SN54HCT374FK-00 [TI]
HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20;型号: | SN54HCT374FK-00 |
厂家: | TEXAS INSTRUMENTS |
描述: | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20 驱动 输出元件 逻辑集成电路 |
文件: | 总22页 (文件大小:1171K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ꢊ ꢅꢆꢋꢌ ꢍꢎꢏ ꢍ ꢐꢆꢑ ꢒꢏ ꢏꢍ ꢑꢍꢎ ꢎꢐꢆ ꢓꢔ ꢍ ꢕ ꢌꢒ ꢔ ꢐꢕ ꢌꢊ ꢔ
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SCLS005D − MARCH 1984 − REVISED AUGUST 2003
SN54HCT374 . . . J OR W PACKAGE
SN74HCT374 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Operating Voltage Range of 4.5 V to 5.5 V
High-Current 3-State True Outputs Can
Drive Up To 15 LSTTL Loads
D
D
D
D
D
D
D
Low Power Consumption, 80-µA Max I
Typical t = 22 ns
pd
6-mA Output Drive at 5 V
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
V
CC
8Q
8D
1
2
3
4
5
6
7
8
9
20
19
18
CC
17 7D
16 7Q
15 6Q
14
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
Eight D-Type Flip-Flops in a Single Package
Full Parallel Access for Loading
6D
13 5D
12 5Q
11 CLK
GND 10
description/ordering information
These 8-bit flip-flops feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. They are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
SN54HCT374 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
8D
7D
7Q
2D
2Q
3Q
3D
4D
4
5
6
7
8
17
16
The eight flip-flops of the ’HCT374 devices are
edge-triggered D-type flip-flops. On the positive
transition of the clock (CLK) input, the Q outputs
are set to the logic levels that were set up at the
data (D) inputs.
15 6Q
14
9 10 11 12 13
6D
An output-enable (OE) input places the eight
outputs in either a normal logic state (high or low
logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HCT374N
SN74HCT374N
SN74HCT374DW
SN74HCT374DWR
SN74HCT374NSR
SN74HCT374DBR
SN74HCT374PW
SN74HCT374PWR
SN74HCT374PWT
SNJ54HCT374J
SOIC − DW
HCT374
SOP − NS
HCT374
HT374
−40°C to 85°C
SSOP − DB
TSSOP − PW
HT374
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT374J
SNJ54HCT374W
SNJ54HCT374FK
SNJ54HCT374W
SNJ54HCT374FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢊ ꢙ ꢤ ꢜ ꢛꢧ ꢢꢡ ꢟꢠ ꢡꢛ ꢝꢤ ꢦꢘ ꢞꢙ ꢟ ꢟꢛ ꢮꢒ ꢌꢐ ꢔꢑ ꢕ ꢐꢇꢯꢂ ꢇꢂꢉ ꢞꢦꢦ ꢤꢞ ꢜ ꢞ ꢝꢣ ꢟꢣꢜ ꢠ ꢞ ꢜ ꢣ ꢟꢣ ꢠꢟꢣ ꢧ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢃꢉ ꢀꢁꢈ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢃ
ꢊꢅ ꢆꢋ ꢌ ꢍꢎ ꢏꢍꢐ ꢆꢑ ꢒꢏ ꢏꢍ ꢑꢍ ꢎ ꢎꢐꢆ ꢓ ꢔꢍ ꢕꢌ ꢒ ꢔꢐꢕ ꢌ ꢊ ꢔꢀ
ꢖꢒ ꢆ ꢄ ꢇ ꢐꢀꢆꢋꢆ ꢍ ꢊꢗꢆ ꢔ ꢗꢆꢀ
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
description/ordering information (continued)
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
FUNCTION TABLE
(each flip-flop)
INPUTS
OUTPUT
Q
OE
L
CLK
D
H
L
↑
↑
H
L
L
L
H or L
X
X
X
Q
0
H
Z
logic diagram (positive logic)
1
OE
11
CLK
C1
1D
2
1Q
3
1D
To Seven Other Channels
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCLS005D − MARCH 1984 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HCT374
SN74HCT374
MIN NOM MAX
UNIT
MIN NOM
MAX
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
4.5
2
5
5.5
V
V
CC
IH
IL
I
High-level input voltage
Low-level input voltage
Input voltage
V
V
= 4.5 V to 5.5 V
= 4.5 V to 5.5 V
CC
0.8
0.8
V
CC
0
0
V
V
0
0
V
V
V
CC
CC
Output voltage
V
O
CC
CC
∆t/∆v
Input transition rise/fall time
Operating free-air temperature
500
125
500
85
ns
°C
T
A
−55
−40
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN54HCT374 SN74HCT374
A
PARAMETER
TEST CONDITIONS
V
UNIT
V
CC
MIN
TYP
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
= −20 µA
= −6 mA
= 20 µA
= 6 mA
4.4 4.499
OH
OH
OL
OL
V
V = V or V
IH
4.5 V
4.5 V
OH
OL
I
IL
3.98
4.3
0.001
0.17
0.1
3.7
3.84
0.1
0.26
100
0.5
8
0.1
0.4
0.1
0.33
1000
5
V
V = V or V
V
I
IH
IL
I
I
I
V = V
I
or 0
5.5 V
5.5 V
5.5 V
1000
10
nA
µA
µA
I
CC
V
= V
or 0
or 0,
0.01
OZ
CC
O CC
V = V
I
I
O
= 0
160
80
CC
One input at 0.5 V or 2.4 V,
Other inputs at 0 or V
†
5.5 V
1.4
3
2.4
10
3
2.9
10
mA
pF
∆I
CC
CC
4.5 V
to 5.5 V
C
10
i
†
This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V
.
CC
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
T
= 25°C
SN54HCT374 SN74HCT374
A
V
UNIT
MHz
ns
CC
MIN
MAX
31
MIN
MAX
21
MIN
MAX
25
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
f
t
t
t
Clock frequency
clock
36
23
28
16
14
20
17
10
10
24
22
30
27
10
10
20
18
25
23
10
10
Pulse duration, CLK high or low
w
ns
Setup time, data before CLK↑
Hold time, data after CLK↑
su
h
ns
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈ ꢃꢉ ꢀꢁꢈ ꢃ ꢄꢅ ꢆꢇ ꢈ ꢃ
ꢊꢅ ꢆꢋ ꢌ ꢍꢎ ꢏꢍꢐ ꢆꢑ ꢒꢏ ꢏꢍ ꢑꢍ ꢎ ꢎꢐꢆ ꢓ ꢔꢍ ꢕꢌ ꢒ ꢔꢐꢕ ꢌ ꢊ ꢔꢀ
ꢖꢒ ꢆ ꢄ ꢇ ꢐꢀꢆꢋꢆ ꢍ ꢊꢗꢆ ꢔ ꢗꢆꢀ
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
36
SN54HCT374 SN74HCT374
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
MHz
ns
CC
MIN
31
MAX
MIN
21
MAX
MIN
25
MAX
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
f
t
t
t
t
max
pd
en
dis
t
36
40
23
28
30
36
32
30
27
30
27
12
11
54
49
45
41
45
41
18
16
45
41
38
34
38
34
15
14
CLK
OE
Any Q
Any Q
Any Q
Any Q
25
26
ns
23
23
ns
OE
22
10
ns
9
switching characteristics over recommended operating free-air temperature range, C = 150 pF
L
(unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
40
SN54HCT374 SN74HCT374
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
ns
CC
MIN
MAX
46
MIN
MAX
69
MIN
MAX
58
4.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
t
pd
t
en
t
t
CLK
OE
Any Q
Any Q
Any Q
35
41
62
52
34
40
60
50
ns
29
36
54
45
18
42
63
53
ns
16
38
57
48
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per flip-flop
No load
85
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢋ
ꢆ
ꢍ
ꢊ
ꢗ
ꢆ
ꢔ
ꢗ
ꢆ
SCLS005D − MARCH 1984 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
V
CC
PARAMETER
R
C
S1
S2
L
L
50 pF
or
150 pF
t
Open
Closed
Closed
Open
PZH
S1
S2
Test
Point
t
t
1 kΩ
1 kΩ
en
t
t
t
R
PZL
PHZ
PLZ
L
From Output
Under Test
Open
Closed
Open
50 pF
dis
C
L
Closed
(see Note A)
50 pF
or
150 pF
t
or t
−−
Open
Open
pd
t
LOAD CIRCUIT
3 V
Reference
Input
1.3 V
3 V
0 V
High-Level
0 V
1.3 V
1.3 V
1.3 V
Pulse
t
t
h
su
3 V
0 V
t
Data
Input
w
2.7 V
2.7 V
1.3 V
0.3 V
1.3 V
0.3 V
3 V
0 V
Low-Level
Pulse
1.3 V
t
t
r
f
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
Output
Control
(Low-Level
Enabling)
3 V
0 V
3 V
0 V
Input
1.3 V
1.3 V
1.3 V
1.3 V
t
t
PLH
PHL
90%
t
t
PLZ
PZL
V
V
OH
≈V
CC
In-Phase
Output
Output
Waveform 1
(See Note B)
90%
t
1.3 V
10%
1.3 V
10%
1.3 V
1.3 V
10%
t
OL
V
OL
OH
t
r
f
f
t
t
t
PHL
90%
PLH
PZH
PHZ
Out-of-
Phase
Output
V
V
OH
V
Output
Waveform 2
(See Note B)
90%
t
90%
1.3 V
10%
1.3 V
10%
OL
≈0 V
t
r
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
O
r
f
D. For clock inputs, f
is measured when the input duty cycle is 50%.
E. The outputs are measured one at a time with one input transition per measurement.
max
F.
G.
H.
t
t
t
and t
and t
and t
are the same as t
.
dis
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
.
en
are the same as t .
pd
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
5962-8550701VRA
ACTIVE
CDIP
CFP
J
20
20
20
20
TBD
TBD
TBD
A42
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
5962-8550701VR
A
SNV54HCT374J
5962-8550701VSA
85507012A
ACTIVE
ACTIVE
W
25
1
-55 to 125
-55 to 125
5962-8550701VS
A
SNV54HCT374W
LCCC
FK
POST-PLATE
85507012A
SNJ54HCT
374FK
8550701RA
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
J
J
J
20
20
20
1
1
1
TBD
TBD
TBD
TBD
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
-55 to 125
8550701RA
SNJ54HCT374J
JM38510/65652BRA
M38510/65652BRA
JM38510/
65652BRA
JM38510/
65652BRA
SN54HCT374J
ACTIVE
ACTIVE
CDIP
J
20
20
1
A42
N / A for Pkg Type
-55 to 125
-40 to 85
SN54HCT374J
SN74HCT374DBR
SSOP
DB
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
HT374
SN74HCT374DBRE4
SN74HCT374DBRG4
SN74HCT374DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DB
DB
20
20
20
20
20
20
20
20
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
HT374
Green (RoHS
& no Sb/Br)
HT374
DW
DW
DW
DW
DW
DW
Green (RoHS
& no Sb/Br)
HCT374
HCT374
HCT374
HCT374
HCT374
HCT374
SN74HCT374DWE4
SN74HCT374DWG4
SN74HCT374DWR
SN74HCT374DWRE4
SN74HCT374DWRG4
25
Green (RoHS
& no Sb/Br)
25
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN74HCT374N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HCT374N
SN74HCT374N3
SN74HCT374NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
20
20
TBD
Call TI
Call TI
-40 to 85
-40 to 85
20
2000
2000
2000
70
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HCT374N
HCT374
HCT374
HCT374
HT374
SN74HCT374NSR
SN74HCT374NSRE4
SN74HCT374NSRG4
SN74HCT374PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
20
20
20
20
20
20
20
20
20
20
20
20
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-55 to 125
SO
Green (RoHS
& no Sb/Br)
SO
NS
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
LCCC
PW
PW
PW
PW
PW
PW
PW
PW
PW
FK
Green (RoHS
& no Sb/Br)
SN74HCT374PWE4
SN74HCT374PWG4
SN74HCT374PWR
SN74HCT374PWRE4
SN74HCT374PWRG4
SN74HCT374PWT
SN74HCT374PWTE4
SN74HCT374PWTG4
SNJ54HCT374FK
70
Green (RoHS
& no Sb/Br)
HT374
70
Green (RoHS
& no Sb/Br)
HT374
2000
2000
2000
250
250
250
1
Green (RoHS
& no Sb/Br)
HT374
Green (RoHS
& no Sb/Br)
HT374
Green (RoHS
& no Sb/Br)
HT374
Green (RoHS
& no Sb/Br)
HT374
Green (RoHS
& no Sb/Br)
HT374
Green (RoHS
& no Sb/Br)
HT374
TBD
85507012A
SNJ54HCT
374FK
SNJ54HCT374J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
8550701RA
SNJ54HCT374J
(1) The marketing status values are defined as follows:
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HCT374, SN54HCT374-SP, SN74HCT374 :
Catalog: SN74HCT374, SN54HCT374
•
Military: SN54HCT374
•
Space: SN54HCT374-SP
•
NOTE: Qualified Version Definitions:
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Catalog - TI's standard catalog product
•
•
•
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HCT374DBR
SN74HCT374DWR
SN74HCT374DWR
SN74HCT374NSR
SN74HCT374PWR
SN74HCT374PWT
SSOP
SOIC
DB
DW
DW
NS
20
20
20
20
20
20
2000
2000
2000
2000
2000
250
330.0
330.0
330.0
330.0
330.0
330.0
16.4
24.4
24.4
24.4
16.4
16.4
8.2
10.8
10.8
8.2
7.5
13.0
13.3
13.0
7.1
2.5
2.7
2.7
2.5
1.6
1.6
12.0
12.0
12.0
12.0
8.0
16.0
24.0
24.0
24.0
16.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
SO
TSSOP
TSSOP
PW
PW
6.95
6.95
7.1
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74HCT374DBR
SN74HCT374DWR
SN74HCT374DWR
SN74HCT374NSR
SN74HCT374PWR
SN74HCT374PWT
SSOP
SOIC
DB
DW
DW
NS
20
20
20
20
20
20
2000
2000
2000
2000
2000
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
45.0
45.0
38.0
38.0
SOIC
SO
TSSOP
TSSOP
PW
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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