SM320C6727BHFHM [TI]
军用级 C6727B 浮点 DSP | HFH | 256 | -55 to 125;型号: | SM320C6727BHFHM |
厂家: | TEXAS INSTRUMENTS |
描述: | 军用级 C6727B 浮点 DSP | HFH | 256 | -55 to 125 |
文件: | 总110页 (文件大小:1049K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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浮点数字信号处理器
查询样片: SM320C6727B
1 浮点数字信号处理器
1.1 特性
123
• 32/64 位 250MHz 浮点数字信号处理器 (DSP)
• 升级为 C67x+ CPU,原先为 C67x™ DSP 系列:
– 2X CPU 寄存器 [64 通用]
– 全新的音频专用指令
– 与 C67x CPU 兼容
• 增强型存储器系统
• 3 个多通道音频串口
– 发射/接收时钟高达 50MHz
– 6 个时钟区域和 16 个串行数据引脚
– 支持时分复用 (TDM),I2S,和相似格式
– 支持动态互联网技术 (DIT)(McASP2)
• 通用主机端口接口 (UHPI)
– 256K 字节统一程序/数据 RAM
– 384K 字节统一程序/数据 ROM
– 来自 CPU 的单周期数据访问
– 大容量程序高速缓存(32K 字节)支持
RAM,ROM 和外部存储器
– 针对高带宽的 32 位宽数据总线
– 复用和非复用地址和数据
• 2 个具有 3,4 和 5 引脚选项的 10MHz 串行外设接
口 (SPI) 端口
• 2 个集成电路间 (I2C) 端口
• 实时中断计数器/看门狗
• 振荡器和软件控制的锁相环 (PLL)
• 应用范围:
• 外部存储器接口 (EMIF) 支持
– 133MHz SDRAM(16 或 32 位)
– 异步 NOR 闪存,SRAM(8,16 或 32 位)
– NAND 闪存(8 或 16 位)
• 增强型输入输出 (I/O) 系统
– 高性能纵横开关
– 专业音频
•
•
•
•
•
•
•
混音器
效果框
– 专用多通道音频串口 (McASP) 直接存储器存取
(DMA) 总线
– 确定的 I/O 性能
音频合成器
仪表/放大器建模
音频会议
• dMAX(双数据移动加速器)
支持:
音频广播
音频编码器
– 16 条独立的通道
– 2 个传输
请求的同时处理
– 新兴音频应用
– 生物识别技术
– 医疗
– 1,2 和 3 维存储器至存储器和存储器至外设数据
– 工业
传输
• 军用温度范围
– 循环寻址,在这里,循环缓冲器 (FIFO) 的大小未
(-55°C 至 125°C Tcase
)
被限制为 2n
• 256 引脚,0.5mm,陶瓷四方扁平 (CQFP) 封装
[HFH 后缀]
– 与一个循环缓冲器间的基于表格的多阶延迟读取
和写入传输
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
C67x, TMS320C6000, C6000, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments.
Philips is a registered trademark of Koninklijki Philips Electronics N.V.
2
3
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
版权 © 2014, Texas Instruments Incorporated
English Data Sheet: SPRS861
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1.2 说明
SMV320C6727B 是德州仪器 (TI) C67x 系列高性能 32/64 位浮点数字信号处理器的下一代产品。
增强型 C67x+ CPU。 C67x+ CPU 是 C671x DSP 上使用的 C67x CPU 的增强型版本。 它与 C67x CPU
兼容,但是极大提升了每个时钟周期内的速度、代码密度和浮点性能。 此 CPU 本身支持 32 位定点,32 位
单精度浮点和 64 位双精度浮点算术运算。
高效的存储器系统。 此存储器控制器将大型片载 256K 字节 RAM 和 384K 字节 ROM 映射为统一程序和数
据存储器。 由于与某些其它器件一样,在程序与数据存储器尺寸之间没有固定的分界,所以开发过程被简
化。
此存储器控制器支持 C67x+ CPU 对 RAM 和 ROM 的单周期数据存取。 支持以下 4 个源中 3 个源对内部
RAM 和 ROM 高达 3 次并行存取:
•
•
•
来自 C67x+ CPU 的 2 个 64 位数据存取
一个来自内核与程序高速缓存的 256 位程序取指令
一个来自外设系统(dMAX 或 UHPI)的 32 位数据存取
对于大多数应用,大型(32 字节)程序高速缓存转化为高命中率。 这防止了与片载存储器的大多数程序/数
据存取冲突。 它还能够从一个诸如 SDRAM 的芯片外存储器上实现有效程序执行。
高性能纵横开关。 一个高性能纵横开关被用作不同总线主控 (CPU,dMAX,UHPI) 与不同目标(外设和存
储器)之间的中央集线器。 此纵横开关被部分连接;某些连接不被支持(例如,UHPI 到外设的连接)。
只要针对一个特定目标的多个总线主控之间没有冲突,可通过纵横开关实现并行多重传输。 当确实发生冲突
时,仲裁是一个简单且确定的固定优先级机制。
由于 dMAX 负责大多数时间关键 I/O 传输,它被授予最高优先级,其次是 UHPI,最后是 CPU。
dMAX 双向数据传输加速器。 dMAX 是一个被设计用来执行数据传输加速的模块。 数据传输加速器
(dMAX) 控制器处理内部数据存储器控制器与 C6727B DSP 上器件外设之间的用户设定的数据传输。 dMAX
允许数据在任何可寻址存储器空间之间移动,其中包括内部存储器、外设和外部存储器。
dMAX 控制器包括一些特性,诸如执行三维数据传输以实现数据分类的能力,将存储器的一部分管理为支持
基于阶延迟数据读取和写入的循环缓冲器 / FIFO 的能力。 dMAX 控制器能够同时处理 2 个传输请求(如果
它们去往/来自不同的目的/源)。
用于实现灵活性和扩展的外部存储器接口 (EMIF)。 C6727B 上的外部存储器接口支持一个单组 SDRAM 和
单组异步存储器。 EMIF 数据宽度为 16 位宽。
SDRAM 支持的存储器包括 x16 和 x32 SDRAM 器件,这些器件具有 1,2 或 4 组。
C6727B 将 SDRAM 支持扩展至 256M 位和 512M 位器件。
异步存储器支持通常被用来从一个并行非复用 NOR 闪存器件引导,此器件可以为 8,16 或 32 位宽。 通过
使用针对上部地址线路的通用 I/O 引脚,可实现从较大闪存器件(大于专用 EMIF 地址线路本来支持的器
件)的引导。
此异步存储器接口也可被配置成支持 8 或 16 位宽 NAND 闪存。 它包括一个可在高达 512 字节数据块上运
行的硬件纠错码 (ECC) 计算(用于单一位错误)。
针对高速并行 I/O 的通用主机端口接口 (UHPI)。通用主机端口接口 (UHPI) 是一个并行接口,通过这个接
口,一个外部主机 CPU 能够访问 DSP 上的存储器。 C6727B UHPI 所支持的 3 个模式为:
•
•
•
复用地址/数据 - 半字(16 位宽)模式(与 C6713 相似)
复用地址/数据 - 全字(32 位宽)模式
非复用模式 - 16 位地址和 32 位数据总线
UHPI 也可被限制成访问 C6727B 地址空间内任一位置存储器的单页(64K 字节);这个页可被改变,但是
只能由 C6727B CPU 更改。 这个特性使得 UHPI 能够被用于高速数据传输,即使在对安全性有严格要求的
系统中也是如此。
UHPI 只在 C6727B 上提供。
2
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多通道音频串口(McASP0,McASP1 和 McASP2)- 多达 16 个立体声通道 I2S。 多通道音频串口
(McASP) 与编解码器 (CODEC),数模转换器 (DAC),模数转换器 (ADC) 和其它器件无缝对接。 它支持常
见的 IIS 格式,以及这个格式的很多变体,其中包括具有多达 32 个时间槽的时分复用 (TDM) 格式。
每个 McASP 包括一个发送和接收部分,此部分可单独或同步运行;此外,每个部分有其自身的灵活时钟发
生器和扩展误差校验逻辑。
当数据通过 McASP 时,它可被重新排列,这样,在无需任何 CPU 开销进行转换的情况下,应用代码所使
用的定点表示法可以不受外部器件使用的表示法的影响。
McASP 是一个可配置模块,并且支持 2 个至 16 个串行数据引脚。 它还具有支持一个数字接口发送器 (DIT)
模式的选项,此模式具有一个完全 384 位通道状态和用户数据存储器。
集成电路间串行端口 (I2C0,I2C1)。 C6727B 包含 2 个集成电路间 (I2C) 串行端口。 一个典型应用是,将
一个 I2C 串行端口配置为一个受外部用户接口微控制器控制的端口。 然后,另外一个 I2C 端口可被
C6727B DSP 用来控制外部外设器件,诸如一个 CODEC 或网络控制器,这些外设是此 DSP 器件的功能外
设。
这 2 个 I2C 串行端口与 SPI0 串行端口引脚复用。
串行外设接口端口 (SPI0,SPI1)。 与 I2C 串行端口的情况一样,C6727B DSP 也包含 2 个串行外设接口
(SPI) 串行端口。 这使得一个 SPI 端口可被配置为一个受控端口来控制 DSP,而另外一个 SPI 串行端口被
DSP 用来控制外设。
此 SPI 端口支持一个基本 3 引脚模式,以及可选的 4 和 5 引脚模式。 可选引脚包括一个受控芯片选择引脚
和一个使能引脚,此使能引脚在硬件中执行自动握手以实现最大 SPI 数据吞吐量。
SPI0 端口与 2 个 I2C 串行端口(I2C0 和 I2C1)引脚复用。 SPI1 串行端口与 McASP0 和 McASP1 的串行
数据引脚中的 5 个引脚复用。
实时中断定时器 (RTI)。 实时中断定时器模块包括:
•
•
•
•
2 个 32 位计数器和预分频器对
2 个输入捕捉(被接至 McASP 直接存储器访问 [DMA] 事件以实现采样率测量)
具有自动升级功能的 4 个比较
针对增强型系统稳健耐用性的数字安全看门狗(可选)
时钟生成(PLL 和 OSC)。 C6727B DSP 包含一个片载振荡器,此振荡器支持的晶振范围为 12MHz 至
25MHz。 或者,此时钟可由 CLKIN 引脚从外部提供。
DSP 包含一个灵活的、软件设定的锁相环 (PLL) 时钟发生器。 通过分割 PLL 输出,可生成 3 个不同的时钟
域(SYSCLK1,SYSCLK2 和 SYSCLK3)。 SYSCLK1 是 CPU,存储器控制和存储器使用的时钟。
SYSCLK2 是外设子系统和 dMAX 使用的时钟。 SYSCLK3 只由 EMIF 使用。
1.2.1 器件兼容性
SMV320C6727B 浮点数字信号处理器基于全新的 C67x+ CPU。 这个内核与 TMS320C671x DSP 上使用的
C67x CPU 内核代码兼容,但是它进行了包括额外浮点指令在内的重大改进。 请参阅 Section 2.2
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浮点数字信号处理器
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1.3 功能方框图
图 1-1 显示了 C6727B 器件的功能方框图。
Program/Data
RAM
256K Bytes
JTAG EMU
32
256
D1
Data
R/W
McASP0
16 Serializers
64
64
C67x+ CPU
32
32
Program/Data
ROM Page0
256K Bytes
D2
Data
R/W
256
Memory
Controller
32
32
McASP1
6 Serializers
Program
Fetch
Program/Data
ROM Page1
128K Bytes
I/O
INT
256
32
McASP2
2 Serializers
+ DIT
32
32
32
32
32
32
32
32
32
CSP
PMP DMP
32 32
32
Program
Cache
32K Bytes
SPI1
SPI0
I2C0
I2C1
RTI
256
High-Performance
Crossbar Switch
32
32
32
32
32
I/O Interrupts MAX0
Out
CONTROL
dMAX
MAX1
Events
In
UHPI
PLL
EMIF
Peripheral Interrupt and DMA Events
图 1-1. C6727B DSP 方框图
4
浮点数字信号处理器
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1
浮点数字信号处理器 ...................................... 1
4.3 Recommended Operating Conditions .............. 33
4.4 Electrical Characteristics ........................... 33
4.5 Parameter Information .............................. 34
4.6 Timing Parameter Symbology ...................... 35
4.7 Power Supplies ..................................... 36
4.8 Reset ............................................... 37
1.1 特性 .................................................. 1
1.2 说明 .................................................. 2
1.3 功能方框图 ........................................... 4
Device Overview ........................................ 6
2.1 Device Characteristics ............................... 6
2.2 Enhanced C67x+ CPU .............................. 6
2.3 CPU Interrupt Assignments .......................... 8
2.4 Internal Program/Data ROM and RAM .............. 9
2.5 Program Cache ..................................... 10
2.6 High-Performance Crossbar Switch ................ 12
2.7 Memory Map Summary ............................ 15
2.8 Boot Modes ......................................... 16
2.9 Pin Assignments .................................... 19
2.10 Development ........................................ 25
Device Configurations ................................ 29
3.1 Device Configuration Registers .................... 29
3.2 Peripheral Pin Multiplexing Options ................ 29
3.3 Peripheral Pin Multiplexing Control ................. 30
Peripheral and Electrical Specifications .......... 32
4.1 Electrical Specifications ............................ 32
4.2 Absolute Maximum Ratings ........................ 32
2
4.9
Dual Data Movement Accelerator (dMAX) ......... 38
4.10 External Interrupts .................................. 43
4.11 External Memory Interface (EMIF) ................. 44
4.12 Universal Host-Port Interface (UHPI) [C6727B Only]
...................................................... 54
4.13 Multichannel Audio Serial Ports (McASP0, McASP1,
and McASP2) ....................................... 67
4.14 Serial Peripheral Interface Ports (SPI0, SPI1) ..... 79
4.15 Inter-Integrated Circuit Serial Ports (I2C0, I2C1) ... 92
4.16 Real-Time Interrupt (RTI) Timer With Digital
3
4
Watchdog ........................................... 97
4.17 External Clock Input From Oscillator or CLKIN Pin
..................................................... 100
4.18 Phase-Locked Loop (PLL) ........................ 102
Application Example ................................ 105
Mechanical Data ...................................... 106
5
6
6.1
Package Thermal Resistance Characteristics .... 106
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2 Device Overview
2.1 Device Characteristics
Table 2-1 provides an overview of the C6727B DSPs. The table shows significant features of each device,
including the capacity of on-chip memory, the peripherals, the execution time, and the package type with
pin count.
Table 2-1. Characteristics of the C6727B Processors
HARDWARE FEATURES
dMAX
EMIF
UHPI
McASP
SPI
1
1 (32-bit)
Peripherals
1
3
2
2
1
Not all peripheral pins are available at the same
time. (For more details, see the Device
Configurations section.)
I2C
RTI
32KB Program Cache
256KB RAM
On-Chip Memory
Size (KB)
384KB ROM
Control Status Register
(CSR.[31:16])
CPU ID + CPU Rev ID
0x0300
Frequency
MHz
ns
250
4 ns
133
Cycle Time
EMIF Frequency
MHz
1.4 V
(C6727B-350)
1.2 V
(C6727B-300)
(C6727B-275)
(C6727BA-250)
Core (V)
Voltage
I/O (V)
3.3 V
Prescaler
Multiplier
Postscaler
36 x 36 mm
µm
/1, /2, /3, ..., /32
x4, x5, x6, ..., x25
/1, /2, /3, ..., /32
256-Pin CQFP (HFH)
0.13 µm
Clock Generator Options
Package (see Section 6)
Process Technology
Product Preview (PP),
Advance Information (AI), or
Production Data (PD)
Product Status
PD(1)
(1) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
2.2 Enhanced C67x+ CPU
The SM320C6727B floating-point digital signal processors are based on the new C67x+ CPU. This core is
code-compatible with the C67x CPU core used on the TMS320C671x DSPs, but with significant
enhancements including an increase in core operating frequency of 250 MHz while operating at 1.2 V.
The CPU fetches 256-bit-wide advanced very-long instruction word (VLIW) fetch packets that are
composed of variable-length execute packets. The execute packets can supply from one to eight 32-bit
instructions to the eight functional units during every clock cycle. The variable-length execute packets are
a key memory-saving feature, distinguishing the C67x CPU from other VLIW architectures. Additionally,
execute packets can now span fetch packets, providing a code size improvement over the C67x CPU
core.
6
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The CPU features two data paths, shown in Figure 2-1, each composed of four functional units (.D, .M, .S,
and .L) and a register file. The .D unit in each data path is a data-addressing unit that is responsible for all
data transfers between the register files and the memory. The .M functional units are dedicated for
multiplies, and the .S and .L functional units perform a general set of arithmetic, logical, and branch
functions. All instructions operate on registers as opposed to data in memory, but results stored in the 32-
bit registers can be subsequently moved to memory as bytes, half-words, or words.
Data Path A
Data Path B
Cross
Paths
Register File A
Register File B
.D1
.M1
.S1
.L1
.D2
.M2
.S2
.L2
Figure 2-1. CPU Data Paths
The register file in each data path contains 32 32-bit registers for a total of 64 general-purpose registers.
This doubles the number of registers found on the C67x CPU core, allowing the optimizing C compiler to
pipeline more complex loops by decreasing register pressure significantly.
The four functional units in each data path of the CPU can freely share the 32 registers belonging to that
data path. Each data path also features a single cross path connected to the register file on the opposing
data path. This allows each data path to source one cross-path operand per cycle from the opposing
register file. On the C67x+ CPU, this single cross-path operand can be used by two functional units per
cycle, an improvement over the C67x CPU in which only one functional unit could use the cross-path
operand. In addition, the cross-path register read(s) are not counted as part of the limit of four reads of the
same register in a single cycle.
The C67x+ CPU executes all C67x instructions plus new floating-point instructions to improve
performance specifically during audio processing. These new instructions are listed in Table 2-2.
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Table 2-2. New Floating-Point Instructions for C67x+ CPU
FLOATING-POINT
IMPROVES
INSTRUCTION
OPERATION(1)
MPYSPDP
SP x DP → DP
Faster than MPYDP.
Improves high Q biquads (bass management) and FFT.
MPYSP2DP
SP x SP → DP
Faster than MPYDP.
Improves Long FIRs (EQ).
ADDSP (new to CPU “S” Unit)
ADDDP (new to CPU “S” Unit)
SUBSP (new to CPU “S” Unit)
SUBDP (new to CPU “S” Unit)
SP + SP → SP
DP + DP → DP
SP – SP → SP
DP – DP → DP
Now up to four floating-point add and subtract operations in parallel.
Improves FFT performance and symmetric FIR.
(1) SP means IEEE Single-Precision (32-bit) operations and DP means IEEE Double-Precision (64-bit) operations.
Finally, two new registers, which are dedicated to communication with the dMAX unit, have been added to
the C67x+ CPU. These registers are the dMAX Event Trigger Register (DETR) and the dMAX Event
Status Register (DESR). They allow the CPU and dMAX to communicate without requiring any accesses
to the memory system.
2.3 CPU Interrupt Assignments
Table 2-3 lists the interrupt channel assignments on the C6727B device. If more than one source is listed,
the interrupt channel is shared and an interrupt on this channel could have come from any of the enabled
peripherals on that channel.
The dMAX peripheral has two CPU interrupts dedicated to reporting FIFO status (INT7) and transfer
completion (INT8). In addition, the dMAX can generate interrupts to the CPU on lines INT9–13 and INT15
in response to peripheral events. To enable this functionality, the associated Event Entry within the dMAX
can be programmed so that a CPU interrupt is generated when the peripheral event is received.
Table 2-3. CPU Interrupt Assignments
CPU INTERRUPT
INT0
INTERRUPT SOURCE
RESET
INT1
NMI (From dMAX or EMIF Interrupt)
INT2
Reserved
INT3
Reserved
INT4
RTI Interrupt 0
INT5
RTI Interrupts 1, 2, 3, and RTI Overflow Interrupts 0 and 1.
UHPI CPU Interrupt (from External Host MCU)
FIFO status notification from dMAX
INT6
INT7
INT8
Transfer completion notification from dMAX
dMAX event (0x2 specified in the dMAX interrupt event entry)
dMAX event (0x3 specified in the dMAX interrupt event entry)
dMAX event (0x4 specified in the dMAX interrupt event entry)
dMAX event (0x5 specified in the dMAX interrupt event entry)
dMAX event (0x6 specified in the dMAX interrupt event entry)
I2C0, I2C1, SPI0, SPI1 Interrupts
INT9
INT10
INT11
INT12
INT13
INT14
INT15
dMAX event (0x7 specified in the dMAX interrupt event entry)
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2.4 Internal Program/Data ROM and RAM
The organization of program/data ROM and RAM on C6727B is simple and efficient. ROM is organized as
two 256-bit-wide pages with four 64-bit-wide banks. RAM is organized as a single 256-bit-wide page with
eight 32-bit-wide banks.
The internal memory organization is illustrated in Figure 2-2 (ROM) and Figure 2-3 (RAM).
ROM Page 1
Base Address
0x0004 0000
ROM Page 0
Base Address
0x0000 0000
Bank
0
Bank
1
Bank
2
Bank
3
Figure 2-2. Program/Data ROM Organization
RAM Page 0
Base Address
0x1000 0000
Bank
0
Bank
1
Bank
2
Bank
3
Bank
4
Bank
5
Bank
6
Bank
7
Figure 2-3. Program/Data RAM Organization
The C6727B memory controller supports up to three parallel accesses to the internal RAM and ROM from
three of the following four sources as long as there are no bank conflicts:
•
•
•
Two 64-bit data accesses from the C67x+ CPU
One 256-bit-wide program fetch from the program cache
One 32-bit data access from the peripheral system (either dMAX or UHPI)
A program cache miss is 256 bits wide and conflicts only with data accesses to the same page. Multiple
data accesses to different pages, or to the same page but different banks will occur without conflict.
The organization of the C6727B internal memory system into multiple pages (3 total) and a large number
of banks (16 total) means that it is straightforward to optimize DSP code to avoid data conflicts. Several
factors, including the large program cache and the partitioning of the memory system into multiple pages,
minimize the number of program versus data conflicts.
The result is an efficient memory system which allows easy tuning towards the maximum possible CPU
performance.
The C6727B ROM consists of a software bootloader plus additional software.
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2.5 Program Cache
The C6727B DSP executes code directly from a large on-chip 32K-byte program cache. The program
cache has these key features:
•
•
•
•
•
•
•
Wide 256-bit path to internal ROM/RAM
Single-cycle access on cache hits
2-cycle miss penalty to internal ROM/RAM
Caches external memory as well as ROM/RAM
Direct-mapped
Modes: Enable, Freeze, Bypass
Software invalidate to support code overlay
The program cache line size is 256 bits wide and is matched with a 256-bit-wide path between cache and
internal memory. This allows the program cache to fill an entire line (corresponding to eight C67x+ CPU
instructions) with only a single miss penalty of 2 cycles.
The program cache control registers are listed in Table 2-4.
Table 2-4. Program Cache Control Registers
REGISTER NAME
L1PISAR
L1PICR
BYTE ADDRESS
0x2000 0000
DESCRIPTION
L1P Invalidate Start Address
0x2000 0004
L1P Invalidate Control Register
CAUTION
Any application which modifies the contents of program RAM (for example, a program
overlay) must invalidate the addresses from program cache to maintain coherency by
explicitly writing to the L1PISAR and L1PICR registers.
The Cache Mode (Enable, Freeze, Bypass) is configured through a CPU internal register (CSR, bits 7:5).
These options are listed in Table 2-5. Typically, only the Cache Enable Mode is used. But advanced users
may utilize Freeze and Bypass modes to tune performance.
Table 2-5. Cache Modes Set Through PCC Field of CSR CPU Register on
C6727B
CPU CSR[7:5]
CACHE MODE
000b
010b
011b
100b
Enable (Deprecated - Means direct mapped RAM on some C6000 devices)
Enable - Cache is enabled, cache misses cause a line fill.
Freeze - Cache is enabled, but contents are unchanged by misses.
Bypass - Forces cache misses, cache contents frozen.
Reserved - Not Supported
Other Values
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CAUTION
Although the reset value of CSR[7:5] (PCC field) is 000b, the value may be modified
during the boot process by the ROM code. Refer to the appropriate ROM data sheet for
more details. However, note that the cache may be disabled when control is actually
passed to application code. Therefore, it may be necessary to write '010b' to the PCC
field to explicitly enable the cache at the start of application code.
CAUTION
Changing the cache mode through CSR[7:5] does not invalidate any lines already in the
cache. To invalidate the cache after modifications are made to program space, the
control registers L1PISAR and L1PICR must be used.
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2.6 High-Performance Crossbar Switch
The C6727B DSP includes a high-performance crossbar switch that acts as a central hub between bus
masters and targets. Figure 2-4 illustrates the connectivity of the crossbar switch.
Program
Cache
ROM
RAM
CPU
PLL
RTI SPI0 SPI1 I2C0 I2C1
EMIF
External
Memory
SDRAM/
Flash
Memory Controller
T2
Data
Master
Port
CPU
Slave
Port
Program
Master
Port
Peripheral Configuration Bus
T3
(DMP)
(CSP)
(PMP)
Priority
BR4
M1
T1
M2
2
1
McASP0 McASP1 McASP2
BR1
BR2
BR3
SYSCLK1
SYSCLK2
SYSCLK1
SYSCLK3
SYSCLK1
SYSCLK3
SYSCLK2
McASP DMA Bus
T4
SYSCLK2
Priority
2
Priority
Priority
2
Priority
1
3
1
2
3
4
1
3
1
2
dMAX MAX0 Unit Master Port − High Priority
dMAX MAX1 Unit Master Port − Second Priority
Memory Controller DMP − Data Read/Write by CPU
UHPI Master Interface (External Host CPU)
M5
1
2
3
Crossbar
Priority
M3
MAX0 MAX1
M4
T5
External
Host MCU
Config
UHPI
Universal Host-Port
Interface
Config
dMAX
Figure 2-4. Block Diagram of Crossbar Switch
As shown in Figure 2-4, there are five bus masters:
M1
M2
M3
M4
M5
Memory controller DMP for CPU data accesses to peripherals and EMIF.
Memory controller PMP for program cache fills from the EMIF.
dMAX HiMAX master port for high-priority DMA accesses.
dMAX LoMAX master port for lower-priority DMA accesses.
UHPI master port for an external MCU to access on-chip and off-chip memories.
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The five bus masters arbitrate for five different target groups:
T1
T2
T3
T4
T5
On-chip memories through the CPU Slave Port (CSP).
Memories on the external memory interface (EMIF).
Peripheral registers through the peripheral configuration bus.
McASP serializers through the dedicated McASP DMA bus.
dMAX registers.
The crossbar switch supports parallel accesses from different bus masters to different targets. When two
or more bus masters contend for the same target beginning at the same cycle, then the highest-priority
master is given ownership of the target while the other master(s) are stalled. However, once ownership of
the target is given to a bus master, it is allowed to complete its access before ownership is arbitrated
again. Following are two examples.
Example 1: Simultaneous accesses without conflict
•
•
•
•
dMAX HiMAX accesses McASP Data Port for transfer of audio data.
dMAX LoMAX accesses SPI port for control processing.
UHPI accesses internal RAM through the CSP.
CPU fills program cache from EMIF.
Example 2: Conflict over a shared resource
•
•
dMAX HiMAX accesses RTI port for McASP sample rate measurement.
dMAX LoMAX accesses SPI port for control processing.
In Example 2, both masters contend for the same target, the peripheral configuration bus. The HiMAX
access will be given priority over the LoMAX access.
The master priority is illustrated in Figure 2-4 by the numbers 1 through 4 in the bus arbiter symbols. Note
that the EMIF arbitration is distributed so that only one bridge crossing is necessary for PMP accesses.
The effect is that PMP has 5th priority to the EMIF but lower latency.
A bus bridge is needed between masters and targets which run at different clock rates. The bus bridge
contains a small FIFO to allow the bridge to accept an incoming (burst) access at one clock rate and pass
it through the bridge to a target running at a different rate. Table 2-6 lists the FIFO properties of the four
bridges (BR1, BR2, BR3, and BR4) in Figure 2-4.
Table 2-6. Bus Bridges
LABEL
BR1
BRIDGE DESCRIPTION
DMP Bridge to peripherals, dMAX, EMIF
dMAX, UHPI to ROM/RAM (CSP)
PMP to EMIF
MASTER CLOCK
SYSCLK1
TARGET CLOCK
SYSCLK2
BR2
SYSCLK2
SYSCLK1
BR3
SYSCLK1
SYSCLK3
BR4
CPU, UHPI, and dMAX to EMIF
SYSCLK2
SYSCLK3
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Figure 2-5 shows the bit layout of the device-level bridge control register (CFGBRIDGE) and Table 2-7
contains a description of the bits.
31
15
16
Reserved
1
0
Reserved
CSPRST
R/W, 1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 2-5. CFGBRIDGE Register Bit Layout (0x4000 0024)
Table 2-7. CFGBRIDGE Register Bit Field Description (0x4000 0024)
BIT NO.
31:1
0
NAME
Reserved
CSPRST
RESET VALUE
READ WRITE
N/A
DESCRIPTION
N/A
1
Reads are indeterminate. Only 0s should be written to these bits.
R/W
Resets the CSP Bridge (BR2 in Figure 2-4).
1 = Bridge Reset Asserted
0 = Bridge Reset Released
CAUTION
The CSPRST bit must be asserted after any change to the PLL that affects SYSCLK1
and SYSCLK2 and must be released before any accesses to the CSP bridge occur from
either the dMAX or the UHPI.
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2.7 Memory Map Summary
A high-level memory map of the C6727B DSP appears in Table 2-8. The base address of each region is
listed. Any address past the end address must not be read or written. The table also lists whether the
regions are word-addressable or byte- and word-addressable.
Table 2-8. C6727B Memory Map
DESCRIPTION
Internal ROM Page 0 (256K Bytes)
Internal ROM Page 1 (128K Bytes)
Internal RAM Page 0 (256K Bytes)
Memory and Cache Control Registers
Emulation Control Registers (Do Not Access)
Device Configuration Registers
PLL Control Registers
BASE ADDRESS
0x0000 0000
0x0004 0000
0x1000 0000
0x2000 0000
0x3000 0000
0x4000 0000
0x4100 0000
0x4200 0000
0x4300 0000
0x4400 0000
0x4500 0000
0x4600 0000
0x4700 0000
0x4800 0000
0x4900 0000
0x4A00 0000
0x5400 0000
0x5500 0000
0x5600 0000
0x6000 0000
0x6100 8000
0x6100 8080
0x6100 80A0
0x6200 8000
0x6200 8080
0x6200 80A0
0x8000 0000
0x9000 0000
0xF000 0000
END ADDRESS
0x0003 FFFF
0x0005 FFFF
0x1003 FFFF
0x2000 001F
0x3FFF FFFF
0x4000 0083
0x4100 015F
0x4200 00A3
0x4300 0043
0x4400 02BF
0x4500 02BF
0x4600 02BF
0x4700 007F
0x4800 007F
0x4900 007F
0x4A00 007F
0x54FF FFFF
0x55FF FFFF
0x56FF FFFF
0x6000 008F
0x6100 807F
0x6100 809F
0x6100 81FF
0x6200 807F
0x6200 809F
0x6200 81FF
0x8FFF FFFF
0x9FFF FFFF
0xF000 00BF
BYTE- OR WORD-ADDRESSABLE
Byte and Word
Byte and Word
Byte and Word
Word Only
Word Only
Word Only
Word Only
Real-time Interrupt (RTI) Control Registers
Universal Host-Port Interface (UHPI) Registers
McASP0 Control Registers
Word Only
Word Only
Word Only
McASP1 Control Registers
Word Only
McASP2 Control Registers
Word Only
SPI0 Control Registers
Word Only
SPI1 Control Registers
Word Only
I2C0 Control Registers
Word Only
I2C1 Control Registers
Word Only
McASP0 DMA Port (any address in this range)
McASP1 DMA Port (any address in this range)
McASP2 DMA Port (any address in this range)
dMAX Control Registers
Word Only
Word Only
Word Only
Word Only
MAX0 (HiMAX) Event Entry Table
Reserved
Byte and Word
MAX0 (HiMAX) Transfer Entry Table
MAX1 (LoMAX) Event Entry Table
Reserved
Byte and Word
Byte and Word
MAX1 (LoMAX) Transfer Entry Table
External SDRAM space on EMIF
External Asynchronous / Flash space on EMIF
EMIF Control Registers
Byte and Word
Byte and Word
Byte and Word
Word Only(1)
(1) The upper byte of the EMIF’s SDRAM Configuration Register (SDCR[31:24]) is byte-addressable to support placing the EMIF into the
Self-Refresh State without triggering the SDRAM Initialization Sequence.
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2.8 Boot Modes
The C6727B DSP supports only one hardware bootmode option, this is to boot from the internal ROM
starting at address 0x0000 0000. Other bootmode options are implemented by a software bootloader
stored in ROM. The software bootloader uses the CFGPIN0 and CFGPIN1 registers, which capture the
state of various device pins at reset, to determine which mode to enter. Note that in practice, only a few
pins are used by the software.
CAUTION
Only an externally applied RESET causes the CFGPIN0 and CFGPIN1 registers to
recapture their associated pin values. Neither an emulator reset nor a RTI reset causes
these registers to update.
The ROM bootmodes include:
•
•
•
•
Parallel Flash on EM_CS[2]
SPI0 or I2C1 master mode from serial EEPROM
SPI0 or I2C1 slave mode from external MCU
UHPI from an external MCU
Table 2-9 describes the required boot pin settings at device reset for each bootmode.
Table 2-9. Required Boot Pin Settings at Device Reset
BOOT MODE
UHPI_HCS
SPI0_SOMI
SPI0_SIMO
SPI0_CLK
UHPI
0
1
1
1
1
1
BYTEAD(1)
FULL(1)
NMUX(1)
Parallel Flash
SPI0 Master
SPI0 Slave
I2C1 Master
I2C1 Slave
0
0
0
1
1
1
0
1
0
1
0
1
1
1
1
(1) When UHPI_HCS is 0, the state of the SPI0_SOMI, SPI0_SIMO, and SPI0_CLK pins is copied into the specified bits in the CFGHPI
register described in Table 4-14.
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Figure 2-6 shows the bit layout of the CFGPIN0 register and Table 2-10 contains a description of the bits.
31
8
Reserved
7
6
5
4
3
2
1
0
PINCAP7
PINCAP6
PINCAP5
PINCAP4
PINCAP3
PINCAP2
PINCAP1
PINCAP0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 2-6. CFGPIN0 Register Bit Layout (0x4000 0000)
Table 2-10. CFGPIN0 Register Bit Field Description (0x4000 0000)
BIT NO.
NAME
DESCRIPTION
31:8
7
Reserved
PINCAP7
PINCAP6
PINCAP5
PINCAP4
PINCAP3
PINCAP2
PINCAP1
PINCAP0
Reads are indeterminate. Only 0s should be written to these bits.
SPI0_SOMI/I2C0_SDA pin state captured on rising edge of RESET pin.
SPI0_SIMO pin state captured on rising edge of RESET pin.
6
5
SPI0_CLK/I2C0_SCL pin state captured on rising edge of RESET pin.
SPI0_SCS/I2C1_SCL pin state captured on rising edge of RESET pin.
SPI0_ENA/I2C1_SDA pin state captured on rising edge of RESET pin.
AXR0[8]/AXR1[5]/SPI1_SOMI pin state captured on rising edge of RESET pin.
AXR0[9]/AXR1[4]/SPI1_SIMO pin state captured on rising edge of RESET pin.
AXR0[7]/SPI1_CLK pin state captured on rising edge of RESET pin.
4
3
2
1
0
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Figure 2-7 shows the bit layout of the CFGPIN1 register and Table 2-11 contains a description of the bits.
31
8
Reserved
7
6
5
4
3
2
1
0
PINCAP15
PINCAP14
PINCAP13
PINCAP12
PINCAP11
PINCAP10
PINCAP9
PINCAP8
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 2-7. CFGPIN1 Register Bit Layout (0x4000 0004)
Table 2-11. CFGPIN1 Register Bit Field Description (0x4000 0004)
BIT NO.
NAME
DESCRIPTION
Reads are indeterminate. Only 0s should be written to these bits.
AXR0[5]/SPI1_SCS pin state captured on rising edge of RESET pin.
AXR0[6]/SPI1_ENA pin state captured on rising edge of RESET pin.
UHPI_HCS pin state captured on rising edge of RESET pin.
UHPI_HD[0] pin state captured on rising edge of RESET pin.
EM_D[16]/UHPI_HA[0] pin state captured on rising edge of RESET pin.
AFSX0 pin state captured on rising edge of RESET pin.
31:8
7
Reserved
PINCAP15
PINCAP14
PINCAP13
PINCAP12
PINCAP11
PINCAP10
PINCAP9
PINCAP8
6
5
4
3
2
1
AFSR0 pin state captured on rising edge of RESET pin.
0
AXR0[0] pin state captured on rising edge of RESET pin.
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2.9 Pin Assignments
2.9.1 Pin Maps
Figure 2-8 shows the pin assignments on the 256-pin HFH package.
VSS
NC
193
194
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
VSS
NC
ACLKR2
DVDD
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
EM_D[26]/UHPI_HA[10]
DVDD
SPI0_SOMI/I2C0_SDA
AFSR2
EM_A[12]
VSS
VSS
SPI0_SIMO
AXR0[0]
EM_CLK
EM_CKE
CVDD
CVDD
AXR0[1]
AXR0[2]
EM_WE_DQM1
VSS
EM_D[10]
EM_D[8]
VSS
ACLKX2
AXR0[3]
DVDD
EM_D[9]
DVDD
NC
AXR0[4]
VSS
EM_D[13]
EM_D[11]
CVDD
VSS
AFSX2
EM_D[12]
VSS
AXR0[5]/SPI1_SCS
CVDD
EM_D[27]/UHPI_HA[11]
EM_D[15]
DVDD
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
AMUTE2/HINT
AXR0[6]/SPI1_ENA
VSS
AXR0[7]/SPI1_CLK
UHPI_HCNTL[1]
DVDD
EM_D[28]/UHPI_HA[12]
VSS
EM_D[14]
VSS
UHPI_HCNTL[0]
EM_D[29]/UHPI_HA[13]
DVDD
AXR0[9]/AXR1[4]/SPI1_SIMO
VSS
98
EM_D[30]/UHPI_HA[14]
VSS
UHPI_HAS
97
AXR0[8]/AXR1[5]/SPI1_SOMI
96
EM_D[0]
VSS
UHPI_HRW
95
EM_D[1]
94
CVDD
AXR0[10]/AXR1[3]
AXR0[11]/AXR1[2]
93
EM_D[16]/UHPI_HA[0]
VSS
92
DVDD
UHPI_HCS
91
EM_D[3]
90
VSS
UHPI_HDS[1]
89
EM_D[17]/UHPI_HA[1]
EM_D[31]/UHPI_HA[15]
DVDD
VSS
AXR0[13]/AXR1[0]
88
87
UHPI_HDS[2]
CVDD
AXR0[12]/AXR1[1]
86
235
236
237
EM_D[2]
85
EM_D[4]
84
VSS
AXR0[14]/AXR2[1]
VSS
83
238
239
EM_WE_DQM0
CVDD
82
UHPI_HRDY
AXR0[15]/AXR2[0]
DVDD
81
EM_D[21]/UHPI_HA[5]
EM_D[18]/UHPI_HA[2]
VSS
240
241
242
243
80
79
ACLKR0
78
EM_D[5]
UHPI_HBE[0]
77
DVDD
244
245
246
247
248
249
250
251
252
76
VSS
UHPI_HBE[1]
EM_D[19]/UHPI_HA[3]
EM_D[6]
75
74
VSS
AFSR0
CVDD
ACLKX0
73
EM_D[7]
72
CVDD
UHPI_HBE[2]
71
EM_D[20]/UHPI_HA[4]
EM_WE
VSS
UHPI_HBE[3]
70
69
VSS
68
AHCLKR0/AHCLKR1
253
EM_CAS
67
DVDD
DVDD
AFSX0
254
255
66
EM_D[22]/UHPI_HA[6]
VSS
65
VSS
256
Figure 2-8. 256-Pin Ceramic Quad Flatpack (HFH Suffix)—Top View
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2.9.2 Terminal Functions
Table 2-12, the Terminal Functions table, identifies the external signal names, the associated pin/ball
numbers along with the mechanical package designator, the pin type (I, O, IO, OZ, or PWR), whether the
pin/ball has any internal pullup/pulldown resistors, whether the pin/ball is configurable as an IO in GPIO
mode, and a functional pin description.
Table 2-12. Terminal Functions
SIGNAL NAME
HFH
TYPE(1)
PULL(2)
GPIO(3)
DESCRIPTION
External Memory Interface (EMIF) Address and Control
EM_A[0]
165
158
159
155
150
149
142
147
145
137
164
134
124
172
169
175
178
68
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
-
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
EM_A[1]
-
EM_A[2]
-
EM_A[3]
-
EM_A[4]
-
EM_A[5]
-
EM_A[6]
-
EMIF Address Bus
EM_A[7]
-
EM_A[8]
-
EM_A[9]
-
EM_A[10]
EM_A[11]
EM_A[12]
EM_BA[0]
EM_BA[1]
EM_CS[0]
EM_CS[2]
EM_CAS
EM_RAS
EM_WE
-
-
IPD
-
SDRAM Bank Address and Asynchronous Memory Low-
Order Address
-
-
SDRAM Chip Select
-
Asynchronous Memory Chip Select
SDRAM Column Address Strobe
SDRAM Row Address Strobe
-
174
70
-
-
SDRAM/Asynchronous Write Enable
SDRAM Clock Enable
EM_CKE
EM_CLK
121
122
83
-
-
EMIF Output Clock
EM_WE_DQM0
EM_WE_DQM1
EM_WE_DQM2
EM_WE_DQM3
EM_OE
-
Write Enable or Byte Enable for EM_D[7:0]
Write Enable or Byte Enable for EM_D[15:8]
Write Enable or Byte Enable for EM_D[23:16]
Write Enable or Byte Enable for EM_D[31:24]
SDRAM/Asynchronous Output Enable
Asynchronous Memory Read/not Write
119
139
133
186
183
-
IPU
IPU
-
EM_RW
-
Asynchronous Wait Input (Programmable Polarity) or
Interrupt (NAND)
EM_WAIT
190
I
IPU
N
(1) TYPE column refers to pin direction in functional mode. If a pin has more than one function with different directions, the functions are
separated with a slash (/).
(2) PULL column:
IPD = Internal Pulldown resistor
IPU = Internal Pullup resistor
(3) If the GPIO column is 'Y', then in GPIO mode, the pin is configurable as an IO unless otherwise marked.
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Table 2-12. Terminal Functions (continued)
SIGNAL NAME
HFH
TYPE(1)
PULL(2)
GPIO(3)
DESCRIPTION
External Memory Interface (EMIF) Data Bus / Universal Host-Port Interface (UHPI) Address Bus Option
EM_D[0]
96
95
IO
IO
-
-
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
EM_D[1]
EM_D[2]
86
IO
-
EM_D[3]
91
IO
-
EM_D[4]
85
IO
-
EM_D[5]
78
IO
-
EM_D[6]
75
IO
-
EM_D[7]
73
IO
-
EMIF Data Bus [Lower 16 Bits]
EM_D[8]
116
114
117
111
109
112
102
106
93
IO
-
EM_D[9]
IO
-
EM_D[10]
IO
-
EM_D[11]
IO
-
EM_D[12]
IO
-
EM_D[13]
IO
-
EM_D[14]
IO
-
EM_D[15]
IO
-
EM_D[16]/UHPI_HA[0]
EM_D[17]/UHPI_HA[1]
EM_D[18]/UHPI_HA[2]
EM_D[19]/UHPI_HA[3]
EM_D[20]/UHPI_HA[4]
EM_D[21]/UHPI_HA[5]
EM_D[22]/UHPI_HA[6]
EM_D[23]/UHPI_HA[7]
EM_D[24]/UHPI_HA[8]
EM_D[25]/UHPI_HA[9]
EM_D[26]/UHPI_HA[10]
EM_D[27]/UHPI_HA[11]
EM_D[28]/UHPI_HA[12]
EM_D[29]/UHPI_HA[13]
EM_D[30]/UHPI_HA[14]
EM_D[31]/UHPI_HA[15]
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IO/I
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
89
80
76
71
81
66
63
EMIF Data Bus [Upper 16 Bits (IO)] or UHPI Address Input
(I)
131
135
126
107
104
100
98
88
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Table 2-12. Terminal Functions (continued)
SIGNAL NAME
HFH
TYPE(1)
PULL(2)
GPIO(3)
DESCRIPTION
Universal Host-Port Interface (UHPI) Data and Control
UHPI_HD[0]
UHPI_HD[1]
UHPI_HD[2]
UHPI_HD[3]
UHPI_HD[4]
UHPI_HD[5]
UHPI_HD[6]
UHPI_HD[7]
UHPI_HD[8]
UHPI_HD[9]
UHPI_HD[10]
UHPI_HD[11]
UHPI_HD[12]
UHPI_HD[13]
UHPI_HD[14]
UHPI_HD[15]
UHPI_HD[16]/HHWIL
UHPI_HD[17]
UHPI_HD[18]
UHPI_HD[19]
UHPI_HD[20]
UHPI_HD[21]
UHPI_HD[22]
UHPI_HD[23]
UHPI_HD[24]
UHPI_HD[25]
UHPI_HD[26]
UHPI_HD[27]
UHPI_HD[28]
UHPI_HD[29]
UHPI_HD[30]
UHPI_HD[31]
161
156
153
152
146
138
143
141
181
179
182
177
168
171
162
167
30
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO/I
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
IPD
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
UHPI Data Bus [Lower 16 Bits]
29
27
18
21
UHPI Data Bus [Upper 16 Bits (IO)] in the following modes:
12
•
•
Fullword Multiplexed Address and Data
Fullword Non-Multiplexed
11
3
UHPI_HHWIL (I) on pin UHPI_HD[16]/HHWIL and GPIO on
other pins in the following mode:
57
•
Half-word Multiplexed Address and Data
61
In this mode, UHPI_HHWIL indicates whether the high or
low half-word is being addressed.
60
49
58
43
46
32
Universal Host-Port Interface (UHPI) Control
UHPI_HBE[0]
UHPI_HBE[1]
UHPI_HBE[2]
UHPI_HBE[3]
UHPI_HCNTL[0]
UHPI_HCNTL[1]
244
246
250
252
221
219
I
I
I
I
I
I
IPD
IPD
IPD
IPD
IPD
IPD
Y
Y
Y
Y
Y
Y
UHPI Byte Enable for UHPI_HD[7:0]
UHPI Byte Enable for UHPI_HD[15:8]
UHPI Byte Enable for UHPI_HD[23:16]
UHPI Byte Enable for UHPI_HD[31:24]
UHPI Control Inputs Select Access Mode
UHPI Host Address Strobe for Hosts with Multiplexed
Address/Data bus
UHPI_HAS
224
I
IPD
Y
UHPI_HRW
UHPI_HDS[1]
UHPI_HDS[2]
UHPI_HCS
227
232
235
231
240
I
I
IPD
IPU
IPU
IPU
IPD
Y
Y
Y
Y
Y
UHPI Read/not Write Input
UHPI Select Signals which create the internal HSTROBE
active when:
I
(UHPI_HCS == '0') & (UHPI_HDS[1] != UHPI_HDS[2])
UHPI Ready Output
I
UHPI_HRDY
O
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Table 2-12. Terminal Functions (continued)
SIGNAL NAME
HFH
TYPE(1)
PULL(2)
GPIO(3)
DESCRIPTION
McASP0, McASP1, McASP2, and SPI1 Serial Ports
AHCLKR0/AHCLKR1
ACLKR0
253
243
247
2
IO
IO
IO
IO
IO
IO
O
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
McASP0 and McASP1 Receive Master Clock
McASP0 Receive Bit Clock
AFSR0
McASP0 Receive Frame Sync (L/R Clock)
McASP0 and McASP2 Transmit Master Clock
McASP0 Transmit Bit Clock
AHCLKX0/AHCLKX2
ACLKX0
249
255
5
AFSX0
McASP0 Transmit Frame Sync (L/R Clock)
McASP0 MUTE Output
AMUTE0
AXR0[0]
201
203
204
207
210
213
216
218
IO
IO
IO
IO
IO
IO
IO
IO
McASP0 Serial Data 0
AXR0[1]
McASP0 Serial Data 1
AXR0[2]
McASP0 Serial Data 2
AXR0[3]
McASP0 Serial Data 3
AXR0[4]
McASP0 Serial Data 4
AXR0[5]/SPI1_SCS
AXR0[6]/SPI1_ENA
AXR0[7]/SPI1_CLK
McASP0 Serial Data 5 or SPI1 Slave Chip Select
McASP0 Serial Data 6 or SPI1 Enable (Ready)
McASP0 Serial Data 7 or SPI1 Serial Clock
AXR0[8]/AXR1[5]/
SPI1_SOMI
McASP0 Serial Data 8 or McASP1 Serial Data 5 or SPI1
Data Pin Slave Out Master In
225
222
IO
IO
-
-
Y
Y
AXR0[9]/AXR1[4]/
SPI1_SIMO
McASP0 Serial Data 9 or McASP1 Serial Data 4 or SPI1
Data Pin Slave In Master Out
AXR0[10]/AXR1[3]
AXR0[11]/AXR1[2]
AXR0[12]/AXR1[1]
AXR0[13]/AXR1[0]
AXR0[14]/AXR2[1]
AXR0[15]/AXR2[0]
ACLKR1
228
229
237
234
238
241
8
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
O
-
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
McASP0 Serial Data 10 or McASP1 Serial Data 3
McASP0 Serial Data 11 or McASP1 Serial Data 2
McASP0 Serial Data 12 or McASP1 Serial Data 1
McASP0 Serial Data 13 or McASP1 Serial Data 0
McASP0 Serial Data 14 or McASP2 Serial Data 1
McASP0 Serial Data 15 or McASP2 Serial Data 0
McASP1 Receive Bit Clock
-
-
-
-
-
-
AFSR1
17
-
McASP1 Receive Frame Sync (L/R Clock)
McASP1 Transmit Master Clock
AHCLKX1
6
-
ACLKX1
15
-
McASP1 Transmit Bit Clock
AFSX1
14
-
McASP1 Transmit Frame Sync (L/R Clock)
McASP1 MUTE Output
AMUTE1
9
-
AHCLKR2
191
195
198
206
212
215
IPD
IPD
IPD
IPD
IPD
IPD
McASP2 Receive Master Clock
ACLKR2
McASP2 Receive Bit Clock
AFSR2
McASP2 Receive Frame Sync (L/R Clock)
McASP2 Transmit Bit Clock
ACLKX2
AFSX2
McASP2 Transmit Frame Sync (L/R Clock)
McASP2 MUTE Output or UHPI Host Interrupt
AMUTE2/HINT
SPI0, I2C0, and I2C1 Serial Port Pins
SPI0_SOMI/I2C0_SDA
SPI0_SIMO
197
200
189
185
187
IO
IO
IO
IO
IO
-
-
-
-
-
Y
Y
Y
Y
Y
SPI0 Data Pin Slave Out Master In or I2C0 Serial Data
SPI0 Data Pin Slave In Master Out
SPI0_CLK/I2C0_SCL
SPI0_SCS/I2C1_SCL
SPI0_ENA/I2C1_SDA
SPI0 Serial Clock or I2C0 Serial Clock
SPI0 Slave Chip Select or I2C1 Serial Clock
SPI0 Enable (Ready) or I2C1 Serial Data
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Table 2-12. Terminal Functions (continued)
SIGNAL NAME
HFH
TYPE(1)
PULL(2)
GPIO(3)
DESCRIPTION
Clocks
OSCIN
37
39
42
40
26
48
I
-
-
-
-
-
-
N
N
N
N
N
N
Oscillator Input
OSCOUT
OSCVDD
OSCVSS
CLKIN
O
Oscillator Output
PWR
PWR
I
Oscillator CVDD tap point (for filter only)
Oscillator VSS tap point (for filter only)
Alternate clock input (3.3-V LVCMOS Input)
PLL 3.3-V Supply Input (requires external filter)
PLLHV
PWR
Device Reset
RESET
20
I
-
N
Device reset pin
Emulation/JTAG Port
TCK
55
34
52
54
36
45
51
I
I
IPU
N
Test Clock
TMS
IPU
IPU
IPU
IPD
IPU
IPU
N
Test Mode Select
Test Data In
TDI
I
N
TDO
OZ
I
N
Test Data Out
Test Reset
TRST
EMU[0]
EMU[1]
N
IO
IO
N
N
Emulation Pin 0
Emulation Pin 1
Power Pins
Core Supply (CVDD
)
10, 22, 44, 56, 72, 82, 94, 110, 120, 140, 154, 166, 180, 202, 214, 236, 248
4, 16, 28, 33, 38, 50, 62, 67, 77, 87, 99, 105, 115, 125, 132, 148, 157, 163, 173, 188, 196, 208, 220, 230,
242, 254
IO Supply (DVDD
)
1, 7, 13, 19, 23, 25, 31, 35, 41, 47, 53, 59, 64, 65, 69, 74, 79, 84, 90, 92, 97, 101, 103, 108, 113, 118, 123,
Ground (VSS
)
128, 129, 136, 144, 151, 160, 170, 176, 184, 192, 193, 199, 205, 211, 217, 223, 226, 233, 239, 245, 251,
256
No Connect (NC)
24, 127, 130, 194, 209
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2.10 Development
2.10.1 Development Support
TI offers an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of C6000™ DSP-based applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software ( DSP/BIOS™), which provides the basic run-time target
software needed to support any DSP application.
Hardware Development Tools:
Extended Development System ( XDS™) Emulator (supports C6000™ DSP multiprocessor system
debug) EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320C6000™ DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For
information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
2.10.2 Device Support
2.10.2.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (e.g., TMS320C6727BZDH275). Texas Instruments recommends two of three possible
prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX / TMDX) through fully qualified production
devices/tools (TMS / TMDS).
Device development evolutionary flow:
TMX
TMP
TMS
Experimental device that is not necessarily representative of the final device’s electrical
specifications
Final silicon die that conforms to the device’s electrical specifications but has not completed
quality and reliability verification
Fully-qualified production device
Support tool development evolutionary flow:
TMDX
Development support product that has not yet completed Texas Instruments internal
qualification testing
TMDS
Fully qualified development support product
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
“Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty applies.
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Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, HFH) and the temperature range. Figure 2-9 provides a legend for reading the
complete device name for any TMS320C6000™ DSP platform member.
For device part numbers and further ordering information for SM320C6727B, see the Texas Instruments
(TI) website at http://www.ti.com or contact your TI sales representative.
M
C 6727B HFH
SM 320
PREFIX
TEMPERATURE RANGE
SMX = Experimental device
M = -55°C to 125°C
W = -55°C to 115°C
SMJ =
QMLQ processing
SMV = QMLV processing
SM =
Commercial processing
PACKAGE TYPE
HFH = 256-pin ceramic quad flat pack
DEVICE FAMILY
320 = 320 DSP family
DEVICE
6727B DSP
TECHNOLOGY
C = CMOS
Figure 2-9. SM320C6727B DSP Device Nomenclature
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2.10.2.2 Documentation Support
Extensive documentation supports all TMS320™ DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data
manuals, such as this document, with design specifications; complete user's reference guides for all
devices and tools; technical briefs; development-support tools; on-line help; and hardware and software
applications. The following is a brief, descriptive list of support documentation specific to the C6727B DSP
devices:
SPRS277
C9230C100 SM320C6727B Floating-Point Digital Signal Processor ROM Data Manual.
Describes the features of the C9230C100 SM320C6727B digital signal processor ROM.
SPRZ232
TMS320C6727, TMS320C6727B, TMS320C6726, TMS320C6726B, TMS320C6722,
TMS320C6722B, TMS320C6720 Digital Signal Processors Silicon Errata. Describes the
known exceptions to the functional specifications for the TMS320C6727, TMS320C6727B,
TMS320C6726, TMS320C6726B, TMS320C6722, TMS320C6722B, and TMS320C6720
digital signal processors (DSPs).
SPRU723
SPRU877
SPRU795
SM320C6727B DSP Peripherals Overview Reference Guide. This document provides an
overview and briefly describes the peripherals available on the SM320C6727B digital signal
processors (DSPs) of the TMS320C6000 DSP platform.
SM320C6727B DSP Inter-Integrated Circuit (I2C) Module Reference Guide. This
document describes the inter-integrated circuit (I2C) module in the SM320C6727B digital
signal processors (DSPs) of the TMS320C6000 DSP platform.
SM320C6727B DSP Dual Data Movement Accelerator (dMAX) Reference Guide. This
document provides an overview and describes the common operation of the data movement
accelerator (dMAX) controller in the SM320C6727B digital signal processors (DSPs) of the
TMS320C6000 DSP platform. This document also describes operations and registers unique
to the dMAX controller.
SPRAA78 TMS320C6713 to SM320C6727B Migration. This document describes the issues related to
migrating from the TMS320C6713 to SM320C6727B digital signal processor (DSP).
SPRU711
SPRU718
SM320C6727B DSP External Memory Interface (EMIF) User's Guide. This document
describes the operation of the external memory interface (EMIF) in the SM320C6727B digital
signal processors (DSPs) of the TMS320C6000 DSP platform.
SM320C6727B DSP Serial Peripheral Interface (SPI) Reference Guide. This reference
guide provides the specifications for a 16-bit configurable, synchronous serial peripheral
interface. The SPI is
a programmable-length shift register, used for high speed
communication between external peripherals or other DSPs.
SPRU719
SPRU878
SPRU879
SM320C6727B DSP Universal Host Port Interface (UHPI) Reference Guide. This
document provides an overview and describes the common operation of the universal host
port interface (UHPI).
SM320C6727B DSP Multichannel Audio Serial Port (McASP) Reference Guide. This
document describes the multichannel audio serial port (McASP) in the SM320C6727B digital
signal processors (DSPs) of the TMS320C6000 DSP platform.
SM320C6727B DSP Software-Programmable Phase-Locked Loop (PLL) Controller
Reference Guide. This document describes the operation of the software-programmable
phase-locked loop (PLL) controller in the SM320C6727B digital signal processors (DSPs) of
the TMS320C6000 DSP platform.
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SPRU733
TMS320C67x/C67x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C67x and TMS320C67x+
digital signal processors (DSPs) of the TMS320C6000 DSP platform. The C67x/C67x+ DSP
generation comprises floating-point devices in the C6000 DSP platform. The C67x+ DSP is
an enhancement of the C67x DSP with added functionality and an expanded instruction set.
SPRAA69 Using the SM320C6727B Bootloader Application Report. This document describes the
design details about the SM320C6727B bootloader. This document also addresses parallel
flash and HPI boot to the extent relevant.
SPRU301
TMS320C6000 Code Composer Studio Tutorial. This tutorial introduces you to some of
the key features of Code Composer Studio. Code Composer Studio extends the capabilities
of the Code Composer Integrated Development Environment (IDE) to include full awareness
of the DSP target by the host and real-time analysis tools. This tutorial assumes that you
have Code Composer Studio, which includes the TMS320C6000 code generation tools along
with the APIs and plug-ins for both DSP/BIOS and RTDX. This manual also assumes that
you have installed a target board in your PC containing the DSP device.
SPRU198
TMS320C6000 Programmer's Guide. Reference for programming the TMS320C6000 digital
signal processors (DSPs). Before you use this manual, you should install your code
generation and debugging tools. Includes a brief description of the C6000 DSP architecture
and code development flow, includes C code examples and discusses optimization methods
for the C code, describes the structure of assembly code and includes examples and
discusses optimizations for the assembly code, and describes programming considerations
for the C64x DSP.
SPRU186
SPRU187
TMS320C6000 Assembly Language Tools v6.0 Beta User's Guide. Describes the
assembly language tools (assembler, linker, and other tools used to develop assembly
language code), assembler directives, macros, common object file format, and symbolic
debugging directives for the TMS320C6000 platform of devices (including the C64x+ and
C67x+ generations). NOTE: The enhancements to tools release v5.3 to support the
C6727B devices are documented in the tools v6.0 documentation.
TMS320C6000 Optimizing Compiler v6.0 Beta User's Guide. Describes the
TMS320C6000 C compiler and the assembly optimizer. This C compiler accepts ANSI
standard
C source code and produces assembly language source code for the
TMS320C6000 platform of devices (including the C64x+ and C67x+ generations). The
assembly optimizer helps you optimize your assembly code. NOTE: The enhancements to
tools release v5.3 to support the C6727B devices are documented in the tools v6.0
documentation.
SPRA839
Using IBIS Models for Timing Analysis. Describes how to properly use IBIS models to
attain accurate timing analysis for a given system.
The tools support documentation is electronically available within the Code Composer Studio™ Integrated
Development Environment (IDE). For a complete listing of C6000™ DSP latest documentation, visit the
Texas Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL).
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3 Device Configurations
3.1 Device Configuration Registers
The C6727B DSP includes several device-level configuration registers, which are listed in Table 3-1.
These registers need to be programmed as part of the device initialization procedure. See Section 3.2.
Table 3-1. Device-Level Configuration Registers
REGISTER NAME
CFGPIN0
BYTE ADDRESS
0x4000 0000
DESCRIPTION
DEFINED
Table 2-10
Captures values of eight pins on rising edge of RESET pin.
Captures values of eight pins on rising edge of RESET pin.
Controls enable of UHPI and selection of its operating mode.
CFGPIN1
0x4000 0004
Table 2-11
Table 4-14
Table 4-15
CFGHPI
0x4000 0008
CFGHPIAMSB
0x4000 000C
Controls upper byte of UHPI address into C6727B address space in
Non-Multiplexed Mode or if explicitly enabled for security purposes.
CFGHPIAUMB
CFGRTI
0x4000 0010
0x4000 0014
Controls upper middle byte of UHPI address into C6727B address
space in Non-Multiplexed Mode or if explicitly enabled for security
purposes.
Table 4-16
Table 4-39
Selects the sources for the RTI Input Captures from among the six
McASP DMA events.
CFGMCASP0
CFGMCASP1
CFGMCASP2
CFGBRIDGE
0x4000 0018
0x4000 001C
0x4000 0020
0x4000 0024
Selects the peripheral pin to be used as AMUTEIN0.
Selects the peripheral pin to be used as AMUTEIN1.
Selects the peripheral pin to be used as AMUTEIN2.
Table 4-21
Table 4-22
Table 4-23
Controls reset of the bridge BR2 in Figure 2-4. This bridge must be reset Table 2-7
explicitly after any change to the PLL controller affecting SYSCLK1 and
SYSCLK2 and before the dMAX or UHPI accesses the CPU Slave Port
(CSP).
3.2 Peripheral Pin Multiplexing Options
This section describes the options for configuring peripherals which share pins on the C6727B DSP.
Table 3-2 lists the options for configuring the SPI0, I2C0, and I2C1 peripheral pins.
Table 3-2. Options for Configuring SPI0, I2C0, and I2C1
CONFIGURATION
OPTION 1
OPTION 2
OPTION 3
PERIPHERAL
PINS
SPI0
3-, 4,- or 5-pin mode 3-pin mode
disabled
enabled
enabled
I2C0_SDA
I2C0
disabled
disabled
I2C1
disabled
enabled
SPI0_SOMI/I2C0_SDA
SPI0_SIMO
SPI0_SOMI
SPI0_SIMO
SPI0_CLK
SPI0_SCS
SPI0_ENA
SPI0_SOMI
SPI0_SIMO
SPI0_CLK
I2C1_SCL
I2C1_SDA
GPIO through SPI0_SIMO pin control
SPI0_CLK/I2C0_SCL
SPI0_SCS/I2C1_SCL
SPI0_ENA/I2C1_SDA
I2C0_SCL
I2C1_SCL
I2C1_SDA
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Table 3-3 lists the options for configuring the SPI1, McASP0, and McASP1 pins. Note that there are
additional finer grain options when selecting which McASP controls the particular AXR serial data pins but
these options are not listed here and can be made on a pin by pin basis.
Table 3-3. Options for Configuring SPI1, McASP0, and McASP1 Data Pins
CONFIGURATION
OPTION 1
5-pin mode
11
OPTION 2
4-pin mode
12
OPTION 3
4-pin mode
12
OPTION 4
3-pin mode
13
OPTION 5
disabled
PERIPHERAL
SPI1
McASP0
16
(max data pins)
McASP1
4
4
4
4
6
(max data pins)
PINS
AXR0[5]/
SPI1_SCS
SPI1_SCS
SPI1_ENA
SPI1_CLK
SPI1_SOMI
SPI1_SIMO
SPI1_SCS
AXR0[6]
SPI1_CLK
SPI1_SOMI
SPI1_SIMO
AXR0[5]
SPI1_ENA
SPI1_CLK
SPI1_SOMI
SPI1_SIMO
AXR0[5]
AXR0[6]
SPI1_CLK
SPI1_SOMI
SPI1_SIMO
AXR0[5]
AXR0[6]/
SPI1_ENA
AXR0[6]
AXR0[7]/
SPI1_CLK
AXR0[7]
AXR0[8]/AXR1[5]/
SPI1_SOMI
AXR0[8] or AXR1[5]
AXR0[9] or AXR1[4]
AXR0[9]/AXR1[4]/
SPI1_SIMO
Table 3-4 lists the options for configuring the shared EMIF and UHPI pins.
Table 3-4. Options for Configuring EMIF and UHPI (C6727B Only)
CONFIGURATION
OPTION 1
OPTION 2
PERIPHERAL
PINS
UHPI
EMIF
Multiplexed Address/Data Mode, Fullword, or Non-Multiplexed Address/Data Mode
Half-Word
Fullword
32-bit EMIF Data
EM_D[31:16]
16-bit EMIF Data
UHPI_HA[15:0]
EM_D[31:16]/
UHPI_HA[15:0]
3.3 Peripheral Pin Multiplexing Control
While Section 3.2 describes at a high level the most common pin multiplexing options, the control of pin
multiplexing is largely determined on an individual pin-by-pin basis. Typically, each peripheral that shares
a particular pin has internal control registers to determine the pin function and whether it is an input or an
output.
The C6727B device determines whether a particular pin is an input or output based upon the following
rules:
•
The pin will be configured as an output if it is configured as an output in any of the peripherals sharing
the pin.
•
It is recommended that only one peripheral configure a given pin as an output. If more than one
peripheral does configure a particular pin as an output, then the output value is controlled by the
peripheral with highest priority for that pin. The priorities for each pin are given in Table 3-5.
•
The value input on the pin is passed to all peripherals sharing the pin for input simultaneously.
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Table 3-5. Priority of Control of Data Output on Multiplexed Pins
PIN
FIRST PRIORITY
SPI0_SOMI
SECOND PRIORITY
I2C0_SDA
THIRD PRIORITY
SPI0_SOMI/I2C0_SDA
SPI0_CLK/I2C0_SCL
SPI0_SCS/I2C1_SCL
SPI0_ENA/I2C1_SDA
AXR0[5]/SPI1_SCS
AXR0[6]/SPI1_ENA
AXR0[7]/SPI1_CLK
AXR0[8]/AXR1[5]/SPI1_SOMI
AXR0[9]/AXR1[4]/SPI1_SIMO
AXR0[10]/AXR1[3]
SPI0_CLK
SPI0_SCS
SPI0_ENA
AXR0[5]
I2C0_SCL
I2C1_SCL
I2C1_SDA
SPI1_SCS
SPI1_ENA
SPI1_CLK
AXR1[5]
AXR0[6]
AXR0[7]
AXR0[8]
SPI1_SOMI
SPI1_SIMO
AXR0[9]
AXR1[4]
AXR0[10]
AXR0[11]
AXR0[12]
AXR0[13]
AXR0[14]
AXR0[15]
AHCLKR0
AHCLKX0
AMUTE2
HD[16]
AXR1[3]
AXR0[11]/AXR1[2]
AXR1[2]
AXR0[12]/AXR1[1]
AXR1[1]
AXR0[13]/AXR1[0]
AXR1[0]
AXR0[14]/AXR2[1]
AXR2[1]
AXR0[15]/AXR2[0]
AXR2[0]
AHCLKR0/AHCLKR1
AHCLKX0/AHCLKX2
AMUTE2/HINT
AHCLKR1
AHCLKX2
HINT
HD[16]/HHWIL
HHWIL
EM_D[31:16]/UHPI_HA[15:0](1)
EM_D[31:16] (Disabled if
CFGHPI.NMUX=1)
UHPI_HA[15:0] (Input Only)
(1) When using the UHPI in non-multiplexed mode, ensure EM_D[31:16] are configured as inputs so that these pins may be used as
UHPI_HA[15:0]. To ensure this, you must set the CFGHPI.NMUX bit to a '1' before the EMIF SDRAM initialization completes;
otherwise, a drive conflict will occur. [The EMIF bus parking function drives the data bus in between accesses.]
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4 Peripheral and Electrical Specifications
4.1 Electrical Specifications
This section provides the absolute maximum ratings and the recommended operating conditions for the
SM320C6727B DSP.
All electrical and switching characteristics in this data manual are valid over the recommended operating
conditions unless otherwise specified.
4.2 Absolute Maximum Ratings(1) (2)
Over Operating Case Temperature Range (Unless Otherwise Noted)
UNIT
(3)
Supply voltage range, CVDD, OSCVDD
Supply voltage range, DVDD , PLLHV
Input Voltage Range
–0.3 to 1.8
–0.3 to 4
V
V
All pins except OSCIN
OSCIN pin
–0.3 to DVDD + 0.5
–0.3 to CVDD + 0.5
–0.3 to DVDD + 0.5
–0.3 to CVDD + 0.5
±20
V
V
Output Voltage Range
All pins except OSCOUT
OSCOUT pin
Clamp Current
mA
°C
Operating case temperature range, TC
Storage temperature range, Tstg
–55 to 125
–65 to 150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with referenced to VSS unless otherwise specified.
(3) If OSCVDD and OSCVSS pins are used as filter pins for reduced oscillator jitter, they should not be connected to CVDD and VSS
externally.
1000000.00
100000.00
`
10000.00
1000.00
80
90
100
110
120
130
140
150
160
Continuous TJ (°C)
(1) See datasheet for absolute maximum and minimum recommended operating conditions.
Figure 4-1. SM320C6727B EM Operating Life Derating Chart
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4.3 Recommended Operating Conditions(1)
MIN
1.14
3.13
–55
NOM
1.2
MAX UNIT
CVDD
DVDD
TC
Core Supply Voltage
1.32
3.47
125
V
V
I/O Supply Voltage
3.3
Operating Case Temperature Range
°C
(1) All voltage values are with referenced to VSS unless otherwise specified.
4.4 Electrical Characteristics
Over Operating Case Temperature Range (Unless Otherwise Noted)
PARAMETER
High Level Output Voltage
Low Level Output Voltage
High-Level Output Current
Low-Level Output Current
High-Level Input Voltage
Low-Level Input Voltage
Input Hysterisis
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VOH
VOL
IOH
IO = –100 µA
IO = 100 µA
DVDD – 0.2
0.2
–8
V
VO = 0.78 x DVDD
VO = 0.22 x DVDD
mA
mA
V
IOL
8
VIH
2
0
DVDD
0.8
VIL
V
VHYS
0.13 x DVDD
V
Pins without pullup or pulldown
±10
–170
170
II, IOZ
Input Current and Off State Output Current Pins with internal pullup
Pins with internal pulldown
–40
40
µA
ttr
Input Transition Time
Input Capacitance(1)
Output Capacitance(1)
CVDD Supply(2)
25
ns
pF
pF
CI
10
10
CO
IDD2V
CVDD = 1.2 V,
CPU clock = 250 MHz
800
76
mA
mA
IDD3V
DVDD Supply(2)
DVDD = 3.3 V,
32-bit EMIF speed = 100 MHz
(1) Tested at initial qualification or major change only.
(2) Assumes the following conditions: 25°C case temperature; 60% CPU utilization; EMIF at 50% utilization (100 MHz), 50% writes, 50% bit
switching; two 10-MHz SPI at 100% utilization, 50% bit switching.
The actual current draw is highly application-dependent.
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4.5 Parameter Information
4.5.1 Parameter Information Device-Specific Information
Tester Pin Electronics
Data Sheet Timing Reference Point
Output
Under
Test
42 Ω
3.5 nH
Transmission Line
Z0 = 50 Ω
(see note)
Device Pin
(see note)
4.0 pF
1.85 pF
A. The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its
transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to
produce the desired transmission line effect. The transmission line is intended as a load only. It is not neccessary to
add or subtract the transmission line delay (2 ns or longer) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the
device pin.
Figure 4-2. Test Load Circuit for AC Timing Measurements
4.5.1.1 Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both "0" and "1" logic levels.
V
ref
= 1.5 V
Figure 4-3. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,
VOL MAX and VOH MIN for output clocks.
V
ref
= V MIN (or V MIN)
IH OH
V
ref
= V MAX (or V MAX)
IL OL
Figure 4-4. Rise and Fall Transition Time Voltage Reference Levels
4.5.1.2 Signal Transition Rates
All timings are tested with an input edge rate of 4 Volts per nanosecond (4 V/ns).
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4.6 Timing Parameter Symbology
Timing parameter symbols used in the timing requirements and switching characteristics tables are
created in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and
other related terminology have been abbreviated as follows:
Lowercase subscripts and their meanings:
Letters and symbols and their meanings:
a
access time
H
L
High
c
cycle time (period)
delay time
Low
d
V
Z
Valid
dis
en
f
disable time
High impedance
enable time
fall time
h
hold time
r
rise time
su
t
setup time
transition time
valid time
v
w
X
pulse duration (width)
Unknown, changing, or don't care level
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4.7 Power Supplies
For more information regarding TI’s power management products and suggested devices to power TI
DSPs, visit www.ti.com/dsppower.
4.7.1 Power-Supply Sequencing
This device does not require specific power-up sequencing between the DVDD and CVDD voltage rails;
however, there are some considerations that the system designer should take into account:
1. Neither supply should be powered up for an extended period of time (>1 second) while the other
supply is powered down.
2. The I/O buffers powered from the DVDD rail also require the CVDD rail to be powered up in order to be
controlled; therefore, an I/O pin that is supposed to be 3-stated by default may actually drive
momentarily until the CVDD rail has powered up. Systems should be evaluated to determine if there is
a possibility for contention that needs to be addressed. In most systems where both the DVDD and
CVDD supplies ramp together, as long as CVDD tracks DVDD closely, any contention is also mitigated by
the fact that the CVDD rail would reach its specified operating range well before the DVDD rail has fully
ramped.
4.7.2 Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. The core supply caps can be placed in the interior space of the package and
the I/O supply caps can be placed around the exterior space of the package. For the HFH package, it is
recommended that the core supply caps be placed on the underside of the PCB and the I/O supply caps
be placed on the top side of the PCB.
Both core and I/O decoupling can be accomplished by alternating small (0.1 μF) low ESR ceramic bypass
caps with medium (0.220 μF) low ESR ceramic bypass caps close to the DSP power pins and adding
large tantalum or ceramic caps (ranging from 10 μF to 100 μF) further away. Assuming 0603 caps, it is
recommended that at least 6 small, 6 medium, and 4 large caps be used for the core supply and 12 small,
12 medium, and 4 large caps be used for the I/O supply.
Any cap selection needs to be evaluated from an electromagnetic radiation (EMI) point-of-view; EMI varies
from one system design to another so it is expected that engineers alter the decoupling capacitors to
minimize radiation. Refer to the High-Speed DSP Systems Design Reference Guide (literature number
SPRU889) for more detailed design information on decoupling techniques.
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4.8 Reset
A hardware reset (RESET) is required to place the DSP into a known good state out of power-up. The
RESET signal can be asserted (pulled low) prior to ramping the core and I/O voltages or after the core
and I/O voltages have reached their proper operating conditions. As a best practice, RESET should be
held low during power-up. Prior to deasserting RESET (low-to-high transition), the core and I/O voltages
should be at their proper operating conditions.
4.8.1 Reset Electrical Data/Timing
Table 4-1 assumes testing over recommended operating conditions.
Table 4-1. Reset Timing Requirements
NO.
1
PARAMETER
MIN
100
20
TYP
MAX UNIT
tw(RSTL)
Pulse width, RESET low
ns
ns
ns
2
tsu(BPV-RSTH)
th(RSTH-BPV)
Setup time, boot pins valid before RESET high
Hold time, boot pins valid after RESET high
3
20
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4.9 Dual Data Movement Accelerator (dMAX)
4.9.1 dMAX Device-Specific Information
The dMAX is a module designed to perform Data Movement Acceleration. The dMAX controller handles
user-programmed data transfers between the internal data memory controller and the device peripherals
on the C6727B DSP. The dMAX allows movement of data to/from any addressable memory space,
including internal memory, peripherals, and external memory. The dMAX controller in the C6727B DSP
has a different architecture from the previous EDMA controller in the C621x/C671x devices.
The dMAX controller includes features, such as capability to perform three-dimensional data transfers for
advanced data sorting, capability to manage a section of the memory as a circular buffer/FIFO with delay
tap based reading and writing data. The dMAX controller is capable of concurrently processing two
transfer requests (provided that they are to/from different source/destinations).
Figure 4-5 shows a block diagram of the dMAX controller.
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High-Priority PaRAM
Event Entry #0
dMAX
Event
Entry
Table
Event Entry #k
HiMAX
RAM
R/W
Event Entry #31
Reserved
HiMAX
Master
Crossbar
Switch
Port
HiMAX
(MAX0)
Transfer Entry #0
Transfer
Entry
Table
High-Priority
REQ
Transfer Entry #k
Transfer Entry #7
Interrupt
Lines to
the CPU
Control
R/W
Event
Encoder
+
To/From
Crossbar
Switch
Event and
Interrupt
Events
Low-Priority PaRAM
Event Entry #0
Registers
Event
Entry
Table
Event Entry #k
Low-Priority
REQ
LoMAX
RAM
Event Entry #31
Reserved
R/W
LoMAX
Master
Crossbar
Switch
Port
LoMAX
(MAX1)
Transfer Entry #0
Transfer
Entry
Table
Transfer Entry #k
Transfer Entry #7
Figure 4-5. dMAX Controller Block Diagram
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The dMAX controller comprises:
•
•
•
•
•
•
Event and interrupt processing registers
Event encoder
High-priority event Parameter RAM (PaRAM)
Low-priority event Parameter RAM (PaRAM)
Address-generation hardware for High-Priority Events – MAX0 (HiMAX)
Address-generation hardware for Low-Priority Events – MAX1 (LoMAX)
The SM320C6727B Peripheral Bus Structure can be described logically as a Crossbar Switch with five
master ports and five slave ports. When accessing the slave ports, the MAX0 (HiMAX) module is always
given the highest priority followed by the MAX1 (LoMAX) module. In other words, in case several masters
(including MAX0 and MAX1) attempt to access same slave port concurrently, the MAX0 will be given the
highest priority followed by MAX1.
Event signals are connected to bits of the dMAX Event Register (DER), and the bits in the DER reflect the
current state of the event signals. An event is defined as a transition of the event signal. The dMAX Event
Flag Register (DEFR) can be programmed, individually for each event signal, to capture either low-to-high
or high-to-low transitions of the bits in the DER (event polarity is individually programmable).
An event is a synchronization signal that can be used: 1) to either trigger dMAX to start a transfer, or 2) to
generate an interrupt to the CPU. All the events are sorted into two groups: low-priority event group and
high-priority event group.
The High-Priority Data Movement Accelerator MAX0 (HiMAX) module is dedicated to serving requests
coming from the high-priority event group. The Low-Priority Data Movement Accelerator MAX1 (LoMAX)
module is dedicated to serving requests coming from the low-priority event group.
Each PaRAM contains two sections: the event entry table section and the transfer entry table section. An
event entry describes an event type and associates the event to either one of transfer types or to an
interrupt. In case an event entry associates the event to one of the transfer types, the event entry will
contain a pointer to the specific transfer entry in the transfer entry table. The transfer table may contain up
to eight transfer entries. A transfer entry specifies details required by the dMAX controller to perform the
transfer. In case an event entry associates the event to an interrupt, the event entry specifies which
interrupt should be generated to the CPU in case the event arrives.
Prior to enabling events and triggering a transfer, the event entry and transfer entry must be configured.
The event entry must specify: type of transfer, transfer details (type of synchronization, reload, element
size, etc.), and should include a pointer to the transfer entry. The transfer entry must specify: source,
destination, counts, and indexes. If an event is sorted in the high-priority event group, the event entry and
transfer entry must be specified in the high-priority Parameter RAM. If an event is sorted in the low-priority
event group, the event entry and transfer entry must be specified in the low-priority parameter RAM.
The dMAX Event Flag Register (DEFR) captures up to 31 separate events; therefore, it is possible for
events to occur simultaneously on the dMAX event inputs. In such cases, the event encoder resolves the
order of processing. This mechanism sorts simultaneous events and sets the priority of the events. The
dMAX controller can simultaneously process one event from each priority group. Therefore, the two
highest-priority events (one from each group) can be processed at the same time.
An event-triggered dMAX transfer allows the submission of transfer requests to occur automatically based
on system events, without any intervention by the CPU. The dMAX also includes support for CPU-initiated
transfers for added control and robustness, and they can be used to start memory-to-memory transfers.
To generate an event to the dMAX controller the CPU must create a transition on one of the bits from the
dMAX Event Trigger (DETR) Register, which are mapped to the DER register.
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Table 4-2 lists how the synchronization events are associated with event numbers in the dMAX controller.
Table 4-2. dMAX Peripheral Event Input Assignments
EVENT NUMBER
EVENT ACRONYM
DETR[0]
EVENT DESCRIPTION
0
The CPU triggers the event by creating appropriate transition (edge) on bit0
in DETR register.
1
DETR[16]
The CPU triggers the event by creating appropriate transition (edge) on bit16
in DETR register.
2
3
RTIREQ0
RTI DMA REQ[0]
RTIREQ1
RTI DMA REQ[1]
4
MCASP0TX
MCASP0RX
MCASP1TX
MCASP1RX
MCASP2TX
MCASP2RX
DETR[1]
McASP0 TX DMA REQ
McASP0 RX DMA REQ
McASP1 TX DMA REQ
McASP1 RX DMA REQ
McASP2 TX DMA REQ
McASP2 RX DMA REQ
5
6
7
8
9
10
The CPU triggers the event by creating appropriate transition (edge) on bit1
in DETR register.
11
DETR[17]
The CPU triggers the event by creating appropriate transition (edge) on bit17
in DETR register.
12
13
14
15
16
17
UHPIINT
SPI0RX
UHPI CPU_INT
SPI0 DMA_RX_REQ
SPI1 DMA_RX_REQ
RTI DMA REQ[2]
RTI DMA REQ[3]
SPI1RX
RTIREQ2
RTIREQ3
DETR[2]
The CPU triggers the event by creating appropriate transition (edge) on bit2
in DETR register.
18
DETR[18]
The CPU triggers the event by creating appropriate transition (edge) on bit18
in DETR register.
19
20
21
22
23
I2C0XEVT
I2C0REVT
I2C1XEVT
I2C1REVT
DETR[3]
I2C 0 Transmit Event
I2C 0 Receive Event
I2C 1 Transmit Event
I2C 1 Receive Event
The CPU triggers the event by creating appropriate transition (edge) on bit3
in DETR register.
24
DETR[19]
The CPU triggers the event by creating appropriate transition (edge) on bit19
in DETR register.
25
26
27
28
29
30
Reserved
MCASP0ERR
MCASP1ERR
MCASP2ERR
OVLREQ[0/1]
DETR[20]
AMUTEIN0 or McASP0 TX INT or McASP0 RX INT (error on McASP0)
AMUTEIN1 or McASP1 TX INT or McASP1 RX INT (error on McASP1)
AMUTEIN2 or McASP2 TX INT or McASP2 RX INT (error on McASP2)
Error on RTI
The CPU triggers the event by creating appropriate transition (edge) on bit20
in DETR register.
31
DETR[21]
The CPU triggers the event by creating appropriate transition (edge) on bit21
in DETR register.
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4.9.2 dMAX Peripheral Registers Description(s)
Table 4-3 is a list of the dMAX registers.
Table 4-3. dMAX Configuration Registers
BYTE ADDRESS
0x6000 0008
0x6000 000C
0x6000 0010
0x6000 0014
0x6000 0018
0x6000 001C
0x6000 0034
0x6000 0054
0x6000 0074
0x6000 0094
0x6000 0040
0x6000 0060
0x6000 0080
0x6000 00A0
N/A
REGISTER NAME
DESCRIPTION
DEPR
DEER
DEDR
DEHPR
DELPR
DEFR
DER0
Event Polarity Register
Event Enable Register
Event Disable Register
Event High-priority Register
Event Low-priority Register
Event Flag Register
Event Register 0
DER1
Event Register 1
DER2
Event Register 2
DER3
Event Register 3
DFSR0
DFSR1
DTCR0
DTCR1
DETR
DESR
FIFO Status Register 0
FIFO Status Register 1
Transfer Complete Register 0
Transfer Complete Register 1
Event Trigger Register (Located in C67x+ DSP Register File)
Event Status Register (Located in C67x+ DSP Register File)
N/A
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4.10 External Interrupts
The C6727B DSP has no dedicated general-purpose interrupt pins, but the dMAX can be used in
combination with a McASP AMUTEIN signal to provide external interrupt capability. There is a multiplexer
for each McASP, controlled by the CFGMCASP0/1/2 registers, which allows the AMUTEIN input for that
McASP to be sourced from one of seven I/O pins on the DSP. Once a pin is configured as an AMUTEIN
source, a very short pulse (two SYSCLK2 cycles or more) on that pin will generate an event to the dMAX.
This event can trigger the dMAX to generate a CPU interrupt by programming the assoicated Event Entry.
There are a few additional points to consider when using the AMUTEIN signal to enable external interrupts
as described above. The I/O pin selected by the CFGMCASP0/1/2 registers must be configured as a
general-purpose input pin within the associated peripheral. Also, the AMUTEIN signal should be disabled
within the corresponding McASP so that AMUTE is not driven when AMUTEIN is active. This can be done
by clearing the INEN bit of the AMUTE register inside the McASP. Finally, AMUTEIN events are logically
ORed with the McASP transmit and receive error events within the dMAX; therefore, the ISR that
processes the dMAX interrupt generated by these events must discern the source of the event.
The EMIF EM_WAIT pin has the ability to generate an NMI (INT1) based upon a rising edge on the
EM_WAIT pin. Note that while this interrupt is connected to the CPU NMI (non-maskable interrupt), it is
actually maskable through the EMIF control registers. In fact, the default state for this interrupt is disabled.
Also, interrupt generation always occurs on a rising edge of EM_WAIT; the polarity selection for wait state
generation has no effect on the interrupt polarity. The EM_WAIT pin should remain asserted for at least
two SYSCLK3 cycles to ensure that the edge is detected.
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4.11 External Memory Interface (EMIF)
4.11.1 EMIF Device-Specific Information
The C6727B DSP includes an external memory interface (EMIF) for optional SDRAM, NOR FLASH,
NAND FLASH, or SRAM. The key features of this EMIF are:
•
•
One chip select (EM_CS[0]) dedicated for x16 and x32 SDRAM (x8 not supported)
One chip select (EM_CS[2]) dedicated for x8, x16, or x32 NOR FLASH; x8, x16, or x32 Asynchronous
SRAM; or x8 or x16 NAND FLASH
•
•
•
•
•
•
Data bus width is 32 bits on the C6727B.
SDRAM burst length of 16 bytes
External Wait Input on the C6727B through EM_WAIT (programmable active-high or active-low)
External Wait pin functions as an interrupt for NAND Flash support
NAND Flash logic calculates ECC on blocks of up to 512 bytes
ECC logic suitable for single-bit errors
Figure 4-6 shows a typical example of EMIF-to-memory hookup on the C6727B DSP.
As the figures illustrate, the C6727B DSP includes a limited number of EMIF address lines. These are
sufficient to connect to SDRAM seamlessly. Asynchronous memory such as FLASH typically will need to
use additional GPIO pins to act as upper address lines during device boot up when the FLASH contents
are copied into SDRAM. (Normally, code is executed from SDRAM since SDRAM has faster access
times).
Any pins listed with a ‘Y' in the GPIO column of Table 2-12 may be used for this purpose, as long as it can
be assured that they be pulled low at (and after) reset and held low until configured as outputs by the
DSP.
Note that EM_BA[1:0] are used as low-order address lines for the asynchronous interface. For example, in
Figure 4-6, the flash memory is not byte-addressable and its A[0] input selects a 16-bit value. The
corresponding DSP address comes from EM_BA[1]. The remaining address lines from the DSP
(EM_A[12:0]) drive a word address into the flash inputs A[13:1].
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C6727B
DSP EMIF
SDRAM
4M x 16 x 4 Bank
EM_CS[0]
EM_CAS
EM_RAS
EM_WE
CE
CAS
RAS
WE
EM_CLK
EM_CKE
EM_BA[1:0]
CLK
CKE
BA[1:0]
EM_A[12:0]
EM_WE_DQM[0]
EM_WE_DQM[1]
EM_D[15:0]
A[12:0]
LDQM
UDQM
DQ[15:0]
EM_WE_DQM[2]
EM_WE_DQM[3]
EM_D[31:16]/UHPI_HA[15:0]
EM_CS[2]
SDRAM
4M x 16 x 4 Bank
CE
EM_RW
EM_OE
EM_WAIT
CAS
RAS
WE
GPIO
(5 Pins)
CLK
CKE
BA[1:0]
RESET
A[12:0]
LDQM
RESET
UDQM
DQ[15:0]
FLASH
512K x 16
EM_BA[1]
A[0]
A[13:1]
DQ[15:0]
CE
WE
OE
RESET
A[18:14]
Any GPIO-capable pins which
RY/BY
can be pulled down at reset
can be used to control A[18:14]
for FLASH BOOTLOAD
Examples: AHCLKR0, SPI0_SCS/SCL1
Figure 4-6. C6727B DSP 32-Bit EMIF Example
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4.11.2 EMIF Peripheral Registers Description(s)
Table 4-4 is a list of the EMIF registers. For more information about these registers, see the
TMS320C6727B DSP External Memory Interface (EMIF) User's Guide (literature number SPRU711).
Table 4-4. EMIF Registers
BYTE ADDRESS
0xF000 0004
0xF000 0008
0xF000 000C
0xF000 0010
0xF000 0020
0xF000 003C
0xF000 0040
0xF000 0044
0xF000 0048
0xF000 004C
0xF000 0060
0xF000 0064
0xF000 0070
REGISTER NAME
AWCCR
DESCRIPTION
Asynchronous Wait Cycle Configuration Register
SDRAM Configuration Register
SDCR
SDRCR
A1CR
SDRAM Refresh Control Register
Asynchronous 1 Configuration Register
SDRAM Timing Register
SDTIMR
SDSRETR
EIRR
SDRAM Self Refresh Exit Timing Register
EMIF Interrupt Raw Register
EIMR
EMIF Interrupt Mask Register
EIMSR
EMIF Interrupt Mask Set Register
EMIF Interrupt Mask Clear Register
NAND Flash Control Register
EIMCR
NANDFCR
NANDFSR
NANDF1ECC
NAND Flash Status Register
NAND Flash 1 ECC Register
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4.11.3 EMIF Electrical Data/Timing
Table 4-5 through Table 4-10 assume testing over recommended operating conditions (see Figure 4-7
through Figure 4-13).
Table 4-5. 100-MHz EMIF SDRAM Interface Timing Requirements(1)
NO.
PARAMETER
MIN
TYP
MAX UNIT
Input setup time, read data valid on D[31:0] before EM_CLK
rising
19 tsu(EM_DV-EM_CLKH)
3
ns
Input hold time, read data valid on D[31:0] after EM_CLK
rising
20 th(EM_CLKH-EM_DIV)
1.9
ns
(1) For more information about supported EMIF frequency, see Table 2-1.
Table 4-6. 100-MHz EMIF SDRAM Interface Switching Characteristics(1)
NO.
1
PARAMETER
MIN
10
3
TYP
MAX UNIT
ns
tc(EM_CLK)
Cycle time, EMIF clock EM_CLK
2
tw(EM_CLK)
Pulse width, EMIF clock EM_CLK high or low
Delay time, EM_CLK rising to EM_CS[0] valid
Output hold time, EM_CLK rising to EM_CS[0] invalid
ns
3
td(EM_CLKH-EM_CSV)S
toh(EM_CLKH-EM_CSIV)S
7.7 ns
ns
4
1.15
-3
5
td(EM_CLKH-EM_WE-DQMV)S Delay time, EM_CLK rising to EM_WE_DQM[3:0] valid
7.7 ns
toh(EM_CLKH-EM_WE-
DQMIV)S
Output hold time, EM_CLK rising to EM_WE_DQM[3:0]
invalid
6
7
ns
7.7 ns
ns
Delay time, EM_CLK rising to EM_A[12:0] and EM_BA[1:0]
valid
td(EM_CLKH-EM_AV)S
Output hold time, EM_CLK rising to EM_A[12:0] and
EM_BA[1:0] invalid
8
9
toh(EM_CLKH-EM_AIV)S
td(EM_CLKH-EM_DV)S
-3
Delay time, EM_CLK rising to EM_D[31:0] valid
Output hold time, EM_CLK rising to EM_D[31:0] invalid
Delay time, EM_CLK rising to EM_RAS valid
7.7 ns
ns
10 toh(EM_CLKH-EM_DIV)S
11 td(EM_CLKH-EM_RASV)S
12 toh(EM_CLKH-EM_RASIV)S
13 td(EM_CLKH-EM_CASV)S
14 toh(EM_CLKH-EM_CASIV)S
15 td(EM_CLKH-EM_WEV)S
16 toh(EM_CLKH-EM_WEIV)S
17 tdis(EM_CLKH-EM_DHZ)S
18 tena(EM_CLKH-EM_DLZ)S
-3
1.15
1.15
1.15
7.7 ns
ns
Output hold time, EM_CLK rising to EM_RAS invalid
Delay time, EM_CLK rising to EM_CAS valid
7.7 ns
ns
Output hold time, EM_CLK rising to EM_CAS invalid
Delay time, EM_CLK rising to EM_WE valid
7.7 ns
ns
Output hold time, EM_CLK rising to EM_WE invalid
Delay time, EM_CLK rising to EM_D[31:0] 3-stated
Output hold time, EM_CLK rising to EM_D[31:0] driving
7.7
ns
1.15
ns
(1) For more information about supported EMIF frequency, see Table 2-1.
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Table 4-7. 133-MHz EMIF SDRAM Interface Timing Requirements(1)
NO.
PARAMETER
MIN
TYP
MAX UNIT
Input setup time, read data valid on D[31:0] before EM_CLK
rising
19 tsu(EM_DV-EM_CLKH)
5
ns
Input hold time, read data valid on D[31:0] after EM_CLK
rising
20 th(EM_CLKH-EM_DIV)
1.9
ns
(1) For more information about supported EMIF frequency, see Table 2-1.
Table 4-8. 133-MHz EMIF SDRAM Interface Switching Characteristics(1)
NO.
1
PARAMETER
MIN
7.5
TYP
MAX UNIT
ns
tc(EM_CLK)
Cycle time, EMIF clock EM_CLK
2
tw(EM_CLK)
Pulse width, EMIF clock EM_CLK high or low
Delay time, EM_CLK rising to EM_CS[0] valid
Output hold time, EM_CLK rising to EM_CS[0] invalid
2.25
ns
3
td(EM_CLKH-EM_CSV)S
toh(EM_CLKH-EM_CSIV)S
7.7 ns
ns
4
1.15
-3
5
td(EM_CLKH-EM_WE-DQMV)S Delay time, EM_CLK rising to EM_WE_DQM[3:0] valid
7.7 ns
toh(EM_CLKH-EM_WE-
DQMIV)S
Output hold time, EM_CLK rising to EM_WE_DQM[3:0]
invalid
6
7
ns
7.7 ns
ns
Delay time, EM_CLK rising to EM_A[12:0] and EM_BA[1:0]
valid
td(EM_CLKH-EM_AV)S
Output hold time, EM_CLK rising to EM_A[12:0] and
EM_BA[1:0] invalid
8
9
toh(EM_CLKH-EM_AIV)S
td(EM_CLKH-EM_DV)S
-3
Delay time, EM_CLK rising to EM_D[31:0] valid
Output hold time, EM_CLK rising to EM_D[31:0] invalid
Delay time, EM_CLK rising to EM_RAS valid
7.7 ns
ns
10 toh(EM_CLKH-EM_DIV)S
11 td(EM_CLKH-EM_RASV)S
12 toh(EM_CLKH-EM_RASIV)S
13 td(EM_CLKH-EM_CASV)S
14 toh(EM_CLKH-EM_CASIV)S
15 td(EM_CLKH-EM_WEV)S
16 toh(EM_CLKH-EM_WEIV)S
17 tdis(EM_CLKH-EM_DHZ)S
18 tena(EM_CLKH-EM_DLZ)S
-3
1.15
1.15
1.15
7.7 ns
ns
Output hold time, EM_CLK rising to EM_RAS invalid
Delay time, EM_CLK rising to EM_CAS valid
7.7 ns
ns
Output hold time, EM_CLK rising to EM_CAS invalid
Delay time, EM_CLK rising to EM_WE valid
7.7 ns
ns
Output hold time, EM_CLK rising to EM_WE invalid
Delay time, EM_CLK rising to EM_D[31:0] 3-stated
Output hold time, EM_CLK rising to EM_D[31:0] driving
7.7
ns
1.15
ns
(1) For more information about supported EMIF frequency, see Table 2-1.
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Table 4-9. EMIF Asynchronous Interface Timing Requirements(1) (2)
NO.
PARAMETER
MIN
TYP
MAX UNIT
Input setup time, read data valid on EM_D[31:0] before
EM_CLK rising
28 tsu(EM_DV-EM_CLKH)A
11
ns
Input hold time, read data valid on EM_D[31:0] after
EM_CLK rising
29 th(EM_CLKH-EM_DIV)A
2
ns
30 tsu(EM_CLKH-EM_WAITV)A
31 th(EM_CLKH-EM_WAITIV)A
33 tw(EM_WAIT)A
Setup time, EM_WAIT valid before EM_CLK rising edge
Hold time, EM_WAIT valid after EM_CLK rising edge
Pulse width of EM_WAIT assertion and deassertion
6
0
ns
ns
ns
2E + 5
Delay from EM_WAIT sampled deasserted on EM_CLK
rising to beginning of HOLD phase
34 td(EM_WAITD-HOLD)A
4E(3)
ns
Setup before end of STROBE phase (if no extended wait
states are inserted) by which EM_WAIT must be sampled
asserted on EM_CLK rising in order to add extended wait
states.(4)
35 tsu(EM_WAITA-HOLD)A
4E(3)
ns
(1) E = SYSCLK3 (EM_CLK) period.
(2) These parameters apply to memories selected by EM_CS[2] in both normal and NAND modes.
(3) These parameters specify the number of EM_CLK cycles of latency between EM_WAIT being sampled at the device pin and the EMIF
entering the HOLD phase. However, the asynchronous setup (parameter 30) and hold time (parameter 31) around each EM_CLK edge
must also be met in order to ensure the EM_WAIT signal is correctly sampled.
(4) In Figure 4-13, it appears that there are more than 4 EM_CLK cycles encompassed by parameter 35. However, EM_CLK cycles that are
part of the extended wait period should not be counted; the 4 EM_CLK requirement is to the start of where the HOLD phase would
begin if there were no extended wait cycles.
Table 4-10. EMIF Asynchronous Interface Switching Characteristics(1)
NO.
1
PARAMETER
MIN
10
7.5
3
TYP
MAX UNIT
100-MHz EMIF Frequency
133-MHz EMIF Frequency
Cycle time, EMIF clock
EM_CLK
tc(EM_CLK)
tw(EM_CLK)
ns
2
Pulse width, high or low, EMIF clock EM_CLK
ns
ns
ns
17 tdis(EM_CLKH-EM_DHZ)S
18 tena(EM_CLKH-EM_DLZ)S
21 td(EM_CLKH-EM_CS2V)A
Delay time, EM_CLK rising to EM_D[31:0] 3-stated
Output hold time, EM_CLK rising to EM_D[31:0] driving
Delay time, from EM_CLK rising edge to EM_CS[2] valid
7.7
1.15
0
8
8
ns
ns
22 td(EM_CLKH-EM_WE_DQMV)A Delay time, EM_CLK rising to EM_WE_DQM[3:0] valid
-2
Delay time, EM_CLK rising to EM_A[12:0] and EM_BA[1:0]
valid
23 td(EM_CLKH-EM_AV)A
-0.3
8
ns
24 td(EM_CLKH-EM_DV)A
25 td(EM_CLKH-EM_OEV)A
26 td(EM_CLKH-EM_RW)A
27 tdis(EM_CLKH-EM_DDIS)A
32 td(EM_CLKH-EM_WE)A
Delay time, EM_CLK rising to EM_D[31:0] valid
Delay time, EM_CLK rising to EM_OE valid
Delay time, EM_CLK rising to EM_RW valid
Delay time, EM_CLK rising to EM_D[31:0] 3-stated
Delay time, EM_CLK rising to EM_WE valid
-0.8
0
8
8
8
ns
ns
ns
ns
ns
0
4
0
8
(1) These parameters apply to memories selected by EM_CS[2] in both normal and NAND modes.
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1
BASIC SDRAM
WRITE OPERATION
2
2
EM_CLK
EM_CS[0]
3
5
7
7
9
4
6
EM_WE_DQM[3:0]
EM_BA[1:0]
8
8
EM_A[12:0]
EM_D[31:0]
EM_RAS
EM_CAS
EM_WE
11
12
13
15
14
16
Figure 4-7. Basic SDRAM Write Operation
1
BASIC SDRAM
READ OPERATION
2
2
EM_CLK
EM_CS[0]
3
5
7
7
4
6
EM_WE_DQM[3:0]
EM_BA[1:0]
8
8
EM_A[12:0]
19
20
2 EM_CLK Delay
17
18
EM_D[31:0]
EM_RAS
11
12
13
14
EM_CAS
EM_WE
Figure 4-8. Basic SDRAM Read Operation
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ASYNCHRONOUS READ
WE STROBE MODE
SETUP
STROBE
HOLD
TA
EM_CLK
21
22
23
23
17
21
22
23
23
EM_CS[2]
EM_WE_DQM[3:0]
EM_BA[1:0]
ADDRESS
EM_A[12:0]
ADDRESS
28
29
READ DATA
EM_D[31:0]
25
25
18
EM_OE
EM_WE
EM_RW
Figure 4-9. Asynchronous Read WE Strobe Mode
ASYNCHRONOUS READ
SELECT STROBE MODE
SETUP
STROBE
21
HOLD
21
TA
EM_CLK
EM_CS[2]
22
23
23
17
22
23
23
EM_WE_DQM[3:0]
EM_BA[1:0]
BYTE LANE ENABLES
ADDRESS
EM_A[12:0]
ADDRESS
28
29
READ DATA
EM_D[31:0]
25
25
18
EM_OE
EM_WE
EM_RW
Figure 4-10. Asynchronous Read Select Strobe Mode
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ASYNCHRONOUS WRITE
WE STROBE MODE
SETUP
STROBE
HOLD
EM_CLK
EM_CS[2]
21
22
23
23
24
21
22
23
23
22
22
EM_WE_DQM[3:0]
EM_BA[1:0]
BYTE WRITE STROBES
ADDRESS
EM_A[12:0]
ADDRESS
27
EM_D[31:0]
WRITE DATA
EM_OE
EM_WE
32
32
26
26
EM_RW
Figure 4-11. Asynchronous Write WE Strobe Mode
ASYNCHRONOUS WRITE
SELECT STROBE MODE
SETUP
STROBE
HOLD
21
EM_CLK
EM_CS[2]
21
22
23
23
24
22
EM_WE_DQM[3:0]
EM_BA[1:0]
BYTE LANE ENABLES
23
23
ADDRESS
ADDRESS
WRITE DATA
EM_A[12:0]
27
EM_D[31:0]
EM_OE
32
32
EM_WE
EM_RW
26
26
Figure 4-12. Asynchronous Write Select Strobe Mode
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STROBE HOLD
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SETUP
STROBE
EXTENDED WAIT STATES
35
34
EM_CLK
EM_WAIT
30
31
ASSERTED
33
DEASSERTED
33
Figure 4-13. EM_WAIT Timing Requirements
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4.12 Universal Host-Port Interface (UHPI) [C6727B Only]
4.12.1 UHPI Device-Specific Information
The C6727B DSP includes a flexible universal host-port interface (UHPI) with more options than the host-
port interface on the C671x DSP.
The UHPI on the C6727B DSP supports three major operating modes listed in Table 4-11.
Table 4-11. UHPI Major Modes on C6727B
UHPI MAJOR MODE
EXAMPLE FIGURE
Figure 4-15
Multiplexed Host Address/Data Half-Word (16-Bit) Mode
Multiplexed Host Address/Data Fullword (32-Bit) Mode
Non-Multiplexed Host Address/Data Fullword (32-Bit) Mode
Figure 4-16
Figure 4-17
In all modes, the UHPI uses three select inputs (UHPI_HCS, UHPI_HDS[2:1]) which are combined
internally to produce the internal strobe signal HSTROBE. The HSTROBE strobe signal is used in the
UHPI to capture incoming address and control signals on its falling edge and write data on its rising edge.
The UHPI_HCS signal also gates the deassertion of the UHPI_HRDY signal externally.
UHPI_HDS[2]
UHPI_HDS[1]
Internal HSTROBE
UHPI_HCS
UHPI_HRDY
Internal HRDY
Figure 4-14. UHPI Strobe and Ready Interaction
The two HPI control pins UHPI_HCNTL[1:0] determine the type of access that the host will perform. Note
that only two of the four access types are supported in Non-Multiplexed Host Address/Data Fullword
Mode.
Table 4-12. HPI Access Types Selected by UHPI_HCNTL[1:0]
NON-
MULTIPLEXED
FULLWORD
MULTIPLEXED
HALF-WORD
MULTIPLEXED
FULLWORD
UHPI_HCNTL[1:0]
DESCRIPTION
00
01
10
11
HPI Control Register (HPIC) Access
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
N
Y
HPI Data Access (HPID) with autoincrementing address
HPI Address Register (HPIA) Access
HPI Data Access (HPID) without autoincrementing
address
CAUTION
When performing
a
set of HPID with autoincrementing address accesses
(UHPI_HCNTL[1:0] = '01'), the set must begin and end at a word-aligned address. In
addition, all four of the UHPI_HBE[3:0] must be enabled on every access in the set.
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CAUTION
The encoding of UHPI_CNTL[1:0] on the C6727B DSP is different from HCNTL[1:0] on
the C671x DSP. Modes 01 and 10 are swapped.
Figure 4-15 illustrates the Multiplexed Host Address/Data Half-Word Mode hookup between the C6727B
DSP and an external host microcontroller. In this mode, each 32-bit HPI access is broken up into two
halves. The UHPI_HD[16]/HHWIL pin functions as UHPI_HHWIL which must be '0' during the first half of
access and '1' during the second half.
CAUTION
Unless configured as general-purpose I/O in the UHPI module, UHPI_HD[31:17] and
UHPI_HD[16]/HHWIL will be driven as outputs along with UHPI_HD[15:0] when the HPI
is read, even though only the lower half-word is used to transfer data. This can be
especially problematic for the UHPI_HD[16]/HHWIL pin which should be used as an
input in this mode. Therefore, be sure to configure the upper half of the UHPI_HD bus
as general-purpose I/O pins. Furthermore, be sure to program the UHPI_HD[16] function
as a general-purpose input to avoid a drive conflict with the external host MCU.
In this mode, as well as the Multiplexed Host Address/Data Fullword mode, the UHPI can be made more
secure by restricting the upper 16 bits of the DSP addresses it can access to what is set in CFGHPIAMSB
and CFGHPIAUMB registers. (See Table 4-15 and Table 4-16).
The host is responsible for configuring the internal HPIA register whether or not it is being overridden by
the device configuration registers CFGHPIAMSB and CFGHPIAUMB.
After the HPIA register has been set, either a single or a group of autoincrementing accesses to HPID
may be performed.
The UHPI_HRDY adds wait states to extend the host MCU access until the C6727B DSP has completed
the desired operation.
The HINT signal is available for the DSP to interrupt the host MCU. The UHPI also includes an interrupt to
the DSP core from the host as part of the HPIC register.
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DSP
External Host MCU
(A)
EM_D[31:16]/UHPI_HA[15:0]
NC
(D)
UHPI_HCNTL[1:0]
UHPI_HD[15:0]
A[x:y]
D[15:0]
(E)
UHPI_HD[16]/HHWIL
A[1]
UHPI_HD[31:17]
NC or GPIO
(B)
UHPI_HAS
(C)
(F)
UHPI_HBE[1:0]
BE[1:0]
UHPI_HRW
R/W
(G)
(G)
UHPI_HDS[2]
WE
(G)
(G)
UHPI_HDS[1]
RD
UHPI_HCS
UHPI_HRDY
CS
RDY
AMUTE2/HINT
INTERRUPT
A. May be used as EM_D[31:16]
B. Optional for hosts supporting multiplexed address and data. Pull up if not used. Low when address is on the bus.
C. DSP byte enables UHPI_HBE[3:2] are not required in this mode.
D. Two host address lines or host GPIO if address lines are not available.
E. A[1], assuming this address increments from 0 to 1 between two successive 16-bit accesses.
F. Byte Enables (active during reads and writes). Some processors support a byte-enable mode on their write-enable
pins.
G. Only required if needed for strobe timing. Not required if CS meets strobe timing requirements. Tie UHPI_HDS[2] and
UHPI_HDS[1] opposite. For more information, see Figure 4-14.
Figure 4-15. UHPI Multiplexed Host Address/Data Half-Word Mode
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Figure 4-16 illustrates the Multiplexed Host Address/Data Fullword Mode hookup between the C6727B
DSP and an external host microcontroller. In this mode, all 32 bits of UHPI_HD[31:0] are used and the
host can access HPIA, HPID, and HPIC in a single bus cycle.
DSP
External Host MCU
(A)
EM_D[31:16]/UHPI_HA[15:0]
NC
(C)
UHPI_HCNTL[1:0]
UHPI_HD[15:0]
A[x:y]
D[15:0]
D[16]
UHPI_HD[16]/HHWIL
UHPI_HD[31:17]
D[31:17]
(B)
UHPI_HAS
(D)
UHPI_HBE[3:0]
UHPI_HRW
BE[3:0]
R/W
(E)
UHPI_HDS[2]
UHPI_HDS[1]
UHPI_HCS
WE
(E)
RD
CS
UHPI_HRDY
AMUTE2/HINT
RDY
INTERRUPT
A. May be used as EM_D[31:16]
B. Optional for hosts supporting multiplexed address and data. Pull up if not used. Low when address is on the bus.
C. Two host address lines or host GPIO if address lines are not available.
D. Byte Enables (active during reads and writes). Some processors support a byte-enable mode on their write enable
pins.
E. Only required if needed for strobe timing. Not required if CS meets strobe timing requirements.
Figure 4-16. UHPI Multiplexed Host Address/Data Fullword Mode
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Figure 4-17 illustrates the Non-Multiplexed Host Address/Data Fullword mode of the UHPI. In this mode,
the UHPI behaves almost like an asynchronous SRAM except it asserts the UHPI_HRDY signal. This
mode allows the host to randomly access a 64K-byte page in the C6727B address space. The upper
32 bits of the C6727B address are set by the DSP (only) through the CFGHPIAMSB and CFGHPIAUMB
registers (see Table 4-15 and Table 4-16).
DSP
External Host MCU
A[17:2]
EM_D[31:16]/UHPI_HA[15:0]
(A)
UHPI_HCNTL[1:0]
UHPI_HD[15:0]
A[x:y]
D[15:0]
D[16]
UHPI_HD[16]/HHWIL
UHPI_HD[31:17]
D[31:17]
(B)
UHPI_HAS
(C)
UHPI_HBE[3:0]
UHPI_HRW
BE[3:0]
R/W
(D)
UHPI_HDS[2]
UHPI_HDS[1]
UHPI_HCS
WE
(D)
RD
CS
UHPI_HRDY
AMUTE2/HINT
RDY
INTERRUPT
A. Two host address lines or host GPIO if address lines are not available.
B. Not used in this mode.
C. Byte Enables (active during reads and writes). Some processors support a byte-enable mode on their write enable
pins.
D. Only required if needed for strobe timing. Not required if CS meets strobe timing requirements.
Figure 4-17. UHPI Non-Multiplexed Host Address/Data Fullword Mode
CAUTION
The EMIF data bus and UHPI HA inputs share the EM_D[31:16]/UHPI_HA[15:0] pins.
When using Non-Multiplexed mode, make sure the EMIF does not drive EM_D[31:16];
otherwise, a drive conflict with the external host MCU may result. Normally, the EMIF
will begin to drive the EM_D[31:16] lines immediately after it completes the SDRAM
initialization sequence, which occurs automatically after RESET is released. To avoid a
drive conflict then, the boot software must set CFGHPI.NMUX to '1' before the EMIF
drives EM_D[31:16]. Setting CFGHPI.NMUX to '1' forces these pins to be input pins.
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4.12.2 UHPI Peripheral Registers Description(s)
Table 4-13 is a list of the UHPI registers.
Table 4-13. UHPI Configuration Registers
BYTE ADDRESS
REGISTER NAME
DESCRIPTION
Device-Level Configuration Registers Controlling UHPI
0x4000 0008
0x4000 000C
0x4000 0010
CFGHPI
UHPI Configuration Register
CFGHPIAMSB
CFGHPIAUMB
Most Significant Byte of UHPI Address
Upper Middle Byte of UHPI Address
UHPI Internal Registers
0x4300 0000
0x4300 0004
0x4300 0008
0x4300 000C
0x4300 0010
0x4300 0014
0x4300 0018
0x4300 001C
0x4300 0020
0x4300 0024
0x4300 0028
0x4300 002C
0x4300 0030
0x4300 0034
0x4300 0038
0x4300 003C
0x4300 0040
PID
Peripheral ID Register
PWREMU
GPIOINT
GPIOEN
GPIODIR1
GPIODAT1
GPIODIR2
GPIODAT2
GPIODIR3
GPIODAT3
Reserved
Reserved
HPIC
Power and Emulation Management Register
General Purpose I/O Interrupt Control Register
General Purpose I/O Enable Register
General Purpose I/O Direction Register 1
General Purpose I/O Data Register 1
General Purpose I/O Direction Register 2
General Purpose I/O Data Register 2
General Purpose I/O Direction Register 3
General Purpose I/O Data Register 3
Reserved
Reserved
Control Register
HPIAW
Write Address Register
HPIAR
Read Address Register
Reserved
Reserved
Reserved
Reserved
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The UHPI has several device-level configuration registers which affect its behavior. Figure 4-18, Figure 4-
19, and Figure 4-20 show the bit layout of these registers. Table 4-14, Table 4-15, and Table 4-16 contain
a description of the bits in these registers.
31
8
Reserved
7
5
4
3
2
1
0
Reserved
BYTEAD
R/W, 0
FULL
R/W, 0
NMUX
R/W, 0
PAGEM
R/W, 0
ENA
R/W, 0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-18. CFGHPI Register Bit Layout (0x4000 0008)
Table 4-14. CFGHPI Register Bit Field Description (0x4000 0008)
RESET
VALUE
READ
WRITE
BIT NO.
NAME
Reserved
DESCRIPTION
31:5
4
N/A
0
N/A
Reads are indeterminate. Only 0s should be written to these bits.
BYTEAD
R/W
UHPI Host Address Type
0 = Host Address is a word address
1 = Host Address is a byte address
3
2
FULL
0
0
R/W
R/W
UHPI Multiplexing Mode (when NMUX = 0)
0 = Half-Word (16-bit data) Multiplexed Address and Data Mode
1 = Fullword (32-bit data) Multiplexed Address and Data Mode
NMUX
UHPI Non-Multiplexed Mode Enable
0 = Multiplexed Address and Data Mode
1 = Non-Multiplexed Address and Data Mode (utilizes optional UHPI_HA[15:0] pins).
Host data bus is 32 bits in Non-Multiplexed mode. Setting this bit prevents the EMIF
from driving data out or 'parking' the shared EM_D[31:16]/UHPI_HA[15:0] pins.
1
0
PAGEM
ENA
0
0
R/W
R/W
UHPI Page Mode Enable (Only for Multiplexed Address and Data Mode).
0 = Full 32-bit DSP address specified through host port.
1 = Only lower 16 bits of DSP address are specified through host port. Upper 16 bits
are restricted to the page selected by CFGHPIAMSB and CFGHPIAUMB registers.
UHPI Enable
0 = UHPI is disabled
1 = UHPI is enabled. Set this bit to '1' only after configuring the other bits in this
register.
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31
8
0
Reserved
7
HPIAMSB
R/W, 0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-19. CFGHPIAMSB Register Bit Layout (0x4000 000C)
Table 4-15. CFGHPIAMSB Register Bit Field Description (0x4000 000C)
RESET
VALUE
READ
WRITE
BIT NO.
NAME
DESCRIPTION
31:8
7:0
Reserved
HPIAMSB
N/A
0
N/A
Reads are indeterminate. Only 0s should be written to these bits.
R/W
UHPI most significant byte of DSP address to access in Non-Multiplexed mode and
in Multiplexed Address and Data mode when PAGEM = 1. Sets bits [31:24] of the
DSP internal address as accessed through UHPI.
31
7
8
Reserved
0
HPIAUMB
R/W, 0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-20. CFGHPIAUMB Register Bit Layout (0x4000 0010)
Table 4-16. CFGHPIAUMB Register Bit Field Description (0x4000 0010)
RESET
VALUE
READ
WRITE
BIT NO.
NAME
DESCRIPTION
31:8
7:0
Reserved
HPIAUMB
N/A
0
N/A
Reads are indeterminate. Only 0s should be written to these bits.
R/W
UHPI upper middle byte of DSP address to access in Non-Multiplexed mode and in
Multiplexed Address and Data mode when PAGEM = 1. Sets bits [23:16] of the DSP
internal address as accessed through UHPI.
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4.12.3 UHPI Electrical Data/Timing
4.12.3.1 Universal Host-Port Interface (UHPI) Read and Write Timing
Table 4-17 and Table 4-18 assume testing over recommended operating conditions (see Figure 4-21
through Figure 4-24).
Table 4-17. UHPI Read and Write Timing Requirements(1) (2)
NO.
9
PARAMETER
MIN
6.5
2
TYP
MAX UNIT
tsu(HASL-DSL)
th(DSL-HASL)
tsu(HAD-HASL)
th(HASL-HAD)
tw(DSL)
Setup time, UHPI_HAS low before DS falling edge
Hold time, UHPI_HAS low after DS falling edge
Setup time, HAD valid before UHPI_HAS falling edge
Hold time, HAD valid after UHPI_HAS falling edge
Pulse duration, DS low
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
10
11
12
13
14
15
16
17
18
37
38
6.5
5
15
2P
5
tw(DSH)
Pulse duration, DS high
tsu(HAD-DSL)
th(DSL-HAD)
tsu(HD-DSH)
th(DSH-HD)
Setup time, HAD valid before DS falling edge
Hold time, HAD valid after DS falling edge
Setup time, HD valid before DS rising edge
Hold time, HD valid after DS rising edge
Setup time, UHPI_HCS low before DS falling edge
Hold time, DS high after UHPI_HRDY falling edge
5
7
0
tsu(HCSL-DSL)
th(HRDYL-DSH)
0.75
1
(1) P = SYSCLK2 period
(2) DS refers to HSTROBE. HD refers to UHPI_HD[31:0]. HDS refers to UHPI_HDS[1] or UHPI_HDS[2]. HAD refers to UHPI_HCNTL[0],
UHPI_HCNTL[1], UHPI_HHWIL, and UHPI_HRW.
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Table 4-18. UHPI Read and Write Switching Characteristics(1) (2)
PARAMETER
MIN
TYP
MAX
UNIT
Case 1. HPIC or HPIA read
-1
15
Case 2. HPID read with no auto-
increment
9 * 2H + 20(3)
Case 3. HPID read with auto-
increment and read FIFO
initially empty
9 * 2H + 20(3)
1
td(DSL-HDV)
Delay time, DS low to HD valid
ns
Case 4. HPID read with auto-
increment and data previously
prefetched into the read FIFO
-1.5
15
2
3
4
5
tdis(DSH-HDV)
ten(DSL-HDD)
td(DSL-HRDYH)
td(DSH-HRDYH)
Disable time, HD high-impedance from DS high
Enable time, HD driven from DS low
2.5
9
ns
ns
ns
ns
Delay time, DS low to UHPI_HRDY high
Delay time, DS high to UHPI_HRDY high
14
14
Case 1. HPID read with no auto-
increment
10 * 2H + 20(3)
Delay time, DS low to
UHPI_HRDY low
6
td(DSL-HRDYL)
ns
Case 2. HPID read with auto-
increment and read FIFO initialy
empty
10 * 2H + 20(3)
7
td(HDV-HRDYL)
Delay time, HD valid to UHPI_HRDY low
Case 1. HPIA write
0
ns
ns
5 * 2H + 20(3)
5 * 2H + 20(3)
Delay time, DS high to
UHPI_HRDY low
Case 2. HPID read with auto-
increment and read FIFO
initially empty
34
td(DSH-HRDYL)
Delay time, DS low to UHPI_HRDY low for HPIA write and FIFO not
empty
35
36
td(DSL-HRDYL)
40 * 2H + 20(3)
12
ns
ns
td(HASL-HRDYH)
Delay time, UHPI_HAS low to UHPI_HRDY high
(1) H = 0.5 * SYSCLK2 period
(2) DS refers to HSTROBE. HAD refers to UHPI_HCNTL[0], UHPI_HCNTL[1], UHPI_HHWIL, and UHPI_HRW.
(3) Max delay is a best case, assuming no delays due to resource conflicts between UHPI and dMAX or CPU. UHPI_HRDY should always
be used to indicate when an access is complete instead of relying on these parameters.
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Read
13
Write
UHPI_HCS
UHPI_HDSx
37
37
14
13
15
15
16
16
UHPI_HRW
UHPI_HA[15:0]
Valid
Valid
1
2
3
UHPI_HD[31:0]
(Read)
Read data
18
17
UHPI_HD[31:0]
(Write)
Write data
34
4
7
5
6
UHPI_HRDY
A. Depending on the type of write or read operation (HPID or HPIC), transitions on UHPI_HRDY may or may not occur.
Figure 4-21. Non-Multiplexed Read/Write Timings
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UHPI_HCS
UHPI_HAS
12
11
12
11
UHPI_HCNTL[1:0]
12
11
12
11
UHPI_HRW
12
11
12
11
UHPI_HHWIL
10
9
10
9
37
13
13
37
14
(A)
HSTROBE
1
3
1
3
2
2
UHPI_HD[15:0]
7
38
36
6
UHPI_HRDY
A. See Figure 4-14.
B. Depending on the type of write or read operation (HPID without auto-incrementing, HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on UHPI_HRDY may or may not occur.
Figure 4-22. Multiplexed Read Timings Using UHPI_HAS
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UHPI_HCS
UHPI_HAS
UHPI_HCNTL[1:0]
UHPI_HRW
UHPI_HHWIL
13
16
13
16
15
15
37
37
14
(A)
HSTROBE
3
3
1
1
2
2
UHPI_HD[15:0]
38
4
7
6
UHPI_HRDY
A. See Figure 4-14.
B. Depending on the type of write or read operation (HPID without auto-incrementing, HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on UHPI_HRDY may or may not occur.
Figure 4-23. Multiplexed Read Timings With UHPI_HAS Held High
UHPI_HCS
UHPI_HAS
UHPI_HCNTL[1:0]
UHPI_HRW
UHPI_HHWIL
16
13
16
15
13
37
15
37
14
(A)
HSTROBE
18
34
18
17
17
UHPI_HD[15:0]
34
38
4
5
35
5
UHPI_HRDY
A. See Figure 4-14.
B. Depending on the type of write or read operation (HPID without auto-incrementing, HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on UHPI_HRDY may or may not occur.
Figure 4-24. Multiplexed Write Timings With UHPI_HAS Held High
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4.13 Multichannel Audio Serial Ports (McASP0, McASP1, and McASP2)
The McASP serial port is specifically designed for multichannel audio applications. Its key features are:
•
•
•
Flexible clock and frame sync generation logic and on-chip dividers
Up to sixteen transmit or receive data pins and serializers
Large number of serial data format options, including:
–
–
–
–
–
TDM Frames with 2 to 32 time slots per frame (periodic) or 1 slot per frame (burst).
Time slots of 8,12,16, 20, 24, 28, and 32 bits.
First bit delay 0, 1, or 2 clocks.
MSB or LSB first bit order.
Left- or right-aligned data words within time slots
•
•
•
DIT Mode (optional) with 384-bit Channel Status and 384-bit User Data registers.
Extensive error-checking and mute generation logic
All unused pins GPIO-capable
Pins
Function
AHCLKRx Receive Master Clock
Receive Logic
Clock/Frame Generator
State Machine
Peripheral
Configuration
Bus
GIO
Control
ACLKRx
AFSRx
Receive Bit Clock
Receive Left/Right Clock or Frame Sync
The McASPs DO NOT have
dedicated AMUTEINx pins.
AMUTEINx
AMUTEx
Clock Check and
Error Detection
DIT RAM
384 C
384 U
AFSXx
ACLKXx
AHCLKXx
Transmit Left/Right Clock or Frame Sync
Transmit Bit Clock
Transmit Master Clock
Transmit Logic
Clock/Frame Generator
State Machine
Optional
Transmit
Formatter
Serializer 0
Serializer 1
AXRx[0]
AXRx[1]
Transmit/Receive Serial Data Pin
Transmit/Receive Serial Data Pin
McASP
DMA Bus
(Dedicated)
Receive
Formatter
Serializer y
AXRx[y]
Transmit/Receive Serial Data Pin
McASPx (x = 0, 1, 2)
Figure 4-25. McASP Block Diagram
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The three McASPs on C6727B have different configurations (see Table 4-19).
Table 4-19. McASP Configurations on C6727B DSP
McASP
McASP0
DIT
No
CLOCK PINS
DATA PINS
Up to 16
COMMENTS
AHCLKX0/AHCLKX2, ACLKX0, AFSX0
AHCLKR0/AHCLKR1, ACLKR0, AFSR0
AHCLKX0/AHCLKX2 share pin.
AHCLKR0/AHCLKR1 share pin.
McASP1
McASP2
No
AHCLKX1, ACLKX1, AFSX1, ACLKR1, AFSR1
Up to 6
Up to 2
AHCLKR0/AHCLKR1 share pin
Yes
ACLKX2, AFSX2, AHCLKR2, ACLKR2, AFSR2
(Only available on the C6727B.)
Full functionality on C6727B. On
C6726B, functions only as DIT since only
AHCLKX0/AHCLKX2 is available.
NOTE: The McASPs do not have dedicated AMUTEINx pins. Instead they can select one of the pins
listed in Table 4-21, Table 4-22, and Table 4-23 to use as a mute input.
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4.13.1 McASP Peripheral Registers Description(s)
Table 4-20 is a list of the McASP registers. For more information about these registers, see the
TMS320C6727B DSP Multichannel Audio Serial Port (McASP) Reference Guide (literature number
SPRU878).
Table 4-20. McASP Registers Accessed Through Peripheral Configuration Bus
McASP0
BYTE
ADDRESS
McASP1
BYTE
ADDRESS
McASP2
BYTE
ADDRESS
REGISTER
NAME
DESCRIPTION
Device-Level Configuration Registers Controlling McASP
0x4000 0018
0x4000 001C
0x4000 0020
CFGMCASPx
Selects the peripheral pin to be used as AMUTEINx
McASP Internal Registers
0x4400 0000
0x4400 0004
0x4400 0010
0x4400 0014
0x4400 0018
0x4400 001C
0x4500 0000
0x4500 0004
0x4500 0010
0x4500 0014
0x4500 0018
0x4500 001C
0x4600 0000
0x4600 0004
0x4600 0010
0x4600 0014
0x4600 0018
0x4600 001C
PID
Peripheral identification register
PWRDEMU
PFUNC
Power down and emulation management register
Pin function register
PDIR
Pin direction register
PDOUT
Pin data output register
PDIN (reads)
PDSET (writes)
Read returns: Pin data input register
Writes affect: Pin data set register
(alternate write address: PDOUT)
0x4400 0020
0x4400 0044
0x4400 0048
0x4400 004C
0x4400 0050
0x4400 0060
0x4500 0020
0x4500 0044
0x4500 0048
0x4500 004C
0x4500 0050
0x4500 0060
0x4600 0020
0x4600 0044
0x4600 0048
0x4600 004C
0x4600 0050
0x4600 0060
PDCLR
Pin data clear register (alternate write address: PDOUT)
Global control register
GBLCTL
AMUTE
DLBCTL
DITCTL
RGBLCTL
Audio mute control register
Digital loopback control register
DIT mode control register
Receiver global control register: Alias of GBLCTL, only
receive bits are affected - allows receiver to be reset
independently from transmitter
0x4400 0064
0x4400 0068
0x4400 006C
0x4400 0070
0x4400 0074
0x4400 0078
0x4400 007C
0x4400 0080
0x4400 0084
0x4400 0088
0x4400 008C
0x4400 00A0
0x4500 0064
0x4500 0068
0x4500 006C
0x4500 0070
0x4500 0074
0x4500 0078
0x4500 007C
0x4500 0080
0x4500 0084
0x4500 0088
0x4500 008C
0x4500 00A0
0x4600 0064
0x4600 0068
0x4600 006C
0x4600 0070
0x4600 0074
0x4600 0078
0x4600 007C
0x4600 0080
0x4600 0084
0x4600 0088
0x4600 008C
0x4600 00A0
RMASK
Receive format unit bit mask register
Receive bit stream format register
Receive frame sync control register
Receive clock control register
RFMT
AFSRCTL
ACLKRCTL
AHCLKRCTL
RTDM
Receive high-frequency clock control register
Receive TDM time slot 0-31 register
Receiver interrupt control register
Receiver status register
RINTCTL
RSTAT
RSLOT
Current receive TDM time slot register
Receive clock check control register
Receiver DMA event control register
RCLKCHK
REVTCTL
XGBLCTL
Transmitter global control register. Alias of GBLCTL, only
transmit bits are affected - allows transmitter to be reset
independently from receiver
0x4400 00A4
0x4400 00A8
0x4400 00AC
0x4400 00B0
0x4400 00B4
0x4400 00B8
0x4400 00BC
0x4400 00C0
0x4400 00C4
0x4500 00A4
0x4500 00A8
0x4500 00AC
0x4500 00B0
0x4500 00B4
0x4500 00B8
0x4500 00BC
0x4500 00C0
0x4500 00C4
0x4600 00A4
0x4600 00A8
0x4600 00AC
0x4600 00B0
0x4600 00B4
0x4600 00B8
0x4600 00BC
0x4600 00C0
0x4600 00C4
XMASK
Transmit format unit bit mask register
Transmit bit stream format register
Transmit frame sync control register
Transmit clock control register
XFMT
AFSXCTL
ACLKXCTL
AHCLKXCTL
XTDM
Transmit high-frequency clock control register
Transmit TDM time slot 0-31 register
Transmitter interrupt control register
Transmitter status register
XINTCTL
XSTAT
XSLOT
Current transmit TDM time slot register
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Table 4-20. McASP Registers Accessed Through Peripheral Configuration Bus (continued)
McASP0
BYTE
ADDRESS
McASP1
BYTE
ADDRESS
McASP2
BYTE
ADDRESS
REGISTER
NAME
DESCRIPTION
0x4400 00C8
0x4500 00C8
0x4600 00C8
0x4600 00CC
0x4600 0100
0x4600 0104
0x4600 0108
0x4600 010C
0x4600 0110
0x4600 0114
0x4600 0118
0x4600 011C
0x4600 0120
0x4600 0124
0x4600 0128
0x4600 012C
0x4600 0130
0x4600 0134
0x4600 0138
0x4600 013C
0x4600 0140
0x4600 0144
0x4600 0148
0x4600 014C
0x4600 0150
0x4600 0154
0x4600 0158
0x4600 015C
0x4600 0180
0x4600 0184
–
XCLKCHK
Transmit clock check control register
Transmitter DMA event control register
Left channel status register 0
Left channel status register 1
Left channel status register 2
Left channel status register 3
Left channel status register 4
Left channel status register 5
Right channel status register 0
Right channel status register 1
Right channel status register 2
Right channel status register 3
Right channel status register 4
Right channel status register 5
Left channel user data register 0
Left channel user data register 1
Left channel user data register 2
Left channel user data register 3
Left channel user data register 4
Left channel user data register 5
Right channel user data register 0
Right channel user data register 1
Right channel user data register 2
Right channel user data register 3
Right channel user data register 4
Right channel user data register 5
Serializer control register 0
0x4400 00CC
0x4500 00CC
XEVTCTL
DITCSRA0
DITCSRA1
DITCSRA2
DITCSRA3
DITCSRA4
DITCSRA5
DITCSRB0
DITCSRB1
DITCSRB2
DITCSRB3
DITCSRB4
DITCSRB5
DITUDRA0
DITUDRA1
DITUDRA2
DITUDRA3
DITUDRA4
DITUDRA5
DITUDRB0
DITUDRB1
DITUDRB2
DITUDRB3
DITUDRB4
DITUDRB5
SRCTL0
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0x4400 0180
0x4400 0184
0x4400 0188
0x4400 018C
0x4400 0190
0x4400 0194
0x4400 0198
0x4400 019C
0x4400 01A0
0x4400 01A4
0x4400 01A8
0x4400 01AC
0x4400 01B0
0x4400 01B4
0x4400 01B8
0x4400 01BC
0x4400 0200
0x4400 0204
0x4400 0208
0x4500 0180
0x4500 0184
SRCTL1
Serializer control register 1
0x4500 0188
SRCTL2
Serializer control register 2
0x4500 018C
–
SRCTL3
Serializer control register 3
0x4500 0190
–
SRCTL4
Serializer control register 4
0x4500 0194
–
SRCTL5
Serializer control register 5
–
–
SRCTL6
Serializer control register 6
–
–
SRCTL7
Serializer control register 7
–
–
SRCTL8
Serializer control register 8
–
–
SRCTL9
Serializer control register 9
–
–
SRCTL10
SRCTL11
SRCTL12
SRCTL13
SRCTL14
SRCTL15
XBUF0(1)
XBUF1(1)
XBUF2(1)
Serializer control register 10
Serializer control register 11
Serializer control register 12
Serializer control register 13
Serializer control register 14
Serializer control register 15
Transmit buffer register for serializer 0
Transmit buffer register for serializer 1
Transmit buffer register for serializer 2
–
–
–
–
–
–
–
–
–
–
0x4500 0200
0x4500 0204
0x4500 0208
0x4600 0200
0x4600 0204
–
(1) Writes to XRBUF originate from peripheral configuration bus only when XBUSEL = 1 in XFMT.
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Table 4-20. McASP Registers Accessed Through Peripheral Configuration Bus (continued)
McASP0
BYTE
ADDRESS
McASP1
BYTE
ADDRESS
McASP2
BYTE
ADDRESS
REGISTER
NAME
DESCRIPTION
0x4400 020C
0x4400 0210
0x4400 0214
0x4400 0218
0x4400 021C
0x4400 0220
0x4400 0224
0x4400 0228
0x4400 022C
0x4400 0230
0x4400 0234
0x4400 0238
0x4400 023C
0x4400 0280
0x4400 0284
0x4400 0288
0x4400 028C
0x4400 0290
0x4400 0294
0x4400 0298
0x4400 029C
0x4400 02A0
0x4400 02A4
0x4400 02A8
0x4400 02AC
0x4400 02B0
0x4400 02B4
0x4400 02B8
0x4400 02BC
0x4500 020C
–
XBUF3(1)
Transmit buffer register for serializer 3
Transmit buffer register for serializer 4
Transmit buffer register for serializer 5
Transmit buffer register for serializer 6
Transmit buffer register for serializer 7
Transmit buffer register for serializer 8
Transmit buffer register for serializer 9
0x4500 0210
–
XBUF4(1)
XBUF5(1)
XBUF6(1)
XBUF7(1)
XBUF8(1)
XBUF9(1)
XBUF10(1)
XBUF11(1)
XBUF12(1)
XBUF13(1)
XBUF14(1)
XBUF15(1)
RBUF0(2)
RBUF1(3)
RBUF2(3)
RBUF3(3)
RBUF4(3)
RBUF5(3)
RBUF6(3)
RBUF7(3)
RBUF8(3)
RBUF9(3)
RBUF10(3)
RBUF11(3)
RBUF12(3)
RBUF13(3)
RBUF14(3)
RBUF15(3)
0x4500 0214
–
–
–
–
–
–
–
–
–
–
–
Transmit buffer register for serializer 10
Transmit buffer register for serializer 11
Transmit buffer register for serializer 12
Transmit buffer register for serializer 13
Transmit buffer register for serializer 14
Transmit buffer register for serializer 15
Receive buffer register for serializer 0
Receive buffer register for serializer 1
Receive buffer register for serializer 2
Receive buffer register for serializer 3
Receive buffer register for serializer 4
Receive buffer register for serializer 5
Receive buffer register for serializer 6
Receive buffer register for serializer 7
Receive buffer register for serializer 8
Receive buffer register for serializer 9
Receive buffer register for serializer 10
Receive buffer register for serializer 11
Receive buffer register for serializer 12
Receive buffer register for serializer 13
Receive buffer register for serializer 14
Receive buffer register for serializer 15
–
–
–
–
–
–
–
–
–
–
0x4500 0280
0x4600 0280
0x4500 0284
0x4600 0284
0x4500 0288
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0x4500 028C
0x4500 0290
0x4500 0294
–
–
–
–
–
–
–
–
–
–
(2) Reads from XRBUF originate on peripheral configuration bus only when RBUSEL = 1 in RFMT.
(3) Reads from XRBUF originate on peripheral configuration bus only when RBUSEL = 1 in RFMT.
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Figure 4-26 shows the bit layout of the CFGMCASP0 register and Table 4-21 contains a description of the
bits.
31
8
Reserved
7
3
2
0
Reserved
AMUTEIN0
R/W, 0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-26. CFGMCASP0 Register Bit Layout (0x4000 0018)
Table 4-21. CFGMCASP0 Register Bit Field Description (0x4000 0018)
RESET
VALUE
READ
WRITE
BIT NO.
NAME
DESCRIPTION
31:3
2:0
Reserved
AMUTEIN0
N/A
0
N/A
Reads are indeterminate. Only 0s should be written to these bits.
R/W
AMUTEIN0 Selects the source of the input to the McASP0 mute input.
000 = Select the input to be a constant '0'
001 = Select the input from AXR0[7]/SPI1_CLK
010 = Select the input from AXR0[8]/AXR1[5]/SPI1_SOMI
011 = Select the input from AXR0[9]/AXR1[4]/SPI1_SIMO
100 = Select the input from AHCLKR2
101 = Select the input from SPI0_SIMO
110 = Select the input from SPI0_SCS/I2C1_SCL
111 = Select the input from SPI0_ENA/I2C1_SDA
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Figure 4-27 shows the bit layout of the CFGMCASP1 register and Table 4-22 contains a description of the
bits.
31
8
Reserved
7
3
2
0
Reserved
AMUTEIN1
R/W, 0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-27. CFGMCASP1 Register Bit Layout (0x4000 001C)
Table 4-22. CFGMCASP1 Register Bit Field Description (0x4000 001C)
RESET
VALUE
READ
WRITE
BIT NO.
NAME
DESCRIPTION
31:3
2:0
Reserved
AMUTEIN1
N/A
0
N/A
Reads are indeterminate. Only 0s should be written to these bits.
R/W
AMUTEIN1 Selects the source of the input to the McASP1 mute input.
000 = Select the input to be a constant '0'
001 = Select the input from AXR0[7]/SPI1_CLK
010 = Select the input from AXR0[8]/AXR1[5]/SPI1_SOMI
011 = Select the input from AXR0[9]/AXR1[4]/SPI1_SIMO
100 = Select the input from AHCLKR2
101 = Select the input from SPI0_SIMO
110 = Select the input from SPI0_SCS/I2C1_SCL
111 = Select the input from SPI0_ENA/I2C1_SDA
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Figure 4-28 shows the bit layout of the CFGMCASP2 register and Table 4-23 contains a description of the
bits.
31
8
Reserved
7
3
2
0
Reserved
AMUTEIN2
R/W, 0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-28. CFGMCASP2 Register Bit Layout (0x4000 0020)
Table 4-23. CFGMCASP2 Register Bit Field Description (0x4000 0020)
RESET
VALUE
READ
WRITE
BIT NO.
NAME
DESCRIPTION
31:3
2:0
Reserved
AMUTEIN2
N/A
0
N/A
Reads are indeterminate. Only 0s should be written to these bits.
R/W
AMUTEIN2 Selects the source of the input to the McASP2 mute input.
000 = Select the input to be a constant '0'
001 = Select the input from AXR0[7]/SPI1_CLK
010 = Select the input from AXR0[8]/AXR1[5]/SPI1_SOMI
011 = Select the input from AXR0[9]/AXR1[4]/SPI1_SIMO
100 = Select the input from AHCLKR2
101 = Select the input from SPI0_SIMO
110 = Select the input from SPI0_SCS/I2C1_SCL
111 = Select the input from SPI0_ENA/I2C1_SDA
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4.13.2 McASP Electrical Data/Timing
4.13.2.1 Multichannel Audio Serial Port (McASP) Timing
Table 4-24 and Table 4-25 assume testing over recommended operating conditions (see Figure 4-29 and
Figure 4-30).
Table 4-24. McASP Timing Requirements(1) (2)
NO.
PARAMETER
MIN
TYP
MAX UNIT
Cycle time, AHCLKR external, AHCLKR input
Cycle time, AHCLKX external, AHCLKX input
Pulse duration, AHCLKR external, AHCLKR input
Pulse duration, AHCLKX external, AHCLKX input
Cycle time, ACLKR external, ACLKR input
Cycle time, ACLKX external, ACLKX input
Pulse duration, ACLKR external, ACLKR input
Pulse duration, ACLKX external, ACLKX input
Setup time, AFSR input to ACLKR internal
Setup time, AFSX input to ACLKX internal
Setup time, AFSR input to ACLKR external input
Setup time, AFSX input to ACLKX external input
Setup time, AFSR input to ACLKR external output
Setup time, AFSX input to ACLKX external output
Hold time, AFSR input after ACLKR internal
Hold time, AFSX input after ACLKX internal
Hold time, AFSR input after ACLKR external input
Hold time, AFSX input after ACLKX external input
Hold time, AFSR input after ACLKR external output
Hold time, AFSX input after ACLKX external output
Setup time, AXRn input to ACLKR internal
Setup time, AXRn input to ACLKR external input
Setup time, AXRn input to ACLKR external output
Hold time, AXRn input after ACLKR internal
Hold time, AXRn input after ACLKR external input
Hold time, AXRn input after ACLKR external output
20
1
tc(AHCKRX)
tw(AHCKRX)
tc(ACKRX)
tw(ACKRX)
ns
20
7.5
2
3
4
ns
ns
ns
7.5
greater of 2P or 20 ns
greater of 2P or 20 ns
10
10
8
8
3
3
3
3
0
0
3
3
3
3
8
3
3
3
3
3
5
6
tsu(AFRXC-ACKRX)
ns
ns
th(ACKRX-AFRX)
7
8
tsu(AXR-ACKRX)
ns
ns
th(ACKRX-AXR)
(1) ACLKX internal – ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1
ACLKX external input – ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0
ACLKX external output – ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1
ACLKR internal – ACLKRCTL.CLKRM = 1, PDIR.ACLKR =1
ACLKR external input – ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0
ACLKR external output – ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1
(2) P = SYSCLK2 period
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Table 4-25. McASP Switching Characteristics(1)
NO.
PARAMETER
MIN
20
TYP
MAX UNIT
Cycle time, AHCLKR internal, AHCLKR output
Cycle time, AHCLKR external, AHCLKR output
Cycle time, AHCLKX internal, AHCLKX output
Cycle time, AHCLKX external, AHCLKX output
20
9
tc(AHCKRX)
ns
20
20
Pulse duration, AHCLKR internal, AHCLKR output
Pulse duration, AHCLKR external, AHCLKR output
Pulse duration, AHCLKX internal, AHCLKX output
Pulse duration, AHCLKX external, AHCLKX output
(AHR/2) – 2.5(2)
(AHR/2) – 2.5(2)
(AHX/2) – 2.5(3)
(AHX/2) – 2.5(3)
10
tw(AHCKRX)
ns
ns
ns
greater of 2P or
20 ns(4)
Cycle time, ACLKR internal, ACLKR output
Cycle time, ACLKR external, ACLKR output
Cycle time, ACLKX internal, ACLKX output
Cycle time, ACLKX external, ACLKX output
greater of 2P or
20 ns(4)
11
12
tc(ACKRX)
greater of 2P or
20 ns(4)
greater of 2P or
20 ns(4)
Pulse duration, ACLKR internal, ACLKR output
Pulse duration, ACLKR external, ACLKR output
Pulse duration, ACLKX internal, ACLKX output
Pulse duration, ACLKX external, ACLKX output
Delay time, ACLKR internal, AFSR output
(AR/2) – 2.5(5)
(AR/2) – 2.5(5)
(AX/2) – 2.5(6)
(AX/2) – 2.5(6)
tw(ACKRX)
5
5
Delay time, ACLKX internal, AFSX output
Delay time, ACLKR external input, AFSR output
Delay time, ACLKX external input, AFSX output
Delay time, ACLKR external output, AFSR output
Delay time, ACLKX external output, AFSX output
Delay time, ACLKR internal, AFSR output
10
10
10
10
ns
13
td(ACKRX-FRX)
–2
–2
0
Delay time, ACLKX internal, AFSX output
Delay time, ACLKR external input, AFSR output
Delay time, ACLKX external input, AFSX output
Delay time, ACLKR external output, AFSR output
Delay time, ACLKX external output, AFSX output
Delay time, ACLKX internal, AXRn output
0
0
0
5
14
15
td(ACLKX-AXRV)
Delay time, ACLKX external input, AXRn output
Delay time, ACLKX external output, AXRn output
Disable time, ACLKX internal, AXRn output
10
10
ns
ns
3.5
3.5
3.5
tdis(ACKX-AXRHZ) Disable time, ACLKX external input, AXRn output
Disable time, ACLKX external output, AXRn output
(1) ACLKX internal – ACLKXCTL.CLKXM = 1, PDIR.ACLKX = 1
ACLKX external input – ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 0
ACLKX external output – ACLKXCTL.CLKXM = 0, PDIR.ACLKX = 1
ACLKR internal – ACLKRCTL.CLKRM = 1, PDIR.ACLKR =1
ACLKR external input – ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 0
ACLKR external output – ACLKRCTL.CLKRM = 0, PDIR.ACLKR = 1
(2) AHR - Cycle time, AHCLKR.
(3) AHX - Cycle time, AHCLKX.
(4) P = SYSCLK2 period
(5) AR - ACLKR period.
(6) AX - ACLKX period.
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2
1
2
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
4
3
4
(A)
ACLKR/X (CLKRP = CLKXP = 0)
(B)
ACLKR/X (CLKRP = CLKXP = 1)
6
5
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
8
7
AXR[n] (Data In/Receive)
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
A. For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
receiver is configured for falling edge (to shift data in).
B. For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
receiver is configured for rising edge (to shift data in).
Figure 4-29. McASP Input Timings
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10
10
9
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
12
11
12
(A)
ACLKR/X (CLKRP = CLKXP = 1)
(B)
ACLKR/X (CLKRP = CLKXP = 0)
13
13
13
13
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
AXR[n] (Data Out/Transmit)
13
13
13
14
15
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
A. For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
receiver is configured for rising edge (to shift data in).
B. For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
receiver is configured for falling edge (to shift data in).
Figure 4-30. McASP Output Timings
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4.14 Serial Peripheral Interface Ports (SPI0, SPI1)
4.14.1 SPI Device-Specific Information
Figure 4-31 is a block diagram of the SPI module, which is a simple shift register and buffer plus control
logic. Data is written to the shift register before transmission occurs and is read from the buffer at the end
of transmission. The SPI can operate either as a master, in which case, it initiates a transfer and drives
the SPIx_CLK pin, or as a slave. Four clock phase and polarity options are supported as well as many
data formatting options.
SPIx_SIMO
SPIx_SOMI
Peripheral
Configuration Bus
16-Bit Shift Register
SPIx_ENA
SPIx_SCS
SPIx_CLK
State
Machine
GPIO
Control
(all pins)
Interrupt and
DMA Requests
16-Bit Buffer
Clock
Control
16-Bit Emulation Buffer
C672x SPI Module
Figure 4-31. Block Diagram of SPI Module
The SPI supports 3-, 4-, and 5-pin operation with three basic pins (SPIx_CLK, SPIx_SIMO, and
SPIx_SOMI) and two optional pins (SPIx_SCS, SPIx_ENA).
The optional SPIx_SCS (Slave Chip Select) pin is most useful to enable in slave mode when there are
other slave devices on the same SPI port. The C6727B will only shift data and drive the SPIx_SOMI pin
when SPIx_SCS is held low.
In slave mode, SPIx_ENA is an optional output and can be driven in either a push-pull or open-drain
manner. The SPIx_ENA output provides the status of the internal transmit buffer (SPIDAT0/1 registers). In
four-pin mode with the enable option, SPIx_ENA is asserted only when the transmit buffer is full, indicating
that the slave is ready to begin another transfer. In five-pin mode, the SPIx_ENA is additionally qualified
by SPIx_SCS being asserted. This allows a single handshake line to be shared by multiple slaves on the
same SPI bus.
In master mode, the SPIx_ENA pin is an optional input and the master can be configured to delay the start
of the next transfer until the slave asserts SPIx_ENA. The addition of this handshake signal simplifies SPI
communications and, on average, increases SPI bus throughput since the master does not need to delay
each transfer long enough to allow for the worst-case latency of the slave device. Instead, each transfer
can begin as soon as both the master and slave have actually serviced the previous SPI transfer.
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Optional − Slave Chip Select
Optional Enable (Ready)
SPIx_SCS
SPIx_ENA
SPIx_CLK
SPIx_SOMI
SPIx_SIMO
SPIx_SCS
SPIx_ENA
SPIx_CLK
SPIx_SOMI
SPIx_SIMO
MASTER SPI
SLAVE SPI
Figure 4-32. Illustration of SPI Master-to-SPI Slave Connection
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4.14.2 SPI Peripheral Registers Description(s)
Table 4-26 is a list of the SPI registers.
Table 4-26. SPIx Configuration Registers
SPI0
BYTE ADDRESS
SPI1
REGISTER NAME
DESCRIPTION
Global Control Register 0
BYTE ADDRESS
0x4800 0000
0x4800 0004
0x4800 0008
0x4800 000C
0x4800 0010
0x4800 0014
0x4800 0018
0x4800 001C
0x4800 0020
0x4800 0024
0x4800 0028
0x4800 002C
0x4800 0030
0x4800 0034
0x4800 0038
0x4800 003C
0x4800 0040
0x4800 0044
0x4800 0048
0x4800 004C
0x4800 0050
0x4800 0054
0x4800 0058
0x4800 005C
0x4800 0060
0x4800 0064
0x4700 0000
0x4700 0004
0x4700 0008
0x4700 000C
0x4700 0010
0x4700 0014
0x4700 0018
0x4700 001C
0x4700 0020
0x4700 0024
0x4700 0028
0x4700 002C
0x4700 0030
0x4700 0034
0x4700 0038
0x4700 003C
0x4700 0040
0x4700 0044
0x4700 0048
0x4700 004C
0x4700 0050
0x4700 0054
0x4700 0058
0x4700 005C
0x4700 0060
0x4700 0064
SPIGCR0
SPIGCR1
SPIINT0
SPILVL
Global Control Register 1
Interrupt Register
Interrupt Level Register
SPIFLG
Flag Register
SPIPC0
Pin Control Register 0 (Pin Function)
Pin Control Register 1 (Pin Direction)
Pin Control Register 2 (Pin Data In)
Pin Control Register 3 (Pin Data Out)
Pin Control Register 4 (Pin Data Set)
Pin Control Register 5 (Pin Data Clear)
Reserved - Do not write to this register
Reserved - Do not write to this register
Reserved - Do not write to this register
Shift Register 0 (without format select)
Shift Register 1 (with format select)
Buffer Register
SPIPC1
SPIPC2
SPIPC3
SPIPC4
SPIPC5
Reserved
Reserved
Reserved
SPIDAT0
SPIDAT1
SPIBUF
SPIEMU
SPIDELAY
SPIDEF
Emulation Register
Delay Register
Default Chip Select Register
Format Register 0
SPIFMT0
SPIFMT1
SPIFMT2
SPIFMT3
TGINTVECT0
TGINTVECT1
Format Register 1
Format Register 2
Format Register 3
Interrupt Vector for SPI INT0
Interrupt Vector for SPI INT1
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4.14.3 SPI Electrical Data/Timing
4.14.3.1 Serial Peripheral Interface (SPI) Timing
Table 4-27 through Table 4-34 assume testing over recommended operating conditions (see Figure 4-33
through Figure 4-36).
Table 4-27. General Timing Requirements for SPIx Master Modes(1)
NO.
1
PARAMETER
MIN
greater of 8P or 100 ns
greater of 4P or 45 ns
greater of 4P or 45 ns
TYP
MAX UNIT
tc(SPC)M
Cycle Time, SPIx_CLK, All Master Modes
Pulse Width High, SPIx_CLK, All Master Modes
Pulse Width Low, SPIx_CLK, All Master Modes
256P
ns
ns
ns
2
tw(SPCH)M
tw(SPCL)M
3
Polarity = 0, Phase = 0,
to SPIx_CLK rising
2P
0.5tc(SPC)M + 2P
2P
Polarity = 0, Phase = 1,
to SPIx_CLK rising
Delay, initial data bit
valid on SPIx_SIMO to
initial edge on
4
5
6
7
8
td(SIMO_SPC)M
ns
ns
ns
ns
ns
Polarity = 1, Phase = 0,
to SPIx_CLK falling
SPIx_CLK(2)
Polarity = 1, Phase = 1,
to SPIx_CLK falling
0.5tc(SPC)M + 2P
Polarity = 0, Phase = 0,
from SPIx_CLK rising
15
15
15
15
Polarity = 0, Phase = 1,
from SPIx_CLK falling
Delay, subsequent bits
valid on SPIx_SIMO
after transmit edge of
SPIx_CLK
td(SPC_SIMO)M
Polarity = 1, Phase = 0,
from SPIx_CLK falling
Polarity = 1, Phase = 1,
from SPIx_CLK rising
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)M – 10
0.5tc(SPC)M – 10
0.5tc(SPC)M – 10
0.5tc(SPC)M – 10
0.5P + 15
Output hold time,
SPIx_SIMO valid after
toh(SPC_SIMO)M receive edge of
SPIxCLK, except for
final bit(3)
Polarity = 0, Phase = 1,
from SPIx_CLK rising
Polarity = 1, Phase = 0,
from SPIx_CLK rising
Polarity = 1, Phase = 1,
from SPIx_CLK falling
Polarity = 0, Phase = 0,
to SPIx_CLK falling
Polarity = 0, Phase = 1,
to SPIx_CLK rising
Input Setup Time,
SPIx_SOMI valid
before receive
edge of SPIx_CLK
0.5P + 15
tsu(SOMI_SPC)M
Polarity = 1, Phase = 0,
to SPIx_CLK rising
0.5P + 15
Polarity = 1, Phase = 1,
to SPIx_CLK falling
0.5P + 15
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5P + 5
Polarity = 0, Phase = 1,
from SPIx_CLK rising
Input Hold Time,
0.5P + 5
SPIx_SOMI valid after
tih(SPC_SOMI)M
receive edge of
Polarity = 1, Phase = 0,
from SPIx_CLK rising
0.5P + 5
SPIx_CLK
Polarity = 1, Phase = 1,
from SPIx_CLK falling
0.5P + 5
(1) P = SYSCLK2 period
(2) First bit may be MSB or LSB depending upon SPI configuration. MO(0) refers to first bit and MO(n) refers to last bit output on
SPIx_SIMO. MI(0) refers to the first bit input and MI(n) refers to the last bit input on SPIx_SOMI.
(3) The final data bit will be held on the SPIx_SIMO pin until the SPIDAT0 or SPIDAT1 register is written with new data.
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Table 4-28. General Timing Requirements for SPIx Slave Modes(1)
PARAMETER
MIN
greater of 8P or 100 ns
greater of 4P or 45 ns
greater of 4P or 45 ns
TYP
MAX UNIT
9
tc(SPC)S
10 tw(SPCH)S
11 tw(SPCL)S
Cycle Time, SPIx_CLK, All Slave Modes
Pulse Width High, SPIx_CLK, All Slave Modes
Pulse Width Low, SPIx_CLK, All Slave Modes
Polarity = 0, Phase = 0,
256P
ns
ns
ns
2P
2P
2P
2P
to SPIx_CLK rising
Setup time, transmit
data written to SPI and
output onto
Polarity = 0, Phase = 1,
to SPIx_CLK rising
12 tsu(SOMI_SPC)S
ns
ns
ns
ns
ns
SPIx_SOMI pin before
initial clock edge from
master.(2) (3)
Polarity = 1, Phase = 0,
to SPIx_CLK falling
Polarity = 1, Phase = 1,
to SPIx_CLK falling
Polarity = 0, Phase = 0,
from SPIx_CLK rising
2P + 15
2P + 15
2P + 15
2P + 15
Polarity = 0, Phase = 1,
from SPIx_CLK falling
Delay, subsequent bits
valid on SPIx_SOMI
after transmit edge of
SPIx_CLK
13 td(SPC_SOMI)S
Polarity = 1, Phase = 0,
from SPIx_CLK falling
Polarity = 1, Phase = 1,
from SPIx_CLK rising
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)S – 10
0.5tc(SPC)S – 10
0.5tc(SPC)S – 10
0.5tc(SPC)S – 10
0.5P + 15
Output hold time,
SPIx_SOMI valid after
Polarity = 0, Phase = 1,
from SPIx_CLK rising
14 toh(SPC_SOMI)S receive edge of
SPIxCLK, except for
final bit(4)
Polarity = 1, Phase = 0,
from SPIx_CLK rising
Polarity = 1, Phase = 1,
from SPIx_CLK falling
Polarity = 0, Phase = 0,
to SPIx_CLK falling
Polarity = 0, Phase = 1,
to SPIx_CLK rising
Input Setup Time,
SPIx_SIMO valid
0.5P + 15
15 tsu(SIMO_SPC)S
before receive
edge of SPIx_CLK
Polarity = 1, Phase = 0,
to SPIx_CLK rising
0.5P + 15
Polarity = 1, Phase = 1,
to SPIx_CLK falling
0.5P + 15
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5P + 5
Polarity = 0, Phase = 1,
from SPIx_CLK rising
Input Hold Time,
0.5P + 5
SPIx_SIMO valid after
16 tih(SPC_SIMO)S
receive edge of
SPIx_CLK
Polarity = 1, Phase = 0,
from SPIx_CLK rising
0.5P + 5
Polarity = 1, Phase = 1,
from SPIx_CLK falling
0.5P + 5
(1) P = SYSCLK2 period
(2) First bit may be MSB or LSB depending upon SPI configuration. SO(0) refers to first bit and SO(n) refers to last bit output on
SPIx_SOMI. SI(0) refers to the first bit input and SI(n) refers to the last bit input on SPIx_SIMO.
(3) Measured from the termination of the write of new data to the SPI module, as evidenced by new output data appearing on the
SPIx_SOMI pin. In analyzing throughput requirements, additional internal bus cycles must be accounted for to allow data to be written to
the SPI module by either the DSP CPU or the dMAX.
(4) The final data bit will be held on the SPIx_SOMI pin until the SPIDAT0 or SPIDAT1 register is written with new data.
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Table 4-29. Additional(1) SPI Master Timings, 4-Pin Enable Option(2) (3)
NO.
PARAMETER
MIN
TYP
MAX UNIT
Polarity = 0, Phase = 0,
to SPIx_CLK rising
3P + 15
Polarity = 0, Phase = 1,
to SPIx_CLK rising
0.5tc(SPC)M + 3P + 15
Delay from slave assertion of
17
td(ENA_SPC)M SPIx_ENA active to first SPIx_CLK
ns
from master.(4)
Polarity = 1, Phase = 0,
to SPIx_CLK falling
3P + 15
Polarity = 1, Phase = 1,
to SPIx_CLK falling
0.5tc(SPC)M + 3P + 15
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)M
Polarity = 0, Phase = 1,
from SPIx_CLK falling
Max delay for slave to deassert
SPIx_ENA after final SPIx_CLK
0
0.5tc(SPC)M
0
18
td(SPC_ENA)M
ns
edge to ensure master does not
Polarity = 1, Phase = 0,
from SPIx_CLK rising
begin the next transfer.(5)
Polarity = 1, Phase = 1,
from SPIx_CLK rising
(1) These parameters are in addition to the general timings for SPI master modes (Table 4-27).
(2) P = SYSCLK2 period
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.
(4) In the case where the master SPI is ready with new data before SPIx_ENA assertion.
(5) In the case where the master SPI is ready with new data before SPIx_ENA deassertion.
Table 4-30. Additional(1) SPI Master Timings, 4-Pin Chip Select Option(2) (3)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
Polarity = 0, Phase = 0,
to SPIx_CLK rising
2P – 10
Polarity = 0, Phase = 1,
to SPIx_CLK rising
0.5tc(SPC)M + 2P – 10
Delay from SPIx_SCS active to first
19
td(SCS_SPC)M
ns
(5)
SPIx_CLK(4)
Polarity = 1, Phase = 0,
to SPIx_CLK falling
2P – 10
Polarity = 1, Phase = 1,
to SPIx_CLK falling
0.5tc(SPC)M + 2P – 10
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)M
Polarity = 0, Phase = 1,
from SPIx_CLK falling
0
0.5tc(SPC)M
0
Delay from final SPIx_CLK edge to
master deasserting SPIx_SCS
20
td(SPC_SCS)M
ns
(6) (7)
Polarity = 1, Phase = 0,
from SPIx_CLK rising
Polarity = 1, Phase = 1,
from SPIx_CLK rising
(1) These parameters are in addition to the general timings for SPI master modes (Table 4-27).
(2) P = SYSCLK2 period
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.
(4) In the case where the master SPI is ready with new data before SPIx_SCS assertion.
(5) This delay can be increased under software control by the register bit field SPIDELAY.C2TDELAY[4:0].
(6) Except for modes when SPIDAT1.CSHOLD is enabled and there is additional data to transmit. In this case, SPIx_SCS will remain
asserted.
(7) This delay can be increased under software control by the register bit field SPIDELAY.T2CDELAY[4:0].
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Table 4-31. Additional(1) SPI Master Timings, 5-Pin Option(2) (3)
PARAMETER
MIN
TYP
MAX UNIT
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)M
Max delay for slave to
deassert SPIx_ENA after
final SPIx_CLK edge to
ensure master does not
begin the next transfer.(4)
Polarity = 0, Phase = 1,
from SPIx_CLK falling
0
18
td(SPC_ENA)M
ns
Polarity = 1, Phase = 0,
from SPIx_CLK rising
0.5tc(SPC)M
Polarity = 1, Phase = 1,
from SPIx_CLK rising
0
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)M
Polarity = 0, Phase = 1,
from SPIx_CLK falling
Delay from final
0
0.5tc(SPC)M
0
SPIx_CLK edge to
master deasserting
20
21
22
td(SPC_SCS)M
ns
Polarity = 1, Phase = 0,
from SPIx_CLK rising
(5) (6)
SPIx_SCS
Polarity = 1, Phase = 1,
from SPIx_CLK rising
Max delay for slave SPI to drive SPIx_ENA valid after
td(SCSL_ENAL)M master asserts SPIx_SCS to delay the
master from beginning the next transfer.
0.5P
ns
ns
Polarity = 0, Phase = 0,
to SPIx_CLK rising
2P – 10
0.5tc(SPC)M + 2P – 10
2P – 10
Polarity = 0, Phase = 1,
to SPIx_CLK rising
Delay from SPIx_SCS
active to first
td(SCS_SPC)M
(8) (9)
SPIx_CLK(7)
Polarity = 1, Phase = 0,
to SPIx_CLK falling
Polarity = 1, Phase = 1,
to SPIx_CLK falling
0.5tc(SPC)M + 2P – 10
Polarity = 0, Phase = 0,
to SPIx_CLK rising
3P + 15
0.5tc(SPC)M + 3P + 15
3P + 15
Polarity = 0, Phase = 1,
to SPIx_CLK rising
Delay from assertion of
SPIx_ENA low to first
SPIx_CLK edge.(10)
23
td(ENA_SPC)M
ns
Polarity = 1, Phase = 0,
to SPIx_CLK falling
Polarity = 1, Phase = 1,
to SPIx_CLK falling
0.5tc(SPC)M + 3P + 15
(1) These parameters are in addition to the general timings for SPI master modes (Table 4-27).
(2) P = SYSCLK2 period
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four master clocking modes.
(4) In the case where the master SPI is ready with new data before SPIx_ENA deassertion.
(5) Except for modes when SPIDAT1.CSHOLD is enabled and there is additional data to transmit. In this case, SPIx_SCS will remain
asserted.
(6) This delay can be increased under software control by the register bit field SPIDELAY.T2CDELAY[4:0].
(7) If SPIx_ENA is asserted immediately such that the transmission is not delayed by SPIx_ENA.
(8) In the case where the master SPI is ready with new data before SPIx_SCS assertion.
(9) This delay can be increased under software control by the register bit field SPIDELAY.C2TDELAY[4:0].
(10) If SPIx_ENA was initially deasserted high and SPIx_CLK is delayed.
Table 4-32. Additional(1) SPI Slave Timings, 4-Pin Enable Option(2) (3)
NO.
PARAMETER
MIN
TYP
MAX UNIT
3P + 15
Polarity = 0, Phase = 0,
from SPIx_CLK falling
P – 10
Polarity = 0, Phase = 1,
from SPIx_CLK falling
Delay from final
SPIx_CLK edge to
slave deasserting
SPIx_ENA.
–0.5tc(SPC)M + P – 10
P – 10
–0.5tc(SPC)M + 3P + 15
3P + 15
24
td(SPC_ENAH)S
ns
Polarity = 1, Phase = 0,
from SPIx_CLK rising
Polarity = 1, Phase = 1,
from SPIx_CLK rising
–0.5tc(SPC)M + P – 10
–0.5tc(SPC)M + 3P + 15
(1) These parameters are in addition to the general timings for SPI slave modes (Table 4-28).
(2) P = SYSCLK2 period
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.
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Table 4-33. Additional(1) SPI Slave Timings, 4-Pin Chip Select Option(2) (3)
NO.
PARAMETER
MIN
TYP
MAX UNIT
Required delay from SPIx_SCS asserted at slave to first
SPIx_CLK edge at slave.
25
td(SCSL_SPC)S
P
ns
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)M + P + 10
P + 10
Polarity = 0, Phase = 1,
from SPIx_CLK falling
Required delay from final
SPIx_CLK edge before
SPIx_SCS is deasserted.
26
td(SPC_SCSH)S
ns
Polarity = 1, Phase = 0,
from SPIx_CLK rising
0.5tc(SPC)M + P + 10
P + 10
Polarity = 1, Phase = 1,
from SPIx_CLK rising
Delay from master asserting SPIx_SCS to slave driving
SPIx_SOMI valid
27
28
tena(SCSL_SOMI)S
tdis(SCSH_SOMI)S
P + 15
P + 15
ns
ns
Delay from master deasserting SPIx_SCS to slave 3-stating
SPIx_SOMI
(1) These parameters are in addition to the general timings for SPI slave modes (Table 4-28).
(2) P = SYSCLK2 period
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.
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Table 4-34. Additional(1) SPI Slave Timings, 5-Pin Option(2) (3)
PARAMETER
MIN
TYP
MAX
UNIT
Required delay from SPIx_SCS asserted at slave to first
SPIx_CLK edge at slave.
25
td(SCSL_SPC)S
P
ns
Polarity = 0, Phase = 0,
from SPIx_CLK falling
0.5tc(SPC)M + P + 10
P + 10
Polarity = 0, Phase = 1,
from SPIx_CLK falling
Required delay from final
SPIx_CLK edge before
SPIx_SCS is deasserted.
26
td(SPC_SCSH)S
ns
Polarity = 1, Phase = 0,
from SPIx_CLK rising
0.5tc(SPC)M + P + 10
P + 10
Polarity = 1, Phase = 1,
from SPIx_CLK rising
Delay from master asserting SPIx_SCS to slave driving
SPIx_SOMI valid
27
28
29
tena(SCSL_SOMI)S
tdis(SCSH_SOMI)S
tena(SCSL_ENA)S
P + 15
P + 15
15
ns
ns
ns
Delay from master deasserting SPIx_SCS to slave 3-stating
SPIx_SOMI
Delay from master deasserting SPIx_SCS to slave driving
SPIx_ENA valid
Polarity = 0, Phase = 0,
from SPIx_CLK falling
2P + 15
2P + 15
2P + 15
2P + 15
Polarity = 0, Phase = 1,
Delay from final clock
from SPIx_CLK rising
receive edge on SPIx_CLK
30
tdis(SPC_ENA)S
ns
to slave 3-stating or driving
Polarity = 1, Phase = 0,
from SPIx_CLK rising
high SPIx_ENA.(4)
Polarity = 1, Phase = 1,
from SPIx_CLK falling
(1) These parameters are in addition to the general timings for SPI slave modes (Table 4-28).
(2) P = SYSCLK2 period
(3) Figure shows only Polarity = 0, Phase = 0 as an example. Table gives parameters for all four slave clocking modes.
(4) SPIx_ENA is driven low after the transmission completes if the SPIINT0.ENABLE_HIGHZ bit is programmed to 0. Otherwise it is 3-
stated. If 3-stated, an external pullup resistor should be used to provide a valid level to the master. This option is useful when tying
several SPI slave devices to a single master.
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1
MASTER MODE
POLARITY = 0 PHASE = 0
2
3
SPIx_CLK
SPI_SIMO
SPI_SOMI
5
4
6
MO(0)
7
MO(1)
MO(n−1)
MO(n)
MI(n)
8
MI(0)
MI(1)
MI(n−1)
MASTER MODE
POLARITY = 0 PHASE = 1
4
SPIx_CLK
SPI_SIMO
SPI_SOMI
6
5
MO(0)
7
MO(1)
MI(1)
MO(n−1)
MI(n−1)
MO(n)
MI(n)
8
MI(0)
4
MASTER MODE
POLARITY = 1 PHASE = 0
SPIx_CLK
SPI_SIMO
SPI_SOMI
5
6
MO(0)
7
MO(1)
MI(1)
MO(n−1)
MO(n)
MI(n)
8
MI(0)
MI(n−1)
MASTER MODE
POLARITY = 1 PHASE = 1
SPIx_CLK
SPI_SIMO
SPI_SOMI
5
4
6
MO(0)
7
MO(1)
MI(1)
MO(n−1)
MI(n−1)
MO(n)
MI(n)
8
MI(0)
Figure 4-33. SPI Timings—Master Mode
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9
SLAVE MODE
POLARITY = 0 PHASE = 0
12
10
15
11
SPIx_CLK
16
SPI_SIMO
SPI_SOMI
SI(0)
SI(1)
13
SI(n−1)
SI(n)
14
SO(0)
SO(1)
SO(n−1)
SO(n)
12
SLAVE MODE
POLARITY = 0 PHASE = 1
SPIx_CLK
SPI_SIMO
SPI_SOMI
15
SI(0)
16
SI(1)
SI(n−1)
SI(n)
13
14
SO(0)
SO(1)
SO(n−1)
SO(n)
SLAVE MODE
POLARITY = 1 PHASE = 0
12
SPIx_CLK
SPI_SIMO
SPI_SOMI
15
16
SI(0)
SI(1)
SI(n−1)
SI(n)
13
SO(1)
14
SO(n−1)
SO(0)
SO(n)
SLAVE MODE
POLARITY = 1 PHASE = 1
12
SPIx_CLK
SPI_SIMO
SPI_SOMI
15
16
SI(0)
SI(1)
SI(n−1)
SI(n)
13
14
SO(0)
SO(1)
SO(n−1)
SO(n)
Figure 4-34. SPI Timings—Slave Mode
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MASTER MODE 4 PIN WITH ENABLE
17
18
SPIx_CLK
SPI_SIMO
SPI_SOMI
SPIx_ENA
MO(0)
MI(0)
MO(n)
MI(n)
MO(n−1)
MI(n−1)
MO(1)
MI(1)
MASTER MODE 4 PIN WITH CHIP SELECT
19
20
SPIx_CLK
SPI_SIMO
SPI_SOMI
SPIx_SCS
MO(0)
MO(n)
MI(n)
MO(n−1)
MI(n−1)
MO(1)
MI(1)
MI(0)
MASTER MODE 5 PIN
23
22
20
MO(1)
18
SPIx_CLK
SPI_SIMO
SPI_SOMI
MO(0)
MO(n−1)
MO(n)
MI(0)
MI(1)
MI(n−1)
MI(n)
21
(A)
(A)
SPIx_ENA
SPIx_SCS
DESEL
DESEL
A. DESELECTED IS PROGRAMMABLE EITHER HIGH OR
3−STATE (REQUIRES EXTERNAL PULLUP)
Figure 4-35. SPI Timings—Master Mode (4-Pin and 5-Pin)
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SLAVE MODE 4 PIN WITH ENABLE
24
SPIx_CLK
SPI_SOMI
SPI_SIMO
SPIx_ENA
SO(0)
SI(0)
SO(1)
SO(n−1) SO(n)
SI(n−1) SI(n)
SI(1)
SLAVE MODE 4 PIN WITH CHIP SELECT
25
26
SPIx_CLK
27
28
SO(n−1)
SPI_SOMI
SPI_SIMO
SPIx_SCS
SO(0)
SO(1)
SO(n)
SI(0)
SI(1)
SI(n−1)
SI(n)
SLAVE MODE 5 PIN
25
26
30
SPIx_CLK
27
29
28
SO(1)
SPI_SOMI
SPI_SIMO
SO(0)
SI(0)
SO(n−1)
SO(n)
SI(1)
SI(n−1) SI(n)
SPIx_ENA
SPIx_SCS
(A)
(A)
DESEL
DESEL
A. DESELECTED IS PROGRAMMABLE EITHER HIGH OR
3−STATE (REQUIRES EXTERNAL PULLUP)
Figure 4-36. SPI Timings—Slave Mode (4-Pin and 5-Pin)
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4.15 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
4.15.1 I2C Device-Specific Information
Having two I2C modules on the C6727B simplifies system architecture, since one module may be used by
the DSP to control local peripherals ICs (DACs, ADCs, etc.) while the other may be used to communicate
with other controllers in a system or to implement a user interface. Figure 4-37 is block diagram of the
C6727B I2C Module.
Each I2C port supports:
•
•
•
•
•
•
•
Compatible with Philips® I2C Specification Revision 2.1 (January 2000)
Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
Noise Filter to Remove Noise 50 ns or less
Seven- and Ten-Bit Device Addressing Modes
Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
Events: DMA, Interrupt, or Polling
General-Purpose I/O Capability if not used as I2C
CAUTION
The C6727B I2C pins use a standard ±8 mA LVCMOS buffer, not the slow I/O buffer
defined in the I2C specification. Series resistors may be necessary to reduce noise at
the system level.
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C672x I2C Module
Clock Prescaler
Control
I2CCOARx
Prescaler
Register
Own Address
Register
I2CPSCx
Slave Address
Register
I2CSARx
Bit Clock Generator
I2CCLKHx
Noise
Filter
I2Cx_SCL
Clock Divide
High Register
I2CCMDRx
I2CEMDRx
I2CCNTx
I2CPID1
Mode Register
Extended Mode
Register
Clock Divide
Low Register
I2CCLKLx
Data Count
Register
Peripheral
Configuration
Bus
Transmit
I2CXSRx
Peripheral ID
Register 1
Transmit Shift
Register
Peripheral ID
Register 2
I2CPID2
I2CDXRx
Transmit Buffer
Noise
Filter
I2Cx_SDA
Interrupt/DMA
Interrupt Enable
Register
Receive
I2CIERx
Interrupt DMA
Requests
Receive Buffer
I2CDRRx
Interrupt Status
Register
I2CSTRx
I2CSRCx
Receive Shift
Register
Interrupt Source
Register
I2CRSRx
Control
Pin Function
Register
Pin Data Out
Register
I2CPDOUT
I2CPFUNC
Pin Direction
Register
Pin Data In
Register
Pin Data Set
Register
Pin Data Clear
Register
I2CPDIR
I2CPDIN
I2CPDSET
I2CPDCLR
Figure 4-37. I2C Module Block Diagram
4.15.2 I2C Peripheral Registers Description(s)
Table 4-35 is a list of the I2C registers.
Table 4-35. I2Cx Configuration Registers
I2C0
BYTE ADDRESS
I2C1
REGISTER NAME
DESCRIPTION
BYTE ADDRESS
0x4A00 0000
0x4A00 0004
0x4A00 0008
0x4A00 000C
0x4A00 0010
0x4A00 0014
0x4A00 0018
0x4A00 001C
0x4A00 0020
0x4A00 0024
0x4A00 0028
0x4A00 002C
0x4A00 0030
0x4A00 0034
0x4900 0000
0x4900 0004
0x4900 0008
0x4900 000C
0x4900 0010
0x4900 0014
0x4900 0018
0x4900 001C
0x4900 0020
0x4900 0024
0x4900 0028
0x4900 002C
0x4900 0030
0x4900 0034
I2COAR
I2CIER
Own Address Register
Interrupt Enable Register
Interrupt Status Register
Clock Low Time Divider Register
Clock High Time Divider Register
Data Count Register
I2CSTR
I2CCLKL
I2CCLKH
I2CCNT
I2CDRR
I2CSAR
I2CDXR
I2CMDR
I2CISR
Data Receive Register
Slave Address Register
Data Transmit Register
Mode Register
Interrupt Source Register
Extended Mode Register
Prescale Register
I2CEMDR
I2CPSC
I2CPID1
Peripheral Identification Register 1
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Table 4-35. I2Cx Configuration Registers (continued)
I2C0
BYTE ADDRESS
I2C1
REGISTER NAME
DESCRIPTION
BYTE ADDRESS
0x4A00 0038
0x4A00 0048
0x4A00 004C
0x4A00 0050
0x4A00 0054
0x4A00 0058
0x4A00 005C
0x4900 0038
0x4900 0048
0x4900 004C
0x4900 0050
0x4900 0054
0x4900 0058
0x4900 005C
I2CPID2
Peripheral Identification Register 2
Pin Function Register
I2CPFUNC
I2CPDIR
Pin Direction Register
I2CPDIN
Pin Data Input Register
Pin Data Output Register
Pin Data Set Register
I2CPDOUT
I2CPDSET
I2CPDCLR
Pin Data Clear Register
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4.15.3 I2C Electrical Data/Timing
4.15.3.1 Inter-Integrated Circuit (I2C) Timing
Table 4-36 and Table 4-37 assume testing over recommended operating conditions (see Figure 4-38 and
Figure 4-39).
Table 4-36. I2C Input Timing Requirements
NO.
PARAMETER
MIN
10
TYP
MAX UNIT
Standard Mode
Fast Mode
1
tc(SCL)
Cycle time, I2Cx_SCL
μs
2.5
4.7
0.6
4
Standard Mode
Fast Mode
Setup time, I2Cx_SCL high before
I2Cx_SDA low
2
3
tsu(SCLH-SDAL)
th(SCLL-SDAL)
tw(SCLL)
μs
μs
μs
μs
ns
Standard Mode
Fast Mode
Hold time, I2Cx_SCL low after
I2Cx_SDA low
0.6
4.7
1.3
4
Standard Mode
Fast Mode
4
Pulse duration, I2Cx_SCL low
Pulse duration, I2Cx_SCL high
Standard Mode
Fast Mode
5
tw(SCLH)
tsu(SDA-SCLH)
th(SDA-SCLL)
tw(SDAH)
tr(SDA)
0.6
250
100
0
Standard Mode
Fast Mode
Setup time, I2Cx_SDA before
I2Cx_SCL high
6
Standard Mode
Fast Mode
Hold time, I2Cx_SDA after I2Cx_SCL
low
7
μs
0
0.9
Standard Mode
Fast Mode
4.7
1.3
8
Pulse duration, I2Cx_SDA high
Rise time, I2Cx_SDA
Rise time, I2Cx_SCL
Fall time, I2Cx_SDA
μs
Standard Mode
Fast Mode
1000
ns
9
20 + 0.1Cb
20 + 0.1Cb
20 + 0.1Cb
300
Standard Mode
Fast Mode
1000
ns
10
11
12
13
14
15
tr(SCL)
300
Standard Mode
Fast Mode
300
ns
tf(SDA)
300
Standard Mode
Fast Mode
300
ns
tf(SCL)
Fall time, I2Cx_SCL
20 + 0.1Cb
300
Standard Mode
Fast Mode
4
0.6
N/A
0
Setup time, I2Cx_SCL high before
I2Cx_SDA high
tsu(SCLH-SDAH)
μs
Standard Mode
Fast Mode
Pulse duration, spike (must be
suppressed)
tw(SP)
ns
50
Standard Mode
Fast Mode
400
pF
Cb
Capacitive load for each bus line
400
Table 4-37. I2C Switching Characteristics(1)
NO.
PARAMETER
MIN
10
TYP
MAX UNIT
Standard Mode
16
tc(SCL)
Cycle time, I2Cx_SCL
μs
Fast Mode
2.5
4.7
0.6
4
Standard Mode
Fast Mode
Setup time, I2Cx_SCL high before
I2Cx_SDA low
17
18
19
tsu(SCLH-SDAL)
th(SDAL-SCLL)
tw(SCLL)
μs
μs
μs
Standard Mode
Fast Mode
Hold time, I2Cx_SCL low after
I2Cx_SDA low
0.6
4.7
1.3
Standard Mode
Fast Mode
Pulse duration, I2Cx_SCL low
(1) I2C must be configured correctly to meet the timings in Table 4-37.
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Table 4-37. I2C Switching Characteristics(1) (continued)
NO.
PARAMETER
MIN
4
TYP
MAX UNIT
Standard Mode
Fast Mode
20
21
22
23
28
29
tw(SCLH)
Pulse duration, I2Cx_SCL high
μs
0.6
250
100
0
Standard Mode
Fast Mode
Setup time, I2Cx_SDA valid before
I2Cx_SCL high
tsu(SDAV-SCLH)
th(SCLL-SDAV)
tw(SDAH)
ns
Standard Mode
Fast Mode
Hold time, I2Cx_SDA valid after
I2Cx_SCL low
μs
0
0.9
Standard Mode
Fast Mode
4.7
1.3
4
Pulse duration, I2Cx_SDA high
μs
μs
Standard Mode
Fast Mode
Setup time, I2Cx_SCL high before
I2Cx_SDA high
tsu(SCLH-SDAH)
0.6
Standard Mode
Fast Mode
10
pF
10
Capacitive load on each bus line from
this device
Cb
11
9
I2Cx_SDA
I2Cx_SCL
6
8
14
4
13
5
10
1
12
3
2
7
3
Stop
Start
Repeated
Start
Stop
Figure 4-38. I2C Receive Timings
26
24
I2Cx_SDA
I2Cx_SCL
21
23
19
28
20
25
16
27
18
17
22
18
Stop
Start
Repeated
Start
Stop
Figure 4-39. I2C Transmit Timings
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4.16 Real-Time Interrupt (RTI) Timer With Digital Watchdog
4.16.1 RTI/Digital Watchdog Device-Specific Information
C6727B includes an RTI timer module which is used to generate periodic interrupts. This module also
includes an optional digital watchdog feature. Figure 4-40 contains a block diagram of the RTI module.
Counter 0
SYSCLK2
32-Bit + 32-Bit Prescale
(Used by DSP BIOS)
Compare 0
32-Bit
RTI Interrupt 0
Capture 0
32-Bit + 32-Bit Prescale
Compare 1
32-Bit
RTI Interrupt 1
RTI Interrupt 2
RTI Interrupt 3
Compare 2
32-Bit
Counter 1
32-Bit + 32-Bit Prescale
Compare 3
32-Bit
Capture 1
32-Bit + 32-Bit Prescale
Digital Watchdog
25-Bit Counter
RESET
(Internal Only)
Controlled by
CFGRTI Register
Watchdog Key Register
16-Bit Key
McASP0,1,2
Transmit/Receive
DMA Events
McASP0,1,2
Transmit/Receive
DMA Events
Figure 4-40. RTI Timer Block Diagram
The RTI timer module consists of two independent counters which are both clocked from SYSCLK2 (but
may be started individually and may have different prescaler settings).
The counters provide the timebase against which four output comparators operate. These comparators
may be programmed to generate periodic interrupts. The comparators include an adder which
automatically updates the compare value after each periodic interrupt. This means that the DSP only
needs to initialize the comparator once with the interrupt period.
The two input captures can be triggered from any of the McASP0, McASP1, or McASP2 DMA events. The
device configuration register which selects the McASP events to measure is defined in Table 4-39.
Measuring the time difference between these events provides an accurate measure of the sample rates at
which the McASPs are transmitting and receiving. This measurement can be useful as a hardware assist
for a software asynchronous sample rate converter algorithm.
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The digital watchdog is disabled by default. Once enabled, a sequence of two 16-bit key values (0xE51A
followed by 0xA35C in two separate writes) must be continually written to the key register before the
watchdog counter counts down to zero; otherwise, the DSP will be reset. This feature can be used to
provide an added measure of robustness against a software failure. If the application fails and ceases to
write to the watchdog key; the watchdog will respond by resetting the DSP and thereby restarting the
application.
Note that Counter 0 and Compare 0 are used by DSP BIOS to generate the tick counter it requires;
however, Capture 0 is still available for use by the application as well as the remaining RTI resources.
4.16.2 RTI/Digital Watchdog Registers Description(s)
Table 4-38 is a list of the RTI registers.
Table 4-38. RTI Registers
BYTE ADDRESS
REGISTER NAME
DESCRIPTION
Device-Level Configuration Registers Controlling RTI
0x4000 0014
CFGRTI
Selects the sources for the RTI input captures from among the six McASP DMA event.
RTI Internal Registers
0x4200 0000
0x4200 0004
0x4200 0008
0x4200 000C
0x4200 0010
0x4200 0014
0x4200 0018
0x4200 0020
RTIGCTRL
Reserved
Global Control Register. Starts / stops the counters.
Reserved bit.
RTICAPCTRL
RTICOMPCTRL
RTIFRC0
Capture Control. Controls the capture source for the counters.
Compare Control. Controls the source for the compare registers.
Free-Running Counter 0. Current value of free-running counter 0.
Up-Counter 0. Current value of prescale counter 0.
Compare Up-Counter 0. Compare value compared with prescale counter 0.
RTIUC0
RTICPUC0
RTICAFRC0
Capture Free-Running Counter 0. Current value of free-running counter 0 on external
event.
0x4200 0024
0x4200 0030
0x4200 0034
0x4200 0038
0x4200 0040
RTICAUC0
RTIFRC1
Capture Up-Counter 0. Current value of prescale counter 0 on external event.
Free-Running Counter 1. Current value of free-running counter 1.
Up-Counter 1. Current value of prescale counter 1.
RTIUC1
RTICPUC1
RTICAFRC1
Compare Up-Counter 1. Compare value compared with prescale counter 1.
Capture Free-Running Counter 1. Current value of free-running counter 1 on external
event.
0x4200 0044
0x4200 0050
0x4200 0054
RTICAUC1
RTICOMP0
RTIUDCP0
Capture Up-Counter 1. Current value of prescale counter 1 on external event.
Compare 0. Compare value to be compared with the counters.
Update Compare 0. Value to be added to the compare register 0 value on compare
match.
0x4200 0058
0x4200 005C
RTICOMP1
RTIUDCP1
Compare 1. Compare value to be compared with the counters.
Update Compare 1. Value to be added to the compare register 1 value on compare
match.
0x4200 0060
0x4200 0064
RTICOMP2
RTIUDCP2
Compare 2. Compare value to be compared with the counters.
Update Compare 2. Value to be added to the compare register 2 value on compare
match.
0x4200 0068
0x4200 006C
RTICOMP3
RTIUDCP3
Compare 3. Compare value to be compared with the counters.
Update Compare 3. Value to be added to the compare register 3 value on compare
match.
0x4200 0070
0x4200 0074
0x4200 0080
Reserved
Reserved
RTISETINT
Reserved bit.
Reserved bit.
Set Interrupt Enable. Sets interrupt enable bits int RTIINTCTRL without having to do a
read-modify-write operation.
0x4200 0084
0x4200 0088
RTICLEARINT
RTIINTFLAG
Clear Interrupt Enable. Clears interrupt enable bits int RTIINTCTRL without having to
do a read-modify-write operation.
Interrupt Flags. Interrupt pending bits.
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Table 4-38. RTI Registers (continued)
BYTE ADDRESS
REGISTER NAME
DESCRIPTION
Digital Watchdog Control. Enables the Digital Watchdog.
0x4200 0090
0x4200 0094
0x4200 0098
0x4200 009C
0x4200 00A0
RTIDWDCTRL
RTIDWDPRLD
RTIWDSTATUS
RTIWDKEY
Digital Watchdog Preload. Sets the experation time of the Digital Watchdog.
Watchdog Status. Reflects the status of Analog and Digital Watchdog.
Watchdog Key. Correct written key values discharge the external capacitor.
Digital Watchdog Down-Counter
RTIDWDCNTR
Figure 4-41 shows the bit layout of the CFGRTI register and Table 4-39 contains a description of the bits.
31
8
Reserved
7
6
4
3
2
0
Reserved
CAPSEL1
R/W, 0
Reserved
CAPSEL0
R/W, 0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 4-41. CFGRTI Register Bit Layout (0x4000 0014)
Table 4-39. CFGRTI Register Bit Field Description (0x4000 0014)
RESET
VALUE
READ
WRITE
BIT NO.
NAME
DESCRIPTION
31:7,3 Reserved
N/A
0
N/A
R/W
R/W
Reads are indeterminate. Only 0s should be written to these bits.
6:4
2:0
CAPSEL1
CAPSEL0
CAPSEL0 selects the input to the RTI Input Capture 0 function.
CAPSEL1 selects the input to the RTI Input Capture 1 function.
0
The encoding is the same for both fields:
000 = Select McASP0 Transmit DMA Event
001 = Select McASP0 Receive DMA Event
010 = Select McASP1 Transmit DMA Event
011 = Select McASP1 Receive DMA Event
100 = Select McASP2 Transmit DMA Event
101 = Select McASP2 Receive DMA Event
Other values are reserved and their effect is not determined.
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4.17 External Clock Input From Oscillator or CLKIN Pin
The C6727B device includes two choices to provide an external clock input, which is fed to the on-chip
PLL to generate high-frequency system clocks. These options are illustrated in Figure 4-42.
•
•
Figure 4-42 (a) illustrates the option that uses an on-chip oscillator with external crystal circuit.
Figure 4-42 (b) illustrates the option that uses an external 3.3-V LVCMOS-compatible clock input with
the CLKIN pin.
Note that the two clock inputs are logically combined internally before the PLL so the clock input that is not
used must be tied to ground.
CV
DD
C
5
OSCV
OSCV
DD
DD
C
C
7
OSCIN
OSCIN
X
1
R
B
Clock
Input
From
CLKIN
to
Clock
Input
From
OSCIN
to
8
R
S
NC
OSCOUT
OSCOUT
PLL
C
6
PLL
OSCV
SS
OSCV
SS
CLKIN
CLKIN
On-Chip Oscillator
(a)
External 3.3-V LVCMOS-Compatible Clock Source
(b)
Figure 4-42. C6727B Clock Input Options
If the on-chip oscillator is chosen, then the recommended component values for Figure 4-42 (a) are listed
in Table 4-40.
Table 4-40. Recommended On-Chip Oscillator Components
(1)
(1)
FREQUENCY
22.579
XTAL TYPE
AT-49
X1
C5
C6
C7
C8
RB
RS
KDS 1AF225796A
KDS 1AS225796AG
KDS 1AF245766AAA
KDS 1AS245766AHA
470 pF
470 pF
470 pF
470 pF
470 pF
470 pF
470 pF
470 pF
8 pF
8 pF
8 pF
8 pF
8 pF
8 pF
8 pF
8 pF
1 MΩ
1 MΩ
1 MΩ
1 MΩ
0 Ω
0 Ω
0 Ω
0 Ω
22.579
24.576
24.576
SMD-49
AT-49
SMD-49
(1) Capacitors C5 and C6 are used to reduce oscillator jitter, but are optional. If C5 and C6 are not used, then the node connecting
capacitors C7 and C8 should be tied to OSCVSS and OSCVDD should be tied to CVDD
.
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4.17.1 Clock Electrical Data/Timing
Table 4-41 assumes testing over recommended operating conditions.
Table 4-41. CLKIN Timing Requirements
NO.
1
PARAMETER
MIN
12
TYP
MAX UNIT
fosc
Oscillator frequency range (OSCIN/OSCOUT)
Cycle time, external clock driven on CLKIN
Pulse width, CLKIN high
25
MHz
ns
2
tc(CLKIN)
tw(CLKINH)
tw(CLKINL)
tt(CLKIN)
fPLL
20
3
0.4tc(CLKIN)
0.4tc(CLKIN)
ns
4
Pulse width, CLKIN low
ns
5
Transition time, CLKIN
5
ns
6
Frequency range of PLL input
12
50
MHz
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4.18 Phase-Locked Loop (PLL)
4.18.1 PLL Device-Specific Information
The C6727B DSP generates the high-frequency internal clocks it requires through an on-chip PLL.
The input to the PLL is either from the on-chip oscillator (OSCIN pin) or from an external clock on the
CLKIN pin. The PLL outputs four clocks that have programmable divider options. Figure 4-43 illustrates
the PLL Topology.
The PLL is disabled by default after a device reset. It must be configured by software according to the
allowable operating conditions listed in Table 4-42 before enabling the DSP to run from the PLL by setting
PLLEN = 1.
PLLEN
(PLL_CSR[0])
Clock
Input
from
PLLOUT
Divider
D0
(/1 to /32)
PLLREF
PLL
x4 to x25
1
0
Divider
D1
(/1 to /32)
SYSCLK1
SYSCLK2
CPU and Memory
CLKIN or
OSCIN
Divider
D2
(/1 to /32)
Peripherals and dMAX
Divider
D3
(/1 to /32)
SYSCLK3
AUXCLK
EMIF
McASP0,1,2
Figure 4-43. PLL Topology
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Table 4-42. Allowed PLL Operating Conditions
ALLOWED SETTING OR RANGE
TYP
NO.
PARAMETER
DEFAULT VALUE
MIN
MAX
1
2
PLLRST = 1 assertion time during initialization
N/A
N/A
125 ns
187.5 µs
Lock time before setting PLLEN = 1. After changing D0,
PLLM, or input clock.
3
4
5
PLL input frequency (PLLREF after D0(1)
PLL multiplier values (PLLM)
)
12 MHz
x4
50 MHz
x25
x13
N/A
PLL output frequency (PLLOUT before dividers D1, D2,
D3)(2)
140 MHz
600 MHz
6
SYSCLK1 frequency (set by PLLM and dividers D0, D1)
PLLOUT/1
Device Frequency
Specification
7
8
SYSCLK2 frequency (set by PLLM and dividers D0, D2)
SYSCLK3 frequency (set by PLLM and dividers D0, D3)
PLLOUT/2
PLLOUT/3
/2, /3, or /4 of SYSCLK1
EMIF Frequency
Specification
(1) Some values for the D0 divider produce results outside of this range and should not be selected.
(2) In general, selecting the PLL output clock rate closest to the maximum frequency will decrease clock jitter.
CAUTION
SYSCLK1, SYSCLK2, SYSCLK3 must be configured as aligned by setting ALNCTL[2:0]
to '1'; and the PLLCMD.GOSET bit must be written every time the dividers D1, D2, and
D3 are changed in order to make sure the change takes effect and preserves alignment.
CAUTION
When changing the PLL parameters which affect the SYSCLK1, SYSCLK2, SYSCLK3
dividers, the bridge BR2 in Figure 2-4 must be reset by the CFGBRIDGE register. See
Table 2-7.
The PLL is an analog circuit and is sensitive to power supply noise. Therefore it has a dedicated 3.3-V
power pin (PLLHV) that should be connected to DVDD at the board level through an external filter, as
illustrated in Figure 4-44.
BOARD
DV (3.3 V)
DD
PLLHV
+
Place Filter and Capacitors as Close
to DSP as Possible
10 mF
0.1 mF
EMI
Filter
EMI Filter: TDK ACF451832−333, −223, −153, or −103,
Panasonic EXCCET103U, or Equivalent
Figure 4-44. PLL Power Supply Filter
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4.18.2 PLL Registers Description(s)
Table 4-43 is a list of the PLL registers. For more information about these registers, see the
SM320C6727B DSP Software-Programmable Phase-Locked Loop (PLL) Controller Reference Guide
(literature number SPRU879).
Table 4-43. PLL Controller Registers
BYTE ADDRESS
0x4100 0000
0x4100 0100
0x4100 0110
0x4100 0114
0x4100 0118
0x4100 011C
0x4100 0120
0x4100 0138
0x4100 013C
0x4100 0140
0x4100 0148
0x4100 014C
0x4100 0150
REGISTER NAME
PLLPID
DESCRIPTION
PLL controller peripheral identification register
PLLCSR
PLLM
PLL control/status register
PLL multiplier control register
PLL controller divider register 0
PLL controller divider register 1
PLL controller divider register 2
PLL controller divider register 3
PLL controller command register
PLL controller status register
PLL controller clock align control register
Clock enable control register
Clock status register
PLLDIV0
PLLDIV1
PLLDIV2
PLLDIV3
PLLCMD
PLLSTAT
ALNCTL
CKEN
CKSTAT
SYSTAT
SYSCLK status register
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5 Application Example
Figure 5-1 illustrates a high-level block diagram of the device and other devices to which it may typically
connect. See 节 1.2 for an overview of each major block.
DSP
CODEC, DIR,
Audio Zone 1
McASP0
SPI1
ADC, DAC, DSD,
Network
256K
Bytes
RAM
SPI or I2C
Control (optional)
C67x+
DSP Core
I2C0
Audio Zone 2
Audio Zone 3
McASP1
McASP2
SPIO
384K
Bytes
ROM
CODEC, DIR,
ADC, DAC, DSD,
Network
Program
Cache
I2C1
Crossbar Switch
Digital Out,
TDM Port
RTI
EMIF
dMAX
UHPI
PLL
OSC
6 Independent Audio
Zones (3 TX + 3 RX)
16 Serial Data Pins
ASYNC
FLASH
High Speed
Parallel Data
DSP Control
SPI or I2C
Host
Microprocessor
133 MHz
SDRAM
Figure 5-1. SM320C6727B Audio DSP System Diagram
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6 Mechanical Data
6.1 Package Thermal Resistance Characteristics
Table 6-1 provides the thermal characteristics for the HFH package.
Table 6-1. Thermal Characteristics
AIR FLOW
(m/s)
°C/W
Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB
RθJC
Thermal Resistance Junction to Top of Case
2.2
0
106
Mechanical Data
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PACKAGE OPTION ADDENDUM
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16-Feb-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SM320C6727BHFHM
ACTIVE
CFP
HFH
256
3
Non-RoHS &
Non-Green
AU
N / A for Pkg Type
-55 to 125
SM320C6727BHFHM
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Feb-2023
OTHER QUALIFIED VERSIONS OF SM320C6727B :
Catalog : TMS320C6727B
•
Enhanced Product : SM320C6727B-EP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 2
MECHANICAL DATA
MCFP026B – JANUARY 1995 – REVISED JUNE 1999
HFH (R-CQFP-F256)
CERAMIC QUAD FLATPACK WITH NCTB
76,40
74,85
75,40
74,60
57,00
55,60
8,45
36,36
SQ
Tie Bar Width
7,05
35,64
31,50
BSC
1,55
Dia
1,45
4 Places
DETAIL ”C”
256
193
192
1
70,00 BSC
3,60
3,50
64
65
129
128
DETAIL ”B”
2,60
2,50
2,60
2,50
2 Places
Dia
DETAIL ”A”
0,50 MAX
0,25
256 X
0,18
3,21 MAX
2,66 MAX
1,05
0,20
0,10
0,75
0,35
0,05
0,50
DETAIL ”C”
DETAIL ”B”
DETAIL ”A”
4040232-2/F 12/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. This package is hermetically sealed with a metal lid.
D. The terminals are gold-plated.
E. Leads not shown for clarity purposes
F. Falls within JEDEC MO-134AB
1
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