SN54HC04VTDE1 [TI]
HEX INVERTER Wide Operating Voltage Range; 六反相器宽工作电压范围
| 型号： | SN54HC04VTDE1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HEX INVERTER Wide Operating Voltage Range |
| 文件： | 总5页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN54HC04-DIE
www.ti.com
SCLS736 –JULY 2013
HEX INVERTER
Check for Samples: SN54HC04-DIE
1
FEATURES
•
Wide Operating Voltage Range
•
Low Input Current
•
Low Power Consumption
DESCRIPTION
The SN54HC04-DIE contains six independent inverters and performs the Boolean function Y = A in positive
logic.
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
SN54HC04VTDE1
SN54HC04VTDE2
100
10
SN54HC04
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control
System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature
only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual
Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN54HC04-DIE
SCLS736 –JULY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
Floating
TiW/AlCu2%
1199 nm
2
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: SN54HC04-DIE
SN54HC04-DIE
www.ti.com
SCLS736 –JULY 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
86.03
Y MIN
379.73
209.33
125.33
125.33
121.73
209.33
355.73
499.73
670.13
760.13
767.33
760.13
670.13
523.73
X MAX
171.23
171.23
303.23
447.83
591.83
755.63
764.03
752.03
764.03
620.03
475.43
331.43
171.23
166.43
Y MAX
464.93
294.53
210.53
210.53
206.93
294.53
440.93
584.93
755.33
845.33
852.53
845.33
755.33
608.93
1A
1Y
1
2
86.03
2A
3
218.03
362.63
506.63
670.43
678.83
666.83
678.83
534.83
390.23
246.23
86.03
2Y
4
3A
5
3Y
6
GND
4Y
7
8
4A
9
5Y
10
11
12
13
14
5A
6Y
6A
VCC
81.23
Copyright © 2013, Texas Instruments Incorporated
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3
Product Folder Links: SN54HC04-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
17-Jul-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN54HC04VTDE1
SN54HC04VTDE2
ACTIVE
0
0
100
TBD
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
ACTIVE
10
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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