SN54HC368_08 [TI]
HEX INVERTING BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS; HEX反相缓冲器及其与线路驱动器三态输出
| 型号： | SN54HC368_08 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HEX INVERTING BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS |
| 文件： | 总18页 (文件大小：748K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SCLS310D − JANUARY 1996 −REVISED OCTOBER 2003
SN54HC368 . . . J OR W PACKAGE
SN74HC368 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Wide Operating Voltage Range of 2 V to 6 V
High-Current 3-State Outputs Drive Bus
Lines, Buffer Memory Address Registers,
or Drive Up To 15 LSTTL Loads
1OE
1A1
1Y1
1A2
1Y2
1A3
1Y3
GND
V
CC
1
2
3
4
5
6
7
8
16
15
14
13
2OE
2A2
2Y2
D
D
D
D
D
Inverting Outputs
Low Power Consumption, 80-µA Max I
CC
Typical t = 10 ns
pd
6-mA Output Drive at 5 V
12 2A1
11
10
9
2Y1
1A4
1Y4
Low Input Current of 1 µA Max
description/ordering information
SN54HC368 . . . FK PACKAGE
(TOP VIEW)
These hex inverting buffers and line drivers are
designed specifically to improve both the
performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters. The ’HC368 devices
are organized as dual 4-line and 2-line
buffers/drivers with active-low output-enable
(1OE and 2OE) inputs. When OE is low, the
device passes inverted data from the A inputs to
the Y outputs. When OE is high, the outputs are
in the high-impedance state.
3
2
1
20 19
18
2A2
2Y2
NC
1Y1
1A2
NC
4
5
6
7
8
17
16
15 2A1
14
9 10 11 12 13
1Y2
1A3
2Y1
NC − No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
SOIC − D
Tube of 25
Tube of 40
Reel of 2500
Reel of 250
Reel of 2000
Reel of 2000
Tube of 90
Reel of 2000
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HC368N
SN74HC368N
SN74HC368D
SN74HC368DR
SN74HC368DT
SN74HC368NSR
SN74HC368DBR
SN74HC368PW
SN74HC368PWR
SN74HC368PWT
SNJ54HC368J
HC368
SOP − NS
HC368
HC368
−40°C to 85°C
SSOP − DB
TSSOP − PW
HC368
CDIP − J
CFP − W
LCCC − FK
SNJ54HC368J
SNJ54HC368W
SNJ54HC368FK
−55°C to 125°C
SNJ54HC368W
SNJ54HC368FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢚ ꢝ ꢨ ꢠ ꢟꢫ ꢦꢥ ꢣꢤ ꢥꢟ ꢡꢨ ꢪꢜ ꢢꢝ ꢣ ꢣꢟ ꢲꢍ ꢗꢙ ꢛꢏ ꢔ ꢙꢆꢈꢂ ꢆꢂꢉ ꢢꢪꢪ ꢨꢢ ꢠ ꢢ ꢡꢧ ꢣꢧꢠ ꢤ ꢢ ꢠ ꢧ ꢣꢧ ꢤꢣꢧ ꢫ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢄ ꢋꢌ ꢍ ꢁ ꢎꢋꢏ ꢐ ꢍ ꢁꢑ ꢒꢓ ꢔꢔ ꢋꢏ ꢀ ꢕꢁ ꢖ ꢗꢍ ꢁ ꢋ ꢖꢏꢍ ꢎꢋ ꢏꢀ
ꢘꢍ ꢐ ꢄ ꢆ ꢙꢀꢐꢕꢐ ꢋ ꢚꢓꢐ ꢛ ꢓꢐꢀ
SCLS310D − JANUARY 1996 −REVISED OCTOBER 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
Y
OE
A
X
H
L
H
L
L
Z
L
H
logic diagram (positive logic)
1
15
1OE
2OE
2A1
2
3
12
11
1A1
1Y1
2Y1
To Three Other Channels
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
To One Other Channel
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS310D − JANUARY 1996 −REVISED OCTOBER 2003
recommended operating conditions (see Note 3)
SN54HC368
MIN NOM
SN74HC368
MIN NOM
UNIT
MAX
MAX
V
V
Supply voltage
2
1.5
5
6
2
1.5
5
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
3.15
4.2
High-level input voltage
V
V
IH
= 2 V
0.5
1.35
1.8
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
= 2 V
1000
500
400
125
1000
500
400
85
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
T
A
Operating free-air temperature
−55
−40
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HC368
SN74HC368
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V = V or V
IH
V
OH
OL
I
IL
IL
I
I
= −6 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −7.8 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
0.5
8
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V
V = V or V
V
I
IH
I
I
= 6 mA
4.5 V
6 V
0.4
0.33
0.33
1000
5
OL
= 7.8 mA
0.4
OL
I
I
I
V = V
I
or 0
6 V
1000
10
nA
µA
µA
pF
I
CC
V
O
= V
or 0
6 V
0.01
OZ
CC
CC
V = V
I
or 0,
I
O
= 0
6 V
160
10
80
CC
C
2 V to 6 V
3
10
10
i
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢇ ꢈꢉ ꢀꢁ ꢊ ꢃ ꢄꢅꢆ ꢇ ꢈ
ꢄ ꢋꢌ ꢍ ꢁ ꢎꢋꢏ ꢐ ꢍ ꢁꢑ ꢒꢓ ꢔꢔ ꢋꢏ ꢀ ꢕꢁ ꢖ ꢗꢍ ꢁ ꢋ ꢖꢏꢍ ꢎꢋ ꢏꢀ
ꢘꢍ ꢐ ꢄ ꢆ ꢙꢀꢐꢕꢐ ꢋ ꢚꢓꢐ ꢛ ꢓꢐꢀ
SCLS310D − JANUARY 1996 −REVISED OCTOBER 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
50
SN54HC368
SN74HC368
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
95
MIN
MAX
145
29
MIN
MAX
120
24
2 V
4.5 V
6 V
12
19
t
t
t
t
A
Y
Y
ns
pd
en
dis
t
10
16
25
20
2 V
100
26
190
38
285
57
238
48
4.5 V
6 V
OE
OE
ns
ns
ns
21
32
48
41
2 V
50
175
35
265
53
240
48
4.5 V
6 V
21
Y
19
30
45
41
2 V
28
60
90
75
Any
4.5 V
6 V
8
12
18
15
6
10
15
13
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
70
SN54HC368
SN74HC368
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
MAX
120
24
MIN
MAX
180
36
MIN
MAX
150
30
2 V
4.5 V
6 V
17
t
t
t
A
Y
Y
ns
pd
en
t
14
20
31
25
2 V
140
30
230
46
345
69
285
57
4.5 V
6 V
OE
ns
ns
28
39
59
48
2 V
45
210
42
315
63
265
53
Any
4.5 V
6 V
17
13
36
53
45
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per buffer/driver
No load
35
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢃ
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ꢘ ꢍꢐ ꢄ ꢆ ꢙꢀꢐꢕꢐ ꢋ ꢚ ꢓꢐ ꢛ ꢓꢐ
SCLS310D − JANUARY 1996 −REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
L
S1
S2
L
50 pF
or
150 pF
t
S1
S2
Open
Closed
Closed
Open
PZH
Test
Point
t
t
1 kΩ
1 kΩ
en
R
L
t
t
t
PZL
PHZ
PLZ
From Output
Under Test
Open
Closed
Open
50 pF
C
dis
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
V
CC
Input
50%
50%
0 V
t
t
PLH
PHL
90%
V
V
OH
In-Phase
Output
90%
50%
10%
50%
10%
OL
t
Output
Control
(Low-Level
Enabling)
t
r
f
f
V
CC
t
t
PLH
PHL
90%
50%
50%
V
V
OH
90%
t
0 V
Out-of-Phase
Output
50%
10%
50%
10%
t
t
PLZ
PZL
OL
t
≈V
CC
≈V
CC
r
Output
Waveform 1
(See Note B)
50%
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
10%
V
OL
OH
t
t
PZH
PHZ
V
CC
V
Output
Waveform 2
(See Note B)
90%
t
90%
90%
Input
50%
10%
50%
10%
50%
0 V
≈0 V
t
r
f
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CDIP
CDIP
SOIC
Drawing
5962-86812012A
5962-8681201EA
JM38510/65709BEA
SN54HC368J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
20
16
16
16
16
1
1
1
1
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
J
SN74HC368D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC368DBR
SN74HC368DBRE4
SN74HC368DBRG4
SN74HC368DE4
SN74HC368DG4
SN74HC368DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
DB
DB
DB
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC368DRE4
SN74HC368DRG4
SN74HC368DT
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC368DTE4
SN74HC368DTG4
SN74HC368N
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC368NE4
SN74HC368NSR
SN74HC368NSRE4
SN74HC368NSRG4
SN74HC368PW
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SO
NS
NS
NS
PW
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC368PWE4
SN74HC368PWG4
SN74HC368PWR
SN74HC368PWRE4
SN74HC368PWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
SN74HC368PWT
SN74HC368PWTE4
SN74HC368PWTG4
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
PW
PW
PW
16
16
16
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54HC368FK
SNJ54HC368J
ACTIVE
ACTIVE
LCCC
CDIP
FK
J
20
16
1
1
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74HC368DBR
SN74HC368DR
SN74HC368NSR
SN74HC368PWR
SSOP
SOIC
SO
DB
D
16
16
16
16
2000
2500
2000
2000
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
8.2
6.5
8.2
7.0
6.6
10.3
10.5
5.6
2.5
2.1
2.5
1.6
12.0
8.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
NS
PW
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HC368DBR
SN74HC368DR
SN74HC368NSR
SN74HC368PWR
SSOP
SOIC
SO
DB
D
16
16
16
16
2000
2500
2000
2000
346.0
333.2
346.0
346.0
346.0
345.9
346.0
346.0
33.0
28.6
33.0
29.0
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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