SM72480SD-120/NOPB [TI]
1.6V,LLP-6 出厂预设温度开关和温度传感器 | NGF | 6 | -50 to 150;型号: | SM72480SD-120/NOPB |
厂家: | TEXAS INSTRUMENTS |
描述: | 1.6V,LLP-6 出厂预设温度开关和温度传感器 | NGF | 6 | -50 to 150 开关 温度传感 输出元件 传感器 换能器 温度传感器 |
文件: | 总26页 (文件大小:944K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SM72480
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SNIS156C –NOVEMBER 2010–REVISED APRIL 2013
SM72480 SolarMagic 1.6V, WSON-6 Factory Preset Temperature Switch and Temperature
Sensor
Check for Samples: SM72480
1
FEATURES
DESCRIPTION
The SM72480 is a low-voltage, precision, dual-output,
low-power temperature switch and temperature
sensor. The temperature trip point (TTRIP) is set at the
factory to be 120°C. Built-in temperature hysteresis
(THYST) keeps the output stable in an environment of
temperature instability.
2
•
Renewable Energy Grade
Low 1.6V Operation
•
•
Latching Function: Device Can Latch the Over
Temperature Condition
•
•
Push-pull and Open-Drain Temperature Switch
Outputs
In normal operation the SM72480 temperature switch
outputs assert when the die temperature exceeds
TTRIP. The temperature switch outputs will reset when
the temperature falls below a temperature equal to
(TTRIP − THYST). The OVERTEMP digital output, is
active-high with a push-pull structure, while the
OVERTEMP digital output, is active-low with an open-
drain structure.
Very Linear Analog VTEMP Temperature Sensor
Output
•
•
•
VTEMP Output Short-circuit Protected
2.2 mm by 2.5 mm (typ) WSON-6 Package
Excellent Power Supply Noise Rejection
APPLICATIONS
The analog output, VTEMP, delivers an analog output
voltage with Negative Temperature Coefficient —
NTC.
•
•
•
•
•
PV Power Optimizers
Wireless Transceivers
Battery Management
Automotive
Driving the TRIP TEST input high: (1) causes the
digital outputs to be asserted for in-situ verification
and, (2) causes the threshold voltage to appear at the
VTEMP output pin, which could be used to verify the
temperature trip point.
Disk Drives
KEY SPECIFICATIONS
The SM72480's low minimum supply voltage makes it
ideal for 1.8 volt system designs. Its wide operating
range, low supply current , and excellent accuracy
provide a temperature switch solution for a wide
range of commercial and industrial applications.
•
•
•
Supply Voltage 1.6V to 5.5V
Supply Current 8 μA (typ)
Accuracy, Trip Point Temperature 0°C to 150°C
±2.2°C
•
•
•
•
Accuracy, VTEMP 0°C to 150°C ±2.3°C
VTEMP Output Drive ±100 μA
Operating Temperature −50°C to 150°C
Hysteresis Temperature 4.5°C to 5.5°C
Connection Diagram
TRIP
TEST
1
2
3
6
5
4
V
TEMP
GND
DAP
OVERTEMP
V
DD
OVERTEMP
Figure 1. WSON-6 - Top View
See Package Number NGF0006A
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
SM72480
SNIS156C –NOVEMBER 2010–REVISED APRIL 2013
www.ti.com
Typical Transfer Characteristic
Figure 2. VTEMP Analog Voltage vs Die Temperature
3500
3000
2500
120oC œ 125oC Trip
105oC Trip
2000
1500
1000
500
0
-50
0
50
100
150
DIE TEMPERATURE (oC)
Block Diagram
V
DD
4
TRIP TEST = 0
(Default)
SM72480
6
3
V
TEMP
TRIP TEST = 1
OVERTEMP
V
V
TRIP
TS
V
DD
TEMP
SENSOR
TEMP
5
THRESHOLD
OVERTEMP
1
2
GND
TRIP
TEST
PIN DESCRIPTIONS
Pin
Name
No.
Type
Equivalent Circuit
Description
V
DD
TRIP TEST pin. Active High input.
If TRIP TEST = 0 (Default) then:
VTEMP = VTS, Temperature Sensor Output Voltage
If TRIP TEST = 1 then:
OVERTEMP and OVERTEMP outputs are asserted and
VTEMP = VTRIP, Temperature Trip Voltage.
This pin may be left open if not used.
TRIP
TEST
Digital
Input
1
1 mA
GND
2
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PIN DESCRIPTIONS (continued)
Pin
No.
Name
Type
Equivalent Circuit
Description
V
DD
Over Temperature Switch output
Active High, Push-Pull
Asserted when the measured temperature exceeds the Trip Point
Temperature or if TRIP TEST = 1
Digital
Output
5
OVERTEMP
This pin may be left open if not used.
GND
Over Temperature Switch output
Active Low, Open-drain (See OVERTEMP OPEN-DRAIN DIGITAL
OUTPUT regarding required pull-up resistor.)
Asserted when the measured temperature exceeds the Trip Point
Temperature or if TRIP TEST = 1
Digital
Output
3
OVERTEMP
This pin may be left open if not used.
GND
V
DD
V
SENSE
VTEMP Analog Voltage Output
If TRIP TEST = 0 then
Analog
Output
VTEMP = VTS, Temperature Sensor Output Voltage
If TRIP TEST = 1 then
6
VTEMP
VTEMP = VTRIP, Temperature Trip Voltage
This pin may be left open if not used.
GND
4
2
VDD
Power
Positive Supply Voltage
Power Supply Ground
GND
Ground
The best thermal conductivity between the device and the PCB is achieved
by soldering the DAP of the package to the thermal pad on the PCB. The
thermal pad can be a floating node. However, for improved noise immunity
the thermal pad should be connected to the circuit GND node, preferably
directly to pin 2 (GND) of the device.
DAP
Die Attach Pad
Typical Application
V
V
Supply
DD
DD
Analog
(+1.6V to +5.5V)
V
ADC Input
TEMP
Example: 2 to 3
Battery Cells
SM72480
Microcontroller
OVERTEMP
OVERTEMP
TRIP TEST
GND
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
Supply Voltage
−0.3V to +6.0V
−0.3V to +6.0V
−0.3V to (VDD + 0.5V)
−0.3V to (VDD + 0.5V)
±7 mA
Voltage at OVERTEMP pin
Voltage at OVERTEMP and VTEMP pins
TRIP TEST Input Voltage
Output Current, any output pin
Input Current at any pin(2)
Storage Temperature
5 mA
−65°C to +150°C
+155°C
Maximum Junction Temperature
ESD Susceptibility(3)
TJ(MAX)
Human Body Model
Machine Model
Charged Device Model
4500V
300V
1000V
For soldering specifications: see www.ti.com/lit/SNOA549
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5 mA.
(3) The Human Body Model (HBM) is a 100 pF capacitor charged to the specified voltage then discharged through a 1.5 kΩ resistor into
each pin. The Machine Model (MM) is a 200 pF capacitor charged to the specified voltage then discharged directly into each pin. The
Charged Device Model (CDM) is a specified circuit characterizing an ESD event that occurs when a device acquires charge through
some triboelectric (frictional) or electrostatic induction processes and then abruptly touches a grounded object or surface.
Operating Ratings(1)
Specified Temperature Range
TMIN ≤ TA ≤ TMAX
SM72480
−50°C ≤ TA ≤ +150°C
+1.6 V to +5.5 V
152 °C/W
Supply Voltage Range (VDD
)
(2)(3)
Thermal Resistance (θJA
)
WSON-6 (Package SDB06A)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The junction to ambient temperature resistance (θJA) is specified without a heat sink in still air.
(3) Changes in output due to self heating can be computed by multiplying the internal dissipation by the temperature resistance.
Accuracy Characteristics Trip Point Accuracy
Units
(Limit)
Parameter
Conditions
0°C − 150°C
Limits(1)
±2.2
Trip Point Accuracy(2)
VDD = 5.0 V
°C (max)
(1) Limits are ensured to AOQL (Average Outgoing Quality Level).
(2) Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Conversion Table at the
specified conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the
specified conditions. Accuracy limits do not include load regulation; they assume no DC load.
4
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Accuracy Characteristics VTEMP Analog Temperature Sensor Output Accuracy
The limits do not include DC load regulation. The stated accuracy limits are with reference to the values in the SM72480
Conversion Table.
Units
(Limit)
Parameter
Conditions
Limits(1)
TA = 20°C to 40°C
TA = 0°C to 70°C
TA = 0°C to 90°C
TA = 0°C to 120°C
TA = 0°C to 150°C
TA = –50°C to 0°C
TA = 20°C to 40°C
TA = 0°C to 70°C
TA = 0°C to 90°C
TA = 0°C to 120°C
TA = 0°C to 150°C
TA = −50°C to 0°C
VDD = 2.3 to 5.5 V
VDD = 2.5 to 5.5 V
VDD = 2.5 to 5.5 V
VDD = 2.5 to 5.5 V
VDD = 2.5 to 5.5 V
VDD = 3.0 to 5.5 V
VDD = 1.8 to 5.5 V
VDD = 1.9 to 5.5 V
VDD = 1.9 to 5.5 V
VDD = 1.9 to 5.5 V
VDD = 1.9 to 5.5 V
VDD = 2.3 to 5.5 V
±1.8
±2.0
±2.1
±2.2
±2.3
±1.7
±1.8
±2.0
±2.1
±2.2
±2.3
±1.7
VTEMP Temperature
Accuracy(2)
Trip Point
125°C or 120°C
°C
(max)(2)
VTEMP Temperature
Accuracy
Trip Point
105°C
°C (max)
(1) Limits are ensured to AOQL (Average Outgoing Quality Level).
(2) Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Conversion Table at the
specified conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the
specified conditions. Accuracy limits do not include load regulation; they assume no DC load.
Electrical Characteristics
Unless otherwise noted, these specifications apply for +VDD = +1.6V to +5.5V. Boldface limits apply for TA = TJ = TMIN to
TMAX ; all other limits TA = TJ = 25°C.
Units
(Limit)
Symbol
Parameter
Conditions
Typical(1)
Limits(2)
GENERAL SPECIFICATIONS
IS Quiescent Power Supply
8
5
16
μA (max)
Current
5.5
4.5
°C (max)
°C (Min)
Hysteresis
OVERTEMP DIGITAL OUTPUT
ACTIVE HIGH, PUSH-PULL
VDD ≥ 1.6V
VDD ≥ 2.0V
VDD ≥ 3.3V
VDD ≥ 1.6V
VDD ≥ 2.0V
VDD ≥ 3.3V
Source ≤ 340 μA
Source ≤ 498 μA
Source ≤ 780 μA
Source ≤ 600 μA
Source ≤ 980 μA
Source ≤ 1.6 mA
V
DD − 0.2V
V (min)
V (min)
VOH
Logic "1" Output Voltage
VDD − 0.45V
BOTH OVERTEMP and OVERTEMP DIGITAL OUTPUTS
VDD ≥ 1.6V
VDD ≥ 2.0V
VDD ≥ 3.3V
VDD ≥ 1.6V
VDD ≥ 2.0V
VDD ≥ 3.3V
Sink ≤ 385 μA
Sink ≤ 500 μA
Sink ≤ 730 μA
Sink ≤ 690 μA
Sink ≤ 1.05 mA
Sink ≤ 1.62 mA
0.2
VOL
Logic "0" Output Voltage
V (max)
0.45
(1) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(2) Limits are ensured to AOQL (Average Outgoing Quality Level).
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Electrical Characteristics (continued)
Unless otherwise noted, these specifications apply for +VDD = +1.6V to +5.5V. Boldface limits apply for TA = TJ = TMIN to
TMAX ; all other limits TA = TJ = 25°C.
Units
(Limit)
Symbol
Parameter
Conditions
Typical(1)
Limits(2)
OVERTEMP DIGITAL OUTPUT
Logic "1" Output Leakage
ACTIVE LOW, OPEN DRAIN
TA = 30 °C
0.001
0.025
IOH
1
μA (max)
Current(3)
TA = 150 °C
VTEMP ANALOG TEMPERATURE SENSOR OUTPUT
VTEMP Sensor Gain
Trip Point = 105°C
Trip Point = 125°C or 120°C
Source ≤ 90 μA
-7.7
mV/°C
mV/°C
−10.3
−0.1
0.1
−1
1
mV (max)
mV (max)
mV (max)
mV (max)
(VDD − VTEMP) ≥ 200 mV
1.6V ≤ VDD < 1.8V
Sink ≤ 100 μA
VTEMP ≥ 260 mV
VTEMP Load Regulation(4)
Source ≤ 120 μA
−0.1
0.1
−1
1
(VDD − VTEMP) ≥ 200 mV
VDD ≥ 1.8V
Sink ≤ 200 μA
VTEMP ≥ 260 mV
Source or Sink = 100 μA
1
Ohm
mV
0.29
74
VDD Supply- to-VTEMP
DC Line Regulation(5)
VDD = +1.6V to +5.5V
μV/V
dB
−82
VTEMP Output Load
Capacitance
CL
Without series resistor. See CAPACITIVE LOADS.
1100
pF (max)
TRIP TEST DIGITAL INPUT
VIH
VIL
Logic "1" Threshold Voltage
V
DD− 0.5
V (min)
V (max)
μA (max)
μA (max)
Logic "0" Threshold Voltage
0.5
IIH
Logic "1" Input Current
Logic "0" Input Current(3)
1.5
2.5
IIL
0.001
1
TIMING
Time from Power On to Digital
Output Enabled. See definition
below.
tEN
1.1
1.0
2.3
2.9
ms (max)
ms (max)
Time from Power On to Analog VTEMP CL = 0 pF to 1100 pF
Temperature Valid. See
tV
definition below.
(3) The 1 µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the
current for every 15°C increase in temperature. For example, the 1 nA typical current at 25°C would increase to 16 nA at 85°C.
(4) Source currents are flowing out of the SM72480. Sink currents are flowing into the SM72480.
(5) Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest
supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in VOLTAGE SHIFT.
6
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Definitions of tEN and tV
V
DD
V
DD
1.3V
t
EN
t
VTEMP
Valid
OVERTEMP
OVERTEMP
Enabled
Enabled
V
TEMP
The curves shown represent typical performance under worst-case conditions. Performance improves with larger
overhead (VDD − VTEMP), larger VDD, and lower temperatures.
The curves shown represent typical performance under worst-case conditions. Performance improves with larger
VTEMP, larger VDD and lower temperatures.
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Typical Performance Characteristics
VTEMP Output Temperature Error
Minimum Operating Temperature
vs.
vs.
Temperature
Supply Voltage
120°or 125°C Trip
105°C Trip
0
Figure 3.
Figure 4.
Supply Current
vs.
Temperature
Supply Current
vs.
Supply Voltage
Figure 5.
Figure 6.
Line Regulation
VTEMP
vs.
VTEMP Supply-Noise Rejection
Supply Voltage
Trip Points
120°C
vs.
Frequency
Figure 7.
Figure 8.
8
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SM72480 VTEMP VS DIE TEMPERATURE CONVERSION TABLE
The SM72480 has a factory-set gain, which is dependent on the Temperature Trip Point. The VTEMP temperature
sensor voltage, in millivolts, at each discrete die temperature over the complete operating range is shown in the
conversion table below.
Table 1. VTEMP Temperature Sensor Output Voltage vs Die Temperature Conversion Table(1)
VTEMP, Analog Output Voltage, mV
TTRIP = 125 or 120°C
Die Temp.,
°C
TTRIP = 105°C
1967
1960
1952
1945
1937
1930
1922
1915
1908
1900
1893
1885
1878
1870
1863
1855
1848
1840
1833
1825
1818
1810
1803
1795
1788
1780
1773
1765
1757
1750
1742
1735
1727
1720
1712
1705
1697
1690
1682
−50
−49
−48
−47
−46
−45
−44
−43
−42
−41
−40
−39
−38
−37
−36
−35
−34
−33
−32
−31
−30
−29
−28
−27
−26
−25
−24
−23
−22
−21
−20
−19
−18
−17
−16
−15
−14
−13
−12
2623
2613
2603
2593
2583
2573
2563
2553
2543
2533
2523
2513
2503
2493
2483
2473
2463
2453
2443
2433
2423
2413
2403
2393
2383
2373
2363
2353
2343
2333
2323
2313
2303
2293
2283
2272
2262
2252
2242
(1) The VTEMP temperature sensor output voltage, in mV, vs Die Temperature, in °C for the gain corresponding to the temperature trip point.
VDD = 5.0V.
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Table 1. VTEMP Temperature Sensor Output Voltage vs Die Temperature Conversion Table(1) (continued)
VTEMP, Analog Output Voltage, mV
TTRIP = 125 or 120°C
Die Temp.,
°C
TTRIP = 105°C
1674
1667
1659
1652
1644
1637
1629
1621
1614
1606
1599
1591
1583
1576
1568
1561
1553
1545
1538
1530
1522
1515
1507
1499
1492
1484
1477
1469
1461
1454
1446
1438
1431
1423
1415
1407
1400
1392
1384
1377
1369
1361
1354
1346
1338
1331
−11
−10
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
2232
2222
2212
2202
2192
2182
2171
2161
2151
2141
2131
2121
2111
2101
2090
2080
2070
2060
2050
2040
2029
2019
2009
1999
1989
1978
1968
1958
1948
1938
1927
1917
1907
1897
1886
1876
1866
1856
1845
1835
1825
1815
1804
1794
1784
1774
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
10
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Table 1. VTEMP Temperature Sensor Output Voltage vs Die Temperature Conversion Table(1) (continued)
VTEMP, Analog Output Voltage, mV
TTRIP = 125 or 120°C
Die Temp.,
°C
TTRIP = 105°C
1323
1315
1307
1300
1292
1284
1276
1269
1261
1253
1245
1238
1230
1222
1214
1207
1199
1191
1183
1176
1168
1160
1152
1144
1137
1129
1121
1113
1105
1098
1090
1082
1074
1066
1059
1051
1043
1035
1027
1019
1012
1004
996
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
1763
1753
1743
1732
1722
1712
1701
1691
1681
1670
1660
1650
1639
1629
1619
1608
1598
1588
1577
1567
1557
1546
1536
1525
1515
1505
1494
1484
1473
1463
1453
1442
1432
1421
1411
1400
1390
1380
1369
1359
1348
1338
1327
1317
1306
1296
988
980
972
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Table 1. VTEMP Temperature Sensor Output Voltage vs Die Temperature Conversion Table(1) (continued)
VTEMP, Analog Output Voltage, mV
TTRIP = 125 or 120°C
Die Temp.,
°C
TTRIP = 105°C
964
957
949
941
933
925
917
909
901
894
886
878
870
862
854
846
838
830
822
814
807
799
791
783
775
767
759
751
743
735
727
719
711
703
695
687
679
671
663
655
647
639
631
623
615
607
81
82
1285
1275
1264
1254
1243
1233
1222
1212
1201
1191
1180
1170
1159
1149
1138
1128
1117
1106
1096
1085
1075
1064
1054
1043
1032
1022
1011
1001
990
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
979
969
958
948
937
926
916
905
894
884
873
862
852
841
831
820
809
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Table 1. VTEMP Temperature Sensor Output Voltage vs Die Temperature Conversion Table(1) (continued)
VTEMP, Analog Output Voltage, mV
TTRIP = 125 or 120°C
Die Temp.,
°C
TTRIP = 105°C
599
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
798
788
777
766
756
745
734
724
713
702
691
681
670
659
649
638
627
616
606
595
584
573
562
552
591
583
575
567
559
551
543
535
527
519
511
503
495
487
479
471
463
455
447
438
430
422
414
VTEMP vs DIE TEMPERATURE APPROXIMATIONS
The SM72480's VTEMP analog temperature output is very linear. The Conversion Table above and the equation in
The Second-Order Equation (Parabolic) represent the most accurate typical performance of the VTEMP voltage
output vs Temperature.
The Second-Order Equation (Parabolic)
The data from the Conversion Table, or the equation below, when plotted, has an umbrella-shaped parabolic
curve. VTEMP is in mV.
V(TEMP=120 or 125) = 1814.6 - 10.270 x (TDIE - 30°C) - 2.12e-3 x (T DIE - 30°C) 2
V(TEMP=105) = 1361.4 œ 7.701 x (TDIE - 30°C) œ 1.60e-3 x (TDIE - 30°C) 2
(1)
The First-Order Approximation (Linear)
For a quicker approximation, although less accurate than the second-order, over the full operating temperature
range the linear formula below can be used. Using this formula, with the constant and slope in the following set
of equations, the best-fit VTEMP vs Die Temperature performance can be calculated with an approximation error
less than 18 mV. VTEMP is in mV.
V(TEMP=120 or 125) = 2119 - 10.36 x TDIE
V(TEMP=105) = 1590 œ 7.77 x TDIE
(2)
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First-Order Approximation (Linear) over Small Temperature Range
For a linear approximation, a line can easily be calculated over the desired temperature range from the
Conversion Table using the two-point equation:
V2 - V1
’
◊
’
ì
V - V1 =
(T - T1)
T2 - T1
(3)
Where V is in mV, T is in °C, T1 and V1 are the coordinates of the lowest temperature, T2 and V2 are the
coordinates of the highest temperature.
x
(-12.8 mV/°C) (T - 20°C)
V - 2396 mV =
(4)
(5)
x
(-12.8 mV/°C) (T-20°C) + 2396 mV
V =
Using this method of linear approximation, the transfer function can be approximated for one or more
temperature ranges of interest.
OVERTEMP and OVERTEMP Digital Outputs
The OVERTEMP Active High, Push-Pull Output and the OVERTEMP Active Low, Open-Drain Output both assert
at the same time whenever the Die Temperature reaches the factory preset Temperature Trip Point. They also
assert simultaneously whenever the TRIP TEST pin is set high. Both outputs de-assert when the die temperature
goes below the Temperature Trip Point - Hysteresis. These two types of digital outputs enable the user the
flexibility to choose the type of output that is most suitable for his design.
Either the OVERTEMP or the OVERTEMP Digital Output pins can be left open if not used.
OVERTEMP OPEN-DRAIN DIGITAL OUTPUT
The OVERTEMP Active Low, Open-Drain Digital Output, if used, requires a pull-up resistor between this pin and
VDD. The following section shows how to determine the pull-up resistor value.
Figure 9. Determining the Pull-up Resistor Value
V
DD
i
T
R
Pull-Up
V
OUT
OVERTEMP
Digital Input
i
L
i
sink
The Pull-up resistor value is calculated at the condition of maximum total current, iT, through the resistor. The
total current is:
iT = iL + isink
where
•
•
•
•
iT is the maximum total current through the Pull-up Resistor at VOL
.
iL is the load current, which is very low for typical digital inputs.
VOUT is the Voltage at the OVERTEMP pin. Use VOL for calculating the Pull-up resistor.
VDD(Max) is the maximum power supply voltage to be used in the customer's system.
(6)
(7)
The pull-up resistor maximum value can be found by using the following formula:
Rpull-up = VDD (Max) œ VOL
iT
EXAMPLE CALCULATION
Suppose we have, for our example, a VDD of 3.3 V ± 0.3V, a CMOS digital input as a load, a VOL of 0.2 V.
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1. We see that for VOL of 0.2 V the electrical specification for OVERTEMP shows a maximim isink of 385 µA.
2. Let iL= 1 µA, then iT is about 386 µA max. If we select 35 µA as the current limit then iT for the calculation
becomes 35 µA
3. We notice that VDD(Max) is 3.3V + 0.3V = 3.6V and then calculate the pull-up resistor as RPull-up = (3.6 −
0.2)/35 µA = 97k
4. Based on this calculated value, we select the closest resistor value in the tolerance family we are using.
In our example, if we are using 5% resistor values, then the next closest value is 100 kΩ.
NOISE IMMUNITY
The SM72480 is virtually immune from false triggers on the OVERTEMP and OVERTEMP digital outputs due to
noise on the power supply. Test have been conducted showing that, with the die temperature within 0.5°C of the
temperature trip point, and the severe test of a 3 Vpp square wave "noise" signal injected on the VDD line, over
the VDD range of 2V to 5V, there were no false triggers.
TRIP TEST Digital Input
The TRIP TEST pin simply provides a means to test the OVERTEMP and OVERTEMP digital outputs
electronically by causing them to assert, at any operating temperature, as a result of forcing the TRIP TEST pin
high.
When the TRIP TEST pin is pulled high the VTEMP pin will be at the VTRIP voltage.
If not used, the TRIP TEST pin may either be left open or grounded.
VTEMP Analog Temperature Sensor Output
The VTEMP push-pull output provides the ability to sink and source significant current. This is beneficial when, for
example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC). In these applications
the source current is required to quickly charge the input capacitor of the ADC. See the Applications Circuits
section for more discussion of this topic. The SM72480 is ideal for this and other applications which require
strong source or sink current.
NOISE CONSIDERATIONS
The SM72480's supply-noise rejection (the ratio of the AC signal on VTEMP to the AC signal on VDD) was
measured during bench tests. It's typical attenuation is shown in the Typical Performance Characteristics section.
A load capacitor on the output can help to filter noise.
For operation in very noisy environments, some bypass capacitance should be present on the supply within
approximately 2 inches of the SM72480.
CAPACITIVE LOADS
The VTEMP Output handles capacitive loading well. In an extremely noisy environment, or when driving a switched
sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling. Without any
precautions, the VTEMP can drive a capacitive load less than or equal to 1100 pF as shown in Figure 10. For
capacitive loads greater than 1100 pF, a series resistor is required on the output, as shown in Figure 11, to
maintain stable conditions.
V
DD
V
TEMP
SM72480
OPTIONAL
BYPASS
CAPACITANCE
GND
C
LOAD
Ç 1100 pF
Figure 10. SM72480 No Decoupling Required for Capacitive Loads Less than 1100 pF.
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V
DD
R
S
V
TEMP
SM72480
OPTIONAL
BYPASS
CAPACITANCE
C
>
GND
LOAD
1100 pF
Figure 11.
CLOAD
Minimum RS
3 kΩ
1.1 nF to 99 nF
100 nF to 999 nF
1 μF
1.5 kΩ
800 Ω
VOLTAGE SHIFT
The SM72480 is very linear over temperature and supply voltage range. Due to the intrinsic behavior of an
NMOS/PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is ramped over the
operating range of the device. The location of the shift is determined by the relative levels of VDD and VTEMP. The
shift typically occurs when VDD − VTEMP = 1.0V.
This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VTEMP. Since
the shift takes place over a wide temperature change of 5°C to 20°C, VTEMP is always monotonic. The accuracy
specifications in the Electrical Characteristics table already includes this possible shift.
Mounting and Temperature Conductivity
The SM72480 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be
glued or cemented to a surface.
The best thermal conductivity between the device and the PCB is achieved by soldering the DAP of the package
to the thermal pad on the PCB. The temperatures of the lands and traces to the other leads of the SM72480 will
also affect the temperature reading.
Alternatively, the SM72480 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath
or screwed into a threaded hole in a tank. As with any IC, the SM72480 and accompanying wiring and circuits
must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate
at cold temperatures where condensation can occur. If moisture creates a short circuit from the VTEMP output to
ground or VDD, the VTEMP output from the SM72480 will not be correct. Printed-circuit coatings are often used to
ensure that moisture cannot corrode the leads or circuit traces.
The thermal resistance junction-to-ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. The equation used to calculate the rise in the SM72480's die
temperature is
TJ = TA + qJA (VDDIQ) + (VDD - VTEMP) IL
[
]
(8)
where TA is the ambient temperature, IQ is the quiescent current, IL is the load current on the output, and VO is
the output voltage. For example, in an application where TA = 30 °C, VDD = 5 V, IDD = 9 μA, Gain 4, VTEMP = 2231
mV, and IL = 2 μA, the junction temperature would be 30.021 °C, showing a self-heating error of only 0.021°C.
Since the SM72480's junction temperature is the actual temperature being measured, care should be taken to
minimize the load current that the VTEMP output is required to drive. If The OVERTEMP output is used with a 100
k pull-up resistor, and this output is asserted (low), then for this example the additional contribution is [(152°
C/W)x(5V)2/100k] = 0.038°C for a total self-heating error of 0.059°C. Table 2 shows the thermal resistance of the
SM72480.
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Table 2. SM72480 Thermal Resistance
Package
Number
Thermal
Resistance (θJA
Device Number
)
SM72480SD
SDB06A
152° C/W
Applications Circuits
V
DD
4
1
5
6
3
OVERTEMP
NC
Asserts when T
> T
TRIP
DIE
SM72480
NC
See text.
NC
2
GND
Figure 12. Temperature Switch Using Push-Pull Output
V
DD
4
100k
OVERTEMP
1
3
6
NC
Asserts when T
> T
TRIP
DIE
SM72480
NC
See text.
5
NC
2
GND
Figure 13. Temperature Switch Using Open-Drain Output
SAR Analog-to-Digital Converter
Reset
+1.6V to +5.5V
Input
Pin
SM72480
Sample
R
IN
4
6
5
V
V
DD
TEMP
C
BP
C
PIN
C
C
TRIP
TEST
FILTER
1
2
SAMPLE
OT
3
OT
GND
Figure 14. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage
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Most CMOS ADCs found in microcontrollers and ASICs have a sampled data comparator input structure. When
the ADC charges the sampling cap, it requires instantaneous charge from the output of the analog source such
as the SM72480 temperature sensor and many op amps. This requirement is easily accommodated by the
addition of a capacitor (CFILTER). The size of CFILTER depends on the size of the sampling capacitor and the
sampling frequency. Since not all ADCs have identical input stages, the charge requirements will vary. This
general ADC application is shown as an example only.
V
TEMP
V+
R3
V
V
T1
R4
T2
R1
V
T
(High = overtemp alarm)
4.1V
U3
+
V
OUT
V
OUT
U1
LM4040
0.1 mF
-
R2
(4.1)R2
V
V
=
=
T1
R1 + R2||R3
V
TEMP
SM72480
V
DD
(4.1)R2
T2
U2
R2 + R1||R3
Figure 15. Celsius Temperature Switch
V
DD
100k
4
3
6
TRIP TEST
1
OVERTEMP
SM72480
NC
OVERTEMP
5
2
GND
Figure 16. TRIP TEST Digital Output Test Circuit
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V
DD
100k
4
TRIP TEST
1
5
6
OVERTEMP
SM72480
NC
RESET
Momentary
OVERTEMP
3
2
GND
Figure 17. Latch Circuit using OVERTEMP Output
The TRIP TEST pin, normally used to check the operation of the OVERTEMP and OVERTEMP pins, may be
used to latch the outputs whenever the temperature exceeds the programmed limit and causes the digital outputs
to assert. As shown in the figure, when OVERTEMP goes high the TRIP TEST input is also pulled high and
causes OVERTEMP output to latch high and the OVERTEMP output to latch low. The latch can be released by
either momentarily pulling the TRIP TEST pin low (GND), or by toggling the power supply to the device. The
resistor limits the current out of the OVERTEMP output pin.
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 19
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SM72480SD-105/NOPB
SM72480SD-120/NOPB
SM72480SD-125/NOPB
ACTIVE
ACTIVE
ACTIVE
WSON
WSON
WSON
NGF
NGF
NGF
6
6
6
1000 RoHS & Green
1000 RoHS & Green
1000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-50 to 150
-50 to 150
-50 to 150
701
S80
299
SN
SN
SM72480SDE-105/NOPB
SM72480SDE-120/NOPB
SM72480SDE-125/NOPB
SM72480SDX-105/NOPB
SM72480SDX-120/NOPB
SM72480SDX-125/NOPB
NRND
NRND
NRND
NRND
NRND
NRND
WSON
WSON
WSON
WSON
WSON
WSON
NGF
NGF
NGF
NGF
NGF
NGF
6
6
6
6
6
6
250
250
250
RoHS & Green
RoHS & Green
RoHS & Green
SN
SN
SN
SN
SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-50 to 150
-50 to 150
-50 to 150
-50 to 150
-50 to 150
-50 to 150
701
S80
299
701
S80
299
4500 RoHS & Green
4500 RoHS & Green
4500 RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SM72480SD-105/NOPB WSON
SM72480SD-120/NOPB WSON
SM72480SD-125/NOPB WSON
SM72480SDE-105/NOPB WSON
SM72480SDE-120/NOPB WSON
SM72480SDE-125/NOPB WSON
SM72480SDX-105/NOPB WSON
SM72480SDX-120/NOPB WSON
SM72480SDX-125/NOPB WSON
NGF
NGF
NGF
NGF
NGF
NGF
NGF
NGF
NGF
6
6
6
6
6
6
6
6
6
1000
1000
1000
250
178.0
178.0
178.0
178.0
178.0
178.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.8
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
250
250
4500
4500
4500
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SM72480SD-105/NOPB
SM72480SD-120/NOPB
SM72480SD-125/NOPB
SM72480SDE-105/NOPB
SM72480SDE-120/NOPB
SM72480SDE-125/NOPB
SM72480SDX-105/NOPB
SM72480SDX-120/NOPB
SM72480SDX-125/NOPB
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
NGF
NGF
NGF
NGF
NGF
NGF
NGF
NGF
NGF
6
6
6
6
6
6
6
6
6
1000
1000
1000
250
208.0
208.0
208.0
208.0
208.0
208.0
367.0
367.0
367.0
191.0
191.0
191.0
191.0
191.0
191.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
250
250
4500
4500
4500
Pack Materials-Page 2
MECHANICAL DATA
NGF0006A
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