input offset voltage
Input offset current
VO = 0
mV
5
TA = 25°C
TA = Full range(2)
10
150
nA
200
TA = 25°C
TA = Full range(2)
200
800
nA
Input bias current
1000
VICR
Common-mode input-voltage range
±12
24
±13
26
V
V
Maximum peak-to-peak output-voltage
swing
VOPP
R
L ≥ 600 Ω, VCC± = ±15 V
L ≥ 600 Ω, VO = ±10 V
TA = 25°C
TA = Full range(2)
15
10
25
15
50
R
Large-signal differential-voltage
amplification
AVD
V/mV
V/mV
TA = 25°C
TA = Full range(2)
100
RL ≥ 2 kΩ, VO±10 V
Small-signal differential-voltage
amplification
Avd
f = 10 kHz
2.2
BOM
B1
ri
Maximum output-swing bandwidth
Unity-gain bandwidth
Input resistance
RL = 600 Ω, VO = ±10 V
RL = 600 Ω, CL = 100 pF
140
10
kHz
MHz
kΩ
30
300
0.3
100
zo
Output impedance
AVD = 30 dB, RL = 600 Ω, f = 10 kHz
Ω
CMRR Common-mode rejection ratio
VIC = VICR min
70
80
10
dB
Supply-voltage rejection ratio
kSVR
VCC± = ±9 V to ±15 V, VO = 0
100
dB
(ΔVCC±/ΔVIO
)
IOS
ICC
Output short-circuit current
Total supply curent
38
8
60
16
mA
mA
dB
VO = 0, No load
Crosstalk attenuation (VO1/VO2
)
V01 = 10 V peak, f = 1 kHz
110
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
(2) Full temperature ranges are: –40°C to 85°C for the SA5532 and SA5532A, and 0°C to 70°C for the NE5532 and NE5532A.
Copyright © 1979–2009, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
NE5532, NE5532A
SA5532, SA5532A
SLOS075I–NOVEMBER 1979–REVISED APRIL 2009................................................................................................................................................... www.ti.com
OPERATING CHARACTERISTICS
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
NE5532, SA5532
NE5532A, SA5532A
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
MAX
MIN
TYP
MAX
SR
Slew rate at unity gain
Overshoot factor
9
9
V/µs
VI = 100 mV, RL = 600 Ω,
AVD = 1, CL = 100 pF
10
10
%
f = 30 Hz
f = 1 kHz
f = 30 Hz
f = 1 kHz
8
5
8
5
10
6
Vn
In
Equivalent input noise voltage
Equivalent input noise current
nV/√Hz
pA/√Hz
2.7
0.7
2.7
0.7
4
Submit Documentation Feedback
Copyright © 1979–2009, Texas Instruments Incorporated
Product Folder Link(s): NE5532 NE5532A SA5532 SA5532A
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
PACKAGING INFORMATION
Orderable Device
NE5532AD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NE5532ADE4
NE5532ADG4
NE5532ADR
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NE5532ADRE4
NE5532ADRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NE5532AIP
NE5532AP
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
TBD
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NE5532APE4
NE5532APSR
NE5532APSRE4
NE5532APSRG4
NE5532D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
P
PS
PS
PS
D
8
8
8
8
8
8
8
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NE5532DE4
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NE5532DG4
NE5532DR
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NE5532DRE4
NE5532DRG4
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NE5532IP
NE5532P
OBSOLETE
ACTIVE
PDIP
PDIP
P
P
8
8
TBD
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
NE5532PE4
NE5532PSR
NE5532PSRE4
NE5532PSRG4
SA5532AD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
P
PS
PS
PS
D
8
8
8
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SA5532ADE4
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SA5532ADG4
SA5532ADR
SA5532ADRE4
SA5532ADRG4
SA5532AP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
P
P
D
D
D
D
D
D
P
P
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SA5532APE4
SA5532D
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SA5532DE4
SA5532DG4
SA5532DR
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SA5532DRE4
SA5532DRG4
SA5532P
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SA5532PE4
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2009
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
NE5532ADR
NE5532APSR
NE5532DR
SOIC
SO
D
PS
D
8
8
8
8
8
8
2500
2000
2500
2000
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
12.4
16.4
12.4
16.4
12.4
12.4
6.4
8.2
6.4
8.2
6.4
6.4
5.2
6.6
5.2
6.6
5.2
5.2
2.1
2.5
2.1
2.5
2.1
2.1
8.0
12.0
8.0
12.0
16.0
12.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
SO
NE5532PSR
SA5532ADR
SA5532DR
PS
D
12.0
8.0
SOIC
SOIC
D
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Feb-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
NE5532ADR
NE5532APSR
NE5532DR
SOIC
SO
D
PS
D
8
8
8
8
8
8
2500
2000
2500
2000
2500
2500
340.5
346.0
340.5
346.0
340.5
340.5
338.1
346.0
338.1
346.0
338.1
338.1
20.6
33.0
20.6
33.0
20.6
20.6
SOIC
SO
NE5532PSR
SA5532ADR
SA5532DR
PS
D
SOIC
SOIC
D
Pack Materials-Page 2
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
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SI9137DB
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